WO2017173870A1 - 喷嘴和刻蚀装置 - Google Patents

喷嘴和刻蚀装置 Download PDF

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Publication number
WO2017173870A1
WO2017173870A1 PCT/CN2017/070397 CN2017070397W WO2017173870A1 WO 2017173870 A1 WO2017173870 A1 WO 2017173870A1 CN 2017070397 W CN2017070397 W CN 2017070397W WO 2017173870 A1 WO2017173870 A1 WO 2017173870A1
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WO
WIPO (PCT)
Prior art keywords
nozzle
mouthpiece
main body
liquid
connecting portion
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PCT/CN2017/070397
Other languages
English (en)
French (fr)
Inventor
丁希龙
黄二元
王成胜
吴兆甑
訾玉宝
刘祖宏
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/541,428 priority Critical patent/US10186434B2/en
Publication of WO2017173870A1 publication Critical patent/WO2017173870A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0207Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the work being an elongated body, e.g. wire or pipe
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B05B1/202Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor comprising inserted outlet elements

Definitions

  • the invention belongs to the field of etching technology, and in particular to a nozzle for an etching device and an etching device including the same.
  • wet etching is a technique in which a metal layer of an uncovered region of a photoresist on a substrate surface is etched by an etching solution to form a desired metal line.
  • the wet etching process capability directly affects the yield of the product.
  • the replacement rate of the etching liquid around the substrate is fast and the etching liquid in the middle of the substrate is replaced.
  • the slow rate (referred to as the water accumulation effect) causes a portion of the substrate to be etched faster and the middle portion of the substrate to be etched slowly (ie, the etching ability is not uniform). In this way, it is easy to cause unevenness in the line width distribution of the metal lines, which affects the product yield. As the size of the substrate increases and the thickness of the metal film layer increases, the phenomenon that the etching ability is uneven due to the water accumulation effect becomes more apparent.
  • embodiments of the present invention provide a nozzle for an etching apparatus and an etching apparatus including the same.
  • a nozzle for an etching apparatus comprising: a hollow body, the body is provided with an interface at one end, and a main body liquid outlet is provided at the other end, and the main body outer wall is provided with a main body connection The end of the main body is connected to the pipe through an interface; and the mouthpiece includes a mouthpiece connecting portion and a mouthpiece liquid outlet, and the mouthpiece is connected to the body connecting portion through the mouthpiece connecting portion
  • the main body is provided with an outer side of one end of the main body liquid outlet;
  • the mouthpiece is movable relative to the body in a direction in which the body is discharged move.
  • the outer wall of the main body connecting portion and the inner wall of the mouthpiece connecting portion are provided with matching threads, and the main body and the mouthpiece are screwed through the thread.
  • the mouthpiece connecting portion is provided with a plug, wherein the plug is movable in a direction perpendicular to a direction in which the body is discharged; and an outer wall of the body connecting portion is in a body discharging direction There are a plurality of limiting holes for accommodating the plug.
  • the body is provided with a filtering structure for filtering foreign matter in the etching solution.
  • the filter structure comprises a filter mesh, a filter pore, a macroporous material, or a combination thereof.
  • the mouthpiece liquid outlet is provided with a liquid guiding tube for changing the liquid discharging direction of the etching liquid.
  • the catheter is constructed of an elastic material.
  • a side of the mouthpiece liquid outlet adjacent to the main body is provided with a rotating shaft penetrated by the liquid guiding tube.
  • the size of the rotating shaft is larger than the size of the mouthpiece outlet, and the rotating shaft drives the liquid pipe to rotate to change the etching in the liquid guiding tube.
  • the direction of liquid discharge is larger than the size of the mouthpiece outlet, and the rotating shaft drives the liquid pipe to rotate to change the etching in the liquid guiding tube.
  • Embodiments of the present invention also provide an etching apparatus including the above nozzle and a pipe for supplying liquid.
