WO2017199824A1 - Substrat multicouche et appareil électronique - Google Patents

Substrat multicouche et appareil électronique Download PDF

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Publication number
WO2017199824A1
WO2017199824A1 PCT/JP2017/017773 JP2017017773W WO2017199824A1 WO 2017199824 A1 WO2017199824 A1 WO 2017199824A1 JP 2017017773 W JP2017017773 W JP 2017017773W WO 2017199824 A1 WO2017199824 A1 WO 2017199824A1
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WO
WIPO (PCT)
Prior art keywords
region
conductor
multilayer substrate
resin layer
ground conductor
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PCT/JP2017/017773
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English (en)
Japanese (ja)
Inventor
邦明 用水
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株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201790000681.9U priority Critical patent/CN209462743U/zh
Publication of WO2017199824A1 publication Critical patent/WO2017199824A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a multilayer substrate in which a plurality of resin layers are laminated and a signal conductor and a ground conductor are formed, and an electronic device using the multilayer substrate.
  • Patent Document 1 describes a high-frequency signal line using a dielectric body.
  • the dielectric body is a multilayer substrate in which a plurality of dielectric sheets (resin layers) are stacked.
  • the dielectric body is provided with a signal conductor layer and a ground conductor layer. The ground conductor layer and the signal conductor layer are opposed to each other.
  • the dielectric body has a first region and a second region in the direction in which the signal conductor extends.
  • the first region is adjacent to the second region.
  • the interval between the signal conductor layer and the ground conductor layer in the first region is smaller than the interval between the signal conductor layer and the ground conductor layer in the second region.
  • the thickness of the laminated body in the first region is smaller than the thickness of the laminated body in the second region.
  • the ground conductor layer in the first region and the ground conductor layer in the second region are different layers in the stacking direction of the dielectric element bodies.
  • the ground conductor layer in the first region and the ground conductor layer in the second region are connected by an interlayer connection conductor.
  • an interlayer connection conductor is provided at the end of the first region that is highly flexible and easy to bend, and there is a possibility that the interlayer connection conductor is disconnected by bending.
  • the ground conductor layer in the first region and the ground conductor layer in the second region are disconnected. That is, the ground conductor layer is partially disconnected.
  • the object of the present invention is to have a high-flexibility region and a low-flexibility region, and a ground conductor extending over these high-flexibility region and low-flexibility region.
  • Another object of the present invention is to provide a multilayer substrate capable of suppressing disconnection of the ground conductor, and an electronic apparatus using the multilayer substrate.
  • the multilayer substrate of the present invention includes a laminate, a signal conductor, and a first ground conductor.
  • the laminate is formed by laminating a plurality of resin layers each having flexibility.
  • the signal conductor has a shape that is disposed at an intermediate position in the stacking direction of the plurality of resin layers in the stacked body and extends in the signal transmission direction.
  • the first ground conductor is formed in the multilayer body and is disposed apart from the signal conductor in the stacking direction.
  • the laminate has a first region and a second region along the direction in which the signal conductor extends.
  • the number of resin layers between the signal conductor and the first ground conductor in the first region is smaller than the number of resin layers between the signal conductor and the first ground conductor in the second region.
  • the resin layer in which the first ground conductor in the first region is formed and the resin layer in which the first ground conductor in the second region is formed are the same resin layer.
  • the distance between the signal conductor and the first ground conductor in the first region is shorter than the distance between the signal conductor and the first ground conductor in the second region.
  • the first ground conductor is disposed over both the first region and the second region along a step at the boundary between the first region and the second region.
  • the resin layer in which the signal conductor in the first region is formed and the resin layer in which the signal conductor in the second region are formed are preferably the same resin layer.
  • the signal conductor in the first region and the signal conductor in the second region are connected as one conductor pattern without using the interlayer connection conductor. Thereby, there is little transmission loss of a signal conductor, and the disconnection of a signal conductor is suppressed.
  • the multilayer substrate of the present invention preferably has the following configuration.
  • the multilayer substrate includes a second ground conductor.
