WO2018068389A1 - 真空蒸镀装置 - Google Patents

真空蒸镀装置 Download PDF

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Publication number
WO2018068389A1
WO2018068389A1 PCT/CN2016/110731 CN2016110731W WO2018068389A1 WO 2018068389 A1 WO2018068389 A1 WO 2018068389A1 CN 2016110731 W CN2016110731 W CN 2016110731W WO 2018068389 A1 WO2018068389 A1 WO 2018068389A1
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Prior art keywords
magnetic plate
unit
magnetic
vacuum evaporation
substrate
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PCT/CN2016/110731
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English (en)
French (fr)
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姜亮
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深圳市华星光电技术有限公司
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Priority to US15/328,889 priority Critical patent/US20180207677A1/en
Publication of WO2018068389A1 publication Critical patent/WO2018068389A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
    • B05C17/06—Stencils
    • B05C17/08—Stencil holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of fabrication of OLED displays, and more particularly to a vacuum evaporation apparatus.
  • OLED display is a promising flat panel display technology with excellent display performance, especially self-illumination, simple structure, ultra-thin, fast response, wide Viewing angle, low power consumption and flexible display, it is known as "dream display", and its investment in production equipment is much smaller than TFT-LCD. It has been favored by major display manufacturers and has become the first in display technology. The main force of the three generations of display devices. At present, OLED has been on the eve of mass production. With the further development of research and the emergence of new technologies, OLED display devices will have a breakthrough development.
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the current mass production method is still based on the vacuum evaporation process by adding a metal mask (Mask) to the vacuum evaporation process.
  • Mosk metal mask
  • the patterning method of the organic light-emitting layer is widely used by various households because it can achieve good screen performance.
  • the role of the metal mask is to evaporate the OLED material to the design position, so the opening position, shape and surface flatness of the metal mask are very important.
  • the metal mask 10 is generally composed of a mask frame 11 and a mask sheet 12 disposed on the mask frame 1 , and a plurality of masks 12 are formed on the mask 12 .
  • Spacer masks 121 arranged in a spaced manner, wherein each mask unit 121 corresponds to a shape of an OLED product to be formed, having a plurality of openings uniformly distributed to define pixels on respective OLED products The area is such that the evaporation material is deposited in the pixel region.
  • the vacuum evaporation apparatus includes an evaporation chamber, a cooling plate 21 disposed in the evaporation chamber, a magnetic plate 22, and a driving mechanism 23; in the evaporation process, the metal mask 10 is used to define a pixel, thereby The evaporated organic material is deposited in the pixel region, the cooling plate 21 is attached to one side of the substrate 30, and the metal mask 10 bonded to the other side of the substrate 30 is cooled by the substrate 30; the magnetic plate 22 is placed in the cooling The plate 21 is pressed down by the driving mechanism 23, and the mask 12 of the metal mask 10 is adsorbed on the side surface of the substrate 30 by magnetic force, so that the mask 12 and the substrate 30 are closely adhered to reduce the evaporation process.
  • the magnetic board includes a plurality of magnetic board units that are relatively independently driven, which can effectively improve product color mixing caused by incomplete release of the mask deformation, thereby improving the yield of the OLED product.
  • the present invention provides a vacuum evaporation apparatus for vacuum evaporation of a substrate by using it in combination with a metal mask;
  • the vacuum evaporation device includes a cooling plate, a magnetic plate, and a magnetic plate driving mechanism
  • the cooling plate is disposed on the substrate to cool the metal mask and the substrate;
  • the magnetic plate is disposed above the cooling plate for adsorbing the metal mask on the lower surface of the substrate by the magnetic force of the magnetic plate;
  • the magnetic plate includes a plurality of magnetic plate units respectively corresponding to different regions on the metal reticle, the magnetic plates adsorbing corresponding regions on the metal reticle on the lower surface of the substrate by the magnetic force of the magnetic plate unit;
  • the magnetic plate driving mechanism includes a plurality of driving units connected in one-to-one correspondence with the plurality of magnetic plate units, and the plurality of magnetic plate units are independently moved up and down under the driving of the corresponding driving units.
  • the magnetic plate includes three or more magnetic plate units.
