WO2018086148A1 - 用于刀具刃口加工的工装夹具、装置及方法 - Google Patents

用于刀具刃口加工的工装夹具、装置及方法 Download PDF

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Publication number
WO2018086148A1
WO2018086148A1 PCT/CN2016/106316 CN2016106316W WO2018086148A1 WO 2018086148 A1 WO2018086148 A1 WO 2018086148A1 CN 2016106316 W CN2016106316 W CN 2016106316W WO 2018086148 A1 WO2018086148 A1 WO 2018086148A1
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Prior art keywords
laser
tool
cutting edge
processing
cutter
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Ceased
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PCT/CN2016/106316
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English (en)
French (fr)
Inventor
季凌飞
王文豪
燕天阳
姜锐
王思聪
林真源
杨强
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Beijing University of Technology
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Beijing University of Technology
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Priority to US15/574,503 priority Critical patent/US20190210156A1/en
Publication of WO2018086148A1 publication Critical patent/WO2018086148A1/zh
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/20—Tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Definitions

  • the present invention relates to the field of laser precision machining technology, and more particularly to a fixture, apparatus and method for tool edge machining.
  • Diamond has been used in machining as a superhard tool material for hundreds of years.
  • the tool material was mainly represented by high-speed steel.
  • Germany first developed the cemented carbide tool material and was widely used; in the 1950s, Sweden and Synthetic diamonds were synthesized in the United States, and the cutting tools were stepped into the period represented by superhard materials.
  • people used high-pressure synthesis technology to synthesize polycrystalline diamond (PCD), which solved the problem of rare and expensive natural diamonds, and extended the application range of diamond tools to aviation, aerospace, automotive, electronics, and stone. And so on.
  • PCD polycrystalline diamond
  • polycrystalline diamond Although polycrystalline diamond has many special excellent properties, because of its high hardness and good wear resistance, its forming process is very difficult, which seriously hinders its popularization and application. Therefore, it is particularly important to study its processing method.
  • countries in the United States, Britain, China, Japan, Germany, South Africa, Switzerland, and France are conducting research in this area. At present, the main methods used are grinding, grinding, EDM, laser machining, electrochemical machining, ultrasonic machining and composite machining.
  • EDM requires materials to be electrically conductive, and is incapable of being used for non-conductive materials.
  • PCD blanks are processed with the same low efficiency and cannot be used for actual production.
  • Ultrasonic machining needs to be combined with grinding, and chemical processing also needs to be combined with machining to achieve direct removal.
  • the mechanism of laser processing diamond is: the laser beam with extremely high beam energy density is irradiated onto the diamond surface, and part of the light energy is absorbed by the surface and converted into heat energy.
  • the local temperature of the spot is rapidly increased to tens of thousands of degrees, causing the diamond material to partially melt or even vaporize and form a pit.
  • thermal diffusion started, and as a result, the material around the spots melted.
  • the steam in the crater expands, the pressure increases, and the melt is ejected at high speed in an explosive form.
  • the recoil pressure generated by the injection forms a strong shock wave inside the workpiece.
  • the diamond etches away some of the substances under the action of high temperature melt vaporization and shock waves to form a laser etch pit.
  • the laser parameters that determine the function of the laser processing material are pulse width, maximum pulse power, and average pulse power. Since the mechanism utilizes the high-energy density thermal processing of the laser, the micro-graphite layer on the diamond surface after processing needs to be refined. Therefore, the conventional laser processing is mostly used for rough machining of diamond.
  • Chinese invention patent application CN200810201484.0 discloses a diamond polycondensation crystal lockable four-sided knife and a manufacturing method thereof. The diamond polycrystal is cut into a tetrahedron by electric discharge wire cutting or laser, and then refined.
  • the Chinese invention patent CN201410401572.0 discloses a cutting edge processing method, which performs grinding processing or electric discharge wire cutting processing on a material to obtain a cutting portion, and then applies a laser action to improve the smoothness and straightness of the cutting edge.
  • International Patent No. WO 2015195754 A1 discloses a device for laser leaching PCD, and a method of operation. Although the related art can process simple shapes and the efficiency precision is relatively low, the laser processing can not be directly used to obtain good roughness and high precision, and the standard cutting edge can be directly used.
  • the present invention provides a fixture, apparatus and method for tool edge machining.
  • a first object of the present invention is to provide a fixture for tool edge machining, comprising: a clamp housing;
  • a rotatable bevel base is disposed in the clamp housing
  • An angle adjusting device with an indication is mounted on a side wall of the clamp housing, and the angle adjusting device is connected to the inclined base for adjusting an angle of the inclined base;
  • the inclined base is equipped with a loading plate, and the loading plate is provided with a plurality of through grooves;
  • the through slot includes a first slot body and a second slot body, wherein the first slot body is used for receiving a machining tool and placing a cutting edge of the tool to be processed in the second slot body, the second slot body Provide a place for edge processing to ensure that the loading plate does not block the incidence of laser light at the machining edge.
  • the number of the inclined bases is two and oppositely disposed, and each of the inclined bases is connected with an angle adjusting device.
  • a second object of the present invention is to provide an apparatus for tool edge machining, comprising: the fixture according to claim 1, a controller, a laser, a reflection lens and a laser galvanometer;
  • the controller is respectively connected to the laser and the laser galvanometer
  • the controller is configured to set a laser parameter of the laser, and control the laser scanning path by the laser galvanometer;
  • the laser of the laser sequentially passes through the reflecting lens and the laser galvanometer to cause the laser to be incident perpendicular to the reference surface to the tool to be processed mounted on the loading plate to complete the machining of the cutting edge of the tool.
  • the ground is used as a reference surface.
  • the laser includes one of a picosecond laser, a CO 2 gas laser, a fiber laser, and a YAG laser.