  • the level of the mouthpiece outlet of the nozzle disposed at a central portion of the pipe is lower than the level of the mouthpiece outlet of the mouth provided at the edge of the pipe.
  • the pipe comprises a straight pipe and a curved pipe, and the straight pipe is disposed outside the curved pipe.
  • the number of nozzles provided at the edge of the pipe is less than the number of nozzles located at the center of the pipe.
  • the size of the mouth outlet of the mouthpiece disposed at the edge of the pipe is smaller than the size of the mouthpiece of the mouthpiece disposed at the middle of the pipe.
  • the curved tube has a certain curvature in a direction toward the object to be etched.
  • the nozzle and the etching device provided by the embodiments of the present invention can reduce or even eliminate the water accumulation effect, so that the etching effect is uniform.
  • the nozzle and the etching device provided by the embodiments of the present invention are suitable for use in various etching processes.
  • FIG. 1 is a schematic structural view of a nozzle according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the structure of a nozzle according to an embodiment of the present invention.
  • FIG 3 is a schematic view showing the structure of a nozzle according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a nozzle according to an embodiment of the present invention.
  • Fig. 5 is a schematic structural view of a nozzle according to an embodiment of the present invention.
  • Figure 6 is a schematic view showing the structure of a nozzle according to an embodiment of the present invention.
  • Figure 7 is a perspective schematic view of a nozzle in accordance with an embodiment of the present invention.
  • FIG. 8 is a schematic structural view of an etching apparatus according to an embodiment of the present invention.
  • FIG. 9 is a partial structural schematic view of an etching apparatus according to an embodiment of the present invention.
  • Embodiments of the present invention provide a nozzle for an etching apparatus
  • FIG. 1 is a schematic structural view of a nozzle according to an embodiment of the present invention.
  • the nozzle of the embodiment includes: a hollow main body 1 , the main body 1 is provided with an interface 11 at one end, and a main body liquid outlet 13 is provided at the other end, and the outer wall of the main body 1 is provided with a main body connecting portion.
  • the one end of the main body 1 is connected to the pipe 4 through the interface 11;
  • the mouthpiece 2 includes a mouthpiece connecting portion and a mouthpiece liquid outlet 21, and the mouthpiece 2 is connected to the main body connecting portion through the mouthpiece connecting portion
  • the main body 1 is provided with an outer side of one end of the main body liquid outlet 13.
  • the mouthpiece 2 is movable relative to the body 1 in a direction in which the body 1 is discharged.
  • a plurality of nozzles are connected to the pipe 4 through which the etching liquid is passed. Since the mouthpiece 2 is movable relative to the main body 1, the mouthpiece liquid outlet 21 corresponding to the position of the substrate can be adjusted to The distance of the substrate to control the etching solution and the substrate The pressure at the time of contact reduces or even eliminates the water accumulation effect, resulting in an even etching effect. For example, the distance from the nozzle outlet 21 corresponding to the middle of the substrate to be etched to the substrate to be etched is smaller than the distance from the nozzle outlet 21 corresponding to the edge of the substrate to be etched to the substrate to be etched. .
  • the nozzle of the embodiment includes a hollow body 1 having an interface 11 at one end and a main body outlet 13 at the other end.
  • the outer wall of the main body 1 is provided with a main body connecting portion, and the main body 1
  • the end of the mouth is connected to the pipe 4 through the interface 11;
  • the mouthpiece 2 includes a mouthpiece connecting portion and a mouthpiece liquid outlet 21, and the mouthpiece 2 is connected to the body connecting portion through the mouthpiece connecting portion
  • the main body 1 is provided with an outer side of one end of the main body liquid outlet 13.
  • the mouthpiece 2 is movable relative to the body 1 in a direction in which the body 1 is discharged.
  • FIG. 2 and 3 are schematic views showing a connection manner of the main body 1 and the mouthpiece 2.
  • the mouthpiece connecting portion is provided with a plug 3, and the plug 3 is movable in a direction perpendicular to the liquid discharging direction of the main body 1.
