WO2017202245A1

WO2017202245A1 - Multi-position processing apparatus and multi-position processing method for silicon boule

Info

Publication number: WO2017202245A1
Application number: PCT/CN2017/085048
Authority: WO
Inventors: 卢建伟
Original assignee: 上海日进机床有限公司
Priority date: 2016-05-23
Filing date: 2017-05-19
Publication date: 2017-11-30

Abstract

A multi-position processing apparatus for a silicon boule. The apparatus comprising: a machine base (1) provided with a silicon boule processing platform; a silicon boule loading and unloading device (2) for loading and unloading a silicon boule at a pre-treatment area of the silicon boule processing platform; a first processing device (3) for performing a first processing operation on the silicon boule at a first processing area of the silicon boule processing platform; a second processing device (4) for performing a second processing operation on the silicon boule at a second processing area of the silicon boule processing platform; and a silicon boule transfer device (5) for transferring the silicon boule between the pre-treatment area, the first processing area, and the second processing area. The multi-position processing apparatus combines a plurality of processing devices, allowing the apparatus to automatically perform multiple processing tasks. The invention thereby reduces labor costs, increases production efficiency, and improves processing quality. The invention further provides a multi-position processing method for a silicon boule.

Description

Silicon rod multi-station processing machine and silicon rod multi-station processing method

Technical field

The application relates to the technical field of silicon workpiece processing, in particular to a silicon rod multi-station processing machine and a silicon rod multi-station processing method.

Background technique

At present, with the emphasis and opening up of green renewable energy utilization, the field of photovoltaic solar power is getting more and more attention and development. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are fabricated on high quality silicon wafers which are cut and subsequently processed by a multi-wire saw after pulling or casting a silicon ingot.

The production process of the existing silicon wafer is exemplified by a single crystal silicon product. Generally, the approximate working process may include: first cutting off the original long silicon rod by using a silicon rod cutting machine to form a plurality of short silicon rods; After that, a silicon rod opener is used to form a single crystal silicon rod after the cut short silicon rod is opened, and then the single crystal silicon rod is subjected to rounding, grinding, etc., so that the surface of the single crystal silicon rod is made. The shaping achieves the corresponding flatness and dimensional tolerance requirements; after subsequent slicing of the single crystal silicon rod by the microtome, a single crystal silicon wafer is obtained. Taking a polysilicon product as an example, generally, the approximate working process may include: first performing a square processing of a primary silicon ingot (large-sized silicon ingot) using a silicon ingot opening machine to form a secondary silicon ingot (small size silicon ingot) After the opening is completed, the secondary ingot is cut by a silicon ingot cutting machine to form a polycrystalline silicon rod; then the polycrystalline silicon rod is chamfered, barreled, etc., so that the surface of the polycrystalline silicon rod is shaped to a corresponding level. Degree and dimensional tolerance requirements; subsequent use of the slicer to slice the polycrystalline silicon rod to obtain a polycrystalline silicon wafer.

However, in the general case, in the related art, the operations required for each process operation (such as grinding, chamfering, barreling, spheronization, etc.) are independently arranged, and the corresponding processing devices are dispersed in different production units or production. In different production areas of the workshop or production workshop, the conversion of workpieces performing different process operations needs to be handled and adjusted, and pre-treatment work may be required before each operation is performed. Thus, the process is complicated, the efficiency is low, and the silicon is easily affected. The quality of the bar processing operation requires more manpower or transfer equipment, and the safety hazard is large. In addition, there are many flow links between the operation equipments in each process, which increases the risk of workpiece damage during the workpiece transfer process, and is prone to non-productive factors. The resulting unqualified, reduced product qualification rate and unreasonable loss caused by existing processing methods are major improvement issues faced by various companies.

Application content

In view of the above various related technologies, the purpose of the present application is to disclose a silicon rod multi-station processing machine and a silicon rod multi-station processing method for solving the inefficiency between the various processes existing in the related art. The problem of complicated transfer of silicon rods and poor processing performance of silicon rods.

To achieve the above and other objects, the present application discloses, in one aspect, a silicon rod multi-station processing machine, including: a base, a silicon rod processing platform; a silicon rod loading and unloading device disposed in a pretreatment zone of the silicon rod processing platform for loading a silicon rod to be processed into a pretreatment location of the silicon rod processing platform and processing the processed The silicon rod is unloaded from the pretreatment location of the silicon rod processing platform; the first processing device is disposed in the first processing location of the silicon rod processing platform for performing the first processing operation on the silicon rod; the second processing The device is disposed in a second processing location of the silicon bar processing platform for performing a second processing operation on the silicon rod after the first processing operation by the first processing device; the silicon rod switching device is rotated and disposed at the The silicon rod processing platform is configured to convert a silicon rod loaded by the silicon rod loading and unloading device between a pretreatment position on the silicon rod processing platform, a first processing position, and a second processing position.

The silicon rod multi-station processing machine of the present application integrates a plurality of processing devices, and the silicon rod loading and unloading device can use the silicon rod loading and unloading device to load and unload the silicon rod quickly, smoothly and without damage, and the silicon rod can be used to process the silicon rod in each processing device. The process is transferred in an orderly and seamless manner and automated to realize the multiple process operations of the silicon rod processing. The plurality of processing devices can simultaneously perform corresponding processing operations on the corresponding silicon rods, thereby improving production efficiency and quality of product processing operations.

In some embodiments, the silicon rod loading and unloading device comprises: a silicon rod loading and unloading location, a silicon rod carrying platform for carrying the silicon rod to be placed upright; a reversing carrier for reversing motion; and a silicon rod a clamping device disposed on the first mounting surface of the reversing carrier; wherein, by driving the reversing carrier for reversing movement, the silicon rod clamp of the reversing carrier is in the loading and unloading position of the silicon rod The pretreatment zone is switched between transfers to transfer the silicon rod.

In some embodiments, the silicon rod clamp comprises: a clamp mounting member disposed on the commutating carrier; at least two silicon rod clamping members disposed along a distance of the clamp mounting member; The silicon rod clamping member comprises: a clamping arm mounting seat disposed on the clamp mounting member; at least two clamping arms disposed on the clamping arm mounting seat; and a clamping arm driving mechanism for driving the at least The two clamp arms act as opening and closing.

In some embodiments, at least one of the at least two silicon rod holders is provided with a guide drive mechanism for driving it to move along the clamp mount to adjust the The spacing of at least two of the silicon rod holders is described.

In some embodiments, the silicon rod handling device further includes a height detector disposed on the commutation carrier for detecting a height of the silicon rod.

In some embodiments, the silicon rod multi-station processing machine further includes a flatness detector disposed on the second mounting surface of the reversing carrier for planar flatness detection of the silicon rod.

In some embodiments, the flatness detector includes: a contact detecting structure; a detector shifting mechanism; a detecting controller connected to the contact detecting structure and the detector shifting mechanism for controlling The detector shifting mechanism drives the contact detecting structure to shift and controls the contact detecting structure to sequentially detect the relative distances of the detecting points on the surface to be tested in the silicon rod.

In some embodiments, the silicon rod switching device comprises: a disc-shaped or a circular conveying body; a silicon rod positioning machine The utility model is disposed on the conveying body for positioning the silicon rod, and a switching driving mechanism for driving the conveying body to rotate to drive the silicon rod switching position of the silicon rod positioning mechanism.

In some embodiments, the silicon rod positioning mechanism comprises: a rotating carrier disposed on the disc-shaped or circular conveying body for carrying the silicon rod; a rotary pressing device, a relative setting Above the rotating stage, for pressing the silicon rod; lifting driving device for driving the rotating pressing device to perform lifting movement in a vertical direction; and rotating driving device for driving the rotating pressure The device is tightened and drives the rotary pressing device to perform a rotary motion.

In some embodiments, the first processing device includes: a first frame; at least one pair of first abrasive tools disposed oppositely on the first frame for facing the first processing location The silicon rod on the silicon rod switching device performs the first processing operation.

In some embodiments, the first grinding tool comprises: a first spindle; at least one first grinding wheel disposed at a working end of the first spindle; the first grinding wheel has a first size particle of a first abrasive grain .

In some embodiments, the second processing device includes: a second frame; at least one pair of second abrasive tools disposed oppositely on the second frame for facing the second processing location The silicon rod on the silicon rod switching device performs a second processing operation.

In some embodiments, the second grinding tool comprises: a second main shaft; at least one second grinding wheel disposed at a working end of the second main shaft; and the second grinding wheel has a second coarse particle of a second granularity .

In certain embodiments, the silicon rod multi-station processing machine further includes a guard door for isolating the pretreatment location from the first processing zone and the second processing zone.

In some embodiments, the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform are distributed at 120°, and the rotation angle of the silicon bar switching device is ± 240°.

In some embodiments, the silicon rod multi-station processing machine further includes a third processing device disposed at a third processing location of the silicon rod processing platform; a pretreatment location on the silicon rod processing platform, The first processing zone, the second machining zone, and the third machining zone are distributed at a 90° relationship between the two adjacent portions, and the rotation angle of the silicon bar switching device ranges from ±270°.

In some embodiments, the silicon rod switching device has a range of rotation angles of ±360° or the silicon rod switching device employs a one-way infinite rotation.

The present application, in another aspect, discloses a silicon rod multi-station processing method, comprising the steps of: loading a first silicon rod to be processed into a pretreatment location of a silicon rod processing platform by a silicon rod handling device; Pre-treating the first silicon rod at the pre-processing location; rotating the silicon rod switching device by a first predetermined angle to convert the pre-processed first silicon rod from the pre-processing location to the first processing location; Performing a first processing operation on the first silicon rod in the first processing location, at this stage, causing the silicon rod loading and unloading device to load the second silicon rod to be processed in the pretreatment position and performing pretreatment; and rotating the silicon rod switching device a second preset angle for converting the first silicon bar that completes the first processing operation from the first processing location to the second processing location and converting the pre-processed second silicon gate from the pre-processing location to the first processing location; Second processing device for the second plus The first silicon rod on the work area performs the second processing operation. At this stage, the first processing device performs the first processing operation on the second silicon rod on the first processing position and the first processing unit of the silicon rod loading and unloading device The three silicon rods are loaded in the pretreatment zone and pretreated.

The silicon rod multi-station processing method of the present application can utilize the silicon rod loading and unloading device to load and unload the silicon rod quickly, smoothly and without damage, and the silicon rod switching device can order the silicon rod between the processing devices without any order. The seam is transferred and automated to realize multiple process operations of the silicon rod processing, and multiple processing devices can simultaneously perform corresponding processing operations on the corresponding silicon rods, thereby improving production efficiency and quality of product processing operations.

In some embodiments, the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform have a 120° distribution between the two; in accordance with the pretreatment zone, the first processing zone And the sequence of the second processing zone is defined as the forward direction, the first predetermined angle for rotating the silicon rod switching device is 120° in the forward direction; and the silicon rod switching device is rotated to the second predetermined angle to the positive direction Rotate 120°.

In some embodiments, the silicon rod multi-station processing method further comprises: rotating the silicon rod switching device by a third predetermined angle to convert the first silicon rod that completes the second processing operation from the second processing location to the pre-processing Processing the location and the second silicon rod that will complete the first processing operation is converted from the first processing location to the second processing location and the third silicon rod that completes the pre-processing is converted from the pre-processing location to the first processing location; The device unloads the first silicon rod on the pretreatment location and loads the fourth silicon rod to be processed into the pretreatment location and pretreats the fourth silicon rod located at the pretreatment location, at this stage, The second processing device performs a second processing operation on the second silicon rod on the second processing location and causes the first processing device to perform a first processing operation on the third silicon rod on the first processing location.

In some embodiments, the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform have a 120° distribution between the two; in accordance with the pretreatment zone, the first processing zone And the direction of the sequence of the second processing location is defined as the forward direction, the first predetermined angle for rotating the silicon rod switching device is 120° in the forward direction; the silicon rod switching device is rotated second The preset angle is 120° in the forward direction; the third predetermined angle of rotation of the silicon rod switching device is 120° in the forward direction or 240° in the reverse direction.

DRAWINGS

FIG. 1 is a schematic perspective view showing the structure of a silicon rod multi-station processing machine in a certain viewing angle according to an embodiment of the present application.

2 is a top plan view of a silicon rod multi-station processing machine in an embodiment of the present application.

3 is a side view showing a silicon rod multi-station processing machine in an embodiment of the present application.

4 is a schematic view showing the structure of a silicon rod holding member in a silicon rod multi-station processing machine of the present application in an embodiment.

FIG. 5 is a schematic view showing the structure of a silicon rod holding member in a silicon rod multi-station processing machine of the present application in another embodiment.

Figure 6 is a rear elevational view of the silicon rod clamp in the silicon rod multi-station processing machine of the present application.

FIG. 7 is a schematic flow chart showing an embodiment of a silicon rod multi-station processing method of the present application in an embodiment.

FIG. 8 is a schematic flow chart showing another embodiment of the silicon rod multi-station processing method of the present application.

Fig. 9 is a view showing a state in which a silicon rod is placed upright on a silicon rod carrier.

Fig. 10 is a view showing a state in which a silicon rod is held by a silicon rod holder.

Figure 11 is a schematic view showing a state in which a silicon rod is placed in a pretreatment position by a reversing carrier.

Figure 12 is a schematic view showing the state in which the height detector detects the height of the silicon rod on the loading and unloading platform.

13 and 14 are views showing a state in which the flatness detector detects the flatness of the silicon rod.

Figure 15 is a schematic view showing the operation of correcting a single crystal silicon rod.

Figure 16 is a schematic view showing the operation of correcting the polycrystalline silicon rod.

Fig. 17 is a view showing a state in which the first silicon bar is subjected to the first processing operation and the second silicon bar is loaded.

Fig. 18 is a view showing a state change of a single crystal silicon rod in a dicing operation.

Fig. 19 is a view showing a state change of a single crystal silicon rod in a rough grinding operation.

Figure 20 is a schematic view showing the state change of the polycrystalline silicon rod in the rough grinding operation.

Fig. 21 is a view showing a state in which the silicon rod multi-station processing machine of the present application simultaneously processes three silicon rods.

Fig. 22 is a view showing the state of a single crystal silicon rod in a spheronization process.

Figure 23 is a view showing the state of a single crystal silicon rod in a refining operation.

Figure 24 is a view showing the state of the polycrystalline silicon rod in the chamfering operation.

Figure 25 is a view showing the state of the polycrystalline silicon rod in the refining operation.

Fig. 26 is a view showing a state in which the silicon bar is discharged to complete the processing operation.

Fig. 27 is a view showing the state of the three-station processing operation of the silicon rod multi-station processing machine of the present application.

FIG. 28 is a schematic view showing the state of the silicon rod multi-station processing machine of the present application in a four-station processing operation.

detailed description

The embodiments of the present application are described below by specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application by the contents disclosed in the present specification. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention.

It should be noted that the structures, the proportions, the sizes, and the like of the drawings in the present specification are only used to cooperate with the content disclosed in the specification for understanding and reading by those skilled in the art, and are not intended to limit the present application. The qualifications that can be implemented are not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should be continued without affecting the effects and objectives of the application. The scope of the technical content disclosed in the present application can be covered Inside. In the meantime, the terms "upper", "lower", "left", "right", "intermediate" and "one" as used in this specification are also for convenience of description, and are not intended to limit the present. The scope of the application can be implemented, and the change or adjustment of the relative relationship is considered to be within the scope of the application.

The inventors of the present application have found that in the related processing technology for the silicon rod, the processing devices such as grinding, chamfering, and barreling are dispersed and independently arranged, and the conversion of the silicon rods for performing different process operations is required. Pre-treatment before handling and processing has problems such as complicated processes and low efficiency.

In view of this, the present application proposes a multi-station processing machine for silicon rods and a multi-station processing method for silicon rods. Through equipment modification, a plurality of processing devices are assembled in one device, and the silicon rods are fast, stable and non-damaged. The conversion between the various processing areas can automatically realize multiple processing operations of the silicon rod processing and can simultaneously perform corresponding processing operations on the corresponding silicon rods, seamlessly connecting the various processing operations, saving labor costs and improving production efficiency. Improve the quality of silicon rod processing operations.

Referring to FIG. 1 to FIG. 3 , FIG. 1 is a schematic structural view of a silicon rod multi-station processing machine according to an embodiment of the present invention. FIG. 1 is a perspective view of a silicon rod multi-station processing machine according to an embodiment of the present application. FIG. 2 is a top view of a silicon rod multi-station processing machine in an embodiment of the present application, and FIG. 3 is a side view of the silicon rod multi-station processing machine in the embodiment of the present application. In one embodiment, the silicon rod multi-station processing machine of the present application is used for processing a silicon rod, where the silicon rod is a rectangular-shaped silicon rod, which may be a single crystal silicon rod or a polycrystalline silicon rod. , should all fall within the scope of protection of this application.

Taking a single crystal silicon rod as an example, the forming process of the single crystal silicon rod may include: first cutting off the original long silicon rod by using a silicon rod cutting machine to form a plurality of short silicon rods; after the truncation is completed, using the silicon rod to open the square The machine performs a square operation on the short silicon rod after the truncation to form a single crystal silicon rod having a rectangular cross section. For a specific implementation manner of using a silicon rod cutting machine to cut off the original long silicon rod to form a plurality of short silicon rods, reference may be made to patent publications such as CN105856445A, CN105946127A, and CN105196433A, using a silicon rod square machine to cut off. For a specific implementation of forming a single-crystal silicon rod having a rectangular cross section after the short silicon rod is opened, reference can be made to the patent publications such as CN105818285A. However, the forming process of the single crystal silicon rod is not limited to the foregoing technology. In an alternative example, the forming process of the single crystal silicon rod may further include: first performing the opening operation of the original long silicon rod by using a full silicon rod square machine A long single crystal silicon rod having a rectangular cross section is formed; after the opening is completed, the long single crystal silicon rod after the opening is cut off by a silicon rod cutting machine to form a short crystal silicon rod. For the specific implementation of the above-described long silicon rod in the above-mentioned long silicon rod to form a rectangular-shaped long single crystal silicon rod, reference may be made to a patent publication such as CN106003443A.

Taking a polycrystalline silicon rod as an example, the forming process of the polycrystalline silicon rod may include: first performing a square processing of a primary silicon ingot or a silicon square body (large size silicon ingot) using a silicon ingot squarer to form a secondary silicon ingot (small size silicon ingot) Ingot); after the opening is completed, the secondary ingot is cut by a silicon ingot cutting machine to form a polycrystalline silicon rod. Wherein, a specific implementation manner of forming a secondary silicon ingot (large-sized silicon ingot) by using a silicon ingot squarer to form a secondary silicon ingot (small-sized silicon ingot) can be referred to, for example, as Patent publications such as CN102172997A, CN105216128A, CN105690582A, etc., and a specific implementation manner of cutting a secondary silicon ingot using a silicon ingot cutter to form a polycrystalline silicon rod can be referred to, for example, a patent publication such as CN105196434A.

Whether it is a single crystal silicon rod or a polycrystalline silicon rod, it is necessary to carry out corresponding subsequent processing operations, such as grinding, chamfering, barreling or spheronization, etc., and these subsequent processing operations can pass the present The silicon rod multi-station processing machine described in the application is implemented.

1 to 3, the silicon rod multi-station processing machine of the present application comprises: a base 1, a silicon rod loading and unloading device 2, a first processing device 3, a second processing device 4, and a silicon rod switching device 5.

The silicon rod multi-station processing machine of the present application will be described in detail below.

As the main component of the silicon rod multi-station processing machine of the present application, the base 1 has a silicon rod processing platform, wherein the silicon rod processing platform can be divided into a plurality of functional locations according to the specific operation content of the silicon rod processing operation. Specifically, in the embodiment, the silicon rod processing platform includes at least a pretreatment location, a first processing location, and a second processing location.

a silicon rod switching device 5 is disposed in a central region of the silicon rod processing platform for pretreating the first processing area of the silicon rod 100 loaded by the silicon rod handling device 2 on the silicon rod processing platform, and Conversion between the second processing zone. In one embodiment, the silicon rod switching device 5 is rotatably disposed on the silicon rod processing platform, and the silicon rod switching device 5 includes: a disc-shaped or circular conveying body 51; the silicon rod positioning mechanism 53 is disposed on the conveying body 51 is used for positioning the silicon rod; the conversion driving mechanism is used for driving the conveying body 51 to rotate to drive the silicon rod switching position of the silicon rod positioning mechanism 53.

