WO2018099123A1 - 印制线路板及其表面贴装方法 - Google Patents

印制线路板及其表面贴装方法 Download PDF

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WO2018099123A1
WO2018099123A1 PCT/CN2017/096271 CN2017096271W WO2018099123A1 WO 2018099123 A1 WO2018099123 A1 WO 2018099123A1 CN 2017096271 W CN2017096271 W CN 2017096271W WO 2018099123 A1 WO2018099123 A1 WO 2018099123A1
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large device
reflow soldering
mounting
printed wiring
wiring board
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PCT/CN2017/096271
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English (en)
French (fr)
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黄海兵
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威创集团股份有限公司
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Publication of WO2018099123A1 publication Critical patent/WO2018099123A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding

Definitions

  • the invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a surface mounting method thereof.
  • PCB printed circuit board
  • SMT surface mount
  • PCBA plug-in package
  • Welding technology plays an extremely important role in the assembly of printed circuit boards.
  • General welding is divided into reflow and wave soldering.
  • the reflow process is: BOT surface pre-coated solder paste ⁇ patch (divided into manual placement and automatic machine placement) ⁇ reflow soldering ⁇ TOP surface pre-coated solder paste ⁇ patch (divided into manual placement and machine Automatic placement) ⁇ reflow soldering ⁇ inspection and electrical testing; wave soldering process is: insert components into the corresponding component holes ⁇ pre-coat flux ⁇ pre-baking (temperature 90-1000 ° C, length 1-1.2 m) ⁇ peak Welding (220-2400 ° C) ⁇ cut off the extra plug foot ⁇ check. According to the characteristics of the above process, reflow is usually used to solder the chip components, while wave soldering is used to solder the pin components.
  • the chip components are small in size, light in weight, and easy to solder, disassemble, replace, and store, and the resulting circuit has high stability and reliability. Therefore, the soldering method of reflow soldering is more in line with the development direction of multi-functionality, small size, light weight, and high performance of electronic products.
  • wave soldering is only suitable for hand-inserted boards, and all components are required to be heat-resistant.
  • the surface of the over-peak should not have the components of the SMT solder paste.
  • the board of SMT solder paste can only be reflow soldered, and wave soldering should not be used. . Therefore, compared with reflow soldering, wave soldering has a low production efficiency and a narrow application range.
  • SMDs Surface mount devices
  • the SMD large device is designed on the TOP side of the PCB, and as the current PCB design becomes more and more complicated, such as the large device can only be placed on the TOP surface, the PCB board size and the number of layers are greatly increased. , which in turn leads to an increase in costs and complicates the production process.
  • the empty board includes a first surface and a second surface, the first surface is provided with a large device mounting area for mounting the large device, and the large device mounting area includes a pad area corresponding to the solder fillet, and a blank area corresponding to the large device body;
  • dispensing and first side patch performing a dispensing process in the blank area to form a glue layer, and then mounting the large device on the large device mounting area, the glue layer being located Between the large device body and the first surface;
  • Second side treatment conventional printing, patching and reflow soldering may be performed on the second side.
  • the surface mounting method of the above printed circuit board uses the reflow soldering method to perform surface mounting of SMD large devices, and creatively applies the dispensing process to the reflow soldering process, and reflows the second surface of the SMD large device.
  • the problem of easy to drop pieces during welding, the reason for setting the first side of the patch processing process is: first side printing----dispensing----first side patch---reflow soldering. After the first side printing process is completed, the large device disposed on the first side is dispensed between the pads, after the dispensing is completed, the patch is formed, and then, in the subsequent reflow soldering, the glue layer formed by the dispensing is Curing, which in turn secures the large device to the first side.
  • the large device design can be preferentially laid on the second surface, and when the second surface cannot be completed, the large device is laid out on the first surface, thereby further simplifying the dispensing process.
  • Other devices can be arbitrarily arranged according to the circuit.
  • the empty plate of the present invention refers to a sub-board which is produced by a preparation process of a conventional printed wiring board and which has not been surface-mounted.
