WO2017213248A1 - 接着フィルム及びダイシングダイボンディング一体型フィルム - Google Patents
接着フィルム及びダイシングダイボンディング一体型フィルム Download PDFInfo
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- WO2017213248A1 WO2017213248A1 PCT/JP2017/021454 JP2017021454W WO2017213248A1 WO 2017213248 A1 WO2017213248 A1 WO 2017213248A1 JP 2017021454 W JP2017021454 W JP 2017021454W WO 2017213248 A1 WO2017213248 A1 WO 2017213248A1
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- film
- adhesive film
- polymer
- epoxy resin
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- 239000003822 epoxy resin Substances 0.000 claims abstract description 56
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- 239000003795 chemical substances by application Substances 0.000 claims abstract description 39
- 239000000945 filler Substances 0.000 claims abstract description 39
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- 239000007788 liquid Substances 0.000 claims abstract description 9
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- 125000004122 cyclic group Chemical group 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
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- 230000017525 heat dissipation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
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- 239000004593 Epoxy Substances 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
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- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 4
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
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- 238000009849 vacuum degassing Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Definitions
- This disclosure relates to an adhesive film and a dicing die bonding integrated film.
- Patent Document 1 discloses a package for a semiconductor device in which a heat dissipation effect of heat generated by a semiconductor element is enhanced by providing a metal base under the die pad on which the semiconductor element is placed and the lead part.
- the thermal conductivity after thermosetting of this die bond film is 1 W / (m ⁇ K) or more by blending particles having a thermal conductivity of 12 W / (m ⁇ K) or more into the thermosetting die bond film. It is disclosed that.
- Patent Document 1 has room for improvement in the following points. That is, the metal base employed in the invention described in Patent Document 1 has a different coefficient of thermal expansion from that of the semiconductor element and the die pad. There is a risk of cracking.
- Patent Document 2 discloses a film having a thermal conductivity of 1 W / (m ⁇ K) or more after thermosetting, it is required to further increase the thermal conductivity of the film.
- the thermal conductivity of the adhesive film can be further increased by further increasing the blending amount of the filler having high thermal conductivity.
- the filler content is excessively increased, the resin content is relatively reduced.
- the adhesive force (shear strength after curing) of the adhesive film is likely to be insufficient, and it is difficult to play a role as an adhesive that should be fulfilled. That is, it was difficult to achieve both excellent adhesiveness and heat dissipation only by adjusting the blending amount of the filler having high thermal conductivity.
- the present disclosure has been made in view of the above problems, and provides an adhesive film that can achieve both adhesiveness and heat dissipation to a sufficiently high level, and a dicing die bonding integrated film including the same as a die bonding film. For the purpose.
- the present disclosure includes (a) a polymer, (b) an epoxy resin that is liquid at 50 ° C., (c) at least one of a curing agent and a curing accelerator, and (d) a thermal conductivity of 10 W / (m ⁇ K) or more. And an adhesive film having thermosetting properties. This adhesive film satisfies the conditions represented by the following inequality (1), and the shear strength after thermosetting is 1.5 MPa or more.
- M (Ma + mb + mc) /M ⁇ 0.43 (1)
- ma is (a) the mass of carbon that forms the cyclic structure of the polymer
- mb is the mass of carbon that forms the cyclic structure of (b) the epoxy resin
- mc is the cyclic structure of (c) the curing agent and curing accelerator.
- Carbon mass to be formed, M represents the total mass of (a) polymer, (b) epoxy resin, and (c) curing agent and curing accelerator, respectively.
- the polymer includes a polymer that satisfies the condition represented by the following inequality (2). ma / M A ⁇ 0.40 (2) Wherein, ma carbon mass to form a cyclic structure of (a) polymer, the M A respectively on the total weight of (a) polymer. ]
- the polymer contains a phenoxy resin.
- the filler is ⁇ -alumina particles.
- the thickness of an adhesive film is 50 micrometers or less. The content of (d) filler is 60 to 95 parts by mass when (a) polymer, (b) epoxy resin, (c) curing agent and curing accelerator, and (d) total amount of filler is 100 parts by mass. It is.
- the present disclosure provides a dicing die bonding integrated film including the adhesive film as a die bonding film. That is, the dicing die bonding integrated film includes a die bonding film made of the adhesive film and a dicing film laminated on the die bonding film.
- an adhesive film that can achieve both adhesiveness and heat dissipation at a sufficiently high level, and a dicing die bonding integrated film provided with this as a die bonding film.
- FIG. 1 is a cross-sectional view schematically showing an embodiment of a dicing die bonding integrated film according to the present disclosure.
- the adhesive film according to this embodiment has thermosetting properties, and includes (a) a polymer, (b) an epoxy resin that is liquid at 50 ° C., and (c) at least one of a curing agent and a curing accelerator. And (d) filler (heat conductivity of 10 W / (m ⁇ K) or more) dispersed in the resin component.
- This adhesive film was made based on the new finding that the thermal conductivity of the adhesive film after curing can be increased by increasing the amount of the cyclic structure (especially aromatic ring) in the resin component. is there.
- the adhesive film according to the present embodiment adjusts the amount of the cyclic structure in the resin component instead of, or together with, the conventional method of adjusting the blending amount of the filler having high thermal conductivity. This is a new technique for improving the thermal conductivity of the cured adhesive film.
- the adhesive film according to this embodiment satisfies the condition represented by the following inequality (1), and the shear strength after thermosetting is 1.5 MPa or more.
- ma is (a) the mass of carbon that forms the cyclic structure of the polymer
- mb is the mass of carbon that forms the cyclic structure of (b) the epoxy resin
- mc is the cyclic structure of (c) the curing agent and curing accelerator.
- Carbon mass to be formed, M represents the total mass of (a) polymer, (b) epoxy resin, and (c) curing agent and curing accelerator, respectively.
- the amount of aromatic rings of the components constituting the resin component can be evaluated by ring parameters.
- the ring parameter is a value calculated by dividing the mass of carbon forming the aromatic ring of the compound by the total mass of the compound.
- the value of the left side of the inequality (1) can be increased by selecting a polymer, epoxy resin, curing agent, or curing accelerator having a large ring parameter value.
- the resin component preferably satisfies the following inequality (1A), and more preferably satisfies the following inequality (1B).
- (1A) (Ma + mb + mc) /M ⁇ 0.45 (1A)
- the upper limit of ((ma + mb + mc) / M) is, for example, about 0.70. If this upper limit is exceeded, the film becomes hard and the adhesiveness tends to be insufficient.
- the thermal conductivity of the adhesive film after thermosetting is preferably 1.3 W / (m ⁇ K) or more, more preferably 1.5 W / (m ⁇ K) or more, and even more preferably 1.7 W / (M ⁇ K) or more. If the heat conductivity of the cured adhesive film is 1.3 W / (m ⁇ K) or more, for example, when a semiconductor device is manufactured using this adhesive film as a die bonding film, a sufficient heat dissipation effect is obtained. Can do.
- the upper limit of the thermal conductivity of the cured adhesive film is, for example, 6.0 W / (m ⁇ K), and may be 4.0 W / (m ⁇ K).
