WO2017197895A1 - 用于扬声器模组的吸音组件和扬声器模组 - Google Patents

用于扬声器模组的吸音组件和扬声器模组 Download PDF

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Publication number
WO2017197895A1
WO2017197895A1 PCT/CN2016/113239 CN2016113239W WO2017197895A1 WO 2017197895 A1 WO2017197895 A1 WO 2017197895A1 CN 2016113239 W CN2016113239 W CN 2016113239W WO 2017197895 A1 WO2017197895 A1 WO 2017197895A1
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WIPO (PCT)
Prior art keywords
sound
sound absorbing
speaker module
absorbing assembly
accommodating groove
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PCT/CN2016/113239
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English (en)
French (fr)
Inventor
陈阿亮
刘广福
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Goertek Inc
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Goertek Inc
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Priority to US16/098,678 priority Critical patent/US10701475B2/en
Publication of WO2017197895A1 publication Critical patent/WO2017197895A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/029—Manufacturing aspects of enclosures transducers

Definitions

  • the invention relates to the technical field of a speaker module, in particular to a sound absorbing component and a speaker module for a speaker module.
  • the wall thickness of the small cavity must be designed thick enough for supporting the mesh cloth, but this will cause the sound cavity space to be reduced and the sound quality to be reduced. Moreover, in this way, the injection molding yield is low, and the requirements for the injection molding machine are high, which leads to an increase in production cost.
  • the sound absorbing component and the speaker module for the speaker module of the present invention are proposed to overcome the above problems or at least partially solve The above question.
  • a sound absorbing assembly for a speaker module includes a carrier, the carrier is provided with a placement slot, and the placement slot is filled with a sound absorbing material,
  • the casing is fixed in the rear acoustic cavity of the speaker module by injection molding, and a sound hole is arranged on the bottom of the groove of the placement groove, and the inside of the placement groove communicates with the rear sound cavity through the sound hole.
  • the carrier is a metal stamping or an injection molded part.
  • the placement groove has a groove depth of 1.5 mm.
  • the metal stamping part is made of stainless steel or copper alloy, and the metal stamping part has a sheet thickness of 0.15 mm.
  • the two sides of the notch edge of the bracket are respectively provided with fixing ears, and the fixing ear is injection molded into the sound chamber housing of the speaker module when the bracket is injection molded.
  • the sound hole is disposed on a groove wall of the tray.
  • the sound hole has a circular shape, the aperture size is 0.1 mm, and the number of the sound holes is evenly distributed.
  • the sound absorbing material is a non-foamed porous particle.
  • a speaker module in which a sound absorbing assembly according to any of the above is installed in a sound chamber.
  • the bottom of the tray has a gap with the bottom of the rear sound chamber, and the gap distance is 0.8 mm.
  • the sound absorbing component of the present invention is provided with a placement groove on the tray, and a sound transmission channel is formed through the sound hole of the placement groove, so that the sound absorbing material placed in the placement groove functions as a sound absorbing function, thereby improving the sound quality of the speaker.
  • the thickness of the shell wall is thin and the strength is high, which can save the sound cavity space, which is beneficial to improve the sound quality of the product, and the shell is integrally molded and fixed in the rear sound cavity of the speaker module. Compared with the injection mesh, the injection yield is high, and the injection molding process is high. Lower requirements, cost savings, and mass production.
  • Figure 1 is a perspective view of a sound absorbing assembly of a sound absorbing assembly of the present invention
  • Figure 2 is a cross-sectional view of the sound absorbing assembly of the present invention
  • FIG. 3 is a schematic view showing the injection molding of the sound absorbing component of the present invention in a speaker module
  • Figure 4 is a cross-sectional view of the speaker module of the present invention.
  • Figure 5 is an exploded view of the speaker module of the present invention.
  • FIG. 1 is a perspective view of a sound absorbing assembly of the present invention
  • FIG. 2 is a cross-sectional view of the sound absorbing assembly of the present invention.
