WO2018018743A1 - Led灯具、烤箱及微波炉 - Google Patents

Led灯具、烤箱及微波炉 Download PDF

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Publication number
WO2018018743A1
WO2018018743A1 PCT/CN2016/100341 CN2016100341W WO2018018743A1 WO 2018018743 A1 WO2018018743 A1 WO 2018018743A1 CN 2016100341 W CN2016100341 W CN 2016100341W WO 2018018743 A1 WO2018018743 A1 WO 2018018743A1
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WO
WIPO (PCT)
Prior art keywords
heat
led lamp
reflector
led
oven
Prior art date
Application number
PCT/CN2016/100341
Other languages
English (en)
French (fr)
Inventor
罗晨阳
赵铱楠
江新华
庄喜贤
Original Assignee
深圳和而泰智能控制股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳和而泰智能控制股份有限公司 filed Critical 深圳和而泰智能控制股份有限公司
Priority to PL16910322T priority Critical patent/PL3492801T3/pl
Priority to EP16910322.3A priority patent/EP3492801B1/en
Priority to US15/885,943 priority patent/US10480769B2/en
Publication of WO2018018743A1 publication Critical patent/WO2018018743A1/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15Thermal insulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/0004Personal or domestic articles
    • F21V33/0044Household appliances, e.g. washing machines or vacuum cleaners
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/006Arrangements for circulation of cooling air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/008Illumination for oven cavities
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/6444Aspects relating to lighting devices in the microwave cavity
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/04Optical design
    • F21V7/041Optical design with conical or pyramidal surface
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30Lighting for domestic or personal use
    • F21W2131/307Lighting for domestic or personal use for ovens
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the embodiments of the present application relate to the field of LED lighting technologies, and in particular, to an LED lamp, an oven, and a microwave oven.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • incandescent lamps and halogen lamps with high energy consumption and short life in most lighting fields due to their advantages of energy saving, environmental protection and long life.
  • the home appliance with illumination function such as an oven, a microwave oven, etc., also has the requirement of replacing with an LED light source.
  • the inventors found that there is the following problem: since the LED itself is a cold light source, the chip and the packaging material do not have the characteristics of high temperature resistance, and the LED light source replaces the conventional light source as the light source of the oven or the microwave oven, and works. LEDs in high temperature environments are extremely susceptible to damage.
  • the technical problem to be solved by the embodiment of the present application is to provide an LED lamp, an oven and a microwave oven, which can effectively separate the heat in the microwave oven or the oven from the LED unit, thereby achieving an ambient temperature at which the LED unit can work normally, and prolonging the use of the LED lamp. life.
  • an LED lamp including:
  • the illuminating assembly of the heat dissipating component comprises an LED unit and a reflector disposed on the heat dissipating component and a first transmissive cover covering the reflector, the reflector is disposed around the LED unit, The reflector is provided with at least one first ventilation hole;
  • a heat conducting bracket disposed on the heat dissipating member, the heat conducting bracket is disposed around the reflector cup, and the heat conducting bracket is provided with at least one second venting hole;
  • the second transmissive cover covers the heat conducting bracket.
  • the reflector has a flared structure with oppositely disposed small mouth ends and large mouth ends;
  • the first vent is disposed adjacent to the small end of the reflector.
  • the large end of the reflector has a plurality of engaging portions protruding outwardly, and the first transparent cover is engaged with the engaging portion.
  • the heat conducting bracket protrudes outwardly from at least two ears, and the ear portion is fixedly connected to the heat sink.
  • the second transparent cover is screwed to the heat conducting bracket.
  • the LED lamp further includes a heat insulating member fixedly disposed on the heat dissipating member, and the heat conducting bracket is fixedly connected to the heat insulating member.
  • the LED lamp further includes an insulating sealing ring, and the heat insulating sealing ring is sandwiched between the heat conducting bracket and the second transparent cover.
  • the LED unit includes a PCB board that is in contact with the heat sink and an LED wick that is electrically connected to the PCB board, and a side of the PCB board that is in contact with the heat sink is coated with a layer of heat conductive material.
  • an oven including a box, and further comprising the above LED lamp, wherein the LED lamp is embedded on the box.
  • a microwave oven including a box body, and further comprising the above LED lamp, wherein the LED lamp is embedded on the box body.
