WO2018000916A1 - Pcb板组件及具有其的移动终端 - Google Patents

Pcb板组件及具有其的移动终端 Download PDF

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Publication number
WO2018000916A1
WO2018000916A1 PCT/CN2017/080959 CN2017080959W WO2018000916A1 WO 2018000916 A1 WO2018000916 A1 WO 2018000916A1 CN 2017080959 W CN2017080959 W CN 2017080959W WO 2018000916 A1 WO2018000916 A1 WO 2018000916A1
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WO
WIPO (PCT)
Prior art keywords
chip
conductive layer
pcb board
board assembly
assembly according
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PCT/CN2017/080959
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English (en)
French (fr)
Inventor
范艳辉
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广东欧珀移动通信有限公司
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Publication of WO2018000916A1 publication Critical patent/WO2018000916A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to the field of mobile terminal technologies, and in particular, to a PCB board assembly and a mobile terminal therewith.
  • the chip has a complicated circuit structure inside, and has different circuit structures in different places of the chip. In some places, there are key sensitive circuit parts, and the wiring on the PCB cannot be noticed at the time of wiring.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a PCB board assembly that has the advantage of less interference to the chip.
  • the present invention also proposes a mobile terminal comprising the above PCB board assembly.
  • a PCB board assembly includes: a chip; a board body having a grounding point thereon and including a plurality of stacked conductive layers, the plurality of conductive layers including the first conductive layer and the a second conductive layer adjacent to the conductive layer, the chip is disposed on the first conductive layer, and a groove is disposed on the first conductive layer near the chip, and the groove penetrates the a first conductive layer; a conductive member, the conductive member is disposed on the second conductive layer and disposed opposite to the recess, and the conductive member is electrically connected to the ground point.
  • a PCB board assembly by disposing a chip on a first conductive layer of a board body of a PCB board assembly, and providing a groove at a position on the first conductive layer close to the chip, in the second conductive layer
  • the conductive member is disposed at a position opposite to the groove, and the conductive member is electrically connected to the grounding point, thereby not only avoiding the wiring on the board body from interfering with the work inside the chip, thereby ensuring the reliability of the working part of the sensitive circuit inside the chip, and also Ensure the normal operation of the chip and improve the reliability of the PCB board assembly.
  • the recess is located directly below the chip.
  • the width of the groove is less than the width of the chip.
  • the grooves are plural and spaced apart in a circumferential direction of the chip.
  • a plurality of the grooves are evenly distributed along a circumferential direction of the chip.
  • a plurality of the grooves are symmetrically arranged about a centerline of the chip.
  • the grooves are one and extend in a circumferential direction of the chip.
  • the cross section of the groove is formed as a square ring.
  • the peripheral wall of the chip is flush with the radially inner side wall surface of the groove.
  • the grooves are square grooves.
  • the electrically conductive member is a copper skin.
  • the sensitive circuitry of the chip is located at a location of the chip proximate the first conductive layer.
  • the conductive member is laid on a side of the second conductive layer adjacent to the first conductive layer.
  • a mobile terminal according to an embodiment of the present invention includes the above PCB board assembly.
  • the mobile terminal of the embodiment of the present invention by providing the above-described PCB board assembly, the reliability of the operation of the mobile terminal can be improved.
  • the mobile terminal is a mobile phone, a tablet or a notebook computer.
  • FIG. 1 is a schematic structural view of a PCB board assembly according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a PCB board assembly according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a PCB board assembly in accordance with an embodiment of the present invention.
  • the board body 2 The board body 2, the first conductive layer 21, the second conductive layer 22, the recess 23,
  • a PCB board assembly 100 in accordance with an embodiment of the present invention is described below with reference to FIGS.
  • a PCB board assembly 100 includes a chip 1, a board 2, and a conductive member 3.
  • the board body 2 is provided with a grounding point and includes a plurality of stacked conductive layers.
  • the plurality of conductive layers include a first conductive layer 21 and a second conductive layer 22 adjacent to the first conductive layer 21, and the chip 1 is provided.
  • the conductive member 3 is laid on the second conductive layer 22 and disposed opposite to the recess 23, and the conductive member 3 is electrically connected to the ground point. This ensures the normal operation of the chip 1. As shown in FIG. 1, the conductive member is laid on the side of the second conductive layer 22 close to the first conductive layer 21.
