WO2018078749A1 - Procédé d'inspection de carte inlay pour dispositif d'inspection, et procédé de fabrication - Google Patents

Procédé d'inspection de carte inlay pour dispositif d'inspection, et procédé de fabrication Download PDF

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Publication number
WO2018078749A1
WO2018078749A1 PCT/JP2016/081770 JP2016081770W WO2018078749A1 WO 2018078749 A1 WO2018078749 A1 WO 2018078749A1 JP 2016081770 W JP2016081770 W JP 2016081770W WO 2018078749 A1 WO2018078749 A1 WO 2018078749A1
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WIPO (PCT)
Prior art keywords
press
fitting jig
fitting
load
heat transfer
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PCT/JP2016/081770
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English (en)
Japanese (ja)
Inventor
保明 関
直之 牧野
和男 志々目
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株式会社メイコー
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Priority to JP2018546993A priority Critical patent/JPWO2018078749A1/ja
Priority to PCT/JP2016/081770 priority patent/WO2018078749A1/fr
Publication of WO2018078749A1 publication Critical patent/WO2018078749A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to an inlay substrate inspection method, inspection apparatus, and manufacturing method.
  • Circuit boards on which electronic components that generate heat during operation are mounted generally take measures for heat dissipation by forming thermal vias or copper inlays at the positions where the electronic components are mounted.
  • the thermal via fills the inside of the through-hole provided in the circuit board with high thermal conductivity plating in order to conduct the heat released from the electronic components arranged on one side of the board to the other side. Formed. Therefore, the thermal via is often formed with a relatively small cross-sectional area so that smooth plating filling is possible.
  • the copper inlay is formed by press-fitting copper as a heat transfer member with a pressing piece inside a through hole provided in the circuit board, as disclosed in Patent Document 1 for a method of manufacturing the circuit board. Therefore, since the cross-sectional area is relatively large, it is known that the heat dissipation effect is higher than that of the thermal via.
  • the volume of the pressed-in copper when the volume of the pressed-in copper is smaller than the volume of the through hole provided in the circuit board, there is a gap between the circuit board and the through hole. May be formed.
  • the through hole cannot be completely filled with the copper inlay. Insufficient caulking of copper inlay.
  • the pressed-in copper is not completely fixed to the circuit board, so that heat transfer efficiency from the heat-generating component is lowered, and copper may be detached from the circuit board in the circuit board manufacturing process.
  • a circuit board is mass-produced, it takes time and inspection accuracy is low.
  • the present invention has been made in view of such a problem, and the object of the present invention is to accurately and quickly detect a press-fitting abnormality when a heat transfer member is press-fitted into a through-hole provided in a circuit board.
  • An object of the present invention is to provide an inlay substrate inspection method, inspection apparatus, and manufacturing method for determination.
  • the inlay substrate inspection method of the present invention is an inlay substrate inspection method for determining a press-fitting abnormality of an inlay substrate formed by press-fitting a heat transfer member into a through-hole provided in a circuit board.
  • a press step of inserting the heat transfer member by inserting the heat transfer member into a through hole, abutting a press-fitting jig on the heat transfer member, and moving the press-fitting jig in a press-fitting direction; and the press-fitting jig A load measuring step for measuring a load applied to the press fitting, and a brake for stopping the movement of the press fitting jig in the press fitting direction on condition that the load applied to the press fitting jig reaches a preset set load.
  • the rate of increase of the load applied to the press-fitting jig is high, and the load applied to the press-fitting jig only when the press-fitting jig contacts the surface of the circuit board is Above the threshold.
  • the inlay board inspection apparatus of the present invention includes a press-fitting jig for press-fitting a heat transfer member into a through-hole provided in a circuit board, and a load measurement for measuring a load applied to the press-fitting jig. And the movement of the press-fitting jig in the press-fitting direction on the condition that the load applied to the press-fitting jig reaches a preset set load.
  • a pressing control unit that performs braking control for stopping the pressing, and after the braking control, the press-fitting jig in a state in which movement of the press-fitting jig is stopped while the press-fitting jig and the heat transfer member are in contact with each other.
  • a press-fitting determination unit that determines that the heat transfer member is in a press-fitting abnormality when the applied load is equal to or greater than a predetermined threshold.