  • the The outer wall of the main body connecting portion is provided with a plurality of limiting holes for accommodating the plug 3. That is, the relative position of the main body 1 and the mouthpiece 2 can be fixed by the plug 3.
  • the plug 3 can be inserted into the corresponding limiting hole as needed to adjust the distance from the nozzle outlet 21 to the substrate.
  • the mouthpiece outlet port 21 of Fig. 2 is closer to the substrate, so that the pressure at which the etching liquid comes into contact with the substrate is greater.
  • FIG. 4 shows another way of connecting the main body 1 to the mouthpiece 2.
  • the outer wall of the body connecting portion and the inner wall of the mouthpiece connecting portion are provided with matching threads 12, and the body 1 and the mouthpiece 2 are screwed by the thread 12.
  • the threaded sleeve 12 is aligned and the mouthpiece 2 is screwed onto the body 1.
  • the depth of the screwed thread 12 can be adjusted so that the distance from the nozzle outlet 21 to the substrate at a different position from the substrate can be set as desired.
  • the inside of the main body 1 may be provided with a filtering structure 5 for filtering foreign matter in the etching liquid.
  • the filter structure 5 can be a filter well, a filter mesh, a macroporous material, or a combination thereof.
  • the mouthpiece liquid outlet 21 may be provided.
  • a rotatable catheter 22 for changing the direction of discharge of the etching solution that is, not only the pressure at which the etching liquid comes into contact with the substrate can be adjusted, but also the rotation direction of the nozzle outlet opening 21 can be adjusted to a predetermined direction by using the rotatable liquid guiding tube 22.
  • the catheter 22 is made of an elastic material.
  • the side of the mouthpiece liquid outlet 21 adjacent to the body 1 is provided with a rotating shaft 23 that is penetrated by the liquid guiding tube 22.
  • the size of the rotating shaft 23 is larger than the size of the mouthpiece liquid outlet 21, and the rotating shaft 23 drives the liquid guiding tube 22 to rotate to change the liquid guiding tube. 22 out of the direction of the etchant. That is, the etching liquid is guided to a predetermined direction by providing the rotating shaft 23.
  • FIG. 8 is a schematic structural view of an etching apparatus according to an embodiment of the present invention
  • FIG. 9 is a partial structural schematic diagram of an etching apparatus according to an embodiment of the present invention.
  • the etching apparatus of the embodiment includes the above nozzle and a pipe 4 for supplying liquid.
  • the duct 4 may include a straight tube 41 and a curved tube 42, which is disposed outside the curved tube 42.
  • the curved tube has a certain curvature in a direction toward the substrate to be etched.
  • the height of the mouthpiece outlet 21 provided in the middle of the duct 4 may be lower than the level of the mouthpiece outlet 21 provided at the edge of the duct 4. That is, the nozzle outlet 21 provided in the middle of the pipe is closer to the substrate to be etched.
  • the number of nozzles provided at the edge of the pipe is smaller than the number of nozzles provided at the center of the pipe. That is to say, the nozzles at the central position of the pipe are arranged more densely.
  • the liquid discharge amount corresponding to the middle portion and the edge portion on the substrate can be adjusted, thereby further reducing or even eliminating the water accumulation effect.
  • the nozzle outlets with different calibers to control different positions from the substrate.
  • the corresponding outflow of the etching solution For example, the size of the mouthpiece outlet corresponding to the position of the edge of the substrate can be made smaller than the size of the mouthpiece outlet corresponding to the position in the middle of the substrate, thereby further reducing or even eliminating the water accumulation effect.

