WO2018018937A1 - 电路板和具有其的移动终端 - Google Patents

电路板和具有其的移动终端 Download PDF

Info

Publication number
WO2018018937A1
WO2018018937A1 PCT/CN2017/080487 CN2017080487W WO2018018937A1 WO 2018018937 A1 WO2018018937 A1 WO 2018018937A1 CN 2017080487 W CN2017080487 W CN 2017080487W WO 2018018937 A1 WO2018018937 A1 WO 2018018937A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
pin
conducting member
board according
heat conducting
Prior art date
Application number
PCT/CN2017/080487
Other languages
English (en)
French (fr)
Inventor
黄占肯
Original Assignee
广东欧珀移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2018018937A1 publication Critical patent/WO2018018937A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Definitions

  • the present invention relates to the field of electronic device technologies, and in particular, to a circuit board and a mobile terminal having the same.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a circuit board that can enhance the heat dissipation capability of electrical components.
  • the invention also proposes a mobile terminal having the circuit board.
  • a circuit board comprising: a main board having a pad; an electric component having a lead, the pin being soldered to the pad; a heat conducting member, A heat conducting member is coupled to the motherboard and in contact with the electrical component.
  • a mobile terminal according to an embodiment of the second aspect of the present invention includes the circuit board according to the embodiment of the first aspect of the present invention.
  • FIG. 1 is a perspective view of a circuit board in accordance with an embodiment of the present invention.
  • Figure 2 is an enlarged schematic view of the portion A circled in Figure 1;
  • FIG. 3 is a cross-sectional view of a circuit board in accordance with an embodiment of the present invention.
  • the heat conductive member 300 The heat conductive member 300.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more of the features either explicitly or implicitly. In the description of the present invention, "a plurality” means two or more unless otherwise stated.
  • electrical components and circuit boards are usually connected by surface soldering, which causes the heat of the pins of the electrical components to be quickly diffused to the circuit board, which is not conducive to heat dissipation of the electrical components and affects the stability and reliability of mobile terminals such as mobile phones. Sex.
  • the present invention provides a circuit board 1 which is suitable for a mobile terminal such as a mobile phone, which can enhance the heat dissipation capability of the electrical component and ensure the stability and reliability of the working operation of the mobile terminal.
  • a circuit board 1 according to an embodiment of the first aspect of the present invention will be described below with reference to Figs.
  • a circuit board 1 includes a main board 100, an electrical component 200, and a heat conductive member 300.
  • the main board 100 has pads 110.
  • the electrical component 200 has a pin 210 that is soldered to the pad 110, ie, the electrical component 200 is soldered to the pad 110 by a pin 210.
  • the heat conductive member 300 is connected to the main board 100, and the heat conductive member 300 is in contact with the electric component 200. In this way, the heat of the pin 210 of the electrical component 200 can be quickly transferred to the heat conducting component 300 during operation, so that the heat dissipation capability of the pin 210 of the electrical component 200 can be enhanced, and the heat of the electrical component 200 can be quickly diffused.
  • the heat conducting member 300 is a steel sheet or a copper sheet for good thermal conductivity.
  • the heat conductive member 300 by contacting the heat conductive member 300 with the electrical component 200, the heat dissipation capability of the pin 210 of the electrical component 200 can be enhanced, the heat of the electrical component 200 can be quickly diffused, and the stability of the working operation can be ensured. reliability.
  • the heat conducting member 300 is in contact with the pad 110, so that the connection of the heat conducting member 300 to the circuit board 1 is more secure. Further, the heat conductive member 300 is soldered to the pad 110 to facilitate connection and heat dissipation.
  • the end face of the free end of the pin 210 is in contact with the end face of the heat conducting member 300.
  • the free end of the pin 210 is the non-electrical element of the pin 210
  • One end of the connector 200 is connected such that the pin 210 can quickly dissipate heat from the electrical component 200 through the heat conducting member 300.
  • the end face of the free end of the pin 210 and/or the end face of the heat conducting member 300 that is in contact with the pin 210 is formed as a plane to further increase the heat dissipation area and enhance the heat dissipation effect.
  • the end surface of the free end of the pin 210 or the end surface of the heat conductive member 300 may be formed into a plane, that is, the end surface of the free end of the pin 210 and the end surface of the heat conductive member 300 are formed into a plane; or, The end face of the free end of the pin 210 and the end face of the heat conducting member 300 are both formed into a plane, so that the contact of the pin 210 with the heat conducting member 300 is in surface contact, so that the heat dissipating area is larger and the heat dissipating effect is better.