  • a third object of the present invention is to provide a method for processing a cutting edge of a tool, comprising:
  • Step 1 According to the shape and processing requirements of the tool to be processed, the shape of the groove is designed, and the tool to be processed is stuck in the through groove;
  • Step 2 adjusting the angle of processing required for the cutting edge of the tool by the angle adjusting device
  • Step 3 setting a laser parameter and a laser scanning path by a controller, the laser parameter includes a wavelength of 100 nm to 1064 nm, 10.6 um, an average pulse power of 1 w to 500 w, a pulse width of 10 ps to 300 ns, and a repetition frequency of 200 kHz to 10 MHz;
  • Step 4 Complete the machining of the cutting edge of the tool.
  • the laser parameters include a wavelength of 100 nm to 1064 nm, 10.6 um, an average pulse power of 1 w to 20 w, a pulse width of 10 ps to 80 ns, and a repetition frequency of 200 kHz to 10 MHz.
  • the laser parameters include a wavelength of 355 nm, an average pulse power of 15 w, a pulse width of 10 ps, and a repetition frequency of 500 kHz.
  • the laser parameters further include a scanning speed of 800 mm/s.
  • the processing method is applicable to a diamond cutter, a diamond cutter, a cemented carbide cutter, a zirconia cutter, a cubic boron nitride cutter, and a composite cutter obtained by sintering and patch welding of the above materials.
  • the fixture, device and method for tool edge processing disclosed by the invention complete cutting the cutting edge of the tool by the fixture with the laser; the invention only needs one laser cutting on the cutting part to obtain the required edge No need for other auxiliary processing, such as wire cutting, electric spark, grinding, etc.; it can be applied to non-conductive materials such as diamonds, the processing time is greatly reduced, the processing efficiency of single-piece tools is reduced by at least half, and batches can be batched. Production, greatly increase production and efficiency, and reduce costs;
  • the invention cooperates with the laser parameters through the fixture, and the cutting thickness can reach more than 1 mm, and the cutting angle can be controlled, especially for the front and rear angle processing of the cutter, but not limited to the front and rear angles;
  • the cutting edge obtained by the invention has significant improvement in various indexes such as roughness and processing precision, and the surface roughness obtained by the processing of the invention can reach 1.327 um; the surface roughness of the processing is compared with the surface processed by the existing method. Roughness (the surface roughness in existing methods is above 2 um) has a significant improvement, especially for the processing of diamond tools.
  • FIG. 1 is a structural view of a fixture for tool edge processing disclosed in an embodiment of the present invention
  • Figure 2 is an enlarged view of A in Figure 1;
  • FIG. 3 is a structural view of a tool to be processed disclosed in an embodiment of the present invention.
  • FIG. 4 is a view showing a cooperation between a tool to be processed and a through groove according to an embodiment of the present invention
  • Figure 5 is a structural view of an apparatus for cutting a cutting edge of a tool according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a laser scanning path disclosed in an embodiment of the present invention.
  • FIG. 7 is a macroscopic view of a shape of a tool to be processed after being processed according to an embodiment of the present invention.
  • FIG. 8 is a topographical view of a front cutting edge under a confocal microscope according to an embodiment of the present invention.
  • FIG. 9 is a topography diagram of a front cutting edge under a confocal microscope according to an embodiment of the present invention.
  • Figure 10 is a roughness test chart of Figure 9.
  • Fixture housing 2. Inclined base; 3. Angle adjusting device; 4. Feeding plate; 5. Passing groove; 51, first groove; 52, second groove; 6. Controller; 8, reflective lens; 9, laser galvanometer; 10, the tool to be processed; 11, the cutting edge; 12, marking line.
  • the invention relates to a method for processing a hard material, in particular to a fixture, a device and a method for processing a cutting edge of a tool, and belongs to the field of laser precision machining.
  • the invention directly cuts the super-hard material, and obtains a blade with good roughness, high precision and direct use (PCD, diamond, but not limited to PCD, diamond), the cutting thickness can reach more than 1mm, and the cutting angle can be controlled.
  • PCD high precision and direct use
  • the cutting thickness can reach more than 1mm
  • the cutting angle can be controlled.
  • front and rear corner machining of the tool but not limited to the front and rear corners.
  • the output has been greatly improved, achieving the purpose of rapid production and mass production.
  • the present invention relates to various hard materials such as, but not limited to, diamond, diamond, cemented carbide, zirconium dioxide, cubic boron nitride, and the like, and composites obtained by sintering, patch welding, etc., such as CVD, CBN.
  • Embodiment 1 As shown in FIG. 1, the present invention provides a fixture for tool edge machining, comprising: a clamp housing 1, a bevel base 2, an angle adjusting device 3 and a loading plate 4; wherein:
  • the clamp housing is a frame structure composed of a bottom plate and four side plates, and the clamp housing 1 is provided with a rotatable inclined base 2; an angle adjusting device 3 with an indication is mounted on the side wall of the clamp housing 1 for adjusting the angle
  • the device 3 is connected to the inclined base 2 for adjusting the angle of the inclined base 2; in the present invention, the number of the inclined bases 2 is two and oppositely disposed, and each inclined base 2 is connected with an angle adjusting device 3.
  • the inclined base 2 of the present invention has a loading plate 4 clamped thereon, and the loading plate 3 can be prepared in multiple pieces, and can be processed on the idle plate during processing to meet batch scale production, and the loading plate 4 is uniformly distributed.
  • Through slot 5 As shown in FIG. 2-4, the tool to be processed 10 of the present invention has the structure shown in FIG. 3, and according to the shape and processing requirements of the tool 10 to be processed, the matching loading plate is designed, wherein the through groove 5 includes the first connected.
  • the first groove body 51 is used for stabilizing the card receiving processing tool 10 and the tool cutting edge 11 of the tool to be processed is placed in the second groove body 52, and the second groove body 52 is a place for cutting edge processing, and the length thereof is slightly Longer than the tool, it is ensured that the loading plate 4 does not block the incidence of the laser of the machining edge.