  • the magnetic plate comprises three magnetic plate units arranged side by side, wherein the magnetic plate unit disposed in the middle is a central magnetic plate unit, and the magnetic plate units located on the left and right sides of the central magnetic plate unit are located on the left and right sides of the central magnetic plate unit.
  • the board unit is a side magnetic board unit;
  • the central magnetic plate unit and the side magnetic plate unit of the magnetic plate are sequentially moved downward by the driving of the corresponding driving unit, so that the metal mask plate corresponds to the intermediate portion of the central magnetic plate unit by magnetic force, And the two side regions corresponding to the side magnetic plate unit are sequentially adsorbed on the lower surface of the substrate.
  • Each drive unit includes a drive motor and a drive shaft disposed on the respective magnetic plate unit to allow the magnetic plate unit to ascend and descend.
  • Each of the magnetic plate units includes a filler and a plurality of magnets surrounded by the filler.
  • the metal mask includes a mask frame and a mask disposed on the mask frame for adsorbing a mask of the metal mask on a lower surface of the substrate by a magnetic force thereof.
  • the vacuum evaporation apparatus further includes an evaporation chamber, and the cooling plate, the magnetic plate, and the magnetic plate driving mechanism are all disposed in the vapor deposition chamber.
  • a top of the vapor deposition chamber is provided with a substrate position adjusting unit and a substrate position observing unit.
  • a side of the vapor deposition chamber is provided with a vacuuming unit.
  • a vapor deposition gas generating unit is disposed at the bottom of the vapor deposition chamber.
  • the invention also provides a vacuum evaporation device, which is vacuum-deposited by using a metal mask together with a metal mask;
  • the vacuum evaporation device includes a cooling plate, a magnetic plate, and a magnetic plate driving mechanism
  • the cooling plate is disposed on the substrate to cool the metal mask and the substrate;
  • the magnetic plate is disposed above the cooling plate for adsorbing the metal mask on the lower surface of the substrate by the magnetic force of the magnetic plate;
  • the magnetic plate includes a plurality of magnetic plate units respectively corresponding to different regions on the metal reticle, the magnetic plates adsorbing corresponding regions on the metal reticle on the lower surface of the substrate by the magnetic force of the magnetic plate unit;
  • the magnetic plate driving mechanism includes a plurality of driving units connected in one-to-one correspondence with the plurality of magnetic plate units, and the plurality of magnetic plate units are independently moved up and down under the driving of the corresponding driving units;
  • each driving unit comprises a driving motor and a driving shaft disposed on the corresponding magnetic plate unit to allow the magnetic plate unit to rise and fall;
  • each magnetic plate unit comprises a filler and a plurality of magnets surrounded by the filler.
  • the present invention provides a vacuum evaporation apparatus comprising a cooling plate, a magnetic plate, and a magnetic plate driving mechanism, which is vacuum-deposited by using a metal mask together; the magnetic plate is disposed at Above the cooling plate, the metal mask is adsorbed on the lower surface of the substrate by the magnetic force of the magnetic plate, wherein the magnetic plate comprises a plurality of magnetic plate units respectively corresponding to different regions on the metal mask, the magnetic plate
  • the driving mechanism includes a plurality of driving units connected in one-to-one correspondence with the plurality of magnetic plate units, and the plurality of magnetic plate units are independently moved up and down under the driving of the corresponding driving units, thereby adjusting a plurality of magnetic plates
  • the order of movement of the unit fully releases the stress generated by the mask of the metal mask during the adsorption on the substrate, reduces the design difficulty of the metal mask, improves the yield of the product, and adjusts the corresponding magnetic plate unit in real time according to the color mixing of the product.
  • the equipment utilization rate the order of movement of
  • FIG. 1 is a schematic structural view of a conventional metal mask
  • FIG. 2 is a schematic structural view of a conventional vacuum evaporation apparatus
  • Fig. 3 is a schematic view showing the structure of a vacuum evaporation apparatus of the present invention.
