WO2018132064A1 - Apparatus for testing an optoelectronic device and method of operating the same - Google Patents

Apparatus for testing an optoelectronic device and method of operating the same Download PDF

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Publication number
WO2018132064A1
WO2018132064A1 PCT/SG2018/050010 SG2018050010W WO2018132064A1 WO 2018132064 A1 WO2018132064 A1 WO 2018132064A1 SG 2018050010 W SG2018050010 W SG 2018050010W WO 2018132064 A1 WO2018132064 A1 WO 2018132064A1
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WO
WIPO (PCT)
Prior art keywords
optoelectronic device
thermal
stage
optoelectronic
testing
Prior art date
Application number
PCT/SG2018/050010
Other languages
English (en)
French (fr)
Inventor
Jens Geiger
Yeoh Ging SHENG
Kevin Hauser
Original Assignee
Heptagon Micro Optics Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte. Ltd. filed Critical Heptagon Micro Optics Pte. Ltd.
Priority to EP18739026.5A priority Critical patent/EP3568706B1/en
Priority to CN201880006861.7A priority patent/CN110178039B/zh
Priority to US16/472,141 priority patent/US10908208B2/en
Publication of WO2018132064A1 publication Critical patent/WO2018132064A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Definitions

  • the optical performance of an optoelectronic device sometimes is measured at a number of different temperatures in order to evaluate performance of the device under different operating temperatures, and to evaluate whether the optoelectronic device is stable upon repeated exposure to non-ambient temperatures (i.e., thermal cycling).
  • These tests can include directing the optoelectronic device to capture data of a test target (e.g., a grey card).
  • a testing apparatus may include both the optoelectronic device and the test target.
  • the entire apparatus is subjected to temperature changes in order to collect the test data from the optoelectronic device at the different temperatures.
  • the optoelectronic device may be heated via convection by a heating element in close proximity to the optoelectronic device. This can result, however, in the entire apparatus being heated due inefficiencies in the method of heat transfer.
  • Such a testing apparatus may have a number of problems. For example, as the temperature of the entire testing apparatus is altered, and the apparatus heat capacity is substantial, significant time may be required to reach a desired testing temperature.
  • the optoelectronic device is tested at elevated temperatures (e.g., 70°C). As the entire testing apparatus must be heated to an elevated temperature, the target also is heated to an elevated temperature. This can cause a number of issues. For example, as a single target may be used to evaluate multiple optoelectronic modules (e.g., 10s, 100s, or even 1000s), the target may exhibit dimensional changes with repeated testing such that the captured test data is inaccurate. Further, the test target may experience dimensional changes during testing (i.e., at an elevated temperature). Further, the test target may change chemically (e.g., the surface may oxidize), thereby generating spurious results.
  • elevated temperatures e.g. 70°C.
  • This disclosure describes apparatus for testing optoelectronic devices at multiple different temperatures that, in some cases, overcome the aforementioned challenges.
  • the disclosure also describes methods for operating the apparatus.
  • the apparatus can facilitate rapid optical performance measurements at multiple different temperatures.
  • the test target can exhibit reduced degradation, thereby reducing or minimizing the collection of spurious measurement data.
  • an apparatus for testing an optoelectronic device at multiple different temperatures includes an optoelectronic device stage, and a cavity disposed within the optoelectronic device stage.
  • the cavity can be configured to accommodate the optoelectronic device such that the optoelectronic device is inset within the cavity.
  • the apparatus further includes electrical contacts.
  • the electrical contacts can be positioned at least partially within the optoelectronic device stage and can be operable to contact the optoelectronic device electrically.
  • the electrical contacts can be operable to transmit testing commands and testing data between the optoelectronic device and a testing controller.
  • the apparatus further includes a temperature sensing device.
  • the temperature sensing device can be positioned within the stage proximal to the cavity and the optoelectronic device.
  • the temperature sensing device can be operable to transmit temperature sensing data to a thermal controller.
  • the apparatus further includes at least one actuatable mechanical connector fixedly connected to the optoelectronic device stage and a base.
  • the actuatable mechanical connector(s) can be operable to bring the base and the optoelectronic device stage in thermal and mechanical communication.
  • the apparatus further includes a thermal-adjustment device mounted proximal to the base and can be in thermal communication with the base.
