WO2018099158A1 - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
WO2018099158A1
WO2018099158A1 PCT/CN2017/101720 CN2017101720W WO2018099158A1 WO 2018099158 A1 WO2018099158 A1 WO 2018099158A1 CN 2017101720 W CN2017101720 W CN 2017101720W WO 2018099158 A1 WO2018099158 A1 WO 2018099158A1
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WO
WIPO (PCT)
Prior art keywords
circuit
display device
package
display
disposed
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PCT/CN2017/101720
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English (en)
French (fr)
Inventor
张玉欣
程鸿飞
吴新银
乔勇
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP17849859.8A priority Critical patent/EP3550627A4/en
Priority to US15/762,662 priority patent/US20190081108A1/en
Priority to KR1020187011780A priority patent/KR20180081051A/ko
Priority to JP2018512173A priority patent/JP2019537040A/ja
Publication of WO2018099158A1 publication Critical patent/WO2018099158A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display device.
  • Silicon-based OLED microdisplays are used in a wide range of applications, especially for head-mounted displays, stereo displays, and eyeglass-type displays.
  • the present invention is directed to solving one of the technical problems existing in the prior art, and provides a display device.
  • a display device includes: a substrate substrate divided into a main panel region and a peripheral region surrounding the main panel region; and a display structure disposed at the On the base substrate and in the main panel area; a circuit structure disposed in the peripheral area for driving control of the display structure, wherein the display device further comprises a circuit package, the circuit package Used to package the circuit structure.
  • the display device includes a plurality of the circuit structures, and the plurality of the circuit structures are respectively disposed at two sides of the main panel region.
  • the display device includes a plurality of circuit packages, and the plurality of circuit packages are in one-to-one correspondence with the plurality of circuit structures.
  • the display device further includes a circuit back plate disposed on a surface of the substrate substrate facing away from the circuit structure.
  • the circuit package further encapsulates the circuit backplane.
  • the base substrate includes a silicon substrate and a silicon-based driving circuit disposed on a surface of the silicon substrate facing the display structure
  • the display device further includes a planarization layer, the planarization layer is disposed
  • the circuit structure is disposed on the planarization layer on a surface of the silicon-based driving circuit facing away from the silicon substrate.
  • the display device includes a package cover plate disposed on a side of the display structure facing away from the base substrate, and the circuit package further encapsulates the package cover plate.
  • the circuit package further encapsulates an upper surface of the package cover.
  • the circuit package further encapsulates a side end of the package cover and a top surface of the circuit package is flush with an upper surface of the package cover.
  • the circuit package further encapsulates a lower surface of the package cover.
  • the display device further includes an encapsulation layer disposed between the package cover and the display structure for packaging the display structure with the planarization layer.
  • the display structure comprises an organic light emitting diode display panel.
  • the circuit structure includes a drive control circuit for controlling display of the display structure.
  • the circuit package is formed of a resin.
  • the circuit package is formed as a multilayer film structure.
  • the multilayer film structure is formed from an organic film.
  • the multilayer film structure is formed from an inorganic film.
  • the multilayer film structure is formed of an inorganic film and an organic film which are alternately disposed.
  • the material of the organic film is selected from any one of polyimide, polyurea, polyamic acid, polyester, polyethylene, and polypropylene.
  • the material of the inorganic thin film may be selected from the group consisting of nano silicon dioxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiCxNy), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), tin oxide. (SnO2), any of aluminum nitride (AlN), magnesium fluoride (MgF2), calcium fluoride (CaF2), indium oxide (In2O3), and indium tin oxide (ITO).
  • SiOx nano silicon dioxide
  • SiNx silicon nitride
  • SiCxNy silicon oxynitride
  • SiOxNy silicon oxynitride
  • AlOx aluminum oxide
  • tin oxide SnO2
  • AlN aluminum nitride
  • MgF2 magnesium fluoride
  • CaF2 calcium fluoride
  • ITO indium tin oxide
  • the circuit structure located in the peripheral region of the base substrate is packaged, thereby preventing the circuit structure in the peripheral region from being damaged due to long-term contact with water and oxygen. , prolonging the service life of the device in the circuit structure, thereby prolonging the life of the display device, and avoiding the problem that the display device is poorly displayed due to damage of the circuit structure.