  • the end surface of the free end of the pin 210 is a rectangular surface; for example, the heat conducting member 300 may have a rectangular parallelepiped shape to further increase the heat dissipation area, thereby further enhancing the heat dissipation effect.
  • the width of the heat conducting member 300 is D1, the width of the pin 210 is D2, and D1 and D2 satisfy: D1>D2, that is, the width of the heat conducting member 300 is greater than the width of the pin 210, thereby facilitating heat dissipation of the pin 210.
  • D1 and D2 satisfy: D1-D2 ⁇ 0.2 mm, so that the heat dissipation effect of the pin 210 is better.
  • the width of the heat conductive member 300 is 0.2 mm larger than the width of the lead 210, and the long side of the heat conductive member 300 and the long side of the lead 210 adjacent thereto are 0.1 mm in the width direction of the pin 210.
  • the width of the heat conductive member 300 is smaller than the width of the pad 110, thereby facilitating the connection of the heat conductive member 300 to the pad 110, thereby ensuring electronic control safety.
  • a portion of the edge of the heat conductive member 300 extends beyond the pad 110 to enhance the heat dissipation effect.
  • an end surface of the heat conductive member 300 that does not conform to the pin 210 exceeds the pad 110. .
  • the height of the heat conducting member 300 is 0.1 mm to 0.3 mm to ensure the heat dissipation effect of the heat conducting member 300.
  • the height of the heat conducting member 300 is from 0.1 mm to 0.15 mm.
  • a circuit board 1 according to an embodiment of the present invention which is suitable for a fast charging path of a mobile terminal, will be described in detail below with reference to the accompanying drawings. It is worth understanding that the following description is only an example It is to be understood that the invention is not to be construed as limiting.
  • a circuit board 1 includes a main board 100, an electrical component 200, and a heat conductive member 300.
  • the main board 100 is a rectangular plate whose length is oriented in the left-right direction and whose width is oriented in the front-rear direction, and the main board 100 has a plurality of pads 110.
  • the electrical component 200 has a plurality of pins 210 that are soldered to the plurality of pads 110, that is, the electrical component 200 is soldered to the pad 110 by pins 210, and the end faces of the free ends of the pins 210 are formed into a rectangular plane.
  • the heat conducting member 300 is a copper piece soldered on the pad 110.
  • the front and rear end faces and the left and right end faces of the heat conducting member 300 are respectively formed into a rectangular plane, and the end faces of the free ends of the pins 210 are bonded to the end faces of the heat conducting members 300.
  • the width of the heat-conducting member 300 is D1
  • the width of the pin 210 is D2
  • the rear end surface of the heat conducting member 300 is in contact with the front end surface of the pin 210, and the left end surface of the heat conducting member 300 and the left end surface of the corresponding pin 210 have a distance of 0.1 mm in the left-right direction, and the right end surface of the heat conducting member 300 The distance from the right end surface of the corresponding pin 210 in the left-right direction is 0.1 mm, and the front end of the heat conductive member 300 faces the front beyond the corresponding pad 110.
  • the left end surface of the heat conducting member 300 is attached to the right end surface of the pin 210, and the front end surface of the heat conducting member 300 and the front end surface of the corresponding pin 210 are 0.1 mm in the front-rear direction, and the rear end of the heat conducting member 300 The distance between the end surface and the rear end surface of the corresponding pin 210 in the front-rear direction is 0.1 mm, and the right end of the heat conductive member 300 faces the right beyond the corresponding pad 110.
  • each pin 210 with the corresponding heat conducting member 300 is in surface contact, and the heat of the pin 210 of the electrical component 200 can be quickly transferred to the heat conducting member 300 during operation, so that the lead of the electrical component 200 can be quickly enhanced.
  • the heat dissipation capability of the foot 210 causes the heat of the electrical component 200 to rapidly diffuse.
  • the heat conductive member 300 by contacting the heat conductive member 300 with the electrical component 200, the heat dissipation capability of the pin 210 of the electrical component 200 can be quickly enhanced, and the heat of the electrical component 200 can be quickly diffused to ensure the stability of the working operation. And reliability.
  • circuit board 1 in accordance with embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
  • a mobile terminal includes the circuit board 1 according to the embodiment of the first aspect of the present invention.
  • the mobile terminal can be a mobile phone.
  • the mobile terminal according to the embodiment of the present invention uses the circuit board 1 as described above to have good stability and high reliability.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • Connected, or integrally connected can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种电路板(1)和具有其的移动终端。电路板(1)包括主板(100)、电器元件(200)和导热件(300)，主板(100)具有焊盘(110)；电器元件(200)具有引脚(210)，引脚(210)与焊盘(110)焊接；导热件(300)与主板(100)连接且与电器元件(200)接触。