  • the sound absorbing assembly 1 for the speaker module includes a tray 11 which is provided with a placement groove 113.
  • the placement groove 113 is filled with a sound absorbing material 12, and the tray 11 is fixed to the speaker by injection molding.
  • a sound hole 111 is disposed on the bottom of the groove of the placement groove 113, and the inside of the placement groove 113 communicates with the rear sound cavity through the sound hole 111.
  • the sound hole 111 constitutes a passage for sound transmission, so that the sound absorbing material 12 placed in the groove 113 can exert a sound absorbing effect to improve the sound quality of the speaker.
  • the sound absorbing material 12 placed in the placement groove 113 is a non-foamed porous particle such as activated carbon, natural zeolite powder, activated silica, molecular sieve or the like.
  • the shell 11 is a metal stamping, the metal stamping is made of stainless steel or copper alloy, and the sheet metal stamping has a thickness of 0.15 mm.
  • the metal material can ensure the strength of the bracket 11 under the premise of saving the acoustic cavity space by using the thin-wall structure, and the sound absorbing material 12 is more stably loaded, and the stamping process is mature, the manufacturing cost is low, and the qualification rate is high.
  • the through hole 111 can be provided by etching on the stamping member.
  • the sound hole 111 has a circular shape with a pore size of 0.1 mm, and the number of the sound holes 111 is evenly distributed. More preferably, the sound hole 111 is also provided in the groove wall of the tray 11 to increase the sound passage, so that the sound absorbing material 12 exerts a better sound absorbing effect.
  • the groove 113 of the tray 11 has a groove depth of 1.5 mm. Of course, it can also be adjusted according to the size of the rear cavity of the speaker module. whole.
  • a fixing ear 112 is respectively disposed on two sides of the notch edge of the bracket 11 , and the fixing ear 112 is injected into the sound chamber casing of the speaker module when the bracket 11 is injection molded, and FIG. 3 is an injection molding of the sound absorbing component of the present invention in the speaker module.
  • the mounting schematic, as shown in FIG. 3, is molded into the sealed upper casing 5 of the speaker module.
  • the fixing ear 112 can also be provided with a positioning hole to ensure that the fixing of the bracket 11 can be more accurate and firm.
  • FIG. 4 is a cross-sectional view of the speaker module of the present invention, in which the sound absorbing assembly 1 shown in each of the above embodiments is mounted in the acoustic chamber 2, as shown in FIG. 4, when the bracket 11 is injection molded and fixed, the fixing ear 112 is molded by molding.
  • the speaker module is fixed in the sound chamber housing.
  • the bottom of the bracket 11 has a gap with the bottom of the rear acoustic cavity 2 of the speaker module, and the gap distance is 0.8 mm.
  • the arrangement of the gap ensures that a sound path is formed, and the sound is smoothly transmitted to the sound absorbing material 12 of the sound absorbing member 1, and a sound quality effect is obtained by the sound absorbing effect.
  • FIG. 5 is an exploded view of the speaker module of the present invention.
  • the speaker module includes a sealed lower case 3, a speaker unit 4, a sound absorbing assembly 1, a sealed upper case 5, a middle case 6, and a PET (Polyethylene terephthalate) piece. 7.
  • the above structures are assembled in order from top to bottom to constitute the speaker module of the present invention.
  • the sound absorbing assembly of the present invention is provided with a placement slot on the tray, and a sound transmission channel is formed through the sound hole of the slot, so that the sound absorbing material placed in the placement slot functions as a sound absorbing function, thereby improving the sound quality of the speaker.
  • the bracket is made of stamping parts, the wall thickness is thin, the strength is high, the sound cavity space can be saved, the sound quality of the product is improved, and the shell is integrated, and the injection molding is fixed in the rear sound cavity of the speaker module, compared with The injection molding mesh on the small cavity has high injection yield and low requirements for the injection molding process, which can save costs and facilitate mass production.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开了用于扬声器模组的吸音组件和扬声器模组。该吸音组件包括托壳，托壳设置有放置槽，放置槽内填充有吸音材料，托壳通过注塑固定在扬声器模组的后声腔内，放置槽的槽底上设置有通音孔，放置槽内部通过通音孔与后声腔连通。本发明的吸音组件在托壳上设置有放置槽，通过放置槽的通音孔形成传音通道，使放置槽内放置的吸音材料发挥吸音功能，改善扬声器的音质。托壳壁厚薄，强度高，可以节省声腔空间，有利于提高产品音质，且托壳整体注塑固定在扬声器模组的后声腔内，相比于注塑网布，其注塑良率高，对注塑工艺要求更低，能节省成本，利于批量生产。

