WO2018010233A1 - 一种led芯片发光灯条基板材料及led球泡灯 - Google Patents

一种led芯片发光灯条基板材料及led球泡灯 Download PDF

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WO2018010233A1
WO2018010233A1 PCT/CN2016/093190 CN2016093190W WO2018010233A1 WO 2018010233 A1 WO2018010233 A1 WO 2018010233A1 CN 2016093190 W CN2016093190 W CN 2016093190W WO 2018010233 A1 WO2018010233 A1 WO 2018010233A1
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light
led
strip
emitting
raw material
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PCT/CN2016/093190
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French (fr)
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张伯文
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张伯文
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Definitions

  • the invention relates to an LED chip light-emitting light strip substrate material and a preparation method thereof and an LED bulb lamp, in particular to a technical solution for replacing a current sapphire, an alumina ceramic, etc. as a light-emitting light strip substrate with a YAG fluorescent multi-phase polycrystal.
  • the preparation method of the polycrystalline light bar substrate is described in detail, and belongs to the field of inorganic material preparation and illumination application.
  • LED filament lamp as a stereo light source capable of 360-degree full-angle illumination has changed the status quo of white LED in the field of civil lighting, with incandescent lamps as Prototype configuration, "traditional appearance, upgraded 'recipe'", people can see that it is made of LED lamps can understand that it is a familiar lighting fixture, as soon as it is listed, it is accepted by consumers. Then, the candle light, the crystal light, and the bulb light with the LED filament as the light source began to appear in large numbers.
  • the mainstream LED filament process usually packs 28 0.02W LED chips in series on a long strip of 38mm long and 1.5mm in diameter (or 30mm ⁇ 0.8mm ⁇ 0.4mm), and then implements the top-sealing fluorescent glue. .
  • the LED filament is driven by a current of 10 mA, the voltage is 84V, the power is 0.84W, the luminous flux is 100lm, and the luminous efficiency can reach 120lm/W or more. If it is matched with a red chip, the color rendering index can reach 95 or more.
  • the LED filament has the characteristics of small current and high voltage, which effectively reduces the heat generation of the LED and the cost of the driver, and has outstanding advantages.
  • LED filament lamps use tanks to inject inert gases (such as nitrogen, nitrogen and argon gas, etc.) or liquids (ethylene glycol, oil, etc.) in the form of heat conduction, convection or radiation. Cooling, but in actual applications and design effects are quite different. Therefore, how to effectively reduce heat generation or rapid heat conduction is a guarantee for reducing the light decay, prolonging the life and improving the reliability of the LED filament lamp.
  • the chips of the LED filament lamp are mounted on the substrate material, and then connected to a metal heat conduction system such as copper or aluminum for heat dissipation. As the first stage of heat transfer and heat conduction, the choice of thermal substrate material is an effective solution.
  • the main material of the filament lamp substrate is sapphire (single crystal), transparent alumina (polycrystalline) and translucent white ceramic (99 alumina or 96 alumina, etc.) and other materials.
  • single crystal sapphire has the highest flexural strength, thermal conductivity, refractive index and light transmittance, which ensures its strength, heat dissipation and optical properties as a substrate material, but its price is very expensive and difficult to use.
  • Translucent white ceramics often have low light transmittance and heat dissipation coefficient, which are often difficult to achieve practical performance indicators, although their cost is greatly reduced.
  • polycrystalline transparent alumina has high requirements on the preparation process, and has shortcomings in the high-end market and the low-end market.
  • the low-end filament lamps below 2W on the market are mainly made of glass substrates, because the heat dissipation can withstand them, the price is relatively cheap, and the production yield is relatively high.
  • Most of the high-end products use sapphire substrates, which occupy the majority of the market share.
  • the series of patents published by Zhejiang Ruidisheng Photoelectric Co., Ltd. (such as PCT/CN2011/079234, WO2012/031533) are made of transparent substrates such as soft glass, hard glass, quartz glass, transparent ceramics or plastics to improve the LED illumination. effectiveness.
  • the substrate materials used above only serve as a substrate fixing chip and corresponding heat dissipation, and the corresponding transparent or translucent properties provide high light transmittance and luminous efficiency, and still need to be coated on the surface of the chip.
  • Phosphor layer after mixing for a long time, the phosphor blends silica gel or epoxy resin as the phosphor aging and light decay, including the light decay of the blue LED itself, the temperature quenching of the phosphor and the aging of the silicone resin. .
  • the pure YAG:Ce material system is used as a material for emitting yellow-green light (MgAl 2 O 4 or undoped YAG is a transparent ceramic base material, which does not emit light), although it can be Tb-substituted, Cr- and Pr-co-doped.
  • MgAl 2 O 4 or undoped YAG is a transparent ceramic base material, which does not emit light
  • the heterogeneous increase of the red light component in the spectrum but its increase effect is limited, its color rendering performance and color temperature control ability is poor, and the performance requirement cannot be met in the specific use process.
  • the object of the present invention is to provide an LED chip light-emitting strip substrate material for the prior art, and another object of the present invention is to provide a method for preparing the above-mentioned substrate material, and an object of the present invention is to provide an LED chip using the above-mentioned LED chip. LED bulbs that illuminate the light strip substrate material.
  • the present invention provides a novel LED bulb lamp, which replaces the existing sapphire, alumina ceramic, etc. with a YAG fluorescent multiphase polycrystal as a light-emitting light strip substrate, and relates in detail to the polycrystalline light strip.
  • the preparation method of the substrate is to enhance the red light emission by introducing a nitride red powder, and adding a sintering aid and a sintering improver to improve the sintering problem of the multiphase polycrystal.
  • the novel environmentally friendly water-based tape casting process is used to achieve low-cost preparation of high-quality transparent fluorescent polycrystalline substrate materials.
  • the fluorescent polycrystal is used as the substrate, the blue chip is coated with the phosphor layer on one side, and the phosphor layer is not coated on the other side, combined with the advanced economical heat-dissipating gas composition design, effectively solving the heat problem, and ensuring and improving the overall filament The quality of the light. Finally, a high-efficiency, high color rendering index, high optical transmission of fluorescent polycrystalline substrate material and a bulb with uniform color temperature and heat dissipation, high reliability and long life are obtained.
  • the specific technical solution of the present invention is as follows: an LED chip light-emitting light strip substrate material, characterized in that the YAG:Ce raw material powder and the nitride red fluorescent powder are mixed in a mass percentage of 100:(1 ⁇ 5) and then burned.
  • YAG fluorescent multiphase polycrystal wherein YAG:Ce raw material powder satisfies stoichiometric ratio (Y 1-x Ce x ) 3 Al 5 O 12 , wherein 0.05% ⁇ x ⁇ 1.0%; nitride red phosphor powder
  • the luminescence peak wavelength is in the red region of 610-680 nm, and the luminescence half-width is 75-120 nm, and the particle size is 5-10 ⁇ m, which can be efficiently excited by blue light in the 360-470 nm band.
  • the substrate material has a thickness: a width: a length ratio of 1: (1.5 to 3): (50 to 200), and an optical total transmittance of 50% to 70% at 600 nm.
  • the invention also provides a method for preparing the above-mentioned LED chip light-emitting light strip substrate material, the specific steps of which are:
  • step 2 casting molding: the slurry obtained in step 1 is sieved, vacuum defoaming; the slurry is prevented from being cast on a casting machine; the cast blank is dried in a drying chamber to obtain a thickness of 0.4 to 1.2 mm. Casting blank;
  • the two obtained blanks are vacuum-sealed and placed in a warm isostatic press to pressurize to increase the density, the temperature is 60-80 ° C, the pressure is 80-120 Mpa, and the time is 5-10 min; Pre-cutting is performed in consideration of the shrinkage ratio to avoid cutting processing of the subsequent finished polycrystal;
  • step 4 row of glue the blank obtained in step 3 is placed in a muffle furnace for debinding, the heating rate is 0.5 ⁇ 1 ° C / min, and the temperature is maintained at 500 ⁇ 800 ° C for 4 ⁇ 10h;
  • the degreased green body is vacuum sintered at 1730 ° C ⁇ 1850 ° C for 4 ⁇ 30 h, and then annealed in air at 1300 ° C ⁇ 1550 ° C for 10 ⁇ 25 h, to obtain dense YAG fluorescent multiphase transparent polycrystalline
  • the LED chip light-emitting strip substrate material is obtained by a slight external force separation.
  • the mass purity of the above Y 2 O 3 , Al 2 O 3 and CeO 2 is 99.9 to 99.99%; the particle size of the Y 2 O 3 and CeO 2 raw materials are both 0.5 to 2 ⁇ m, and the particle size of the Al 2 O 3 raw material is 0.2 to 0.8.
