WO2017212786A1 - Dispositif de capteur et son procédé de correction - Google Patents

Dispositif de capteur et son procédé de correction Download PDF

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Publication number
WO2017212786A1
WO2017212786A1 PCT/JP2017/015350 JP2017015350W WO2017212786A1 WO 2017212786 A1 WO2017212786 A1 WO 2017212786A1 JP 2017015350 W JP2017015350 W JP 2017015350W WO 2017212786 A1 WO2017212786 A1 WO 2017212786A1
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Prior art keywords
sensor
frequency characteristic
frequency
piezoelectric element
vibration
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PCT/JP2017/015350
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English (en)
Japanese (ja)
Inventor
大泉晶
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株式会社テイエルブイ
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Priority to JP2017545981A priority Critical patent/JP6568596B2/ja
Publication of WO2017212786A1 publication Critical patent/WO2017212786A1/fr

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H17/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements

Definitions

  • the technology disclosed herein relates to a sensor device and a sensor correction method.
  • the sensor may include a transmission unit that contacts the measurement object and transmits the vibration of the measurement object to the piezoelectric element.
  • the transmission unit has a frequency characteristic (for example, a resonance frequency) unique to the transmission unit, and the specific frequency characteristic depends on the mass, size, and the like of the transmission unit. That is, if the mass and size of the transmission unit are different, the inherent frequency characteristics are also different.
  • the senor may include other elements of the transmission unit.
  • the sensor may include a spring or a weight for pressing the piezoelectric element toward the transmission unit.
  • the specific frequency characteristic of the entire sensor depends not only on the specific frequency of the piezoelectric element but also on the mass of elements other than the piezoelectric element, the structure of the sensor, and the like.
  • the technology disclosed herein has been made in view of such a point, and an object of the technique is to reduce variations in detection accuracy caused by variations in frequency characteristics among sensors.
  • the sensor device disclosed herein includes a piezoelectric element, and includes a sensor that detects vibration of a measurement object, and a correction unit that corrects a detection result of the sensor, and the correction unit converts the detection result into the detection result. It shall correct
  • the sensor correction method disclosed herein includes a step of detecting vibration of the measurement object by the sensor, and a step of correcting the detection result of the sensor based on a specific frequency characteristic of the sensor. It shall be a sensor with features.
  • the “sensor detection result” includes not only a detection signal output from the sensor but also a detection signal processed after that and a value obtained from the detection signal.
  • the sensor device disclosed herein it is possible to reduce variations in detection accuracy due to variations in frequency characteristics of each sensor.
  • FIG. 1 is a front view showing a schematic configuration of the sensor device.
  • FIG. 2 is a longitudinal sectional view of the sensor.
  • FIG. 3 is a longitudinal sectional view showing an example of a sensor attached to a measurement object.
  • FIG. 4 is a block diagram of the processing unit.
  • FIG. 5 is a diagram showing the inherent frequency characteristics of the sensor.
  • FIG. 6 is a diagram illustrating a power spectrum of vibration of the measurement object.
  • FIG. 7 is a diagram illustrating the power spectrum of the detection signal of the sensor.
  • FIG. 8 is a diagram illustrating a frequency characteristic pattern according to the second embodiment.
  • FIG. 9 is a diagram for explaining three points used when obtaining an approximate expression of frequency characteristics in the third embodiment.
  • FIG. 1 is a front view illustrating a schematic configuration of the sensor device 100.
  • the sensor device 100 is a so-called contact-type sensor that detects a physical quantity of a measurement object in contact with the measurement object.
  • the measurement object is a steam trap
  • the physical quantity is vibration and temperature of the steam trap.
  • the sensor device 100 includes a sensor 2, a processing unit 5, and a connecting pipe 4 that connects the sensor 2 and the processing unit 5.
  • the sensor 2, the processing unit 5, and the connecting pipe 4 are arranged along a predetermined axis X, and the sensor device 100 is formed in a rod shape as a whole.
  • the sensor 2 and the connection pipe 4 are connected by a union nut 42.
  • the processing unit 5 and the connection pipe 4 are connected by a union nut 41.
  • the sensor device 100 is usually installed such that the axis X is oriented vertically, the sensor 2 is located below, and the processing unit 5 is located above.
  • the processing unit 5 is referred to as the upper side
  • the sensor 2 is referred to as the lower side.
  • FIG. 2 is a longitudinal sectional view of the sensor 2.