  • FIG. 1 is a schematic structural view of a first embodiment of a display device according to the present invention.
  • FIG. 2 is a schematic structural view of a second embodiment of a display device provided by the present invention.
  • FIG. 3 is a schematic structural view of a third embodiment of a display device according to the present invention.
  • FIG. 4 is a schematic structural view of a fourth embodiment of a display device according to the present invention.
  • a substrate 101, a main panel area; 102, a peripheral area; 103, a silicon substrate; 104, a silicon-based driving circuit; 11, a display structure; 111, an anode; 112, an organic light-emitting layer; 113, a cathode; 12, circuit structure; 13, circuit package; 14, circuit back; 15, flattening layer; 16, package cover; 17, encapsulation layer.
  • a silicon-based organic light-emitting diode microdisplay is based on a single crystal silicon chip, and its pixel size is one tenth of that of a conventional display device, so the fineness is much higher than that of a conventional display device.
  • current silicon-based organic light-emitting diode microdisplays generally only package the light-emitting area of the organic light-emitting diode without encapsulating the peripheral area around the light-emitting area, so that the circuit designed in the peripheral area is exposed to water and air for a long time. Therefore, it is easy to cause damage to the circuit, which may cause problems such as poor display.
  • the display device includes a base substrate 10 and a display structure 11 disposed on the base substrate 10.
  • the base substrate 10 is divided into main The panel region 101 and the peripheral region 102 surrounding the main panel region 101, the display structure 11 is disposed in the main panel region 101, and the peripheral structure 102 is provided with a circuit structure 12, and the circuit structure 12 can be, for example, a peripheral driver for driving the display panel for display.
  • a control circuit wherein the display device further includes a circuit package 13 that encapsulates the circuit structure 12 on the base substrate 10.
  • the circuit structure located in the peripheral region of the base substrate is packaged to prevent the circuit structure in the peripheral region from being damaged due to long-term contact with water and oxygen. , prolonging the service life of the device in the circuit structure, thereby prolonging the life of the display device, and avoiding the display device display failure problem due to damage of the circuit structure.
  • the circuit structure 12 is located on the peripheral region 102 of the base substrate 10, and the circuit structure 12 is covered by the circuit package 13 so that the circuit structure 12 is not exposed to water and oxygen.
  • the circuit structure 12 is not damaged by water and oxygen, extending the useful life of the device in the circuit structure 12.
  • the circuit package 13 may be formed as a sealing structure, for example, the circuit package 13 may be formed of a resin, or a circuit
  • the package 13 may be formed as a sealed multilayer film structure which may be formed of an organic or inorganic film.
  • the multilayer film structure may be a multilayer organic film structure, a multilayer inorganic film structure, or an alternate of a plurality of organic and inorganic films.
  • Stack structure When the circuit package 13 is formed into an alternate stack structure of a plurality of organic thin films and inorganic thin films, an inorganic thin film may be formed first, and then an organic thin film is formed on the inorganic thin film by coating, and then applied by coating. The way to form an inorganic film on the organic film, if repeated, is repeated until the desired alternating stack structure is formed.
  • the coating process is simple and easy to implement, thereby ensuring that the circuit package 13 has good packaging performance, and can simplify the process and reduce the cost.
  • the material of the organic thin film may be selected from at least one of polyimide, polyurea, polyamic acid, polyester, polyethylene, and polypropylene; the material of the inorganic thin film may be selected from nano silica (SiOx) ), silicon nitride (SiNx), silicon oxynitride (SiCxNy), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), tin oxide (SnO2), aluminum nitride (AlN), magnesium fluoride (MgF2), fluorine At least one of calcium (CaF 2 ), indium oxide (In 2 O 3 ), and indium tin oxide (ITO). It is easy to understand that when the material of the inorganic thin film is selected from indium tin oxide, a layer of insulating material should be disposed between the indium tin oxide inorganic thin film and the circuit structure.
  • each of the above films may be prepared by any one of sputtering, thermal evaporation, chemical vapor deposition, plasma chemical vapor deposition, ion beam assisted deposition, and atomic layer deposition.
  • the display device includes a plurality of circuit structures 12 that are respectively disposed in peripheral regions 102 on both sides of the main panel region 101.
