WO2017211291A1 - 发光二极管照明模组 - Google Patents

发光二极管照明模组 Download PDF

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Publication number
WO2017211291A1
WO2017211291A1 PCT/CN2017/087428 CN2017087428W WO2017211291A1 WO 2017211291 A1 WO2017211291 A1 WO 2017211291A1 CN 2017087428 W CN2017087428 W CN 2017087428W WO 2017211291 A1 WO2017211291 A1 WO 2017211291A1
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WO
WIPO (PCT)
Prior art keywords
base
led lighting
lighting module
emitting diode
hole
Prior art date
Application number
PCT/CN2017/087428
Other languages
English (en)
French (fr)
Inventor
陈凯
黄建明
Original Assignee
杭州华普永明光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201620553724.3U external-priority patent/CN205717124U/zh
Application filed by 杭州华普永明光电股份有限公司 filed Critical 杭州华普永明光电股份有限公司
Priority to EP17809730.9A priority Critical patent/EP3460323A4/en
Priority to US16/307,737 priority patent/US10808912B2/en
Priority to JP2018563895A priority patent/JP2019523972A/ja
Publication of WO2017211291A1 publication Critical patent/WO2017211291A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F21V27/02—Cable inlets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present disclosure relates to an LED lighting module.
  • a Light Emitting Diode is a semiconductor light emitting device.
  • a light emitting diode includes a semiconductor chip, and by applying a current to the semiconductor chip, photon emission can be caused by composite emission of carriers in the semiconductor to cause photon emission, thereby enabling the semiconductor chip to emit light.
  • An LED lighting device is an illumination device that uses a light emitting diode as a light source. LED lighting device has the advantages of energy saving, long life, good applicability, short response time and environmental protection. Therefore, it has a good application prospect in the fields of illumination, signal indication and backlight display.
  • An embodiment of the present disclosure provides an LED lighting module, including: a base having a mounting surface; at least one LED component disposed on a mounting surface of the base, each of the LED components including the package And a plurality of light emitting diode chips; and a lens assembly disposed on a side of the base on which the at least one light emitting diode element is disposed, and forming an accommodating space with the base, the at least one light emitting diode element Located in the accommodating space, the lens assembly includes a lens supporting portion and a lens portion corresponding to the light emitting diode element, and the lens portion is disposed on a corresponding light emitting diode element to implement the corresponding illuminating The light distribution of the diode element is connected to the lens portion to support the lens portion.
  • each of the light emitting diode elements is a separately packaged multi-chip light emitting diode bead.
  • the light emitting diode element further includes: a bracket, the plurality of light emitting diode chips are arranged in a matrix on the bracket; and an encapsulation layer enclosing the bracket and the plurality of light emitting diodes chip.
  • the encapsulation layer directly covers the bracket and the plurality of light emitting diodes On the chip, the plurality of light emitting diode chips are sealed on the bracket.
  • the LED lighting module further includes: a circuit board disposed on the mounting surface, the at least one light emitting diode element disposed on the circuit board.
  • the base includes a circuit board.
  • the base includes a body portion that supports the light emitting diode element.
  • the base further includes a heat sink disposed on a side of the body portion opposite the mounting surface.
  • the base includes a light stand.
  • the LED lighting module further includes a securing assembly disposed at an edge of the lens assembly to secure the lens assembly to the base.
  • the securing assembly includes at least one of: a securing member configured to apply a pressure to the lens assembly toward the base to tighten the lens assembly to the base a sealant disposed between the lens assembly and the base to secure the lens assembly to the base and to form the accommodation between the lens assembly and the base Space, the accommodating space is a sealed space.
  • the LED lighting module further includes: a resilient washer disposed between the base and the lens assembly, the fixing assembly fixing the lens assembly and the base to each other and the elastic washer It is in a compressed state.
  • the lens support is integral with the fixture.
  • the lens support is separate from the fixture.
  • the fixture includes a first portion disposed on a side of the lens assembly opposite the base and facing a portion of the lens assembly, and extending from the first portion and the base A second portion of the attachment, the first portion of the fastener applying a pressure to the lens assembly toward the base.
  • the second portion extends from a side of the lens assembly to a side of the base, and the second portion of the fixture forms a snap-fit structure with the base to enable the first portion Two parts are connected to the base.
  • the second portion extends from a side of the lens assembly to a side of the base, and a second portion of the fastener passes through a fastener to connect the second portion to the base.
  • the fixture includes a first portion disposed on a side of the lens assembly opposite the base and facing a portion of the lens assembly, the LED lighting module further including a fastening The fastener secures the first portion to the base.
  • the fastener is a screw.
  • the light stand includes a power source mounting portion and the light source mounting portion, the lens assembly and the light emitting diode element are disposed on the light source mounting portion, and the power source mounting portion is configured to place a power source assembly.
  • the base includes a plurality of through holes between the light source mounting portion and the power source mounting portion.
  • the LED lighting module further includes: a wire lead-out structure including a wire leading from the receiving space through a through hole penetrating the base to an outside of the LED lighting device, the wire and the wire The through holes are sealed.
  • the wire take-up structure further includes a seal ring that seals a gap between the wire and the through hole.
  • the wire take-up structure further includes an externally threaded tube passing through the sealing ring and the externally threaded tube, an inner circumferential surface of the sealing ring being in close contact with the wire, An outer peripheral surface of the seal ring closely fits an inner peripheral surface of the outer-threaded tube, and the outer-threaded tube at least partially protrudes into the through hole and is coupled to an inner wall of the through hole.
  • the through hole penetrating the base includes a first hole, a transitional conical hole, and a second hole that are sequentially connected, and the first hole is formed on a side of the base away from the accommodating space, the first Two holes are formed on a side of the base adjacent to the accommodating space, and the transitional tapered hole is formed between the first hole and the second hole; the diameter of the first hole is larger than the first hole a diameter of the two-hole, the transitional tapered hole gradually changing from a diameter of the first hole to a second hole in a direction from an end away from the accommodating space to an end close to the accommodating space diameter of.
  • the first hole of the through hole has an internal thread
  • the externally threaded tube extends into the first hole of the through hole
  • the external thread of the externally threaded tube and the internal thread of the first hole Engage with each other.
  • the seal ring includes a head portion having a larger outer diameter and a body portion having a smaller outer diameter, and an inner peripheral surface of the outer-threaded tube closely fits an outer peripheral surface of the body portion of the seal ring.
  • the head of the seal ring is closer to the accommodating space than the body portion of the seal ring.
  • an outer diameter of the outer threaded tube and an outer diameter of a head of the sealing ring are both larger than a diameter of a second hole of the through hole, the head of the sealing ring being pressed at the Between the end of the externally threaded tube and the tapered surface of the transitional conical bore.
  • the base includes a body portion that supports the light emitting diode element and a heat sink disposed on a side of the body portion opposite the mounting surface.
  • the base further includes a mounting portion that projects outwardly from the heat sink at both ends of the LED lighting device.
  • the mounting portion is a plate-like structure that is parallel to the mounting surface or a wedge-shaped structure that is bent into a wedge shape.
  • the end of the wire that protrudes outside the receiving space is connected with a waterproof joint.
  • FIG. 1 is an exploded perspective view of an LED lighting module according to an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view of an LED lighting module according to an embodiment of the present disclosure
  • FIG. 3 is a schematic plan view of an LED lighting module according to an embodiment of the present disclosure.
  • FIG. 4a is a schematic plan view of an LED component according to an embodiment of the present disclosure.
  • FIG. 4b is a cross-sectional view of an LED device along the AA' direction of FIG. 4a according to an embodiment of the present disclosure
  • FIG. 5 is a schematic cross-sectional view of an LED lighting module according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic cross-sectional view of another LED lighting module according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic cross-sectional view of another LED lighting module according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of another LED lighting module according to an embodiment of the present disclosure.
  • FIG. 9 is a schematic cross-sectional view of another LED lighting module according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic cross-sectional view of another LED lighting module according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic plan view of a lamp holder according to an embodiment of the present disclosure.
  • FIG. 12 is a perspective view of a light emitting diode illumination device according to the present disclosure.
  • FIG. 13 is a perspective view of a light emitting diode illumination device according to the present disclosure.
  • 15a and 15b are cross-sectional views and partially enlarged schematic views of an LED lighting device.
  • the present disclosure provides an LED lighting module including a base having a mounting surface; at least one light emitting diode element disposed on a mounting surface of the base; and disposed on a side of the base on which the at least one light emitting diode element is disposed Lens assembly.
  • An accommodating space is formed between the lens assembly and the base, and at least one LED component is located in the accommodating space.
  • Each of the light emitting diode elements includes a plurality of light emitting diode chips packaged together.
  • the lens assembly includes a lens support portion and a lens portion corresponding to the light emitting diode element.
  • the lens portion is disposed on the corresponding light emitting diode element to realize light distribution of the corresponding light emitting diode element, and the lens support portion is coupled to the lens portion to support The lens portion. Therefore, the present disclosure provides a light-emitting diode illumination module that can improve the brightness of the light-emitting diode element by providing a plurality of light-emitting diode chips in the light-emitting diode element, thereby improving the illumination effect.
  • the light emitting diode element includes a plurality of light emitting diode chips, when some of the plurality of light emitting diode chips fail due to various reasons, the light emitting quality of the LED lighting module provided by the present disclosure is less damaged. Thereby, the stability of the illumination can be improved and the service life of the LED lighting module can also be improved.
