WO2017202249A1 - 电脑主机中的隔板 - Google Patents

电脑主机中的隔板 Download PDF

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Publication number
WO2017202249A1
WO2017202249A1 PCT/CN2017/085098 CN2017085098W WO2017202249A1 WO 2017202249 A1 WO2017202249 A1 WO 2017202249A1 CN 2017085098 W CN2017085098 W CN 2017085098W WO 2017202249 A1 WO2017202249 A1 WO 2017202249A1
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WIPO (PCT)
Prior art keywords
partition
circuit
partition plate
socket
main board
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PCT/CN2017/085098
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English (en)
French (fr)
Inventor
周奋豪
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周奋豪
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Application filed by 周奋豪 filed Critical 周奋豪
Publication of WO2017202249A1 publication Critical patent/WO2017202249A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]

Definitions

  • the invention relates to the technical field of computer hardware devices, in particular to a technology of a partition in a computer mainframe.
  • the mainstream of the existing traditional desktop computer mainframe is a tower mainframe, and its overall shape is a rectangular parallelepiped.
  • Desktop mainframes are available in both horizontal and vertical styles, which are generally the most common. All physical components in the mainframe are generally referred to as computer hardware, including motherboards, hard disks, CPUs, memory modules, discrete graphics cards, optical drives and power supplies, and various heat sinks.
  • the existing tower mainframe is a non-thin chassis, which is large in size and heavy in weight.
  • Hardware arrangement and routing At present, the hardware layout in the traditional desktop mainframe is designed to be able to install almost one type of computer hardware in one location space, so in order to meet more hardware support, a lot of settings are provided in the main chassis.
  • the installation space of each hardware when some hardware installation bits are not used, can only be idle there, which greatly wastes the space volume in the main chassis, so that the space utilization rate in the main chassis is very low.
  • RVV wires Most of the data or power connections between the hardware in the mainframe of a conventional desktop computer are RVV wires, which connect the associated hardware through wires.
  • the connecting wires formed are criss-crossed, complicated and complicated. Not only do users need to have certain professional basic knowledge, but also seriously affect the use.
  • the interior of the main chassis is beautiful, and various traces also greatly occupy the space volume inside the chassis.
  • the traditional CPU heat sink uses 4 screws/expansion bayonet, through the CPU mounting hole on the motherboard, rigid or nearly rigid material, structural way to fix the CPU heat sink on the motherboard on.
  • the following five problems often occur: First, because the screw/expansion pin is tightened too much, the force between the heat sink and the main board is too large, causing the main board to deform and bend to different degrees. Second, sometimes the four screws are unbalanced when they are tightened, causing a partial tilt between the surface of the CPU chip and the heat-conducting base of the heat sink, resulting in a fine gap, which greatly increases the CPU chip and the heat-conductive base of the heat sink. The thermal conductivity hinders heat transfer from the CPU chip to the heat sink.
  • the discrete graphics card in the traditional desktop mainframe if it is a low-end graphics card, generally uses the original heatsink of the graphics card for heat dissipation. If it is a high-power high-end graphics card, either use a high-cost, cumbersome water cooling solution, or re-install a better air-cooled heat sink.
  • most of the independent graphics air-cooled heat sinks on the market have a certain range of compatibility, or there are many matching parts and the installation process is cumbersome. And users who don't have a certain amount of expertise don't even know what kind of radiator should be chosen.
  • the discrete graphics card has the following problems in terms of heat dissipation:
  • the size of the heat sink can hardly exceed the size range of the graphics card itself due to the limitation of the installation method and size specifications.
  • the matching fan also occupies a part of the volume of the heat sink, so the actual heat dissipation area of the heat sink is limited.
  • the discrete graphics card is perpendicular to the air inlet of the side panel of the chassis. If air cooling is adopted, the cold air flowing in from the air inlet is disturbed by the common disorder of the CPU cooling fan and the graphics card cooling fan on the main board, and the cold air outside the chassis cannot be completely and unidirectionally flowed through the independent graphics card radiator. Efficient heat dissipation, because the unscientific and tight air duct in the chassis, the cold air flowing into the independent graphics card and the CPU radiator is caught with the returning hot air, which affects the heat exchange effect of the radiator.
  • the discrete graphics card heatsinks are placed in parallel horizontally, which is very unfavorable for the natural upward movement of the air heat flow.
  • the discrete graphics card is directly inserted vertically into the graphics card slot of the motherboard. Since the main board and the discrete graphics card are both large-sized hardware in the chassis, the space in which the two are vertically mounted is large in size. But this way is very compatible with the hardware.
  • Cooling air duct The design of the cooling air duct in the traditional desktop mainframe is unscientific and disordered, and almost all of them have the phenomenon of returning hot air. And in order to increase the cooling effect of the CPU or the discrete graphics card, blindly increase the size of the heat sink to solve. There is no simple and effective way to transfer and diffuse a part of the heat source by means of the metal casing of the chassis itself.
  • the fan speed in a traditional desktop mainframe usually has two forms: one is a fixed speed, and the other is a temperature-controlled speed by connecting a motherboard PWM jack.
  • the former regardless of the temperature inside the chassis is always a speed, unscientific; the latter, the fan must first have a PWM function, and then enter the motherboard BISS to open, set, the user needs to have certain professional knowledge.
  • there are many types of fans and if the fan in the PWM speed control mode is too noisy or the wind speed is too small, there is almost no way for the user to effectively adjust.
  • the power supply box in the traditional desktop mainframe is large in size. Its function is to directly convert the input municipal AC power into DC output of different voltage values required by each hardware, and connect with each hardware by using many RVV wires, plus The design of the traditional mainframe is backward, which causes the various wires of the inner box of the mainframe to be densely packed and criss-crossed. This greatly wastes the space in the mainframe and affects the aesthetics of the mainframe, and also hinders the convenience of the user. .
  • the object of the present invention is to provide a computer hardware that can be rearranged, so that the required connection lines between the hardware are concentrated into an ultra-thin circuit and have a hidden effect, which can greatly reduce the size and weight of the host.
  • the partitions in the mainframe provide superior support for designing ultra-thin hosts.
  • a further goal is to install computer hardware accurately and quickly.
  • a partition in a computer main body the partition is provided with a front side and a back side
  • the host computer further comprises computer hardware such as a main board, a hard disk, a power supply box, a separate graphics card, a fan, etc.
  • the partition divides the computer host space into two
  • An electric circuit of an ultra-thin flat shape is closely adhered/embedded in the front surface and/or the back surface of the partition plate or in the partition plate. More clearly, the front or back surface of the partition plate is closely attached with an ultra-thin flat shape circuit.
  • an ultra-thin flat-shaped circuit is embedded in the front or back of the partition; or the front and back sides of the partition are closely attached to an ultra-thin flat-shaped circuit, or the front and back sides of the partition are embedded
  • the thickness of the conductor in the circuit is ⁇ 0.5 mm.
  • the computer hardware is correctly connected to each other through the baffle sockets corresponding to the ultra-thin circuits on the baffles, or the special interface of the hardware is directly attached to the corresponding bare conductive circuit contact points on the baffles. Correctly matched and turned on after contact.
  • the ultra-thin flat-shaped circuit in which the upper/inner side of the above-mentioned main body is tightly bonded/embedded is hereinafter referred to as a "separator circuit". These are connected to the corresponding bulkhead circuit through the bulkhead sockets, wires and directly to the computer hardware mounted on the matching bare conductive bulkhead circuit, which will be mounted in parallel or parallel to one side of the bulkhead or On both sides.
  • the separator circuit and the separator are insulated from each other, and the surface of the flat conductor circuit is not higher than the height of the peripheral surface of the separator.
  • the entire separator circuit surface has a tight coverage of the insulation and wear layer.
  • the above-mentioned separator is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate, an ultra-thin insulating copper plate embedded partition plate or a metal-based conductive coating.
  • the circuit separator; or the above-mentioned separator is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate, and the glass fiber/semi-glass fiber-based PCB circuit board is formed into a wiring circuit and a physical physical dimension required for the design, and the partition plate For aluminum alloy or copper metal plate, at the position of one or both sides of the separator, a groove matching the shape and thickness of the above PCB circuit board is processed, and the above PCB circuit board is closely attached to the separator In the corresponding groove, the surface of the PCB circuit board is at the same plane height as the surface of the partition plate.
  • the above-mentioned embedded PCB circuit board has a tight covering of the insulating and wear-resistant layers on the entire surface.
  • the partition plate is made of the same material as the metal casing or the skeleton of the computer main body, and is integrally formed by hot-melting or squeezing the material through a mold, and the partition plate is integrally formed with the metal casing or the skeleton of the computer case; or the above-mentioned partition plate and
  • the metal frame or outer casing of the computer mainframe is separated and independent, and the partition plate is welded and fixed to the metal frame of the chassis or the inner wall of the outer casing.
  • the baffle sockets are directly soldered or contacted to the corresponding baffle circuit.
  • the hardware interface type of the partition socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk interface, SAS hard disk interface, SATA 7+15pin data + power hard disk interface, SATA 7+6pin data + power supply optical drive interface, motherboard boot Start pin POWER SW, motherboard reset pin RESET SW, USB 3.019/20pin jack, USB 2.0 9pin jack, motherboard audio pin HD AUDIO, discrete graphics PCI-E 16X slot, motherboard main power supply 24pin slot, motherboard Auxiliary power supply 4/8pin slot and discrete graphics card auxiliary power supply 6/8pin slot, or any combination of the above hardware interfaces.
  • the bottom of the baffle socket is arranged with the corresponding pins of the socket, and the soldering point is arranged at the corresponding mounting position of the baffle circuit, and the pins at the bottom of the baffle socket are directly soldered and fixed at the corresponding baffle circuit position.
  • the bottom of the baffle socket is arranged with the corresponding pins of the socket, and the pins are in the form of exposed conductive metal shrapnel.
  • the periphery of the shrapnel at the bottom of the baffle socket is provided with a convex positioning pin.
  • the corresponding mounting position on the partition plate has a mounting structure with a concave structure, and the exposed conductive circuit contact points are arranged in order in the concave portion, and correspondingly arranged on the outer periphery of the inner concave portion Positioning hole, the spacer socket is fastened to the corresponding mounting position on the partition by the screw/expansion bayonet, and the conductive metal dome at the bottom of the partition socket is in contact with the circuit contact point in the corresponding concave area on the partition
  • the protruding positioning pins at the bottom of the partition socket are also inserted and matched one by one with the positioning holes on the corresponding mounting positions on the partition plate.
  • main board support columns (the front side of which is a front side of the partition) are distributed and fixed on one side of the partition plate.
  • the support column protrudes from the height of the plate surface by 4 to 7 mm, and the distribution position of the support column of the main board is matched with the mounting hole position on the corresponding supporting main board.
  • the main board support column is made of conductive metal.
  • the main board support column has an internal threaded hole perpendicular to the surface of the partition plate or a matching pin hole matched with the expansion bayonet.
  • the main board support column suspends the main board parallel to the front surface of the partition plate, and the back of the main board and the partition plate The front side is opposite, and the main board is fixed to the main board support column of the partition by screws or expansion pins.
  • a partition in a computer main body wherein: the partition divides a computer mainframe space into two, the partition is provided with a front surface and a back surface, and the partition substrate is a conductive metal flat plate, and the partition plate is It is provided with a partition socket, which is designed as the main bearing conductor for the DC negative/ground transmission of the whole computer mainframe.
  • the computer hardware including the main board, hard disk, power supply box, discrete graphics card and fan is mounted in parallel or parallel to the partition.
  • computer hardware including motherboard, hard disk, power supply box, discrete graphics card, fan, etc., through the bulkhead socket or directly contact with the conductive metal separator, the DC negative circuit/grounding and metal partition in the hardware The phase is turned on.
  • the invention can re-lay most of the hardware in the computer host, significantly reduce the size and weight of the computer host, so that the required connection lines between the hardware are concentrated into an ultra-thin circuit and have a hidden effect, which provides strong support for designing an ultra-thin chassis.
  • the ultra-thin mainframe is about 1/6 of the size of a traditional full-tower chassis. In the case of fully loaded hardware, the ultra-thin mainframe is about half the weight of a traditional full-tower chassis.
  • This ultra-thin host can meet almost all conventional motherboard models (such as ATX, M-ATX, ITX, etc.) installed on the market. It can be installed to support all 3.5-inch hard drives and 2.5-inch hard drives. It can be installed to support all full height and half height.
  • the ultra-long, high-power discrete graphics card can be installed to support notebook optical drives within 14mm thickness.
  • the hardware in the main chassis has been rearranged and the connection form is defined.
  • the user can disassemble and assemble the required hardware extremely quickly and accurately.
  • the main box has a matching integrated "U”.
  • the glyph slider housing (this slider housing is available in a transparent, translucent material) provides an extremely simple mode of operation for the user to open/close the main unit.
  • the whole machine also has excellent heat dissipation performance and humanized one-button intelligent temperature control system.
  • the CPU heatsink, discrete graphics heatsink, power supply box, and exhaust fan in this slim host are custom-sized models that match this slim host.
  • the main board support column on the partition has the same function as the traditional one, but there is one more use here. Because the main board support column is electrically conductive and connected to the partition. Because this ultra-thin chassis is designed with the metal separator as the DC negative pole of the whole machine and the grounding bearing main conductor. The mounting hole of the PC type motherboard is connected to the output DC negative pole and the grounding point of the main board, and the main board fixed on the partition plate through the main board mounting hole through the conductive screw or the bayonet pin.
  • the direct DC/grounding of the main board output is directly connected with the metal partition, and part of the DC negative/ground ground output from the main board is first transmitted to the metal partition through the main board support column, and then the bottom of the power supply box and the metal The large area of the separator plate is returned to the power supply box.
  • the traditional PC mainframe a large number of wires are connected to the power supply slot of the main board, and all the DC negative output of the main board is directly transmitted back to the power supply box, which requires a large number of wires and takes up a lot of space.
  • the cover plate is concealed/covered with an ultra-thin flat circuit, which may be referred to as a "invisible circuit spacer".
  • an ultra-thin flat circuit which may be referred to as a "invisible circuit spacer”.
  • the partition socket is to directly or indirectly connect the hardware in the chassis to the corresponding partition circuit according to the interface type of different hardware; the advantage of the FFC line is that it is ultra-thin soft, precise, and can pass a large current, suitable for Docking between the bulkhead socket and the hardware for a short distance.
  • the bulkhead sockets are soldered or contacted directly to the corresponding bulkhead circuit.
  • some hardware in the chassis can be directly plugged into a matching bulkhead socket for use.
  • a matching bulkhead socket for use.
  • Such as 3.5-inch, 2.5-inch hard drive because it is the hardware used more often, so that the design can be used directly, very fast and user-friendly.
  • Hardware that cannot be plugged directly into the bulkhead socket uses the shortest threaded connection concept to connect the hardware to the matching bulkhead socket with a cord. It also greatly reduces the wiring between the hardware, making the whole machine simple and beautiful.
  • the movable partition socket is generally used for the design of different hardware in the same partition position. That is, increase the number and type of hardware that can be extended in the chassis without increasing the size of the chassis.
  • the mounting position of the movable bulkhead socket on the bulkhead circuit is an inner concave area, there is a circuit contact point of the bare conductor in the concave area.
  • the surface height of the bare circuit contact point in the recessed area is lower than the height of the surrounding spacer surface, so that a short circuit is not caused by touching other hardware.
  • the recessed area can be filled with a matching insulating patch to isolate insulation and dust.
  • Figure 1-8 is a schematic structural view of a computer case in use in the present invention.
  • Figure 9 ⁇ 12 is a schematic view showing the structure of the partition of the computer case
  • Figure 13 is a schematic view showing the structure of a computer case with a sliding cover
  • Figure 14 is a schematic view of the structure of the slider
  • Figure 15 is a schematic view showing the mounting structure when the graphics card is mounted on the partition plate of the present invention.
  • Figure 16 is a schematic view showing the structure of a graphics card mounted on the spacer of the present invention.
  • Figure 17 is a schematic structural view of a separate graphics card heat sink
  • Figure 18 is a schematic structural view of a power supply box
  • Figure 19 is a schematic structural view of a power distribution module
  • Figure 20 is a schematic structural view of a movable partition socket
  • 21 is a schematic structural view of a CPU heat sink when installed
  • Figure 22 is a schematic view showing the structure of a mounting and fixing device for a CPU heat sink.
  • partition 31, main board support column; 32, partition circuit; 33, concave contact point; 34, fixed partition socket; 35, movable partition socket; 36, positioning hole; 37, temperature probe ; 38, ventilation holes; 39, graphics card windshield;
  • motherboard 41, motherboard I / O interface group; 42, CPU chip; 43, PCI ⁇ E / graphics card slot; 44, memory slot; 45, motherboard main power supply slot; 46, motherboard auxiliary power supply slot ; 47, motherboard mounting hole;
  • the buckle the support column, also known as the buckle support column
  • 52 the sliding rod
  • 53 the bridge pressure rod
  • 54 the expansion pin
  • CPU heatsink 61, (CPU) thermal base; 62, (CPU) vacuum heat pipe; 63, (CPU) heat sink fins; 64, CPU additional heatsink;
  • independent graphics card radiator 81, (independent graphics card radiator) thermal base; 82, (independent graphics card radiator) vacuum heat pipe; 83, (independent graphics card radiator) cooling fins;
  • 201 fan; 202, 2.5-inch hard disk; 203, hard disk; 204, optical drive; 205, expansion socket; 206, silicone pad; 208, motherboard I / O baffle.
  • the computer host has a meaning with the computer mainframe, and the computer mainframe is referred to as the computer chassis.
  • a computer case includes a main chassis 1 frame and a computer hardware, wherein the computer hardware includes a motherboard 4, a hard disk 203/power box 9 and a corresponding heat sink, and the main chassis 1/skeleton is provided.
  • the computer hardware includes a motherboard 4, a hard disk 203/power box 9 and a corresponding heat sink, and the main chassis 1/skeleton is provided.
  • a hard disk 203/power supply box 9 is provided on the other side of the partition 3, which is the back surface of the partition 3.
  • the main board 4, the hard disk 203/the power supply box 9 are all parallel to the side surface of the partition plate 3, and the circuit board 3 is provided with a circuit on the front side or/and the back side or the partition plate 3, and the circuit board 3 is provided with computer hardware for circuit connection. Baffle socket.
  • the separator 3 is made of a metal material, it is called a metal separator.
  • the computer mainframe is a vertical ultra-thin computer mainframe, and the overall outline is a flat square body, but the local corners and planes have different angles or structures, and the volume is about 1/6 of the traditional PC main box, and the hardware is fully loaded.
  • this ultra-thin host is about half the weight of a traditional PC mainframe.
  • you can install motherboard 4 models (such as: ATX, M-ATX, ITX, etc.) that support almost all PCs currently on the market.
  • An optical drive 204 is mounted on the partition 3, and a notebook optical drive 204 supporting a thickness of 14 mm is preferentially mounted.
  • the hardware in this ultra-thin host has been rearranged and the connection form definition.
  • the glyph slide 2 housing (this slider 2 housing can be a transparent, translucent material) provides an extremely simple operating mode for the user to open/close the main unit.
