WO2017181462A1 - 一种基于boa技术的显示面板及制作方法 - Google Patents

一种基于boa技术的显示面板及制作方法 Download PDF

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Publication number
WO2017181462A1
WO2017181462A1 PCT/CN2016/082304 CN2016082304W WO2017181462A1 WO 2017181462 A1 WO2017181462 A1 WO 2017181462A1 CN 2016082304 W CN2016082304 W CN 2016082304W WO 2017181462 A1 WO2017181462 A1 WO 2017181462A1
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Prior art keywords
photoresist
spacer
region
layer
array substrate
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Ceased
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PCT/CN2016/082304
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English (en)
French (fr)
Inventor
王海军
张霞
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US15/117,197 priority Critical patent/US10365523B2/en
Publication of WO2017181462A1 publication Critical patent/WO2017181462A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13396—Spacers having different sizes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/52—RGB geometrical arrangements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel and a manufacturing method based on the BOA technology.
  • TFT-LCD Thin film transistor-liquid crystal Display
  • the liquid crystal panel can be divided into a thin film transistor array substrate and a color filter substrate according to the structural composition.
  • the alignment is not Good light leakage, reduced aperture ratio, reduced panel brightness, etc., and limited application on curved display.
  • color filters have been integrated into the array substrate (Color Filter On Array, COA) combined with black matrix integrated on the array substrate (Black matrix on Array, BOA) technology, the color filter part is integrated on the array substrate, that is, the color photoresist layer and the black matrix are prepared on the array substrate, which overcomes the disadvantages caused by poor alignment, but the technology of COA combined with BOA There is still no reduction in the production process, resulting in no improvement in cost.
  • the technical problem to be solved by the present invention is to provide a display panel and a manufacturing method based on the BOA technology, which can reduce the production process and reduce the production cost.
  • a technical solution adopted by the present invention is to provide a method for manufacturing a display panel based on BOA technology, including:
  • the array substrate comprises a display area and a non-display area
  • the black matrix layer is exposed with a reticle to form a second spacer and/or a first spacer corresponding to the non-display area, wherein the first spacer is different in height and position from the second spacer.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a display panel based on BOA technology, including:
  • the array substrate comprises a display area and a non-display area
  • a color photoresist layer and a black matrix layer are formed on the array substrate, and spacers are simultaneously formed in the process of forming the color photoresist layer and/or the black matrix layer.
  • forming spacers simultaneously in the process of forming the color photoresist layer and/or the black matrix layer comprises:
  • the black matrix layer is exposed to form a second spacer corresponding to the non-display area.
  • first spacer and the second spacer have different positions and different heights.
  • forming a color photoresist layer on the array substrate, and exposing the color photoresist layer to form a first spacer corresponding to the non-display area comprises:
  • the first spacer is formed on the non-display area of the array substrate, where the red photoresist, the green photoresist or the blue photoresist is formed.
  • forming a color photoresist layer on the array substrate, and exposing the color photoresist layer to form a first spacer corresponding to the non-display area comprises:
  • the translucency is greater than the translucency of the second region of the photomask corresponding to the first spacer, and the remaining regions of the photomask that remove the first region and the second region are impermeable to the film;
  • a blue photoresist is formed on the array substrate.
  • the first region of the reticle corresponding to the green photoresist is a full permeable membrane, and the second region of the reticle corresponding to the first spacer has a light transmittance greater than that of the opaque film.
  • exposing the black matrix layer to form a second spacer corresponding to the non-display area comprises:
  • the black matrix layer After exposing the black matrix layer, the black matrix layer forms a second spacer corresponding to the non-display area, wherein the first region of the photomask corresponding to the second spacer has greater light transmittance than the second region of the photomask removing the first region The light transmittance, the black matrix layer corresponding to the second region leaves the remaining black matrix layer.
  • the first region of the photomask corresponding to the second spacer is a full permeable film, and the second region of the reticle removing the first region has a light transmissivity greater than that of the opaque film.
  • forming spacers simultaneously in the process of forming the color photoresist layer and/or the black matrix layer comprises:
  • Forming a color photoresist layer on the array substrate exposing the color photoresist layer to form a recessed region and a color photoresist, wherein the recessed region is located in the color resist region corresponding to the non-display region of the array substrate;
  • the black matrix layer is exposed such that a first spacer is formed on the recessed region, and a second spacer is formed on the non-display region of the array substrate corresponding to the colored photoresist layer.
  • forming a color photoresist layer on the array substrate, exposing the color photoresist layer to form the recessed region and the color photoresist comprises:
  • a green photoresist and a blue photoresist are formed on the array substrate.
  • the first region of the photomask corresponding to the red photoresist is a full permeable membrane
  • the second region of the reticle removing the first region is an impermeable membrane
  • forming a color photoresist layer on the array substrate, exposing the color photoresist layer to form the recessed region and the color photoresist comprises:
  • a red photoresist and a blue photoresist are formed on the array substrate.
  • forming a color photoresist layer on the array substrate, exposing the color photoresist layer to form the recessed region and the color photoresist comprises:
  • a red photoresist and a green photoresist are formed on the array substrate.
  • the black matrix layer is exposed such that a first spacer is formed on the recessed region, and the second spacer is formed on the colored photoresist layer, including:
  • the light transmittance of the first region of the photomask corresponding to the first spacer and the second spacer is greater than the light transmittance of the second region of the photomask with the first region removed.
  • the first region of the reticle corresponding to the first spacer and the second spacer is a full permeable film, and the second region of the reticle removing the first region has a light transmissivity greater than that of the opaque film.
  • another technical solution adopted by the present invention is to provide a display panel based on BOA technology, including:
  • An array substrate comprising a display area and a non-display area
  • the spacers are disposed in the non-display area of the array substrate, and the spacers are formed in the process of forming the color photoresist layer and/or the black matrix layer.
  • the spacer comprises a first spacer and a second spacer, the first spacer and the second spacer have different heights and different positions;
  • the first spacer is formed in the process of forming the color photoresist layer
  • the second spacer is formed in the process of forming the black matrix layer.
  • the color photoresist layer comprises a red photoresist, a green photoresist and a blue photoresist;
  • the first spacer and the red photoresist are formed by exposing a red photoresist layer corresponding to the red photoresist by a primary mask; or
  • the first spacer and the green photoresist are formed by exposing a green photoresist layer corresponding to the green photoresist with a primary mask; or
  • the first spacer and the blue photoresist are formed by exposing the blue photoresist layer corresponding to the blue photoresist with a primary mask.
  • the spacer comprises a first spacer and a second spacer, the first spacer and the second spacer have different heights and different positions;
  • the first spacer and the second spacer are formed in a process of forming a black matrix layer.
  • the present invention provides an array substrate, wherein the array substrate includes a display area and a non-display area, and a color photoresist layer and a black matrix layer are formed on the array substrate, and In the process of forming the color photoresist layer and/or the black matrix layer, spacers are simultaneously formed. In this way, the present invention simultaneously forms spacers in the process of forming the color photoresist layer and/or the black matrix layer, thereby reducing the flow of separately forming the spacers, thereby reducing the manufacturing process of the entire display panel and reducing the production cost.
  • FIG. 1 is a flow chart of a first embodiment of a method for fabricating a display panel based on BOA technology according to the present invention
  • FIG. 2 is a specific flowchart of an application scenario in step S12 of FIG. 1;
  • FIG. 3 is a flow chart of a second embodiment of a method for fabricating a display panel based on BOA technology according to the present invention.
  • 4a is a top plan view of the array substrate in step S201 of FIG. 3;
  • 4b-4h are schematic cross-sectional views of the display panel in each step of FIG. 3;
  • 4i is a top plan view of the display panel after step S207 in FIG. 3;
  • FIG. 5 is a flow chart of a third embodiment of a method for fabricating a display panel based on BOA technology according to the present invention.
  • Figure 6a is a top plan view of the array substrate in step S301 of Figure 5;
  • 6b-6g are schematic cross-sectional views of the display panel in each step of FIG. 5;
  • 6h is a schematic top view of the display panel after step S303 in FIG. 5;
  • FIG. 7 is a schematic structural view of an embodiment of a display panel based on BOA technology of the present invention.