  • the display device includes two circuit structures 12 that are respectively disposed in peripheral regions 102 on either side of the main panel region 101.
  • the display device may include a plurality of circuit structures 12 as needed, and are disposed in the peripheral region 102, and the peripheral region 102 surrounds the main in the display device.
  • Panel area 101 It is provided that when the display device comprises a plurality of circuit structures 12, in order to facilitate layout of the circuit structures 12, the plurality of circuit structures 12 are generally uniformly disposed on both sides of the main panel region 101, for example, the plurality of circuit structures 12 are respectively disposed in the peripheral area 102 located on both sides of the main panel area 101.
  • one circuit package 13 can be provided for each of the circuit structures 12 on the side of the main panel region 101, so that the respective circuit packages 13 corresponding to the circuit structures 12 located on both sides of the main panel region 101 are correspondingly They are disposed on both sides of the main panel region 101, and respectively package the respective circuit structures 12 on the base substrate 10 on both sides of the main panel region 101.
  • the display device shown in FIG. 1 is an embodiment in which the circuit structure 12 is located in the peripheral region 102 on the side of the main panel region 101
  • the display device shown in FIG. 2 is the peripheral region 102 in which the circuit structure 12 is located on both sides of the main panel region 101.
  • the display device further includes a circuit back plate 14 disposed on a surface of the base substrate 10 facing away from the circuit structure 12. .
  • the circuit back plate 14 is located on the lower surface of the base substrate 10.
  • the circuit backplane 14 is a printed circuit board. As can be seen from the figure, the circuit backplane 14 is located at the bottom of the display device. Therefore, the circuit backplane 14 needs to have good supporting performance, and the printed circuit The board has an advantage of high hardness and, therefore, can be preferably used as the circuit back sheet 14.
  • the wiring on the circuit backplane 14 as a printed circuit board is electrically connected to a silicon substrate and a silicon-based driving circuit (described later) provided in the base substrate to provide an electrical signal thereto.
  • the printed circuit board also has the advantages of high wiring density and light weight.
  • circuit package 13 in order to make the package of the circuit structure 12 more robust and compact, a portion of the circuit package 13 is in contact with and bonded to the circuit backplane 14, that is, the circuit package 13 is also The circuit backplane 14 is packaged.
  • a portion of the bottom of the circuit package 13 is in contact with and bonded together with the circuit backplane 14 (ie, the package circuit backplane 14), and another portion is in contact with and bonded to the substrate substrate 10. Together (ie, package the substrate 10), In this way, the circuit structure 12 can be covered more completely, the sealing of the package is good, and the package is more firm.
  • the base substrate 10 includes a silicon substrate 103 and a silicon-based driving circuit 104 disposed on a surface of the silicon substrate 103 facing the display structure 11,
  • the display device further includes a planarization layer 15 disposed on a surface of the silicon-based driving circuit 104 facing away from the silicon substrate 103, and the circuit structure 12 is disposed on the planarization layer 15.
  • the upper surface of the silicon substrate 103 is provided with a silicon-based driving circuit 104
  • the upper surface of the silicon-based driving circuit 104 is provided with a planarization layer 15, and the planarization layer 15 is provided.
  • a via hole is disposed thereon, and the circuit structure 12 is connected to the silicon-based driving circuit 104 located under the planarization layer 15 through the via hole.
  • the silicon-based microdisplay device since the silicon-based microdisplay device is widely used, and the silicon-based display device includes the circuit structure 12 having various functions, when the circuit package 13 is used in the silicon-based display device, the protection can be effectively performed.
  • the circuit structure 12 disposed on the base substrate 10 effectively improves the service life of the silicon-based display device.
  • the display device includes a package cover plate 16 disposed on a side of the display structure 11 facing away from the base substrate 10.
  • the top of the circuit package 13 is in contact with and bonded together with the package cover 16, in other words, the circuit package 13 also encapsulates the package cover 16.
  • the circuit package 13 and the package cover 16 can be used to package the display device well, which can better protect the display device and effectively improve the service life of the silicon-based display device.
  • the package cover 16 is disposed on the upper surface of the display structure 11.
  • An encapsulation layer 17 is disposed between the package cover 16 and the display structure 11.
  • the encapsulation material used for the encapsulation layer 17 may be a silica gel or other material that can be used as a package, or may be a glass glue, that is, a glass powder is laser-integrated. sintering.