  • the sintering aid is analytically pure TEOS and analytically pure MgO, and the sintering aid TEOS is added in an amount of 0.05 to 0.50% of the total mass of the Y 2 O 3 , Al 2 O 3 and CeO 2 raw material powder, and the sintering aid
  • the addition amount of MgO is 0.05 to 0.20% of the total mass of the Y 2 O 3 , Al 2 O 3 and CeO 2 raw material powder
  • the sintering modifier is analytically pure CaO, and the addition amount of the sintering modifier is Y 2 O 3 , 0.1 to 0.5% of the total mass of the Al 2 O 3 , CeO 2 and the nitride red phosphor
  • the dispersant is polyacrylamide
  • the binder is a PVA aqueous solution having a mass concentration of 10 to 15.0%
  • the plasticizer is polyethylene glycol (PEG-400);
  • the defoaming agent is polypropylene glycol (P-1200); in the
  • the ball mill dispersion time is 20-24h; the ball milling time is 20-24h; the step 2 is sieved 80-200 mesh sieve; the vacuum defoaming vacuum is 0.05-0.1MPa, and the defoaming time is 5-8min; Blade tape casting machine height is 0.5mm ⁇ 1.5mm, the casting speed is 10 ⁇ 200mm / min; 50 into dried claim 95 ⁇ 70, 90 ⁇ 50 ⁇ 70 deg.] C and three-stage drying.
  • one side of the substrate material 6 comprises 1 to 3 strings of PN junctions in the same direction, and the LED blue chip 9 having an emission wavelength of 430 to 470 nm is connected, and the chips are connected to each other by an electrical connection line, and the surface of the blue chip 9 is coated with a phosphor.
  • Layer 7 converts part of the blue light into white light (the phosphor layer is made by mixing the commercial YAG:Ce phosphor with silica gel or epoxy resin using a mature solution, generally silica gel or epoxy resin accounts for 85% to 95% of the weight of the phosphor layer).
  • the substrate material has no LED blue core
  • One side of the strip is not coated with a phosphor layer; both ends of the strip are provided with electrical connection lines 10.
  • the light strip of the LED chip can be emitted by 4 ⁇ .
  • the present invention also provides an LED bulb based on the above-mentioned LED chip light-emitting strip as a light-emitting strip, characterized in that the light-emitting strip 1 of the LED chip, the driving power source 2, the glass bulb shell 3, the glass holder stem 4 and The electrical connector 5 is composed; wherein the glass bulb 3 and the support stem 4 are vacuum-sealed into a cavity and then filled with a high heat-conducting gas, and the bracket stem 4 and the light-emitting strip 1 fixed thereon are accommodated in the sealed cavity; 1 is electrically connected to the driving power source 2 and the electrical connector 5 in sequence; when lighting, the electrical connector 5 is electrically connected to the external power source to supply power to the LED lighting strip.
  • the number of the LED chip light strips 1 capable of 4 ⁇ light emission is 1 to 10, and the number of LED blue light chips on each side of each light strip 1 needs to satisfy the total driving voltage after all the light strips 1 are connected in series or in parallel. Equal to the external drive voltage, the chips are connected to each other by electrical connections.
  • the above-mentioned number of LED chip light-emitting strips 1 capable of 4 ⁇ light-emitting can be connected in series or in series and in parallel, and can be connected to two-way alternating current or one-way direct current operation, and the arrangement of the LED chips in the cavity can be various and sealed.
  • the driving power source 2 When the driving power source 2 is in the bidirectional alternating current operation of the light bar (1), at least one of the LED light strips 1 is turned on in the positive direction and the reverse direction, respectively, and is turned on when the alternating current is alternately turned on and off; the driving power source 2 is in the light strip.
  • unidirectional DC operation directly use external DC power supply, or add a buck current limiting circuit and filter circuit composed of capacitors and resistors.
  • the glass bulb 3 has light transmissivity, can be sanded and added, and has the shape of A or G;
  • the glass holder stem 4 is a high light transmissive colorless glass column for supporting the light strip;
  • the connector 5 is one of E40 or E27;
  • the high thermal conductivity gas charged by the glass bulb 3 and the support stem 4 after being vacuum-sealed into a cavity is a mixture of nitrogen and hydrogen, wherein the proportion of hydrogen in the mixture is It is 3.0 to 5.0%, and the total pressure at room temperature (25 ° C) is 0.01 to 0.1 MPa.
  • the LED bulb prepared by the invention has a luminous efficiency of 130-180 lm/W and a color rendering index of 85-92. It has the advantages of adjustable color temperature (2500 ⁇ 7000K), good heat dissipation, high reliability, long life and low cost.
  • the invention adopts YAG fluorescent multiphase polycrystal to replace the existing sapphire, alumina ceramics and the like as the light-emitting light strip substrate, which not only bears the role of the substrate, but also functions as a fluorescent material, and is effective.
  • the problem of light decay is solved, and the service life and reliability of the LED filament bulb are enhanced.
  • the invention applies a phosphor layer on one side of the LED filament lamp strip substrate, and does not coat the phosphor layer on one side, which reduces the amount of the phosphor layer while retaining the phosphor layer to control the color of the lamp. Flexibility to easily meet the needs of different power, different quality light colors.
  • the YAG fluorescent multiphase polycrystal is prepared by a water-based tape casting molding process, which is environmentally friendly and energy-saving, has no pollution of the solvent, and has no harm to the operator.
  • the thickness of the cast sheet is precisely controllable and the microstructure is uniform, which is free from subsequent processing and cutting.
  • the YAG fluorescent multiphase polycrystal is combined with the YAG:Ce raw material powder and the nitride red powder to regulate the color rendering index and color temperature of the filament bulb lamp, and the luminous efficiency is high, the color rendering performance and the color temperature are consistent. Good sex.
  • the sintering aid added in the preparation process of the YAG fluorescent multiphase polycrystal and the sintering modifier suitable for the multiphase polycrystal in the invention effectively solve the problem of interfacial compatibility of the two-phase composite polycrystal and High quality transparent polycrystalline preparation technology.
  • the invention adopts the fluorescence multiphase polycrystal as the light bar, and improves the kind and proportion of the convective gas in the cavity of the bulb lamp, and combines the advantage of not coating the phosphor on the side of the polycrystalline strip substrate to obtain the advantage of the phosphor. Better convection and heat dissipation.
  • the raw material of the YAG fluorescent multiphase polycrystalline light strip prepared by the invention is cheap (the price of the main raw material used for rare earth Y 2 O 3 (99.99%, 50-60 yuan/Kg) is even lower than that of Al 2 O 3 (99.99%, 100 ⁇ 120 yuan/Kg)), environmentally friendly process and low cost.
  • the YAG fluorescent multiphase polycrystal prepared by the invention has an optical total transmittance of 50% to 70% at 600 nm, and has high optical transmittance and luminous intensity, thereby designing a LED bulb for a filament substrate.
  • the luminous efficiency can reach 130-180 lm/W, the color rendering index is 85-92, and the color temperature is adjustable (2500-7000K).
  • FIG. 1 is a schematic view showing the structure of an LED bulb having a YAG fluorescent multiphase polycrystal as a light-emitting strip in Embodiment 1 of the present patent application; wherein, 1 - YAG fluorescent multiphase polycrystal is used as a substrate, and LED chip which can emit light by 4 ⁇ emits light.
  • FIG. 2 is a schematic cross-sectional view of a YAG fluorescent multiphase polycrystalline light strip in Embodiment 1 of the present patent application; Among them, 6-fluorescent polycrystalline substrate; 7-phosphor layer; 8--series wiring; 9-blue chip; 10-electric connection.
  • 1Ingredients and ball milling Weigh all powders such as Y 2 O 3 , Al 2 O 3 , CeO 2 raw material powder, sintering aid, nitride material and sintering modifier in stoichiometric ratio, and add deionized water as solvent.
  • the Y 2 O 3 and CeO 2 raw materials have a particle size of 0.5 ⁇ m and 1.0 ⁇ m, and the Al 2 O 3 raw material has a particle size of 0.2 ⁇ m; the sintering aids TEOS and MgO are both analytically pure and above, and the added amount thereof is Y 2 O 3 , 0.05 wt.% and 0.10 wt.% of the total mass of the Al 2 O 3 and CeO 2 raw material powders.
  • the nitride fluorescent material used is a commercial Sr 2 Si 5 N 8 :Eu 2+ red phosphor, and its luminescence peak wavelength is in the red light region of 640 nm, and its half width is 104 nm, the particle size is 5 ⁇ m, and the excitation range is 360 ⁇ . 470 nm, the center excitation wavelength is 455 nm.
