WO2017156853A1 - 一种具有防爆功能的铜制程装置及铜制程防爆方法 - Google Patents

一种具有防爆功能的铜制程装置及铜制程防爆方法 Download PDF

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Publication number
WO2017156853A1
WO2017156853A1 PCT/CN2016/081786 CN2016081786W WO2017156853A1 WO 2017156853 A1 WO2017156853 A1 WO 2017156853A1 CN 2016081786 W CN2016081786 W CN 2016081786W WO 2017156853 A1 WO2017156853 A1 WO 2017156853A1
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Prior art keywords
container
liquid medicine
control unit
liquid
explosion
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Ceased
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PCT/CN2016/081786
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English (en)
French (fr)
Inventor
李嘉
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US15/128,967 priority Critical patent/US20180142359A1/en
Publication of WO2017156853A1 publication Critical patent/WO2017156853A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device

Definitions

  • the invention relates to the technical field of liquid crystal display production, in particular to a copper process device with explosion-proof function and a copper process explosion-proof method.
  • TFT-LCD thin film transistor-liquid crystal display
  • LCD thin film transistor-liquid crystal display
  • the Cu process has been widely used on large-sized panels due to its low resistance, high frequency, and the like.
  • Cu metal etching usually uses hydrogen peroxide.
  • the form of hydrogen peroxide is very unstable. As the content of Cu ion increases, the decomposition of hydrogen peroxide accelerates, resulting in a large amount of heat and gas in a short period of time, which is prone to container explosion and safe production. Bring hidden dangers.
  • the present invention provides a safe and reliable copper process device with explosion-proof function and an explosion-proof method.
  • a copper process device with explosion-proof function comprising a reaction chamber, a container disposed under the reaction chamber for holding a chemical solution for etching, a liquid inlet pipe, a return pipe, a temperature control unit, an automatic control unit, and a pump on the liquid inlet tube, wherein the reaction chamber is provided with a spray assembly for spraying a liquid medicine toward the substrate therein, and the liquid inlet tube is connected between the spray assembly and the container.
  • the unit includes a temperature sensor, the temperature sensor is disposed in the container for detecting the temperature of the liquid medicine in the container in real time; the automatic control unit is electrically connected to the temperature control unit, and the temperature of the liquid medicine in the container When the temperature is higher than the preset temperature range, the automatic control unit controls the pump to stop working.
  • the copper process device with explosion-proof function further includes an over-temperature alarm module connected to the automatic control unit, and the over-temperature alarm module is issued when the temperature of the liquid medicine in the container is higher than the preset temperature range Alert message.
  • the temperature control unit further includes a heater, and when the temperature of the liquid medicine in the container is lower than the preset temperature range, the heater heats the liquid medicine in the container until the liquid medicine reaches the Preset temperature range.
  • the copper process device with explosion-proof function further includes a drain pipe connecting the container, and the self-control unit controls the drain pipe to open when the temperature of the liquid medicine in the container is higher than the preset temperature range Drain.
  • the copper process device with explosion-proof function further includes a circulation pipe and a circulation pump disposed on the circulation pipe, and two ends of the circulation pipe are respectively connected to two different height portions of the container,
  • the circulation pump delivers the liquid medicine from the lower nozzle of the circulation pipe to the other nozzle.
  • the copper process device with an explosion-proof function further includes a dilution water pipe connected to the container, and the automatic control unit controls the dilution water pipe to open when the temperature of the liquid medicine in the container is higher than the preset temperature range Dilute the liquid in the water.
  • Another object of the present invention is to provide a copper process explosion-proof method, wherein a temperature control unit detects a temperature of a liquid medicine in the container, and when the temperature of the liquid medicine in the container is higher than a preset temperature range, the self-control The unit controls the pump to stop working while the liquid chemical in the reaction chamber is returned from the return tube to the container in the lower portion of the reaction chamber by gravity.
  • the copper process explosion-proof method further includes: when the temperature of the liquid medicine in the container is lower than the preset temperature range, the automatic control unit controls the temperature control unit to heat the liquid medicine in the container Until the liquid medicine reaches the preset temperature range.
  • the copper process explosion-proof method further includes: when the temperature of the liquid medicine in the container is higher than the preset temperature range, the automatic control unit controls the dilution water pipe to inject water into the container until the liquid medicine reaches the Preset temperature range.
  • the copper process explosion-proof method further includes: when the temperature of the liquid medicine in the container is higher than the preset temperature range, the automatic control unit controls the drain pipe to open the liquid discharge until the liquid medicine is lower than the predetermined liquid The amount of water entering the dilution water pipe per unit time is less than the discharge amount of the drain pipe.