  • the encapsulation layer 17 encapsulates the display structure 11 with the planarization layer 15.
  • the top of the circuit package 13 is brought into contact with and bonded to the upper surface of the package cover 16. That is, the circuit package 13 top package is packaged The upper surface of the cover plate 16.
  • the bottom of the circuit package 13 encapsulates the base substrate 10, and the top surface of the circuit package 13 encloses the upper surface of the package cover 16.
  • the bottom of the circuit package 13 can have other packaging methods, such as a part of the bottom of the circuit package 13 packaging the circuit back board 14, and another part of the package substrate 10, that is, the bottom of the circuit package 13 It can be packaged as shown in Figures 3 and 4.
  • the top end of the circuit package 13 encloses the side end face of the package cover 16 and the top of the circuit package 13 The surface is flush with the upper surface of the package cover 16.
  • the package pattern of the top package package cover 16 of the circuit package 13 is different from that shown in FIGS. 1 and 2, and the upper surface of the top of the circuit package 13 and the package cover 16 are The upper surface is flush, a portion of the bottom of the circuit package 13 shown in FIG. 3 encapsulates the circuit backplane 14, and the other portion encapsulates the substrate substrate 10. It can be understood that when the top of the circuit package 13 is the package mode shown in FIG. 3, the bottom of the circuit package 13 can also be packaged with the base substrate 10 as shown in FIGS. 1 and 2.
  • the top surface of the circuit package 13 encapsulates the lower surface of the package cover 16.
  • a portion of the bottom of the circuit package 13 encapsulates the circuit backplane 14, and another portion encapsulates the base substrate 10, and the top surface of the circuit package 13 encapsulates the lower surface of the package cover 16. It can be understood that when the package mode shown in FIG. 4 is adopted on the top of the circuit package 13, the bottom of the circuit package 13 can also be packaged with the base substrate 10 as shown in FIGS. 1 and 2.