  • the mass percentage of the YAG:Ce raw material powder and the nitride fluorescent material is 100:5; and the sintering modifier for improving the performance of the multiphase polycrystal is added to analyze pure CaO as all powders (Y 2 O 3 , Al 2 )
  • the O 3 , CeO 2 and nitride fluorescent materials were added in an amount of 0.5 wt.%.
  • step 2 casting molding: the slurry obtained in step 1 is sieved through a 80 mesh sieve, and then removed at a vacuum of 0.08 MPa. Soak for 6min. The slurry is prevented from casting on the casting machine, the cutting edge height is 0.5 mm, the casting speed is 10 mm/min; the cast blank is dried in the drying chamber, and the drying temperature is divided into three sections, respectively 50, 90, At 70 ° C, a cast green sheet having a thickness of 0.4 mm was finally obtained.
  • 3Warm and pre-cut The two obtained blanks are vacuum-sealed and placed in a warm isostatic press to pressurize to increase the density.
  • the temperature is 60 ° C
  • the pressure is 120 MPa
  • the time is 5 min
  • step 4 row of glue:
  • the blank obtained in step 3 was placed in a muffle furnace for debinding, the heating rate was 0.5 ° C / min, and the temperature was kept at 600 ° C for 8 h.
  • the YAG fluorescence multiphase polycrystal obtained in step (1) has a medium thickness: width: length ratio of 1:2:50, and optical total transmittance test is 70% at 600 nm, and SEM shows that the microstructure is uniform. .
  • the number of LED chip light-emitting strips (1) capable of 4 ⁇ light-emitting is two, and each light-emitting strip (1) comprises two strings of PN-junctions in the same direction on one side.
  • the blue light chip (emission wavelength 455nm) all the light strips (1) are connected in series, connected in a bidirectional alternating current, and arranged in the cavity in the mutual manner as shown in Fig. 1, both sealed in the bulb shell (3), the total The drive voltage is close to the external drive voltage.
  • one side of the LED blue chip needs to be coated with a phosphor layer to convert part of the blue light into white light, and the light powder layer is made by mixing and stirring the commercial YAG:Ce phosphor powder and the LED package special silica gel by a mature scheme.
  • the content of silica gel and phosphor is 86.3% and 13.7%, and can be used after being uniformly defoamed by stirring; while the YAG fluorescent multiphase polycrystalline substrate on the luminescent strip (1) has no LED blue chip and no phosphor layer is coated.
  • a schematic view of the section is shown in Figure 2.
  • Driving power supply (2) Light-emitting light bar (1) Two-way AC work, one LED light bar (1) is turned in the positive direction and one in the opposite direction, and is turned on when the alternating current is positive and negative.
  • the glass bulb (3) has light transmissivity and is a colorless transparent A-type bubble shell.
  • the glass support stem (4) is a high light transmissive colorless glass column for supporting the light strip.
  • the electrical connector (5) connects the standard lamp head hardware to the E40 active bulb.
  • the schematic diagram of the finally obtained LED bulb is shown in Fig. 1.
  • the luminous efficiency is up to 180 lm/W
  • the color rendering index is 92
  • the color temperature is 2,500.
  • 1Ingredients and ball milling Weigh all powders such as Y 2 O 3 , Al 2 O 3 , CeO 2 raw material powder, sintering aid, nitride material and sintering modifier in stoichiometric ratio, and add deionized water as solvent.
  • the Y 2 O 3 and CeO 2 raw materials have a particle size of 2 ⁇ m and 0.5 ⁇ m, and the Al 2 O 3 raw material has a particle size of 0.8 ⁇ m; the sintering aids TEOS and MgO are both analytically pure and above, and the added amounts thereof are Y 2 O 3 and Al, respectively. 2 wt% of the total mass of the 2 O 3 and CeO 2 raw material powders, 0.05 wt.%.
  • the nitride fluorescent material used is a commercial Ca 2 Si 5 N 8 :Eu 2+ red phosphor with a peak wavelength of 610 nm in a red light region, a half-length of light emission of 120 nm, a particle size of 10 ⁇ m, and an excitation range of 360 to 470 nm.
  • the center excitation wavelength is 460 nm.
  • the mass percentage of the YAG:Ce raw material powder and the nitride fluorescent material is 100:3; and the sintering modifier added for improving the performance of the multiphase polycrystal is analyzed as pure CaO of 0.2 wt.% of all the powder added amount.
  • 3Warm and pre-cut The two obtained blanks are vacuum-sealed and placed in a warm isostatic press to pressurize to increase the density.
  • the temperature is 80 ° C
  • the pressure is 80 MPa
  • the time is 10 min
  • pre-cutting machine is pre-cut. cut.
  • step 4 row of glue:
  • the blank obtained in step 3 was placed in a muffle furnace for debinding, the heating rate was 1.0 ° C / min, and the temperature was kept at 500 ° C for 10 h.
  • the YAG fluorescence multiphase polycrystal obtained in step (1) has a medium thickness: width: length ratio of 1:1.5:100, optical total transmittance test is 50% at 600 nm, and SEM shows uniform microstructure .
  • the number of the LED chip light-emitting strips (1) capable of 4 ⁇ light-emitting is one, and the light-emitting strips (1) comprise three strings of PN junctions in the same direction of the LED blue light chip on one side ( The emission wavelength is 430 nm), sealed in the bulb (3), and its total driving voltage is close to the external driving voltage.
  • one side of the LED blue chip needs to be coated with a phosphor layer to convert part of the blue light into white light, and the light powder layer is made by mixing and stirring the commercial YAG:Ce phosphor powder and the LED package special silica gel by a mature scheme.
  • the content of silica gel and phosphor is 92.8% and 7.2%, and can be used after being uniformly defoamed by stirring; while the YAG fluorescent multiphase polycrystalline substrate on the luminescent strip (1) is not coated with a phosphor layer on one side of the LED blue chip. .
  • Driving power supply (2) The light-emitting light bar (1) operates in one-way DC, and is directly powered by an external DC power supply.
  • the glass bulb (3) is translucent and is a matte translucent G-type bubble shell.
  • the glass support stem (4) is a high light transmissive colorless glass column for supporting the light strip.
  • the electrical connector (5) connects the E27 active bulb to the standard base hardware.
  • the resulting LED bulb has a luminous efficiency of 130 lm/W, a color rendering index of 85, and a color temperature of 7000K.
  • 1Ingredients and ball milling Weigh all powders such as Y 2 O 3 , Al 2 O 3 , CeO 2 raw material powder, sintering aid, nitride material and sintering modifier in stoichiometric ratio, and add deionized water as solvent.
  • polyacrylamide as dispersant to the ball mill tank, adding 2/5 volume of ball milling medium; dispersing ball milling at 120r/min for 20h; adding pre-configured 12.0wt% PVA aqueous solution as binder
  • plasticizer polyethylene glycol (PEG-400) and defoamer polypropylene glycol P-1200 to the ball mill tank; continue to ball mill at the same speed for 22h; among them, all raw material powder: solvent deionized water: dispersed Agent polyacrylamide: binder PVA aqueous solution: plasticizer PEG: defoamer polypropylene glycol mass ratio of 55:30:1.0:25:2:0.8.
  • the Y 2 O 3 and CeO 2 raw materials have a particle size of 1.0 ⁇ m and 1.5 ⁇ m, and the Al 2 O 3 raw material has a particle size of 0.5 ⁇ m; the sintering aids TEOS and MgO are both analytically pure and above, and the added amount thereof is Y 2 O 3 , 0.2 wt.% and 0.2 wt.% of the total mass of the Al 2 O 3 and CeO 2 raw material powders.
  • the nitride fluorescent material used is a commercial CaAlSiN 3 :Eu 2+ red phosphor, and its luminescence peak wavelength is located in the red light region of 680 nm, and its half width is 75 nm, the particle size is 8 ⁇ m, and the excitation range is 360-470 nm.
  • the wavelength is 460 nm.
  • the mass percentage of the YAG:Ce raw material powder and the nitride fluorescent material is 100:1; and the sintering modifier added for improving the performance of the multiphase polycrystal is analyzed as pure CaO of 0.1 wt.% of all the powder added amount.
  • 3Warm and pre-cut The two obtained blanks are vacuum-sealed and placed in a warm isostatic press to pressurize to increase the density.
  • the temperature is 70 ° C
  • the pressure is 100 MPa
  • the time is 8 min
  • the pre-cutting machine is pre-prepared. cut.
  • step 3 The green sheet obtained in step 3 was placed in a muffle furnace for debinding, the heating rate was 0.67 ° C / min, and the temperature was kept at 800 ° C for 4 h.