  • the thermal-adjustment device can be operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the apparatus further includes a target stage mounted proximal to the optoelectronic device stage.
  • the target stage can be operable to mechanically contact the optoelectronic device.
  • the apparatus further includes a target mounted within the target stage and aligned with the optoelectronic device.
  • the apparatus for testing an optoelectronic device at different temperatures includes an optoelectronic device stage in thermal
  • the thermal-adjustment device is a thermoelectric device.
  • the thermal-adjustment device is a thermal heating element.
  • the temperature-sensing device is a thermocouple.
  • the temperature-sensing device is a thermistor.
  • the apparatus for testing an optoelectronic device at different temperatures includes a fluid-filled thermal adjustment device mounted to a thermal adjustment device, the fluid-filled thermal adjustment device being in thermal communication with the thermal adjustment device.
  • the apparatus for testing an optoelectronic device at different temperatures includes a heat sink mounted to a thermal adjustment device, the heat sink being in thermal communication with the thermal adjustment device.
  • the heat sink is composed at least partially of aluminum.
  • the heat sink is composed at least partially of copper.
  • the actuatable mechanical connector is a spring.
  • the electrical contacts are spring-loaded pins.
  • the a cover glass is mounted within the target stage and is aligned with the optoelectronic device.
  • the apparatus for testing an optoelectronic device at different temperatures includes a target stage and an optoelectronic device stage mounted forming a gas-tight seal around the optoelectronic device and a target.
  • the apparatus for testing an optoelectronic device at different temperatures includes a channel operable to conduct gas between
  • the cavity and an area external to the cavity.
  • FIG. 1A depicts an example of an apparatus, in an open position, for testing an optoelectronic device at different temperatures.
  • FIG. IB depicts the apparatus depicted in FIG. 1A in a closed position.
  • FIG. 2 depicts another example of an apparatus for testing an optoelectronic device at different temperatures.
  • FIG. 3 depicts still another example of an apparatus for testing an optoelectronic device at different temperatures.
  • FIG. 4 depicts yet still another example of an apparatus for testing an
  • FIG. 5A depicts an example of an apparatus for testing multiple optoelectronic devices at different temperatures.
  • FIG. 5B depicts another example of an apparatus for testing multiple
  • FIG. 1 A An example apparatus 100 for testing an optoelectronic device at multiple different temperatures is depicted in FIG. 1 A in an open position.
  • the apparatus 100 includes an optoelectronic device 101.
  • the optoelectronic device 101 includes an optoelectronic device stage 102 and a cavity 104 disposed within the optoelectronic device stage 102.
  • the cavity 104 is configured to accommodate the optoelectronic device 101 such that the optoelectronic device 101 is inset within the cavity 104.
  • the apparatus 100 further includes multiple electrical contacts 106.
  • the electrical contacts 106 can be positioned at least partially within the optoelectronic device stage 102 and are operable to contact the optoelectronic device 101 electrically.
  • the electrical contacts 106 are operable to transmit testing commands and testing data between the optoelectronic device and a testing controller.
  • the electrical contacts 106 can be spring-loaded pins (pogo-pins), for example, or other adjustable electrical contacts.
  • the apparatus 100 further includes a temperature sensing device 108.
  • the temperature sensing device 108 can be positioned within the optoelectronic device stage 102 proximal to the cavity 104 and the optoelectronic device 101.
  • the temperature sensing device 108 is operable to transmit temperature sensing data to a thermal controller such as a proportional-integral-derivative (PID) controller.
  • PID proportional-integral-derivative
  • the temperature sensing device 108 can be a thermocouple or a thermistor, for example.
  • the apparatus 100 further includes at least one actuatable mechanical connector 110.
  • the at least one actuatable mechanical connector 110 is fixedly connected to the optoelectronic device stage 102 and a base 112.
  • the at least one actuatable mechanical connector 110 is operable to bring the base 112 and the optoelectronic device stage 102 in thermal and mechanical communication.
  • the at least one actuatable mechanical connector 110 is a spring.
  • the apparatus 100 further includes a thermal-adjustment device 114 mounted proximal to the base 112 and can be in thermal communication with the base 112.
  • the thermal-adjustment device 114 is operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the thermal-adjustment device 114 can be a thermoelectric device or a thermal heating element, for example.
  • the apparatus 100 further includes a heat sink 115 mounted to the thermal- adjustment device 114.