As described above, the silicon rod processing platform in one embodiment includes a pre-processing location, a first processing location, and a second processing location, and the silicon rod positioning mechanism on the delivery body 51 is adapted to the functional locations. The number of 53 can be set to three, and each of the silicon rod positioning mechanisms 53 can position a silicon rod. Further, the angles set between the two silicon rod positioning mechanisms 53 are also consistent with the angular distribution between the two functional areas. Thus, when a certain silicon rod positioning mechanism 53 corresponds to a certain functional position, inevitably, the other two silicon rod positioning mechanisms 53 also correspond to the other two functional areas, respectively. Thus, at any time in the flow operation, when each of the silicon rod positioning mechanisms 53 is positioned with a silicon rod and the silicon rod positioning mechanism 53 corresponds to the functional position, the silicon rods are located at a corresponding one. The processing area performs the corresponding processing operations. For example, the silicon rods in the pretreatment area can be pre-processed, the silicon rods in the first processing area can perform the first processing operation, and the silicon rods in the second processing area can be processed. The second processing operation. In an optional embodiment, the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform are distributed at 120° between the two, so correspondingly, the disk is The three silicon rod positioning mechanisms 53 on the shaped or toroidal delivery body 51 are also distributed 120[deg.] between each other. Of course, the number of the silicon rod positioning mechanisms 53 can be changed according to actual needs. Not limited to this, for example, the number of the silicon rod positioning mechanisms 53 may be determined according to the number of functional locations set by the silicon rod processing platform.

In an embodiment, the silicon rod positioning mechanism 53 may further include a rotation bearing table 531, a rotation pressing device 533, a lifting drive device (not shown), and a rotation driving device (not shown).

The rotating stage 531 is disposed on the disc-shaped or circular conveying body 51 of the silicon rod switching device 5 for carrying the silicon rod 100 and placing the silicon rod 100 in an upright position, that is, the bottom of the silicon rod 100 is located at the rotation On the carrying platform 531. In the present embodiment, the stage 531 is rotated and rotated together when the disk-shaped or circular-shaped conveying body 51 is rotated in the silicon-bar switching device 531. In particular, the rotation stage 531 can also be designed to be rotatable, for example, the rotation stage 531 has a rotation axis with respect to the delivery body 51 to achieve a rotation motion, such that after the rotation stage 531 supports the silicon rod 100, the rotation stage The 531 and the silicon rod 100 thereon can be rotated together. Further, the contact surface of the rotating carrier 531 for contacting the silicon rod has damping to provide a certain frictional force that can drive the silicon rod. The rotating carrier 531 is adapted to the silicon rod 100. In an alternative embodiment, the rotating stage 531 can be a circular carrier that is adapted to the cross-sectional dimensions of the silicon rod 100.

A rotary pressing device 533 is disposed opposite the rotating carriage 531 for pressing against the top of the silicon rod 100 to compress the silicon rod 100. The rotary hold down device 533 can further include an erected abutment 532 and a push-on movable block 534 disposed at the bottom of the support 532. The support 532 is movably disposed on a central mounting frame 13 that is located in a central region of the transport body 51 and that rotates along with the transport body 51. In a specific implementation, the central mounting frame 13 can include at least six mounting posts 131 disposed vertically, and is divided into three groups in a manner of two in each group, wherein two mounting posts 131 in each group are used to set up a support for the movable 532, each of the supports 532 is driven by a lifting drive to move up and down along the mounting post 131. In an alternative embodiment, the mounting post 131 is a relatively smooth cylindrical structure. If necessary, lubricating oil may be applied to the surface of the mounting post 131 to facilitate the smooth movement of the support 532. In addition, a protective sleeve may be sleeved on the mounting post 131 to protect the mounting post 131 from dust, debris and the like. The pressing active block 534 is adapted to the silicon rod 100. In an alternative embodiment, the pressing active block 534 can be a pie-shaped compact corresponding to the cross-sectional dimensions of the silicon rod 100. Further, the pressing movable block 534 in the rotary pressing device 533 is pivotally coupled to the abutment 532 and is rotatable relative to the abutment 532.

In the foregoing, the rotating carrier 531 is designed to be able to rotate and the pressing block 534 of the rotary pressing device 533 is pivotally connected to the support 532. Therefore, the rotating carrier 531 or the pressing movable block 534 can be linked to each other. A rotary drive. In one case, when the rotating stage 531 is linked to a rotary driving device, the rotating movable table 531 acts as a driving rotating member and the pressing movable block 534 acts as a driven rotating member; in another case, when the top When the pressing movable block 534 is interlocked with a rotary driving device, the pressing movable block 534 is used as the active rotating member, and the rotating stage 531 is used as the driven rotating member.

In practical applications, the rotary pressing device 533 can cooperate with the rotating loading platform 531 under it. Specifically, after the silicon rod 100 is vertically placed on the rotating bearing platform 531, the support 532 is driven by the lifting drive device along The mounting post 131 is lowered for movement until the pressing block 534 on the holder 532 is pressed against the top of the silicon rod 100. Subsequently, when the silicon rod 100 needs to be rotated, the rotating rotating platform 531 or the pressing movable block 534 driven by the rotary driving device rotates, and the friction between the rotating bearing table 531, the silicon rod 100, and the pressing movable block 534 is utilized. The force drives the silicon rod 100 to rotate together to realize the adjustment of the working surface or the working area in the silicon rod 100, thereby performing processing on the adjusted working surface or working area in the silicon rod 100. The rotational speed and angle of rotation of the silicon rod 100 can be controlled by a rotary drive. In a specific implementation, the lifting drive device can be, for example, a cylinder or a lifting motor, and the rotary driving device can be, for example, a rotating electrical machine.

Further, it can be seen from the above that in some cases, the rotating carrier 531 or the pressing movable block 534 can be controlled to rotate by the rotating driving device to drive the silicon rod 100 to rotate to change the working surface or the working area, sometimes when silicon When the rod 100 is rotated to the desired work surface or work area, it is necessary to stop the operation and position it to accept the processing operation of the processing device in the corresponding functional position. Therefore, in the present application, the silicon rod positioning mechanism may be configured with a locking mechanism if necessary. In one implementation, a carrier lock mechanism (not shown) may be disposed at the bottom of the center mount 13 adjacent to the spin platform 531, the deck lock mechanism may include a lock latch And a locking cylinder connected to the locking bolt. In practical applications, when it is required to lock the rotating carrier 531, the locking cylinder in the carrier locking mechanism drives the locking latch to protrude and acts on the bottom or neck of the rotating carrier 531, ensuring that the rotating carrier 531 is stable. When the silicon bar is required to be rotated to change the working surface or the working area, the locking cylinder in the loading table locking mechanism drives the locking pin to contract, unlocking the rotating carrier 531, so that the rotating carrier 531 can Turn.

The disc-shaped or toroidal conveying body 51 is rotated by the driving of the switching drive mechanism, and the silicon rod positioning mechanism 53 on the conveying body 51 is realized by the rotation of the disc-shaped or circular conveying body 51 and The silicon rods 100 positioned by the silicon rod positioning mechanism 53 are switched between different functional locations.

In one embodiment, the conversion drive mechanism further includes: a conversion tooth belt disposed on a circumference side of the disc-shaped or circular conveying body 51; a driving motor and a linkage structure connected to the driving motor and driven by the driving motor, It is disposed on the silicon rod processing platform of the base 1, and the linkage structure includes a rotating gear that meshes with the conversion toothed belt. In this manner, the rotating gear drives the disc-shaped or circular conveying body 51 to rotate under the driving of the driving motor to drive the silicon rod positioning mechanism 53 and the silicon rod 100 thereon to switch to other functional positions to complete the conveying. The drive motor can be a servo motor.

The silicon rod loading and unloading device 2 is disposed in a pretreatment position of the silicon rod processing platform for loading the silicon rod to be processed into a pretreatment position of the silicon rod processing platform and processing the processed silicon rod from the silicon rod processing platform. The preprocessing location is unloaded. Further, the silicon rod loading and unloading device 2 is used for loading the silicon rod to be processed into the pretreatment position of the silicon rod processing platform and unloading the processed silicon rod from the pretreatment position of the silicon rod processing platform. Loading the silicon rod to be processed to the transport body 51 The rotating stage 531 corresponding to the pretreatment zone of the silicon bar processing platform and the processed silicon bar are unloaded from the rotating carrier 531 corresponding to the pretreatment zone of the silicon bar processing platform in the conveying body 51.

In one embodiment, the silicon rod loading and unloading device 2 further includes: a silicon rod loading and unloading position, a reversing carrier 23, and a silicon rod clamp 25.

The silicon rod loading and unloading area is provided with a silicon rod carrying platform 21 for carrying the vertical placement of the silicon rod 100; the reversing carrier 23 is used for the reversing movement; and the silicon rod clamp 25 is disposed on the first mounting surface of the reversing carrier 23. By driving the reversing carrier 23 for the reversing motion, the silicon rod clamp 25 of the reversing carrier 23 is switched between the silicon rod loading and unloading position and the pretreatment position to transfer the silicon rod 100.

The silicon rod loading and unloading device is disposed on a bottom mounting structure, and the bottom mounting structure is protruded from the base 1. One side of the bottom mounting structure serves as a silicon rod loading and unloading location, and a silicon rod carrying platform 21 is provided on the silicon rod loading and unloading location, and the silicon rod carrying platform 21 is used to carry the silicon rod 100. In a preferred embodiment, in order to facilitate the clamping of the silicon rod holder 25, if the loaded silicon rod 100 can be adjusted in time to fit the silicon rod holder 25, the silicon rod carrier 21 is rotated. The silicon rod carrier 21 is provided with a rotating shaft and a driving motor. The silicon rod carrier 21 is rotated about the rotating shaft under the control of the driving motor to adjust the angle of the silicon rod 100 on the silicon rod carrier 21. In addition, in an alternative embodiment, the silicon rod carrier 21 can further adopt a lifting design, that is, the rotating shaft below the silicon rod carrier 21 can be controlled to perform a telescopic action to drive the silicon rod carrier. 21 is used for lifting movement to adjust the height of the silicon rod on the silicon rod carrier 21.

The reverse carrier 23 is disposed on the bottom mounting structure and is reversible relative to the bottom mounting structure. In one embodiment, the reversing carrier 23 is operated by a reversing mechanism to effect a reversing motion. The reversing mechanism that causes the reversing carrier 23 to effect the reversing motion may include a rotating shaft and a reversing motor, and the reversing carrier 23 is coupled to the bottom mounting structure therethrough by the rotating shaft. When the steering motion is implemented, the reversing motor is started to drive the rotating shaft to rotate to drive the reversing carrier 23 to rotate to realize the reversing motion. The rotation of the driving rotating shaft can be designed to be a one-way rotation or a two-way rotation. The one-way rotation can be, for example, a clockwise rotation or a counterclockwise rotation, and the two-way rotation can be, for example, a clockwise rotation and a counterclockwise rotation. In addition, the angle of the rotation of the driving rotating shaft can be set according to the actual configuration of the silicon rod loading and unloading device, etc., wherein the actual configuration of the silicon rod loading and unloading device can be, for example, the angle of rotation of the driving rotating shaft, according to the loading and unloading position of the silicon rod and the pretreatment. The positional relationship between the locations or the structure of the commutation carrier 23, and the like. The central position of the reversing base 231 in the reversing carrier 23 is connected to the rotating shaft. Generally, the shape of the reversing base 231 can adopt the structure of the disc, but not limited thereto, and the square disc or ellipse can also be used. plate.

In addition, if necessary, due to the mechanical structure design, the positional relationship between the silicon rod loading and unloading position and the pre-processing position cannot satisfy the silicon rod clamp on the reversing carrier 23 by the reversing movement of the reversing carrier 23. 25 can correspond exactly to the silicon rod loading and unloading area and the pretreatment position. At this time, the silicon rod handling device may further include a translation mechanism for driving the translational movement of the reversing carrier 23 relative to the bottom mounting structure toward/away from the pretreatment position. In an embodiment, the silicon rod loading and unloading device is changing A conversion chassis 241 is further provided between the carrier 23 and the bottom mounting structure, wherein the reversing carrier 23 is coupled to the conversion chassis 241 via a rotating shaft, and the conversion chassis 241 is mounted on the bottom mounting structure by a translating mechanism.

In an achievable manner, the translation mechanism further includes: a translational rack disposed on the bottom mounting structure along the translation direction; a translational rotating gear disposed on the conversion chassis 241 and engaged with the translational rack; A motor (not shown) is used to drive the translational gear rotation such that the conversion chassis 241 and the commutating carrier 23 thereon move along the translational rack to advance and retreat relative to the bottom mounting structure.

In a practical application, the translational rack can be, for example, at least one rack having a length that can be mounted to the bottom mounting structure. In order to cause the shifting chassis 241 and the reversing carrier 23 thereon to move more smoothly along the translational direction, at least two translational gears may be provided for each of the racks, at least two of which are spaced apart. The translation gear can be connected to the translation drive motor via a drive shaft. The translation drive motor can be, for example, a servo motor.

In a practical application, as described above, the translation mechanism includes a translational rack, a translational gear, and a translational drive motor, and the translational drive motor drives the translational gear to rotate so that the conversion chassis 241 and the reverse carrier 23 thereon Move along the translational rack for precise movement. The above-mentioned translation mechanism is only an example, but is not intended to limit the present application. Alternatively, in other alternative embodiments, the translation mechanism may include: a lead screw and a servo motor, and the lead screw has high precision and reversibility. And high efficiency, in this way, by the cooperation of the servo motor and the lead screw, the accuracy of the horizontal conversion of the conversion chassis 241 and the reversing carrier 23 thereon in the translation direction is improved, that is, the conversion chassis 241 and the upper portion thereof are The distance that the reversing carrier 23 travels horizontally in translation is more precise.

Further, in the embodiment, in order to make the conversion chassis 241 and the reversing carrier 23 thereon move more smoothly and smoothly with respect to the bottom mounting structure in the translation direction, the translation mechanism may further include a translation guide rail and a translation. a sliding seat, wherein the translational guide rail is disposed at a bottom of the conversion chassis 241 in a translation direction, and the translation sliding seat is mounted on the bottom mounting structure, and the translational guide rail and the translation sliding seat cooperate to assist the conversion chassis 241 and the reversing carrier thereon 23 moves in the translation direction. In a practical application, the translational drive motor is driven to rotate the translational gear to move the conversion chassis 241 and the reversing carrier 23 thereon along the translational rack. At the same time, as a translational guide and translation slide of the auxiliary device, the translation guide rail Sliding in the translational slide causes the conversion chassis 241 and the reversing carrier 23 thereon to move in the translational direction. Alternatively, in other embodiments, the translation mechanism may further include a translation rail and a translation slider, wherein the translation rail is disposed on the bottom mounting structure in the translation direction, and the translation slider is mounted on the bottom of the conversion chassis 241. The cooperation of the translational rail with the translational slider can cause the translational slider to slide along the translational rail, thereby assisting the conversion of the chassis 241 and the reversing carrier 23 thereon in the translational direction.

A silicon rod clamp 25 is used to hold the silicon rod. In an embodiment, the silicon rod clamp 25 includes a clamp mount 251 and at least two silicon rod clamps 253. The jig mount 251 is provided on the reversing carrier 23. At least two of the silicon rod holders 253 are spaced apart along the clamp mount 251. In an embodiment, the workpiece carrier at the location of the silicon rod loading and unloading area can carry silicon The rods are placed upright so that at least two of the silicon rod holders 253 are vertically spaced apart, i.e., at least two of the silicon rod holders 253 are disposed one above the other.

In a specific implementation, each of the silicon rod holders 253 further includes: a clamp arm mount 252 and at least two clamp arms 254, wherein the clamp arm mount 252 is disposed on the clamp mounting member 251, at least two clamps The arm 254 is movable on the clamp arm mount 252. In view of the silicon rod to be processed, whether it is a single crystal silicon rod or a polycrystalline silicon rod, the cross section of the silicon rod is polygonal. In the related art, the cross section of the silicon rod is mostly rectangular, and therefore, in one embodiment, the silicon rod clamp The holding member 253 is a square workpiece holder as a whole, and the clamping arms 254 constituting the silicon rod holding member 253 are two symmetrically designed. The single clamping arm 254 is designed to have a single flat clamping surface (see Fig. 4) or a corner clip. Holding the face (see Fig. 5), the folding face is composed of two consecutive straight clamping faces with a chamfer between the two clamping faces. Of course, a cushion pad may be additionally added to the flat clamping surface of the clamp arm 254 for avoiding damage to the surface of the silicon rod during the process of clamping the silicon rod, thereby achieving a good effect of protecting the silicon rod. Additionally, the use of the silicon rod holder 253 can also serve as a centering adjustment.

In general, the clamp arm 254 in the silicon rod holder 253 is in the sandwiched state, and the center of the clamp space formed by the two clamp arms 254 coincides with the center of the silicon rod carrier 21 . Therefore, taking the silicon rod holder 253 having the clamp arm 254 shown in FIG. 5 as an example, when the silicon rod 100 placed upright on the silicon rod carrier 21 is held by the silicon rod holder 253, the silicon rod holder The clamp arm 254 in the holder 253 is contracted, and the folding surface of the clamp arm 254 abuts against the silicon rod 100, wherein two of the flat clamping surfaces correspond to the silicon rod 100, respectively. Two adjacent sides in the middle. During the process of shrinking and clamping the silicon rod 100 by the clamp arm 254, the silicon rod 100 is pushed by the two clamp arms 254 on both sides and moved toward the central area of the clamping space until the silicon rod 100 is held by the silicon rod holder 253. The two clamp arms 254 are clamped, and at this time, the center of the silicon rod 100 can be located at the center of the holding space of the silicon rod holder 253. In particular, in order to enable the at least two clamping arms 254 of the silicon rod holder 253 to smoothly and stably hold different types of different sizes of silicon rods, the silicon rod holder 253 further includes a clamping arm driving mechanism for At least two clamping arms 254 are driven to open and close.

Please refer to FIG. 6 , which is a rear view of the silicon rod clamp 25 . In a specific implementation, as shown in FIG. 6, the clamp arm driving mechanism further includes: an opening and closing gear 255, a gear driving member 256, and a driving source 257.

The opening and closing gear 255 is disposed on the corresponding clamping arm 254. The gear drive member 256 has a tooth pattern that engages with the opening and closing gear 255 on the clamp arm 254. The drive source is coupled to the gear drive 256 for driving the gear drive member 256 to move. In one implementation, the gear drive member 256 is a rack, and the rack 256 is located in the middle of the two clamp arms 254, and the two outer sides of the rack arms 254 facing the two sides respectively are respectively provided with The opening and closing gears 255 on the two clamping arms 254 engage corresponding tooth patterns, and the driving source 257 can be, for example, a drive motor or a cylinder.

Thus, according to the above implementation, in the actual application, when the clamping arm 254 needs to be clamped, the rack 256 as the gear driving member is driven upward by the driving motor or the cylinder as the driving source, and the two sides are driven by the rack 256. Opening and closing The gear 255 is externally rotated, and the opening and closing gear 255 drives the clamping arm 254 during the external rotation (the opening and closing gear 255 and the clamping arm 254 can be connected through the rotating shaft) to perform a lowering motion to be transferred from the released state to the clamping state; When the clamp arm 254 is loosened, the rack motor 256 as a gear drive member is driven downward by the drive motor (or cylinder) as a drive source, and the split gear 255 meshed by the rack 256 is internally rotated. The opening and closing gear 255 drives the clamping arm 254 during the internal rotation (the opening and closing gear 255 and the clamping arm 254 can be connected through the rotating shaft) to perform a lifting action to shift from the clamping state to the released state. Of course, the above is only an embodiment, and is not intended to limit the working state of the silicon rod holder 253. In fact, the above-mentioned "upward", "outer rotation", "downward", "downward", "inner rotation" The "upward", and "release" and "clamp" state changes may vary depending on the configuration and mode of operation of the clamp arm 254, and the configuration of the clamp arm drive mechanism.