  • the front surface of the partition plate 3 is further provided with a main board support column 31 (on which the main board 4 is mounted), a partition 3 invisible circuit, a partition socket, a CPU heat sink 6 buckle 5, a CUP additional heat sink, an inner wall expansion socket 205, and a main board. I/O baffle spacer card slot 16.
  • the front surface of the partition plate 3 is provided with a main plate support column 31, and the main plate 4 is fixed to the surface of the partition plate 3 through the main plate support column 31.
  • the main board support column 31 has an internal thread hole perpendicular to the plate surface of the partition plate 3 or a bayonet hole matched with the expansion bayonet.
  • the main board support column 31 suspends the main board 4 in parallel on the front surface of the partition plate 3, and the main board 4
  • the back side is opposite to the front side of the partition plate 3, and the main board 4 is fixed on the main board 4 of the partition plate 3 by screws or expansion bayonet pins.
  • the main board 4 and the partition 3 are suspended so that the protruding pins on the circuit board on the back side of the main board 4 do not come into contact with the surface of the partition 3 to cause a short circuit.
  • a plurality of main board support columns 31 are disposed on the front surface of the partition plate 3, and the height of the board surface of the partition plate 3 is 4-7 mm, and the distribution positions of the main board support columns 31 are opposite to the mounting holes of the corresponding supporting main board 4. One by one match.
  • the main board support column 31 is made of a conductive metal material and is fastened and electrically connected to the partition plate 3.
  • the main board support column 31 in the present application not only has the function of the main board support column 31 in the conventional chassis, but also because the ultra-thin PC main box is designed as the main body of the DC negative/ground bearing of the whole machine, and the conventional main board
  • the mounting hole is connected to the output DC negative pole and the grounding of the main board 4, and the conductive screw or the bayonet pin is fixed in the main board supporting column 31 of the partition plate 3 through the main board mounting hole 47, that is, the output DC negative pole of the main board 4 is realized/ The ground is in direct communication with the partition 3.
  • the above circuit is a flat conductor circuit and the maximum thickness of the conductor is ⁇ 0.5 mm, and the flat conductor circuit and the separator 3 are insulated from each other, and the surface height of the flat conductor circuit is not higher than the height of the surface of the partition plate 3 around it, except for the socket.
  • the entire surface of the circuit outside the area is covered by an insulating and wear-resistant layer.
  • a plurality of pieces of hardware are mounted in parallel on both sides of the partition plate 3, and most of the wires connected between the respective hardware are covered on the surface of the partition plate 3 or embedded in the partition plate 3 by the above-mentioned very flat conductor circuit, and are densely packed. Arrangement and centralized routing, effectively solve the signal and power transmission between hardware, rearrange the hardware, and greatly reduce the size of the chassis.
  • the partition plate 3 is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate 3, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate 3, an ultra-thin insulating copper plate embedded partition plate 3 or a metal base. Conductive coated circuit separator 3. A platform for mounting fixed supports can be provided for each hardware.
  • the separator 3 is a glass fiber/semi-glass fiber-based printed circuit-embedded separator 3, wherein the glass fiber/semi-glass fiber is a substrate, and the glass fiber/semi-glass is formed to meet the design requirements of the circuit wiring and the physical shape.
  • the fiber-based PCB circuit board, the partition plate 3 is a metal plate made of aluminum alloy or copper, and a groove which is opposite to the shape and size of the corresponding PCB circuit board is processed at a position of one or both sides of the partition plate 3,
  • the PCB circuit board is closely attached to the corresponding recess in the partition 3, so that the surface of the PCB circuit board is at the same plane height as the surface of the partition 3 on which it is placed.
  • the circuit on the spacer 3 is collectively referred to as "invisible circuit spacer 3".
  • the flat conductor circuit on the hidden circuit board 3 is hereinafter referred to as "separator circuit 32".
  • the partition 3 of the embedded PCB circuit board is covered with an insulating layer and a wear layer.
  • the specific operation process is: processing a groove having a depth of 0.1 to 1 mm on the partition 3, the position of the groove, The shape and size depend on the specific requirements of the trace, and then the ultra-thin printed integrated PCB circuit board is filled into the groove, and the groove of the spacer 3 and the surface of the PCB circuit board are insulated and coated, and the PCB is printed by the adhesive.
  • the circuit board is seamlessly fastened in the corresponding recess of the partition 3.
  • the surface height of the PCB circuit board is basically the same as the height of the board surface of the partition plate 3, and finally the insulating and wear-resistant coating is applied on the entire surface of the partition plate 3 in which the PCB circuit board is fastened. Therefore, the partition 3 is integrated with the surface of the PCB circuit board, and the circuit inside is hardly seen.
  • the PCB circuit board is uniformly embedded in the front surface of the separator 3.
  • the partition plate 3 is an ultra-thin insulating copper sheet embedded with the partition plate 3, that is, a process of etching, CNC milling or die-molding, and processing the position of the metal plate (separator 3) where the wires need to be routed.
  • the copper sheet with a thickness of 0.05-0.5 mm is made into various traces required for the design by etching or die stamping and shearing process, and the outermost contour specifications of the copper traces are densely arranged and the metal
  • the shape and size of the grooves on the flat plate (separator 3) match.
  • the groove on the metal plate (separator 3) and the processed ultra-thin copper piece are routed, the surface is insulated, and finally the ultra-thin insulating copper piece is closely embedded in the metal plate (separator 3) by an adhesive.
  • the surface height of the ultra-thin copper wire is not higher than the surface height of the surrounding metal plate (separator 3).
  • the partition 3 is an FPC flexible wire interposing partition 3, except that the embedded circuit material is an FPC flexible wire row, and other processes embedded in the separator 3 and the above-mentioned "glass fiber/semi-glass fiber base printing"
  • the circuit board embedded partition 3" is basically the same.
  • the separator 3 is a metal-based conductive coating circuit separator 3, that is, the metal surface is covered with an insulating layer, and then the liquid/colloidal/powder conductive coating is used to paint the desired trace circuit on the insulating layer. After curing by air drying or high temperature, a stable conductive circuit coating is formed, and finally the insulation and wear layer are covered on the entire circuit board 3 (except for the partial area connected to the bulkhead socket).
  • the coatings and processes used in this solution are relatively expensive.
  • the partition plate 3 is made of the same material as the metal casing or the skeleton of the computer case, and is integrally formed by heat-melting or squeezing the material through a mold.
  • the metal frame or casing of the partition 3 and the computer case may also be separated and separated, and the partition 3 is welded and fixed to the metal frame of the case or the inner wall of the case. Because the partition 3 is connected to the metal casing of the casing, it provides good heat conduction and heat dissipation support for the hardware that is mounted in parallel on the surface of the partition 3 in parallel.
  • the above-mentioned "metal casing of the chassis” is the "main casing 1" in the figure.
  • the process of the separator 3 having the metal invisible circuit fixedly connected with the metal casing or the skeleton of the main box is: an integral type, that is, the partition 3 is the same material as the metal shell or the skeleton of the main box, and is integrally formed by a mold.
  • the material is integrally formed after hot melt or extrusion.
  • the process is processed on the partition 3 in the formed main box, so that the ultra-thin circuit traces required for the design are arranged on/in the partition 3; the reflow soldering, the partition 3 and the metal frame or the outer casing of the chassis are Separate and independent, the ultra-thin circuit traces required for the design have been processed on/in the separator 3, and then the parts to be connected and fixed to the metal frame of the chassis or the inner wall of the case are soldered first, and the combination is matched. After that, it is placed in a reflow device for reflow soldering. After cooling out, the partition 3 is tightly fixed to the metal frame or casing of the chassis.
  • the separator socket is directly soldered or contacted to the circuit of the corresponding partition 3.
  • the hardware interface type of the partition socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk 203 interface, SAS hard disk 203 interface, SATA 7 +15pin data + power supply hard disk 203 interface, SATA 7+6pin data + power supply optical drive 204 interface, motherboard 4 boot pin POWER SW, motherboard 4 restart pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin Socket, motherboard 4 audio pin HD AUDIO, discrete graphics card PCI-E 16X slot, motherboard 4 main power supply 24pin slot, motherboard 4 auxiliary power supply 4/8pin slot and independent graphics card 7 auxiliary power supply 6 / 8pin slot, or any combination of the above hardware interfaces.
  • the bulkhead socket interfaces the hardware in the main chassis with the corresponding bulkhead circuit 32 according to the interface type of the different hardware.
  • the advantage of the FFC line is that it is ultra-thin, soft, accurate, and capable of passing large currents. It is suitable for short-distance docking between the bulkhead and the hardware.
  • the "separator socket” described above is a general term for the following "welded/fixed bulkhead socket” and "movable bulkhead socket”.
  • the bulkhead sockets are divided into welded and movable types according to the layout and design requirements in the chassis.
  • the bottom of the "separator socket” is arranged with the corresponding pins (pins) of the socket.
  • the corresponding mounting position of the spacer circuit 32 has solder joints, and the pins (pins) at the bottom of the "separator socket” are arranged. Direct soldering is fixed to the solder joint location of the corresponding spacer circuit 32.
  • the welded bulkhead socket is also referred to as a fixed bulkhead receptacle 34.
  • the bottom of the "baffle socket” is arranged with the corresponding pins (pins) of the socket, and these pins (pins) are in the form of exposed conductive metal domes 104, and the metal at the bottom of the "separator socket” There are a plurality of positioning pins 94 around the shrapnel 104.
  • the movable bulkhead socket 35 is generally used for the design of different hardware in the same partition 3 position, that is, to increase the number and type of hardware that can be extended in the chassis without increasing the volume of the chassis.
  • the area on the bulkhead circuit 32 for mounting the "moving bulkhead receptacle 35" has a concave configuration 33 in which the exposed conductive, flat circuit contacts are arranged in an orderly manner, said "circuit contact point".
  • the positioning pin 94 at the bottom of the movable partition socket 35 can be inserted into the positioning hole 36 of the concave portion of the partition circuit 32, and finally the movable type by the screw/expansion bayonet
  • the baffle receptacle 35 is fixed to the partition 3, and the conductive metal dome 104 at the bottom of the "moving baffle receptacle 35" and the circuit contact point in the recessed area of the baffle circuit 32 are completely and accurately connected one by one. .
  • the mounting position of the movable partition socket 35 on the partition circuit 32 is an inner concave portion, there is a bare circuit contact point in the concave portion, and the bare circuit in the concave portion is when other hardware is mounted at the same position.
  • the surface height of the contact point is lower than the height of the surface of the surrounding partition 3, so that a short circuit is not caused by touching other hardware.
  • the recessed area can be filled with a matching insulating patch to isolate insulation and dust.
  • the bottom of the spacer socket is arranged with the corresponding pins of the socket, and the corresponding mounting position of the spacer circuit 32 has soldering points, and the pins at the bottom of the spacer socket are directly soldered and fixed to the corresponding spacers.
  • the board circuit 32 is positioned; or the bottom of the bulkhead socket is arranged with the corresponding pins of the socket, and the pins are present in the form of bare conductive metal domes 104 around the shrapnel 104 at the bottom of the bulkhead socket.
  • the positioning pin 94 is disposed, and the area for mounting the partition socket on the partition 3 has a concave structure, and the exposed conductive and flat circuit contact points are arranged in the concave area, outside the concave area.
  • the peripheral partition plate 3 is provided with a corresponding positioning hole 36.
  • the partition socket is fixed on the partition plate 3 by a screw/expansion bayonet, and the conductive metal dome 104 at the bottom of the partition socket and the circuit in the concave area on the partition plate 3 The contact points are precisely touched and turned on.
  • Some hardware in the main chassis can be directly inserted into the "separator socket", such as the 3.5-inch, 2.5-inch hard disk 202, because it is the hardware used more often, so that the design can be directly plugged in, very fast and user-friendly.
  • Hardware that can't be plugged directly into the "baffle socket” uses the concept of the shortest threaded connection, and the cable is used to connect the hardware to the matching "baffle socket", which also greatly reduces the routing between hardware. Make the whole machine simple and beautiful.
  • the main board 4 is backed by the front surface of the partition plate 3 and is fixed in parallel to the main plate support column 31 on the front surface of the partition plate 3. Because the main box is of vertical design, on the one hand, the center of gravity of the whole machine should be moved down as much as possible, and the end of the main board 4 close to the CPU position is obviously biased, and the downward placement can lower the overall center of gravity of the main box.
  • the main box is more stable when it is vertical; on the other hand, the main box is vertical, and the air heat flow in it is continuously rising, and is concentrated in the upper space of the main box, and the lower air flow of the main box relative to the upper air flow.
  • the temperature is low, so the north end of the motherboard 4 near the CPU is placed downward, which is more conducive to the heat dissipation effect of the CPU heat sink 6 in the airflow.
  • the north end side of the main board 4 near the CPU position is downward (can be vertical, or the angle between the downward direction and the vertical direction is ⁇ 5°)
  • the west end side of the main board 4 ie, one end of the main board I/O interface group 41 Facing the tail portion 13 of the chassis
  • the back surface of the main board 4 faces the front surface of the partition plate 3, and is fixed to the main board support column 31 parallel to the partition plate 3. Due to the angular position between the north end side and the west end side of the main board 4, there is a main board auxiliary power supply slot 46, which is projected on the front side of the main board 4 on the front side of the main board 4 on the front side of the main board 4, close to this.
  • the partition 3 of the main board auxiliary power supply slot 46 has a bulkhead socket at the front side.
  • the bottom pin (pin) of the baffle socket is sequentially connected to the output +12V DC and the DC negative (ground) in the baffle circuit 32, and is inserted into the main board auxiliary power supply slot 46 on the main board 4 through one end of the wire.
  • the other end of the wire is inserted into the bulkhead socket for communication, so that the corresponding power supply circuit on the partition 3 communicates with the main board auxiliary power supply slot 46 on the main board 4.
  • the main board 4 is backed by the front side of the partition 3, the north end side of the main board 4 near the CPU position faces downward, and the west end of the main board 4, that is, one end of the main board I/O interface group 41 faces the tail of the chassis.
  • a partition socket is disposed on the front side of the partition 3 adjacent to the auxiliary power supply slot of the main board 4, and the bottom stitch of the partition socket is connected to the partition circuit 32.
  • One end of the wire is inserted into the motherboard auxiliary power supply slot 46 on the main board 4, and the other end of the wire is inserted into the bulkhead socket to connect the corresponding power supply circuit of the partition 3 to the main board auxiliary power supply slot 46 on the main board 4. .
  • the heat sink of the computer CPU includes a CPU additional heat sink 64 and a CPU heat sink 6.
  • the CPU heat sink 6 is fixed by an H-bridge clamp device, that is, the mounting and fixing device of the CPU heat sink, the H-bridge press buckle
  • the bracket comprises two sliding rods 52.
  • the middle sections of the two sliding rods 52 are parallel to each other, and the two sliding rods 52 are bent at both ends, and are at an angle of 45° outward, at the two ends of the two sliding rods 52.
  • Each of the bent sections has a support post 51 movable on the section.
  • the bottom of the support post 51 has an expansion chuck.
  • the size and shape of the expansion chuck are the same as the CPU heat sink 6 on the main board 4.
  • the mounting holes are matched.
  • Support column 51 is also called Buckle support column.
  • a bridge bar 53 which is freely movable in the direction of the axis of the two slide bars 52 is provided in a section parallel to the middle of the two slide bars 52, and the intermediate section of the bridge bar 53 has an inner groove structure.
  • the two sliding rods 52 are resilient material members or the bridge pressing rods 53 are resilient material members. Since the sliding rod 52 of the buckle 5, the bridge pressing rod 53 and even the convex structure on the back surface of the heat-conducting base are resilient material, the heat-conducting base and the CPU chip are not caused by excessive force or imbalance during manual fastening. 42 The thermal conductivity of the contact between the surfaces changes too much, and it is not easy to deform and bend the main board 4.
  • the two sliding rods 52 and the bridge pressing rods 53 are combined to form the "H" type structure, so the fastener 5 of the CPU is referred to as an "H-shaped bridge fastener bracket".
  • One end of the CPU additional heat sink 64 is a flat vacuum heat pipe evaporation end, and the other end is a vacuum heat pipe condensation end to which the (CPU) heat sink fin 63 is welded, and the CPU is attached to the heat sink 64.
  • the corrugated tube greatly enhances the flexibility of the (CPU) vacuum heat pipe 62, making it easier for the user to operate and adapt to different types of motherboards 4.
  • the bottom of the condensation end of the CPU additional heat sink 64 is flat, and is fixed on the inner wall of the metal casing of the chassis closest to the CPU by screws or snaps, thereby transferring part of the heat of the CPU heat-conducting base 61 to the metal casing of the chassis and the CPU is attached.
  • the heat sink fins on the condensation end of the heat sink 64 dissipate heat.
  • the CPU heat sink 6 is a vacuum heat pipe type heat sink, and the bottom of the CPU heat sink 6 has a heat conducting base mounted on the CPU chip 42.
  • the front side of the thermally conductive base is directly parallel to the surface of the CPU chip 42.
  • the substantially central position of the back surface of the heat-conducting base has a convex structure, and the concave sliding groove of the middle portion of the bridge pressing rod 53 can just buckle the protruding structure, and the bridge pressing rod 53 is placed on the back surface of the heat-conductive base. Since the bridge pressing rod 53 of the buckle 5 passes through the convex structure at the center of the back surface of the heat-conducting base, the downward pressure generated when the buckle 5 is tightened is concentrated on the central area of the heat-conductive base, so that the heat-conductive base and the CPU chip 42 are The contact surfaces are evenly stressed, making the thermal conductivity between them stable.
  • the heat conducting base is attached to the CPU chip 42 by a protruding structure that is fastened to the back surface thereof by the bridge pressing rod 53, and the bridge pressing rod 53 is movably fixed to the two sliding rods 52, and the two sliding rods 52 are movable.
  • the chucks on the support columns 51 are respectively inserted into the mounting holes of the four CPU heat sinks 6 on the main board 4, and finally the expansion pins 54 are inserted into the pin holes supported therein, thereby the entire clip 5 brackets together with the CPU heat sink 6 Fastened together on the main board 4.
  • the bridge pressing rod 53 can move on the sliding rod 52, so that the entire CPU heat sink 6 can be in the plane of the main board 4.
  • a small range of translation in any direction greatly reduces the chance that the edge of the CPU heat sink 6 will not be properly installed due to the conflict with the position of the components on the motherboard 4.
  • the CPU additional heat sink 64 adopts a movable installation mode, and the user can freely select whether to install according to requirements, without replacing the entire CPU heat sink 6, which greatly saves the user's economic expenses.
  • the main chassis is small in size, it cleverly utilizes the metal casing of the chassis to quickly transfer part of the CPU heat to the casing for heat dissipation, which greatly increases the effective area of heat dissipation.
  • the buckle 5 bracket adopts a movable fixed design in many places, it is almost compatible with all conventional motherboard models.
  • the buckle 5 has few accessories and light weight, and the disassembly and assembly operation is extremely convenient, and the disassembly and assembly can be completed in 10 seconds.
