WO2018082362A1 - Procédé de fabrication d'électrode épidermique - Google Patents

Procédé de fabrication d'électrode épidermique Download PDF

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Publication number
WO2018082362A1
WO2018082362A1 PCT/CN2017/097654 CN2017097654W WO2018082362A1 WO 2018082362 A1 WO2018082362 A1 WO 2018082362A1 CN 2017097654 W CN2017097654 W CN 2017097654W WO 2018082362 A1 WO2018082362 A1 WO 2018082362A1
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WO
WIPO (PCT)
Prior art keywords
metal layer
metal film
skin electrode
fabricating
sensing
Prior art date
Application number
PCT/CN2017/097654
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English (en)
Chinese (zh)
Inventor
杨泽宇
鲁南姝
王普林
Original Assignee
成都柔电云科科技有限公司
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Filing date
Publication date
Application filed by 成都柔电云科科技有限公司 filed Critical 成都柔电云科科技有限公司
Publication of WO2018082362A1 publication Critical patent/WO2018082362A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/28—Applying continuous inductive loading, e.g. Krarup loading
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Definitions

  • the invention relates to a method for manufacturing a sensor, and more particularly to a method for manufacturing a skin electrode in the field of manufacturing a wearable device.
  • the epidermal electrode is a flexible pullable secondary electrode that can be adhered to human skin like a temporary tattoo so as to be able to monitor the electrophysiological signal of the human body like a conventional device.
  • the existing skin electrode is usually made of a composite film formed by a metal layer and a plastic layer adhered together, wherein the metal layer is used for bonding with the skin of the human body, in order to conduct the data of the metal layer to the external chip,
  • the electro-physiological data measured by the metal layer is obtained by perforating the composite film and mounting the conductive nails in the perforations, connecting the metal layer through the conductive nails, and connecting the conductive nails to the chip through the external wires.
  • the skin electrode of the structure has a thick thickness of the skin electrode due to the use of the conductive nail structure, which limits the development of the skin electrode to the light and thin direction; in addition, the friction generated by the conductive nail and the metal layer under the dynamic of the human body is generated. Dynamic noise causes measurement data to be inaccurate and wears the metal layer; further, conductive pins are not conducive to connection to small chips.
  • the invention provides a method for fabricating a skin electrode, wherein the skin electrode has a sensing contact, and the method for manufacturing the skin electrode comprises the following steps:
  • the metal film includes an upper metal layer and a lower metal layer, and a plastic layer is interposed between the upper metal layer and the lower metal layer;
  • c) potting filling a plurality of the perforations with a conductive paste to electrically connect the upper metal layer and the lower metal layer through the conductive paste;
  • the method and the advantage of the method for producing the skin electrode of the present invention are that a thinner and thinner skin electrode can be produced by the method, and the method for producing the skin electrode is simple and the production efficiency is high.
  • FIG. 1 is a schematic view showing the outer structure of a sensor contact sheet of a skin electrode of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a metal film used to manufacture the skin electrode of the present invention.
  • Figure 3 is a schematic cross-sectional view of a perforation in a metal film.
  • FIG. 4 is a schematic cross-sectional view showing a conductive paste filled in a perforation of a metal film.
  • Figure 5 is a schematic cross-sectional view showing the adhesion of a metal film to a plastic base film.
  • Fig. 6 is a schematic cross-sectional view showing the structure of punching a sensor contact on a metal film.
  • Figure 7 is a schematic cross-sectional view showing the sensor contact pad attached to the plastic base film.
  • Fig. 8 is a schematic view showing the structure of the bottom surface of the skin electrode.
  • Fig. 9 is a schematic view showing the top surface structure of the skin electrode.
  • Fig. 10 is a schematic view showing the structure of a metal film after perforation.
  • Fig. 11 is a schematic view showing the structure of the lower metal layer of the metal film after half-cutting.
  • Fig. 12 is a schematic view showing the structure of the upper metal layer of the metal film after half-cutting.
  • the present invention provides a method for fabricating a skin electrode, the skin electrode 1 having a sensing contact 11, and the method for fabricating the skin electrode includes the following steps:
  • the metal film 2 includes an upper metal layer 21 and a lower metal layer 22, between the upper metal layer 21 and the lower metal layer 22 is sandwiched with a plastic layer 23;
  • the skin electrode 1 is a tool for contacting the human skin and sensing the potential difference of the human body. By connecting the skin electrode 1 to the chip, data detected on the skin electrode 1 can be obtained.
  • the sensing contact 11 of the skin electrode 1 is a basic unit for measuring the potential of the human body, and the shape of the sensing contact 11 can be arbitrarily selected according to actual needs.
  • the sensing contact 11 is A plurality of connected hollow fan structures 113 are formed.
  • the hollow fan structure 113 is composed of four sides of a generally "S" shape, and each of the hollow fan structures 113 has a hollow hole 114.
  • the sensing contact 11 of the structure is adopted.
  • the potential difference of the human body can be acquired in real time by arranging the plurality of sensing contacts 11 on the human skin and conducting the measurement data of the plurality of sensing contacts 11 to the external chip through the external wires.
  • a metal film 2 is first provided, and the metal film 2 is substantially in the shape of a rectangular parallelepiped, which is formed by sequentially bonding the upper metal layer 21, the plastic layer 23 and the lower metal layer 22 to each other.
  • Thin film structure the upper metal layer 21 may be made of platinum, gold or stainless steel, and has a thickness h1 of 50 nm to 200 nm; and the lower metal layer 22 may be made of a conductive metal material or alloy material such as gold, aluminum, stainless steel or copper.
  • the thickness h2 is 50 nm to 200 nm; the plastic layer 23 may be a polyethylene terephthalate (PET) or a polyimide (PI) material having a thickness h3 of 0.5 ⁇ m to 25 ⁇ m.
  • PET polyethylene terephthalate
  • PI polyimide
  • step b) as shown in FIG. 3, according to the shape and structure of the sensor contact piece 11 to be formed, a punching operation is performed at a position on the metal film 2 where the sensor contact piece 11 is to be formed, and the hole diameter d of the hole 111 is 0.1. Mm ⁇ 0.3mm.
  • the through hole 111 penetrates the upper surface of the metal film 2 and the lower surface of the metal film 2.
  • the through hole 111 can be formed, for example, by laser etching. Of course, other prior art tools can be used for the metal film. 2 Perform the punching operation without limitation.