Abstract

提供了用于刻蚀装置的喷嘴和包括该喷嘴的刻蚀装置。所述喷嘴包括:中空的主体,所述主体一端设有接口,另一端设有主体出液口,所述主体外壁设有主体连接部,所述主体的所述一端通过接口与管道连接;和嘴套,包括嘴套连接部和嘴套出液口,所述嘴套通过所述嘴套连接部与所述主体连接部连接于所述主体设有主体出液口的一端的外侧。在沿所述主体出液的方向上,所述嘴套可相对于所述主体移动。

Description

喷嘴和刻蚀装置 技术领域
本发明属于刻蚀技术领域,具体涉及用于刻蚀装置的喷嘴和包括该喷嘴的刻蚀装置。
背景技术
湿法刻蚀是利用刻蚀液对基板表面光刻胶未覆盖区域的金属层进行刻蚀,从而形成所需要的金属线路的技术。湿法刻蚀工艺能力直接影响产品的良率。
在采用湿法刻蚀工艺对刻蚀设备内的基板进行刻蚀时,由于刻蚀液喷洒在基板后从基板四周流出,造成基板四周的刻蚀液置换速率快而基板中间的刻蚀液置换速率慢(简称积水效应),导致基板四周部分刻蚀的快而基板中间部分刻蚀的慢(即,刻蚀能力不均匀)。这样,容易引起金属线路的线宽大小分布不均匀等不良,从而影响到产品良率。随着基板尺寸的大型化发展和金属膜层厚度增加,由于积水效应导致刻蚀能力不均匀的现象越发明显。
发明内容
至少针对现有技术中刻蚀过程中由于积水效应导致刻蚀能力不均匀的问题,本发明的实施例提供一种用于刻蚀装置的喷嘴和一种包括该喷嘴的刻蚀装置。
根据本发明的实施例,提供了一种用于刻蚀装置的喷嘴,包括:中空的主体,所述主体一端设有接口,另一端设有主体出液口,所述主体外壁设有主体连接部,所述主体的所述一端通过接口与管道连接;和嘴套,包括嘴套连接部和嘴套出液口,所述嘴套通过所述嘴套连接部与所述主体连接部连接于所述主体设有主体出液口的一端的外侧;
在沿所述主体出液的方向上,所述嘴套可相对于所述主体移 动。
可选的是,所述主体连接部的外壁与所述嘴套连接部的内壁设有相互匹配的螺纹,所述主体与所述嘴套通过所述螺纹螺接。
可选的是,所述嘴套连接部设有插栓,在与所述主体出液方向垂直的方向上,所述插栓可移动;在主体出液方向上,所述主体连接部的外壁设有多个可容纳所述插栓的限位孔。
可选的是,所述主体设有过滤结构,用于过滤刻蚀液中的异物。
可选的是,所述过滤结构包括过滤网、过滤孔、大孔材料或其组合。
可选的是,所述嘴套出液口设有导液管,用于改变刻蚀液的出液方向。
可选的是,所述导液管由弹性材料构成。
可选的是,所述嘴套出液口靠近主体的一侧设有被所述导液管穿透的转动轴。
可选的是,在与所述主体出液方向垂直的方向上,所述转动轴的尺寸大于嘴套出液口的尺寸,所述转动轴带动导液管转动以改变导液管中刻蚀液的出液方向。
本发明的实施例还提供一种刻蚀装置,包括上述的喷嘴和用于供液的管道。
可选的是,设于管道中部位置处的所述嘴套出液口的水平高度低于设于管道边缘位置处的嘴套出液口的水平高度。
可选的是,所述管道包括直管和曲管,所述直管设于所述曲管的外侧。
可选的是,设于管道边缘位置处的喷嘴数量少于设于管道中部位置处的喷嘴数量。
可选的是,设于管道边缘位置处的嘴套出液口的尺寸小于设于管道中部位置处的嘴套出液口的尺寸。
可选的是,所述曲管在朝向待刻蚀物体的方向上具有一定的弧度。
与现有技术相比,本发明实施例提供的喷嘴和刻蚀装置可以减弱甚至消除积水效应,使得刻蚀效果均匀。本发明实施例提供的喷嘴和刻蚀装置适用于各种刻蚀工艺中。
附图说明
图1为根据本发明的实施例的喷嘴的结构示意图。
图2为根据本发明的实施例的喷嘴的结构示意图。
图3为根据本发明的实施例的喷嘴的结构示意图。
图4为根据本发明的实施例的喷嘴的结构示意图。
图5为根据本发明的实施例的喷嘴的结构示意图。
图6为根据本发明的实施例的喷嘴的结构示意图。
图7为根据本发明的实施例的喷嘴的立体示意图。
图8为根据本发明的实施例的刻蚀装置的结构示意图。
图9为根据本发明的实施例的刻蚀装置的局部结构示意图。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案,下面结合附图和具体实施方式对本发明作进一步详细描述。