  • Embodiment 2 As shown in FIG. 5, the present invention provides an apparatus for tool edge machining, comprising: a fixture, a controller 6, a laser 7, a reflection lens 8 and a laser galvanometer 9;
  • the controller 6 is connected to the laser 7 and the laser galvanometer 9, respectively; the controller 6 is used to set the laser parameters of the laser 7, and the laser scanning path is controlled by the laser galvanometer 9.
  • the laser of the laser 7 passes through the reflecting lens 8 and the laser galvanometer 9 in sequence, and the laser light is incident perpendicularly to the reference surface to the tool to be processed 10 mounted on the loading plate 4 to complete the processing of the cutting edge 11; wherein the ground is used as the reference surface .
  • the present invention comprises a plurality of lasers, such as but not limited to picosecond, CO 2 gas lasers, optical fibers, picoseconds, YAG lasers, etc., which can utilize the edge processing method provided by the present invention, but a picosecond laser is preferred.
  • a picosecond laser is preferred.
  • Embodiment 3 The present invention provides a tool cutting edge processing method for a tool edge machining device, comprising:
  • Step 1 According to the shape and processing requirements of the tool to be processed, the shape of the groove is designed, and the tool to be processed is stuck in the through groove;
  • Step 2 adjusting the angle of processing required for the cutting edge of the tool by the angle adjusting device
  • the laser parameter and the laser scanning path are set by the controller.
  • the invention includes a set of laser parameter selection, such as: but not limited to the wavelengths of 100 nm to 1064 nm, 10.6 um, the output power of 1 w to 500 w, the pulse width of 10 ps to 300 ns, and the repetition frequency. 200KHz ⁇ 10MHz, the above parameters of the laser can be applied to the cutting edge processing method provided by the present invention;
  • Step 4 Complete the machining of the cutting edge of the tool.
  • the laser parameters include a wavelength of 100 nm to 1064 nm, 10.6 um, an average pulse power of 1 w to 20 w, a pulse width of 10 ps to 80 ns, and a repetition frequency of 200 kHz to 10 MHz.
  • the laser parameters include a wavelength of 355 nm, an average pulse power of 15 w, a pulse width of 10 ps, a repetition frequency of 500 kHz, and a scanning speed of 800 mm/s.
  • the processing method is applicable to a diamond cutter, a diamond cutter, a cemented carbide cutter, a zirconia cutter, a cubic boron nitride cutter, and a composite cutter obtained by sintering and patch welding of the above materials.
  • the laser of the present invention is a dotted line along the right side of the marking line 12.
  • scanning array width L l * sin ⁇ , where l is the thickness of the workpiece, ⁇ is the processed angle, and the filling pitch is L/m, where m is the size of the spot.
  • the starting position of the laser scanning is the rightmost side of the portion to be cut; when scanning, it is sequentially removed from the bottom to the top, and the length of the laser scanning is the positive deviation of the width of the workpiece.
  • the invention comprises a set of mature laser parameters, and the processing effect of the diamond tool and the PCD tool is better by the parameters of the high frequency, high speed and high power short pulse.
  • the repetition frequency is 500KHz
  • the processing speed is 800mm/s
  • the power is 15w
  • the pulse width is 10ps.
  • FIG. 7 is a macroscopic view of the shape of the tool to be processed, which is formed by one-time processing by the above-mentioned processing method
  • FIG. 8 is a topographical view of the front cutting edge under the confocal microscope, and the surface of the front cutting edge is processed by the above-mentioned processing method.
  • the precision is high
  • Figures 9 and 10 are the roughness topography
  • Figure 10 is the surface roughness of 1.327um calculated by selecting three test points on the topographical diagram of Figure 9
  • the surface roughness of the processing and the existing method The surface roughness of the processing (the surface roughness in the prior art is more than 2 um) is significantly improved.
  • Embodiment 4 The present invention is described by taking a 1 mm thick diamond cutter and processing a 30 degree back angle as an example; as shown in FIG. 3, the cutter structure diagram of the workpiece is 1.7 mm long on the long side and 0.3 mm on the short side, and is processed by laser cutting. The two rear corners correspond to the long side of the long side.
  • the loading plate is prepared, and the first groove of the through groove of the loading plate is the same as the processed diamond tool, so that the processed tool can be stably stuck in the first groove.
  • the thickness of the feeding plate is 0.9 mm, and the second groove body is 0.5 mm long and 0.2 mm wide at the preparation cutting edge.
  • the prepared loading plate is fixed on the inclined base, and the angle adjustment device is the same as the processed back angle.
  • the ground is used as the reference surface, and the laser is perpendicular to the reference surface, and the long side of the workpiece is in contact with the base.
  • the edge is the starting position of the laser scan.
  • the laser scanning path was designed.
  • the appropriate laser parameters are selected to process the material.
  • the laser parameters of wavelength 355 nm, scanning speed 800 mm/s, repetitive frequency 500 KHz, power 15 w, and pulse width 10 ps are used.
  • the back angle of the long side is obtained, and the obtained back angle surface is perpendicular to the reference plane.
  • the back angle is adjusted to adjust the angle of the fixture.
  • One of the back angles is adjusted.
  • the cutting edge was observed by confocal microscope, as shown in Figure 9, the roughness measurement shown in Figure 10.
  • the test results, the roughness of the surface was calculated by selecting three test points on the roughness topography chart to be 1.327um; the surface roughness of the processing and the surface roughness of the existing method (the surface roughness in the existing method is 2um) The above) has a significant improvement.
  • Embodiment 5 The present invention is described by taking a 1 mm thick diamond cutter and processing a 30 degree back angle as an example; as shown in FIG. 3, the cutter has a long side 1.7 mm and a short side 0.3 mm, which is processed by laser cutting. The two rear corners correspond to the long side of the long side.