  • FIG. 8 is a top plan view of an array substrate in an embodiment of a display panel based on BOA technology of the present invention.
  • a first embodiment of a method for manufacturing a display panel based on BOA technology of the present invention includes:
  • Step S11 providing an array substrate, wherein the array substrate comprises a display area and a non-display area;
  • an array substrate is prepared, which may include a data line, a scan line, a thin film transistor, a pixel electrode, and the like, the array substrate including a display area for displaying an image and a display area other than, for example, for spacing or distinguishing Non-display area of different pixels.
  • Step S12 forming a color photoresist layer and a black matrix layer on the array substrate, and simultaneously forming a spacer in the process of forming the color photoresist layer and/or the black matrix layer.
  • step S12 the color photoresist layer and the black matrix layer are formed on the array substrate, so that the color photoresist layer can be aligned with the pixel electrode accurately.
  • the spacer is located on the array substrate, and is an array substrate and an opposite substrate, usually a glass substrate, providing a reserved space for filling a liquid crystal or the like while supporting the array substrate and the opposite substrate.
  • the spacer may be formed in the process of forming the color photoresist layer, in the process of forming the black matrix layer, or in the process of forming the color photoresist layer and forming the black matrix layer, respectively Different spacers.
  • the spacers are usually divided into two types, one being the main spacer and serving as the main support.
  • the other is an auxiliary spacer whose height is usually smaller than the height of the main spacer, and which is different from the position where the main spacer is located, and serves as an auxiliary support when the display panel is pressed.
  • the formation of the main spacer and the auxiliary spacer may be formed once in the process of forming the color photoresist layer; it may be formed once in the process of forming the black matrix layer; or the main spacer is formed in the process of fabricating the color photoresist layer.
  • the auxiliary spacer is formed in the process of fabricating the black matrix layer; or the auxiliary spacer is formed in the process of fabricating the color photoresist layer, and the main spacer is formed in the process of fabricating the black matrix layer.
  • An application scenario of the present embodiment adopts a method in which an auxiliary spacer is formed in a process of fabricating a color photoresist layer, and a main spacer is formed in a process of forming a black matrix layer, as shown in FIG. 2, and the specific steps are as follows:
  • Sub-step S101 forming a color photoresist layer on the array substrate, exposing the color photoresist layer to form a first spacer corresponding to the non-display area;
  • the first spacer means an auxiliary spacer.
  • the color photoresist may include one or a combination of a red photoresist, a green photoresist, and a blue photoresist, and the color photoresist layer is performed by using the corresponding mask During the patterning process, the first spacer is simultaneously formed, and the first spacer can be formed in three ways:
  • the first method is: performing a first exposure on the red photoresist layer corresponding to the red photoresist to form a red photoresist and a first spacer protruding from the red photoresist;
  • a green photoresist and/or a blue photoresist may be pre-formed before the red photoresist, a portion of the red photoresist layer covers the green photoresist and/or the blue photoresist, and the other portion is combined with the green photoresist and/or the blue light. Blocking the same layer, the red photoresist layer is exposed once to form a red photoresist and a first spacer, and the first spacer is formed on the green photoresist and/or the blue photoresist. In some cases, the first spacer Optionally, it is formed on the red photoresist, and the first spacer protrudes from the red photoresist and is integrally formed with the red photoresist.
  • the second method is: performing a first exposure on the green photoresist layer corresponding to the green photoresist to form a green photoresist and a first spacer protruding from the green photoresist;
  • a red photoresist and/or a blue photoresist may be pre-formed before the green photoresist, a part of the green photoresist layer covers the red photoresist and/or the blue photoresist, and the other part is combined with the red photoresist and/or the blue light. Blocking the same layer, performing a single exposure on the green photoresist layer to form a green photoresist and a first spacer, the first spacer being formed on the red photoresist and/or the blue photoresist, and in some cases, the first spacer Optionally, it is formed on the green photoresist, and the first spacer protrudes from the green photoresist and is integrally formed with the green photoresist.
  • the third way is: performing a first exposure on the blue photoresist layer corresponding to the blue photoresist to form a blue photoresist and a first spacer protruding from the blue photoresist;
  • a red photoresist and/or a green photoresist may be pre-formed before the blue photoresist, a portion of the blue photoresist layer covers the red photoresist and/or the green photoresist, and the other portion is combined with the red photoresist and/or the green light. Blocking the same layer, performing a single exposure on the blue photoresist layer to form a blue photoresist and a first spacer, the first spacer being formed on the red photoresist and/or the green photoresist, and in some cases, the first spacer Optionally, it is formed on the blue photoresist, and the first spacer protrudes from the blue photoresist and is integrally formed with the blue photoresist.
  • the first spacer formed is on the non-display area of the array substrate in a red photoresist, a blue photoresist or a green photoresist.
  • Sub-step S102 forming a black matrix layer on the color photoresist layer
  • a black matrix layer is formed on the non-display area of the array substrate corresponding to the color photoresist layer.
  • the black matrix layer blocks the emitted light of the backlight from the non-display area. Leak out to avoid light leakage.
  • Sub-step S103 exposing the black matrix layer to form a second spacer corresponding to the non-display area.
  • the second spacer refers to the main spacer. Exposure of the black matrix layer leaves the remaining black matrix layer on the color photoresist layer while forming a second spacer that protrudes the remaining black matrix layer on the remaining black matrix layer.
  • the black matrix layer may be exposed by using a mask, the mask may be a halftone mask, and the first region of the mask corresponding to the second spacer is greater than the second region of the mask removing the first region. Translucency. After exposing the black matrix layer, a portion of the second region corresponding to the mask leaves a remaining black matrix layer, and a portion corresponding to the first region of the mask forms a second spacer that protrudes from the remaining black matrix layer.
  • step S12 may be performed first, the color photoresist layer is formed through the step S12, and then the array substrate is formed through the step S11.
  • the black matrix layer and the spacers therefore, the order of steps S11 and S12, and the steps involved in step S12 are not limited to the order of the embodiment, and the actual requirements shall prevail.
  • the first embodiment of the method for fabricating a display panel based on the BOA technology of the present invention provides an array substrate, wherein the array substrate includes a display region and a non-display region, and a color photoresist layer and a black matrix layer are formed on the array substrate. And forming a first spacer in the process of forming the color photoresist layer, and forming a second spacer in the process of forming the black matrix layer. In this way, in the process of forming the color photoresist layer and the black matrix layer, the first spacer and the second spacer are respectively formed at the same time, thereby reducing the flow of separately forming the first spacer and the second spacer. Thereby reducing the production process of the entire display panel and reducing the production cost.
  • FIG. 3 is a flow chart of a second embodiment of a method for fabricating a display panel based on the BOA technology of the present invention
  • FIGS. 4b to 4h are schematic cross-sectional views of the display panel in the steps of the second embodiment of the present invention, as shown in FIG. 3 and FIG.
  • the method for manufacturing the display panel specifically includes the following steps:
  • Step S201 providing an array substrate 21, wherein the array substrate 21 includes a display area 201 and a non-display area 202;
  • FIG. 4a is a schematic top view of the array substrate 21 prepared by the step S201
  • FIG. 4b is a schematic cross-sectional view of the array substrate 21, which provides an array substrate 21, which may include data lines and scan lines.
  • a thin film transistor, a pixel electrode, and the like (none of which are shown in the drawing), the array substrate 21 includes a display area 201 for displaying an image and a non-display area 202 for spacing or distinguishing different pixels.
  • Step S202 forming a red photoresist 22 on the array substrate 21;
  • a red photoresist layer may be coated on the array substrate 21, and the red photoresist layer may be patterned to form a red photoresist 22.
  • Step S203 coating a green photoresist layer 23 on the red photoresist 22;
  • a green photoresist layer 23 is coated on the red photoresist 22, and the green photoresist layer 23 covers the red photoresist 22 and extends onto the array substrate 21.
  • Step S204 exposing the green photoresist layer 23 to the green photoresist layer 24 and the first spacer 25 by using the mask 30, wherein the first spacer 25 is located on the non-display area 202 of the array substrate 21 corresponding to the red photoresist 22. ;
  • the reticle 30 adopts three different translucent materials, and the transmissiveness of the reticle 30 corresponding to the first region 32 of the green photoresist 24 is greater than the second region of the reticle 30 corresponding to the first spacer 25 .