As is known to those skilled in the art, for a single crystal silicon rod or a polycrystalline silicon rod, the original long silicon rod or the primary silicon ingot (large size silicon ingot) has different specifications, and the original long silicon rod is cut off or Different starting and cutting operations of the primary silicon ingot are bound to make the difference in size between the single crystal silicon rod and the polycrystalline silicon rod, between the individual single crystal silicon rods, and between the individual polycrystalline silicon rods, in view of the silicon rod clamp 25 being For clamping the silicon rod 100 in an upright position, therefore, for the silicon rod clamp 25, the influence of the aforementioned dimensional difference is mainly manifested in the difference in length of the silicon rod to the silicon rod clamp in the silicon rod clamp 25. Whether the holding member 253 can correspond to the hidden worry of the silicon rod. In order to reduce or even eliminate the above-mentioned silicon rod holder 253, there is a risk that the silicon rod may not be clamped.

In one implementation, the silicon rod clamp 25 employs a fixed silicon rod holder, that is, a plurality of silicon rod holders 253 are vertically disposed on the first mounting surface of the reverse carrier 23 in a vertical manner. Moreover, the spacing of two adjacent silicon rod holders 253 of the silicon rod holders 253 is as small as possible, and thus, the silicon rod holders 253 can cover various types of lengths of silicon rods. For example, if the length of the silicon rod is long, more silicon rod holders 253 on the reversing carrier 23 are used for clamping; if the length of the silicon rod is shorter, less use of the reversing carrier 23 is used. The silicon rod holder 253 participates in the clamping.

In other implementations, the silicon rod clamp 25 employs a movable silicon rod holder, that is, the silicon rod holder 253 is vertically disposed on the first mounting surface of the reverse carrier 23, since, silicon The rod holder 253 is of a movable design, so that the number of the silicon rod holders 253 can be greatly reduced, generally two or three. As such, the use of these movable silicon rod holders 253 can cover silicon rods of various gauge lengths. For example, if the length of the silicon rod is long, the silicon rod holder 253 is moved to extend the clamping pitch of the two silicon rod holding members 253; if the length of the silicon rod is short, the silicon rod holding member 253 is moved, The clamping pitch of the two silicon rod holding members 253 is shortened. In the implementation manner in which the silicon rod clamp 25 adopts the movable silicon rod clamping member, in order to facilitate the smooth and smooth upper and lower movement of the movable silicon rod clamping member to adjust the position, the clamp mounting member 251 in the silicon rod clamp 25 can be utilized. The guiding action of the movable silicon rod holder 253 is guided. In an achievable manner, the clamp mounting member 251 can adopt a guiding column structure, and the clamping arm mounting seat 252 adopts a movable block structure that is sleeved on the guiding column structure. Specifically, the guide post structure as the clamp mount 251 includes two guide posts that are erected and parallel, as the clamp mount 252 The movable block structure is provided with two through holes or two clips corresponding to the two guiding columns in the guiding column structure. If a through hole is used, the movable block is sleeved on the guide post and can be slid along the guide post. If a clip is used, the movable block is clamped to the guide post and can be slid along the guide post, wherein in practical applications, the clip can be clamped to at least half of the guide post section.

There are also variations to the silicon rod clamp 25 for the movable silicon rod holder 253. Taking two silicon rod holders 253 as an example, in an alternative embodiment, one of the two silicon rod holders 253 is movable and another silicon rod holder 253 is designed. It is a fixed design, so that in practical applications, the clamping distance between the fixed and designed silicon rod holders 253 is adjusted by moving the movable silicon rod holder 253. As can be seen from the above, the silicon rods 100 are placed upright, and therefore, regardless of the gauge length of the silicon rods, the bottom of the silicon rods 100 can always be relatively easily determined. Therefore, preferably, the two silicon rod holders 253 can be The silicon rod holder 253 located above is designed to be movable so that only the position of the upper silicon rod holder 253 is adjusted. To achieve movement of the silicon rod holder 253, the movable design of the silicon rod holder 253 may be provided with a guide drive mechanism. The silicon rod holder 253, which is capable of driving the movable design, is moved up and down along the clamp mounting member 251 by a guide drive mechanism.

In one implementation, the guiding drive mechanism may include, for example, a lead screw 258 and a guiding motor 259, wherein the guiding screw 258 is erected, and one end of the guiding screw 258 is connected to the clamping arm mounting 252, the guiding screw The other end of the 258 is connected to the guiding motor 259, and the guiding motor 259 can be disposed at the top of the reversing carrier 23, but not limited thereto, and the guiding motor 259 can also be disposed at the bottom of the reversing carrier 23. The lead screw 258 has the characteristics of high precision, reversibility and high efficiency. Thus, when the position of the upper silicon rod holder 253 needs to be adjusted, the guide motor 259 drives the guide screw 258 to rotate, and the lead screw 258 rotates. The middle driving silicon rod clamping member 253 moves up and down along the clamp mounting member 251. For example, the guiding motor 259 drives the guiding screw 258 to rotate in the forward direction, thereby driving the upper silicon rod clamping member 253 to move upward along the clamp mounting member 251. Along from the lower silicon rod clamping member 253; the guiding motor 259 drives the guiding screw 258 to rotate in the reverse direction, thereby driving the upper silicon rod clamping member 253 to move downward along the clamp mounting member 251 to approach the lower silicon rod holding member 253. . The nip distance between the two silicon rod holders 253 is adjusted to effectively clamp the silicon rods 100 of different gauge lengths.

In another alternative embodiment, the two silicon rod holders 253 are of a movable design such that, in practical applications, the movement of the two silicon rod holders 253 of the movable design can be adjusted to each other. The spacing between the grips. Since the silicon rod holder 253 is of a movable design, at least one of the two silicon rod holders 253 is provided with a guiding drive mechanism for driving the two silicon rod holders 253 along The clamp mounting member 251 is moved.

In contrast to the foregoing alternative embodiment, in the alternative embodiment, since the two silicon rod holders 253 in the silicon rod clamp 25 are movable, there will be two silicon rod clamping One of the silicon rod holders 253 of the member 253 is provided with a guide drive mechanism or a guide drive mechanism is provided on both of the silicon rod holders 253. Now held in two silicon rods The upper silicon rod holder 253 of the member 253 is provided with a guide driving mechanism as an example, in which case, between the clamp arm mount 252 and the clamp mounting member 251 in the two silicon rod holding members 253 For the movable connection, that is, the clamp arm mount 252 and the clamp arm 254 thereon in any one of the silicon rod holders 253 move up and down along the clamp mounting member 251, and the guide drive mechanism is provided to include the guide screw 258 and a guiding motor, wherein one end of the guiding screw 258 is connected to the clamping arm mounting 252 of the upper silicon rod clamping member 253, and the other end of the guiding screw 258 is connected to the guiding motor 259, and the guiding motor 259 can be disposed at The top of the carrier 23 is reversed. Thus, when the position of the upper silicon rod holder 253 needs to be adjusted, the guide screw 258 is driven to rotate by the guide motor 259, and the rod holder 253 is driven during the rotation of the lead screw 258. Moving up and down along the clamp mounting member 251, for example, the guiding motor 259 drives the guiding screw 258 to rotate in the forward direction, thereby driving the upper silicon rod clamping member 253 to move upward along the clamp mounting member 251 to move away from the lower silicon rod clamping member. 253; guide motor 259 drive guide Reverse rotation of the screw 258, the silicon drive member above the rod holder 253 moves downward along the mounting member 251 to be close to the clamp member holding the silicon rod 253 downward. The silicon rod holding member 253 moves up and down along the clamp mounting member 251 to adjust the clamping distance between the two silicon rod holding members 253, thereby effectively clamping the silicon rods 100 of different gauge lengths.

In fact, in the case where the two silicon rod holders 253 are both movable designs, the guiding drive mechanism can be used to adjust not only the clamping distance between the two silicon rod holding members 253 but also different lengths of silicon rods. In addition to the effective clamping, the clamped silicon rod 100 can also be lifted and lowered. After the two silicon rod holding members 253 are effectively clamped to the silicon rod, the movement of the silicon rod holding member 253 is driven. Lift the silicon rod 100. Specifically, the guiding mechanism is further provided by the upper silicon rod clamping member 253. First, the upper silicon rod clamping member 253 is adjusted up and down along the clamp mounting member 251 by the guiding driving mechanism to adjust the lower silicon rod. The clamping distance between the clamping members 253; then, the clamping arm driving mechanism in each of the silicon rod clamping members 253 drives the corresponding two clamping arms to perform a clamping action to smoothly and stably hold the silicon rods; Subsequently, the upper silicon rod holder 253 is further driven to move upward along the clamp mounting member 251 by the guide driving mechanism. At this time, the held silicon rod 100 and the lower silicon rod holding member 253 due to the frictional force. The upward movement is accompanied by the upward movement of the held silicon rod 100 by the friction between the upper silicon rod clamping member 253 and the silicon rod 100, and the silicon rod clamping member 253 is moved upward to utilize It is the frictional force between the silicon rod 100 and the underlying silicon rod holder 253. The downward movement of the upper silicon rod holder 253 by the driving drive mechanism to drive the silicon rod 100 and the lower silicon rod holder 253 downward is also the same process, and will not be described herein.

It should be noted that, in other variations, for example, a guiding drive mechanism is disposed on the lower silicon rod holding member 253 of the two silicon rod holding members 253, and the structure, arrangement, and driving operation mode of the guiding driving mechanism are The guiding drive mechanism of the upper silicon rod holder 253 is similar, for example, by the lower silicon rod holder 253 being driven up and down along the clamp mounting member 251 by the driving mechanism to adjust the upper silicon rod clamping member. The clamping gap between 253, and the lower silicon rod holder 253 drives the silicon rod 100 and the upper silicon rod holder 253 along the clip under the driving of the guiding drive mechanism The mounting member 251 is moved up and down. For example, the two silicon rod clamping members 253 are provided with guiding driving mechanisms, and the manner of setting and driving the guiding driving mechanism and the movement manner of the two silicon rod clamping members 253 are not mentioned here, and will not be described herein.

In the case where the movable silicon rod holder 253 is moved up and down along the clamp mounting member 251 to be fitted to the silicon rods of different gauge lengths, the silicon rod holder 253 is movable structure design, silicon. The rod holder 253 needs to be provided with a guide driving mechanism or the like, and it is necessary to know the specification length of the silicon rod currently required to be clamped. In view of this, the silicon rod loading and unloading device in the present application may further include a height detector 7 for detecting the height of the vertically placed silicon rod carried by the silicon rod carrier 21, thereby serving as the movable silicon rod holder 253. Subsequent movement along the silicon rod clamp mount 251 to move up or down and to move the distance.

When the silicon rod to be processed is loaded from the silicon rod loading and unloading position to the pretreatment position of the silicon rod processing platform 11 by the silicon rod clamp 25 in the silicon rod handling device 2, for subsequent processing operations, in an embodiment, for example, A processing device 3 and a second processing device 4 respectively perform a first processing operation and a second processing operation on the silicon rod 100, and at least include a corresponding silicon rod surface shaping treatment in the subsequent processing operation. Therefore, it is necessary to know the current flatness condition of the silicon rod 100 before performing subsequent processing operations on the silicon rod. In view of this, the silicon rod multi-station processing machine of the present application may further comprise a flatness detector for at least flatness detection of the silicon rod 100 to be processed. In one embodiment, the flatness detector is disposed on the second mounting surface of the reversing carrier 23, and specifically includes: a contact detecting structure, a detector shifting mechanism, and a detecting controller.

The contact detecting structure in the flatness detector is used to perform flatness detection of the surface to be tested by contacting the surface to be tested of the silicon rod. Generally speaking, the contact detection structure performs the flatness detection of the surface to be tested by contacting the surface to be tested of the silicon rod, which specifically refers to: detecting, by the contact detection structure, each detection point of the surface to be tested of the silicon rod is sequentially detected. Corresponding to the relative distance values of the respective detection points, the flatness of the surface to be tested is determined according to the relative distance values.

In this embodiment, determining the flatness of the surface to be tested according to the relative distance value of each detection point is determined by comparing the difference between the maximum value and the minimum value among the measured relative distance values, If the difference is less than the standard value or falls within the standard range, it indicates that the flatness of the surface to be tested conforms to the specification. In a specific implementation, the contact detecting structure 61 may further include: a telescopic contact probe and an on/off switch.

A telescopic contact probe is used to contact the surface to be tested of the silicon rod 100. The on/off switch is associated with the telescopic contact probe and is coupled to the detection controller for transmitting a corresponding on-off signal to the detection controller upon contact of the telescopic contact probe with the surface to be tested of the silicon rod 100 for detection control Based on this, the relative distance of the detection point in the surface to be tested currently touched by the telescopic contact probe relative to the reference point is converted.

In an optional embodiment, the telescopic contact probe in the contact detection structure may further include: a contact probe, a probe base for providing the contact probe, at least partially built into the probe base and used for the top support Elastic support for the probe. The contact probe can be, for example, a rod having a cylindrical shape, and the top end of the rod can be sharpened and rounded or additionally provided with a bump. In practical applications, the contact probe can adopt high hardness and high wear resistance. Made of cemented carbide. The probe base can be, for example, a cylindrical table that is hollow and can accommodate a contact probe in the form of a rod. When the probe base is in contact with the contact probe, the top end of the contact probe protrudes from the probe base. The elastic support member is built into the probe base and is used for the top support contact probe, and the elastic support member is also associated with the on/off switch. The elastic support member is mainly embodied in the conduction of force. Here, the conduction of the force is at least in two aspects as follows: 1. Receiving the contact pressure of the contact probe due to contact with the surface to be tested and The pressing force is transmitted to the on/off switch for the on/off switch to generate a corresponding on/off signal according to the pressing force. 2. The returning probe is provided with a restoring force to restore the original shape, and the receiving contact probe is retracted relative to the probe base due to contact with the surface to be tested, and the elastic supporting member is subjected to the force to provide the original contact to the contact probe according to the force. The restoring force causes the contact probe to move outward relative to the probe base according to the restoring force to return to the original state. In practical applications, the elastic support member may employ, for example, a pressure spring, and the opposite ends of the pressure spring may correspond to the contact probe and the on/off switch, respectively. However, the components of the contact detecting structure and the structure of each component are not limited to the foregoing embodiments.

In other embodiments, the contact detection structure can still be changed. For example, the contact probe can be, for example, a tetrahedral rod, and the probe base can also be a tetrahedral tubular table. The elastic support member can also adopt a flexible elastic piece, and the opposite ends of the flexible elastic piece can respectively correspond to the contact probe and the on-off switch. The on/off switch is a high-precision switch with high sensitivity, which can be perceived even with very small forces. In addition, in other implementation manners of the optional embodiment, the signal transmission device or the signal transmission circuit may be further included between the on-off switch and the detection controller, such that the on-off signal generated by the on-off switch can pass through the signal transmission device. Or the signal transmission circuit is transmitted to the detection controller.

In the practical application, when the telescopic contact probe contacts the surface to be tested of the silicon rod 100, the telescopic contact probe is opposite to the probe base under the blocking of the surface to be tested of the silicon rod 100. For retraction, the elastic support member receives the abutting pressure of the contact probe through the pedestal contact probe and conducts the abutting pressure to the on/off switch, so that the on/off switch generates a corresponding conduction signal according to the abutting pressure. Or disconnecting the signal, the conduction signal or the disconnection signal is transmitted to the detection controller through the signal transmission device or the signal transmission circuit, and the detection controller can convert the current contact probe according to the conduction signal or the disconnection signal The relative distance of the detected points in the surface to be tested that are in contact with the reference point.

The detector shifting mechanism in the flatness detector is used to drive the displacement of the contact detecting structure 61. In this embodiment, the detector shifting mechanism may be, for example, a three-dimensional shifting mechanism. In a specific implementation, the three-dimensional shifting mechanism may include: a first direction shifting mechanism, a second direction shifting mechanism, and a third The direction shifting mechanism, for convenience of description, indicates the first direction as an X-axis, the second direction as a Y-axis, and the third direction as a Z-axis. As can be seen from FIG. 1 , the Y-axis in the second direction is consistent with the translational direction of the translation mechanism in the silicon rod loading and unloading device. Therefore, in an optional embodiment, the second direction shifting mechanism can be coupled with the aforementioned translation mechanism. Coincidentally, that is, the second direction shifting mechanism is constituted by the aforementioned translation mechanism The structure of the translation mechanism and the operation mode thereof can be referred to the foregoing description, so the second direction moving mechanism will not be described again.

The following description focuses on the first direction shifting mechanism and the third direction shifting mechanism in detail.

The first direction shifting mechanism further includes: a side shifting base 243 and a first direction shifting unit, and the shifting of the side shifting base 243 in the first direction (for example, the X-axis direction) can be provided by the first direction shifting unit . The first direction shifting unit further includes: a first direction rack disposed on the bottom mounting structure in the first direction; a first rotating gear disposed on the side shifting base 243 and meshing with the first direction rack; The driving motor is configured to drive the first rotating gear to rotate so that the side shifting base 243 advances and retreats along the first direction rack. In particular, the first direction rack can be, for example, at least one rack having a length that is mounted to the bottom mounting structure. In order to move the side shifting base 243 more smoothly in the first direction, at least two first rotating gears may be disposed for each of the racks, and at least two of the first rotating gears are spaced apart. The first rotating gear may be drivingly coupled to the first drive motor via a drive shaft, the first drive motor being coupled to the detection controller and controlled by the detection controller. The first drive motor can be, for example, a servo motor. In a practical application, as described above, the first direction shifting unit includes a first direction rack, a first rotating gear, and a first driving motor, and the first driving motor receives a shift control command from the detecting controller, and The first rotating gear is rotated according to the shift control command to shift the side shift base 243 along the first direction rack until the shift value is satisfied, so as to achieve precise displacement. The shift control command includes at least a shift value or a parameter related to the shift value.

In addition, the first direction shifting unit is merely an example, but is not intended to limit the application. For example, in an alternative embodiment, the first direction shifting unit may include: a lead screw and a servo motor, a lead screw With high precision, reversibility and high efficiency, the accuracy of the horizontal movement of the side-shifting base 243 in the first direction is improved by the cooperation of the servo motor and the lead screw. In addition, the first direction shifting unit may further include a first direction rail and a first slider, wherein the first direction rail is disposed on the bottom mounting structure in the first direction, and the first slider is disposed on the side shifting base 243 and Cooperating with the first direction guide rail, the auxiliary side shift base 243 is displaced along the first direction by the cooperation of the first direction rail and the first slider.

In a practical application, the first drive motor receives a shift control command from the detection controller (the shift control command includes at least a shift value or a parameter related to the shift value) and according to the shift control command Driving the first rotating gear to rotate to displace the side shifting base 243 along the first direction pinion, wherein the shift control command includes at least a shift value or a parameter related to the shift value, and at the same time, as an auxiliary facility A direction guide rail and a first slider, the first slider slides along the first direction rail, thereby displace the side shift base 243 in the first direction.

In a further embodiment, the first direction shifting unit may further include a first direction rail and a first sliding seat, wherein the first direction rail is disposed in the first direction on the side shifting base 243, the first sliding seat Mounted on the bottom mounting structure, the auxiliary side shifting base 243 is displaced in the first direction by the cooperation of the first direction rail and the first sliding seat. As mentioned above, the flatness check The measuring instrument is used for surface flatness detection of the silicon rod. Therefore, in general, the flatness measuring instrument can be used together with other processing equipment. This type of processing equipment can be a single function processing equipment (for example, a cutting machine, The surface finishing machine or the polishing machine can also be a multi-function composite processing device, which can be, for example, a cutting machine, a surface finishing machine, or a polishing machine, etc., the composite processing The device can be, for example, a face polishing machine.