  • the LED lighting module includes a base 110 , the base 110 includes a mounting surface 111 , and at least one LED component 130 is disposed on the base 110 .
  • each of the light emitting diode elements 130 includes a plurality of light emitting diode chips (not shown) packaged together; and a lens assembly 120 disposed on a side of the base 110 on which the at least one light emitting diode element 130 is disposed (ie, The base 110 is provided with one side of the mounting surface 111).
  • an accommodating space 200 is formed between the lens assembly 120 and the base 110. At least one light emitting diode element 130 is located in the accommodating space 200.
  • the lens assembly 120 includes a lens supporting portion 121 and a light emitting diode element 130.
  • the lens portion 122 is disposed on the corresponding light emitting diode element 130 to realize the light distribution of the corresponding light emitting diode 130.
  • the lens supporting portion 121 is coupled to the lens portion 122 to support the lens portion 122.
  • the LED lighting module provided in this embodiment since a plurality of LED chips packaged together may be included in one LED component, the luminance of the LED component is high, thereby improving the provided by the embodiment.
  • the lighting effect of the LED lighting module In the LED lighting module provided in this embodiment, the LED elements are disposed in one-to-one correspondence with the lens portion, and each of the LED elements is distributed by a lens portion corresponding to one of the LED elements, that is, a point of each LED element.
  • the light source is expanded into a surface light source through a lens portion corresponding to one of the light sources, thereby achieving an effect of increasing the light emitting surface, eliminating glare, and the like.
  • the light-emitting diode element when a plurality of light emitting diode chips of the plurality of light emitting diode chips in the light emitting diode element are used for various reasons, In the event of a fault, since the light-emitting diode elements are arranged in one-to-one correspondence with the lens portion, the light-emitting diode element only has a reduced brightness and does not form a dark spot, thereby causing less loss to the illumination effect of the entire LED lighting module. It can improve the stability of the LED lighting module.
  • the light emitting diode element comprises a plurality of light emitting diode chips.
  • the LED chip with a short life span in the light emitting diode element fails, the LED chip with a long life is long. It still works normally and has less effect on the lighting effect, which can improve the service life of the LED lighting module.
  • the LED lighting module may further include a heat sink 112 , and the heat sink 112 may be integrally formed with the base 110 .
  • the base 110 includes a main body portion 113 that supports the light emitting diode element 130 and a heat sink 112 that is disposed on a side of the main body portion 113 opposite to the mounting surface 111.
  • the present disclosure includes but is not limited thereto, and the heat sink and the base may also be separate structures assembled together by the fixing members.
  • the heat sink may be a finned heat sink or a heat conductive metal block or a heat conductive metal plate.
  • the heat sink can be dissipated by using a material with excellent thermal conductivity to form a base.
  • the LED lighting module may further include a wire 160.
  • the base 110 includes an opening through which the wire 160 is connected.
  • a light emitting diode element 130 on the base 110, the wire 160 is used to connect a power source and provide power to the light emitting diode element 130.
  • the LED lighting module may further include a wire waterproof joint 161 for sealing the opening in the base 110. Preventing moisture from entering the inside of the accommodating space from the opening and contaminating or corroding the light emitting diode element or circuit in the accommodating space.
  • the embodiment provides an LED lighting module.
  • each LED component is an independently packaged multi-chip LED lamp bead.
  • the multi-chip LED The number of light emitting diode chips in the lamp bead is greater than or equal to two.
  • FIG. 4a is a schematic plan view of an LED device according to an embodiment of the present disclosure.
  • the LED component includes eight LED chips 132. When one LED chip with a short lifetime cannot emit light, the other seven LED chips can still emit light normally. At this time, the LED component is normally illuminated. The brightness is only reduced to 7/8, and because of the action of the lens portion, the light-emitting diode chip that cannot emit light does not form dark spots. Therefore, the LED component can continue to be used, thereby extending the service life of the LED lighting module.
  • the number of the light emitting diode chips in each of the light emitting diode elements of the present disclosure is not limited to eight.
  • the number of light emitting diode chips in each of the light emitting diode elements may be two, three, or four or more.
  • FIG. 4b is a cross-sectional view of an LED component along the AA' direction of FIG. 4a according to an embodiment of the present disclosure.
  • the LED component further includes: a bracket 131, the plurality of LED chips 132 are arranged in a matrix on the bracket 131; The bracket 131 and the encapsulation layer 133 on the plurality of LED chips 132.
  • the encapsulation layer 133 is used to package the plurality of LED chips 132 together.
  • the encapsulation layer 13 wraps the 131 and the plurality of LED chips 132, thereby sealing the plurality of LED chips 132 in the bracket. 131.
  • the waterproof and anti-oxidation characteristics of the LED component can be improved, the service life of the LED component can be improved, and the service life of the LED illumination module can be improved.
  • the bracket 131 may include a protrusion located around the light emitting diode to better seal the plurality of LED chips 132 with the encapsulation layer 133.
  • the embodiment provides an LED lighting module.
  • the lens portion 122 and the lens supporting portion 121 are integrated.
  • the structure of the lens assembly can be simplified and the mounting can be facilitated.
  • the present disclosure includes but is not limited thereto, and the lens portion and the lens support portion may also be separate structures.
  • the ribs may be provided on the lens assembly 120 or locally thickened by the lens assembly 120 to prevent deformation of the lens assembly 120.
  • the material of the lens assembly 120 is, for example, PC (polycarbonate) or PMMA (polymethyl methacrylate, also known as acrylic).
  • the LED lighting module is provided.
  • the LED lighting module further includes a fixing component 140 disposed at an edge of the lens assembly 120.
  • the fixing assembly 140 can secure the lens assembly 120 to the base 110. Therefore, the lens assembly 120 is fixed to the LED component 130 by the fixing component 140, and the displacement of the LED component 130 to the light distribution of the LED component 130 can be improved, thereby improving the LED illumination provided by the embodiment.
  • the stability of the lighting effect of the module is provided.
  • the LED lighting module is provided.
  • the fixing component 140 includes a fixing component 142 configured to apply a pressure to the lens component 120 toward the base 110 to The lens assembly 120 is secured to the base 110.
  • the LED light-emitting diode module further includes an elastic washer 141 disposed between the base 110 and the lens assembly 120, that is, disposed on the mounting surface and the lens assembly. between.
  • the fixing member 142 applies a pressure toward the base 110 to the lens assembly 120 to fasten the lens assembly 120 and the base 110, and the elastic washer 141 is in a compressed state and abuts against the surface of the lens assembly 120 and the base 110.
  • the elastic washer 141 and the fixing member 142 the lens assembly 120 can be firmly fixed to the base 110 on the one hand.
  • the accommodating space 200 formed between the lens assembly 120 and the base 110 can be sealed to achieve waterproofing.
  • the elastic washer 141 is, for example, a closed ring shape, and its cross section is, for example, a circular shape, a T shape, or a zigzag shape.
  • the material of the elastic gasket 141 is, for example, a silicone rubber, a rubber, or other elastic material.
  • the resilient washer 141 is in an interference fit with the lens assembly 120 and the base 110 such that the resilient washer 141 is deformed and pressed between the lens assembly 120 and the base 110. That is, the distance between the surface of the lens assembly 120 in contact with the elastic washer 141 and the surface of the base 110 in contact with the elastic washer 141 is smaller than when the elastic washer 141 is not pressed in the direction perpendicular to the mounting surface 111 of the base 110. Original size. That is, the elastic washer 141 is pressed between the lens assembly 120 and the base 110, elastically deformed, and abuts against the surface of the lens assembly 120 and the base 110. By such an interference fit, it is advantageous to seal the accommodation space.
  • the fixture 142 includes a first portion 1421 disposed on a side of the lens assembly 120 opposite the base 110 and facing a portion of the lens assembly 120, and extending from the first portion 1421 and coupled to the base 110.
  • the second portion 1422, the first portion 1421 of the fixture 142 applies a pressure to the lens assembly 120 toward the base 110.
  • the second portion 1422 extends from the side of the lens assembly 120 to the side of the base 110, and the second portion 1422 of the fixture 142 forms a snap-fit structure with the base 110 such that the second portion 1142 Connected to the base 110. That is, the fixing member 142 engages the lens assembly 120 with the base 110 through the first portion 1421 and the second portion 1422, and the first portion 1421 applies a pressure to the lens assembly 120 toward the base 110, thereby the lens assembly 120 and the base 110. The fastening is made and the elastic gasket 141 is in a compressed state and is in close contact with the surface of the lens assembly 120 and the base 110. It should be noted that the fixing member 142 and the lens assembly 120 are different structures.
  • the fixing member 142 Since the material selection of the lens assembly 120 needs to consider the light transmittance, mechanical properties and outdoor performance of the material, the fixing member 142 usually deforms and needs to be formed. The hardness, strength and elastic properties are better, so the lens assembly 120 and the fixture 142 can be made of different materials.
  • the present disclosure includes but is not limited thereto, and the fixing member 142 may also be integrally formed with the lens assembly 120.
  • the first portion 1421 of the fixing member 142 may be integrally formed with the lens assembly 120 and located at the same horizontal plane, and engaged by the second portion 1422. A pressure is applied to the lens assembly 120 toward the base 110 on the base.