  • the second ground conductor is formed in the multilayer body, and is arranged on the opposite side of the signal conductor from the signal conductor in the stacking direction and spaced from the signal conductor.
  • the number of resin layers between the signal conductor and the second ground conductor in the first region is smaller than the number of resin layers between the signal conductor and the second ground conductor in the second region.
  • the resin layer in which the second ground conductor in the first region is formed and the resin layer in which the second ground conductor in the second region is formed are the same resin layer.
  • a strip line is formed by the multilayer substrate, and the second ground conductor is also arranged over both the first region and the second region along the step of the boundary between the first region and the second region. Is done.
  • the first ground conductor or the second ground conductor in the first region may have a conductor non-forming portion that overlaps the signal conductor in plan view.
  • the proportion of the conductor shown in the entire first region is reduced, and the flexibility of the first region is improved.
  • capacitive coupling between the signal conductor and the first ground conductor or the second ground conductor in the first region is reduced. Therefore, the width of the signal conductor can be increased and transmission loss is suppressed as compared with the case where no conductor non-forming portion is provided. In the first region, it is easy to match the characteristic impedance even if the thickness of the multilayer substrate is reduced.
  • the width of the signal conductor in the first region is preferably narrower than the width of the signal conductor in the second region.
  • the characteristic impedance of the first region and the characteristic impedance of the second region can be easily approximated.
  • the first region is preferably a bent portion.
  • the multilayer substrate can be bent easily.
  • an electronic device of the present invention includes any one of the multilayer substrates described above and a mounting substrate having a function of an electronic circuit.
  • the multilayer body includes an external connection conductor in the second region.
  • the multilayer substrate is connected to the mounting substrate by an external connection conductor.
  • the multilayer substrate is connected to the mounting substrate in the second region having low flexibility.
  • the first region is not directly connected to the mounting board and is easily used for routing. Thereby, the multilayer substrate is easily connected to the mounting substrate in a predetermined posture.
  • the electronic device of the present invention may include a plurality of multilayer substrates, and the plurality of multilayer substrates may be overlapped with each other in the first region and intersected with each other and connected to the mounting substrate.
  • a ground conductor that has a highly flexible region and a lowly flexible region and spans the highly flexible region and the less flexible region. Disconnection can be suppressed.
  • 1 is a side view showing a main configuration of a multilayer board according to a first embodiment of the present invention.
  • 1 is an external perspective view of a multilayer substrate according to a first embodiment of the present invention.
  • 1 is an exploded perspective view of a multilayer substrate according to a first embodiment of the present invention.
  • 1 is an exploded plan view of a multilayer substrate according to a first embodiment of the present invention. It is a side view which shows the main structures of the multilayer board
  • substrate which concerns on the 2nd Embodiment of this invention.
  • It is an external appearance perspective view of the multilayer substrate which concerns on the 3rd Embodiment of this invention.
  • It is an external appearance perspective view of the multilayer substrate which concerns on the 4th Embodiment of this invention.
  • FIG. 1 is a side view showing the main configuration of the multilayer substrate according to the first embodiment of the present invention.
  • FIG. 2 is an external perspective view of the multilayer substrate according to the first embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of the multilayer substrate according to the first embodiment of the present invention.
  • FIG. 4 is an exploded plan view of the multilayer substrate according to the first embodiment of the present invention.
  • the multilayer substrate 10 includes a multilayer body 20, a signal conductor 30, a ground conductor 40, and a ground conductor 50.
  • the laminate 20 includes a plurality of resin layers 21, 221, 222, 23, 24, 251, 252, and 26.
  • the plurality of resin layers 21, 221, 222, 23, 24, 251, 252, and 26 have thermoplasticity and flexibility.
  • the plurality of resin layers 21, 221, 222, 23, 24, 251, 252, and 26 have a liquid crystal polymer as a main component. Since the plurality of resin layers 21, 221, 222, 23, 24, 251, 252 and 26 have flexibility, the laminate 20 also has flexibility.
