WO2017187898A1 - Dissipateur thermique et boîtier - Google Patents

Dissipateur thermique et boîtier Download PDF

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Publication number
WO2017187898A1
WO2017187898A1 PCT/JP2017/013884 JP2017013884W WO2017187898A1 WO 2017187898 A1 WO2017187898 A1 WO 2017187898A1 JP 2017013884 W JP2017013884 W JP 2017013884W WO 2017187898 A1 WO2017187898 A1 WO 2017187898A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat sink
cavity
housing
fins
Prior art date
Application number
PCT/JP2017/013884
Other languages
English (en)
Japanese (ja)
Inventor
輝男 垣谷
Original Assignee
株式会社コンテック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社コンテック filed Critical 株式会社コンテック
Publication of WO2017187898A1 publication Critical patent/WO2017187898A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink for dissipating heat generated from a device and a housing including the heat sink.
  • a heat sink has been provided in the electronic component or its housing.
  • a plurality of fins are provided on the surface of the heat sink, and heat transmitted from the heat source is released through the fins.
  • the conventional heat sink has a plurality of fins so that the surface area of the heat sink on the heat dissipation side is increased, and the heat dissipation effect is increased.
  • the conventional heat sink has a problem that the heat dissipation efficiency is limited by the material of the heat sink, the number, size, and surface area of the fins.
  • the heat radiation efficiency is lowered.
  • the present invention aims to solve the above problems and improve the heat dissipation efficiency of the heat sink.
  • a heat sink includes one or more plate-like body portions, one or more cavity portions adjacent to the body portion, and the cavity portions. Openings provided at both ends, a plurality of first fins provided on the surface of each main body, and a plurality of second fins provided on the inner surface of each cavity. It is characterized by.
  • a housing according to an embodiment of the present invention is a housing of an electronic device having a heat source therein, and at least a part of an outer surface of the housing is the heat sink, and the opening of each heat sink. And a pair of top plates forming the other outer surface of the casing facing each other and facing each other, and a vent hole formed at a position in contact with the opening of each top plate.
  • the heat sink according to one embodiment of the invention as described above there are fins provided on the surface of the main body, a cavity provided adjacent to the main body, and a fin provided inside the cavity.
  • an air flow is generated in the cavity due to the chimney effect, and the heat dissipation efficiency is improved by the air flow.
  • the perspective view which shows the structural example of the heat sink of this invention The perspective view which shows the structural example of the housing
  • the figure which illustrates the heat dissipation aspect of this invention The figure which shows the example of arrangement
  • Heat sinks may be mounted on electronic components that are heat sources, industrial devices that have heat sources inside, electronic devices such as computers, and other various devices in order to release the generated heat.
  • FIG. 1 is a perspective view showing a configuration example of a heat sink according to the present invention, showing the configuration of both front and back surfaces.
  • FIG. 2 is a perspective view showing a configuration example of the housing of the present invention.
  • the heat sink 2 is composed of a plate-like main body 3 and a cavity 1 adjacent to the main body 3.
  • the main body 3 includes a plurality of fins 5 on the surface 4.
  • the number, thickness, height, length, arrangement direction, and shape of the fins 5 are arbitrary.
  • the cavity 1 has a cylindrical shape that is in continuous contact with the main body 3.
  • the cavity 1 has a cavity whose space extends in the length direction A of the end portion of the main body 3 in contact with the cavity 1. Both end portions of the cavity portion 1 in the direction A are opened and become opening portions 6.
  • the cavity 1 comprises one or more fins 8 on its inner surface 7.
  • the number, the thickness, the height from the inner surface, the length in the direction A, and the shape of the fins 8 can be arbitrarily set according to the heat radiation efficiency.
  • the position of the end portion in the direction A of the fin 8 may be flush with the opening 6, or may protrude from the opening 6 inside the cavity 1 from the opening 6.
  • the fin 8 may be divided in the cavity 1 in the direction A.