  • the present invention provides a vacuum evaporation apparatus for vacuum evaporation of a substrate 300 by using it in combination with a metal mask 200;
  • the vacuum evaporation device includes a cooling plate 110, a magnetic plate 120, and a magnetic plate driving mechanism 130;
  • the cooling plate 110 is configured to be disposed on the substrate 300 to cool the metal mask 200 and the substrate 300;
  • the magnetic plate 120 is disposed above the cooling plate 110 for adsorbing the metal mask 200 on the lower surface of the substrate 300 by the magnetic force of the magnetic plate 120;
  • the magnetic plate 120 includes a plurality of magnetic plate units 121 respectively corresponding to different regions on the metal mask 200, and the magnetic plates 120 adsorb the corresponding regions on the metal mask 200 to the substrate 300 by the magnetic force of the magnetic plate unit 121.
  • the magnetic plate driving mechanism 130 includes a plurality of driving units 131 connected in one-to-one correspondence with the plurality of magnetic plate units 121, and the plurality of magnetic plate units 121 are independently driven by the corresponding driving units 131. The upper and lower movements are performed so that the magnetic forces of the plurality of magnetic plate units 121 on the corresponding regions on the metal mask 200 can be individually controlled.
  • the metal mask 200 includes a mask frame and a mask disposed on the mask frame, and the magnetic plate 120 is driven downward by the magnetic plate driving mechanism 130 to move the metal through the magnetic force thereof.
  • the mask of the material is pulled toward the substrate 300, and the mask is adsorbed on the lower surface of the substrate 300.
  • the magnetic plate unit 121 is moved downward by the driving of the corresponding driving unit 131, and the corresponding region of the mask is pulled toward the substrate 300 by the magnetic force thereof, so that the corresponding region of the mask is adsorbed on the lower surface of the substrate 300. .
  • the magnetic plate 120 is designed to include a plurality of magnetic plate units 121 that can be relatively independently controlled, so that the mask of the metal mask 200 can be sufficiently released by adjusting the order of movement of the plurality of magnetic plate units 121.
  • the stress generated in the process of adsorbing on the substrate 300 reduces the design difficulty of the metal mask 200, improves the product yield, and separately adjusts the corresponding area of the metal mask 200 to the corresponding magnetic plate unit 121 for the local color mixing of the product.
  • the magnetic force adjusts the corresponding magnetic plate unit 121 in real time according to the color mixing condition of the product, thereby improving the equipment utilization rate.
  • the magnetic plate 120 includes three or more magnetic plate units 121.
  • the magnetic plate 120 includes three magnetic plate units 121 arranged side by side, wherein the magnetic plate unit 121 disposed in the middle is a central magnetic plate unit, and the magnetic plate unit 121 located at the left and right sides of the central magnetic plate unit is a side portion.
  • Magnetic plate unit 121 arranged side by side, wherein the magnetic plate unit 121 disposed in the middle is a central magnetic plate unit, and the magnetic plate unit 121 located at the left and right sides of the central magnetic plate unit is a side portion.
  • the central magnetic plate unit and the side magnetic plate unit of the magnetic plate 120 are sequentially moved downward by the driving of the corresponding driving unit 131, so that the magnetic mask 200 corresponds to the central magnetic plate unit by magnetic force.
  • the intermediate portion and the side regions corresponding to the side magnetic plate unit are sequentially adsorbed on the lower surface of the substrate 300.
  • the present invention can be fully released by adjusting the moving order of the plurality of magnetic plate units 121.
  • the mask generated by the mask of the metal mask 200 during the adsorption on the substrate 300 reduces the design difficulty of the metal mask 200 and improves the yield of the product.
  • each of the driving units 131 includes a driving motor and a driving shaft provided on the corresponding magnetic plate unit 121 to allow the magnetic plate unit 121 to ascend and descend.
  • each of the magnetic plate units 121 includes a filler and a plurality of magnets surrounded by the filler.
  • the vacuum evaporation apparatus of the present invention further includes an evaporation chamber, and the cooling plate 110, the magnetic plate 120, and the magnetic plate driving mechanism 130 are all disposed in the evaporation chamber, and evaporation of the substrate 300 occurs in the evaporation chamber. .
  • the top of the vapor deposition chamber is provided with a substrate position adjusting unit and a substrate position observing unit to observe and adjust the position of the substrate 300 to achieve accurate alignment with the metal mask 200.
  • a side of the vapor deposition chamber is provided with a vacuuming unit to achieve vapor deposition in a vacuum environment.
  • a vapor deposition gas generating unit is disposed at a bottom of the vapor deposition chamber to generate a vapor deposition gas.
