WO2018054306A1 - 精密金属遮罩、显示基板及其对位方法 - Google Patents
精密金属遮罩、显示基板及其对位方法 Download PDFInfo
- Publication number
- WO2018054306A1 WO2018054306A1 PCT/CN2017/102481 CN2017102481W WO2018054306A1 WO 2018054306 A1 WO2018054306 A1 WO 2018054306A1 CN 2017102481 W CN2017102481 W CN 2017102481W WO 2018054306 A1 WO2018054306 A1 WO 2018054306A1
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- WIPO (PCT)
- Prior art keywords
- alignment
- metal mask
- precision metal
- display substrate
- holes
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 24
- 229910001111 Fine metal Inorganic materials 0.000 title abstract 3
- 238000001704 evaporation Methods 0.000 claims abstract description 20
- 230000008020 evaporation Effects 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims description 135
- 238000007740 vapor deposition Methods 0.000 claims description 14
- 239000011368 organic material Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the alignment mark is a registration hole.
- Figure 6 is an enlarged schematic view showing a fourth position of the precision metal mask shown in Figure 2;
- FIG. 11 is an enlarged schematic view showing a third position of the OLED substrate shown in FIG. 8;
- the shape of the pattern area 110 is not limited thereto, and those skilled in the art can understand that the pattern area can be any suitable shape as needed, such as a triangle, a rectangle, a square, or other polygons, or an ellipse, an ellipse, or the like. .
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (12)
- 一种精密金属遮罩,其特征在于,包括:图案区域,其包括多个开口;以及多个对位孔,其位于所述图案区域外部。
- 根据权利要求1所述的精密金属遮罩,其特征在于,所述图案区域为圆形,所述多个对位孔沿所述图案区域的周向均匀分布。
- 根据权利要求1所述的精密金属遮罩,其特征在于,所述多个对位孔的数量为至少三个。
- 根据权利要求1所述的精密金属遮罩,其特征在于,所述多个对位孔与所述图案区域中的所述多个开口具有相同的形状和尺寸。
- 根据权利要求1所述的精密金属遮罩,其特征在于,所述多个对位孔与所述图案区域中的所述多个开口具有相同的排列方式。
- 一种显示基板,其适于在蒸镀时与权利要求1到5中任意一项所述的密金属遮罩配合,其特征在于,包括:像素区域,其与所述精密金属遮罩中的图案区域相对应;以及多个对位标记,其位于所述像素区域外部,并且每一个对位标记在所述显示基板中的位置与所述多个对位孔中的相应一个对位孔在所述精密金属遮罩中的位置相对应。
- 根据权利要求6所述的显示基板,其特征在于,所述对位标记为对位套合孔。
- 根据权利要求7所述的显示基板,其特征在于,所述对位套合孔的开口尺寸小于所述对位孔的开口尺寸。
- 一种用于蒸镀的精密金属遮罩的对位方法,该对位方法包括以下步骤:提供精密金属遮罩,所述精密金属遮罩包括图案区域和多个对位孔,图案区域包括多个开口,所述多个对位孔位于所述图案区域外部;识别所述精密金属遮罩中的所述多个对位孔,根据识别的所述多个对位孔,使用张网装置将所述精密金属遮罩张紧在网框上,所述精密金属遮罩和所述网 框形成掩膜板;提供显示基板,所述显示基板包括像素区域和多个对位标记,所述像素区域与所述精密金属遮罩中的图案区域相对应,所述多个对位标记中的每一个对位标记在所述显示基板中的位置与所述多个对位孔中的相应一个对位孔在所述精密金属遮罩中的位置相对应;将所述掩膜板放置在所述显示基板上方,调整所述精密金属遮罩的位置,使得所述精密金属遮罩中的所述多个对位孔分别与所述显示基板中的所述多个对位标记中的相应一个对位标记位置对齐;使用蒸镀源对所述掩膜板和所述显示基板组成的组件进行蒸镀。
- 根据权利要求9所述的用于显示蒸镀的精密金属遮罩的对位方法,其特征在于,所述方法包括提供多个精密金属遮罩,每个精密金属遮罩中的图案区域具有不同的像素图案,在进行蒸镀时,每个精密金属遮罩用于在所述显示基板上形成单一颜色的像素。
- 根据权利要求9所述的用于显示蒸镀的精密金属遮罩的对位方法,其特征在于,所述对位标记的尺寸小于所述对位孔的开口尺寸。
- 根据权利要求11所述的用于显示蒸镀的精密金属遮罩的对位方法,其特征在于,调整所述精密金属遮罩的位置,使得所述精密金属遮罩中的所述多个对位孔分别与所述显示基板中的所述多个对位标记中的相应一个对位标记位置对齐包括:调整所述精密金属遮罩的位置,使得所述显示基板中的所述多个对位标记中的每一个对位标记均位于所述精密金属遮罩中的所述多个对位孔中的相应一个对位孔的开口的中心位置。
Priority Applications (4)