  • the press-fitting jig contacts the surface of the circuit board.
  • the rate of increase in the load applied to the press-fitting jig is high when contacting the surface of the circuit board, and the load applied to the press-fitting jig only when the press-fitting jig contacts the surface of the circuit board is greater than or equal to the threshold value. It is.
  • the inlay substrate manufacturing method of the present invention is an inlay substrate manufacturing method for determining a press-fitting abnormality of an inlay substrate formed by press-fitting a heat transfer member into a through hole provided in a circuit board.
  • Load is predetermined And less than the value.
  • an inlay board inspection method, inspection apparatus, and manufacturing method are provided for accurately determining a press-fitting abnormality when a heat transfer member is press-fitted into a through-hole provided in a circuit board in a short time. Can do.
  • FIG. 1 is a configuration diagram of a servo press 1 according to the present invention.
  • the servo press 1 includes a bolster 10, a servo motor 11, a connecting rod 12, a press-fitting jig 13, a press control unit 14, a load measurement unit 15, a press-fit determination unit 16, an output unit 17, and an input unit 18.
  • the servo press 1 is a C frame type mechanical press in this embodiment, but the frame shape is not limited to this.
  • the bolster 10 is a flat pedestal on which a circuit board 2 as a processing target to be described later is placed.
  • Servo motor 11 is a motor that generates power for pressing by receiving electric power.
  • the connecting rod 12 is a member that is displaced in the vertical direction by the power generated by the servo motor 11 via a link mechanism (not shown).
  • the press-fitting jig 13 is connected to the lower end of the connecting rod 12 and is displaced in the vertical direction via the connecting rod 12 by the power of the servo motor 11 to press a desired portion of the circuit board 2 placed on the bolster 10. It is a slide.
  • the pressing control unit 14 is a control device that controls the servo motor 11 so that the servo motor 11 can adjust the vertical position, moving speed, and pressing force of the press-fitting jig 13 via the connecting rod 12.
  • the pressing control unit 14 is built in the servo press 1 as a single module.
  • the load measurement unit 15 and the press-fit determination unit 16 may be implemented as a program executed by the control device.
  • the load measuring unit 15 acquires the reaction load that the press-fitting jig 13 receives from the processing target when the press-fitting jig 13 presses the processing target with a pressure sensor (not shown).
  • the press-fitting determination unit 16 determines whether or not the press-fitting is normally performed based on the load acquired by the load measuring unit 15 when the press-fitting jig 13 press-fits the heat transfer member 3 into the circuit board 2.
  • the output unit 17 is a display that displays the load acquired by the load measuring unit 15 and the press-fit state determined by the press-fit determining unit 16.
  • the output unit 17 may display other various parameters set in the servo press 1.
  • the input unit 18 is an interface for setting various parameters including a set load Ws, a threshold load Wth, and the like set in the servo press 1 before the press work. And a cross key.
  • the input unit 18 may be formed integrally with the output unit 17 as a touch panel.
  • FIG. 2 is a cross-sectional view of the circuit board 2 before press working.
  • the circuit board 2 is exemplified as a multilayer board on which four layers of inner layer circuits are formed. However, the number of layers can be changed as appropriate, or a double-sided board that does not include an inner layer circuit may be used.
  • the circuit board 2 includes an insulating layer 21, a conductor layer 22, a plating film 23, and a through hole 24.
  • the insulating layer 21 is a prepreg made of an insulating resin material.
  • the conductor layer 22 is made of a conductive material such as copper and constitutes a circuit pattern.
  • the plating film 23 is formed in the surface of the circuit board 2 before a press work with an electroconductive material. After the press working, the circuit board 2 is newly formed with lid plating on the surface, and a part of the circuit board 2 is etched together with the plating film 23 to form a circuit pattern.
  • the circuit board 2 is formed with various structures such as electronic components, lands, heat sinks, and solder resists (not shown) in a later manufacturing process.
  • the through hole 24 for press-fitting the heat transfer member 3 is formed in the circuit board 2 before the plating film 23 is formed.
  • the through hole 24 is a so-called through hole that penetrates both surfaces of the circuit board 2, and in this embodiment, the cross-sectional shape perpendicular to the through direction is circular.
