WO2017220319A1 - Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural - Google Patents

Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural Download PDF

Info

Publication number
WO2017220319A1
WO2017220319A1 PCT/EP2017/063757 EP2017063757W WO2017220319A1 WO 2017220319 A1 WO2017220319 A1 WO 2017220319A1 EP 2017063757 W EP2017063757 W EP 2017063757W WO 2017220319 A1 WO2017220319 A1 WO 2017220319A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
cavity
carrier
component
housing body
Prior art date
Application number
PCT/EP2017/063757
Other languages
German (de)
English (en)
Inventor
Eckart Schellkes
Florian Grabmaier
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2017220319A1 publication Critical patent/WO2017220319A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0654—Protection against aggressive medium in general against moisture or humidity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the invention generally relates to a housing for components.
  • the invention relates to a housing for electronic and / or micromechanical components, wherein the housing has a carrier and a housing body with a cavity which is provided, for example, for receiving a sensor element.
  • Housings for electronic components are subject to different requirements depending on the purpose, resulting from the nature of the arranged in the housing components. Housings for sensors are known.
  • the sensor device comprises a substrate, one on the
  • the Moldverpackung has a cavity above the circuit chip in which a sensor chip is provided, and within the cavity, a through hole through which an electrical connection of the
  • a housing that simultaneously accommodates different types of devices, such as sensors and electronic components for the sensors.
  • the components should be sufficiently protected against environmental influences, wherein Furthermore, a possibility for a secure contact of the respective
  • sensor elements can be comparatively sensitive to a thermomechanical and mechanical stress occurring between the housing and the carrier.
  • an arrangement is provided with a carrier and a housing body, wherein the housing body is arranged on the carrier and defines a cavity for receiving at least one component.
  • a passivation of a first material in a first region and of a second material in a second region is provided, wherein the second region is different from the first region.
  • the first material has a higher modulus of elasticity and / or a higher hardness compared to the second material.
  • the first area covers a partial area of the carrier, and the second area covers a partial area of the case body.
  • the component is arranged in the second region.
  • the passivation of components can be significantly improved, whereby a two-part passivation is created, which can meet in the first region and the second region of the passivation respectively different requirements for the passivation.
  • a two-part encapsulation can be applied, with which mutually exclusive requirements can be selectively realized by two substances.
  • the robustness of Kavticianspackages can be significantly increased compared to the prior art.
  • the cavity forms a passage opening leading to the carrier, which is at least partially filled with the first material.
  • a material can be advantageously selected for the first region that is better suited for protecting a partial surface of the carrier than other materials or for the second material, and
  • the housing body may form a cavity defining projection, wherein the component is disposed on the projection and the second material covers the projection.
  • the second material can be chosen so that the partial surface of the housing body or a component located thereon is protected, which is exposed at the same time as little as possible thermodynamic and mechanical stress.
  • a component located thereon is protected, which is exposed at the same time as little as possible thermodynamic and mechanical stress.
  • Stress-sensitive device that has a different coefficient of expansion and / or a different flexibility compared to a plastic of the carrier, not mounted on the support, whereby thermal stresses, such as arise during soldering, and mechanical and thermo-mechanical stress on the device can be avoided. Further, the device in the second region sufficiently well against a Environmental stress, such as penetrating moisture, are protected.
  • the component in the second region is designed as a sensor element, in particular as a pressure sensor.
  • a sensor device can advantageously be realized in which the retention of the sensor characteristic curve is ensured, in that a negative influence on the sensor characteristic can be prevented, in particular during assembly.
  • the advantages of a premold housing can be used, in which the sensor is usually very stiff on one
  • Plastic bottom is mounted, while the other sides of the sensor are surrounded only by a suitable, gentle passivation.
  • a sensor device is provided with simply realized feed openings, for example for supplying a gas pressure to the sensor.
  • feed opening is easier to implement than in a pure mold housing, where the component or the sensor is surrounded by the housing body.
