WO2017187378A1 - Brasure tendre active et procédé de brasage - Google Patents

Brasure tendre active et procédé de brasage Download PDF

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Publication number
WO2017187378A1
WO2017187378A1 PCT/IB2017/052433 IB2017052433W WO2017187378A1 WO 2017187378 A1 WO2017187378 A1 WO 2017187378A1 IB 2017052433 W IB2017052433 W IB 2017052433W WO 2017187378 A1 WO2017187378 A1 WO 2017187378A1
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WO
WIPO (PCT)
Prior art keywords
soldering
solder
metal
mass
active
Prior art date
Application number
PCT/IB2017/052433
Other languages
English (en)
Other versions
WO2017187378A4 (fr
Inventor
Roman KOLEŇÁK
Original Assignee
Slovenská Technická Univerzita V Bratislave
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Slovenská Technická Univerzita V Bratislave filed Critical Slovenská Technická Univerzita V Bratislave
Publication of WO2017187378A1 publication Critical patent/WO2017187378A1/fr
Publication of WO2017187378A4 publication Critical patent/WO2017187378A4/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C23/00—Alloys based on magnesium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C23/00—Alloys based on magnesium
    • C22C23/04—Alloys based on magnesium with zinc or cadmium as the next major constituent

Definitions

  • the invention concerns the composition of active soft solder for soldering of the non-metal materials with the metal/non-metal materials, and method of their soldering by this active soft solder.
  • the invention falls within the field of lead-free solder in the electrotechnic or automotive industry.
  • the state of the art shows that some ceramic materials (e.g. AI2O3, S1O2, T1O2 and so on), some non-metal materials (Si, Ge, graphite, and so on) and some difficultly solderable metal materials (W, Mo, Ta and so on) are hitherto soldered in such a way that the solderable metal coating is applied on the surface of the ceramic material and the soldering itself is then realized.
  • the metallization of the ceramic removes the problems connected with the wettability of the ceramic and some non-metal materials. From the point of view of a type of metallization, the temperature at which the soldered component would be soldered, has to be known. Pursuant to this either soft or hard solder is used. The required solderable coating is then achieved:
  • the produced solderable coating ensures excellent wettability of the surface of the material - which is otherwise non-wettable - by the solder.
  • Soldering of the non-metal materials (AI2O3, S1O2, T1O2 and so on) or difficultly solderable materials (W, Mo, Ta and so on) is known in the prior state of the art: it is so-called direct soldering with use of so- called active solder which contains small amount of active metal (for example alkaline earth metals - Mg, Ba, etc.).
  • the direct soldering with use of the active solder is known for example in pattent application US 3,103,067 A disclosing an ultrasound soldering of metal materials with non-metal (for example glass, ceramics, and so on), whereby the essence of the technology lies in use of the active element (e.g. Mg) in the solder on Sn-Pb/Sn-Zn/Pb-Ag basis with addition of In, whereby the solder does not contain flux (addition).
  • solder is on a basis of Sn-Zn alloy with additive (e.g. In) with active element (Ti, Mg and so on).
  • additive e.g. In
  • active element Ti, Mg and so on
  • solders The basis of all active solders disclosed above is at least one of these metals: Sn, Pb. Pb is subsequently substituted by alternative elements, since it is considered harmful. Sn also causes the lowering of the application temperature of the given solder. Such solders are therefore incompatible with the given solder on a basis of Zn-ln with addition of Mg according to this invention. Even though the Zn-ln alloy as a solder is known, it cannot be considered an active solder designed for soldering of non-metal (e.g. ceramic) materials.
  • non-metal e.g. ceramic
  • Patent application WO 2013115949 marginally touches this problematic in its description of method of production of Al profile, where at least one of either the first profile component or second profile component is Al alloy which contains Zn in more than 0,8% of the mass, with the use of solder which contains either Mg or Zn. Presence of Mg in the solder ranges from 35% to 60% of the mass.
  • Publication CN 103934590 is known and it discloses high- temperature lead-free solder on Zn-AI-Mg-ln basis used for covering of the openings in the micro-electronic industry.
  • the solder contains Al in 3,9 to 4,1 % of the mass, Mg in 2,4 to 3,1 % of the mass, In in 0,5 to 3,0 % of the mass, or P in 0,05 to 1,0 % of the mass, and balancing element Zn.
  • In and P elements are added in order to decrease the temperature of melting of the alloy and they improve the resistance to oxidation.
  • composition of lead-free active soft solde for soldering of the non-metal materials with non-metal/metal materials and a method of soldering of these materials by the proposed active soft solder according to this invention, whereby the methods of ultrasound, laser or gradual soldering can be undertaken.
  • the abovementioned deficiencies are significantly remedied by an active soft solder adapted for ultrasound, laser and other methods of soldering of the non-metal materials with metal/non-metal materials according to this invention.
  • the non-metal material is ceramics, glass, and so on.
