WO2018083752A1 - Système d'alimentation en composants - Google Patents

Système d'alimentation en composants Download PDF

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Publication number
WO2018083752A1
WO2018083752A1 PCT/JP2016/082574 JP2016082574W WO2018083752A1 WO 2018083752 A1 WO2018083752 A1 WO 2018083752A1 JP 2016082574 W JP2016082574 W JP 2016082574W WO 2018083752 A1 WO2018083752 A1 WO 2018083752A1
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WO
WIPO (PCT)
Prior art keywords
component
unit
lead
components
component supply
Prior art date
Application number
PCT/JP2016/082574
Other languages
English (en)
Japanese (ja)
Inventor
達 松本
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to EP16920763.6A priority Critical patent/EP3537862B1/fr
Priority to CN201680090308.7A priority patent/CN109863839B/zh
Priority to JP2018548498A priority patent/JP6805266B2/ja
Priority to PCT/JP2016/082574 priority patent/WO2018083752A1/fr
Priority to US16/340,187 priority patent/US11425849B2/en
Publication of WO2018083752A1 publication Critical patent/WO2018083752A1/fr

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/001Article feeders for assembling machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/022Feeding of components with orientation of the elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry

Definitions

  • the present invention relates to a component supply system that supplies components in a state where components scattered on a stage are held by a holder and the components held by the holder are placed in a recess of a mounting table.
  • the component supply system includes a stage in which components are scattered, a holder for holding the components scattered in the stage, and a mounting table in which concave portions having shapes corresponding to the components are formed, and is held by the holder.
  • a system for supplying a component in a state where the component is placed in the recess of the mounting table is described.
  • an installation unit for installing any one of a plurality of mounting tables is provided, and a mounting table corresponding to the component to be supplied is installed in the installation unit.
  • This invention is made
  • the present specification includes a stage in which parts are scattered, a holder for holding the parts scattered in the stage, and a recess having a shape corresponding to the parts.
  • An installation part for installing an arbitrary one of the plurality of mounting tables, and placing the component held by the holder in the concave portion of the mounting table installed in the installation unit,
  • a component supply system for supplying a component, wherein the mounting table includes an identification unit for identifying the type of component that can be placed in the recess.
  • FIG. 1 shows a component mounter 10.
  • the component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12.
  • the component mounting machine 10 includes an apparatus main body 20, a base material conveyance holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a loose component supply device 32, and a control device (see FIG. 11) 34.
  • the circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.
  • the apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40.
  • the substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52.
  • the conveyance device 50 is a device that conveys the circuit substrate 12
  • the clamp device 52 is a device that holds the circuit substrate 12.
  • the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position.
  • the conveyance direction of the circuit substrate 12 is referred to as an X direction
  • a horizontal direction perpendicular to the direction is referred to as a Y direction
  • a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.
  • the component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64.
  • Each of the work heads 60 and 62 has a suction nozzle (see FIG. 2) 66 and holds the component by the suction nozzle 66.
  • the work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. Further, as shown in FIG.
  • each work head 60, 62 is detachably attached to the sliders 74, 76, and the Z-direction moving device 72 individually moves the sliders 74, 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
  • the imaging device 26 is attached to the slider 74 in a state of facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. Thereby, the imaging device 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the imaging device 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the imaging device 28 images the parts held by the suction nozzles 66 of the work heads 60 and 62.
  • the component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction.
  • the component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (not shown).
  • the tray-type component supply device 78 is a device that supplies components placed on the tray.
  • the feeder-type component supply device is a device that supplies components using a tape feeder (not shown) and a stick feeder (not shown).
  • the bulk component supply device 32 is disposed at the other end portion of the frame portion 40 in the front-rear direction.
  • the separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.
  • the structure of the component supply apparatus 32 is demonstrated in detail.
  • examples of the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components.
  • Electronic circuit components include components having leads and components not having leads.
  • the bulk component supply device 32 includes a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.
  • the component supply unit 82 includes a component supplier 88, a component scattering device (see FIG. 4) 90, and a component return device (see FIG. 5) 92, and these component supplier 88 and component scattering device 90. And the component returning device 92 are integrally configured.
  • the component supply unit 82 is detachably assembled to the base 96 of the main body 80. In the bulk component supply device 32, five component supply units 82 are arranged in a line in the X direction.
  • the component feeder 88 has a generally rectangular parallelepiped box shape, and is disposed so as to extend in the Y direction as shown in FIGS. 4 and 5.