  • the cross-sectional shape is not limited to a circle.
  • the cross-sectional shape may be formed in accordance with the shape of the heat-generating component.
  • the heat transfer member 3 is made of a material having a high thermal conductivity, and in this embodiment, is a cylindrical copper.
  • the heat transfer member 3 before being pressed is protruded from the through hole 24 in the vertical direction, and is processed into a size and shape that fits in the through hole 24 in the horizontal direction perpendicular to the vertical direction.
  • the amount of copper is set so that the heat transfer member 3 has a volume equal to or slightly larger than the prescribed volume of the through hole 24. More specifically, for example, the distance between the side surface of the heat transfer member 3 before press working and the inner wall surface of the through hole 24 is 200 ⁇ m or less, and the volume of the through hole 24 is 100 to 110 of the volume of the heat transfer member 3. %.
  • the press-fitting jig 13 is moved in the press-fitting direction, that is, vertically downward from the state where the heat transfer member 3 is inserted into the through hole 24 of the circuit board 2 placed on the bolster 10.
  • the heat transfer member 3 is press-fitted into the through hole 24 by the pressing surface 13a of the press-fitting jig 13 to form an inlay substrate.
  • the area of the pressing surface 13a is 1.4 times or more as compared with the cross-sectional area of the through hole 24, more preferably 3.4 times or more.
  • the size and arrangement of the press-fitting jig 13 with respect to the through hole 24 are set so that the outer periphery of the pressing surface 13a surrounds the outer periphery of the through hole 24 in plan view. Is set.
  • FIG. 3 is a cross-sectional view of the circuit board 2 after press working. More specifically, FIG. 3A shows a cross section of the circuit board 2 in a state where the heat transfer member 3 is normally press-fitted into the through hole 24 of the circuit board 2 by press working. FIG. 3B shows a cross section of the circuit board 2 when a press-fitting abnormality occurs in the heat transfer member 3 by press working.
  • the pressing surface 13a of the press-fitting jig 13 after press working is slightly higher than the surface of the circuit board 2 or is lowered to an equivalent height, so that the heat transfer member 3 is plastically deformed.
  • the heat transfer member 3 is normally press-fitted with the through-holes 24 filled without gaps. Details of the braking control for stopping the movement of the press-fitting jig 13 will be described later.
  • the volume of the through hole 24 of the circuit board 2 increases.
  • an error in the thickness of the circuit board 2 greatly affects the volume of the through hole 24. Therefore, as shown in FIG. 3B, even if the pressing surface 13a of the press-fitting jig 13 after pressing is lowered to the same height as the surface of the circuit board 2, the heat transfer member 3 and the through hole 24 A gap g is formed between them, and a press-fitting abnormality occurs.
  • the circuit board 2 cannot completely fix the heat transfer member 3 and may be detached in the subsequent manufacturing process. Further, for example, when the heat transfer member 3 is displaced inside the through-hole 24 due to the press-fitting abnormality of the heat transfer member 3, the heat transfer efficiency between the heat generating components and the heat sink respectively mounted on both surfaces of the circuit board 2 is reduced. There is a risk that it will end up. Hereinafter, description of the determination method of the press-fitting abnormality will be continued.
  • FIG. 4 is a flowchart showing the control of the servo press 1 according to the present invention.
  • the press work performed by the servo press 1 is started from the state of FIG. 2 in which the heat transfer member 3 is inserted into the through hole 24 of the circuit board 2 placed on the bolster 10 as described above.
  • the servo press 1 checks whether or not the parameters necessary for the press work are set (step S1).
  • the press machine can select a reference for stopping the press as a mode such as position stop or load stop.
  • the position stop is a mode in which the slide is braked on condition that the slide corresponding to the press-fitting jig 13 of the present embodiment has been displaced to a preset position (height), and the load stop is set in advance. In this mode, the slide is braked on condition that the applied load is applied to the slide.
  • a preset load that is, a set load Ws needs to be set in advance.
  • the default value of the set load Ws may be set in advance, or may be manually input by the operator of the servo press 1 through the input unit 18, or from an external device separately connected to the servo press 1. It may be entered automatically.
