CN112159209A - 高显指高热导荧光陶瓷、制备方法及在激光显示中的应用 - Google Patents
高显指高热导荧光陶瓷、制备方法及在激光显示中的应用 Download PDFInfo
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Abstract
本发明属于无机发光材料技术领域,公开了一种高显指高热导荧光陶瓷、制备方法及在激光显示或者高显指激光照明设备中应用,所述高显指高热导荧光陶瓷以Al2O3陶瓷基底、分布在Al2O3陶瓷基底中的石榴石基荧光粉或青光、绿光、黄光、红光荧光粉以及助熔剂组成。所述高显指高热导荧光陶瓷的制备方法包括:放电等离子烧结(SPS),或者是真空高温烧结,或者是热等静压烧结。本发明高显指高热导荧光陶瓷的热导率为10‑30W·m‑1K‑1,激发源为蓝光激光二极管产生的蓝光,或者是紫外光激光二极管产生的紫外光,发射峰为宽带发射,发射波长可调(480–750nm),显指为75‑95。
Description
技术领域在
本发明属于无机发光材料技术领域,尤其涉及一种高显指高热导荧光陶瓷、制备方法及在激光显示或者高显指激光照明设备中应用。
背景技术
如今较为热门的激光投影仪与激光电视,均采用激光显示技术。相比传统液晶等显示技术,激光显示具有色域空间大、色彩丰富、色饱和度高、寿命长、低能耗等特点。目前激光显示中的光源部分主要由蓝、绿、黄三种颜色光组成,可利用蓝光、绿光、红光激光二极管组成三原色,即三基色纯激光光源(RGB),该方案色纯度高、色域广,但由于绿光和红光激光二极管成本高,且对散热要求更高,使得该方案在实际应用中难以大规模采用。目前该领域主要使用的是能将蓝光转换为具有黄绿红复合光的Ce3+离子掺杂Y3Al5O12(简称YAG:Ce)钇铝石榴石荧光玻璃作为绿色光与红色光的光源,即激光荧光粉显示技术(ALPD)。但由于荧光玻璃热导率低,不能承受较大功率的蓝光激光照射,故将荧光玻璃设计为环形,与其他相关部件封装形成为荧光色轮。在使用过程中,荧光色轮高速运转,且配备有风扇进行散热,这样的结构使得荧光玻璃能够满足激光显示器件的要求。但这种结构尺寸较大,能耗也较大,性价比也不够高,且红光部分依旧不足。
而在照明领域中,目前主流的白光LED是利用发射出460nm的蓝光LED芯片作为光源,激发稀土铈离子Ce3+掺杂的Y3Al5O12(简称YAG:Ce)钇铝石榴石荧光粉或者陶瓷,利用YAG:Ce荧光材料将部分蓝光转换成黄绿光,然后未被吸收、透过的蓝光与黄绿光复合形成白光。然而,传统的白光LED中荧光材料多采用YAG:Ce荧光粉加树脂或硅胶的传统封装方式,而LED芯片所产生的热量也是非常大,封装材料在高温下易老化且热导率较低(硅胶和环氧树脂热导率仅为0.4W/m·K),使得白光LED色温产生变化,发光效率下降,甚至老化失效。此外,这种封装方式更不适用于大功率白光LED显示、大功率高显指LED照明、或者激光显示与高显指激光照明中。YAG:Ce透明陶瓷具有可调节的掺杂浓度和透明度,优异的热导率(热导率为14W/m·K)和高的发光效率,且容易实现掺杂离子分散均匀,工艺技术成熟可控,再加上制备成本与难度均低于YAG单晶,使其在大功率白光LED显示、大功率LED照明、或者激光显示与激光照明设备受到广泛关注。但是由于YAG:Ce荧光透明陶瓷本身的一些缺陷,导致现有技术存在的问题及缺陷为:
(1)YAG:Ce荧光透明陶瓷本身具有较高透过率(可见光部分>70%),导致LED芯片或者蓝光激光芯片所发出的大部分蓝光会完全穿透YAG:Ce荧光透明陶瓷(漏蓝现象),不能完全激发YAG:Ce荧光材料,导致最终形成的光束显指低、光效低,还有严重的漏蓝现象,使得光颜色分布不均,对人体产生较大的伤害。