  • the Y direction may be described as the front-rear direction of the component supplier 88
  • the left direction in FIG. 5 may be described as the front
  • the component feeder 88 is open at the upper surface and the front surface, and the opening at the upper surface is a component inlet 97, and the front opening is a component outlet 98.
  • an inclined plate 104 is disposed below the input port 97.
  • the inclined plate 104 is arranged in the entire width direction (X direction) of the component feeder 88 from the rear end face of the component feeder 88 toward the center, and the front end is positioned below. Inclined to do.
  • a conveyor device 106 is disposed on the front side of the inclined plate 104.
  • the conveyor device 106 includes a pair of rollers 108 and 110 and a conveyor belt 112.
  • Each of the pair of rollers 108 and 110 is disposed inside the component supplier 88 so as to extend in the width direction of the component supplier 88 and spans the entire width of the component supplier 88. Yes.
  • the roller 108 is opposed to the front end portion of the inclined plate 104, that is, the end portion located at the lowest position of the inclined plate 104 with a clearance. Note that the clearance between the front end of the inclined plate 104 and the roller 108 is smaller than that of the component supplied by the component supplier 88.
  • the roller 110 is disposed obliquely above the front side of the roller 108.
  • the conveyor belt 112 is wound around a pair of rollers 108 and 110.
  • the conveyor belt 112 is wide, and the width of the conveyor belt 112 is slightly smaller than the inner dimension of the component feeder 88 in the width direction.
  • the pair of rollers 108 and 110 are rotatable about the axis, and are rotated in a controllable manner by the operation of the rotating device 114.
  • the rotation directions of the rollers 108 and 110 are counterclockwise in FIG.
  • the conveyor belt 112 rotates counterclockwise in FIG. 5 between the pair of rollers 108 and 110. That is, the conveying direction by the conveyor belt 112 is obliquely upward from the front end portion of the inclined plate 104 toward the front.
  • a plurality of protrusions 115 are formed on the surface of the conveyor belt 112, that is, on the conveying surface, so as to extend in the width direction of the conveyor belt 112.
  • the plurality of protrusions 115 are formed at regular intervals in the rotation direction of the conveyor belt 112, and the intervals are longer than the dimensions in the length direction of the components supplied by the component supplier 88.
  • a brush holding portion 123 is disposed obliquely above the front side of the roller 110 of the conveyor device 106.
  • the brush holding portion 123 is disposed so as to extend in the width direction of the component supplier 88, and spans the entire width direction of the component supplier 88.
  • the wide brush 124 is attached to the lower end part of the brush holding part 123 so that it may extend toward the roller 110 of the conveyor apparatus 106.
  • the width dimension of the brush 124 is slightly smaller than the inner dimension of the component feeder 88 in the width direction, and the conveyor belt 112 wound around the roller 110 and the width direction of the component feeder 88 are The whole is facing with clearance.
  • the clearance between the tip of the brush 124 and the conveyor belt 112 wound around the roller 110 is longer than the dimension in the thickness direction of the component supplied by the component feeder 88 and is twice the dimension in the thickness direction. It is said that it is less than.
  • an inclined plate 126 is disposed obliquely below the front side of the roller 110 of the conveyor device 106.
  • the inclined plate 126 is disposed in the entire width direction of the component feeder 88 from the front end surface of the component feeder 88 toward the lower side of the roller 110 so that the end on the rear side is positioned below. It is inclined to.
  • an inclined plate 128 is disposed below the inclined plate 126.
  • the inclined plate 128 is disposed in the entire width direction of the component feeder 88 from below the central portion of the conveyor device 106 toward the discharge port 98 of the component feeder 88, and the front end portion is directed downward. Inclined to be located.
  • the rear end portion of the inclined plate 128 is located behind the rear end portion of the inclined plate 126, and the rear end portion of the inclined plate 128 is bent at a right angle upward. ing. Further, the front end of the inclined plate 128 is bent rearward so as to be generally horizontal.
  • a pair of side frame portions 130 is assembled to the base 96.
  • the pair of side frame portions 130 are erected so as to be parallel to each other and to extend in the Y direction in an opposed state.
  • the distance between the pair of side frame portions 130 is slightly larger than the dimension in the width direction of the component feeder 88, and the component feeder 88 is detachable between the pair of side frame portions 130. It is attached to.
  • the component supply device 32 is provided with a safety door 136 that can be opened and closed. By opening the safety door 136, the interior of the component supply device 32 is exposed. Therefore, by opening the safety door 136, the component supplier 88 is attached and detached between the pair of side frame portions 130 by the operator.