  • the plurality of resin layers 21, 221, 222, 23, 24, 251, 252, and 26 have substantially the same thickness.
  • the laminated body 20 is long along the direction in which the signal conductor 30 disposed inside extends, and has a short outer shape in a direction orthogonal to the extending direction, and is rectangular in plan view.
  • the external shape of the laminated body 20 is not restricted to this.
  • the stacked body 20 has regions 110, 121, and 122 along the direction in which the signal conductor 30 extends.
  • the region 110 is sandwiched between the region 121 and the region 122 along the direction in which the signal conductor 30 extends.
  • a region 121 is connected to one end of the region 110 and a region 122 is connected to the other end.
  • the area 110 corresponds to the “first area” of the present invention, and the areas 121 and 122 correspond to the “second area” of the present invention.
  • the laminate 20 is formed by laminating a resin layer 21, a resin layer 23, a resin layer 24, and a resin layer 26.
  • the resin layer 21, the resin layer 23, the resin layer 24, and the resin layer 26 are laminated in this order from the first main surface to the second main surface of the region 110.
  • the laminate 20 is formed by laminating a resin layer 21, a resin layer 221, a resin layer 23, a resin layer 24, a resin layer 251, and a resin layer 26.
  • the resin layer 21, the resin layer 221, the resin layer 23, the resin layer 24, the resin layer 251, and the resin layer 26 are laminated in this order from the first main surface to the second main surface of the region 121.
  • the laminate 20 is formed by laminating the resin layer 21, the resin layer 222, the resin layer 23, the resin layer 24, the resin layer 252, and the resin layer 26.
  • the resin layer 21, the resin layer 222, the resin layer 23, the resin layer 24, the resin layer 252, and the resin layer 26 are laminated in this order from the first main surface to the second main surface of the region 122.
  • the resin layer 21, the resin layer 23, the resin layer 24, and the resin layer 26 are disposed over all the regions 110, 121, and 122 of the stacked body 20.
  • the resin layer 221 and the resin layer 251 are disposed only in the region 121, and the resin layer 222 and the resin layer 252 are disposed only in the region 122.
  • the number of resin layers forming the region 110 is smaller than the number of resin layers forming the region 121 and the number of resin layers forming the region 122.
  • the thickness D110 of the region 110 is smaller than the thickness D121 of the region 121 and the thickness D122 of the region 122.
  • the thickness D121 of the region 121 and the thickness D122 of the region 122 are the same.
  • the flexibility of the region 110 is higher than the flexibility of the region 121 and the flexibility of the region 122. Therefore, the multilayer substrate 10 can be easily folded by setting the region 110 as a bent portion.
  • the laminate 20 has a plurality of steps UE41, UE42, UE51, and UE52 because the thickness is different between the region 110, the region 121, and the region 122 as described above.
  • the step UE41 occurs at the boundary between the region 110 and the region 121 on the first main surface of the stacked body 20.
  • the step UE42 occurs at the boundary between the region 110 and the region 122 on the first main surface of the stacked body 20.
  • the step UE51 occurs at the boundary between the region 110 and the region 121 on the second main surface of the stacked body 20.
  • the step UE52 occurs at the boundary between the region 110 and the region 122 on the first main surface of the stacked body 20.
  • the signal conductor 30 is disposed on the first main surface of the resin layer 24, that is, the interface between the resin layer 23 and the resin layer 24. As a result, the signal conductor 30 is disposed at an intermediate position in the stacking direction of the plurality of resin layers in the stacked body 20.
  • the signal conductor 30 has a shape extending along the signal transmission direction, and includes a first portion 31, a second portion 32, and a third portion 33 along the extending direction.
  • the first portion 31 is a portion disposed in the region 121 in the signal conductor 30.
  • the second portion 32 is a portion disposed in the region 122 in the signal conductor 30.
  • the third portion 33 is a portion disposed in the region 110 in the signal conductor 30.
  • the width of the third portion 33 is narrower than the width of the first portion 31 and the width of the second portion 32.