  • the invention utilizes the temperature control unit to monitor the temperature of the container for holding the chemical liquid in real time, and when the temperature of the chemical liquid is abnormal, the coordination of the corresponding structure of the automatic control unit control device is used to ensure that the liquid medicine in the container is in a normal state. temperature.
  • the temperature control unit is controlled to be heated.
  • the over-temperature alarm module can be controlled to issue an alarm, and the supply of the chemical solution in the reaction chamber can be cut off to prevent damage to the substrate.
  • the dilution water pipe can be operated to reduce the temperature of the liquid medicine in the container, and the diluted chemical liquid is discharged through the drain pipe.
  • the copper process device and the copper process explosion-proof method can ensure the smooth progress of the copper process, can avoid the explosion of the container caused by the instability of the chemical liquid reaction process, and ensure the personal safety of the operator.
  • FIG. 1 is a schematic structural view of a copper processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic block diagram of a copper process explosion-proof structure according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a copper process explosion-proof method according to an embodiment of the present invention.
  • a copper process apparatus with an explosion-proof function includes a reaction chamber 10 for placing a substrate S for a reaction process and a container 20 located below the reaction chamber 10 in the reaction chamber 10 .
  • a spray assembly 11 is provided for spraying the liquid chemical toward the substrate S therein, the liquid inlet tube 30 is connected between the spray assembly 11 and the container 20, and the return flow tube 40 is connected between the bottom of the chamber 10 and the container 20.
  • the container 20 is for holding the chemical solution for etching, and the pump M is connected to the liquid inlet pipe 30. When the pump M is in the working state, the liquid medicine in the container 20 is drawn into the reaction chamber 10 by the liquid inlet pipe 30.
  • the shower unit 11 is sprayed toward the substrate S, and the chemical solution after the etching reaction flows into the container 20 from the return pipe 40 at the bottom of the reaction chamber 10 for secondary use, and is circulated.
  • the structure of the explosion-proof portion of the copper process device includes a temperature control unit 50 and an automatic control unit C that are electrically connected.
  • the temperature control unit 50 has a temperature sensor 51 disposed in the container 20 for detecting the temperature of the liquid medicine in the container 20 in real time; when the temperature of the liquid medicine in the container 20 is higher than the preset temperature range T 0 , the temperature control unit 50 Unit C controls the pump M to stop working.
  • the liquid inlet pipe 30 stops the delivery of the chemical liquid, and the liquid medicine in the liquid inlet pipe 30 is completely returned to the container 20 under the action of gravity, which can prevent the chemical liquid from continuing to react with the copper substrate S to aggravate the decomposition of the chemical solution.
  • the preset temperature range T 0 can be set below the explosion limit temperature, and a certain buffer time is reserved.
  • an early warning is generated to cut off the supply of the liquid medicine, in advance. Prevent accidents.
  • the copper processing device further has a circulation pipe 1 and a circulation pump M 0 disposed on the circulation pipe 1, and two ends of the circulation pipe 1 are respectively connected to two different heights of the container 20, and the circulation pump M 0 is self-circulating pipe 1
  • the lower nozzle delivers the liquid to the other nozzle.
  • one end of the circulation pipe 1 is disposed on one side wall of the container 20, and the other end is disposed on the top wall of the container 20.
  • the liquid medicine is extracted from the bottom up and then flows back from the top to the bottom to achieve thorough mixing. Achieve thermal uniformity of the hot and cold liquid.
  • the copper processing device of the embodiment can also be connected with an over-temperature alarm module on the self-control unit C.
  • the automatic control unit C feeds back the information to the over-temperature.
  • the alarm module causes it to send an alert message that can be brought to the attention of the operator to take action.
  • the temperature control unit 50 may further be provided with a heater in consideration of the optimum reaction temperature of the chemical solution.
  • the heater may heat the liquid in the container 20 . Until the liquid reaches the preset temperature range T 0 (the heater automatically stops heating after the liquid reaches the preset temperature range T 0 ).
  • the container 20 of the copper processing device of the embodiment is further connected with a drain pipe 60 at one end thereof, and the drain pipe 60 is provided with a drain valve K1.
  • the drain pipe 60 is preferably disposed at the bottom of vessel 20 to facilitate discharge of liquid level within vessel 20 to any desired level.
  • the copper processing device further includes a dilution water pipe 70 connecting the container 20, and the dilution water pipe 70 is provided with a water inlet valve K2.
  • the automatic control unit C controls the dilution water pipe 70 to open the water-diluting liquid medicine, and the water inlet valve K2 is automatically shut off until the liquid medicine in the container 20 reaches the preset temperature range T 0 .