  • the heat sink 115 is in thermal communication with the thermal adjustment device 114.
  • the heat sink 115 can be at least partially composed of copper or aluminum, for example. In some instances, the heat sink 115 is at least partially composed of a high heat capacity material and/or a material with high thermal conductivity.
  • the apparatus 100 further includes a target stage 116 mounted proximal to the optoelectronic device stage 102.
  • the target stage 116 is operable to mechanically contact the optoelectronic device 101.
  • the apparatus 100 further includes a target 118 mounted within the target stage 116 and aligned with the optoelectronic device 101 as indicated by alignment arrows Al as illustrated in FIG. 1A.
  • the target can be a grey card, for example.
  • FIG. IB depicts the apparatus 100 for testing an optoelectronic device at different temperatures in a closed position.
  • the apparatus 100 is illustrated with principal components in thermal and mechanical communication.
  • FIG. 2 depicts another example of an apparatus for testing an optoelectronic device at multiple different temperatures.
  • the apparatus 200 includes an optoelectronic device 201.
  • the optoelectronic device 201 includes an optoelectronic device stage 202 and a cavity 204 disposed within the optoelectronic device stage 202.
  • the cavity 204 is configured to accommodate the optoelectronic device 201 such that the optoelectronic device 201 is inset within the cavity 204.
  • the apparatus 200 further includes electrical contacts 206.
  • the electrical contacts 206 are positioned at least partially within the optoelectronic device stage 202 and are operable to contact the optoelectronic device 201 electrically.
  • the electrical contacts 206 are operable to transmit testing commands and testing data between the optoelectronic device and a testing controller.
  • the electrical contacts 206 can be spring- loaded pins (pogo-pins), for example, or other adjustable electrical contacts.
  • the apparatus 200 further includes a temperature sensing device 208.
  • the temperature sensing device 108 is positioned within the optoelectronic device stage 202 proximal to the cavity 204 and the optoelectronic device 201.
  • the temperature sensing device 208 is operable to transmit temperature sensing data to a thermal controller such as a PID controller.
  • the temperature sensing device 208 can be a thermocouple or a thermistor, for example.
  • the apparatus 200 further includes at least one actuatable mechanical connector 210.
  • the at least one actuatable mechanical connector 210 is fixedly connected to the optoelectronic device stage 202 and a base 212.
  • the at least one actuatable mechanical connector 210 is operable to bring the base 212 and the optoelectronic device stage 202 in thermal and mechanical communication.
  • the at least one actuatable mechanical connector 210 is a spring.
  • the apparatus 200 further includes a thermal-adjustment device 214 mounted proximal to the base 212 and is in thermal communication with the base 212.
  • the thermal-adjustment device 214 is operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the thermal-adjustment device 214 can be a thermoelectric device or a thermal heating element, for example.
  • the apparatus 200 further includes a fluid- filled thermal adjustment device 220 with a fluid 222.
  • the fluid-filled adjustment device 220 is mounted in thermal and mechanical communication with the thermal adjustment device 214.
  • the fluid 222 can be water, ethelyne glycol, oil, air or any other suitable fluid operable to conduct heat from the vicinity of the thermal adjustment device 214 and further is operable to affect rapid temperature changes on the optoelectronic device 201.
  • the apparatus 200 further includes a target stage 216 mounted proximal to the optoelectronic device stage 202.
  • the target stage 216 is operable to mechanically contact the optoelectronic device 201.
  • the apparatus 200 further includes a target 218 mounted within the target stage 216 and aligned with the optoelectronic device 201.
  • the target can be a grey card, for example.
  • FIG. 3 depicts still another example apparatus for testing an optoelectronic device at different temperatures.
  • the apparatus 300 includes an optoelectronic device 301.
  • the optoelectronic device 301 includes an optoelectronic device stage 302 and a cavity 304 disposed within the optoelectronic device stage 302.
  • the cavity 304 is configured to accommodate the optoelectronic device 301 such that the optoelectronic device 301 is inset within the cavity 304.
  • the apparatus 300 further includes a cover glass 324 aligned with the optoelectronic device 301.
  • the cover glass 324 can simulate a cover glass with which the optoelectronic device 301 is likely to be aligned and mounted in operation (i.e., as implemented in an end-user's device).
  • the apparatus 300 further includes electrical contacts 306.
