WO2018043037A1 - Dispositif de moulage par injection sans canal de coulée - Google Patents

Dispositif de moulage par injection sans canal de coulée Download PDF

Info

Publication number
WO2018043037A1
WO2018043037A1 PCT/JP2017/028515 JP2017028515W WO2018043037A1 WO 2018043037 A1 WO2018043037 A1 WO 2018043037A1 JP 2017028515 W JP2017028515 W JP 2017028515W WO 2018043037 A1 WO2018043037 A1 WO 2018043037A1
Authority
WO
WIPO (PCT)
Prior art keywords
block
gate
resin
cooling
injection molding
Prior art date
Application number
PCT/JP2017/028515
Other languages
English (en)
Japanese (ja)
Inventor
正彦 今泉
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN201780053660.8A priority Critical patent/CN109641378B/zh
Priority to JP2018537071A priority patent/JP6624477B2/ja
Publication of WO2018043037A1 publication Critical patent/WO2018043037A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould

Definitions

  • the present invention relates to a runnerless injection molding apparatus.
  • a heating unit that heats the cavity portion is disposed in the vicinity of the cavity portion formed on the parting surface, and communicates with the cavity portion.
  • cooling means for cooling the resin passage portion is provided in the vicinity of the resin passage portion.
  • a device in which a heat insulating means is interposed between a cavity portion heated by a heating means and a resin passage portion cooled by a cooling means is known (for example, Patent Document 1). reference).
  • This runnerless injection molding apparatus does not cure the resin since the resin passage is cooled by the cooling action of the cooling means during molding.
  • the resin filled in the cavity is cured by the heating action of the heating means.
  • cures in a cavity part is to the position where a heat insulation means exists. For this reason, when the mold is opened after molding, only the molded product on the cavity portion side is taken out from the position of the heat insulating means, and runnerless molding can be performed.
  • the conventional open gate type runnerless injection molding apparatus has a problem in that the gate cut position is not always constant and the position varies. Due to such variations, the waste of the resin member is increased or the molded product is chipped. For this reason, in recent years, in order to stabilize the position of the gate cut, a technique in which a gate block whose temperature is not adjusted is interposed between the cavity portion and the resin passage portion has been studied. However, even if the gate block is simply interposed between the cavity portion and the resin passage portion, the gate block is thermally expanded by the heat from the cavity portion. When the gate block thermally expands, the contact state between the gate block and the resin passage portion changes, and the heat transfer state between the two changes greatly. Thereby, there is a possibility that the resin may be cured in the resin passage portion, which is a cause of dispersion of resin filling in the cavity portion.
  • an object of the present invention is to provide a runnerless injection molding apparatus that not only suppresses the curing of the resin in the flow path portion but also stabilizes the fluidity of the resin and suppresses variations in resin filling.
  • a runnerless injection molding apparatus is a runnerless injection molding apparatus for injection molding a thermosetting resin, and is a sprue that is a flow path of a thermosetting resin.
  • a cooling block that is disposed around a part of the sprue and formed with a cooling flow path through which a coolant flows, and a heating block having a heat source for curing the thermosetting resin,
  • the gate block is disposed between the cooling block and the heating block and is not temperature-controlled.
  • the gate block includes a gate, and a gap communicating with the gate is provided between the gate block and the cooling block. It is formed around.
  • a runnerless injection molding apparatus that can stabilize resin flowability and suppress variation in resin filling by suppressing the curing of the resin in the flow path portion.
  • FIG. 1 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus according to an embodiment.
  • FIG. 2 is a cross-sectional view showing a cooling block according to the embodiment.
  • FIG. 3 is a top view schematically showing the overall shape of the cooling flow path according to the embodiment.
  • FIG. 4 is a cross-sectional view of a runnerless injection molding apparatus showing one step of a method for producing a resin molded product.
  • FIG. 5 is a cross-sectional view of a runnerless injection molding apparatus showing one step of a method for producing a resin molded product.
  • FIG. 6 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus according to Modification 1.
  • FIG. 7 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus according to Modification 2.
  • FIG. 1 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus 10 according to the embodiment.
  • the runnerless injection molding apparatus 10 is an apparatus for injection molding a thermosetting resin.
  • the thermosetting resin is a resin that is cured by heating.
  • the thermosetting resin also includes a thermosetting elastomer.
  • the thermosetting here includes vulcanization and crosslinking.
  • the runnerless injection molding apparatus 10 includes a mold 20 for molding a thermosetting resin (hereinafter referred to as a resin 11; see FIG. 4), a mold 20 and a resin communication path that communicate with each other.
  • a control unit (computer: not shown) for controlling these operations.