  • the vacuum evaporation apparatus of the present invention comprises a cooling plate, a magnetic plate, and a magnetic plate driving mechanism, and the substrate is vacuum-deposited by being used in combination with a metal mask; the magnetic plate is disposed above the cooling plate.
  • a magnetic mask for adsorbing a metal mask on a lower surface of the substrate by a magnetic force of the magnetic plate wherein the magnetic plate includes a plurality of magnetic plate units respectively corresponding to different regions on the metal reticle, the magnetic plate driving mechanism including the number a driving unit connected in one-to-one correspondence with the plurality of magnetic plate units, wherein the plurality of magnetic plate units are independently moved up and down under the driving of the corresponding driving unit, thereby adjusting the moving order of the plurality of magnetic plate units Fully releasing the stress generated by the mask of the metal mask in the process of adsorbing the substrate, reducing the design difficulty of the metal mask, improving the yield of the product, and adjusting the corresponding magnetic plate unit in real time according to the color mixing of the product, thereby improving

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种真空蒸镀装置，磁板（120）设计为包括数个分别对应于金属掩模板（200）上不同区域的磁板单元（121），所述磁板（120）通过磁板单元（121）的磁力将金属掩模板（200）上的相应区域吸附在基板（300）的下表面上，磁板驱动机构（130）包括数个与所述数个磁板单元（121）一一对应连接的驱动单元（131），所述数个磁板单元（121）独立地在相应的驱动单元（131）的驱动下进行上下移动，从而可通过调节数个磁板单元（121）的移动顺序，充分释放金属掩模板（200）的掩模在吸附于基板（300）过程中所产生的应力，降低金属掩模板（200）设计难度，提升产品良率，并且可根据产品的混色情况实时调整相应的磁板单元（121），提高设备稼动率，可针对产品局部混色情况单独调节金属掩模板（200）上相应区域所受到的磁力。

Description

真空蒸镀装置 技术领域
本发明涉及OLED显示器的制作领域，尤其涉及一种真空蒸镀装置。
背景技术
有机发光二级管(Organic Light Emitting Diode，OLED)显示器是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。在OLED的制作工艺中，有机发光层的图案化技术虽有许多方式，但目前量产的使用方式仍是以通过真空蒸镀装置加金属掩模板(Mask)进行真空蒸镀工艺为主，此有机发光层的图案化方法由于可达成良好的屏幕效能，故广为各家所采用。