  • the display structure 11 includes an organic light emitting diode display panel.
  • the organic light emitting diode display panel includes an anode 111, an organic light emitting layer 112, and a cathode 113 which are disposed in this order from bottom to top.
  • the display device provided by the invention encapsulates the circuit structure located in the peripheral region of the base substrate by providing a circuit package to prevent the circuit structure in the peripheral region from being damaged due to long-term contact with water and oxygen, and prolonging the circuit.
  • the service life of the device in the structure further prolongs the life of the display device, and also avoids the problem that the display device is poorly displayed due to damage of the circuit structure.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示装置，包括：衬底基板（10），其被划分为主面板区域（101）和围绕该主面板区域四周的周边区域（102）；显示结构（11），其设置在该衬底基板上且位于该主面板区域内；电路结构（12），其设置在该周边区域内，用于对该显示面板进行驱动控制，电路封装件（13），其封装该电路结构。该显示装置延长了电路结构中的器件的使用寿命，进而延长了显示器件的寿命，也避免了由于电路结构的损坏引起显示装置显示不良的问题的发生。

Description

显示装置
相关申请的交叉引用
本申请要求于2016年12月1日提交的申请号为201621310187.6、发明名称为“一种显示装置”的申请的优先权，其全部内容通过引用并入本文。
技术领域
本发明涉及显示技术领域，具体涉及一种显示装置。
背景技术
硅基有机发光二极管微显示器应用范围广泛，尤其适用于头盔显示器、立体显示器以及眼镜式显示器等。
发明内容
本发明旨在解决现有技术中存在的技术问题之一，提供了一种显示装置。
为实现上述目的，作为本发明的一个方面，提供一种显示装置，包括：衬底基板，其被划分为主面板区域和围绕所述主面板区域四周的周边区域；显示结构，其设置在所述衬底基板上且位于所述主面板区域内；电路结构，其设置在周边区域内，用于对显示结构进行驱动控制，其中，所述显示装置还包括电路封装件，所述电路封装件用于封装所述电路结构。
可选地，所述显示装置包括多个所述电路结构，多个所述电路结构分别设置在所述主面板区域的两侧。
可选地，所述显示装置包括多个电路封装件，所述多个电路封装件与所述多个电路结构一一对应。
可选地，所述显示装置还包括电路背板，所述电路背板设置在所述衬底基板背离所述电路结构的表面上。
可选地，所述电路封装件还封装所述电路背板。
可选地，所述衬底基板包括硅基板和设置在所述硅基板的朝向所述显示结构的表面上的硅基驱动电路，所述显示装置还包括平坦化层，所述平坦化层设置在所述硅基驱动电路的背离所述硅基板的表面上，所述电路结构设置在所述平坦化层上。
可选地，所述显示装置包括封装盖板，所述封装盖板设置在所述显示结构的背离所述衬底基板的一侧，所述电路封装件还封装所述封装盖板。
可选地，所述电路封装件还封装所述封装盖板的上表面。
可选地，所述电路封装件还封装所述封装盖板的侧面端部且所述电路封装件的顶部表面与所述封装盖板的上表面齐平。
可选地，所述电路封装件还封装所述封装盖板的下表面。
可选地，所述显示装置还包括封装层，其设置在所述封装盖板和所述显示结构之间，用于将所述显示结构与所述平坦化层封装在一起。
可选地，所述显示结构包括有机发光二极管显示面板。
可选地，所述电路结构包括用于控制所述显示结构的显示的驱动控制电路。
可选地，所述电路封装件由树脂形成。
