WO2017191781A1 - Film électroconducteur anisotrope - Google Patents

Film électroconducteur anisotrope Download PDF

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Publication number
WO2017191781A1
WO2017191781A1 PCT/JP2017/016345 JP2017016345W WO2017191781A1 WO 2017191781 A1 WO2017191781 A1 WO 2017191781A1 JP 2017016345 W JP2017016345 W JP 2017016345W WO 2017191781 A1 WO2017191781 A1 WO 2017191781A1
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WIPO (PCT)
Prior art keywords
conductive particles
conductive film
anisotropic conductive
repeating unit
anisotropic
Prior art date
Application number
PCT/JP2017/016345
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English (en)
Japanese (ja)
Inventor
怜司 塚尾
恭志 阿久津
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017085744A external-priority patent/JP7274811B2/ja
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020217011350A priority Critical patent/KR20210046827A/ko
Priority to CN202110776384.6A priority patent/CN113707361B/zh
Priority to US16/085,515 priority patent/US11794444B2/en
Priority to CN201780025115.8A priority patent/CN109074894B/zh
Priority to KR1020187021398A priority patent/KR102243340B1/ko
Publication of WO2017191781A1 publication Critical patent/WO2017191781A1/fr

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Definitions

  • the present invention relates to an anisotropic conductive film.
  • anisotropic conductive film in which conductive particles are dispersed in an insulating resin binder is widely used when an electronic component such as an IC chip is mounted on a wiring board or the like.
  • anisotropic conductive films by narrowing the pitch of bumps due to high-density mounting of electronic components, it is strongly required to improve the trapping property of conductive particles in the bumps and avoid short circuit between adjacent bumps. .
  • the arrangement of conductive particles in the anisotropic conductive film is arranged in a lattice pattern, and the arrangement axis is inclined with respect to the longitudinal direction of the anisotropic conductive film. It has been proposed that the distance be separated by a predetermined ratio (Patent Document 1, Patent Document 2). In addition, it has also been proposed that the conductive particles form a dense region locally by connecting the conductive particles to cope with a narrow pitch (Patent Document 3).
  • the bump layout corresponds to the inclination angle of the arrangement axis and the distance between the conductive particles. Therefore, if the bumps have a narrow pitch, the distance between the conductive particles must be reduced, and it becomes difficult to avoid a short circuit. In addition, the number density of the conductive particles increases, and the manufacturing cost of the anisotropic conductive film also increases.
  • the method in which the conductive particles form a locally dense region by connecting the conductive particles is not preferable because the risk of short-circuiting increases when a plurality of connected conductive particles simultaneously enter the space between the bumps.
  • an object of the present invention is to provide an anisotropic conductive film that can deal with bumps of a narrow pitch and can reduce the number density of conductive particles as compared with a conventional anisotropic conductive film.
  • the present inventor can form a dense region of conductive particles on the entire surface of the anisotropic conductive film by repeatedly arranging conductive particle units in which the conductive particles are in a specific arrangement while being spaced apart from each other on the entire surface of the anisotropic conductive film. Bumps with a narrow pitch can be connected in the dense area of the sparse / dense area, and the conductive particles are separated from each other even in the dense area, thereby reducing the risk of short circuit.
  • the inventors have found that the number density of particles can be reduced and have come up with the present invention.
  • the present invention is an anisotropic conductive film in which conductive particles are arranged in an insulating resin binder, Provided is an anisotropic conductive film in which conductive particle repeating units are arranged in which conductive particles are arranged in a row at intervals and in which conductive particles having different numbers of conductive particles are arranged in parallel.
  • the conductive particles are not arranged in a simple grid pattern, but the repeating units of the conductive particles having a specific particle arrangement are repeatedly arranged, the conductive particles are densely arranged on the film. Since the region can be formed, an increase in the number density of conductive particles can be suppressed in the entire anisotropic conductive film. Therefore, an increase in manufacturing cost accompanying an increase in the number density of conductive particles can be suppressed. In general, as the number density of conductive particles increases, the thrust required for the pressing jig during anisotropic conductive connection also increases.
  • the number density of conductive particles Since the increase in thrust required for the pressing jig at the time of anisotropic conductive connection is also suppressed by the suppression of the increase in the electrical conductivity, it is possible to prevent the electronic component from being deformed by the anisotropic conductive connection. Further, since excessive thrust is not required for the pressing jig, the thrust of the pressing jig is stabilized, so that the quality such as the conduction characteristics of the electronic parts connected anisotropically is stabilized.
  • the anisotropic conductive film of the present invention since the repeating unit in which the conductive particles are dense regions is repeatedly formed in the vertical and horizontal directions, it is possible to connect bumps with a narrow pitch. Furthermore, since the conductive particles are separated from each other in the repeating unit, it is possible to avoid occurrence of a short circuit even when the repeating unit straddles the inter-terminal space.
  • FIG. 1A is a plan view showing the arrangement of conductive particles of the anisotropic conductive film 1A of the example.
  • FIG. 1B is a cross-sectional view of the anisotropic conductive film 1A of the example.
  • FIG. 2 is a plan view of the anisotropic conductive film 1B of the example.
  • FIG. 3 is a plan view of the anisotropic conductive film 1C of the example.
  • FIG. 4 is a plan view of the anisotropic conductive film 1D of the example.
  • FIG. 5 is a plan view of the anisotropic conductive film 1E of the example.
  • FIG. 6 is a plan view of the anisotropic conductive film 1F of the example.
  • FIG. 1A is a plan view showing the arrangement of conductive particles of the anisotropic conductive film 1A of the example.
  • FIG. 1B is a cross-sectional view of the anisotropic conductive film 1A of the example.
  • FIG. 2 is
  • FIG. 7 is a plan view of the anisotropic conductive film 1G of the example.
  • FIG. 8 is a plan view of the anisotropic conductive film 1H of the example.
  • FIG. 9 is a plan view of the anisotropic conductive film 1I of the example.
  • FIG. 10 is a plan view of the anisotropic conductive film 1J of the example.
  • FIG. 11 is a plan view of the anisotropic conductive film 1K of the example.
  • FIG. 12 is a cross-sectional view of the anisotropic conductive film 1a of the example.
  • FIG. 13 is a cross-sectional view of the anisotropic conductive film 1b of the example.
  • FIG. 14 is a cross-sectional view of the anisotropic conductive film 1c of the example.
  • FIG. 15 is a cross-sectional view of the anisotropic conductive film 1d of the example.