  • the large device according to the present invention refers to a device which is heavy in weight and/or bulk and which is easy to be dropped during secondary reflow soldering, and specifically includes the device shown in Table 1.
  • the material of the glue layer in step (3) is a poly-dilute compound.
  • the material of the adhesive layer of step (3) is red plastic.
  • the red glue has a freezing point of 150 ° C and a red color.
  • the poly-dilute compound of the freezing point is used as a rubber layer material to ensure the bonding between the large device and the empty plate to prevent it from falling during the reflow soldering of the second surface. At the same time, it can be solidified by the temperature rise of the circuit board during the first surface reflow soldering, simplifying the process.
  • the thickness of the glue layer in step (3) is less than or equal to 0.13 mm.
  • the thickness of the adhesive layer in step (3) is from 0.08 to 0.13 mm.
  • the reflow soldering process of step (4) includes preheating, heat preservation, and soldering.
  • the preheating heating rate is ⁇ 2.5 ° C / s; the tempering temperature is 150 to 200 ° C, the time is 90 to 150 s; the welding is maintained at 217 ° C (the solder paste The time above the melting point temperature is 45 to 55 s.
  • the advantage of the soldering leg of the pin component is long, and the device is usually fixed by dispensing. Since the chip component has a short solder tail, it is necessary to properly control various process parameters such as the thickness of the adhesive layer and the reflow soldering process parameters for the characteristics of the chip component when using the dispensing process.
  • the adhesive layer can be effectively fixed to a large device, and can be sufficiently cured during reflow soldering, thereby tightly bonding large devices, and at the same time, Guarantee the quality of reflow soldering process.
  • the incubation temperature is 170 to 190 ° C and the time is 100 to 120 s.
  • the invention also provides a printed wiring board prepared by the surface mounting method of the printed wiring board.
  • FIG. 1 is a schematic view showing an empty plate obtained in the surface mounting method of Embodiment 1;
  • FIG. 2 is a schematic view of the surface mount method of the first embodiment after dispensing and first patching.
  • a surface mounting method for a printed wiring board is provided.
  • the printed circuit board is provided with a tantalum capacitor (D type), and includes the following steps:
  • the empty board includes a first surface 10 and a second surface 20, and the first surface 10 is provided with a large device mounting area for mounting a tantalum capacitor, and the large device mounting area The pad area corresponding to the solder fillet of the tantalum capacitor and the blank area corresponding to the tantalum capacitor body;
  • (2) PCB layout design the tantalum capacitor design is preferentially arranged on the second surface 20, and the tantalum capacitor is disposed on the first surface 10 when the layout cannot be completed on the second surface 20;
  • First side printing printing a solder paste on the pad area on the first side 10 according to a conventional process
  • a dispensing machine is used to perform a dispensing process at a position in the middle of the blank area on the first side 10 to form a glue layer 40, the material of the glue layer 40. It is red plastic and has a thickness of 0.1 mm.
  • the tantalum capacitor 30 is mounted on the large device mounting area by using a mounter. The solder fillet of the tantalum capacitor 30 is correspondingly disposed in the pad region, and the adhesive layer 40 is located on the body of the tantalum capacitor 30.
  • Reflow soldering reflow soldering the device on the first side 10 (including the tantalum capacitor 30).
  • the process includes preheating, heat preservation and soldering.
  • the specific process parameters are as follows:
  • the preheating heating rate is 2.5 ° C / sec; the holding temperature is 180 ° C, the time is 110 sec; the welding time is maintained above 217 ° C for 50 sec; in the process, the PCB board peak temperature ⁇ 245 ° C, the welding zone peak temperature is 240+/-3°C;
  • Second surface treatment conventional printing, patching and reflow soldering are performed on the second surface 20; when the second surface 20 is reflow soldered, the tantalum capacitor 30 on the first surface 10 is firmly bonded and does not occur. Pieces.
  • a surface mounting method for a printed wiring board is provided.