  • the loading plate is prepared, and the first groove of the through groove of the loading plate is the same as the processed diamond tool, so that the processed tool can be stably stuck in the first groove.
  • the thickness of the feeding plate is 0.9 mm, and the second groove body is 0.5 mm long and 0.2 mm wide at the preparation cutting edge.
  • the prepared loading plate is fixed on the inclined base, and the angle adjustment device is the same as the processed back angle.
  • the ground is used as the reference surface, and the laser is perpendicular to the reference surface, and the long side of the workpiece is in contact with the base.
  • the edge is the starting position of the laser scan.
  • the laser scanning path was designed.
  • the appropriate laser parameters are selected to process the material.
  • the laser parameters of wavelength 100 nm, scanning speed 800 mm/s, repetitive frequency 200 KHz, power 1 w, and pulse width 100 ps are used.
  • the back angle of the long side is obtained, and the obtained back angle surface is perpendicular to the reference plane.
  • the back angle is adjusted to adjust the angle of the fixture.
  • One of the back angles is adjusted.
  • Embodiment 6 The present invention is described by taking a 1 mm thick diamond cutter and processing a 30 degree back angle as an example; as shown in FIG. 3, the cutter has a long side 1.7 mm and a short side 0.3 mm, which is processed by laser cutting. The two rear corners correspond to the long side of the long side.
  • the loading plate is prepared, and the first groove of the through groove of the loading plate is the same as the processed diamond tool, so that the processed tool can be stably stuck in the first groove.
  • the thickness of the feeding plate is 0.9 mm, and the second groove body is 0.5 mm long and 0.2 mm wide at the preparation cutting edge.
  • the prepared loading plate is fixed on the inclined base, and the angle adjustment device is the same as the processed back angle.
  • the ground is used as the reference surface, and the laser is perpendicular to the reference surface, and the long side of the workpiece is in contact with the base.
  • the edge is the starting position of the laser scan.
  • the laser scanning path was designed.
  • the appropriate laser parameters are selected to process the material.
  • the laser parameters of wavelength 1064 nm, scanning speed 800 mm/s, re-frequency 10 MHz, power 500 w, and pulse width 300 ns are used.
  • the back angle of the long side is obtained, and the obtained back angle surface is perpendicular to the reference plane.
  • the back angle is adjusted to adjust the angle of the fixture.
  • One of the back angles is adjusted.
  • Embodiment 7 The present invention is described by taking a 1 mm thick diamond cutter and processing a 30 degree back angle as an example; as shown in FIG. 3, the structure of the tool to be processed has a long side of the blade of 1.7 mm and a short side of 0.3 mm, which is processed by laser cutting. The two rear corners correspond to the long side of the long side.