  • the first portion 1421 of the fixture 142 in a plane parallel to the base, can be an annular structure disposed along the edge of the lens assembly 120 such that the lens assembly 120 The force is relatively uniform, and it is beneficial to ensure good airtightness of the accommodating space.
  • the elastic washer 141 may also have a ring structure.
  • the second portion 1422 of the fixture 142 can be a plurality of separate sub-extensions. The plurality of sub-extensions are evenly distributed around the periphery of the lens assembly 120.
  • the second portion 1422 of the fixing member 142 may also be an annular structure disposed along the edge of the base 110.
  • the fixing component 140 may include a sealant 143 disposed between the lens assembly 120 and the base 110, and the sealant 143 passes the adhesive force.
  • the lens assembly 120 is fixed on the base 110 and forms an accommodation space 200 between the lens assembly 120 and the base 110, and the accommodation space 200 is a sealed space.
  • the sealant 143 can be used alone as the fixing component 140, or can be used together with the elastic gasket 141 or the fixing member 142. When the sealant is used together with the elastic gasket, the lens assembly is pressed against the base after the sealant is applied during the installation process, and the applied pressure is removed after the sealant is cured.
  • sealants, gaskets and fasteners are common.
  • the fixing component may be fixed by other fixing methods, for example, by welding, screwing or the like, and the disclosure is not limited herein.
  • the LED lighting module further includes a circuit board 170, the circuit board 170 is disposed on the mounting surface 111, and at least one of the foregoing The light emitting diode element 130 is disposed on the circuit board 170.
  • the circuit board 170 can be located in the accommodating space 200 so as to be free from corrosion of external water oxygen.
  • the circuit board 170 can be a printed circuit board (Printed Circuit Board).
  • the LED component 130 can be disposed on the PCB to form a PCBA (Printed Circuit Board Assembly) provided with the LED components, and then the assembled circuit board is disposed on the base 110.
  • PCBA printed Circuit Board Assembly
  • the lens supporting portion 121 and the fixing member 142 may be a unitary structure.
  • the present disclosure includes but is not limited thereto, and the lens support portion and the fixing member may also be separate structures.
  • the fixing member 142 and the lens assembly 120 are separated structures, and the fixing member 142 includes a lens unit 120 disposed opposite to the base 110 .
  • the first portion 1421 facing the side of the lens assembly 120, the LED lighting module further includes a fastener 170 that secures the first portion 1421 Go to the base 110.
  • the fastener 170 can be a screw that can be screwed into a hole with an internal thread in the base to be secured.
  • the base 110 includes threaded holes that match the fasteners 170.
  • the fixing member 142 and the lens assembly 120 are integrated structures, and the LED lighting module further includes a fastener 170 and a fastener.
  • the fixing member 142 is fixed to the base 110.
  • the fastener 170 can be a screw that can be screwed into a hole with an internal thread in the base to be secured.
  • the base 110 includes threaded holes that match the fasteners 170.
  • the second portion 1422 extends from the side of the lens assembly 120 to the side of the base 110, and the second portion 1422 of the fixing member 142 passes through the tight portion.
  • the firmware 170 is such that the second portion 1422 is coupled to the base 110.
  • the embodiment provides an LED lighting module.
  • the base 110 is a lamp holder, and the lens assembly 120 and the LED component 130 are directly fixed on the lamp holder. It should be noted that when the LED module includes a circuit board, the circuit board is also directly fixed on the lamp holder.
  • the LED lighting module according to an embodiment of the present disclosure is illustrated as having a substantially rectangular planar structure, however, the planar shape of the LED lighting module according to an embodiment of the present disclosure is not limited to a rectangle. It can be square, circular, elliptical, or any other regular or irregular shape.
  • the lamp holder 110 includes a power source mounting portion 1102 and a light source mounting portion 1101, and the lens assembly 120 and the light emitting diode element 130 are disposed in the light source mounting portion.
  • the power supply mounting portion 1102 is configured to place a power supply component.
  • the lamp holder 110 includes a plurality of through holes 119 between the light source mounting portion 1101 and the power source mounting portion 1102.
  • a plurality of through holes 119 can be used to facilitate the timely removal of accumulated water, to prevent stagnant water from entering the interior of the lamp, and to damage internal components of the lamp, such as a protection driving power source and a lightning arrester.
  • the plurality of through holes 119 can also be used as an LED lighting module.
  • the heat dissipation vents of the group further block the mutual transfer and influence of heat between the power component and the LED component, and improve the heat dissipation performance of the whole lamp. Improved lighting stability Qualitative.
  • Embodiments of the present disclosure provide an LED lighting device.
  • the LED lighting device can be an LED lighting module.
  • the LED lighting device according to the present embodiment may further include a wire drawn from an accommodation space between the lens component (lens assembly) and the chassis. The wire is led out from one side of the base and can be electrically connected to the light emitting diode element in the accommodating space, so that the light emitting diode element can be powered by the wire.
  • a wire take-up structure is provided in this embodiment.
  • the wire lead-out structure can be used in the LED lighting module provided by the above embodiments, but the embodiment according to the present disclosure is not limited thereto, and the wire lead-out structure can be applied to seal various LED components in an accommodating space. LED lighting module.
  • the LED lighting module includes: a base having a mounting surface; a light emitting diode element disposed on a mounting surface of the base; a lens component disposed on a side of the mounting surface of the base; a gasket, a setting Between the base and the lens component, such that the light emitting diode element is located in a region surrounded by the gasket, and a region surrounded by the gasket between the lens component and the base constitutes a hermetic seal
  • the accommodating space, the LED component is located in the accommodating space.
  • the wire take-up structure includes a wire that is led out from the accommodating space through a through hole penetrating the base to the outside of the LED lighting device, and the wire is sealed with the through hole.
  • the LED lighting device may include a base 310, a light emitting diode element disposed on the base, and a lens group 330 and a fixture 350.
  • the positional relationship and the mounting relationship of these components may be referred to the above respective embodiments or any other suitable arrangement as long as the light emitting diode element can be sealed in the accommodation space between the lens component (lens assembly) and the chassis.
  • the base 310 may include a light source support portion (main body portion) for supporting a light source (light emitting diode element) and a heat sink 311.
  • the heat sink 311 and the light source support portion may be integrally provided.
  • the heat sink 311 includes at least one sheet-like or arcuate projection extending on a side opposite to the mounting surface of the base 310.
  • the heat sink is disposed on the opposite side of the mounting surface of the base to facilitate the dissipation of heat generated during operation of the LED.
  • the base 310 further includes opposite ends disposed on the base 310 and respectively At least one module mounting portion 313 extending from the sheet-like projection or the arcuate projection of the heat sink.
  • the module mounting portion 313 for module mounting extending from the heat sink 311 in this embodiment has two forms, one is a platform mounting portion ( FIG. 12 ), and the other is Wedge mounting ( Figure 13).
  • the platform mounting portion is a flat structure parallel to the mounting surface of the base 310.
  • the LED lighting device according to the present embodiment can be mounted on the lamp housing through a module mounting portion provided at both ends of the heat sink.
  • a notch or hole is provided in the edge portion of the platform mounting portion, and the illuminating device can be fixed to the lamp housing through the notches or holes by fasteners.
  • the notches on the platform mounting portion may have other shapes.
  • the wedge-shaped mounting portion is a wedge-shaped structure formed by bending a plate-like member into a wedge shape.
  • the edge portion of the wedge-shaped mounting portion may be provided with a notch or hole for fixing.
  • the light emitting diode illumination device may be disposed on the PCB board 312.
  • the fixing member 350, the lens member 330, the gasket 340, the PCB board 312, and the base 310 are sequentially laminated in a direction perpendicular to the mounting surface of the base.
  • the area surrounded by the gasket 340 between the lens member 330 and the base 310 constitutes a sealed accommodating space in which the light emitting diode elements are located.
  • the wire lead-out structure must also be sealed to avoid damaging the airtightness of the accommodating space.
  • the LED lighting device includes a wire lead-out structure including a wire drawn from the accommodating space through the through hole penetrating the base 310 to the outside of the LED lighting device, and the wire and the through hole are sealed .
  • the light-emitting diode in the sealed accommodating space can supply power while ensuring the airtightness of the accommodating space, so as to prevent moisture and the like from entering the accommodating space to cause the light-emitting diode. Bad effects.
  • the wire can be sealed between the through hole and the through hole therethrough, and other methods can be used.
  • the gap between the wire and the through hole may be sealed with a sealing ring, and the specific form of sealing with the sealing ring is not particularly limited.
  • the seal can be elastic
  • the material, for example, the sealing ring is made of a rubber material.
  • the wire take-up structure may include a seal ring and an externally threaded pipe in addition to the wire. Wires can pass through the seal and the externally threaded tube.
  • the inner circumferential surface of the sealing ring is in close contact with the wire
  • the outer circumferential surface of the sealing ring is in close contact with the inner circumferential surface of the externally threaded pipe
  • the externally threaded pipe at least partially protrudes into the through hole and is The inner wall of the through hole is combined. That is to say, the sealing ring is sleeved on the wire
  • the externally threaded pipe is sleeved on the sealing ring
  • the externally threaded pipe is coupled to the through hole in the base.
  • Fig. 15a and 15b are a cross-sectional view and a partially enlarged schematic view of an LED lighting device according to the present embodiment.