  • another component is embedded in the housing body.
  • This device which is preferably chosen so that it does not require media access, can be particularly well protected against environmental influences, since it is surrounded directly by the housing body.
  • the first region has a smaller thickness than the second region, wherein the first material comprises, for example, an epoxy resin or a lacquer.
  • the first part of the two-part passivation can protect the carrier with a hard and thin encapsulation.
  • the dense and hard encapsulation keeps media damaging much longer away from the sensitive structures compared to softer material.
  • a low permeability to media such as air, moisture, and exhaust gases, halides, bases or acids can be achieved.
  • the thin application ensures that no thermomechanical stresses lead to cracks and delamination, which would otherwise be expected for a larger volume.
  • the second material may comprise a gel, in particular a silicone gel.
  • Such a material has over plastics, such as
  • Epoxides the advantage that it can be used as a full potting over the device.
  • stress-induced characteristic changes as well as cracks and delamination due to thermo-mechanical stress can be avoided in the second area.
  • the second part of the two-part passivation can protect both the sensor element and the volume of the cavity with an incompressible casting of soft material with a low modulus of elasticity.
  • the housing body may be made for example by plastic injection molding.
  • the housing body can be manufactured in an efficient manner, while at the same time, by the plastic, further a good protection of the components against environmental influences can be ensured. It may advantageously be a production of a mold-premold housing with overmolded Components are realized on a circuit board or a leadframe as a carrier with a Premoldkavtician and a two-part passivation.
  • the component is connected by a wire connection to an electrical connection on the carrier, wherein the connection is arranged in the first region and is covered by the first material, wherein the wire bond passes through the first region and through the first region second area is guided.
  • this embodiment can be used particularly advantageous in a sensitive circuit board as a carrier, wherein on the circuit board bond areas for contacting the in the second area
  • the two-part passivation can advantageously both a dense protection of the printed circuit board and the bonding connection on the
  • a method of manufacturing a device with a device comprising the steps of: providing a carrier, encasing the carrier with a molding material so as to form a cavity, the cavity extending to one Top of the carrier ranges, placing a device in the cavity, introducing a first material into the cavity, wherein the first material is applied to the surface of the carrier in the cavity, and applying a second material in the cavity, wherein the device of the second Material is covered and wherein the second material has a lower modulus of elasticity and / or a higher hardness compared to the first material.
  • the second material is also applied to the first material. It is further preferred that the first material is applied in a thinner layer than the second material.
  • the first material may cover the entire surface of the carrier in the cavity, and the second material may cover the entire device.
  • the aspects of the invention advantages of both a mold housing, in which the components are mounted on a support, such as a circuit board, and then molded with plastic, as well as a premold housing, in which a carrier is first encapsulated, with areas beispielswiese are kept for electrical contacting and the device is then added and contacted, can be advantageously used, wherein the aspects of the invention, an improved passivation is provided.
  • a combination of both of the above-mentioned types of housing may be provided, that is, assembled components may be overmolded and recesses may be kept free to thereafter add further components, and at the same time passivation for all components may be ensured in a manner which takes particular account of the function of the components.
  • components which have a low sensitivity to stress and require no gas access can be gold-plated, whereas a stress-sensitive sensor element is constructed in a molded premold cavity.
  • the protection of the molded components is achieved against environmental influences while ensuring that the
  • a circuit board-based mold-premold housing can advantageously be realized in order to protect components which do not require media access in the molding body, and at the same time to produce a premold region in which a sensor element with a two-part passivation is protected against media influences.
  • the aspects of the invention can be realized both with a leadframe and with a substrate as a carrier.
  • FIG. 1 shows a schematic cross-sectional view of an arrangement with a carrier and a housing body, according to a first embodiment of the invention
  • FIG. 2 shows a schematic plan view of an arrangement with a carrier and a housing body, according to a second embodiment of the invention