  • the control unit includes, for example, a nonvolatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input / output port, and a processor that executes the program.
  • the mold 20 includes a cooling block 30, a gate block 40, a fixed side heating block 50, and a movable side heating block 60.
  • liquidity is supplied with respect to the metal mold
  • the resin injection part injects the BMC to the mold 20 in a state where the temperature of the BMC is adjusted to 70 ° C. or more and 80 ° C. or less where the viscosity is lowest.
  • a cooling block 30, a gate block 40, a fixed side heating block 50, and a movable side heating block 60 are arranged in order from the upstream in the flow direction of the resin 11.
  • the upstream side in the flow direction of the resin 11 is “upper” and the downstream side is “lower”.
  • FIG. 2 is a cross-sectional view showing the cooling block 30 according to the embodiment.
  • the cooling block 30 includes a second sprue 31 that forms part of a sprue that is a flow path of the resin 11, and a cooling flow path 32 that cools the resin 11 in the second sprue 31. Is formed.
  • the cooling block 30 is formed of a metal material such as stainless steel, for example.
  • the second sprue 31 is a flow path that guides the resin 11 injected from the resin injection portion to the gate block 40.
  • the second sprue 31 is a cylindrical space that tapers toward the downstream side.
  • the extending direction of the second sprue 31 is the same as the flow direction of the resin 11 and is the vertical direction in the present embodiment. Moreover, in this Embodiment, let the direction orthogonal to the extending direction be the width direction.
  • the cooling flow path 32 is disposed around the second sprue 31 and is a flow path through which the coolant 33 flows.
  • the coolant 33 include refrigerants such as water and oil.
  • a cooling source (not shown) is connected to the cooling channel 32, and the cooling source circulates the coolant 33 in the cooling channel 32.
  • the cooling source adjusts the coolant 33 to a predetermined temperature.
  • the predetermined temperature is a temperature at which the fluidity of the resin 11 can be stabilized in a high state (a state where the viscosity is low).
  • the resin 11 is BMC, a temperature between 70 ° C. and 80 ° C. is set as the predetermined temperature.
  • FIG. 3 is a top view schematically showing the overall shape of the cooling flow path 32 according to the embodiment.
  • FIG. 2 is a cross-sectional view of the cut surface including the II-II line in FIG.
  • the cooling flow path 32 is a single flow path in the cooling block 30.
  • the cooling flow path 32 includes a supply unit 321 to which the coolant 33 is supplied from a cooling source, a discharge unit 322 that discharges the coolant 33 to the cooling source, and an intermediate unit 323 between the supply unit 321 and the discharge unit 322. It has.
  • the supply unit 321 and the discharge unit 322 are arranged above the cooling block 30 and above the intermediate unit 323.
  • the cooling flow path 32 forms a closed space in the cooling block 30 except for the supply unit 321 and the discharge unit 322. Thereby, the leakage of the coolant 33 from the cooling block 30 is prevented.
  • the intermediate part 323 of the cooling flow path 32 is a part that contributes to temperature adjustment for the resin 11 in the second sprue 31.
  • the intermediate portion 323 includes a first spiral portion 324 that causes the coolant 33 to flow from upstream to downstream in the flow direction of the resin 11 and a second spiral portion that causes the coolant 33 to flow from downstream to upstream in the flow direction of the resin 11. 325.
  • the lower end portion of the first spiral portion 324 and the lower end portion of the second spiral portion 325 communicate with each other.
  • the 1st spiral part 324 and the 2nd spiral part 325 become the shape wound by the same winding diameter.
  • the first spiral portion 324 is indicated by a broken line
  • the second spiral portion 325 is indicated by a two-dot chain line.
  • a portion on the near side of the cut surface including the II-II line is illustrated by a black line
  • a portion on the far side is illustrated by a gray line.
  • the gate block 40 is disposed between the cooling block 30 and the fixed-side heating block 50.
  • the gate block 40 is formed by a metal material such as stainless steel or a material having low thermal conductivity (for example, ceramics) so that the temperature is not adjusted.
  • the gate block 40 is formed with a gate block side gate (gate) 42 forming a part of a sprue that is a flow path of the resin 11.
  • the gate block side gate 42 is a flow path for guiding the resin 11 supplied from the second sprue 31 of the cooling block 30 to the fixed side heating block 50.
  • the gate block side gate 42 extends in the vertical direction as a whole.
  • the upper end portion of the gate block side gate 42 is a throttle portion 41 whose inner diameter is narrower than that of the second sprue 31.
  • the throttle part 41 is a cylindrical space.
  • the downstream side of the throttle part 41 in the gate block side gate 42 is an enlarged diameter part 43 having an inner diameter wider than that of the throttle part 41.
  • the enlarged diameter portion 43 is a tapered space whose upper end portion has the smallest inner diameter and whose lower end portion has the largest inner diameter.
  • the upper surface of the gate block 40 is a flat surface, and a gap 45 is formed between the gate block 40 and the cooling block 30 when the resin molded product is manufactured.
  • the gap 45 is always maintained by another mold (not shown) when the resin molded product is manufactured.