  • the component scattering device 90 includes a component support member 150 and a component support member moving device 152.
  • the component support member 150 includes a stage 156 and a pair of side wall portions 158.
  • the stage 156 has a generally longitudinal plate shape and is disposed so as to extend forward from below the component feeder 88 mounted between the pair of side frame portions 130. Note that the upper surface of the stage 156 is generally horizontal, and is disposed with a slight clearance from the bent forward end of the inclined plate 128 of the component supplier 88 as shown in FIG. ing. Further, as shown in FIG. 4, the pair of side wall portions 158 are fixed in a state of being erected on both sides in the longitudinal direction of the stage 156, and the upper end of each side wall portion 158 is from the upper surface of the stage 156. It extends upward.
  • the component support member moving device 152 includes a guide rail 160 and a slider 162 as shown in FIG.
  • the guide rail 160 is disposed below the component support member 150 so as to extend in the longitudinal direction of the stage 156.
  • the slider 162 is slidably attached to the guide rail 160, and slides to an arbitrary position by the operation of the electromagnetic motor (see FIG. 11) 166.
  • the stage 156 of the component support member 150 is connected to the slider 162 via a connecting mechanism 168. Thereby, the component support member 150 moves in the Y direction by the operation of the component support member moving device 152, and the stored state (see FIG. 6) stored below the component supplier 88 and from below the component supplier 88. It moves between the exposed state (see FIG. 5).
  • the component return device 92 includes a component recovery container 180 and a container swing device 181 as shown in FIG.
  • the parts collection container 180 is generally box-shaped, and the bottom surface has an arc shape.
  • the component collection container 180 is slidably held at the end of the component support member 150 on the front side of the stage 156 and swings by the operation of the container oscillating device 181. At this time, the component collection container 180 swings between a collection posture with the opening directed upward (see FIG. 7) and a return posture with the opening directed toward the upper surface of the stage 156 of the component support member 150 (see FIG. 8). To do.
  • the imaging device 84 includes a camera 290 and a camera moving device 292.
  • the camera moving device 292 includes a guide rail 296 and a slider 298.
  • the guide rail 296 is fixed to the main body 80 so as to extend in the width direction (X direction) of the bulk component supply device 32 above the component supplier 88.
  • the slider 298 is slidably attached to the guide rail 296, and slides to an arbitrary position by the operation of the electromagnetic motor (see FIG. 11) 299.
  • the camera 290 is attached to the slider 298 so as to face downward.
  • the component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304, as shown in FIG.
  • the component holding head moving device 300 includes an X direction moving device 310, a Y direction moving device 312, and a Z direction moving device 314.
  • the Y-direction moving device 312 has a Y slider 316 disposed above the component supply unit 82 so as to extend in the X direction.
  • the Y slider 316 is driven by an electromagnetic motor (see FIG. 11) 319. , Move to any position in the Y direction.
  • the X-direction moving device 310 has an X-slider 320 disposed on the side surface of the Y-slider 316.
  • the X-slider 320 is moved to an arbitrary position in the X-direction by driving an electromagnetic motor (see FIG. 11) 321. Moving.
  • the Z-direction moving device 314 has a Z-slider 322 disposed on the side surface of the X-slider 320.
  • the Z-slider 322 is moved to an arbitrary position in the Z-direction by driving an electromagnetic motor (see FIG. 11) 323. Moving.
  • the component holding head 302 includes a head main body 330, a suction nozzle 332, a nozzle turning device 334, and a nozzle rotating device 335.
  • the head body 330 is formed integrally with the Z slider 322.
  • the suction nozzle 332 holds parts and is detachably attached to the lower end portion of the holder 340.
  • the holder 340 can be bent at the support shaft 344, and the operation of the nozzle turning device 334 causes the holder 340 to be bent 90 degrees upward.
  • the suction nozzle 332 attached to the lower end of the holder 340 turns 90 degrees and is located at the turning position. That is, the suction nozzle 332 turns between the non-turning position and the turning position by the operation of the nozzle turning device 334.
  • the nozzle rotating device 335 rotates the suction nozzle 332 around its axis.
  • each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, and is fixed to the main body 80 side by side in front of the component supply unit 82.
  • Five component receiving members 392 are mounted on the component carrier 388 in a row in the horizontal direction, and the components are placed on each component receiving member 392.
  • the component supplied by the bulk component supply device 32 is an electronic circuit component (hereinafter sometimes abbreviated as “lead component”) 410 having a lead.
  • the block-shaped component main body 412 and two leads 414 protruding from the bottom surface of the component main body 412 are configured.