  • FIG. 16 is a cross-sectional view of the anisotropic
  • FIG. 1A is a plan view showing the arrangement of conductive particles of an anisotropic conductive film 1A according to an embodiment of the present invention
  • FIG. 1B is a cross-sectional view thereof.
  • the anisotropic conductive film 1A has a structure in which the conductive particles 2 are arranged in a single layer on the surface of the insulating resin binder 3 or in the vicinity thereof, and the insulating adhesive layer 4 is laminated thereon.
  • the anisotropic conductive film of the present invention may have a configuration in which the insulating adhesive layer 4 is omitted and the conductive particles 2 are embedded in the insulating resin binder 3.
  • the electroconductive particle 2 what is used in the well-known anisotropic conductive film can be selected suitably, and can be used. Examples thereof include metal particles such as nickel, copper, silver, gold, and palladium, and metal-coated resin particles in which the surfaces of resin particles such as polyamide and polybenzoguanamine are coated with a metal such as nickel.
  • the size of the conductive particles to be disposed is preferably 1 to 30 ⁇ m, more preferably 1 ⁇ m to 10 ⁇ m, and further preferably 2 ⁇ m to 6 ⁇ m.
  • the average particle diameter of the conductive particles 2 can be measured by an image type or laser type particle size distribution meter. You may obtain
  • the surface of the conductive particles 2 is preferably covered with an insulating coat or an insulating particle treatment. Such a coating is easily peeled off from the surface of the conductive particles 2 and does not hinder anisotropic connection. Further, protrusions may be provided on the entire surface or a part of the surface of the conductive particles 2. The height of the protrusion is preferably within 20% of the conductive particle diameter, and preferably within 10%.
  • the arrangement of the conductive particles 2 in a plan view of the anisotropic conductive film 1A is such that the repeating unit 5 in which the conductive particle arrays 2p, 2q, and 2r and the single conductive particles 2s are juxtaposed is vertically and horizontally on the entire surface of the anisotropic conductive film 1A (
  • the polygon formed by sequentially connecting the centers of the conductive particles forming the outer shape of the repeating unit 5 is a triangle.
  • the anisotropic conductive film of this invention can have the area
  • the conductive particles 2 are arranged in a straight line at intervals in a plan view.
  • the number of conductive particles constituting the conductive particle rows 2p, 2q, and 2r is gradually different, and the conductive particle rows 2p, 2q, and 2r are arranged in parallel.
  • the number density of the conductive particles is locally sparsely formed. Even when there is a minute positional deviation when attached to the surface, it becomes easy to capture a stable number of conductive particles in any bump constituting the bump row.
  • the conductive particles are captured at any part of the bump length range by causing the number density of the conductive particles to be sparse and dense in the bump length range.
  • a position where the conductive particles are captured and a position where the conductive particles are not captured are generated simultaneously by one bump. Accordingly, if the bump shape (area) is the same in any of the bump arrangements, the number of conductive particles captured by the bumps can be stabilized by appropriately setting the repeat interval of the repeat unit. Therefore, even if a slight misalignment occurs in the application of the anisotropic conductive film, the state of capturing conductive particles in the bump array for each connection body when the connection body is continuously manufactured on the production line It becomes easier to stabilize.
  • the arrangement of the conductive particles 2 in the repeating unit 5 is an arrangement in which a part of the conductive particles 2 constituting the repeating unit 5 occupies a part of the apex of each hexagon when the regular hexagons are arranged without gaps. ing.
  • the arrangement is such that the vertices of the regular triangle when the regular triangles are arranged without a gap and the conductive particles constituting the repeating unit 5 overlap.
  • the remaining arrangement in which the conductive particles at predetermined lattice points are regularly removed from the arrangement in which the conductive particles exist at each lattice point of the hexagonal lattice arrangement is the repeating unit 5.
  • the conductive particles 2 are arranged at the lattice points of the hexagonal lattice arrangement in this way, the particle arrangement of the repeating unit 5 can be easily recognized and the design can be facilitated.
  • the arrangement of the conductive particles in the repeating unit is not limited to that based on a hexagonal lattice, but may be based on a square lattice. It may be based on an arrangement in which the sides of the regular polygon to be overlapped.
  • repeating unit 5 More specifically, the repetition of the repeating unit 5 in the anisotropic conductive film 1A shown in FIG. 1A is repeated in the X direction at intervals of particles in the repeating unit 5. Further, in the Y direction, a repeating unit 5B obtained by inverting the repeating unit 5 around the symmetry axis in the Y direction and the repeating unit 5 are alternately repeated with an interval. In this case, the position on the side in the longitudinal direction of the anisotropic conductive film when a polygon formed by sequentially connecting the centers of the conductive particles forming the outer shape of the repeating unit is projected in the short direction of the anisotropic conductive film.
  • the same position of the repeating unit adjacent to the repeating unit is partially overlapped.
  • the width direction of the terminal of the electronic component is the longitudinal direction of the anisotropic conductive film
  • the conductive particles are captured by the terminal of the electronic component when the polygon forming the outer shape of the repeating unit is overlapped as described above. This is because the probability increases.
  • a unit including the repeating unit 5 and the repeating unit 5B obtained by inverting the repeating unit 5 can be regarded as a repeating unit of the conductive particles.
  • the unit is a unit in which a plurality of conductive particle arrays are arranged in parallel, and is the smallest unit that is repeated vertically and horizontally.
  • the size of the anisotropic conductive film of the repeating unit 5 and the distance between the repeating units are preferably determined by the bump width of the electronic component connected by the anisotropic conductive film 1A and the size of the space between the bumps.
  • the size of the repeating unit 5 in the longitudinal direction of the anisotropic conductive film is preferably smaller than the narrower one of the bump width and the space between the bumps. Even if it is such a size, the repeating unit 5 is repeatedly arranged, so that the minimum number of conductive particles necessary for connection can be captured by the bump, and the number of conductive particles not involved in connection can be reduced. Thus, the cost of the anisotropic conductive film can be reduced.
  • by making the polygonal sides forming the outer shape of the repeating unit 5 skew in the short direction of the anisotropic conductive film 1A stable connection performance can be achieved regardless of the cutting position of the long anisotropic conductive film. Obtainable.
  • the distance between adjacent repeating units 5 and 5B in the longitudinal direction of the anisotropic conductive film when the connection target is a non-fine pitch may be shorter than the space between the bumps of the electronic component connected by the anisotropic conductive film. preferable.
  • connection target is a fine pitch
  • size of the repeating units 5 and 5B in the longitudinal direction of the anisotropic conductive film is set so as to straddle the space between the bumps.