  • the gap 45 communicates with the gate block side gate 42.
  • the thickness T of the gap 45 is not less than 0.01 mm and not more than 0.15 mm.
  • the thickness T of the gap 45 is set to a value at which the resin 11 flowing through the second sprue 31 and the gate block side gate 42 does not leak into the gap 45.
  • the gate block 40 is thermally expanded.
  • the thickness T of the gap 45 is determined to a value that does not close the gap 45 even during this thermal expansion.
  • the thickness T of the gap 45 may be 0.1 mm or less.
  • the thickness T of the gap 45 even after expansion. Is 0.1 mm or less. That is, before the gate block 40 is thermally expanded, the thickness T of the gap 45 is 0.15 mm or less.
  • the maximum thermal expansion amount may be 0.01 mm or less, and in the case of a resin other than phenol, the resin may leak through a gap 45 of about 0.01 mm. Therefore, the gap 45 is set to 0.01 mm or more.
  • the fixed side heating block 50 is disposed between the gate block 40 and the movable side heating block 60.
  • the fixed-side heating block 50 is made of a metal material such as stainless steel.
  • the fixed-side heating block 50 is formed with a heating block-side gate 53 that forms a part of a sprue that is a flow path for the resin 11 and a cavity 54.
  • the heating block side gate 53 is a flow path that guides the resin 11 supplied from the gate block side gate 42 of the gate block 40 to the cavity 54.
  • the heating block side gate 53 extends in the up-down direction as a whole, and is a tapered space with an upper end portion having the smallest inner diameter and a lower end portion having the largest inner diameter.
  • the cavity 54 is a recess for forming a resin molded product, and the lower part is opened.
  • the cavity 54 becomes a closed space by overlapping the movable heating block 60 when the mold is closed.
  • a resin molded product is formed by filling and curing the resin 11 in the space closed when the mold is closed. This space is formed in a shape corresponding to the shape of the resin molded product.
  • the fixed-side heating block 50 has a heat source 51 for curing the resin 11 in the heating block-side gate 53 and the cavity 54.
  • the heat source 51 is, for example, a heating wire, and is disposed around the heating block side gate 53 and the cavity 54 in the fixed side heating block 50.
  • the resin 11 is cured and becomes a resin molded product.
  • a portion corresponding to the cavity 54 is a product portion
  • a portion corresponding to the heating block side gate 53 is a non-product portion.
  • the heat source 51 adjusts the temperature to a temperature at which the resin 11 in the heating block side gate 53 and the cavity 54 is cured. For example, when the resin 11 is BMC, it is heated to 140 ° C. or higher.
  • the movable side heating block 60 is a mold that moves up and down to move toward and away from the fixed side heating block 50.
  • the movable side heating block 60 is made of a metal material such as stainless steel, for example.
  • the upper surface of the movable-side heating block 60 has a shape portion 61 that has a shape corresponding to a part of the cavity 54, and the movable-side heating block 60 overlaps the fixed-side heating block 50 and is in a mold-closed state The cavity 54 is closed.
  • the movable heating block 60 has a heat source 62 for curing the resin 11 in the cavity 54.
  • the heat source 62 is a heating wire, for example, and is disposed around the shape portion 61. When the heat from the heat source 62 is transmitted to the resin 11 in the cavity 54, the resin 11 is cured and becomes a resin molded product.
  • FIGS. 1, 4, and 5 are cross-sectional views of the runnerless injection molding apparatus 10 showing the steps of the manufacturing method.
  • the resin 11 is injected from the resin injection portion.
  • the resin 11 is supplied and filled into the cavity 54 via the second sprue 31, the gate block side gate 42 and the heating block side gate 53.
  • the gap 45 communicates with the gate block side gate 42.
  • the thickness T of the gap 45 is set to an appropriate value, the resin 11 does not leak into the gap 45. It has become. Even if the resin 11 leaks into the gap 45, since the portion corresponds to the non-product portion, the quality of the product portion is not affected.
  • the coolant 33 circulates in the cooling flow path 32 of the cooling block 30, and the temperature of the resin 11 in the second sprue 31 is adjusted.
  • the heat sources 51 and 62 generate heat, respectively, and the inside of the heating block side gate 53 and the cavity 54 is adjusted to a temperature at which the resin 11 is cured.
  • the resin 11 can be hardened stably in the fixed-side heating block 50.
  • the resin 11 in the gate block 40 is also cured because the heat is transmitted from the resin 11 in the fixed-side heating block 50.
  • the gap 45 is formed between the gate block 40 and the cooling block 30, the amount of heat transfer from the gate block 40 to the cooling block 30 can be suppressed by the gap 45. Therefore, it can suppress that resin 11 hardens
  • the movable side heating block 60 is lowered and separated from the fixed side heating block 50, and the mold is opened. Thereafter, the resin molded product 100 is taken out from the shape portion 61 of the movable heating block 60 by the molded product take-out device 80.
  • gate cutting is performed in the vicinity of the boundary between the gate block 40 and the cooling block 30 where the fluidity of the resin 11 is low.
  • the narrowed portion 41 having an inner diameter smaller than the large-diameter portion 43 in the gate block side gate 42 is disposed in the vicinity of the boundary, stress at the time of extraction can be concentrated on the narrowed portion 41. Therefore, the certainty of the gate cut performed near the boundary can be improved.