  • LED lamps embedded in a microwave oven or oven such that the heat in the microwave oven or oven is mostly convected and/or radiated through the second transmissive cover and the heat-conducting bracket to the atmosphere outside the oven or oven, the reflector and the
  • the heat in the cavity between the transparent cover diffuses to the atmosphere through the first ventilation hole and the second ventilation hole, tends to balance the heat, and the heat generated by the LED unit is transmitted to the heat dissipation member, thereby realizing the heat in the microwave oven or the oven and the LED unit.
  • FIG. 1 is a cross-sectional view showing a partial structure of a microwave oven according to an embodiment of the present application
  • FIG. 2 is a schematic structural view of a reflector shown in the embodiment of the present application.
  • FIG. 3 is a schematic structural view of a heat conduction bracket shown in an embodiment of the present application.
  • FIG. 4 is a structural block diagram of a microwave oven in an embodiment of the present application.
  • FIG. 5 is a block diagram showing the structure of an oven in the embodiment of the present application.
  • a microwave oven 11 is provided in an embodiment of the present application.
  • the microwave oven 11 includes an LED lamp 100 and a box 200 .
  • the LED lamp 100 is embedded in the box 200 .
  • the LED lamp 100 includes a heat dissipating component 10 , a light emitting component disposed on the heat sink 10 , a heat conducting bracket 20 disposed on the heat sink 10 , and a second light transmissive cover 30 covering the heat conducting bracket 20 .
  • the housing 200 is provided with a mounting hole for assembling the LED lamp 100, and the heat conducting bracket 20 abuts against the hole wall of the mounting hole.
  • the light emitting assembly includes an LED unit 41, a reflector cup 42, and a first light transmissive cover 43.
  • the LED unit 41 is disposed on the heat sink 10.
  • the LED unit 41 includes a PCB board 411 that is in contact with the heat sink 10 and an LED wick 412 that is electrically connected to the PCB board 411.
  • the LED wick 412 is mounted.
  • the LED wick 412 is inserted into the PCB board 411.
  • the side of the PCB board 411 and the heat sink 10 abutting is coated with a layer of heat conductive material, for example,
  • the layer of thermally conductive material is a layer of thermally conductive silicone.
  • the reflector 42 is disposed on the heat sink 10 and disposed around the LED unit 41.
  • the first transparent cover 43 is covered with the reflector 42 so that the LED unit 41 is located together with the heat sink 10, the reflector cup 42 and the first transparent cover 43. In the cavity.
  • the reflector cup 42 has a horn-like structure, and the reflector cup 42 has a relatively small end 421 and a large end 422.
  • the aperture of the small end 421 is smaller than the aperture of the large end 422.
  • the small end 421 of the reflector cup 42 is disposed on the heat sink 10.
  • the reflector 42 is provided with at least one first ventilation hole 423.
  • the first ventilation hole 423 is disposed near the small end 421 of the reflector 42.
  • the first transparent cover 43 is disposed adjacent to the large end 422 of the reflector 42.
  • the first transparent cover 43 includes, but is not limited to, a light transmissive glass, a light transmissive resin,
  • the large end 422 of the reflector 42 protrudes outwardly from the at least two engaging portions 424 , and the first transparent cover 43 is engaged with the engaging portion 424 .
  • the number of the carding portions 424 is four, and the four carding portions 424 are evenly arranged on the large end 422 of the reflector 42. The cover 43 is snapped between the four latching portions 424.
  • the reflector 42 is nested with a reflective cover that uses a highly reflective diffuse reflective material to facilitate the collection of light from the LED wick, thereby improving light utilization.
  • the heat-conducting bracket 20 is disposed around the reflector cup 42.
  • the heat-conducting bracket 20 may be a metal bracket with better heat conduction effect, or other non-metal brackets with better heat conduction effect.
  • the LED lamp further includes a heat-insulating member 50 fixedly disposed on the heat-dissipating member 10, and the heat-conducting bracket 20 is fixedly connected to the heat-insulating member 50. Specifically, as shown in FIG.
  • the heat conducting bracket 20 is provided with at least one second venting hole 21, and the heat conducting bracket 20 protrudes outwardly from the at least two ears 22, and is sequentially screwed by screws, bolts, etc.
  • the ear portion 22 of the heat-conducting bracket 20 and the heat insulator 50 are fixedly connected to the heat sink 10 .
  • the second transparent cover 30 is provided with a heat-conducting support 20.