  • the ground conductor 40 is disposed on the first main surface of the resin layer 21, that is, the first main surface of the multilayer body 20.
  • the ground conductor 40 is disposed on substantially the entire first main surface of the resin layer 21.
  • the ground conductor 40 corresponds to the “first ground conductor” of the present invention.
  • the ground conductor 50 is disposed on the second main surface of the resin layer 26, that is, the second main surface of the multilayer body 20. In other words, the ground conductor 50 is disposed on the side opposite to the ground conductor 40 with respect to the signal conductor 30 in the stacking direction of the plurality of resin layers.
  • the ground conductor 50 is disposed on substantially the entire second main surface of the resin layer 26 excluding the region where the external connection conductor 51 and the external connection conductor 52 are formed. Between the ground conductor 50, the external connection conductor 51, and the external connection conductor 52, a conductor non-formation portion is provided.
  • the ground conductor 50 corresponds to the “second ground conductor” of the present invention.
  • the ground conductor 50 is connected to the ground conductor 40 by a plurality of interlayer connection conductors 63.
  • the external connection conductor 51 is disposed on the second main surface of the resin layer 26 in the region 121, that is, on the second main surface of the multilayer body 20.
  • the external connection conductor 51 is connected to the first portion 31 of the signal conductor 30 by the interlayer connection conductor 61.
  • the external connection conductor 52 is disposed on the second main surface of the resin layer 26 in the region 122, that is, on the second main surface of the multilayer body 20.
  • the external connection conductor 52 is connected to the second portion 32 of the signal conductor 30 by the interlayer connection conductor 62.
  • the multilayer substrate 10 realizes a strip line in which the signal conductor 30 is sandwiched between the ground conductor 40 and the ground conductor 50 in the stacking direction of the plurality of resin layers.
  • the number of resin layers between the signal conductor 30 and the ground conductor 40 in the region 110 is smaller than the number of resin layers between the signal conductor 30 and the ground conductor 40 in the regions 121 and 122.
  • the number of resin layers between the signal conductor 30 and the ground conductor 50 in the region 110 is smaller than the number of resin layers between the signal conductor 30 and the ground conductor 50 in the regions 121 and 122. Accordingly, the region 110 is easier to bend than the regions 121 and 122.
  • the first main surface side of the stacked body 20 has the steps UE41 and UE42 as described above.
  • the ground conductor 40 is formed in a planar shape on the first main surface of the resin layer 21 (the first main surface of the multilayer body 20). That is, the resin layer in which the ground conductor 40 in the region 110 is formed and the resin layer in which the ground conductor 40 in the regions 121 and 122 is formed are the same resin layer. Therefore, the ground conductor 40 is curved following the step shape at the steps UE41 and UE42, and is arranged in a shape that continues across the region 110 and the regions 121 and 122.
  • the second main surface side of the stacked body 20 has the steps UE51 and UE52 as described above.
  • the ground conductor 50 is formed in a planar shape on the second main surface of the resin layer 26 (second main surface of the multilayer body 20). That is, the resin layer in which the ground conductor 50 in the region 110 is formed and the resin layer in which the ground conductor 50 in the regions 121 and 122 is formed are the same resin layer. Accordingly, the ground conductor 50 is curved following the step shape at the steps UE51 and UE52, and is arranged in a shape continuous over the region 110 and the regions 121 and 122.
  • the multilayer substrate 10 of the present embodiment has a highly flexible region (region 110) and a low flexibility region (regions 121 and 122), and a highly flexible region (region). 110). Furthermore, even when the highly flexible region (region 110) is bent, the multilayer substrate 10 can greatly suppress the disconnection of the ground conductors 40 and 50.
  • the ground conductors 40 and 50 are planar conductors, and are continuous in a highly flexible region (region 110) and a low flexibility region (regions 121 and 122). It is connected to.
  • the interlayer connection conductor is linear as described above, it is difficult to form a conductor having a large line width. As a result, the interlayer connection conductor is likely to have L property.