Since, in one embodiment, the second direction shifting mechanism is concurrently performed by the aforementioned translation mechanism, in order to cooperate with the first direction translation mechanism, in the structure of the translation mechanism, the conversion chassis 241 passes through the translation mechanism. The mounting on the bottom mounting structure is essentially that the conversion chassis 241 is mounted on the side shifting base of the first direction shifting mechanism by the translation mechanism, which is specifically described herein.

The third direction shifting mechanism can provide the contact detecting structure 61 with respect to the reversing carrier 23 in the third direction (for example, the Z-axis direction, in the following, for the third-direction shift, which will also be customary in this document. It is called up and down shift). In one embodiment, the contact detection structure 61 is disposed on the commutation carrier 23 by a detection structure mount 63. The detecting structure mounting member 63 can adopt a guiding post structure, and the contact detecting structure adopts a movable block structure that is sleeved on the guiding post structure. Specifically, the guide post structure as the detecting structure mounting member 63 includes two guiding columns that are erected and parallel, and the contact detecting structure 61 is provided with two corresponding to the two guiding columns in the guiding post structure. Through holes or two clips.

If a through hole is used, the contact detecting structure is sleeved on the guiding column and can be slid along the guiding column. If a clip is used, the contact detecting structure is clipped to the guide post and can be slid along the guide post, wherein the clip can be clamped to at least a half of the guide post. Therefore, in order to realize the up-and-down displacement of the contact detecting structure 61 along the detecting structure mounting member 63, the third direction shifting mechanism may further include: a lead screw and a lifting motor, wherein the lead screw is erected, and the lead screw is One end is connected to the contact detecting structure 61, and the other end of the lead screw is connected to the lifting motor, and the lifting motor can be disposed at the top of the reversing carrier 23, but not limited thereto, the lifting motor can also be set in the reverse loading With the bottom of 23. The lead screw has the characteristics of high precision, reversibility and high efficiency. Thus, when the position of the contact detecting structure 61 needs to be adjusted, the lifting screw drives the screw to rotate, and the contact detecting structure 61 drives the detection along the lead screw during the rotation. The structural mounting member 63 moves up and down, for example, the driving motor drives the screw to rotate in the forward direction, and then drives the upper contact detecting structure 61 to move upward along the detecting structure mounting member 63; the driving motor drives the screw to rotate in the reverse direction to drive the contact detecting Structure 61 moves downward along detection structure mount 63.

In a practical application, the lift motor receives a shift control command from the detection controller that includes at least a shift value or a parameter related to the shift value and drives the screw rotation to drive the contact according to the shift control command. The type detecting structure 61 moves up and down along the detecting structure mounting member 63 until the requirement of the shift value is satisfied, and the purpose of accurate shifting is achieved. It should be noted that the combination of the lead screw and the driving motor in the third direction shifting mechanism is only an example, and is not intended to limit the third direction shifting mechanism of the present application. Alternatively, in other embodiments, The third direction shifting mechanism can also adopt teeth The belt shifting mechanism may include a timing belt, a rotating gear, and a drive motor in the belt shifting mechanism, wherein the timing belt is disposed on the second mounting surface of the reverse carrier 23, and the contact detecting structure 61 The connecting gear can be coupled to the timing belt, and the rotating gear meshes with the timing belt. The driving motor is used to drive the rotation of the rotating gear to drive the contact detecting structure 61 up and down along the detecting structure mounting member 63 by the timing belt.

The detecting controller is connected with the contact detecting structure and the shifting mechanism of the detecting device for controlling the shifting mechanism of the detecting device to drive the displacement of the contact detecting structure and controlling the contact detecting structure to sequentially detect the detecting points on the surface to be tested in the silicon rod Relative distance. In an embodiment, the detector shifting mechanism may include a first direction shifting mechanism, a second direction shifting mechanism, and a third direction shifting mechanism, and thus, the detecting controller and the first direction shifting mechanism, the second a direction shifting mechanism and a third direction shifting mechanism for respectively transmitting respective shift control commands to the first direction shifting mechanism, the second direction shifting mechanism, and the third direction shifting mechanism to drive the control contact type The detection structure reaches a predetermined detection position by three-dimensional displacement and can contact the detection point in the surface to be tested of the silicon rod 100 at the detection position. The contact detection structure may include: a telescopic contact probe and an on/off switch, wherein the on/off switch is connected to the detection controller, and the on/off switch is inspected and controlled when the telescopic contact probe contacts the surface to be tested of the silicon rod 100. The device sends an on/off signal, and the detection controller converts the relative distance of the detection point in the to-be-measured surface currently contacted by the contact probe with respect to the reference point according to the on-off signal.

In practical applications, the setting of the reference point may be determined according to a structural characteristic or a detection manner of the flatness detector, such as a first direction shifting mechanism in the detector shifting mechanism, and a second direction shifting. The structure of the mechanism and the third direction shifting mechanism. The relative distance obtained by converting the reference point is related to the reference point and the displacement distance of the contact detecting structure along the second direction by the second direction shifting mechanism. The displacement distance along the second direction is the initial position of the contact detecting structure in the unactivated state of the second direction shifting mechanism and the second detection position after the contact detecting structure touches the detecting side of the silicon rod 100 The distance between the contact positions of the contact detecting structures in the state in which the direction shifting mechanism is suspended. Of course, the simple processing method is: setting the reference point directly to the initial position of the contact detecting structure in the unactivated state of the second direction shifting mechanism, so that the relative distance of the detecting point in the surface to be tested relative to the reference point is The displacement direction of the contact detecting structure along the second direction is driven by the second direction shifting mechanism.

It should be noted that, in an embodiment, the flatness detector is disposed on the second mounting surface of the reversing carrier 23, and the silicon rod clamp is disposed on the first mounting surface of the reversing carrier 23, where The first mounting surface and the second mounting surface can be set according to the actual device structure. For example, the first mounting surface and the second mounting surface are two mounting faces that are disposed away from each other in the reversing carrier 23, and further, the first mounting surface and the second mounting surface may be different by 180°, so that the silicon rod is loaded and unloaded. The position of the silicon rod carrier 21 is connected to the rotating stage 531 of the silicon rod switching device 5 at the pretreatment position, so that when the reversing carrier 23 is rotated by 180, the original first mounting surface can be switched to The second mounting surface or the original second mounting surface can be switched to the first mounting surface, but the setting relationship for the first mounting surface or the second mounting surface in the actual application is not so demanding, the first installation The face and the second mounting surface may also differ by, for example, 90°, that is, the silicon rod carrier 21 located in the silicon bar loading and unloading position is 90° out of phase with the rotating stage 531 in the pretreatment zone of the silicon rod switching device 5, even The first mounting surface and the second mounting surface may be in any position within a suitable range as long as the silicon rod carrier 21 and the silicon rod switching device 5 between the first mounting surface and the second mounting surface or in the silicon rod loading and unloading position In the middle of the rotating stage 531 located in the pre-processing area, it is ensured that no unnecessary interference occurs. In addition, the height detector 7 mentioned above may be provided on the first mounting surface or on the second mounting surface, or even the other part of the commutation carrier 23.

In particular, the silicon rod 100 can be subjected to a correcting operation by the cooperation of the flatness detector 7 and the silicon rod holder 25. As can be seen from the foregoing description, the silicon rod 100 can be held by the silicon rod clamp 25 and transferred to the rotation of the silicon rod positioning mechanism 53 at the pretreatment position after the reversing movement of the reversing carrier 23. On the carrying platform 531. However, as such, there may be a case where the rotation stage 531 is not located in the central area of the silicon rod 100. In this case, the silicon rod products after subsequent processing operations are likely to fail to meet the workpiece specifications. Therefore, before the subsequent processing of the silicon rod, the silicon rod 100 can be subjected to the correcting operation, and in the correcting operation, it is easy to operate, and ideally, the center of the silicon rod 100 is coincident with the center of the rotating stage 531.

In practical applications, the flatness detection of the silicon rod 100 carried on the rotating stage 531 is performed by the flatness detector 7, thereby obtaining an overall positional overview of the silicon rod 100; the overall position and rotation of the obtained silicon rod 100 is obtained. The position of the stage 531 is subjected to comparative analysis, thereby obtaining deviation information between the center of the silicon rod 100 and the center of the rotating stage 531; the commutation carrier 23 is rotated by 180° for the reversing motion, by the reversing carrier 23 The silicon rod clamp 25 corresponds to the silicon rod 100 on the rotating stage 531 and clamps the silicon rod 100; the reverse direction carrier is driven by the first direction shifting mechanism and the second direction shifting mechanism in the three-dimensional shifting mechanism Moving in the first direction and/or the second direction, thereby driving the silicon rod clamp 25 and the silicon rod 100 held by the silicon rod clamp 25 to be positionally adjusted with respect to the rotation bearing stage 531, and finally the center of the silicon rod 100 is obtained. It coincides with the center of the rotating stage 531, and the correcting operation for the silicon rod 100 is completed.

The first processing device 3 is disposed in the first processing zone of the silicon bar processing platform 11 for performing the first processing operation on the silicon bar 100. The second processing device 4 is disposed in the second processing zone of the silicon bar processing platform 11 for performing a second processing operation on the silicon rod 100 after the first processing operation by the first processing device 3. In the present embodiment, as described above, the silicon rod 100 can be positioned in an upright position by the silicon rod positioning mechanism 53. Therefore, the first processing apparatus 3 performs the first processing operation on the silicon rod 100 placed upright and the first processing The second processing device 4 performs the second processing operation on the silicon rod 100 placed upright, which is a vertical processing method.

It should be particularly noted that the first processing device 3 and the second processing device 4 may have different combinations of variations for different types of silicon rods. For example, if the silicon rod 100 is a single crystal silicon rod, the first processing device 3 may be a tangential and coarse grinding device and the second processing device 4 may be a spheronization and refining device; if the silicon rod 100 is a polycrystalline silicon rod, then A processing device 3 can be The coarse grinding device and the second processing device may be chamfering and refining devices. In particular, in an embodiment, a protective door may be added between the pre-processing location and the first processing location and between the second processing location and the pre-processing location for The pretreatment location is isolated from the first processing zone and the second processing zone to protect the silicon rod from contamination or damage.

Hereinafter, the silicon rod 100 will be described in detail as an example of a single crystal silicon rod.

In the case where the silicon rod 100 is a single crystal silicon rod, the first processing device 3 is a tangential and coarse grinding device, and the second processing device 4 is a spheronization and refining device.

The tangential and coarse grinding device 3 as the first processing device is disposed on the machine base 1 and located in the first processing area of the silicon rod processing platform for performing rounding and rough grinding operations on the single crystal silicon rod. The dicing and roughing device 3 has a first accommodating space for receiving a single crystal silicon rod which is transported through the transport body 51 in the silicon rod switching device 5. The tangential and rough grinding device 3 mainly comprises a first frame 31 and at least one pair of first grinding tools 33, at least one pair of first grinding tools 33 are oppositely disposed on the first frame 31 for the first processing The single crystal silicon rod on the silicon rod switching device 5 at the location performs rounding and rough grinding operations. Further, each of the first grinding tools 33 further includes a first main shaft 32 and a first grinding wheel 34, wherein the mounting surface of the first main shaft 32 and the first frame 31 is provided with a lateral sliding guiding mechanism and a longitudinal sliding guide The mechanism, the lateral sliding guide mechanism may employ, for example, a combination of a slide rail and a slider, and the longitudinal slide guide mechanism may employ, for example, a combination of a slide rail and a slider. With the lateral sliding guide mechanism, the first main shaft 32 or the first grinding wheel 34 can be moved forward and backward relative to the first frame 31. The first main shaft 32 can be vertically moved up and down with respect to the first frame 31 by the longitudinal sliding guide mechanism.

In a practical application, at least one pair of first abrasive tools 33 are disposed on a grinding tool base, and the grinding tool base is longitudinally slidably coupled to the first frame 31 by a longitudinal sliding guiding mechanism, at least one pair a grinding tool 33 is slidably coupled to the grinding tool base by a lateral sliding guiding mechanism, wherein the grinding tool base is controlled by a lifting motor and the longitudinal sliding guiding mechanism is longitudinally slid to the first frame 31, Each of the at least one pair of first abrasives 33 is independently controlled by an advance and retreat motor to slide laterally to the abrasive base. The first grinding wheel 34 is disposed at the working end of the first main shaft 32 and has a first size of first frosted particles. Here, the single crystal silicon rod to be processed is a silicon square body having a substantially rectangular cross section, and has four side faces, and a connecting face surface having an R angle is formed between adjacent two side faces. Therefore, the pair of first grinding tools 33 in the tangential and rough grinding device 3 are disposed oppositely with a first accommodating space for accommodating the single crystal silicon rods, and the single crystal silicon rods are transported to the first After accommodating between the pair of first grinding wheels 34 in the space, the first grinding wheel 34 can contact the opposite pair of side faces or a pair of connecting facets of the single crystal silicon rod for corresponding processing operations.

In practical applications, the single crystal silicon rod is first transferred to the first processing location of the silicon rod processing platform by the silicon rod conversion device 5, and the single crystal silicon rod is positioned and adjusted by the silicon rod positioning mechanism 53 to make the single crystal silicon rod The pair of connecting facets correspond to the pair of first grindstones 33, and the first grindstone 33 performs a rounding operation on the connecting facets of the single crystal silicon rods. The rounding processing operation can be For example, it is matched with the positioning adjustment of the single crystal silicon rod by the silicon rod positioning mechanism 53, and the first grinding wheel 34 of the first grinding tool 33 is rotated according to the feeding amount, and the first grinding tool 33 is driven to move up and down to perform grinding. Performing a plurality of rough cuts on the first pair of connecting facets and adjacent regions and performing a plurality of rough cuts on the second pair of connecting facets and adjacent regions thereof, so that the connection between the respective connecting facets and the adjacent sides forms a preliminary Curved connection. Then, the single crystal silicon rod is positioned and adjusted by the silicon rod positioning mechanism 53, so that a pair of side surfaces of the single crystal silicon rod correspond to a pair of first grinding tools 33, and the side surface of the single crystal silicon rod is performed by the first grinding tool 33. Rough grinding operation.

The rough grinding operation may be, for example, positioning adjustment of the single crystal silicon rod by the silicon rod positioning mechanism 53 such that the first pair of side faces of the single crystal silicon rod correspond to the pair of first abrasive tools 33, and the pair of first abrasive tools 33 The first grinding wheel 34 performs a rough grinding operation on the first pair of side faces of the single crystal silicon rod; then, the single crystal silicon rod is positioned and adjusted by the silicon rod positioning mechanism 53 so that the second pair of side faces of the single crystal silicon rod correspond to In the pair of first grinding tools 33, the second pair of side faces of the single crystal silicon rods are rough-grounded by the first grinding wheel 34 of the pair of first grinding tools 33. Wherein, the rough grinding operation of any pair of sides may include, for example, providing a feed amount, driving the first grinding wheel 34 of the pair of first grinding tools 33 to move from top to bottom to grind a pair of sides of the single crystal silicon rod After the pair of first grinding wheels 34 are ground to the bottom of the single crystal silicon rod and pass through the single crystal silicon rod, stay at the lower limit position, and then add a feed amount to drive the pair of first grinding wheels 34 to move from bottom to top to grind the single a crystalline silicon rod; a pair of first grinding wheels 34 are ground to the top of the single crystal silicon rod and pass through the single crystal silicon rod to stay at the upper limit position, continue to increase a feed amount, and drive a pair of first grinding wheels 34 to move from top to bottom The single crystal silicon rod is ground; thus, grinding, increasing the feed amount, back grinding, increasing the feed amount, and after repeating several times, the pair of sides of the single crystal silicon rod can be ground to a predetermined size.

The spheronization and refining device as the second processing device is disposed on the machine base 1 and located in the second processing position of the silicon rod processing platform for the tangential and rough grinding operation of the tangential and rough grinding device 3 The single crystal silicon rod is subjected to rounding and fine grinding operations. The spheronization and refining device 4 has a second receiving space for receiving a single crystal silicon rod conveyed by the conveying body 51 in the silicon rod switching device 5. The spheronization and refining device 4 mainly comprises a second frame 41 and at least one pair of second grinding tools 43. At least one pair of second grinding tools 43 are oppositely disposed on the second frame 41 for positioning in the second processing zone. The single crystal silicon rod on the silicon rod switching device 5 is subjected to rounding and fine grinding operations.

Further, each of the second grinding tools 43 further includes a second main shaft 42 and a second grinding wheel 44, wherein the mounting surfaces of the second main shaft 42 and the second main frame 41 are provided with a lateral sliding guiding mechanism and a longitudinal sliding guide The mechanism, the lateral sliding guide mechanism may employ, for example, a combination of a slide rail and a slider, and the longitudinal slide guide mechanism may employ, for example, a combination of a slide rail and a slider. The second main shaft 42 or the second grinding wheel 44 can be moved forward and backward relative to the second frame 41 by using the lateral sliding guiding mechanism, and the second main shaft 42 can be opposite to the second frame by the longitudinal sliding guiding mechanism. 41 for vertical movement up and down.

In a practical application, at least one pair of second grinding tools 43 are disposed on a base of the grinding tool, and the base of the grinding tool is longitudinally slidably coupled to the second frame 41 by a longitudinal sliding guiding mechanism, at least one pair Two grinding tools 43 through the lateral sliding guide The shank base is controlled to be laterally slidably coupled to the grinding tool base, wherein the grinding tool base is controlled by a lifting motor and the longitudinal sliding guiding mechanism is longitudinally slid to the second frame 41, at least one pair of second grinding tools 43 Each of the second grinding tools 43 is independently controlled by an advance and retreat motor to slide laterally to the base of the grinding tool. The second grinding wheel 44 is disposed at the working end of the second main shaft 42 and has a second size of second frosted particles. In contrast, the second frosted particles in the second grinding wheel 44 have a particle size smaller than that of the first frosting particles in the first grinding wheel 34 in the tangential and coarse grinding device 3. Therefore, the pair of second grinding tools 43 in the spheronization and refining device 4 are disposed oppositely with a second accommodating space for accommodating the single crystal silicon rods, and the single crystal silicon rods are transported to the second After accommodating between the pair of second grinding wheels 44 in the space, the second grinding wheel 44 can contact the single crystal silicon rod for corresponding processing operations.

In practical applications, the single crystal silicon rod is first transferred to the second processing position of the silicon rod processing platform by the silicon rod switching device 5, and the single crystal silicon rod is positioned by the silicon rod positioning mechanism 53 and the single crystal silicon rod is rotated. The second grindstone 43 performs a rounding operation on the joint facet of the single crystal silicon rod.

The spheronization processing operation may include, for example, positioning the single crystal silicon rod by the silicon rod positioning mechanism 53 such that a pair of the second grinding wheel 44 of the second grinding tool 43 is facing the side of the single crystal silicon rod, a pair of second The spacing between the grinding wheels 44 is smaller than the current diagonal spacing of the single crystal silicon rods, the difference between the two spacings being the feed amount of the at least one pair of second grinding wheels 44; the single crystal silicon rods in the second receiving The space is driven by the silicon rod positioning mechanism 53 to rotate, and the pair of second grinding wheels 44 grind a pair of connecting prism faces corresponding to a pair of chamfers of the single crystal silicon rod in the rotation into an arc shape, wherein When the crystal silicon rod is contacted and ground by the second grinding wheel 44, the rotation speed is slow, and the single crystal silicon rod is rotated by the second grinding wheel 44 after the connecting prism face is ground, and the rotation speed is faster, and the single crystal silicon rod continues to rotate. And causing another pair of connecting facets corresponding to the other pair of chamfers to contact the second grinding wheel 44 and being ground into a circular arc shape by the second grinding wheel 44; the pair of second grinding wheels 44 continue downward, as in the foregoing steps, for the single crystal Grinding and rounding of each joint facet of the lower section of the silicon rod until the grinding is rounded to a single At the bottom of the silicon rod, a single connection of the single crystal silicon rod is completed, and the rounding is performed; the feed amount is continuously increased, the pair of second grinding wheels 44 are driven to move from the bottom to the top, and the single grinding wheel 44 is ground by the second grinding wheel 44. Each connecting facet; thus, grinding, increasing the feed amount, back grinding, increasing the feed amount, after repeated several times, the joint facet of the single crystal silicon rod can be ground to a predetermined size and integrally rounded, That is, the connecting facet and the side are smoothly transitioned. Then, the single crystal silicon rod is positioned and adjusted by the silicon rod positioning mechanism 53, so that a pair of side surfaces of the single crystal silicon rod correspond to a pair of second grinding tools 43, and the side surface of the single crystal silicon rod is performed by the second grinding tool 43. Fine grinding operations.