  • the second transparent cover 30 includes, but is not limited to, a light-transmissive glass, a light-transmissive resin, or the like.
  • the second translucent cover 30 is screwed to the thermally conductive bracket 20.
  • the LED lamp further comprises an insulating sealing ring 70, and the heat sealing seal The ring 70 is sandwiched between the heat conducting bracket 20 and the second light transmissive cover 30 to prevent the hot gas from affecting the LED unit 41.
  • the LED luminaire 100 embedded in the microwave oven causes the heat in the microwave oven to be convected and/or radiated to the atmosphere outside the cabinet 200 of the microwave oven through the second transmissive cover 30 and the thermally conductive support 20 in turn, the reflective cup 42 and the first
  • the heat in the cavity between the transparent cover 43 is diffused to the atmosphere through the first ventilation hole 423 and the second ventilation hole 21, and the heat is balanced, and the heat generated by the LED unit 41 is transmitted to the heat dissipation member 10, thereby realizing heat and LED in the microwave oven.
  • the units 41 are effectively spaced apart to achieve an ambient temperature at which the LED unit 41 can operate normally, extending the service life of the LED lamp 100.
  • the LED lamp described in the embodiment of the present application can also be applied to other home appliances, such as an oven.
  • another embodiment of the present application provides an oven 12 that also includes an LED lamp 300 and a case 400.
  • the LED lamp 300 is embedded in the case 400.
  • the structure and method of use of the LED lamp 300 are the same as those of the LED lamp of the embodiment shown in FIGS. 1 to 3.
  • the structure and the method of use of the case 400 are the same as those of the embodiment shown in FIGS. 1 to 3.
  • the LED lamp 300 By providing the LED lamp 300 in the oven 12, it is possible to effectively heat the oven 12 and bake it.