  • the component receiving member 392 is formed with a component receiving recess 416 having a shape corresponding to the lead component 410.
  • the component receiving recess 416 is a stepped recess, and includes a main body receiving recess 418 that opens to the top surface of the component receiving member 392 and a lead receiving recess 420 that opens to the bottom surface of the main body receiving recess 418. Yes.
  • the main body receiving recess 418 has a shape corresponding to the component main body 412 of the lead component 410
  • the lead receiving recess 420 has a shape corresponding to the lead 414 of the lead component 410.
  • the lead component 410 is inserted into the component receiving recess 416 with the lead 414 facing downward.
  • the lead 414 is inserted into the lead receiving recess 420 and the lead component 410 is placed inside the component receiving recess 416 with the component main body 412 inserted into the main body receiving recess 418.
  • the component carrier moving device 390 is a plate-like longitudinal member, and is disposed on the front side of the component supply unit 82 so as to extend in the front-rear direction.
  • a component carrier 388 is slidably disposed in the front-rear direction on the upper surface of the component carrier moving device 390, and is slid to an arbitrary position in the front-rear direction by driving an electromagnetic motor (see FIG. 11) 430.
  • the component carrier 388 slides in a direction approaching the component supply unit 82
  • the component carrier 388 slides to a component receiving position located within the movement range of the component holding head 302 by the component holding head moving device 300.
  • the component carrier 388 slides in the direction away from the component supply unit 82
  • the component carrier 388 slides to the component supply position located within the movement range of the work heads 60 and 62 by the work head moving device 64.
  • the control device 34 includes an overall control device 450, a plurality of individual control devices (only one is shown in the figure) 452, an image processing device 454, and a storage device 456.
  • the overall control device 450 is configured mainly by a computer, and is connected to the base material conveyance holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32. ing. Thereby, the overall control device 450 controls the base material conveyance holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32 in an integrated manner.
  • the plurality of individual control devices 452 are configured mainly by a computer, and are provided in the base material conveyance holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. (In the figure, only the individual control device 452 corresponding to the bulk component supply device 32 is shown).
  • the individual control device 452 of the bulk component supply device 32 is connected to the component scattering device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304.
  • the individual control device 452 of the bulk component supply device 32 controls the component scattering device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304.
  • the image processing device 454 is connected to the imaging device 84 and processes imaging data captured by the imaging device 84.
  • the image processing device 454 is connected to the individual control device 452 of the bulk component supply device 32.
  • the individual control device 452 of the bulk component supply device 32 acquires the imaging data captured by the imaging device 84.
  • the storage device 456 stores various data and is connected to the individual control device 452. As a result, the individual control device 452 acquires various data from the storage device 456.
  • the component mounting operation is performed on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration. Specifically, the circuit substrate 12 is transported to the work position, and is fixedly held by the clamp device 52 at that position. Next, the imaging device 26 moves above the circuit substrate 12 and images the circuit substrate 12. Thereby, the information regarding the error of the holding position of the circuit base material 12 is obtained.
  • the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. It should be noted that the supply of components by the bulk component supply device 32 will be described in detail later. Then, one of the work heads 60 and 62 moves above the component supply position, and holds the component by the suction nozzle 66.
  • the work heads 60 and 62 holding the components move above the imaging device 28, and the components held by the suction nozzle 66 are imaged by the imaging device 28. As a result, information on the error of the component holding position can be obtained. Then, the work heads 60 and 62 holding the components move above the circuit substrate 12 and correct the held components for errors in the holding position of the circuit substrate 12, errors in the holding position of the components, and the like. And mounted on the circuit substrate 12.
  • the lead component 410 introduced from the inlet 97 of the component supplier 88 falls onto the inclined plate 104 of the component supplier 88 and rolls down to the lower end on the front side of the inclined plate 104.
  • the lead component 410 that has rolled down to the lower end on the front side of the inclined plate 104 is piled up between the lower end on the front side of the inclined plate 104 and the lower end on the rear side of the conveyor device 106. That is, the space between the lower end on the front side of the inclined plate 104 and the lower end on the rear side of the conveyor device 106 functions as the accommodating portion 100 for accommodating the lead component 410.
  • the lead component 410 conveyed obliquely upward by the conveyor belt 112 passes between the upper end on the front side of the conveyor device 106 and the brush 124, and between the upper end on the front side of the conveyor device 106 and the brush 124. It falls on the inclined plate 126 disposed below.
  • the lead component 410 that has fallen onto the inclined plate 126 rolls back on the inclined plate 126 and falls onto the inclined plate 128 disposed below the inclined plate 126.
