WO2017187513A1 - Dispositif de support de substrat, dispositif de sérigraphie, dispositif d'enduction, machine de montage en surface et procédé d'agencement de broche de support - Google Patents

Dispositif de support de substrat, dispositif de sérigraphie, dispositif d'enduction, machine de montage en surface et procédé d'agencement de broche de support Download PDF

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Publication number
WO2017187513A1
WO2017187513A1 PCT/JP2016/063060 JP2016063060W WO2017187513A1 WO 2017187513 A1 WO2017187513 A1 WO 2017187513A1 JP 2016063060 W JP2016063060 W JP 2016063060W WO 2017187513 A1 WO2017187513 A1 WO 2017187513A1
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WO
WIPO (PCT)
Prior art keywords
backup
pin
substrate
substrate support
plate
Prior art date
Application number
PCT/JP2016/063060
Other languages
English (en)
Japanese (ja)
Inventor
一之 菅原
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2016/063060 priority Critical patent/WO2017187513A1/fr
Priority to JP2018513986A priority patent/JP6546697B2/ja
Publication of WO2017187513A1 publication Critical patent/WO2017187513A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the technology disclosed in this specification relates to a substrate support device, a screen printing device, a coating device, a surface mounter, and a backup pin setup method.
  • Patent Document 1 a device that performs so-called backup pin arrangement in which the arrangement of the backup pin is changed according to the type of the substrate is known (for example, see Patent Document 1). ).
  • the electronic component mounting apparatus described in Patent Document 1 includes a support plate and support pins (corresponding to backup pins) that are held in all pin support holes of the support plate so as to be movable up and down. The setup is performed by holding the support pins other than the necessary support pins in the lowered position.
  • the board support device may not necessarily require all the backup pins.
  • backup pins that are not used to support the three kinds of boards are not required.
  • the electronic component mounting apparatus described in Patent Document 1 described above has support pins held in all the pin support holes from the beginning, even if only three types of substrates are produced, these three types of substrates are used.
  • a backup pin that is not used for supporting the battery must be provided, and there is a problem that the cost increases unnecessarily.
  • Patent Document 1 describes that as a conventional technique, an operator manually sets a backup pin by inserting a support pin into a pin support hole from above. However, there is a problem that such a manual setup places a heavy burden on the operator.
  • This specification discloses a technique for reducing the burden on an operator when setting up a backup pin while suppressing an unnecessary increase in cost due to provision of an unnecessary backup pin.
  • the substrate support device disclosed in the present specification is a substrate support device that supports a substrate from below using a backup pin, and a plurality of pin insertions in which the backup pin is movably inserted between a raised position and a lowered position
  • a backup plate having a hole, a lifting part for raising and lowering the backup plate, and a pin raising part for moving all backup pins in the lowered position among the backup pins inserted into the pin insertion holes to the raised position
  • backup pins used for supporting boards of a plurality of types that are scheduled to be produced can be inserted.
  • Backup pins that are not used to support different types of products can be automatically lowered, reducing the burden on workers when setting up backup pins while suppressing unnecessary cost increases due to unnecessary backup pins. can do.
  • the pin holding unit may hold the backup pin in a form in which the backup pin descends when the backup pin is pressed down.
  • the backup pin can be lowered by a simple operation of pressing the backup pin downward.
  • the pin holding portion is an elastic body attached to the outer periphery of the lower end portion of the backup pin, and when the backup pin moves to the raised position, the elastic body is press-fitted into the pin insertion hole and the backup pin May be held.
  • it may have a lock portion for locking the backup pin at the raised position.
  • the backup pin is locked in the raised position, so that the backup pin can be prevented from being lowered when the board is supported.
  • the lock unit may lock the backup pin at a position where the backup pin supports the substrate.
  • the backup pin it is possible to prevent the backup pin from descending while supporting the substrate by the backup pin.
  • the pin lowering part moves the backup pins not used for supporting the substrate one by one to the lowering position, and moves the backup pins to the lowering position at a position where the backup pins are not inserted. It may not be possible.
  • the operation of moving to the lowered position is not performed at the position where the backup pins are not inserted.
  • the time required can be shortened. Thereby, the productivity at the time of product type switching can be improved.
  • the pin lowering portion is a jig having a pressing pin provided corresponding to the backup pin that is not used for supporting the substrate, and the upper portion of the substrate supporting device is positioned so that the pressing pin extends downward.
  • the backup plate is raised by the elevating part, the backup pins that are not used for supporting the substrate may be pressed together by the pressing pins.
  • the backup pins that are not used for supporting the substrate can be lowered at a time, so that the time required for setup can be further reduced as compared with the case where the backup pins are sequentially lowered one by one.
  • the pin raising portion is a lower plate arranged below the backup plate.
  • the backup pin in the lowered position comes into contact with the lower plate and rises upward. You may move to the said raising position collectively by being extruded.
  • the pin ascending portion uses the elevating portion that raises and lowers the backup plate to collectively move the backup pins to the ascending position. For example, compared with the case where the backup pins are pulled up one by one. It can be moved to the raised position in a short time.