- the shear strength of the adhesive film after thermosetting is 1.5 MPa or more, preferably 1.6 MPa or more, more preferably 1.7 MPa or more. If the shear strength of the cured adhesive film is 1.5 MPa or more, a sufficiently high adhesive force can be secured.
- the upper limit of the shear strength of the cured adhesive film is, for example, 10.0 MPa.
- the arithmetic average roughness Ra (hereinafter simply referred to as “surface roughness Ra”) of the adhesive film after thermosetting is preferably 0.25 ⁇ m or less, more preferably 0.20 ⁇ m or less, and still more preferably 0. .16 ⁇ m or less. If the surface roughness Ra of the cured adhesive film is 0.25 ⁇ m or less, a sufficiently high adhesive force can be secured.
- the lower limit value of the surface roughness Ra of the cured adhesive film is, for example, 0.03 ⁇ m.
- the thickness of the adhesive film may be 50 ⁇ m or less, for example, 5 to 50 ⁇ m, preferably 5 to 40 ⁇ m, more preferably 8 to 40 ⁇ m. If the thickness of the adhesive film is less than 5 ⁇ m, the stress relaxation effect tends to be poor, and the embedding property tends to decrease. If it exceeds 50 ⁇ m, the cost tends to increase.
- phenoxy resin polyimide resin, polyamide resin, acrylic resin, cyanate ester resin, and polycarbodiimide resin are more preferable, and from the viewpoint of easy adjustment such as molecular weight and property addition. More preferred is a phenoxy resin.
- the 1 type selected from the said resin may be used individually or in mixture of 2 or more types, and the copolymer of 2 or more types of monomers may be used.
- the polymer (a) preferably includes a polymer that satisfies the condition represented by the following inequality (2), and the following inequality (2A ) Is more preferable, and the following inequality (2B) is more preferably satisfied.
- ma represents the carbon mass to form a cyclic structure of the polymer
- M A is the total weight of the polymer, respectively.
- the polymer is preferably composed of one or more polymers, and at least one of the polymers preferably has a ring parameter of 0.40 or more, more preferably 0.45 or more, Preferably it is 0.50 or more.
- the weight average molecular weight is preferably 20,000 or more, more preferably 30,000 or more.
- commercially available phenoxy resins include YP-50, YP-55, YP-70, YPB-40PXM40, YPS-007A30, FX-280S, FX-281S, FX-293, and ZX-1356-2 (above, Tohto Kasei Co., Ltd.) 1256, 4250, 4256, 4275, YX7180, YX6954, YX8100, YX7200, YL7178, YL7290, YL7600, YL7734, YL7827 and YL7864 (above, product names made by Japan Epoxy Resins Co., Ltd.) Of these, one of them may be used alone, or two or more of them may be used in combination.
- the glass transition temperature (Tg) of the phenoxy resin is preferably less than 85 ° C.
- commercially available products that satisfy this condition include, for example, YP-50, YP-55, YP-70, ZX-1356-2 (above, Tokyo Metropolitan Government) Kasei Co., Ltd., product name); 4250, 4256, 7275, YX7180, and YL7178 (above, Japan Epoxy Resin Co., Ltd., product name).
- one kind may be used alone, or two or more kinds may be used in combination.
- a polymer having a reactive group (functional group) and a weight average molecular weight of 100,000 or more is preferable.
- the reactive group include a carboxylic acid group, an amino group, a hydroxyl group, and an epoxy group.
- the functional group monomer is a carboxylic acid type acrylic acid
- the crosslinking reaction is likely to proceed, and the adhesive strength decreases due to gelation in the varnish state and increase in the degree of cure in the B stage state. There is. Therefore, it is more preferable to use glycidyl acrylate or glycidyl methacrylate having an epoxy group which does not generate these or even has a long period.
- acrylic resins it is more preferable to use an epoxy group-containing acrylic copolymer having a weight average molecular weight of 100,000 or more.
- the polymer is obtained by polymerizing so that unreacted monomers remain, or by obtaining a polymer compound and then adding a reactive group-containing monomer. be able to.
- a weight average molecular weight is a polystyrene conversion value using the calibration curve by a standard polystyrene by the gel permeation chromatography method (GPC).
- acrylic copolymer examples include acrylic rubber that is a copolymer of acrylic acid ester, methacrylic acid ester, acrylonitrile, and the like. Further, since it has high adhesiveness and heat resistance, it contains 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate as a functional group, and has a glass transition temperature (Tg) of ⁇ 50 ° C. or more and 50 ° C. or less, and further ⁇ 10 An acrylic copolymer having a temperature of from 50 ° C. to 50 ° C. and a weight average molecular weight of 100,000 or more is particularly preferred.
- Tg glass transition temperature
- acrylic copolymer containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate, having a Tg of ⁇ 10 ° C. or more and a weight average molecular weight of 100,000 or more include HTR-860P-3 (Imperial Chemical Industry). Product name).
- the amount of glycidyl acrylate or glycidyl methacrylate used as the functional group monomer is more preferably a copolymer ratio of 2 to 6% by mass.
- the content is preferably 2% by mass or more, and if it exceeds 6% by mass, gelation may occur.
- the balance may be a mixture of alkyl acrylate having 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate, alkyl methacrylate, styrene, acrylonitrile and the like.
- ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable.
- the mixing ratio is preferably adjusted in consideration of the Tg of the copolymer.
- Tg is less than ⁇ 10 ° C.
- the tackiness of the adhesive layer or adhesive film in the B-stage state tends to increase, and the handling property may deteriorate.
- a polymerization method For example, pearl polymerization, solution polymerization, etc. are mentioned, A copolymer is obtained by these methods.
- the weight average molecular weight of the epoxy group-containing acrylic copolymer is preferably 300,000 to 3,000,000, and more preferably 400,000 to 2,000,000. If the weight average molecular weight is less than 300,000, the strength or flexibility of the adhesive film (or adhesive sheet) may be reduced or the tackiness may be increased. There is a possibility that the circuit filling property of the wiring is reduced.
- the content of (a) polymer in the adhesive film is preferably 3 with respect to 100 parts by mass of the total amount of (a) polymer, (b) epoxy resin, (c) curing agent and curing accelerator, and (d) filler. -40 parts by mass, more preferably 3-30 parts by mass, still more preferably 3-20 parts by mass. (A) If the content of the polymer is 3 parts by mass or more, the elastic modulus can be appropriately reduced and the flowability at the time of molding can be imparted. May decrease, and the circuit fillability may be reduced.
- Epoxy resin an epoxy resin having a bifunctional group or more and a molecular weight of preferably less than 5000, more preferably less than 3000 can be used.
- two resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin can be used.
- a functional epoxy resin, a phenol novolac type epoxy resin, a novolac type epoxy resin such as a cresol novolac type epoxy resin, or the like can be used.
- what is generally known, such as a polyfunctional epoxy resin and a heterocyclic ring-containing epoxy resin can also be applied.
- Examples of commercially available epoxy resins include Epicoat 152, Epicoat 154, Epicoat 604, Epicoat 630, Epicoat 630LSD, Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1002, and Epicoat 1003.