  • the sensor 2 includes a casing 10, a vibration detection mechanism 20 that detects (measures) vibration of the measurement object, and a temperature detection mechanism 30 that detects (measures) the temperature of the measurement object.
  • the vibration detection mechanism 20 and the temperature detection mechanism 30 are accommodated in the casing 10.
  • the casing 10 is formed in a substantially cylindrical shape, and is arranged so that the axis coincides with the axis X.
  • a step 10f is provided inside the casing 10, and the inner diameter of the upper portion 10a of the casing 10 is larger than the inner diameter of the lower portion 10b.
  • a male screw 10 c into which the union nut 42 is screwed is formed on the outer peripheral surface of the upper portion 10 a of the casing 10.
  • a male screw 10 e is formed on the outer peripheral surface of the lower portion 10 b of the casing 10.
  • a lower end 10 g that is one end in the axis X direction of the casing 10 is in contact with the measurement object when the sensor device 100 is installed.
  • the vibration detection mechanism 20 includes a detection needle 21, a holder 22, a first piezoelectric element 25a, a second piezoelectric element 25b, a first electrode plate 26a, a second electrode plate 26b, a weight 27, and a disc spring 28. And a cap 29.
  • the detection needle 21 is an elongated rod-like member.
  • the detection needle 21 is arranged so that the axis coincides with the axis X.
  • the tip (lower end) of the detection needle 21 protrudes downward from the lower end 10 g of the casing 10.
  • the detection needle 21 transmits the vibration of the measurement object to the first piezoelectric element 25 a and the second piezoelectric element 25.
  • the detection needle 21 is an example of a transmission unit.
  • the holder 22 includes an inner metal holder 23 and an outer resin holder 24 that accommodates the metal holder 23. Both the metal holder 23 and the resin holder 24 are formed in a substantially cylindrical shape, and are arranged so that the axis coincides with the axis X.
  • the metal holder 23 is opened upward, while a bottom wall 23 a is provided at the lower part of the metal holder 23.
  • An insertion hole 23b is formed in the bottom wall 23a.
  • the detection needle 21 is inserted into the insertion hole 23 b, and the detection needle 21 protrudes downward from the metal holder 23.
  • the upper end of the detection needle 21 is locked to the bottom wall 23 a so that the detection needle 21 does not fall out of the metal holder 23.
  • the first piezoelectric element 25a, the first electrode plate 26a, the second piezoelectric element 25b, the second electrode plate 26b, the weight 27, the disc spring 28, and the cap 29 are in contact with each other in order from the bottom. Is arranged in.
  • the first piezoelectric element 25 a is in contact with the upper end of the detection needle 21.
  • two signal lines (not shown) are connected to the first electrode plate 26a and the second electrode plate 26b.
  • the two signal lines are wired from the sensor 2 through the connection pipe 4 to the processing unit 5.
  • the cap 29 is a disk-shaped member having a male screw formed on the outer peripheral surface. On the inner peripheral surface of the upper end portion of the metal holder 23, a female screw is formed. The cap 29 is screwed to the upper end portion of the metal holder 23. The cap 29 presses the disc spring 28 downward by the tightening force, and the disc spring 28 presses the first piezoelectric element 25a, the second piezoelectric element 25b, and the like to the detection needle 21 through the weight 27 by the biasing force.
  • the first piezoelectric element 25a and the second piezoelectric element 25b are pressed against the detection needle 21 with a predetermined force (initial pressing force) by the weight 27, the disc spring 28, and the like.
  • a predetermined force initial pressing force
  • the disturbances can be absorbed and the influence of the disturbances can be reduced.
  • the resin holder 24 is opened upward, while a bottom wall 24 a is provided at the lower part of the resin holder 24.
  • An insertion hole 24b is formed in the bottom wall 24a.
  • a metal holder 23 is press-fitted into the resin holder 24.
  • the detection needle 21 is inserted into the insertion hole 24b, and the detection needle 21 protrudes downward from the resin holder 24.
  • the holder 22 is accommodated in the upper part 10 a of the casing 10, and the detection needle 21 protruding downward from the holder 22 is accommodated in the lower part 10 b of the casing 10.
  • the coil spring 11 is disposed above the holder 22.
  • the holder 22 is urged downward by the coil spring 11.
  • a groove 10d is formed on the inner peripheral surface of the upper end portion of the casing 10, and a snap ring 12 is fitted in the groove 10d.