  • the lower plate is formed with a through hole into which the backup pin can be inserted, and the substrate support device inserts the backup pin in the lowered position into the through hole when the backup plate is lowered.
  • a lower plate driving unit that slides the lower plate at a position where the lower plate is brought into contact with the lower plate without being inserted into the through hole may be provided.
  • the backup plate In the substrate support device, there are cases where it is desired to lower the backup plate so that the backup pin does not interfere with the conveyance when the substrate is conveyed. However, if there is a lower plate below the backup pin, when the backup plate is lowered, the backup pin in the lowered position may come into contact with the lower plate and move to the raised position. According to the above substrate support device, when lowering the backup plate so that the backup pin does not interfere with the conveyance of the substrate, by sliding the lower plate to the position where the backup pin in the lowered position is inserted into the through hole, It is possible to prevent the backup pin in the lowered position from moving to the raised position.
  • An imaging unit that images the backup pin from above, the imaging unit being focused on an upper end surface of the backup pin at the raised position or an upper end surface of the backup pin at the lowered position;
  • a determination unit that analyzes an image captured by the imaging unit and determines whether or not the backup pin is in the lowered position.
  • the backup pin is imaged by focusing on the upper end surface of the backup pin in the raised position, the upper end surface of the backup pin in the raised position is clearly imaged, while the backup pin in the lowered position has a contour of the upper end surface. Since the image is blurred and cannot be distinguished from the surroundings, it can be determined whether or not the backup pin is in the lowered position. Thereby, it can be determined whether or not the backup pin to be moved to the lowered position has actually moved to the lowered position. This determination can also be made by focusing on the upper end surface of the backup pin at the lowered position.
  • a screen printing device disclosed in the present specification prints a printing material on a substrate supported by the substrate support device according to any one of claims 1 to 10 and a substrate supported by the substrate support device by screen printing.
  • a printing unit
  • the coating device disclosed in this specification includes a substrate support device according to any one of claims 1 to 10 and a coating unit that applies an adhesive to a substrate supported by the substrate support device. .
  • a surface mounter disclosed in the present specification includes a substrate support device according to any one of claims 1 to 10 and a mounting unit that mounts an electronic component on a substrate supported by the substrate support device. And comprising.
  • a backup pin setup method disclosed in the present specification is a backup pin setup method using the substrate support device according to any one of claims 1 to 10, wherein the backup pin setup method is inserted into the pin insertion hole.
  • a pin raising step of moving all the backup pins in the lowered position among the backup pins being moved to the raised position by the pin raising portion, and holding the backup pins moved to the raised position by the pin holding portion And a pin lowering step of lowering the backup pin not used for supporting the substrate by the pin lowering portion after the pin holding step.
  • FIG. 1 is a side view schematically showing a screen printing apparatus according to a first embodiment.
  • Side view of substrate support device Side view of backup pin Top view of backup plate Top view of top plate Top view of lower plate Top view schematically showing the pin lowering part
  • Block diagram showing electrical configuration of screen printing device Flow chart showing electrical configuration of screen printing device Flow chart showing the flow of board production
  • Cross-sectional view schematically showing the state of the substrate support device (A) Backup plate: standby position, upper plate: unlocked position, lower plate: lower position (B) Backup plate: standby position, upper plate: unlocked position, lower part Plate: Lower position (C) Backup plate: Lower position, Upper plate: Lock position, Lower plate: Lower position (D) Backup plate: Standby position, Upper plate: Lock position, Lower plate: Lower position (E) Backup plate: Standby position, upper plate: unlocked position, lower plate: lower position (F) Backup plate: standby position, upper plate: unlocked position, lower plate: lower position (G) Backup plate: standby position, upper plate: locked position
  • the left-right direction shown in FIG. 1 is the X-axis direction
  • the direction perpendicular to the paper surface in FIG. 1 is the Y-axis direction
  • the front side of the page is the front side
  • the back side of the page is the rear side.
  • the screen printing apparatus 1 uses a mask 11 to print a printing material such as cream solder or conductive paste on a pattern of a substrate 12, and includes a mask 11, a base 13, a conveyor 14, a substrate support device 15, A printing unit 16 and the like are provided.
  • a mask 11 to print a printing material such as cream solder or conductive paste on a pattern of a substrate 12, and includes a mask 11, a base 13, a conveyor 14, a substrate support device 15, A printing unit 16 and the like are provided.
  • the mask 11 is a metal plate material in which an opening corresponding to a pattern to be printed is formed, and is removably held by a mask holding unit (not shown).
  • the base 13 has a rectangular shape when viewed from above and has a flat upper surface, and is supported by four support columns.
  • the transport conveyor 14 transports the substrate 12 in the X-axis direction, and includes two belt units 17 that are spaced apart from each other in the Y-axis direction. In FIG. 1, only the rear belt unit 17 is shown.