  • the printed circuit board is provided with a tantalum capacitor (D type), and includes the following steps:
  • the empty board includes a first side and a second side, and the first side is provided with a tantalum capacitor for mounting a large device mounting region including a pad region corresponding to a solder fillet of the tantalum capacitor and a blank region corresponding to the tantalum capacitor body;
  • Dispensing and first-side patch using a dispenser, dispensing a glue layer at a position in the middle of the blank area on the first side, the material of the glue layer is red plastic, and the thickness is 0.1 mm; Then, the tantalum capacitor is mounted on the large device mounting area by using a chip mounter, and the solder fillet of the tantalum capacitor is correspondingly disposed in the pad area, and the glue layer is located between the body of the tantalum capacitor and the first surface;
  • Reflow soldering reflow soldering the device on the first side (including the inductor).
  • the process includes preheating, heat preservation and soldering.
  • the specific process parameters are as follows:
  • the preheating heating rate is 2 ° C / sec; the holding temperature is 150 ° C, the time is 150 sec; the welding time is maintained above 217 ° C for 45 sec; in the process, the PCB board peak temperature ⁇ 245 ° C, the welding zone peak temperature is 240+/-3°C;
  • Second side treatment conventional printing, patching and reflow soldering are performed on the second side; in the reflow soldering of the second side, the tantalum capacitance bonding stability on the first side is slightly worse than that in the first embodiment, However, no missing items occurred.
  • a surface mounting method for a printed wiring board is provided.
  • the printed circuit board is provided with a tantalum capacitor (D type), and includes the following steps:
  • the empty board includes a first surface and a second surface, and the first surface is provided with a large device mounting area for mounting a tantalum capacitor, and the large device mounting area includes a solder fillet phase with a tantalum capacitor a corresponding pad area and a blank area corresponding to the tantalum capacitor body;
  • Dispensing and first-side patch using a dispenser, dispensing a glue layer at a position in the middle of the blank area on the first side, the material of the glue layer is red plastic, and the thickness is 0.1 mm; Then, the tantalum capacitor is mounted on the large device mounting area by using a chip mounter, and the solder fillet of the tantalum capacitor is correspondingly disposed in the pad area, and the glue layer is located between the body of the tantalum capacitor and the first surface;
  • Reflow soldering reflow soldering the device on the first side (including tantalum capacitor).
  • the process includes preheating, heat preservation and soldering.
  • the specific process parameters are as follows:
  • the preheating heating rate is 2.5 ° C / sec; the holding temperature is 200 ° C, the time is 90 sec; the welding time is maintained above 217 ° C for 55 sec; in the process, the PCB board peak temperature ⁇ 245 ° C, the welding zone peak temperature is 240+/-3°C;
  • Second side treatment conventional printing, patching and reflow soldering are performed on the second side; in the reflow soldering of the second side, the tantalum capacitance bonding stability on the first side is slightly worse than that in the first embodiment, However, no missing items occurred.
  • a surface mounting method of a printed circuit board is provided.
  • the printed circuit board is provided with an inductance (L*W ⁇ 5cm), and includes the following steps:
  • the empty board includes a first side and a second side, and the first side is provided with a large device mounting area for mounting an inductor, and the large device mounting area includes a soldering leg corresponding to the inductor a pad area, and a blank area corresponding to the inductor body;
  • PCB layout design the inductor design is preferentially placed on the second side, and the inductor is placed on the first side when the layout cannot be completed on the second side;
  • Dispensing and first-side patch using a dispenser, dispensing a glue layer at a position in the middle of the blank area on the first side, the material of the glue layer is red plastic, and the thickness is 0.1 mm; Then, the inductor is mounted on the mounting area of the large device by using a chip mounter, and the solder fillet of the inductor is correspondingly disposed in the pad area, and the glue layer is located between the body of the inductor and the first surface;
  • Reflow soldering reflow soldering of devices (including inductors) on the first side, including Preheating, heat preservation and welding, the specific process parameters are as follows:
  • the preheating heating rate is 2.5 ° C / sec; the holding temperature is 180 ° C, the time is 110 sec; the welding time is maintained above 217 ° C for 50 sec; in the process, the PCB board peak temperature ⁇ 245 ° C, the welding zone peak temperature is 240+/-3°C;
  • Second side treatment conventional printing, patching and reflow soldering are performed on the second side; during reflow soldering of the second side, the inductance on the first side is firmly bonded, and no missing parts occur.