  • step S1 it is also checked whether or not a threshold load Wth as a “predetermined threshold” to be described later for determining a press-fitting abnormality based on the load W related to the press-fitting jig 13 is set in advance. If a parameter required for press working is not set (No in step S1), for example, the fact is displayed on the output unit 17 to enter a parameter setting waiting state.
  • step S1 When the setting of parameters such as the set load Ws and the threshold load Wth is confirmed in step S1 (Yes in step S1), the pressing control unit 14 instructs the servo motor 11 to drive, and press-fit treatment is performed by the power of the servo motor 11.
  • the tool 13 starts to move in the press-fitting direction and press is started (step S2).
  • the load measuring unit 15 starts acquiring the load W applied to the press-fitting jig 13 (step S3). That is, the “load measuring step” corresponds to a period from step S3 to the end (end) of the control of the servo press 1 in this embodiment.
  • step S3 may be performed between the start of the control operation and step S1, or may be performed between step S1 and step S2.
  • the heat transfer member 3 starts plastic deformation at the timing when the pressing surface 13a of the press-fitting jig 13 contacts the surface of the heat transfer member 3.
  • the press-fitting jig 13 starts to receive the load W from this timing, and the load W increases as the plastic deformation progresses.
  • the load measuring unit 15 monitors whether or not the load W applied to the press-fitting jig 13 reaches a preset threshold value Ws (step S4). In a state where the load W is less than the set threshold value Ws, the servo motor 11 moves the press-fitting jig 13 in the press-fitting direction and continues the press-fitting of the heat transfer member 3 (No in step S4).
  • the pressing control unit 14 stops the press on the servo motor 11 on condition that the value of the load W acquired by the load measuring unit 15 has reached the set threshold value Ws (Yes in step S4). Instructs braking control. At this time, the servo motor 11 performs a braking control to stop the movement of the press-fitting jig 13 in the press-fitting direction (step S5). That is, the period from the step S2 to the determination of Yes in step S4 is the “press process”.
  • the servo motor 11 takes a certain time ⁇ t after receiving the braking control from the pressing control unit 14 until the movement of the press-fitting jig 13 in the pressing state is completely stopped.
  • the braking control must be continued for at least a certain time ⁇ t. Therefore, the pressing control unit 14 confirms whether the movement of the press-fitting jig 13 is completely stopped based on, for example, the operating state of the servo motor 11 (step S6). While the press-fitting jig 13 is moving, the servo motor 11 continues the braking control (No in step S6).
  • step S6 When the movement of the press-fitting jig 13 is completely stopped (Yes in step S6), the load measuring unit 15 reads the load W at that time as a final load (step S7) and transmits the final load to the press-fit determining unit 16. To do.
  • the period from the determination of Yes in step S4 to the determination of Yes in step S6 is the “braking control process”.
  • the press-fitting determination unit 16 compares the preset threshold load Wth with the final load. Then, the press-fit determination unit 16 determines that the press-fitting of the heat transfer member 3 is normal when the end load is less than the threshold load Wth, and when the end load is equal to or greater than the threshold load Wth, It is determined that there is a press-fitting abnormality (step S8, determination step).
  • the servo press 1 displays the determination result of the press-fitting determination unit 16 on the output unit 17 and ends the control operation.
  • FIG. 5 is a timing chart schematically showing a time change of the load W applied to the press-fitting jig 13.
  • the horizontal axis represents time
  • the vertical axis represents the load W. More specifically, FIG. 5 (a) shows the time change of the load W when the heat transfer member 3 is normally press-fitted into the through hole 24, and FIG. 5 (b) shows that the heat transfer member 3 is abnormal in press-fitting. It represents the time change of the load W in a certain case.
  • the timing at which the pressing surface 13a of the press-fitting jig 13 contacts the surface of the heat transfer member 3 is t0.
  • the press-fit determination unit 16 of the servo press 1 can determine that the heat transfer member 3 has been normally press-fitted into the through hole 24.
  • the press-fitting jig 13 is completely stopped after a certain time ⁇ t has elapsed (timing t4).