  • the LED lighting units of the box 12 are separated to prevent the working environment temperature of the LED lighting unit from being too high, which is advantageous for extending the life of the LED lamp 300.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED灯具(100, 300)、烤箱(12)及微波炉(11),LED灯具(100, 300)包括:散热件(10)、设于散热件(10)的发光组件和导热支架(20)、罩设于导热支架(20)的第二透光罩(30)。发光组件包括设于散热件(10)的LED单元(41)和反光杯(42)以及罩设于反光杯(42)的第一透光罩(43),反光杯(42)上开设有第一通风孔(423);导热支架(20)围绕反光杯(42)设置,导热支架(20)上开设有第二通风孔(21)。嵌设于微波炉(11)或烤箱(12)上的LED灯具(100, 300)能够有效地将微波炉(11)或烤箱(12)内的热量与LED单元(41)隔开,避免LED单元(41)的工作环境温度过高,有利于延长LED灯具(100, 300)的使用寿命。

Description

LED灯具、烤箱及微波炉 技术领域
本申请实施方式涉及LED照明技术领域,特别是涉及一种LED灯具、烤箱及微波炉。
背景技术
LED(Light Emitting Diode,发光二极管)以其节能环保、寿命长的优势,已在大多数照明领域逐步替代了高能耗、寿命短的白炽灯和卤素灯等传统光源。其中,在工作时不仅腔体内部温度过高,而且又需要有照明功能的家电产品,例如,烤箱、微波炉等,也同样具有替换成LED光源的要求。
然而,发明人在实现本申请过程中,发现存在以下问题:由于LED本身是冷光源,其芯片和封装材料不具有耐高温的特性,将LED光源替代传统光源作为烤箱、微波炉的光源时,工作在高温环境下的LED极易损坏。
发明内容
本申请实施方式主要解决的技术问题是提供一种LED灯具、烤箱及微波炉,能够将微波炉或烤箱内的热量与LED单元有效隔开,达到LED单元能够正常工作的环境温度,延长LED灯具的使用寿命。
为解决上述技术问题,本申请实施例采用的一个技术方案是:提供一种LED灯具,包括:
散热件;
设于所述散热件的发光组件,包括设于所述散热件的LED单元和反光杯以及罩设所述反光杯的第一透光罩,所述反光杯围绕所述LED单元设置,所述反光杯上开设有至少一个第一通风孔;
设于所述散热件的导热支架,所述导热支架围绕所述反光杯设置,所述导热支架上开设有至少一个第二通风孔;
第二透光罩,罩设所述导热支架。
其中,所述反光杯呈喇叭状结构,具有相对设置的小口端和大口端;所述 第一通风孔靠近所述反光杯的小口端设置。
其中,所述反光杯的大口端向外凸伸出至少两个卡设部,所述第一透光罩卡接于所述卡设部。
其中,所述导热支架上向外凸伸出至少两个耳部,所述耳部与所述散热件固定连接。
其中,所述第二透光罩与所述导热支架螺纹连接。
其中,所述LED灯具还包括隔热件,所述隔热件固定设于所述散热件上,所述导热支架与所述隔热件固定连接。
其中,所述LED灯具还包括隔热密封圈,所述隔热密封圈夹设于所述导热支架与所述第二透光罩之间。
其中,所述LED单元包括贴靠于所述散热件的PCB板以及电连接于所述PCB板的LED灯芯,所述PCB板与所述散热件贴靠的一侧涂覆有导热材料层。
为解决上述技术问题,本申请实施例采用的另一个技术方案是:提供一种烤箱,包括箱体,还包括上述LED灯具,所述LED灯具嵌设于所述箱体上。
为解决上述技术问题,本申请实施例采用的另一个技术方案是:提供一种微波炉,包括箱体,还包括上述LED灯具,所述LED灯具嵌设于所述箱体上。
嵌设于微波炉或烤箱上的LED灯具,使得微波炉或烤箱内的热量大多依次通过第二透光罩和导热支架对流和/或辐射至微波炉或烤箱的箱体外的大气中,反光杯和第一透光罩之间腔体内的热量通过第一通风孔和第二通风孔向大气扩散,趋向热量平衡,LED单元产生的热量传导至散热件,实现将微波炉或烤箱内的热量与LED单元有效隔开,达到LED单元能够正常工作的环境温度,延长LED灯具的使用寿命。
附图说明
图1是本申请一实施例微波炉的部分结构的剖视图;
图2是本申请实施例中所示反光杯的结构示意图;
图3是本申请实施例中所示导热支架的结构示意图;
图4是本申请实施例中微波炉的结构框图;
图5是本申请实施例中烤箱的结构框图。
具体实施方式
参阅图1至图4,本申请实施例提供的一种微波炉11,该微波炉11包括LED灯具100以及箱体200,LED灯具100嵌设于箱体200上。
其中,如图1所示,LED灯具100包括:散热件10、设于散热件10的发光组件、设于散热件10的导热支架20以及罩设导热支架20的第二透光罩30。具体的,箱体200上开设有用于装配LED灯具100的安装孔,导热支架20抵持于安装孔的孔壁。
发光组件包括:LED单元41、反光杯42以及第一透光罩43。
LED单元41设于散热件10上,在本申请实施例中,LED单元41包括贴靠于散热件10的PCB板411以及电连接于PCB板411的LED灯芯412,比如,LED灯芯412贴装于PCB板411,又如,LED灯芯412插接于PCB板411。为了更好地将装配在PCB板411上的电子元器件散发的热量通过PCB板411传导至散热件10上,PCB板411与散热件10贴靠的一侧涂覆有导热材料层,例如,该导热材料层为导热硅胶层。