其中，金属掩模板的作用是使OLED材料蒸镀到设计的位置，因此金属掩模板的开孔位置、形状以及表面平整度都相当重要。如图1所示，通常金属掩模板10由掩模边框(Mask Frame)11、及设于所述掩模边框1上的掩模(Mask Sheet)12所组成，该掩模12上形成有数个间隔排布的掩模单元121，其中，每一掩模单元121与所需要形成的一个OLED产品的形状相对应，其具有均匀分布的数个开孔以定义相应OLED产品上的像素(pixel)区域，从而使蒸镀材料沉积在pixel区域内。
如图2所示，真空蒸镀装置包括蒸镀室、及设置在蒸镀室内的冷却板21、磁板22与驱动机构23；在蒸镀过程中，金属掩模板10用于定义pixel，从而使蒸发的有机材料沉积在pixel区域内，冷却板21贴合在基板30的一侧面，且通过基板30对贴合在基板30另一侧面的金属掩模板10进行冷却；磁板22设置在冷却板21上，在驱动机构23带动下而下压，通过磁力将金属掩模板10的掩模12吸附在基板30的侧面上，从而使掩模12和基板30紧密贴合，减小蒸镀过程中的阴影效应(Shadow Effect)。现行技术中，由于磁板22为整体下压，掩模12的中间和两端部分同时受力，致使掩模12 的变形不能完全通过两端的应力缓冲区释放，未释放的变形量造成掩模12的起皱变形(wrinkle)，进而导致产品的混色良率降低。
发明内容
本发明的目的在于提供一真空蒸镀装置，磁板包括相对独立驱动的数个磁板单元，能够有效改善因掩模变形释放不完全而导致的产品混色现象，从而提升OLED产品的良率。
为实现上述目的，本发明提供一种真空蒸镀装置，通过与金属掩模板结合使用对基板进行真空蒸镀；
所述真空蒸镀装置包括冷却板、磁板、及磁板驱动机构；
所述冷却板用于设置在基板上，以对金属掩模板和基板进行冷却；
所述磁板设置在冷却板上方，用于通过磁板的磁力将金属掩模板吸附在基板的下表面上；
所述磁板包括数个分别对应于金属掩模板上不同区域的磁板单元，所述磁板通过磁板单元的磁力将金属掩模板上的相应区域吸附在基板的下表面上；
所述磁板驱动机构包括数个与所述数个磁板单元一一对应连接的驱动单元，所述数个磁板单元独立地在相应的驱动单元的驱动下进行上下移动。
所述磁板包括三个及以上的磁板单元。
所述磁板包括并列排列的三个磁板单元，其中设于中间的磁板单元为中部磁板单元，位于中部磁板单元左右两侧的磁板单元位于中部磁板单元左右两侧的磁板单元为侧部磁板单元；
使用过程中，所述磁板的中部磁板单元、侧部磁板单元在相应的驱动单元的驱动下依次向下移动，从而通过磁力使金属掩模板上对应于中部磁板单元的中间区域、及对应于侧部磁板单元的两侧区域依次吸附在基板的下表面上。
每一驱动单元包括驱动电动机、及设于相应的磁板单元上以允许该磁板单元上升和下降的驱动轴。
每一磁板单元包括填料、及数个被填料包围的磁体。
所述金属掩模板包括掩模框、及设于所述掩模框上的掩模，所述磁板用于通过其磁力将金属掩模板的掩模吸附在基板的下表面上。
所述真空蒸镀装置还包括蒸镀室，所述冷却板、磁板、及磁板驱动机构均设置在蒸镀室内。
所述蒸镀室的顶部设置有基板位置调整单元和基板位置观测单元。
所述蒸镀室的侧部设置有抽真空单元。
所述蒸镀室的底部设置有蒸镀气体发生单元。
本发明还提供一种真空蒸镀装置，通过与金属掩模板结合使用对基板进行真空蒸镀；
所述真空蒸镀装置包括冷却板、磁板、及磁板驱动机构；
所述冷却板用于设置在基板上，以对金属掩模板和基板进行冷却；
所述磁板设置在冷却板上方，用于通过磁板的磁力将金属掩模板吸附在基板的下表面上；
所述磁板包括数个分别对应于金属掩模板上不同区域的磁板单元，所述磁板通过磁板单元的磁力将金属掩模板上的相应区域吸附在基板的下表面上；
所述磁板驱动机构包括数个与所述数个磁板单元一一对应连接的驱动单元，所述数个磁板单元独立地在相应的驱动单元的驱动下进行上下移动；
其中，每一驱动单元包括驱动电动机、及设于相应的磁板单元上以允许该磁板单元上升和下降的驱动轴；
其中，每一磁板单元包括填料、及数个被填料包围的磁体。
本发明的有益效果：本发明提供的一种真空蒸镀装置，包括冷却板、磁板、及磁板驱动机构，通过与金属掩模板结合使用对基板进行真空蒸镀；所述磁板设置在冷却板上方，用于通过磁板的磁力将金属掩模板吸附在基板的下表面上，其中，所述磁板包括数个分别对应于金属掩模板上不同区域的磁板单元，所述磁板驱动机构包括数个与所述数个磁板单元一一对应连接的驱动单元，所述数个磁板单元独立地在相应的驱动单元的驱动下进行上下移动，从而可通过调节数个磁板单元的移动顺序，充分释放金属掩模板的掩模在吸附于基板过程中所产生的应力，降低金属掩模板设计难度，提升产品良率，并且可根据产品的混色情况实时调整相应的磁板单元，提高设备稼动率，可针对产品局部混色情况单独调节金属掩模板上相应区域所受到的磁力。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的金属掩模板的结构示意图；