  • the dilution solution injected from the self-dilution water pipe 70 is diluted and cooled by DIW (De-Ion water) to minimize the influence of impurities on the chemical solution.
  • DIW De-Ion water
  • the water intake amount of the dilution water pipe 70 per unit time is smaller than the liquid discharge amount of the drain pipe 60, and the liquid medicine in the container 20 can be ensured not to overflow during the dilution and cooling process.
  • the embodiment also provides a copper process explosion-proof method.
  • the pump M operates, and the liquid medicine is extracted from the liquid inlet pipe 30 into the shower assembly 11 in the reaction chamber 10 toward the substrate. S is sprayed, and the chemical solution after the etching reaction flows into the container 20 from the return pipe 40 at the bottom of the reaction chamber 10 for secondary use.
  • the circulation pump M 0 delivers the liquid medicine from the lower nozzle of the circulation pipe 1 toward the other nozzle.
  • the temperature control unit 50 detects in real time whether the temperature of the liquid medicine in the container 20 is abnormal (that is, whether it is within the preset temperature range T 0 ), and when the temperature of the liquid medicine in the container 20 is higher than the preset temperature range T 0 , the automatic control unit C controls The pump M stops working, and the liquid medicine in the reaction chamber 10 is returned from the return pipe 40 to the container 20 at the lower portion of the reaction chamber 10 by gravity, and the liquid medicine in the inlet pipe 30 is stopped.
  • the copper process explosion-proof method further includes: when the temperature of the liquid in the container 20 is too low (below the preset temperature range T 0 ), the automatic control unit C controls the temperature control unit 50 to heat the liquid in the container 20 until the liquid medicine The preset temperature range T 0 is reached.
  • the copper process explosion-proof method further includes: the automatic control unit C controls the dilution water pipe 70 to inject water into the container 20 until the liquid reaches the preset temperature range T 0 .
  • the copper process explosion-proof method further includes: the automatic control unit C controls the drain pipe 60 to open the liquid discharge until the liquid medicine is lower than the predetermined liquid level, and preferably The water intake amount of the dilution water pipe 70 per unit time is smaller than the liquid discharge amount of the drain pipe 60.