  • the electrical contacts 306 are positioned at least partially within the optoelectronic device stage 302 and are operable to contact the optoelectronic device 301 electrically.
  • the electrical contacts 306 are operable to transmit testing commands and testing data between the optoelectronic device and a testing controller.
  • the electrical contacts 306 can be spring- loaded pins (pogo-pins), for example, or other adjustable electrical contacts.
  • the apparatus 300 further includes a temperature sensing device 308.
  • the temperature sensing device 308 is positioned within the optoelectronic device stage 302 proximal to the cavity 304 and the optoelectronic device 301.
  • the temperature sensing device 308 is operable to transmit temperature sensing data to a thermal controller such as a PID controller.
  • the temperature sensing device 308 can be a thermocouple or a thermistor, for example.
  • the apparatus 300 further includes at least one actuatable mechanical connector 310.
  • the at least one actuatable mechanical connector 310 is fixedly connected to the optoelectronic device stage 302 and a base 312.
  • the at least one actuatable mechanical connector 310 is operable to bring the base 312 and the optoelectronic device stage 302 in thermal and mechanical communication.
  • the at least one actuatable mechanical connector 310 is a spring.
  • the apparatus 300 further includes a thermal-adjustment device 314 mounted proximal to the base 312 and is in thermal communication with the base 312.
  • the thermal-adjustment device 314 is operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the thermal-adjustment device 314 can be a thermoelectric device or a thermal heating element, for example.
  • the apparatus 300 further includes a fluid-filled thermal adjustment device 320 with a fluid 322.
  • the fluid-filled adjustment device 320 is mounted in thermal and mechanical communication with the thermal adjustment device 314.
  • the fluid 322 can be water, ethylene glycol, oil, air or any other suitable fluid operable to conduct heat from the vicinity of the thermal adjustment device 314 and further is operable to affect rapid temperature changes on the optoelectronic device 301.
  • the apparatus 300 further includes a target stage 316 mounted proximal to the optoelectronic device stage 302. The target stage 316 is operable to mechanically contact the optoelectronic device 301.
  • the apparatus 300 further includes a target 318 mounted within the target stage 316 and aligned with the optoelectronic device 301.
  • the target can be a grey card, for example.
  • FIG. 4 depicts yet still another example apparatus for testing an optoelectronic device at different temperatures.
  • the apparatus 400 includes an optoelectronic device 401.
  • the optoelectronic device 401 includes an optoelectronic device stage 402 and a cavity 404 disposed within the optoelectronic device stage 402.
  • the cavity 404 is configured to accommodate the optoelectronic device 401 such that the optoelectronic device 401 is inset within the cavity 404.
  • the apparatus 400 further includes a cover glass 424 aligned with the optoelectronic device 401.
  • the cover glass 424 can simulate a cover glass with which the optoelectronic device 401 is likely to be aligned and mounted in operation (i.e., as implemented in an end-user's device).
  • the apparatus 400 further includes electrical contacts 406.
  • the electrical contacts 406 are positioned at least partially within the optoelectronic device stage 402 and are operable to contact the optoelectronic device 401 electrically.
  • the electrical contacts 406 are operable to transmit testing commands and testing data between the optoelectronic device and a testing controller.
  • the electrical contacts 406 can be spring- loaded pins (pogo-pins), for example, or other adjustable electrical contacts.
  • the apparatus 400 further includes a temperature sensing device 408.
  • the temperature sensing device 408 is positioned within the optoelectronic device stage 402 proximal to the cavity 404 and the optoelectronic device 401.
  • the temperature sensing device 408 is operable to transmit temperature sensing data to a thermal controller such as a PID controller.
  • the temperature sensing device 408 can be a thermocouple or a thermistor, for example.
  • the apparatus 400 further includes at least one actuatable mechanical connector 410.
  • the at least one actuatable mechanical connector 410 is fixedly connected to the optoelectronic device stage 402 and a base 412.
  • the at least one actuatable mechanical connector 410 is operable to bring the base 412 and the optoelectronic device stage 402 in thermal and mechanical communication.
  • the at least one actuatable mechanical connector 410 can be a spring.
  • the apparatus 400 further includes a thermal-adjustment device 414 mounted proximal to the base 412 and is in thermal communication with the base 412.