  • the number of the perforations 111 on the sensing contact 11 and the distance between the two adjacent perforations 111 can also be selected according to actual needs, which is not limited herein.
  • the position of the plurality of perforations 111 can be set, for example, on the common “S” edge of two adjacent hollow fan structures 113, each “S” edge. There are three perforations 111 arranged at equal intervals.
  • the plurality of perforations 111 on the metal film 2 are subjected to an ultrasonic cleaning operation.
  • the metal film 2 etched with the plurality of through holes 111 is placed in the ultrasonic cleaning device, and the ultrasonic cleaning device is activated to perform ultrasonic cleaning on the plurality of through holes 111 on the metal film 2 to remove the broken holes in the through holes 111.
  • the swarf facilitates the subsequent adhesion of the conductive paste in the through hole 111 to the through hole 111.
  • step c) is performed, as shown in FIG. 4, the plurality of perforations 111 of the metal film 2 are filled. gum.
  • the conductive paste 112 is dropped into the through hole 111 by means of titration.
  • the conductive paste 112 may be a conductive paste made of epoxy resin mixed silver powder.
  • the conductive paste 112 gradually The solidification in the perforation 111 is limited by the material of the conductive paste 112, so that the two ends of the conductive paste 112 dropped into the through hole 111 slightly overflow the upper metal layer 21 and the lower metal layer 22 of the metal film 2, so that the conductive paste can be made.
  • the contact area of the upper metal layer 21 and the lower metal layer 22 is relatively increased, which facilitates the circuit connection between the upper metal layer 21 and the lower metal layer 22.
  • the step d) can be completed in two steps as follows:
  • step d2) All external engraving: After completing step d1), the outer edge 115 of the sensing contact 11 is punched out on the metal film 2.
  • the metal film 2 is adhered to a plastic base film 3; that is, before the step d1), the lower metal layer of the metal film 2 is as shown in FIG. 22 is adhered to the plastic base film 3, which may be a single-sided PET or PI material having a thickness h4 of 0.05 mm to 0.1 mm.
  • each of the hollow holes 114 of the sensing contact 11 is punched on the metal film 2 and the plastic base film 3.
  • the metal film 2 with the plastic base film 3 is placed on a horizontal film plate with the metal film 2 facing upward and the plastic base film 3 facing downward; then, a first cutter is provided, and the first cutter is placed on the metal film 2 Above, the first cutter is moved downward to punch the metal film 2 and the plastic base film 3.
  • the first cutter has the same shape as the contour of the plurality of hollow holes 114 of the sensing contact 11, and the die-cut metal film 2 and the plastic are adjusted by adjusting the distance that the first cutter moves downward.
  • the metal film 2 and the plastic base film 3 are die-cut by the first cutter so that a plurality of hollow holes 114 are formed on the metal film 2 and the plastic base film 3.
  • step d2) is performed on the outer side: the outer edge 115 of the sensing contact 11 is punched on the metal film 2.
  • the metal film 2 is punched down by the second tool.
  • the second cutter has a cutter having the same contour shape as the outer edge 115 of the sensor contact 11, and the depth of the die-cut metal film 2 is adjusted by adjusting the distance by which the second cutter moves downward.
  • the second cutter performs the punching operation only on the metal film 2 without performing the punching operation on the plastic base film 3.
  • step d2) After the above step d2) is completed, as shown in FIG. 7, the sensing contact piece 11 and the scrap metal film 12 separated from each other are formed on the plastic base film 3, and the scrap metal film 12 is peeled off from the plastic base film 3. That is, the sensing contact 11 adhered to the plastic base film 3 is obtained.
  • the sensor contact piece 11 adhered to the plastic base film 3 can be reversely bonded to a plastic film having a viscosity greater than that of the plastic base film 3, thereby achieving peeling of the sensor contact piece 11 and the plastic base film 3, and finally producing Complete a complete epidermal electrode 1 structure.
  • the structure of the skin electrode 1 is not limited to the above-mentioned sensor contact piece 11 having a plurality of hollow fan structures 113, and the sensor contact piece 11 of the skin electrode 1 can be arbitrarily selected according to actual needs. Shape, no restrictions here.
  • the metal film 2 can be punched by a punching tool to form the structure of the sensor contact piece 11, wherein the punching tool is die-cut.
  • the shape of the knife is the same as the contour shape of the sensor contact piece 11.
  • the skin electrode 1 includes a collecting contact 13 and a plurality of spaced apart sensing contacts 11 , between each sensing contact 11 and the collecting contact 13 . They are connected by a sensing strip 14.
  • the skin sensor 1 has three sensing contacts 11 as an example. The three sensing contacts 11 are equally spaced, the collecting contacts 13 are located at the middle and lower portions of the skin electrode 1, and the three sensing contacts 11 are respectively The three contact strips 14 are connected to the collecting contact 13 .
  • the specific steps of fabricating the above-described skin electrode 1 on the provided metal film 2 are as follows:
  • step b1) is further included: the metal layer 22 is half-cut: the lower metal layer 22 is punched to form a half on the lower metal layer 22.
  • the line 221 is located on the sensing strip 14.
  • the step b2) is further performed on the metal layer 21: the metal layer 21 is die-cut, and the upper metal layer 21 forms a half-notch 211 corresponding to the position where the contact 13 is collected. A plurality of sensing strips 14 are separated from each other by the half-notch 211.
  • the position of the plurality of perforations 111 formed after the perforation operation on the metal film 2 is as shown in FIG. 10 from the plan view of the metal film 2.
  • the step b1) is performed for half-cutting of the metal layer 22: please refer to FIG. 8 to perform a half-cut operation at a position corresponding to the sensing strip 14 and the sensing contact 11, that is, The lower metal layer 22 of the metal film 2 after the perforation is etched by laser cutting, and as shown in FIG. 11, three half-cut lines 221 are formed on the lower metal layer 22.
  • step b2) is performed on the metal layer 21 for half-time: please refer to FIG. 9 , at the position where the contact strip 13 is collected, the contacts 131 connected to the corresponding sensing strips 14 are respectively reserved, and the contacts are respectively The point 131 is used for electrical connection with the external chip, and the region of the collection contact 13 other than the three electric contacts 131 (ie, the half-notch 211) is etched, as shown in FIG. As shown, the sensing strips 14 at the position of the upper metal layer 21 are separated from each other by the half-notch 211.
  • the structure of the collecting contact 13 is punched out on the metal film 2 .
  • the structure of the plurality of sensing strips 14 is punched out to produce a complete skin electrode 1 structure.
  • a thinner and thinner skin electrode can be produced by the method, and the method for producing the skin electrode is simple and the production efficiency is high.