本发明实施例提供一种用于刻蚀装置的喷嘴,图1为根据本发明的实施例的喷嘴的结构示意图。如图1所示,实施例的喷嘴包括:中空的主体1,所述主体1一端设有接口11,另一端设有主体出液口13,所述主体1外壁设有主体连接部,所述主体1的所述一端通过接口11与管道4连接;嘴套2,包括嘴套连接部和嘴套出液口21,所述嘴套2通过所述嘴套连接部与所述主体连接部连接于所述主体1设有主体出液口13的一端的外侧。在沿所述主体1出液的方向上,所述嘴套2可相对于所述主体1移动。
在实际使用时,在通有刻蚀液的管道4上连接多个喷嘴,由于嘴套2可相对于所述主体1移动,因此可以调节与基板不同位置处对应的嘴套出液口21到基板的距离,从而控制刻蚀液与基板 接触时的压力,减弱甚至消除积水效应,使得刻蚀效果均匀。例如,可以调节使得与待刻蚀基板中部对应的嘴套出液口21到待刻蚀基板的距离小于与待刻蚀基板边缘位置处对应的嘴套出液口21到待刻蚀基板的距离。
下面,参照图2至图7,对本发明实施例提供的喷嘴的具体结构进行描述。如上所述,实施例的喷嘴包括:中空的主体1,所述主体1一端设有接口11,另一端设有主体出液口13,所述主体1外壁设有主体连接部,所述主体1的所述一端通过接口11与管道4连接;嘴套2,包括嘴套连接部和嘴套出液口21,所述嘴套2通过所述嘴套连接部与所述主体连接部连接于所述主体1设有主体出液口13的一端的外侧。在沿所述主体1出液的方向上,所述嘴套2可相对于所述主体1移动。
图2和图3是示出主体1与嘴套2的一种连接方式的示意图。如图2所示,所述嘴套连接部设有插栓3,在与所述主体1出液方向垂直的方向上,所述插栓3可移动;在主体1出液方向上,所述主体连接部的外壁设有多个可容纳所述插栓3的限位孔。即,可以通过插栓3来固定主体1与嘴套2的相对位置。在实际使用时,根据需要将插栓3插入相应的限位孔中,即可调整嘴套出液口21到基板的距离。与图3示出的情况相比,图2中嘴套出液口21到基板的距离更近,从而使得刻蚀液与基板接触时的压力更大。
图4、图5和图7示出了主体1与嘴套2的另一种连接方式。如图7所示,所述主体连接部的外壁与所述嘴套连接部的内壁设有相互匹配的螺纹12,所述主体1与所述嘴套2通过所述螺纹12螺接。在实际使用时,对准螺纹12,将嘴套2拧到主体1上。拧上的螺纹12的深度可以调整,这样就可以根据需求设置与基板不同位置处相对应的嘴套出液口21到基板的距离。
在一些实施例中,如图4所示,所述主体1内部可以设置有过滤结构5,用于过滤刻蚀液中的异物。例如,所述过滤结构5可以为过滤孔、过滤网、大孔材料、或其组合。
在一些实施例中,如图5所示,所述嘴套出液口21可以设有 可转动的导液管22,用于改变刻蚀液的出液方向。也就是说,不仅刻蚀液与基板接触时的压力可以调节,而且通过采用可转动的导液管22可以将嘴套出液口21的出液方向旋转调整到预定方向。可选地,所述导液管22由弹性材料制成。
在一些实施例中,如图6所示,所述嘴套出液口21靠近主体1的一侧设有被所述导液管22穿透的转动轴23。具体地,在与所述主体1出液方向垂直的方向上,所述转动轴23的尺寸大于嘴套出液口21的尺寸,所述转动轴23带动导液管22转动以改变导液管22中刻蚀液的出液方向。即,通过设置转动轴23将刻蚀液引导至预定方向。
本发明实施例还提供一种刻蚀装置,图8为根据本发明的实施例的刻蚀装置的结构示意图,图9为根据本发明的实施例的刻蚀装置的局部结构示意图。如图8和图9所示,实施例的刻蚀装置包括上述喷嘴和用于供液的管道4。
可选地,如图8所示,所述管道4可以包括直管41和曲管42,所述直管41设于所述曲管42的外侧。例如,所述曲管在朝向待刻蚀基板的方向上具有一定弧度。
可选地,如图9所示,设于管道4中部的所述嘴套出液口21的水平高度可以低于设于管道4边缘位置处的嘴套出液口21的水平高度。即,设于管道中部的嘴套出液口21距待刻蚀的基板距离更近。
可选地,如图8和图9所示,设于管道边缘位置处的喷嘴数量少于设于管道中部位置处的喷嘴数量。也就是说,管道的中部位置处的喷嘴设置得更加密集。