  • One end of the coil spring 11 is supported by the snap ring 12.
  • the other end of the coil spring 11 is in contact with the upper end surface of the resin holder 24.
  • the coil spring 11 urges the resin holder 24 (holder 22) downward, and presses the resin holder 24 against the step 10f in the casing 10. In this state, the tip of the detection needle 21 slightly protrudes from the lower end 10 g of the casing 10.
  • the temperature detection mechanism 30 includes a contact plate 31 (heat transfer plate) and a holding member 32.
  • the contact plate 31 is a substantially annular plate member having an opening at the center.
  • the holding member 32 is formed in a substantially cylindrical shape having a through hole 33 in the center, and is inserted into the lower end portion of the casing 10. The contact plate 31 is held at the tip of the holding member 32.
  • the holding member 32 is formed with two arrangement holes 34 and 35 for arranging a thermocouple so as to extend in the axial direction.
  • a thermocouple (not shown) is arranged in each of the arrangement holes 34 and 35. One end of each thermocouple is connected to the contact plate 31, and the other end is connected to the processing unit 5 through the connection pipe 4.
  • the coil spring 13 is disposed above the holding member 32.
  • One end of the coil spring 13 is held by a holder 22 (resin holder 24).
  • the other end of the coil spring 13 is in contact with the holding member 32.
  • the coil spring 13 biases the holding member 32 downward, so that the contact plate 31 protrudes slightly below the lower end 10 g of the casing 10. That is, the contact plate 31 protrudes from the lower end 10 g of the casing 10, and the detection needle 21 further protrudes from the contact plate 31.
  • the contact plate 31 contacts the measurement object.
  • FIG. 3 is a longitudinal sectional view showing an example of the sensor 2 attached to the measurement object 90.
  • the sensor 2 is attached to the attachment seat 91 of the measurement object 90.
  • the mounting seat 91 is formed, for example, in a steam trap casing.
  • the mounting seat 91 is formed in a boss shape and has a bottomed installation hole 92. On the inner peripheral surface of the installation hole 92, a female screw is formed.
  • the sensor 2 is screwed to the measuring object 90 by screwing the lower part 10b of the casing 10 into the installation hole 92. At this time, the casing 10 is tightened with a predetermined tightening torque by a torque wrench or the like.
  • the tip of the detection needle 21 and the contact plate 31 protrude below the lower end 10g.
  • the detection needle 21 can move upward with respect to the casing 10 against the biasing force of the coil spring 11, and the contact plate 31 moves upward with respect to the casing 10 against the biasing force of the coil spring 13. Is possible. Therefore, when the lower end 10 g of the casing 10 contacts the bottom of the installation hole 92, the tip of the detection needle 21 and the contact plate 31 are flush with the lower end 10 g of the casing 10 and contact the bottom of the installation hole 92. Yes.
  • the detection needle 21 and the contact plate 31 are in contact with the bottom of the installation hole 92, and the vibration and temperature of the measurement object 90 are detected.
  • FIG. 4 is a block diagram of the processing unit 5.
  • the processing unit 5 processes the detection signal from the sensor 2 and transmits / receives a signal to / from an external device.
  • the processing unit 5 determines the vibration processing unit 51 that processes the detection signal from the vibration detection mechanism 20, the temperature processing unit 52 that processes the detection signal from the temperature detection mechanism 30, the memory 53, and the state of the measurement object.
  • a communication unit 55 that communicates with an external device.
  • the vibration processing unit 51 includes a filter 56, an amplifier 57, an A / D conversion unit 58, an FFT unit 59, and a correction unit 510.
  • the filter 56 is a bandpass filter, and cuts frequency components other than a predetermined frequency band in the output signal from the vibration detection mechanism 20.
  • the predetermined frequency band is set according to the vibration that can occur in the measurement object.
  • the amplifier 57 amplifies the signal processed by the filter 56.
  • the A / D converter 58 converts the signal amplified by the amplifier 57 into a digital signal.
  • the FFT unit 59 performs FFT (Fast Fourier Transform), that is, fast Fourier transform, on the digital signal from the A / D conversion unit 58. That is, the FFT unit 59 obtains the power spectrum (or amplitude spectrum) of each frequency component included in the detection signal.
  • FFT Fast Fourier Transform
  • the correction unit 510 corrects the power spectrum obtained by the FFT unit 59 based on the unique frequency characteristic of the sensor 2. Details of correction by the correction unit 510 will be described later.