  • the YAG fluorescence multiphase polycrystal obtained in step (1) has a medium thickness: width: length ratio of 1:3:200, and optical total transmittance test is 62% at 600 nm, and SEM shows that the microstructure is uniform. .
  • each light-emitting strip (1) includes one string of PN-junctions in the same direction.
  • a blue chip emission wavelength 470 nm
  • each of the five light-emitting strips (1) are connected in series, and the two are connected in parallel, which are arranged in a prismatic arrangement in the cavity, and are sealed in the bulb shell (3), and the total The drive voltage is close to the external drive voltage.
  • one side of the LED blue chip needs to be coated with a phosphor layer to convert part of the blue light into white light, and the light powder layer is mixed and mixed by a commercial YAG:Ce phosphor and an LED package special epoxy resin by a mature scheme.
  • the epoxy resin and phosphor powders accounted for 88.2% and 11.8% of the mass, and can be used after being uniformly defoamed by stirring; while the YAG fluorescent multiphase polycrystalline substrate on the luminescent strip (1) is not coated with one side of the LED blue chip. Cover the phosphor layer.
  • Driving power supply (2) The light-emitting light bar (1) operates in one-way DC, and adopts a step-down current limiting circuit and a filter circuit scheme composed of a capacitor and a resistor.
  • the glass bulb (3) has light transmissivity and is a retro gold R-shaped bubble shell.
  • the glass support stem (4) is a high light transmissive colorless glass column for supporting the light strip.
  • the electrical connector (5) is a GY active bulb connected to the standard lamp head hardware.
  • the resulting LED bulb has a luminous efficiency of 145 lm/W, a color rendering index of 87, and a color temperature of 4500.

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Abstract

一种LED芯片发光灯条基板材料及LED球泡灯，其中LED球泡灯由发光条(1)、驱动电源(2)、玻璃球泡壳(3)、玻璃支架芯柱(4)和电连接器(5)组成；其中玻璃球泡壳(3)与支架芯柱(4)真空密封成腔体后充入高导热气体，支架芯柱(4)和固定其上的发光条(1)容纳在密封腔体中；发光条(1)与驱动电源(2)及电连接器(5)依次电连接；LED芯片的发光条(1)由YAG:Ce原料粉体与氮化物红色荧光粉体烧制成基板材料(6)的一个面上包含LED蓝光芯片(9)组成，蓝光芯片(9)表面涂覆荧光粉层(7)。

Description

一种LED芯片发光灯条基板材料及LED球泡灯 技术领域
本发明涉及了一种LED芯片发光灯条基板材料及制备方法和LED球泡灯，尤其是用以YAG荧光复相多晶体取代现用蓝宝石、氧化铝陶瓷等为发光灯条基板的技术方案，并详述了该多晶体灯条基板的制备方式，属于无机材料制备及其照明应用领域。
背景技术
白光LED作为一种固体照明技术已经逐步在日常照明、景观照明、汽车前灯、隧道照明等领域开始了其普遍应用，并展现出其极强的节能、环保、寿命长等优势。最近，在国家“禁用白炽灯”和节能减排双政策的推动下，LED灯丝灯作为一种能够360度全角度发光的立体光源改变了白光LED在民用照明领域的现状，其以白炽灯为原型配置，“传统的外型，升级的‘配方’”，人们看到它做成的LED灯具便能想明白它就是熟悉的照明灯具，一上市就被消费者所接受。随后以LED灯丝为光源的蜡烛灯、水晶灯、球泡灯开始大量出现。
通常，主流LED灯丝工艺通常是将28颗0.02W的LED芯片串联封装在长38mm、直径1.5mm的基板长条(或30mm×0.8mm×0.4mm)上，再进行模顶封荧光胶来实现。LED灯丝采用10mA电流驱动，电压为84V，功率为0.84W，光通量为100lm，光效可以达到120lm/W以上，如果搭配红色芯片，显色指数可以达到95以上。另外，LED灯丝具备的小电流高电压的特性，有效地降低了LED的发热和驱动器的成本，具有突出的优势。
然而，由于LED的发光来自PN结的发光，PN结出射的光子与PN结中电子注入所产生的能量差有约70％的电功率转变为热，如何将大量热量散发掉，避免因PN结温度升高导致发光效率恶化甚至“烧死”是所有功率型LED照明所面临的关键难题之一。针对LED灯丝灯，由于其芯片采用COB(Chip on Board)的封装形式，其基板面积过小，在芯片表面又封装有荧光胶，由此导致的散热不足和光衰是限制其长足发展的关键瓶颈。目前，LED灯丝灯采用罐冲惰性气体(如氮气、氮氩混合气等)或液体(乙二醇、油等)以热传导、对流或辐射的形式进 行散热，但在现实应用中与设计效果差别较大。因此如何有效地减少发热或快速导热是LED灯丝灯降低光衰、延长寿命、提高可靠性的保证。而LED灯丝灯的芯片均是安装在基板材料上，再与金属导热系统如铜、铝等相连进行散热。作为传热和导热的第一阶段，导热基板材质的选择是一种行之有效的方案。目前，灯丝灯主要的灯条基板材料主要有蓝宝石(单晶)、透明氧化铝(多晶)及半透明白陶瓷(99氧化铝或96氧化铝等)及其他材料。其中单晶蓝宝石具有最高的抗弯强度、导热系数、折射率和光透过率，保证了其作为基板材料的强度、散热和光学性能，但其价格十分昂贵，难以实用。半透明白陶瓷其较低的光透光率和散热系数又往往难以达到实用性能指标，尽管其价格成本大大降低。多晶透明氧化铝作为一种性能和价格适中的基板材料其制备过程对设备要求较高，对高端市场和低端市场各有不足，地位尴尬。