(2)此外,YAG:Ce荧光透明陶瓷的热导率不能继续提升,YAG基质本身热导率限制该荧光透明陶瓷的热导率最大值为14W/m·K,导致该YAG:Ce荧光透明陶瓷的热导率不能够满足已有的大功率白光LED显示、大功率高显指LED照明、或者激光显示与高显指激光照明器件的使用,也同时严重限制了其在激光照明设备的应用。
(3)YAG:Ce荧光透明陶瓷对制备工艺要求高,良品率较低,不同批次荧光透明陶瓷保持相同光学性能较难;且制备过程中会长时间球磨,容易引入杂相,使得荧光透明陶瓷透过率也难以控制。
(4)由于YAG:Ce荧光透明陶瓷的红光发射部分比例较低,使得透明陶瓷的显色指数较低,基本不会超过68。故在激光显示与高显指激光照明中的使用受到限制。
解决以上问题及缺陷的难度为:为了解决上述问题,提高YAG:Ce荧光陶瓷的显色指数、热导率、以及降低漏蓝现象,其中一种方法就是在YAG:Ce荧光透明陶瓷制备过程中引入一定程度尺寸和分布的微孔,利用这些微孔对蓝光激光芯片产生的大部分蓝光进行散射,解决了部分漏蓝现象,发射出的光分布较为均匀。但微孔导致YAG:Ce荧光透明陶瓷的热导率大幅下降,不能承受高功率激光激发,且此时器件发光效率会降低。此外,为了提高陶瓷显色指数,可以在YAG:Ce透明陶瓷制备时共掺杂Pr3+、Cr3+、Eu3+等离子,来提高其在红光部分的发射,其显色指数会有一定的提升,但这也会造成透明陶瓷的热导率严重下降,热猝灭严重,不利于其在高功率激光照明与显示器件中的应用。
解决以上问题及缺陷的意义为:经上述分析,通过采用新型的荧光陶瓷设计方案,在YAG:Ce荧光透明陶瓷的基础上加入过量Al2O3,形成YAG:Ce-Al2O3复合荧光陶瓷,并且,进一步通过改变YAG:Ce(Y3Al5O12:Ce3+)中元素构成为(YxLuyGdz)3(AlmGanMgpSiq)5O12:Ce3+,Eu3 +,Pr3+,Cr3+,Dy3+,可实现荧光材料不同波长的发射,提高红光发光部分与显色指数;此外,采用将青光、绿光、黄光、红光荧光粉与Al2O3复合,烧结形成荧光陶瓷,可实现兼顾高显指、高热导、高光效、无漏蓝等问题,可以使该高显指高热导荧光陶瓷在大功率白光高显指激光照明或者激光显示中获得广泛应用。
发明内容
针对现有技术存在的问题,本发明提供了一种高显指高热导荧光陶瓷、制备方法及在激光显示或者高显指激光照明设备中应用。
本发明是这样实现的,一种高显指高热导荧光陶瓷,所述高显指高热导荧光陶瓷以Al2O3陶瓷基底、分布在Al2O3陶瓷基底中的石榴石基荧光粉或青光、绿光、黄光、红光荧光粉以及助熔剂组成。
进一步,所述石榴石基荧光粉为(YxLuyGdz)3(AlmGanMgpSiq)5O12:Ce3+,Eu3+,Pr3+,Cr3 +,Dy3+。其中Ce3+含量为0~20at.%,Eu3+含量为0~20at.%,Pr3+含量为-0~20at.%,Cr3+含量为0~20at.%,Dy3+含量为0~20at.%;x+y+z=1,且0≤x,y,z≤1;m+n+p+q=1,且0≤m,n,p,q≤1;所述青光荧光粉(C)为:(Ba1-xSrx)Si2O2N2:Eu2+,或(Ba5-ySry)(PO4)3Cl:Eu2+;其中Eu2+含量为0.01~20at%;0<x<1或0<y<1;在蓝光/紫外光激光二极管的激发下,青光荧光粉发射波长峰值在490-500nm;所述绿光荧光粉(G)为Y3Al5-mGamO12:Ce3+或Lu3Al5O12:Ce3+,其中0<m<5,Ce3+含量均为0.01~50at%;在蓝光/紫外光激光二极管的激发下,绿光荧光粉发射波长峰值在530-540nm;所述黄光荧光粉(Y)为Y3Al5O12:Ce3+,其中Ce3+含量为0.01~50at%;在蓝光/紫外光激光二极管的激发下,黄光荧光粉发射波长峰值在545-565nm;所述红光荧光粉(R)为:M2Si5N8:Eu2+(M=Ca,Sr,Ba),或CaAlSiN3:Eu2+,其中Eu2+含量为0.01~50at%;红光荧光粉发射波长峰值在610-670nm;使用时,各种青光、绿光、黄光、红光荧光粉比例为C:G:Y:R=a:b:c:d,其中0≤a≤1,0≤b≤1,0≤c≤1,0≤d≤1,且满足a+b+c+d=1。上述荧光粉在陶瓷中的总含量为2-98wt%,助熔剂AX,(A=Li,Na,K,X=F,Br,I);MgO、TEOS中的一种或几种,使用含量为0.01-10wt%。
