WO2018043037A1

WO2018043037A1 - Runnerless injection molding device

Info

Publication number: WO2018043037A1
Application number: PCT/JP2017/028515
Authority: WO
Inventors: 正彦今泉
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2016-09-05
Filing date: 2017-08-07
Publication date: 2018-03-08
Also published as: JP6624477B2; JPWO2018043037A1; CN109641378A; CN109641378B

Abstract

A runnerless injection molding device (10) for injection molding a heat-curable resin (11). The runnerless injection molding device (10) comprises: a cooling block (30) that has formed therein a flow path for the heat-curable resin (11), the flow path being one part (31) of a sprue, and a cooling flow path (32) that is arranged around the one part (31) of the sprue and has a cooling material (33) flowing therethrough; a fixed-side heating block (50) that has a heat source (51) for curing the heat-curable resin (11); and a gate block (40) that is arranged between the cooling block (30) and the fixed-side heating block (50) and is not temperature controlled. The gate block (40) has a gate (42). A gap (45) that communicates with the gate (42) is formed around the gate (42) between the gate block (40) and the cooling block (30).

Description

Runnerless injection molding equipment

The present invention relates to a runnerless injection molding apparatus.

2. Description of the Related Art Conventionally, in a runnerless injection molding apparatus that performs injection molding of a thermosetting resin, a heating unit that heats the cavity portion is disposed in the vicinity of the cavity portion formed on the parting surface, and communicates with the cavity portion. In some cases, cooling means for cooling the resin passage portion is provided in the vicinity of the resin passage portion. In such a runnerless injection molding apparatus, a device in which a heat insulating means is interposed between a cavity portion heated by a heating means and a resin passage portion cooled by a cooling means is known (for example, Patent Document 1). reference).

This runnerless injection molding apparatus does not cure the resin since the resin passage is cooled by the cooling action of the cooling means during molding. On the other hand, the resin filled in the cavity is cured by the heating action of the heating means. In this case, the part which hardens | cures in a cavity part is to the position where a heat insulation means exists. For this reason, when the mold is opened after molding, only the molded product on the cavity portion side is taken out from the position of the heat insulating means, and runnerless molding can be performed.

JP-A 62-16114

By the way, the conventional open gate type runnerless injection molding apparatus has a problem in that the gate cut position is not always constant and the position varies. Due to such variations, the waste of the resin member is increased or the molded product is chipped. For this reason, in recent years, in order to stabilize the position of the gate cut, a technique in which a gate block whose temperature is not adjusted is interposed between the cavity portion and the resin passage portion has been studied. However, even if the gate block is simply interposed between the cavity portion and the resin passage portion, the gate block is thermally expanded by the heat from the cavity portion. When the gate block thermally expands, the contact state between the gate block and the resin passage portion changes, and the heat transfer state between the two changes greatly. Thereby, there is a possibility that the resin may be cured in the resin passage portion, which is a cause of dispersion of resin filling in the cavity portion.

Accordingly, an object of the present invention is to provide a runnerless injection molding apparatus that not only suppresses the curing of the resin in the flow path portion but also stabilizes the fluidity of the resin and suppresses variations in resin filling. And

In order to achieve the above object, a runnerless injection molding apparatus according to an aspect of the present invention is a runnerless injection molding apparatus for injection molding a thermosetting resin, and is a sprue that is a flow path of a thermosetting resin. A cooling block that is disposed around a part of the sprue and formed with a cooling flow path through which a coolant flows, and a heating block having a heat source for curing the thermosetting resin, The gate block is disposed between the cooling block and the heating block and is not temperature-controlled. The gate block includes a gate, and a gap communicating with the gate is provided between the gate block and the cooling block. It is formed around.

According to the present invention, it is possible to provide a runnerless injection molding apparatus that can stabilize resin flowability and suppress variation in resin filling by suppressing the curing of the resin in the flow path portion.

FIG. 1 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus according to an embodiment. FIG. 2 is a cross-sectional view showing a cooling block according to the embodiment. FIG. 3 is a top view schematically showing the overall shape of the cooling flow path according to the embodiment. FIG. 4 is a cross-sectional view of a runnerless injection molding apparatus showing one step of a method for producing a resin molded product. FIG. 5 is a cross-sectional view of a runnerless injection molding apparatus showing one step of a method for producing a resin molded product. FIG. 6 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus according to Modification 1. FIG. 7 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus according to Modification 2.