目前市场上2W以下的低端灯丝灯主要以玻璃基板为主，因为散热能承受，价格比较便宜，生产良率也比较高。高端产品则大多采用蓝宝石基板，陶瓷基板占据了中间的大部分市场份额。浙江锐迪生光电有限公司公布的系列专利(如PCT/CN2011/079234,WO2012/031533)中采用了透明基板如软玻璃、硬玻璃、石英玻璃、透明陶瓷或塑料等制成，提高了LED的发光效率。但是，以上采用的基板材料均只是起到基板固定芯片和相应的散热作用，相应的透明或半透明的属性为其提供了较高的光透过率和发光效率，在芯片表面仍需涂覆荧光粉层，在长时间工作下荧光粉混合硅胶或环氧树脂作为荧光体的老化及光衰，包括蓝光LED自身的光衰、荧光粉的温度猝灭和有机硅树脂老化等引起的光衰。中国科学院上海光学精密机械研究所公布的专利(201410161313.5)采用透明陶瓷(Ce:YAG(包括Ce离子浓度为零的情况)或Ce:Tb3Al5O12或Ce,Cr:YAG或Ce,Pr:YAG或“Ce:YAG+MgAl2O4”或“Ce,Pr:YAG+MgAl2O4”或“Ce,Cr:YAG+MgAl2O4”中的一种)为基板材料在起到基板作用的同时，还可以起到荧光材料的作用，可以有效解决LED灯丝灯的荧光粉光衰问题。然而，该技术方案中单纯YAG：Ce材料体系作为发射黄绿光的材料(MgAl2O4或未掺杂的YAG为透明陶瓷基体材料，并不发光)，尽管其可以Tb取代、Cr及Pr共掺杂增加光谱中的红光成分，但其增加效果有限，其显色性能及色温调控能力较差，在具体使用过程中仍然满足不了性能要求。
发明内容
本发明的目的是针对现有的问题而提出了一种LED芯片发光灯条基板材料，本发明的另一目的是提供上述基板材料的制备方法，本发明还有目的是提供利用上述的LED芯片发光灯条基板材料的LED球泡灯。
本发明的技术方案为：本发明提出一种新颖的LED球泡灯，其以YAG荧光复相多晶体取代现用蓝宝石、氧化铝陶瓷等为发光灯条基板，并详细涉及该多晶体灯条基板的制备方式，通过引入氮化物红粉增强红光发射，并添加烧结助剂、烧结改进剂来改善复相多晶体的烧结问题。再采用新颖环保的水基流延成型工艺实现高质量透明荧光多晶体基板材料的低成本制备。以此荧光多晶体为基板，蓝光芯片一面涂覆荧光粉层，另一面不涂覆荧光粉层，结合先进经济的散热气体组分设计，有效地解决了热问题，同时保证并提高了灯丝整体的发光品质。最终获得了高光效、高显色指数、高光学透过的荧光多晶体基板材料及色温一致性及散热好、可靠性高、寿命长的球泡灯。
本发明的具体技术方案如下：一种LED芯片发光灯条基板材料，其特征在于是由YAG:Ce原料粉体与氮化物红色荧光粉体按质量百分比为100：(1～5)混合后烧制的YAG荧光复相多晶体；其中YAG:Ce原料粉体满足化学计量比(Y1-xCex)3Al5O12，其中0.05％≤x≤1.0％；氮化物红色荧光粉体其发光峰值波长位于610～680nm的红光区域，其发光半峰宽为75～120nm，粒度为5～10μm，能被360～470nm波段内的蓝光高效激发。
优选上述的基板材料的尺寸为厚：宽：长比值为1：(1.5～3)：(50～200)，光学全透过率在600nm处为50％～70％。
本发明还提供了制备上述的LED芯片发光灯条基板材料的方法，其具体步骤为：
①配料及球磨：按(Y1-xCex)3Al5O12，0.05％≤x≤1.0％，化学计量比称量Y2O3、Al2O3和CeO2原料粉体、烧结助剂及氮化物荧光材料和烧结改性剂，加入去离子水作为溶剂，再加入分散剂，至球磨罐中，再加入球磨介质(一般为球磨罐体积的1/3～1/2)分散球磨；然后将粘结剂加入，一并加入塑化剂及除泡剂于球磨罐中；以同样转速继续球磨；其中所有原料粉体：溶剂去离子水：分散剂：粘结剂：塑化剂：除泡剂的质量比为(50～60):(20～30):(0.5～1.5):(15～25):(1～2): (0.5～1.0)；
②流延成型：将步骤①获得的浆料过筛，真空除泡；将浆料防止在流延机上进行流延；流延好的坯片进入干燥室干燥，最终得到厚度为0.4～1.2mm的流延坯片；
③温等及预切：将②所得到的坯片真空塑封后置于温等静压机中进行加压以提高致密度，温度60-80℃，压力为80～120Mpa，时间5～10min；在考虑收缩比的情况下进行预切裁剪，以免除后续成品多晶体的切割加工；
④排胶：将步骤③得到的坯片置于马弗炉中进行排胶，升温速度0.5～1℃/min，在500～800℃保温4～10h；
⑤烧结和退火：将排胶后的素坯在1730℃～1850℃真空烧结4～30h，接着置于空气中于1300℃～1550℃退火10～25h，即得致密YAG荧光复相透明多晶体，稍加外力分开即得到LED芯片发光灯条基板材料。
优选上述的Y2O3、Al2O3和CeO2的质量纯度均为99.9～99.99％；Y2O3和CeO2原料粒度均为0.5～2μm，Al2O3原料粒度为0.2～0.8μm；烧结助剂为分析纯的TEOS和分析纯的MgO，烧结助剂TEOS的添加量为Y2O3、Al2O3和CeO2原料粉体总质量的0.05～0.50％，烧结助剂MgO的添加量为Y2O3、Al2O3和CeO2原料粉体总质量的0.05～0.20％；烧结改性剂为分析纯CaO，烧结改性剂的添加量为Y2O3、Al2O3、CeO2和氮化物红色荧光粉体总质量的0.1～0.5％；所述的分散剂为聚丙烯酰胺；所述的粘结剂为质量浓度为10～15.0％的PVA水溶液；所述的塑化剂为聚乙二醇(PEG-400)；所述的除泡剂为聚丙二醇(P-1200)；所述的步骤①中球磨机的转速为80～150r/min，加入球磨机球磨分散时间为20～24h；继续球磨时间为20-24h；步骤②中过筛过80～200目筛；真空除泡的真空度为0.05～0.1MPa，除泡时间为5～8min；流延机的刀口高度为0.5mm～1.5mm，流延速度10～200mm/min；所述的干燥分为50～70、90～95和50～70℃三段式干燥。
优选基板材料6的一个面上包含1～3串PN结同向串联的发射波长为430～470nm的LED蓝光芯片9，芯片彼此间用电连接线连接，并在蓝光芯片9表面涂覆荧光粉层7将部分蓝光转变为白光(荧光粉层由采用成熟方案由商业YAG:Ce荧光粉与硅胶或环氧树脂混合搅拌制成，一般硅胶或环氧树脂占荧光粉层重量的85％～95％，经搅拌除泡均匀后即可使用)；基板材料没有LED蓝光芯 片的一面不涂覆荧光粉层；发光条的两端装配有电连接线10。LED芯片的发光条可以4π出光的。
本发明还提供了基于上述的LED芯片发光灯条为发光条的LED球泡灯，其特征在于由以LED芯片的发光条1、驱动电源2、玻璃球泡壳3、玻璃支架芯柱4和电连接器5组成；其中玻璃球泡壳3与支架芯柱4真空密封成腔体后充入高导热气体，支架芯柱4和固定其上的发光条1容纳在密封腔体中；发光条1与驱动电源2及电连接器5依次电连接；在点亮时，电连接器5再与外部电源电连接以给LED发光条供电。
优选上述能够4π出光的LED芯片发光条1的数量为1～10根，且每一根发光条1单面上LED蓝光芯片的数量需满足在所有发光条1串联或并联后，其总驱动电压等于外驱动电压，芯片彼此间用电连接线连接。
上述数量为1～10根能够4π出光的LED芯片发光条1可以相互串联或串并联，可以连接成双向交流或单向直流工作，其在空腔中相互间排布方式可以多样，均被密封在球泡壳内3内。
上述驱动电源2在发光灯条(1)双向交流工作时，分别至少1条LED发光条1正方向、反方向导通，在交流电正反交替时而分别导通发光；驱动电源2在发光灯条1单向直流工作时，直接用外部直流电源供电，或加入由电容、电阻构成的降压限流电路和滤波电路。
优选玻璃球泡壳3具有透光性，可以磨砂、加色，其形状为A或G型；所述的玻璃支架芯柱4为高透光无色玻璃柱，用于支撑发光灯条；电连接器5为E40或E27中的一种；玻璃球泡壳3与支架芯柱4真空密封成腔体后充入的高导热气体为氮气和氢气的混合气，其中氢气所占混合气体积比例为3.0～5.0％，室温(25℃)下总压力为0.01～0.1MPa。
本发明所制备的LED球泡灯的发光效率达130～180lm/W，显色指数在85～92。具有色温可调(2500～7000K)一致性好、散热好、可靠性高、寿命长、成本低等优点。
有益效果：
(1)本发明采用以YAG荧光复相多晶体取代现用蓝宝石、氧化铝陶瓷等为发光灯条基板，其既承担了基板作用的同时，还可以起到荧光材料的作用，有效 解决了光衰问题，增强了LED灯丝球泡灯的使用寿命和可靠性。
(2)本发明在LED灯丝灯灯条基板一侧涂覆荧光粉层，一侧不涂覆荧光粉层，在减少了荧光粉层的用量的同时保留了荧光粉层对灯具光色调控的灵活性，以方便地满足不同功率、不同品质光色的需求。
(3)本发明中YAG荧光复相多晶体采用水基流延成型工艺制备，环保节能，溶剂无污染，对操作人员无伤害。在规定的组分配方和工艺参数下，流延薄片厚度精确可控、微结构均匀，免于后续加工切割。
(4)本发明中YAG荧光复相多晶体以YAG:Ce原料粉料和氮化物红粉搭配来调控出灯丝球泡灯出光的显色指数和色温，其光效高，显色性能及色温一致性好。
(5)本发明中在YAG荧光复相多晶体的制备过程中添加的烧结助剂及适用于复相多晶体的烧结改性剂，有效地解决了两相复合多晶体界面相容性问题和高质量透明多晶体制备技术。
(6)本发明在采用荧光复相多晶体为灯条的基础上，通过改善球泡灯腔体内对流气体的种类和比例，结合多晶体条基板一侧没有涂覆荧光粉的自身优势，获得了较好的对流及热传导的散热效果。