本发明的另一目的在于提供一种所述高显指高热导荧光陶瓷的制备方法,所述高显指高热导荧光陶瓷的制备方法包括:放电等离子烧结(SPS),或者是真空高温烧结,或者是热等静压烧结。其制备好的荧光陶瓷结构如图1所示。
进一步,所述放电等离子烧结(SPS)工艺流程为:
①将上述荧光粉与Al2O3粉按一定比例混合;②将混合好的粉体放置进石墨模具中,压制为直径Ф=1~100mm的圆,高度为1-100mm;或边长为1~100mm的方形,高度为1-100mm;③将装有粉料的石墨模具放入SPS电炉中烧结,烧结温度为1000-2000℃,烧结压力为0-500MPa,烧结时间为0.01-1000小时,烧结气氛为真空(0-10-3Pa)、氮气、氢气等气氛;
进一步,所述真空高温烧结工艺流程为:
①将上述荧光粉与Al2O3粉按一定比例混合;②将混合好的粉体利用模具压制为直径Ф=1~100mm的圆,高度为1-100mm,并脱模;或边长为1~100mm的方形,高度为1-100mm,并脱模;压片时压力范围为100-300MPa;③将压制好的粉体块放入真空高温电炉中烧结,烧结温度为1000-2000℃,烧结气氛为真空,真空度为10-3-10-6Pa,烧结时间为1-1000小时;
进一步,所述热等静压烧结工艺流程为:
①将上述荧光粉与Al2O3粉按一定比例混合;②将混合好的粉体利用模具压制为直径Ф=1~100mm的圆,高度为1-100mm,并脱模;或边长为1~100mm的方形,高度为1-100mm,并脱模;压片时压力为100-300MPa;③将压制好的粉体块放入真高温电炉中预先烧结,烧结温度为1000-1500℃,时间为0.5-10小时;④将预先烧结后的陶瓷块放入热等静压炉专用模具中,并烧结;烧结温度为1000-2000℃,烧结压力为0-500MPa,烧结时间为0.01-1000小时。
本发明的另一目的在于提供一种激光电视机激光显示光源模块的封装方法,所述激光电视机激光显示光源模块的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm。并采用以下封装方式将切割后的陶瓷片与激光器进行封装:
(1)透过式封装:
1)将陶瓷片/陶瓷块切割为:①直径Ф=1~100mm的圆片或圆环,圆片或圆环的内径为Ф=0.5~100mm;②边长为1~100mm的方片;③其他各类形状;厚度均为0.08-10mm;
2)将切割好的陶瓷片/陶瓷块的其中一面用胶黏在镀有黄绿光反射与蓝光透过膜的蓝宝石片上;
3)陶瓷另一表面镀圆环形高反膜,圆环内径为Ф=0.5~100mm;4)将与蓝宝石相粘结后的陶瓷与蓝光/紫外光激光器按直线进行集成装配,如图2所示;
(2)反射式封装:
1)将陶瓷片/陶瓷块切割为:①直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;②边长为1~100mm的方片;③其他各类形状;厚度均为0.08-10mm;
2)将切割好的陶瓷片/陶瓷块的其中一面黏结在铜或铝片上;
3)将封装后的陶瓷与蓝光/紫外光激光器按V字形组装,如图3所示。
本发明的另一目的在于提供一种激光投影仪激光显示光源模块的封装方法,所述激光投影仪激光显示光源模块的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;其封装方式可采用透过式封装(图2)或反射式封装(图3)。
本发明的另一目的在于提供一种激光显示屏激光显示光源模块的封装方法,所述激光显示屏激光显示光源模块的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;其封装方式可采用透过式封装(图2)或反射式封装(图3)。