Description

电路板和具有其的移动终端 技术领域
本发明涉及电子设备技术领域，尤其是涉及一种电路板和具有所述电路板的移动终端。
背景技术
诸如手机等移动终端的电器元件的散热性不好，导致稳定性和可靠性较差。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明提出一种电路板，所述电路板可以增强电器元件的散热能力。
本发明还提出一种具有所述电路板的移动终端。
根据本发明第一方面实施例的电路板，包括：主板，所述主板具有焊盘；电器元件，所述电器元件具有引脚，所述引脚与所述焊盘焊接；导热件，所述导热件与所述主板连接且与所述电器元件接触。
根据本发明第二方面实施例的移动终端，包括根据本发明第一方面实施例所述的电路板。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
图1是根据本发明实施例的电路板的立体图；
图2是图1中圈示的A部的放大示意图；
图3是根据本发明实施例的电路板的剖视图。
附图标记：
电路板1，
主板100，焊盘110，
电器元件200，引脚210，
导热件300。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本申请基于发明人对以下事实和问题的发现和认识作出的：
目前电器元件与电路板通常采用表面焊接的方式连接在一起，导致电器元件的引脚的热量很难快速扩散到电路板上，不利于电器元件散热，影响诸如手机等移动终端的稳定性和可靠性。
为此，本发明提出一种电路板1，该电路板1适于诸如手机等移动终端，可以增强电器元件的散热能力，保证移动终端工作运行的稳定性和可靠性。
下面参考图1-图3描述根据本发明第一方面实施例的电路板1。
如图1-图3所示，根据本发明实施例的电路板1，包括主板100、电器元件200和导热件300。
具体而言，主板100具有焊盘110。电器元件200具有引脚210，引脚210与焊盘110焊接，即电器元件200通过引脚210焊接在焊盘110上。导热件300与主板100连接，且导热件300与电器元件200接触。这样，在工作时电器元件200的引脚210的热量可以快速传导到导热件300上面，从而可以增强电器元件200的引脚210的散热能力，使电器元件200的热量快速扩散。有利地，导热件300为钢片或铜片，从而导热性能好。
根据本发明实施例的电路板1，通过使导热件300与电器元件200接触，可以增强电器元件200的引脚210的散热能力，使电器元件200的热量快速扩散，保证工作运行的稳定性和可靠性。
在本发明的一些实施例中，如图1-图3所示，导热件300与焊盘110接触，从而导热件300与电路板1的连接更加牢靠。进一步地，导热件300与焊盘110焊接，从而便于连接且散热效果好。
根据本发明的一些实施例，如图1和图2所示，引脚210的自由端的端面与导热件300的端面贴合。这里，引脚210的自由端为引脚210的不与电器元 件200连接的一端，如此，引脚210通过导热件300可以快速将电器元件200的热量扩散出去。
有利地，引脚210的自由端的端面和/或导热件300的与引脚210贴合的端面形成为平面，以进一步增大散热面积，加强散热效果。其中，可以是引脚210的自由端的端面或导热件300的所述端面形成为平面，即引脚210的自由端的端面和导热件300的所述端面中的一个形成为平面；或者，可以是引脚210的自由端的端面和导热件300的所述端面均形成为平面，这样，引脚210与导热件300的接触为面接触，从而散热面积更大，散热效果更好。例如，如图1和图2所示，引脚210的自由端的端面为矩形面；又如，导热件300可以为长方体形，以进一步增大散热面积，进一步增强散热效果。
可选地，导热件300的宽度为D1，引脚210的宽度为D2，D1和D2满足：D1＞D2，即导热件300的宽度大于引脚210的宽度，从而利于增强引脚210的散热。有利地，D1和D2满足：D1-D2≥0.2mm，从而引脚210的散热效果更好。例如，导热件300的宽度比引脚210的宽度大0.2mm，导热件300的长边与引脚210的邻近其的长边在引脚210的宽度方向上的距离为0.1mm。
根据本发明的一些实施例，如图1-图3所示，导热件300的宽度小于焊盘110的宽度，从而方便导热件300与焊盘110的连接，保证电控安全性。在图1和图2所示的实施例中，导热件300的部分边缘延伸并超过焊盘110，以增强散热效果，例如，导热件300的不与引脚210贴合的端面超过焊盘110。
在本发明的一些实施例中，导热件300的高度为0.1mm-0.3mm，以保证导热件300的散热效果。有利地，导热件300的高度为0.1mm-0.15mm。
下面参考附图详细描述根据本发明的一个具体实施例的电路板1，该电路板1适于移动终端的快充电路。值得理解的是，下述描述只是示例性说 明，而不能理解为对本发明的限制。
如图1-图3所示，根据本发明实施例的电路板1，包括主板100、电器元件200和导热件300。
具体而言，主板100为长度沿左右方向定向、宽度沿前后方向定向的长方形板，且主板100具有多个焊盘110。电器元件200具有多个引脚210，多个引脚210分别与多个焊盘110焊接，即电器元件200通过引脚210焊接在焊盘110上，引脚210的自由端的端面形成为矩形平面。导热件300为焊接在焊盘110上的铜片，导热件300的前后端面和左右端面分别形成为矩形平面，引脚210的自由端的端面与导热件300的端面贴合。其中，相互贴合的导热件300与引脚210中，导热件300的宽度为D1，引脚210的宽度为D2，D1和D2满足：D1-D2＝0.2mm，即，导热件300的宽度比引脚210的宽度大0.2mm，且导热件300的宽度小于对应的焊盘110的宽度。
例如，导热件300的后端面与引脚210的前端面贴合，该导热件300的左端面与对应的引脚210的左端面在左右方向上的距离为0.1mm，导热件300的右端面与对应的引脚210的右端面在左右方向上的距离为0.1mm，且该导热件300的前端面向前超过对应的焊盘110。又如，导热件300的左端面与引脚210的右端面贴合，该导热件300的前端面与对应的引脚210的前端面在前后方向上的距离为0.1mm，导热件300的后端面与对应的引脚210的后端面在前后方向上的距离为0.1mm，且该导热件300的右端面向右超过对应的焊盘110。
由此，每个引脚210与对应的导热件300的接触为面接触，在工作时电器元件200的引脚210的热量可以快速传导到导热件300上面，从而可以快速增强电器元件200的引脚210的散热能力，使电器元件200的热量快速扩散。
根据本发明实施例的电路板1，通过使导热件300与电器元件200接触，可以快速增强电器元件200的引脚210的散热能力，使电器元件200的热量快速扩散，保证工作运行的稳定性和可靠性。
根据本发明实施例的电路板1的其他构成以及操作对于本领域普通技术人员而言都是已知的，这里不再详细描述。
根据本发明第二方面实施例的移动终端，包括根据本发明第一方面实施例所述的电路板1。例如，移动终端可以是手机。
根据本发明实施例的移动终端，利用如上所述的电路板1，稳定性好、可靠性高。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“具体实施例”、“可选实施例”、“示例”或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种 变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (18)