  • the temperature processing unit 52 appropriately processes the detection signal from the temperature detection mechanism 30 so that the determination unit 54 can process it. In the present disclosure, details thereof are omitted.
  • the memory 53 stores programs and data necessary for processing in the processing unit 5.
  • the memory 53 stores a unique frequency characteristic of the sensor 2.
  • the memory 53 is an example of a storage unit.
  • the determination unit 54 determines the state of the measurement object based on the signal processed by the vibration processing unit 51 and / or the signal processed by the temperature processing unit 52.
  • the determination unit 54 determines the state of the steam trap that is the measurement target based on the signal processed by the vibration processing unit 51. Specifically, the determination unit 54 obtains an index (hereinafter referred to as “vibration level”) indicating the magnitude of the vibration of the steam trap based on the signal processed by the vibration processing unit 51.
  • vibration level an index
  • the determination unit 54 determines that there is no steam leak in the steam trap when the vibration level is equal to or lower than the predetermined determination level, and determines that there is steam leak in the steam trap when the vibration level is higher than the determination level.
  • the determination unit 54 determines the state of the steam trap based on the signal processed by the temperature processing unit 52. Specifically, the temperature of the steam trap is close to the saturation temperature of the vapor pressure when the drain is appropriately distributed, while it is lowered when the drain is retained. The determination unit 54 determines that there is no retention of drain when the temperature of the steam trap is equal to or higher than a predetermined determination temperature, and determines that there is retention of drain when the temperature of the steam trap is lower than the determination temperature.
  • the communication unit 55 transmits and receives signals to and from external devices by wireless communication.
  • the communication unit 55 transmits the determination result by the determination unit 54 to the external device.
  • ⁇ Sensor correction method> Hereinafter, the correction of the sensor 2 will be described in detail.
  • the sensor 2 has a sensitivity relationship with respect to frequency as shown by a solid line in FIG.
  • the frequency characteristics of the sensor 2 include the mass of the detection needle 21, the intrinsic frequency characteristic of the first piezoelectric element 25a, the intrinsic frequency characteristic of the second piezoelectric element 25b, the mass of the weight 27, the elastic constant of the disc spring 28, and the sensor. 2 is dependent on assembly error. If these factors vary, the frequency characteristics of the sensor 2 may vary as shown by the two-dot chain line in FIG.
  • the output (detection signal) of the sensor 2 varies.
  • vibration having a power spectrum as shown in FIG. In the case of the sensor 2 having the sensitivity relationship R1 (f) with respect to the frequency shown by the solid line in FIG. 5, the power spectrum S1 (f) of the detection signal is as shown by the solid line in FIG.
  • the power spectrum S2 (f) of the detection signal is as shown by the two-dot chain line in FIG.
  • frequency characteristic R (f) the relationship of sensitivity to frequency
  • frequency characteristic R (f) the relationship of sensitivity to frequency
  • the sensor device 100 corrects the detection signal of the sensor 2 based on the frequency characteristic of the sensor 2.
  • the inherent frequency characteristic is obtained by detecting the output of the sensor 2 when vibration of a single frequency is applied to the sensor 2 by the vibrator, and repeating this detection while sweeping the frequency within a predetermined frequency band. Measured.
  • the process of measuring the intrinsic frequency characteristic of the sensor 2 is performed in advance, and the frequency characteristic of the sensor 2 is stored in the memory 53.
  • the processing unit 5 reads the detection signal from the sensor 2. This step corresponds to a step of detecting the vibration of the measurement object with a sensor. Then, as described above, the processing unit 5 performs filter processing, amplification processing, A / D conversion, and FFT processing on the detection signal from the sensor 2.
  • the correction unit 510 corrects the detection signal from the sensor 2 that has been transformed into a power spectrum by FFT processing. This correction corresponds to a step of correcting the detection result of the sensor 2 based on the inherent frequency characteristic.
  • the correction unit 510 corrects the detection signal of the sensor 2 so as to be a detection signal when the sensor 2 has a predetermined reference frequency characteristic.
  • the reference frequency characteristic is set in common with other sensor devices 100. For example, a reference frequency characteristic Rref (f) as shown by a broken line in FIG. 5 is set.
  • the reference frequency characteristic Rref (f) has a uniform sensitivity r1 in a predetermined frequency band, and the sensitivity is 0 outside the frequency band.