The refining processing operation may be, for example, positioning adjustment of the single crystal silicon rod by the silicon rod positioning mechanism 53 such that the first pair of side surfaces of the single crystal silicon rod correspond to the pair of second grinding tools 43 and the pair of second grinding tools The second grinding wheel 44 of 43 performs a finishing grinding operation on the first pair of side faces of the single crystal silicon rod; subsequently, the single crystal silicon rod is positioned and adjusted by the silicon rod positioning mechanism 53 so that the second pair of sides of the single crystal silicon rod Corresponding to the pair of second grindstones 43, the second pair of side faces of the single crystal silicon rods are subjected to a finish grinding operation by the second grinding wheel 44 of the pair of second grindstones 43. Wherein, the finishing grinding operation of any pair of sides may include, for example, providing a feed And driving a second grinding wheel 44 of the pair of second grinding tools 43 to move from top to bottom to grind a pair of sides of the single crystal silicon rod; a pair of second grinding wheels 44 are ground to the bottom of the single crystal silicon rod and pass through the single After the crystalline silicon rod stays at the lower limit position, a feed amount is further increased, and the pair of second grinding wheels 44 are driven to move from bottom to top to grind the single crystal silicon rod; after the pair of second grinding wheels 44 are ground to the top of the single crystal silicon rod, After passing through the single crystal silicon rod, staying at the upper limit position, continue to increase a feed amount, driving a pair of second grinding wheels 44 to move from top to bottom to grind the single crystal silicon rod; thus, grinding, increasing the feed amount, and back grinding The feed amount is increased, and after repeated several times, a pair of sides of the single crystal silicon rod can be ground to a predetermined size.

As can be seen from the above description, in an alternative embodiment, the spheronization and refining device 4 as the second processing device performs rounding and fine grinding on the single crystal silicon rod by first joining the face grinding and then grinding the side surface. The polishing process is not limited thereto. In other modified embodiments, the spheronization and refining operation of the spheronization and refining device 4 on the single crystal silicon rod may also be performed by first side grinding and then joining the face grinding. The grinding process should have the same technical effect.

Hereinafter, the silicon rod 100 will be described as an example of a polycrystalline silicon rod.

In the case where the silicon rod 100 is a polycrystalline silicon rod, the first processing device 3 is a coarse grinding device, and the second processing device 4 is a chamfering and refining device.

The coarse grinding device 3 as the first processing device is disposed on the machine base 1 and located in the first processing zone of the silicon bar processing platform for rough grinding the polycrystalline silicon rod. The rough grinding device 3 has a first receiving space for receiving a polycrystalline silicon rod conveyed by the conveying body 51 in the silicon rod switching device 5. The coarse grinding device 3 mainly includes a first frame 31 and at least one pair of first grinding tools 33, and at least one pair of first grinding tools 33 are oppositely disposed on the first frame 31 for facing the first processing area. The polycrystalline silicon rod on the silicon rod switching device 5 performs a rough grinding operation. Further, each of the first grinding tools 33 further includes a first main shaft 32 and a first grinding wheel 34, wherein the mounting surface of the first main shaft 32 and the first frame 31 is provided with a lateral sliding guiding mechanism and a longitudinal sliding guide The mechanism, the lateral sliding guide mechanism may employ, for example, a combination of a slide rail and a slider, and the longitudinal slide guide mechanism may employ, for example, a combination of a slide rail and a slider. By using the lateral sliding guiding mechanism, the first main shaft 32 or the first grinding wheel 34 can be moved forward and backward relative to the first frame 31, and the longitudinal sliding guiding mechanism can make the first main shaft 32 relatively opposite to the first frame. 31 for vertical movement up and down.

In a practical application, at least one pair of first abrasive tools 33 are disposed on a grinding tool base, and the grinding tool base is longitudinally slidably coupled to the first frame 31 by a longitudinal sliding guiding mechanism, at least one pair a grinding tool 33 is slidably coupled to the grinding tool base by a lateral sliding guiding mechanism, wherein the grinding tool base is controlled by a lifting motor and the longitudinal sliding guiding mechanism is longitudinally slid to the first frame 31, Each of the at least one pair of first abrasives 33 is independently controlled by an advance and retreat motor to slide laterally to the abrasive base. The first grinding wheel 34 is disposed at the working end of the first main shaft 32 and has a first size of first frosted particles. Here, the polycrystalline silicon rod to be processed is a silicon square body having a rectangular cross section, and has four side faces and four corners. Therefore, a pair of first grinding tools 33 in the rough grinding device 3 are disposed oppositely, and a polycrystalline silicon rod is reserved between the two. The first receiving space, when the polycrystalline silicon rod is transported between the pair of first grinding wheels 34 in the first receiving space, the first grinding wheel 34 can contact the opposite pair of sides or a pair of corners of the polycrystalline silicon rod Corresponding rough grinding operations.

In practical applications, the polysilicon rod is first transferred to the first processing location of the silicon rod processing platform by the silicon rod switching device 5, and the polysilicon rod is positioned and adjusted by the silicon rod positioning mechanism 53 so that a pair of sides in the polycrystalline silicon rod correspond to The pair of first grindstones 33 perform rough grinding processing on the side faces of the polycrystalline silicon rods by the first grindstone 33.

The rough grinding processing operation may be, for example, positioning adjustment of the polycrystalline silicon rod by the silicon rod positioning mechanism 53 such that the first pair of side faces of the polycrystalline silicon rod correspond to the pair of first abrasive tools 33, and the first one of the pair of first abrasive tools 33 a grinding wheel 34 performs a rough grinding operation on the first pair of sides of the polysilicon rod; then, the polysilicon rod is positioned and adjusted by the silicon rod positioning mechanism 53 such that the second pair of sides of the polycrystalline rod correspond to the pair of first abrasives 33, The second pair of sides of the polysilicon rod are rough-milled by the first grinding wheel 34 of the pair of first grinding tools 33, wherein the rough grinding operation of any pair of sides may include, for example, providing a feed amount, driving The first grinding wheel 34 of the pair of first grinding tools 33 moves from top to bottom to grind a pair of sides of the polycrystalline silicon rod; a pair of first grinding wheels 34 are ground to the bottom of the polycrystalline silicon rod and pass through the polycrystalline silicon rod to stay at the lower limit. Adding a feed amount, driving a pair of first grinding wheels 34 to move from bottom to top to grind the polycrystalline silicon rod; after grinding a pair of first grinding wheels 34 to the top of the polycrystalline silicon rod and passing through the polycrystalline silicon rod, staying at the upper limit position, continue to increase one Giving a quantity, driving a pair of first grinding wheels 34 to move from top to bottom to grind the polycrystalline silicon rod; thus, grinding, increasing the feed amount, back grinding, increasing the feed amount, and after repeating several times, one of the polycrystalline silicon rods can be Grind the side to the preset size.

The chamfering and refining device as the second processing device is disposed on the machine base 1 and located in the second processing position of the silicon rod processing platform for inverting the polycrystalline silicon rod after the coarse grinding processing operation by the rough grinding device 3 Corner and fine grinding operations. The chamfering and refining device 4 has a second receiving space for receiving the polycrystalline silicon rods conveyed by the conveying body 51 in the silicon rod switching device 5. The chamfering and refining device 4 mainly comprises a second frame 41 and at least one pair of second grinding tools 43. The at least one pair of second grinding tools 43 are oppositely disposed on the second frame 41 for the second processing. The polycrystalline silicon rods on the silicon rod switching device 5 at the location are chamfered and finished.

In a practical application, at least one pair of second grinding tools 43 are disposed on a base of the grinding tool, and the base of the grinding tool is longitudinally slidably coupled to the second frame 41 by a longitudinal sliding guiding mechanism, at least one pair The two grinding tools 43 are laterally slidably coupled to the grinding tool base by a lateral sliding guiding mechanism, wherein the grinding tool base is controlled by a lifting motor and longitudinally sliding The guiding mechanism slides longitudinally on the second frame 41, and each of the at least one pair of second grinding tools 43 is independently controlled by an advance and retreat motor to slide laterally to the grinding tool base. The second grinding wheel 44 is disposed at the working end of the second main shaft 42 and has a second size of second frosted particles. In contrast, the second frosted particles in the second grinding wheel 44 have a smaller granularity than the coarse grinding device 3 The particle size of the first matte particles in a grinding wheel 34. Therefore, the pair of second grinding tools 43 in the chamfering and refining device 4 are disposed oppositely with a second receiving space for accommodating the polycrystalline silicon rods, and the polycrystalline silicon rods are transported into the second receiving space. After the pair of second grinding wheels 44, the second grinding wheel 44 can contact the polycrystalline silicon rods for corresponding chamfering operations.

In practical applications, the polysilicon rod is first transferred to the second processing location of the silicon rod processing platform by the silicon rod switching device 5, and the polysilicon rod is positioned by the silicon rod positioning mechanism 53 and the polycrystalline silicon rod is rotated so that the corners of the polycrystalline silicon rod correspond to one For the second grinding wheel 44 of the second grinding tool 43, the polycrystalline silicon rod is chamfered by the second grinding tool 43.

The chamfering operation may include, for example, first rotating the silicon rod positioning mechanism 53 by a certain angle when chamfering such that the first pair of corners of the polysilicon rod correspond to the second grinding wheel 44 of the pair of second grinding tools 43; The second grinding wheel 44 is lowered to the grinding position. At this time, the spacing between the pair of second grinding wheels 44 is smaller than the current diagonal spacing of the first pair of corners in the polycrystalline silicon rod, and the difference between the two spacings is the pair. The feed amount of the second grinding wheel 44, the pair of second grinding wheels 44 move downward to grind the first pair of corners in the silicon rod 100 to form a chamfered surface; the pair of second grinding wheels 44 continue downward, as in the foregoing steps Grinding the first pair of corners of the lower section of the silicon rod 100 until grinding to the bottom of the silicon rod 100, completing the single angular grinding of the silicon rod 100; continuing to increase the feed amount and driving the second grinding tool 43 moving from bottom to top, grinding the first pair of corners of the silicon rod 100 by the second grinding wheel 44; thus, grinding, increasing the feed amount, reverse grinding, increasing the feed amount, after repeated several times, The first pair of corners of the silicon rod 100 are ground to a predetermined size to form a first pair of chamfered faces. Then chamfering and fine grinding the second pair of corners: when chamfering, first rotating the silicon rod positioning mechanism 53 by a certain angle so that the second pair of corners of the polysilicon rod correspond to the second of the pair of second abrasives 43 The grinding wheel 44; the pair of second grinding wheels 44 are lowered to the grinding position, at which time the spacing between the pair of second grinding wheels 44 is smaller than the current diagonal spacing of the second pair of corners in the silicon rod 100, the two spacings The gap is the feed amount of the pair of second grinding wheels 44. The pair of second grinding wheels 44 move downward to grind the second pair of corners in the silicon rod 100 to form a chamfered surface; the pair of second grinding wheels 44 continue Downward, as in the foregoing steps, the second pair of corners of the lower section of the silicon rod 100 is ground until grinding to the bottom of the silicon rod 100, completing the single angular grinding of the silicon rod 100; continuing to increase the feed amount Driving the second grinding tool 43 from bottom to top, grinding the second pair of corners of the silicon rod 100 by the second grinding wheel 44; thus, grinding, increasing the feed amount, reverse grinding, increasing the feed amount, repeating After a few times, the second pair of corners of the silicon rod 100 can be ground to a predetermined size to form a second pair of chamfers. .

Then, the polysilicon rod is positioned by the silicon rod positioning mechanism 53 and the polysilicon rod is rotated so that the side surface of the polysilicon rod corresponds to the second grinding wheel 44 of the pair of second grinding tools 43 and the polycrystalline silicon rod is refined by the second grinding tool 43. Grinding operations. Fine The grinding operation may include, for example, positioning adjustment of the polycrystalline silicon rod by the silicon rod positioning mechanism 53 such that the first pair of side faces of the polycrystalline silicon rod correspond to a pair of second abrasive tools 43 and the second of the pair of second abrasive tools 43 The grinding wheel 44 performs a finishing grinding operation on the first pair of sides of the polysilicon rod; then, the polysilicon rod is positioned and adjusted by the silicon rod positioning mechanism 53 such that the second pair of sides of the polycrystalline rod correspond to the pair of second grinding tools 43 The second grinding wheel 44 of the pair of second grinding tools 43 performs a finishing grinding operation on the second pair of side faces of the polycrystalline silicon rod, wherein the finishing operation of any pair of side surfaces may include, for example, providing a feed amount, driving one The second grinding wheel 44 of the second grinding tool 43 is moved from top to bottom to grind a pair of sides of the polycrystalline silicon rod; a pair of second grinding wheels 44 are ground to the bottom of the polycrystalline silicon rod and pass through the polycrystalline silicon rod to stay at the lower limit position, and then Increasing a feed amount, driving a pair of second grinding wheels 44 to move from bottom to top to grind the polycrystalline silicon rod; after grinding a pair of second grinding wheels 44 to the top of the polycrystalline silicon rod and passing through the polycrystalline silicon rod, staying at the upper limit position, continue to increase one Giving a quantity, driving a pair of second grinding wheels 44 to move from top to bottom to grind the polycrystalline silicon rod; thus, grinding, increasing the feed amount, back grinding, increasing the feed amount, and after repeating several times, one of the polycrystalline silicon rods can be Grind the side to the preset size.

It should be noted that the above is merely an exemplary description, and is not intended to limit the scope of protection of the present application, for example, in the description of the machining operation of the chamfering and refining device as the second processing device. The chamfering operation of the polycrystalline silicon rod is performed first, and then the refining processing operation of the polycrystalline silicon rod is performed, but not limited thereto. In other embodiments, the polycrystalline silicon rod is first subjected to the finishing processing operation and then the polycrystalline silicon is executed. Rod chamfering operations are also possible and should still fall within the scope of this application.

Subsequently, after the silicon rod 100 is processed by the first processing device 3 and the second processing device 4, the silicon rod switching device 5 converts the silicon rod from the second processing position to the pretreatment position, and then the silicon rod loading and unloading device The processed silicon rods are unloaded from the pretreatment zone of the silicon rod processing platform. Of course, before unloading the silicon rod 100, if necessary, in the pretreatment position, the flatness detection of the silicon rod 100 after the processing operation can still be performed by the flatness detector. Using the flatness detector, on the one hand, it is possible to check whether the silicon rod meets the product requirements after each processing operation by detecting the flatness of the silicon rod 100 to determine the effect of each processing operation; on the other hand, through the silicon rod The flatness measurement of 100 can also indirectly obtain the wear condition of the processed parts in each processing device, so as to facilitate calibration or correction, or even repair or replacement in real time.

It should be added that in the silicon rod multi-station processing machine of the present application, a silicon rod polishing device may also be included. The silicon rod polishing device can be disposed on the base for polishing the silicon rod.

For the silicon rod polishing device, generally, after the silicon rod is processed by the first processing device and the second processing device, the surface of the silicon rod still has some unevenness such as depressions and protrusions, and therefore, the silicon rod is required. Perform corresponding polishing operations to improve the surface of the silicon rod to achieve high flatness and smooth surface finish. The silicon rod polishing device mainly comprises a polishing frame and at least one pair of polishing units, and at least one pair of polishing units are oppositely disposed on the polishing frame for polishing the silicon rods on the silicon rod conversion device located at the polishing processing position. operation.

Further, each polishing unit further includes a polishing spindle and a polishing brush, wherein the polishing spindle and the mounting surface of the polishing frame are provided with a lateral sliding guiding mechanism and a longitudinal sliding guiding mechanism, and the lateral sliding guiding mechanism can be The longitudinal sliding guide mechanism may employ, for example, a combination of a slide rail and a slider, or the like, using, for example, a combination of a slide rail and a slider. By using the lateral sliding guiding mechanism, the polishing spindle or the polishing brush can be moved forward and backward transversely with respect to the polishing frame, and the longitudinal sliding guiding mechanism can be used to vertically move the polishing spindle vertically relative to the polishing frame. The polishing brush is disposed at the working end of the polishing spindle. In an alternative embodiment, the polishing brush can be, for example, an annular brush that can be controlled to rotate.

In the case where the silicon rod is a single crystal silicon rod, the polishing operation of the single crystal silicon rod by the silicon rod polishing apparatus may further include: firstly transferring the single crystal silicon rod to the polishing processing of the silicon rod processing platform by using the silicon rod conversion device. Positioning, positioning the single crystal silicon rod by the silicon rod positioning mechanism and rotating the single crystal silicon rod, driving the polishing brush in at least one pair of polishing units to rotate, and polishing the connecting prism surface of the single crystal silicon rod by the polishing brush , wherein the spacing between the polishing brushes in the at least one pair of polishing units is smaller than the spacing between the two connecting prism faces that are diagonal; then, the positioning of the single crystal silicon rods is adjusted by the silicon rod positioning mechanism, The first pair of sides of the single crystal silicon rod are corresponding to a pair of polishing units, and the first pair of sides of the single crystal silicon rod are polished by a polishing brush in a pair of polishing units; then, the single rod is positioned by the silicon rod positioning mechanism The silicon rod is positioned and adjusted such that the second pair of sides of the single crystal silicon rod correspond to a pair of polishing units, and the second pair of sides of the single crystal silicon rod are polished by a polishing brush in a pair of polishing units.

Wherein, when polishing the connecting facet of the single crystal silicon rod: the single crystal silicon rod is always rotating, the polishing brush is also always rotated, and the pair of polishing brushes continue downward, the next section of the single crystal silicon rod Each joint facet is polished until it is polished to the bottom of the single crystal silicon rod, and the single-crystal silicon rod is single-joined and polished; then a pair of polishing brushes are driven to move from bottom to top, and the polishing brush continues to polish the single The connecting facets of the crystalline silicon rods; thus, after repeated several times, the joint faces of the single crystal silicon rods can be polished to a high flatness and a smooth surface; when polishing the sides of the single crystal silicon rods, The polishing of any pair of sides may include, for example, the single crystal silicon rod being positioned by the silicon rod positioning mechanism to provide a feed amount, driving the polishing brush in the pair of polishing units to move from top to bottom to polish the single crystal silicon. a pair of sides of the rod; a pair of polishing brushes are polished to the bottom of the single crystal silicon rod and passed through the single crystal silicon rod, and then a pair of polishing brushes are driven to move from bottom to top to polish the single crystal silicon rod; thus, the number of repetitions After each time, each of the single crystal silicon rods can be Side polished to a high flatness and surface finish effect.

In addition, as can be seen from the above description, in an alternative embodiment, the polishing process of the silicon rod polishing apparatus for the single crystal silicon rod is performed by first connecting the surface polishing after the prism surface polishing, but not by this. In other modified embodiments, the polishing operation of the silicon rod polishing apparatus on the single crystal silicon rod may also be performed by the process of first side polishing and connecting the prism surface polishing, and the same technical effect should be obtained.