  • the boundary between the fine pitch and the non-fine pitch can be a fine pitch when the bump width is less than 30 ⁇ m, and a non-fine pitch of 30 ⁇ m or more.
  • the number of conductive particles constituting the repeating unit 5 is preferably 5 or more, more preferably 10 or more, and further more than 20 preferable. In general, it is preferable that 3 or more, particularly 10 or more conductive particles are captured between opposing terminals connected by anisotropic conductive connection, so that when a repeating unit is sandwiched between opposing terminals This is because it is possible to confirm from the indentation of one repeating unit that such a number of conductive particles are captured.
  • the arrangement of the conductive particles 2 in the repeating unit 5 and the vertical and horizontal repeating pitches of the repeating unit 5 can be appropriately changed according to the shape of the terminal to be connected for anisotropic conductive connection and the pitch of the terminal. it can. Therefore, as compared with the case where the conductive particles 2 are arranged in a simple lattice pattern, the entire anisotropic conductive film can achieve high trapping properties with a small number of conductive particles.
  • the repeating units 5 may be repeated in a staggered arrangement like an anisotropic conductive film 1B shown in FIG.
  • the staggered array the effect of resin flow on the conductive particles during anisotropic conductive connection of electronic components differs between the bumps located in the center of the staggered array and the bumps located outside, and the bumps in the center of the staggered array Since the short-circuit risk is different between the bump located on the outer side and the bump located on the outer side, the flow of the resin flow can be adjusted by appropriately changing the shape of the repeating unit 5.
  • the arrangement of the conductive particles 2 in the repeating unit 5 can also be changed as appropriate according to the shape of the terminal to be connected for anisotropic conductive connection and the pitch of the terminals.
  • the number of conductive particles constituting the conductive particle array 2p in one repeating unit 5 may be gradually increased and decreased. Single conductive particles 2s may be repeatedly arranged.
  • the number of conductive particles constituting the central conductive particle row is reduced even if it is greater than the number of conductive particles constituting the conductive particle rows on both sides. Also good.
  • each repeating unit 5 in each repeating unit 5, the conductive particle row 2p in which four conductive particles 2 are arranged in the longitudinal direction of the anisotropic conductive film and the conductive in which two conductive particles are arranged.
  • the particle array 2q, three conductive particle arrays 2r and one conductive particle 2s are arranged in parallel.
  • the outer shape of the repeating unit becomes a complex polygonal shape, and it is easy to cope with the connection of radial bump arrays (so-called fan-out bumps).
  • the arrangement of the conductive particles in one repeating unit is represented by the number of conductive particles in the conductive particle array constituting the repeating unit.
  • the repeating unit shown in FIG. 4 is represented by [4-2-3-1].
  • An example is [4-2-3-2-1-4-3].
  • the distance between the conductive particles in one conductive particle row may be the same or different between the conductive particle rows arranged in parallel in one repeating unit.
  • the outer shape of the repeating unit 5 may be a rhombus, and the conductive particles 2 may be arranged at the center.
  • a conductive particle array 2m composed of five conductive particles
  • a conductive particle array 2n composed of two conductive particles
  • a conductive particle array 2o composed of three conductive particles
  • two conductive particles two conductive particles.
  • the conductive particle row 2p and the conductive particle row 2q composed of five conductive particles are arranged in parallel, the distance between the conductive particles in the conductive particle rows 2m and 2q, the distance between the conductive particles in the conductive particle rows 2n and 2p, and the conductive The distance between the conductive particles in the particle row 2o is different from each other.
  • the arrangement may be such that the conductive particles at the center of 3 are removed. This is because the risk of occurrence of a short circuit can be further reduced.
  • the arrangement of the conductive particles 2 in the repeating units 5 and 5B exists at the lattice points of the hexagonal lattice, but the conductive particle rows 2p are arranged in parallel. As long as it exists, it is good also as an arrangement
  • An anisotropic conductive film 1G shown in FIG. 7 includes a repeating unit 5 composed of two rows of conductive particles 2p and 2q, and a repeating unit 5B obtained by rotating the arrangement axis of the conductive particles of the repeating unit 5 by 60 °. It is repeatedly arranged on the entire film surface. In this way, a certain repeating unit and a repeating unit obtained by rotating it by a predetermined angle may be used in combination.
  • a polygon formed by sequentially connecting the conductive particles forming the outer shape may be a regular polygon. This is preferable because the arrangement of the conductive particles can be easily recognized.
  • each conductive particle forming the repeating unit may not be present at a lattice point of a hexagonal lattice or a tetragonal lattice.
  • the outer shape of the repeating unit 5 can be formed into a regular octagon like an anisotropic conductive film 1H shown in FIG.
  • the conductive particles forming the outer shape of the repeating unit are arranged at the apexes of the regular octagon of the lattice in which regular octagons are arranged vertically and horizontally and the sides of adjacent regular octagons are overlapped as shown by a broken line in FIG. Has been placed.
  • the conductive particles may be arranged at the vertices of a regular dodecagon or higher regular polygon.
  • the repeating unit 5 of the anisotropic conductive film 1I shown in FIG. 9 is formed from the conductive particles 2 arranged on the lattice points of a square lattice, and is also short in the longitudinal direction of the anisotropic conductive film. Is a symmetrical octagon. Thereby, the arrangement of the conductive particles can be easily recognized.
  • the conductive particle rows arranged in parallel in the repetitive unit do not necessarily have to be parallel, and may be arranged in a radial pattern.
  • the repeating units 5 having the conductive particle arrays 2m, 2n, 2o, 2p, and 2q arranged radially can be repeatedly arranged in the vertical and horizontal directions.
  • the conductive particles 2 do not have to exist at lattice points of a hexagonal lattice or a tetragonal lattice.
  • each side of the triangle 5x formed by sequentially connecting the centers of the conductive particles forming the outer shape of the repeating unit 5 is anisotropic. It crosses with the longitudinal direction or the transversal direction of the conductive film 1A. Thereby, the outer tangent L1 of the conductive particle 2a in the longitudinal direction of the anisotropic conductive film penetrates the conductive particle 2b adjacent to the conductive particle 2a in the longitudinal direction of the anisotropic conductive film.
  • the outer tangent L2 of the conductive particles 2a in the short direction of the anisotropic conductive film penetrates the conductive particles 2c adjacent to the conductive particles 2a in the short direction of the anisotropic conductive film.
  • the side of the polygon 5x of the repeating unit 5 is the longitudinal direction or the short direction of the anisotropic conductive film 1A.