图2为现有的真空蒸镀装置的结构示意图；
图3为本发明的真空蒸镀装置的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3，本发明提供一种真空蒸镀装置，通过与金属掩模板200结合使用对基板300进行真空蒸镀；
所述真空蒸镀装置包括冷却板110、磁板120、及磁板驱动机构130；
所述冷却板110用于设置在基板300上，以对金属掩模板200和基板300进行冷却；
所述磁板120设置在冷却板110上方，用于通过磁板120的磁力将金属掩模板200吸附在基板300的下表面上；
所述磁板120包括数个分别对应于金属掩模板200上不同区域的磁板单元121，所述磁板120通过磁板单元121的磁力将金属掩模板200上的相应区域吸附在基板300的下表面上，所述磁板驱动机构130包括数个与所述数个磁板单元121一一对应连接的驱动单元131，所述数个磁板单元121独立地在相应的驱动单元131的驱动下进行上下移动，从而可单独控制数个磁板单元121对金属掩模板200上相应区域的磁力。
具体地，所述金属掩模板200包括掩模框、及设于所述掩模框上的掩模，所述磁板120在磁板驱动机构130的驱动下向下移动，通过其磁力将金属材质的掩模拉向基板300，使掩模吸附在基板300的下表面上。
具体地，所述磁板单元121在相应的驱动单元131的驱动下向下移动，通过其磁力将掩模的对应区域拉向基板300，使掩模的对应区域吸附在基板300的下表面上。
本发明的真空蒸镀装置，将磁板120设计为包括数个可相对独立控制的磁板单元121，从而可通过调节数个磁板单元121的移动顺序，充分释放金属掩模板200的掩模在吸附于基板300过程中所产生的应力，降低金属掩模板200的设计难度，提升产品良率，并且可针对产品局部混色情况单独调节金属掩模板200上相应区域所受到对应磁板单元121的磁力，根据产品的混色情况实时调整相应的磁板单元121，提高设备稼动率。
具体地，所述磁板120包括三个及以上的磁板单元121。
优选地，所述磁板120包括并列排列的三个磁板单元121，其中设于中间的磁板单元121为中部磁板单元，位于中部磁板单元左右两侧的磁板单元121为侧部磁板单元；
使用过程中，所述磁板120的中部磁板单元、侧部磁板单元在相应的驱动单元131的驱动下依次向下移动，从而通过磁力使金属掩模板200上对应于中部磁板单元的中间区域、及对应于侧部磁板单元的两侧区域依次吸附在基板300的下表面上。相较于现行技术中通过磁板整体下压而使得掩模的中间和两端部分同时受力而吸附于基板上的方案，本发明可通过调节数个磁板单元121的移动顺序，充分释放金属掩模板200的掩模在吸附于基板300过程中所产生的应力，降低金属掩模板200的设计难度，提升产品良率。
具体地，每一驱动单元131包括驱动电动机、及设于相应的磁板单元121上以允许该磁板单元121上升和下降的驱动轴。
具体地，每一磁板单元121包括填料、及数个被填料包围的磁体。
具体地，本发明的真空蒸镀装置还包括蒸镀室，所述冷却板110、磁板120、及磁板驱动机构130均设置在蒸镀室内，对基板300的蒸镀发生在蒸镀室内。
具体地，所述蒸镀室的顶部设置有基板位置调整单元和基板位置观测单元，以观察和调整基板300的位置，实现与金属掩模板200的准确对位。
具体地，所述蒸镀室的侧部设置有抽真空单元，以实现真空环境下的蒸镀。
具体地，所述蒸镀室的底部设置有蒸镀气体发生单元，以产生蒸镀气体。
综上所述，本发明的真空蒸镀装置，包括冷却板、磁板、及磁板驱动机构，通过与金属掩模板结合使用对基板进行真空蒸镀；所述磁板设置在冷却板上方，用于通过磁板的磁力将金属掩模板吸附在基板的下表面上，其中，所述磁板包括数个分别对应于金属掩模板上不同区域的磁板单元，所述磁板驱动机构包括数个与所述数个磁板单元一一对应连接的驱动单元，所述数个磁板单元独立地在相应的驱动单元的驱动下进行上下移动，从而可通过调节数个磁板单元的移动顺序，充分释放金属掩模板的掩模在吸附于基板过程中所产生的应力，降低金属掩模板设计难度，提升产品良率，并且可根据产品的混色情况实时调整相应的磁板单元，提高设备稼动率，可针对产品局部混色情况单独调节金属掩模板上相应区域所受到的磁力。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (18)

  1. 一种真空蒸镀装置，通过与金属掩模板结合使用对基板进行真空蒸镀；
    所述真空蒸镀装置包括冷却板、磁板、及磁板驱动机构；
    所述冷却板用于设置在基板上，以对金属掩模板和基板进行冷却；
    所述磁板设置在冷却板上方，用于通过磁板的磁力将金属掩模板吸附在基板的下表面上；