  • the invention utilizes the temperature control unit to monitor the temperature of the container for holding the chemical liquid in real time, and when the temperature of the chemical liquid is abnormal, the coordination of the corresponding structure of the automatic control unit control device ensures that the liquid medicine in the container is at a normal temperature.
  • the temperature control unit is controlled to be heated.
  • the over-temperature alarm module can be controlled to issue an alarm, and the supply of the chemical solution in the reaction chamber can be cut off to prevent damage to the substrate.
  • the dilution water pipe can be operated to reduce the temperature of the liquid medicine in the container, and the diluted chemical liquid is discharged through the drain pipe.
  • the copper process device and the copper process explosion-proof method can ensure the smooth progress of the copper process, can avoid the explosion of the container caused by the instability of the chemical liquid reaction process, and ensure the personal safety of the operator.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)

Abstract

一种具有防爆功能的铜制程装置和铜制程防爆方法，铜制程装置包括反应腔室（10）、设于反应腔室（10）下方用于盛放刻蚀用的药液的容器（20）、进液管（30）、回流管（40）、温控单元（50）、自控单元（C）和进液管（30）上的泵（M），反应腔室（10）内设有用于朝其内的基板（S）喷洒药液的喷淋组件（11），进液管（30）和回流管（40）分别同时连接在喷淋组件（11）和容器（20）之间，进液管（30）用于在泵（M）的工作下自容器（20）朝喷淋组件（11）运输药液；温控单元（50）包括温度传感器（51），温度传感器（51）设于容器（20）内，用于实时检测容器（20）内的药液温度；自控单元（C）与温控单元（50）电连接，容器（20）内的药液温度高于预设温度范围（T 0）时，自控单元（C）控制泵（M）停止工作。该防爆装置和防爆方法可以避免药液温度异常时出现药液容器（20）爆炸的现象，保障了作业人员的人身安全。

Description

一种具有防爆功能的铜制程装置及铜制程防爆方法 技术领域
本发明涉及液晶显示器生产技术领域，尤其涉及一种具有防爆功能的铜制程装置及铜制程防爆方法。
背景技术
随着TFT-LCD(thin film transistor-liquid crystal display，即薄膜晶体管液晶显示器)逐渐往超大尺寸、高驱动频率、高分辨率等方面发展，如何有效地降低面板导线电阻与寄生电容日趋重要。薄膜晶体管液晶显示器在制作时，高质量的导线制程技术已经成为主宰薄膜晶体管组件与面板特性的关键。
在TFT中，Cu制程由于低电阻、高频等优点现已取代Al而被广泛应用在大尺寸面板上。但是Cu金属刻蚀通常使用的是双氧水，双氧水形态非常不稳定，随着药液Cu离子含量增加会加速双氧水的分解，从而短时间内产生大量的热和气体，容易出现容器爆炸，给安全生产带来隐患。
发明内容
鉴于现有技术存在的不足，本发明提供了一种安全可靠的具有防爆功能的铜制程装置及防爆方法。
为了实现上述的目的，本发明采用了如下的技术方案：
一种具有防爆功能的铜制程装置，包括反应腔室、设于所述反应腔室下方用于盛放刻蚀用的药液的容器、进液管、回流管、温控单元、自控单元和所述进液管上的泵，所述反应腔室内设有用于朝其内的基板喷洒药液的喷淋组件，所述进液管连接在所述喷淋组件和所述容器之间，所述回流管连接在所述应腔室的底部和所述容器之间，所述进液管用于在所述泵的工作下自所述容器朝所述喷淋组件运输药液；所述温控单元包括温度传感器，所述温度传感器设于所述容器内，用于实时检测所述容器内的药液温度；所述自控单元与所述温控单元电连接，所述容器内的药液温度高于预设温度范围时，所述自控单元控制所述泵停止工作。
进一步地，所述具有防爆功能的铜制程装置还包括连接所述自控单元的超温警报模块，所述容器内的药液温度高于所述预设温度范围时，所述超温警报模块发出警报信息。
进一步地，所述温控单元还包括加热器，所述容器内的药液温度低于所述预设温度范围时，所述加热器对所述容器内的药液加热直至药液达到所述预设温度范围。
进一步地，所述具有防爆功能的铜制程装置还包括连接所述容器的排水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述排水管开启排液。
进一步地，所述具有防爆功能的铜制程装置还包括循环管道和设于所述循环管道上的循环泵，所述循环管道的两端分别连接在所述容器的两个不同高度的部位，所述循环泵自所述循环管道较低的管口朝另一管口输送药液。
进一步地，所述具有防爆功能的铜制程装置还包括连接所述容器的稀释水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述稀释水管开启进水稀释药液。
本发明的另一目的在于提供一种铜制程防爆方法，其中，温控单元检测所述容器内的药液温度，在所述容器内的药液温度高于预设温度范围时，所述自控单元控制所述泵停止工作，同时反应腔室内的药液在重力作用下自所述回流管回流至所述反应腔室下部的所述容器。