  • the PCB board assembly 100 is provided by disposing the chip 1 on the first conductive layer 21 of the board body 2 of the PCB board assembly 100, and providing a groove at a position on the first conductive layer 21 close to the chip 1.
  • the conductive member 3 is disposed on the second conductive layer 22 opposite to the recess 23, and the conductive member 3 is electrically connected to the grounding point, thereby not only avoiding the wiring on the board 2 from interfering with the work inside the chip 1, thereby ensuring
  • the reliability of the working part of the sensitive circuit inside the chip 1 can also ensure the normal operation of the chip 1 and improve the reliability of the work of the PCB board assembly 100.
  • the recess 23 is located directly below the chip 1. Therefore, not only the wiring on the board 2 can be prevented from interfering with the work inside the chip 1, but also the reliability of the working part of the sensitive circuit inside the chip 1 can be ensured, the normal operation of the chip 1 can be ensured, and the work of the PCB board assembly 100 can be improved. reliability. At the same time, the structure of the plate body 2 can be simplified. Further, as shown in FIG. 1, the width of the groove 23 is smaller than the width of the chip 1.
  • the grooves 23 are plural and spaced apart in the circumferential direction of the chip 1. Therefore, not only the wiring on the board 2 can be prevented from interfering with the work inside the chip 1, but also the reliability of the working part of the sensitive circuit inside the chip 1 can be ensured, the normal operation of the chip 1 can be ensured, and the work of the PCB board assembly 100 can be improved. reliability. At the same time, the structure of the plate body 2 can be simplified. Further, as shown in FIG. 2, a plurality of grooves 23 are evenly distributed in the circumferential direction of the chip 1. In addition, a plurality of grooves 23 are symmetrically distributed with respect to the center line of the chip 1.
  • the grooves 23 are one and extend in the circumferential direction of the chip 1. Therefore, not only the wiring on the board 2 can be prevented from interfering with the work inside the chip 1, but also the reliability of the working part of the sensitive circuit inside the chip 1 can be ensured, the normal operation of the chip 1 can be ensured, and the work of the PCB board assembly 100 can be improved. reliability.
  • the structure of the plate body 2 can be simplified.
  • the cross section of the groove 23 is formed as a square ring.
  • the outer peripheral wall of the chip 1 is flush with the inner side wall surface of the radially inner side of the groove 23.
  • the groove 23 is a square groove, thereby facilitating the processing of the groove 23, which is advantageous for improving production efficiency.
  • the conductive member 3 is a copper skin, and the copper sheath has good conductivity and thermal conductivity, which not only facilitates the normal operation of the chip 1, but also facilitates heat dissipation of the chip 1.
  • the sensitive circuitry of the chip 1 is located at a location of the chip 1 proximate to the first conductive layer 21. Therefore, by providing the recess 23 on the first conductive layer 21 of the board 2, the wiring on the first conductive layer 21 of the board 2 can be prevented from interfering with the internal working of the chip 1, thereby ensuring the sensitive circuit inside the chip 1. Part of the reliability of the work.
  • the PCB board assembly 100 in accordance with three embodiments of the present invention is described below with reference to FIGS. 1-3.
  • the following description is merely illustrative and is not intended to limit the invention.
  • a PCB board assembly 100 includes a chip 1, a board 2, and a conductive member 3.
  • the board body 2 is provided with a grounding point and comprises a plurality of stacked conductive layers
  • the multi-layer conductive layer comprises a first conductive layer 21 and a second conductive layer 22 adjacent to the first conductive layer 21, the chip 1 is arranged On the first conductive layer 21, the sensitive circuit of the chip 1 is located near the first conductive layer 21, and the first conductive layer 21 is provided with a square groove 23 at the position directly below the chip 1, the width of the groove 23.
  • the conductive member 3 is disposed on the second conductive layer 22 and disposed opposite to the recess 23, and the conductive member 3 is laid on the second conductive layer.
  • the conductive member 3 is disposed on the second conductive layer 22 and disposed opposite to the recess 23, and the conductive member 3 is disposed on the second conductive layer 22. On the side of the layer 22 remote from the first conductive layer 21, the conductive member 3 is electrically connected to the ground point.