  • Fig. 15a is a cross-sectional view showing a mounting module mounting portion and a lead wire take-out structure through the LED lighting device
  • Fig. 15b is an enlarged view of a portion indicated by a circle in Fig. 15a.
  • the wires electrically connected to the assembled PCB board are passed out from the base 310 with respect to the through holes on one side of the LED elements, and are electrically connected to the power supply assembly.
  • the wires herein may be directly connected to the light emitting diode elements or directly connected to the PCB board, which is not particularly limited in the present disclosure.
  • the through hole through the base may include a first hole 313, a transitional tapered hole 315, and a second hole 314.
  • the first hole 313, the transitional tapered hole 315, and the second hole 314 are sequentially connected to form a through hole penetrating the base.
  • the first hole 313 is formed on a side of the base away from the accommodating space
  • the second hole 314 is formed on a side of the base close to the accommodating space
  • the transitional tapered hole 315 is formed between the first hole 313 and the second hole 314.
  • the diameter of the first hole 313 is larger than the diameter of the second hole 314.
  • the diameter of the transitional conical hole 315 gradually changes from the diameter of the first hole 313 to the second direction from the end away from the accommodating space to the end close to the accommodating space.
  • the seal ring 500 is a T-ring, that is, the cross-sectional shape of the seal ring in the axial direction is substantially T-shaped, and has a hole portion in the axial direction of the T-shape.
  • the T-ring includes a head 501 having a larger outer diameter and a body portion 502 having a smaller outer diameter.
  • the diameters of the holes of the respective portions of the T-ring in the axial direction are substantially equal. That is to say, the hole of the sealing ring can be cylindrical and its diameter can be matched with the wire, which of course is not specifically shown in the present disclosure.
  • the original diameter of the hole of the sealing ring is smaller than the diameter of the wire.
  • the sealing ring When the sealing ring is sleeved on the wire, it can be closely attached to the wire to form a sealing structure between the interfaces.
  • the body portion 502 of the T-ring may have the same outer diameter from a direction near its head 501 to a distance away from the head 501, or may have a gradually decreasing outer diameter.
  • the externally threaded tube 600 is sleeved over the body portion 502 of the T-ring.
  • the inner diameter of the externally threaded tube 600 is such that when it is mounted on a T-ring 500 that is sheathed over the wire 400, the externally threaded tube 600 can compress the T-ring to form a seal.
  • the externally threaded tube 600 can be mated with the first bore 313 such that the externally threaded tube 600 can be coupled to the first bore 313.
  • the inner wall of the first hole 313 is provided with a threaded structure matching the external thread of the externally threaded tube 600, the external thread of the externally threaded tube and the internal thread of the first hole being engaged with each other.
  • the outer diameter of the head 501 of the T-ring 500 is equal to or larger than the inner diameter of the first hole 313, and the outer diameter of the outer-threaded tube 600 is larger than the diameter (inner diameter) of the second hole 314, thus, in the direction in which the wire extends
  • the end surface of the externally threaded tube 600 is at least partially opposed to the tapered surface of the transitional conical hole 315.
  • the head 501 of the T-shaped threaded tube 500 can be pressed against the tapered surface of the transitional conical hole.
  • the head of the seal ring is pressed between the end of the externally threaded tube and the tapered surface of the transitional conical bore.
  • the body portion of the T-ring 500 has a uniform outer diameter in the axial direction, or the outer diameter of the body portion 502 gradually decreases in a direction away from the head 501 to form a conical portion.
  • the inner peripheral surface of the T-ring is in close contact with the wire.
  • the inner circumferential surface of the externally threaded tube fits closer to the T-shaped sealing ring, so that the seal between the sealing ring and the wire becomes more and more The better.