  1. 一种电路板，其特征在于，包括：
    主板，所述主板具有焊盘；
    电器元件，所述电器元件具有引脚，所述引脚与所述焊盘焊接；
    导热件，所述导热件与所述主板连接且与所述电器元件接触。
  2. 根据权利要求1所述的电路板，其特征在于，所述导热件与所述焊盘接触。
  3. 根据权利要求2所述的电路板，其特征在于，所述导热件与所述焊盘焊接。
  4. 根据权利要求1-3中任一项所述的电路板，其特征在于，所述引脚的自由端的端面与所述导热件的端面贴合。
  5. 根据权利要求4所述的电路板，其特征在于，所述引脚的自由端的端面形成为平面。
  6. 根据权利要求5所述的电路板，其特征在于，所述引脚的自由端的端面为矩形面。
  7. 根据权利要求4所述的电路板，其特征在于，所述导热件的与所述引脚贴合的端面形成为平面。
  8. 根据权利要求4所述的电路板，其特征在于，所述引脚的自由端的端面和所述导热件的与所述引脚贴合的端面均为平面。
  9. 根据权利要求1-8中任一项所述的电路板，其特征在于，所述导热件为长方体形。
  10. 根据权利要求1-9中任一项所述的电路板，其特征在于，所述导热件 的宽度为D1，所述引脚的宽度为D2，所述D1和D2满足：D1＞D2。
  11. 根据权利要求10所述的电路板，其特征在于，所述D1和D2满足：D1-D2≥0.2mm。
  12. 根据权利要求1-11中任一项所述的电路板，其特征在于，所述导热件的宽度小于所述焊盘的宽度。
  13. 根据权利要求1-12中任一项所述的电路板，其特征在于，所述导热件的部分边缘延伸并超过所述焊盘。
  14. 根据权利要求1-13中任一项所述的电路板，其特征在于，所述导热件的高度为0.1mm-0.3mm。
  15. 根据权利要求1-14中任一项所述的电路板，其特征在于，所述导热件为钢片。
  16. 根据权利要求1-15中任一项所述的电路板，其特征在于，所述导热件为铜片。
  17. 一种移动终端，其特征在于，包括根据权利要求1-16中任一项所述的电路板。
  18. 根据权利要求17所述的移动终端，其特征在于，所述移动终端为手机。
PCT/CN2017/080487 2016-07-28 2017-04-13 电路板和具有其的移动终端 WO2018018937A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610608684.2 2016-07-28
CN201610608684.2A CN106211555A (zh) 2016-07-28 2016-07-28 电路板和具有其的移动终端