  • the bottom 12 of the ultra-thin PC main box casing has an elongated strip-shaped air inlet opening, which increases the airflow exchange around the bottom plate of the chassis; and because of this long opening, the partition 3 is greatly hindered.
  • the heat on the chassis floor area in the front space is transferred to the chassis floor area of the back space of the partition 3 and the partition 3 itself, so that the CPU attached to the chassis floor installed in the front space of the partition 3 is attached with the heat sink 64.
  • the heat transferred can be taken away by the airflow more quickly, and it will not be transmitted to other parts of the chassis and affect the heat dissipation of other hardware.
  • the computer case is vertical, and the motherboard 4 is placed near the end of the CPU, that is, the north end of the main board 4 is placed downward, the south end of the main board 4 is upward, and the inner wall of the casing near the south end of the main board 4 is the top inner wall of the chassis, and the inner wall is vertically higher than
  • a long strip-shaped socket is arranged to form an inner wall expansion socket 205.
  • the inner wall expansion socket 205 includes three kinds of interfaces, DC+5V, DC negative power supply. Interface, 7+6pin SATA optical drive 204 interface and 7+15pin SATA hard drive interface.
  • the inner wall expansion socket 205 adopts a long strip PCB circuit board to concentrate the wires, the long strip PCB circuit board closely fits the inner wall of the chassis, the circuit board portion extends to the edge of the front surface of the partition plate 3, and the extension portion of the long strip PCB circuit board
  • the circuit is connected to the corresponding circuit on the partition 3, and is fixed by welding.
  • the pins on the bottom of the interface socket are fixed on the corresponding circuit of the long PCB circuit board by soldering or contact, and the socket interface is oriented parallel to the surface of the partition 3.
  • the user-friendly "inner wall expansion socket 205" is designed to be an active installation type, and the user can select whether to install according to his own use requirements.
  • the notebook optical drive 204 or the 2.5-inch hard disk 202 When the notebook optical drive 204 or the 2.5-inch hard disk 202 is inserted into the inner wall expansion socket 205, the notebook optical drive 204 or the 2.5-inch hard disk 202 is parallel to the main board 4 and is located above the south end side of the main board 4. Considering the practicability, the input port of the notebook optical drive 204 faces the front of the main chassis. Cleverly Efficient use of the free space above the south end of the motherboard 4, because the notebook optical drive 204 and 2.5-inch hard disk 202 is very light and low, the heat is very low, so the impact on the center of gravity and heat dissipation of the entire chassis can be neglected.
  • the motherboard 4 has a lot of pins, slots and wires on the south end side, the effect is beautiful, and the notebook optical drive 204 and the 2.5-inch hard disk 202 which are installed in parallel at the position of the main board 4 can be subtly blocked and the whole chassis can be shielded. The arrangement is more beautiful.
  • a board I/O baffle partition slot 16 is disposed at a position on the edge of the main board 4 where the I/O interface group is located on the west end of the main board 4, and the slot is opened.
  • Straight groove/hole slit of about 1mm, seam depth of 2 ⁇ 3mm, total length of slot/opening ⁇ total length of main board I/O baffle 208 (main board 4 tailgate), loading main board 4 into main unit
  • the tailgate is snapped into the matching hole in the motherboard I/O bezel 208 (main board 4 tailgate) at the rear of the chassis.
  • the motherboard I/O barrier 208 (the motherboard 4 tailgate) is close to the back of the motherboard 4.
  • One side snaps into the slot of the partition 3 and is mounted in a manner that is as simple as a conventional chassis.
  • the hardware installed in the space on the back side of the partition 3 includes a separate graphics card 7 including a heat sink, a power supply box 9, a turbo fan 201, a hard disk 203, and a power distribution module 10, all of which are mounted in parallel on the partition 3, due to the parallel stickers.
  • a variety of hardware mounted on the back of the partition 3 has a certain requirement for heat dissipation, so that the back surface of the partition 3 is in contact with the concave partition circuit 32 which is matched with the power supply box 9, the partition socket, and the power distribution module 10.
  • the surface of the other areas on the back side of the spacer 3 is presented as a flat, thermally conductive metal plate.
  • the specific structure is as follows:
  • the discrete graphics card 7 is disposed in parallel with the back surface of the spacer 3.
  • This ultra-thin computer chassis can be installed to support all full-height, half-height, ultra-long, high-power discrete graphics cards7.
  • the I/O interface on the discrete graphics card 7 is oriented the same as the I/O interface on the motherboard 4, and the I/O interface area on the discrete graphics card 7 is offset from the edge of the motherboard 4 PCB board, and the edge of the motherboard 4 PCB is set.
  • the edge of the PCB board of the /O interface that is, the west end edge of the motherboard 4.
  • the above-mentioned "I/O interface on the discrete graphics card 7" is the “independent graphics I/O interface group 71" in the figure, and the above “I/O interface on the motherboard 4" is the “mainboard I/O interface group 41" in the figure. ".
  • the motherboard 4 is mounted parallel to one side of the metal plate, the metal plate is opposite to the back surface of the motherboard 4, and the independent graphics card 7 is mounted in parallel on the other side of the metal plate.
  • the discrete graphics card 7 has a facing metal plate of the GPU chip 72, and the discrete graphics card 7 is placed in parallel on the back side of the motherboard 4 near the south end region.
  • the 7I/O interface of the discrete graphics card is oriented in the same direction as the 4I/O interface of the motherboard, and in the direction in which their I/O interfaces are oriented, the edge of the PCB board where the independent graphics card 7I/O interface is located protrudes from the motherboard 4I/
  • the distance between the edge of the PCB board where the O interface is located is 15 to 40 mm, that is, the I/O interface area on the discrete graphics card 7 is translated to the west end of the motherboard 4.
  • the I/O interfaces of the high-end discrete graphics card 7 are mostly double-layered, it is ingenious to separate the I/O on the discrete graphics card 7 in consideration of being fully compatible with all the graphics cards and minimizing the space occupied by the graphics card.
  • the interface area is partially translated out of the west end of the motherboard 4.
  • the discrete graphics card 7 communicates with the corresponding graphics card slot 43 on the motherboard 4 through a riser card or an extension cable.
  • the side (back side) on which the heat sink cannot be mounted on the discrete graphics board PCB board 70 faces the back of the motherboard 4.
  • the board 4 and the discrete graphics card 7 do not necessarily have the partition 3, and the PCB board where the 7I/O interface of the discrete graphics card is located
  • the edge does not have to protrude from the edge of the PCB where the 4I/O interface of the motherboard is located.
  • the discrete graphics card 7 communicates with the corresponding graphics card slot on the motherboard 4 through a riser card or an extension cable.
  • the motherboard 4 and the discrete graphics card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space.
  • the biggest advantage of this method is that it does not need to modify the heatsink and fan 201 of the discrete graphics card 7, and the original heatsink and fan 201 of the discrete graphics card 7 can be used, and the compatibility is good in this way.
  • the disadvantage is that the required chassis space is larger than the "inside" type.
  • the heat sink mounted on the discrete graphics card 7 is provided with a vacuum heat pipe 82 and a heat conducting base 81.
  • the vacuum heat pipe has an evaporation end and a condensation end, and the evaporation end of all the vacuum heat pipes on the heat sink directly or indirectly with the independent graphics card 7
  • the GPU chip 72 is in contact with each other, and the condensation end of some or all of the vacuum heat pipes is directly or indirectly contacted with the partition 3 or the inner wall of the metal casing of the chassis.
  • the “chassis metal casing” is the "main box” in the figure Housing 1".
  • the above-mentioned independent graphics card heatsink 8 is a flat heatsink as a whole, and has a small footprint. It comprises aluminum or copper fins 83 arranged in parallel spaced, 2-8 vacuum heat pipes and 1 or 2 of said heat conducting bases.
  • the aluminum or copper heat sink fins form the main part of the flat heat sink, and the flat heat sink is mounted in parallel on the discrete graphics card 7 or on the back surface of the bulkhead 3, and the heat conductive base is disposed on the front surface of the heat sink, the surface of the back surface of the heat sink
  • the condensing end of the flat vacuum heat pipe is arranged in a row, and the evaporation end of the vacuum heat pipe is in close contact with a copper or aluminum heat conductive base.
  • the condensing end of the vacuum heat pipe is extruded into a semi-arc or flat shape through a die, and is closely attached to the fin.
  • the condensing end of the semi-arc/flat vacuum heat pipe on the back side of the heat sink is also in parallel with the separator. 3 Conduct heat on the back side.
  • the flat heat sink further comprises an arranged vacuum heat pipe, each vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded in the heat conduction.
  • the condensation end of the vacuum heat pipe is extruded through the die into a "D" shape in cross section, that is, a flat side is formed at the condensation end of the vacuum heat pipe, and the flat side is parallel to the back surface of the heat sink.
  • a non-flat side portion formed by the condensation end of the "D" shaped vacuum heat pipe is fixed to the back surface of the heat sink in combination with the heat dissipation fin of the heat sink.
  • the heat sink is intimately in contact with the partition wall 3 or the inner wall of the metal casing of the chassis through the condensation section of the vacuum heat pipe, and the graphics card heatsink fan 201 is not mounted on the heat sink, so The actual heat dissipation area of the discrete graphics card 7 is greatly increased.
  • the partition 3 for heat dissipation and the metal casing of the chassis exist themselves, which also greatly saves the material cost and the quality of the graphics card heat sink.
  • the heat sink is fixed to the mounting position of the independent graphics card 7 on the back of the partition 3.
  • the heat sink is provided with one or more heat conducting bases, and the heat conducting base is closely fitted with the evaporation end of the vacuum heat pipe, and the vacuum is installed.
  • the condensation end of the heat pipe is processed into a flat shape, and is closely attached to the back surface of the separator 3 or the inner wall of the metal casing of the casing, and the heat-dissipating fins arranged in parallel are arranged in close contact with the partition plate 3 having the flat vacuum heat pipe.
  • the discrete graphics card 7 has one side of the GPU chip 72 parallel to the partition 3, the side of the discrete graphics card 7 facing the partition 3 and the partition 3 have a space in which a separate graphics card heat sink 8 is mounted.
  • the heat dissipating fins in the heat sink are arranged in parallel and spaced apart, and the strip fins perpendicular to the partition 3 have a certain oblique angle with the geographical vertical direction.
  • the heat-conducting base of the heat sink is in close contact with the surface of the GPU chip 72 of the discrete graphics card 7, and the "evaporation section" in the vacuum heat pipe is closely embedded in the heat-conducting bottom.
  • the "condensing section" of the other part of the vacuum heat pipe is distributed between the back surface of the partition plate 3 and the heat radiating fins, and closely adheres to the partition plate 3 and the heat radiating fins. Or distributed on the inner wall of the metal casing of the chassis near the graphics card, and closely fits the inner wall of the casing.
  • the heat in the 7 GPU chip 72 of the discrete graphics card is conducted by the "evaporation section" of the vacuum heat pipe which is conducted by the heat-conducting base close to the surface, and is quickly transferred to the "condensation section” by the "evaporation section".
  • the heat-dissipating fins, the partitions 3, or the metal casing of the chassis, which are in close contact with the "condensing section”, exchange heat with the air for a large area to achieve heat dissipation.
  • graphics card cooler 8 Due to the “internal discrete graphics card cooler 8", hereinafter referred to as "graphic card cooler".
  • graphics card in the following is the “independent graphics card 7" in the figure.
  • the “chassis cover/cover” in the following is the “slider 2" in the figure, and the “PCB board of the discrete graphics card 7" is shown in the figure.
  • Independent graphics card board 70 According to the design of the main box and user requirements, it is divided into two forms:
  • the digital finger socket of the graphics card is inserted into the graphics card slot in the back space of the chassis, and the graphics card heatsink is parallel to the back of the partition 3. touch.
  • the GPU chip 72 of the discrete graphics card 7 is vertically projected to the center of the back of the PCB of the graphics card to paste/install the matched insulating elastic silicone pad 206.
  • the chassis cover is pushed through the slot in the chassis, the cover is independent.
  • the spacing between the PCB boards of the graphics card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed to generate a rebound pressure which acts vertically on the back surface of the discrete graphics card board 70.
  • the graphics card heatsink is fixed to the discrete graphics card board 70, the resulting pressure eventually causes the graphics card heatsink to adhere to the surface of the spacer 3. A part of the heat in the graphics card heat sink is efficiently conducted to the partition 3 for heat dissipation.
  • the graphics card heat sink is firstly mounted in parallel to the corresponding partition 3 position on the back space of the chassis.
  • the "condensing section" of the vacuum heat pipe 82 in the heat sink is closely related to the surface of the partition 3 or the inner wall of the metal casing of the chassis. fit.
  • a matching insulating elastic silicone pad 206 is pasted/mounted in a center position of the vacant discrete graphics 7 GPU chip 72 vertically projected to the back of the graphics card PCB.
  • the vacant discrete graphics card 7 has a GPU chip 72 facing the graphics card heatsink, and the gold finger interface on the discrete graphics card 7 is correctly inserted into the matching graphics card slot, and the GPU chip 72 and the graphics card of the discrete graphics card 7 are fixed.
  • the heat conductive base 81 of the heat sink is close to each other. After the chassis cover is pushed through the slot in the chassis, the spacing between the cover and the PCB of the discrete graphics card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed to generate a rebound pressure. Vertically acts on the back of the discrete graphics PCB board 70.
  • the surface of the GPU chip 72 on the discrete graphics card 7 is subjected to the vertical pressure in the direction of the spacer 3, the surface of the GPU chip 72 is in parallel with the front surface of the thermal conduction base 81 of the graphics card heat sink.
  • the discrete graphics card 7 has been historically fast and easy to install with a fixed graphics card heatsink, installed in almost a second. Since the GPU chip 72 is subjected to the center position of the back, the surface of the GPU chip 72 can be smoothly attached to the surface of the heat-conducting base 81 of the graphics card heat sink, so that the force between the GPU chip 72 and the heat-conductive base 81 is naturally balanced, and the user Don't worry about the heat transfer effect caused by the uneven force of the four screws when installing the traditional heat sink.
  • the power box 9 is an ultra-thin contact type power supply box 9, which is provided with a bottom surface 91, a top surface and a side surface, and is provided with an input port of a power source and an output port 92 of a power source.
  • the output port 92 of the power box 9 is directly provided.
  • the three plugs and sockets are connected.
  • the side of the power supply box 9 which is in parallel with the surface of the partition plate 3 is set as the bottom surface of the power supply box 9.
  • the independent contact copper piece 93 has a front surface which is very smooth and bare and electrically conductive, and the front surface of each contact copper piece 93 is parallel to the bottom surface of the power supply box 9, and the back surface of the contact copper piece 93 is fixed at On one layer of insulating elastic rubber, the insulating elastic rubber is fixed in the power supply box 9, and the back surface of each contact copper piece 93 is only in communication with the positive DC 12V output circuit in the power supply box 9.
  • Each contact copper piece 93 has a positive area of 0.2 to 1 cm 2 ; the second set of copper pieces is a contact spring piece 104 which communicates with a VC 220 V circuit in the power supply box 9.
  • the two sets of contact copper sheets 93 and the bottom surface of the power supply box 9 are insulated from each other.
  • the bottom surface of the power supply box 9 is flat and smooth except for the positioning pins 94 and the conductive contact copper pieces 93 which are protruded by 0.5 to 3 mm, and the bottom surface of the power supply box 9 is provided. It is connected to the negative DC 12V output circuit and the ground in the power supply box 9, and the power supply box 9 is fixed to the partition 3 by the fastening of the power supply box 9 by fastening screws.
  • Another power transmission port of the power supply box is in the form of: the power input port and the power output port of the power box are combined into an integrated port on the bottom surface of the power box, and the integrated port is directly
  • the corresponding bare conductive circuits on the spacers are pressed and contacted one after another to form a contact copper strip group, and the contact copper strips in the contact copper strip group may have different circuit definitions and respectively
  • the corresponding circuits in the power box are connected.
  • the bottom surface of the power box is mounted in parallel to a corresponding circuit area mounted on the partition surface.
  • the power box 9 is mounted in parallel on the surface of the partition 3 in the chassis.
  • the largest side of the power box 9 is The bottom surface is made of a conductive metal material and is directly in contact with the surface of the separator 3.
  • the bottom of the power box 9 has an "output port 92".
  • a plurality of bare conductive metal domes 104 are arranged in the output port 92 in a flat and orderly manner.
  • the metal domes 104 are insulated from the bottom surface of the metal material of the power supply box 9, and the surface height of the metal domes 104 is protruded.
  • the surface of the bottom surface of the power supply box 9 is 0.5 to 3 mm.
  • the metal dome 104 in the "output port 92" is divided into two groups of larger areas and smaller areas.
  • the power box 9 has an "input port” into which the municipal alternating current or the matching direct current outside the chassis is inserted into the power box 9 by inserting a wire plug.
  • a part of the municipal alternating current is converted into a stable direct current output by the power box 9, wherein the direct current positive pole is connected with a group of metal shrapnel 104 having a larger area in the "output port 92", and the direct current negative pole/ground is connected to the bottom surface of the conductive metal of the power supply box 9.
  • the other part of the municipal alternating current is connected to a group of metal domes 104 of smaller area in the "output port 92".
  • a region of the partition 3 on which the power supply box 9 is mounted has a concave partition circuit 32 and a plurality of positioning holes 36, and a concave partition.
  • Circuit 32 has exposed conductive, smooth, flat circuit contacts.
  • the concave-shaped spacer circuit 32 on the partition 3 and the positioning hole 36 and the metal elastic piece 104 in the "output port 92" of the bottom surface of the power supply box 9 and the protruding positioning pin 94 are in the size specification, The alignment position and the circuit definition are perfectly matched.
  • the bottom surface of the power supply box 9 is opposed to the mounting area of the partition plate 3, and the positioning pin 94 on the bottom surface of the power supply box 9 is completely matched with the positioning hole 36 on the partition plate 3, and then inserted, and then screwed/expanded.
  • the power supply box 9 is fastened to the partition 3.
  • each set of conductive metal domes 104 in the "output port 92" at the bottom of the power box 9 and the corresponding concave-shaped diaphragm circuit 32 on the partition 3 are completely precisely matched and one-touch contact.
  • the concave area is filled with a matching insulating sheet, and the position can be at this position. Space to install additional hardware. Achieve multi-effect matching of the same location space in the chassis. At the same time, due to the extremely compact structure in the power box 9, and the direct connection with the diaphragm circuit 32 for transmission and power supply, no wires are used, which greatly reduces the space occupied by the power box 9 in the chassis.
  • the partition 3 also has two corresponding recessed diaphragm circuits 32 contact points. Wherein the municipal alternating current is connected to the "input port" of the first power supply box 9 by a wire plug, and a group of metal domes 104 having a smaller area in the bottom surface "output port 92" are transmitted to the partition plate 3 through the spacer circuit 32.
  • the second inner recessed diaphragm circuit 32 corresponds to the contact point, and the second power supply box 9 is properly mounted at the contact point of the second inner concave diaphragm circuit 32.
  • the municipal alternating current is input to the second power supply box 9 through the corresponding contact point of the second inner concave diaphragm circuit 32 to be converted into a desired stable direct current.