- (B) Use one or more liquid epoxy resins at 50 ° C. According to the study by the present inventors, it is useful to satisfy the inequality (1) and maintain the softness of the adhesive film in order to produce an adhesive film that can achieve both adhesiveness and heat dissipation. For example, even if the inequality (1) is satisfied, if the adhesive film is too hard, the adhesiveness is insufficient, and the thermal conductivity tends to be insufficient. In order to maintain the softness of the adhesive film, liquid epoxy is employed at 50 ° C. in this embodiment. Note that an epoxy resin that is not liquid at 50 ° C. (a solid epoxy resin at 50 ° C.) may be used as long as the softness of the adhesive film can be maintained.
- the polymer (b) includes YDF-8170 (trade name, manufactured by Tohto Kasei Co., Ltd.) that has a proven record.
- the amount of the bifunctional epoxy resin when the total amount thereof is 100 parts by mass, the amount of the bifunctional epoxy resin is 50 parts by mass or higher (trifunctional or higher functional).
- the amount of the epoxy resin is preferably less than 50 parts by mass. From the viewpoint of increasing the Tg, the amount of the bifunctional epoxy resin is more preferably 50 to 90 parts by mass, and the amount of the trifunctional or higher functional epoxy resin is more preferably 10 to 50 parts by mass.
- the content of (b) epoxy resin in the adhesive film is preferably 100 parts by mass with respect to the total amount of (a) polymer, (b) epoxy resin, (c) curing agent and curing accelerator, and (d) filler.
- the amount is 3 to 40 parts by mass, more preferably 3 to 30 parts by mass, and still more preferably 3 to 20 parts by mass.
- the adhesive film which concerns on this embodiment should just contain at least one of a hardening
- the curing agent for example, polyfunctional phenols, amines, imidazole compounds, acid anhydrides, organophosphorus compounds and their halides, polyamides, polysulfides, and boron trifluoride can be used.
- polyfunctional phenols include monocyclic bifunctional phenols hydroquinone, resorcinol, catechol, polycyclic bifunctional phenols bisphenol A, bisphenol F, bisphenol S, naphthalenediols, biphenols, and halides thereof, Examples include alkyl group-substituted products.
- phenol resins such as phenol novolac resins, resol resins, bisphenol A novolak resins and cresol novolak resins which are polycondensates of these phenols and aldehydes may be used.
- phenol resin curing agents include, for example, Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH4150, Phenolite VH4170 (above, Dainippon Ink & Chemicals, Inc.)
- Phenolite LF2882 Phenolite LF2822
- Phenolite TD-2090 Phenolite TD-2149
- Phenolite VH4150 Phenolite VH4170
- Phenolite VH4170 above, Dainippon Ink & Chemicals, Inc.
- the product made by company, a brand name), XLC series (Mitsui Chemicals, brand name) etc. are mentioned.
- a phenol resin having a hydroxyl group equivalent of 150 g / eq or more is not particularly limited as long as it has the above-mentioned value, but it is preferable to use a novolak-type or resol-type resin because it is excellent in electric corrosion resistance at the time of moisture absorption.
- Specific examples of the above-described phenol resin include a phenol resin represented by the following formula (I).
- R 1 may be the same or different and each represents a hydrogen atom, a linear or branched alkyl group having 1 to 10 carbon atoms, a cyclic alkyl group, an aralkyl group, an alkenyl group, a hydroxyl group, an aryl group, or Represents a halogen atom, n represents an integer of 1 to 3, and m represents an integer of 0 to 50; ]
- Such a phenolic resin is not particularly limited as long as it conforms to the formula (I).
- the water absorption after charging for 48 hours in a constant temperature and humidity chamber of 85 ° C. and 85% RH is 2 It is preferable that it is below mass%.
- the heat weight reduction rate at 350 ° C. temperature increase rate: 5 ° C./min, atmosphere: nitrogen
- TGA thermogravimetric analyzer
- Suppressing volatile matter, etc. increase the reliability of various properties such as heat resistance and moisture resistance, and reduce contamination of equipment due to volatile matter during work such as heat processing ,preferable.
- the phenol resin represented by the formula (I) can be obtained, for example, by reacting a phenol compound and a xylylene compound that is a divalent linking group in the presence of no catalyst or an acid catalyst.
- the phenol resin as described above examples include the Milex XLC-series and the XL series (above, trade name, manufactured by Mitsui Chemicals, Inc.).
- the equivalent ratio of epoxy equivalent and hydroxyl equivalent is preferably 0.70 / 0.30 to 0.30 / 0.70. 65 / 0.35 to 0.35 / 0.65 is more preferable, 0.60 / 0.30 to 0.30 / 0.60 is still more preferable, and 0.55 / 0.45 to A ratio of 0.45 / 0.55 is particularly preferable.
- the curability exceeds the above range, the curability may be inferior when an adhesive is used.
- Phenol compounds used in the production of the phenol resin of formula (I) include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, on-propylphenol, m- n-propylphenol, pn-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, on-butylphenol, mn-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol, resorcin, catechol, hydride Quinone, 4-methoxyphenol, o-phenylphenol, m-
- the following xylylene dihalide, xylylene diglycol and derivatives thereof can be used.
- mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid and polyphosphoric acid
- organic acids such as dimethyl sulfuric acid, diethyl sulfuric acid, p-toluenesulfonic acid, methanesulfonic acid and ethanesulfonic acid Carboxylic acids
- Super strong acids such as trifluoromethane sulfonic acid
- Strong acidic ion exchange resins such as alkane sulfonic acid type ion exchange resin
- Super strong acidic ion exchange such as perfluoroalkane sulfonic acid type ion exchange resin Resins (trade names: Nafion, Nafion, Du Pont); natural and synthetic zeolites; activated clay (acid clay), etc., and an xylylene compound that is substantially a raw material at 50 to 250 ° C.
- the reaction is continued until it disappears and the reaction composition becomes constant.
- the reaction time depends on the raw materials and the reaction temperature, but is generally about 1 to 15 hours. In practice, it may be determined while tracking the reaction composition by GPC (gel permeation chromatography) or the like. Exceptionally, when a halogenoxylene derivative such as ⁇ , ⁇ '-dichloro-p-xylene is used, an acid catalyst is not required because the reaction proceeds without a catalyst while generating the corresponding hydrogen halide gas. . In other cases, the reaction proceeds in the presence of an acid catalyst to produce the corresponding water or alcohol.
- the phenol compound is usually used in excess, and the unreacted phenol compound is recovered after the reaction. At this time, the average molecular weight is determined by the amount of the phenol compound, and a phenol resin having a lower average molecular weight is obtained as the phenol compound is more excessive.
- the phenol resin whose phenol compound part is allylphenol is obtained by, for example, producing a non-allylated phenol resin, reacting it with allyl halide, allyl ether, and then allylating by Claisen transition. Can do.
- amines include aliphatic or aromatic primary amines, secondary amines, tertiary amines, quaternary ammonium salts and aliphatic cyclic amines, guanidines, urea derivatives, and the like.