  • the reference frequency characteristic Rref (f) is stored in the memory 53.
  • the correction unit 510 corrects the power spectrum S (f) obtained by the FFT unit 59 based on Expression (1).
  • S ′ (f) A (f) ⁇ S (f) (1)
  • S ′ (f) is a corrected power spectrum, and is hereinafter referred to as “corrected power spectrum”.
  • a (f) is a function having the frequency f as a variable, and is hereinafter referred to as a “correction function”.
  • the correction function A (f) is expressed by equation (2).
  • R (f) Rref (f) / R (f) (2)
  • R (f) is a characteristic frequency characteristic of the sensor 2 described above, and is a relationship of sensitivity to frequency.
  • Rref (f) is a relationship that serves as a reference for sensitivity to frequency, and is referred to as a reference frequency characteristic.
  • the correction function A (f) is a ratio of the reference frequency characteristic Rref (f) to the inherent frequency characteristic R (f). In the inherent frequency characteristic of the sensor 2, the value of the correction function A (f) increases as the frequency component has a sensitivity lower than that of the reference frequency characteristic.
  • the correction unit 510 increases or decreases each frequency component of the power spectrum according to the ratio of the sensitivity of the reference frequency characteristic to the sensitivity of the inherent frequency characteristic.
  • the corrected power spectrum S ′ (f) thus obtained corresponds to the power spectrum detected by the sensor 2 having the reference frequency characteristic Rref (f).
  • R (f) R1 (f) in the equation (2).
  • the power spectrum S (f) is corrected according to the ratio of the reference frequency characteristic Rref (f) to the frequency characteristic R1 (f).
  • the corrected power spectrum S1 '(f) is as shown by the broken line in FIG.
  • R (f) R2 (f) in the equation (2).
  • the power spectrum S (f) is corrected according to the ratio of the reference frequency characteristic Rref (f) to the frequency characteristic R2 (f).
  • the corrected power spectrum S2 '(f) is as shown by the broken line in FIG. That is, the corrected power spectrum S1 '(f) and the corrected power spectrum S2' (f) are substantially the same.
  • any of the power spectra S1 (f) and S2 (f) has the same reference frequency characteristic Rref (f). Is corrected to a power spectrum detected by the sensor 2. As a result, if the vibration of the measurement object is the same, the corrected power spectra S1 '(f) and S2' (f) are also substantially the same. That is, even if the frequency characteristics of the sensor 2 vary, the variation in detection accuracy is reduced.
  • the sensor device 100 includes the first piezoelectric element 25a and the second piezoelectric element 25b, the sensor 2 that detects the vibration of the measurement object, and the correction unit 510 that corrects the detection result from the sensor 2.
  • the correction unit 510 corrects the detection result based on the unique frequency characteristic of the sensor 2.
  • the correction method of the sensor 2 includes a step of detecting the vibration of the measurement object 90 by the sensor 2 and a step of correcting the detection result of the sensor 2 based on the unique frequency characteristic of the sensor 2.
  • the output signal of the sensor 2 is corrected based on the unique frequency characteristic of the sensor 2, the variation in the detection signal of the sensor 2 due to the variation in the frequency characteristic of each sensor 2 can be reduced. it can.
  • the sensor device 100 further includes a memory 53 that stores a unique frequency characteristic of the sensor 2.
  • the unique frequency characteristic of the sensor 2 can be acquired in advance and stored in the memory 53.
  • the sensor 2 has a detection needle 21 (transmission unit) that transmits the vibration of the measurement object to the first piezoelectric element 25a and the second piezoelectric element 25, and the inherent frequency characteristics are at least the first piezoelectric element 25a and the second piezoelectric element.
  • This is a frequency characteristic of a structure including the element 25b and the detection needle 21.
  • the processing unit 5 corrects the output signal of the sensor 2 based on the frequency characteristics of the structure including at least the first piezoelectric element 25a, the second piezoelectric element 25b, and the detection needle 21.
  • the output signal of the sensor 2 is corrected in consideration of the variation in the frequency characteristics caused by the elements that can affect the frequency characteristics. be able to.
  • Embodiment 2 ⁇ Embodiment 2 >> Next, a sensor correction method according to the second embodiment will be described.
  • the configuration of the sensor device 100 is common to the first embodiment and the second embodiment.
  • a correction function for correcting the power spectrum S (f) of the detection signal of the sensor 2 is different from that of the first embodiment.