  • the light transmittance of 31 is such that after exposure and development, the green photoresist layer 23 corresponding to the first region 32 forms a green photoresist 24, and the green photoresist layer 23 corresponding to the second region 31 forms a first interval of the red photoresist 22
  • the object 25 and the first spacer 25 are exposed to a greater extent than the green photoresist 24, which is generally for the subsequent consideration of the second spacer 28 such that the height of the first spacer 25 and the second spacer 28
  • the height of the mask 30 is removed from the first region 32 and the remaining region 37 of the second region 31.
  • the green photoresist layer 23 removes the green photoresist 24 and the remaining portion of the first spacer 25 is completely removed.
  • the first region 32 of the reticle 30 corresponding to the green photoresist 24 is a full permeable film, and the corresponding green photoresist layer 23 is all exposed to form a green photoresist 24, and the reticle 30 corresponds to the first spacer 25 .
  • the second region 31 has a light transmittance greater than that of the impermeable film, and the corresponding green photoresist layer 23 is exposed to form a first spacer 25 protruding from the red photoresist 22, and the remaining portion of the green photoresist layer 23 is completely removed by development.
  • Step S205 A blue photoresist 26 is formed on the array substrate 21.
  • a blue photoresist layer is coated on the array substrate 21, and the blue photoresist layer is patterned to form a blue photoresist 26.
  • Step S206 coating the red matrix 22, the green photoresist 24, the blue photoresist 26 on the black matrix layer 27;
  • a black matrix layer 27 having a certain thickness is formed on the red photoresist 22, the green photoresist 24, and the blue photoresist 26, and the black matrix layer 27 corresponds to the non-display region 202 of the array substrate 21.
  • Step S207 exposing the black matrix layer 27 by using a mask
  • the reticle 35 adopts two materials having different light transmittances, and the first region 34 of the reticle 35 is a full permeable membrane, and the second region 33 of the reticle 35 has a light transmittance greater than that of the opaque membrane.
  • the black matrix layer 27 corresponding to the first region 34 forms the second spacer 28, and the second spacer 28 is located in the black matrix layer 27 corresponding to the second region 33 leaving the remaining black.
  • Matrix layer 27 is
  • the formation of the color photoresist 22/24/26, the black matrix layer 27, the first spacer 25 and the second spacer 28 is completed by the above steps, and it can be seen that the heights of the first spacer 25 and the second spacer 28 are different. And the position is different; as shown in FIG. 4i, which is a top view of FIG. 4h, it can be seen that the black matrix layer 27, the first spacer 25 and the second spacer 28 are all located on the color array 22/24/26 corresponding array substrate. On the non-display area 202 of 21.
  • the red photoresist 22 is formed on the array substrate 21, and the green photoresist layer 23 is coated on the red photoresist 22 by providing an array substrate 21.
  • the photoresist layer 23 is exposed to form a green photoresist 24 and a first spacer 25, and then a blue photoresist 26 is formed.
  • the black matrix layer 27 is coated over the red photoresist 22, the green photoresist 24, and the blue photoresist 26.
  • the matrix layer 27 leaves the remaining black matrix layer 27 and forms the second spacer 28 after one exposure.
  • the first spacer 25 and the second spacer 28 are simultaneously formed, respectively, and the first spacer 25 and the second spacer are separately formed.
  • the process of the object 28 thereby reducing the production process of the entire display panel and reducing the production cost.
  • FIG. 5 is a flow chart of a third embodiment of a method for fabricating a display panel based on the BOA technology of the present invention
  • FIGS. 6b to 6g are schematic cross-sectional views of the display panel in the steps of the third embodiment of the present invention, as shown in FIG. 5 and FIG.
  • the method for manufacturing the display panel specifically includes the following steps:
  • Step S301 providing an array substrate 301, the array substrate 301 includes a display area 3011 and a non-display area 3012;
  • FIG. 6a is a schematic top view of the array substrate 301 prepared by the step S301
  • FIG. 6b is a schematic cross-sectional view of the array substrate 301.
  • the array substrate 301 is provided.
  • the array substrate 301 can include data lines and scan lines.
  • a thin film transistor, a pixel electrode, and the like (none of which are shown in the drawing), the array substrate 301 includes a display area 3011 for displaying an image and a non-display area 3012 for spacing or distinguishing different pixels.
  • Step S302 forming a color photoresist layer on the array substrate 301, exposing the color photoresist layer to form a recessed region and a color photoresist, wherein the recessed region is located in the color photoresist region corresponding to the non-display region 3012 of the array substrate 301. on;
  • a color photoresist layer is formed on the array substrate 301, and the color photoresist layer includes one or a combination of a red photoresist, a green photoresist, and a blue photoresist.
  • the color photoresist layer The red photoresist, the green photoresist and the blue photoresist need to be included, and the recessed region may be formed by exposing the red photoresist layer to a red photoresist, or by exposing the green photoresist layer to a green photoresist. In the process, or in the process of exposing the blue photoresist layer to form a blue photoresist.
  • 6c-6e is a schematic cross-sectional view of the display panel after performing step S302 in the embodiment, optionally forming a red photoresist layer 302 on the array substrate 301, as shown in FIG. 6c;
  • the red photoresist layer 302 is exposed by the primary mask 310 to form a red photoresist 303 and a recessed region 306 located in the region of the red photoresist 303.
  • the mask 310 corresponds to the first of the red photoresist 303.
  • the light transmittance of the region 311 is greater than the light transmittance of the second region 312 of the first region 311.
  • the first region 311 is a fully permeable membrane, and the second region 312 is an impermeable membrane.
  • the number of the recessed regions 306 may be one or more, and each of the recessed regions 306 is located in the region of the red photoresist 303, and the number of the recessed regions 306 is not limited.
  • the green photoresist 304 and the blue photoresist 305 are continuously formed on the array substrate 301, and the red photoresist 303, the green photoresist 304, and the blue photoresist 305 are located.
  • a portion of the non-display area 3012 may also be covered on the display area 3011 of the array substrate 301.
  • Step S302 forming a black matrix layer 307 on the color photoresist layer, the black matrix layer 307 covering the color photoresist layer and the recessed region 306;
  • a black matrix layer 307 having a certain thickness is applied on the red photoresist 303, the green photoresist 304, and the blue photoresist 305, and the black matrix layer 307 corresponds to the non-display area 3012 of the array substrate 301 due to
  • the black matrix layer 307 is coated to have the same thickness, so the black matrix layer 307 is still in a recessed state above the recessed region 306.
  • Step S303 exposing the black matrix layer 307 such that a first spacer 308 is formed on the recess region 306, and a second spacer 309 is formed on the non-display region 3012 of the array substrate 301 corresponding to the color photoresist layer.
  • the first spacer 308 and the second spacer 309 are both formed in the process of forming the black matrix layer 307, and the black matrix layer 307 may be exposed by using the photomask 320 once, so that the recess is formed.
  • a first spacer 308 is formed on the region 306, and a second spacer 309 is formed on the blue photoresist 305;
  • the light transmittance of the mask 320 corresponding to the first region 322 of the first spacer 308 and the second spacer 309 is greater than the light transmittance of the second region 321 of the mask 320 except the first region 322.
  • the first The area 322 is a full-transparent film
  • the light transmittance of the second area 321 is greater than that of the anti-permeable film
  • the black matrix layer 307 corresponding to the first area 322 is completely retained, and the remaining black matrix is left on the black matrix layer 307 corresponding to the second area 321 .
  • Layer 307, and the remaining black matrix layer 307 has a lower height than the black matrix layer 307 in the recessed region 306 such that the convex portion forms the first spacer 308, and likewise, a convex residue is formed on the blue photoresist 305.
  • the second spacer 309 of the black matrix layer 307. In this way, the flow of separately forming the first spacer 308 and the second spacer 309 can be reduced, thereby reducing the manufacturing process of the entire display panel and reducing the production cost.