In the case where the silicon rod is a polycrystalline silicon rod, the polishing operation of the polycrystalline silicon rod by the silicon rod polishing apparatus may further include: first transferring the polycrystalline silicon rod to the polishing processing position of the silicon rod processing platform by using the silicon rod conversion device, and positioning by the silicon rod Institution Positioning and adjusting the polysilicon rod such that the first pair of sides of the polysilicon rod correspond to a pair of polishing units, and the first pair of sides of the polysilicon rod are polished by a polishing brush in a pair of polishing units; and then, the silicon rod positioning mechanism is used The polycrystalline silicon rod is positioned and adjusted such that the second pair of sides of the polycrystalline silicon rod correspond to a pair of polishing units, and the second pair of sides of the polycrystalline silicon rod are polished by a polishing brush in a pair of polishing units. The polishing of any pair of sides may include, for example, the polysilicon rod being positioned by the silicon rod positioning mechanism to provide a feed amount, driving the polishing brush in the pair of polishing units to move from top to bottom to polish the polycrystalline silicon rod. a pair of sides; a pair of polishing brushes are polished to the bottom of the polycrystalline silicon rod and passed through the polycrystalline silicon rods, and then a pair of polishing brushes are driven to move from bottom to top to polish the polycrystalline silicon rods; thus, after repeated times, the polycrystalline silicon rods can be Each side is polished to a high flatness and a smooth surface.

Furthermore, in an alternative embodiment, in addition to the polishing operations on the respective sides of the polycrystalline silicon rods, the respective chamfered surfaces of the polycrystalline silicon rods may be subjected to a polishing operation. When performing the polishing operation on the chamfered surface, the polysilicon rod is first positioned and adjusted by the silicon rod positioning mechanism, so that the first pair of chamfered surfaces of the polycrystalline silicon rod correspond to a pair of polishing units, and are polished by a pair of polishing units. Brushing the first pair of sides of the polysilicon rod; then, positioning the polysilicon rod by the silicon rod positioning mechanism, so that the second pair of sides of the polysilicon rod correspond to a pair of polishing units, polished by a pair of polishing units The brush polishes the second pair of sides of the polysilicon rod. For the specific operation process of polishing the diagonal surface, refer to the foregoing description of the process of polishing the side surface, which will not be described herein.

Further, in the silicon rod multi-station processing machine of the present application, in an alternative embodiment, a silicon rod cleaning device may also be included. The silicon rod cleaning device can be disposed on the base for performing and cleaning the silicon rod. For the silicon rod cleaning device, generally, after the silicon rod is processed by the first processing device and the second processing device, or the first processing device, the second processing device, and the third processing device, the cutting process is generated during the operation. The chips adhere to the surface of the silicon rod, so if necessary, the silicon rod needs to be cleaned as necessary. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning liquid spraying device matched with the cleaning brush head. When cleaning, the cleaning liquid spraying device sprays the cleaning liquid against the silicon rod, and at the same time, The motor-driven cleaning brush head acts on the silicon rod to complete the cleaning operation. In a practical application, the cleaning liquid may be, for example, pure water, and the cleaning brush head may be, for example, a rotary brush head.

In particular, if the silicon rod multi-station processing machine adds a corresponding processing device, the functional location on the silicon rod processing platform and the number of the silicon rod positioning mechanisms on the transport body and their positional relationship need to be corresponding. Adjustment. Assume that a silicon rod multi-station processing machine adds a processing device (for example, a silicon rod polishing device), and a functional position (for example, a polishing processing position) is added to the silicon rod processing platform, and the conveying body is also increased by one. Silicon rod positioning mechanism. Further, preferably, the angles set between the two silicon rod positioning mechanisms are also consistent with the angular distribution between the two functional areas. Thus, when one of the silicon rod positioning mechanisms corresponds to a certain functional position, the other three silicon rod positioning mechanisms also correspond to the other three functional positions, respectively. In this way, in the flow of work, at any time, when each When the silicon rod positioning mechanism is positioned with a silicon rod and the silicon rod positioning mechanism corresponds to the functional position, the silicon rods are located at a corresponding functional position to perform corresponding processing operations. In an alternative embodiment, the four functional zones on the silicon rod processing platform are distributed at a 90° angle between each other, and accordingly, corresponding to the disc-shaped or circular transport body. The four silicon rod positioning mechanisms are also distributed at 90° between the two.

The present application further discloses a silicon rod multi-station processing method for performing multi-station processing on a silicon rod. In one embodiment, the silicon rod multi-station processing method is applied to a silicon rod multi-station processing machine, and the silicon rod multi-station processing machine includes a silicon rod processing platform, a silicon rod loading and unloading device, a first processing device, A second processing apparatus, and a silicon rod converting apparatus, wherein the silicon rod processing platform has a pretreatment location, a first processing location, and a second processing location.

Please refer to FIG. 7 , which is a schematic flowchart of an embodiment of a silicon rod multi-station processing method according to the present application. As shown in FIG. 7, the method for processing a silicon rod multi-station of the present application comprises the following steps:

Step S101 is a pretreatment step of the first silicon rod: the silicon rod loading and unloading device loads the first silicon rod to be processed into a pretreatment position of the silicon rod processing platform, and the first silicon rod located at the pretreatment position Pretreatment is performed. Through step S101, loading and pretreatment of the first silicon rod can be completed.

Step S103: performing a first processing operation on the first silicon rod and a pre-processing step of the second silicon rod: rotating the silicon rod switching device by a first predetermined angle to convert the pre-processed first silicon rod from the pre-processing position to the first a processing location; causing the first processing device to perform a first processing operation on the first silicon rod on the first processing location; at this stage, the silicon rod loading and unloading device loads the second silicon rod to be processed into the pretreatment location and performs Pretreatment. Through the step S103, the first processing operation is performed on the first silicon rod converted to the first processing location, and at the same time, the loading and pre-processing of the second silicon rod are completed.

Step S105: performing a second processing operation on the first silicon rod, a first processing of the second silicon rod, and a pre-processing step of the third silicon rod: rotating the silicon rod switching device by a second predetermined angle to complete the first processing operation Converting the first silicon rod from the first processing location to the second processing location and converting the pre-processed second silicon rod from the pre-processing location to the first processing location; causing the second processing device to be the first in the second processing location The silicon rod performs a second processing operation. At this stage, the first processing device performs a first processing operation on the second silicon rod on the first processing location and causes the silicon rod loading and unloading device to load the third silicon rod to be processed in the pre-process. The location is processed and pre-processed. Step S105, performing a second processing operation on the first silicon rod converted to the second processing location, performing a first processing operation on the second silicon rod converted to the first processing location, and simultaneously completing loading of the third silicon rod and Pretreatment.

As can be seen from the above, for the silicon rod processing operation (refer to the first silicon rod), the silicon rod can perform the loading, the first processing operation, and the second processing operation in an orderly and seamless manner, and the plurality of processing steps can be The completion of a multi-station processing machine has effectively improved the integrity and production efficiency of the silicon rod processing operation, and ensured the quality of product processing operations. In addition, a plurality of silicon rods can perform corresponding processing operations at different processing locations at the same time, independently and without mutual interference, forming a processing operation of the pipeline, which greatly improves the efficiency of the silicon rod processing operation.

In fact, the silicon rod multi-station processing method of the present application may further include other subsequent steps. Referring to FIG. 8, the silicon rod multi-station processing method of the present application may further include:

Step S107: discharging the first silicon rod, performing the second processing operation of the second silicon rod, and performing the first processing operation of the third silicon rod: rotating the silicon rod switching device by a third predetermined angle to complete the second processing operation Converting the first silicon rod from the second processing location to the pre-processing location and converting the second silicon rod that completes the first processing operation from the first processing location to the second processing location and the third silicon rod that will complete the pre-processing Processing the location to be converted to the first processing location; causing the silicon rod handling device to unload the first silicon rod on the pretreatment location and loading the fourth silicon rod to be processed into the pretreatment location and located at the pretreatment location The fourth silicon rod is pretreated, at this stage, the second processing device performs a second processing operation on the second silicon rod on the second processing location and the third processing rod on the first processing location Perform the first machining operation. In step S107, the first silicon rod that completes the second processing operation is converted to the pretreatment location and then unloaded, and the second silicon processing rod converted to the second processing location is subjected to the second processing operation, and the second processing operation is performed on the second processing location. The third silicon rod performs the first processing operation, and at the same time, the loading and pre-processing of the fourth silicon rod is completed, and the corresponding processing operations are performed in an orderly manner in each processing area.

In practical applications, it should be specially noted that for different types of silicon rods, the first processing operation of the silicon rod by the first processing device and the second processing operation of the silicon rod by the second processing device may be different. The change combination example. For example, if the silicon rod 100 is a single crystal silicon rod, the first processing device 3 may be a tangential and coarse grinding device and the second processing device 4 may be a spheronization and refining device; if the silicon rod 100 is a polycrystalline silicon rod, then A processing device 3 can be a coarse grinding device and a second processing device can be a chamfering and refining device.

Hereinafter, in combination with the above-described FIG. 7, the different processing operations of the single crystal silicon rod and the polycrystalline silicon rod will be described for the silicon rod multi-station processing method in the above embodiment.

Take a single crystal silicon rod as an example:

In step S101, pre-processing the first silicon rod located at the pre-processing location includes: causing the flatness detector to perform planar flatness detection on the first silicon rod.

In step S103, the first processing device performs a first processing operation on the first silicon rod on the first processing location, including: circumcising the first silicon rod on the first processing location by the tangential and coarse grinding device And rough grinding processing. The tangential and rough grinding operations further include: first using a tangential and coarse grinding device to join the joint facets in the first silicon rod at the first processing location The circular cutting operation is performed such that the connection between the respective connecting facets and the adjacent side faces forms a preliminary curved connection; afterwards, the side faces of the first silicon rod are rough-grounded by a tangential and coarse grinding device.

In step S105, the second processing device performs a second processing operation on the first silicon rod on the second processing location, including: spheronizing and refining the first silicon rod on the second processing location. Grinding operations. The spheronization and refining operations further include: first performing a spheronization operation on the first silicon rod by using a spheronization and refining device, and grinding the joint facets in the first silicon rod so that the joint facets in the first silicon rod are The side is smooth and smooth; afterwards, the side of the first silicon rod is subjected to a fine grinding operation by means of a spheronization and a refining device.

Take the polysilicon rod as an example:

In step S103, the first processing device is caused to perform a first processing operation on the first silicon rod on the first processing location, including: causing the coarse grinding device to perform a rough grinding operation on the first silicon rod on the first processing location.

In step S105, the second processing device performs a second processing operation on the first silicon rod on the second processing location, including: chamfering and refining the first silicon rod on the second processing location And fine grinding operations. The chamfering and finishing operations further include: first performing a rounding operation on the first silicon rod by using a chamfering and refining device, grinding the corners of the first silicon rod to form a chamfered surface; and then using chamfering and finening The grinding device performs a finishing grinding operation on the side surface of the first silicon rod.

The silicon rod multi-station processing method of the present application can utilize the silicon rod loading and unloading device to load and unload the silicon rod quickly, smoothly and without damage, and the silicon rod switching device can order the silicon rods between the processing devices in an orderly and seamless manner. The ground transfer and automation realize the multiple process operations of the silicon rod processing, and the plurality of processing devices can simultaneously perform corresponding processing operations on the corresponding silicon rods, thereby improving production efficiency and quality of product processing operations.

In the following, in conjunction with FIG. 9 to FIG. 24, the silicon rod multi-station processing machine of the present application is described in detail in some examples to perform a silicon rod multi-station processing operation. In the following examples, the first setting is as follows: the silicon rod may be a single crystal silicon rod or a polycrystalline silicon rod, wherein: the single crystal silicon rod to be processed is a substantially square rectangular silicon square body having four sides. A connecting facet having an R angle is formed between the adjacent two side faces; the polycrystalline silicon rod to be processed is a silicon square body having a rectangular cross section, and has four sides and four corners. The silicon rod multi-station processing machine used includes a silicon rod processing platform, a silicon rod loading and unloading device, a first processing device, a second processing device, and a silicon rod conversion device. Of course, the silicon rod multi-station processing machine may further comprise Height detector, flatness detector, etc. In addition, the silicon rod processing platform is provided with a pretreatment position, a first processing position, and a second processing position, and the pretreatment position, the first processing position, and the second processing position are sequentially set according to the process of the silicon rod processing operation, and Correspondingly, the silicon rod switching device is also provided with three silicon rod positioning mechanisms, wherein the pretreatment position, the first processing position, and the second processing position are distributed at 120° between the two, so that three silicon rod positioning mechanisms are provided. There is also a 120° distribution between the two. Here, fake It is assumed that the direction according to the order of the pre-processing area, the first processing area, and the second processing area is positive, and the direction opposite to the forward direction is reverse.

In step 1, the first silicon rod to be processed is placed on the workpiece carrier of the silicon rod handling device. In the present embodiment, the first silicon rod 101 is placed upright on the silicon rod carrier 21, and the operation of placing the first silicon rod 101 on the silicon rod carrier 21 in the silicon rod loading and unloading position can be manually performed. It can be implemented with a corresponding jig, which can be, for example, a silicon rod transfer jig. In addition, if necessary, the angle of the first silicon rod 101 on the silicon rod carrier 21 can be adjusted by rotating the silicon rod carrier 21, which can be placed, for example, at 45°, that is, two of the first silicon rods 101. The diagonal lines correspond to the side shift direction (X-axis direction) and the translation direction (Y-axis direction), respectively. For the state of the silicon rod multi-station processing machine after the above operation is implemented, refer to FIG. 9. FIG. 9 is a schematic view showing a state in which the silicon rod is placed upright on the silicon rod carrier.

In step 2, the first silicon rod to be processed is loaded into the pretreatment zone of the silicon rod processing platform. In the present embodiment, the first silicon rod 101 to be processed is loaded into the pretreatment position of the silicon rod processing platform 11 by the silicon rod holder 25 in the silicon rod handling device 2. Specifically, first, it is ensured that the silicon rod jig 25 in the silicon rod loading and unloading device 2 corresponds to the silicon rod loading and unloading position, for example, by driving the reversing carrier 23 for the reversing movement, so that the silicon rod jig 25 of the reversing carrier 23 is caused. Switching to the silicon rod loading and unloading position; subsequently, driving the clamping arm 254 in the silicon rod holding member 253 to perform a lowering operation to be transferred from the released state to the clamping state and holding the first silicon rod 101, and performing the above operation of the silicon For the state of the bar multi-station processing machine, refer to FIG. 10, which is a schematic view showing a state in which the silicon rod is clamped by the silicon rod clamp; then, the first silicon rod 101 is detached from the silicon rod loading and unloading position. In the detachment operation, in an alternative embodiment, the silicon rod holder 253 is kept in a clamped state, and the silicon rod carrier 21 in the silicon rod loading and unloading position is used for the descending movement, so that the first silicon rod 101 is separated from the silicon rod. The carrier 21; in another alternative embodiment, the driving movement of the silicon rod holder 253 (the silicon rod holder 253 is a movable design) to drive the first silicon rod 101 away from the silicon rod carrier 21; then, the commutation carrier 23 is driven to perform a reversing motion (for example, 180° rotation), so that the silicon rod clamp 25 on the reversing carrier 23 is switched from the silicon rod loading and unloading position to the pretreatment position; then, the first silicon is The rod 101 is placed on the rotating stage 531 of the first silicon rod positioning mechanism 53 at the pre-processing position, and is rotated by the rotary pressing device 533 of the first silicon rod positioning mechanism 53 by the lifting driving device to press the first A silicon rod 101 is positioned, and the state of the silicon rod multi-station processing machine after performing the above operation can be specifically seen in FIG. 11. FIG. 11 is a schematic view showing a state in which the silicon rod is placed in the pretreatment position by the reversing carrier.

It should be noted that, in an alternative embodiment, the height of the first silicon rod 101 may also be detected by the height detector 7 before the first silicon rod is clamped by the silicon rod clamp 25, such that the silicon rod clamp 25 The silicon rod holder 253 can be moved upward or downward according to the detection result of the height detector 7 to adjust the nip distance between the plurality of silicon rod holders 253, and the silicon rod is more than the above operation. The state of the station processing machine can be specifically seen in FIG. 12, and FIG. 12 shows a state in which the height detector detects the height of the silicon rod on the loading and unloading platform.

In step 3, planar flatness detection is performed on the first silicon rod at the pretreatment location. The state of the silicon rod multi-station processing machine after the above operation is specifically shown in FIG. 13 and FIG. 14, which is a schematic diagram showing the state in which the flatness detector detects the flatness of the silicon rod.

In the present embodiment, the planar flatness detection of the first silicon rod 101 at the pretreatment location is performed by a flatness detector. Specifically, the reversing carrier 23 is driven to perform a reversing motion (for example, 180° rotation), so that the flatness detector on the reversing carrier 23 is switched from the silicon rod loading and unloading position to the pretreatment position, wherein the silicon rod clamp 25 and The flatness detectors are respectively disposed on the first mounting surface and the second mounting surface disposed opposite to each other in the reversing carrier 23, and at this stage, if necessary, by driving the rotary pressing device 533 of the first silicon rod positioning mechanism 53 Rotating motion to adjust the angle of the first silicon rod 101, for example, driving the first silicon rod 101 to rotate by 45°, so that the first silicon rod 101 corresponds to the lateral direction (X-axis direction) and the translation direction by the original two diagonal lines, respectively. (Y-axis direction) is adjusted so that the adjacent two sides correspond to the side shift direction and the translation direction, that is, one of the sides is opposite to the flatness detector on the reversing carrier 23; then, the flatness is detected The device performs planar flatness detection on the four sides of the first silicon rod 101, and the planar flatness detection of any one of the sides further includes: controlling the detector shifting mechanism by the detecting controller to drive the contact detector 61 to shift and control the contact Type detector 61 in order Measuring a first silicon rod in each detection point on the side surface 101 of the current to be measured.

Specifically, in one aspect, detecting, for each of the detection points in any one of the to-be-measured surfaces, includes: controlling, by the detection controller, a detector displacement mechanism (including a first direction shifting mechanism, a second direction shifting mechanism, and The third direction shifting mechanism drives the contact type detector to shift in the moving plane such that the contact type detector corresponds to the current detection point to be tested; the detection controller controls the detector shifting mechanism (mainly the second direction shift) The positional mechanism drives the contact detector to move toward the current detection point to be tested until it contacts the silicon rod. At this time, the detection controller receives the conduction signal (or the disconnection signal) sent from the contact detector and Suspension detection controller controls the operation of the detector shifting mechanism according to the conduction signal (or disconnection signal), and passes the reference point information and the detector shifting mechanism (mainly the second direction shifting mechanism) in the second direction The moving distance on the upper side is used to calculate the relative distance of the detection point in the surface to be tested that the contact detector is currently in contact with the reference point; the detection controller controls the shift mechanism of the detector to drive the contact detection The meter moves away from the current detection point to be tested to reset, and completes the detection of one detection point.

On the other hand, for the detection of multiple detection points on the surface to be tested, it is necessary to perform position switching between the detection points. Therefore, after the detection of the previous detection point is completed, the contact detector is to be moved through the detector. After the position mechanism is reset, the position of the next detection point is shifted by the detector shifting mechanism, wherein the plurality of detection points belonging to one side to be tested can be arranged in a regular lattice manner. It should also be noted that after the flatness detection of one side of the first silicon rod 101 is completed, it is also necessary to switch to the next side for flatness detection. The switching of the sides can be achieved by transferring the first silicon rod 101, for example, in the workpiece loading structure, by rotating the rotary pressing device 533 of the first silicon rod positioning mechanism 53. The movement is switched to the adjacent next side by adjusting the angle of the first silicon rod 101 (for example, driving the first silicon rod 101 to rotate by 90°).

Additionally, in step 3, in addition to the flatness detection of the first silicon rod 101 at the pretreatment location by the flatness detector 7, the fit of the flatness detector 7 and the silicon rod clamp 25 may be used. The first silicon rod 101 is subjected to a correcting operation.