  • the thermal-adjustment device 414 is operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the thermal-adjustment device 414 is a thermoelectric device or a thermal heating element, for example.
  • the apparatus 400 further includes a fluid-filled thermal adjustment device 420 with a fluid 422.
  • the fluid-filled adjustment device 420 is mounted in thermal and mechanical communication with the thermal adjustment device 414.
  • the fluid 422 can be water, ethylene glycol, oil, air or any other suitable fluid operable to conduct heat from the vicinity of the thermal adjustment device 414 and further operable to affect rapid temperature changes on the optoelectronic device 401.
  • the apparatus 400 further includes a target stage 416 mounted proximal to the optoelectronic device stage 402.
  • the target stage 416 is operable to mechanically contact the optoelectronic device 401.
  • the apparatus 400 further includes a target 418 mounted within the target stage 416 and aligned with the optoelectronic device 401.
  • the target can be a grey card, for example.
  • the target stage 416 and the optoelectronic device stage 402 are mounted forming a gas-tight seal around the optoelectronic device 401 and the target 418.
  • the apparatus 400 further includes an inert gas channel 426.
  • the inert gas channel 426 is operable to conduct inert gas 428 between the cavity 404 and an area external to the cavity 404.
  • inert gas 428 is argon or a reducing gas such as hydrogen or a mixture of gasses including hydrogen.
  • the inert gas channel 426 is operable to evacuate the cavity 404.
  • the humidity of the cavity 404 is altered via the inert gas channel 426.
  • FIG. 5 A depicts an example apparatus for testing a plurality of optoelectronic devices at different temperatures.
  • the apparatus 500A includes optoelectronic devices 501.
  • the plurality of optoelectronic devices 501 include optoelectronic device stages 502A, 502B, 502C, and cavities 504A, 504B, 504C correspondingly disposed within each of the optoelectronic device stages 502A, 502B, 502C.
  • the cavities 504A, 504B, 504C are configured to correspondingly accommodate the optoelectronic devices 501A, 501B, 501C such that the optoelectronic devices 501A, 501B, 501C are correspondingly inset within each of the cavities 504A, 504B, 504C.
  • the apparatus 500A further includes electrical contacts 506.
  • the electrical contacts 506 are positioned at least partially within each of the optoelectronic device stages 502 A, 502B, 502C and are operable to correspondingly contact each of the optoelectronic devices 501A, 501B, 501C electrically.
  • the electrical contacts 506 are operable to correspondingly transmit testing commands and testing data between each of the optoelectronic devices 501A, 501B, 501C and a testing controller.
  • the electrical contacts 506 can be spring-loaded pins (pogo-pins), for example, or other adjustable electrical contacts.
  • the apparatus 500A further includes temperature sensing devices 508A, 508B, 508C.
  • Each of the temperature sensing devices 508A, 508B, 508C is positioned within a corresponding optoelectronic device stage 502A, 502B, 502C proximal to a
  • Each of the temperature sensing devices 508A, 508B, 508C is operable to transmit temperature sensing data to a thermal controller such as a PID controller.
  • a thermal controller such as a PID controller.
  • Each of the temperature sensing devices 508A, 508B, 508C can be a thermocouple or a thermistor, for example.
  • the apparatus 500A further includes at least one actuatable mechanical connector 51 OA, 51 OB, 5 IOC fixedly connected to a corresponding optoelectronic device stage 502A, 502B, 502C and a base 212.
  • the at least one actuatable mechanical connector 51 OA, 51 OB, 5 IOC are operable to bring the base 212 and a corresponding optoelectronic device stage 502A, 502B, 502C in thermal and mechanical communication.
  • the at least one actuatable mechanical connectors 51 OA, 51 OB, 5 IOC are springs.
  • the apparatus 500A further includes a thermal-adjustment device 514 mounted proximal to the base 512 and in thermal communication with the base 512.
  • the thermal- adjustment device 514 is operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the thermal- adjustment device 514 can be a thermoelectric device or a thermal heating element, for example.
  • the apparatus 500A further includes target stages 516A, 516B, 516C
  • the target stages 516A, 516B, 516C are operable to correspondingly
  • the apparatus 500A further includes targets 518A, 518B, 518C correspondingly mounted within the target stages 516A, 516B, 516C and correspondingly aligned with the optoelectronic devices 501A, 501B, 501C.