  • the converted DC positive pole and the "output port 92" in the second power box 9 A group of metal domes 104 having a larger inner area are in communication, and the DC positive poles are transmitted to the "power distribution module 10" via the contact points corresponding to the second inner concave diaphragm circuit 32 and the spacer circuit 32.
  • the converted DC negative electrode in the power supply box 9 is connected to the bottom surface of the conductive metal of the power supply box 9.
  • the bottom surface of the power supply box 9 is mounted in parallel on the partition 3, and the partition 3 in the chassis serves as the main conductor of the DC negative/ground bearing of the whole machine. Therefore, the metal bottom surface of the power supply box 9 and the surface of the partition plate 3 are in close contact with each other and are electrically conductive.
  • the DC negative electrode on the partition 3 can pass through the conductive metal bottom surface of the power supply box 9 to transmit a large area and a large current to the DC negative circuit in the power supply box 9.
  • the power supply box 9 has a problem of heat dissipation.
  • the power box 9 is generally in the shape of a flat hexahedron.
  • the maximum thickness of the power box 9 is ⁇ 31 mm, wherein the length ⁇ 150 mm, the width ⁇ 110 mm; or the length ⁇ 260 mm, the width ⁇ 120 mm, the input port of the power supply box 9 is the input DC 12V or VC 220V, the output port 92 of the power box 9 is output DC 12V or VC 220V.
  • the overall outline of the power box 9 is a flat square body, and the specific size and shape depend on the design requirements and the power level.
  • the heat dissipation mode of the power supply box 9 has a compact internal structure and a concentrated heat source.
  • the outer casing of the power box 9 is made of aluminum alloy.
  • the heat element in the power box 9 is directly attached to the aluminum alloy case, or the vacuum heat pipe is connected to the aluminum alloy case, and most of the heat is quickly transferred to the power box. 9 metal casings. Because the power box 9 is closely parallel to the partition 3 or a part of the inner wall of the metal casing of the chassis, the partition 3 or the metal casing of the chassis, together with the ventilation inside the chassis, achieves large-area efficient heat dissipation.
  • the side of the power distribution module 10 that is in contact with the back surface of the partition 3 is a bottom surface 102.
  • the bottom surface is provided with a "DC input port 102" and a “DC output port 103", a "DC input port 102” and a “DC output.
  • a plurality of contact copper pieces 93 protruding from the bottom surface by 0.5 to 3 mm are arranged neatly and orderly in the port 103".
  • the front faces of the contact copper strips 93 are smooth, bare and electrically conductive.
  • the inwardly facing back faces of the copper strips 93 are fixed on an elastic material member insulated from other circuits, and the elastic material members are fixed to the power distribution.
  • a plurality of raised positioning pins 94 are disposed on the bottom surface of the power distribution module 10 except for the "DC input port 102" and the “DC output port 103", and the area of the power distribution module 10 is mounted on the partition plate 3 respectively.
  • Electrical module The bottom surface of the "DC input port 102", the “DC output port 103" and the positioning pin 94 are completely correctly matched in the size, position, and circuit definition of the concave circuit contact point and the positioning hole 36.
  • the surface of the contact point of the concave circuit is barely conductive, but is insulated from the spacer 3, and the contact points of the concave circuit are respectively connected to the corresponding spacer circuit 32.
  • the power distribution module 10 also integrates a temperature control module, and the power distribution module 10 provides power supply and installation location space and/or circuit routing structure for the temperature control module.
  • the contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is in communication with the DC input circuit in the power distribution module 10; the contact in the "DC output port 103" on the bottom surface of the power distribution module 10
  • the copper sheets 93 are each in communication with a DC output supply of different output voltage values within the power distribution module 10.
  • the contact copper pieces 93 defined by different circuits are independent and insulated from each other, and the contact copper piece 93 is also insulated from the bottom surface of the power distribution module 10.
  • the contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is matched with the corresponding concave circuit contact point on the partition plate 3, and then the power supply box 9 is outputted to the above-mentioned partition circuit 32.
  • the DC is introduced into the power distribution module 10 and converted into DC power supplies of different voltage values required by the hardware devices, and the DC power supplies of the different voltage values are respectively contacted through the contacts in the "DC output port 103" on the bottom surface of the power distribution module 10.
  • the DC power supplies of the different voltage values are respectively transmitted to the corresponding partition circuit 32.
  • the power distribution module 10 is mounted adjacent to the back edge of the partition 3 of the front panel of the chassis, and the power distribution module 10 is integrated with one or more of the following interfaces.
  • One or more sockets, partition sockets 6/8pin discrete graphics auxiliary power supply slot 73, 24pin motherboard main power supply slot 45, turbo fan 201 power supply interface, 7+15pin SATA hard drive 203 interface, SATA Express hard drive 203 interface, SAS hard drive 203 interface, USB 3.0 19/20pin jack, USB 2.0 9pin jack, 7+6pin SATA optical drive interface.
  • the bottom surface of the power distribution module 10 is a flat metal conductive material except for the "DC input port 102" and the "DC output port 103", and the DC output negative/ground circuit in the power distribution module 10 is connected to the metal bottom surface of the power distribution module 10. through.
  • the power distribution module 10 is fastened to the surface of the inner partition 3 of the chassis by screws or expansion pins in parallel, and is in contact with the surface of the partition 3 for large-area contact.
  • one or more hardware-matched sockets or bulkhead sockets are integrated on the power distribution module 10, and are directly inserted into the matching socket/separator sockets of the power distribution module 10 through wires or the hardware self-contained interfaces. Connected.
  • the DC negative/ground of the hardware in communication with the socket/separator socket integrated on the power distribution module 10 is conducted to the partition 3 through the metal conductive bottom surface of the power distribution module 10.
  • the partition 3 is in contact with the conductive bottom surface of the power supply box 9, so that the bottom surface of the power distribution module 10 is connected to the bottom surface of the power supply box 9, that is, the DC negative/ground of the two.
  • the circuits are connected.
  • the power distribution module 10 is a DC power supply that converts the DC voltage of a single voltage value transmitted from the power box 9 into different voltage values required by each hardware, and the power distribution module 10 integrates one or A variety of socket/separator sockets that match the hardware interface. That is, the DC power supply of each voltage value converted and outputted in the power distribution module 10 is partially connected to the integrated socket/separator socket, and the corresponding power supply is transmitted to the matching by wire or hardware in-line.
  • the DC power supply of each part of the output voltage value is respectively turned on to the corresponding contact point through the "DC output port 103" on the bottom surface of the power distribution module 10 via the matching concave plate circuit 32 contact point on the partition plate 3, respectively.
  • the bulkhead receptacles that are in communication with the bulkhead circuitry 32 are each interfaced with an interface/slot of computer hardware to be powered.
  • the large-current stable transmission can be performed between the power distribution module 10 and the bulkhead circuit 32.
  • a plurality of hardware interface sockets and/or temperature control modules are integrated in the power distribution module 10, so that the structural design is more efficient and compact, and the integrated power distribution module 10 has a multifunctional integrated structure, which is convenient for the user to disassemble and assemble. use.
  • the intelligent main control system is provided in the mainframe of the computer, including a manual adjustment switch 18, a temperature control module, a fan 201, and a temperature probe 37.
  • the manual adjustment switch 18 is disposed on the casing of the casing for convenient operation by the user, and the temperature control module and the fan 201 are located.
  • the required position in the chassis, the temperature probe 37 is placed beside the CPU heatsink 6 or the graphics card heatsink, and is in the downwind duct of the radiator airflow, the temperature control module is simultaneously with the manual adjustment switch 18, the fan 201, the temperature probe 37 Connected.
  • the temperature probe 37 belongs to a thermistor, and the ambient temperature of the temperature probe 37 is high. Will change its own resistance value, the temperature control module connected with the temperature probe 37, according to the value fed back by the temperature probe 37, accurately output the corresponding supply voltage to the fan 201 in the voltage section, thereby realizing the real-time through the temperature probe 37 The purpose of automatically changing the speed of the fan 201 by monitoring the ambient temperature.
  • the main board support column 31 type temperature probe 37 because the desktop machine does not necessarily have a separate graphics card 7, and the temperature of the CPU can more objectively reflect the change of the temperature of the whole machine, so it is necessary to be near the CPU heat sink 6 Place a temperature probe 37.
  • a motherboard mounting hole 47 is defined between the PCI-E slot on the motherboard 4 and the memory module slot 44.
  • the mounting hole is correspondingly connected to the corresponding motherboard support post 31 of the partition 3 to mount the temperature probe 37.
  • This temperature probe 37 includes the following two forms:
  • the temperature probe 37 is generally columnar, the upper end is a temperature probe 37 element, the size can just pass through the corresponding motherboard mounting hole 47; the lower end is the pin of the temperature probe 37 component, fixed to the corresponding partition circuit 32 by welding And the temperature probe 37 is substantially perpendicular to the front surface of the partition plate 3, and the main board mounting hole 47 located between the PCI-E slot and the memory module slot 44 on the main board 4 is mapped on the front surface of the partition plate 3;
  • the main board mounting hole 47 between the main board 4PCI-E slot and the memory stick slot 44 is mapped to a position corresponding to the front surface of the partition 3, and has a socket of the temperature probe 37.
  • the temperature probe 37 socket is soldered and fixed on the corresponding partition circuit 32, and its height is not higher than the height of the other main board support columns 31.
  • the lower end of the rod-shaped temperature probe 37 is inserted into the motherboard mounting hole 47 between the PCI-E slot and the memory module slot 44 of the main board 4, and inserted into the temperature probe 37 socket on the partition 3, at this time, the temperature probe 37 It is in proper communication with the corresponding circuit on the partition 3, and the upper temperature probe 37 element is located above the front surface of the main board 4 for reading the temperature of the air flow at the position.
  • the computer chassis adopts the above intelligent temperature control system, which has excellent user operation and is very user-friendly. It is no longer necessary to consider whether the fan 201 has a PWM function, and does not need to enter the motherboard 4BISS to open and set, and the heat dissipation and noise can be perfectly dynamic. balance.
  • the air-cooling air duct is arranged in the computer case, and the air-dissipating air-cooling heat-dissipating method is adopted.
  • the turbo fan 201 for exhausting the air outside the chassis is installed at the tail portion 13 of the chassis, and the whole machine has two large mains.
  • the tuyere and two small auxiliary air inlets, the two large main air inlets are the CPU air inlet 22 and the video card air inlet 23, and the two small auxiliary air inlets are the box bottom air inlet 15 and the side top air inlet 14.
  • the CPU air inlet 22 is located on the right side panel of the chassis shell, and has a large opening near the CPU heat sink 6; the video card air inlet 23 is located at the front of the chassis shell, and has a position corresponding to the area of the chassis in which the discrete graphics card 7 is mounted. a large elongated opening; the bottom air inlet 15 is located on the bottom casing of the chassis, and an elongated opening is formed between the partition 3 in the chassis and the two intersecting lines extending perpendicularly from the main board 4 to the bottom plate of the chassis.
  • the side air inlet 14 has a small elongated opening at a position on the left side panel of the cabinet casing near the top portion 11 and the front portion of the cabinet.
  • the air-suction type air-dissipating air passage except for the above-mentioned four air inlet openings and the optical drive 204 into the dish opening 24, there is no other air inlet hole, and the fan 201 in the tail of the chassis continuously pulls the air in the box.
  • the air pressure inside the box is lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets to the box.
  • the air pressure on the surface of the object will rise, and the air pressure will increase to the heat state, which is not conducive to the surface between the physical object and the airflow.
  • Heat exchange if the exhaust type is adopted, the air pressure on the surface of the air passage slightly decreases, and the low-pressure air will more absorb the heat and expand its own volume, which is beneficial to the heat exchange between the surface of the object and the air of the air.
  • the cold air flowing in the air inlet 23 of the graphics card directly flows through the corresponding independent graphics card heat sink 8, the upper half of the back surface of the partition 3, and the inner top of the chassis in the back space of the partition 3.
  • a graphics card windshield 39 is disposed between the position of the video card inlet 23 and the turbo fan 201 on the back of the partition 3.
  • the card windshield 39 is simultaneously sealed and touched.
  • the cold air of the air inlet 23 of the graphics card is simply and efficiently drained through the heat sink of the independent graphics card 7 to absorb heat, and finally extracted by the turbo fan 201, and the air passage is not disturbed by the heat flow in other spaces in the chassis.
  • the turbo fan 201 Since the vent hole 38 is opened in the central portion of the partition 3, the turbo fan 201 is attached to the vent hole 38 on the back surface of the partition 3.
  • the cold air flowing in the inlet vent 15 of the tank flows through the lower half of the front surface of the partition 3 and the lower half of the back surface of the main plate 4.
  • the lower half of the back surface of the partition plate 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, a part of the heat generation is transmitted to the lower half of the partition plate 3, and the cold air flowing in from the air inlet 15 of the tank bottom is taken away by the cold air; The other part of the heat is mainly transferred to the tail and bottom of the metal casing of the chassis for heat dissipation; and a part of the heat is absorbed by the lower temperature heat flow remaining after the CPU inlet 22 flows as described above.
  • a side air inlet 14 is also added, and the inflowing cold air mainly absorbs the area and a small portion of the chassis in the back space of the partition 3.
  • the cold air flowing in the four air inlets exchanges heat with each radiator, the partition 3, the heating hardware, and the inner wall of the metal casing of the chassis to become an air heat flow, and is installed in a plurality of turbo fans at the upper half and the tail of the chassis. 201 is discharged outside the box.
  • the sealed design of the whole machine, together with the hardware arrangement in the chassis is scientific and concise, and the generated wind resistance is small.
  • the ultra-thin PC mainframe has a small volume. When the air is exhausted, the air pressure difference generated in the cabinet is more obvious than that of the large chassis. The airflow formed in the chassis is large and the wind speed is fast.
  • the air duct formed by the low pressure generated by the suction, together with the hardware arrangement is scientific, concise, and windy. The resistance is small, the air in the air duct flows in an orderly manner, and there is no phenomenon of returning hot air.
  • An air filter 25 is arranged on the four air inlet openings to filter dust entering the air in the box, so that the main box is kept clean and has good ventilation and heat dissipation performance for a long time.
  • a turbo fan 201 is mounted in the front space of the partition 3 and the back space of the partition 3,
  • the front space of the partition 3 has an I/O interface group of the main board 4 at a positional area on the west end of the main board 4, and a component on the main board 4 of the left side of the main board 4 remaining on the side of the main board I/O interface group 41.
  • the height is less than 18mm, so the space above the main board 4 is relatively wide, and the west end of the main board 4 is close to the outer casing of the chassis. Therefore, a turbo fan 201 is installed on the inner wall of the casing rear casing at the position of the main board 4, and the air outlet of the turbo fan 201 is connected to the opening 17 of the casing rear casing to discharge the airflow to the outside of the casing.
  • the turbo fan 201 installed in the idle position of the west end of the main board 4 utilizes the idle position for exhausting heat efficiently and efficiently, without additionally increasing the volume of the chassis, and the movable mounting structure does not affect the disassembly and assembly of the hardware at all. .
  • a vent hole 38 is formed in the partition plate 3, and one side of the turbo fan 201 is attached to the back surface of the partition plate 3 against the vent hole 38.
  • One side of the turbo fan 201 draws air in the gap between the partition plate 3 and the main plate 4 through the vent hole 38 in the partition plate 3; the other side of the turbo fan 201 extracts air in the space behind the partition plate 3.
  • the air outlet of the turbo fan 201 is connected to the opening of the rear casing of the chassis, and all the extracted air is discharged outside the casing;
  • the turbofan 201 mounted on the inner wall of the rear casing of the chassis contains the following two forms:
  • turbo fan 201 is fixed to the inner wall of the rear casing of the chassis by screws or mounting slots;
  • a guide rail is mounted on two frames perpendicular to the air outlet of the turbo fan 201, and an opening is provided in the position of the fan 201 installed in the rear casing of the chassis, and the shape and size of the opening are exactly the same as those of the turbo fan 201.
  • the cross section of the air outlet is matched.
  • a rail chute is vertically mounted on the inner wall of the casing rear casing, and the rail-equipped turbofan 201 is matched with the rail chute on the inner wall of the casing tail casing, and the turbo fan 201 is opened through the casing tail casing. The hole can be freely moved inside and outside the chassis.
  • the turbo fan 201 can be moved to the outside of the chassis, and the hardware in the standby box is disassembled and then This turbo fan 201 is moved back to the inner wall of the casing.
  • the present invention is not limited to the above specific embodiments.
  • the computer mainframe is customarily referred to as a computer mainframe in Chinese, and the main computer mainframe is also referred to as a computer chassis. Further developments made by those of ordinary skill in the art in accordance with the present invention fall within the scope of the present invention.