  • the loading plate is prepared, and the first groove of the through groove of the loading plate is the same as the processed diamond tool, so that the processed tool can be stably stuck in the first groove.
  • the thickness of the feeding plate is 0.9 mm, and the second groove body is 0.5 mm long and 0.2 mm wide at the preparation cutting edge.
  • the prepared loading plate is fixed on the inclined base, and the angle adjustment device is the same as the processed back angle.
  • the ground is used as the reference surface, and the laser is perpendicular to the reference surface, and the long side of the workpiece is in contact with the base.
  • the edge is the starting position of the laser scan.
  • the laser scanning path was designed.
  • the material is processed by selecting suitable laser parameters.
  • the laser parameters of wavelength 110.6 um, scanning speed 800 mm/s, re-frequency 1 MHz, power 100 w, and pulse width 10 ns are used.
  • the back angle of the long side is obtained, and the obtained back angle surface is perpendicular to the reference plane.
  • the back angle is adjusted to adjust the angle of the fixture.
  • One of the back angles is adjusted.
  • the fixture, device and method for tool edge processing disclosed by the invention complete cutting the cutting edge of the tool by the fixture with the laser; the invention only needs one laser cutting on the cutting part to obtain the required edge No need for other auxiliary processing, such as wire cutting, electric spark, grinding, etc.; it can be applied to non-conductive materials such as diamonds, the processing time is greatly reduced, the processing efficiency of single-piece tools is reduced by at least half, and batches can be batched.
  • the invention through the fixture with laser parameters, the cutting thickness can reach more than 1mm, and the cutting angle can be controlled, especially for the tool front and rear angle processing, but not limited to the front and rear angle;
  • the cutting edge obtained by the invention has significant improvement in various indexes such as roughness and processing precision, and the surface roughness obtained by the processing of the invention can reach 1.327 um; the surface roughness of the processing is processed by the existing method. Surface roughness (more than 2um in surface roughness in existing methods) has a significant improvement, especially for diamond tooling.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
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Abstract

一种用于刀具刃口（11）加工的工装夹具、装置及方法，工装夹具包括：夹具壳体（1）内设有可转动的斜面底座（2），通过角度调节装置（3）调节斜面底座（2）的角度；斜面底座（2）上装有上料板（4），上料板（4）上均布有多个用于夹持待加工刀具（10）并完成刀具刃口（11）加工的通槽（5）；装置及方法为控制器（6）分别与激光器（7）、激光振镜（9）相连，激光器（7）的激光依次经过反射透镜（8）和激光振镜（9）使激光垂直于基准面入射至安装在上料板（4）上的待加工刀具（10），完成刀具刃口（11）的加工；其中，激光参数包括波长100nm～1064nm、10.6um，平均脉冲功率1w～500w，脉宽10ps～300ns，重复频率200kHz～10MHz。只需对切削部进行一次激光切割，即可得到所需的刀具刃口（11），大幅度提高产量和效率，降低成本；加工获得的刀具刃口（11），粗糙度、加工精度等各项指标均有显著提升。

