WO2018094965A1 - 微波器件焊接基体及微波器件 - Google Patents

微波器件焊接基体及微波器件 Download PDF

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Publication number
WO2018094965A1
WO2018094965A1 PCT/CN2017/081978 CN2017081978W WO2018094965A1 WO 2018094965 A1 WO2018094965 A1 WO 2018094965A1 CN 2017081978 W CN2017081978 W CN 2017081978W WO 2018094965 A1 WO2018094965 A1 WO 2018094965A1
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WIPO (PCT)
Prior art keywords
soldering
microwave device
groove
welding
tin
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PCT/CN2017/081978
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English (en)
French (fr)
Inventor
刘培涛
卜斌龙
游建军
段红彬
彭李静
Original Assignee
京信通信技术(广州)有限公司
京信通信系统（中国）有限公司
天津京信通信系统有限公司
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Application filed by 京信通信技术(广州)有限公司, 京信通信系统（中国）有限公司, 天津京信通信系统有限公司 filed Critical 京信通信技术(广州)有限公司
Priority to EP17873013.1A priority Critical patent/EP3546102A4/en
Priority to US16/463,443 priority patent/US20190319370A1/en
Priority to BR112019010605A priority patent/BR112019010605A2/pt
Publication of WO2018094965A1 publication Critical patent/WO2018094965A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors

Definitions

  • the present invention relates to the field of soldering technology for mobile communication devices, and more particularly to a microwave device soldering substrate and a microwave device using the microwave device to solder the substrate.
  • microwave devices are often used in the field of microwave communication technology. Especially for the field of communication, the stability of the electrical performance of microwave devices is very important.
  • Microwave devices require the use of external cables, but due to the need for the selection of existing microwave devices.
  • the commonly used material is aluminum alloy, and the aluminum alloy itself cannot be soldered directly to the cable through solder. Therefore, it is often necessary to perform overall plating on the microwave device before soldering, but since the plating of the entire device itself is costly, and The parts that need to be welded are only a small part, so the cost is too high.
  • solderable conductor can be soldered to the non-corrodible base.
  • the technique disclosed in the patent is a coating process to spray a layer of copper (copper) in an aluminum welded base weld.
  • the copper substrate is relatively strong after soldering between the aluminum substrate and the coaxial cable, its vibration resistance and tensile strength are still weak, and the solder joint is subjected to large vibration or the coaxial cable is pulled hard.
  • the coaxial cable is easy to carry solder (ie, solder) from the soldering groove of the soldering substrate.
  • the traditional welding scheme is not strong, the reliability is poor, there is a safety hazard, and the electrical performance index of the microwave device cannot be guaranteed.
  • the purpose of the present invention is to solve the problem that the welding method of the welding method of the microwave device in the prior art is not strong,
  • the technical problem that the solder is easy to fall off provides a microwave device and a soldering base thereof which have a simple structure and improve the reliability of the connection between the solder substrate and the soldered member.
  • a microwave device welding substrate comprising a cavity and a soldering groove disposed on the cavity, the inner side wall of the soldering groove is provided with at least one soldering space, and the soldering space is opposite to the inner side of the soldering groove
  • the direction of the angle is extended so that the solder (for example, solder) is solidified to form a physical interference structure with the soldering groove, which restricts the movement of the solder relative to the soldering groove, thereby preventing the solder and the soldered member from falling off the soldering groove.
  • the at least one tin-receiving space is uniformly or discretely disposed inside the welding groove.
  • the welding groove is distributed with a plurality of the tin-receiving spaces on the same cross section.
  • the tin-storing spaces are correspondingly disposed at positions at the same height of a pair of opposite sides of the welding groove.
  • the distance between every two adjacent tin-filled spaces on the same cross-section is equal.
  • the tin-storage space is disposed at the intersection of the side and the bottom of the weld groove.
  • the tin-receiving space includes a groove disposed on a side of the welding groove.
  • the sides of the welding groove are unevenly disposed to form the groove.
  • the tin-receiving space comprises a through hole penetrating the side of the welding groove and/or a blind hole opening from the inner side of the welding groove on the side of the welding groove.
  • the microwave device welding substrate is integrally formed by a pultrusion or die casting process.
  • a microwave device that uses the above microwave device to solder a substrate.
  • the present invention has the following advantages:
  • the solution of the present invention is provided with a tin-receiving space on the inner side of the soldering groove, and the tin-receiving space extends in an angle at an angle with the inner side wall of the soldering groove, so that when soldering, part of the solder will enter the soldering space, and then in the solder After the cold setting, the part of the solder is trapped in the soldering space, and the solder is not easily detached from the soldering groove, thereby solving the technical problem that the soldering point of the existing microwave device soldering scheme is not strong and the solder is easily detached.
  • the welding device of the microwave device of the invention has the characteristics of firm and reliable solder joints, thereby ensuring the reliability of the electrical connection of the microwave device.
  • the welding device of the microwave device has a simple structure and is integrally formed by a pultrusion or die-casting process, and has good consistency, which is advantageous for mass production.
  • FIG. 1 is a schematic structural view of a welding base of a microwave device according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a welding base of a microwave device according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a welding base of a microwave device according to still another embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a microwave device according to an embodiment of the present invention.
  • FIG. 1 is a partial schematic view of a preferred embodiment of a soldering substrate for a microwave device of the present invention, showing the structure of the soldering substrate of the microwave device at the solder joint.
  • the microwave device soldering substrate (hereinafter referred to as "welding substrate”) includes a cavity 1, a soldering groove 2 and at least one soldering space 6; wherein the soldering groove 2 is disposed on the cavity 1 for accommodating a soldering member 4, and the soldered member 4 may be soldered to the inner sidewall 5 of the soldering groove 2 by solder 3; the soldering space 6 is disposed on the inner sidewall 5 of the soldering groove 2 for cooling the solder A physical interference structure is then formed with the inside of the solder bath such that the solder 3 is stuck to define the longitudinal movement of the solder, thereby preventing the solder 3 from falling out of the solder bath 2, thereby ensuring the reliability of the soldered connection to the solder substrate.
  • solder part 4 When the soldered part 4 is soldered to the inner side wall 5 of the soldering groove 2 by the solder 3, since the soldering space 6 is opened on the inner side wall 5, the solder 2 is covered in the soldered part 4 in a hot melt state.
  • the solder 2 flows into the solder space 6, so that the solder 2 has a part when solidified. It is fixed in the tin-filled space 6, thereby achieving the locking and fixing of the solder 2, and defining the longitudinal movement of the solder. Even if the solder is loose at the solder joint, it will not fall off from the soldering groove 2, and the soldered substrate and the soldered body are improved. Reliability of the weldment connection.
  • the welding groove may be plated and sprayed with a solderable material to enable better connection between the inside of the soldering groove and the solder.
  • the at least one tin-receiving space 6 is uniformly or discretely disposed on the inner sidewall 5 of the soldering groove 2.
  • the welding groove 2 is distributed with a plurality of the tin-receiving spaces 6 on the same cross section.
  • the tin-receiving spaces 6 are correspondingly disposed at positions at the same height of a pair of opposite side walls of the welding groove 2.
  • the distance between every two adjacent tin-filled spaces on the same cross-section is equal.
  • the tin-filled space 6 is disposed at the intersection of the side wall and the bottom of the weld tank 2.
  • the tin-receiving space 6 is at least one of a groove disposed on the inner side wall 5 of the soldering groove 2, a through hole and a blind hole formed on the sidewall of the soldering groove 2.
  • the inner side wall 5 of the welding groove 2 is unevenly disposed to form the groove.
  • the welding device of the microwave device of the invention has a simple structure, and the cavity 1 and the welding groove 2 can be processed by various molding processes such as pultrusion and die casting, which is advantageous for mass production.
  • the present invention also relates to a microwave device for soldering a substrate using the above microwave device, wherein a microwave network 7 of the microwave device is disposed in the cavity 1. Due to the use of the above-mentioned microwave device soldering substrate, the microwave device of the present invention has a firm and reliable connection between the solder substrate and the soldered member, thereby making the signal transmission of the microwave device safe, stable and reliable.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
  • Arc Welding In General (AREA)

Abstract

一种微波器件焊接基体，包括腔体（1）及设置在所述腔体（1）上的焊接槽（2），所述焊接槽（2）的内侧壁上设有至少一个容锡空间（6），并且所述容锡空间（6）以与焊接槽（2）的内侧成夹角的方向延伸。还涉及一种采用所述微波器件焊接基体的微波器件。通过在焊接槽（2）的内侧设置有容锡空间（6），使得焊接时部分焊料（3）会进入该容锡空间（6），进而在焊料（3）硬化后使得焊料（3）会被卡在所述容锡空间（6）内，焊料（3）不易脱落，解决了现有的微波器件焊接方案中焊接点不牢固、焊料容易脱落的问题。