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Abstract

一种电脑主机中的隔板（3），该隔板（3）将电脑主机空间一分为二，隔板（3）上设有正面与背面，该隔板（3）正面和/或背面或隔板（3）内紧密贴合/内嵌有扁平形态的电路，构成隔板电路（32），隔板电路（32）中导体的厚度≤0.5mm，隔板（3）上设有与隔板电路（32）对应连通的隔板插座（34、35），包括主板（4）、硬盘（203）、电源盒（9）、独立显卡（7）、风扇（201）在内的电脑硬件通过隔板插座（34、35）相匹配对接后彼此正确连通，或直接将其接口贴触安装在隔板（3）上对应的裸露导电的电路接触点（33）上进行正确匹配、接触后导通。该技术方案适用于重新布局电脑硬件的超薄主机中，大大减小机箱厚度，使机箱体积小、重量轻、简洁美观，且各硬件间的走线集中、具有隐蔽效果，为设计超薄主机提供优势支持，而且拆装电脑硬件方便快捷。

Description

电脑主机中的隔板 技术领域
本发明涉及电脑硬件设备的技术领域，尤其是一种电脑主机中的隔板的技术。
背景技术
现有的传统台式电脑主机的主流为塔式主机，其总体体型为长方体。台式机的主机有卧式和立式之分，一般以立式最为常见。其中主机箱内所有的物理零部件一般称为电脑硬件，包括主板、硬盘、CPU、内存条、独立显卡、光驱和电源，以及各散热器。现有的塔式主机箱为非超薄机箱，体型大、重量重。
1)硬件排布与走线：目前传统台式主机箱内的硬件排布设计为，一个位置空间几乎只能安装使用一种电脑硬件，所以为了满足支持更多的硬件，主机箱内设置了很多各硬件的安装空间位置，当有些硬件安装位使用不到时，就只能空闲在那，极大的浪费了主机箱内的空间体积，使主机箱内的空间利用率很低。
传统台式机的主机箱内各硬件之间的数据或供电连接，绝大部分采用的是RVV导线，通过导线将相关联的各硬件之间连接起来。但由于传统主机箱内的布局和走线方式落后，加上各种硬件众多，所形成的连接导线也就纵横交错、复杂繁多，使用起来不仅用户需要具备一定的专业基础知识，而且严重影响了主机箱内部的美观，各种走线还大大占用了机箱内的空间体积。传统的主机箱内，由于各硬件排布存在不合理的原因，加上采用普通导线相连接，且硬件间的连接距离不是最短的，也无法做到最短程的连接，因为太短了，普通导线变得又粗又硬，所以非常不便于用户安装使用。
2)CPU散热器的结构及其安装：传统的CPU散热器是用4颗螺丝/膨胀卡销，通过主板上的CPU安装孔，刚性或接近刚性的材料、结构方式将CPU散热器固定在主板上。常常出现以下五种问题：第一，由于螺丝/膨胀卡销拧的过紧，散热器与主板间的受力过大，致使主板不同程度的变形弯曲。第二，有时由于这4颗螺丝紧固时各自受力程度不均衡，导致CPU芯片表面与散热器的导热底座间局部翘起，产生细微空隙，大大增加了CPU芯片与散热器导热底座之间的导热系数，阻碍了CPU芯片向散热器间的热传递。第三，传统的CPU散热器及配套的扣具、零件繁多，安装起来较繁琐，大多需要几分钟到十几分钟不等。第四，部分传统CPU散热器安装在主板上时，不能移动或者只能单向移动。致使有时出现CPU散热器与某些主板上元部件位置相冲突，而不能正常安装的弊端。第 五，大多数传统高端的CPU散热器为了达到更好的散热效果，只能一味的增加散热器的尺寸体型。这样使得大型CPU散热器对主机箱和主板的兼容性大大降低，用户购买的花费也明显增加。
另外，普通用户使用的CPU绝大部分TDP功耗都在100W以内，但考虑到顶级CPU和超频用户的苛刻需求，CPU散热器能承载的功耗要达到180W以上。因此对散热器的性能也提出了更高的要求。
3)独立显卡的安装及散热：传统台式主机箱内的独立显卡，如果是中低端显卡，一般是使用显卡原配的散热器进行散热。如果是大功率高端显卡，要么使用高昂、繁琐的水冷方案，要么重新安装更好的风冷散热器。但市面上大部分独立显卡风冷散热器要么具有一定的兼容性范围，要么配套零件多、安装过程繁琐。而且不具备一定专业知识的用户根本不知道应该选择什么样的散热器最合适。传统的台式主机箱，独立显卡在散热方面存在以下几点问题：
第一，独立显卡如果采用风冷，由于安装方式和尺寸规格的限制，散热器尺寸几乎不能超过显卡本身的尺寸范围。且其匹配的风扇还要占据散热器的一部分体积，所以散热器的实际散热面积有限。
第二，如果采用水冷，光其高昂的费用不说。与水冷配套的水箱、水泵、散热器、风扇、水管等都需要额外增加机箱的体积和重量。且安装繁琐，用户安装水冷时还需具备一定的专业动手能力。
第三，独立显卡是与机箱侧板进风口是相垂直的。如果采用风冷，由进风口流入的冷空气受到主板上的CPU散热风扇和显卡散热风扇的共同无序干扰，机箱外的冷空气不能完全、单向有序的流经独立显卡散热器中进行高效散热，因为机箱内不科学、严密的风道，使流入独立显卡、CPU散热器的冷空气中夹带着回流热空气，影响了散热器的热交换效果。
第四，独立显卡散热器是呈水平平行放置，非常不利于空气热流自然向上的升力。
传统的台式主机箱，独立显卡是直接垂直插在主板的显卡插槽内使用。由于主板和独立显卡在机箱内都属于大尺寸的硬件，两者相互垂直安装的方式占用的空间体积很大。但这种方式对硬件的兼容性很好。
4)散热风道：传统台式主机箱内的散热风道设计不科学、无序，几乎都存在回流热风的现象。且为了增加CPU或独立显卡散热的效果，一味的靠增加散热器尺寸体积来解决。并没有简单、有效的借助于机箱本身的金属外壳来传递、扩散一部分热源。
另外，风扇转速与其产生的噪音一直都是风冷散热的一大矛盾。传统台式机主机箱内的风扇转速通常有两种形式：一种是固定转速，一种是通过连接主板PWM插口进行温控转速。前者，不管机箱内温度高低始终都是一个转速，不科学；后者，风扇首先要具备PWM功能，然后要进主板BISS下进行开启、设置，用户需要具备一定的专业知识。而且风扇型号繁多，处于PWM控速模式下的风扇如果噪音过大或者风速偏小，用户几乎没有办法进行有效调节。
5)电源：传统台式主机箱内的电源盒体积较大，其功能是将输入的市政交流电直接转换成各硬件所需不同电压值的直流输出，使用众多RVV导线分别与各硬件对接，加上传统主机箱内的设计排布落后，致使主机内箱的各种导线密密麻麻、纵横交错，极大的占用浪费了主机箱内的空间体积和影响了主机的美观，还阻碍了用户使用的便捷性。
发明内容
为克服现有产品技术的缺陷，本发明目的是提供一种可以重新排布电脑硬件，使硬件间所需的连接走线集中成超薄电路且具有隐藏效果，能大大缩减主机体积和重量的电脑主机中的隔板，为设计超薄主机提供优势支持。
进一步的目的是安装电脑硬件精准、快捷。
本发明通过下述技术方案来实现：
一种电脑主机中的隔板，隔板上设有正面与背面，主机中还包括有主板、硬盘、电源盒、独立显卡、风扇等电脑硬件，所述隔板将电脑主机空间一分为二，所述隔板正面和/或背面或隔板内紧密贴合/内嵌有超薄扁平形态的电路，更加清楚的表述是所述隔板正面或背面紧密贴合有超薄扁平形态的电路，或者所述隔板正面或背面内嵌有超薄扁平形态的电路；或者所述隔板正面和背面均紧密贴合有超薄扁平形态的电路，或者所述隔板正面和背面均内嵌有超薄扁平形态的电路；或者所述隔板内有内嵌电路。电路中导体的厚度≤0.5mm。各电脑硬件间通过与隔板上超薄电路对应连通的隔板插座相匹配对接后彼此正确连通，或直接将硬件的特制接口贴触安装在隔板上对应的裸露导电的电路接触点上进行正确匹配、接触后导通。
上述主机中隔板上/内紧密贴合/内嵌的超薄扁平形态的电路，以下简称为“隔板电路”。这些通过隔板插座、导线与对应的隔板电路相连通和直接贴触安装在相匹配的裸露导电的隔板电路上的电脑硬件，这些硬件将平行或平行贴触安装在隔板的一面或双面上。
上述隔板电路与上述隔板间相互绝缘，扁平的导体电路表面高度不高于其周围隔板表面的高度。整个隔板电路表面有绝缘和耐磨层的紧密覆盖。
上述隔板为玻璃纤维/半玻璃纤维基印制电路内嵌隔板、金属基印制电路板、FPC软线排内嵌隔板、超薄绝缘铜片内嵌隔板或金属基导电涂层电路隔板；或者上述隔板为玻璃纤维/半玻璃纤维基印制电路内嵌隔板，将玻璃纤维/半玻璃纤维基PCB电路板制作成设计所需的布线电路和物理外形尺寸，隔板为铝合金或铜质的金属平板，在隔板上一面或双面设计的位置，加工出与上述PCB电路板形状和厚度相匹配的凹槽，将上述PCB电路板紧密贴覆在隔板上对应的凹槽内，使PCB电路板表面与其所在隔板表面处于同一平面高度。上述内嵌PCB电路板的隔板整面上有绝缘、耐磨层的紧密覆盖。
上述隔板与电脑主机的金属外壳或骨架是同一材质的且构成一体，通过模具将材料热熔或挤压后使隔板与电脑机箱的金属外壳或骨架一体成型而成；或者上述隔板和电脑主机的金属骨架或外壳是分离独立的，隔板与机箱金属骨架或外壳内壁之间焊接固定。
上述隔板插座直接焊接或贴触连接在对应的隔板电路上。隔板插座的硬件接口类型包括SATA 2.0数据接口、SATA 3.0数据接口、SATA Express硬盘接口、SAS硬盘接口、SATA 7+15pin数据+供电硬盘接口、SATA 7+6pin数据+供电光驱接口、主板的开机启动插针POWER SW、主板的重新启动插针RESET SW、USB 3.019/20pin插口、USB 2.0 9pin插口、主板音频插针HD AUDIO、独立显卡PCI‐E 16X插槽、主板主供电24pin插槽、主板辅助供电4/8pin插槽和独立显卡辅助供电6/8pin插槽,或者是上述硬件接口的任意组合。
上述隔板插座的底部有序排列着该插座对应的引脚，在隔板电路相应的安装位置上有焊接点，上述隔板插座底部的引脚直接焊接固定在对应的隔板电路位置上。或者上述隔板插座的底部有序排列着该插座对应的引脚，且这些引脚以裸露的导电金属弹片的形式存在，在隔板插座底部的所述弹片的周边设有凸起的定位销，在隔板上对应的安装位有呈内凹形构造的安装区域，内凹形区域中有序排布着裸露导电的电路接触点，在内凹形区域外周边的隔板上设有相应的定位孔，隔板插座通过螺丝/膨胀卡销紧固在隔板上对应的安装位后，隔板插座底部的导电金属弹片与隔板上对应的内凹形区域中的电路接触点相一一贴触导通，隔板插座底部凸起的定位销也与隔板上对应的安装位上的定位孔相一一插入匹配。
上述隔板的一面上分布、固定有若干个主板支撑柱(此面设为隔板的正面)， 支撑柱凸出于板面的高度为4～7mm，且上述主板支撑柱的分布位置与所对应支持的主板上的安装孔位相一一匹配，上述主板支撑柱为导电金属材质。
上述主板支撑柱内有垂直于隔板板面的内螺纹孔或与膨胀卡销相匹配的卡销孔，所述主板支撑柱将主板平行悬离于隔板正面上，且主板背面与隔板正面相对，通过螺丝或膨胀卡销将主板固定在隔板上的主板支撑柱中。
本申请披露了另外的一种技术方案：
一种电脑主机中的隔板，其特征在于：所述隔板将电脑主机空间一分为二，隔板上设有正面与背面,所述隔板基材为导电的金属平板，隔板上设有隔板插座，其设计为电脑主机整机的直流负极/接地传输的主要承载导体，包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件平行或平行贴触安装在隔板的一面或两面上，包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件通过隔板插座或直接与导电金属隔板相贴触将硬件中的直流负极电路/接地与金属隔板相导通。
本发明的有益效果是：
本发明可以重新布局电脑主机中大部分硬件，明显缩减电脑主机体积和重量，使硬件间所需的连接走线集中成超薄电路且具有隐藏效果，为设计超薄机箱提供有力支持。该超薄主机体积是传统全塔机箱的约1/6，满载硬件的情况下，超薄主机是传统全塔机箱重量的一半左右。此超薄主机能满足安装支持目前市场上几乎所有常规的主板型号(如：ATX、M‐ATX、ITX等)，能安装支持所有3.5寸硬盘、2.5寸硬盘，能安装支持所有全高、半高、超长、大功率的独立显卡，能安装支持14mm厚度以内的笔记本光驱。主机箱内的各硬件进行了重新排布、连接形式定义。箱内有一金属平板，各硬件有序的平行安装在该金属平板的两面上，用户可极为快捷、准确的拆装、组配所需的硬件；此主机箱有一相匹配的一体式“U”字形滑盖外壳(此滑盖外壳可为透明、半透明的材质)，为用户打开/封闭主机箱提供了极为简便的操作模式。整机还具备优异的散热性能和人性化的一键智能温控系统。此超薄主机内的CPU散热器、独立显卡散热器、电源盒和排风风扇均为与此超薄主机相匹配的定制尺寸型号。
本申请具体相关零部件的设置具有如下优点：
1)隔板上的主板支撑柱与传统机箱是一样的作用，但这里多一个用途。因为主板支撑柱为导电的，且与隔板相连接。因为此超薄机箱将金属隔板设计为整机的直流负极和接地的承载主导体。PC类主板的安装孔是与主板的输出直流负极及接地位相连通的，通过导电螺丝或卡销通过主板安装孔固定在隔板上的主板 支撑柱中，即实现了主板输出的部分直流负极/接地与金属隔板的直接连通，主板输出的部分直流负极/接地先经过主板支撑柱传输到金属隔板上，再由电源盒底部与金属隔板板面大面积贴触传回给电源盒。而传统PC主机箱内是采用大量导线与主板的供电插槽相连，将主板全部的直流负极输出直接传回给电源盒，将需要大量导线和占用较多空间体积。
2)隔板上隐蔽的内嵌/覆盖了超薄扁平电路，所述隔板可称为“隐形电路隔板”。电脑主机内通过重新定义排布，硬件兼容性极好(能支持市面上99％以上的常规硬件)。还巧妙的实现了同一位置空间可根据用户不同的需求安装不同的硬件，在提高了机箱内空间位置的利用率和自由搭配性时，将机箱体积缩减到最小：第一，隐形电路隔板高效解决了各硬件间的信号、供电传输，重新排布各硬件，大大缩小了机箱的体积；第二，为各硬件提供安装固定支撑的平台；第三，因为金属基质的隔板与机箱金属外壳相连，为平行贴触安装在隔板背面的硬件提供良好的导热、散热支持。
3)隔板插座是根据不同硬件的接口类型将机箱内的硬件与对应的隔板电路直接或间接地相对接；FFC线排的优点是超薄柔软、精准、能过较大电流，适用于隔板插座与硬件间较短距离的对接。隔板插座直接焊接或贴触连接在对应的隔板电路上。
第一，机箱内有些硬件可直接插入相匹配的隔板插座中使用。如3.5寸、2.5寸硬盘，因其为较常更替使用的硬件，这样可直插使用的设计，非常快捷人性化。那些无法直接插入隔板插座中使用的硬件，则采用最短线程的连接理念，用软线排将这些硬件与匹配的隔板插座相对接。也大大缩减了硬件间的走线，使整机内简洁、美观。
第二，活动式的隔板插座，一般用于同一隔板位置可安装不同硬件的设计。即在不增加机箱体积的情况下，增加机箱内能支持扩展的硬件数量和类型。
第三，由于活动式隔板插座在隔板电路上的安装位是一块内凹形区域，内凹区域中有裸露导线的电路接触点。当同一位置安装了其他硬件时，内凹区域中的裸露电路接触点的表面高度低于周围隔板表面的高度，所以不会因为触碰到其他硬件而产生短路。在不使用该内凹区域时，可用配套的绝缘贴片将该内凹区域填平，起到隔离绝缘和防尘的作用。
附图说明
图1‐8为本发明使用中的电脑机箱结构示意图；
图9‐12为电脑机箱之隔板使用中的结构示意图；
图13安装有滑盖的电脑机箱结构示意图；
图14滑盖结构示意图；
图15本发明隔板上装有显卡时的安装结构示意图；
图16本发明隔板上安装显卡的结构示意图；
图17独立显卡散热器的结构示意图；
图18电源盒的结构示意图；
图19配电模块的结构示意图；
图20活动式隔板插座的结构示意图；
图21为CPU散热器安装时的结构示意图；
图22为CPU散热器的安装固定装置的结构示意图。
下面是各附图中的标识说明：
1、主机箱外壳；11、主机箱外壳的顶部；12、主机箱外壳的底部；13、主机箱外壳的尾部；14、侧顶进风口；15、箱底进风口；16、主板I/O挡板隔板卡槽；17、排风开孔；18、手动调节开关；
2、滑盖；21、滑盖前面板(机箱外壳前部)；22、CPU进风口；23、显卡进风口；24、入碟开孔；25、防尘网；
3、隔板；31、主板支撑柱；32、隔板电路；33、内凹形接触点；34、固定式隔板插座；35、活动式隔板插座；36、定位孔；37、温度探头；38、通风孔；39、显卡风挡；
4、主板；41、主板I/O接口组；42、CPU芯片；43、PCI‐E/显卡插槽；44、内存条插槽；45、主板主供电插槽；46、主板辅助供电插槽；47、主板安装孔；
5、扣具；51、支撑柱，也称作扣具支撑柱；52、滑动杆；53、桥压杆；54、膨胀销钉；
6、CPU散热器；61、(CPU)导热底座；62、(CPU)真空热导管；63、(CPU)散热鳍片；64、CPU附加散热器；
7、独立显卡；70、独立显卡PCB板；71、独立显卡I/O接口组；72、GPU芯片；73、独立显卡辅助供电插槽；74、(独立显卡)金手指；
8、独立显卡散热器；81、(独立显卡散热器的)导热底座；82、(独立显卡散热器的)真空热导管；83、(独立显卡散热器的)散热鳍片；
9、电源盒；91、底面；92、输出端口；93、接触铜片；94、定位销；
10、配电模块；101、(配电模块的)底面；102、直流输入口；103、直流输出口；104、弹片；
201、风扇；202、2.5寸硬盘；203、硬盘；204、光驱；205、扩展插座；206、硅胶垫；208、主板I/O挡板。
具体实施方式
以下结合附图对本发明作进一步描述:
电脑主机在本申请的中文含义上来说，与电脑主机箱为一个意思，电脑主机箱简称电脑机箱。
如图1‐图14，一种电脑机箱，包括主机箱外壳1/骨架和电脑硬件，其中电脑硬件包括主板4、硬盘203/电源盒9以及相应的散热器，主机箱外壳1/骨架内设有隔板3，隔板3将主机箱外壳1/骨架所构成的空腔一分为二，主板4固定在隔板3的一个侧面上，该侧面为隔板3的正面。硬盘203/电源盒9设在隔板3的另一个侧面上，该侧面为隔板3的背面。主板4、硬盘203/电源盒9均与隔板3的侧面平行，所述隔板3正面或/和背面或隔板3内设有电路，在隔板3上设有用于电脑硬件进行电路连接的隔板插座。隔板3是金属材质制造时，称为金属隔板。