根据该设计,除了可以调节不同位置处刻蚀液与基板接触时的压力以外,还可以调节与基板上中部和边缘处分别对应的出液量,从而进一步减弱甚至消除积水效应。
显然,上述各实施例的具体实施方式还可进行许多变化。例如:可以设置口径不同的嘴套出液口,从而控制与基板不同位置 处相对应的刻蚀液的流出量。例如,可以使与基板边缘位置处对应的嘴套出液口的尺寸小于与基板中部位置处对应的嘴套出液口尺寸,从而进一步减弱甚至消除积水效应。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。

Claims (14)

  1. 一种用于刻蚀装置的喷嘴,包括:
    中空的主体,所述主体一端设有接口,另一端设有主体出液口,所述主体外壁设有主体连接部,所述主体的所述一端通过接口与管道连接;和
    嘴套,包括嘴套连接部和嘴套出液口,所述嘴套通过所述嘴套连接部与所述主体连接部连接于所述主体设有主体出液口的一端的外侧;
    其中,在沿所述主体出液的方向上,所述嘴套可相对于所述主体移动。
  2. 根据权利要求1所述的喷嘴,其中,所述主体连接部的外壁与所述嘴套连接部的内壁设有相互匹配的螺纹,所述主体与所述嘴套通过所述螺纹螺接。
  3. 根据权利要求1所述的喷嘴,其中,所述嘴套连接部设有插栓,在与所述主体出液方向垂直的方向上,所述插栓可移动;在主体出液方向上,所述主体连接部的外壁设有多个可容纳所述插栓的限位孔。
  4. 根据权利要求1所述的喷嘴,其中,所述主体内部设有过滤结构,用于过滤刻蚀液中的异物。
  5. 根据权利要求4所述的喷嘴,其中,所述过滤结构包括过滤孔、过滤网、大孔材料、或其组合。
  6. 根据权利要求1所述的喷嘴,其中,所述嘴套出液口设有导液管,用于改变刻蚀液的出液方向。
  7. 根据权利要求6所述的喷嘴,其中,所述导液管由弹性材料制成。
  8. 根据权利要求6所述的喷嘴,其中,所述嘴套出液口靠近主体的一侧设有被所述导液管穿透的转动轴。
  9. 一种刻蚀装置,包括喷嘴和用于供液的管道,每根所述管道上均连接有多个喷嘴,所述喷嘴包括权利要求1至8中任一项所述的喷嘴。
  10. 根据权利要求9所述的刻蚀装置,其中,设于管道中部位置处的所述嘴套出液口的水平高度低于设于管道边缘位置处的嘴套出液口的水平高度。
  11. 根据权利要求9所述的刻蚀装置,其中,所述管道包括直管和曲管,所述直管设于所述曲管的外侧。
  12. 根据权利要求9所述的刻蚀装置,其中,设于管道边缘位置处的喷嘴数量少于设于管道中部位置处的喷嘴数量。
  13. 根据权利要求9所述的刻蚀装置,其中,设于管道边缘位置处的嘴套出液口的尺寸小于设于管道中部位置处的嘴套出液口的尺寸。
  14. 根据权利要求11所述的刻蚀装置,其中,所述曲管在朝向待刻蚀物体的方向上具有一定的弧度。
PCT/CN2017/070397 2016-04-05 2017-01-06 喷嘴和刻蚀装置 WO2017173870A1 (zh)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105870040B (zh) 2016-04-05 2018-09-04 京东方科技集团股份有限公司 一种喷嘴和刻蚀装置
CN109998736B (zh) * 2019-04-09 2021-07-23 陕西科技大学 一种具有仿生结构的生物复合材料、挤出装置及制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080251107A1 (en) * 2006-10-13 2008-10-16 Naoyuki Osada Nozzle and a substrate processing apparatus including the same
CN102713001A (zh) * 2009-11-18 2012-10-03 瑞科硅公司 流化床反应器