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Abstract

一种印制线路板的表面贴装方法，该印制线路板设有大器件，该大器件包括大器件本体和焊脚，包括如下步骤：（1）获取空板：所述空板包括第一面（10）和第二面（20），该第一面（10）设有大器件贴装区域，包括焊盘区域和空白区域；（2）第一面印刷：于焊盘区域内进行印锡膏；（3）点胶和第一面贴片：于空白区域内进行点胶形成胶层（40），然后将该大器件贴装于该大器件贴装区域；（4）回流焊：对贴装后的该大器件进行回流焊；（5）二面处理：对该第二面（20）进行常规印刷、贴片和回流焊，即可。上述方法解决了大器件布局在第一面（10）掉件的问题，同时，无需增加PCB板的尺寸，降低了生产成本，提高PCB布局效率，且方法简单，便于工业应用。

Description

印制线路板及其表面贴装方法 技术领域
本发明涉及印制电路板技术领域，特别是涉及印制线路板及其表面贴装方法。
背景技术
印制电路板组装是指印制电路板(PCB)的空板经过表面贴装(SMT)上件，再经过插件封装的整个制程，简称PCBA。
焊接技术在印制电路板组装中占有极其重要的地位。一般焊接分为回流焊和波峰焊。其中，回流焊的流程为：BOT面预涂锡膏→贴片(分为手工贴装和机器自动贴装)→回流焊→TOP面预涂锡膏→贴片(分为手工贴装和机器自动贴装)→回流焊→检查及电测试；波峰焊的流程为：将元件插入相应的元件孔中→预涂助焊剂→预烘(温度90-1000℃，长度1-1.2m)→波峰焊(220-2400℃)→切除多余插件脚→检查。根据上述工艺流程特点，回流焊通常用于焊接贴片元件，而波峰焊则用于焊接插脚元件。
与插脚元件相比，贴片元件体积小，重量轻，且容易进行焊接、拆卸、替换和保存，制作得到的电路的稳定性和可靠性高。因此，回流焊的焊接方式较波峰焊更符合电子产品多功能化、小型轻量化、高性能化的发展方向。另外，波峰焊只适用于手插板，而且要求所有元件要耐热，过波峰的表面不可以有曾经SMT锡膏的元件，SMT锡膏的板子就只可以过回流焊，不可以用波峰焊。因此，与回流焊相比较，波峰焊的生产效率低，应用范围窄。
表面贴装器件(SMD)中包括一类大器件，其由于重量、体积较大而容易在PCBA第二次回流焊时发生掉件的情况，影响印制电路板的生产。
目前，为了减少SMD大器件在第二次回流焊中掉件，采用的PCB设计和工艺流程如下：
(1)PCB设计时先把大器件布局在TOP；
(2)当TOP面布局不下所有大器件时增加PCB设计尺寸，直到所有大器件能够有效地布局在TOP面；
(3)其他器件根据电路任意在TOP面或BOT面进行布局设计；
(4)加工PCB；
(5)PCBA加工：
a、BOT面贴片加工：印刷---贴片---回流焊接----AOI检测；
b、TOP面贴片加工：印刷---贴片---回流焊接----AOI检测；
(6)后续工艺。
上述PCB设计和工艺流程中，把SMD大器件设计在PCB的TOP面，而随着目前PCB设计越来越复杂，如大器件只能布局在TOP面会极大的增加PCB单板尺寸和层数，进而导致成本的增加，并使生产工艺复杂化。
发明内容
基于此，有必要提供一种能够有效解决SMD大器件在PCBA过程中掉件的问题，同时不会增加PCB生产成本，生产工艺简单的印制线路板的表面贴装方法。
一种印制线路板的表面贴装方法，所述印制线路板设有大器件，所述大器件包括大器件本体和焊脚，包括如下步骤：
(1)获取空板：所述空板包括第一面和第二面，所述第一面设有用于贴装所述大器件的大器件贴装区域，所述大器件贴装区域中包括与所述焊脚相对应的焊盘区域，以及与所述大器件本体相对应的空白区域；