  • the polygon 5x formed by the conductive particles forming the outer shape of the repeating unit 5 does not necessarily include all the sides. May not be obliquely crossed with the longitudinal direction or the short direction of the anisotropic conductive film, but from the viewpoint of trapping the conductive particles, preferably two or more sides, more preferably three or more sides are anisotropically conductive. It is preferable that it is crossed with the longitudinal direction or the transversal direction of the film.
  • the polygon forming the repeating unit has a side in the longitudinal direction or the short direction of the anisotropic conductive film. That is, in order to prevent the bumps to be connected from being displaced even by thermal expansion of the base material on which the bumps are provided, the bump arrangement pattern may be made radial (for example, Japanese Patent Application Laid-Open No. 2007-19550). In that case, the angle formed by the longitudinal direction of each bump and the longitudinal direction of the anisotropic conductive film changes gradually.
  • the repeating unit 5 without repeating the polygonal sides of the repeating unit 5 with the longitudinal direction or the short direction of the anisotropic conductive film, the repeating unit 5 with respect to the longitudinal edges of the individual bumps arranged radially, The sides of the 5B polygon are crossed. Therefore, it is possible to avoid a phenomenon in which most of the conductive particles applied to the edge of the bump at the time of anisotropic conductive connection are not captured by the bump and the capturing property of the conductive particle is lowered.
  • the radial arrangement pattern of the bumps is usually formed symmetrically.
  • the polygon that forms the outer shape of the repeating unit 5 has the longitudinal or short side of the anisotropic conductive film. It is preferable to have. Therefore, for example, when the repeating unit is a triangular shape similar to the anisotropic conductive film 1A shown in FIG. 1A, the triangular shape forming the outer shape of the repeating unit 5 like the anisotropic conductive film 1K shown in FIG. It is preferable to arrange
  • positioning of the electrically-conductive particle in this invention it is not limited to the arrangement
  • the illustrated arrangement may be inclined.
  • an aspect in which the film is inclined by 90 °, that is, a mode in which the longitudinal direction and the short direction of the film are interchanged is also included.
  • interval of the electrically-conductive particle in a repeating unit may be used.
  • the distance between the nearest adjacent particles of the conductive particles is preferably 0.5 times or more the average conductive particle diameter both between the adjacent conductive particles in the repeating unit 5 and between the adjacent conductive particles in the repeating unit 5.
  • the distance between the repeating units 5 is preferably longer than the distance between adjacent conductive particles in the repeating unit 5. If this distance is too short, a short circuit is likely to occur due to contact between the conductive particles.
  • the upper limit of the distance between adjacent conductive particles is determined according to the bump shape and bump pitch.
  • the distance between the conductive particles is less than 400 ⁇ m when at least one conductive particle is present in either the bump width or the space between the bumps.
  • the thickness is preferably less than 200 ⁇ m.
  • the number density of the conductive particles is a conductive material because it suppresses the manufacturing cost of the anisotropic conductive film and prevents the thrust required for the pressing jig used for anisotropic conductive connection from becoming excessively large.
  • the average particle diameter of the particles is less than 10 ⁇ m, 50000 / mm 2 or less is preferable, 35000 / mm 2 or less is more preferable, and 30000 / mm 2 or less is more preferable.
  • the number density of the conductive particles is preferably 300 / mm 2 or more, more preferably 500 / mm 2 or more, since there is a concern about poor conduction due to insufficient capture of the conductive particles at the terminal if the number density is too small. 800 pieces / mm 2 or more is more preferable.
  • the average particle diameter of the conductive particles is 10 ⁇ m or more, 15 particles / mm 2 or more is preferable, 50 particles / mm 2 or more is more preferable, and 160 particles / mm 2 or more is even more preferable.
  • the occupied area ratio of the conductive particles also increases.
  • it is preferably 1800 pieces / mm 2 or less, more preferably 1100 pieces / mm 2 or less, and further preferably 800 pieces / mm 2 or less.
  • the number density of the conductive particles may be locally deviated (for example, 200 ⁇ m ⁇ 200 ⁇ m) from the number density described above.
  • thermopolymerizable composition As the insulating resin binder 3, a thermopolymerizable composition, a photopolymerizable composition, a photothermal combined polymerizable composition, etc. that are used as an insulating resin binder in a known anisotropic conductive film are appropriately selected and used. can do.
  • thermo polymerizable composition a thermal radical polymerizable resin composition containing an acrylate compound and a thermal radical polymerization initiator, a thermal cationic polymerizable resin composition containing an epoxy compound and a thermal cationic polymerization initiator, and an epoxy compound And a thermal anion polymerization initiator containing a thermal anion polymerization initiator, and the photopolymerizable composition includes a photo radical polymerizable resin composition containing an acrylate compound and a photo radical polymerization initiator.
  • a plurality of types of polymerizable compositions may be used in combination. Examples of the combination include the combined use of a thermal cationic polymerizable composition and a thermal radical polymerizable composition.
  • the photopolymerization initiator a plurality of types that react to light having different wavelengths may be contained. This makes it possible to use different wavelengths for the photocuring of the resin constituting the insulating resin layer during the production of the anisotropic conductive film and the photocuring of the resin for adhering the electronic components during the anisotropic connection. be able to.
  • the insulating resin binder 3 When the insulating resin binder 3 is formed using a photopolymerizable composition, all or part of the photopolymerizable compound contained in the insulating resin binder 3 is obtained by photocuring during the production of the anisotropic conductive film. Can be photocured. By this photocuring, the arrangement of the conductive particles 2 in the insulating resin binder 3 is maintained or fixed, and it is expected that the short circuit is suppressed and the capture is improved. Moreover, the viscosity of the insulating resin layer in the manufacturing process of an anisotropic conductive film can be adjusted by adjusting the conditions of this photocuring.
  • the blending amount of the photopolymerizable compound in the insulating resin binder 3 is preferably 30% by mass or less, more preferably 10% by mass or less, and more preferably less than 2% by mass. This is because when the amount of the photopolymerizable compound is too large, the thrust applied to the indentation at the time of anisotropic conductive connection increases.
  • the heat-polymerizable composition contains a heat-polymerizable compound and a heat-polymerization initiator.
  • the heat-polymerizable compound one that also functions as a photopolymerizable compound may be used.
  • you may make a thermopolymerizable composition contain a photopolymerizable initiator while containing a photopolymerizable compound separately from a thermopolymerizable compound.
  • a photopolymerizable compound and a photopolymerization initiator are contained separately from the thermally polymerizable compound.
  • a thermal cationic polymerization initiator is used as the thermal polymerization initiator
  • an epoxy resin is used as the thermopolymerizable compound
  • a photoradical initiator is used as the photopolymerization initiator
  • an acrylate compound is used as the photopolymerizable compound.