本发明的另一目的在于提供一种高显指激光照明灯具的封装方法,所述高显指激光照明灯具的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;其封装方式可采用透过式封装(图2)或反射式封装(图3),或者“Z”型封装:1)将陶瓷片/陶瓷块切割为:①直径Ф=1~100mm的圆片;或②边长为1~100mm的方片;或③其他各类形状;2)将切割好的陶瓷片其中一面黏结在如图4所示的铜或铝片基板上;铜或铝片基板外有具有高反光特征的反射镜外壳,并在反光镜一侧开有小孔,直径为0.5-5mm;蓝光/紫外光激光器所发射出的激光能从该小孔穿过并照射、激发荧光陶瓷,经反射镜聚光后,从另一侧发出光,如图4所示。
本发明的另一目的在于提供一种景观照明灯的封装方法,所述景观照明灯的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;可采用透过式封装、反射式封装以及“Z”型封装或其他封装方式,分别如图2、3、4所示。
本发明的另一目的在于提供一种射灯的封装方法,所述射灯的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;可采用透过式封装、反射式封装以及“Z”型封装或其他封装方式,分别如图2、图3、图4所示。
本发明的另一目的在于提供一种内窥镜灯的封装方法,所述内窥镜灯的封装方法使用所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm。激光二极管与光纤其中一端相连接,光纤长度为0.005-10000米,直径为0.1-2毫米;光纤另一端与高热导高显指荧光陶瓷可按透过式封装、反射式封装或“Z”型封装或其他封装方式进行封装;内窥镜灯式封装示意图如图5所示。
结合上述的所有技术方案,本发明所具备的优点及积极效果为:本发明热导率在10-30W·m-1K-1,激发源为蓝光或紫外光的激光,宽带发射,发射波长可调(480–750nm),显指为75-95,流明效率:>50lm/W。
附图说明
为了更清楚地说明本申请实施例的技术方案,下面将对本申请实施例中所需要使用的附图做简单的介绍,显而易见地,下面所描述的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的高显指高热导荧光陶瓷结构示意图。
图2是本发明实施例提供的激光显示光源模块的透过式封装示意图。
图3是本发明实施例提供的激光显示光源模块的反射式封装示意图。
图4是本发明实施例提供的“Z”型封装示意图。
图5是本发明实施例提供的内窥镜灯式封装示意图。
图6是本发明实施例提供的实施例1中YAG:Ce,Pr,Cr-Al2O3高显指高热导荧光陶瓷白光激光照明射灯性能示意图。
图7是本发明实施例提供的实施例2中YAG:Ce-Al2O3高显指高热导荧光陶瓷在透过式激光显示光源中测试结果图。
图8是本发明实施例提供的实施例3中YAG:Ce-Al2O3高显指高热导荧光陶瓷在反射式激光显示光源中测试结果图。
图9是本发明实施例提供的实施例4中荧光陶瓷SEM测试结果图。
图10是本发明实施例提供的实施例4中高显指高热导荧光陶瓷在暖白光激光照明中测试结果图。
图中:1、Al2O3基底;2、石榴石基荧光粉或其他各色荧光粉;3、激光二极管;4、高热导高显指荧光陶瓷;5、黄绿光与橙红光为主所形成的复合光;6、反射镜;7、光纤;8、复合光。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
针对现有技术存在的问题,本发明提供了一种高显指高热导荧光陶瓷、制备方法及封装设备中应用,下面结合附图对本发明作详细的描述。
实施例1:
高显指高热导荧光陶瓷的射灯在白光激光照明的应用(透过式)