(2)第一面印刷：对所述焊盘区域处进行印锡膏；
(3)点胶和第一面贴片：于所述空白区域内进行点胶处理形成胶层，然后将所述大器件贴装于所述大器件贴装区域，所述胶层位于所述大器件本体与所述第一面之间；
(4)回流焊：对贴装后的所述大器件进行回流焊；
(5)第二面处理：对所述第二面进行常规印刷、贴片和回流焊，即可。
上述印制线路板的表面贴装方法，采用回流焊的方式进行SMD大器件的表面贴装，且创造性的将点胶工艺应用于回流焊的工艺流程中，针对SMD大器件在第二面回流焊接时容易掉件的问题，合理设置第一面的贴片加工工序为：第一面印刷----点胶----第一面贴片---回流焊。当完成第一面印刷工序后，对布局在第一面的大器件在其焊盘之间进行点胶，点胶完成后进行贴片，然后在后续回流焊时，点胶形成的胶层会固化，进而把大器件固定在第一面上。由此，在后续第二面的表面贴装加工时，由于大器件通过胶层和PCB固化粘接在一起，因此不会出现掉件，从而解决了大器件布局在第一面掉件的问题，同时，无需增加PCB板的尺寸，降低了生产成本，提高PCB布局效率，且方法简单，便于工业应用。
在进行上述表面贴装方法时，可优先将大器件设计布局在第二面上，当在第二面无法完成布局时再把大器件布局在第一面，由此可进一步简化点胶工序，其它器件可根据电路进行任意布局。
本发明所述空板是指采用常规印制线路板的制备工序制作得到，还未进行器件的表面贴装的子板。
本发明所述的大器件是指，重量和/或体积较大，在二次回流焊接时容易掉件的器件，具体可包括表1所示器件。
表1
分类 尺寸规格
铝电解电容 所有
固态电容 所有
电感 L*W≥5cm
钽电容 C型号、D型号
贴片螺母 所有
在其中一个实施例中，步骤(3)所述胶层的材料为聚稀化合物。
在其中一个实施例中，步骤(3)所述胶层的材料为红胶。红胶的凝固点为150℃，颜色为红色，采用该凝固点的聚稀化合物作为胶层材料，能够保证大器件与空板之间粘结紧固，防止其在第二面的回流焊接时掉落，同时，能够利用第一面回流焊接时线路板的升温而固化，简化工艺。
在其中一个实施例中，步骤(3)所述胶层的厚度小于等于0.13mm。
在其中一个实施例中，步骤(3)所述胶层的厚度为0.08～0.13mm。
在其中一个实施例中，步骤(4)所述回流焊接的工艺包括预热、保温和焊接。
在其中一个实施例中，所述预热的升温速率≤2.5℃/s；所述保温的温度为150～200℃，时间为90～150s；所述焊接时保持217℃(所述锡膏的熔点温度)以上的时间为45～55s。
现有的波峰焊中，为使器件在后续受到波峰冲击时保持稳定，利用插脚元件的焊脚较长的优点，通常会进行点胶使器件固定。而贴片元件由于焊脚较短，因此在采用点胶工艺时需要针对贴片元件的特点对各工艺参数，如胶层厚度、回流焊工艺参数等进行合理控制。
采用如上所述胶层厚度以及回流焊接时线路板的温度，可使胶层能够对大器件进行有效的固定，并且在回流焊时可以充分固化，进而紧密的粘结大器件，同时，还可以保证回流焊的工艺质量。
在其中一个实施例中，所述保温的温度为170～190℃，时间为100～120s。
本发明还提供所述的印制线路板的表面贴装方法制备得到的印制线路板。
附图说明
图1为实施例1的表面贴装方法中获取空板的示意图；
图2为实施例1的表面贴装方法中点胶和第一面贴片后的示意图。
具体实施方式
以下结合具体实施例对本发明的印制线路板及其表面贴装方法作进一步详 细的说明。
实施例1
本实施例一种印制线路板的表面贴装方法，所述印制线路板设有钽电容(D型)，包括如下步骤：