  • the insulating resin binder 3 may include a cured product of these polymerizable compositions.
  • acrylate compound used as the heat or photopolymerizable compound a conventionally known thermal polymerization type (meth) acrylate monomer can be used.
  • a monofunctional (meth) acrylate monomer or a bifunctional or higher polyfunctional (meth) acrylate monomer can be used.
  • the epoxy compound used as the polymerizable compound forms a three-dimensional network structure and imparts good heat resistance and adhesion, and it is preferable to use a solid epoxy resin and a liquid epoxy resin in combination.
  • the solid epoxy resin means an epoxy resin that is solid at room temperature.
  • the liquid epoxy resin means an epoxy resin that is liquid at room temperature.
  • the normal temperature means a temperature range of 5 to 35 ° C. defined by JIS Z 8703.
  • two or more epoxy compounds can be used in combination.
  • an oxetane compound may be used in combination.
  • the solid epoxy resin is not particularly limited as long as it is compatible with a liquid epoxy resin and is solid at room temperature, and includes a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a polyfunctional type epoxy resin, a dicyclopentadiene type epoxy resin, A novolak phenol type epoxy resin, a biphenyl type epoxy resin, a naphthalene type epoxy resin, and the like are listed, and one of these can be used alone, or two or more can be used in combination. Among these, it is preferable to use a bisphenol A type epoxy resin.
  • the liquid epoxy resin is not particularly limited as long as it is liquid at normal temperature, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac phenol type epoxy resin, naphthalene type epoxy resin, and the like. Can be used alone or in combination of two or more. In particular, it is preferable to use a bisphenol A type epoxy resin from the viewpoint of film tackiness and flexibility.
  • thermal radical polymerization initiators examples include organic peroxides and azo compounds.
  • an organic peroxide that does not generate nitrogen that causes bubbles can be preferably used.
  • the amount of the thermal radical polymerization initiator used is preferably 2 to 60 parts by weight, more preferably 100 parts by weight of the (meth) acrylate compound. 5 to 40 parts by mass.
  • thermal cationic polymerization initiator those known as thermal cationic polymerization initiators for epoxy compounds can be employed.
  • thermal cationic polymerization initiators for epoxy compounds.
  • iodonium salts, sulfonium salts, phosphonium salts, ferrocenes, etc. that generate an acid by heat are used.
  • an aromatic sulfonium salt showing a good potential with respect to temperature can be preferably used.
  • the amount of the thermal cationic polymerization initiator used is preferably 2 to 60 mass relative to 100 parts by mass of the epoxy compound. Part, more preferably 5 to 40 parts by weight.
  • thermal anionic polymerization initiator commonly used known ones can be used.
  • organic acid dihydrazide, dicyandiamide, amine compound, polyamidoamine compound, cyanate ester compound, phenol resin, acid anhydride, carboxylic acid, tertiary amine compound, imidazole, Lewis acid, Bronsted acid salt, polymercaptan curing agent , Urea resin, melamine resin, isocyanate compound, block isocyanate compound, and the like one kind can be used alone, or two or more kinds can be used in combination.
  • it is preferable to use a microcapsule type latent curing agent having an imidazole-modified product as a core and a surface thereof coated with polyurethane.
  • the film-forming resin corresponds to, for example, a high-molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation.
  • the film-forming resin include various resins such as phenoxy resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, polyimide resin, and butyral resin. These may be used alone or in combination of two or more. May be used. Among these, it is preferable to use a phenoxy resin from the viewpoints of film formation state, connection reliability, and the like.
  • the heat-polymerizable composition may contain an insulating filler for adjusting the melt viscosity.
  • an insulating filler for adjusting the melt viscosity. Examples of this include silica powder and alumina powder.
  • the size of the insulating filler is preferably 20 to 1000 nm, and the blending amount is preferably 5 to 50 parts by mass with respect to 100 parts by mass of a thermally polymerizable compound (photopolymerizable compound) such as an epoxy compound. .
  • fillers softeners, accelerators, anti-aging agents, colorants (pigments, dyes), organic solvents, ion catchers and the like different from the above-described insulating fillers may be contained.
  • a stress relaxation agent examples include a hydrogenated styrene-butadiene block copolymer and a hydrogenated styrene-isoprene block copolymer.
  • the silane coupling agent examples include epoxy, methacryloxy, amino, vinyl, mercapto sulfide, and ureido.
  • the inorganic filler examples include silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like.
  • the insulating resin binder 3 can be formed by forming a coating composition containing the above-described resin into a film by a coating method and drying it, or by further curing it, or by previously forming a film by a known method.
  • the insulating resin binder 3 may be obtained by laminating a resin layer as necessary.
  • the insulating resin binder 3 is preferably formed on a release film such as a release-treated polyethylene terephthalate film.
  • the minimum melt viscosity of the insulating resin binder 3 can be appropriately determined according to the manufacturing method of the anisotropic conductive film.
  • the insulating resin binder is a film.
  • the minimum melt viscosity of the resin is preferably 1100 Pa ⁇ s or more.
  • a recess 3b is formed around the exposed portion of the conductive particles 2 pushed into the insulating resin binder 3 as shown in FIG. 12 or 13, or an insulating resin binder as shown in FIG.
  • the minimum melt viscosity is preferably 1500 Pa ⁇ s or more, more preferably 2000 Pa ⁇ s or more, and still more preferably 3000 to 15000 Pa ⁇ s, particularly from the point of forming a recess 3 c directly above the conductive particles 2 pushed into the 3. 3000 to 10000 Pa ⁇ s.
  • This minimum melt viscosity is obtained by using a rotary rheometer (TA instrument) as an example, using a measuring plate having a temperature rising rate of 10 ° C./min, a measuring pressure of 5 g, and a diameter of 8 mm. Can do. Further, when the step of pushing the conductive particles 2 into the insulating resin binder 3 is preferably performed at 40 to 80 ° C., more preferably 50 to 60 ° C., 60 ° C. from the viewpoint of forming the recesses 3b or 3c as described above.
  • the lower limit of the viscosity is preferably 3000 Pa ⁇ s or more, more preferably 4000 Pa ⁇ s or more, further preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s or less, more preferably 15000 Pa ⁇ s or less, and further Preferably, it is 10,000 Pa ⁇ s or less.
  • the conductive particles 2 are sandwiched between connection objects such as opposing electronic components when the anisotropic conductive film is used.