  • the lead component 410 that has dropped from the upper end on the front side of the conveyor device 106 once falls on the inclined plate 126 and then drops on the inclined plate 128. Then, the lead component 410 is discharged from the discharge port 98 of the component supplier 88. Thereby, it is possible to reduce damage due to the drop of the lead component 410.
  • the component support member 150 is moved forward from the lower side of the component supply device 88 by the operation of the component support member moving device 152 in accordance with the timing at which the lead component 410 is discharged from the discharge port 98 of the component supply device 88. Moved. As a result, the lead component 410 discharged from the discharge port 98 of the component supplier 88 is discharged onto the upper surface of the stage 156 of the component support member 150.
  • the lead component 410 discharged from the component feeder 88 onto the stage 156 rolls forward and falls from the front end of the stage 156, it is stored in the component collection container 180.
  • the lead component 410 discharged from the component feeder 88 onto the stage 156 rolls sideways, the lead component 410 is dropped from the stage 156 by the side wall portion 158 of the component support member 150. Is prevented.
  • the movement of the component support member 150 is stopped.
  • the lead components 410 are scattered over the entire upper surface of the stage 156.
  • the operation of the conveyor device 106 is stopped so that the lead component 410 is finally discharged from the component supplier 88 in synchronization with the timing at which the movement of the component support member 150 is stopped.
  • the camera 290 of the imaging device 84 is operated by the camera moving device 292 to operate the component support member 150.
  • the lead component 410 is imaged by being moved upward.
  • a plurality of lead components 410 scattered on the upper surface of the component support member 150 can be picked up by the suction nozzle 332 based on the imaging data (hereinafter, referred to as “pickup target component” in some cases).
  • the lead nozzle 332 separates the lead parts that cannot be picked up (hereinafter may be referred to as “non-pickup target parts”).
  • the lead component 410 and the lead 414 in a state where the surface that is difficult to attract, such as the uneven surface, faces upward.
  • the lead component 410 and the like that are in contact with the upper surface of the component support member 150 and are tilted are classified as non-pickup target components, and the other lead components 410 are classified as pickup target components. Further, information such as the position on the component support member 150 and the posture of the lead component 410 is acquired for the lead component 410 classified as the pickup target component based on the imaging data.
  • the component holding head 302 is moved above the pickup target component by the operation of the component holding head moving device 300 based on the acquired position information of the pickup target component, and the pickup target component is sucked by the suction nozzle 332. Retained. Note that when the pickup target component is sucked and held by the suction nozzle 332, the suction nozzle 332 is located at the non-turning position.
  • the component holding head 302 is moved above the component carrier 388.
  • the component carrier 388 moves to the component receiving position by the operation of the component carrier moving device 390.
  • the suction nozzle 332 is pivoted to the pivot position. The suction nozzle 332 is rotated by the operation of the nozzle rotating device 335 so that the lead 414 of the lead component 410 held by the suction nozzle 332 in the turning position faces downward in the vertical direction.
  • the lead component 410 with the lead 414 facing downward in the vertical direction is inserted into the component receiving recess 416 of the component receiving member 392.
  • the lead component 410 is placed on the component receiving member 392 with the lead 414 facing downward in the vertical direction.
  • the component carrier 388 When the lead component 410 is placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by the operation of the component carrier moving device 390. Since the component carrier 388 moved to the component supply position is located in the movement range of the work heads 60 and 62, the lead component 410 is supplied at this position in the loose component supply device 32. As described above, in the bulk component supply device 32, the lead component 410 is supplied in a state where the lead 414 faces downward and the upper surface facing the bottom surface to which the lead 414 is connected faces upward. For this reason, the suction nozzle 66 of the work heads 60 and 62 can hold the lead component 410 appropriately.
  • the lead component 410 remaining on the stage 156 is collected in the component collection container 180. Then, the lead parts 410 collected in the parts collection container 180 are scattered again on the stage 156, and the posture of the lead parts 410 is changed, so that the pickup of the lead parts 410 from the stage 156 is resumed.
  • the component support member 150 is moved downward of the component feeder 88 by the operation of the component support member moving device 152. That is, the component support member 150 is moved from the exposed state (see FIG. 5) toward the retracted state (see FIG. 6). At this time, the component collection container 180 disposed at the front end portion of the component support member 150 is in a posture in which the opening is directed upward, that is, in a collection posture. As the component support member 150 moves, the lead component 410 on the stage 156 of the component support member 150 is blocked by the front end of the inclined plate 128 of the component supplier 88. Further, as shown in FIG. 6, when the component support member 150 is moved to the retracted state, the lead component 410 on the stage 156 is scraped off inside the component collection container 180.