  • the belt unit 17 includes two pulleys 17A, a belt 17B driven by the two pulleys 17A, a belt drive motor 49 (see FIG. 8) that rotates the belt 17B, and the like.
  • the distance between the two belt units 17 in the Y-axis direction is variable, and the operator can adjust the distance between the two belt units 17 according to the width of the substrate 12 in the Y-axis direction.
  • the substrate support device 15 supports the substrate 12 transported upward by the transport conveyor 14 in a state of being lifted from below and in close contact with the lower surface of the mask 11, and is disposed between the two belt units 17. .
  • the substrate support device 15 will be described later. In the following description, lifting and supporting the substrate 12 from below is referred to as “backup”.
  • the printing unit 16 prints a pattern on the substrate 12 while the mask 11 and the substrate 12 are in close contact with each other.
  • the squeegee 18 and a squeegee driving motor 50 that moves the squeegee 18 in a direction parallel to the plate surface of the mask 11. (See FIG. 8).
  • the paste 19 spreads out evenly on the mask 11 and fills the openings formed in the mask 11. As a result, the paste is printed on the pattern of the substrate 12.
  • the substrate support device 15 includes a plurality of backup pins 20 (only two are shown in FIG. 2), and the backup pins 20 are in the raised position (for example, shown in FIG. 10E). Position) and the lowering position (for example, the position shown in FIG. 10A), the backup plate 21 having a plurality of pin insertion holes 21A (see FIG. 4) and the backup pin 20 are moved upward and downward.
  • a lower plate driving unit 25 that slides in the left-right direction, an imaging unit 26 (see FIG. 1), a pin lowering unit 27 (see FIG. 1), and the like are provided. Yes.
  • the backup pin 20 is in the shape of a round bar and has different diameters in the length direction.
  • the backup pin 20 includes a small-diameter portion 28, a large-diameter portion 29A, a medium-diameter portion 30A, a large-diameter portion 29B, a medium-diameter portion 30B, and a large-diameter portion 29C from the top.
  • a concave groove is formed over the entire outer peripheral surface of the lowermost large diameter portion 29C, and an O-ring 31 (an example of a pin holding portion and an elastic body) is fitted into the concave groove. ing.
  • the backup plate 21 is a metal plate-like member, and a plurality of pin insertion holes 21A into which the backup pins 20 are inserted are formed.
  • the inner diameter of the pin insertion hole 21 ⁇ / b> A is larger than the large diameter portion 29 of the backup pin 20.
  • the diameter of the uppermost large diameter portion 29A of the backup pin 20 may be larger than the diameter of the pin insertion hole 21A.
  • the lock unit 22 includes an upper plate 22A, an upper plate driving unit 22B that slides the upper plate 22A left and right, and a connecting member 22C that connects the upper plate 22A and the upper plate driving unit 22B. ing.
  • the upper plate 22A is arranged on the upper surface of the backup plate 21, and is supported by the backup plate 21 so as to be slidable in the left-right direction.
  • the upper plate 22A is a metal plate-like member, and a through hole 22D is formed at a position corresponding to the pin insertion hole 21A of the backup plate 21.
  • the shape of the through hole 22D is roughly a shape in which a small circle is superimposed next to a large circle (so-called Dharma hole shape).
  • the inner diameter of the large circle is larger than the diameter of the pin insertion hole 21A of the backup plate 21.
  • the inner diameter of the small circle is smaller than the diameter of the large diameter portion 29 of the backup pin 20 and larger than the diameter of the medium diameter portion 30.
  • the upper plate driving unit 22B is fixed to the backup plate 21 via a support unit (not shown) and moves up and down together with the backup plate 21.
  • the upper plate driving unit 22B has a cylinder connected to the upper plate 22A via a connecting member 22C, and is connected to an external air supply device that supplies positive pressure and negative pressure via two air hoses (not shown). It is connected.
  • Each air hose is provided with a switching valve 52 (see FIG. 8) formed of an electromagnetic valve.
  • the elevating part 23 has a ball screw 23A whose upper end is connected to the backup plate 21, a ball nut 23B screwed to the ball screw 23A, an elevating motor 51 for rotating the ball nut 23B via a belt 23C, and the like. Yes.
  • the ball screw 23A moves in the vertical direction, whereby the backup plate 21 moves up and down.
  • the lower plate 24 is formed by bending the left and right sides of a metal plate-like member 90 degrees downward, and is supported by a support portion (not shown) so as to be slidable in the left-right direction at a position spaced downward from the backup plate 21. .
  • the lower plate 24 has a through hole 24 ⁇ / b> D formed at a position corresponding to the pin insertion hole 21 ⁇ / b> A of the backup plate 21.
  • the inner diameter of the through hole 24 ⁇ / b> D is larger than the diameter of the large diameter portion 29.
  • the structure of the lower plate driving unit 25 is substantially the same as that of the upper plate driving unit 22B, and the lower plate 24 is slid left and right by positive pressure and negative pressure supplied from an external air supply device.
  • the imaging unit 26 is attached to a pin lowering head 27A of a pin lowering unit 27 described later.