可选地，所述电路封装件形成为多层膜结构。
可选地，所述多层膜结构由有机薄膜形成。
可选地，所述多层膜结构由无机薄膜形成。
可选地，所述多层膜结构由交替设置的无机薄膜和有机薄膜形成。
可选地，所述有机薄膜的材料选自聚酰亚胺、聚脲、聚酰胺酸、聚酯、聚乙烯和聚丙烯中的任意一种。
可选地，所述无机薄膜的材料可以选自纳米二氧化硅(SiOx)、氮化硅(SiNx)、氮碳化硅(SiCxNy)、氮氧化硅(SiOxNy)、氧化铝(AlOx)、氧化锡(SnO2)、氮化铝(AlN)、氟化镁(MgF2)、氟化钙(CaF2)、氧化铟(In2O3)和氧化铟锡(ITO)中的任意一种。
在本发明提供的显示装置中，通过设置电路封装件，将位于衬底基板的周边区域中的电路结构进行封装，避免了周边区域中的电路结构因长期接触水和氧气而受到损坏的现象发生，延长了电路结构中的器件的使用寿命，进而延长了显示器件的寿命，也避免了由于电路结构的损坏引起显示装置显示不良的问题的发生。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：
图1为本发明提供的显示装置的第一种实施方式的结构示意图；
图2为本发明提供的显示装置的第二种实施方式的结构示意图；
图3为本发明提供的显示装置的第三种实施方式的结构示意图；
图4为本发明提供的显示装置的第四种实施方式的结构示意图。
其中，10、衬底基板；101、主面板区域；102、周边区域；103、硅基板；104、硅基驱动电路；11、显示结构；111、阳极；112、有机发光层；113、阴极；12、电路结构；13、电路封装件；14、电路背板；15、平坦化层；16、封装盖板；17、封装层。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
需要说明的是，本发明中所提到的方位词“上”、“下”等，均是指附图中所示的“上”和“下”方向。
在显示技术领域中，硅基有机发光二极管微显示器是以单晶硅芯片为基底，其像素尺寸为传统显示器件的十分之一，因此精细度远远高于传统显示器件。但是目前的硅基有机发光二极管微显示器通常只是将有机发光二极管的发光区域进行封装而没有对发光区域周围的周边区域进行封装，这样使得设计在周边区域中的电路长时间暴露于水和空气，因而易于导致电路损坏，进而引起显示不良等问题。
因此，如何使得现有技术中的利用硅基有机发光二极管微显示器的显示装置的发光区域周边的电路不受损坏成为亟待解决的问题。
作为本发明的一个方面，提供了一种显示装置，如图1所示，所述显示装置包括衬底基板10和设置在衬底基板10上的显示结构11，衬底基板10被划分为主面板区域101和围绕主面板区域101四周的周边区域102，显示结构11设置在主面板区域101中，周边区域102内设置有电路结构12，电路结构12例如可以是驱动显示面板进行显示的外围驱动控制电路，其中，所述显示装置还包括电路封装件13，电路封装件13将电路结构12封装在衬底基板10上。
在本发明提供的显示装置中，通过设置电路封装件，将位于衬底基板的周边区域中的电路结构进行封装，以避免周边区域的电路结构因长期接触水和氧气而收到损坏的现象发生，延长了电路结构中的器件的使用寿命，进而延长了显示器件的寿命，也避免了由于电路结构的损坏引起显示装置显示不良问题的发生。
具体地，在图1所示的显示装置中，电路结构12位于衬底基板10的周边区域102上，通过设置电路封装件13将电路结构12覆盖，使得电路结构12接触不到水和氧气，这样电路结构12不会因为水和氧气的原因而受到损坏，延长了电路结构12中器件的使用寿命。
作为电路封装件13的具体实施方式，电路封装件13可以形成为密封结构，例如，电路封装件13可以由树脂形成，或者电路 封装件13可以形成为密封的多层膜结构，所述多层膜结构可以由有机或无机薄膜形成。
在将电路封装件13形成为所述多层膜结构时，所述多层膜结构可以是多层有机薄膜结构，也可以是多层无机薄膜结构，还可以是多层有机和无机薄膜的交替堆叠结构。在将电路封装件13形成为多层有机薄膜和无机薄膜的交替堆叠结构时，可以先形成一层无机薄膜，然后通过涂敷的方式在无机薄膜上形成一层有机薄膜，然后再通过涂敷的方式在有机薄膜上形成一层无机薄膜，如是依次重复，直到形成所需的交替堆叠结构。涂敷工艺简单易实现，从而既保证了电路封装件13具有良好的封装性能，又能实现简化工艺、降低成本。
可选地，有机薄膜的材料可以选自聚酰亚胺、聚脲、聚酰胺酸、聚酯、聚乙烯和聚丙烯中的至少一种；无机薄膜的材料可以选自纳米二氧化硅(SiOx)、氮化硅(SiNx)、氮碳化硅(SiCxNy)、氮氧化硅(SiOxNy)、氧化铝(AlOx)、氧化锡(SnO2)、氮化铝(AlN)、氟化镁(MgF2)、氟化钙(CaF2)、氧化铟(In2O3)和氧化铟锡(ITO)中的至少一种。容易理解的是，当无机薄膜的材料选用氧化铟锡时，该氧化铟锡无机薄膜与电路结构之间应当设置有绝缘材料层。