  • connection objects such as opposing electronic components
  • the conductive particles 2 in the anisotropic conductive film can be prevented from flowing due to the flow of the molten insulating resin binder 3.
  • the thickness La of the insulating resin binder 3 is preferably 1 ⁇ m to 60 ⁇ m, more preferably 1 ⁇ m to 30 ⁇ m, and still more preferably 2 ⁇ m to 15 ⁇ m. Further, regarding the thickness La of the insulating resin binder 3, the ratio (La / D) thereof is preferably 0.6 to 10 in relation to the average particle diameter D of the conductive particles 2. If the thickness La of the insulating resin binder 3 is too large, the conductive particles are likely to be misaligned during anisotropic conductive connection, and the trapping property of the conductive particles at the terminal is lowered. This tendency is remarkable when La / D exceeds 10.
  • La / D is more preferably 8 or less, and even more preferably 6 or less.
  • the thickness La of the insulating resin binder 3 is too small and La / D is less than 0.6, it is difficult to maintain the conductive particles in a predetermined particle dispersion state or a predetermined arrangement by the insulating resin binder 3.
  • the ratio (La / D) between the layer thickness La of the insulating resin binder 3 and the particle diameter D of the conductive particles 2 is preferably 0.8-2.
  • the embedded state of the conductive particles 2 in the insulating resin binder 3 is not particularly limited, but when anisotropic conductive connection is performed by sandwiching an anisotropic conductive film between opposing parts and heating and pressing, As shown in FIGS. 12 and 13, the conductive particles 2 are partially exposed from the insulating resin binder 3, and with respect to the tangential plane 3P of the surface 3 a of the insulating resin binder at the central portion between the adjacent conductive particles 2.
  • a recess 3b is formed around the exposed portion of the conductive particle 2, or the insulating resin binder portion directly above the conductive particle 2 pushed into the insulating resin binder 3 as shown in FIG.
  • a recess 3 c is formed on the similar tangential plane 3 ⁇ / b> P so that undulation is present on the surface of the insulating resin binder 3 immediately above the conductive particles 2.
  • the conductive particles 2 In contrast to the flattening of the conductive particles 2 that occurs when the conductive particles 2 are sandwiched between the electrodes of the opposing electronic component and are heated and pressurized, the conductive particles 2 have the dents 3b shown in FIGS.
  • the resistance received from the insulating resin binder 3 is reduced as compared with the case where there is no recess 3b. For this reason, the conductive particles 2 are easily sandwiched between the opposing electrodes, and the conduction performance is improved.
  • the depression 3c (FIG. 14) is formed on the surface of the resin just above the conductive particles 2, so that heating and pressurization are performed as compared with the case where there is no depression 3c.
  • the pressure at that time is easily concentrated on the conductive particles 2, and the conductive particles 2 are easily sandwiched between the electrodes, so that the conduction performance is improved.
  • (Le / D) is preferably less than 50%, more preferably less than 30%, even more preferably 20 to 25%, and the recess 3b around the exposed portion of the conductive particles 2 (the maximum diameter in FIGS. 12 and 13).
  • the ratio (Ld / D) between Ld and the average particle diameter D of the conductive particles 2 is preferably 100% or more, more preferably 100 to 150%, and the dent 3c in the resin immediately above the conductive particles 2 (FIG. 14).
  • the ratio (Lf / D) between the maximum depth Lf and the average particle diameter D of the conductive particles 2 is preferably greater than 0, preferably less than 10%, more preferably less than 5%.
  • the diameter Lc of the exposed portion of the conductive particles 2 can be made equal to or smaller than the average particle diameter D of the conductive particles 2, and is preferably 10 to 90% of the average particle diameter D.
  • the conductive particles 2 may be exposed at one point on the top 2t of the conductive particles 2, or the conductive particles 2 may be completely embedded in the insulating resin binder 3 so that the diameter Lc becomes zero.
  • the distance of the deepest portion of the conductive particles 2 from the tangent plane 3p of the surface 3a of the insulating resin binder in the central portion between the adjacent conductive particles 2 (hereinafter referred to as the embedding amount)
  • the ratio (Lb / D) between Lb and the average particle diameter D of the conductive particles 2 (hereinafter referred to as the embedding rate) is preferably 60% or more and 105% or less.
  • an insulating adhesive layer 4 having a viscosity and adhesiveness different from those of the resin constituting the insulating resin binder 3 is laminated. It may be.
  • the insulating adhesive layer 4 has the dent 3b formed in the insulating resin binder 3 as in the anisotropic conductive film 1d shown in FIG. It may be laminated on the surface on which the recess 3b is formed, or may be laminated on the surface opposite to the surface on which the recess 3b is formed, as in the anisotropic conductive film 1e shown in FIG. The same applies when the indentation 3c is formed in the insulating resin binder 3.
  • an anisotropic conductive film is used to anisotropically connect an electronic component, the space formed by the electrodes and bumps of the electronic component is filled to improve adhesion. Can do.
  • the insulating adhesive layer 4 is an IC chip or the like regardless of whether the insulating adhesive layer 4 is on the formation surface of the recesses 3b and 3c. It is preferable that it is on the first electronic component side (in other words, the insulating resin binder 3 is on the second electronic component side such as a substrate). By doing so, unintentional movement of the conductive particles can be avoided, and the trapping property can be improved.
  • the first electronic component such as an IC chip is on the pressing jig side
  • the second electronic component such as a substrate is on the stage side
  • the anisotropic conductive film is temporarily bonded to the second electronic component
  • the first electronic component is The component and the second electronic component are subjected to main pressure bonding.
  • the first electronic component and the second electronic component may be temporarily bonded after the anisotropic conductive film is temporarily attached to the first electronic component. Crimp the parts.
  • the insulating adhesive layer 4 a material used as an insulating adhesive layer in a known anisotropic conductive film can be appropriately selected and used.
  • the insulating adhesive layer 4 may have a viscosity adjusted to be lower by using the same resin as the insulating resin binder 3 described above. As the minimum melt viscosity between the insulating adhesive layer 4 and the insulating resin binder 3 is different, the space formed by the electrodes and bumps of the electronic component is more easily filled with the insulating adhesive layer 4, and the electronic components are bonded to each other. The effect which improves property can be expected.
  • the minimum melt viscosity ratio between the insulating adhesive layer 4 and the insulating resin binder 3 is preferably 2 or more, more preferably 5 or more, and still more preferably 8 or more.
  • this ratio is too large, when a long anisotropic conductive film is used as a wound body, there is a possibility that the resin protrudes or blocks, so that it is practically preferably 15 or less.