  • the external thread of the externally threaded tube cooperates with the internal thread of the first hole, and the head of the T-shaped sealing ring is respectively fitted to one end surface of the externally threaded tube and the tapered surface of the transitional conical hole.
  • the illumination device described above in the present embodiment is based on the first to third embodiments (the above-described boss or first groove is provided inside the gasket or directly above the gasket).
  • the structure of the present embodiment is not limited to the basic structure described in the first to third embodiments, and may be applied to the case where the above-mentioned convex portion or the first groove is provided on the outer side of the gasket, and the details are not described here again. description.
  • the above-described boss or first groove is disposed outside the gasket, and since the first portion of the fixing member has a gap between the portion other than the boss and the lens member, in these examples, The resultant force of the fixture to the lens component is on the outside of the gasket. In these examples, the problem of the central projection of the lens component can be solved by other means.
  • a waterproof connector can be connected to the end.
  • the specific structure of the waterproof joint is not particularly limited in this embodiment, and any suitable waterproof joint can be used.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)

Abstract

一种发光二极管照明模组，包括：底座（110），具有一安装面（111）；至少一个发光二极管元件（130），设置在底座（110）的安装面上（111），各发光二极管元件（130）包括封装在一起的多个发光二极管芯片；以及透镜组件（120），设置在底座（110）的设置有至少一个发光二极管元件（130）的一侧，并与底座（110）之间形成一容置空间（200），至少一个发光二极管元件（130）位于容置空间（200）内，透镜组件（120）包括透镜支撑部（121）以及与发光二极管元件（130）一一对应的透镜部（122），透镜部（122）设置在对应的发光二极管元件（130）上，以实现对应的发光二极管元件（130）的配光，透镜支撑部（121）与透镜部（122）连接，以支撑透镜部。该照明模组能够提供更高的照明亮度，并且在部分发光二极管芯片故障时模组的发光质量受损较小。

Description

发光二极管照明模组 技术领域
本公开涉及一种发光二极管照明模组。
背景技术
发光二极管(Light Emitting Diode,LED)是一种半导体发光器件。通常，发光二极管包括半导体芯片，通过向半导体芯片施加电流，可在半导体中通过载流子发生复合放出过剩的能量而引起光子发射，从而可使该半导体芯片发光。
发光二极管照明装置是一种利用发光二极管作为光源的照明装置。发光二极管照明装置具有节能、寿命长、适用性好、响应时间短、环保等优点，因此，其在照明、信号指示、背光显示等领域具有很好的应用前景。
发明内容
本公开的一个实施例提供一种发光二极管照明模组，包括：底座，具有一安装面；至少一个发光二极管元件，设置在所述底座的安装面上，各所述发光二极管元件包括封装在一起的多个发光二极管芯片；以及透镜组件，设置在所述底座的设置有所述至少一个发光二极管元件的一侧，并与所述底座之间形成一容置空间，所述至少一个发光二极管元件位于所述容置空间内，所述透镜组件包括透镜支撑部以及与所述发光二极管元件一一对应的透镜部，所述透镜部设置在对应的发光二极管元件上，以实现所述对应的发光二极管元件的配光，所述透镜支撑部与所述透镜部连接，以支撑所述透镜部。
在一些示例中，各所述发光二极管元件为独立封装的多芯片发光二极管灯珠。
在一些示例中，所述发光二极管元件还包括：支架，所述多个发光二极管芯片呈矩阵排列在所述支架上；以及封装层，所述封装层包裹所述支架和所述多个发光二极管芯片。
在一些示例中，所述封装层直接覆盖在所述支架和所述多个发光二极管 芯片上，以将所述多个发光二极管芯片密封在所述支架上。
在一些示例中，发光二极管照明模组还包括：电路板，所述电路板设置在所述安装面上，所述至少一个发光二极管元件设置在所述电路板上。
在一些示例中，所述底座包括电路板。
在一些示例中，所述底座包括支撑所述发光二极管元件的主体部。
在一些示例中，所述底座还包括设置在所述主体部的与所述安装面相反的一侧的散热器。
在一些示例中，所述底座包括灯架。
在一些示例中，发光二极管照明模组还包括：固定组件，所述固定组件设置在所述透镜组件的边缘，以将所述透镜组件固定在所述底座上。
在一些示例中，所述固定组件包括以下至少之一：固定件，所述固定件被配置为对所述透镜组件施加一朝向所述底座的压力，以将所述透镜组件与所述底座紧固；密封胶，所述密封胶设置在所述透镜组件与所述底座之间以将所述透镜组件固定在所述底座上并使所述透镜组件与所述底座之间形成所述容置空间，所述容置空间为密封空间。
在一些示例中，发光二极管照明模组还包括：弹性垫圈，设置在所述底座和所述透镜组件之间，所述固定组件将所述透镜组件和所述底座彼此固定并使所述弹性垫圈处于压缩状态。
在一些示例中，所述透镜支撑部与所述固定件为一体结构。
在一些示例中，所述透镜支撑部与所述固定件为分离的结构。
在一些示例中，所述固定件包括设置在所述透镜组件的与所述底座相反的一侧并与所述透镜组件的一部分面对的第一部分以及从所述第一部分延伸并与所述底座连接的第二部分，所述固定件的第一部分对所述透镜组件施加一朝向所述底座的压力。
在一些示例中，所述第二部分从所述透镜组件的侧面延伸到所述底座的侧面，所述固定件的第二部分与所述底座形成彼此配合的卡扣结构，以使得所述第二部分连接到所述底座。
在一些示例中，所述第二部分从所述透镜组件的侧面延伸到所述底座的侧面，所述固定件的第二部分通过紧固件以使得所述第二部分连接到所述底座。
在一些示例中，所述固定件包括设置在所述透镜组件的与所述底座相反的一侧并与所述透镜组件的一部分面对的第一部分，所述发光二极管照明模组还包括紧固件，所述紧固件将所述第一部分固定到所述底座上。
在一些示例中，所述紧固件为螺钉。
在一些示例中，所述灯架包括电源安装部和光源安装部，所述透镜组件以及所述发光二极管元件设置在所述光源安装部上，所述电源安装部被配置为放置电源组件。
在一些示例中，所述底座包括多个通孔，所述多个通孔位于所述光源安装部和所述电源安装部之间。
在一些示例中，发光二极管照明模组还包括：导线引出结构，包括从所述容置空间经过贯穿所述底座的通孔引出到所述发光二极管照明装置外部的导线，所述导线与所述通孔之间被密封。
在一些示例中，所述导线引出结构还包括密封圈，所述密封圈将所述导线和所述通孔之间的间隙密封。
在一些示例中，所述导线引出结构还包括外螺纹管，所述导线穿过所述密封圈和所述外螺纹管，所述密封圈的内周面与所述导线紧密贴合，所述密封圈的外周面与所述外螺纹管的内周面紧密贴合，且所述外螺纹管至少部分伸入所述通孔中并与所述通孔的内壁结合。
在一些示例中，贯穿所述底座的通孔包括依次连接的第一孔、过渡圆锥孔和第二孔，所述第一孔形成在所述底座的远离容置空间的一侧，所述第二孔形成在所述底座的靠近所述容置空间的一侧，所述过渡圆锥孔形成在所述第一孔和所述第二孔之间；所述第一孔的直径大于所述第二孔的直径，所述过渡圆锥孔从远离所述容置空间的一端到靠近所述容置空间的一端的方向上，其直径从所述第一孔的直径逐渐变为所述第二孔的直径。
在一些示例中，所述通孔的第一孔具有内螺纹，所述外螺纹管伸入所述通孔的第一孔且所述外螺纹管的外螺纹与所述第一孔的内螺纹彼此啮合。
在一些示例中，所述密封圈包括外径较大的头部和外径较小的主体部，所述外螺纹管的内周面与所述密封圈的主体部的外周面紧密贴合。
在一些示例中，所述密封圈的头部比所述密封圈的主体部更靠近所述容置空间。
在一些示例中，所述外螺纹管的外径和所述密封圈的头部的外径均大于所述通孔的第二孔的直径，所述密封圈的头部被挤压在所述外螺纹管的端部与所述过渡圆锥孔的锥面之间。
在一些示例中，所述底座包括支撑所述发光二极管元件的主体部以及设置在所述主体部的与所述安装面相反的一侧的散热器。
在一些示例中，所述底座还包括在所述发光二极管照明装置的两端从所述散热器向外伸出的安装部。
在一些示例中，所述安装部为平行于所述安装面的板状结构或者弯折成楔形的楔形结构。
在一些示例中，所述导线伸出到所述容置空间外部的一端连接有防水接头。
附图说明
为了更清楚地说明实用新型实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及实用新型的一些实施例，而非对实用新型的限制。
图1是本公开一实施例提供的一种发光二极管照明模组的分解示意图；
图2是本公开一实施例提供的一种发光二极管照明模组的截面示意图；
图3是本公开一实施例提供的一种发光二极管照明模组的平面示意图；
图4a是本公开一实施例提供的一种发光二极管元件的平面示意图；
图4b是本公开一实施例提供的一种发光二极管元件沿图4a中AA’方向的剖面示意图；
图5是本公开一实施例提供的一种发光二极管照明模组的截面示意图；
