WO2017220319A1 - Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural - Google Patents
Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural Download PDFInfo
- Publication number
- WO2017220319A1 WO2017220319A1 PCT/EP2017/063757 EP2017063757W WO2017220319A1 WO 2017220319 A1 WO2017220319 A1 WO 2017220319A1 EP 2017063757 W EP2017063757 W EP 2017063757W WO 2017220319 A1 WO2017220319 A1 WO 2017220319A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- cavity
- carrier
- component
- housing body
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0654—Protection against aggressive medium in general against moisture or humidity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
L'invention concerne un ensemble (1) comprenant un support (3) et un corps de boîtier (4). Le support (3) est disposé sur le corps de boîtier (4) et délimite une cavité (9) servant à recevoir au moins un élément structural (16). Une passivation (19) constituée d'un premier matériau dans une première région (21) et d'un deuxième matériau dans une deuxième région (22) différente de la première région (21) est située dans la cavité (9). Le premier matériau présente, par comparaison avec le deuxième matériau, un plus grand module d'élasticité et/ou une plus grande dureté, la première région (21) recouvrant une partie de surface (20) du support (3) et la deuxième région (22) recouvrant une partie de surface (14) du corps de boîtier (4). L'élément structural (16) est disposé dans la deuxième région (22).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016210940.5 | 2016-06-20 | ||
| DE102016210940.5A DE102016210940A1 (de) | 2016-06-20 | 2016-06-20 | Anordnung mit einem Träger und einem Gehäusekörper, und Verfahren zum Herstellen einer Anordnung mit einem Bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017220319A1 true WO2017220319A1 (fr) | 2017-12-28 |
Family
ID=59070627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2017/063757 WO2017220319A1 (fr) | 2016-06-20 | 2017-06-07 | Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102016210940A1 (fr) |
| TW (1) | TW201810449A (fr) |
| WO (1) | WO2017220319A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0215528A1 (fr) * | 1985-09-17 | 1987-03-25 | Sentron B.V. | Cathéter de mesure de pression |
| WO2005008205A1 (fr) * | 2003-07-15 | 2005-01-27 | Robert Bosch Gmbh | Dispositif de detection |
| DE102009029281A1 (de) * | 2009-09-08 | 2010-10-07 | Robert Bosch Gmbh | Modul und Verfahren zur Herstellung eines Moduls |
| US20120168884A1 (en) * | 2011-01-05 | 2012-07-05 | Freescale Semiconductor, Inc | Pressure sensor and method of packaging same |
| DE102011084582B3 (de) | 2011-10-17 | 2013-02-21 | Robert Bosch Gmbh | Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren |
-
2016
- 2016-06-20 DE DE102016210940.5A patent/DE102016210940A1/de not_active Withdrawn
-
2017
- 2017-06-07 WO PCT/EP2017/063757 patent/WO2017220319A1/fr active Application Filing
- 2017-06-16 TW TW106120101A patent/TW201810449A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0215528A1 (fr) * | 1985-09-17 | 1987-03-25 | Sentron B.V. | Cathéter de mesure de pression |
| WO2005008205A1 (fr) * | 2003-07-15 | 2005-01-27 | Robert Bosch Gmbh | Dispositif de detection |
| DE102009029281A1 (de) * | 2009-09-08 | 2010-10-07 | Robert Bosch Gmbh | Modul und Verfahren zur Herstellung eines Moduls |
| US20120168884A1 (en) * | 2011-01-05 | 2012-07-05 | Freescale Semiconductor, Inc | Pressure sensor and method of packaging same |
| DE102011084582B3 (de) | 2011-10-17 | 2013-02-21 | Robert Bosch Gmbh | Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201810449A (zh) | 2018-03-16 |
| DE102016210940A1 (de) | 2017-12-21 |
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