Description

微波器件焊接基体及微波器件 【技术领域】
本发明涉及移动通信器件焊接技术领域，尤其涉及一种微波器件焊接基体及采用该微波器件焊接基体的微波器件。
【背景技术】
目前，在微波通信技术领域中，常常用到微波器件，特别是对于通讯领域，微波器件的电气性能的稳定是非常重要，微波器件均为需要外接电缆使用，但是由于现有微波器件选材的需要，常用的材料为铝合金，而铝合金本身并不能通过焊锡直接与电缆焊接，因此常常需要对微波器件进行整体电镀后，才能进行焊接，但是由于对整个器件本身进行电镀成本较高，且其需要进行焊接的部位只占一小部分，因此导致其成本过高。
为了解决上述问题，专利号为CN201510515683.9的可锡焊导体与非可锡焊基体焊接的实现方法、应用方法和连接结构，提出了一种在微波器件上喷上可焊接材料的方案来实现可锡焊导体与非可锡焊基体焊接。
但是该现有技术中，存在以下问题：焊料从焊接基体中脱落的现象是很普遍的，尤其是表面焊接或者是设置带焊槽的焊接点焊接，被焊件容易携带焊料从焊接基体中脱落。对于铝质焊接基体与同轴电缆(即被焊件)焊接，该专利公开的技术为经过涂覆处理，在铝质焊接基体焊槽内喷涂一层铜(覆铜)。虽然经过覆铜处理，铝质基体与同轴电缆之间焊接后较为牢固，但是其抗震动能力和抗拉能力还是较弱，焊点在经历大震动或者同轴电缆被用力拉的情况下，同轴电缆容易携带焊锡(即焊料)从焊接基体的焊槽中脱落。
因此，传统的焊接方案不牢固，可靠性差，存在安全隐患，无法保证微波器件的电气性能指标的稳定。
【发明内容】
本发明的目的旨在解决现有技术中微波器件的焊接方式焊接点不牢固、 焊料容易脱落的技术问题，提供了一种结构简单、提高焊接基体与被焊件的连接可靠性的微波器件及其焊接基体。
为实现该目的，本发明采用如下技术方案：
一种微波器件焊接基体，包括腔体及设置在所述腔体上的焊接槽，所述焊接槽的内侧壁上设有至少一个容锡空间，并且所述容锡空间以与焊接槽的内侧成夹角的方向延伸，使得焊料(例如焊锡)冷固后与焊接槽形成物理干涉结构，限制焊料相对焊接槽的运动，进而防止焊料及被焊件从焊接槽上脱落。
优选地，所述至少一个容锡空间均匀或离散设置在所述焊接槽的内侧。
优选地，所述焊接槽在同一横截面上分布有多个所述容锡空间。
优选地，当所述至少一个容锡空间均匀设置在焊接槽内侧时，所述容锡空间一一对应配对设于焊接槽一对相对的侧边相同高度的位置处。
优选地，同一横截面上每两个相邻的容锡空间之间的距离相等。
优选地，所述容锡空间设置在所述焊接槽的侧边与底部的交汇处。
优选地，所述容锡空间包括设置在所述焊接槽侧边上的凹槽。
优选地，所述焊接槽的侧边凹凸不平设置以形成所述凹槽。
优选地，所述容锡空间包括贯通所述焊接槽侧边的通孔和/或从焊接槽内侧开设在焊接槽侧边上的盲孔。
优选地，该微波器件焊接基体通过拉挤或压铸工艺一体成型。
一种微波器件，其采用上述微波器件焊接基体。
与现有技术相比，本发明具备如下优点：
本发明方案在焊接槽的内侧设置有容锡空间，并且容锡空间以与焊接槽内侧壁呈夹角的方向延伸，使得在进行焊接时，部分焊料会-进入该容锡空间，进而在焊料冷固后使得该部分焊料会被卡在所述容锡空间内，焊料不易从焊槽中脱落，解决了现有的微波器件焊接方案中焊接点不牢固、焊料容易脱落的技术问题。本发明的微波器件焊接基体，具有焊点牢固可靠的特点，从而可以保证微波器件的电气连接的可靠性。此外，该微波器件焊接基体结构简单，采用拉挤或压铸工艺一体成型，一致性好，利于批量化生产。
本发明附加的方面和优点将在下面的描述中部分给出，这些将从下面的描述中变得明显，或通过本实用新型的实施例了解到。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，但本发明不限于此。
图1为本发明一个实施例中微波器件焊接基体的结构示意图；
图2为本发明另一个实施例中微波器件焊接基体的结构示意图；
图3为本发明又一个实施例中微波器件焊接基体的结构示意图；
图4为本发明一个实施例中微波器件的结构示意图。
【具体实施方式】
下面结合附图和示例性实施例对本发明作进一步地描述，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。此外，如果已知技术的详细描述对于示出本发明的特征是不必要的，则将其省略。
下文详细说明本发明的具体实施方式。
在本方案的一个实施例中，具体请参见附图1，图1为本发明的微波器件焊接基体的优选实施例的局部示意图，示出了微波器件焊接基体在焊接点处的结构。
所述微波器件焊接基体(以下简称“焊接基体”)包括有腔体1、焊接槽2和至少一个容锡空间6；其中所述焊接槽2设置在所述腔体1上，用于容纳被焊件4，并可通过焊料3将被焊件4焊接在该焊接槽2的内侧壁5；所述容锡空间6设置在所述焊接槽2的内侧壁5上，用于使焊料冷固后与所述焊接槽内侧形成物理干涉结构，使得焊料3被卡住以限定焊料的纵向运动，从而防止焊料3从焊接槽2中脱落，进而保证被焊接与焊接基体连接的可靠性。
当通过焊料3将被焊件4焊接在焊接槽2的内侧壁5上时，由于在该内侧壁5上开设有容锡空间6，焊料2在热熔状态下，覆盖在被焊件4和容锡空间6之间时，焊料2流入所述容锡空间6中，使得焊料2在凝固时有部分 固定在容锡空间6中，从而实现对焊料2的卡接固定，限定了焊料的纵向运动，即使焊料在焊点处发生松动，也不会从焊接槽2中脱落，提高了焊接基体和被焊件连接的可靠性。
优选地，在应用时，为了提高焊接效果，可以对所述焊接槽进行电镀、喷涂可焊接材料的处理，使到所述焊接槽内侧与焊料之间能更好的连接。
请结合图2和图3，进一步地，在本方案的一个实施例中，所述至少一个容锡空间6均匀或离散设置在所述焊接槽2的内侧壁5上。
具体地，当所述至少一个容锡空间6均匀设置在焊接槽2内侧壁时，所述焊接槽2在同一横截面上分布有多个所述容锡空间6。其中，所述容锡空间6一一对应配对设于焊接槽2一对相对的侧壁相同高度的位置处。优选地，同一横截面上每两个相邻的容锡空间之间的距离相等。
在本方案的一个优选实施例中，所述容锡空间6设置在所述焊接槽2的的侧壁与底部的交汇处。
在本方案的一个实施例中，所述容锡空间6为设置在所述焊接槽2内侧壁5上的凹槽、开设在焊接槽2侧壁上的通孔和盲孔中的至少一种。
具体地，所述焊接槽2内侧壁5凹凸不平设置，从而形成所述凹槽。
本发明的微波器件焊接基体结构简单，其腔体1与焊接槽2可通过拉挤，压铸等多种成型工艺加工，利于批量生产。
此外，如图4所示，本发明还涉及一种采用上述微波器件焊接基体的微波器件，其中，微波器件的微波网络7设置在所述腔体1内。由于采用上述微波器件焊接基体，本发明的微波器件具有焊接基体与被焊件的连接牢固可靠，从而使得微波器件的信号传输安全、稳定而可靠。
在此处所提供的说明书中，虽然说明了大量的具体细节。然而，能够理解，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实施例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
虽然上面已经示出了本发明的一些示例性实施例，但是本领域的技术人员将理解，在不脱离本发明的原理或精神的情况下，可以对这些示例性实施例做出改变，本发明的范围由权利要求及其等同物限定。