CN103008299A (zh) * 2012-11-30 2013-04-03 北京七星华创电子股份有限公司 一种气液两相雾化清洗装置及清洗方法
CN104862672A (zh) * 2014-02-11 2015-08-26 朗姆研究公司 衬底处理装置喷头模块的滚珠丝杠喷头模块调节器组件
CN105870040A (zh) * 2016-04-05 2016-08-17 京东方科技集团股份有限公司 一种喷嘴和刻蚀装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3591082A (en) * 1969-05-12 1971-07-06 Howard W Brenner Adjustable spray nozzle
DE2324597A1 (de) * 1973-05-16 1974-12-05 Wagner Gmbh J Spritzduese zum zerstaeuben von fluessigkeiten, insbesondere zur reinigung von textilien mittels eines spritzstrahles
US6117778A (en) * 1998-02-11 2000-09-12 International Business Machines Corporation Semiconductor wafer edge bead removal method and tool
KR100716276B1 (ko) * 2005-11-04 2007-05-10 부덕실업 주식회사 부동급수주
JP2008130643A (ja) * 2006-11-17 2008-06-05 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法
CN102151623A (zh) * 2011-02-22 2011-08-17 中国农业科学院农田灌溉研究所 一种变流量喷头喷嘴
CN203513798U (zh) * 2013-11-11 2014-04-02 临安升达电子厂 蚀刻机喷液系统
JP2016002524A (ja) * 2014-06-18 2016-01-12 凸版印刷株式会社 スプレーノズル、ウェット処理装置およびウェット処理装置の制御方法
US9707571B2 (en) * 2014-12-30 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for supplying chemical solution on semiconductor substrate
CN104888996B (zh) * 2015-06-29 2017-08-11 深圳市华星光电技术有限公司 喷淋组件以及具有该喷淋组件的湿刻设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080251107A1 (en) * 2006-10-13 2008-10-16 Naoyuki Osada Nozzle and a substrate processing apparatus including the same
CN102713001A (zh) * 2009-11-18 2012-10-03 瑞科硅公司 流化床反应器
CN103008299A (zh) * 2012-11-30 2013-04-03 北京七星华创电子股份有限公司 一种气液两相雾化清洗装置及清洗方法
CN104862672A (zh) * 2014-02-11 2015-08-26 朗姆研究公司 衬底处理装置喷头模块的滚珠丝杠喷头模块调节器组件
CN105870040A (zh) * 2016-04-05 2016-08-17 京东方科技集团股份有限公司 一种喷嘴和刻蚀装置

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