  • the correction unit 510 corrects the power spectrum S (f) obtained by the FFT unit 59 based on Expression (3).
  • B (f) is a correction function for correcting the power spectrum S (f).
  • the correction function B (f) is set according to the unique frequency characteristic of the sensor 2.
  • correction function B (f) is expressed by the equation (4).
  • Rb (f) Rref (f) / ⁇ Rb (f) ⁇ (rp / r2) ⁇ (4)
  • Rb (f) is a frequency characteristic pattern selected from a plurality of frequency characteristic patterns prepared in advance. For example, as shown in FIG. 8, three frequency characteristic patterns Rb1 (f), Rb2 (f), and Rb3 (f) are prepared.
  • the three frequency characteristic patterns Rb1 (f), Rb2 (f), and Rb3 (f) have the same graph shape, and are representative graph shapes of the unique frequency characteristics of the sensor 2.
  • the three frequency characteristic patterns Rb1 (f), Rb2 (f), and Rb3 (f) differ only in the resonance frequency, that is, in the frequency band.
  • the first frequency characteristic pattern Rb1 (f) is a frequency characteristic having a relatively low resonance frequency.
  • the third frequency characteristic pattern Rb3 (f) is a frequency characteristic having a relatively high resonance frequency.
  • the second frequency characteristic pattern Rb2 (f) is a frequency characteristic having an intermediate resonance frequency.
  • the maximum sensitivity values of the three frequency characteristic patterns Rb1 (f), Rb2 (f), and Rb3 (f) are the same at r2.
  • a pattern that is closest to the specific frequency characteristic of the sensor 2 is selected, and the magnitude of the sensitivity of the selected frequency characteristic pattern is the magnitude of the sensitivity of the specific frequency characteristic of the sensor 2. It is adjusted so that it approaches.
  • the first frequency characteristic pattern Rb1 (f) is selected.
  • the second frequency characteristic pattern Rb2 (f) is selected.
  • the third frequency characteristic pattern (f) is selected. That is, a pattern whose frequency band is closest to the frequency band of the unique frequency characteristic of the sensor 2 is selected from the three frequency characteristic patterns. In the example of FIG. 8, the second frequency characteristic pattern Rb2 (f) is selected.
  • Rp / r2 is the ratio of the maximum sensitivity value of the sensor 2 to the maximum sensitivity value of the frequency characteristic pattern. That is, by multiplying the frequency characteristic pattern Rb (f) by the ratio rp / r2 of the maximum sensitivity value, the magnitude of the sensitivity of the frequency characteristic pattern Rb (f) becomes the magnitude of the sensitivity of the intrinsic frequency characteristic of the sensor 2. It is adjusted to approach. In the example of FIG. 8, the magnitude of the sensitivity of the second frequency characteristic pattern Rb2 (f) is expanded as a whole.
  • the inherent resonance frequency fr of the sensor 2 and the maximum sensitivity value rp of the sensor 2 are obtained by measuring the inherent frequency characteristics of the sensor 2 as described above.
  • the denominator of the equation (2) in the first embodiment is a frequency characteristic unique to the sensor 2
  • the denominator of the equation (4) in the second embodiment approximates the frequency characteristic unique to the sensor 2. It is a characteristic.
  • the power spectrum S (f) is corrected according to the ratio of the reference frequency characteristic Rref (f) to the frequency characteristic to be approximated to obtain a corrected power spectrum S ′ (f).
  • the power spectrum S (f) is corrected to a power spectrum close to the power spectrum detected by the sensor 2 having the reference frequency characteristic Rref (f).
  • the memory 53 includes three frequency characteristic patterns Rb1 (f), Rb2 (f), Rb3 (f), a maximum sensitivity value r2 of the frequency characteristic pattern, and a unique resonance frequency of the sensor 2 as the frequency characteristic of the sensor 2
  • the maximum value rp of the sensitivity of fr and the sensor 2 is stored.
  • the correction unit 510 selects an optimum frequency characteristic pattern from the three frequency characteristic patterns Rb1 (f), Rb2 (f), and Rb3 (f) based on the unique resonance frequency fr of the sensor 2. Then, the correction unit 510 obtains a corrected power spectrum S ′ (f) based on the equations (3) and (4).