  • the preferable minimum melt viscosity of the insulating adhesive layer 4 more specifically satisfies the above-mentioned ratio and is 3000 Pa ⁇ s or less, more preferably 2000 Pa ⁇ s or less, and particularly 100 to 2000 Pa ⁇ s.
  • a coating composition containing a resin similar to the resin forming the insulating resin binder 3 is formed by coating and dried, further cured, or known in advance. It can form by forming into a film by the method of.
  • the thickness of the insulating adhesive layer 4 is preferably 1 ⁇ m or more and 30 ⁇ m or less, more preferably 2 ⁇ m or more and 15 ⁇ m or less.
  • the minimum melt viscosity of the whole anisotropic conductive film combining the insulating resin binder 3 and the insulating adhesive layer 4 depends on the thickness ratio of the insulating resin binder 3 and the insulating adhesive layer 4, it is practically used. May be 8000 Pa ⁇ s or less, and may be 200 to 7000 Pa ⁇ s, and preferably 200 to 4000 Pa ⁇ s to facilitate filling between the bumps.
  • the insulating resin binder 3 and the insulating adhesive layer 4 may be added with an insulating filler such as silica fine particles, alumina, and aluminum hydroxide as necessary. It is preferable that the compounding quantity of an insulating filler shall be 3 to 40 mass parts with respect to 100 mass parts of resin which comprises those layers. Thereby, even if the anisotropic conductive film melts at the time of anisotropic conductive connection, it is possible to suppress unnecessary movement of the conductive particles with the molten resin.
  • an insulating filler such as silica fine particles, alumina, and aluminum hydroxide
  • a transfer mold for arranging conductive particles in a predetermined arrangement is manufactured, a conductive particle is filled in a recess of the transfer mold, and formed on a release film.
  • the conductive particles 2 are transferred onto the insulating resin binder 3 by applying the pressure by covering the insulating resin binder 3 and pressing the conductive particles 2 into the insulating resin binder 3.
  • an insulating adhesive layer 4 is further laminated on the conductive particles 2.
  • the anisotropic conductive film 1A can be obtained.
  • an insulating resin binder is placed thereon, the conductive particles are transferred from the transfer mold to the surface of the insulating resin binder, and the conductive particles on the insulating resin binder are insulated.
  • An anisotropic conductive film may be manufactured by pushing into a conductive resin binder.
  • the embedding amount (Lb) of the conductive particles can be adjusted by the pressing force, temperature, etc. at the time of the pressing. Further, the shape and depth of the recesses 3b and 3c can be adjusted by the viscosity of the insulating resin binder during pressing, the pressing speed, the temperature, and the like.
  • the lower limit of the viscosity of the insulating resin binder when the conductive particles are pushed in is preferably 3000 Pa ⁇ s or more, more preferably 4000 Pa ⁇ s or more, further preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s.
  • the upper limit is preferably 20000 Pa ⁇ s.
  • such a viscosity is preferably obtained at 40 to 80 ° C., more preferably 50 to 60 ° C. More specifically, when manufacturing the anisotropic conductive film 1a having the recess 3b shown in FIG.
  • the viscosity of the insulating resin binder when the conductive particles are pushed in is 8000 Pa ⁇ s.
  • the viscosity of the insulating resin binder when the conductive particles are pushed in is 4500 Pa ⁇ s (50 ⁇ 60 ° C.).
  • a fine adhesive may be applied to the top surface of the convex portions so that the conductive particles adhere to the top surface.
  • transfer molds can be manufactured by using and applying known techniques such as machining, photolithography, and printing.
  • a method for arranging the conductive particles in a predetermined arrangement a method using a biaxially stretched film or the like may be used instead of a method using a transfer mold.
  • the anisotropic conductive film is preferably a film wound body wound on a reel in order to continuously provide for connection of electronic components.
  • the length of the film wound body should just be 5 m or more, and it is preferable that it is 10 m or more. Although there is no particular upper limit, it is preferably 5000 m or less, more preferably 1000 m or less, and even more preferably 500 m or less from the viewpoint of handleability of the shipment.
  • the film winding body may be one in which anisotropic conductive films shorter than the entire length are connected and connected with a tape. There may be a plurality of connected locations, may exist regularly, or may exist randomly.
  • the thickness of the connecting tape is not particularly limited as long as it does not hinder the performance, but if it is too thick, it affects the protrusion and blocking of the resin, and is preferably 10 to 40 ⁇ m.
  • the width of the film is not particularly limited, but is 0.5 to 5 mm as an example.
  • continuous anisotropic conductive connection can be performed, which can contribute to cost reduction of the connection body.
  • the anisotropic conductive film of the present invention is formed by heat or light between a first electronic component such as an FPC, an IC chip, or an IC module and a second electronic component such as an FPC, a rigid substrate, a ceramic substrate, a glass substrate, or a plastic substrate. It can be preferably applied when anisotropic conductive connection is made. Further, the first electronic components can be anisotropically conductively connected by stacking IC chips or IC modules. The connection structure thus obtained and the manufacturing method thereof are also part of the present invention.
  • the interface on the side where the conductive particles are present in the film thickness direction of the anisotropic conductive film is placed on a stage such as a wiring board placed on a stage.
  • the first electronic component such as an IC chip is mounted on the temporarily adhered anisotropic conductive film, and thermocompression bonding is performed using a pressing jig from the first electronic component side. This is preferable from the viewpoint of improving connection reliability.
  • the connection of the same electronic component can also be performed using photocuring.
  • the anisotropic conductive film is temporarily attached. Is performed on the first electronic component of the IC chip placed on the stage, and then the first electronic component and the second electronic component are thermocompression bonded.
  • Experimental Example 1 to Experimental Example 8 (Preparation of anisotropic conductive film) Regarding the anisotropic conductive film used for the COG connection, the influence of the resin composition of the insulating resin binder and the arrangement of the conductive particles on the film forming ability and the conduction characteristics was examined as follows.
  • resin compositions for forming an insulating resin binder and an insulating adhesive layer were prepared according to the formulation shown in Table 1.
  • the minimum melt viscosity of the resin composition was adjusted according to the preparation conditions of the insulating resin composition.
  • a resin composition for forming an insulating resin binder is coated on a PET film having a film thickness of 50 ⁇ m with a bar coater, dried in an oven at 80 ° C. for 5 minutes, and insulated with a thickness La shown in Table 2 on the PET film.
  • a functional resin binder layer was formed.
  • an insulating adhesive layer was formed on a PET film with a thickness shown in Table 2.
  • a metal mold was prepared so that the arrangement of the conductive particles in plan view was as shown in Table 2, and the distance between the centers of the closest conductive particles in the repeating unit was 6 ⁇ m.