Hereinafter, a runnerless injection molding apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement and connection forms of constituent elements, processes, order of processes, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

(Embodiment)
[Runnerless injection molding equipment]
FIG. 1 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus 10 according to the embodiment. The runnerless injection molding apparatus 10 is an apparatus for injection molding a thermosetting resin. Here, the thermosetting resin is a resin that is cured by heating. For example, phenol resin, urea resin, melamine resin, epoxy resin, silicon resin, unsaturated polyester resin (BMC: Bulk Molding Compound, SMC: Seat) Molding Compound). The thermosetting resin also includes a thermosetting elastomer. The thermosetting here includes vulcanization and crosslinking.

The runnerless injection molding apparatus 10 includes a mold 20 for molding a thermosetting resin (hereinafter referred to as a resin 11; see FIG. 4), a mold 20 and a resin communication path that communicate with each other. A resin injection portion (not shown) for injecting resin from a point gate manifold (not shown) and a first sprue (not shown), and a molded product take-out device 80 for taking out a resin molded product from the mold 20 (FIG. 5). And a control unit (computer: not shown) for controlling these operations. The control unit includes, for example, a nonvolatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input / output port, and a processor that executes the program.

[Mold]
The mold 20 includes a cooling block 30, a gate block 40, a fixed side heating block 50, and a movable side heating block 60. In addition, the resin 11 with high fluidity | liquidity is supplied with respect to the metal mold | die 20 by the resin injection part which is not shown in figure. For example, when the resin 11 is BMC, the resin injection part injects the BMC to the mold 20 in a state where the temperature of the BMC is adjusted to 70 ° C. or more and 80 ° C. or less where the viscosity is lowest. In the mold 20, a cooling block 30, a gate block 40, a fixed side heating block 50, and a movable side heating block 60 are arranged in order from the upstream in the flow direction of the resin 11. In the present embodiment, the upstream side in the flow direction of the resin 11 is “upper” and the downstream side is “lower”.

[Cooling block]
FIG. 2 is a cross-sectional view showing the cooling block 30 according to the embodiment. As shown in FIG. 2, the cooling block 30 includes a second sprue 31 that forms part of a sprue that is a flow path of the resin 11, and a cooling flow path 32 that cools the resin 11 in the second sprue 31. Is formed. The cooling block 30 is formed of a metal material such as stainless steel, for example.

The second sprue 31 is a flow path that guides the resin 11 injected from the resin injection portion to the gate block 40. The second sprue 31 is a cylindrical space that tapers toward the downstream side. The extending direction of the second sprue 31 is the same as the flow direction of the resin 11 and is the vertical direction in the present embodiment. Moreover, in this Embodiment, let the direction orthogonal to the extending direction be the width direction.

The cooling flow path 32 is disposed around the second sprue 31 and is a flow path through which the coolant 33 flows. Examples of the coolant 33 include refrigerants such as water and oil. A cooling source (not shown) is connected to the cooling channel 32, and the cooling source circulates the coolant 33 in the cooling channel 32. The cooling source adjusts the coolant 33 to a predetermined temperature. As a result, the coolant 33 adjusts the temperature of the resin 11 in the second sprue 31 via the cooling flow path 32. Here, the predetermined temperature is a temperature at which the fluidity of the resin 11 can be stabilized in a high state (a state where the viscosity is low). For example, when the resin 11 is BMC, a temperature between 70 ° C. and 80 ° C. is set as the predetermined temperature.

FIG. 3 is a top view schematically showing the overall shape of the cooling flow path 32 according to the embodiment. FIG. 2 is a cross-sectional view of the cut surface including the II-II line in FIG.

2 and 3, the cooling flow path 32 is a single flow path in the cooling block 30. The cooling flow path 32 includes a supply unit 321 to which the coolant 33 is supplied from a cooling source, a discharge unit 322 that discharges the coolant 33 to the cooling source, and an intermediate unit 323 between the supply unit 321 and the discharge unit 322. It has. The supply unit 321 and the discharge unit 322 are arranged above the cooling block 30 and above the intermediate unit 323. The cooling flow path 32 forms a closed space in the cooling block 30 except for the supply unit 321 and the discharge unit 322. Thereby, the leakage of the coolant 33 from the cooling block 30 is prevented.