图6是本公开一实施例提供的另一种发光二极管照明模组的截面示意图；
图7是本公开一实施例提供的另一种发光二极管照明模组的截面示意图；
图8是本公开一实施例提供的另一种发光二极管照明模组的截面示意图；
图9是本公开一实施例提供的另一种发光二极管照明模组的截面示意图；
图10是本公开一实施例提供的另一种发光二极管照明模组的截面示意图；以及
图11是本公开一实施例提供的一种灯架的平面示意图；
图12是本公开一种发光二极管照明装置的立体示意图；
图13是本公开一种发光二极管照明装置的立体示意图；
图14是本公开一种发光二极管照明装置的分解示意图；
图15a和15b是一种发光二极管照明装置的截面图以及局部放大示意图。
具体实施方式
为使实用新型实施例的目的、技术方案和优点更加清楚，下面将结合实用新型实施例的附图，对实用新型实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是实用新型的一部分实施例，而不是全部的实施例。基于所描述的实用新型的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，都属于实用新型保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为实用新型所属领域内具有一般技能的人士所理解的通常意义。实用新型专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。
本公开提供一种发光二极管照明模组，其包括具有一安装面的底座；设置在底座的安装面上的至少一个发光二极管元件；以及设置在底座的设置有至少一个发光二极管元件的一侧的透镜组件。透镜组件和底座之间形成一容置空间，至少一个发光二极管元件位于该容置空间内。各发光二极管元件包括封装在一起的多个发光二极管芯片。透镜组件包括透镜支撑部以及与发光二极管元件一一对应的透镜部，透镜部设置在对应的发光二极管元件上，以实现对应的发光二极管元件的配光，透镜支撑部与透镜部连接，以支撑所述透镜部。由此，本公开提供发光二极管照明模组通过在发光二极管元件中设置多个发光二极管芯片可提高发光二极管元件的亮度，提高照明效果。另外，因为发光二极管元件包括多个发光二极管芯片，当多个发光二极管芯片中的部分发光二极管芯片因各种原因发生故障时，本公开提供的发光二极管照明模组的发光质量受损较小，从而可提高照明的稳定性并且还可提高发光二极管照明模组的使用寿命。
下面结合附图对本公开实施例提供的发光二极管照明模组进行说明。
实施例一
本实施例提供一种发光二极管照明模组，如图1所示，该发光二极管照明模组包括：底座110，底座110包括一安装面111；至少一个发光二极管元件130，设置在底座110的安装面111上，各发光二极管元件130包括封装在一起的多个发光二极管芯片(图中未示出)；以及透镜组件120，设置在底座110的设置有至少一个发光二极管元件130的一侧(即，底座110设有安装面111的一侧)。如图2所示，透镜组件120与底座110之间形成一容置空间200，至少一个发光二极管元件130位于容置空间200内，透镜组件120包括透镜支撑部121以及与发光二极管元件130一一对应的透镜部122，透镜部122设置在对应的发光二极管元件130上，以实现对应的发光二极管130的配光，透镜支撑部121与透镜部122连接，以支撑透镜部122。
在本实施例提供的发光二极管照明模组中，由于一个发光二极管元件中可包括封装在一起的多个发光二极管芯片，因此，发光二极管元件的发光亮度较高，从而可提高本实施例提供的发光二极管照明模组的照明效果。在本实施例提供的发光二极管照明模组中，发光二极管元件与透镜部一一对应设置，各发光二极管元件通过与之一一对应设置的透镜部进行配光，即，各发光二极管元件的点光源经过与之一一对应设置的透镜部扩展为面光源，从而实现增大发光面、消除眩光等效果，因此，当发光二极管元件中多个发光二极管芯片中的部分发光二极管芯片因各种原因发生故障时，由于发光二极管元件与透镜部一一对应设置，该发光二极管元件只是亮度有所降低，不会形成暗斑，从而对整个发光二极管照明模组的照明效果造成的损失较小，从而可提高发光二极管照明模组的稳定性。另外，发光二极管元件包括多个发光二极管芯片，由于发光二极管芯片由于生产批次等原因具有不同的使用寿命，当发光二极管元件中寿命较短的发光二极管芯片故障后，寿命较长的发光二极管芯片仍可正常工作，并且对照明效果影响较小，从而可提高发光二极管照明模组的使用寿命。
例如，在本实施例一示例提供的发光二极管照明模组中，如图1所示，发光二极管照明模组还可包括散热器112，散热器112可与底座110一体形成。例如，底座110包括支撑发光二极管元件130的主体部113以及设置在主体部113的与安装面111相反的一侧的散热器112。当然，本公开包括但不限于此，散热器与底座也可为分离结构，通过固定件组装在一起。
例如，在本实施例一示例提供的发光二极管照明模组中，散热器可为带鳍片的散热器也可为导热金属块或导热金属板。
例如，在本实施例一示例提供的发光二极管照明模组中，底座上也可不设置散热器，通过使用导热性能优异的材料制作底座来对发光二极管进行散热。
例如，在本实施例一示例提供的发光二极管照明模组中，如图1所示，发光二极管照明模组还可包括导线160，底座110包括一开孔，导线160穿过该开口连接设置在底座110上的发光二极管元件130，导线160用于连接电源并给发光二极管元件130提供电力。
例如，在本实施例一示例提供的发光二极管照明模组中，如图1所示，发光二极管照明模组还可包括导线防水接头161，导线防水接头161用于密封底座110上的开孔，防止水汽从开孔进入容置空间内部并污染或腐蚀容置空间内的发光二极管元件或电路。
实施例二
在实施例一的基础上，本实施例提供一种发光二极管照明模组，在该发光二极管照明模组中，各发光二极管元件为独立封装的多芯片发光二极管灯珠，所述多芯片发光二极管灯珠中的发光二极管芯片的数量大于等于2。
例如，图4a是本公开一实施例提供的一种发光二极管元件的平面示意图。如图4a所示，发光二极管元件包括八个发光二极管芯片132，当其中使用寿命较短的一个发光二极管芯片不能发光时，其他七个发光二极管芯片仍可正常发光，此时，该发光二极管元件的亮度只降低到7/8，而且，因为透镜部的作用，不能发光的发光二极管芯片不会形成暗斑。因此，该发光二极管元件仍可继续使用，从而延长了发光二极管照明模组的使用寿命。需要说明的是，本公开各发光二极管元件中发光二极管芯片的数量不限于八个。例如，各发光二极管元件中发光二极管芯片的数量可以为两个、三个、或四个以上。
例如，图4b是本公开一实施例提供的一种发光二极管元件沿图4a中AA’方向的剖面示意图。在本实施例一示例提供的发光二极管照明模组中，如图4a-4b所示，该发光二极管元件还包括：支架131，多个发光二极管芯片132呈矩阵排列在支架131上；以及设置在支架131和多个发光二极管芯片132上的封装层133。封装层133用于将多个发光二极管芯片132封装在一起。
例如，在本实施例一示例提供的发光二极管照明模组中，如图4a-4b所示，封装层13包裹131和多个发光二极管芯片132上，从而将多个发光二极管芯片132密封在支架131上。由此，可提高发光二极管元件的防水防氧化特性，提高发光二极管元件的使用寿命，从而提高发光二极管照明模组的使用寿命。需要说明的是，支架131可包括位于该发光二极管四周的凸起部，以更好地与封装层133将多个发光二级管芯片132密封。
实施例三
在实施例一的基础上，本实施例提供一种发光二极管照明模组，如图2所示，透镜部122与透镜支撑部121为一体结构。由此，通过将透镜部122与透镜支撑部121一体形成可简化透镜组件的结构，便于安装。当然，本公开包括但不限于此，透镜部与透镜支撑部也可为分离结构。
例如，透镜组件120上可以设置加强筋，或者将透镜组件120局部增厚，防止透镜组件120变形。
例如，透镜组件120的材料例如为PC(聚碳酸酯)或PMMA(聚甲基丙烯酸甲酯，又名亚克力)。
例如，在本实施例一示例提供发光二极管照明模组中，如图2所示，该发光二极管照明模组还包括设置在透镜组件120边缘的固定组件140。固定组件140可将透镜组件120固定在底座110上。由此，透镜组件120通过固定组件140与发光二极管元件130固定，不会轻易发生位移，可提高透镜部122对发光二极管元件130的配光的稳定性，进而提高本实施例提供的发光二极管照明模组的照明效果的稳定性。
例如，在本实施例一示例提供发光二极管照明模组中，如图2所示，固定组件140包括固定件142，固定件142被配置为对透镜组件120施加一朝向底座110的压力，以将透镜组件120与底座110紧固。
例如，如图2所示，本实施例一示例提供发光二极管照明模组还包括：弹性垫圈141，弹性垫圈141设置在底座110和透镜组件120之间，即，设置在安装面与透镜组件之间。固定件142通过对透镜组件120施加一朝向底座110的压力，从而将透镜组件120与底座110紧固，并使弹性垫圈141处于压缩状态，并紧贴在透镜组件120和底座110的表面。由此，通过弹性垫圈141和固定件142的作用，一方面可将透镜组件120牢牢固定在底座110 上，另一方面可使透镜组件120与底座110之间形成的容置空间200密封，以达到防水的目的。
例如，弹性垫圈141例如为封闭的环形，其截面例如为圆型、T型或7字型等其他形状，弹性垫圈141的材料例如为硅胶、橡胶或其他弹性材料。
例如，弹性垫圈141与透镜组件120和底座110之间均为过盈配合，使弹性垫圈141发生形变并被紧压在透镜组件120和底座110之间。也就是说，透镜组件120与弹性垫圈141接触位置的表面和底座110与弹性垫圈141接触位置的表面之间的距离小于弹性垫圈141在垂直于底座110的安装面111的方向上未受压时的原始尺寸。即弹性垫圈141被紧压在透镜组件120和底座110之间，发生弹性形变，并紧贴在透镜组件120和底座110的表面。通过这样的过盈配合，有利于密封容置空间。
例如，如图2所示，固定件142包括设置在透镜组件的120与底座110相反的一侧并与透镜组件120的一部分面对的第一部分1421以及从第一部分1421延伸并与底座110连接的第二部分1422，固定件142的第一部分1421对透镜组件120施加一朝向底座110的压力。
例如，如图2所示，第二部分1422从透镜组件120的侧面延伸到底座110的侧面，固定件142的第二部分1422与底座110形成彼此配合的卡扣结构，以使得第二部分1142连接到底座110。也就是说，固定件142通过第一部分1421和第二部分1422将透镜组件120与底座110卡合，并且第一部分1421对透镜组件120施加一朝向底座110的压力，从而将透镜组件120与底座110紧固，并使弹性垫圈141处于压缩状态，并紧贴在透镜组件120和底座110的表面。需要说明的是，上述的固定件142与透镜组件120为分离的不同结构，由于透镜组件120的选材需要考虑材料的透光性能、机械性能和户外性能，而固定件142通常会发生形变，需要较好的硬度、强度和弹性性能，因此透镜组件120与固定件142可采用不同的材料制成。然而，本公开包括但不限于此，固定件142也可与透镜组件120一体形成，例如，固定件142的第一部分1421可与透镜组件120一体形成且位于同一水平面，通过第二部分1422卡合在底座上并对透镜组件120施加一朝向底座110的压力。