  • the advantage of this proposal is in suitable basis and in choice of suitable active metal.
  • Zn-ln is the proposed basis.
  • a solder based on Zn-ln is perspective substitution for the lead solders for the higher application temperatures in general, even during soldering of metal materials. Multiple active metals have been tested together with this basis.
  • solder During the design and production of the solder following criteria were used: productibility of the solder with active metal, acceptable price, relatively low toxicity, structural compatibility with Zn- ln basis, and reaction capabilities of the active metal - it should be able to react with broad scale of soldered materials.
  • the best choice is alloying (doping) with magnesium.
  • Magnesium has high affinity towards oxygen and other elements which are components of the soldered materials.
  • indium ensures good wettability of the metal, as well as ceramic materials.
  • the solidity of the joints ranges from 40 to 85 MPa, which is sufficient for the operation of the solder of this type.
  • the essence of the invention lies in the fact that soft active solder is composed from 1 to 10 % of the mass from In (indium), 0,5 to 3 % fo the mass from Mg (magnesium), whereby the rest is Zn (zinc). Aside from this, the solder can contain common admixtures or impurities. All three components of the solder - Zn, In and Mg - are active metals which have strong chemical affinity to oxygen.
  • Advantageous composition of the solder consists of 4 to 6 % mass of In, 0,5 to 3 % mass of MG, whereby the rest is Zn and common impurities.
  • a method is applicable, too: a method of soldering of non-metal (ceramic) material with non-metal (ceramic) or metal material, whose essence lies in the fact that the connected non-metal material is directly soldered with the non-metal/metal material by ultrasound, laser and so on, with use of active soft solder on the basis Zn-ln-Mg, without coating operation, or - eventually - a method of gradual soldering is used.
  • the joints with higher temperature of soldering are soldered first; in second stage the joints with lower temperature of soldering are soldered, whereby the joints from first stage cannot be melted. In the first stage it is advantageous to use the solder according to this invention.
  • active soft solder on Zn-ln-Mg basis and the method of soldering of non-metal material with non-metal/metal material according to this invention are apparent from their outwardly manifested effects.
  • this is direct soldering with use of special so-called active solder which contains small amount of active metal.
  • This soldering alloy is in combination with ultrasound or laser or other activation (wave soldering or reflow soldering), suitable for direct soldering of the ceramic or other difficultly solderable materials, without the use of coating and without the use of flue.
  • the time necessary for production of the joints is therefore also lowered, the hygiene of the working environment is improved and the economy of production of soldered joints is improved.
  • the active element is important part of the solder, since it ensures wettability and creation of bond between the metal solder and ceramical material.
  • the significant advantage of the solder at hand is its applicability in higher application temperatures without the use of flue. Higher application temperature predetermines the applicability of this solder mainly in the process of gradual soldering.
  • composition of the solder according to this invention ensures high shear strength of the soldered joints and high tensile strength of the solder. These strengths are significantly higher than with use of the individual components of the solders which are known in the prior state of the art. High strengths result from synergetic effect which occurs with the composition according to this invention. Description of drawings
  • Figure 1 depicts shear strengths of the sodlered joints Cu/Cu and silicon/Cu with Zn-ln-Mg solders in dependence on the amount of In.
  • Figure 2 depicts tensile strength of the soldered alloys Zn-ln-Mg in dependence on amount of In.
  • composition of the active soft solder on Zn-ln-Mg basis is disclosed.
  • the active soft solder is composed from 1% of the mass from In, 1% of the mass from Mg, and the rest is Zn.
  • Example 2 In this example of the particular realization of the object of the technical solution a composition of the active soft solder on Zn-ln-Mg basis is disclosed.
  • the active soft solder is composed from 2% of the mass from In, 1% of the mass from Mg, and the rest is Zn.
  • composition of the active soft solder on Zn-ln-Mg basis is disclosed.
  • the active soft solder is composed from 10% of the mass from In, 1% of the mass from Mg, and the rest is Zn, whereby alternatively acceptable values for Mg are also those in range from 0,5 to 3 % of the mass.
  • solder on the Zn-ln-Mg basis according to this invention is perspective substitute for lead solders in case of higher application temperatures. It can be applied in electronic, electrotechnical or automotive industry. It can be used during gradual soldering in progressive technologies of covering, such as Ball Grid Array (BGA), Flip-Chip technology (C4), Chip-Scale-Package (CSP) or Multi-Chip Module (MCM).
  • BGA Ball Grid Array
  • C4 Flip-Chip technology
  • CSP Chip-Scale-Package
  • MCM Multi-Chip Module

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)