  • the component support member 150 is moved forward from the retracted state by the operation of the component support member moving device 152. Then, at the timing when the component support member 150 moves forward by a predetermined amount from the retracted state, the container swinging device 181 of the component returning device 92 operates, and the component recovery container 180 swings. As a result, the posture of the component collection container 180 changes rapidly from a posture in which the opening is directed upward (collection posture) to a posture in which the opening is directed to the stage 156 (return posture). At this time, the lead component 410 recovered in the component recovery container 180 is released toward the stage 156 vigorously. As a result, the lead components 410 are scattered from the component collection container 180 onto the stage 156, whereby the posture of the lead component 410 is changed, and the lead components 410 are picked up again from above the stage 156.
  • the lead component 410 accommodated in the component supplier 88 is supplied in a state of being placed on the component receiving member 392 of the component carrier 388.
  • the type of component supplied by the bulk component supply device 32 is changed. That is, the operator opens the safety door 136, takes out the component supplier 88 from the inside of the bulk component supply device 32, and replaces the lead component 410 accommodated in the component supplier 88 with another type of component. Replace.
  • the kind of components supplied by the bulk component supply device 32 can be changed by mounting the component feeder 88 containing different types of components on the bulk component supply device 32.
  • the lead component 410 accommodated in the component feeder 88 is supplied in a state of being placed on the component receiving member 392 of the component carrier 388.
  • the type of the component to be changed is changed, the type of the lead component 410 accommodated in the component supplier 88 is replaced, and the component receiving member 392 mounted on the component carrier 388 is also replaced.
  • the component receiving member 392 is formed with the component receiving recess 416 having a shape corresponding to the component to be mounted, and the supply component is mounted in the component receiving recess 416. . Therefore, a plurality of types of component receiving members 392a to 392c are prepared as shown in FIGS. 12 to 14 according to the types of components supplied by the bulk component supply device 32.
  • Each of the component receiving members 392a to 392c includes a plate thickness portion 470 and a plate thin portion 472, and the plate thickness portion 470 and the plate thin portion 472 are integrally formed.
  • a component receiving recess 416 having a shape corresponding to a component to be placed is formed at a substantially central portion of the upper surface of the plate thickness portion 470.
  • the component receiving member 392a is for mounting the A component, and the component receiving recess 416 of the component receiving member 392a has a shape corresponding to the A component.
  • the component receiving member 392b is for placing the B component, and the component receiving recess 416 of the component receiving member 392b has a shape corresponding to the B component.
  • the component receiving member 392c is for placing the C component, and the component receiving recess 416 of the component receiving member 392c has a shape corresponding to the C component.
  • an identification plate 478 is attached to a corner portion on the upper surface of the plate thickness portion 470.
  • a 2D code (not shown) is written on the identification plate 478, and the 2D code corresponds to the type of component placed in the component receiving recess 416. Therefore, the identification plate 478 of the component receiving member 392a has a 2D code corresponding to the A component, and the identification plate 478 of the component receiving member 392b has a 2D code corresponding to the B component.
  • the identification plate 478 of the component receiving member 392c has a 2D code corresponding to the C component.
  • a pair of through holes 480 and 482 penetrating in the vertical direction are formed in the thin plate portion 472 of each of the component receiving members 392a to 392c.
  • the pair of through holes 480 and 482 are formed at the same position in each of the component receiving members 392a to 392c, and a pair of pins (not shown) that can be inserted into the pair of through holes 480 and 482 Is disposed on a component carrier 388. For this reason, by inserting the pins of the component carrier 388 into the through holes 480 and 482 of the component receiving members 392a to 392c, the component carrier 388 is positioned in a predetermined position. It is attached to.
  • the operator lifts the component receiving members 392a to 392c mounted on the component carrier 388 upward.
  • the pins are removed from the through holes 480 and 482, and the component receiving members 392a to 392c attached to the component carrier 388 are removed.
  • the component receiving members 392a to 392c corresponding to the components scheduled to be supplied by the bulk component supply device 32, that is, the component receivers corresponding to the components accommodated in the component supplier 88 Members 392a-c are selected.
  • the operator lowers the selected component receiving members 392a to 392c above the component carrier 388, thereby inserting the pins of the component carrier 388 into the through holes 480 and 482 of the component receiving members 392a to 392c. To do.