Description

用于扬声器模组的吸音组件和扬声器模组 技术领域
本发明涉及扬声器模组技术领域，特别涉及用于扬声器模组的吸音组件和扬声器模组。
发明背景
近几年来，市场对扬声器模组的性能要求越来越高，吸音颗粒的应用也越来越多。现有技术在扬声器模组内应用吸音颗粒时，多为在扬声器壳体内的后声腔中设计一小腔体，该小腔体中填充吸音颗粒，并通过一体成型技术，在小腔体通音孔处注塑网布形成封口装置，小腔体通过网布与音腔连通，吸音颗粒发挥吸音作用。
此种设计，为了保证网布能够牢固注塑在小腔体上，小腔体的壁厚必须设计足够厚，用于托载网布，但是这会造成声腔空间缩小，音响品质降低。而且采用此种方式，注塑成型良率低，对注塑机台要求高，会导致生产成本增加。
发明内容
鉴于现有技术的吸音颗粒填充结构造成的声腔空间缩小和注塑成型良率低等问题，提出了本发明的用于扬声器模组的吸音组件和扬声器模组，以便克服上述问题或者至少部分地解决上述问题。
依据本发明的一个方面，提供了一种用于扬声器模组的吸音组件，所述吸音组件包括托壳，所述托壳设置有放置槽，所述放置槽内填充有吸音材料，所述托壳通过注塑固定在扬声器模组的后声腔内，所述放置槽的槽底上设置有通音孔，所述放置槽内部通过所述通音孔与后声腔连通。
可选地，所述托壳为金属冲压件，或为注塑件。
可选地，所述放置槽的槽深为1.5mm。
可选地，所述金属冲压件的材质为不锈钢或铜合金，金属冲压件的板材厚度为0.15mm。
可选地，所述托壳的槽口边缘两侧分别设置有固定耳，所述托壳注塑固定时所述固定耳注塑在扬声器模组的音腔壳体内。
可选地，所述托壳的槽壁上设置有所述通音孔。
可选地，所述通音孔为圆形形状，孔径大小为0.1mm，通音孔数量均匀分布。
可选地，所述吸音材料为非发泡多孔颗粒。
依据本发明的另一个方面，提供了一种扬声器模组，该扬声器模组后声腔内安装有上述任一项所述的吸音组件。
可选地，所述托壳底部与后声腔底部具有间隙，所述间隙距离是0.8mm。
本发明的优点是：
本发明的吸音组件在托壳上设置有放置槽，通过放置槽的通音孔形成传音通道，使放置槽内放置的吸音材料发挥吸音功能，改善扬声器的音质。托壳壁厚薄，强度高，可以节省声腔空间，有利于提高产品音质，且托壳整体注塑固定在扬声器模组的后声腔内，相比于注塑网布，其注塑良率高，对注塑工艺要求更低，能节省成本，利于批量生产。
附图简要说明
图1为本发明吸音组件的吸音组件立体图；
图2为本发明吸音组件的剖面图；
图3为本发明吸音组件在扬声器模组内的注塑安装示意图；
图4为本发明的扬声器模组剖面图；
图5为本发明的扬声器模组爆炸图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。
图1为本发明的吸音组件立体图，图2为本发明吸音组件的剖面图。
如图1-2所示，用于扬声器模组的吸音组件1，包括托壳11，托壳11设置有放置槽113，放置槽113内填充有吸音材料12，托壳11通过注塑固定在扬声器模组的后声腔内，放置槽113的槽底上设置有通音孔111，放置槽113内部通过通音孔111与后声腔连通。通音孔111构成声音传输的通道，使得放置槽113内的吸音材料12可以发挥吸音作用，改善扬声器的音质。
放置槽113内放置的吸音材料12为非发泡多孔颗粒，例如活性炭、天然沸石粉、活性二氧化硅和分子筛等。
托壳11为金属冲压件，金属冲压件的材质为不锈钢或铜合金，金属冲压件的板材厚度为0.15mm。采用金属材质，能保证在利用薄壁结构节省声腔空间的前提下，保证托壳11的强度，更稳固地装载吸音材料12，并且冲压工艺成熟，制作成本低，合格率高。在冲压之前，冲压件上可以通过蚀刻的方式设置通音孔111。
通音孔111为圆形形状，孔径大小为0.1mm，通音孔111数量均匀分布。更优选地，托壳11的槽壁上也设置有通音孔111，以此增加声音通道，使吸音材料12发挥更好的吸音效果。
托壳11的放置槽113槽深为1.5mm，当然，也可以根据扬声器模组的后声腔尺寸进行调 整。
托壳11的槽口边缘两侧分别设置有固定耳112，托壳11注塑固定时固定耳112注塑在扬声器模组的音腔壳体内，图3为本发明吸音组件在扬声器模组内的注塑安装示意图，如图3所示，该吸音组件1注塑在扬声器模组的密封上壳5内。优选地，固定耳112上还可以设置定位孔，保证托壳11的固定能够更准确牢固。
图4为本发明的扬声器模组剖面图，其后声腔2内安装有上述各实施例所示的吸音组件1，如图4所示，托壳11注塑固定时，通过将固定耳112注塑在扬声器模组的音腔壳体内实现固定。托壳11底部与该扬声器模组的后声腔2底部具有间隙，间隙距离是0.8mm。间隙的设置能够保证形成声音通路，顺利地将声音传输到吸音组件1的吸音材料12，通过吸音作用获得更好的音质效果。
图5为本发明的扬声器模组爆炸图。如图5所示，该扬声器模组包括密封下壳3、扬声器单体4、吸音组件1、密封上壳5、中壳6和PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)片7，上述结构自上而下依次组装在一起构成本发明的扬声器模组。
综上所述，本发明的吸音组件在托壳上设置有放置槽，通过放置槽的通音孔形成传音通道，使放置槽内放置的吸音材料发挥吸音功能，改善扬声器的音质。在优选方案中，托壳采用冲压件，壁厚薄，强度高，可以节省声腔空间，有利于提高产品音质，且托壳为一整体，注塑固定在扬声器模组的后声腔内，相比于在小腔体上注塑网布，托壳的注塑良率高，对注塑工艺要求更低，能节省成本，利于批量生产。
以上所述仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内所作的任何修改、等同替换、改进等，均包含在本发明的保护范围内。