    所述磁板包括数个分别对应于金属掩模板上不同区域的磁板单元，所述磁板通过磁板单元的磁力将金属掩模板上的相应区域吸附在基板的下表面上；
    所述磁板驱动机构包括数个与所述数个磁板单元一一对应连接的驱动单元，所述数个磁板单元独立地在相应的驱动单元的驱动下进行上下移动。
  2. 如权利要求1所述的真空蒸镀装置，其中，所述磁板包括三个及以上的磁板单元。
  3. 如权利要求2所述的真空蒸镀装置，其中，所述磁板包括并列排列的三个磁板单元，其中设于中间的磁板单元为中部磁板单元，位于中部磁板单元左右两侧的磁板单元为侧部磁板单元；
    使用过程中，所述磁板的中部磁板单元、侧部磁板单元在相应的驱动单元的驱动下依次向下移动，从而通过磁力使金属掩模板上对应于中部磁板单元的中间区域、及对应于侧部磁板单元的两侧区域依次吸附在基板的下表面上。
  4. 如权利要求1所述的真空蒸镀装置，其中，每一驱动单元包括驱动电动机、及设于相应的磁板单元上以允许该磁板单元上升和下降的驱动轴。
  5. 如权利要求1所述的真空蒸镀装置，其中，每一磁板单元包括填料、及数个被填料包围的磁体。
  6. 如权利要求1所述的真空蒸镀装置，其中，所述金属掩模板包括掩模框、及设于所述掩模框上的掩模，所述磁板用于通过其磁力将金属掩模板的掩模吸附在基板的下表面上。
  7. 如权利要求1所述的真空蒸镀装置，还包括蒸镀室，所述冷却板、磁板、及磁板驱动机构均设置在蒸镀室内。
  8. 如权利要求7所述的真空蒸镀装置，其中，所述蒸镀室的顶部设置有基板位置调整单元和基板位置观测单元。
  9. 如权利要求7所述的真空蒸镀装置，其中，所述蒸镀室的侧部设置有抽真空单元。
  10. 如权利要求7所述的真空蒸镀装置，其中，所述蒸镀室的底部设置有蒸镀气体发生单元。
  11. 一种真空蒸镀装置，通过与金属掩模板结合使用对基板进行真空蒸镀；
    所述真空蒸镀装置包括冷却板、磁板、及磁板驱动机构；
    所述冷却板用于设置在基板上，以对金属掩模板和基板进行冷却；
    所述磁板设置在冷却板上方，用于通过磁板的磁力将金属掩模板吸附在基板的下表面上；
    所述磁板包括数个分别对应于金属掩模板上不同区域的磁板单元，所述磁板通过磁板单元的磁力将金属掩模板上的相应区域吸附在基板的下表面上；
    所述磁板驱动机构包括数个与所述数个磁板单元一一对应连接的驱动单元，所述数个磁板单元独立地在相应的驱动单元的驱动下进行上下移动；
    其中，每一驱动单元包括驱动电动机、及设于相应的磁板单元上以允许该磁板单元上升和下降的驱动轴；
    其中，每一磁板单元包括填料、及数个被填料包围的磁体。
  12. 如权利要求11所述的真空蒸镀装置，其中，所述磁板包括三个及以上的磁板单元。
  13. 如权利要求12所述的真空蒸镀装置，其中，所述磁板包括并列排列的三个磁板单元，其中设于中间的磁板单元为中部磁板单元，位于中部磁板单元左右两侧的磁板单元为侧部磁板单元；
    使用过程中，所述磁板的中部磁板单元、侧部磁板单元在相应的驱动单元的驱动下依次向下移动，从而通过磁力使金属掩模板上对应于中部磁板单元的中间区域、及对应于侧部磁板单元的两侧区域依次吸附在基板的下表面上。
  14. 如权利要求11所述的真空蒸镀装置，其中，所述金属掩模板包括掩模框、及设于所述掩模框上的掩模，所述磁板用于通过其磁力将金属掩模板的掩模吸附在基板的下表面上。
  15. 如权利要求11所述的真空蒸镀装置，还包括蒸镀室，所述冷却板、磁板、及磁板驱动机构均设置在蒸镀室内。
  16. 如权利要求15所述的真空蒸镀装置，其中，所述蒸镀室的顶部设置有基板位置调整单元和基板位置观测单元。
  17. 如权利要求15所述的真空蒸镀装置，其中，所述蒸镀室的侧部设置有抽真空单元。
  18. 如权利要求15所述的真空蒸镀装置，其中，所述蒸镀室的底部设置有蒸镀气体发生单元。
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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018209612A1 (zh) * 2017-05-17 2018-11-22 深圳市柔宇科技有限公司 接触板、对位系统和蒸镀装置
CN107475680B (zh) * 2017-08-29 2020-08-25 京东方科技集团股份有限公司 一种基板承载装置及蒸镀设备
CN108203805A (zh) * 2018-01-27 2018-06-26 武汉华星光电半导体显示技术有限公司 蒸镀设备及其磁性固定板
CN108400256A (zh) * 2018-02-02 2018-08-14 信利（惠州）智能显示有限公司 一种贴合方法及系统和蒸镀装置