例如，如图3所示，在平行于底座的平面上，固定件142的第一部分1421可为环形结构，设置为沿透镜组件120的边缘一周，从而使透镜组件120的 受力比较均匀，并且有利于保证容置空间的良好的密闭性。此时，弹性垫圈141同样可为环形结构。如图3所示，固定件142的第二部分1422可为多个分离的子延伸部。多个子延伸部均匀分布在透镜组件120的周边，当然，固定件142的第二部分1422也可为环形结构，设置为沿底座110的边缘一周。
例如，在本实施例一示例提供的发光二极管照明模组中，如图5所示，固定组件140可包括设置在透镜组件120与底座110之间的密封胶143，密封胶143通过粘结力将透镜组件120固定在底座110上并使透镜组件120与底座110之间形成容置空间200，并且，容置空间200为密封空间。需要说明的是，密封胶143可单独作为固定组件140使用，也可与弹性垫圈141或固定件142一起使用。当密封胶和弹性垫圈一起使用的情况下，在安装过程中，在涂覆密封胶后将透镜组件与底座压合，在密封胶固化后，再去除外加的压力。当然，密封胶、垫圈和固定件均有是通常的情况。
需要说明的是，在本实施例提供的发光二极管照明模组中，固定组件还可采用其他固定方式进行固定，例如，通过焊接、螺纹连接等固定方式，本公开在此不作限制。
例如，在本实施例一示例提供的发光二极管照明模组中，如图6所示，该发光二极管照明模组还包括电路板170，电路板170设置在安装面111上，并且上述的至少一个发光二极管元件130设置在电路板170上。
例如，电路板170可位于容置空间200内，从而免于外界水氧的腐蚀。
例如，电路板170可为PCB板(Printed Circuit Board，印刷电路板)。发光二极管元件130可设置在PCB板上，形成设置有发光二极管元件的PCBA(Printed Circuit Board Assembly，组装电路板)，再将组装电路板设置在底座110上。
例如，在本实施例一示例提供的发光二极管照明模组中，如图7所示，透镜支撑部121与固定件142可以是一体结构。当然，本公开包括但不限于此，透镜支撑部与固定件也可以是分离结构。
例如，在本实施例一示例提供的发光二极管照明模组中，如图8所示，固定件142和透镜组件120为分离结构，固定件142包括设置在透镜组件120的与底座110相反的一侧并与透镜组件120的一部分面对的第一部分1421，该发光二极管照明模组还包括紧固件170，紧固件170将第一部分1421固定 到底座110上。例如，紧固件170可为螺钉，其可以旋入底座内带有内螺纹的孔中而被固定。与此相对的，底座110上包括与紧固件170相匹配的螺纹孔。
例如，在本实施例一示例提供的发光二极管照明模组中，如图9所示，固定件142和透镜组件120为一体结构，该发光二极管照明模组还包括紧固件170，紧固件170将固定件142固定到底座110上。例如，紧固件170可为螺钉，其可以旋入底座内带有内螺纹的孔中而被固定。与此相对的，底座110上包括与紧固件170相匹配的螺纹孔。
例如，在本实施例一示例提供的发光二极管照明模组中，如图10所示，第二部分1422从透镜组件120的侧面延伸到底座110的侧面，固定件142的第二部分1422通过紧固件170以使得第二部分1422连接到底座110。
实施例四
本实施例提供一种发光二极管照明模组，如图10所示，在该发光二极管照明模组中，底座110为灯架，透镜组件120和发光二极元件130直接固定在灯架上。需要说明的是，当该发光二极管模组包括电路板时，该电路板同样也直接固定在灯架上。
在图10所示的平面示意图中，根据本公开实施例的发光二极管照明模组示出为具有大致矩形的平面结构，然而，根据本公开实施例的发光二极管照明模组的平面形状不限于矩形，其可以为正方形、圆形、椭圆形、或者其他任何规则或不规则形状。
例如，在本实施例一示例提供的发光二极管照明模组中，如图10所示，灯架110包括电源安装部1102和光源安装部1101，透镜组件120以及发光二极管元件130设置在光源安装部1101上，电源安装部1102被配置为放置电源组件。
例如，在本实施例一示例提供的发光二极管照明模组中，如图11所示，灯架110包括多个通孔119，位于光源安装部1101和电源安装部1102之间。多个通孔119可用于可便于及时排除积水，避免积水进入到灯具内部，损坏灯具内部元件，例如保护驱动电源和防雷器，同时，多个通孔119也可作为发光二极管照明模组的散热通风孔，进一步的阻断了电源组件和发光二极管元件之间热量的相互传递和影响，提高整灯的散热性能。提高了的灯具的稳 定性。
实施例五
本公开的实施例提供一种发光二极管照明装置。例如，该发光二极管照明装置可以为发光二极管照明模组。根据本实施例的发光二极管照明装置还可以包括从透镜部件(透镜组件)与底座之间的容置空间引出的导线。所述导线从底座一侧引出，并可以与容置空间中的发光二极管元件电连接，以能够通过该导线为发光二极管元件提供电源。
在本实施例中提供了一种导线引出结构。该导线引出结构可以用于上述各实施例提供的发光二极管照明模组中，但根据本公开的实施例不限于此，该导线引出结构可以应用于各种将发光二极管元件密封在一容置空间中的发光二极管照明模组。例如，该发光二极管照明模组包括：底座，具有一安装面；发光二极管元件，设置在所述底座的安装面上；透镜部件，设置在所述底座的所述安装面一侧；垫圈，设置在所述底座和所述透镜部件之间，以使得所述发光二极管元件位于由所述垫圈包围的区域内，所述透镜部件和所述底座之间的由所述垫圈围绕的区域构成一密闭的容置空间，所述发光二极管元件位于所述容置空间内。例如该导线引出结构包括从所述容置空间经过贯穿所述底座的通孔引出到所述发光二极管照明装置外部的导线，所述导线与所述通孔之间被密封。
图12和图13分别为两个示例的立体示意图，图14为根据一个示例的发光二极管装置的分解示意图。例如，如图12-14所示，在该实施例中，发光二极管照明装置可以包括底座310、设置在底座上的发光二极管元件、以及透镜组330、固定件350。这些部件的位置关系以及安装关系可以参照上述各个实施例或者采取其他任何合适的布置，只要可以将发光二极管元件密封在透镜部件(透镜组件)与底座之间的容置空间即可。在本实施例中，例如，底座310可以包括用于支撑光源(发光二极管元件)的光源支撑部(主体部分)和散热器311。散热器311与光源支撑部可以为一体设置。散热器311包括在与底座310的安装面相反的一侧延伸有至少一个片状或者弧状凸起。
在该实施例中，将散热器设置在底座的安装面的相反侧，有利于将发光二极管工作期间产生的热量散发出去。
在本实施例中，底座310还包括设置在底座310的相对两端上且分别从 散热器的片状凸起或者弧状凸起处延伸的至少一个模组安装部313。如图12和图13所示，本实施例中从散热器311延伸的用于模组安装的模组安装部313有两种形式，一种为平台安装部(图12)，另一种为楔形安装部(图13)。例如，平台安装部为平行于底座310的安装面的平板状结构。例如，根据本实施例的发光二极管照明装置可以通过设置在散热器两端的模组安装部安装在灯壳上。例如，在该平台安装部的边缘部分设置有缺口或者孔，可以利用紧固件通过这些缺口或孔将照明装置固定在灯壳上。当然在其他的实施例中，平台安装部上的缺口还可以为其他的形状。例如，如图13所示，楔形安装部为将板状部件弯折成楔形而形成的楔形结构。同样，楔形安装部的边缘部分也可以设置用于固定的缺口或孔。
例如，如图14的分解示意图所示，根据本实施例的发光二极管照明装置可以设置在PCB板312上。在垂直于底座安装面的方向上，固定件350、透镜部件330、垫圈340、PCB板312和底座310依次层叠。各个部件的安装顺序以及相对位置关系可以参照前述各个实施例或者采取其他任何合适的布置，只要可以将发光二极管元件密封在透镜部件(透镜组件)与底座之间的容置空间即可，这里不再赘述。
对于本实施例，参照前述各个实施例可知，透镜部件330和底座310之间的由垫圈340围绕的区域构成一密闭的容置空间，发光二极管元件位于所述容置空间内。然而，为了给位于密闭的容置空间的发光二极管提供电源以及其他控制信号，需要从密闭空间引出导线，但导线引出结构也必须是密封的，以避免破坏容置空间的密闭性。
例如，根据本实施例的发光二极管照明装置包括导线引出结构，该导线引出结构包括从容置空间经过贯穿底座310的通孔引出到发光二极管照明装置的外部的导线，导线与通孔之间被密封。
在该实施例中，通过设置密封的导电引出结构，能够在密封的容置空间中的发光二极管提供电源的同时，保证容置空间的密闭性，以防止水汽等进入容置空间对发光二极管造成不良影响。
对于导线引出结构的密封，例如，可以将导线与其穿过的通孔之间被密封，也可以采用其他的方式。例如，导线与通孔之间的间隙可以采用密封圈来密封，采用密封圈进行密封的具体形式没有特别限制。密封圈可以为弹性 材料，例如，密封圈由橡胶材料制成。
下面参照图15a和15b对根据本实施例的一些示例性结构进行描述。
例如，导线引出结构除导线之外还可以包括密封圈和外螺纹管。导线可以穿过密封圈和外螺纹管。密封圈的内周面与导线紧密贴合，密封圈的外周面与所述外螺纹管的内周面紧密贴合，且所述外螺纹管至少部分伸入所述通孔中并与所述通孔的内壁结合。也就是说，密封圈套设在导线上，外螺纹管套设在密封圈上，且外螺纹管结合到底座中的通孔。
图15a和15b为根据本实施例的发光二极管照明装置的截面图以及局部放大示意图。例如，图15a为经过发光二极管照明装置的设置模组安装部以及导线引出结构的截面图，图15b为图15a中圆圈标示的部分的放大图。
参照图15a和15b可以看到，与组装PCB板电气连接(也就是说与发光二极管元件电气连接)的导线从底座310相对于LED元件的一面上的通孔穿出，与电源组件电连接。例如，这里的导线可以与发光二极管元件直接连接，也可以与PCB板直接连接，本公开对此没有特别限定。
例如，贯穿底座的通孔可以包括第一孔313、过渡圆锥孔315和第二孔314。第一孔313、过渡圆锥孔315和第二孔314依次连接形成贯穿底座的通孔。第一孔313形成在底座的远离容置空间的一侧，第二孔314形成在底座的靠近容置空间的一侧，过渡圆锥孔315形成在第一孔313和第二孔314之间。第一孔313的直径大于第二孔314的直径，过渡圆锥孔315从远离容置空间的一端到靠近容置空间的一端的方向上，其直径从第一孔313的直径逐渐变为第二孔314的直径。