  • Fig. 3 is a schematic cross-sectional view of an arrangement with a carrier and a housing body, according to a third embodiment of the invention.
  • FIG. 4 shows a flow diagram of a method for producing a device with a component, according to an embodiment of the invention.
  • Fig. 1 shows a schematic cross-sectional view of a
  • the carrier 3 serves as a substrate for the housing body 4, and the housing body has an upper side 6 and a lower side 5, the lower side 5 largely covering the carrier 3.
  • the carrier 3 can in principle be configured as a leadframe or printed circuit board, wherein according to the embodiment shown here, the carrier 3 a printed circuit board is, which is equipped with a variety of electronic components 7, of which in the drawing, a component 7 is shown as an example.
  • the component 7 is encased by the housing body 4 and is electrically connected to the circuit board, ie the support 3, by means of conductive connections 8.
  • the conductive connections 8 have, for example, wire bonds.
  • the housing body 4 is made of a plastic material and forms a chip housing for the component 7.
  • the housing body 4 can be manufactured, for example, by injection molding. Since the component 7 is encased by the housing body 4, which thus acts as a mold housing, as shown in the drawing, the component 7 is protected in the housing body 4 from environmental influences.
  • the housing body 4 further defines a cavity 9 defined by side walls 10, i. Inner walls of the housing body 4, is limited.
  • the limiting side walls 10, as shown in Fig. 2 be connected to each other at the outer periphery of the cavity 9.
  • the cavity 9 has a part
  • Step-shaped cross-section, by the housing body 4 is formed so that the cavity 9 is further limited by a projecting into the cavity 9 projection 1 1.
  • a bottom 13, a top 14, and a side wall 15 of the projection 1 1 are also visible.
  • the projection 1 1 of the housing body 4 covers a partial surface of the support 3, wherein the bottom 13 of the projection 1 1 is a part of the bottom 5 of the housing body.
  • the side wall 15 of the projection 1 1 extends parallel to the side wall or inner wall 10 of the housing body 4, wherein the
  • Housing body is not limited to such a shape. Furthermore, the cavity 9 forms a passage opening 12 leading to the carrier 3, so that the carrier 4 is not covered by the housing body 4 in a region located below the passage opening 12.
  • the cavity 9 serves to receive a component 16 which is not placed directly on the printed circuit board 3.
  • the device 16 is disposed on the top 14 of the projection 1 1 and by means of a wire connection 17 with the PCB 3 connected.
  • On the circuit board 3 associated bond feet 18 are also provided as connections for the wire bonds 17.
  • the bonding feet 18 are elements of a structure of the construction of the printed circuit board 3 which is not shown in greater detail in the drawing.
  • the component 16 in the cavity 9 is here a sensor element which may have a micromechanical sensor element. In particular, the component 16 may be a pressure sensor.
  • Sensor element is at least partially placed on the circuit board 3.
  • the electronics have, for example, the component 7 and may also have other elements that are not shown in detail for simplicity in the drawing. These can also be provided in the region of the passage opening 12 on the printed circuit board 3.
  • a passivation 19 is provided which is suitable for both passivating the device, i. Sensor element 16 and for passivating a portion of the circuit board 3, which is located in the region of the passage opening 12 of the cavity 9, is used.
  • the passivation 19 has a first region 21 made of a first material and a second region 22 made of a second material.
  • the first region 21 of the passivation 19 covers a partial surface of the printed circuit board 3, which is not already covered by the underside 5 of the housing body 4.
  • the second region 22 of the passivation 19 covers a partial surface 14 of the
  • the second region 22 of the passivation 19 also extends beyond the first region 21, so that the first region 21 and the second region 22 have a common interface 20, which according to this embodiment is parallel to the printed circuit board 3. This allows the
  • the thickness di of the first region 21 is smaller than the thickness d2 of the second region 22. Specifically, the thickness d2 of the second region 22 is selected such that the second region 22 surrounds the sensor element 16, whereas the first region 21 covers the carrier 3.
  • the two regions 21, 22 of the passivation 19 can take any conceivable suitable forms, which depend on the type, number, and arrangement of the components to be protected.
  • area in this context is not limited to the description of a two-dimensional extent, as already apparent from the above embodiment, and "different” means that the areas have at most common interfaces but no identical volume areas.
  • the first material comprises, for example, epoxy resin or lacquer
  • the second material comprises, for example, a gel, in particular a silicone gel.