  • the rate of increase of the load W at the timing t2 when the load W reaches the set load Ws as described above is increased compared to the case of FIG. Therefore, the end load W2 in FIG. 5B is higher than the end load W1 in FIG. 5A, and is a value equal to or greater than the threshold load Wth.
  • the press-fitting determination unit 16 of the servo press 1 can determine that the heat transfer member 3 has a press-fitting abnormality.
  • FIG. 6 is a graph showing the load history of the servo press 1. More specifically, FIG. 6 shows respective load histories when the heat transfer member 3 is press-fitted into a through-hole 24 formed in a circle having a diameter of 6 mm under the four conditions C1 to C4 described below. Yes, the horizontal axis represents the elapsed time t from the start of press-fitting, and the vertical axis represents the load W.
  • Condition C1 is that the thickness of the circuit board 2 is a specified value, and the pressing surface 13a of the press-fitting jig 13 is a circle having a diameter of 7 mm.
  • Condition C2 is that the thickness of the circuit board 2 is larger than a specified value, and the pressing surface 13a of the press-fitting jig 13 is a circle having a diameter of 7 mm.
  • Condition C3 is that the thickness of the circuit board 2 is a specified value, and the pressing surface 13a of the press-fitting jig 13 is circular with a diameter of 11 mm.
  • Condition C4 is that the thickness of the circuit board 2 is larger than a specified value, and the pressing surface 13a of the press-fitting jig 13 is circular with a diameter of 11 mm.
  • the ratio of the diameter of the pressing surface 13a of the press-fitting jig 13 to the through hole 24 is 1.17 times, and the area ratio is 1.36 times.
  • the ratio of the diameter of the pressing surface 13a of the press-fitting jig 13 to the through hole 24 is 1.83 times, and the area ratio is 3.36 times.
  • the load W slightly fluctuates due to a measurement error or the like.
  • the final load of each condition is the average value of the load W from when the change amount of the load W becomes equal to or less than a predetermined value after the braking control of the servo motor 11 is completed until a predetermined time has elapsed. Calculated.
  • the end load of conditions C1 and C2 is shown with the broken line.
  • various methods can be used for calculating the end load, and for example, the load W at the time when the braking control of the servo motor 11 is completed may be used.
  • the load W under the condition C1 where the thickness of the circuit board 2 is the specified value is the end load is less than the threshold load Wth, and it can be determined that the heat transfer member 3 is normally press-fitted.
  • the load W under the condition C2 where the thickness of the circuit board 2 is larger than the specified value can be determined that the end load is equal to or greater than the threshold load Wth, and the heat transfer member 3 is abnormally pressed.
  • the load on the vertical axis in FIGS. 7 and 8 is an arbitrary unit (arb. Unit), both of them only enlarge and display FIG. 6, and the numerical values of the loads in FIGS. 6 can be compared with the conditions C1 and C2 in FIG. 7 and the conditions C3 and C4 in FIG.
  • the load W under the condition C3 in which the thickness of the circuit board 2 is a specified value is that the final load is less than the threshold load Wth, and it can be determined that the heat transfer member 3 has been normally press-fitted.
  • the load W under the condition C4 in which the thickness of the circuit board 2 is larger than the specified value can be determined that the end load is equal to or greater than the threshold load Wth and the heat transfer member 3 is abnormally pressed.
  • the difference in the end load between the conditions C3 and C4 in FIG. 8 is further expanded with respect to the difference in the end load between the conditions C1 and C2 in FIG.
  • the end load is hardly changed.
  • the end load increases as the area of the pressing surface 13a of the press-fitting jig 13 increases. This is considered to be because the larger the contact area between the circuit board 2 and the press-fitting jig 13 is, the easier it is to receive a reaction force applied to the press-fitting jig 13.
  • the threshold load Wth is appropriately set in advance depending on how much the press-fitted state of the heat transfer member 3 is allowed. At this time, as described above, as the area of the pressing surface 13a of the press-fitting jig 13 is larger than the cross-sectional area of the through-hole 24, the width of the load W that can set the threshold load Wth is increased. It becomes easier to judge abnormality. Also, if the difference in the end load between the circuit board with normal press-fitting and the circuit board with abnormal press-in becomes large, not only will the degree of freedom of setting the threshold load Wth increase, but the end load may fluctuate due to measurement errors. In addition, the determination error is eliminated, and the press-fitting abnormality can be determined with higher accuracy.