  • the formation of the red photoresist 303, the green photoresist 304, the blue photoresist 305, the black matrix layer 307, the first spacer 308, and the second spacer 309 is completed by the above steps. It can be seen that the first spacer 308 and the second spacer 308 The heights of the spacers 309 are different and the positions are different. As shown in FIG. 6h, it is a top view of FIG. 6g. It can be seen that the black matrix layer 307, the first spacers 308, and the second spacers 309 are corresponding to the array substrate 301. Non-display area 3012.
  • the recessed region 306 is formed at the same time as the color photoresist layer is formed, so that the photomask 320 can be made of two materials having different light transmissivity.
  • the mask needs to be formed when the black matrix layer is exposed by the primary mask while forming the first spacer and the second spacer.
  • the material is made of at least three different light transmissive materials, and is divided into at least three segments, and the first region of the photomask corresponding to the first spacer and the second region of the photomask corresponding to the second spacer are different in light transmittance.
  • the light transmittance of the cover removing the third region of the first region and the second region is also different from the first two, thereby forming first spacers and second spacers of different heights protruding from the remaining black matrix layer on the color photoresist layer. Things.
  • an embodiment of a display panel based on BOA technology of the present invention includes:
  • the array substrate 401 is a schematic plan view of the array substrate 401, the array substrate 401 includes a display area 408 and a non-display area 409;
  • a color photoresist layer 410 is disposed on the array substrate 401;
  • a red photoresist 402, a green photoresist 403, and a blue photoresist 404 may be formed on the color photoresist layer 410. In some cases, the red photoresist 402, the green photoresist 403, and the blue photoresist 404 may be optionally formed. One or two;
  • the first spacer 405 is formed in the process of forming the color photoresist layer 410.
  • the first spacer 405 is formed while the green photoresist 403 is formed, and the green photoresist 403 is separated from the first spacer.
  • the object 405 can be exposed by a single mask, and the mask is made of a material having three different light transmissive properties.
  • the first spacer 405 is located on the non-display area 409 of the array substrate 401 on the red photoresist 402.
  • the material of the first spacer 405 is the same as the material of the green photoresist 403.
  • the second spacer 407 is formed in the process of forming the black matrix layer 406, and the second spacer 407 and the black matrix layer 406 are exposed by using a mask, and the mask has two different light transmissions. Made of sexual materials.
  • the second spacer 407 is located above the blue photoresist 404 corresponding to the non-display area 409 of the array substrate 401, and the material of the second spacer 407 is the same as the material of the black matrix layer 406;
  • the embodiment of the display panel based on the BOA technology provides an array substrate 401, wherein the array substrate 401 includes a display region 408 and a non-display region 409, and a color photoresist layer 410 and a black matrix layer 406 are formed on the array substrate 401. And a first spacer 405 is formed in the process of forming the color photoresist layer 410, and a second spacer 407 is formed in the process of forming the black matrix layer 406. In this manner, in the process of forming the color photoresist layer 410 and the black matrix layer 406, the first spacer 405 and the second spacer 407 are simultaneously formed, respectively, and the first spacer 405 and the second spacer are separately formed. The flow of the spacer 407, thereby reducing the production process of the entire display panel and reducing the production cost.