(1)将发射峰在530、609、689、707nm左右的Y3Al5O12:Ce3+,Pr3+,Cr3+荧光粉与Al2O3按质量比1:3的比例混合均匀,并加入0.25wt%的MgO与0.25wt%TEOS,制备出混合原料粉体;
(2)利用真空烧结工艺,将粉体原料200MPa压片成型后,5℃/min的升温速度升至1750℃,保温5小时,得到烧制成功的荧光陶瓷;
(3)经过切割和抛光后,制备出厚度为0.13mm厚的荧光陶瓷片;
(4)将制备出的高显指高热导荧光陶瓷按透过式的封装方式与455nm蓝光激光二极管进行封装,组成白光激光照明射灯光源;
(5)对高显指高热导荧光陶瓷进行热导率测试,结果显示,其热导率为19.8W/(m.k)@25℃。
(6)对封装后的射灯器件进行激光照明光谱测试,其结果如图6所示;激光照明测试结果显示,其色温为6500K的白光,显色指数为86,光电转换效率为51lm/W。
实施例2:
高显指高热导荧光陶瓷的射灯在激光显示光源模块的应用(透过式)
(1)将发射峰在565nm的Y3Al5O12:Ce3+荧光粉与Al2O3按质量比1:3的比例混合均匀,并加入0.25wt%的MgO与0.25wt%TEOS,制备出混合原料粉体;
(2)利用真空烧结工艺,将粉体原料200MPa压片成型后,5℃/min的升温速度升至1750℃,保温5小时,得到烧制成功的荧光陶瓷;
(3)经过切割和抛光后,制备出厚度为0.25mm厚的荧光陶瓷片;
(4)将制备出的高显指高热导荧光陶瓷按透过式的封装方式分别与455nm蓝光激光二极管进行封装,组成激光显示光源模块;
(5)对高显指高热导荧光陶瓷进行热导率测试,结果显示,其热导率为17.8W/(m.k)@25℃。
(6)对封装后的激光显示光源模块进行激光照明光谱测试,其结果如图7所示;激光照明测试结果显示,其绿光比例为56.8%,红光比例为43.1%。该结果显示出该高显示高热导荧光陶瓷在作为激光显示光源中绿光与红光光源有着非常大的用途和特点。
实施例3:
高显指高热导荧光陶瓷的射灯在激光显示光源模块的应用(反射式)
(1)将发射峰在565nm的Y3Al5O12:Ce3+荧光粉与Al2O3按质量比1:3的比例混合均匀,并加入0.25wt%的MgO与0.25wt%TEOS,制备出混合原料粉体;
(2)利用真空烧结工艺,将粉体原料200MPa压片成型后,5℃/min的升温速度升至1750℃,保温5小时,得到烧制成功的荧光陶瓷;
(3)经过切割和抛光后,制备出厚度为0.35mm厚的荧光陶瓷片;
(4)将制备出的高显指高热导荧光陶瓷按反射式的封装方式分别与455nm蓝光激光二极管进行封装,组成激光显示光源模块;
(5)对高显指高热导荧光陶瓷进行热导率测试,结果显示,其热导率为17.8W/(m.k)@25℃。
(6)对封装后的激光显示光源模块进行激光照明光谱测试,其结果如图8所示;激光照明测试结果显示,其绿光比例为60.1%,红光比例为38.7%。
实施例4:
高显指高热导荧光陶瓷的射灯在暖白光激光照明的应用(透过式)
(1)将发射峰在550和650nm的黄光荧光粉和红光荧光粉按质量比92:8的比例混合后,再与Al2O3按质量比1:3的比例混合均匀,并加入0.25wt%的LiF,制备出混合原料粉体;
(2)利用SPS烧结工艺,将粉体原料放入石墨模具后加压至60MPa,然后100℃/min的升温速度迅速升至1350℃,保温1小时后冷却,得到烧制成功的荧光陶瓷;
(3)经过切割和抛光后,制备出厚度为0.13mm厚的荧光陶瓷片,其扫电子描电镜(SEM)图像如图9所示;
(4)将制备出的高显指高热导荧光陶瓷按透过式的封装方式与455nm蓝光激光二极管进行封装,组成暖白光激光照明射灯光源;
(5)对高显指高热导荧光陶瓷进行热导率测试,结果显示,其热导率为18.1W/(m.k)@25℃。