  • the inductor is connected in a high frequency manner between the ground conductor in the highly flexible region and the ground conductor in the less flexible region. Therefore, a potential difference is likely to occur between the ground conductor in the highly flexible region and the ground conductor in the less flexible region, and the ground is difficult to stabilize.
  • the multilayer substrate 10 of the present embodiment is a planar conductor, it can be suppressed that an inductor is connected in high frequency between the ground conductor 40 and the ground conductor 50, and the ground potential can be stabilized. Therefore, deterioration of the high frequency transmission characteristics of the multilayer substrate 10 can be suppressed.
  • the width of the third portion 33 disposed in the region 110 is the first portion 31 and the second portion disposed in the regions 121 and 122, respectively. It is narrower than the width of the portion 32. Therefore, in the region 110, even if the distance between the signal conductor 30 and the ground conductors 40 and 50 is small compared to the regions 121 and 122, the capacitive coupling between the signal conductor 30 and the ground conductors 40 and 50 can be reduced. it can. Thereby, the characteristic impedance of the region 110 and the characteristic impedance of the regions 121 and 122 can be matched or brought close to each other, and the characteristic impedance can be matched.
  • the plurality of interlayer connection conductors 63 are formed in the region 121 and the region 122 and are not formed in the region 110. Thereby, the fall of the flexibility of the area
  • region 110 can be suppressed.
  • the plurality of interlayer connection conductors 63 are arranged at positions separated from the boundary between the region 110 in the region 121 and the region 122. Thus, disconnection of the plurality of interlayer connection conductors 63 when the region 110 is bent is suppressed.
  • the external connection conductor 51 is disposed in the low flexibility region 121, and the external connection conductor 52 is disposed in the low flexibility region 122. Thereby, the external connection conductors 51 and 52 are not easily deformed, and the multilayer substrate 10 is easily mounted on the external mounting substrate.
  • the signal conductor 30 is formed only on the first main surface of one resin layer 24. That is, the resin layer in which the signal conductor 30 in the region 110 is formed and the resin layer in which the signal conductor 30 in the regions 121 and 122 are formed are the same resin layer. Further, the signal conductor 30 has a shape that extends continuously over the region 110 and the regions 121 and 122. Therefore, disconnection of the signal conductor 30 due to the above-described bending can be suppressed.
  • the multilayer substrate 10 having such a configuration is manufactured by the following method. First, a resin sheet for forming the resin layer 21, a resin sheet for forming the resin layers 221 and 222, a resin sheet for forming the resin layer 23, a resin sheet for forming the resin layer 24, and a resin sheet for forming the resin layers 251 and 252 A resin sheet for forming the resin layer 26 is prepared.
  • the resin sheet for forming the resin layer 21, the resin sheet for forming the resin layer 23, and the resin sheet for forming the resin layer 26 are single-sided copper-bonded resin sheets.
  • the resin sheet for forming the resin layers 221 and 222, the resin sheet for forming the resin layer 23, and the resin sheet for forming the resin layers 251 and 252 do not need to be copper-attached.
  • the resin sheet for forming the resin layer 21 is patterned to form the ground conductor 40.
  • the signal conductor 30 is formed by patterning the resin sheet on which the resin layer 23 is formed. A patterning process is performed on the resin sheet forming the resin layer 26 to form the ground conductor 50 and the external connection conductors 51 and 52.
  • Through holes are formed in the resin sheets for forming the resin layers 221 and 222 by laser, die punching, or the like. Through holes are formed in the resin sheets for forming the resin layers 251 and 252 by laser, die punching, or the like.
  • a through hole for interlayer connection is formed in each resin sheet, and the through hole for interlayer connection is filled with a conductive paste.
  • FIG. 5 is a side view showing the main configuration of the multilayer substrate according to the second embodiment of the present invention.
  • the multilayer substrate 10A according to the present embodiment is different from the multilayer substrate 10 according to the first embodiment in that there is no step on the second main surface side of the stacked body 20A.