(1)获取空板：如图1所示，空板包括第一面10和第二面20，第一面10设有用于贴装钽电容的大器件贴装区域，该大器件贴装区域中包括与钽电容的焊脚相对应的焊盘区域，以及与钽电容本体相对应的空白区域；
(2)PCB布局设计：优先将钽电容设计布局在第二面20上，当在第二面20上无法完成布局时再把钽电容布局在第一面10上；
(3)第一面印刷：按照常规工序对第一面10上焊盘区域进行印锡膏；
(4)点胶和第一面贴片：如图2所示，采用点胶机，在第一面10上的空白区域的中间位置处进行点胶处理形成胶层40，胶层40的材料为红胶，厚度为0.1mm；然后采用贴片机将钽电容30贴装于大器件贴装区域，钽电容30的焊脚对应设置于焊盘区域，胶层40位于钽电容30的本体与第一面10之间；
(5)回流焊接：对第一面10上的器件(包括钽电容30)进行回流焊接，工艺包括预热、保温和焊接，具体工艺参数如下：
预热的升温速率2.5℃/sec；保温的温度为180℃，时间为110sec；焊接时保持217℃以上的时间为50sec；在该过程中，PCB板峰值温度≤245℃，焊接区峰值温度为240+/-3℃；
(6)第二面处理：对第二面20进行常规印刷、贴片和回流焊接；在该第二面20的回流焊接时，第一面10上的钽电容30粘结稳固，未发生掉件。
实施例2
本实施例一种印制线路板的表面贴装方法，所述印制线路板设有钽电容(D型)，包括如下步骤：
(1)获取空板：空板包括第一面和第二面，第一面设有用于贴装钽电容的 大器件贴装区域，该大器件贴装区域中包括与钽电容的焊脚相对应的焊盘区域，以及与钽电容本体相对应的空白区域；
(2)PCB布局设计：优先将钽电容设计布局在第二面上，当在第二面上无法完成布局时再把钽电容布局在第一面上；
(3)第一面印刷：按照常规工序对第一面上焊盘区域进行印锡膏；
(4)点胶和第一面贴片：采用点胶机，在第一面上的空白区域的中间位置处进行点胶处理形成胶层，胶层的材料为红胶，厚度为0.1mm；然后采用贴片机将钽电容贴装于大器件贴装区域，钽电容的焊脚对应设置于焊盘区域，胶层位于钽电容的本体与第一面之间；
(5)回流焊接：对第一面上的器件(包括电感)进行回流焊接，工艺包括预热、保温和焊接，具体工艺参数如下：
预热的升温速率2℃/sec；保温的温度为150℃，时间为150sec；焊接时保持217℃以上的时间为45sec；在该过程中，PCB板峰值温度≤245℃，焊接区峰值温度为240+/-3℃；
(6)第二面处理：对第二面进行常规印刷、贴片和回流焊接；在该第二面的回流焊接时，第一面上的钽电容粘结稳固程度较实施例1稍差，但未发生掉件。
实施例3
本实施例一种印制线路板的表面贴装方法，所述印制线路板设有钽电容(D型)，包括如下步骤：
(1)获取空板：空板包括第一面和第二面，第一面设有用于贴装钽电容的大器件贴装区域，该大器件贴装区域中包括与钽电容的焊脚相对应的焊盘区域，以及与钽电容本体相对应的空白区域；
(2)PCB布局设计：优先将钽电容设计布局在第二面上，当在第二面上无法完成布局时再把钽电容布局在第一面上；
(3)第一面印刷：按照常规工序对第一面上焊盘区域进行印锡膏；
(4)点胶和第一面贴片：采用点胶机，在第一面上的空白区域的中间位置处进行点胶处理形成胶层，胶层的材料为红胶，厚度为0.1mm；然后采用贴片机将钽电容贴装于大器件贴装区域，钽电容的焊脚对应设置于焊盘区域，胶层位于钽电容的本体与第一面之间；
(5)回流焊接：对第一面上的器件(包括钽电容)进行回流焊接，工艺包括预热、保温和焊接，具体工艺参数如下：
预热的升温速率2.5℃/sec；保温的温度为200℃，时间为90sec；焊接时保持217℃以上的时间为55sec；在该过程中，PCB板峰值温度≤245℃，焊接区峰值温度为240+/-3℃；