Description

用于刀具刃口加工的工装夹具、装置及方法 技术领域
本发明涉及激光精密加工技术领域，尤其涉及用于刀具刃口加工的工装夹具、装置及方法。
背景技术
金刚石作为一种超硬刀具材料应用于切削加工已有数百年历史。在刀具发展历程中，从十九世纪末到二十世纪中期,刀具材料以高速钢为主要代表；1927年德国首先研制出硬质合金刀具材料并获得广泛应用；二十世纪五十年代，瑞典和美国分别合成出人造金刚石，切削刀具从此步入以超硬材料为代表的时期。二十世纪七十年代，人们利用高压合成技术合成了聚晶金刚石(PCD)，解决了天然金刚石数量稀少、价格昂贵的问题，使金刚石刀具的应用范围扩展到航空、航天、汽车、电子、石材等多个领域。
聚晶金刚石虽然具有许多特殊优良的性能，但是因为其硬度很高，耐磨性良好，其成形加工非常困难，严重妨碍了它的推广应用，因此，研究其加工方法显得特别重要。美国、英国、中国、日本、德国、南非、瑞士和法国等国家都在进行该领域的研究。目前应用的方法主要有磨削加工、研磨加工、电火花加工、激光加工、电化学加工、超声加工和复合加工。
磨削加工时，由于金刚石刀高硬度，给加工带来了很多的困难，首先，由于材料磨削加工需要很高的磨削压力，起始磨削压力为硬质合金的10倍以上。其次，磨削效率很低，砂轮消耗很大，磨削比只有0.001～0.025，仅是硬质合金的1/1000～1/100000。
金刚石研磨加工作为最传统的加工方法之一，效率极低。
电火花加工需要材料具有导电性，对不导电的材料无能为力，一般对PCD毛坯进行加工，同样效率极低，无法用于实际生产。
超声加工需要与研磨加工相配合，化学加工也需要与机械加工相配合，都不能实现直接的去除。
传统的激光加工金刚石机理：激光加工金刚石的机理是:束能量密度极高的激光束照射到金刚石表面上，部分光能即被表面吸收并转化成热能，照 射斑点的局部区域温度迅速上升到上万度，使金刚石材料局部熔化甚至汽化并形成陷坑。与此同时也开始了热扩散，结果斑点周围材料也熔化。随着激光能量的继续吸收，陷坑中蒸汽膨胀，压力加大，熔融物以爆炸形式被高速喷射出来，喷射所产生的反冲压力又在工件内部形成一个方向很强的冲击波。这样金刚石就在高温熔融汽化和冲击波的作用下蚀除部分物质，形成激光蚀坑。激光加工材料时起决定作用的激光参数是脉冲宽度、最大脉冲功率及平均脉冲功率。由于该机理是利用了激光的高能密度热加工，加工后金刚石表面有微石墨层，还需精修，因此，传统的激光加工多用于金刚石的粗加工。
因此提出一种高效批量生产金刚石刀具具有十分重要的意义。中国发明专利申请CN200810201484.0公开了一种金刚石复聚晶可锁四面刀及制造方法。用放电线切割或者激光将金刚石聚晶切割成四面体，再进行精研而成。中国发明专利CN201410401572.0公开了一种刃口的加工方法，对物料进行磨削加工或放电线切割加工，获得切削部，然后施以激光作用，对刃口的光洁度，直线度进行提高。国际专利WO2015195754A1公开了一种激光浸出PCD的装置，及操作方法。已有相关技术虽然可以加工简单的形状，效率精度都比较低，均不能直接使用激光加工得到粗糙度好，高精度，可直接使用标准的刃口。
随着激光技术的发展，20世纪80代，90年代后期，出现了各种商业化的激光器，并且基本技术参数的不断提升，有望在材料精加工兼顾效率方面带来突破性的飞跃，良好的稳定性以及较低的设备购置与维护成本，使其在工业领域具有非常广阔的应用前景，形成高效高精兼顾的新的去除制造科学具有其他类型激光所不及的优势。
发明内容
针对上述问题中存在的不足之处，本发明提供用于刀具刃口加工的工装夹具、装置及方法。
为实现上述目的，本发明第一目的在于提供一种用于刀具刃口加工的工装夹具，包括：夹具壳体；
所述夹具壳体内设有可转动的斜面底座；
所述夹具壳体侧壁上安装有带有示数的角度调节装置，所述角度调节装置与所述斜面底座相连，用于调节斜面底座的角度；
所述斜面底座上装有上料板，所述上料板上均布有多个通槽；
所述通槽包括相连通的第一槽体和第二槽体，所述第一槽体用于卡接待加工刀具并使待加工刀具的刃口处于第二槽体内，所述第二槽体为刃口加工提供场所，保证上料板不遮挡加工刃口的激光的入射。
作为本发明的进一步改进，所述斜面底座的数量为2个且相对设置，每个所述斜面底座均连接有一角度调节装置。
本发明第二目的在于提供一种用于刀具刃口加工的装置，包括：如权利要求1所述的工装夹具，控制器，激光器，反射透镜和激光振镜；
所述控制器分别与所述激光器、激光振镜相连；
所述控制器用于设置激光器的激光参数，并通过所述激光振镜控制激光扫描路径；
所述激光器的激光依次经过反射透镜和激光振镜使激光垂直于基准面入射至安装在上料板上的待加工刀具，完成刀具刃口的加工。
作为本发明的进一步改进，以地面作为基准面。
作为本发明的进一步改进，所述激光器包括皮秒激光器、CO2气体激光器、光纤激光器和YAG激光器中的一种。
本发明第三目的在于提供一种刀具刃口加工方法，、包括：
步骤1、根据待加工刀具的形貌、加工要求设计通槽的形状，将待加工刀具卡在通槽内；
步骤2、通过角度调节装置调节刀具刃口所需加工的角度；
步骤3、通过控制器设置激光参数和激光扫描路径，所述激光参数包括波长100nm～1064nm、10.6um，平均脉冲功率1w～500w，脉宽10ps～300ns，重复频率200kHz～10MHz；
步骤4、完成刀具刃口的加工。
作为本发明的进一步改进，所述激光参数包括波长100nm～1064nm、10.6um，平均脉冲功率1w～20w，脉宽10ps～80ns，重复频率200kHz～10MHz。
作为本发明的进一步改进，所述激光参数包括波长355nm，平均脉冲功率15w，脉宽10ps，重复频率500kHz。
作为本发明的进一步改进，所述激光参数还包括扫描速度800mm/s。
作为本发明的进一步改进，该加工方法适用于金刚石刀具、钻石刀具、硬质合金刀具、二氧化锆刀具、立方晶氮化硼刀具以及上述材料通过烧结、贴片焊接得到的复合体刀具。
与现有技术相比，本发明的有益效果为：
本发明公开的用于刀具刃口加工的工装夹具、装置及方法，通过工装夹具配合激光完成对刀具刃口的切割；本发明只需对切削部进行一次激光切割，即可得到所需的刃口，不需进行其他辅助加工，如线切割、电火花、磨削加工等；可适用于钻石等不导电的材料，加工时间大大减少，单件刀具加工效率至少缩短了一半以上，并且可批量生产，大幅度提高产量和效率，降低成本；
本发明通过工装夹具配合激光参数，其切割厚度可达到1mm以上，并且切割角度可控，尤其是对于刀具的前后角加工，但不仅限于前后角；
本发明加工获得的刃口，粗糙度、加工精度等各项指标均有显著提升，如本发明加工所得的表面的粗糙度可达1.327um；该加工的表面粗糙度与现有方法加工的表面粗糙度(现有方法中表面粗糙度在2um以上)相比具有显著的提升，尤其是对于钻石刀具的加工。
附图说明
图1为本发明一种实施例公开的用于刀具刃口加工的工装夹具的结构图；
图2为图1中A处放大图；
图3为本发明一种实施例公开的待加工刀具的结构图；
图4为本发明一种实施例公开的待加工刀具与通槽的配合图；
图5为本发明一种实施例公开的用于刀具刃口加工的装置的结构图；