  • Other configurations of the multilayer substrate 10A are the same as those of the multilayer substrate 10 according to the first embodiment, and the description of the same portions is omitted.
  • the laminate 20A is obtained by eliminating the resin layers 251 and 252 from the laminate 20 according to the first embodiment. Accordingly, the stacked body 20A has the steps UE41 and UE42 on the first main surface, but does not have the steps on the second main surface.
  • the multilayer substrate 10A can be easily folded by using the region 110 as a bent portion, and the ground conductors 40 and 50 by this bending can be easily bent. Breakage can be suppressed. Further, similarly to the multilayer substrate 10 according to the first embodiment, the multilayer substrate 10A can prevent generation of unnecessary radiation from the signal conductor 30 to the outside of the multilayer substrate 10A.
  • FIG. 6 is an external perspective view of the multilayer substrate according to the third embodiment of the present invention.
  • the multilayer substrate 10B according to the present embodiment is different from the multilayer substrate 10 according to the first embodiment in that the ground conductor 40 has a conductor non-forming portion 400 and the shape of the third portion 33B of the signal conductor 30B. Different. Other configurations of the multilayer substrate 10B are the same as those of the multilayer substrate 10 according to the first embodiment, and the description of the same portions is omitted.
  • the ground conductor 40 has a conductor non-forming portion 400 in the region 110. Thereby, the flexibility of the region 110 of the multilayer substrate 10B is further increased, and the bending in the region 110 becomes easier.
  • the width of the third portion 33B of the signal conductor 30B is wider than the width of the third portion 33 of the signal conductor 30 according to the first embodiment. Since the ground conductor 40 includes the conductor non-forming portion 400, the capacitive coupling between the third portion 33B of the signal conductor 30B and the ground conductor 40 is increased even if the width of the third portion 33B of the signal conductor 30B is wide. Can be suppressed. As a result, the characteristic impedance of the region 110 can be matched with or close to the characteristic impedance of the regions 121 and 122. And the conductor loss by the signal conductor 30B can be reduced by the width
  • the multilayer substrate 10B can be easily folded by setting the region 110 as a bent portion in the same manner as the multilayer substrate 10 according to the first embodiment, and the ground conductors 40 and 50 by this bending can be easily bent. Breakage can be suppressed. Furthermore, the multilayer substrate 10B is easier to bend in the region 110, and the transmission loss is low.
  • FIG. 7 is an external perspective view of a multilayer substrate according to the fourth embodiment of the present invention.
  • the multilayer substrate 10C according to this embodiment is different from the multilayer substrate 10 according to the first embodiment in that the ground conductor 40 is not formed in the region 110 and in the shape of the third portion 33C of the signal conductor 30C. Different. Other configurations of the multilayer substrate 10C are the same as those of the multilayer substrate 10 according to the first embodiment, and the description of the same portions is omitted.
  • the ground conductor 41 ⁇ / b> B is formed on the first main surface of the region 121 of the multilayer body 20.
  • the ground conductor 42 ⁇ / b> B is formed on the first main surface of the region 122 of the multilayer body 20.
  • a ground conductor is not formed on the first main surface of the region 110 of the multilayer body 20.
  • the width of the third portion 33C of the signal conductor 30C is wider than the width of the third portion 33 of the signal conductor 30 according to the first embodiment. Due to the absence of the ground conductor in the region 110, even if the width of the third portion 33C of the signal conductor 30C is wide, the third portion 33C of the signal conductor 30C has capacitive coupling on the first main surface side of the multilayer body 20. Absent. As a result, the characteristic impedance of the region 110 can be matched with or close to the characteristic impedance of the regions 121 and 122. The conductor loss of the signal conductor 30C can be reduced by increasing the width of the third portion 33C.
  • the third portion 33C is equal to the width of the first portion 31 and the width of the second portion 32, or is larger than the width of the first portion 31 and the width of the second portion 32. It can also be widened.
  • the signal conductor has one aspect, but the above-described configuration can be applied even in an aspect in which a plurality of signal conductors are arranged in the width direction, that is, in a multicore configuration. A working effect can be obtained.