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KR1020197004990A KR102195457B1 (ko) | 2016-09-23 | 2017-09-20 | 금속 마스크, 디스플레이 기판 및 이의 정렬 방법 |
JP2019510363A JP6761540B2 (ja) | 2016-09-23 | 2017-09-20 | メタルマスク、表示基板及びこれらの位置合わせ方法 |
EP17852374.2A EP3489384B1 (en) | 2016-09-23 | 2017-09-20 | Fine metal mask, display substrate, and alignment method therefor |
US16/306,904 US11053579B2 (en) | 2016-09-23 | 2017-09-20 | Fine metal mask, display substrate, and alignment method therefor |
Applications Claiming Priority (2)
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CN201610846761.8 | 2016-09-23 | ||
CN201610846761.8A CN107868931A (zh) | 2016-09-23 | 2016-09-23 | 精密金属遮罩、oled基板及其对位方法 |
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WO2018054306A1 true WO2018054306A1 (zh) | 2018-03-29 |
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PCT/CN2017/102481 WO2018054306A1 (zh) | 2016-09-23 | 2017-09-20 | 精密金属遮罩、显示基板及其对位方法 |
Country Status (7)
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US (1) | US11053579B2 (zh) |
EP (1) | EP3489384B1 (zh) |
JP (1) | JP6761540B2 (zh) |
KR (1) | KR102195457B1 (zh) |
CN (1) | CN107868931A (zh) |
TW (1) | TWI659117B (zh) |
WO (1) | WO2018054306A1 (zh) |
Families Citing this family (4)
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CN110473822B (zh) * | 2018-05-09 | 2021-11-23 | 京东方科技集团股份有限公司 | 对位方法及对位装置、蒸镀设备 |
CN109055892B (zh) * | 2018-07-27 | 2020-01-10 | 云谷(固安)科技有限公司 | 掩膜板及蒸镀装置 |
CN109378329A (zh) * | 2018-09-28 | 2019-02-22 | 昆山国显光电有限公司 | 有机发光显示装置及其制备方法、制备支撑柱的掩膜板 |
KR102391292B1 (ko) * | 2021-12-15 | 2022-04-27 | 주식회사 핌스 | 박막 증착용 하이브리드 마스크, 이의 제조방법 및 마스크 조립체 |
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2016
- 2016-09-23 CN CN201610846761.8A patent/CN107868931A/zh active Pending
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2017
- 2017-09-20 WO PCT/CN2017/102481 patent/WO2018054306A1/zh unknown
- 2017-09-20 JP JP2019510363A patent/JP6761540B2/ja active Active
- 2017-09-20 EP EP17852374.2A patent/EP3489384B1/en active Active
- 2017-09-20 KR KR1020197004990A patent/KR102195457B1/ko active IP Right Grant
- 2017-09-20 US US16/306,904 patent/US11053579B2/en active Active
- 2017-09-22 TW TW106132557A patent/TWI659117B/zh active
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Also Published As
Publication number | Publication date |
---|---|
CN107868931A (zh) | 2018-04-03 |
KR102195457B1 (ko) | 2020-12-28 |
EP3489384B1 (en) | 2024-05-29 |
TW201825695A (zh) | 2018-07-16 |
TWI659117B (zh) | 2019-05-11 |
US20200308687A1 (en) | 2020-10-01 |
EP3489384A4 (en) | 2019-09-04 |
US11053579B2 (en) | 2021-07-06 |
EP3489384A1 (en) | 2019-05-29 |
JP6761540B2 (ja) | 2020-09-23 |
KR20190026034A (ko) | 2019-03-12 |
JP2019526707A (ja) | 2019-09-19 |
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