(6)第二面处理：对第二面进行常规印刷、贴片和回流焊接；在该第二面的回流焊接时，第一面上的钽电容粘结稳固程度较实施例1稍差，但未发生掉件。
实施例4
本实施例一种印制线路板的表面贴装方法，所述印制线路板设有电感(L*W≥5cm)，包括如下步骤：
(1)获取空板：空板包括第一面和第二面，第一面设有用于贴装电感的大器件贴装区域，该大器件贴装区域中包括与电感的焊脚相对应的焊盘区域，以及与电感本体相对应的空白区域；
(2)PCB布局设计：优先将电感设计布局在第二面上，当在第二面上无法完成布局时再把电感布局在第一面上；
(3)第一面印刷：按照常规工序对第一面上焊盘区域进行印锡膏；
(4)点胶和第一面贴片：采用点胶机，在第一面上的空白区域的中间位置处进行点胶处理形成胶层，胶层的材料为红胶，厚度为0.1mm；然后采用贴片机将电感贴装于大器件贴装区域，电感的焊脚对应设置于焊盘区域，胶层位于电感的本体与第一面之间；
(5)回流焊接：对第一面上的器件(包括电感)进行回流焊接，工艺包括 预热、保温和焊接，具体工艺参数如下：
预热的升温速率2.5℃/sec；保温的温度为180℃，时间为110sec；焊接时保持217℃以上的时间为50sec；在该过程中，PCB板峰值温度≤245℃，焊接区峰值温度为240+/-3℃；
(6)第二面处理：对第二面进行常规印刷、贴片和回流焊接；在该第二面的回流焊接时，第一面上的电感粘结稳固，未发生掉件。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (8)

  1. 一种印制线路板的表面贴装方法，所述印制线路板设有大器件，所述大器件包括大器件本体和焊脚，其特征在于，包括如下步骤：
    (1)获取空板：所述空板包括第一面和第二面，所述第一面设有用于贴装所述大器件的大器件贴装区域，所述大器件贴装区域中包括与所述焊脚相对应的焊盘区域，以及与所述大器件本体相对应的空白区域；
    (2)第一面印刷：于所述焊盘区域内进行印锡膏；
    (3)点胶和第一面贴片：于所述空白区域内进行点胶形成胶层，然后将所述大器件贴装于所述大器件贴装区域，所述胶层位于所述大器件本体与所述第一面之间；
    (4)回流焊：对贴装后的所述大器件进行回流焊；
    (5)第二面处理：对所述第二面进行常规印刷、贴片和回流焊，即可。
  2. 根据权利要求1所述的印制线路板的表面贴装方法，其特征在于，步骤(3)所述胶层的材料为聚稀化合物。
  3. 根据权利要求1所述的印制线路板的表面贴装方法，其特征在于，步骤(3)所述胶层的厚度小于等于0.13mm。
  4. 根据权利要求3所述的印制线路板的表面贴装方法，其特征在于，步骤(3)所述胶层的厚度为0.08～0.13mm。
  5. 根据权利要求1-4任一项所述的印制线路板的表面贴装方法，其特征在于，步骤(4)所述回流焊的工艺包括预热、保温和焊接。
  6. 根据权利要求5所述的印制线路板的表面贴装方法，其特征在于，所述预热的升温速率≤2.5℃/s；所述保温的温度为150～200℃，时间为90～150s；所述焊接时保持温度217℃以上的时间为45～55s。
  7. 根据权利要求6所述的印制线路板的表面贴装方法，其特征在于，所述保温的温度为170～190℃，时间为100～120s。
  8. 权利要求1-7任一项所述的印制线路板的表面贴装方法制备得到的印制线路板。
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