  • the runnerless injection molding apparatus 10 is a runnerless injection molding apparatus for injection molding a thermosetting resin (resin 11).
  • the runnerless injection molding apparatus 10 includes a part of the sprue (second sprue 31) that is a flow path of the resin 11, and a cooling flow path 32 that is disposed around the second sprue 31 and into which the coolant 33 flows.
  • the gate block 40 has a gate (gate block side gate 42).
  • a gap 45 communicating with the gate block side gate 42 is formed between the gate block 40 and the cooling block 30 around the gate block side gate 42.
  • the gap 45 communicating with the gate block side gate 42 is formed between the gate block 40 and the cooling block 30, the gap 45 leads from the gate block 40 to the cooling block 30. Heat transfer can be reduced. Therefore, it can suppress that resin 11 hardens
  • the thickness of the gap 45 is 0.01 mm or more and 0.15 mm or less.
  • the gap 45 has a thickness of 0.01 mm or more and 0.15 mm or less, the gap 45 can be maintained even if the gate block 40 is thermally expanded.
  • FIG. 6 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus 10A according to the first modification.
  • a concave portion 36 having a circular shape in plan view surrounding the periphery of the second sprue 31 is formed on the lower surface of the cooling block 30A.
  • the recess 36 is concentric with the second sprue 31 in a plan view.
  • the bottom surface of the recess 36 is a plane parallel to the bottom surface of the cooling block 30A.
  • the peripheral surface of the recess 36 is a tapered surface that expands downward.
  • the gate block 40A is formed in a truncated cone shape, and the upper portion thereof is a protrusion 46 that fits into the recess 36 of the cooling block 30A. That is, the recess 36 of the cooling block 30A and the protrusion 46 of the gate block 40A form an inlay structure.
  • the protrusion 46 is concentric with the gate block side gate 42 in plan view. That is, the gate block side gate 42 is arranged at the center of the protrusion 46. Further, the front end surface of the protrusion 46 is a plane parallel to the bottom surface of the recess 36. The peripheral surface of the protrusion 46 is a tapered surface that expands downward. The peripheral surface of the protrusion 46 is a contact surface that contacts the peripheral surface of the recess 36.
  • the height H of the protrusion 46 is set smaller than the depth D of the recess 36.
  • a gap 45a is formed between the gate block 40A and the cooling block 30A.
  • the thickness T of the gap 45 a is the difference between the depth D of the recess 36 and the height H of the protrusion 46.
  • the gate block 40A and the cooling block 30A are fitted by the inlay structure (projection 46, recess 36) via the gap 45a, the contact area between the projection 46 and the recess 36 is adjusted. Thus, the amount of heat transfer from the gate block 40A to the cooling block 30A can be controlled.
  • the gate block side gate 42 is disposed in the protrusion 46 and the second sprue 31 is disposed in the recess 36, the gate block side gate 42 is obtained by fitting the protrusion 46 and the recess 36. A positional shift with the second sprue 31 can be prevented.
  • the gate block 40A has the protrusion 46 and the cooling block 30A has the recess 36.
  • this relationship may be reversed. .
  • FIG. 7 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus 10B according to Modification 2.
  • a concave portion 57 having a circular shape in plan view surrounding the periphery of the heating block side gate 53 is formed on the upper surface of the fixed side heating block 50B.
  • the recess 57 is concentric with the heating block side gate 53 in plan view.
  • the bottom surface of the recess 57 is a plane parallel to the top surface of the fixed-side heating block 50B.
  • the peripheral surface of the recessed part 57 is a taper surface which spreads upwards.
  • a protrusion 47 having a circular shape in plan view that fits into the recess 57 of the fixed-side heating block 50B is formed on the lower surface of the gate block 40B. That is, the concave portion 57 of the fixed-side heating block 50B and the protrusion 47 of the gate block 40B form an inlay structure.
  • the protrusion 47 is concentric with the gate block side gate 42 in plan view. That is, the gate block side gate 42 is disposed in the center of the protrusion 47. Further, the front end surface of the protrusion 47 is a plane parallel to the bottom surface of the recess 57. The peripheral surface of the protrusion 47 is a tapered surface that spreads upward. The tip surface and the peripheral surface of the protrusion 47 are contact surfaces that contact the bottom surface and the peripheral surface of the recess 57.
  • the gate block 40B and the fixed-side heating block 50B are fitted by the inlay structure (protrusion 47, recess 57), the contact area between the gate block 40B and the fixed-side heating block 50B is increased. Can be bigger. Thereby, the amount of heat transfer from the fixed-side heating block 50B to the gate block 40B can be increased.
  • the gate block side gate 42 is disposed in the protrusion 47 and the heating block side gate 53 is disposed in the recess 57, the protrusion 47 and the recess 57 are fitted to each other so that the gate block side gate 42 and Therefore, it is possible to prevent the positional deviation from the heating block side gate 53.
  • the inlay structure may be provided on either or both of the cooling block 30A side and the fixed side heating block 50B side.