  • FIG. 1 Other embodiments of the display panel based on the BOA technology of the present invention may be fabricated by any one of the three embodiments of the method for fabricating the display panel based on the BOA technology, and details are not described herein.

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Abstract

一种BOA显示面板的制作方法，包括提供一阵列基板（21），其中阵列基板（21）包括显示区域（201）及非显示区域（202），在阵列基板（21）上形成彩色光阻层（22，24，26）和黑矩阵层（27），并且在形成彩色光阻层（22，24，26）和/或黑矩阵层（27）的过程中，同时形成间隔物。还提供一种BOA显示面板。在形成彩色光阻层（22，24，26）和/或黑矩阵层（27）的过程中，同时形成间隔物，减少单独制作间隔物的流程，从而减少整个显示面板的制作流程，降低生产成本。

Description

一种基于BOA技术的显示面板及制作方法
【技术领域】
本发明涉及显示技术领域，特别是涉及一种基于BOA技术的显示面板及制作方法。
【背景技术】
薄膜晶体管液晶显示器(thin film transistor-liquid crystal display，TFT-LCD) 因具有轻、薄、小等特点，同时功耗低、无辐射、制造成本相对较低，在目前平板显示行业应用较为广泛。液晶面板作为TFT-LCD主要部件，按结构组成可分为薄膜晶体管阵列基板和彩色滤光片基板，传统TFT-LCD面板中，在彩色滤光片与像素电极进行对位时，因对位不佳容易漏光，开口率降低，面板亮度降低等影响，同时在曲面显示屏上应用受到限制。
为了解决由于对位不准确造成的漏光及面板亮度降低等问题，已有彩色滤光片整合于阵列基板（Color Filter on Array，COA）结合黑矩阵整合于阵列基板（Black matrix on Array，BOA）技术，将彩色滤波片部分整合到阵列基板上，即将彩色光阻层及黑矩阵制备在阵列基板，克服了因对位不佳造成的不利因素，但这种COA结合BOA的技术在制作流程上仍然没有减少，导致成本方面并未得到改善。
【发明内容】
本发明主要解决的技术问题是提供一种基于BOA技术的显示面板及制作方法，能够减少制作流程，降低生产成本。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种基于BOA技术的显示面板的制作方法，包括：
提供一阵列基板，其中阵列基板包括显示区域及非显示区域；
在阵列基板上形成彩色光阻层；
利用一次光罩对彩色光阻层进行曝光以形成对应非显示区域的第一间隔物；
在彩色光阻层上形成黑矩阵层；
利用一次光罩对黑矩阵层进行曝光以形成对应非显示区域的第二间隔物和/或第一间隔物，其中第一间隔物与第二间隔物高度不同且位置不同。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种基于BOA技术的显示面板的制作方法，包括：
提供一阵列基板，其中阵列基板包括显示区域及非显示区域；
在阵列基板上形成彩色光阻层和黑矩阵层，并且在形成彩色光阻层和/或黑矩阵层的过程中，同时形成间隔物。
其中，在形成彩色光阻层和/或黑矩阵层的过程中同时形成间隔物包括：
在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成对应非显示区域的第一间隔物；
在彩色光阻层上形成黑矩阵层；
对黑矩阵层进行曝光以形成对应非显示区域的第二间隔物。
其中，第一间隔物和第二间隔物位置不同且高度也不同。
其中，在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成对应非显示区域的第一间隔物包括：
在阵列基板上形成红色光阻、绿色光阻及蓝色光阻；
对红色光阻对应的红色光阻层进行一次曝光以形成红色光阻及凸出红色光阻的第一间隔物；
或者对绿色光阻对应的绿色光阻层进行一次曝光以形成绿色光阻及凸出绿色光阻的第一间隔物；
或者对蓝色光阻对应的蓝色光阻层进行一次曝光以形成蓝色光阻及凸出蓝色光阻的第一间隔物；
其中，第一间隔物形成于红色光阻、绿色光阻或蓝色光阻对应于阵列基板的非显示区域上。
其中，在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成对应非显示区域的第一间隔物包括：
在阵列基板上形成红色光阻；
在红色光阻上涂布绿色光阻层；
使用一次光罩对绿色光阻层进行曝光以形成绿色光阻及第一间隔物，其中第一间隔物位于红色光阻对应阵列基板的非显示区域上，光罩对应绿色光阻的第一区域的透光性大于光罩对应第一间隔物的第二区域的透光性，光罩除去第一区域及第二区域的剩余区域为不透膜；
在阵列基板上形成蓝色光阻。
其中，光罩对应绿色光阻的第一区域为全透膜，光罩对应第一间隔物的第二区域的透光性大于不透膜的透光性。
其中，对黑矩阵层进行曝光以形成对应非显示区域的第二间隔物包括：
利用一次光罩对黑矩阵层进行曝光；
对黑矩阵层进行曝光后，黑矩阵层对应非显示区域上形成第二间隔物，其中，光罩对应第二间隔物的第一区域的透光性大于光罩除去第一区域的第二区域的透光性，第二区域对应的黑矩阵层留下剩余的黑矩阵层。
其中，光罩对应第二间隔物的第一区域为全透膜，光罩除去第一区域的第二区域的透光性大于不透膜的透光性。
其中，在形成彩色光阻层和/或黑矩阵层的过程中同时形成间隔物包括：
在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成凹陷区域及彩色光阻，其中，凹陷区域位于彩色光阻区域内对应于阵列基板的非显示区域上；
在彩色光阻层上形成黑矩阵层，黑矩阵层覆盖彩色光阻层及凹陷区域；
对黑矩阵层进行曝光，使得在凹陷区域上形成第一间隔物，在彩色光阻层对应阵列基板非显示区域上形成第二间隔物。
其中，在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成凹陷区域及彩色光阻包括：
在阵列基板上形成红色光阻层；
利用一次光罩对红色光阻层进行曝光以形成红色光阻及位于红色光阻区域内的凹陷区域，其中，光罩对应红色光阻的第一区域的透光性大于光罩除去第一区域的第二区域的透光性；
在阵列基板上形成绿色光阻及蓝色光阻。
其中，光罩对应红色光阻的第一区域为全透膜，光罩除去第一区域的第二区域为不透膜。
其中，在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成凹陷区域及彩色光阻包括：
在阵列基板上形成绿色光阻层；
利用一次光罩对绿色光阻层进行曝光以形成绿色光阻及位于绿色光阻区域内的凹陷区域，其中，光罩对应绿色光阻的第一区域的透光性大于光罩除去第一区域的第二区域的透光性；
在阵列基板上形成红色光阻及蓝色光阻。
其中，在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成凹陷区域及彩色光阻包括：
在阵列基板上形成蓝色光阻层；
利用一次光罩对蓝色光阻层进行曝光以形成蓝色光阻及位于蓝色光阻区域内的凹陷区域，其中，光罩对应蓝色光阻的第一区域的透光性大于光罩除去第一区域的第二区域的透光性；
在阵列基板上形成红色光阻及绿色光阻。
其中，对黑矩阵层进行曝光，使得在凹陷区域上形成第一间隔物，在彩色光阻层上形成第二间隔物包括：
使用一次光罩对黑矩阵层进行曝光，使得在凹陷区域上形成第一间隔物，在彩色光阻层上形成第二间隔物；
其中，光罩对应第一间隔物及第二间隔物的第一区域的透光性大于光罩除去第一区域的第二区域的透光性。
其中，光罩对应第一间隔物及第二间隔物的第一区域为全透膜，光罩除去第一区域的第二区域的透光性大于不透膜的透光性。
为解决上述技术问题，本发明采用的又一技术方案是：提供一种基于BOA技术的显示面板，包括：
阵列基板，阵列基板包括显示区域和非显示区域；
彩色光阻层，设在阵列基板上；
黑矩阵层，设在彩色光阻层上；