- Examples of these compounds include N, N-benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, tetramethylguanidine, triethanolamine, N, N '-Dimethylpiperazine, 1,4-diazabicyclo [2.2.2] octane, 1,8-diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.4.0] -5 -Nonene, hexamethylenetetramine, pyridine, picoline, piperidine, pyrrolidine, dimethylcyclohexylamine, dimethylhexylamine, cyclohexylamine, diisobutylamine, di-n-butylamine, diphenylamine, N-methylaniline, tri-n-propylamine, tri -N-octylamine, tri- - butylamine, triphenyl
- imidazole compounds include imidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2- Heptadecylimidazole, 4,5-diphenylimidazole, 2-methylimidazoline, 2-phenylimidazoline, 2-undecylimidazoline, 2-heptadecylimidazoline, 2-isopropylimidazole, 2,4-dimethylimidazole, 2-phenyl-4 -Methylimidazole, 2-ethylimidazoline, 2-phenyl-4-methylimidazoline, benzimidazole, 1-cyanoethylimidazole and the like.
- acid anhydrides examples include phthalic anhydride, hexahydrophthalic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, and the like.
- the organic phosphorus compound is not particularly limited as long as it is a phosphorus compound having an organic group.
- hexamethylphosphoric triamide, tri (dichloropropyl) phosphate, tri (chloropropyl) phosphate, phosphorous acid examples thereof include triphenyl, trimethyl phosphate, phenylphosphonic acid, triphenylphosphine, tri-n-butylphosphine, diphenylphosphine and the like.
- One kind of these curing agents may be used alone, or two or more kinds may be used in combination.
- the compounding amount of these curing agents can be used without particular limitation as long as the curing reaction of the epoxy group can be advanced, but is preferably in the range of 0.0 to 5.0 equivalents per 1 mol of the epoxy group. And particularly preferably in the range of 0.0 to 1.2 equivalents.
- the compound which does not have mutagenicity for example, the thing which does not use bisphenol A is preferable since the influence on an environment and a human body is small.
- a hardening accelerator there is no restriction
- a tertiary amine, imidazoles, a quaternary ammonium salt etc. can be used.
- imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6.
- Imidazoles are commercially available from Shikoku Kasei Kogyo Co., Ltd. under the trade names 2E4MZ, 2PZ-CN, 2PZ-CNS, 2MA-OK, for example.
- the curing accelerator has a potential in that the period of use of the film becomes long.
- Typical examples include dihydrazide compounds such as dicyandiamide and adipic acid dihydrazide, guanamic acid, melamic acid, addition compound of epoxy compound and imidazole compound, addition compound of epoxy compound and dialkylamine, addition compound of amine and thiourea And an addition compound of an amine and an isocyanate.
- dihydrazide compounds such as dicyandiamide and adipic acid dihydrazide, guanamic acid, melamic acid, addition compound of epoxy compound and imidazole compound, addition compound of epoxy compound and dialkylamine, addition compound of amine and thiourea And an addition compound of an amine and an isocyanate.
- the blending amount of the curing accelerator is preferably 0 to 10.0% by mass, more preferably 0.02 to 5.0% by mass based on the total amount of the epoxy resin and the curing agent, More preferably, the content is 0.03 to 4.0% by mass.
- the blending amount of the curing accelerator exceeds 4.0% by mass, the storage stability tends to decrease and the pot life tends to be insufficient.
- the total content of (c) curing agent and curing accelerator in the adhesive film is 100 parts by mass of the total amount of (a) polymer, (b) epoxy resin, (c) curing agent and curing accelerator, and (d) filler. On the other hand, it is preferably more than 0 parts by mass and 5.0 parts by mass or less, more preferably 0.02 to 3.0 parts by mass, and still more preferably 0.03 to 2.0 parts by mass.
- “(C) Total content of curing agent and curing accelerator” means the content when the component (c) is only the curing agent, and means the content when the component is only the curing accelerator.
- the filler has a thermal conductivity of 10 W / (m ⁇ K) or more.
- Examples of fillers include electrically insulating materials such as alumina particles, boron nitride particles, aluminum nitride particles, silicon nitride particles, zinc oxide particles, magnesium oxide particles, aluminum hydroxide particles, magnesium hydroxide particles, and diamond. Can be mentioned. One of these may be used alone, or two or more may be used in combination. Among these, alumina particles and boron nitride particles have high thermal conductivity, excellent dispersibility, good water resistance, and are preferable from the viewpoint of availability.
- ⁇ -alumina is preferable, and the purity of Al 2 O 3 is preferably 99.90% or more, more preferably 99.92% or more, and further preferably 99.95% or more.
- the upper limit of the thermal conductivity is not particularly limited, but the higher the purity of the ⁇ -alumina filler, the higher the thermal conductivity.
- Sumiko Random AA series (trade name, manufactured by Sumitomo Chemical Co., Ltd.) can be mentioned.
- the average particle size (d50) of the filler is preferably 1/2 or less of the thickness of the adhesive film, more preferably 1/3 or less, and further preferably 1/4 or less. .
- the average particle size of the filler exceeds 1/2 of the thickness of the adhesive film, the unevenness of the film surface becomes large, and the adhesive strength, laminating property, reliability and the like may be lowered.
- the filler one having a single average particle diameter (d50) may be used alone, or two or more kinds of fillers having different average particle diameters (d50) may be used in combination.
- the content of (d) filler in the adhesive film is preferably 60 with respect to 100 parts by mass of the total amount of (a) polymer, (b) epoxy resin, (c) curing agent and curing accelerator, and (d) filler. To 95 parts by mass, more preferably 65 to 95 parts by mass, and still more preferably 70 to 90 parts by mass. (D) If the filler content is less than 60 parts by mass, the thermal conductivity of the adhesive film may be insufficient, and if it exceeds 95 parts by mass, the flexibility and adhesiveness of the adhesive film may be reduced. is there.
- the adhesive composition constituting the adhesive film of this embodiment contains, for example, a curing accelerator, a filler, a coupling agent, an ion scavenger, and a flux agent in addition to the components (a) to (d). Also good.
- the filler of the above (d) filler (thermal conductivity of 10 W / (m ⁇ K) or more) is used.
- Various fillers other than the above may be blended in the resin composition.
- Such fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum borate whisker, crystalline silica, amorphous silica, antimony An oxide etc. are mentioned. Of these, crystalline silica and amorphous silica are preferred for improving thermal conductivity.
- aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, crystalline silica, amorphous Silica and the like are preferable.
- silica, aluminum hydroxide, and antimony oxide are preferable.
- the content of these fillers is preferably 0 to 50 parts by mass, more preferably 0 to 20 parts by mass, and still more preferably 0 to 10 parts by mass with respect to (d) 100 parts by mass of the filler.
- coupling agent In order to improve the interfacial bonding between different materials, various coupling agents may be added to the adhesive composition.
- the coupling agent include silane-based, titanium-based, and aluminum-based, and among these, silane-based coupling agents are preferable.
- the addition amount of the coupling agent is preferably 0 to 10 parts by mass with respect to 100 parts by mass of the total amount of the resin components from the viewpoint of the effect, heat resistance and cost.
- the silane coupling agent is not particularly limited, and examples thereof include vinyltrichlorosilane, vinyltris ( ⁇ -methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, and ⁇ -methacrylate.