  • the press-fitting abnormality when the heat transfer member 3 is press-fitted into the through hole 24 provided in the circuit board 2 is detected. It can be determined, and the press-fitting accuracy of the heat transfer member 3 of the formed inlay substrate can be ensured.
  • FIG. 9 is a configuration diagram of the circuit board 2 on which the press-fitting jig 13 ′ and the plating film 23 ′ according to the modification of the present invention are formed. More specifically, FIG. 9A is a top view of the press-fitting jig 13 ′ and the circuit board 2 according to the modification, and FIG. 9B is a press-fitting jig 13 ′ and the circuit board 2 according to the modification. FIG.
  • the area of the pressing surface 13 a is smaller than the cross-sectional area of the through hole 24.
  • the press-fitting jig 13 ′ is a locking projection that extends outside the through-hole 24 in plan view so that the pressing surface 13 a does not enter the inside of the through-hole 24 than the surface of the circuit board 2 during pressing. 13b and 13c are formed. That is, when the thickness of the circuit board 2 is larger than the specified value during the pressing process, the locking protrusions 13b and 13c come into contact with the surface of the circuit board 2 so that the pressing surface 13a is more than the surface of the circuit board 2. Lock so that it does not enter the lower side.
  • the locking protrusions 13b and 13c and the plating film 23 ' have at least high rigidity at contact points when they are in contact with each other, and the increase rate of the load W applied to the press-fitting jig 13' is increased by the contact. Is formed. Therefore, even if the total area obtained by adding the area of the lower surface of the locking projections 13b and 13c to the area of the pressing surface 13a of the press-fitting jig 13 ′ is smaller than the cross-sectional area of the through-hole 24, the modified example With the press-fitting jig 13 'and the circuit board 2 according to the above, it is possible to determine the press-fitting abnormality as in the above-described embodiment. In other words, the rigidity of the locking protrusions 13b and 13c and the plating film 23 'is set so that the press-fitting abnormality can be determined.
  • the press-fitting abnormality is determined based on whether or not the stop loads W ⁇ b> 1 and W ⁇ b> 2 after the press-fitting jig 13 is stopped are equal to or greater than the threshold load Wth. If the inflection point at the timing t1 of 5 (b) can be sufficiently detected, the press-fitting abnormality may be determined based on the detection of the inflection point. Further, as shown in timing t3 in FIG. 5A and timing t2 in FIG. 5B, the press-fitting abnormality is based on the rate of increase of the load W when the load W applied to the press-fitting jig 13 reaches the set load Ws. May be determined.
  • the inlay substrate inspection method is an inlay substrate inspection method for determining a press-fitting abnormality of an inlay substrate formed by press-fitting a heat transfer member into a through hole provided in a circuit board, A press step of inserting the heat transfer member by inserting the heat transfer member into the hole, contacting the press-fitting jig to the heat transfer member, and moving the press-fitting jig in the press-fitting direction; A load measuring step for measuring the applied load, and a brake control for stopping the movement of the press-fitting jig in the press-fitting direction on condition that the load applied to the press-fitting jig has reached a preset set load.
  • a load applied to the press-fitting jig in a state where the press-fitting jig and the heat transfer member are in contact with each other while the press-fitting jig stops moving is greater than or equal to a predetermined threshold value.
  • the press-fitting jig is compared with a case where the press-fitting jig does not contact the surface of the circuit board.
  • the rate of increase in the load applied to the press-fitting jig is high when contacting the surface of the circuit board, and the load applied to the press-fitting jig only when the press-fitting jig contacts the surface of the circuit board is greater than or equal to the threshold value. is there.
  • the press-fitting jig in the press working for press-fitting the heat transfer member into the through hole provided in the circuit board, when the thickness of the circuit board is larger than the specified value, the press-fitting jig is placed on the surface of the circuit board.
  • the contact increases the rate of increase of the load applied to the press-fitting jig. Therefore, in a state where the press-fitting jig is stopped due to the load stop, the load applied to the press-fitting jig, that is, the stop load is higher than that when the press-fitting jig does not contact the surface of the circuit board. Then, by setting a load threshold value in advance so that both stop loads can be determined, it is possible to determine a press-fit abnormality of the inlay substrate.