(7)本发明制备的YAG荧光复相多晶体灯条原料便宜(所用主要原料稀土Y2O3的价格(99.99％,50-60元/Kg)甚至低于Al2O3(99.99％,100～120元/Kg))、工艺环保、成本低。
(8)本发明制备得到的YAG荧光复相多晶体其光学全透过率在600nm处为50％～70％，光学透过率与发光强度高，以此为灯丝基板设计的LED球泡灯其发光效率可达130～180lm/W，显色指数在85～92，色温可调(2500～7000K)一致性好。
附图说明
图1为本专利申请实施例1中以YAG荧光复相多晶体为发光灯条的LED球泡灯结构示意图；其中，1-以YAG荧光复相多晶体为基板、可以4π出光的LED芯片发光条；2-驱动电源；3-玻璃球泡壳；4-玻璃支架芯柱；5-电连接器。
图2为本专利申请实施例1中YAG荧光复相多晶体发光灯条剖面示意图； 其中，6-荧光多晶体基板；7-荧光粉层；8-串联接线；9-蓝光芯片；10-电连接线。
具体实施方式
下面结合具体实施例对本发明进行详细的阐述。这些实施例将有助于本领域的技术人员进一步理解本发明，但不以任何形式限制本发明的范围。此外应理解，在不脱离本发明构思的前提下，本领域的技术人员对本发明作各种改动或修改，这些都属于本发明的保护范围。
实施例1
(一)YAG荧光复相多晶体基板的制备：
①配料及球磨：按化学计量比称量Y2O3、Al2O3、CeO2原料粉体、烧结助剂及氮化物材料和烧结改性剂等所有粉体，加入去离子水作为溶剂，再加入聚丙烯酰胺为分散剂，至球磨罐中，再加入1/3体积的球磨介质；在150r/min的速度下分散球磨22h；将预先配置的15.0wt％PVA水溶液作为粘结剂加入，一并加入塑化剂聚乙二醇(PEG-400)及除泡剂聚丙二醇P-1200于球磨罐中；继续以同样转速球磨24h；其中，所有原料粉体(Y2O3、Al2O3和CeO2)：溶剂去离子水：分散剂聚丙烯酰胺：粘结剂PVA水溶液：塑化剂PEG：除泡剂聚丙二醇的质量比为50:25:1.5:20:1:0.5。
其中，所用YAG:Ce原料粉体，由满足化学计量比(Y1-xCex)3Al5O12的原料组成，其中x＝1.0％；包括高纯Y2O3、Al2O3、CeO2(纯度均为99.9～99.99％)及烧结助剂正硅酸乙酯(TEOS)与MgO。其中，Y2O3、CeO2原料粒度为0.5μm、1.0μm，Al2O3原料粒度为0.2μm；烧结助剂TEOS与MgO均选用分析纯以上，其添加量分别为Y2O3、Al2O3、CeO2原料粉体总质量的0.05wt.％、0.10wt.％。
其中，所用氮化物荧光材料为商用Sr2Si5N8:Eu2+红色荧光粉，其发光峰值波长位于640nm红光区域，其发光半峰宽为104nm，粒度为5μm，激发范围为360～470nm，中心激发波长455nm。
其中，YAG:Ce原料粉体与氮化物荧光材料的质量百分比为100：5；添加用于改善复相多晶体性能的烧结改性剂分析纯CaO为所有粉料(Y2O3、Al2O3、CeO2和氮化物荧光材料)添加量的0.5wt.％。
②流延成型：将步骤①获得的浆料过筛80目筛，再在0.08MPa真空度下除 泡6min。将浆料防止在流延机上进行流延，刀口高度为0.5mm，流延速度10mm/min；流延好的坯片进入干燥室干燥，干燥温度分为三段式，分别为50、90、70℃，最终得到厚度为0.4mm的流延坯片。
③温等及预切：将②所得到的坯片真空塑封后置于温等静压机中进行加压以提高致密度，温度60℃，压力为120Mpa，时间5min，并在预切机上预切。
④排胶：将步骤③得到的坯片置于马弗炉中进行排胶，升温速度0.5℃/min，在600℃保温8h。
⑤烧结和退火：将排胶后素坯在1730℃真空烧结30h，接着置于空气中于1400℃退火20h，即得致密YAG荧光复相透明多晶体，稍加外力分开即可得到发光灯条(1)的基板材料。
(二)步骤(一)得到的YAG荧光复相多晶体尺寸中厚：宽：长比值为1：2：50，光学全透过率测试在600nm处为70％，SEM表明其显微结构均匀。
(三)发光灯条的制备及连接：能够4π出光的LED芯片发光条(1)的数量为2根，且每一根发光条(1)单面上包含2串PN结同向串联的LED蓝光芯片(发射波长455nm)，所有发光条(1)串联，连接成双向交流，其在空腔中相互间排布方式见图1，均被密封在球泡壳内(3)内，其总驱动电压接近外驱动电压。
在发光条(1)上有LED蓝光芯片的一面需要涂覆荧光粉层将部分蓝光转变为白光，光粉层由采用成熟方案由商业YAG:Ce荧光粉与LED封装专硅胶混合搅拌制成，硅胶、荧光粉质量占比为86.3％、13.7％，经搅拌除泡均匀后即可使用；而发光条(1)上YAG荧光复相多晶体基板没有LED蓝光芯片一面不涂覆荧光粉层，剖面示意图见图2。
(四)驱动电源(2)：发光灯条(1)双向交流工作，1条LED发光条(1)正方向、1条反方向导通，在交流电正反交替时而分别导通发光
(五)玻璃球泡壳(3)具有透光性，为无色透明A型灯泡泡壳。玻璃支架芯柱(4)为高透光无色玻璃柱，用于支撑发光灯条。电连接器(5)为E40现用灯泡连接标准灯头五金件。
(六)分别获得的发光条(1)、驱动电源(2)、玻璃球泡壳(3)、玻璃支架芯柱(4)和电连接器(5)彼此连接；其中玻璃球泡壳(3)与支架芯柱(4)真空密封成腔体后充入高导热氮气和氢气的混合气，室温下总压力为0.1MPa，氢气所占体积比例为 3.5％。支架芯柱(4)和固定其上的发光条(1)容纳在密封腔体中；发光条(1)与驱动电源(2)及电连接器(5)依次电连接；在点亮时，电连接器(5)再与外部电源电连接以给LED发光条供电。
最终制得的LED球泡灯示意图为图1，其发光效率可达180lm/W，显色指数在92，色温2500。
实施例2
(一)YAG荧光复相多晶体基板的制备：
①配料及球磨：按化学计量比称量Y2O3、Al2O3、CeO2原料粉体、烧结助剂及氮化物材料和烧结改性剂等所有粉体，加入去离子水作为溶剂，再加入聚丙烯酰胺为分散剂，至球磨罐中，再加入1/2体积的球磨介质；在80r/min的速度下分散球磨24h；将预先配置的10.0wt％PVA水溶液作为粘结剂加入，一并加入塑化剂聚乙二醇(PEG-400)及除泡剂聚丙二醇P-1200于球磨罐中；继续以同样转速球磨20h；其中，所有原料粉体：溶剂去离子水：分散剂聚丙烯酰胺：粘结剂PVA水溶液：塑化剂PEG：除泡剂聚丙二醇的质量比为60:20:0.5:15:1.5:1.0。
其中，所用YAG:Ce原料粉体，由满足化学计量比(Y1-xCex)3Al5O12的原料组成，其中x＝0.05％；包括高纯Y2O3、Al2O3、CeO2(纯度均为99.9～99.99％)及烧结助剂正硅酸乙酯(TEOS)与MgO。其中，Y2O3、CeO2原料粒度为2μm、0.5μm，Al2O3原料粒度为0.8μm；烧结助剂TEOS与MgO均选用分析纯以上，其添加量分别为Y2O3、Al2O3、CeO2原料粉体总质量的0.5wt.％、0.05wt.％。
其中，所用氮化物荧光材料为商用Ca2Si5N8:Eu2+红色荧光粉，其发光峰值波长位于610nm红光区域，其发光半峰宽120nm，粒度为10μm，激发范围为360～470nm，中心激发波长460nm。
其中，YAG:Ce原料粉体与氮化物荧光材料的质量百分比为100：3；添加用于改善复相多晶体性能的烧结改性剂分析纯CaO为所有粉料添加量的0.2wt.％。
②流延成型：将步骤①获得的浆料过筛200目筛，再在0.10MPa真空度下除泡8min。将浆料防止在流延机上进行流延，刀口高度为1.5mm，流延速度200mm/min；流延好的坯片进入干燥室干燥，干燥温度分为三段式，分别为70、95、60℃，最终得到厚度为1.2mm的流延坯片。
③温等及预切：将②所得到的坯片真空塑封后置于温等静压机中进行加压以提高致密度，温度80℃，压力为80Mpa，时间10min，并在预切机上预切。
④排胶：将步骤③得到的坯片置于马弗炉中进行排胶，升温速度1.0℃/min，在500℃保温10h。
⑤烧结和退火：将排胶后素坯在1800℃真空烧结20h，接着置于空气中于1300℃退火25h，即得致密YAG荧光复相透明多晶体，稍加外力分开即可得到发光灯条(1)的基板材料。
(二)步骤(一)得到的YAG荧光复相多晶体尺寸中厚：宽：长比值为1：1.5：100，光学全透过率测试在600nm处为50％，SEM表明其显微结构均匀。
(三)发光灯条的制备及连接：能够4π出光的LED芯片发光条(1)的数量为1根，且发光条(1)单面上包含3串PN结同向串联的LED蓝光芯片(发射波长430nm)，被密封在球泡壳内(3)内，其总驱动电压接近外驱动电压。