The intermediate part 323 of the cooling flow path 32 is a part that contributes to temperature adjustment for the resin 11 in the second sprue 31. The intermediate portion 323 includes a first spiral portion 324 that causes the coolant 33 to flow from upstream to downstream in the flow direction of the resin 11 and a second spiral portion that causes the coolant 33 to flow from downstream to upstream in the flow direction of the resin 11. 325. The lower end portion of the first spiral portion 324 and the lower end portion of the second spiral portion 325 communicate with each other. Moreover, the 1st spiral part 324 and the 2nd spiral part 325 become the shape wound by the same winding diameter.

In FIG. 2, the first spiral portion 324 is indicated by a broken line, and the second spiral portion 325 is indicated by a two-dot chain line. Further, in FIGS. 2 and 3, in the intermediate portion 323, a portion on the near side of the cut surface including the II-II line is illustrated by a black line, and a portion on the far side is illustrated by a gray line.

[Gate block]
As shown in FIG. 1, the gate block 40 is disposed between the cooling block 30 and the fixed-side heating block 50. The gate block 40 is formed by a metal material such as stainless steel or a material having low thermal conductivity (for example, ceramics) so that the temperature is not adjusted. The gate block 40 is formed with a gate block side gate (gate) 42 forming a part of a sprue that is a flow path of the resin 11.

As shown in FIG. 1, the gate block side gate 42 is a flow path for guiding the resin 11 supplied from the second sprue 31 of the cooling block 30 to the fixed side heating block 50. The gate block side gate 42 extends in the vertical direction as a whole. The upper end portion of the gate block side gate 42 is a throttle portion 41 whose inner diameter is narrower than that of the second sprue 31. The throttle part 41 is a cylindrical space. Further, the downstream side of the throttle part 41 in the gate block side gate 42 is an enlarged diameter part 43 having an inner diameter wider than that of the throttle part 41. The enlarged diameter portion 43 is a tapered space whose upper end portion has the smallest inner diameter and whose lower end portion has the largest inner diameter.

Further, the upper surface of the gate block 40 is a flat surface, and a gap 45 is formed between the gate block 40 and the cooling block 30 when the resin molded product is manufactured. The gap 45 is always maintained by another mold (not shown) when the resin molded product is manufactured. The gap 45 communicates with the gate block side gate 42. In addition, in FIG. 1 etc., since the thickness T of the gap 45 is emphasized, it is different from the actual magnitude relationship. Specifically, the thickness T of the gap 45 is not less than 0.01 mm and not more than 0.15 mm. The thickness T of the gap 45 is set to a value at which the resin 11 flowing through the second sprue 31 and the gate block side gate 42 does not leak into the gap 45. Further, when heat is transferred from the fixed side heating block 50 to the gate block 40, the gate block 40 is thermally expanded. The thickness T of the gap 45 is determined to a value that does not close the gap 45 even during this thermal expansion.

Hereinafter, the case where a general phenol resin is used as the thermosetting resin will be exemplified. The phenol resin has a characteristic that it does not leak out if it is a gap of 0.1 mm or less. For this reason, if the thermal expansion of the gate block 40 is not considered, the thickness T of the gap 45 may be 0.1 mm or less. Assuming a gate block 40 having a maximum thermal expansion amount of, for example, 0.05 mm, if the maximum thermal expansion amount is added to the lower limit value and the upper limit value of the thickness T of the gap 45, the thickness T of the gap 45 even after expansion. Is 0.1 mm or less. That is, before the gate block 40 is thermally expanded, the thickness T of the gap 45 is 0.15 mm or less. Further, depending on the size of the gate block 40 and the set temperature, the maximum thermal expansion amount may be 0.01 mm or less, and in the case of a resin other than phenol, the resin may leak through a gap 45 of about 0.01 mm. Therefore, the gap 45 is set to 0.01 mm or more.

In addition, what is necessary is just to determine an appropriate shape and dimension as the gap | clearance 45 by performing various experiments and simulation according to the kind of thermosetting resin, the material of the gate block 40, and a shape.

[Heating block]
The fixed side heating block 50 is disposed between the gate block 40 and the movable side heating block 60. The fixed-side heating block 50 is made of a metal material such as stainless steel. The fixed-side heating block 50 is formed with a heating block-side gate 53 that forms a part of a sprue that is a flow path for the resin 11 and a cavity 54.