反光杯42设于散热件10上且围绕LED单元41设置,第一透光罩43罩设反光杯42,以使LED单元41位于散热件10、反光杯42以及第一透光罩43共同围合的腔体内。在本申请实施例中,如图2所示,反光杯42呈喇叭状结构,反光杯42具有相对设置的小口端421和大口端422,小口端421的孔径小于大口端422的孔径,其中,反光杯42的小口端421设于散热件10上。反光杯42上开设有至少一个第一通风孔423,第一通风孔423靠近反光杯42的小口端421设置,第一透光罩43靠近反光杯42的大口端422设置。第一透光罩43包括但不限于透光玻璃、透光树脂等。
为了方便拆装第一透光罩43,反光杯42的大口端422向外凸伸出至少两个卡设部424,第一透光罩43卡接于卡设部424。在本申请实施例中,卡设部424的个数为四个,四个卡设部424均匀排布于反光杯42的大口端422,第一透光 罩43卡接于四个卡设部424之间。
在其他实施例中,反光杯42内嵌套有反射罩,该反射罩采用高反射率的漫反射材料,有利于聚集LED灯芯发出的光,从而提高光利用率。
导热支架20围绕反光杯42设置,在本申请实施例中,导热支架20可以是热传导效果较好的金属支架,也可以是其他热传导效果较好的非金属支架。为了减少导热支架20与散热件10之间的热量传导,上述LED灯具还包括隔热件50,隔热件50固定设于散热件10上,导热支架20与隔热件50固定连接。具体的,如图3所示,导热支架20上开设有至少一个第二通风孔21,导热支架20上向外凸伸出至少两个耳部22,利用螺丝、螺栓等螺纹紧固件61依次穿过导热支架20的耳部22、隔热件50后固定连接在散热件10上。
第二透光罩30罩设导热支架20,在本申请实施例中,第二透光罩30包括但不限于透光玻璃、透光树脂等。第二透光罩30与导热支架20螺纹连接。为了有效地阻挡热气从导热支架20与第二透光罩30的连接处缝隙进入导热支架20和第二透光罩30围合的腔体内,LED灯具还包括隔热密封圈70,隔热密封圈70夹设于导热支架20与第二透光罩30之间,避免热气对LED单元41造成影响。
嵌设于微波炉上的LED灯具100,使得微波炉内的热量大多依次通过第二透光罩30和导热支架20对流和/或辐射至微波炉的箱体200外的大气中,反光杯42和第一透光罩43之间腔体内的热量通过第一通风孔423和第二通风孔21向大气扩散,趋向热量平衡,LED单元41产生的热量传导至散热件10,实现将微波炉内的热量与LED单元41有效隔开,达到LED单元41能够正常工作的环境温度,延长LED灯具100的使用寿命。
当然,本申请实施例所述的LED灯具还可以应用于其他家电产品,例如烤箱等。参阅图5,本申请又一实施例提供的一种烤箱12,该烤箱12也包括LED灯具300以及箱体400,LED灯具300嵌设于箱体400上。其中,LED灯具300的结构和使用方法与图1~图3所示实施例的LED灯具相同,箱体400的结构和使用方法与图1~图3所示实施例的箱体相同。
通过在烤箱12内设置LED灯具300,能够有效地将烤箱12内的热量和烤 箱12的LED发光单元隔开,避免LED发光单元的工作环境温度过高,有利于延长LED灯具300的寿命。
以上所述仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。

Claims (10)

  1. 一种LED灯具,其特征在于,包括:
    散热件;
    设于所述散热件的发光组件,包括设于所述散热件的LED单元和反光杯以及罩设所述反光杯的第一透光罩,所述反光杯围绕所述LED单元设置,所述反光杯上开设有至少一个第一通风孔;
    设于所述散热件的导热支架,所述导热支架围绕所述反光杯设置,所述导热支架上开设有至少一个第二通风孔;
    第二透光罩,罩设所述导热支架。
  2. 根据权利要求1所述的LED灯具,其特征在于,所述反光杯呈喇叭状结构,具有相对设置的小口端和大口端;所述第一通风孔靠近所述反光杯的小口端设置。
  3. 根据权利要求2所述的LED灯具,其特征在于,所述反光杯的大口端向外凸伸出至少两个卡设部,所述第一透光罩卡接于所述卡设部。
  4. 根据权利要求1所述的LED灯具,其特征在于,所述导热支架上向外凸伸出至少两个耳部,所述耳部与所述散热件固定连接。
  5. 根据权利要求4所述的LED灯具,其特征在于,所述第二透光罩与所述导热支架螺纹连接。
  6. 根据权利要求1至5任一所述的LED灯具,其特征在于,所述LED灯具还包括隔热件,所述隔热件固定设于所述散热件上,所述导热支架与所述隔热件固定连接。
  7. 根据权利要求1至5任一所述的LED灯具,其特征在于,所述LED灯具还包括隔热密封圈,所述隔热密封圈夹设于所述导热支架与所述第二透光罩之间。
  8. 根据权利要求1所述的LED灯具,其特征在于,所述LED单元包括贴靠于所述散热件的PCB板以及电连接于所述PCB板的LED灯芯,所述PCB板与所述散热件贴靠的一侧涂覆有导热材料层。
  9. 一种烤箱,包括箱体,其特征在于,还包括如权利要求1至8任一所述 的LED灯具,所述LED灯具嵌设于所述箱体上。
  10. 一种微波炉,包括箱体,其特征在于,还包括如权利要求1至8任一所述的LED灯具,所述LED灯具嵌设于所述箱体。
PCT/CN2016/100341 2016-07-29 2016-09-27 Led灯具、烤箱及微波炉 WO2018018743A1 (zh)

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