  • the imaging unit 26 is for confirming the lowered state of the backup pin 20 and is arranged with the imaging surface facing downward.
  • the imaging unit 26 is focused on the upper end surface of the backup pin 20 in the raised position, and the backup pin 20 in the raised position clearly images the upper end surface, while the backup pin 20 in the lowered position is on the upper end surface.
  • the image is blurred and the image is indistinguishable from the surroundings. Accordingly, it can be determined whether the backup pin 20 is in the raised position or the lowered position.
  • the case of focusing on the upper end surface of the backup pin 20 in the raised position has been described as an example, but the focus may be on the upper end surface of the backup pin 20 in the lowered position.
  • the pin lowering portion 27 is for pressing down the backup pin 20 that is not used for backing up the substrate 12 among the backup pins 20 in the raised position. It is provided at a position above the upper end surface.
  • the pin lowering portion 27 has a pin lowering head 27A and a head transporting portion 27B for transporting the pin lowering head 27A in the X axis direction and the Y axis direction within a certain movable region.
  • the head transport unit 27B includes a pair of Y-axis guide rails 27C extending in parallel to the Y-axis direction, a Y-axis ball screw 27D extending in the Y-axis direction, and a Y-axis ball nut 27E, Y engaged with the Y-axis ball screw 27D.
  • Y-axis servo motor 48 for rotating the axial ball screw 27D around the axis, beam 27F for supporting the pin lowering head 27A so as to be movable in the X-axis direction, X-axis ball screw 27G extending in the X-axis direction, X-axis ball screw An X-axis ball nut 27H screwed with 27G, an X-axis servo motor 47 for rotating the X-axis ball screw 27G around the axis, and the like are provided.
  • the Y-axis ball nut 27E is fixed to the beam 27F.
  • the Y-axis ball screw 27D rotates around the axis
  • the Y-axis ball nut 27E advances and retreats along the Y-axis ball screw 27D, thereby moving the beam 27F in the Y-axis direction.
  • the beam 27F extends in the X-axis direction, and both ends in the X-axis direction are slidably supported by the pair of Y-axis guide rails 27C.
  • the X-axis ball screw 27G and the X-axis servomotor 47 are supported by the beam 27F, and the X-axis ball nut 27H is fixed to the pin lowering head 27A.
  • the X-axis ball screw 27G rotates around the axis
  • the X-axis ball nut 27H advances and retreats along the X-axis ball screw 27G, thereby moving the pin lowering head 27A in the X-axis direction.
  • the pin lowering head 27A includes a head main body portion 27I that is slidably supported by a beam 27F, a pressing pin 27J that is supported by the head main body portion 27I so as to be movable up and down, and the like. It is connected to an external air supply device that supplies positive pressure and negative pressure via two air hoses (not shown). Each air hose is provided with a switching valve 52 (see FIG. 8) formed of an electromagnetic valve.
  • a positive pressure or negative pressure
  • pressure or positive pressure
  • the backup pin 20 is moved upward relative to the backup plate 21 (for example, the position shown in FIG. 10B and FIG. 10D) and downward relative to the backup plate 21.
  • the pin is inserted into the pin insertion hole 21A so as to be movable to the lowered position (for example, the position shown in FIG. 10A).
  • the O-ring 31 is press-fitted into the pin insertion hole 21A, and the backup pin 20 is held in the raised position. .
  • the position of the backup plate 21 will be described.
  • the backup plate 21 is moved up and down by the lifting motor.
  • the position shown in FIG. 10B (the position where the backup plate 21 is lowered until it comes into contact with the lower plate 24) is referred to as the lower position of the backup plate 21, and the position shown in FIG. ) Is called a backup position
  • the position shown in FIG. 10A (position between the lower position and the backup position) is called a standby position.
  • the distance between the backup plate 21 and the lower plate 24 at the standby position is lower than the backup plate 21 at the backup pin 20 at the lowered position (for example, the position shown in FIG. 10 (A)).
  • the length of the part that extends to is equal to or wider than that.
  • FIG. 10G shows the upper plate 22A slid to the right.
  • the backup pin 20 in the raised position (left backup pin 20) is restricted from moving in the vertical direction because a part of the upper plate 22A is located between the large diameter portion 29B and the large diameter portion 29C. The That is, the backup pin 20 is locked at the raised position.
  • the backup pin 20 in the lowered position (right backup pin 20) also has a part of the upper plate 22A located between the large diameter portion 29A and the large diameter portion 29B, the vertical movement is restricted. . That is, the backup pin 20 is locked at the lowered position.
  • FIG. 10E shows the upper plate 22A slid to the left.
  • the backup pin 20 is not locked and can be moved in the vertical direction.
  • the position where the upper plate 22A slides to the left side is referred to as an unlocked position
  • the position where the upper plate 22A slides to the right side is referred to as a locked position.
  • FIG. 10A shows the lower plate 24 slid to the right. In this state, a part of the lower plate 24 is located below the backup pin 20, so that the backup pin 20 is in contact with the lower plate 24 and further downward movement is restricted.