The heating block side gate 53 is a flow path that guides the resin 11 supplied from the gate block side gate 42 of the gate block 40 to the cavity 54. The heating block side gate 53 extends in the up-down direction as a whole, and is a tapered space with an upper end portion having the smallest inner diameter and a lower end portion having the largest inner diameter.

The cavity 54 is a recess for forming a resin molded product, and the lower part is opened. The cavity 54 becomes a closed space by overlapping the movable heating block 60 when the mold is closed. A resin molded product is formed by filling and curing the resin 11 in the space closed when the mold is closed. This space is formed in a shape corresponding to the shape of the resin molded product.

The fixed-side heating block 50 has a heat source 51 for curing the resin 11 in the heating block-side gate 53 and the cavity 54. Specifically, the heat source 51 is, for example, a heating wire, and is disposed around the heating block side gate 53 and the cavity 54 in the fixed side heating block 50. When the heat from the heat source 51 is transmitted to the heating block side gate 53 and the resin 11 in the cavity 54, the resin 11 is cured and becomes a resin molded product. Of the resin molded product, a portion corresponding to the cavity 54 is a product portion, and a portion corresponding to the heating block side gate 53 is a non-product portion.

The heat source 51 adjusts the temperature to a temperature at which the resin 11 in the heating block side gate 53 and the cavity 54 is cured. For example, when the resin 11 is BMC, it is heated to 140 ° C. or higher.

[Moving side heating block]
The movable side heating block 60 is a mold that moves up and down to move toward and away from the fixed side heating block 50. The movable side heating block 60 is made of a metal material such as stainless steel, for example. The upper surface of the movable-side heating block 60 has a shape portion 61 that has a shape corresponding to a part of the cavity 54, and the movable-side heating block 60 overlaps the fixed-side heating block 50 and is in a mold-closed state The cavity 54 is closed.

The movable heating block 60 has a heat source 62 for curing the resin 11 in the cavity 54. Specifically, the heat source 62 is a heating wire, for example, and is disposed around the shape portion 61. When the heat from the heat source 62 is transmitted to the resin 11 in the cavity 54, the resin 11 is cured and becomes a resin molded product.

[Production method]
Next, a method for manufacturing a resin molded product according to the embodiment will be described with reference to FIGS. 1, 4, and 5. 4 and 5 are cross-sectional views of the runnerless injection molding apparatus 10 showing the steps of the manufacturing method.

First, as shown in FIG. 1, when the movable side heating block 60 overlaps the fixed side heating block 50 and enters the mold closed state, the resin 11 is injected from the resin injection portion. As a result, as shown in FIG. 4, the resin 11 is supplied and filled into the cavity 54 via the second sprue 31, the gate block side gate 42 and the heating block side gate 53. During this supply, the gap 45 communicates with the gate block side gate 42. However, since the thickness T of the gap 45 is set to an appropriate value, the resin 11 does not leak into the gap 45. It has become. Even if the resin 11 leaks into the gap 45, since the portion corresponds to the non-product portion, the quality of the product portion is not affected.

In addition, when the resin 11 is supplied, the coolant 33 circulates in the cooling flow path 32 of the cooling block 30, and the temperature of the resin 11 in the second sprue 31 is adjusted. On the other hand, in the fixed side heating block 50 and the movable side heating block 60, the

heat sources

51 and 62 generate heat, respectively, and the inside of the heating block side gate 53 and the cavity 54 is adjusted to a temperature at which the resin 11 is cured. Thereby, the resin 11 can be hardened stably in the fixed-side heating block 50. The resin 11 in the gate block 40 is also cured because the heat is transmitted from the resin 11 in the fixed-side heating block 50.

Here, since the gap 45 is formed between the gate block 40 and the cooling block 30, the amount of heat transfer from the gate block 40 to the cooling block 30 can be suppressed by the gap 45. Therefore, it can suppress that resin 11 hardens | cures in the cooling block 30, and the fluidity | liquidity of the resin 11 can be stabilized.

After the curing of the resin 11 in the fixed side heating block 50, as shown in FIG. 5, the movable side heating block 60 is lowered and separated from the fixed side heating block 50, and the mold is opened. Thereafter, the resin molded product 100 is taken out from the shape portion 61 of the movable heating block 60 by the molded product take-out device 80. At the time of removal, gate cutting is performed in the vicinity of the boundary between the gate block 40 and the cooling block 30 where the fluidity of the resin 11 is low. At this time, since the narrowed portion 41 having an inner diameter smaller than the large-diameter portion 43 in the gate block side gate 42 is disposed in the vicinity of the boundary, stress at the time of extraction can be concentrated on the narrowed portion 41. Therefore, the certainty of the gate cut performed near the boundary can be improved.