- the titanium-based coupling agent is not particularly limited.
- isopropyl trioctanoyl titanate isopropyl dimethacrylisostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tri (dioctyl phosphate) titanate, Isopropyltricumylphenyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltris (n-aminoethyl) titanate, tetraisopropylbis (dioctylphosphite) titanate, tetraoctylbis (ditridecylphosphite) titanate, tetra (2, 2-Diallyloxymethyl-1-butyl) bis (ditridecyl) phos
- the aluminum coupling agent is not particularly limited.
- Aluminum chelate compound, aluminum isopropylate, mono-sec-butoxyaluminum diisopropylate, aluminum-sec Butylate, aluminum alcoholates of aluminum ethylate or the like can be used, may be used in combination with well or two or more types may be used one kind of these alone.
- an ion scavenger may be added to the adhesive composition.
- the compounding amount of the ion scavenger is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the resin components from the viewpoint of the effect of addition, heat resistance and cost. What is necessary is just to select a commercially available thing suitably as an ion trapping agent according to the object which should be trapped.
- a compound known as a copper damage inhibitor such as a triazine thiol compound, a bisphenol-based reducing agent, an inorganic ion adsorbent, or the like can be used.
- a copper damage inhibitor comprising a triazine thiol compound as a component Sankyo Pharmaceutical Co., Ltd., trade name: Disnet DB is commercially available.
- Bisphenol-based reducing agents include 2,2′-methylene-bis- (4-methyl-6-tert-butylphenol), 4,4′-thio-bis- (3-methyl-6-tert-butylphenol) Yoshitomi Pharmaceutical Co., Ltd., trade name: Yoshinox BB is commercially available.
- inorganic ion adsorbent examples include zirconium-based compounds, antimony bismuth-based compounds, magnesium aluminum-based compounds, and the like, and trade name: IXE manufactured by Toa Gosei Chemical Industry Co., Ltd. is commercially available.
- ⁇ Manufacture of varnish> There are no particular restrictions on the solvent used for preparing the varnish, such as methyl ethyl ketone, acetone, methyl isobutyl ketone, 2-ethoxyethanol, toluene, butyl cellosolve, methanol, ethanol, 2-methoxyethanol, dimethylacetamide, dimethylformamide. , Methylpyrrolidone, cyclohexanone, and the like can be used. Of these, high-boiling solvents such as methyl ethyl ketone, dimethylacetamide, dimethylformamide, methylpyrrolidone and cyclohexanone are preferred for the purpose of improving the coating properties. These solvents may be used alone or in combination of two or more.
- the blending amount of the solvent is not particularly limited, but the nonvolatile content when the varnish is produced is preferably 40 to 90% by mass, and more preferably 50 to 80% by mass. If the non-volatile content is less than 40% by mass, the amount of solvent that volatilizes during varnish preparation is large, and a large amount of heat is required during drying, which tends to be disadvantageous in terms of cost. Since the viscosity is too high, the coating film may be defective.
- the varnish can be manufactured by (d) dispersibility of fillers and other fillers, using a raking machine, three rolls, bead mill, etc., or a combination thereof.
- a raking machine three rolls, bead mill, etc., or a combination thereof.
- the time required for mixing can be shortened.
- an adhesive film can be formed on a carrier film by removing a solvent by heating.
- the heating conditions are not particularly limited as long as the solvent can be removed without completely curing the resin composition, and vary depending on the components of the resin composition and the type of the solvent. Heat at 80-140 ° C. for 5-60 minutes. It is preferable to cure the resin composition to about the B stage by heating.
- the residual solvent amount of the adhesive film is preferably 3% by mass or less, more preferably 1.5% by mass or less.
- carrier film polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film, polyimide film, polyethylene naphthalate film, polyethersulfone film, polyetheramide film, polyetheramideimide film, Plastic films such as polyamide film and polyamideimide film can be used. If necessary, surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, etching treatment, mold release treatment, etc. may be performed.
- a carrier film for example, Toray DuPont Co., Ltd., trade name: Kapton (polyimide film), Kaneka Chemical Co., Ltd., trade name: Apical (polyimide film), Toray DuPont Co., Ltd., Trade name: Lumirror (polyethylene terephthalate film), manufactured by Teijin Limited, trade name: Purex (polyethylene terephthalate film), etc.
- a dicing die bonding integrated film 30 includes a die bonding film 10 made of the adhesive film and a dicing film 20 laminated on the die bonding film 10.
- the dicing film 20 examples include plastic films such as a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film, and a polyimide film.
- the dicing film 20 may be subjected to surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, etching treatment, and the like as necessary.
- the dicing film 20 preferably has adhesiveness, and examples thereof include those obtained by providing adhesiveness to the above-mentioned plastic film and those provided with an adhesive layer on one side of the above-mentioned plastic film.
- the pressure-sensitive adhesive layer is formed from, for example, a resin composition (resin composition for forming a pressure-sensitive adhesive layer) containing a liquid component and a high molecular weight component and having an appropriate tack strength.
- the dicing tape provided with the pressure-sensitive adhesive layer is obtained by, for example, applying the pressure-sensitive adhesive layer-forming resin composition on the above-described plastic film and drying, or applying the pressure-sensitive adhesive layer-forming resin composition to a base film such as a PET film. It can be manufactured by bonding an adhesive layer formed by applying and drying to the above-mentioned plastic film.
- the tack strength is set to a desired value, for example, by adjusting the ratio of the liquid component and the Tg of the high molecular weight component.
- the die bonding film is the adhesive film of the present embodiment described above.
- the dicing film and the die bonding film may be in direct contact, for example, or may be laminated via another layer such as an adhesive layer.
- the dicing die bonding integrated film 30 can be manufactured, for example, by using the dicing film 20 instead of the base film in the method for manufacturing the adhesive film. Moreover, the dicing die bonding integrated film 30 can also be manufactured, for example, by separately preparing the die bonding film 10 made of the adhesive film and the dicing film 20 and laminating and integrating them.
- Example 1 a composition comprising the following components was prepared.
- -Bisphenol F type epoxy resin 4.0 parts by mass of YDF-8170C (manufactured by Toto Kasei Co., Ltd.)-Cresol novolac type epoxy resin: 1.0 part by mass of YDCN-700-10 (manufactured by Toto Kasei Co., Ltd.) XLC-LL (Mitsui Chemicals Co., Ltd.) 5.5 parts by mass, Curesol 2PZ-CN (Shikoku Chemicals Co., Ltd.) 0.01 parts by mass, A-189 (Nihon Unicar Co., Ltd., ⁇ -mercaptopropyltrimethoxy) Silane) 0.04 parts by mass A-1160 (manufactured by Nippon Unicar Co., Ltd., ⁇ -ureidopropyltriethoxysilane) 0.08 parts by mass
- Cyclohexanone was added to the above composition so that the solid content was about 80% by mass, and 85.0 parts by mass of spherical ⁇ -alumina: alumina beads CB-P05 (manufactured by Showa Denko KK) was further added.
- an equivalent amount (mass) of zirconia beads (1 mm ⁇ ) was added and mixed using a bead mill at 600 rpm for 30 minutes.