  • FIG. 10H and FIG. 10I show the lower plate 24 slid to the left. In this state, the lower plate 24 is not positioned below the backup pin 20 (in other words, the through hole 24D of the lower plate 24 is positioned below the backup pin 20). It can be lowered down.
  • a position where the lower plate 24 slides to the left side (that is, a position where the lower plate 24 is not located below the backup pin 20) is a non-lower position, and a position where the lower plate 24 slides to the right side (that is, a part of the lower plate 24 backs up).
  • the position located below the pin 20) is referred to as the lower position.
  • the control unit 40 includes an arithmetic processing unit 41 (an example of a determination unit) configured by a CPU or the like.
  • the arithmetic processing unit 41 is connected to a storage unit 42, a motor control unit 43, an image processing unit 44, an external input / output unit 45, an operation unit 46, and the like.
  • the storage unit 42 includes a ROM (Read Only Memory) that stores a control program executed by the arithmetic processing unit 41, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. Yes.
  • the storage unit 42 also stores board data for each type of board 12.
  • the board data includes information indicating the position of the backup pin 20 used for backup (in other words, the position of the pin insertion hole 21A into which the backup pin 20 used for backup of the board 12 of the product type is inserted).
  • the motor control unit 43 drives each motor such as an X-axis servo motor 47, a Y-axis servo motor 48, a belt drive motor 49, a squeegee drive motor 50, and a lift motor 51 under the control of the arithmetic processing unit 41.
  • An imaging signal is output from the imaging unit 26 to the image processing unit 44, and the image processing unit 44 generates an image based on the output imaging signal.
  • the external input / output unit 45 is a so-called interface, and opens and closes a switching valve 52 (see FIG. 8) provided in the air hose.
  • the operation unit 46 includes a display device such as a liquid crystal panel, various operation buttons, and the like, and accepts an external input by a manual operation.
  • the production of the substrate 12 is started when the operator operates the operation unit 46 to instruct the screen printing apparatus 1 to start production.
  • the flowchart shown in FIG. 9 includes not only work performed by the screen printing apparatus 1 but also work performed by an operator.
  • control unit 40 moves the backup plate 21 to the standby position, the upper plate 22A to the unlocked position, and the lower plate 24 to the lower position.
  • the operator inserts the necessary backup pins 20 into the backup plate 21, as shown in FIG.
  • the operator inserts only backup pins 20 used for backing up the three types of substrates 12.
  • the lower plate 24 is positioned below the pin insertion hole 21 ⁇ / b> A, the lower end of the inserted backup pin 20 is abutted against the lower plate 24, so that further downward movement is restricted.
  • unnecessary backup pins 20 that are not used in the three types of substrates 12 are inserted in the backup plate 21, the operator pulls out the backup pins 20.
  • the operator operates the operation unit 46 to select the type of substrate 12 to be produced. For example, when three kinds of substrates 12 are produced, the operator sets the three kinds and selects the kind to be produced this time among the three kinds. If three types are already set, it is only necessary to select the type to be produced this time.
  • the control unit 40 sets up the backup pin 20.
  • the controller 40 lowers the backup plate 21 to the lower position. Since the lower end of the backup pin 20 in the lowered position is in contact with the lower plate 24, when the backup plate 21 is lowered to the lower position, it is relatively pushed upward from the backup plate 21 by the lower plate 24. Thereby, all the backup pins 20 in the lowered position among the backup pins 20 inserted in the pin insertion holes 21A are collectively moved to the raised position. As a result, all the backup pins 20 inserted in the backup plate 21 are located at the raised position.
  • control unit 40 slides the upper plate 22A to the lock position to lock the backup pin 20 in the raised position.
  • the reason for locking the backup pin 20 is to prevent the backup pin 20 from falling when the backup plate 21 is raised.
  • the control unit 40 raises the backup plate 21 to the standby position.
  • the control unit 40 slides the upper plate 22A to the unlocked position to release the lock. Since the lock is released, the backup pin 20 is held only by the frictional force of the O-ring 31 in the state shown in FIG. Therefore, when the backup pin 20 is pulled upward, the O-ring 31 is removed from the pin insertion hole 21A, and the backup pin 20 can be pulled out. Conversely, when the backup pin 20 is pressed down, the O-ring 31 is removed from the pin insertion hole 21A, and the backup pin 20 falls (that is, descends). That is, the backup pin 20 shown in FIG. 10E is temporarily held in a form that can be pulled out and lowered when pressed down.
  • the control unit 40 presses the backup pins 20 that are not used for backup of the substrate 12 of the type selected in S103 downward one by one by the pin lowering head 27A. .
  • the backup pins 20 that are not used for backup among the backup pins 20 inserted into the pin insertion holes 21A fall (that is, descend).
  • the control unit 40 sequentially presses the backup pins 20 one by one by the pin lowering head 27A, the backup pins 20 used for backing up the plurality of types of substrates 12 set in S103 described above are inserted.