该电脑主机为立式超薄电脑主机，总体轮廓体型为扁平的方体，但局部的边角、平面有不同的角度或构造，体积是传统PC主机箱的约1/6，满载硬件的情况下，此超薄主机是传统PC主机箱重量的一半左右。同时，可以安装支持目前市场上几乎所有PC类的主板4型号(如：ATX、M‐ATX、ITX等)。隔板3上安装有光驱204，优先安装支持14mm厚度以内的笔记本光驱204。此超薄主机内的各硬件进行了重新排布、连接形式定义。箱内有一金属平板，各硬件有序的平行安装在该金属平板的两面上，用户可极为快捷、准确的拆装、组配所需的硬件；此超薄主机有一相匹配的一体式“U”字形滑盖2外壳(此滑盖2外壳可为透明、半透明的材质)，为用户打开/封闭此主机提供了极为简便的操作模式。隔板3的正面上还设置有主板支撑柱31(主板4安装其上)、隔板3隐形电路、隔板插座、CPU散热器6扣具5、CUP附加散热器、内壁扩展插座205、主板I/O挡板隔板卡槽16。
具体结构如下：
01)主板支撑柱31
隔板3的正面设有主板支撑柱31，主板4通过主板支撑柱31固定在隔板3面上。主板支撑柱31内有垂直于隔板3板面的内螺纹孔或与膨胀卡销相匹配的卡销孔，所述主板支撑柱31将主板4平行悬离于隔板3正面上，且主板4背面与隔板3正面相对，通过螺丝或膨胀卡销将主板4固定在隔板3上的主板支撑 柱31中。主板4与隔板3悬离，使得主板4背面电路板上凸出的针脚不会与隔板3板面相触而引发短路的可能性。
在隔板3的正面上设置若干个主板支撑柱31，凸出于隔板3板面的高度为4～7mm，且这些主板支撑柱31的分布位置与所对应支持的主板4的安装孔位相一一匹配。主板支撑柱31为导电金属材质，且与隔板3紧固、导电相连。
本申请文件中的主板支撑柱31不但具备传统机箱里主板支撑柱31的功能外，还因为此超薄PC主机箱将隔板3设计为整机直流负极/接地承载的主导体，而常规主板的安装孔是与主板4的输出直流负极及接地相连通的，导电螺丝或卡销通过主板安装孔47固定在隔板3上的主板支撑柱31中，即实现了主板4的输出直流负极/接地与隔板3的直接连通。
02)具有隐形电路的隔板3,
上述电路为扁平的导体电路且导体的最大厚度≤0.5mm，扁平的导体电路与隔板3间相互绝缘，扁平的导体电路表面高度不高于其周围隔板3表面的高度，除安装插座的区域外其他整个电路表面有绝缘和耐磨层的覆盖。隔板3的两面上都平行安装了许多硬件，将各硬件间相连接的大部分走线，采用上述非常扁平的导体电路覆盖于隔板3表面上或内嵌于隔板3中，进行密集排布、集中走线，高效解决了各硬件间的信号、供电传输，重新排布各硬件，大大缩小了机箱的体积。
隔板3为玻璃纤维/半玻璃纤维基印制电路内嵌隔板3、金属基印制电路板、FPC软线排内嵌隔板3、超薄绝缘铜片内嵌隔板3或金属基导电涂层电路隔板3。可为各硬件提供安装固定支撑的平台。
优选地，隔板3为玻璃纤维/半玻璃纤维基印制电路内嵌隔板3，其中玻璃纤维/半玻璃纤维为基板，制作成符合设计要求的电路布线和物理形状的玻璃纤维/半玻璃纤维基PCB电路板，隔板3为铝合金或铜材质的金属平板，在隔板3上一面或双面设计的位置，加工出与对应PCB电路板形状和尺寸厚度相对等的凹槽，将PCB电路板紧密贴覆在隔板3上对应的凹槽内，使PCB电路板表面与其所在隔板3表面处于同一平面高度。由于隔板3上的扁平导体电路与隔板3紧密贴合一体，除开此电路的焊接点、接触点之外，整个电路表面进行了绝缘层和耐磨层的覆盖处理，所以几乎看不到隔板3上的电路，固称为“隐形电路隔板3”。隐形电路隔板3上的扁平导体电路，以下简称为“隔板电路32”。内嵌PCB电路板的隔板3整面上进行绝缘、耐磨层的覆盖。
具体的操作过程为，在隔板3上加工出深0.1～1mm的凹槽，凹槽的位置、 形状、尺寸依走线的具体需求而定，再将超薄印刷集成PCB电路板填充至此凹槽中，隔板3凹槽与PCB电路板表面都进行绝缘涂成处理，通过粘合剂将PCB电路板无缝紧固在对应的隔板3凹槽内。紧固好后，PCB电路板表面高度基本与所在的隔板3板面高度一致，最后再在紧固好的，内嵌PCB电路板的隔板3整面上进行绝缘、耐磨的涂层，这样隔板3与PCB电路板表面上就合为一体，也几乎看不到里面的电路。
由于考虑到隔板3背面更需要导热散热，加上简化设计、工艺，统一将PCB电路板内嵌于隔板3的正面中。
优选地，隔板3为超薄绝缘铜片内嵌隔板3，即用蚀刻、CNC铣床加工或模具一体成型的工艺，将金属平板(隔板3)上需要走线的位置区域加工成所需的形状、尺寸的凹槽。用蚀刻或模具冲压剪切工艺再将厚度为0.05～0.5mm厚度的铜片制作成设计所需的各种走线，且这些铜质的走线密集排布后的最外轮廓规格与该金属平板(隔板3)上凹槽的形状、尺寸相匹配。将金属平板(隔板3)上的凹槽和加工后的超薄铜片走线，表面进行绝缘处理，最后通过粘合剂将超薄绝缘铜片走线紧密嵌入金属平板(隔板3)上所对应的凹槽位置内，且超薄铜片走线的表面高度不高于其周围金属平板(隔板3)的表面高度。此工艺方案适合在金属平板(隔板3)上设计排布过大电流的电路走线。
优选地，隔板3为FPC软线排内嵌隔板3，除了嵌入的电路材质为FPC软线排之外，其他内嵌入隔板3中的工艺与上述“玻璃纤维/半玻璃纤维基印制电路内嵌隔板3”基本一致。
优选地，隔板3为金属基导电涂层电路隔板3，即在金属表面覆盖有绝缘层，再在绝缘层上用液态/胶态/粉末的导电涂料涂画成所需的走线电路，再经风干或高温后固化，形成稳固的导电电路涂层，最后再在整个电路隔板3上进行绝缘、耐磨层的覆盖(连接隔板插座的局部区域除外)。此方案所用的涂料和工艺都比较偏贵。
隔板3与电脑机箱的金属外壳或骨架是同一材质的且构成一体，通过模具将材料热熔或挤压后一体成型而成。隔板3和电脑机箱的金属骨架或外壳也可以是分离独立的，隔板3与机箱金属骨架或外壳内壁之间焊接固定。因为隔板3与机箱金属外壳相连，为平行贴触安装在隔板3表面的硬件提供良好的导热、散热支持。上述“机箱的金属外壳”即图中“主机箱外壳1”。
具有金属隐形电路的隔板3与主机箱金属外壳或骨架固定相连的工艺方式为：一体式，即隔板3与主机箱金属外壳或骨架是同一材质的、一体的，用模具将 材料热熔或挤压后一体成形的。再在成型后的主机箱内的隔板3上进行工艺加工，使隔板3上/内排布有设计所需的超薄电路走线；回流焊，隔板3和机箱金属骨架或外壳是分离独立的，隔板3上/内已经先加工好了设计所需的超薄电路走线，之后将隔板3与机箱金属骨架或外壳内壁所要连接固定的部位，先涂抹好焊料，组合匹配好后，再放入回流设备中进行回流焊接。出来冷却后，隔板3就与机箱金属骨架或外壳相紧密固定了。
03)隔板插座
隔板插座直接焊接或贴触连接在对应的隔板3的电路上，隔板插座的硬件接口类型包括SATA 2.0数据接口、SATA 3.0数据接口、SATA Express硬盘203接口、SAS硬盘203接口、SATA 7+15pin数据+供电硬盘203接口、SATA 7+6pin数据+供电光驱204接口、主板4的开机启动插针POWER SW、主板4的重新启动插针RESET SW、USB 3.0 19/20pin插口、USB 2.0 9pin插口、主板4的音频插针HD AUDIO、独立显卡7的PCI‐E 16X插槽、主板4的主供电24pin插槽、主板4的辅助供电4/8pin插槽和独立显卡7的辅助供电6/8pin插槽,或者是上述硬件接口的任意组合。主机箱内的某些硬件可直接插入隔板插座中使用，有的则需通过FFC线排将硬件与对应的隔板插座相连接，所以，隔板插座为了与众硬件相匹配连接，具有不同的接口类型和形状尺寸。隔板插座根据不同硬件的接口类型将主机箱内的硬件与对应的隔板电路32相对接。FFC线排的优点是超薄柔软、精准、能过较大电流，适用于隔板插座与硬件间短距离的对接。
上述文中的“隔板插座”为下述“焊接式/固定式隔板插座”和“活动式隔板插座”的统称。
根据机箱内的排布和设计需求，隔板插座分为焊接式和活动式。焊接式，“隔板插座”的底部有序排列着该插座对应的针脚(引脚)，隔板电路32相应的安装位置上有焊接点，将“隔板插座”底部的针脚(引脚)直接焊接固定于对应的隔板电路32的焊接点位置上。焊接式隔板插座也称为固定式隔板插座34。
活动式，“隔板插座”的底部有序排列着该插座对应的针脚(引脚)，且这些针脚(引脚)以裸露的导电金属弹片104的形式存在，在“隔板插座”底部金属弹片104的周边有若干个定位销94。活动式隔板插座35一般用于同一隔板3位置可安装不同硬件的设计，即在不增加机箱体积的情况下，增加机箱内能支持扩展的硬件数量和类型。
隔板电路32上用于安装“活动式隔板插座35”的区域呈内凹形构造33，内凹区域中有序排布着裸露导电、平整的电路接触点，所述“电路接触点”为图 中的“内凹形接触点33”。在内凹区域外周边的隔板3上有若干个定位孔36，且这些定位孔36的大小、数量、孔距与与之匹配的“活动式隔板插座35”底部的定位销94完全一致。
当活动式隔板插座35的底部对向隔板电路32上的安装区域时，只有当此接口类型的活动式隔板插座35与隔板电路32上内凹区域中的电路接触点排布规格、电路定义、插座方向完全相匹配时，活动式隔板插座35底部的定位销94才能插入到该隔板电路32内凹区域边的定位孔36中，最后通过螺丝/膨胀卡销将活动式隔板插座35固定在隔板3上，此时“活动式隔板插座35”底部的导电金属弹片104与隔板电路32上内凹区域中的电路接触点完全、精准相一一贴触连通。由于活动式隔板插座35在隔板电路32上的安装位是一块内凹形区域，内凹区域中有裸露的电路接触点，当同一位置安装了其他硬件时，内凹区域中的裸露电路接触点的表面高度低于周围隔板3表面的高度，所以不会因为触碰到其他硬件而产生短路。在不使用该内凹区域时，可用配套的绝缘贴片将该内凹区域填平，起到隔离绝缘和防尘的作用。
简而言之，隔板插座的底部有序排列着该插座对应的引脚，隔板电路32相应的安装位置上有焊接点，所述隔板插座底部的引脚直接焊接固定于对应的隔板电路32位置上；或者隔板插座的底部有序排列着该插座对应的引脚，且这些引脚以裸露的导电金属弹片104的形式存在，在隔板插座底部的所述弹片104的周边设有定位销94，在隔板3上用于安装所述隔板插座的区域呈内凹形构造，内凹区域中有序排布着裸露导电、平整的电路接触点，在内凹区域外周边的隔板3上设有相应的定位孔36，隔板插座通过螺丝/膨胀卡销固定在隔板3上，隔板插座底部的导电金属弹片104与隔板3上内凹区域中的电路接触点一一精准贴触导通。
主机箱内有些硬件可直接插入“隔板插座”中使用，如3.5寸、2.5寸硬盘202，因其为较常更替使用的硬件，这样可直插使用的设计，非常快捷人性化。那些无法直接插入“隔板插座”中使用的硬件，则采用最短线程连接的理念，用软线排将这些硬件与匹配的“隔板插座”相对接，也大大缩减了硬件间的走线，使整机内简洁、美观。
04)主板4朝向
由上所述，主板4是背靠隔板3正面，平行固定在隔板3正面的主板支撑柱31上。因为主机箱为立式设计，一方面考虑到整机的重心要尽量下移，而主板4靠近CPU位的一端是明显偏重的，朝下放置可以使主机箱的整体重心下移， 使主机箱在立式的时候更加平稳；另一方面，主机箱为立式的，其内的空气热流是不断向上升腾的，汇聚在主机箱内空间上层，相对于上层气流，主机箱下层气流的温度要偏低，所以靠近CPU的主板4北端边朝下放置，更加有利于CPU散热器6在气流中的散热效果。
因此，将靠近CPU位的主板4北端边朝下(可垂直，也可向下的方向与垂直间的夹角≤5°)，主板4西端边(即主板I/O接口组41的一端)朝向机箱的尾部13，主板4背面对向隔板3正面，平行于隔板3固定在主板支撑柱31上。由于在主板4的北端边与西端边间的角边位置，有一个主板辅助供电插槽46，以就近走线连接的原则，在主板4北端边投影到隔板3正面上的区域，靠近此主板辅助供电插槽46的隔板3正面位置上有一隔板插座。此隔板插座的底部针脚(引脚)与隔板电路32中的输出+12V DC和直流负极(接地)分别有序连接，通过导线一头与主板4上的主板辅助供电插槽46插入连通，导线的另一端插入该隔板插座连通，使隔板3上对应的供电电路与主板4上的主板辅助供电插槽46相连通。
即，主板4是背靠隔板3正面，靠近CPU位的主板4北端边朝下，主板4西端边即主板I/O接口组41的一端朝向机箱的尾部，
在主板4北端边投影到隔板3正面上的区域，靠近主板4的辅助供电插槽的隔板3正面位置上有一隔板插座，所述隔板插座的底部针脚与隔板电路32连接，通过导线一头与主板4上的主板辅助供电插槽46插入连通，导线的另一端插入该隔板插座连通，使隔板3上对应的供电电路与主板4上的主板辅助供电插槽46相连通。
05)CPU的散热器以及CPU散热器的安装固定装置
该电脑CPU的散热器包括CPU附加散热器64和CPU散热器6，CPU散热器6通过一H型桥压扣具支架固定，亦即该CPU散热器的安装固定装置，H型桥压扣具支架包括两条滑动杆52，两条滑动杆52中间区段呈相互平行的状态，两条滑动杆52两端部都弯折，往外呈45°夹角，在两条滑动杆52两端部的弯折的区段上各有一个可在该区段上移动的支撑柱51，支撑柱51底端有一个膨胀卡头，此膨胀卡头大小、形状是与主板4上的CPU散热器6安装孔相匹配的。那么，两条滑动杆52弯折的两端共有4个可移动的支撑柱51，由于不同型号的主板4，其4个CPU散热器6安装孔之间的孔距也不同，所以滑动杆52两端的支撑柱51设计成可移动的，就能满足各种不同的CPU散热器6安装孔间的孔距需求，与之匹配安装固定。H型桥压扣具支架就是前述扣具5。支撑柱51也称为 扣具支撑柱。
在两条滑动杆52中间相平行的区段上设有一条可在两条滑动杆52的杆轴方向上自由移动的桥压杆53，所述桥压杆53中间区段呈内凹槽构造，其中所述两条滑动杆52为回弹性材质件或者桥压杆53为回弹性材质件。由于此扣具5中的滑动杆52、桥压杆53甚至导热底座背面的凸起结构为回弹特性材质，不会因为人为紧固时受力过大或不均衡而导致导热底座与CPU芯片42表面间接触的导热系数变化过大，也不易使主板4变形弯曲。所述两条滑动杆52和桥压杆53组合一起构成所述“H”型结构，故此CPU的扣具5称为“H型桥压扣具支架”。
CPU附加散热器64的一头是扁直的真空热导管蒸发端，另一头是焊接有(CPU)散热鳍片63的真空热导管冷凝端，CPU附加散热器64这两端之间的区段加工成波纹管状，大大提升了(CPU)真空热导管62的弯曲性，用户安装起来更加容易操作和适应不同类型的主板4。CPU附加散热器64的冷凝端的底部为平整的，通过螺丝或卡扣贴触固定在距离CPU最近的机箱金属外壳内壁上，从而将CPU导热底座61的部分热量传递到机箱金属外壳上和CPU附加散热器64冷凝端的散热鳍片上进行散热。
CPU散热器6为真空热导管式散热器，CPU散热器6的底部有一导热底座，安装在CPU芯片42之上。在CPU散热器6的导热底座边缘上，有一与导热底座上排布的真空热导管走向相垂直的沟槽，且此沟槽的形状大小刚好与CPU附加散热器64的蒸发端相匹配，CPU附加散热器64的蒸发端配合卡入导热底座边缘的沟槽内后，用盖板和螺丝紧固在导热底座边缘上。导热底座的正面是直接平行贴触在CPU芯片42表面上的。而导热底座的背面的大致中心位置有一凸起结构，桥压杆53中间区段的内凹滑轨槽能刚好扣住此凸起结构，桥压杆53放置于导热底座背面之上。由于扣具5中的桥压杆53通过导热底座背面中心位置的凸起结构，将扣具5紧固时产生的下压力集中作用于导热底座的中心区域，这样使导热底座与CPU芯片42间接触面的受力很均匀，使它们之间的导热系数稳定。
导热底座是通过桥压杆53扣住其背面的凸起结构紧贴在CPU芯片42之上的，而桥压杆53是活动固定在两条滑动杆52上，两条滑动杆52是通过活动式支撑柱51上的卡头分别卡入主板4上4个CPU散热器6安装孔内，最后将膨胀销钉54插入支撑住中的销孔中，从而将整个扣具5支架连同CPU散热器6一起紧固在主板4上。由于导热底座背面凸起结构可在桥压杆53内凹滑轨槽中移动，桥压杆53又能在滑动杆52上移动，所以整个CPU散热器6可在主板4平面中的 任意方向上小范围的平移，大大降低了因为CPU散热器6边缘与主板4上元配件位置相冲突而不能正常安装的几率。
CPU附加散热器64采用的是活动式安装方式，用户可根据需求自由选择是否安装，而不需要更换整个CPU散热器6，大大节省了用户的经济开支。主机箱虽然体积小，但巧妙的利用了机箱的金属外壳，将部分CPU热量快速传递到外壳上进行散热，大大增加了散热的有效面积。
由于扣具5支架多处采用活动式固定设计，几乎兼容所有常规主板型号，扣具5配件少、重量轻，拆装操作极其便捷，徒手10秒便能完成拆装。
并且，此超薄PC主机箱外壳的底部12中有一细长条形的进风开口，既增加了机箱底板周围的气流交换；又因为这一条长长的开口，极大的阻碍了隔板3正面空间内的机箱底板区域上的热量传递到隔板3背面空间的机箱底板区域和隔板3自身上，从而使贴触安装在隔板3正面空间内的机箱底板上的CPU附加散热器64传递过来的热量既能更加快速的被气流带走，又不会传递到机箱其他部位而影响其他硬件的散热。
06)内壁扩展插座205
其中电脑机箱为立式，主板4靠近CPU的一端即主板4北端边向下放置，主板4南端边向上，靠近主板4南端边的机箱外壳内壁是机箱的顶部内壁，在此内壁上垂直高于主板4正面15～45mm的长条形区域中，活动安装了一长条形的插座，构成机箱内壁扩展插座205，所述内壁扩展插座205上包含有三种接口，DC+5V、直流负极的供电接口、7+6pin SATA光驱204接口和7+15pin SATA硬盘接口。