  • the cavity 9 is designed as a so-called premold cavity, wherein the housing body 4 acts as a premold package or premold housing which protects a surface of the support 3 covered by the underside 5 of the housing body 4. Further, since the component 7 is molded in the housing body 4, a Mold-Premold housing with two-part passivation is thus realized by the arrangement 1 and in particular by the housing body 4.
  • FIG. 2 shows a schematic plan view of an arrangement 24 with a carrier 3 and a housing body 4, according to a second embodiment of the invention.
  • the arrangement 24 substantially corresponds to the arrangement 1 in Fig. 1.
  • the carrier 3 according to the second embodiment as a leadframe, i. designed as a connection frame.
  • the leadframe 3 is arranged under the housing body 4, this being according to the plan view shown in FIG. 2 of a position behind the
  • the leadframe 3 has a plurality of
  • the terminals 25 may serve in a variant of this embodiment for mounting the assembly 24, but are not limited in principle to a particular shape.
  • the arrangement 24 furthermore has a multiplicity of components 7, 26 molded in the housing body 4, two components 7, 26 being shown by way of example in the drawing for the sake of clarity. Not explicitly shown is the electronic connection on the circuit board between the components 7, 26 on the one hand and the sensor element 16 on the other. As further shown in Fig. 2, the side walls 10 of the cavity form a closed rectangle.
  • the shape and arrangement of the cavity 9 and the through hole 12 is not limited to a particular shape and can be adjusted depending on the application. So is after this
  • the width bi2 of the through hole 12 is smaller than the width bg of the cavity 9. According to other embodiments, the width of the through hole 12 but also the width of the cavity 9 correspond.
  • FIG. 3 shows a schematic cross-sectional view of an arrangement 1 with a carrier 3 and a housing body 4, according to a third
  • FIG. 3 essentially corresponds to the arrangement in FIG. 1.
  • a fluid connection 23 is shown, which as one through the second
  • Area 22 leading through hole is configured.
  • the second material is recessed in a partial region of the second region 22 above the sensor element 16.
  • Sensor element 16 to be transmitted pressure waves or pressure changes are better transmitted. According to other embodiments, is based on a separate
  • FIG. 4 shows a method for producing an arrangement with a
  • the method basically has the following steps.
  • a step S100 we provide a carrier.
  • the carrier may be a leadframe or a printed circuit board.
  • the carrier may have a suitable structuring in the form of lines or terminals and components placed thereon.
  • a step S100 we provide a carrier.
  • the carrier may be a leadframe or a printed circuit board.
  • the carrier may have a suitable structuring in the form of lines or terminals and components placed thereon.
  • the carrier is repolished with a molding material, wherein a cavity is further formed.
  • the cavity serves to accommodate further components.
  • a component can be accommodated in the cavity that is arranged in the cavity on the housing body instead of on the carrier.
  • the cavity extends to the surface of the carrier.
  • a step S102 then a component placed in the cavity.
  • a first material is introduced into the cavity, wherein the first material is applied to the surface of the carrier.
  • a second material is introduced into the cavity, wherein a component, which is placed in the cavity, is covered by the second material.
  • the materials are selected so that the second material has a lower modulus of elasticity and / or a higher hardness compared to the first material.
  • the second area is first produced by means of a mask, and then the first material is applied.
  • a fluid connection designed as an opening may also be provided in the first region.
  • first a housing body is formed, and then the cavity is formed in the housing body.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un ensemble (1) comprenant un support (3) et un corps de boîtier (4). Le support (3) est disposé sur le corps de boîtier (4) et délimite une cavité (9) servant à recevoir au moins un élément structural (16). Une passivation (19) constituée d'un premier matériau dans une première région (21) et d'un deuxième matériau dans une deuxième région (22) différente de la première région (21) est située dans la cavité (9). Le premier matériau présente, par comparaison avec le deuxième matériau, un plus grand module d'élasticité et/ou une plus grande dureté, la première région (21) recouvrant une partie de surface (20) du support (3) et la deuxième région (22) recouvrant une partie de surface (14) du corps de boîtier (4). L'élément structural (16) est disposé dans la deuxième région (22).
PCT/EP2017/063757 2016-06-20 2017-06-07 Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural WO2017220319A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016210940.5A DE102016210940A1 (de) 2016-06-20 2016-06-20 Anordnung mit einem Träger und einem Gehäusekörper, und Verfahren zum Herstellen einer Anordnung mit einem Bauelement
DE102016210940.5 2016-06-20