- phenoxy resin: ZX-1356-2 manufactured by Toto Kasei Co., Ltd.
- ZX-1356-2 manufactured by Toto Kasei Co., Ltd.
- a polyethylene terephthalate film A53 (manufactured by Teijin DuPont Films Ltd.) having a release treatment of 38 ⁇ m in thickness was prepared as a carrier film. After applying a varnish on this film, the adhesive film with a thickness of 25 micrometers was produced on the carrier film by heat-drying for 5 minutes at 120 degreeC.
- Example 2 to 4 Adhesive films according to Examples 2 to 4 were produced in the same manner as in Example 1 except that the blending amounts of the respective components were changed to the blending amounts shown in Table 1.
- Cyclohexanone was added to the above composition so that the solid content was about 57% by mass, and 85.0 parts by mass of spherical ⁇ -alumina: alumina beads CB-P05 (manufactured by Showa Denko KK) was further added.
- an equivalent amount (mass) of zirconia beads (1 mm ⁇ ) was added and mixed using a bead mill at 600 rpm for 30 minutes.
- 4.5 parts by mass of an epoxy group-containing acrylic rubber: HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd.
- a polyethylene terephthalate film A31 (manufactured by Teijin DuPont Films, Ltd.) having a thickness of 38 ⁇ m was prepared as a carrier film. After applying a varnish on this film, the adhesive film with a thickness of 25 micrometers was produced on the carrier film by heat-drying for 5 minutes at 120 degreeC.
- Comparative Examples 2 to 4 Adhesive films according to Comparative Examples 2 to 4 were produced in the same manner as in Comparative Example 1 except that the blending amounts of the respective components were set as shown in Table 2.
- Specific heat Cp J / (g ⁇ ° C.): The specific heat of the cured sample was measured under the conditions of a heating rate of 10 ° C./min and a temperature of 10 to 60 ° C. using a DSC method (manufactured by Perkin Elmer, DSC 8500), and a value at 25 ° C. was obtained. .
- Specific gravity (g / cm 3 ): Regarding the specific gravity of the cured sample, the specific gravity was determined using an electronic hydrometer SD-200L (manufactured by Mirage). Based on the values of thermal diffusivity ⁇ , specific heat Cp, and specific gravity obtained by each measurement, thermal conductivity (W / (m ⁇ K)) was calculated using the following formula. Thermal conductivity (W / (m ⁇ K)) thermal diffusivity (mm 2 / s) ⁇ specific heat (J / (g ⁇ ° C.)) ⁇ specific gravity (g / cm 3 )
- the adhesive film was bonded to the semiconductor chip (5 mm square) using a hot roll laminator (80 ° C., 0.3 m / min, 0.3 MPa). Further, this sample was bonded onto a 42 alloy substrate by pressure bonding at 120 ° C. and 250 g for 5 seconds, and cured at 110 ° C. for 1 hour and at 170 ° C. for 3 hours. The shear strength of this sample was measured using a universal bond tester (Dage, series 4000).
- an adhesive film that can achieve both adhesiveness and heat dissipation at a sufficiently high level, and a dicing die bonding integrated film provided with this as a die bonding film.
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Abstract
Description
(ma+mb+mc)/M≧0.43・・・(1)
[式中、maは(a)ポリマの環状構造を形成する炭素質量、mbは(b)エポキシ樹脂の環状構造を形成する炭素質量、mcは(c)硬化剤及び硬化促進剤の環状構造を形成する炭素質量、Mは(a)ポリマ、(b)エポキシ樹脂並びに(c)硬化剤及び硬化促進剤の合計質量をそれぞれ示す。]
・熱硬化後のフィルム表面の算術平均粗さRaが0.25μm以下である。
・(a)ポリマは下記不等式(2)で表される条件を満たすポリマを含む。
ma/MA≧0.40・・・(2)
[式中、maは(a)ポリマの環状構造を形成する炭素質量、MAは(a)ポリマの全質量をそれぞれ示す。]
・(a)ポリマはフェノキシ樹脂を含む。
・(d)フィラはα-アルミナ粒子である。
・接着フィルムの厚さは50μm以下である。
・(d)フィラの含有量は、(a)ポリマ、(b)エポキシ樹脂、(c)硬化剤及び硬化促進剤、並びに(d)フィラの合計量100質量部とすると、60~95質量部である。
(ma+mb+mc)/M≧0.43・・・(1)