  • the multilayer substrate shown in each of the above-described embodiments can be used for electronic devices in the following various modes.
  • FIG. 8 is a diagram showing a first aspect of the electronic device according to the embodiment of the present invention.
  • the electronic device 1 includes a multilayer substrate 10 and mounting substrates 91 and 92.
  • the mounting boards 91 and 92 are each formed with a circuit that realizes a function of a different electronic circuit, and mounted components are mounted as necessary.
  • the mounting board 91 and the mounting board 92 are different in thickness. Therefore, the position of the surface of the mounting board 91 in the height direction of the electronic device 1 is different from the position of the surface of the mounting board 92.
  • Land conductors 911 are formed on the surface of the mounting substrate 91.
  • Land conductors 921 are formed on the surface of the mounting substrate 92.
  • the external connection conductor (corresponding to the external connection conductor 51 in FIG. 1) in the region 121 in the multilayer substrate 10 is connected to the land conductor 911.
  • the external connection conductor (corresponding to the external connection conductor 52 in FIG. 1) in the region 122 in the multilayer substrate 10 is connected to the land conductor 921.
  • the ground conductor (the ground conductor 50 in FIG. 1) of the multilayer substrate 10 is connected to the ground conductors (not shown) of the land conductors 911 and 921.
  • the multilayer substrate 10 Since the multilayer substrate 10 has high flexibility in the region 110, even if the region 121 and the region 122 are connected to the mounting substrate 91 and the mounting substrate 92 having different surface positions, the region 110 becomes a bent portion. Therefore, the multilayer substrate 10 is securely connected to the mounting substrate 91 and the mounting substrate 92.
  • FIG. 8 the aspect which connects the two mounting substrates 91 and 92 by the multilayer substrate 10 was shown.
  • two land conductors having different height positions on one mounting substrate can be connected by the multilayer substrate 10.
  • FIG. 9 is a diagram showing a second aspect of the electronic device according to the embodiment of the present invention.
  • the electronic apparatus 1 ⁇ / b> A includes multilayer substrates 10 ⁇ / b> D ⁇ b> 1 and 10 ⁇ / b> D ⁇ b> 2 and a mounting substrate 93.
  • the multilayer substrate 10D1 and the multilayer substrate 10D2 have the same structure as the multilayer substrate 10 according to the first embodiment.
  • the extending directions of the multilayer substrate 10D1 and the multilayer substrate 10D2 intersect each other.
  • the region 110D1 of the multilayer substrate 10D1 and the region 110D2 of the multilayer substrate 10D2 overlap.
  • the region 110D1 of the multilayer substrate 10D1 is curved in the thickness direction. Accordingly, the multilayer substrate 10D1 and the multilayer substrate 10D2 can be reliably connected to the mounting substrate 93 while the multilayer substrate 10D1 and the multilayer substrate 10D2 intersect.
  • the configurations of the multilayer substrates 10B and 10C according to the third and fourth embodiments can be used as the multilayer substrates 10D1 and 10D2.
  • FIG. 10 is a diagram showing a third aspect of the electronic apparatus according to the embodiment of the present invention.
  • the electronic device 1 ⁇ / b> B includes multilayer substrates 10 ⁇ / b> E ⁇ b> 1 and 10 ⁇ / b> E ⁇ b> 2 and a mounting substrate 93.
  • the multilayer substrate 10E1 has the same structure as the multilayer substrate 10A according to the second embodiment.
  • the multilayer substrate 10E2 is different from the multilayer substrate 10A according to the second embodiment in that the main surface forming the step is different.
  • the extending directions of the multilayer substrate 10E1 and the multilayer substrate 10E2 intersect each other.
  • the region 110E1 of the multilayer substrate 10E1 and the region 110E2 of the multilayer substrate 10E2 overlap.
  • the main surface having the step of the multilayer substrate 10E1 and the main surface having the step of the multilayer substrate 10E2 face each other. Accordingly, the multilayer substrate 10E1 and the multilayer substrate 10E2 can be reliably connected to the mounting substrate 93 while the multilayer substrate 10E1 and the multilayer substrate 10E2 intersect.