  • the embodiment is substantially the same as the structure of the first embodiment, wherein the same components are given the same reference numerals, except that the plurality of grooves 23 are plural and evenly spaced along the circumferential direction of the chip 1.
  • the plurality of grooves 23 are distributed symmetrically with respect to the center line of the chip 1.
  • the structure of the present embodiment is substantially the same as that of the first embodiment, wherein the same components are given the same reference numerals, except that the grooves 23 are one and extend in the circumferential direction of the chip 1, concave.
  • the groove 23 has a square ring in cross section.
  • the mobile terminal according to the embodiment of the present invention includes the above-described PCB board assembly 100, and by providing the above-described PCB board assembly 100, the reliability of the operation of the mobile terminal can be improved.
  • the mobile terminal can be a cell phone, a laptop or a flat computer or the like.
  • the mobile phone or the like uses the above PCB board assembly 100, the reliability of its work can be improved.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. Or integrated; can be mechanical
  • the connections may also be electrically connected or communicated with each other; they may be directly connected or indirectly connected through an intermediate medium, and may be internal communication of two elements or an interaction relationship of two elements unless explicitly defined otherwise.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种PCB板组件（100）及具有其的移动终端，其中，PCB板组件（100）包括芯片（1）、板体（2）和导电件（3），板体（2）上设有接地点且包括多层层叠放置的导电层，多层导电层包括第一导电层（21）和与第一导电层（21）相邻的第二导电层（22），芯片（1）设在第一导电层（21）上，第一导电层（21）上靠近芯片（1）的位置处设有凹槽（23），凹槽（23）贯通第一导电层（21），导电件（3）铺设在第二导电层（22）上且与凹槽（23）相对设置，导电件（3）与接地点电连接。

Description

PCB板组件及具有其的移动终端 技术领域
本发明涉及移动终端技术领域，尤其是涉及一种PCB板组件及具有其的移动终端。
背景技术
相关技术中，芯片内部具有复杂的电路结构，在芯片不同的地方具有不同的电路结构，有的地方存在关键的敏感电路部分，在布线的时候无法注意到此处PCB上的走线。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明提出一种PCB板组件，所述PCB板组件具有对芯片干扰小的优点。
本发明还提出一种移动终端，所述移动终端包括上述PCB板组件。