[式中、maは(a)ポリマの環状構造を形成する炭素質量、mbは(b)エポキシ樹脂の環状構造を形成する炭素質量、mcは(c)硬化剤及び硬化促進剤の環状構造を形成する炭素質量、Mは(a)ポリマ、(b)エポキシ樹脂、並びに(c)硬化剤及び硬化促進剤の合計質量をそれぞれ示す。]
(ma+mb+mc)/M≧0.45・・・(1A)
(ma+mb+mc)/M≧0.47・・・(1B)
((ma+mb+mc)/M)の上限値は例えば0.70程度であり、この上限値を超えるとフィルムが硬くなり、接着性が不十分となりやすい。
<(a)ポリマ>
(a)ポリマとしては、フィルム形成性、耐熱性及び接着性が得られる観点から、フェノキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリカルボジイミド樹脂、シアネートエステル樹脂、アクリル樹脂、ポリエステル樹脂、ポリエチレン樹脂、ポリエーテルスルホン樹脂、ポリエーテルイミド樹脂、ポリビニルアセタール樹脂、及びウレタン樹脂が好ましい。これらの中でもフィルム形成性及び耐熱性に優れる観点から、フェノキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、アクリル樹脂、シアネートエステル樹脂、及びポリカルボジイミド樹脂がより好ましく、分子量、特性付与など調整が容易である観点から、フェノキシ樹脂が更に好ましい。(a)ポリマとして、上記樹脂から選択した一種を単独で又は二種類以上を混合して用いてもよく、二種以上のモノマーの共重合体を用いてもよい。
ma/MA≧0.40・・・(2)
ma/MA≧0.45・・・(2A)
ma/MA≧0.50・・・(2B)
[式中、maはポリマの環状構造を形成する炭素質量、MAはポリマの全質量をそれぞれ示す。]
換言すれば、(a)ポリマは、一種又は二種以上のポリマからなることが好ましく、その少なくとも一種はリングパラメータが好ましくは0.40以上であり、より好ましくは0.45以上であり、更に好ましくは0.50以上である。
(b)エポキシ樹脂として、二官能基以上で、分子量が好ましくは5000未満、より好ましくは3000未満のエポキシ樹脂を使用することができ、例えばビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂などの二官能エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂などのノボラック型エポキシ樹脂などを使用することができる。また、多官能エポキシ樹脂、複素環含有エポキシ樹脂等、一般に知られているものを適用することもできる。
本実施形態に係る接着フィルムは、(c)成分として、硬化剤及び硬化促進剤の少なくとも一方を含有すればよい。以下、硬化剤及び硬化促進剤の具体例を挙げる。
(c)硬化剤として、例えば、多官能フェノール類、アミン類、イミダゾール化合物、酸無水物、有機リン化合物及びこれらのハロゲン化物、ポリアミド、ポリスルフィド、三ふっ化ほう素を使用することができる。多官能フェノール類の例として、単環二官能フェノールであるヒドロキノン、レゾルシノール、カテコール、多環二官能フェノールであるビスフェノールA、ビスフェノールF、ビスフェノールS、ナフタレンジオール類、ビフェノール類、及びこれらのハロゲン化物、アルキル基置換体などが挙げられる。また、これらのフェノール類とアルデヒド類との重縮合物であるフェノールノボラック樹脂、レゾール樹脂、ビスフェノールAノボラック樹脂及びクレゾールノボラック樹脂等のフェノール樹脂などを使用してもよい。
硬化促進剤としては、特に制限がなく、例えば、第三級アミン、イミダゾール類、第四級アンモニウム塩などを用いることができる。イミダゾール類としては、例えば、2-メチルイミダゾール、2-エチル-4-メチルイミダゾール、1-シアノエチル-2-フェニルイミダゾール、1-シアノエチル-2-フェニルイミダゾリウムトリメリテート、2,4-ジアミノ-6-[2’-メチルイミダゾリル-(1’)]-エチル-s-トリアジンイソシアヌル酸付加物等が挙げられ、これらは1種又は2種以上を併用することもできる。イミダゾール類は、例えば、四国化成工業(株)から、2E4MZ、2PZ-CN、2PZ-CNS、2MA-OKという商品名で市販されている。
(d)フィラは10W/(m・K)以上の熱伝導率を有する。(d)フィラとしては、アルミナ粒子、窒化ホウ素粒子、窒化アルミニウム粒子、窒化ケイ素粒子、酸化亜鉛粒子、酸化マグネシウム粒子、水酸化アルミニウム粒子、水酸化マグネシウム粒子、及びダイヤモンド等の電気絶縁性のものが挙げられる。これらのうち一種を単独で用いてもよく、二種以上を併用してもよい。これらの中ではアルミナ粒子、窒化ホウ素粒子が高熱伝導率であり、分散性にも優れ、耐水特性も良好であり、入手の容易さの点から好ましい。アルミナの中ではα-アルミナが好ましく、そのAl2O3純度は好ましくは99.90%以上であり、より好ましくは99.92%以上であり、更に好ましくは99.95%以上である。熱伝導率の上限は特に制限はないが、α-アルミナフィラの純度を高くするほど、熱伝導率を高くできる。純度の高いα-アルミナとしてスミコランダムのAAシリーズ(住友化学工業製、商品名)が挙げられる。
本実施形態の接着フィルムを構成する接着剤組成物は、上記(a)~(d)の成分以外に、例えば、硬化促進剤、フィラ、カップリング剤、イオン捕捉剤、フラックス剤を含有してもよい。
接着剤組成物の取り扱い性の向上、溶融粘度の調整、チクソトロピック性の付与、耐湿性の向上などを目的として、上記(d)フィラ(熱伝導率10W/(m・K)以上)のフィラ以外の各種フィラを樹脂組成物に配合してもよい。このようなフィラとしては、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、ホウ酸アルミウイスカ、結晶性シリカ、非晶性シリカ、アンチモン酸化物等が挙げられる。これらのなかでも、熱伝導性向上のためには、結晶性シリカ、非晶性シリカ等が好ましい。溶融粘度の調整又はチクソトロピック性の付与の目的には、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、結晶性シリカ、非晶性シリカ等が好ましい。耐湿性を向上させるためには、シリカ、水酸化アルミニウム、アンチモン酸化物が好ましい。これらフィラの含有量は、(d)フィラ100質量部に対して好ましくは0~50質量部、より好ましくは0~20質量部、更に好ましくは0~10質量部である。
異種材料間の界面結合をよくするために、接着剤組成物に各種カップリング剤を添加してもよい。カップリング剤としては、シラン系、チタン系、アルミニウム系などが挙げられ、これらのうちシラン系カップリング剤が好ましい。カップリング剤の添加量は、その効果、耐熱性及びコストの点から、樹脂成分の合計量100質量部に対し、0~10質量部とするのが好ましい。
イオン性不純物を吸着して、吸湿時の絶縁信頼性をよくするために、接着剤組成物にイオン捕捉剤を配合してもよい。イオン捕捉剤の配合量は、添加による効果、耐熱性及びコストの点から、樹脂成分の合計量100質量部に対し、1~10質量部であることが好ましい。イオン捕捉剤としては、捕捉すべき対象に応じて市販のものを適宜選択して使用すればよい。銅がイオン化して溶け出すのを防止するため銅害防止剤として知られる化合物、例えば、トリアジンチオール化合物、ビスフェノール系還元剤、無機イオン吸着剤などを用いることができる。トリアジンチオール化合物を成分とする銅害防止剤は、三協製薬株式会社製、商品名:ジスネットDBが市販されている。ビスフェノール系還元剤としては、2,2’-メチレン-ビス-(4-メチル-6-第3-ブチルフェノール)、4,4’-チオ-ビス-(3-メチル-6-第3-ブチルフェノール)等が挙げられ、吉富製薬株式会社製、商品名:ヨシノックスBBが市販されている。無機イオン吸着剤としては、ジルコニウム系化合物、アンチモンビスマス系化合物、マグネシウムアルミニウム系化合物等が挙げられ、東亜合成化学工業株式会社製、商品名:IXEが市販されている。