[Effects, etc.]
As described above, the runnerless injection molding apparatus 10 according to the present embodiment is a runnerless injection molding apparatus for injection molding a thermosetting resin (resin 11). The runnerless injection molding apparatus 10 includes a part of the sprue (second sprue 31) that is a flow path of the resin 11, and a cooling flow path 32 that is disposed around the second sprue 31 and into which the coolant 33 flows. A cooling block 30 with a heat source 51 for curing the resin 11, a gate block 40 that is arranged between the cooling block 30 and the fixed heating block 50 and is not temperature-controlled. Is provided. The gate block 40 has a gate (gate block side gate 42). A gap 45 communicating with the gate block side gate 42 is formed between the gate block 40 and the cooling block 30 around the gate block side gate 42.

According to this configuration, since the gap 45 communicating with the gate block side gate 42 is formed between the gate block 40 and the cooling block 30, the gap 45 leads from the gate block 40 to the cooling block 30. Heat transfer can be reduced. Therefore, it can suppress that resin 11 hardens | cures in the cooling block 30, and the fluidity | liquidity of the resin 11 can be stabilized. Therefore, variation in resin filling can be suppressed.

In particular, in the case where the resin is simultaneously filled into the plurality of molds 20 from the resin injection portion, since the fluidity of the resin 11 is stabilized, variations in resin filling in the plurality of molds 20 are suppressed. It is possible.

The thickness of the gap 45 is 0.01 mm or more and 0.15 mm or less.

According to this configuration, since the gap 45 has a thickness of 0.01 mm or more and 0.15 mm or less, the gap 45 can be maintained even if the gate block 40 is thermally expanded.

(Modification 1)
In the above embodiment, the case where the upper surface, which is the plane of the gate block 40, and the lower surface, which is the plane of the cooling block 30, form the gap 45 has been described as an example. In the first modification, a case where a gap is formed by a recess provided in the cooling block will be described.

In the following description, the same portions as those of the runnerless injection molding apparatus 10 according to the embodiment are denoted by the same reference numerals, the description thereof is omitted, and only different portions are described.

FIG. 6 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus 10A according to the first modification.

As shown in FIG. 6, a concave portion 36 having a circular shape in plan view surrounding the periphery of the second sprue 31 is formed on the lower surface of the cooling block 30A. The recess 36 is concentric with the second sprue 31 in a plan view. The bottom surface of the recess 36 is a plane parallel to the bottom surface of the cooling block 30A. The peripheral surface of the recess 36 is a tapered surface that expands downward.

The gate block 40A is formed in a truncated cone shape, and the upper portion thereof is a protrusion 46 that fits into the recess 36 of the cooling block 30A. That is, the recess 36 of the cooling block 30A and the protrusion 46 of the gate block 40A form an inlay structure.

The protrusion 46 is concentric with the gate block side gate 42 in plan view. That is, the gate block side gate 42 is arranged at the center of the protrusion 46. Further, the front end surface of the protrusion 46 is a plane parallel to the bottom surface of the recess 36. The peripheral surface of the protrusion 46 is a tapered surface that expands downward. The peripheral surface of the protrusion 46 is a contact surface that contacts the peripheral surface of the recess 36.

The height H of the protrusion 46 is set smaller than the depth D of the recess 36. Thus, when the cooling block 30A overlaps the upper surface of the gate block 40A and the recess 36 and the protrusion 46 are fitted, a gap 45a is formed between the gate block 40A and the cooling block 30A. The thickness T of the gap 45 a is the difference between the depth D of the recess 36 and the height H of the protrusion 46.

Thus, since the gate block 40A and the cooling block 30A are fitted by the inlay structure (projection 46, recess 36) via the gap 45a, the contact area between the projection 46 and the recess 36 is adjusted. Thus, the amount of heat transfer from the gate block 40A to the cooling block 30A can be controlled.

In addition, since the gate block side gate 42 is disposed in the protrusion 46 and the second sprue 31 is disposed in the recess 36, the gate block side gate 42 is obtained by fitting the protrusion 46 and the recess 36. A positional shift with the second sprue 31 can be prevented.