内壁扩展插座205采用长条形PCB电路板集中走线，长条形PCB电路板紧密贴合机箱内壁，电路板部分延伸至隔板3正面的边缘，且长条形PCB电路板延伸部分上的电路与隔板3上对应的电路相一一对接，通过焊接连通固定。上述接口插座底部的引脚通过焊接固定或贴触活动固定在长条形PCB电路板上对应的电路上，其插座接口的朝向与隔板3面相平行。
考虑到光驱204这种电脑硬件，大部分用户使用频率很低，所以人性化的将“内壁扩展插座205”设计成活动安装式的，用户可根据自己的使用需求选择是否安装。
但笔记本光驱204或2.5寸硬盘202插入安装在内壁扩展插座205中时，笔记本光驱204或2.5寸硬盘202平行于主板4，且位于主板4南端边附近区域上空位置。考虑到实用性，笔记本光驱204的入碟口朝向主机箱的前面。巧妙地 高效利用了主板4南端边附近上空的空闲空间，由于笔记本光驱204和2.5寸硬盘202十分轻小，发热量很低，所以对整个机箱的重心和散热的影响几乎可以忽略。此外，由于主板4在南端边有很多插针、插槽及走线，影响美观，正好平行安装在主板4此位置上空的笔记本光驱204、2.5寸硬盘202，可以巧妙地遮挡住，使机箱整体排布更加美观。
07)主板I/O挡板隔板卡槽16
在主板4西端边上I/O接口组所在的主板4边缘区段投影到隔板3上的位置设有主板I/O挡板隔板卡槽16，所述卡槽为开有一条缝宽约1mm、缝深2～3mm的笔直凹槽/孔缝，开槽/开孔的总长尺寸≥主板I/O挡板208(主板4后挡板)的总长尺寸，在将主板4装入主机箱之前，先将主板I/O挡板208(主板4后挡板)的一长边卡入到该隔板3凹槽/孔缝中，再将整个主板I/O挡板208(主板4后挡板)卡入至机箱尾部的主板I/O挡板208(主板4后挡板)相匹配的开孔中固定。由于本主机箱采用的是极限超薄设计理念，为了将主板4在机箱中所需占用的高度空间降到最低，故将主板I/O挡板208(主板4后挡板)靠近主板4背面的一边卡入到隔板3的开槽中，且安装方式与传统机箱一样简捷。
隔板3背面的空间内安装的硬件包括包含散热器的独立显卡7、电源盒9、涡轮风扇201、硬盘203、配电模块10且都是平行贴触安装在隔板3上，由于平行贴触安装在隔板3背面的多种硬件对散热有一定的需求，所以隔板3背面除了与电源盒9、隔板插座、配电模块10安装相匹配的内凹形隔板电路32接触点之外，隔板3背面其他区域的表面是以平整、导热的金属平板呈现。具体结构如下：
08)独立显卡7
独立显卡7与隔板3背面相平行设置。本超薄电脑机箱能够安装支持所有全高、半高、超长、大功率的独立显卡7。所述独立显卡7上的I/O接口与主板4上的I/O接口朝向相同，独立显卡7上的I/O接口区域部位与主板4PCB板边沿部错开，主板4PCB板边沿为设置了I/O接口的PCB板边沿部，即主板4西端边沿部。上述“独立显卡7上的I/O接口”即为图中“独立显卡I/O接口组71”，上述“主板4上的I/O接口”即为图中“主板I/O接口组41”。
独立显卡7平行安装在主板4背面包括了以下2种形式：
①内散式：独立显卡7与主板4之间有一块平行的导热材质的隔板3，独立显卡7上装有散热器的一面与隔板3板面相对，且独立显卡7的PCB板面靠近电脑机箱的外壳侧面板，即图13中滑盖2的一侧面。所述“独立显卡7的PCB 板”即图中“独立显卡PCB板70”。独立显卡7上的I/O接口组71所处的PCB板的端边在I/O接口朝向的方向上要凸出于主板4上的I/O接口组所处的PCB板所在端边15～40mm的距离。主板4与独立显卡7的PCB板卡间采用相平行、近距离安置的方式，极大的减少了占用的空间体积。
具体讲，独立显卡7与主板4之间有一块金属平板存在，即金属平板的一面平行安装的是主板4，主板4背面对向金属平板，金属平板的另一面平行安装的是独立显卡7，独立显卡7上有GPU芯片72的一面对向金属平板，且独立显卡7是平行放置于主板4靠近南端边区域的背面。
由上所述，独立显卡7I/O接口与主板4I/O接口朝向一致，且在它们I/O接口朝向的方向上，独立显卡7I/O接口所在的PCB板边缘要凸出于主板4I/O接口所在的PCB板边缘15～40mm的距离，即将独立显卡7上的I/O接口区域部分平移到主板4西端边之外。且上述凸出于主板4西端边之外的独立显卡7I/O接口区域部分与主板4间是没有隔板3的。由于中高端独立显卡7的I/O接口大多是双层的，考虑到既要完全兼容所有显卡，又要将其占用的空间体积降至最小，故巧妙的将独立显卡7上的I/O接口区域部分平移到主板4西端边之外。加上独立显卡7I/O接口区域部分与主板4间没有隔板3的阻隔，这样不管独立显卡7的I/O接口是单层的还是双层的，都不影响其在机箱内的安装使用，达到了与传统机箱一样好的兼容性。独立显卡7通过转接卡或延长排线与主板4上对应的显卡插槽43相连通。
②外散式：独立显卡PCB板70上不能安装散热器的一面(背面)朝向主板4背面，主板4与独立显卡7间不一定有隔板3存在，独立显卡7I/O接口所在的PCB板边缘也不一定要凸出于主板4I/O接口所在的PCB板边缘。独立显卡7通过转接卡或延长排线与主板4上对应的显卡插槽相连通。主板4与独立显卡7间采用相平行、近距离安置的方式，极大的减少了占用的空间体积。这种方式最大的优点是不用改装独立显卡7的散热器和风扇201，使用独立显卡7原配的散热器和风扇201即可，且此方式兼容性很好。缺点是所需占用的机箱空间比“内散式”较大。
09)内散式独立显卡散热器8
独立显卡7上安装的散热器设有真空导热管82和导热底座81，真空导热管上有蒸发端与冷凝端，所述散热器上的所有真空热导管的蒸发端直接或间接与独立显卡7的GPU芯片72相贴触，部分或全部真空热导管的冷凝端与隔板3或机箱金属外壳内壁直接或间接的贴触。所述“机箱金属外壳”即图中“主机箱 外壳1”。
上述独立显卡散热器8整体为扁平状散热器，占用体积很小。其包括有相平行间隔排列的铝质或铜质散热鳍片83、2～8根所述真空热导管和1～2个所述导热底座。铝质或铜质散热鳍片组成扁平状散热器的主体部分，扁平状散热器平行安装在独立显卡7上或隔板3背面上，导热底座设在散热器的正面，散热器的背面的表面上排布着扁平的所述真空热导管的冷凝端，所述真空热导管的蒸发端与铜质或铝质的导热底座相紧密贴合。真空热导管的冷凝端通过模具挤压成横截面为半弧状或扁平状，紧密贴合在鳍片上，所述散热器背面上半弧/扁平的真空热导管冷凝端还平行贴触在隔板3背面上进行导热。
或上述扁平状散热器还包括排布着的真空热导管，每根真空热导管均含有蒸发端和冷凝端，所有真空热导管的蒸发端都有序地紧密贴合或内嵌于所述导热底座上，真空热导管的冷凝端通过模具挤压成横截面为“D”形状,即在所述真空热导管冷凝端形成扁平的一面，且此扁平的一面与所述散热器的背面相平行，而上述“D”形状的真空热导管冷凝端所形成的非扁平一面的部分与所述散热器的散热鳍片相结合固定在所述散热器的背面。当所述扁平状散热器的背面平行安装或贴触在隔板面上时，上述“D”形状的真空热导管冷凝端形成扁平的一面将平行贴触在隔板面上进行导热。
由于此散热器通过真空热导管的冷凝区段巧妙的与隔板3或机箱金属外壳内壁相紧密贴触，且显卡散热器风扇201不是安装在散热器上，没有额外占用散热器的体积，所以大大增加了独立显卡7的实际散热面积。并且，其散热利用的隔板3和机箱金属外壳本身就存在，也大大节省了材料成本和显卡散热器的质量。
散热器是固定在所述隔板3背面的独立显卡7安装位置区域，所述散热器设有一个或一个以上的导热底座，所述导热底座与真空热导管的蒸发端相紧密配合安装，真空热导管的冷凝端加工成扁平状，紧密的贴合在隔板3背面上或机箱金属外壳的内壁上，整齐相平行间隔排列的散热鳍片贴合在有扁平状真空热导管的隔板3背面或机箱金属外壳内壁上。
具体为：因为独立显卡7有GPU芯片72的一面平行对向隔板3，独立显卡7朝向隔板3的一面与隔板3间存在一段距离空间，此空间内安装有独立显卡散热器8。散热器中的散热鳍片为平行相间隔排列，且垂直于隔板3上的条状散热鳍片与地理垂直方向间呈一定的倾斜夹角。散热器的导热底座与独立显卡7的GPU芯片72表面相紧密贴触，真空热导管中的“蒸发区段”紧密内嵌于导热底 座中；真空热导管另一部分的“冷凝区段”分布于隔板3背面与散热鳍片间，且与隔板3、散热鳍片相紧密贴合。或分布于显卡就近的机箱金属外壳内壁上，与外壳内壁相紧密贴合。
即独立显卡7GPU芯片72中的热量，由紧贴其表面的导热底座传导至真空热导管的“蒸发区段”进行吸热，再由“蒸发区段”迅速传递至“冷凝区段”，通过与“冷凝区段”相紧密贴触的散热鳍片、隔板3或机箱金属外壳大面积的与空气进行热交换，达到散热冷却目的。
10)内散式独立显卡散热器8与独立显卡7间的固定方式
由于“内散式独立显卡散热器8”，以下简称“显卡散热器”。下述中的“显卡”即为图中“独立显卡7”，下文中的“机箱盖板/盖板”即为图中“滑盖2”，“独立显卡7的PCB板”即为图中“独立显卡PCB板70”。根据主机箱的设计和用户需求，分为2种形式：
活动式：显卡散热器先与独立显卡PCB板70正确安装固定后，再将显卡的金手指插口插入机箱背面空间的显卡插槽内相对固定，此时显卡散热器已经与隔板3背面平行相触。再在独立显卡7的GPU芯片72垂直投影至此显卡PCB板背面的中心位置粘贴/安装匹配的绝缘弹性硅胶垫206，当机箱盖板通过机箱内的滑槽推进箱体后，由于盖板与独立显卡7的PCB板间的间距小于弹性硅胶垫206的尺寸，弹性硅胶垫206受到挤压后产生回弹压力垂直作用于独立显卡PCB板70背面。又由于显卡散热器与独立显卡PCB板70间是固定的，所以这个产生的压力最后使显卡散热器紧贴于隔板3表面上。达到显卡散热器中的一部分热量高效传导至隔板3上进行散热。
固定式：显卡散热器先平行安装固定于机箱背面空间对应的隔板3位置上，此时散热器中的真空热导管82的“冷凝区段”与隔板3表面或机箱金属外壳内壁相紧密贴合。再在空置的独立显卡7GPU芯片72垂直投影至此显卡PCB板背面的中心位置粘贴/安装匹配的绝缘弹性硅胶垫206。
将空置的独立显卡7有GPU芯片72的一面对向显卡散热器，将独立显卡7上的金手指接口正确插入匹配的显卡插槽中相对固定，此时独立显卡7的GPU芯片72与显卡散热器的导热底座81相贴近。只需将机箱盖板通过机箱内的滑槽推进箱体后，由于盖板与独立显卡7的PCB板间的间距小于弹性硅胶垫206的尺寸，弹性硅胶垫206受到挤压后产生回弹压力垂直作用于独立显卡PCB板70背面。在独立显卡7上的GPU芯片72背面中心受到垂直向隔板3方向的作用压力后，GPU芯片72表面与显卡散热器导热底座81正面相平行、紧密贴合。
独立显卡7在与固定式显卡散热器安装的简易程度上达到了历史性的快捷，几乎一秒钟安装。由于GPU芯片72是其背部中心位置受力，GPU芯片72表面能平稳的贴合在显卡散热器的导热底座81表面上，使GPU芯片72与导热底座间81的作用力达到自然均衡，用户再也不用担心像安装传统散热器时因4个螺丝受力不均衡而影响其导热效果。
11)电源盒9
电源盒9为超薄贴触式电源盒9，其设有底面91、顶面和侧面，还设有电源的输入端口和电源的输出端口92，所述电源盒9的输出端口92设有直接与电脑机箱内的隔板3上所对应的电路受压后相导通的传输结构，所述电源盒9的输出端口92与电脑机箱内的隔板3上所对应的电路之间不存在第三方的插头、插座进行连接。
电源盒9与隔板3表面平行贴触的一面设为电源盒9的底面，电源盒9的底面上有两组凸起0.5～3mm的接触铜片93，第一组上有序排列着的独立的接触铜片93，其向外的正面都是非常平整光滑、裸露导电的，且每个接触铜片93正面与电源盒9底面是相平行的，接触铜片93的背面都是固定在一层绝缘弹性橡胶上，绝缘弹性橡胶又固定在电源盒9内，且每个接触铜片93背面只与电源盒9内的正极DC 12V输出电路相连通。每个接触铜片93的正面积在0.2～1c㎡；第二组铜片为接触弹片104，与电源盒9内VC 220V电路相连通。且这两组接触铜片93与电源盒9底面是相互绝缘的。所述隔板3背面上且在电源安置区域内有与之匹配的内凹压触点，内凹压触点中的裸露接触电路与电源底面凸起的接触铜片93组相一一对应，在电源安置区域内有若干个定位孔36，所述电源盒9底面除了凸起0.5～3mm的定位销94和导电接触铜片93之外，整面都是平整光滑的，且电源盒9底面与电源盒9内的负极DC 12V输出电路和接地相连通，所述电源盒9通过紧固螺丝使电源盒9平行贴触固定在隔板3上。
上述电源盒的另一种供电传输端口的存在形式：所述电源盒的电源输入端口和电源输出端口在所述电源盒的底面上合并为一个集成端口，所述集成端口内设有可直接与所述隔板上相对应的裸露导电的电路受压贴触后相一一匹配导通的接触铜片组，所述接触铜片组中的各接触铜片可具有不同的电路定义并分别与电源盒内对应的电路相连通。所述电源盒的底面平行贴触安装到所述隔板面上对应的电路区域。
以下为电源盒9底面输出端口92为金属弹片104的形式存在的方案。
电源盒9是平行贴触安装在机箱内隔板3面上。电源盒9面积最大的一面为 其底面，是导电金属材质，且直接与隔板3表面相平行贴触。电源盒9底面有一“输出端口92”。“输出端口92”内平整、有序排地列着一些裸露导电的金属弹片104，这些金属弹片104与电源盒9金属材质的底面是相互绝缘的，且金属弹片104的表面高度要凸出于电源盒9底面的表面0.5～3mm。
“输出端口92”内的金属弹片104分为面积较大和面积较小的两组。电源盒9上有一“输入端口”，通过插入导线插头，将机箱外的市政交流电或匹配的直流电输入电源盒9内。其中一部分市政交流电被电源盒9转换成稳定的直流输出，其中直流正极与“输出端口92”内面积较大的一组金属弹片104相连通，直流负极/接地与电源盒9的导电金属底面相连通；另一部分市政交流电被连接至“输出端口92”中面积较小的一组金属弹片104上。
在电源盒9底面有若干个凸出的定位销94，而隔板3上安装电源盒9的区域上有一个内凹形的隔板电路32和若干个定位孔36，内凹形的隔板电路32上有裸露导电、光滑平整的电路接触点。且隔板3上所述的内凹形隔板电路32接触点和定位孔36与电源盒9底面的“输出端口92”内的金属弹片104组和凸出的定位销94，在尺寸规格、排布位置、电路定义上相完全匹配。将电源盒9底面对向其在隔板3的安装区域上，通过电源盒9底面的定位销94完全与隔板3上的定位孔36相匹配、插入后，用螺丝/膨胀卡销将电源盒9紧固在隔板3上。此时电源盒9底部的“输出端口92”内的各组导电金属弹片104与隔板3上对应的内凹形的隔板电路32接触点相完全精准匹配、一一压触连通。由于电源盒9是通过隔板3上内凹形的隔板电路32接触点相连通，当此处不安装电源盒9时，用匹配的绝缘片填平该内凹区域后，可在此位置空间安装其他硬件。实现机箱内同一位置空间的多效搭配利用。同时，由于电源盒9内极其紧凑的结构，加上采用直接与隔板电路32相贴触传输供电，不用导线，大大缩减了电源盒9在机箱内所占用的空间体积。
电路定义：考虑到不同用户对主机箱的供电需求不同，机箱内设计了两处电源盒9的安装位置，即可同时安装两个电源盒9，并联使用。隔板3上也有两个对应的内凹形隔板电路32接触点。其中用导线插头将市政交流电连接至第一个电源盒9的“输入端口”，由其底面“输出端口92”内面积较小的一组金属弹片104通过隔板电路32传输至隔板3上第二个内凹形隔板电路32对应的接触点上，而第二个电源盒9是正确安装在第二个内凹形隔板电路32接触点上的。即市政交流电通过第二个内凹形隔板电路32对应的接触点输入到第二个电源盒9中转换成所需稳定的直流。第二个电源盒9中转换后的直流正极与“输出端口92” 内面积较大的一组金属弹片104相连通，经过第二个内凹形隔板电路32对应的接触点和隔板电路32将直流正极传输给“配电模块10”。
电源盒9内转换后的直流负极是接通至电源盒9的导电金属底面上。由上所知，电源盒9的底面是平行贴触安装在隔板3上，且机箱内的隔板3作为整机直流负极/接地承载的主导体。故电源盒9的金属底面与隔板3板面间是紧密贴合、导电的。隔板3上的直流负极通过电源盒9的导电金属底面可实现大面积、大电流的传回至电源盒9内的直流负极电路中。之所以设计成将电源盒9的直流输出直接贴触传递到隔板3上对应的隔板电路32中，是因为其贴触面积大、贴合紧密，可实现大电流的稳定通过。而且，电源盒9通过与隔板3或机箱金属外壳内壁的大面积、紧密贴触，不仅仅将电源盒9内的直流负极/接地顺利连通至隔板3上，还巧妙、高效的解决了电源盒9散热的问题。
电源盒9整体形状为扁平的六面体，电源盒9的最大厚度≤31mm，其中长≤150mm，宽≤110mm；或者长≤260mm，宽≤120mm，所述电源盒9的电源的输入端口为输入DC 12V或VC 220V，电源盒9的输出端口92为输出DC 12V或VC 220V。
电源盒9整体轮廓为扁平的方体，具体尺寸、外形视设计需求和功率大小而定。
电源盒9的散热方式：此超薄电源盒9由于内部结构紧凑，热源较集中。电源盒9外壳大面积采用铝合金材质，通过将电源盒9内的发热元件直接贴触到铝合金外壳上，或用真空热导管连接至铝合金外壳上，将大部分热量快速传递至电源盒9金属外壳上。因为电源盒9是紧密平行贴触在隔板3上或一部分贴触在机箱金属外壳的内壁上，通过隔板3或机箱金属外壳，加上机箱内的通风实现大面积高效散热。
12)配电模块10
配电模块10贴触在隔板3背面上的那一面设为底面102，所述底面上设有“直流输入口102”和“直流输出口103”，“直流输入口102”和“直流输出口103”内都整齐有序排布着一些凸出于所述底面0.5～3mm高的接触铜片93。这些接触铜片93向外的正面都是光滑平整、裸露导电的，这些接触铜片93向内的背面固定在与其他电路相绝缘的弹性材质件上，所述弹性材质件又固定在配电模块10内。