Claims (10)

  1. 用于扬声器模组的吸音组件，其特征在于，所述吸音组件包括托壳，所述托壳设置有放置槽，所述放置槽内填充有吸音材料，所述托壳通过注塑固定在扬声器模组的后声腔内，所述放置槽的槽底上设置有通音孔，所述放置槽内部通过所述通音孔与后声腔连通。
  2. 如权利要求1所述的吸音组件，其特征在于，所述托壳为金属冲压件。
  3. 如权利要求1所述的吸音组件，其特征在于，所述放置槽的槽深为1.5mm。
  4. 如权利要求2所述的吸音组件，其特征在于，所述金属冲压件的材质为不锈钢或铜合金，金属冲压件的板材厚度为0.15mm。
  5. 如权利要求1所述的吸音组件，其特征在于，所述托壳的槽口边缘两侧分别设置有固定耳，所述托壳注塑固定时所述固定耳注塑在扬声器模组的音腔壳体内。
  6. 如权利要求1所述的吸音组件，其特征在于，所述托壳的槽壁上设置有所述通音孔。
  7. 如权利要求1所述的吸音组件，其特征在于，所述通音孔为圆形形状，孔径大小为0.1mm，通音孔数量均匀分布。
  8. 如权利要求1所述的吸音组件，其特征在于，所述吸音材料为非发泡多孔颗粒。
  9. 一种扬声器模组，其特征在于，该扬声器模组后声腔内安装有如权利要求1-8任一项所述的吸音组件。
  10. 如权利要求9所述的扬声器模组，其特征在于，所述托壳底部与后声腔底部具有间隙，所述间隙距离是0.8mm。
PCT/CN2016/113239 2016-05-20 2016-12-29 用于扬声器模组的吸音组件和扬声器模组 Ceased WO2017197895A1 (zh)

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Application Number Priority Date Filing Date Title
US16/098,678 US10701475B2 (en) 2016-05-20 2016-12-29 Sound absorbing assembly for speaker module and speaker module

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