间隔物，间隔物设在阵列基板的非显示区域，且间隔物形成于形成彩色光阻层和/或黑矩阵层的过程中。
其中，间隔物包括第一间隔物和第二间隔物，第一间隔物与第二间隔物的高度不同且位置不同；
第一间隔物形成于形成彩色光阻层的过程中；
第二间隔物形成于形成黑矩阵层的过程中。
其中，彩色光阻层包括红色光阻、绿色光阻及蓝色光阻；
第一间隔物与红色光阻为利用一次光罩对红色光阻对应的红色光阻层曝光形成；或者
第一间隔物与绿色光阻为利用一次光罩对绿色光阻对应的绿色光阻层曝光形成；或者
第一间隔物与蓝色光阻为利用一次光罩对蓝色光阻对应的蓝色光阻层曝光形成。
其中，间隔物包括第一间隔物和第二间隔物，第一间隔物与第二间隔物的高度不同且位置不同；
第一间隔物和第二间隔物形成于形成黑矩阵层的过程中。
本发明的有益效果是：区别于现有技术的情况，本发明通过提供一阵列基板，其中阵列基板包括显示区域及非显示区域，在阵列基板上形成彩色光阻层和黑矩阵层，并且在形成彩色光阻层和/或黑矩阵层的过程中，同时形成间隔物。通过这种方式，本发明在形成彩色光阻层和/或黑矩阵层的过程中，同时形成间隔物，减少单独制作间隔物的流程，从而减少整个显示面板的制作流程，降低生产成本。
【附图说明】
图1是本发明基于BOA技术的显示面板的制作方法第一实施方式的流程图；
图2是图1中步骤S12一应用场景的具体流程图；
图3是本发明基于BOA技术的显示面板的制作方法第二实施方式的流程图；
图4a是图3中步骤S201中阵列基板的俯视示意图；
图4b-图4h是图3各步骤中显示面板的截面示意图；
图4i是图3中步骤S207后的显示面板的俯视示意图；
图5是本发明基于BOA技术的显示面板的制作方法第三实施方式的流程图；
图6a是图5中步骤S301中阵列基板的俯视示意图；
图6b-图6g是图5各步骤中显示面板的截面示意图；
图6h是图5中步骤S303后的显示面板的俯视示意图；
图7是本发明基于BOA技术的显示面板一种实施方式的结构示意图；
图8是本发明基于BOA技术的显示面板一种实施方式中阵列基板的俯视示意图。
【具体实施方式】
为使本领域的技术人员更好地了解本发明的技术方案，下面结合附图和具体实施方式对本发明所提供的一种基于BOA技术的显示面板及制作方法做进一步详细阐述。
请参阅图1，本发明基于BOA技术的显示面板的制作方法第一实施方式包括：
步骤S11：提供一阵列基板，其中阵列基板包括显示区域及非显示区域；
在步骤S11中，制作阵列基板，该阵列基板可包括数据线、扫描线、薄膜晶体管以及像素电极等，该阵列基板包括用于显示图像的显示区域以及显示区域之外的比如用于间隔或区分不同像素的非显示区域。
步骤S12：在阵列基板上形成彩色光阻层和黑矩阵层，并且在形成彩色光阻层和/或黑矩阵层的过程中，同时形成间隔物。
在步骤S12中，将彩色光阻层和黑矩阵层形成于阵列基板上，可使彩色光阻层与像素电极对位准确。间隔物位于阵列基板上，为阵列基板和对面基板，通常为玻璃基板，提供预留空间以填充液晶等物质，同时起到支撑阵列基板和对面基板的作用。
间隔物的形成可以是在形成彩色光阻层的过程中，也可以是在形成黑矩阵层的过程中，或者是在形成彩色光阻层和形成黑矩阵层的过程中分别形成两种相同或不同的间隔物。
在实际应用中，为了起到很好地支撑作用，间隔物通常分为两种，一种为主要间隔物，起到主要支撑作用。另一种为辅助间隔物，其高度通常小于主要间隔物的高度，与主要间隔物所处的位置不同，在显示面板受到挤压时，起到辅助支撑的作用。主要间隔物和辅助间隔物的形成可以是在形成彩色光阻层的过程一次形成；也可以是在形成黑矩阵层的过程中一次形成；或者是主要间隔物形成于制作彩色光阻层的过程中，辅助间隔物形成于制作黑矩阵层的过程中；或者是辅助间隔物形成于制作彩色光阻层的过程中，主要间隔物形成于制作黑矩阵层的过程中。
本实施方式的一应用场景采用的方式为辅助间隔物形成于制作彩色光阻层的过程中，主要间隔物形成于制作黑矩阵层的过程中，如图2所示，具体步骤为：
子步骤S101：在阵列基板上形成彩色光阻层，对彩色光阻层进行曝光以形成对应非显示区域的第一间隔物；
在步骤S101中，第一间隔物是指辅助间隔物。
在阵列基板的显示区域上形成相应的彩色光阻，该彩色光阻可包括红色光阻、绿色光阻及蓝色光阻中的一种或组合，在利用相应的光罩对彩色光阻层进行图形化处理的过程中，同时形成第一间隔物，第一间隔物的形成可通过三种方式：
第一种方式为：对红色光阻对应的红色光阻层进行一次曝光以形成红色光阻及凸出红色光阻的第一间隔物；
具体地，在红色光阻之前可选预先形成绿色光阻和/或蓝色光阻，红色光阻层的一部分覆盖绿色光阻和/或蓝色光阻，另一部分与绿色光阻和/或蓝色光阻同层，对红色光阻层进行一次曝光以形成红色光阻及第一间隔物，第一间隔物形成于绿色光阻和/或蓝色光阻上，在某些情况下，第一间隔物也可选形成于红色光阻上，第一间隔物凸出红色光阻并与红色光阻一体成型。
第二种方式为：对绿色光阻对应的绿色光阻层进行一次曝光以形成绿色光阻及凸出绿色光阻的第一间隔物；
具体地，在绿色光阻之前可选预先形成红色光阻和/或蓝色光阻，绿色光阻层的一部分覆盖红色光阻和/或蓝色光阻，另一部分与红色光阻和/或蓝色光阻同层，对绿色光阻层进行一次曝光以形成绿色光阻及第一间隔物，第一间隔物形成于红色光阻和/或蓝色光阻上，在某些情况下，第一间隔物也可选形成于绿色光阻上，第一间隔物凸出绿色光阻并与绿色光阻一体成型。
第三种方式为：对蓝色光阻对应的蓝色光阻层进行一次曝光以形成蓝色光阻及凸出蓝色光阻的第一间隔物；
具体地，在蓝色光阻之前可选预先形成红色光阻和/或绿色光阻，蓝色光阻层的一部分覆盖红色光阻和/或绿色光阻，另一部分与红色光阻和/或绿色光阻同层，对蓝色光阻层进行一次曝光以形成蓝色光阻及第一间隔物，第一间隔物形成于红色光阻和/或绿色光阻上，在某些情况下，第一间隔物也可选形成于蓝色光阻上，第一间隔物凸出蓝色光阻并与蓝色光阻一体成型。
形成的第一间隔物在红色光阻、蓝色光阻或绿色光阻对应于阵列基板的非显示区域上。
子步骤S102：在彩色光阻层上形成黑矩阵层；
彩色光阻层及第一间隔物形成后，在彩色光阻层对应阵列基板的非显示区域上形成黑矩阵层，一般来说，黑矩阵层的作用是阻挡背光源的出射光线从非显示区域漏出，避免漏光现象。
子步骤S103：对黑矩阵层进行曝光以形成对应非显示区域的第二间隔物。
在步骤S103中，第二间隔物指主要间隔物。对黑矩阵层进行曝光使得彩色光阻层上留下剩余的黑矩阵层，同时在剩余的黑矩阵层上形成凸出剩余的黑矩阵层的第二间隔物。
具体可通过利用一次光罩对黑矩阵层进行曝光，光罩可选半色调掩膜版，光罩对应第二间隔物的第一区域的透光性大于光罩除去第一区域的第二区域的透光性。在对黑矩阵层进行曝光后，对应光罩第二区域的部位留下剩余的黑矩阵层，对应光罩第一区域的部位形成凸出剩余的黑矩阵层的第二间隔物。
需要说明的是，步骤S11和步骤S12的制作顺序并不固定，在某些情况下，可选先实施步骤S12，通过步骤S12形成彩色光阻层，然后通过步骤S11形成阵列基板，后续继续形成黑矩阵层及间隔物，因此，步骤S11及步骤S12，以及步骤S12中的具体涉及步骤的顺序并不以本实施方式的顺序为限，以实际需求为准。
可以理解，本发明基于BOA技术的显示面板的制作方法第一实施方式，通过提供一阵列基板，其中阵列基板包括显示区域及非显示区域，在阵列基板上形成彩色光阻层和黑矩阵层，并且在形成彩色光阻层的过程中形成第一间隔物，在形成黑矩阵层的过程中形成第二间隔物。通过这种方式，本实施方式在形成彩色光阻层和黑矩阵层的过程中，分别同时形成第一间隔物和第二间隔物，减少单独制作第一间隔物和第二间隔物的流程，从而减少整个显示面板的制作流程，降低生产成本。
图3是本发明基于BOA技术的显示面板的制作方法第二实施方式的流程图，图4b-图4h是本发明第二实施方式各步骤中显示面板的截面示意图，如图3和图4所示，该显示面板的制作方法具体包括以下步骤：
步骤S201：提供一阵列基板21，其中阵列基板21包括显示区域201及非显示区域202；
请参阅图4a-图4b，图4a是通过步骤S201制备的阵列基板21的俯视示意图，图4b是阵列基板21的截面示意图，提供一阵列基板21，该阵列基板21可包括数据线、扫描线、薄膜晶体管以及像素电极等（图中均未示出），该阵列基板21包括用于显示图像的显示区域201以及用于间隔或区分不同像素的非显示区域202。
步骤S202：在阵列基板21上形成红色光阻22；
如图4c所示，为在阵列基板21上形成红色光阻22的断面图，可选在阵列基板21上涂布红色光阻层，对红色光阻层进行图形化处理以形成红色光阻22。
步骤S203：在红色光阻22上涂布绿色光阻层23；
如图4d所示，在红色光阻22上涂布绿色光阻层23，绿色光阻层23覆盖红色光阻22并延伸到阵列基板21上。
步骤S204：使用一次光罩30对绿色光阻层23进行曝光以形成绿色光阻24及第一间隔物25，其中第一间隔物25位于红色光阻22对应阵列基板21的非显示区域202上；