Claims (11)

  1. 一种微波器件焊接基体，包括腔体及设置在所述腔体上的焊接槽，其特征在于：所述焊接槽的内侧壁上设有至少一个容锡空间，并且所述容锡空间以与焊接槽的内侧成夹角的方向延伸。
  2. 根据权利要求1所述的微波器件焊接基体，其特征在于：所述至少一个容锡空间均匀或离散设置在所述焊接槽的内侧壁上。
  3. 根据权利要求2所述的微波器件焊接基体，其特征在于：所述焊接槽在同一横截面上分布有多个所述容锡空间。
  4. 根据权利要求2所述的微波器件焊接基体，其特征在于：当所述至少一个容锡空间均匀设置在焊接槽内侧时，所述容锡空间一一对应配对设于焊接槽一对相对的侧壁上。
  5. 根据权利要求4所述的微波器件焊接基体，其特征在于：同一横截面上每两个相邻的容锡空间之间的距离相等。
  6. 根据权利要求1所述的微波器件焊接基体，其特征在于：所述容锡空间设置在所述焊接槽的侧壁与底部的交汇处。
  7. 根据权利要求1所述的微波器件焊接基体，其特征在于：所述容锡空间包括设置在所述焊接槽侧壁上的凹槽。
  8. 根据权利要求7所述的微波器件焊接基体，其特征在于：所述焊接槽的内侧壁凹凸不平设置以形成所述凹槽。
  9. 根据权利要求1所述的微波器件焊接基体，其特征在于：所述容锡空间包括贯通所述焊接槽侧壁的通孔和/或从焊接槽内侧开设在焊接槽侧壁上的盲孔。
  10. 根据权利要求1所述的微波器件焊接基体，其特征在于：该微波器件焊接基体通过拉挤或压铸工艺一体成型。
  11. 一种微波器件，其特征在于：采用权利要求1至10任意一项所述的微波器件焊接基体。
PCT/CN2017/081978 2016-11-23 2017-04-26 微波器件焊接基体及微波器件 WO2018094965A1 (zh)

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