In the present embodiment, in the correcting operation, generally, the center of the first silicon rod 101 is mainly coincident with the center of the rotation stage 531. The specific operation of the correcting operation may include: performing planar flatness detection on the first silicon rod 101 carried on the rotating carrying platform 531 by the flatness detector 7, thereby obtaining an overall positional overview of the first silicon rod 101; The overall positional overview of the first silicon rod 101 is compared with the position of the rotating stage 531, thereby obtaining deviation information between the center of the first silicon rod 101 and the center of the rotating stage 531; the reversing carrier 23 is rotated 180. ° for the reversing motion, the silicon rod clamp 25 on the reversing carrier 23 corresponds to the first silicon rod 101 on the rotating stage 531 and holds the first silicon rod 101; the detector is controlled by the detection controller The first direction shifting mechanism and/or the second direction shifting mechanism in the mechanism drives the commutation carrier 23 to move in the first direction and/or the second direction, thereby driving the silicon rod clamp 25 and the silicon rod clamp 25 The clamped first silicon rod 101 is positionally adjusted with respect to the rotation stage 531, and finally the center of the first silicon rod 101 is coincident with the center of the rotation stage 531 to complete the correcting operation for the first silicon rod 101.

In addition, there are differences in detail in the rectification work for different types of silicon rods.

Taking a single crystal silicon rod as an example, please refer to FIG. 15 , which is a schematic diagram showing a rectifying operation of a single crystal silicon rod. As shown in FIG. 15, the single crystal silicon rod to be processed is a silicon square body having a substantially rectangular cross section, and has four side faces, and a connecting face surface having an R angle is formed between adjacent two side faces. Therefore, the correcting operation for the single crystal silicon rod may specifically include: flatness detection of four sides of the single crystal silicon rod carried on the rotating stage by the flatness detector, thereby obtaining a single sheet composed of four sides The center O1 of the side of the crystalline silicon rod; the flatness test is performed on the four connecting facets of the single crystal silicon rod carried on the rotating stage by the flatness detector, thereby obtaining single crystal silicon composed of four connecting facets The rod is connected to the center O2 of the facet; the size of the finished single crystal silicon rod after the single-crystal silicon rod is processed by the multi-station is calculated; according to the size of the finished single crystal silicon rod, the center of the side of the single crystal silicon rod O1, single crystal The silicon rod is connected to the center O2 of the facet, and the center O3 of the finished single crystal silicon rod is calculated; the center O3 of the obtained single crystal silicon rod finished product is compared with the center O of the rotating stage, and the deviation information of the two is further analyzed; The reversing carrier is used for the reversing movement, and the silicon rod clamp on the reversing carrier corresponds to the single crystal silicon rod on the rotating bearing platform and holds the single crystal silicon rod, and the detecting controller is used to control the shifting mechanism of the detector First direction shifting mechanism and / The second direction shifting mechanism drives the reversing carrier to move in the first direction and/or the second direction, thereby driving the silicon rod clamp and the single crystal silicon rod clamped by the silicon rod clamp to adjust the position relative to the rotating bearing platform. Finally, the center O3 of the finished single crystal silicon rod is overlapped with the center O of the rotating stage, and the correcting operation for the single crystal silicon rod is completed.

Taking a polycrystalline silicon rod as an example, please refer to FIG. 16 , which is a schematic diagram showing the correcting operation of the polycrystalline silicon rod. As shown in FIG. 16, the polycrystalline silicon rod to be processed is a silicon square body having a rectangular cross section, and has four side faces and four corners. Therefore, the correcting operation for the polycrystalline silicon rod may specifically include: flatness detection of the four sides of the polycrystalline silicon rod carried on the rotating carrying platform by the flatness detector, thereby obtaining the center O1 of the polycrystalline silicon rod composed of four sides. Comparing the center O1 of the obtained polycrystalline silicon rod with the center O of the rotating stage, and then the deviation information of the two; the commutation vehicle is used for the reversing motion, and the silicon rod clamp on the reversing carrier corresponds to the rotation Carrying the polysilicon rod on the stage and holding the polysilicon rod, and controlling the first direction shifting mechanism and/or the second direction shifting mechanism in the shifting mechanism of the detector to drive the commutating vehicle in the first direction by using the detecting controller And/or moving in the second direction, thereby driving the silicon rod clamp and the polycrystalline silicon rod clamped by the silicon rod clamp to adjust the position relative to the rotating carrier, and finally, the center O1 of the polycrystalline silicon rod and the center O of the rotating carrier are correspondingly overlapped. Correction of the polysilicon rod is completed.

Step 4, converting the first silicon rod that completes the planar flatness detection from the pre-processing location to the first processing location and performing the first processing operation on the first silicon rod in the first processing location, at this stage, The second silicon rod to be processed is loaded in the pretreatment zone and pretreated. The state of the silicon rod multi-station processing machine after performing the above operation can be specifically seen in FIG. 17, which is a schematic view showing a state in which the first silicon bar is subjected to the first processing operation and the second silicon rod is loaded.

In this embodiment, converting the first silicon rod that completes the planar flatness detection from the pre-processing location to the first processing location is accomplished by rotating the silicon rod switching device by a first predetermined angle, as before The pre-processing location, the first processing location, and the second processing location are 120° between the two, and the three silicon rod positioning mechanisms 53 are also distributed at 120° between the two, so that the silicon rod switching device 5 rotating the first predetermined angle is actually rotating the silicon rod switching device 5 by 120°, and the first silicon rod positioning mechanism 53 originally located in the pretreatment position and the first silicon rod 101 positioned therein are switched to the first The processing location is up.

The first processing operation of the first silicon rod 101 on the first processing location is performed by the first processing device 3. In the case where the first silicon rod 101 is a single crystal silicon rod, the first processing device 3 is a tangential and coarse grinding device. The tangential and rough grinding operations of the single crystal silicon rod by the dicing and rough grinding device can generally include: a rounding operation and a rough grinding operation.

The rounding operation further includes: first transferring the first silicon rod 101 to the first processing location by using the silicon rod switching device 5, and positioning and adjusting the first silicon rod 101 by the first silicon rod positioning mechanism 53; initially, in silicon When the rod converting device 5 transfers the first silicon rod 101 to the first processing position, the side surface of the first silicon rod 101 corresponds to a pair of first grinding tools 33 in the tangential and rough grinding device, and therefore, the first silicon The positioning adjustment of the first silicon rod 101 by the rod positioning mechanism 53 may include, for example, driving the first silicon rod 101 to rotate forward (or reverse) by 45°, so that the first pair of connecting facets in the first silicon rod 101 corresponds to the cutting. a pair of first grinding tools 33 in the circular and coarse grinding device, the first grinding tool 33 is fed transversely with respect to the first frame 31 according to the feed amount, and the first grinding wheel 34 of the first grinding tool 33 is rotated and driven. The first grinding tool 33 moves up and down to the first pair in the first silicon rod 101 The first surface of the first grinding tool 33 is rotated by 5°, and the first grinding wheel 34 of the first grinding tool 33 is rotated by the first silicon rod positioning mechanism 53 to drive the first grinding wheel 33 up and down. Moving to perform a second rough cut on the first pair of connecting facets in the first silicon rod 101; the first silicon rod 101 is driven to rotate forward by 80° by the first silicon rod positioning mechanism 53 so that the first silicon rod 101 is in the middle The second pair of connecting facets correspond to a pair of first grinding tools 33 in the tangential and coarse grinding device, rotate the first grinding wheel 34 of the first grinding tool 33 and drive the first grinding tool 33 to move up and down to A second pair of connecting facets in a silicon rod 101 is subjected to a first rough cut; the first silicon rod 101 is rotated by 5° by the first silicon rod positioning mechanism 53 to rotate the first grinding wheel in the first grinding tool 33. 34 and driving the first grinding tool 33 to move up and down to perform a second rough cutting on the second pair of connecting prism faces in the first silicon bar 101; the first silicon bar positioning mechanism 53 drives the first silicon bar 101 to rotate in the forward direction 5 °, rotating the first grinding wheel 34 of the first grinding tool 33 and driving the first grinding tool 33 to move up and down to perform the third rough cutting of the second pair of connecting facets in the first silicon bar 101 The first silicon rod 101 is rotated by 80° by the first silicon rod positioning mechanism 53 to rotate the first grinding wheel 34 of the first grinding tool 33 and drive the first grinding tool 33 to move up and down to be in the first silicon rod 101. The first pair of connecting facets is subjected to a third rough cut. For the state in which the single-crystal silicon rod of the first silicon rod 101 is subjected to the above-described rounding processing operation, refer to FIG. 18, which is a schematic view showing a state change of the single crystal silicon rod in the dicing processing operation.

It should be noted that, in the foregoing rounding operation, the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate by a corresponding angle. For example, the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate in the forward direction. °, not the only implementation, in other alternative embodiments, the adjustment angle can be adapted, for example 3° to 7°, including 3°, 4°, 5°, 6°, 7° or other angles, correspondingly In the case where the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward by 80°, the angle is adaptively adjusted. Refer to Table 1 below. Table 1 shows an example of the values for the angle of rotation in the range of 3° to 7°.

Table I

The above-mentioned sizing processing operation is only one embodiment in the sizing processing operation, but is not limited thereto. For example, the first silicon rod 101 is first transferred to the first processing location by the silicon rod switching device 5, A silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward by 40°, so that the first pair of connecting prism faces in the first silicon rod 101 corresponds to a pair of first grinding tools 33 in the tangential and rough grinding device. Rotating the first grinding wheel 34 of the first grinding tool 33 and driving the first grinding tool 33 to move up and down to perform the first rough cutting of the first pair of connecting facets in the first silicon bar 101; positioning by the first silicon bar The mechanism 53 drives the first silicon rod 101 forward Rotating 5°, rotating the first grinding wheel 34 of the first grinding tool 33 and driving the first grinding tool 33 to move up and down to perform a second rough cutting on the first pair of connecting facets in the first silicon bar 101; The silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward by 5°, rotates the first grinding wheel 34 of the first grinding tool 33 and drives the first grinding tool 33 to move up and down to the first pair in the first silicon rod 101. Connecting the facet to perform the third rough cutting; the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward by 80°, rotates the first grinding wheel 34 of the first grinding tool 33 and drives the first grinding tool 33 up and down. The first rough cutting is performed on the second pair of connecting prism faces in the first silicon rod 101; the first silicon rod 101 is rotated by 5° in the forward direction by the first silicon rod positioning mechanism 53 to rotate the first grinding tool 33. The first grinding wheel 34 drives the first grinding tool 33 to move up and down to perform a second rough cutting on the second pair of connecting prism faces in the first silicon rod 101; the first silicon rod 101 is driven by the first silicon rod positioning mechanism 53. Rotating 5° in the forward direction, rotating the first grinding wheel 34 in the first grinding tool 33 and driving the first grinding tool 33 to move up and down to enter the second pair of connecting facets in the first silicon bar 101 Third rough cut.

The rough grinding processing further includes: first transferring the first silicon rod 101 to the first processing location by using the silicon rod switching device 5, and positioning and adjusting the first silicon rod 101 by the first silicon rod positioning mechanism 53 to make the first silicon rod The first pair of sides in the 101 corresponds to a pair of first grinding tools 33 in the tangential and rough grinding device, so that the first grinding tool 33 is fed transversely with respect to the first frame 31 according to the feed amount, and the first grinding wheel is rotated. The first grinding wheel 34 of the 33 is driven to drive the first grinding tool 33 up and down to coarsely grind the first pair of sides in the first silicon rod 101; the first silicon rod 101 is driven by the first silicon rod positioning mechanism 53 Rotating (or inversely) 90° such that the second pair of sides in the first silicon rod 101 corresponds to a pair of first grinding tools 33 in the tangential and coarse grinding device, rotating the first grinding wheel 34 in the first grinding tool 33 The first grinding tool 33 is driven to move up and down to roughly grind the second pair of sides in the first silicon rod 101. For the state in which the above-described rough grinding processing operation is performed on the single crystal silicon rod of the first silicon rod 101, refer to FIG. 19, which is a schematic view showing a state change of the single crystal silicon rod in the rough grinding processing operation.

In the case where the first silicon rod 101 is a polycrystalline silicon rod, the first processing device 3 is a rough grinding device. The rough grinding operation of the polycrystalline silicon rod by the coarse grinding device may generally include: first transferring the first silicon rod 101 to the first processing location by using the silicon rod switching device 5, and the first silicon rod 101 by the first silicon rod positioning mechanism 53 Positioning adjustment is performed such that the first pair of side faces of the first silicon rod 101 correspond to a pair of first grinding tools 33 in the rough grinding device 3, so that the first grinding tool 33 is laterally oriented with respect to the first frame 31 according to the feed amount. Feeding, rotating the first grinding wheel 34 of the first grinding tool 33 and driving the first grinding tool 33 to move up and down to roughly grind the first pair of sides in the first silicon rod 101; being driven by the first silicon rod positioning mechanism 53 The first silicon rod 101 is rotated 90° in the forward direction (or reverse direction) such that the second pair of sides in the first silicon rod 101 corresponds to a pair of first grinding tools 33 in the rough grinding device 3, and the first grinding tool 33 is rotated. The first grinding wheel 34 drives the first grinding tool 33 up and down to coarsely grind the second pair of sides in the first silicon rod 101. For the state in which the above-mentioned rough grinding processing operation is performed on the polycrystalline silicon rod of the first silicon rod 101, reference can be made to FIG. 20, which is a schematic view showing a state change of the polycrystalline silicon rod in the rough grinding processing operation.

In step 4, the second silicon rod to be processed is loaded into the pretreatment zone and the pretreatment process can be referred to before The descriptions in

steps

2 and 3 will not be repeated here.

Step 5, converting the first silicon rod that completes the first processing operation from the first processing location to the second processing location and converting the pre-processed second silicon rod from the pre-processing location to the first processing location; The first silicon rod on the location performs a second processing operation, at which stage the first processing operation is performed on the second silicon rod on the first processing location and the third silicon rod to be processed is loaded in the pretreatment location and performed Pretreatment. The state of the silicon rod multi-station processing machine after the above operation is specifically shown in FIG. 21, and FIG. 21 is a schematic view showing the state in which the silicon rod multi-station processing machine of the present application simultaneously processes three silicon rods.

In this embodiment, the first silicon rod 101 that completes the first processing operation is converted from the first processing location to the second processing location, and the second silicon rod 102 that has completed the pre-processing is converted from the pre-processing location to the first processing location. The method is performed by rotating the silicon rod switching device 5 by a second predetermined angle. As described above, the pretreatment position, the first processing position, and the second processing position are distributed at 120° between the two, three silicon rods. The positioning mechanism 53 also has a 120° distribution between the two, so that rotating the silicon rod switching device 5 by the second predetermined angle actually turns the silicon rod switching device 5 forward by 120°, which is originally located in the first processing position. The first silicon rod positioning mechanism 53 and its positioned first silicon rod 101 are switched to the second processing position, and the second silicon rod positioning mechanism 53 originally located in the preprocessing position and the second silicon rod 102 positioned therein are converted. To the first processing location.

The second processing operation of the first silicon rod 101 on the second processing zone is performed by the second processing apparatus 4. In the case where the first silicon rod 101 is a single crystal silicon rod, the second processing device 4 is a spheronization and refining device. The rounding and fine grinding operations of the single crystal silicon rod by the spheronization and refining device can roughly include: spheronization processing and fine grinding processing. The spheronization processing further includes transferring the first silicon rod 101 as a single crystal silicon rod to a second processing location of the silicon rod processing platform by the silicon rod switching device 5, and the first silicon rod 101 is aligned by the first silicon rod positioning mechanism 53 Positioning and rotating the first silicon rod 101, causing the second grinding tool 43 to feed transversely according to the feed amount with respect to the second frame 41, rotating the second grinding wheel 44 of the second grinding tool 43 and driving the second grinding tool 43 The upper and lower movements are performed to grind and round the respective joint faces of the first silicon rod 101, so that the joint facets of the first silicon rods 101 are ground to a predetermined size and are integrally rounded, that is, the joint facets and the sides are smoothly transitioned. For the state in which the above-described rounding processing operation is performed on the single crystal silicon rod of the first silicon rod 101, refer to FIG. 22, which is a schematic view showing the state of the single crystal silicon rod in the rounding processing operation.

The finishing processing operation further includes: positioning and adjusting the first silicon rod 101 by the first silicon rod positioning mechanism 53 such that the first pair of sides in the first silicon rod 101 corresponds to a pair of the rounding and refining device 4 The second grinding tool 43 causes the second grinding tool 43 to feed the second frame 41 relative to the second frame 41 according to the feed amount, rotates the second grinding wheel 44 of the second grinding tool 43 and drives the second grinding tool 43 to move up and down to The first pair of sides of a silicon rod 101 are finely ground; the first silicon rod 101 is rotated by 90° in the forward (or reverse) direction by the first silicon rod positioning mechanism 53 so that the second pair of sides in the first silicon rod 101 Corresponding to spheronization and fine grinding A pair of second grinding tools 43 in 4 rotates the second grinding wheel 44 of the second grinding tool 43 and drives the second grinding tool 43 to move up and down to finish grinding the second pair of sides in the first silicon rod 101. For the state in which the above-described refining processing operation is performed as the single crystal silicon rod of the first silicon rod 101, see FIG. 23, which is a schematic view showing the state of the single crystal silicon rod in the refining processing operation.

In the case where the first silicon rod 101 is a polycrystalline silicon rod, the second processing device 4 is a chamfering and refining device. The chamfering and finishing operations of the polycrystalline silicon rod by the chamfering and refining device can generally include: chamfering processing and fine grinding processing.

The chamfering operation further includes transferring the first silicon rod 101 as a polycrystalline silicon rod to a second processing location of the silicon rod processing platform by the silicon rod switching device 5, and performing the first silicon rod 101 by the first silicon rod positioning mechanism 53. Positioning adjustment, for example, driving the first silicon rod 101 to rotate 45°, so that the first pair of corners in the first silicon rod 101 corresponds to the chamfering and the pair of second grinding tools 43 in the refining device, so that the second grinding tool 43 Relative to the second frame 41 for lateral feeding according to the feed amount, the second grinding wheel 44 of the second grinding tool 43 is rotated and the second grinding tool 43 is driven to move up and down to grind the first pair of edges of the first silicon rod 101. Cutting, the first pair of edges of the first silicon rod 101 are ground to form a chamfered surface; the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate forward (or reverse) by 90°, so that the first silicon The second pair of corners in the rod 101 corresponds to the pair of second grinding tools 43 in the chamfering and refining device 4, rotates the second grinding wheel 44 in the second grinding tool 43 and drives the second grinding tool 43 to move up and down to The second pair of corners of the first silicon rod 101 are ground such that the second pair of edges of the first silicon rod 101 are ground to form a reverse Surface. For the state in which the above-described chamfering processing operation is performed on the polycrystalline silicon rod of the first silicon rod 101, refer to FIG. 24, which is a schematic view showing a state in which the polycrystalline silicon rod is in a chamfering processing operation.

The refining operation further includes: positioning and adjusting the polysilicon rod as the first silicon rod 101 by the first silicon rod positioning mechanism 53, for example, driving the first silicon rod 101 to rotate by 45°, so that the first one of the first silicon rods 101 The pair of second grinding tools 43 corresponding to the chamfering and refining device on the side, the second grinding tool 43 is fed transversely with respect to the second frame 41 according to the feed amount, and the second grinding tool 43 is rotated. The second grinding wheel 44 drives the second grinding tool 43 to move up and down to finish the first pair of sides of the first silicon rod 101; the first silicon rod positioning mechanism 53 drives the first silicon rod 101 to rotate in the forward (or reverse) direction. ° such that the second pair of sides in the first silicon rod 101 corresponds to the pair of second grinding tools 43 in the chamfering and refining device 4, rotates the second grinding wheel 44 in the second grinding tool 43 and drives the second grinding The 43 is moved up and down to finish the second pair of sides of the first silicon rod 101. The state in which the above-described refining processing operation is performed as the polycrystalline silicon rod of the first silicon rod 101 can be specifically seen in FIG. 25. FIG. 25 is a schematic view showing the state of the polycrystalline silicon rod in the refining processing operation.

In step 5, the second silicon rod that completes the planar flatness detection is converted from the pre-processing location to the first processing location and the second processing operation of the second silicon rod 102 in the first processing location is performed. For the process of referring to the description of the foregoing step 4, the implementation of the third silicon rod to be processed in the pretreatment position and the pretreatment may be referred to the descriptions of the foregoing

steps

2 and 3, and details are not described herein again.