  • each fin 8 may be formed in a direction parallel to the direction A, or may be inclined.
  • the cavity 1 is provided at both ends of the body 3 with the body 3 interposed therebetween, but may be provided only at one end.
  • a plurality of main body portions 3 may be provided, and the hollow portion 1 may be provided between the two main body portions 3.
  • the heat released from the heat source is absorbed by the back surface 9 with respect to the front surface 4 of the main body 3, and released from the fin 5 to the outside, and is opened through the fin 8 and the cavity 1. Released from part 6.
  • an air flow is generated in the cavity 1 due to the chimney effect.
  • the heat released from the fins 8 is easily released from the openings 6 along this air flow. That is, the cavity portion 1 serves as a path (guidance portion) for guiding heat to the outside, and the opening portion serves as a heat discharge port (discharge portion) to the outside.
  • heat radiation efficiency is improved by heat radiation from the fin 8 using the air flow as compared with the case where natural heat radiation is performed from the fin 5 having the same size / shape to the outside. To do. On the contrary, even when the size of the heat sink 2 is reduced because the fins 8 are smaller or the number of the fins 8 is smaller than that of the fins 5, the same heat radiation efficiency as in the conventional case can be secured. In particular, when the heat source is disposed near the back surface 9 of the main body 3, the heat absorbed by the main body 3 is transferred to the cavity 1 and then radiated from the cavity 1.
  • the heat sink 2 can dissipate heat more efficiently.
  • the surface which becomes the heat source direction side in the cavity part 1 and the other side (back surface side) from the fin 5 may be an open surface.
  • a wall (not shown) may be formed on the back side.
  • the fin 8 may be provided also on the inner surface.
  • a housing 10 has a configuration in which at least a part of the outer surface thereof is the heat sink 2 shown in FIG. 1 and includes various devices, devices, and components inside.
  • the heat sink 2 is provided so that the surface 4 of the main body 3 on which the fins 5 are formed is positioned on the outside of the housing 10.
  • the fin 5 faces the outer surface side of the housing 10.
  • the outer surface of the housing 10 facing each of the openings 6 of the heat sink 2 is configured by a top plate 11.
  • the top plate 11 includes a vent hole 12 at least at a part of the position overlapping the opening 6.
  • the vent hole 12 serves as an intake / exhaust port for air flowing through the cavity 1.
  • FIG. 3 is a diagram illustrating a cross-sectional structure of a housing of the present invention
  • FIG. 4 is a diagram illustrating a heat dissipation mode of the present invention.
  • heat sources 13 and 14 such as an electronic circuit and a power source are provided.
  • the heat generated by the heat sources 13 and 14 convects in the housing 10 as indicated by arrows B and C, and is absorbed by the main body 3 from the back surface 9 of the heat sink 2.
  • a part of the heat absorbed by the main body 3 is transmitted to the fins 5 as indicated by an arrow D, and is released from the fins 5 to the outside of the housing 10.
  • the remaining heat is transferred from the main body 3 to the cavity 1 and released from the fins 8 into the cavity 1.
  • an air flow as indicated by an arrow F in FIG.
  • a heat radiating plate may be further provided inside the housing 10.
  • a heat radiating plate 15 is provided.
  • the heat generated from the heat source 14 is absorbed by the heat radiating plate 15, released from the fins 16 of the heat radiating plate 15, and transmitted to the heat sink 2.
  • the heat generated from the heat source 14 disposed at a position away from the heat sink 2 is also efficiently transmitted to the heat sink 2, and the cooling efficiency inside the housing 10 is improved.
  • FIG. 5 is a diagram showing an arrangement example of the industrial equipment provided with the casing of the present invention.
  • a plurality of industrial devices 17 may be installed side by side on the wall surface of a building.
  • a plurality of industrial devices 17 are arranged in contact with each other on a DIN rail 18 installed on a wall surface.
  • the heat sink 2 may be arrange
  • the periphery of the fin 5 is surrounded by the industrial device 17, and the heat dissipation efficiency from the fin 5 is reduced together with the heat generated by the industrial device 17.
  • the air that has absorbed heat is discharged from the opening of the cavity 1 that is not in contact with the other industrial equipment 17, heat dissipation is performed. Reduction can be suppressed.