  • a known transparent resin pellet was poured into the mold in a melted state, and cooled and hardened to form a resin mold having recesses arranged as shown in Table 2.
  • the conductive particles are arranged in a hexagonal lattice arrangement (number density 32,000 / mm 2 ), and one of the lattice axes is inclined 15 ° with respect to the longitudinal direction of the anisotropic conductive film. .
  • metal-coated resin particles (Sekisui Chemical Co., Ltd., AUL703, average particle diameter of 3 ⁇ m) are prepared, and the conductive particles are filled in the resin-type dents, and the above-mentioned insulating resin binder is put thereon. It was stuck by pressing at 60 ° C. and 0.5 MPa. Then, the insulating resin binder is peeled from the mold, and the conductive particles on the insulating resin binder are pressed into the insulating resin binder by pressing (pressing conditions: 60 to 70 ° C., 0.5 Mpa). A film was prepared in which conductive particles were embedded in the binder in the state shown in Table 2.
  • the embedded state of the conductive particles was controlled by the indentation condition.
  • Experimental Example 4 the film shape was not maintained after the conductive particles were pushed in, but in other experimental examples, a film in which the conductive particles were embedded could be produced.
  • a dent was recognized around the exposed portion of the embedded conductive particles or directly above the embedded conductive particles as shown in Table 2.
  • Table 4 shows the dent most clearly for each experimental example. The measured value of what was observed was shown.
  • An anisotropic conductive film having a two-layered resin layer was prepared by laminating an insulating adhesive layer on the side of the film embedded with conductive particles into which the conductive particles were pressed.
  • Experimental Example 4 since the film shape was not maintained after the conductive particles were pushed in, the subsequent evaluation was not performed.
  • the terminal characteristics of the IC for conducting characteristic evaluation and the glass substrate correspond to each other, and the sizes are as follows. Further, when connecting the evaluation IC and the glass substrate, the longitudinal direction of the anisotropic conductive film and the short direction of the bump were matched.
  • Evaluation criteria for initial conduction resistance (no problem if it is less than 2 ⁇ for practical use) A: Less than 0.4 ⁇ B: 0.4 ⁇ or more and less than 0.8 ⁇ C: 0.8 ⁇ or more
  • connection object for evaluation produced in (a) is placed in a thermostatic bath at a temperature of 85 ° C. and a humidity of 85% RH for 500 hours, and the subsequent conduction resistance is the same as the initial conduction resistance. And evaluated according to the following three evaluation criteria.
  • Conduction reliability evaluation criteria (practically no problem if less than 5 ⁇ ) A: Less than 1.2 ⁇ B: 1.2 ⁇ or more and less than 2 ⁇ C: 2 ⁇ or more
  • Table 2 shows that in Experimental Example 4 where the minimum melt viscosity of the insulating resin binder is 800 Pa ⁇ s, it is difficult to form a film having a dent in the insulating resin binder near the conductive particles.
  • the minimum melt viscosity of the insulating resin binder is 1500 Pa ⁇ s or more, it is possible to form a convex portion in the vicinity of the conductive particles of the insulating resin binder by adjusting the conditions at the time of embedding the conductive particles.
  • the anisotropic conductive film has good conduction characteristics for COG.
  • the anisotropic conductive connection can be performed at a lower pressure.
  • IC for evaluating short-circuit rate (7.5 ⁇ m space comb tooth TEG (test element group): Outline 15 x 13mm Thickness 0.5mm Bump specifications Size 25 ⁇ 140 ⁇ m, distance between bumps 7.5 ⁇ m, bump height 15 ⁇ m
  • the short is less than 50 ppm, it is practically preferable, and the anisotropic conductive films of Experimental Examples 1 to 3 and 5 to 8 are all less than 50 ppm.
  • a resin composition for forming an insulating resin binder and an insulating adhesive layer with the composition shown in Table 3 was prepared, and an anisotropic conductive film was prepared in the same manner as in Experimental Example 1 using these.
  • Table 4 shows the arrangement of the conductive particles and the distance between the centers of the closest particles in this case.
  • the conductive particles were arranged in a hexagonal lattice arrangement (number density 15000 / mm 2 ), and one of the lattice axes was inclined 15 ° with respect to the longitudinal direction of the anisotropic conductive film.
  • Non-alkali glass substrate Electrode ITO wiring thickness 0.7mm
  • Evaluation criteria for initial conduction resistance A Less than 1.6 ⁇ B: 1.6 ⁇ or more and less than 2.0 ⁇ C: 2.0 ⁇ or more
  • (C) Short-circuit rate The number of shorts of the connection object for evaluation whose initial conduction resistance was measured was measured, and the short-circuit occurrence rate was determined from the measured number of shorts and the number of gaps of the connection object for evaluation. If the short-circuit occurrence rate is less than 100 ppm, there is no practical problem. In all of Experimental Examples 9 to 11 and 13 to 16, the short-circuit occurrence rate was less than 100 ppm.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne un film électroconducteur anisotrope avec lequel il est possible de supporter des bosses à pas étroit et de réduire la densité de comptage de particules électroconductrices. Dans un film électroconducteur anisotrope (1A), des particules électroconductrices (2) sont disposées comme suit dans un liant de résine isolant (3). De façon précise, des unités de répétition (5) de particules électroconductrices sont disposées de manière répétée sur toute la surface du film électroconducteur anisotrope, les unités de répétition (5) comprenant des rangées de particules électroconductrices (2p, 2q, 2r) dans lesquelles des particules électroconductrices (2) sont disposées en rangées avec des intervalles entre ces dernières, et des rangées qui ont des nombres différents de particules électroconductrices étant disposées en parallèle.
PCT/JP2017/016345 2016-05-05 2017-04-25 Film électroconducteur anisotrope WO2017191781A1 (fr)

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KR1020217011350A KR20210046827A (ko) 2016-05-05 2017-04-25 이방성 도전 필름
CN202110776384.6A CN113707361B (zh) 2016-05-05 2017-04-25 各向异性导电膜
US16/085,515 US11794444B2 (en) 2016-05-05 2017-04-25 Anisotropic conductive film
CN201780025115.8A CN109074894B (zh) 2016-05-05 2017-04-25 各向异性导电膜
KR1020187021398A KR102243340B1 (ko) 2016-05-05 2017-04-25 이방성 도전 필름

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WO2021161935A1 (fr) * 2020-02-12 2021-08-19 デクセリアルズ株式会社 Film électriquement conducteur anisotrope

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