另外，上述各薄膜的制备可以采用溅射、热蒸镀、化学气相沉积、等离子化学气相沉积、离子束辅助沉积和原子层沉积中的任意一种方法。
作为一种具体地实施方式，所述显示装置包括多个电路结构12，多个电路结构12分别设置在主面板区域101两侧的周边区域102中。
例如，如图2所示，所述显示装置包括两个电路结构12，两个电路结构12分别设置在主面板区域101两侧的周边区域102中。
可以理解的是，为了配合所述显示装置的功能多样化，所述显示装置可以根据需要包括多个电路结构12，且均设置在周边区域102中，周边区域102围绕所述显示装置中的主面板区域101 设置，当所述显示装置包括多个电路结构12时，为了方便对各电路结构12进行布局，该多个电路结构12通常均匀设置在主面板区域101的两侧，例如，该多个电路结构12分别设置在位于主面板区域101的两侧的周边区域102中。在该实施例中，可以针对位于主面板区域101一侧的各电路结构12设置一个电路封装件13，所以与位于主面板区域101两侧的电路结构12对应的各电路封装件13相应的也设置在主面板区域101的两侧，并分别将各电路结构12封装在主面板区域101两侧的衬底基板10上。图1所示的显示装置是电路结构12位于主面板区域101一侧的周边区域102中的实施方式，图2所示的显示装置是电路结构12位于主面板区域101的两侧的周边区域102上的实施方式。作为显示装置的另一种具体地实施方式，如图1至图4所示，所述显示装置还包括电路背板14，电路背板14设置在衬底基板10的背离电路结构12的表面上。
具体地，以附图所示的方向为例，电路背板14位于衬底基板10的下表面。
可选地，电路背板14为印刷电路板，由图中可以看出，电路背板14位于所述显示装置的底部，因此，电路背板14需要具有良好的支撑性能，而所述印刷电路板具有硬度高的优势，因此，可以优选用作电路背板14。另外，作为印刷电路板的电路背板14上的布线与设置在衬底基板中的硅基板和硅基驱动电路(下文中进行描述)电连接，为其提供电信号。所述印刷电路板还具有布线密度高，重量轻的优势。
作为电路封装件13的一种具体地实施方式，为了使得电路结构12的封装更加牢固和严实，电路封装件13的一部分与电路背板14接触并且结合在一起，也即，电路封装件13还对电路背板14进行封装。
具体地，如图3和图4所示，电路封装件13的底部的一部分与电路背板14接触并结合在一起(即，封装电路背板14)，另一部分与衬底基板10接触并结合在一起(即，封装衬底基板10)， 这样可以将电路结构12覆盖的更加完全，封装的密封性好，封装也更加牢固。
作为衬底基板10的一种具体地实施方式，如图4所示，衬底基板10包括硅基板103和设置在硅基板103的朝向显示结构11的表面上的硅基驱动电路104，所述显示装置还包括平坦化层15，平坦化层15设置在硅基驱动电路104的背离硅基板103的表面上，电路结构12设置在平坦化层15上。
可以理解的是，以附图中所示的方向为例，硅基板103的上表面设置有硅基驱动电路104，硅基驱动电路104的上表面设置有平坦化层15，且平坦化层15上设置有过孔，电路结构12通过所述过孔与位于平坦化层15的下方的硅基驱动电路104连接。
需要说明的是，由于硅基微显示装置的应用比较广泛，而硅基显示装置中包括了多种功能的电路结构12，所以当硅基显示装置中使用电路封装件13时，能够有效的保护设置在衬底基板10上的电路结构12，有效提高硅基显示装置的使用寿命。
作为所述显示装置的再一种具体地实施方式，如图1至图4所示，所述显示装置包括封装盖板16，封装盖板16设置在显示结构11的背离衬底基板10的一侧，电路封装件13的顶部与封装盖板16接触并结合在一起，换句话说，电路封装件13还对封装盖板16进行封装。利用电路封装件13和封装盖板16可以对显示装置进行良好的封装，能够更好的保护显示装置，有效提高硅基显示装置的使用寿命。
具体地，如图1所示，封装盖板16设置在显示结构11的上表面上。封装盖板16与显示结构11之间设置有封装层17，封装层17采用的封装材料可以为硅胶或其他可用作封装的材料，也可以是玻璃胶，即采用激光融入的方式将玻璃粉烧结。封装层17将显示结构11与平坦化层15封装在一起。
为了使得电路封装件13的封装更加稳定，作为一种可选地实施方式，如图1和图2所示，使电路封装件13的顶部与封装盖板16的上表面接触并结合在一起，即，电路封装件13顶部封装封装 盖板16的上表面。
具体地，如图1和图2所示，电路封装件13的底部封装衬底基板10，电路封装件13的顶部封装封装盖板16的上表面。可以理解的是，电路封装件13的底部还可以有其它的封装方式，例如电路封装件13的底部的一部分封装电路背板14，另一部分封装衬底基板10，即电路封装件13的底部还可以如图3和图4所示的封装方式。
为了使得电路封装件13的封装更加稳定，作为第二种可选地实施方式，如图3所示，电路封装件13的顶部封装封装盖板16的侧部端面且电路封装件13的顶部的表面与封装盖板16的上表面齐平。