  • the sensitivity relationship with respect to the frequency of the sensor 2 (that is, R (f)) is measured for each sensor device 100, and the sensitivity relationship with respect to the frequency of the individual sensor 2 is stored in the memory 53 for each sensor device 100. It is necessary to let On the other hand, in the second embodiment, only the unique resonance frequency fr and the maximum sensitivity value rp of the sensor 2 need only be measured for each sensor device 100, and what is stored individually for each sensor device 100 is unique to the sensor 2. Resonance frequency fr and the maximum sensitivity rp. Therefore, labor and time required for manufacturing the sensor device 100 can be reduced.
  • the frequency characteristic pattern may be selected and the sensitivity magnitude may be adjusted in advance to obtain the denominator of Equation (4) in advance, and the denominator of Equation (4) may be stored in the memory 53.
  • Embodiment 3 ⁇ Embodiment 3 >> Next, a sensor correction method according to the third embodiment will be described.
  • the configuration of the sensor device 100 according to the third embodiment is the same as that of the first embodiment.
  • the correction function for correcting the power spectrum S (f) of the detection signal of the sensor 2 is different from those in the first and second embodiments.
  • the correction unit 510 corrects the power spectrum S (f) obtained by the FFT unit 59 based on Expression (5).
  • C (f) is a correction function for correcting the power spectrum S (f).
  • the correction function C (f) is set according to the unique frequency characteristic of the sensor 2.
  • correction function C (f) is expressed by Equation (6).
  • R ′ (f) Rref (f) / R ′ (f) (6)
  • R ′ (f) is an approximate expression of the inherent frequency characteristic of the sensor 2.
  • the approximate expression R ′ (f) uses three sets of values (fr, rp), (fh1, rp / ⁇ 2), and (fh2, rp / ⁇ 2) related to frequency and sensitivity. This is an approximate expression to be obtained.
  • fr is the inherent resonance frequency of the sensor 2
  • rp is the maximum sensitivity rp of the sensor 2
  • fh1 is the lower frequency when the sensitivity of the sensor 2 is rp / ⁇ 2.
  • fh2 is the higher frequency when the sensitivity of the sensor 2 is rp / ⁇ 2.
  • the power spectrum S (f) is corrected according to the ratio of the reference frequency characteristic Rref (f) to the approximate expression R ′ (f) of the frequency characteristic to obtain a corrected power spectrum S ′ (f).
  • the power spectrum S (f) is corrected to a power spectrum close to the power spectrum detected by the sensor 2 having the reference frequency characteristic Rref (f).
  • the memory 53 stores the above-described three sets of values, that is, the sensitivity maximum values rp and rp / ⁇ 2 of the sensor 2, and the frequencies fr, fh1, and fh2 corresponding to the respective values. Yes. These values are measured in advance.
  • the memory 53 also stores a basic expression for obtaining the approximate expression R ′ (f). The basic formula is common to all the sensor devices 100.
  • the correction unit 510 obtains an approximate expression R ′ (f) based on the basic expression and the three sets of values.
  • the correcting unit 510 calculates a corrected power spectrum S ′ (f) based on the obtained approximate expression R ′ (f) and expressions (5) and (6).
  • each sensor device 100 has three points in the relationship of sensitivity to the frequency of the sensor 2 (that is, the resonance frequency fr and the maximum sensitivity value rp, and the frequency fh1 when the sensitivity is rp / ⁇ 2). , Fh2) only need to be measured, and the values stored individually for each sensor device 100 are also three-point values. Therefore, the labor and time required for manufacturing the sensor device 100 can be reduced, and the amount of data held in the memory 53 can be reduced.
  • the approximate expression R ′ (f) is not limited to those obtained based on three sets of values relating to frequency and sensitivity, and may be obtained based on two sets or four or more sets of values. Further, the three sets of values are not limited to the resonance frequency fr, the maximum sensitivity value rp, and the frequencies fh1 and fh2 when the sensitivity is rp / ⁇ 2, and can be arbitrarily set.
  • the measurement object 90 is not limited to a steam trap.
  • the configuration of the sensor device 100 is not limited to the above-described configuration.
  • the sensor 2 and the processing unit 5 may be coupled without using the connection pipe 4.
  • the sensor device 100 detects temperature and vibration, but may not detect the temperature detection mechanism 30 and may detect only vibration.
  • the sensor device 100 may not be attached to the measurement object by screw fastening.
  • the sensor device 100 may further include a clamp member or the like for attaching to the measurement object, and may be configured to be attached to the measurement object by the clamp member.
  • the configuration of the sensor 2 is not limited to the configuration described above.