  • the pressing operation is performed only above the pin insertion hole 21A. In other words, the control unit 40 does not perform an operation of pressing the backup pin 20 above the pin insertion hole 21A where the backup pin 20 is not inserted.
  • the controller 40 presses the backup pins 20 not used for backup downward one by one by the pin lowering head 27A one by one, the backup pin 20 is pressed by the imaging unit 26 every time one backup pin 20 is pressed. 20 is imaged from above.
  • control unit 40 slides the upper plate 22A to the lock position.
  • the backup pin 20 held in the raised position and the backup pin 20 in the lowered position are locked so as not to move in the vertical direction.
  • the control unit 40 determines whether the setup has been performed normally. Specifically, the control unit 40 analyzes the image captured by the imaging unit 26 to determine whether all the pressed backup pins 20 have moved to the lowered position, and all the pressed backup pins 20 are detected. If it has moved to the lowered position, it is determined that the setup has been performed normally. The control unit 40 proceeds to S106 when determining that the setup has been performed normally, and proceeds to S111 when determining that the setup has not been performed normally.
  • control unit 40 controls each unit of the screen printing apparatus 1 to print a pattern on the substrate 12.
  • FIGS. 10 (H) to 10 (I) a specific description will be given with reference to FIGS. 10 (H) to 10 (I).
  • the control unit 40 raises the backup plate 21 to the backup position as shown in FIG. As a result, the substrate 12 that has been carried in is backed up by the backup plate 21. Further, as shown in FIG. 10 (H), the control unit 40 has a non-lower position where the lower plate 24 is not positioned below the backup pin 20 (in other words, the through hole 24D of the lower plate 24 is positioned below the backup pin 20). Slide to the desired position).
  • the control unit 40 controls the printing unit 16 to print a pattern on the substrate 12.
  • the control unit 40 lowers the backup plate 21 to the lower position so that the backup plate 21 in the raised position does not interfere with the conveyance of the substrate 12 that has finished printing.
  • the backup pin 20 at the lowered position is inserted into the through hole 24D of the lower plate 24. For this reason, even if the backup plate 21 is lowered to the lower position, the backup pin 20 in the lowered position is prevented from moving to the raised position.
  • control unit 40 determines whether or not the production of the scheduled number of sheets has been completed. It is assumed that the planned number of sheets is preset for each product type. When it is determined that the production has been completed, the control unit 40 proceeds to S108, and when it is determined that the production has not been completed, the control unit 40 returns to S106 and repeats the process.
  • S108 the operator operates the operation unit 46 to select the next product type or instructs the end of production.
  • the control unit 40 proceeds to S110 when the selection of the next product is instructed, and ends the production of the day when the end of the production is instructed.
  • control unit 40 prepares for re-setup in order to re-set up the backup pin 20 in accordance with the next product type.
  • control unit 40 raises the backup plate 21 to the backup position as shown in FIG.
  • control unit 40 slides the lower plate 24 to the lower position as shown in FIG. And it returns to S103 and a process is repeated.
  • S104 as shown in FIG. 10B, the backup plate 21 is lowered to the lower position, so that all the backup pins 20 in the lowered position are moved to the raised position, and the previous setup is reset.
  • the control unit 40 displays an error message on the operation unit 46 and stops the production of the substrate 12.
  • the backup pins 20 that are not used for backup of the different types are pulled out to A small number of backup pins 20 can be used effectively, such as being inserted at a position required for backup of different products.
  • the backup pins 20 can be interchanged between the substrate support devices 15 of the same model. Further, the backup pins 20 can be used more effectively if the backup pins 20 have compatibility even between the substrate support devices 15 of different models.
  • the pin holding portion (O-ring 31) holds the backup pin 20 in a form in which the backup pin 20 descends when the backup pin 20 is pressed down.
  • the backup pin 20 can be lowered by a simple operation of pressing.
  • the pin holding portion is an elastic body (O-ring 31).
  • O-ring 31 As a configuration in which the backup pin 20 is held in the form of descending when the backup pin 20 is pressed downward, a configuration in which the backup pin 20 is held by air pressure or electrically held is also conceivable.
  • such holding has a problem that the configuration becomes complicated.
  • maintains by an air pressure there also exists a problem that malfunctions, such as an air leak, occur easily.
  • the backup pin 20 is locked in the raised position, so that the backup pin 20 can be prevented from being lowered when backing up the board 12.
  • the backup pin 20 locks the backup pin 20 at a position where the backup pin 20 backs up the board 12, so that the backup pin 20 is not lowered while the board 12 is backed up by the backup pin 20. be able to.
  • the substrate support device 15 when the backup pins 20 that are not used for backup are pressed down one by one, the operation of pressing down is not performed at a position where the backup pins 20 are not inserted, so that setup is required. Time can be shortened. Thereby, the productivity at the time of product type switching can be improved.
  • the lower plate 24 collectively moves the backup pins 20 to the raised position using the elevating part 23 that raises and lowers the backup plate 21, so that, for example, the backup pins 20 are raised one by one. It can be moved to the raised position in a shorter time than when it is pulled up.