如图4e所示，光罩30采用三种不同透光性的材料，光罩30对应绿色光阻24的第一区域32的透光性大于光罩30对应第一间隔物25的第二区域31的透光性，使得曝光显影后，第一区域32对应的绿色光阻层23形成绿色光阻24，第二区域31对应的绿色光阻层23形成凸出红色光阻22的第一间隔物25，且第一间隔物25的曝光程度大于绿色光阻24的曝光程度，这么做通常是为了后续第二间隔物28的考虑，使得第一间隔物25的高度和第二间隔物28的高度不同；光罩30除去第一区域32及第二区域31的剩余区域37为不透膜，绿色光阻层23除去绿色光阻24及第一间隔物25的剩余部分全部显影消除。
在本实施例中，光罩30对应绿色光阻24的第一区域32为全透膜，对应的绿色光阻层23曝光后全部保留形成绿色光阻24，光罩30对应第一间隔物25的第二区域31的透光性大于不透膜，对应的绿色光阻层23曝光后形成凸出红色光阻22的第一间隔物25，绿色光阻层23的剩余部分被全部显影消除。
步骤S205：在阵列基板21上形成蓝色光阻26。
如图4f所示，在阵列基板21上涂布蓝色光阻层，对蓝色光阻层进行图形化处理形成蓝色光阻26。
步骤S206：在红色光阻22、绿色光阻24、蓝色光阻26上涂布黑矩阵层27；
如图4g所示，在红色光阻22、绿色光阻24、蓝色光阻26上形成具有一定厚度的黑矩阵层27，黑矩阵层27对应于阵列基板21的非显示区域202上。
步骤S207：利用一次光罩对黑矩阵层27进行曝光；
如图4h所示，光罩35采用两种透光性不同的材料，光罩35的第一区域34为全透膜，光罩35的第二区域33的透光性大于不透膜的透光性，对黑矩阵层27进行曝光后，第一区域34对应的黑矩阵层27形成第二间隔物28，第二间隔物28位于第二区域33对应的黑矩阵层27留下剩余的黑矩阵层27。
利用上述步骤完成彩色光阻22/24/26、黑矩阵层27、第一间隔物25及第二间隔物28的形成，可以看出，第一间隔物25与第二间隔物28的高度不同且位置不同；如图4i所示，是图4h的俯视示意图，可以看出，黑矩阵层27、第一间隔物25及第二间隔物28均位于彩色光阻22/24/26对应阵列基板21的非显示区域202上。
本发明基于BOA技术的显示面板的制作方法第二实施方式，通过提供一阵列基板21，在阵列基板21上形成红色光阻22，在红色光阻22上涂布绿色光阻层23，对绿色光阻层23一次曝光形成绿色光阻24及第一间隔物25，然后形成蓝色光阻26，在红色光阻22、绿色光阻24、蓝色光阻26上方涂布黑矩阵层27，对黑矩阵层27一次曝光后留下剩余黑矩阵层27及形成第二间隔物28。通过这种方式，本实施方式在形成绿色光阻24和黑矩阵层27的过程中，分别同时形成第一间隔物25和第二间隔物28，减少单独制作第一间隔物25和第二间隔物28的流程，从而减少整个显示面板的制作流程，降低生产成本。
图5是本发明基于BOA技术的显示面板的制作方法第三实施方式的流程图，图6b-图6g是本发明第三实施方式各步骤中显示面板的截面示意图，如图5和图6所示，该显示面板的制作方法具体包括以下步骤：
步骤S301：提供一阵列基板301，该阵列基板301包括显示区域3011和非显示区域3012；
请参阅图6a-图6b，图6a是通过步骤S301制备的阵列基板301的俯视示意图，图6b是阵列基板301的截面示意图，提供一阵列基板301，该阵列基板301可包括数据线、扫描线、薄膜晶体管以及像素电极等（图中均未示出），该阵列基板301包括用于显示图像的显示区域3011以及用于间隔或区分不同像素的非显示区域3012。
步骤S302：在阵列基板301上形成彩色光阻层，对彩色光阻层进行曝光以形成凹陷区域及彩色光阻，其中，凹陷区域位于彩色光阻区域内对应于阵列基板301的非显示区域3012上；
具体地，在阵列基板301上形成彩色光阻层，彩色光阻层包括红色光阻、绿色光阻、蓝色光阻的一种或组合，通常来说，为了达到彩色显示效果，彩色光阻层需包括红色光阻、绿色光阻及蓝色光阻，凹陷区域的形成可以是对红色光阻层进行曝光形成红色光阻的过程中，也可以是在对绿色光阻层进行曝光形成绿色光阻的过程中，或者是在对蓝色光阻层进行曝光形成蓝色光阻的过程中。
请参阅图6c-图6e，是本实施方式中执行步骤S302后显示面板的截面示意图，可选首先在阵列基板301上形成红色光阻层302，如图6c所示；
如图6d所示，利用一次光罩310对红色光阻层302进行曝光形成红色光阻303及位于红色光阻303区域内的凹陷区域306，其中，光罩310对应红色光阻303的第一区域311的透光性大于光罩除去第一区域311的第二区域312的透光性，可选第一区域311为全透膜，第二区域312为不透膜；
需要说明的是，凹陷区域306的个数可以是一个或多个，每一凹陷区域306位于红色光阻303区域内，凹陷区域306的个数不做限定。
形成红色光阻303及凹陷区域306后，如图6e所示，在阵列基板301上继续形成绿色光阻304及蓝色光阻305，红色光阻303、绿色光阻304及蓝色光阻305均位于阵列基板301的显示区域3011上，也可覆盖部分非显示区域3012。
步骤S302：在彩色光阻层上形成黑矩阵层307，黑矩阵层307覆盖彩色光阻层及凹陷区域306；
如图6f所示，在红色光阻303、绿色光阻304、蓝色光阻305上涂布具有一定厚度的黑矩阵层307，黑矩阵层307对应于阵列基板301的非显示区域3012上，由于黑矩阵层307涂布的厚度一致，因此黑矩阵层307在凹陷区域306的上方仍然处于凹陷状态。
步骤S303：对黑矩阵层307进行曝光，使得在凹陷区域306上形成第一间隔物308，在彩色光阻层对应阵列基板301非显示区域3012上形成第二间隔物309。
具体地，如图6g所示，第一间隔物308及第二间隔物309均形成于形成黑矩阵层307的过程中，可选使用一次光罩320对黑矩阵层307进行曝光，使得在凹陷区域306上形成第一间隔物308，在蓝色光阻305上形成第二间隔物309；
光罩320对应第一间隔物308及第二间隔物309的第一区域322的透光性大于光罩320除去第一区域322的第二区域321的透光性，本实施方式中，第一区域322为全透膜，第二区域321的透光性大于不透膜，对应第一区域322的黑矩阵层307全部保留，对应第二区域321的黑矩阵层307上留下剩余的黑矩阵层307，且剩余的黑矩阵层307的高度低于凹陷区域306内黑矩阵层307的高度，从而使得凸出的部分形成第一间隔物308，同样，在蓝色光阻305上形成凸出剩余的黑矩阵层307的第二间隔物309。通过这种方式，可减少单独制作第一间隔物308和第二间隔物309的流程，从而减少整个显示面板的制作流程，降低生产成本。
利用上述步骤完成红色光阻303、绿色光阻304、蓝色光阻305、黑矩阵层307、第一间隔物308及第二间隔物309的形成，可以看出，第一间隔物308与第二间隔物309的高度不同且位置不同；如图6h所示，是图6g的俯视示意图，可以看出，黑矩阵层307、第一间隔物308及第二间隔物309均对应位于阵列基板301的非显示区域3012上。
本实施方式中，在形成彩色光阻层的同时形成凹陷区域306，这样可使得光罩320采用两种不同透光性的材料制成即可。在其他实施方式中，如果在形成彩色光阻层的同时没有预先形成凹陷区域，那么在利用一次光罩对黑矩阵层进行曝光同时形成第一间隔物及第二间隔物时，该光罩需要采用至少三种不同透光性的材料制成，分为至少三段区域，光罩对应第一间隔物的第一区域与光罩对应第二间隔物的第二区域的透光性不同，光罩除去第一区域和第二区域的第三区域的透光性也与前两者不同，从而在彩色光阻层上形成凸出剩余黑矩阵层的不同高度的第一间隔物和第二间隔物。
请参阅图7，本发明基于BOA技术的显示面板的一种实施方式，包括：
阵列基板401，如图8所示，为阵列基板401的俯视示意图，阵列基板401包括显示区域408和非显示区域409；
彩色光阻层410，设在阵列基板401上；
彩色光阻层410上可选形成红色光阻402、绿色光阻403及蓝色光阻404，在某些情况下，也可选形成红色光阻402、绿色光阻403及蓝色光阻404中的一种或两种；
第一间隔物405，第一间隔物405形成于形成彩色光阻层410的过程中，本实施方式是在形成绿色光阻403的同时形成第一间隔物405，绿色光阻403与第一间隔物405可利用一次光罩曝光而成，光罩为具有三种不同透光性的材料制成。第一间隔物405位于红色光阻402上对应阵列基板401的非显示区域409上，第一间隔物405的材料与绿色光阻403的材料相同。
黑矩阵层406，设在彩色光阻层410上；
第二间隔物407，第二间隔物407形成于形成黑矩阵层406的过程中，第二间隔物407与黑矩阵层406可利用一次光罩曝光而成，光罩为具有两种不同透光性的材料制成。第二间隔物407位于蓝色光阻404上方对应于阵列基板401的非显示区域409上，第二间隔物407的材料与黑矩阵层406的材料相同；
可以看出，第一间隔物405与第二间隔物407的高度不同且位置不同。