  • the number of piezoelectric elements need not be two, but may be one, or three or more.
  • the detection needle 21, the weight 27, the disc spring 28, and the like are not essential, and any configuration can be adopted as long as the vibration of the measurement target is input to the piezoelectric element.
  • the inherent frequency characteristics (for example, the resonance frequency) of the sensor 2 can be adjusted.
  • the processing unit 5 includes the determination unit 54 and determines the state of the measurement object, but is not limited thereto. In addition, the processing unit 5 may output the detection signal corrected by the correction unit 510. The processing unit 5 may be connected to an external device not by radio but by wire.
  • the correction unit 510 is included in the processing unit 5, but is not limited thereto.
  • the correction unit 510 may be included in a server or the like. That is, the correction unit 510 may be physically separated (not integrally packaged) from the sensor 2 and the processing unit 5.
  • the frequency characteristics of the entire structure of the sensor 2 including the detection needle 21, the first piezoelectric element 25 a, the second piezoelectric element 25 b, the weight 27, and the disc spring 28 are set as the inherent frequency characteristics of the sensor 2. It is handled, but it is not limited to this. Only elements that have a large influence on the inherent frequency characteristics of the sensor 2 may be considered. For example, when the influence of the piezoelectric element on the intrinsic frequency characteristic of the sensor 2 is large and the influence of other elements on the intrinsic frequency characteristic of the sensor 2 is slight, the intrinsic frequency characteristic of the piezoelectric element is expressed by the sensor 2. It may be handled as a characteristic frequency characteristic of.
  • the reference frequency characteristic Rref (f) is not limited to the frequency characteristic described above.
  • the reference frequency characteristic Rref (f) may have a graph shape like a normal distribution instead of a uniform sensitivity in a predetermined frequency band. That is, as long as the detection result of the sensor 2 is corrected so that the sensors 2 of all the sensor devices 100 have a common reference frequency characteristic Rref (f), the graph shape of the reference frequency characteristic Rref (f) is an arbitrary shape. It can be.
  • the technique disclosed herein is useful for the sensor device and the sensor correction method.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

La présente invention concerne un dispositif de capteur 100 qui est pourvu : d'un capteur 2, qui possède un premier élément piézoélectrique 25a et un second élément piézoélectrique 25b, et qui détecte les vibrations d'un sujet devant être mesuré ; d'une unité de correction 510 qui corrige les résultats de détection obtenus du capteur 2. L'unité de correction 510 corrige les résultats de détection sur la base des caractéristiques de fréquence inhérentes du capteur 2.
PCT/JP2017/015350 2016-06-07 2017-04-14 Dispositif de capteur et son procédé de correction WO2017212786A1 (fr)

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JP2022088804A (ja) * 2020-12-03 2022-06-15 株式会社ミヤワキ 振動プローブおよび計測装置
JP7349184B1 (ja) 2022-07-28 2023-09-22 株式会社ミヤワキ 計測装置
JP7349183B1 (ja) 2022-07-28 2023-09-22 株式会社ミヤワキ 計測装置

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JP7349161B2 (ja) * 2021-02-25 2023-09-22 株式会社ミヤワキ 計測装置

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JPH06129892A (ja) * 1992-10-15 1994-05-13 Tlv Co Ltd 振動測定装置
JP2000329784A (ja) * 1999-05-24 2000-11-30 Ubukata Seisakusho:Kk 加速度センサー及び加速度検出装置
JP2001021412A (ja) * 1999-07-12 2001-01-26 Shibaura Mechatronics Corp 音圧検知装置
JP2002267490A (ja) * 2001-03-09 2002-09-18 Rion Co Ltd レンジ切換えに伴う切換誤差の自動補正方法及びそれを用いた装置
JP2008545137A (ja) * 2005-06-29 2008-12-11 ソシエテ ドゥ テクノロジー ミシュラン Saw較正係数を格納するrfid
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Publication number Priority date Publication date Assignee Title
JP2022088804A (ja) * 2020-12-03 2022-06-15 株式会社ミヤワキ 振動プローブおよび計測装置
JP7366426B2 (ja) 2020-12-03 2023-10-23 株式会社ミヤワキ 振動プローブおよび計測装置
JP7349184B1 (ja) 2022-07-28 2023-09-22 株式会社ミヤワキ 計測装置
JP7349183B1 (ja) 2022-07-28 2023-09-22 株式会社ミヤワキ 計測装置

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