在发光条(1)上有LED蓝光芯片的一面需要涂覆荧光粉层将部分蓝光转变为白光，光粉层由采用成熟方案由商业YAG:Ce荧光粉与LED封装专硅胶混合搅拌制成，硅胶、荧光粉质量占比为92.8％、7.2％，经搅拌除泡均匀后即可使用；而发光条(1)上YAG荧光复相多晶体基板没有LED蓝光芯片的一面不涂覆荧光粉层。
(四)驱动电源(2)：发光灯条(1)单向直流工作，直接用外部直流电源供电，
(五)玻璃球泡壳(3)具有透光性，为磨砂半透明G型灯泡泡壳。玻璃支架芯柱(4)为高透光无色玻璃柱，用于支撑发光灯条。电连接器(5)为E27现用灯泡连接标准灯头五金件。
(六)分别获得的发光条(1)、驱动电源(2)、玻璃球泡壳(3)、玻璃支架芯柱(4)和电连接器(5)彼此连接；其中玻璃球泡壳(3)与支架芯柱(4)真空密封成腔体后充入高导热氮气和氢气的混合气，室温下总压力为0.01MPa，氢气所占体积比例为3.0％。支架芯柱(4)和固定其上的发光条(1)容纳在密封腔体中；发光条(1)与驱动电源(2)及电连接器(5)依次电连接；在点亮时，电连接器(5)再与外部电源电连接以给LED发光条供电。
最终制得的LED球泡灯发光效率130lm/W，显色指数在85，色温7000K。
实施例3
(一)YAG荧光复相多晶体基板的制备：
①配料及球磨：按化学计量比称量Y2O3、Al2O3、CeO2原料粉体、烧结助剂及氮化物材料和烧结改性剂等所有粉体，加入去离子水作为溶剂，再加入聚丙烯酰胺为分散剂，至球磨罐中，再加入2/5体积的球磨介质；在120r/min的速度下分散球磨20h；将预先配置的12.0wt％PVA水溶液作为粘结剂加入，一并加入塑化剂聚乙二醇(PEG-400)及除泡剂聚丙二醇P-1200于球磨罐中；继续以同样转速球磨22h；其中，所有原料粉体：溶剂去离子水：分散剂聚丙烯酰胺：粘结剂PVA水溶液：塑化剂PEG：除泡剂聚丙二醇的质量比为55:30:1.0:25:2:0.8。
其中，所用YAG:Ce原料粉体，由满足化学计量比(Y1-xCex)3Al5O12的原料组成，其中x＝0.5％；包括高纯Y2O3、Al2O3、CeO2(纯度均为99.9～99.99％)及烧结助剂正硅酸乙酯(TEOS)与MgO。其中，Y2O3、CeO2原料粒度为1.0μm、1.5μm，Al2O3原料粒度为0.5μm；烧结助剂TEOS与MgO均选用分析纯以上，其添加量分别为Y2O3、Al2O3、CeO2原料粉体总质量的0.2wt.％、0.2wt.％。
其中，所用氮化物荧光材料为商用CaAlSiN3:Eu2+红色荧光粉，其发光峰值波长位于680nm红光区域，其发光半峰宽为75nm，粒度为8μm，激发范围为360～470nm，中心激发波长460nm。
其中，YAG:Ce原料粉体与氮化物荧光材料的质量百分比为100：1；添加用于改善复相多晶体性能的烧结改性剂分析纯CaO为所有粉料添加量的0.1wt.％。
②流延成型：将步骤①获得的浆料过筛150目筛，再在0.05MPa真空度下除泡5min。将浆料防止在流延机上进行流延，刀口高度为1.0mm，流延速度100mm/min；流延好的坯片进入干燥室干燥，干燥温度分为三段式，分别为60、92、50℃，最终得到厚度为0.8mm的流延坯片。
③温等及预切：将②所得到的坯片真空塑封后置于温等静压机中进行加压以提高致密度，温度70℃，压力为100Mpa，时间8min，并在预切机上预切。
④排胶：将步骤③得到的坯片置于马弗炉中进行排胶，升温速度0.67℃/min，在800℃保温4h。
⑤烧结和退火：将排胶后素坯在1850℃真空烧结4h，接着置于空气中于1550℃退火10h，即得致密YAG荧光复相透明多晶体，稍加外力分开即可得到 发光灯条(1)的基板材料。
(二)步骤(一)得到的YAG荧光复相多晶体尺寸中厚：宽：长比值为1：3：200，光学全透过率测试在600nm处为62％，SEM表明其显微结构均匀。
(三)发光灯条的制备及连接：能够4π出光的LED芯片发光条(1)的数量为10根，且每一根发光条(1)单面上包含1串PN结同向串联的LED蓝光芯片(发射波长470nm)，其中各5条发光条(1)串联后，两者并联，其在空腔中相互间棱柱状排列，均被密封在球泡壳内(3)内，其总驱动电压接近外驱动电压。
在发光条(1)上有LED蓝光芯片的一面需要涂覆荧光粉层将部分蓝光转变为白光，光粉层由采用成熟方案由商业YAG:Ce荧光粉与LED封装专环氧树脂混合搅拌制成，环氧树脂、荧光粉质量占比为88.2％、11.8％，经搅拌除泡均匀后即可使用；而发光条(1)上YAG荧光复相多晶体基板没有LED蓝光芯片的一面不涂覆荧光粉层。
(四)驱动电源(2)：发光灯条(1)单向直流工作，采用由电容、电阻构成的降压限流电路和滤波电路方案。
(五)玻璃球泡壳(3)具有透光性，为复古金色R型灯泡泡壳。玻璃支架芯柱(4)为高透光无色玻璃柱，用于支撑发光灯条。电连接器(5)为GY现用灯泡连接标准灯头五金件。
(六)分别获得的发光条(1)、驱动电源(2)、玻璃球泡壳(3)、玻璃支架芯柱(4)和电连接器(5)彼此连接；其中玻璃球泡壳(3)与支架芯柱(4)真空密封成腔体后充入高导热氮气和氢气的混合气，室温下总压力为0.05MPa，氢气所占体积比例为5.0％。支架芯柱(4)和固定其上的发光条(1)容纳在密封腔体中；发光条(1)与驱动电源(2)及电连接器(5)依次电连接；在点亮时，电连接器(5)再与外部电源电连接以给LED发光条供电。
最终制得的LED球泡灯发光效率可达145lm/W，显色指数在87，色温4500。

Claims (10)

  1. 一种LED芯片发光灯条基板材料，其特征在于是由YAG:Ce原料粉体与氮化物红色荧光粉体按质量百分比为100：(1～5)混合后烧制的YAG荧光复相多晶体；其中YAG:Ce原料粉体满足化学计量比(Y1-xCex)3Al5O12，其中0.05％≤x≤1.0％；氮化物红色荧光粉体其发光峰值波长位于610～680nm的红光区域，其发光半峰宽为75～120nm，粒度为5～10μm，能被360～470nm波段内的蓝光高效激发。
  2. 按权利要求1所述的LED芯片发光灯条基板材料，其特征在于基板材料的尺寸为厚：宽：长比值为1：(1.5～3)：(50～200)，光学全透过率在600nm处为50％～70％。
  3. 一种制备如权利要求1所述的LED芯片发光灯条基板材料的方法，其具体步骤为：
    ①配料及球磨：按(Y1-xCex)3Al5O12，0.05％≤x≤1.0％，化学计量比称量Y2O3、Al2O3和CeO2原料粉体、烧结助剂及氮化物荧光材料和烧结改性剂，加入去离子水作为溶剂，再加入分散剂，至球磨罐中，再加入球磨介质分散球磨；然后将粘结剂加入，再一并加入塑化剂及除泡剂于球磨罐中；以同样转速继续球磨；其中所有原料粉体：溶剂去离子水：分散剂：粘结剂：塑化剂：除泡剂的质量比为(50～60):(20～30):(0.5～1.5):(15～25):(1～2):(0.5～1.0)；
    ②流延成型：将步骤①获得的浆料过筛，真空除泡；将浆料防止在流延机上进行流延；流延好的坯片进入干燥室干燥，最终得到厚度为0.4～1.2mm的流延坯片；
    ③温等及预切：将②所得到的坯片真空塑封后置于温等静压机中进行加压以提高致密度，温度60-80℃，压力为80～120Mpa，时间5～10min；在考虑收缩比的情况下进行预切裁剪，以免除后续成品多晶体的切割加工；
    ④排胶：将步骤③得到的坯片置于马弗炉中进行排胶，升温速度0.5～1℃/min，在500～800℃保温4～10h；
    ⑤烧结和退火：将排胶后的素坯在1730℃～1850℃真空烧结4～30h，接着置于空气中于1300℃～1550℃退火10～25h，即得致密YAG荧光复相透明多晶体，稍加外力分开即得到LED芯片发光灯条基板材料。
  4. 按权利要求3所述的方法，其特征在于所述的Y2O3、Al2O3和CeO2的质 量纯度均为99.9～99.99％；Y2O3和CeO2原料粒度均为0.5～2μm，Al2O3原料粒度为0.2～0.8μm；烧结助剂为分析纯的TEOS和分析纯的MgO，烧结助剂TEOS的添加量为Y2O3、Al2O3和CeO2原料粉体总质量的0.05～0.50％，烧结助剂MgO的添加量为Y2O3、Al2O3和CeO2原料粉体总质量的0.05～0.20％；烧结改性剂为分析纯CaO，烧结改性剂的添加量为Y2O3、Al2O3、CeO2和氮化物红色荧光粉体总质量的0.1～0.5％；所述的分散剂为聚丙烯酰胺；所述的粘结剂为质量浓度为10～15.0％的PVA水溶液；所述的塑化剂为聚乙二醇；所述的除泡剂为聚丙二醇；所述的步骤①中球磨机的转速为80～150r/min，加入球磨机球磨分散时间为20～24h；继续球磨时间为20-24h；步骤②中过筛过80～200目筛；真空除泡的真空度为0.05～0.1MPa，除泡时间为5～8min；流延机的刀口高度为0.5mm～1.5mm，流延速度10～200mm/min；所述的干燥分为50～70、90～95和50～70℃三段式干燥。