In the inlay structure in the first modification, the gate block 40A has the protrusion 46 and the cooling block 30A has the recess 36. However, this relationship may be reversed. .

(Modification 2)
Next, Modification 2 according to the present embodiment will be described.

In the first modification, the case where the gate block 40A and the cooling block 30A are fitted by the inlay structure through the gap 45a is illustrated, but the gate block and the fixed-side heating block are fitted by the inlay structure. Also good.

In the following description, the same parts as those of the runnerless injection molding apparatus 10A according to the modified example 1 are denoted by the same reference numerals, the description thereof is omitted, and only different parts are described.

FIG. 7 is a cross-sectional view schematically showing a main configuration of a runnerless injection molding apparatus 10B according to Modification 2. As shown in FIG. 7, a concave portion 57 having a circular shape in plan view surrounding the periphery of the heating block side gate 53 is formed on the upper surface of the fixed side heating block 50B. The recess 57 is concentric with the heating block side gate 53 in plan view. The bottom surface of the recess 57 is a plane parallel to the top surface of the fixed-side heating block 50B. And the peripheral surface of the recessed part 57 is a taper surface which spreads upwards.

A protrusion 47 having a circular shape in plan view that fits into the recess 57 of the fixed-side heating block 50B is formed on the lower surface of the gate block 40B. That is, the concave portion 57 of the fixed-side heating block 50B and the protrusion 47 of the gate block 40B form an inlay structure.

The protrusion 47 is concentric with the gate block side gate 42 in plan view. That is, the gate block side gate 42 is disposed in the center of the protrusion 47. Further, the front end surface of the protrusion 47 is a plane parallel to the bottom surface of the recess 57. The peripheral surface of the protrusion 47 is a tapered surface that spreads upward. The tip surface and the peripheral surface of the protrusion 47 are contact surfaces that contact the bottom surface and the peripheral surface of the recess 57.

Thus, since the gate block 40B and the fixed-side heating block 50B are fitted by the inlay structure (protrusion 47, recess 57), the contact area between the gate block 40B and the fixed-side heating block 50B is increased. Can be bigger. Thereby, the amount of heat transfer from the fixed-side heating block 50B to the gate block 40B can be increased.

In addition, since the gate block side gate 42 is disposed in the protrusion 47 and the heating block side gate 53 is disposed in the recess 57, the protrusion 47 and the recess 57 are fitted to each other so that the gate block side gate 42 and Therefore, it is possible to prevent the positional deviation from the heating block side gate 53.

The inlay structure may be provided on either or both of the cooling block 30A side and the fixed side heating block 50B side.

(Other)
As mentioned above, although the runnerless

injection molding apparatus

10, 10A, 10B which concerns on this invention was demonstrated based on embodiment, this invention is not limited to said embodiment.

In addition, the form obtained by making various modifications conceived by those skilled in the art with respect to the above-described embodiments and modifications, and the components and functions in the above-described embodiments and modifications are arbitrarily set within the scope of the present invention. Forms realized by combining them are also included in the present invention.

10, 10A, 10B Runnerless injection molding equipment 11 Resin (thermosetting resin)
20

Mold

30, 30A Cooling block 31 Second sprue (part of sprue)
32 Cooling channel 33

Coolant

36, 57 Recess (Inlay structure)
40, 40A, 40B Gate block 42 Gate block side gate (gate)
45,

45a Clearance

46, 47 Projection (Inlay structure)
50, 50B Fixed heating block (heating block)
51, 62 Heat source

Claims

A runnerless injection molding apparatus for injection molding a thermosetting resin,
A cooling block in which a part of a sprue that is a flow path of the thermosetting resin and a cooling flow path that is disposed around a part of the sprue and in which a coolant flows is formed;
A heating block having a heat source for curing the thermosetting resin;
A gate block that is disposed between the cooling block and the heating block and is not temperature-controlled;
The gate block has a gate;
A runnerless injection molding apparatus in which a gap communicating with the gate is formed around the gate block between the gate block and the cooling block.
The runnerless injection molding apparatus according to claim 1, wherein a thickness of the gap is 0.01 mm or more and 0.15 mm or less.
The runnerless injection molding apparatus according to claim 1, wherein the gate block and the cooling block are fitted by an inlay structure through the gap.
The runnerless injection molding apparatus according to any one of claims 1 to 3, wherein the gate block and the heating block are fitted by an inlay structure.