Abstract

La présente invention concerne une brasure tendre active pour le brasage des matériaux non métalliques avec des matériaux non métalliques/métalliques qui est constituée de In dans 1 à 10 % de sa masse, de Mg dans 0,5 à 3 % de sa masse, le reste étant Zn. De préférence, la composition est constituée de In dans 4 à 6 % de sa masse, de Mg dans 0,5 à 3 % de sa masse, le reste étant Zn et des impuretés usuelles. Le matériau connecté, par exemple un matériau céramique et un matériau céramique/métallique, est brasé au moyen de cette brasure tendre active sur une base de Zn-ln-Mg constituée de In dans 1 à 10 % de sa masse, de Mg dans 0,5 à 3 % de sa masse, le reste étant Zn, directement par ultrasons ou laser sans revêtement. La brasure peut être utilisée dans une première étape du brasage progressif, de sorte que, dans la deuxième étape, le brasage soit effectué avec une brasure différente avec une température de brasage plus basse.
PCT/IB2017/052433 2016-04-28 2017-04-27 Brasure tendre active et procédé de brasage WO2017187378A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SK5011-2016A SK288500B6 (sk) 2016-04-28 2016-04-28 Mäkká aktívna spájka a jej použitie
SKPP5011-2016 2016-04-28

Publications (2)

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WO2017187378A1 true WO2017187378A1 (fr) 2017-11-02
WO2017187378A4 WO2017187378A4 (fr) 2017-12-21

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3103067A (en) * 1959-08-13 1963-09-10 Westinghouse Electric Corp Process of soldering to a ceramic or glass body
US3680200A (en) * 1970-12-16 1972-08-01 Aluminum Co Of America Fluxless ultrasonic soldering of aluminum tubes
US3945554A (en) * 1975-06-12 1976-03-23 Fedders Corporation Ultrasonic soldering process
JPH11172354A (ja) * 1997-12-04 1999-06-29 Sumitomo Metal Mining Co Ltd 高温はんだ付用Ｚｎ合金
JP2004237357A (ja) * 2003-02-06 2004-08-26 Katsuaki Suganuma 高温鉛フリーはんだ
CN101088691A (zh) * 2007-07-20 2007-12-19 哈尔滨工业大学 超声钎焊铝基复合材料焊缝复合化方法
KR20130075475A (ko) * 2011-12-27 2013-07-05 재단법인 포항산업과학연구원 레이저 브레이징 장치 및 방법
CN103934590A (zh) * 2014-04-13 2014-07-23 北京工业大学 一种ZnAlMgIn高温无铅钎料
US20160039031A1 (en) * 2013-03-27 2016-02-11 Panasonic Intellectual Property Management Co., Ltd. Ceramic-metal bonding structure and process for producing same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3103067A (en) * 1959-08-13 1963-09-10 Westinghouse Electric Corp Process of soldering to a ceramic or glass body
US3680200A (en) * 1970-12-16 1972-08-01 Aluminum Co Of America Fluxless ultrasonic soldering of aluminum tubes
US3945554A (en) * 1975-06-12 1976-03-23 Fedders Corporation Ultrasonic soldering process
JPH11172354A (ja) * 1997-12-04 1999-06-29 Sumitomo Metal Mining Co Ltd 高温はんだ付用Ｚｎ合金
JP2004237357A (ja) * 2003-02-06 2004-08-26 Katsuaki Suganuma 高温鉛フリーはんだ
CN101088691A (zh) * 2007-07-20 2007-12-19 哈尔滨工业大学 超声钎焊铝基复合材料焊缝复合化方法
KR20130075475A (ko) * 2011-12-27 2013-07-05 재단법인 포항산업과학연구원 레이저 브레이징 장치 및 방법
US20160039031A1 (en) * 2013-03-27 2016-02-11 Panasonic Intellectual Property Management Co., Ltd. Ceramic-metal bonding structure and process for producing same
CN103934590A (zh) * 2014-04-13 2014-07-23 北京工业大学 一种ZnAlMgIn高温无铅钎料

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Binary alloy phase diagrams", 2 February 1987, ASM, AMERICAN SOCIETY FOR METALS, Metals Park, Ohio, US, ISBN: 978-0-87170-261-6, article THADDEUS B. MASSALSKI: "Binary alloy phase diagrams", XP055397731 *
C. GARCIA-CORDOVILLA ET AL: "The surface tension of liquid pure aluminium and aluminium-magnesium alloy", JOURNAL OF MATERIALS SCIENCE, vol. 21, no. 8, 1 August 1986 (1986-08-01), Dordrecht, pages 2787 - 2792, XP055394940, ISSN: 0022-2461, DOI: 10.1007/BF00551490 *
LIANG H ET AL: "A thermodynamic description of the Al-Mg-Zn system", METALLURGICAL AND MATERIALS TRANSACTIONS A, SPRINGER-VERLAG, NEW YORK, vol. 28, no. 9, 1 September 1997 (1997-09-01), pages 1725 - 1734, XP019692240, ISSN: 1543-1940 *
LIMING LIU ET AL: "Study on Mg/Al Weld Seam Based on Zn-Mg-Al Ternary Alloy", MATERIALS, vol. 7, no. 2, 13 February 2014 (2014-02-13), CH, pages 1173 - 1187, XP055396926, ISSN: 1996-1944, DOI: 10.3390/ma7021173 *

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Publication number Publication date
WO2017187378A4 (fr) 2017-12-21
SK288500B6 (sk) 2017-10-03
SK50112016A3 (sk) 2016-09-05

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