  • the target can be a grey card, for example.
  • FIG. 5B Another example apparatus for testing optoelectronic devices at different temperatures is depicted in FIG. 5B.
  • the apparatus 500B includes optoelectronic devices 501.
  • the optoelectronic devices 501 include optoelectronic device stages 502 A, 502B, 502C, and cavities 504A, 504B, 504C correspondingly disposed within each of the optoelectronic device stages 502A, 502B, 502C.
  • the cavities 504A, 504B, 504C are configured to correspondingly accommodate the optoelectronic devices 501A, 501B, 501C such that the optoelectronic devices 501A, 501B, 501C are correspondingly inset within each of the cavities 504A, 504B, 504C.
  • the apparatus 500B further includes electrical contacts 506.
  • the plurality of electrical contacts 506 are positioned at least partially within each of the optoelectronic device stages 502A, 502B, 502C and are operable to correspondingly contact each of the optoelectronic devices 501A, 501B, 501C electrically.
  • the electrical contacts 506 are operable to correspondingly transmit testing commands and testing data between each of the optoelectronic devices 501A, 501B, 501C and a testing controller.
  • the electrical contacts 506 can be spring-loaded pins (pogo-pins), for example, or other adjustable electrical contacts.
  • the apparatus 500B further includes temperature sensing devices 508A, 508B, 508C.
  • Each of the temperature sensing devices 508A, 508B, 508C is positioned within a corresponding optoelectronic device stage 502A, 502B, 502C proximal to a
  • Each of the temperature sensing devices 508A, 508B, 508C is operable to transmit temperature sensing data to a thermal controller such as a PID controller.
  • a thermal controller such as a PID controller.
  • Each of the temperature sensing devices 508A, 508B, 508C can be a thermocouple or a thermistor, for example.
  • the apparatus 500B further includes at least one actuatable mechanical connector 51 OA, 510B, 5 IOC fixedly connected to a corresponding optoelectronic device stage 502A, 502B, 502C and a base 212.
  • the actuatable mechanical connectors 51 OA, 510B, 5 IOC are operable to bring the base 212 and a corresponding optoelectronic device stage 502A, 502B, 502C in thermal and mechanical communication.
  • the actuatable mechanical connectors 510A, 510B, 5 IOC are springs.
  • the apparatus 500B further includes a thermal-adjustment device 514 mounted proximal to the base 512 and in thermal communication with the base 512.
  • the thermal- adjustment device 514 are operable to exchange thermal energy with the base according to temperature adjustment data transmitted from the thermal controller.
  • the thermal- adjustment device 514 can be a thermoelectric device or a thermal heating element, for example.
  • the apparatus 500B further includes a target stage 516 mounted proximal to the plurality of optoelectronic device stages 502A, 502B, 502C.
  • the target stage 516 is operable to mechanically contact the optoelectronic devices 501A, 501B, 501C.
  • the apparatus 500B further includes targets 518A, 518B, 518C mounted within the target stage 516 and correspondingly aligned with the optoelectronic devices 501 A, 501B, 501C.
  • the target can be a grey card, for example.