  • the selected component receiving members 392a to 392c are mounted on the component carrier 388 in a state where they are positioned at predetermined positions.
  • the part receiving members 392a to 392c mounted on the part carrier 388 are replaced with those according to the parts to be supplied. Therefore, it is possible to change the type of component supplied by the bulk component supply device 32.
  • the operator forgets to replace the component receiving members 392a to 392c even though the component accommodated in the component supplier 88 has been replaced.
  • the operator must replace the component receiving members 392a to 392c mounted on the component carrier 388 with ones corresponding to the components to be supplied, the components erroneously differ from the components to be supplied. In some cases, it may be exchanged according to the conditions.
  • the components can be appropriately placed on the component receiving members 392a to 392c. It is not possible to supply appropriate parts.
  • the part to be supplied is an A part
  • an operator may erroneously mount the part receiving member 392c on the part carrier 388.
  • the component receiving recess 416 of the component receiving member 392a corresponding to the A component is relatively large, it can be understood that the A component is a relatively large component.
  • the component receiving recess 416 of the component receiving member 392c is relatively small as shown in FIG. For this reason, when the component receiving member 392c is mounted on the component carrier 388 even though the component to be supplied is the A component, the A component is placed in the component receiving recess 416 of the component receiving member 392c. It is not possible to supply the A part.
  • the identification plates 478 of the component receiving members 392a to 392c mounted on the component carrier 388 are imaged by the camera 290 of the imaging device 84, and based on the imaging data. Then, it is determined whether or not the component receiving members 392a to 392c mounted on the component carrier 388 correspond to the components to be supplied. Specifically, the camera 290 moves above the component carrier 388 by the operation of the camera moving device 292. Then, the identification plates 478 of the component receiving members 392a to 392c mounted on the component carrier 388 are imaged by the camera 290, and the imaging data of the identification plate 478 obtained by the imaging is transmitted to the individual control device 452. . In the individual control device 452, the transmitted imaging data is analyzed, and the 2D code written on the identification plate 478 is specified.
  • the storage device 456 for each of the plurality of component receiving members 392a to 392c, the 2D code written on the identification plate 478 of each of the component receiving members 392a to 392c and the component receiving recess of each of the component receiving members 392a to 392c are stored.
  • the types of components that can be placed on 416 are stored in association with each other.
  • the individual control device 452 refers to the information stored in the storage device 456, and refers to the type of component associated with the 2D code identified based on the imaging data (hereinafter referred to as “2D code compatible component type”). Is specified).
  • the storage device 456 also stores a program for executing a component supply operation by the bulk component supply device 32.
  • This program is programmed with the type of parts to be supplied, the number of parts to be supplied, and the supply timing.
  • the individual control device 452 is based on the program stored in the storage device 456, and is the type of the component scheduled to be supplied by the loose component supply device 32 (hereinafter may be referred to as “supplied scheduled component type”). Is identified. Then, the individual control device 452 determines whether or not the 2D code-compatible component type and the supply scheduled component type are the same. At this time, when the 2D code-compatible component type and the supply scheduled component type are the same, the component supply operation by the bulk component supply device 32 is executed.
  • the component supply operation by the bulk component supply device 32 is not executed, and the 2D code compatible component type and the planned supply are displayed on the display device (not shown).
  • a screen indicating that the component type is different is displayed. Accordingly, the operator recognizes that the component receiving members 392a to 392c corresponding to the parts different from the parts to be supplied are mounted on the component carrier 388, and the component receiving members 392a to 392 mounted on the component carrier 388 are recognized. c is replaced with one corresponding to the part to be supplied.
  • the confirmation operation of the component receiving members 392a to 392c based on the imaging data of the identification plate 478 is executed every time the safety door 136 of the bulk component supply device 32 is opened and closed. This is because, when the safety door 136 is opened and closed, the components housed in the component feeder 88 may be replaced, and the component receiving members 392a to 392c mounted on the component carrier 388 may be replaced. Is high.
  • the individual control device 452 automatically determines whether or not the 2D code compatible component type and the planned supply component type are the same, and the 2D code compatible component type and the planned supply component type are different.
  • the individual control device 452 automatically determines whether or not the 2D code compatible component type and the planned supply component type are the same, and the 2D code compatible component type and the planned supply component type are different.
  • the individual control device 452 includes a specifying unit 500, an acquiring unit 502, and a determining unit 504.
  • the specifying unit 500 is a functional unit for specifying a 2D code compatible component type.
  • the acquisition unit 502 is a functional unit for acquiring a supply scheduled component type.