Step 6. Converting the first silicon rod that completes the second processing operation from the second processing location to the pre-processing location and will complete The second silicon rod of the first processing operation is converted from the first processing location to the second processing location and the third silicon rod that completes the pre-processing is converted from the pre-processing location to the first processing location; the first silicon in the pre-processing location is The rod is unloaded and the fourth silicon rod to be processed is loaded in the pretreatment zone and the fourth silicon rod located at the pretreatment zone is pretreated, at this stage, the second silicon rod on the second processing zone Performing a second processing operation and performing a first processing operation on the third silicon rod on the first processing location. The state of the silicon rod multi-station processing machine after the above operation is specifically shown in Fig. 26, and Fig. 26 is a schematic view showing the state of discharging the silicon rod for completing the processing operation.

In this embodiment, the first silicon rod 101 that completes the second processing operation is converted from the second processing location to the pre-processing location and the second silicon rod that completes the first processing operation is converted from the first processing location to the second processing. The conversion of the location and the third silicon rod that will complete the pretreatment from the pretreatment location to the first processing location is accomplished by rotating the silicon rod switching device 5 by a third predetermined angle, as previously described, the pretreatment location, first The processing location and the second processing zone are distributed at 120° between the two, and the three silicon rod positioning mechanisms 53 are also distributed at 120° between the two, so that the silicon rod switching device 5 is rotated by a third predetermined angle. The silicon rod switching device 5 is reversely rotated by 240° or the silicon rod switching device 5 is rotated by 120° in the forward direction. The first silicon rod positioning mechanism 53 originally located in the second processing position and the first silicon rod positioned therein are realized. 101, the second silicon rod positioning mechanism 53 which is transferred to the pre-processing area and originally located in the first processing position, and the second silicon rod 102 which is positioned thereon are switched to the second processing position, and are originally located in the pre-processing area. Third silicon rod The positioning mechanism 53 and the third silicon rod 103 is converted to a location on the first processing zone.

In particular, the silicon rod switching device 5 is rotatably disposed on the silicon rod processing platform for converting the silicon rod between the pretreatment position, the first processing position, and the second processing position, and detailed description is necessary.

Please refer to FIG. 27 , which is a schematic view showing the state of the silicon rod multi-station processing machine of the present application in a three-station processing operation. As shown in FIG. 27, in this embodiment, the pretreatment location, the first processing location, and the second processing location on the silicon bar processing platform are sequentially disposed, wherein the pretreatment location is correspondingly provided with a silicon rod loading and unloading The device has a first processing device corresponding to the first processing location, a second processing device corresponding to the second processing location, and a 120° distribution between the pre-processing location, the first processing location, and the second processing location. Correspondingly, the three silicon rod positioning mechanisms on the circular or circular conveying body are also distributed at 120° between the two.

Here, it is assumed that the course in the order of the pre-processing zone, the first machining zone, and the second machining zone is positive, and the course opposite to the forward direction is reverse. Correspondingly, the process of performing the silicon rod multi-station processing may substantially include: in the initial condition, the silicon rod loading and unloading device 2 loads the first silicon rod 101 to be processed into the pretreatment area of the silicon rod processing platform, and is located The first silicon rod 101 at the pretreatment position is pretreated; the silicon rod switching device 5 is rotated forward by 120° to convert the preprocessed first silicon rod 101 from the pretreatment position to the first processing position, The first processing device 3 performs a first processing operation on the first silicon rod 101 on the first processing location, and at this stage, the silicon rod handling device 2 is to be processed. The second silicon rod 102 is loaded in the pretreatment zone and pretreated; the silicon rod switching device 5 is rotated 120° in the forward direction to convert the first silicon rod 101 that completes the first processing operation from the first processing location to the second processing location. And converting the pre-processed second silicon rod 102 from the pre-processing location to the first processing location, causing the second processing device 4 to perform a second processing operation on the first silicon rod 101 on the second processing location, at this stage, Having the first processing device 3 perform a first processing operation on the second silicon rod 102 on the first processing location and the silicon rod handling device 5 loading the third silicon rod 103 to be processed in the pretreatment location and performing pretreatment; The silicon rod switching device 5 rotates 120° in the forward direction or 240° in the reverse direction to convert the first silicon rod 101 that completes the second processing operation from the second processing location to the pretreatment location and the second silicon rod that will complete the first processing operation. The first silicon bar 101 on the pretreatment zone is unloaded by converting the first processing zone to the second processing zone and converting the pre-processed third silicon bar 103 from the pre-processing zone to the first processing zone.

It is considered that a cable such as a power line or a signal line disposed in the silicon rod multi-station processing machine does not excessively entangle the cables due to excessive rotation of the silicon rod switching device, thereby causing the cables to be broken. In a specific embodiment, the technical solution provided by the present application considers limiting the maximum rotation angle of the silicon rod switching device, that is, causing the silicon rod switching device to convert the first silicon rod 101 from the second processing position to the pretreatment position. In the process, you can include the following two situations:

In the first case, the rotation angle of the silicon rod switching device 5 is ±240°, specifically, the silicon rod switching device 5 is returned to the original position after being rotated by 120° in the forward direction and 240° in the reverse direction. The first silicon rod 101 that completes the second processing operation is converted from the second processing location to the pre-processing location. The beneficial effects of this situation also include a more flexible design space for the internal structural design of the entire silicon rod multi-station processing machine, for example, it can be considered to be set between the second processing area and the preprocessing area. Other components need not be considered to hinder the rotation of the silicon rod switching device.

In the second case, the rotation angle of the silicon rod switching device ranges from ±360°, so that the first silicon rod 101 of the second processing operation is completed by the second processing location after the silicon rod switching device 5 rotates 360°. Switch to the pre-processing zone and then reverse the 360° rotation to release the cable that was wound during the forward rotation.

In short, the above two rotation modes can achieve substantially the same effect, but the setting of the silicon rod conversion device is still limited thereto, as long as the silicon rod for processing can smoothly and smoothly perform various processing operations. Then, the conversion mode of the silicon rod switching device (such as the direction of rotation and the angle of rotation, etc.) can be changed.

Of course, the silicon rod switching device can continue to adopt this one-way infinite rotation mode without considering the above-mentioned risk of excessive cable winding or the problem of providing other components between the second processing zone and the pretreatment zone.

Since the loading and unloading of the silicon rod, the flatness detection, the first processing operation, and the second processing operation have been described above, they will not be described again.

Here, it is to be additionally noted that, in other alternative embodiments, if the silicon rod multi-station processing machine adds a corresponding processing operation device, the functional location on the silicon rod processing platform and the silicon rod on the transport body Number of positioning mechanisms and The positional relationship needs to be adjusted accordingly. Subsequently, in the process of multi-station processing of the silicon rod to be processed by the silicon rod multi-station processing machine, the silicon rod is rotated by a predetermined angle to realize the function of the silicon rod. The conversion of the location will also be adjusted accordingly. Assuming that a third processing device is added to the silicon rod multi-station processing machine, a third processing position is added to the silicon rod processing platform and the silicon rod switching device also adds a silicon rod positioning mechanism to the conveying body.

In a specific embodiment, the third processing device is, for example, a silicon rod polishing device. The silicon rod polishing device can be disposed on the base for polishing the silicon rod. For the specific implementation, refer to the foregoing description for the silicon rod polishing apparatus.

In an optional embodiment, the pretreatment location, the first processing location, the second processing location, and the third processing location on the silicon bar processing platform are sequentially disposed, wherein the preprocessing location is correspondingly provided with silicon The bar loading and unloading device has a first processing device corresponding to the first processing zone, a second processing device corresponding to the second processing zone, and a third processing device corresponding to the third processing zone, and the pretreatment zone and the first processing zone The second processing zone and the third processing zone are respectively disposed at a 90° relationship between the two adjacent positions, and correspondingly, the four silicon rod positioning mechanisms on the circular or circular conveying body are adjacent to each other. It is also distributed at 90°.

Please refer to FIG. 28 , which is a schematic diagram showing the state of the silicon rod multi-station processing machine of the present application in a four-station processing operation. As shown in FIG. 28, the process of performing the silicon rod multi-station processing may substantially include: in the initial condition, the silicon rod loading and unloading device 2 loads the first silicon rod 101 to be processed into a pretreatment position of the silicon rod processing platform. And pretreating the first silicon rod 101 located at the pretreatment position; rotating the silicon rod switching device 5 forward by 90° to convert the preprocessed first silicon rod 101 from the pretreatment position to the first processing The first processing device 3 performs a first processing operation on the first silicon rod 101 on the first processing location. At this stage, the silicon rod loading and unloading device 2 loads the second silicon rod 102 to be processed into the pretreatment location. And pre-treating; the silicon rod switching device 5 is rotated forward by 90° to convert the first silicon rod 101 that completes the first processing operation from the first processing location to the second processing location and the second silicon rod that will complete the pre-processing 102: converting the pre-processing location to the first processing location, causing the second processing device 4 to perform a second processing operation on the first silicon rod 101 on the second processing location, and at this stage, causing the first processing device 3 to perform the first processing The second silicon rod 102 on the location performs the first The working industry and the silicon rod loading and unloading device 5 load the third silicon rod 103 to be processed in the pretreatment position and perform pretreatment; the silicon rod switching device 5 is rotated 90° in the forward direction to complete the first silicon for the second processing operation. The rod 101 is converted from the second processing zone to the third processing zone and the second silicon bar 102 that completes the first processing operation is converted from the first processing zone to the second processing zone and the third silicon bar 103 that will complete the pretreatment is pre- The processing location is switched to the first processing location, and the third processing device 8 performs a third processing operation on the first silicon rod 101 on the third processing location. At this stage, the second processing device 4 is placed on the second processing location. The second silicon rod 102 performs a second processing operation and causes the first processing device 3 to perform a first processing operation on the third silicon rod 103 on the first processing location and the fourth silicon rod 104 to be processed by the silicon rod loading and unloading device 5. Loading in the pretreatment zone and performing pretreatment; causing the silicon rod switching device 5 to rotate 90° in the forward direction or 270° in the reverse direction to rotate the first silicon rod 101 completing the third processing operation from the third processing zone Switching to the pre-processing location and converting the second silicon bar 102 that completes the second processing operation from the second processing location to the third processing location, and converting the third silicon bar 103 that completes the first processing operation from the first processing location to the first processing location The second processing zone, and the fourth silicon rod 104 to be pretreated, are converted from the pretreatment zone to the first processing zone, and the first silicon bar 101 on the pretreatment zone is unloaded.

It is considered that a cable such as a power line or a signal line disposed in the silicon rod multi-station processing machine does not excessively entangle the cables due to excessive rotation of the silicon rod switching device, thereby causing the cables to be broken. In a specific embodiment, the technical solution provided by the present application considers limiting the maximum rotation angle of the silicon rod switching device, that is, the silicon rod switching device converts the first silicon rod 101 from the third processing position to the pretreatment position. In the process, you can include the following two situations:

In the first case, the rotation angle of the silicon rod switching device 5 is ±270°, specifically, the silicon rod switching device 5 is returned to the original position after three times of positive rotation by 90° and one reverse rotation by 270°. The first silicon rod 101 that completes the third processing operation is switched from the third processing location to the pre-processing location. The beneficial effects of this situation include that it can provide a more flexible design space for the internal structure design of the entire silicon rod multi-station processing machine, for example, it can be considered to be set between the third processing area and the preprocessing area. Other components need not be considered to hinder the rotation of the silicon rod switching device.

In the second case, the rotation angle of the silicon rod switching device ranges from ±360°, so that the first silicon rod 101 of the third processing operation is completed by the third processing location after the silicon rod switching device 5 rotates 360°. Switch to the pre-processing zone and then reverse the 360° rotation to release the cable that was wound during the forward rotation.

Through the above various steps, it can be seen that the processing devices on the respective processing stations perform their respective duties, and the processing devices are transferred in an orderly and seamless manner and automatically realize the multiple process operations of the silicon rod processing to form an assembly line operation. Improve production efficiency and quality of product processing operations.

The above embodiments are merely illustrative of the principles of the present application and its effects, and are not intended to limit the application. Any of the above-described embodiments may be modified or changed without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention will be covered by the appended claims.

Claims

A silicon rod multi-station processing machine, characterized in that it comprises:

a base with a silicon rod processing platform;

a silicon rod loading and unloading device disposed in a pretreatment zone of the silicon rod processing platform for loading a silicon rod to be processed into a pretreatment zone of the silicon rod processing platform and processing the processed silicon rod from the silicon Pre-processing location unloading of the bar processing platform;

a first processing device disposed in a first processing location of the silicon bar processing platform for performing a first processing operation on the silicon bar;

a second processing device disposed in the second processing location of the silicon bar processing platform for performing a second processing operation on the silicon rod after the first processing operation of the first processing device;

A silicon rod switching device is rotatably disposed on the silicon rod processing platform for converting the silicon rod between the pretreatment location, the first processing location, and the second processing location.
The silicon rod multi-station processing machine according to claim 1, wherein said silicon rod loading and unloading device comprises:

a silicon rod loading and unloading location, and a silicon rod carrying platform for carrying the silicon rod to be placed upright;

a reversing carrier for reversing motion;

a silicon rod clamp disposed on the first mounting surface of the reversing carrier;

Wherein, by driving the reversing carrier for the reversing motion, the silicon rod clamp of the reversing carrier is switched between the silicon rod loading and unloading position and the pretreatment position to transfer the silicon rod.
A silicon rod multi-station processing machine according to claim 2, wherein said silicon rod holder comprises:

a fixture mounting member disposed on the commutation carrier;

At least two silicon rod holders are disposed along the fixture mounting pitch; each of the silicon rod holders comprises:

a clamp arm mount is disposed on the clamp mounting member;

At least two clamp arms, the activity being disposed on the clamp arm mount;

a clamping arm driving mechanism for driving the at least two clamping arms for opening and closing.
A silicon rod multi-station processing machine according to claim 3, wherein at least one of said at least two silicon rod holders is provided with a guiding drive mechanism for driving it along The clamp mount moves to adjust a spacing of the at least two silicon rod clamps.
The silicon rod multi-station processing machine according to claim 4, wherein the silicon rod loading and unloading device further comprises: a height A detector is disposed on the commutation carrier for detecting a height of the silicon rod.
The silicon rod multi-station processing machine according to claim 2, further comprising a flatness detector disposed on the second mounting surface of the reversing carrier for planarly flattening the silicon rod Degree detection.
The silicon rod multi-station processing machine according to claim 6, wherein the flatness detector comprises:

Contact detection structure;

Detector shifting mechanism;

a detection controller connected to the contact detecting structure and the detector shifting mechanism for controlling the shifting mechanism of the detector to drive the contact detecting structure to shift and controlling the contact detecting structure to be sequentially A relative distance of each detection point on the surface to be tested in the silicon rod is detected.
The silicon rod multi-station processing machine according to claim 1, wherein said silicon rod switching device comprises:

a disc-shaped or circular conveying body;

a silicon rod positioning mechanism disposed on the transport body for positioning the silicon rod;

And a switching drive mechanism for driving the conveying body to rotate to drive the silicon rod switching position of the silicon rod positioning mechanism.
The silicon rod multi-station processing machine according to claim 8, wherein the silicon rod positioning mechanism comprises:

a rotating carrying platform disposed on the disc-shaped or circular conveying body for carrying the silicon rod;

a rotary pressing device disposed opposite to the rotating carrier for pressing the silicon rod;

a lifting drive for driving the rotary pressing device to move up and down in a vertical direction;

a rotary driving device for driving the rotary pressing device and driving the rotary pressing device to perform a rotary motion.
The silicon rod multi-station processing machine according to claim 1, wherein said first processing means comprises:

First rack;

At least one pair of first abrasive tools are disposed opposite to the first frame for performing a first processing operation on the silicon rods on the silicon rod switching device located at the first processing location.
The silicon rod multi-station processing machine according to claim 10, wherein the first abrasive tool comprises:

First spindle;

At least one first grinding wheel is disposed at a working end of the first main shaft; the first grinding wheel has a first matte particle of a first size.
The silicon rod multi-station processing machine according to claim 1, wherein said second processing means comprises:

Second rack;

At least one pair of second abrasive tools are oppositely disposed on the second frame for performing a second processing operation on the silicon rods on the silicon rod switching device located at the second processing location.
The silicon rod multi-station processing machine according to claim 12, wherein the second grinding tool comprises:

Second spindle;

At least one second grinding wheel is disposed at a working end of the second main shaft; the second grinding wheel has a second frosted particle of a second size.
The silicon rod multi-station processing machine of claim 1 further comprising a guard door for isolating the pre-processing location from the first processing zone and the second processing zone.
The silicon rod multi-station processing machine according to claim 1, wherein the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform are distributed at 120°. The rotation angle of the silicon rod switching device ranges from ±240°.
The silicon rod multi-station processing machine according to claim 1, further comprising a third processing device disposed at a third processing location of the silicon rod processing platform; and pretreatment on the silicon rod processing platform The location, the first processing zone, the second processing zone, and the third processing zone are distributed at a 90° angle between each other, and the rotation angle of the silicon bar switching device ranges from ±270°.
A silicon rod multi-station processing machine according to claim 1, 15 or 16, wherein:

The rotation angle of the silicon rod switching device ranges from ±360°; or

The silicon rod switching device adopts a one-way infinite rotation mode.
A silicon rod multi-station processing method, characterized in that the method comprises the following steps:

The silicon rod loading and unloading device loads the first silicon rod to be processed into the pretreatment position of the silicon rod processing platform, and is located at the location Pre-processing of the first silicon rod at the pretreatment location;

Having the silicon rod switching device rotate a first predetermined angle to convert the pre-processed first silicon rod from the pre-processing location to the first processing location; causing the first processing device to perform the first silicon rod on the first processing location a first processing operation, in which a silicon rod handling device loads a second silicon rod to be processed in a pretreatment zone and performs pretreatment;

Rotating the silicon rod switching device by a second predetermined angle to convert the first silicon rod that completes the first processing operation from the first processing location to the second processing location and converting the pre-processed second silicon rod from the pre-processing location to a first processing location; causing the second processing device to perform a second processing operation on the first silicon rod on the second processing location, at which stage the first processing device first performs the second silicon rod on the first processing location The processing operation and the silicon rod handling device load the third silicon rod to be processed into the pretreatment zone and perform pretreatment.
The method of processing a silicon rod multi-station according to claim 18, wherein the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform are distributed at 120°; When the course of the preprocessing zone, the first machining zone, and the second machining zone is defined as the forward direction, the first predetermined angle for rotating the silicon rod switching device is 120° in the forward direction; The rod switching device rotates the second predetermined angle to a forward rotation of 120°.
The method of processing a silicon rod multi-station according to claim 18, further comprising the steps of:

Reversing the silicon rod switching device by a third predetermined angle to convert the first silicon rod that completes the second processing operation from the second processing location to the pre-processing location and the second silicon rod that completes the first processing operation from the first processing location Converting to the second processing zone and converting the third silicon rod to be pre-processed from the pre-processing zone to the first processing zone; causing the silicon bar handling device to unload the first silicon bar on the pre-treatment zone and to be processed The silicon rod is loaded in the pretreatment zone and the fourth silicon rod located at the pretreatment zone is pretreated, and at this stage, the second processing device performs the second processing on the second silicon rod on the second processing zone. Working and causing the first processing device to perform a first processing operation on the third silicon rod on the first processing location.
The method of processing a silicon rod multi-station according to claim 20, wherein the pretreatment zone, the first processing zone, and the second processing zone on the silicon bar processing platform are distributed at 120°; When the course of the preprocessing zone, the first machining zone, and the second machining zone is defined as the forward direction, the first predetermined angle for rotating the silicon bar switching device is 120° in the forward direction. The step of rotating the silicon rod switching device by a second predetermined angle is 120° in the forward direction; and the third predetermined angle of rotation of the silicon rod switching device is 120° in the forward direction or 240° in the reverse direction.