Abstract

L'invention concerne un procédé de fabrication d'une électrode épidermique (1). L'électrode épidermique (1) comporte une pièce tactile de transduction (11). Le procédé de fabrication de l'électrode épidermique (1) comprend les étapes suivantes : a) utilisation d'un film métallique (2) : le film métallique (2) comprend une couche métallique supérieure (21) et une couche métallique inférieure (22), et une couche de matière plastique (23) prise en sandwich entre la couche métallique supérieure (21) et la couche métallique inférieure (22); b) perforation : formation d'un trou d'interconnexion (111) sur le film métallique (2) au niveau de la position où la pièce tactile de transduction (11) doit être mise en forme; c) étalage de colle : étalage d'une colle électroconductrice (112) dans une pluralité desdits trous d'interconnexion (11) pour amener la couche métallique supérieure (21) et la couche métallique inférieure (22) à former une connexion électrique par l'intermédiaire de la colle électroconductrice (112); et d) gravure complète : poinçonnage de la structure de la pièce tactile de transduction (11) sur le film métallique (2). Le procédé de fabrication de l'électrode épidermique (1) peut fabriquer une électrode épidermique (1) plus mince, et le procédé de fabrication de l'électrode épidermique (1) est simple et l'efficacité de fabrication est élevée.
PCT/CN2017/097654 2016-11-03 2017-08-16 Procédé de fabrication d'électrode épidermique WO2018082362A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610958195 2016-11-03
CN201610958195.X 2016-11-03

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PCT/CN2017/109016 WO2018082584A1 (fr) 2016-11-03 2017-11-02 Procédé de fabrication d'électrode épidermique

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CN109567744A (zh) * 2018-10-24 2019-04-05 永康国科康复工程技术有限公司 类皮肤基体
CN110051348A (zh) * 2019-03-29 2019-07-26 永康国科康复工程技术有限公司 一种柔性电子检测贴片及人机交互系统
CN110051326A (zh) * 2019-03-29 2019-07-26 永康国科康复工程技术有限公司 一种基于类皮肤基体的电子检测贴片及测量设备

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CN107887079A (zh) 2018-04-06
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