CN108950484B (zh) * 2018-07-06 2020-06-30 武汉华星光电半导体显示技术有限公司 蒸镀装置
CN109023253A (zh) * 2018-07-20 2018-12-18 深圳市华星光电半导体显示技术有限公司 蒸镀设备
CN109295421B (zh) * 2018-10-26 2020-10-27 武汉华星光电半导体显示技术有限公司 蒸镀设备及其调磁装置
CN109487207A (zh) * 2018-12-29 2019-03-19 深圳市华星光电半导体显示技术有限公司 磁力装置
CN109609912A (zh) * 2019-01-21 2019-04-12 昆山国显光电有限公司 真空蒸镀装置和真空蒸镀方法
CN110295346A (zh) * 2019-08-01 2019-10-01 云谷（固安）科技有限公司 蒸镀贴合装置及蒸镀贴合方法
KR20210081700A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 성막장치 및 이를 사용하여 전자 디바이스를 제조하는 방법
CN111621742B (zh) * 2020-05-19 2021-07-23 武汉华星光电半导体显示技术有限公司 一种掩膜板及其应用方法、封装层的制备方法
CN113463021B (zh) * 2021-06-30 2023-05-30 武汉华星光电半导体显示技术有限公司 冷却装置及其冷却方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004259598A (ja) * 2003-02-26 2004-09-16 Hitachi High-Tech Electronics Engineering Co Ltd 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したｅｌパネル
US20070072337A1 (en) * 2005-09-27 2007-03-29 Hitachi Displays, Ltd. Method of manufacturing the organic electroluminescent display and organic electroluminescent display manufactured by the method
CN103668049A (zh) * 2012-09-07 2014-03-26 昆山允升吉光电科技有限公司 一种大尺寸oled蒸镀用掩模板组件
CN103981491A (zh) * 2014-04-30 2014-08-13 京东方科技集团股份有限公司 一种蒸镀装置
CN205368488U (zh) * 2016-02-29 2016-07-06 上海和辉光电有限公司 一种蒸镀装置
CN205420529U (zh) * 2016-03-16 2016-08-03 鄂尔多斯市源盛光电有限责任公司 一种蒸镀装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004259598A (ja) * 2003-02-26 2004-09-16 Hitachi High-Tech Electronics Engineering Co Ltd 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したｅｌパネル
US20070072337A1 (en) * 2005-09-27 2007-03-29 Hitachi Displays, Ltd. Method of manufacturing the organic electroluminescent display and organic electroluminescent display manufactured by the method
CN103668049A (zh) * 2012-09-07 2014-03-26 昆山允升吉光电科技有限公司 一种大尺寸oled蒸镀用掩模板组件
CN103981491A (zh) * 2014-04-30 2014-08-13 京东方科技集团股份有限公司 一种蒸镀装置
CN205368488U (zh) * 2016-02-29 2016-07-06 上海和辉光电有限公司 一种蒸镀装置
CN205420529U (zh) * 2016-03-16 2016-08-03 鄂尔多斯市源盛光电有限责任公司 一种蒸镀装置

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