具体地，如图3所示，电路封装件13的顶部封装封装盖板16的封装方式与图1和图2所示不同的是，电路封装件13的顶部的上表面与封装盖板16的上表面齐平，图3所示的电路封装件13的底部的一部分封装电路背板14，另一部分封装衬底基板10。可以理解的是，在电路封装件13的顶部为图3所示的封装方式时，电路封装件13的底部还可以采用如图1和图2所示的与衬底基板10的封装方式。
为了使得电路封装件13的封装更加稳定，作为第三种可选地实施方式，如图4所示，电路封装件13的顶部封装封装盖板16的下表面。
具体地，如图4所示，电路封装件13的底部的一部分封装电路背板14，另一部分封装衬底基板10，电路封装件13的顶部封装封装盖板16的下表面。可以理解的是，在电路封装件13的顶部采用图4所示的封装方式时，电路封装件13的底部还可以如图1和图2所示的与衬底基板10的封装方式。
作为显示结构11的一种具体地实施方式，显示结构11包括有机发光二极管显示面板。
具体地，如图4所示，所述有机发光二极管显示面板包括由下到上依次设置的阳极111、有机发光层112以及阴极113。
本发明提供的显示装置通过设置电路封装件，将位于衬底基板的周边区域中的电路结构进行封装，以避免周边区域的电路结构因长期接触水和氧气而受到损坏的现象发生，延长了电路结构中的器件的使用寿命，进而延长了显示器件的寿命，也避免了由于电路结构的损坏引起显示装置显示不良的问题的发生。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (20)

  1. 一种显示装置，包括：衬底基板，其被划分为主面板区域和围绕所述主面板区域四周的周边区域；显示结构，其设置在所述衬底基板上且位于所述主面板区域内；电路结构，其设置在所述周边区域内，用于对所述显示结构进行驱动控制；电路封装件，其封装所述电路结构。
  2. 根据权利要求1所述的显示装置，其中，所述显示装置包括多个所述电路结构，多个所述电路结构分别设置在所述主面板区域的两侧。
  3. 根据权利要求2所述的显示装置，其中，所述显示装置包括多个电路封装件，所述多个电路封装件与所述多个电路结构一一对应。
  4. 根据权利要求1至3中任一项所述的显示装置，其中，所述显示装置还包括电路背板，所述电路背板设置在所述衬底基板背离所述电路结构的表面上。
  5. 根据权利要求4所述的显示装置，其中，所述电路封装件还封装所述电路背板。
  6. 根据权利要求1至3中任一项所述的显示装置，其中，所述衬底基板包括硅基板和设置在所述硅基板的朝向所述显示结构的表面上的硅基驱动电路，所述显示装置还包括平坦化层，所述平坦化层设置在所述硅基驱动电路的背离所述硅基板的表面上，所述电路结构设置在所述平坦化层上。
  7. 根据权利要求1至3中任一项所述的显示装置，其中，所述显示装置包括封装盖板，所述封装盖板设置在所述显示结构的背离所述衬底基板的一侧，所述电路封装件还封装所述封装盖板。
  8. 根据权利要求7所述的显示装置，其中，所述电路封装件还封装所述封装盖板的上表面。
  9. 根据权利要求7所述的显示装置，其中，所述电路封装件还封装所述封装盖板的侧面端部且所述电路封装件的顶部表面与所述封装盖板的上表面齐平。
  10. 根据权利要求7所述的显示装置，其中，所述电路封装件还封装所述封装盖板的下表面。
  11. 根据权利要求7所述的显示装置，还包括封装层，其设置在所述封装盖板和所述显示结构之间，用于将所述显示结构与所述平坦化层封装在一起。
  12. 根据权利要求1至3中任一项所述的显示装置，其中，所述显示结构包括有机发光二极管显示面板。
  13. 根据权利要求12所述的显示装置，其中，所述电路结构包括用于控制所述显示结构的显示的驱动控制电路。
  14. 根据权利要求1至3中任一项所述的显示装置，其中，所述电路封装件由树脂形成。
  15. 根据权利要求1至3中任一项所述的显示装置，其中，所述电路封装件为多层膜结构。
  16. 根据权利要求15所述的显示装置，其中，所述多层膜结构为有机薄膜。
  17. 根据权利要求15所述的显示装置，其中，所述多层膜结构为无机薄膜。
  18. 根据权利要求15所述的显示装置，其中，所述多层膜结构为交替设置的无机薄膜和有机薄膜。
  19. 根据权利要求16或18所述的显示装置，其中，所述有机薄膜的材料选自聚酰亚胺、聚脲、聚酰胺酸、聚酯、聚乙烯和聚丙烯中的任意一种。
  20. 根据权利要求17或18所述的显示装置，其中，所述无机薄膜的材料可以选自纳米二氧化硅(SiOx)、氮化硅(SiNx)、氮碳化硅(SiCxNy)、氮氧化硅(SiOxNy)、氧化铝(AlOx)、氧化锡(SnO2)、氮化铝(AlN)、氟化镁(MgF2)、氟化钙(CaF2)、氧化铟(In2O3)和氧化铟锡(ITO)中的任意一种。
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