ワニスを作製する際に使用する溶剤は特に制限がなく、例えば、メチルエチルケトン、アセトン、メチルイソブチルケトン、2-エトキシエタノール、トルエン、ブチルセルソルブ、メタノール、エタノール、2-メトキシエタノール、ジメチルアセトアミド、ジメチルホルムアミド、メチルピロリドン、シクロヘキサノン等を用いることができる。これらのなかでも、塗膜性を向上するなどの目的で、メチルエチルケトン、ジメチルアセトアミド、ジメチルホルムアミド、メチルピロリドン、シクロヘキサノン等の高沸点溶剤が好ましい。これら溶剤は一種を単独で用いてもよく又は二種以上を併用してもよい。
上記ワニスをキャリアフィルム上に塗布した後、加熱により溶剤を除去することにより、キャリアフィルム上に接着フィルムを形成することができる。加熱の条件は、樹脂組成物を完全に硬化させることなく、溶剤を除去することができる条件であれば特に制限はなく、樹脂組成物の成分及び溶剤の種類によって異なるが、一般的には、80~140℃で5~60分間加熱する。加熱により、樹脂組成物をBステージ程度まで硬化させることが好ましい。接着フィルムの残存溶媒量は、好ましくは3質量%以下であり、より好ましくは1.5質量%以下である。
本実施形態の接着フィルムは、例えば、ダイシングダイボンディング一体型フィルムに適用し得る。図1に示すとおり、本実施形態に係るダイシングダイボンディング一体型フィルム30は、上記接着フィルムからなるダイボンディングフィルム10と、ダイボンディングフィルム10に積層されたダイシングフィルム20とを備える。
(a)ポリマ
・フェノキシ樹脂:ZX-1356-2(東都化成株式会社製、分子量63000、リングパラメータ0.59)
・エポキシ基含有アクリルゴム:HTR-860P-3(帝国化学産業株式会社製、分子量100万、Tg-7℃、リングパラメータ0.0)
(b)エポキシ樹脂
・ビスフェノールF型エポキシ樹脂:YDF-8170C(東都化成株式会社製、エポキシ当量:156、液状のエポキシ樹脂、リングパラメータ0.46)
・クレゾールノボラック型エポキシ樹脂:YDCN-700-10(東都化成株式会社製、リングパラメータ0.40)
・多官能エポキシ:1032H60(新日鉄住金化学株式会社製、リングパラメータ0.49)
・YL7175-1000(ジャパンエポキシレジン株式会社製、リングパラメータ0.34)
(c)硬化剤及び硬化促進剤
・フェノール樹脂(硬化剤):XLC-LL(三井化学株式会社製、リングパラメータ0.73)
・硬化促進剤:キュアゾール2PZ-CN(四国化成工業株式会社製)
・硬化促進剤:キュアゾール2MA-OK(四国化成工業株式会社製)
(d)フィラ
・球状α-アルミナ:アルミナビーズCB-P05(昭和電工株式会社製、Al2O3純度99.89%、平均粒子径4μm)
(e)その他添加剤:
・A-189(日本ユニカー株式会社製、γ-メルカプトプロピルトリメトキシシラン)
・A-1160(日本ユニカー株式会社製、γ-ウレイドプロピルトリエトキシシラン)
・2-メチルグルタル酸(和光純薬工業株式会社製)
まず、以下の成分からなる組成物を調製した。
・ビスフェノールF型エポキシ樹脂:YDF-8170C(東都化成株式会社製)4.0質量部
・クレゾールノボラック型エポキシ樹脂:YDCN-700-10(東都化成株式会社製)1.0質量部
・フェノール樹脂:XLC-LL(三井化学株式会社製)5.5質量部
・キュアゾール2PZ-CN(四国化成工業株式会社製)0.01質量部
・A-189(日本ユニカー株式会社製、γ-メルカプトプロピルトリメトキシシラン)0.04質量部
・A-1160(日本ユニカー株式会社製、γ-ウレイドプロピルトリエトキシシラン)0.08質量部
各成分の配合量を表1記載の配合量としたことの他は、実施例1と同様にして実施例2~4に係る接着フィルムをそれぞれ作製した。
まず、以下の成分からなる組成物を調製した。
・ビスフェノールF型エポキシ樹脂:YDF-8170C(東都化成株式会社製)4.0質量部
・クレゾールノボラック型エポキシ樹脂:YDCN-700-10(東都化成株式会社製)1.0質量部
・フェノール樹脂:XLC-LL(三井化学株式会社製)5.5質量部
・硬化促進剤:キュアゾール2PZ-CN(四国化成工業株式会社製)0.01質量部
・カップリング剤:A-189(日本ユニカー株式会社製)0.04質量部
・カップリング剤:A-1160(日本ユニカー株式会社製)0.08質量部
各成分の配合量を表2記載の配合量としたことの他は、比較例1と同様にして比較例2~4に係る接着フィルムをそれぞれ作製した。
(熱伝導率)
接着フィルムを貼り合わることにより、厚さ100μm以上600μm未満の試料を作製した。この試料を110℃で1時間、及び170℃で3時間硬化させた。
・熱拡散率α(mm2/s):
硬化後の上記試料を10mm角に切断することによって、熱拡散率測定用の試料を得た。この試料の熱拡散率(接着フィルムの厚さ方向)についてレーザーフラッシュ法(NETZSCH製、LFA467HyperFlash)を用いて、25℃で測定した。
・比熱Cp(J/(g・℃)):
上記硬化後の試料の比熱について、DSC法(Perkin Elmer製、DSC8500)を用いて、昇温速度10℃/min、温度10~60℃の条件下で測定し、25℃での値を求めた。
・比重(g/cm3):
上記硬化後の試料の比重について、電子比重計SD-200L(Mirage製)を用いて比重を求めた。
各測定によって得られた熱拡散率α、比熱Cp、及び比重の値をもとに、下記式を用いて熱伝導率(W/(m・K))を算出した。
熱伝導率(W/(m・K))=熱拡散率(mm2/s)×比熱(J/(g・℃))×比重(g/cm3)
ホットロールラミネータ(80℃、0.3m/分、0.3MPa)を用いて接着フィルムと厚さ300μmのシリコンウエハを貼り合わせ、その後110℃で1時間、170℃で3時間硬化して試料を得た。微細形状測定機サーフコーダET200(株式会社小坂研究所製)を用いて2.5mmの範囲で接着フィルムの表面粗さ(Ra)を求めた。
半導体チップ(5mm角)にホットロールラミネータ(80℃、0.3m/分、0.3MPa)を用いて接着フィルムを貼り合わせた。更にこの試料を42alloyの基板上に、120℃、250gで5秒圧着して接着し、110℃で1時間、170℃で3時間硬化した。この試料のせん断強度を万能ボンドテスター(Dage社製、シリーズ4000)を用いて測定した。
Claims (8)
- (a)ポリマと、
(b)50℃において液状のエポキシ樹脂と、
(c)硬化剤及び硬化促進剤の少なくとも一方と、
(d)熱伝導率10W/(m・K)以上のフィラと、
を含む、熱硬化性を有する接着フィルムであって、
下記不等式(1)で表される条件を満たし、
熱硬化後のせん断強度が1.5MPa以上である接着フィルム。
(ma+mb+mc)/M≧0.43・・・(1)
[式中、maは(a)ポリマの環状構造を形成する炭素質量、mbは(b)エポキシ樹脂の環状構造を形成する炭素質量、mcは(c)硬化剤及び硬化促進剤の環状構造を形成する炭素質量、Mは(a)ポリマ、(b)エポキシ樹脂並びに(c)硬化剤及び硬化促進剤の合計質量をそれぞれ示す。] - 熱硬化後のフィルム表面の算術平均粗さRaが0.25μm以下である、請求項1に記載の接着フィルム。
- (a)ポリマが下記不等式(2)で表される条件を満たすポリマを含む、請求項1又は2に記載の接着フィルム。
ma/MA≧0.40・・・(2)
[式中、maはポリマの環状構造を形成する炭素質量、MAはポリマの全質量をそれぞれ示す。] - (a)ポリマがフェノキシ樹脂を含む、請求項1~3のいずれか一項に記載の接着フィルム。
- (d)フィラがα-アルミナ粒子である、請求項1~4のいずれか一項に記載の接着フィルム。
- 厚さが50μm以下である、請求項1~5のいずれか一項に記載の接着フィルム。
- (d)フィラの含有量は、(a)ポリマ、(b)エポキシ樹脂、(c)硬化剤及び硬化促進剤、並びに(d)フィラの合計量100質量部とすると、60~95質量部である、請求項1~6のいずれか一項に記載の接着フィルム。
- 請求項1~7のいずれか一項に記載の接着フィルムからなるダイボンディングフィルムと、
前記ダイボンディングフィルムに積層されたダイシングフィルムと、
を備える、ダイシングダイボンディング一体型フィルム。
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