根据本发明实施例的PCB板组件，包括：芯片；板体，所述板体上设有接地点且包括多层层叠放置的导电层，多层导电层包括第一导电层和与所述第一导电层相邻的第二导电层，所述芯片设在所述第一导电层上，所述第一导电层上靠近所述芯片的位置处设有凹槽，所述凹槽贯通所述第一导电层；导电件，所述导电件铺设在所述第二导电层上且与所述凹槽相对设置，所述导电件与所述接地点电连接。
根据本发明实施例的PCB板组件，通过将芯片上设在PCB板组件的板体的第一导电层上，并在第一导电层上靠近芯片的位置处设置凹槽，在第二导电层上与凹槽相对的位置设置导电件并使导电件与接地点电连接，不仅可以避免板体上的走线干扰芯片内部的工作，从而保证芯片内部的敏感电路部分工作的可靠性，还可以保证芯片的正常工作，提高PCB板组件工作的可靠性。
根据本发明的一些实施例，所述凹槽位于所述芯片的正下方。
在本发明的一些实施例中，所述凹槽的宽度小于所述芯片的宽度。
根据本发明的一些实施例，所述凹槽为多个且沿所述芯片的周向方向间隔分布。
在本发明的一些实施例中，多个所述凹槽沿所述芯片的周向方向均匀分布。
在本发明的一些实施例中，多个所述凹槽关于所述芯片的中心线对称布置。
根据本发明的一些实施例，所述凹槽为一个且沿所述芯片的周向方向延伸。
在本发明的一些实施例中，所述凹槽的横截面形成为方形环。
在本发明的一些实施例中，所述芯片的外周壁与所述凹槽的径向内侧的内侧壁面平齐。
根据本发明的一些实施例，所述凹槽为方形槽。
根据本发明的一些实施例，所述导电件为铜皮。
根据本发明的一些实施例，所述芯片的敏感电路位于所述芯片的靠近所述第一导电层的位置处。
根据本发明的一些实施例，所述导电件铺设在所述第二导电层的靠近所述第一导电层的一侧。
根据本发明实施例的移动终端，包括上述PCB板组件。
根据本发明实施例的移动终端，通过设置上述PCB板组件，可以提高移动终端工作的可靠性。
根据本发明的一些实施例，所述移动终端为手机、平板电脑或笔记本电脑。
附图说明
图1是根据本发明实施例的PCB板组件的结构示意图；
图2是根据本发明实施例的PCB板组件的结构示意图；
图3是根据本发明实施例的PCB板组件的结构示意图。
附图标记：
PCB板组件100，
芯片1，
板体2，第一导电层21，第二导电层22，凹槽23，
导电件3。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
下面参考图1-图3描述根据本发明实施例的PCB板组件100。
如图1-图3所示，根据本发明实施例的PCB板组件100，包括芯片1、板体2和导电件3。
具体地，板体2上设有接地点且包括多层层叠放置的导电层，多层导电层包括第一导电层21和与第一导电层21相邻的第二导电层22，芯片1设在第一导电层21上，第一导电层21上靠近芯片1的位置处设有凹槽23，凹槽23贯通第一导电层21。由此，可以避免板体2上第一导电层21上的走线干扰到芯片1内部的工作，从而保证芯片1内部的敏感电路部分 工作的可靠性。导电件3铺设在第二导电层22上且与凹槽23相对设置，导电件3与接地点电连接。由此可以保证芯片1的正常工作。如图1所示，导电件铺设在第二导电层22的靠近第一导电层21的一侧。
根据本发明实施例的PCB板组件100，通过将芯片1设在PCB板组件100的板体2的第一导电层21上，并在第一导电层21上靠近芯片1的位置处设置凹槽23，在第二导电层22上与凹槽23相对的位置设置导电件3并使导电件3与接地点电连接，不仅可以避免板体2上的走线干扰芯片1内部的工作，从而保证芯片1内部的敏感电路部分工作的可靠性，还可以保证芯片1的正常工作，提高PCB板组件100工作的可靠性。
在本发明的一些实施例中，如图1所示，凹槽23位于芯片1的正下方。由此，不仅可以避免板体2上的走线干扰芯片1内部的工作，从而保证芯片1内部的敏感电路部分工作的可靠性，还可以保证芯片1的正常工作，提高PCB板组件100工作的可靠性。同时，可以简化板体2的结构。进一步地，如图1所示，凹槽23的宽度小于芯片1的宽度。
在本发明的一些实施例中，如图2所示，凹槽23为多个且沿芯片1的周向方向间隔分布。由此，不仅可以避免板体2上的走线干扰芯片1内部的工作，从而保证芯片1内部的敏感电路部分工作的可靠性，还可以保证芯片1的正常工作，提高PCB板组件100工作的可靠性。同时，可以简化板体2的结构。进一步地，如图2所示，多个凹槽23沿芯片1的周向方向均匀分布。另外，多个凹槽23关于芯片1的中心线对称分布。
在本发明的一些实施例中，如图3所示，凹槽23为一个且沿芯片1的周向方向延伸。由此，不仅可以避免板体2上的走线干扰芯片1内部的工作，从而保证芯片1内部的敏感电路部分工作的可靠性，还可以保证芯片1的正常工作，提高PCB板组件100工作的可靠性。同时，可以简化板体2的结构。进一步地，如图3所示，凹槽23的横截面形成为方形环。另外，如图3所示，芯片1的外周壁与凹槽23的径向内侧的内侧壁面平齐。