  • the determination unit 504 is a functional unit for determining whether or not the 2D code-compatible component type and the supply scheduled component type are the same.
  • the bulk component supply device 32 is an example of a component supply system.
  • the imaging device 84 is an example of an imaging device.
  • the stage 156 is an example of a stage.
  • the suction nozzle 332 is an example of a holder.
  • the component carrier 388 is an example of an installation unit.
  • the component receiving member 392 is an example of a mounting table.
  • the individual control device 452 is an example of a control device.
  • the storage device 456 is an example of a storage device.
  • the identification plate 478 is an example of an identification unit.
  • the specifying unit 500 is an example of a specifying unit.
  • the acquisition unit 502 is an example of an acquisition unit.
  • the determination unit 504 is an example of a determination unit.
  • this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
  • the identification plate 478 is imaged, and the 2D code corresponding component type is specified based on the imaging data.
  • the identification plate 478 is read by a code reader or the like, and the 2D code is identified. Corresponding component types may be specified.
  • a 2D code is adopted as the identification unit, but various identification symbols such as a QR code (registered trademark) can be adopted.
  • the present invention is not limited to the identification symbol, and various components can be adopted as the identification unit as long as the component type can be identified.
  • an RFID Radio Frequency IDentifier
  • the component type may be identified by receiving ID information stored in the RFID.
  • a plurality of holes may be formed in the component receiving member 392, and the component type may be identified based on the arrangement of the plurality of holes.
  • the individual control device 452 acquires the supply scheduled part type based on the program, but the supply scheduled part type may be acquired by various methods. Specifically, for example, the supply scheduled component type may be acquired based on information input from the input device. In addition, for example, the parts scattered on the stage 156 may be imaged, and the parts to be supplied may be acquired based on the imaging data.
  • the present invention is applied to a component having a lead.
  • the present invention can be applied to various types of components. Specifically, the present invention can be applied to, for example, solar cell components, power module components, electronic circuit components without leads, and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)

Abstract

L'invention concerne un dispositif d'alimentation en composants en vrac qui est pourvu d'un étage sur lequel des composants sont dispersés, d'un support permettant de maintenir les composants dispersés sur l'étage et d'un élément de réception de composant pourvu d'un évidement de réception de composant ayant une forme correspondant au composant, et qui fournit un composant maintenu par le support, le composant étant monté dans l'évidement de réception de composant de l'élément de réception de composant. Le dispositif d'alimentation en composants en vrac comprend également une unité d'installation permettant d'installer un élément souhaité parmi une pluralité d'éléments de réception de composant. Les éléments de réception de composant ont des plaques d'identification fixées à ces derniers, les plaques d'identification désignant un code 2D permettant d'identifier le type de composant qui peut être monté dans l'évidement de réception de composant. Il devient ainsi possible de confirmer le type de composant correspondant à l'élément de réception de composant installé dans l'unité d'installation, et d'installer de manière fiable dans l'unité d'installation l'élément de réception de composant correspondant à un composant dont la livraison est planifiée.
PCT/JP2016/082574 2016-11-02 2016-11-02 Système d'alimentation en composants WO2018083752A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP16920763.6A EP3537862B1 (fr) 2016-11-02 2016-11-02 Système d'alimentation en composants
CN201680090308.7A CN109863839B (zh) 2016-11-02 2016-11-02 元件供给系统
JP2018548498A JP6805266B2 (ja) 2016-11-02 2016-11-02 部品供給システム
PCT/JP2016/082574 WO2018083752A1 (fr) 2016-11-02 2016-11-02 Système d'alimentation en composants
US16/340,187 US11425849B2 (en) 2016-11-02 2016-11-02 Component supply system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/082574 WO2018083752A1 (fr) 2016-11-02 2016-11-02 Système d'alimentation en composants

Publications (1)

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WO2018083752A1 true WO2018083752A1 (fr) 2018-05-11

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US (1) US11425849B2 (fr)
EP (1) EP3537862B1 (fr)
JP (1) JP6805266B2 (fr)
CN (1) CN109863839B (fr)
WO (1) WO2018083752A1 (fr)

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US20190313555A1 (en) 2019-10-10
CN109863839A (zh) 2019-06-07
CN109863839B (zh) 2021-03-23
JP6805266B2 (ja) 2020-12-23
EP3537862A4 (fr) 2019-11-06
US11425849B2 (en) 2022-08-23
JPWO2018083752A1 (ja) 2019-07-11
EP3537862A1 (fr) 2019-09-11
EP3537862B1 (fr) 2024-03-06

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