  • one multilayer substrate may be the multilayer substrate of the present invention, and the other multilayer substrate may be a multilayer substrate having a constant constant thickness.
  • 1, 1A, 1B Electronic device 10, 10A, 10B, 10C, 10D1, 10D2, 10E1, 10E2: Multilayer substrate 20, 20A: Laminate 21, 23, 24, 26, 221, 222, 251, 252: Resin layer 30, 30B, 30C: signal conductor 31: first part 32: second part 33, 33B, 33C: third part 40, 41B, 42B, 50: ground conductor 51, 52: external connection conductors 61, 62, 63: Interlayer connection conductors 91, 92, 93: mounting substrate 110: region 110D1: region 110D2: region 110E1: region 110E2: region 121: region 122: region 400: conductor non-forming portion 911, 921: land conductors UE41, UE42, UE51, UE52: Level difference

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  • Structure Of Printed Boards (AREA)

Abstract

Selon la présente invention, un stratifié (20) constituant un substrat multicouche (10) est formé par empilement d'une pluralité de couches de résine possédant chacune de la souplesse. Un conducteur de signal (30) est disposé à une position intermédiaire le long de la direction d'empilement de la pluralité de couches de résine dans le stratifié (20). Un conducteur de masse (40) est formé sur le stratifié (20) et est disposé avec un écartement par rapport au conducteur de signal (30) dans la direction d'empilement. Le stratifié (20) comprend une région (110) et une région (121) le long de la direction d'extension du conducteur de signal (30). Le nombre de couches de résine entre le conducteur de signal (30) et le conducteur de masse (40) dans la région (110) est inférieur au nombre de couches de résine entre le conducteur de signal (30) et le conducteur de masse (40) dans la région (121). Le conducteur de masse (40) dans la région (110) et le conducteur de masse (40) dans la région (121) existent sur une première face principale d'une couche de résine (21) et sont connectés l'un à l'autre.
PCT/JP2017/017773 2016-05-18 2017-05-11 Substrat multicouche et appareil électronique WO2017199824A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023135931A1 (fr) * 2022-01-13 2023-07-20 株式会社村田製作所 Substrat multicouche
US20230328883A1 (en) * 2018-12-17 2023-10-12 Murata Manufacturing Co., Ltd. Multilayer substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100842A (ja) * 2000-09-22 2002-04-05 Sumitomo Wiring Syst Ltd フレキシブルフラット配線板及びその内部インピーダンスの調整方法
JP2002280675A (ja) * 2001-03-22 2002-09-27 Nippon Mektron Ltd 異なる位相のケーブルを有するフレキシブルプリント基板
JP2006173239A (ja) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法とそれを用いた電子機器
JP2009054876A (ja) * 2007-08-28 2009-03-12 Sumitomo Bakelite Co Ltd プリント配線板
WO2011018979A1 (fr) * 2009-08-11 2011-02-17 株式会社村田製作所 Substrat à plusieurs couches

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100842A (ja) * 2000-09-22 2002-04-05 Sumitomo Wiring Syst Ltd フレキシブルフラット配線板及びその内部インピーダンスの調整方法
JP2002280675A (ja) * 2001-03-22 2002-09-27 Nippon Mektron Ltd 異なる位相のケーブルを有するフレキシブルプリント基板
JP2006173239A (ja) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法とそれを用いた電子機器
JP2009054876A (ja) * 2007-08-28 2009-03-12 Sumitomo Bakelite Co Ltd プリント配線板
WO2011018979A1 (fr) * 2009-08-11 2011-02-17 株式会社村田製作所 Substrat à plusieurs couches

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230328883A1 (en) * 2018-12-17 2023-10-12 Murata Manufacturing Co., Ltd. Multilayer substrate
WO2023135931A1 (fr) * 2022-01-13 2023-07-20 株式会社村田製作所 Substrat multicouche

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