可选地，如图1-图3所示，凹槽23为方形槽，由此，便于凹槽23的加工，有利于提高生产效率。优选地，导电件3为铜皮，铜皮导电性和导热性均较好，不但便于芯片1的正常工作，而且便于芯片1的散热。
在本发明的一些实施例中，芯片1的敏感电路位于芯片1的靠近第一导电层21的位置处。由此，可以通过在板体2的第一导电层21上设置凹槽23，可以避免板体2的第一导电层21上的走线干扰芯片1内部工作，从而保证芯片1内部的敏感电路部分工作的可靠性。
下面参考图1-图3描述根据本发明三个具体实施例的PCB板组件100，下述描述只是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
实施例一
如图1所示，根据本发明实施例的PCB板组件100，包括芯片1、板体2和导电件3。
其中，板体2上设有接地点且包括多层层叠放置的导电层，多层导电层包括第一导电层21和与第一导电层21相邻的第二导电层22，芯片1设在第一导电层21上，芯片1的敏感电路位于靠近第一导电层21的位置处，第一导电层21上位于芯片1正下方的位置处设有方形的凹槽23，凹槽23的宽度小于芯片1的宽度，凹槽23贯通第一导电层21，导电件3为铜皮，导电件3铺设在第二导电层22上且与凹槽23相对设置，导电件3铺设在第二导电层22的远离第一导电层21的一侧，导电件3与接地点电连接。
由此，不仅可以避免板体2上的走线干扰芯片1内部的工作，从而保证芯片1内部的敏感电路部分工作的可靠性，还可以保证芯片1的正常工作，提高PCB板组件100工作的可靠性。
实施例二
如图2所示，本实施例与实施例一的结构大致相同，其中相同的部件采用相同的附图标记，不同之处仅在于凹槽23为多个且沿芯片1的周向方向均匀间隔分布且多个凹槽23关于芯片1的中心线对称。
实施例三
如图3所示，本实施例与实施例一的结构大致相同，其中相同的部件采用相同的附图标记，不同之处仅在于凹槽23为一个且沿芯片1的周向方向延伸，凹槽23的横截面为方形环。
根据本发明实施例的移动终端，包括上述PCB板组件100，通过设置上述PCB板组件100，可以提高移动终端工作的可靠性。
在本发明的一些实施例中，移动终端可以是手机、笔记本电脑或平本电脑等。当手机等使用上述PCB板组件100后，可以提高其工作的可靠性。
在本发明的描述中，需要理解的是，术语“中心”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械 连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (15)

  1. 一种PCB板组件，其特征在于，包括：
    芯片；
    板体，所述板体上设有接地点且包括多层层叠放置的导电层，多层导电层包括第一导电层和与所述第一导电层相邻的第二导电层，所述芯片设在所述第一导电层上，所述第一导电层上靠近所述芯片的位置处设有凹槽，所述凹槽贯通所述第一导电层；
    导电件，所述导电件铺设在所述第二导电层上且与所述凹槽相对设置，所述导电件与所述接地点电连接。
  2. 根据权利要求1所述的PCB板组件，其特征在于，所述凹槽位于所述芯片的正下方。
  3. 根据权利要求2所述的PCB板组件，其特征在于，所述凹槽的宽度小于所述芯片的宽度。
  4. 根据权利要求1所述的PCB板组件，其特征在于，所述凹槽为多个且沿所述芯片的周向方向间隔分布。
  5. 根据权利要求4所述的PCB板组件，其特征在于，多个所述凹槽沿所述芯片的周向方向均匀分布。
  6. 根据权利要求4所述的PCB板组件，其特征在于，多个所述凹槽关于所述芯片的中心线对称布置。
  7. 根据权利要求1所述的PCB板组件，其特征在于，所述凹槽为一个且沿所述芯片的周向方向延伸。
  8. 根据权利要求7所述的PCB板组件，其特征在于，所述凹槽的横截面形成为方形环。
  9. 根据权利要求7所述的PCB板组件，其特征在于，所述芯片的外周壁与所述凹槽的径向内侧的内侧壁面平齐。
  10. 根据权利要求1所述的PCB板组件，其特征在于，所述凹槽为方形槽。
  11. 根据权利要求1-10中任一项所述的PCB板组件，其特征在于，所述导电件为铜皮。
  12. 根据权利要求1-11中任一项所述的PCB板组件，其特征在于，所述芯片的敏感电路位于所述芯片的靠近所述第一导电层的位置处。
  13. 根据权利要求1-12中任一项所述的PCB板组件，其特征在于，所述导电件铺设在所述第二导电层的靠近所述第一导电层的一侧。
  14. 一种移动终端，其特征在于，包括根据权利要求1-13中任一项所述的PCB板组件。
  15. 根据权利要求14所述的移动终端，其特征在于，所述移动终端为手机、平板电脑或笔记本电脑。
PCT/CN2017/080959 2016-06-28 2017-04-18 Pcb板组件及具有其的移动终端 WO2018000916A1 (zh)

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