  • the lower plate 24 is moved to the non-lower position (the backup pin 20 is a through hole). 24D, it is possible to prevent the backup pin 20 in the lowered position from moving to the raised position.
  • the substrate support device 15 it is determined whether or not the backup pin 20 that should be moved to the lowered position has actually moved to the lowered position by focusing on the upper end surface of the backup pin 20 at the raised position. Judgment can be made. Note that this determination can also be made by focusing on the upper end surface of the backup pin 20 in the lowered position.
  • the backup pins 20 have the middle diameter portions 30 at two places with a space in the vertical direction. In other words, the backup pin 20 is constricted in two places. Thereby, the backup pin 20 can be locked at two positions, the raised position and the lowered position.
  • Embodiment 2 of the present invention will be described with reference to FIG.
  • the case where the backup pins 20 that are not used for backup are pressed down one by one by the pin lowering portion 27 has been described as an example.
  • the backup pins 20 that are not used for backup are collectively lowered by the jig component 60 (see FIG. 11).
  • the jig component 60 will be described with reference to FIG. In FIG. 11, the jig component 60 is shown upside down.
  • the jig component 60 includes a plate-like portion 61 formed in a plate shape, and a plurality of pressing pins 62 that project downward from the lower surface of the plate-like portion 61.
  • a plurality of attachment holes 63 for attaching the pressing pins 62 are provided in the plate-like portion 61 at positions corresponding to the pin insertion holes 21 ⁇ / b> A of the backup plate 21.
  • the plurality of pressing pins 62 are attached to attachment holes 63 corresponding to the backup pins 20 that are not used for backup.
  • the jig component 60 is prepared for each type of the substrate 12. For example, it is possible to prepare only one jig component 60 and change the arrangement of the pressing pins 62 according to the type of the substrate 12, but the pin arrangement of the jig component 60 is changed every time the type is changed. This is a heavy burden on the operator. If a jig component 60 is prepared for each type of substrate 12, such work can be omitted.
  • step S ⁇ b> 104 the control unit 40 conveys the jig component 60 to above the substrate support device 15 by the conveyance conveyor 14, and raises the backup plate 21 in this state. As a result, the backup pins 20 that are not used for backup are pressed together by the pressing pins 62.
  • the backup pins 20 that are not used for backup can be lowered at a time, so that the setup is required as compared with the case where the backup pins 20 are lowered one by one in order. Time can be shortened.
  • the pin lowering head 27A and the head transport unit 27B according to the first embodiment are not necessary, so that the configuration of the substrate support device 15 can be simplified as compared with the first embodiment.
  • the backup pins 20 are sequentially pressed one by one by the pin lowering head 27A, and in the second embodiment, a plurality of backup pins 20 are collectively pressed by the jig component 60. did.
  • the pressing using the jig component 60 is enabled so that the pressing using the pin lowering head 27A or the pressing using the jig component 60 can be switched by setting. Also good.
  • the backup pin 20 is held in a form in which the backup pin 20 descends when the backup pin 20 is pushed down has been described as an example.
  • the backup pin 20 may be held.
  • the male screw formed on the outer periphery of the backup pin 20 and the female screw formed in the pin insertion hole 21A may be held by screwing.
  • a convex portion is provided on the outer periphery of the backup pin 20, and the pin insertion hole 21A has a shape that allows the convex portion to pass therethrough, and the backup pin 20 is rotated and protruded with the convex portion moved over the pin insertion hole 21A. You may hold
  • the elastic body (O-ring 31) has been described as an example of the configuration that holds the backup pin 20 in a form in which the backup pin 20 descends when the backup pin 20 is pressed downward. If it does, the structure hold
  • the O-ring 31 is described as an example of the elastic body.
  • the elastic body is not limited to the O-ring 31 as long as it can hold the backup pin 20.
  • the backup plate 21 includes the lock portion 22
  • the backup pin 20 can be prevented from being lowered only by the holding force of the elastic body.
  • the lock unit 22 is not necessarily provided.
  • the lower plate 24 pin rising portion
  • the lower plate 24 does not move in the vertical direction, but even if the lower plate 24 is raised and the backup pin 20 is moved to the raised position in the state shown in FIG. Good.
  • the lower plate 24 is described as an example of the pin raising portion, but the pin raising portion may be the base 13.
  • a configuration may be adopted in which the lower end of the backup pin 20 is moved to the raised position by contacting the base 13.
  • the backup pin 20 at the lowered position is collectively moved to the raised position by the lower plate 24.
  • a mechanism for pulling the backup pin 20 upward is provided, and the backup pin is moved by the mechanism. The structure which pulls up 20 one by one may be sufficient.
  • the substrate support device 15 includes an application device (so-called dispenser) including an application unit that applies an adhesive to the substrate 12. ).
  • the dispenser generally has a head transport unit that transports the dispenser head in the X-axis direction and the Y-axis direction, the pin lowering head 27A may be provided integrally with the dispenser head.