图6为本发明一种实施例公开的激光扫描路径图；
图7为本发明一种实施例公开的待加工刀具加工后的形貌宏观图；
图8为本发明一种实施例公开的共聚焦显微镜下的前切削刃形貌图；
图9为本发明一种实施例公开的共聚焦显微镜下前切削刃粗糙度形貌图；
图10为图9中粗糙度测试图。
图中：
1、夹具壳体；2、斜面底座；3、角度调节装置；4、上料板；5、通槽；51、第一槽体；52、第二槽体；6、控制器；7、激光器；8、反射透镜；9、激光振镜；10、待加工刀具；11、刀具刃口；12、标记线。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明涉及一种硬质材料加工的方法，尤其涉及用于刀具刃口加工的工装夹具、装置及方法，属激光精密加工的范畴。本发明对超硬材料直接进行切割，得到粗糙度好，高精度，可直接使用的刀具(PCD，钻石，但不仅限于PCD，钻石)刃口，切割厚度可达到1mm以上，并且切割角度可控，尤其是对于刀具的前后角加工(但不仅限于前后角)。对于刀具的生产效率、精度、成本，产量有了极大的提高，达到快速生产，批量生产的目的。本发明涉及各种硬质材料，如：但不仅限于金刚石、钻石、硬质合金、二氧化锆、立方晶氮化硼等，以及这些材料通过烧结、贴片焊接等方式得到的复合体，如CVD，CBN。
下面结合附图对本发明做进一步的详细描述：
实施例1：如图1所示，本发明提供一种用于刀具刃口加工的工装夹具，包括：夹具壳体1，斜面底座2，角度调节装置3和上料板4；其中：
夹具壳体为一底板和四侧板构成的框架结构，夹具壳体1内设有可转动的斜面底座2；夹具壳体1侧壁上安装有带有示数的角度调节装置3，角度调节装置3与斜面底座2相连，用于调节斜面底座2的角度；本发明中斜面底座2的数量为2个且相对设置，每个斜面底座2均连接有一角度调节装置3。
本发明的斜面底座2上夹持有上料板4，上料板3可准备多块，加工时即可在闲置板上料，以满足批量规模生产，上料板4上均布有多个通槽5。如图2-4所示，本发明待加工刀具10为图3所示结构，根据待加工刀具10的形貌、加工要求、设计相符的上料板，其中通槽5包括相连通的第一槽体51和第二 槽体52，第一槽体51用于稳定卡接待加工刀具10并使待加工刀具的刀具刃口11处于第二槽体52内，第二槽体52为刃口加工提供场所，其长度略长于刀具，保证上料板4不遮挡加工刃口的激光的入射。
实施例2：如图5所示，本发明提供一种用于刀具刃口加工的装置，包括：工装夹具，控制器6，激光器7，反射透镜8和激光振镜9；
控制器6分别与激光器7、激光振镜9相连；控制器6用于设置激光器7的激光参数，并通过激光振镜9控制激光扫描路径。激光器7的激光依次经过反射透镜8和激光振镜9使激光垂直于基准面入射至安装在上料板4上的待加工刀具10，完成刀具刃口11的加工；其中，以地面作为基准面。
优选的，本发明包含多种激光器，如但不仅限于皮秒、CO2气体激光器、光纤、皮秒、YAG激光器等均能使用本发明提供的刃口加工方法，但优先选择皮秒激光。
实施例3：本发明提供一种刀具刃口加工的装置的刀具刃口加工方法，包括：
步骤1、根据待加工刀具的形貌、加工要求设计通槽的形状，将待加工刀具卡在通槽内；
步骤2、通过角度调节装置调节刀具刃口所需加工的角度；
步骤3、通过控制器设置激光参数和激光扫描路径，本发明包含一套激光参数选择，如：但不仅限于波长100nm～1064nm、10.6um，输出功率1w～500w，脉宽10ps～300ns，重复频率200KHz～10MHz，以上参数的激光器可适用于本发明提供的刃口加工方法；
步骤4、完成刀具刃口的加工。
优选的，激光参数包括波长100nm～1064nm、10.6um，平均脉冲功率1w～20w，脉宽10ps～80ns，重复频率200kHz～10MHz。
进一步优选的，激光参数包括波长355nm，平均脉冲功率15w，脉宽10ps，重复频率500kHz，扫描速度800mm/s。
优选的，该加工方法适用于金刚石刀具、钻石刀具、硬质合金刀具、二氧化锆刀具、立方晶氮化硼刀具以及上述材料通过烧结、贴片焊接得到的复合体刀具。
如图6所示激光扫描路径图，本发明的激光为沿标记线12右侧的虚线方 向入射的阵列填充，扫描阵列宽度L＝l*sinθ，其中l为工件厚度，θ为所加工角度，填充间距为L/m，其中m为光斑的大小。激光扫描的开始位置为需切割部分的最右侧；扫描时，从下往上依次去除，激光扫描的长度为工件的宽度正偏差。
本发明包含一套成熟的激光参数，以高频高速高功率短脉冲的参数作用于钻石刀具、PCD刀具加工效果为佳。如重复频率500KHz，加工速度800mm/s，功率15w，脉宽10ps。
其中，图7为待加工刀具加工后的形貌宏观图，通过上述加工方法一次加工成型；图8为共聚焦显微镜下的前切削刃形貌图，通过上述加工方法得到前切削刃表面的加工精度高；图9、10为粗糙度形貌图，图10为在图9的形貌图上选取3个测试点计算得到表面的粗糙度为1.327um；该加工的表面粗糙度与现有方法加工的表面粗糙度(现有方法中表面粗糙度在2um以上)相比具有显著的提高。
实施例4：本发明以1mm厚的钻石刀具，加工30度后角为例进行说明；如图3所示的待加工刀具结构图，刀刃长边1.7mm，短边0.3mm，通过激光切割加工长边短边对应的两个后角。
根据所加工的刀具尺寸，制作上料板，上料板所留通槽的第一槽体与所加工的钻石刀具相同，保证所加工的刀具可稳定的卡在第一槽体中。上料板的厚度选取0.9mm，第二槽体即准备加工刃口处要长0.5mm，并且宽0.2mm。
将所制作的上料板固定于斜面底座上，通过角度调节装置，调整角度与所加工的后角相同，以地面为基准面，激光垂直于基准面，以工件长边和底座相接触的长边为激光扫描的起始位置。
对激光扫描路径进行设计，扫描阵列总长为0.9/1.73＝0.52mm，激光阵列间距0.02mm，从下往上依次扫描；扫描阵列的宽度与长边相同为1.7mm。
选取适宜的激光参数，对材料进行加工，本实施例采用波长355nm，扫描速度800mm/s，重频500KHz，功率15w，脉宽10ps的激光参数。
加工后得到长边的后角，所得到的后角面与基准面垂直。后角大小为调整好夹具的角度其中一个后角，加工完成后，调整角度，换短边对应的上料板，重复上述步骤，得到短边对应的后角。
采用共聚焦显微镜对切削刃口进行观察，如图9，图10所示的粗糙度测 试结果，在粗糙度形貌图上选取3个测试点计算得到表面的粗糙度为1.327um；该加工的表面粗糙度与现有方法加工的表面粗糙度(现有方法中表面粗糙度在2um以上)相比具有显著的提高。
实施例5：本发明以1mm厚的钻石刀具，加工30度后角为例进行说明；如图3所示的待加工刀具结构图，刀刃长边1.7mm，短边0.3mm，通过激光切割加工长边短边对应的两个后角。
根据所加工的刀具尺寸，制作上料板，上料板所留通槽的第一槽体与所加工的钻石刀具相同，保证所加工的刀具可稳定的卡在第一槽体中。上料板的厚度选取0.9mm，第二槽体即准备加工刃口处要长0.5mm，并且宽0.2mm。
将所制作的上料板固定于斜面底座上，通过角度调节装置，调整角度与所加工的后角相同，以地面为基准面，激光垂直于基准面，以工件长边和底座相接触的长边为激光扫描的起始位置。