  • FIG. 6 is a diagram illustrating an example of an arrangement position of the cavity.
  • the heat source 13 is located in the vicinity of the end of the heat sink 20.
  • the cavity 1 is disposed in the vicinity of the heat source 13, the efficiency of heat absorption in the main body 3 and the efficiency of heat dissipation from the cavity 1 are reduced. Therefore, in this case, the cavity 1 is not provided in the vicinity of the heat source 13, and the cavity 1 is preferably disposed at the opposite end, the center of the heat sink 20, or both. That is, the main body 3 is divided into two, the cavity 1 is sandwiched between them, and the cavity 1 can be provided at one end.
  • the position of the cavity 1 is not limited to this, and may be arranged at any position other than the end of the heat sink 20.
  • the number of the hollow portions 1 may be other than two, or may be one or three or more.
  • the position and the number of the cavity portions 1 can be arbitrarily set according to the position of the heat source 13, and the heat radiation efficiency and the cooling efficiency can be improved.
  • FIG. 7 is a diagram illustrating a configuration example of the cavity.
  • the opening area of the other opening 22 is larger than the opening area of the one opening 21.
  • the opening area of the cross section increases continuously or intermittently.
  • casing using this heat sink it is good for the magnitude
  • the area of the vent 12 on the top plate 11 on the upper side in FIG. 2 may be smaller than the area of the vent on the lower top plate (not shown in FIG. 2).
  • FIG. 8 is a table listing examples of the positional relationship between the ventilation holes of the housing and the fins of the cavity.
  • the positional relationship between the ventilation holes 12 of the housing and the fins 8 of the cavity part or all of the fins 8 may be exposed from the ventilation holes 12 (EXAMPLE 1), or the fins 8 are exposed from the ventilation holes 12.
  • the positional relationship may be such that the side surface of the fin 8 is in contact with the edge of the vent hole 12 (EXAMPLE 2), or the position of the fin 8 and the vent hole 12 may be shifted (EXAMPLE 3).
  • FIG. 9 is a diagram illustrating a configuration example of the heat sink.
  • the heat sink 24 may further include a heat transfer section 25 that is in contact with the heat source and directly transfers the heat generated by the heat source to the main body section 3 on the back surface 9 of the main body section 3. .
  • the back surface 9 of the main body 3 may be provided with fins 26.
  • the heat transfer section 25 and the fins 26 are effective for absorbing heat generated by the heat source and transmitting the heat to the main body section 3.
  • the cavity 1 may be provided with fins 27 on the surface. By providing the fins 27, the cavity 1 can release heat from both the front and back surfaces, and can further improve the heat dissipation efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un dissipateur thermique 2 comprend : des ailettes 5 disposées sur la surface 4 d'une section plate 3 ; une cavité 1 adjacente à la section plate 3 ; et des ailettes 8 disposées à l'intérieur de la cavité 1. Un courant d'air est généré à l'intérieur de la cavité 1 dans le dissipateur thermique 2 par un effet de cheminée.
PCT/JP2017/013884 2016-04-27 2017-04-03 Dissipateur thermique et boîtier WO2017187898A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-088658 2016-04-27
JP2016088658A JP6523207B2 (ja) 2016-04-27 2016-04-27 ヒートシンクおよび筐体

Publications (1)

Publication Number Publication Date
WO2017187898A1 true WO2017187898A1 (fr) 2017-11-02

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ID=60160356

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/013884 WO2017187898A1 (fr) 2016-04-27 2017-04-03 Dissipateur thermique et boîtier

Country Status (2)

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JP (1) JP6523207B2 (fr)
WO (1) WO2017187898A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023004123A (ja) * 2021-06-25 2023-01-17 パナソニックＩｐマネジメント株式会社 電子機器用筐体
JPWO2023074261A1 (fr) * 2021-10-27 2023-05-04

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461937A (en) * 1987-09-02 1989-03-08 Hitachi Ltd Cooling arrangements for air-cooled computer
CN102427708A (zh) * 2012-01-09 2012-04-25 北京柏瑞安科技有限责任公司 风光逆变蓄电控制器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461937A (en) * 1987-09-02 1989-03-08 Hitachi Ltd Cooling arrangements for air-cooled computer
CN102427708A (zh) * 2012-01-09 2012-04-25 北京柏瑞安科技有限责任公司 风光逆变蓄电控制器

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JP2017199770A (ja) 2017-11-02
JP6523207B2 (ja) 2019-05-29

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