  • the substrate support device 15 may be provided in a surface mounter including a mounting unit for mounting electronic components on the substrate 12.
  • a surface mounter has a head transport unit that transports a mounting head to which a suction nozzle for sucking parts is detachably mounted in the X-axis direction and the Y-axis direction, and the suction nozzle moves up and down in the vertical direction. It is provided as possible. For this reason, when the substrate mounting device 15 is provided in the surface mounting machine, a pressing pin for pressing the backup pin 20 downward is attached instead of the suction nozzle, and the backup pin 20 is pressed downward by lowering the pressing pin. May be. In that case, a head conveyance part, a mounting head, a pressing pin, etc. are examples of a pin lowering part.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Screen Printers (AREA)

Abstract

La présente invention concerne un dispositif de support de substrat 15 qui soutient un substrat 12 par-dessous au moyen d'une broche de support 20. Le dispositif de support de substrat 15 comprend : une plaque de support 21 comportant une pluralité de trous d'insertion de broche 21A dans lesquels les broches de support 20 doivent être insérées de façon à être mobiles vers une position levée et une position abaissée ; une partie d'élévation et d'abaissement 23 qui lève et abaisse la plaque de support 21 ; une plaque inférieure 24 (partie de levage de broche) qui déplace toutes les broches de support 20 dans la position abaissée parmi les broches de support 20 insérées dans les trous d'insertion de broche 21A vers la position levée ; des joints toriques 31 (parties de retenue de broche) qui retiennent les broches de support 20 dans la position levée ; et une partie d'abaissement de broches 27 qui déplace les broches de support 20 non utilisées pour le support du substrat 12 parmi les broches de support 20 retenues dans la position levée vers la position abaissée.
PCT/JP2016/063060 2016-04-26 2016-04-26 Dispositif de support de substrat, dispositif de sérigraphie, dispositif d'enduction, machine de montage en surface et procédé d'agencement de broche de support WO2017187513A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2016/063060 WO2017187513A1 (fr) 2016-04-26 2016-04-26 Dispositif de support de substrat, dispositif de sérigraphie, dispositif d'enduction, machine de montage en surface et procédé d'agencement de broche de support
JP2018513986A JP6546697B2 (ja) 2016-04-26 2016-04-26 基板サポート装置、スクリーン印刷装置、塗布装置、表面実装機、及び、バックアップピン段取り方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/063060 WO2017187513A1 (fr) 2016-04-26 2016-04-26 Dispositif de support de substrat, dispositif de sérigraphie, dispositif d'enduction, machine de montage en surface et procédé d'agencement de broche de support

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059677A1 (fr) * 2019-09-25 2021-04-01 株式会社明電舎 Machine tournante
CN114701248A (zh) * 2022-04-02 2022-07-05 青岛海尔空调器有限总公司 用于空调器的丝印工装

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0799400A (ja) * 1993-09-29 1995-04-11 Hitachi Ltd 基板保持固定装置
JP2004006451A (ja) * 2002-04-10 2004-01-08 Hitachi Industries Co Ltd ワーク支持機構
JP2006093243A (ja) * 2004-09-21 2006-04-06 Juki Corp 電子部品実装装置
JP2009115725A (ja) * 2007-11-09 2009-05-28 Panasonic Corp 検査装置
JP2009146945A (ja) * 2007-12-11 2009-07-02 Yamaha Motor Co Ltd 基板支持方法、基板支持装置、バックアップピン引出し治具、部品実装装置、塗布装置及び基板検査装置
JP2010143085A (ja) * 2008-12-18 2010-07-01 Hitachi High-Tech Instruments Co Ltd 基板支持装置及びスクリーン印刷機

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331243B (zh) * 2013-05-28 2016-01-27 上海华虹宏力半导体制造有限公司 涂布设备的热处理腔室

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0799400A (ja) * 1993-09-29 1995-04-11 Hitachi Ltd 基板保持固定装置
JP2004006451A (ja) * 2002-04-10 2004-01-08 Hitachi Industries Co Ltd ワーク支持機構
JP2006093243A (ja) * 2004-09-21 2006-04-06 Juki Corp 電子部品実装装置
JP2009115725A (ja) * 2007-11-09 2009-05-28 Panasonic Corp 検査装置
JP2009146945A (ja) * 2007-12-11 2009-07-02 Yamaha Motor Co Ltd 基板支持方法、基板支持装置、バックアップピン引出し治具、部品実装装置、塗布装置及び基板検査装置
JP2010143085A (ja) * 2008-12-18 2010-07-01 Hitachi High-Tech Instruments Co Ltd 基板支持装置及びスクリーン印刷機

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059677A1 (fr) * 2019-09-25 2021-04-01 株式会社明電舎 Machine tournante
CN114701248A (zh) * 2022-04-02 2022-07-05 青岛海尔空调器有限总公司 用于空调器的丝印工装
CN114701248B (zh) * 2022-04-02 2024-01-16 青岛海尔空调器有限总公司 用于空调器的丝印工装

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