配电模块10底面上除“直流输入口102”和“直流输出口103”之外设有若干个凸起的定位销94，在隔板3上安装配电模块10的区域内分别有与配电模块 10底面的“直流输入口102”、“直流输出口103”和定位销94在尺寸规格、位置方向、电路定义上相完全正确匹配的内凹形电路接触点和定位孔36。内凹形电路接触点表面是裸露导电的，但与隔板3间是相绝缘的，内凹形电路接触点分别与其对应的隔板电路32相连通。
配电模块10中还整合了温控模块，配电模块10为温控模块提供供电和安装位置空间和/或电路走线结构。
结构电路定义：配电模块10底面的“直流输入口102”内的接触铜片93与配电模块10内的直流输入电路相连通；配电模块10底面的“直流输出口103”内的接触铜片93分别与配电模块10内的不同输出电压值的直流输出供电相连通。且不同电路定义的接触铜片93之间是相互独立和绝缘的，接触铜片93与配电模块10底面也是相绝缘的。
配电模块10底面的“直流输入口102”内的接触铜片93通过与隔板3上对应的内凹形电路接触点相匹配对接后，将电源盒9输出到上述隔板电路32中的直流导入到配电模块10中再转换成各硬件设备所需的不同电压值的直流供电，再将上述不同电压值的直流供电经配电模块10底面的“直流输出口103”内的各接触铜片93通过与隔板3上对应的内凹形电路接触点相匹配对接后，将上述不同电压值的直流供电分别传输至对应的隔板电路32中。
在隔板3背面的中间区段，靠近机箱外壳前面板的隔板3背面边缘位置上安装有配电模块10，且所述配电模块10上整合了与以下一种或多种类接口相匹配的一个或多个插座、隔板插座：6/8pin独立显卡辅助供电插槽73、24pin主板主供电插槽45、涡轮风扇201供电接口、7+15pin SATA硬盘203接口、SATA Express硬盘203接口、SAS硬盘203接口、USB 3.0 19/20pin插口、USB 2.0 9pin插口、7+6pin SATA光驱接口。
配电模块10的底面除“直流输入口102”和“直流输出口103”之外为平整的金属导电材质，配电模块10内的直流输出负极/接地电路与配电模块10的金属底面相连通。配电模块10通过螺丝或膨胀卡销平行贴触紧固在机箱内隔板3面上，与隔板3表面间进行大面积接触导通。加上上述配电模块10上还整合了一种或多种硬件相匹配的插座或隔板插座，通过导线或者将硬件自带接口直接插入配电模块10上相匹配的插座/隔板插座中连通。因此这些与配电模块10上整合的插座/隔板插座相连通的硬件的直流负极/接地通过配电模块10的金属导电底面导通至隔板3上。由上所述可知，隔板3又因与电源盒9导电底面相贴触，所以最终配电模块10底面与电源盒9底面相连通，即两者的直流负极/接地 电路是相连通的。
由上述所知，因为配电模块10是将电源盒9传送过来的单一电压值的直流电再次转换成各硬件所需的不同电压值的直流供电，加上配电模块10上整合了一种或多种与硬件接口相匹配的插座/隔板插座。即配电模块10中转换输出的各电压值的直流供电，一部分分别与这些所述整合的插座/隔板插座相对应连通，再通过导线或硬件直插的形式将对应的供电传输给匹配的硬件中；另一部分输出的各电压值的直流供电，通过配电模块10底面的“直流输出口103”经隔板3上相匹配的内凹形隔板电路32接触点分别导通至对应的隔板电路32中，与所述隔板电路32相对应连通的隔板插座再分别与所需供电的电脑硬件的接口/插槽相对接。
由于配电模块10底面使用了与电源盒9底面结构原理相同的大面积压触式导电传输构造，使得配电模块10与隔板电路32间可进行大电流的稳定传输。且配电模块10中还整合了多种硬件接口插座和/或温控模块，使其结构设计更加高效紧凑，使整合后的配电模块10具有多功能的一体式，便于用户的拆装和使用。
13)智能温控系统
电脑主机箱内设有智能温控系统，包括手动调节开关18、温控模块、风扇201、温度探头37，手动调节开关18安置于机箱外壳上，便于用户操作使用，温控模块、风扇201位于机箱内所需的位置，温度探头37放置在接近CPU散热器6或显卡散热器的旁边，且处于散热器气流的下风风道中，温控模块同时与手动调节开关18、风扇201、温度探头37相连接。首先手动调节开关18的档位就已经限制了温控模块输出给风扇201电压的最高数值和最低数值区段；其次温度探头37属于一种热敏电阻，温度探头37所处的环境温度高低将会改变其自身的电阻值，与温度探头37相连接的温控模块，根据温度探头37反馈的数值，在电压区段内精确的给风扇201输出相应的供电电压，从而达到通过温度探头37实时监控环境温度而自动改变风扇201转速的目的。
主板支撑柱31式温度探头37，由于台式机不一定都有独立显卡7，而且相比之下CPU的温度更能客观的反应出整机温度的变化情况，所以有必要在CPU散热器6附近安置一个温度探头37。
在主板4上的PCI‐E插槽与内存条插槽44间有个主板安装孔47，此安装孔相应的在隔板3上对应的那个主板支撑柱31上连接安装有一所述温度探头37，此温度探头37包括以下2种形式：
①固定式，温度探头37整体呈柱状，上端是温度探头37元件，大小能刚好穿过对应的主板安装孔47；下端是此温度探头37元件的针脚，通过焊接固定在对应的隔板电路32上，且温度探头37整体垂直于隔板3正面上，位于主板4上PCI‐E插槽与内存条插槽44间的主板安装孔47在隔板3正面上相映射对应的位置；
②活动式，在主板4PCI‐E插槽与内存条插槽44间的主板安装孔47映射对应在隔板3正面的位置上，有一温度探头37的插座。此温度探头37插座焊接固定在对应的隔板电路32上，且其高度不高于其他主板支撑柱31的高度，当主板4正确安装在机箱内隔板3上后，有一杆状的温度探头37，上端为温度探头37元件，下端为连接插头。将该杆状温度探头37的下端穿过主板4上PCI‐E插槽与内存条插槽44间的主板安装孔47，插入到隔板3上的温度探头37插座中，此时温度探头37与隔板3上对应的电路相正确连通，其上端的温度探头37元件处于主板4正面之上，用于读取该位置的气流温度。
电脑机箱采用上述智能温控系统，可拥有极好用户操作性，非常人性化，再也不用考虑风扇201是否具有PWM功能，也不用进入主板4BISS下开启、设置，并且散热和噪音可以得到完美动态平衡。
14)散热风道
电脑机箱内设有吸风式散热风道，散热方式采用排风式风冷散热，其中用于向机箱外排风的涡轮风扇201安装于机箱的尾部13，整机有两个大的主进风口和两个小的辅助进风口，两个大的主进风口为CPU进风口22、显卡进风口23，两个小的辅助进风口为箱底进风口15、侧顶进风口14。
CPU进风口22位于机箱外壳右侧板，靠近CPU散热器6的位置上有一较大开孔；显卡进风口23位于机箱外壳前部，与机箱内安装独立显卡7的区域相对应的位置上有一较大的长条形开孔；箱底进风口15位于机箱底部外壳上，在机箱内的隔板3与主板4垂直延伸到机箱底板上的2条相交线之间开有一段细长的开孔；侧顶进风口14位于机箱外壳左侧板靠近机箱顶部11和前部的位置上有一较小的长条形开孔。
吸风式散热风道中整个机箱除上述4处进风开孔和光驱204入碟开孔24之外，再无其他进风孔洞，机箱尾部内的风扇201不停的将箱内的空气抽向箱体外，导致箱体内的气压低于箱体外的大气压，迫使箱体外的空气通过各进风口流向箱体内。通常，吹风形式所产生的快速气流遇到实物时，实物表面的气压会上升，气压升高空气反而会趋于放热状态，不利于实物表面与气流空气间的 热交换；而如果采用抽风式，风道中实物表面的气压略微下降，低气压空气会更加趋于吸热状态而膨胀自身体积，有利于实物表面与气流空气间的热交换。
CPU进风口22流入的冷风流经对应的CPU散热器6，吸收其热量后冷风变成了热流。由于主机箱为立式，CPU散热器6在下半部，涡轮风扇201在上半部。温度较高的热流由于其自然升力和涡轮风扇201的吸力，流向机箱顶部，温度较低的部分热流受隔板3背面涡轮风扇201的吸力，经隔板3边缘与滑盖前面板21内壁间的间隙流向至隔板3背面的下半部空间内。由于隔板3背面的下半部分是平行贴触安装的电源盒9或硬盘203，故流入此处温度较低的热流，可以吸收带走电源盒9、硬盘203一部分的发热量。
显卡进风口23流入的冷风直接流经对应的独立显卡散热器8、隔板3背面的上半部分及隔板3背面空间中的机箱内顶。在隔板3背面的中间位置，即独立显卡7安装区域的下方，从显卡进风口23位置至隔板3背面的涡轮风扇201之间设置了一块显卡风挡39，此显卡风挡39同时密封贴触隔板3背面和滑盖2内壁。简单高效的将显卡进风口23的冷风全部引流经过独立显卡7的散热器进行吸热，最后被涡轮风扇201抽出箱体外，而此风道中途不受机箱内其他空间内的热流干扰。
由于在隔板3中部区域上开有通风孔38，且正对此通风孔38在隔板3背面上紧贴着安装有涡轮风扇201。箱底进风口15流入的冷风，流经隔板3正面的下半部和主板4背面下半部。由于隔板3背面的下半部分是平行贴触安装的电源盒9或硬盘203，所以其发热量的一部分传递到了隔板3下半部分，被箱底进风口15流入的冷风吸热带走；另一部分热量主要传递至机箱金属外壳的尾部和底部进行散热；还有一部分热量被上述所说的CPU进风口22流经后剩下的部分温度较低的热流所吸收带走。
由于考虑到大功率独立显卡7发热量很大，且显卡进风口23风量有限，还增加一个侧顶进风口14，其流入的冷风主要吸收机箱内顶在隔板3背面空间的区域和小部分隔板3背面上端区域的热量。所述四种进风口流入的冷风，与各散热器、隔板3、发热硬件、部分机箱金属外壳内壁进行热交换后变成空气热流，被安装于机箱上半部、尾部的若干个涡轮风扇201排出箱体外。
除了几个进风口之外，整机采用的密封式设计，加上机箱内的各硬件排布科学、简洁，所产生的风阻较小。此外超薄PC主机箱的体积小，采用抽风形式时，其箱体内所产生的气压差要比大机箱更加明显，机箱内所形成的风道流量大、风速快。而且，吸风产生的低压所形成的风道，加上硬件排布科学、简洁，风 阻小，风道中的空气有序流动，不会产生回流热风的现象。
上述四个进风开孔上都活动安装有防尘网25，用以过滤进入箱内空气中的灰尘，使主机箱内保持清洁和长久的良好通风、散热性能。
15)涡轮风扇201
隔板3正面空间和隔板3背面空间内都安装有涡轮风扇201，
隔板3正面空间，在主板4西端边有一段位置区域上是主板4的I/O接口组，而在主板I/O接口组41旁边余下的主板4西端边部分，其主板4上的元件高度都在18mm以内，所以其主板4上空的空间比较空阔，且主板4西端边是靠近机箱尾部外壳的。故在主板4此位置上空的机箱尾部外壳内壁上安装有涡轮风扇201，涡轮风扇201的出风口与机箱尾部外壳的开孔17相连，将气流排向箱体外。安装在主板4西端边空闲位置上的涡轮风扇201，巧妙、高效地利用了该空闲位置进行排风散热，没有额外增加机箱的体积，且活动式的安装结构也完全不影响硬件的拆装使用。
在隔板3上开有通风孔38，涡轮风扇201的一面紧贴着此通风孔38安装在隔板3背面上。此涡轮风扇201的一面透过隔板3上的通风孔38抽取隔板3与主板4间间隙中的空气；涡轮风扇201的另一面抽取隔板3背面空间内的空气。此涡轮风扇201的出风口与机箱尾部外壳的开孔相连，将所有抽取的空气排出箱体之外；
安装在机箱尾部外壳内壁上的涡轮风扇201，包含以下2种形式存在：
①固定式，即涡轮风扇201通过螺丝或安装卡槽固定于机箱尾部外壳的内壁上；
②活动式，与涡轮风扇201出风口相垂直的两条边框上安装有导轨，在机箱尾部外壳安装风扇201位置上有开孔，且此开孔的形状、尺寸都刚好与涡轮风扇201所在的出风口横截面相匹配。有一导轨滑槽正好垂直正对此开孔安装在机箱尾部外壳的内壁上，带有导轨的涡轮风扇201与机箱尾部外壳内壁上的导轨滑槽相匹配，涡轮风扇201通过机箱尾部外壳上的开孔可自由在机箱体内外移动，当安装的此涡轮风扇201阻碍到机箱内硬件的拆装时，可将此涡轮风扇201移动到机箱体外,待机箱内的硬件拆装好了后，再将此涡轮风扇201移回至机箱体内的内壁上。
本发明不局限于上述具体实施方式，在上述介绍中电脑主机箱，在中文中习惯上是指电脑主机，电脑主机箱也简称电脑机箱。本领域的普通技术人员根据本发明做出的进一步拓展均落入本发明的保护范围。

Claims (11)

  1. 一种电脑主机中的隔板，其特征在于：所述隔板将电脑主机箱外壳所构成的空腔或骨架所构成的空腔一分为二，隔板上设有正面与背面,
    所述隔板正面或背面紧密贴合有电路，或者所述隔板正面或背面内嵌有电路；或者所述隔板正面和背面均紧密贴合有电路，或者所述隔板正面和背面均内嵌有电路；或者所述隔板内有内嵌电路；所述电路构成隔板电路，隔板电路与所述隔板之间相互绝缘。
  2. 根据权利要求1所述电脑主机中的隔板，其特征在于：所述隔板电路为扁平的导体电路，隔板电路中导体的厚度≤0.5mm，
    所述隔板上设有与隔板电路对应连通的隔板插座，包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件通过隔板插座相匹配对接后彼此正确连通，或直接将包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件的接口贴触安装在隔板上对应的裸露导电的电路接触点上进行正确匹配、接触后导通。
  3. 根据权利要求1所述电脑主机中的隔板，其特征在于：包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件平行或平行贴触安装在隔板的正面或背面，或隔板的正面与隔板的背面上。
  4. 根据权利要求1所述电脑主机中的隔板，其特征在于：所述隔板电路表面高度不高于其周围隔板表面的高度，整个隔板电路表面有绝缘和耐磨层进行紧密覆盖，所述隔板为玻璃纤维/半玻璃纤维基印制电路内嵌隔板、金属基印制电路板、FPC软线排内嵌隔板、超薄绝缘铜片内嵌隔板或金属基导电涂层电路隔板。
  5. 根据权利要求1所述电脑主机中的隔板，其特征在于：所述隔板电路为玻璃纤维/半玻璃纤维基印制的PCB电路板，将该PCB电路板制作成设计所需的布线电路和物理外形尺寸；所述隔板为铝合金或铜质的金属平板，在隔板的正面或背面设计的位置，或隔板的正面与隔板的背面设计的位置，加工出与所述PCB电路板形状和厚度相匹配的凹槽，将所述PCB电路板紧密贴覆在隔板上对应的凹槽内，使PCB电路板表面与其所在隔板表面处于同一平面高度，内嵌有PCB电路板的隔板整面上有绝缘、耐磨层的紧密覆盖。
  6. 根据权利要求1所述电脑主机中的隔板，其特征在于：所述隔板与电脑主机的金属外壳或骨架是同一材质的且构成一体，通过模具将材料热熔或挤压后使 隔板与电脑主机的金属外壳或骨架一体成型而成；或者所述隔板和电脑主机的金属骨架或外壳是分离独立的，隔板与主机金属骨架或外壳内壁之间焊接固定。
  7. 根据权利要求2所述电脑主机中的隔板，其特征在于：所述隔板插座直接焊接或贴触连接在对应的隔板电路上，隔板插座的硬件接口类型包括7pin SATA 2.0数据接口、7pin SATA 3.0数据接口、SATA Express硬盘接口、SAS硬盘接口、SATA 7+15pin数据+供电硬盘接口、SATA 7+6pin数据+供电光驱接口、主板的开机启动插针POWER SW、主板的重新启动插针RESET SW、USB 3.0 19/20pin插口、USB 2.0 9pin插口、主板音频插针HD AUDIO、独立显卡PCI-E 16X插槽、主板主供电24pin插槽、主板辅助供电4/8pin插槽和独立显卡辅助供电6/8pin插槽,或者是上述硬件接口的任意组合，
    所述隔板插座的底部有序排列着该插座对应的引脚，在隔板电路相应的安装位置上有焊接点，所述隔板插座底部的引脚直接焊接固定在对应的隔板电路位置上；或者所述隔板插座的底部有序排列着该插座对应的引脚，且这些引脚以裸露的导电金属弹片的形式存在。
  8. 根据权利要求7所述电脑主机中的隔板，其特征在于：在隔板插座底部的所述导电金属弹片的周边设有凸起的定位销，在隔板上对应的安装位有呈内凹形构造的安装区域，内凹形区域中有序排布着裸露导电的电路接触点，在内凹形区域外周边的隔板上设有相应的定位孔，隔板插座通过螺丝/膨胀卡销紧固在隔板上对应的安装位后，隔板插座底部的导电金属弹片与隔板上对应的内凹形区域中的电路接触点相一一贴触导通，隔板插座底部凸起的定位销也与隔板上对应的安装位上的定位孔相一一插入匹配。
  9. 根据权利要求1所述电脑主机中的隔板，其特征在于：所述隔板的正面上分布、固定有若干个主板支撑柱，支撑柱凸出于板面的高度为4～7mm，且所述主板支撑柱的分布位置与所对应支持的主板上的安装孔位相一一匹配，所述主板支撑柱为导电金属材质。
  10. 根据权利要求9所述电脑主机中的隔板，其特征在于：所述主板支撑柱内有垂直于隔板板面的内螺纹孔或与膨胀卡销相匹配的卡销孔，所述主板支撑柱将主板平行悬离于隔板正面上，且主板背面与隔板正面相对，通过螺丝或膨胀卡销将主板固定在隔板上的主板支撑柱中。
  11. 一种电脑主机中的隔板，其特征在于：所述隔板将电脑主机箱外壳所构成的空腔或骨架所构成的空腔一分为二，隔板上设有正面与背面,所述隔板上设有隔板插座且设计为电脑主机整机的直流负极或接地传输的主要承载导体；
    所述隔板正面或背面紧密贴合有电路，或者所述隔板正面或背面内嵌有电路；或者所述隔板正面和背面均紧密贴合有电路，或者所述隔板正面和背面均内嵌有电路；或者所述隔板内进行内嵌有电路；所述电路构成隔板电路，隔板电路与所述隔板之间相互绝缘；
    包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件平行或平行贴触安装在隔板的正面或背面，或隔板的正面与隔板的背面；或者包括主板、硬盘、电源盒、独立显卡、风扇在内的电脑硬件通过隔板插座安装在隔板的正面或背面，或隔板的正面与隔板的背面。
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