(6)对封装后的射灯器件进行激光照明光谱测试,其结果如图10所示;激光照明测试结果显示,其色温为3000K的暖白光,显色指数为83,光电转换效率为55lm/W。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,都应涵盖在本发明的保护范围之内。
Claims (10)
1.一种高显指高热导荧光陶瓷,其特征在于,所述高显指高热导荧光陶瓷以Al2O3陶瓷基底、分布在Al2O3陶瓷基底中的石榴石基荧光粉或青光、绿光、黄光、红光荧光粉以及助熔剂组成。
2.如权利要求1所述的高显指高热导荧光陶瓷,其特征在于,所述石榴石基荧光粉为(YxLuyGdz)3(AlmGanMgpSiq)5O12:Ce3+,Eu3+,Pr3+,Cr3+,Dy3+。其中Ce3+含量为0~20at.%,Eu3+含量为0~20at.%,Pr3+含量为0~20at.%,Cr3+含量为0~20at.%,Dy3+含量为0~20at.%;x+y+z=1,且0≤x,y,z≤1;m+n+p+q=1,且0≤m,n,p,q≤1;所述青光荧光粉为氮氧化物,在蓝光/紫外光激光二极管的激发下,发射波长峰值在490-500nm;所述绿光荧光粉为GaYAG铝酸盐或LuAG铝酸盐,在蓝光/紫外光激光二极管的激发下,发射波长峰值在530-540nm;所述黄光荧光粉为YAG铝酸盐,在蓝光/紫外光激光二极管的激发下,发射波长峰值在545-565nm;所述红光荧光粉为氮化物,在蓝光/紫外光激光二极管的激发下,发射波长峰值在610-670nm;荧光粉在陶瓷中的含量为2-98wt%,助熔剂AX,(A=Li,Na,K,X=F,Br,I);MgO、TEOS中的一种或几种,使用含量为0.01-10wt%。
3.一种如权利要求1~2任意一项所述高显指高热导荧光陶瓷的制备方法,其特征在于,所述高显指高热导荧光陶瓷的制备方法包括:放电等离子烧结(SPS),或者是真空高温烧结,或者是热等静压烧结。
4.一种激光电视机激光显示光源模块的封装方法,其特征在于,所述激光电视机激光显示光源模块的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;以及透过式、反射式的封装方式。
5.一种激光投影仪激光显示光源模块的封装方法,其特征在于,所述激光投影仪激光显示光源模块的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;以及透过式、反射式的封装方式。
6.一种激光显示屏激光显示光源模块的封装方法,其特征在于,所述激光显示屏激光显示光源模块的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;以及透过式、反射式的封装方式。
7.一种高显指激光照明灯具激光照明模块的封装方法,其特征在于,所述高显指激光照明灯具激光照明模块的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;以及透过式、反射式、“Z”型封装的封装方式。
8.一种景观照明灯的封装方法,其特征在于,所述景观照明灯的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;以及透过式、反射式、“Z”型封装的封装方式。
9.一种射灯的封装方法,其特征在于,所述射灯的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm;以及透过式、反射式、“Z”型封装的封装方式。
10.一种内窥镜灯的封装方法,其特征在于,所述内窥镜灯的封装方法使用权利要求1~2任意一项所述高显指高热导荧光陶瓷,包括:将陶瓷片/陶瓷块切割为:直径Ф=1~100mm的圆片或圆环,圆环内径为Ф=0.5~100mm;边长为1~100mm的方片;厚度均为0.08-10mm。
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