Publications (1)

Publication Number Publication Date
WO2017220319A1 true WO2017220319A1 (fr) 2017-12-28

Family

ID=59070627

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/063757 WO2017220319A1 (fr) 2016-06-20 2017-06-07 Ensemble comprenant un support et un corps de boîtier, et procédé de fabrication d'un ensemble comprenant un élément structural

Country Status (3)

Country Link
DE (1) DE102016210940A1 (fr)
TW (1) TW201810449A (fr)
WO (1) WO2017220319A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0215528A1 (fr) * 1985-09-17 1987-03-25 Sentron B.V. Cathéter de mesure de pression
WO2005008205A1 (fr) * 2003-07-15 2005-01-27 Robert Bosch Gmbh Dispositif de detection
DE102009029281A1 (de) * 2009-09-08 2010-10-07 Robert Bosch Gmbh Modul und Verfahren zur Herstellung eines Moduls
US20120168884A1 (en) * 2011-01-05 2012-07-05 Freescale Semiconductor, Inc Pressure sensor and method of packaging same
DE102011084582B3 (de) 2011-10-17 2013-02-21 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0215528A1 (fr) * 1985-09-17 1987-03-25 Sentron B.V. Cathéter de mesure de pression
WO2005008205A1 (fr) * 2003-07-15 2005-01-27 Robert Bosch Gmbh Dispositif de detection
DE102009029281A1 (de) * 2009-09-08 2010-10-07 Robert Bosch Gmbh Modul und Verfahren zur Herstellung eines Moduls
US20120168884A1 (en) * 2011-01-05 2012-07-05 Freescale Semiconductor, Inc Pressure sensor and method of packaging same
DE102011084582B3 (de) 2011-10-17 2013-02-21 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren

Also Published As

Publication number Publication date
TW201810449A (zh) 2018-03-16
DE102016210940A1 (de) 2017-12-21

Similar Documents

Publication Publication Date Title
DE102017205346B4 (de) Drucksensor-package mit mehreren dies und dazugehöriges herstellungsverfahren
DE102009038706B4 (de) Sensorbauelement
DE102010006132B4 (de) Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102014108951B4 (de) Mikrofon-Baugruppe
EP1917509A1 (fr) Dispositif de detection comportant un substrat et un boitier et procede de fabrication d'un dispositif de detection
DE102011084582B3 (de) Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren
DE102013217349B4 (de) Mikromechanische Sensoranordnung und entsprechendes Herstellungsverfahren
DE102016106311A1 (de) Kavitätspackage mit kompositsubstrat
EP1472727A2 (fr) Composant semi-conducteur presentant une surface de capteur ou d'actionneur et procede pour le produire
DE102012223550B4 (de) Mikromechanischer, kapazitiver Drucksensor
DE102007005630B4 (de) Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls
DE102014117757A1 (de) Drucksensor-Package mit einer gestapelten Die-Anordnung
DE102012107403A1 (de) Chip-Gehäuse-Modul für einen Chip und ein Verfahren zum Herstellen eines Chip-Gehäuse-Moduls
DE102014118769B4 (de) Drucksensor-Modul mit einem Sensor-Chip und passiven Bauelementen innerhalb eines gemeinsamen Gehäuses
DE102011053434A1 (de) Bauteil zur Verwendung als doppelseitiges Sensorgehäuse
WO2015169615A1 (fr) Composant de capteur à deux fonctions de détection
DE102014014103A1 (de) Sensormodul zur Messung eines Druckes eines Fluides mit mindestens einer auf einem Schaltungsträger angeordneten elektronischen Schaltung, insbesondere einem integrierten Schaltkreis und mindestens einem Druckmesschip
EP3117457B1 (fr) Module électronique ainsi que procédé de fabrication d'un module électronique
DE102008015709A1 (de) Elektrische Einrichtung mit Abdeckung
DE102010042987A1 (de) Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung
DE102017212422A1 (de) Drucksensoranordnung und Verfahren zu deren Herstellung
DE102004019428A1 (de) Halbleiterbauteil mit einem Hohlraumgehäuse und Verfahren zur Herstellung desselben
DE102017202605A1 (de) Mikromechanische Anordnung mit einem sensitiven Element und dazugehöriges Herstellungsverfahren
WO2023169904A1 (fr) Composant micromécanique et procédé de fabrication correspondant
EP1835538A1 (fr) Composant électronique, bloc électronique tout comme procédé de fabrication d'un bloc électronique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17730726

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17730726

Country of ref document: EP

Kind code of ref document: A1