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
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  • Testing Of Individual Semiconductor Devices (AREA)
  • Semiconductor Lasers (AREA)
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PCT/SG2018/050010 2017-01-13 2018-01-09 Apparatus for testing an optoelectronic device and method of operating the same WO2018132064A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP18739026.5A EP3568706B1 (en) 2017-01-13 2018-01-09 Apparatus for testing an optoelectronic device and method of operating the same
CN201880006861.7A CN110178039B (zh) 2017-01-13 2018-01-09 用于测试光电装置的设备和操作所述设备的方法
US16/472,141 US10908208B2 (en) 2017-01-13 2018-01-09 Apparatus for testing an optoelectronic device and method of operating the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762445842P 2017-01-13 2017-01-13
US62/445,842 2017-01-13

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WO2018132064A1 true WO2018132064A1 (en) 2018-07-19

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101187689A (zh) * 2007-12-10 2008-05-28 杭州浙大三色仪器有限公司 测量半导体发光器件用的温控座
JP2011237350A (ja) * 2010-05-12 2011-11-24 Showa Denko Kk 発光部品試験モジュールおよび発光部品試験装置
KR20130088371A (ko) * 2012-01-31 2013-08-08 주식회사 에타맥스 발광다이오드 테스트 모듈
US20150204942A1 (en) * 2012-06-29 2015-07-23 Eles Semiconductor Equipment S.P.A. Test board with local thermal conditioning elements

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911897A (en) * 1997-01-13 1999-06-15 Micro Control Company Temperature control for high power burn-in for integrated circuits
US7317743B2 (en) * 2002-11-08 2008-01-08 Finisar Corporation Temperature and jitter compensation controller circuit and method for fiber optics device
US7206518B2 (en) * 2002-11-19 2007-04-17 Bookham Technology, Plc High speed optoelectronic subassembly and package for optical devices
US6971793B2 (en) * 2003-03-21 2005-12-06 Asm Assembly Automation Ltd. Test handler temperature monitoring system
KR100513728B1 (ko) * 2003-06-26 2005-09-08 삼성전자주식회사 광전 신호 검출기
US7042240B2 (en) * 2004-02-27 2006-05-09 Wells-Cti, Llc Burn-in testing apparatus and method
US20060086096A1 (en) * 2004-10-22 2006-04-27 Nanocoolers, Inc. Thermoelectric cooling and/or moderation of transient thermal load using phase change material
CN2764980Y (zh) * 2004-12-27 2006-03-15 日扬电子科技(上海)有限公司 光电设备用干式真空泵冷却系统
TWI273251B (en) * 2006-05-17 2007-02-11 Southern Taiwan University Of A method for analyzing the reliability of optoelectronic elements rapidly
CN201110883Y (zh) * 2007-12-05 2008-09-03 杭州浙大三色仪器有限公司 半导体发光器件热性能测量装置
CN102565001A (zh) * 2010-12-30 2012-07-11 上海龙天信息科技有限公司 光电露点仪散热系统
CN202101835U (zh) * 2011-04-08 2012-01-04 佛山科学技术学院 一种大功率白光led温度特性测量实验装置
ITMI20121157A1 (it) * 2012-06-29 2013-12-30 Eles Semiconductor Equipment S P A Test di dispositivi elettronici con riscaldatori disposti tra scheda di test e dispositivi elettronici da testare
US9400291B2 (en) * 2012-08-31 2016-07-26 Intel Corporation Integrated circuit test temperature control mechanism
WO2014162730A1 (ja) * 2013-04-01 2014-10-09 公立大学法人大阪市立大学 温度補償機能付センサ素子とそれを用いた磁気センサおよび電力測定装置
CN104807897B (zh) * 2014-01-29 2017-04-12 罗斯蒙特分析公司 具有改进的热稳定性的过程分析装置
DE102014106069B4 (de) * 2014-04-30 2023-02-16 Pictiva Displays International Limited Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Betriebsverfahren einer optoelektronischen Bauelementevorrichtung
US20160005906A1 (en) * 2014-07-03 2016-01-07 MH Solar Co. LTD. Optoelectronic Thermal Interfaces for 3-Dimensional Billet Devices, Including Vertical Multijunction Photovoltaic Receivers Using Heat Sinked Anode/Billet/Cathode For High Intensity Beaming and Wireless Power Transmission
CN105588958B (zh) * 2016-01-22 2018-10-09 中山大学 一种快速多功能电子元器件温度特性测量仪器及测试腔体
EP3315963A1 (de) * 2016-10-26 2018-05-02 Fuchs Petrolub SE Probenaufnahmeelement, analysenset und verfahren zur analyse eines liquids, insbesondere einer kühlschmierstoffemulsion
US10677836B2 (en) * 2016-12-29 2020-06-09 Sensor Electronic Technology, Inc. Optoelectronic device with semiconductor heterostructure and stress controlling structure to exert stress onto layers of the heterostructure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101187689A (zh) * 2007-12-10 2008-05-28 杭州浙大三色仪器有限公司 测量半导体发光器件用的温控座
JP2011237350A (ja) * 2010-05-12 2011-11-24 Showa Denko Kk 発光部品試験モジュールおよび発光部品試験装置
KR20130088371A (ko) * 2012-01-31 2013-08-08 주식회사 에타맥스 발광다이오드 테스트 모듈
US20150204942A1 (en) * 2012-06-29 2015-07-23 Eles Semiconductor Equipment S.P.A. Test board with local thermal conditioning elements

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CN110178039B (zh) 2021-10-26
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