  • the press-fitting jig is configured such that the outer periphery of the pressing surface that presses the heat transfer member is the outer periphery of the through hole in plan view.
  • the size and arrangement are set so as to enclose.
  • the press-fitting jig In addition to pressing, it comes into contact with the portion surrounding the outer periphery of the through hole on the surface of the circuit board.
  • the area of the pressing surface is 1.4 times or more the cross-sectional area of the through hole.
  • the contact surface between the press-fitting jig and the circuit board in the second embodiment described above can be ensured more reliably, the difference between the end load and the threshold load is increased, and higher accuracy is achieved.
  • the press-fit abnormality of the inlay substrate can be determined.
  • An inlay board inspection apparatus includes a press-fitting jig for press-fitting a heat transfer member into a through hole provided in a circuit board, A load measuring unit for measuring a load applied to the press-fitting jig; The movement of the press-fitting jig in the press-fitting direction is controlled, and the movement of the press-fitting jig in the press-fitting direction is stopped on condition that the load applied to the press-fitting jig reaches a preset load.
  • a press-in determination unit that determines that the heat member is in a press-in abnormality, In the braking control, the rate of increase in the load applied to the press-fitting jig when the press-fitting jig contacts the surface of the circuit board as compared to the case where the press-fitting jig does not contact the surface of the circuit board.
  • the load applied to the press-fitting jig only when the press-fitting jig contacts the surface of the circuit board is equal to or greater than the threshold value.
  • the press-fitting jig in the press working for press-fitting the heat transfer member into the through hole provided in the circuit board, if the thickness of the circuit board is larger than the specified value, the press-fitting jig is placed on the surface of the circuit board.
  • the contact increases the rate of increase of the load applied to the press-fitting jig. Therefore, in a state where the press-fitting jig is stopped due to the load stop, the load applied to the press-fitting jig, that is, the stop load is higher than that when the press-fitting jig does not contact the surface of the circuit board. Then, by setting a load threshold value in advance so that both stop loads can be determined, it is possible to determine a press-fit abnormality of the inlay substrate.
  • the press-fitting jig has an outer periphery of a pressing surface that presses the heat transfer member, and an outer periphery of the through hole in a plan view. The size and arrangement are set so as to enclose.
  • the press-fitting jig In addition to pressing, it comes into contact with the portion surrounding the outer periphery of the through hole on the surface of the circuit board.
  • the area of the pressing surface is 1.4 times or more the cross-sectional area of the through hole.
  • the contact surface between the press-fitting jig and the circuit board in the fifth embodiment described above can be more reliably secured, the difference between the final load and the threshold load is increased, and higher accuracy is achieved.
  • the press-fit abnormality of the inlay substrate can be determined.
  • An inlay substrate manufacturing method is an inlay substrate manufacturing method for determining a press-fitting abnormality of an inlay substrate formed by press-fitting a heat transfer member into a through-hole provided in a circuit board, A press step of inserting the heat transfer member by inserting the heat transfer member into the hole, contacting the press-fitting jig to the heat transfer member, and moving the press-fitting jig in the press-fitting direction; A load measuring step for measuring the applied load, and a brake control for stopping the movement of the press-fitting jig in the press-fitting direction on condition that the load applied to the press-fitting jig has reached a preset set load.
  • the press-fitting jig in the press working for press-fitting the heat transfer member into the through hole provided in the circuit board, when the thickness of the circuit board is larger than the specified value, the press-fitting jig is placed on the surface of the circuit board.
  • the contact increases the rate of increase of the load applied to the press-fitting jig. Therefore, in a state where the press-fitting jig is stopped due to the load stop, the load applied to the press-fitting jig, that is, the stop load is higher than that when the press-fitting jig does not contact the surface of the circuit board.
  • by setting a load threshold value in advance so that both stop loads can be determined it is possible to determine a press-fit abnormality of the inlay substrate. Therefore, the inlay board
  • the press-fitting jig is configured such that the outer periphery of the pressing surface that presses the heat transfer member has an outer periphery of the through hole in plan view.