本发明基于BOA技术的显示面板的实施方式，通过提供一阵列基板401，其中阵列基板401包括显示区域408和非显示区域409，在阵列基板401上形成彩色光阻层410和黑矩阵层406，并且在形成彩色光阻层410的过程中形成第一间隔物405，在形成黑矩阵层406的过程中形成第二间隔物407。通过这种方式，本实施方式在形成彩色光阻层410和黑矩阵层406的过程中，分别同时形成第一间隔物405和第二间隔物407，减少单独制作第一间隔物405和第二间隔物407的流程，从而减少整个显示面板的制作流程，降低生产成本。
本发明基于BOA技术的显示面板的其他实施方式，可以是以上述基于BOA技术的显示面板的制作方法的三种实施例中的任一种方法制作而成，在此不再赘述。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种基于BOA技术的显示面板的制作方法，其中，包括：
    提供一阵列基板，其中所述阵列基板包括显示区域及非显示区域；
    在所述阵列基板上形成彩色光阻层；
    利用一次光罩对所述彩色光阻层进行曝光以形成对应所述非显示区域的第一间隔物；
    在所述彩色光阻层上形成所述黑矩阵层；
    利用一次光罩对所述黑矩阵层进行曝光以形成对应所述非显示区域的第二间隔物和/或所述第一间隔物，其中所述第一间隔物与所述第二间隔物高度不同且位置不同。
  2. 一种基于BOA技术的显示面板的制作方法，其中，包括：
    提供一阵列基板，其中所述阵列基板包括显示区域及非显示区域；
    在所述阵列基板上形成彩色光阻层和黑矩阵层，并且在形成所述彩色光阻层和/或所述黑矩阵层的过程中，同时形成间隔物。
  3. 根据权利要求2所述的方法，其中，所述在形成所述彩色光阻层和/或所述黑矩阵层的过程中同时形成间隔物包括：
    在所述阵列基板上形成所述彩色光阻层，对所述彩色光阻层进行曝光以形成对应所述非显示区域的第一间隔物；
    在所述彩色光阻层上形成所述黑矩阵层；
    对所述黑矩阵层进行曝光以形成对应所述非显示区域的第二间隔物。
  4. 根据权利要求3所述的方法，其中，
    所述第一间隔物和第二间隔物位置不同且高度也不同。
  5. 根据权利要求3所述的方法，其中，所述在所述阵列基板上形成彩色光阻层，对所述彩色光阻层进行曝光以形成对应所述非显示区域的第一间隔物包括：
    在所述阵列基板上形成红色光阻、绿色光阻及蓝色光阻；
    对所述红色光阻对应的红色光阻层进行一次曝光以形成所述红色光阻及凸出所述红色光阻的所述第一间隔物；
    或者对所述绿色光阻对应的绿色光阻层进行一次曝光以形成所述绿色光阻及凸出所述绿色光阻的所述第一间隔物；
    或者对所述蓝色光阻对应的蓝色光阻层进行一次曝光以形成所述蓝色光阻及凸出所述蓝色光阻的所述第一间隔物；
    其中，所述第一间隔物形成于所述红色光阻、所述绿色光阻或所述蓝色光阻对应于所述阵列基板的非显示区域上。
  6. 根据权利要求3所述的方法，其中，所述在所述阵列基板上形成彩色光阻层，对所述彩色光阻层进行曝光以形成对应所述非显示区域的第一间隔物包括：
    在所述阵列基板上形成红色光阻；
    在所述红色光阻上涂布所述绿色光阻层；
    使用一次光罩对所述绿色光阻层进行曝光以形成绿色光阻及所述第一间隔物，其中所述第一间隔物位于所述红色光阻对应所述阵列基板的非显示区域上，所述光罩对应所述绿色光阻的第一区域的透光性大于所述光罩对应所述第一间隔物的第二区域的透光性，所述光罩除去所述第一区域及所述第二区域的剩余区域为不透膜；
    在所述阵列基板上形成蓝色光阻。
  7. 根据权利要求6所述的方法，其中，
    所述光罩对应所述绿色光阻的第一区域为全透膜，所述光罩对应所述第一间隔物的第二区域的透光性大于所述不透膜的透光性。
  8. 根据权利要求3所述的方法，其中，所述对所述黑矩阵层进行曝光以形成对应所述非显示区域的第二间隔物包括：
    利用一次光罩对所述黑矩阵层进行曝光；
    对所述黑矩阵层进行曝光后，所述黑矩阵层对应所述非显示区域上形成所述第二间隔物，其中，所述光罩对应所述第二间隔物的第一区域的透光性大于所述光罩除去所述第一区域的第二区域的透光性，所述第二区域对应的所述黑矩阵层留下剩余的黑矩阵层。
  9. 根据权利要求8所述的方法，其中，
    所述光罩对应所述第二间隔物的第一区域为全透膜，所述光罩除去所述第一区域的第二区域的透光性大于不透膜的透光性。
  10. 根据权利要求2所述的方法，其中，所述在形成所述彩色光阻层和/或所述黑矩阵层的过程中同时形成间隔物包括：
    在所述阵列基板上形成所述彩色光阻层，对所述彩色光阻层进行曝光以形成凹陷区域及彩色光阻，其中，所述凹陷区域位于所述彩色光阻区域内对应于所述阵列基板的非显示区域上；
    在所述彩色光阻层上形成所述黑矩阵层，所述黑矩阵层覆盖所述彩色光阻层及所述凹陷区域；
    对所述黑矩阵层进行曝光，使得在所述凹陷区域上形成第一间隔物，在所述彩色光阻层对应所述阵列基板非显示区域上形成第二间隔物。
  11. 根据权利要求10所述的方法，其中，所述在所述阵列基板上形成所述彩色光阻层，对所述彩色光阻层进行曝光以形成凹陷区域及彩色光阻包括：
    在所述阵列基板上形成红色光阻层；
    利用一次光罩对所述红色光阻层进行曝光以形成红色光阻及位于所述红色光阻区域内的凹陷区域，其中，所述光罩对应所述红色光阻的第一区域的透光性大于所述光罩除去所述第一区域的第二区域的透光性；
    在所述阵列基板上形成绿色光阻及蓝色光阻。
  12. 根据权利要求11所述的方法，其中，
    所述光罩对应所述红色光阻的第一区域为全透膜，所述光罩除去所述第一区域的第二区域为不透膜。
  13. 根据权利要求10所述的方法，其中，所述在所述阵列基板上形成所述彩色光阻层，对所述彩色光阻层进行曝光以形成凹陷区域及彩色光阻包括：
    在所述阵列基板上形成绿色光阻层；
    利用一次光罩对所述绿色光阻层进行曝光以形成绿色光阻及位于所述绿色光阻区域内的凹陷区域，其中，所述光罩对应所述绿色光阻的第一区域的透光性大于所述光罩除去所述第一区域的第二区域的透光性；
    在所述阵列基板上形成红色光阻及蓝色光阻。
  14. 根据权利要求10所述的方法，其中，所述在所述阵列基板上形成所述彩色光阻层，对所述彩色光阻层进行曝光以形成凹陷区域及彩色光阻包括：
    在所述阵列基板上形成蓝色光阻层；
    利用一次光罩对所述蓝色光阻层进行曝光以形成蓝色光阻及位于所述蓝色光阻区域内的凹陷区域，其中，所述光罩对应所述蓝色光阻的第一区域的透光性大于所述光罩除去所述第一区域的第二区域的透光性；
    在所述阵列基板上形成红色光阻及绿色光阻。
  15. 根据权利要求10所述的方法，其中，所述对所述黑矩阵层进行曝光，使得在所述凹陷区域上形成第一间隔物，在所述彩色光阻层上形成第二间隔物包括：
    使用一次光罩对所述黑矩阵层进行曝光，使得在所述凹陷区域上形成第一间隔物，在所述彩色光阻层上形成第二间隔物；
    其中，所述光罩对应所述第一间隔物及所述第二间隔物的第一区域的透光性大于所述光罩除去所述第一区域的第二区域的透光性。
  16. 根据权利要求15所述的方法，其中，
    所述光罩对应所述第一间隔物及所述第二间隔物的第一区域为全透膜，所述光罩除去所述第一区域的第二区域的透光性大于不透膜的透光性。
  17. 一种基于BOA技术的显示面板，其中，包括：
    阵列基板，所述阵列基板包括显示区域和非显示区域；
    彩色光阻层，设在所述阵列基板上；
    黑矩阵层，设在所述彩色光阻层上；
    间隔物，所述间隔物设在所述阵列基板的非显示区域，且所述间隔物形成于形成所述彩色光阻层和/或所述黑矩阵层的过程中。
  18. 根据权利要求17所述的显示面板，其中，
    所述间隔物包括第一间隔物和第二间隔物，所述第一间隔物与所述第二间隔物的高度不同且位置不同；
    所述第一间隔物形成于形成所述彩色光阻层的过程中；
    所述第二间隔物形成于形成所述黑矩阵层的过程中。
  19. 根据权利要求18所述的显示面板，其中，所述彩色光阻层包括红色光阻、绿色光阻及蓝色光阻；
    所述第一间隔物与所述红色光阻为利用一次光罩对所述红色光阻对应的红色光阻层曝光形成；或者
    所述第一间隔物与所述绿色光阻为利用一次光罩对所述绿色光阻对应的绿色光阻层曝光形成；或者
    所述第一间隔物与所述蓝色光阻为利用一次光罩对所述蓝色光阻对应的蓝色光阻层曝光形成。
  20. 根据权利要求17所述的显示面板，其中，
    所述间隔物包括第一间隔物和第二间隔物，所述第一间隔物与所述第二间隔物的高度不同且位置不同；
    所述第一间隔物和所述第二间隔物形成于形成所述黑矩阵层的过程中。
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