例如，密封圈500为T型密封圈，也就是说，该密封圈的轴线方向的截面形状大致为T字型，且在T字的轴线方向上具有孔部分。例如，T型密封圈包括外径较大的头部501以及外径较小的主体部502。T型密封圈在轴线方向上各部分的孔的直径大致相等。也就是说密封圈的孔可以为圆柱形，其直径能够与导线匹配，当然，本公开对此没有特别显示。例如，密封圈的孔的原始直径比导线的直径小，当密封圈套设在导线上之后，可以与导线紧密贴合，以在二者界面之间形成密封结构。T型密封圈的主体部分502从靠近其头部501到远离头部501的方向上可以具有相同的外径，也可以具有逐步减小的外径。
外螺纹管600套设在T型密封圈的主体部分502。例如，外螺纹管600的内径设置为当其安装在套设在导线400上的T型密封圈500时外螺纹管600能够压紧T型密封圈，以形成密封。外螺纹管600可以与第一孔313相匹配，以使得外螺纹管600可以结合到第一孔313处。例如，第一孔313的内壁设置有与外螺纹管600的外螺纹相匹配的螺纹结构，所述外螺纹管的外螺纹与所述第一孔的内螺纹彼此啮合。
例如，T型密封圈500的头部501的外径等于或大于第一孔313的内径，外螺纹管600的外径大于第二孔314的直径(内径)，这样，在导线的延伸方向上，外螺纹管600的端面至少部分与过渡圆锥孔315的锥面相对，在外螺纹管600插入第一孔313时，可以将T型螺纹管500的头部501抵压在过渡圆锥孔的锥面上，以使得进一步增强密封效果。也就是说，所述密封圈的头部被挤压在所述外螺纹管的端部与所述过渡圆锥孔的锥面之间。
例如，T型密封圈500的主体部分在轴线方向上具有均一的外径，或者主体部分502的外径在远离头部501的方向上逐渐减小，以形成圆锥部。
例如，T形密封圈的内周面与导线紧密贴合。当外螺纹管相对于T形密封圈朝密封圈的头部移动时，外螺纹管的内周面与T形密封圈贴合得越来越紧密，使得密封圈与导线之间的密封越来越好。外螺纹管的外螺纹与第一孔的内螺纹相配合，并使得T形密封圈的头部分别与外螺纹管的一端面以及过渡圆锥孔的锥面相贴合。当外螺纹管靠近第一孔时，T形密封圈的头部在外螺纹管的挤压下与过渡圆锥孔的锥面贴合得越来越紧，使得第二孔和T型密封圈之间的密封越来越好。
此外，需要注意的是，虽然本实施例以上描述的照明装置基于第一至第三实施例(上述凸起部或第一凹槽设置在所述垫圈的内侧或所述垫圈的正上方)。然而，本实施例的结构并不限于第一至第三实施例所述的基本结构，也可以应用于上述凸起部或第一凹槽设置在所述垫圈的外侧的情况，这里不再详细描述。在一些示例中，上述凸起部或第一凹槽设置在所述垫圈的外侧，由于固定件的第一部分除凸起部之外的部分与透镜部件之间具有间隙，因此，这些示例中，固定件对透镜部件的合力点在垫圈的外侧。在这些示例中，透镜部件的中部凸起的问题则可以依靠其他方式来解决。
另外，如图12-14所示，对于导线400，在其伸出到容置空间之外的一 端可以连接有防水接头。本实施例对防水接头的具体结构没有特别限制，可以使用任意合适的防水接头。
在本公开中，各个实施例中的相同或相似的部件使用了相同或相似的附图标记，对这些部件的描述可以参考各个实施例，且不同实施例的结构与方案可以彼此结合或部分结合。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2016年6月7日递交的中国专利申请第201620553724.3号以及于2016年8月29日递交的中国专利申请第201620980014.9号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (33)

  1. 一种发光二极管照明模组，包括：
    底座，具有一安装面；
    至少一个发光二极管元件，设置在所述底座的安装面上，各所述发光二极管元件包括封装在一起的多个发光二极管芯片；以及
    透镜组件，设置在所述底座的设置有所述至少一个发光二极管元件的一侧，并与所述底座之间形成一容置空间，所述至少一个发光二极管元件位于所述容置空间内，所述透镜组件包括透镜支撑部以及与所述发光二极管元件一一对应的透镜部，所述透镜部设置在对应的发光二极管元件上，以实现所述对应的发光二极管元件的配光，所述透镜支撑部与所述透镜部连接，以支撑所述透镜部。
  2. 根据权利要求1所述的发光二极管照明模组，其中，各所述发光二极管元件为独立封装的多芯片发光二极管灯珠。
  3. 根据权利要求1所述的发光二极管照明模组，其中，所述发光二极管元件还包括：
    支架，所述多个发光二极管芯片呈矩阵排列在所述支架上；以及
    封装层，所述封装层包裹所述支架和所述多个发光二极管芯片。
  4. 根据权利要求3所述的发光二极管照明模组，其中，所述封装层直接覆盖在所述支架和所述多个发光二极管芯片上，以将所述多个发光二极管芯片密封在所述支架上。
  5. 根据权利要求1-4任一项所述的发光二极管照明模组，还包括：
    电路板，所述电路板设置在所述安装面上，所述至少一个发光二极管元件设置在所述电路板上。
  6. 根据权利要求1-4任一项所述的发光二极管照明模组，其中，所述底座包括电路板。
  7. 根据权利要求1-4任一项所述的发光二极管照明模组，其中，所述底座包括支撑所述发光二极管元件的主体部。
  8. 根据权利要求7所述的发光二极管照明模组，其中，所述底座还包括设置在所述主体部的与所述安装面相反的一侧的散热器。
  9. 根据权利要求1-4任一项所述的发光二极管照明模组，其中，所述底座包括灯架。
  10. 根据权利要求1所述的发光二极管照明模组，还包括：
    固定组件，所述固定组件设置在所述透镜组件的边缘，以将所述透镜组件固定在所述底座上。
  11. 根据权利要求10所述的发光二极管照明模组，其中，所述固定组件包括以下至少之一：
    固定件，所述固定件被配置为对所述透镜组件施加一朝向所述底座的压力，以将所述透镜组件与所述底座紧固；
    密封胶，所述密封胶设置在所述透镜组件与所述底座之间以将所述透镜组件固定在所述底座上并使所述透镜组件与所述底座之间形成所述容置空间，所述容置空间为密封空间。
  12. 根据权利要求11所述的发光二极管照明模组，还包括：
    弹性垫圈，设置在所述底座和所述透镜组件之间，所述固定组件将所述透镜组件和所述底座彼此固定并使所述弹性垫圈处于压缩状态。
  13. 根据权利要求11所述的发光二极管照明模组，其中，所述透镜支撑部与所述固定件为一体结构。
  14. 根据权利要求11所述的发光二极管照明模组，其中，所述透镜支撑部与所述固定件为分离的结构。
  15. 根据权利要求13或14所述的发光二极管照明模组，其中，所述固定件包括设置在所述透镜组件的与所述底座相反的一侧并与所述透镜组件的一部分面对的第一部分以及从所述第一部分延伸并与所述底座连接的第二部分，所述固定件的第一部分对所述透镜组件施加一朝向所述底座的压力。
  16. 根据权利要求15所述的发光二极管照明模组，其特征在于，所述第二部分从所述透镜组件的侧面延伸到所述底座的侧面，所述固定件的第二部分与所述底座形成彼此配合的卡扣结构，以使得所述第二部分连接到所述底座。
  17. 根据权利要求15所述的发光二极管照明模组，其中，所述第二部分从所述透镜组件的侧面延伸到所述底座的侧面，所述固定件的第二部分通过紧固件以使得所述第二部分连接到所述底座。
  18. 根据权利要求11所述的发光二极管照明模组，其中，所述固定件包括设置在所述透镜组件的与所述底座相反的一侧并与所述透镜组件的一部分面对的第一部分，所述发光二极管照明模组还包括紧固件，所述紧固件将所述第一部分固定到所述底座上。
  19. 根据权利要求17所述的发光二极管照明模组，其中，所述紧固件为螺钉。
  20. 根据权利要求9所述的发光二极管照明模组，其中，所述灯架包括电源安装部和光源安装部，所述透镜组件以及所述发光二极管元件设置在所述光源安装部上，所述电源安装部被配置为放置电源组件。
  21. 根据权利要求20所述的发光二极管照明模组，其中，所述底座包括多个通孔，所述多个通孔位于所述光源安装部和所述电源安装部之间。
  22. 根据权利要求1所述的发光二极管照明模组，还包括：导线引出结构，包括从所述容置空间经过贯穿所述底座的通孔引出到所述发光二极管照明装置外部的导线，所述导线与所述通孔之间被密封。
  23. 根据权利要求22所述的发光二极管照明模组，其中，所述导线引出结构还包括密封圈，所述密封圈将所述导线和所述通孔之间的间隙密封。
  24. 根据权利要求23所述的发光二极管照明模组，其中，所述导线引出结构还包括外螺纹管，所述导线穿过所述密封圈和所述外螺纹管，所述密封圈的内周面与所述导线紧密贴合，所述密封圈的外周面与所述外螺纹管的内周面紧密贴合，且所述外螺纹管至少部分伸入所述通孔中并与所述通孔的内壁结合。
  25. 根据权利要求24所述的发光二极管照明模组，其中，贯穿所述底座的通孔包括依次连接的第一孔、过渡圆锥孔和第二孔，所述第一孔形成在所述底座的远离容置空间的一侧，所述第二孔形成在所述底座的靠近所述容置空间的一侧，所述过渡圆锥孔形成在所述第一孔和所述第二孔之间；所述第一孔的直径大于所述第二孔的直径，所述过渡圆锥孔从远离所述容置空间的一端到靠近所述容置空间的一端的方向上，其直径从所述第一孔的直径逐渐变为所述第二孔的直径。
  26. 根据权利要求25所述的发光二极管照明模组，其中，所述通孔的第一孔具有内螺纹，所述外螺纹管伸入所述通孔的第一孔且所述外螺纹管的外 螺纹与所述第一孔的内螺纹彼此啮合。
  27. 根据权利要求25或26所述的发光二极管照明模组，其中，所述密封圈包括外径较大的头部和外径较小的主体部，所述外螺纹管的内周面与所述密封圈的主体部的外周面紧密贴合。
  28. 根据权利要求27所述的发光二极管照明模组，其中，所述密封圈的头部比所述密封圈的主体部更靠近所述容置空间。
  29. 根据权利要求27所述的发光二极管照明装置，其中，所述外螺纹管的外径和所述密封圈的头部的外径均大于所述通孔的第二孔的直径，所述密封圈的头部被挤压在所述外螺纹管的端部与所述过渡圆锥孔的锥面之间。
  30. 根据权利要求22-26任一项所述的发光二极管照明模组，其中，所述底座包括支撑所述发光二极管元件的主体部以及设置在所述主体部的与所述安装面相反的一侧的散热器。
  31. 根据权利要求30所述的发光二极管照明模组，其中，所述底座还包括在所述发光二极管照明装置的两端从所述散热器向外伸出的安装部。
  32. 根据权利要求31所述的发光二极管照明模组，其中，所述安装部为平行于所述安装面的板状结构或者弯折成楔形的楔形结构。
  33. 根据权利要求22-26任一项所述的发光二极管照明模组，其中，所述导线伸出到所述容置空间外部的一端连接有防水接头。
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