Abstract

Dispositif de moulage par injection sans canal de coulée (10) pour le moulage par injection d'une résine thermodurcissable (11). Le dispositif de moulage par injection sans canal de coulée (10) comprend : un bloc de refroidissement (30) dans lequel sont formés un chemin d'écoulement pour la résine thermodurcissable (11), le chemin d'écoulement étant une partie (31) d'une descente de coulée, et un chemin d'écoulement de refroidissement (32) qui est agencé autour de la partie (31) de la descente de coulée et qui a un matériau de refroidissement (33) s'écoulant dans celui-ci ; un bloc de chauffage côté fixe (50) qui a une source de chaleur (51) pour durcir la résine thermodurcissable (11) ; et un bloc de grille (40) qui est agencé entre le bloc de refroidissement (30) et le bloc de chauffage côté fixe (50) et n'est pas régulé en température. Le bloc de grille (40) comporte une grille (42). Un espace (45) qui communique avec la grille (42) est formé autour de la grille (42) entre le bloc de grille (40) et le bloc de refroidissement (30).
PCT/JP2017/028515 2016-09-05 2017-08-07 Dispositif de moulage par injection sans canal de coulée WO2018043037A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780053660.8A CN109641378B (zh) 2016-09-05 2017-08-07 无流道注射成形装置
JP2018537071A JP6624477B2 (ja) 2016-09-05 2017-08-07 ランナーレス射出成形装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-173198 2016-09-05
JP2016173198 2016-09-05

Publications (1)

Publication Number Publication Date
WO2018043037A1 true WO2018043037A1 (fr) 2018-03-08

Family

ID=61300597

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/028515 WO2018043037A1 (fr) 2016-09-05 2017-08-07 Dispositif de moulage par injection sans canal de coulée

Country Status (3)