  • the size and arrangement are set so as to enclose.
  • the press-fitting jig In addition to pressing, it comes into contact with the portion surrounding the outer periphery of the through hole on the surface of the circuit board.
  • substrate manufacturing method by the 8th embodiment can provide the inlay board
  • the area of the pressing surface is 1.4 times or more the cross-sectional area of the through hole.
  • the contact surface between the press-fitting jig and the circuit board in the above-described eighth embodiment can be more reliably ensured, so that the difference between the end load and the threshold load is increased, and higher accuracy is achieved.
  • the press-fit abnormality of the inlay substrate can be determined. Therefore, the inlay board

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Automatic Assembly (AREA)

Abstract

L'invention concerne un procédé d'inspection de carte inlay qui consiste à déterminer une insertion à force anormale dans une carte inlay, formée par l'insertion à force d'un élément (3) de transfert de chaleur dans un trou traversant (24) ménagé dans une carte (2) de circuit imprimé, et comprend : une étape de pressage, dans laquelle l'élément (3) de transfert de chaleur est inséré dans le trou traversant (24) et un gabarit (13) d'insertion à force est mis en contact avec l'élément (3) de transfert de chaleur et déplacé dans la direction d'insertion à force, afin d'insérer à force l'élément (3) de transfert de chaleur ; une étape de mesure de charge, dans laquelle une charge W appliquée sur le gabarit (13) d'insertion à force est mesurée ; une étape de commande de freinage, pour mettre en oeuvre une commande de freinage en vue d'arrêter le déplacement du gabarit (13) d'insertion à force dans la direction d'insertion à force du gabarit (13) lorsque la charge W appliquée sur le gabarit (13) a atteint une charge prédéfinie Ws ; et une étape de détermination, dans laquelle, après la commande de freinage, lorsque la charge W appliquée sur le gabarit (13), dans un état dans lequel le déplacement du gabarit est arrêté pendant que le gabarit et l'élément (3) de transfert de chaleur sont en contact l'un avec l'autre, est supérieure ou égale à un seuil prédéfini Wth, l'élément (3) de transfert de chaleur est déterminé comme étant anormalement inséré à force.
PCT/JP2016/081770 2016-10-26 2016-10-26 Procédé d'inspection de carte inlay pour dispositif d'inspection, et procédé de fabrication WO2018078749A1 (fr)

Priority Applications (2)

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JP2018546993A JPWO2018078749A1 (ja) 2016-10-26 2016-10-26 インレイ基板の検査方法、検査装置、及び製造方法
PCT/JP2016/081770 WO2018078749A1 (fr) 2016-10-26 2016-10-26 Procédé d'inspection de carte inlay pour dispositif d'inspection, et procédé de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/081770 WO2018078749A1 (fr) 2016-10-26 2016-10-26 Procédé d'inspection de carte inlay pour dispositif d'inspection, et procédé de fabrication

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113660784A (zh) * 2021-08-19 2021-11-16 景旺电子科技(龙川)有限公司 一种pcb内埋导电胶的加工方法及检验方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06226558A (ja) * 1993-02-09 1994-08-16 Honda Motor Co Ltd ピストンヘッド挿入装置
JPH07164199A (ja) * 1993-12-10 1995-06-27 Japan Automat Mach Co Ltd プレス加工機の品質管理方法及びその装置
JP2003230999A (ja) * 2002-02-12 2003-08-19 Aida Eng Ltd プレス機械
JP5456214B1 (ja) * 2013-06-12 2014-03-26 株式会社メイコー 放熱基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06226558A (ja) * 1993-02-09 1994-08-16 Honda Motor Co Ltd ピストンヘッド挿入装置
JPH07164199A (ja) * 1993-12-10 1995-06-27 Japan Automat Mach Co Ltd プレス加工機の品質管理方法及びその装置
JP2003230999A (ja) * 2002-02-12 2003-08-19 Aida Eng Ltd プレス機械
JP5456214B1 (ja) * 2013-06-12 2014-03-26 株式会社メイコー 放熱基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113660784A (zh) * 2021-08-19 2021-11-16 景旺电子科技(龙川)有限公司 一种pcb内埋导电胶的加工方法及检验方法

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