对激光扫描路径进行设计，扫描阵列总长为0.9/1.73＝0.52mm，激光阵列间距0.02mm，从下往上依次扫描；扫描阵列的宽度与长边相同为1.7mm。
选取适宜的激光参数，对材料进行加工，本实施例采用波长100nm，扫描速度800mm/s，重频200KHz，功率1w，脉宽100ps的激光参数。
加工后得到长边的后角，所得到的后角面与基准面垂直。后角大小为调整好夹具的角度其中一个后角，加工完成后，调整角度，换短边对应的上料板，重复上述步骤，得到短边对应的后角。
实施例6：本发明以1mm厚的钻石刀具，加工30度后角为例进行说明；如图3所示的待加工刀具结构图，刀刃长边1.7mm，短边0.3mm，通过激光切割加工长边短边对应的两个后角。
根据所加工的刀具尺寸，制作上料板，上料板所留通槽的第一槽体与所加工的钻石刀具相同，保证所加工的刀具可稳定的卡在第一槽体中。上料板的厚度选取0.9mm，第二槽体即准备加工刃口处要长0.5mm，并且宽0.2mm。
将所制作的上料板固定于斜面底座上，通过角度调节装置，调整角度与所加工的后角相同，以地面为基准面，激光垂直于基准面，以工件长边和底座相接触的长边为激光扫描的起始位置。
对激光扫描路径进行设计，扫描阵列总长为0.9/1.73＝0.52mm，激光阵列间距0.02mm，从下往上依次扫描；扫描阵列的宽度与长边相同为1.7mm。
选取适宜的激光参数，对材料进行加工，本实施例采用波长1064nm，扫描速度800mm/s，重频10MHz，功率500w，脉宽300ns的激光参数。
加工后得到长边的后角，所得到的后角面与基准面垂直。后角大小为调整好夹具的角度其中一个后角，加工完成后，调整角度，换短边对应的上料板，重复上述步骤，得到短边对应的后角。
实施例7：本发明以1mm厚的钻石刀具，加工30度后角为例进行说明；如图3所示的待加工刀具结构图，刀刃长边1.7mm，短边0.3mm，通过激光切割加工长边短边对应的两个后角。
根据所加工的刀具尺寸，制作上料板，上料板所留通槽的第一槽体与所加工的钻石刀具相同，保证所加工的刀具可稳定的卡在第一槽体中。上料板的厚度选取0.9mm，第二槽体即准备加工刃口处要长0.5mm，并且宽0.2mm。
将所制作的上料板固定于斜面底座上，通过角度调节装置，调整角度与所加工的后角相同，以地面为基准面，激光垂直于基准面，以工件长边和底座相接触的长边为激光扫描的起始位置。
对激光扫描路径进行设计，扫描阵列总长为0.9/1.73＝0.52mm，激光阵列间距0.02mm，从下往上依次扫描；扫描阵列的宽度与长边相同为1.7mm。
选取适宜的激光参数，对材料进行加工，本实施例采用波长110.6um，扫描速度800mm/s，重频1MHz，功率100w，脉宽10ns的激光参数。
加工后得到长边的后角，所得到的后角面与基准面垂直。后角大小为调整好夹具的角度其中一个后角，加工完成后，调整角度，换短边对应的上料板，重复上述步骤，得到短边对应的后角。
本发明公开的用于刀具刃口加工的工装夹具、装置及方法，通过工装夹具配合激光完成对刀具刃口的切割；本发明只需对切削部进行一次激光切割，即可得到所需的刃口，不需进行其他辅助加工，如线切割、电火花、磨削加工等；可适用于钻石等不导电的材料，加工时间大大减少，单件刀具加工效率至少缩短了一半以上，并且可批量生产，大幅度提高产量和效率，降低成本；本发明通过工装夹具配合激光参数，其切割厚度可达到1mm以上，并且切割角度可控，尤其是对于刀具的前后角加工，但不仅限于前后角；本发明加工获得的刃口，粗糙度、加工精度等各项指标均有显著提升，如本发明加工所得的表面的粗糙度可达1.327um；该加工的表面粗糙度与现有方法加工的 表面粗糙度(现有方法中表面粗糙度在2um以上)相比具有显著的提升，尤其是对于钻石刀具的加工。
以上仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种用于刀具刃口加工的工装夹具，其特征在于，包括：夹具壳体(1)；
    所述夹具壳体(1)内设有可转动的斜面底座(2)；
    所述夹具壳体(1)侧壁上安装有带有示数的角度调节装置(3)，所述角度调节装置(3)与所述斜面底座(2)相连，用于调节斜面底座(2)的角度；
    所述斜面底座(2)上装有上料板(4)，所述上料板(4)上均布有多个通槽(5)；
    所述通槽(5)包括相连通的第一槽体(51)和第二槽体(52)，所述第一槽体(51)用于卡接待加工刀具(10)并使待加工刀具的刃口处于第二槽体(52)内，所述第二槽体(52)为刃口加工提供场所，保证上料板(4)不遮挡加工刃口的激光的入射。
  2. 如权利要求1所述的用于刀具刃口加工的工装夹具，其特征在于，所述斜面底座(2)的数量为2个且相对设置，每个所述斜面底座(2)均连接有一角度调节装置(3)。
  3. 一种用于刀具刃口加工的装置，其特征在于，包括：如权利要求1所述的工装夹具，控制器(6)，激光器(7)，反射透镜(8)和激光振镜(9)；
    所述控制器(6)分别与所述激光器(7)、激光振镜(9)相连；
    所述控制器(6)用于设置激光器(7)的激光参数，并通过所述激光振镜(9)控制激光扫描路径；
    所述激光器(7)的激光依次经过反射透镜(8)和激光振镜(9)使激光垂直于基准面入射至安装在上料板(4)上的待加工刀具(10)，完成刀具刃口(11)的加工。
  4. 如权利要求3所述的用于刀具刃口加工的装置，其特征在于，以地面作为基准面。
  5. 如权利要求3所述的用于刀具刃口加工的装置，其特征在于，所述激光器(7)包括皮秒激光器、CO2气体激光器、光纤激光器和YAG激光器中的一种。
  6. 一种使用如权利要求3所述的用于刀具刃口加工的装置的刀具刃口加工方法，其特征在于，包括：
    步骤1、根据待加工刀具的形貌、加工要求设计通槽的形状，将待加工刀具卡在通槽内；
    步骤2、通过角度调节装置调节刀具刃口所需加工的角度；
    步骤3、通过控制器设置激光参数和激光扫描路径，所述激光参数包括波长100nm～1064nm、10.6um，平均脉冲功率1w～500w，脉宽10ps～300ns，重复频率200kHz～10MHz；
    步骤4、完成刀具刃口的加工。
  7. 如权利要求6所述的刀具刃口加工方法，其特征在于，所述激光参数包括波长100nm～1064nm、10.6um，平均脉冲功率1w～20w，脉宽10ps～80ns，重复频率200kHz～10MHz。
  8. 如权利要求7所述的刀具刃口加工方法，其特征在于，所述激光参数包括波长355nm，平均脉冲功率15w，脉宽10ps，重复频率500kHz。
  9. 如权利要求8所述的刀具刃口加工方法，其特征在于，所述激光参数还包括扫描速度800mm/s。
  10. 如权利要求6所述的刀具刃口加工方法，其特征在于，该加工方法适用于金刚石刀具、钻石刀具、硬质合金刀具、二氧化锆刀具、立方晶氮化硼刀具以及上述材料通过烧结、贴片焊接得到的复合体刀具。
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