  5. 一种以权利要求1所述的YAG荧光复相多晶体材料为基板的LED芯片发光条，其特征在于基板材料(6)的一个面上包含1～3串PN结同向串联的发射波长为430～470nm的LED蓝光芯片(9)，芯片彼此间用电连接线(10)连接，并在蓝光芯片(9)表面涂覆荧光粉层(7)将部分蓝光转变为白光；基板材料没有LED蓝光芯片的一面不涂覆荧光粉层；发光条的两端装配有电连接线。
  6. 一种以权利要求5所述的LED芯片发光灯条为发光条的LED球泡灯，其特征在于由以LED芯片的发光条(1)、驱动电源(2)、玻璃球泡壳(3)、玻璃支架芯柱(4)和电连接器(5)组成；其中玻璃球泡壳(3)与支架芯柱(4)真空密封成腔体后充入高导热气体，支架芯柱(4)和固定其上的发光条(1)容纳在密封腔体中；发光条(1)与驱动电源(2)及电连接器(5)依次电连接；在点亮时，电连接器(5)再与外部电源电连接以给LED发光条供电。
  7. 按权利要求6所述的LED球泡灯，其特征在于：LED芯片发光条(1)的数量为1～10根，且每一根发光条(1)单面上LED蓝光芯片的数量需满足在所有发光条(1)串联或并联后，其总驱动电压等于外驱动电压，芯片彼此间用电连接线连接。
  8. 按权利要求6所述的LED球泡灯，其特征在于：驱动电源(2)在发光灯条(1)双向交流工作时，分别至少1条LED发光条(1)正方向、反方向导通，在交 流电正反交替时而分别导通发光；驱动电源(2)在发光灯条(1)单向直流工作时，直接用外部直流电源供电，或加入由电容、电阻构成的降压限流电路和滤波电路。
  9. 按权利要求6所述的LED球泡灯，其特征在于：玻璃球泡壳(3)的形状为A或G型；所述的玻璃支架芯柱(4)为高透光无色玻璃柱，用于支撑发光灯条；电连接器(5)为E40或E27中的一种；玻璃球泡壳(3)与支架芯柱(4)真空密封成腔体后充入的高导热气体为氮气和氢气的混合气，其中氢气所占混合气体积比例为3.0～5.0％，室温下总压力为0.01～0.1MPa。
  10. 按权利要求6所述的LED球泡灯，其特征在于：LED球泡灯的发光效率达130～180lm/W，显色指数在85～92。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108253320A (zh) * 2018-03-07 2018-07-06 佛山电器照明股份有限公司 基于一体化芯柱的led灯泡
CN114538774A (zh) * 2022-03-08 2022-05-27 浙江大学 高浓度掺杂荧光粉的玻璃陶瓷及其制备方法和应用

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106678730A (zh) * 2017-03-03 2017-05-17 四川鋈新能源科技有限公司 色温可调的led灯丝及led灯泡
CN108730790A (zh) * 2017-04-19 2018-11-02 大连利德照明研发中心有限公司 荧光粉转换型植物生长用灯丝灯
CN109838763B (zh) * 2017-09-13 2021-04-30 深圳光峰科技股份有限公司 一种波长转换装置及其制备方法
CN107473729A (zh) * 2017-09-18 2017-12-15 重庆文理学院 一种半透明yag荧光陶瓷薄片制备方法
CN107940269B (zh) * 2017-10-27 2020-10-30 厦门阳光恩耐照明有限公司 一种球泡灯光源成型工艺
CN108019632A (zh) * 2017-12-29 2018-05-11 深圳市丰功文化传播有限公司 一种具有红外辐射散热的led灯丝灯及其led发光条
CN109107050A (zh) * 2018-09-17 2019-01-01 深圳市名家汇科技股份有限公司 Led红光脸部理疗带及其控制方法
CN108997014A (zh) * 2018-09-28 2018-12-14 成都东骏激光股份有限公司 一种高显色荧光陶瓷及其制备方法与应用
CN112573903B (zh) * 2019-09-30 2022-08-26 国网河南省电力公司桐柏县供电公司 一种氧化铝复合基板材料及其制备方法
CN111517804B (zh) * 2020-04-27 2021-08-31 中国科学院上海硅酸盐研究所 一种氮化物红色复相荧光陶瓷及其制备方法
CN113501715B (zh) * 2021-06-29 2022-07-08 南通大学 一种基于改性荧光粉的荧光陶瓷的制备方法
CN114409394B (zh) * 2022-01-17 2023-03-17 江苏师范大学 一种大尺寸yag透明陶瓷薄片的制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020047516A1 (en) * 2000-10-24 2002-04-25 Tadanobu Iwasa Fluorescent tube
CN102060540A (zh) * 2009-11-16 2011-05-18 中国科学院福建物质结构研究所 利用不同成型方式制备Re:YAG多晶透明陶瓷的方法
CN102718492A (zh) * 2012-05-21 2012-10-10 苏州晶品光电科技有限公司 一种led用透明陶瓷荧光基板的制备方法
US20130088143A1 (en) * 2010-03-31 2013-04-11 Ube Industries, Ltd. Ceramic composite for light conversion, process for production thereof, and light-emitting devices provided with same
CN103058633A (zh) * 2011-10-18 2013-04-24 中国科学院福建物质结构研究所 一种yag复合透明激光陶瓷的方法
CN103594607A (zh) * 2012-08-13 2014-02-19 松下电器产业株式会社 照明装置
CN204313079U (zh) * 2015-01-05 2015-05-06 武汉和光照明科技有限公司 一种led球泡灯

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020047516A1 (en) * 2000-10-24 2002-04-25 Tadanobu Iwasa Fluorescent tube
CN102060540A (zh) * 2009-11-16 2011-05-18 中国科学院福建物质结构研究所 利用不同成型方式制备Re:YAG多晶透明陶瓷的方法
US20130088143A1 (en) * 2010-03-31 2013-04-11 Ube Industries, Ltd. Ceramic composite for light conversion, process for production thereof, and light-emitting devices provided with same
CN103058633A (zh) * 2011-10-18 2013-04-24 中国科学院福建物质结构研究所 一种yag复合透明激光陶瓷的方法
CN102718492A (zh) * 2012-05-21 2012-10-10 苏州晶品光电科技有限公司 一种led用透明陶瓷荧光基板的制备方法
CN103594607A (zh) * 2012-08-13 2014-02-19 松下电器产业株式会社 照明装置
CN204313079U (zh) * 2015-01-05 2015-05-06 武汉和光照明科技有限公司 一种led球泡灯

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108253320A (zh) * 2018-03-07 2018-07-06 佛山电器照明股份有限公司 基于一体化芯柱的led灯泡
CN114538774A (zh) * 2022-03-08 2022-05-27 浙江大学 高浓度掺杂荧光粉的玻璃陶瓷及其制备方法和应用

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