Publications (1)

Publication Number Publication Date
WO2018018937A1 true WO2018018937A1 (zh) 2018-02-01

Family

ID=57496062

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/080487 WO2018018937A1 (zh) 2016-07-28 2017-04-13 电路板和具有其的移动终端

Country Status (2)

Country Link
CN (1) CN106211555A (zh)
WO (1) WO2018018937A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211555A (zh) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 电路板和具有其的移动终端
CN110856338B (zh) * 2019-10-22 2021-03-23 Tcl华星光电技术有限公司 电路板组件及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661299A (ja) * 1992-08-05 1994-03-04 Nec Corp 半導体装置及びその製造方法
CN203086852U (zh) * 2013-01-28 2013-07-24 精英电脑股份有限公司 内埋式印刷电路板结构
CN103747610A (zh) * 2013-12-24 2014-04-23 苏州欢颜电气有限公司 一种pcb散热焊盘
CN103763849A (zh) * 2013-10-28 2014-04-30 高德(苏州)电子有限公司 一种高散热铜基线路板
CN104394644A (zh) * 2014-10-24 2015-03-04 苏州德鲁森自动化系统有限公司 一种四引脚3528led灯的焊盘
JP2015195340A (ja) * 2014-03-17 2015-11-05 アスモ株式会社 電子部品組立体
CN106211555A (zh) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 电路板和具有其的移动终端

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06342966A (ja) * 1993-06-02 1994-12-13 Toshiba Corp 電子回路モジュール
CN205378350U (zh) * 2016-01-08 2016-07-06 广州顶源电子科技有限公司 一种dip产品专用防虚焊pcb板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661299A (ja) * 1992-08-05 1994-03-04 Nec Corp 半導体装置及びその製造方法
CN203086852U (zh) * 2013-01-28 2013-07-24 精英电脑股份有限公司 内埋式印刷电路板结构
CN103763849A (zh) * 2013-10-28 2014-04-30 高德(苏州)电子有限公司 一种高散热铜基线路板
CN103747610A (zh) * 2013-12-24 2014-04-23 苏州欢颜电气有限公司 一种pcb散热焊盘
JP2015195340A (ja) * 2014-03-17 2015-11-05 アスモ株式会社 電子部品組立体
CN104394644A (zh) * 2014-10-24 2015-03-04 苏州德鲁森自动化系统有限公司 一种四引脚3528led灯的焊盘
CN106211555A (zh) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 电路板和具有其的移动终端

Also Published As

Publication number Publication date
CN106211555A (zh) 2016-12-07

Similar Documents

Publication Publication Date Title
US20160295739A1 (en) Heat spreading module for portable electronic device
JP2013540371A5 (zh)
CN107251669B (zh) 基板单元
CN110459512A (zh) 散热主板及光模块
WO2017206682A1 (zh) 移动显示设备
WO2018018937A1 (zh) 电路板和具有其的移动终端
JP5360419B2 (ja) 電子回路基板
CN106028628A (zh) 电路板和具有其的移动终端
US11043443B2 (en) Electric device and heat radiator
TWM547692U (zh) 可拆卸式ｍ.２介面散熱模組
TWM449938U (zh) 薄型熱管之受熱端接觸結構
TWM422759U (en) Cooling structure for junction box
TW201006048A (en) Contact and connector including the same
CN107078106B (zh) 散热结构
CN209572203U (zh) 一种用于手机分段式柔性线路板
CN202307856U (zh) 一种集成电路器件散热结构及集成电路器件
CN208609264U (zh) 一种电路板组件及电子装置
CN210379033U (zh) 一种功率器件连接结构
CN214152892U (zh) 一种功率器件的封装结构
CN219204804U (zh) 一种pcb板
JP6060053B2 (ja) パワー半導体装置
CN103426840B (zh) 具有续流二极管的开关装置
CN209517614U (zh) 一种电路板
CN112242372A (zh) 一种功率器件连接结构
CN217591199U (zh) 一种具有耐磨保护结构的双面镂空刚性电路板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17833243

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17833243

Country of ref document: EP

Kind code of ref document: A1