Country Link
JP (1) JP6624477B2 (fr)
CN (1) CN109641378B (fr)
WO (1) WO2018043037A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143019U (ja) * 1984-08-11 1986-03-20 エヌオーケー株式会社 成形装置
JPS62278010A (ja) * 1986-03-21 1987-12-02 インテリテク　コ−ポレイシヨン プラスチツク成形工程用のサ−マルゲ−ト
JPH06106557A (ja) * 1992-09-24 1994-04-19 Matsushita Electric Works Ltd 熱硬化性樹脂成形材料用の成形装置
JPH06339954A (ja) * 1993-06-02 1994-12-13 Sumitomo Bakelite Co Ltd ランナレス成形金型
JP2000326361A (ja) * 1999-05-20 2000-11-28 Matsushita Electric Ind Co Ltd 射出成形用金型
JP2004058647A (ja) * 2002-06-04 2004-02-26 Seiki Corp 熱硬化性樹脂およびゴムなどのランナーレス成形方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11198186A (ja) * 1998-01-19 1999-07-27 Meiki Co Ltd 光ディスク成形品の成形用金型
DE10297634B4 (de) * 2002-06-04 2010-01-21 Seiki Corp., Yonezawa Angusslose Einspritzdüse für vernetzbare Harze und Gummis und Verfahren zum Betreiben
KR100721416B1 (ko) * 2003-05-22 2007-05-23 스미도모쥬기가이고교 가부시키가이샤 성형방법, 성형용 금형, 성형품 및 성형기
KR100761529B1 (ko) * 2006-03-28 2007-10-04 김관표 사출성형장치
CN102069559A (zh) * 2009-11-25 2011-05-25 牟维军 一种热固性塑料点浇口无流道的模具
CN103722693A (zh) * 2013-12-19 2014-04-16 浙江大安模塑科技有限公司 一种用于热固性材料注塑成型的模具

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143019U (ja) * 1984-08-11 1986-03-20 エヌオーケー株式会社 成形装置
JPS62278010A (ja) * 1986-03-21 1987-12-02 インテリテク　コ−ポレイシヨン プラスチツク成形工程用のサ−マルゲ−ト
JPH06106557A (ja) * 1992-09-24 1994-04-19 Matsushita Electric Works Ltd 熱硬化性樹脂成形材料用の成形装置
JPH06339954A (ja) * 1993-06-02 1994-12-13 Sumitomo Bakelite Co Ltd ランナレス成形金型
JP2000326361A (ja) * 1999-05-20 2000-11-28 Matsushita Electric Ind Co Ltd 射出成形用金型
JP2004058647A (ja) * 2002-06-04 2004-02-26 Seiki Corp 熱硬化性樹脂およびゴムなどのランナーレス成形方法

Also Published As

Publication number Publication date
CN109641378A (zh) 2019-04-16
JP6624477B2 (ja) 2019-12-25
JPWO2018043037A1 (ja) 2019-03-28
CN109641378B (zh) 2021-02-26

Similar Documents

Publication Publication Date Title
US7261536B2 (en) Injection molding device with outside air inlet part
KR101558056B1 (ko) 렌즈 성형용 금형장치
JP5580666B2 (ja) 硬質液状樹脂成形用金型及び硬質液状樹脂成形方法
JPH11129289A (ja) 熱硬化性樹脂の射出成形用金型
WO2018043037A1 (fr) Dispositif de moulage par injection sans canal de coulée
JP5941946B2 (ja) 射出成形金型及び射出成形方法
WO2018139664A1 (fr) Procédé de moulage par injection et dispositif de moulage par injection
JP2010094937A (ja) サイドバルブゲート式ホットランナーシステム
US20170282427A1 (en) Method of multi-cavity injection molding and mold
KR20090115105A (ko) 비엠씨를 이용하는 사출성형금형 및 그 방법
WO2018043038A1 (fr) Bloc de refroidissement et dispositif de moulage par injection sans canal
US20200353535A1 (en) Mold
KR100787735B1 (ko) 인서트 성형 방법 및 인서트 성형용 금형
JP6304487B2 (ja) 金型および射出成形方法
US20220305705A1 (en) Injection molding die
KR102293720B1 (ko) 콜드 러너 사출 금형 구조
KR20080107879A (ko) 사출 성형 장치
JP4129840B2 (ja) 射出成形用金型
JP2017105001A (ja) 射出成形品の製造方法、射出成形品の製造システム、および成形型
JP2017013262A (ja) 合成樹脂発泡成形型、当該成形型を用いた合成樹脂発泡成形品の製造方法及び当該製造方法によって成形された合成樹脂発泡成形品
JP2002530222A (ja) 射出成形の金型温度制御方法
JP2012131178A (ja) 熱硬化性樹脂成形用金型
Košík et al. Reduction of Injection Moulded Plastic Part Warpage Using Advanced Gas Assisted Injection Moulding
JP6146910B2 (ja) 射出成形方法及び射出成形装置
JPH04284213A (ja) ガス注入成形方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17846046

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2018537071

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17846046

Country of ref document: EP

Kind code of ref document: A1