进一步地，所述铜制程防爆方法还包括：在所述容器内的药液温度低于所述预设温度范围时，所述自控单元控制所述温控单元对所述容器内的药液加热直至药液达到所述预设温度范围。
进一步地，所述铜制程防爆方法还包括：在所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制稀释水管朝所述容器内注水直至药液达到所述预设温度范围。
进一步地，所述铜制程防爆方法还包括：在所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述排水管开启排液直至药液低于预定液位，单位时间内所述稀释水管的进水量小于排水管的排液量。
本发明利用温控单元实时监控盛放药液的容器的温度，并在药液的温度不正常时，利用自控单元控制装置的相应结构的协调，保证容器内药液处于正常 温度。当药液温度过低时控制温控单元加热，当药液温度过高时可控制超温警报模块发出警报，并可切断反应腔室的药液供给，防止基板损伤。另外还可通过控制稀释水管工作以降低容器内药液的温度，通过排水管排出稀释后的药液。该铜制程装置和铜制程防爆方法可以保证铜制程顺利进行，可以避免药液反应过程中不稳定引起的容器爆炸，保障了作业人员的人身安全。
附图说明
图1为本发明实施例的铜制程装置的结构示意图。
图2为本发明实施例的铜制程防爆结构的原理框图。
图3为本发明实施例的铜制程防爆方法的原理图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1，本发明实施例的一种具有防爆功能的铜制程装置，包括用于放置基板S进行反应制程的反应腔室10和位于反应腔室10下方的容器20，在反应腔室10内设有用于朝其内的基板S喷洒药液的喷淋组件11，进液管30连接在喷淋组件11和容器20之间，回流管40连接在应腔室10的底部和容器20之间。容器20用于盛放刻蚀用的药液，进液管30上连接有泵M，在泵M工作状态下，容器20内的药液由进液管30抽取进入反应腔室10内的喷淋组件11中朝基板S喷洒，刻蚀反应后的药液自反应腔室10底部的回流管40流入容器20内进行二次利用，如此循环。
但刻蚀反应后的药液分解易产生大量的气体和热量，为防止经回流管40流回容器20内的液体温度过高而引起容器20爆炸，结合图2所示，本发明实施例的铜制程装置的防爆部分的结构包括电连接的温控单元50和自控单元C。温控单元50具有温度传感器51，该温度传感器51设置在容器20内，用于实时检测容器20内的药液温度；在容器20内的药液温度高于预设温度范围T0时，自控单元C即控制泵M停止工作。当泵M停止工作后，进液管30即停止输送药液，进液管30内的药液在重力作用下全部回流至容器20，可以防止药液与铜基板S继续反应加剧药液分解，从而可以避免事故发生。例如，预设温度范围T0可以设置在爆炸极限温度以下，预留一定的缓冲时间，当容器20内的药液温度尚未 达到该爆炸极限温度时即产生预警而切断制程的药液供给，提前预防事故发生。
具体地，铜制程装置还具有循环管道1和设于循环管道1上的循环泵M0，循环管道1的两端分别连接在容器20的两个不同高度的部位，循环泵M0自循环管道1较低的管口朝另一管口输送药液。较佳地，循环管道1的一端设于容器20的一个侧壁，其另一端设于容器20的顶壁，药液自下而上被抽出，再自上而下流回，可以实现充分混合并实现冷热药液的热均匀性。
同时，本实施例的铜制程装置还可以在自控单元C上连接有超温警报模块，当容器20内的药液温度高于预设温度范围T0时，自控单元C即将信息反馈给超温警报模块使其发出警报信息，可以引起操作者关注以采取相关措施。
考虑到药液的最佳反应温度，温控单元50还可以设有加热器，当容器20内的药液温度低于预设温度范围T0时，加热器可以对容器20内的药液加热直至药液达到预设温度范围T0(药液达到预设温度范围T0后加热器即自动停止加热)。
进一步地，本实施例的铜制程装置的容器20一端还连接有排水管60，排水管60上设置有排液阀K1，当容器20内的药液温度高于预设温度范围T0时，泵M停止工作，药液在重力作用下全部回流至容器20，自控单元C控制排水管60开启排液，以排除高温药液。排水管60最好是设置在容器20的底部，以方便容器20内液位可以排放至任意所需的液位。
作为本实施例的一种实施方式，该铜制程装置还包括连接容器20的稀释水管70，稀释水管70上设置有进水阀K2，当容器20内的药液温度高于预设温度范围T0时，自控单元C控制稀释水管70开启进水稀释药液，直至容器20内药液达到预设温度范围T0即自动关断进水阀K2。其中，自稀释水管70注入的稀释液采用DIW(De-Ion water，去离子水)稀释和降温，可以最大限度地避免杂质影响药液。其中，单位时间的稀释水管70进水量小于排水管60的排液量，可以保证容器20内药液在稀释和降温过程中不溢出。
本实施例还提供了一种铜制程防爆方法，如图3所示，正常状态下，泵M工作，药液由进液管30被抽取进入反应腔室10内的喷淋组件11中朝基板S喷洒，刻蚀反应后的药液自反应腔室10底部的回流管40流入容器20内进行二次利用。同时，循环泵M0自循环管道1较低的管口朝另一管口输送药液。温控单元50实时检测容器20内的药液温度是否异常(即是否在预设温度范围T0内)，在容器20内的药液温度高于预设温度范围T0时，自控单元C控制泵M停止工作，同时反应腔室10内的药液在重力作用下自回流管40回流至反应腔室10下部的 容器20，进液管30内的药液停止输送。
该铜制程防爆方法还包括：当容器20内的药液温度过低(低于预设温度范围T0)时，自控单元C控制温控单元50对容器20内的药液加热，直至药液达到预设温度范围T0。
当容器20内的药液温度高于预设温度范围T0时，该铜制程防爆方法还进一步包括：自控单元C控制稀释水管70朝容器20内注水，直至药液达到预设温度范围T0。
当容器20内的药液温度高于预设温度范围T0时，该铜制程防爆方法还进一步包括：自控单元C控制排水管60开启排液直至药液低于预定液位，且最好是单位时间内稀释水管70的进水量小于排水管60的排液量。
本发明利用温控单元实时监控盛放药液的容器的温度，并在药液的温度不正常时，利用自控单元控制装置的相应结构的协调，保证容器内药液处于正常温度。当药液温度过低时控制温控单元加热，当药液温度过高时可控制超温警报模块发出警报，并可切断反应腔室的药液供给，防止基板损伤。另外还可通过控制稀释水管工作以降低容器内药液的温度，通过排水管排出稀释后的药液。该铜制程装置和铜制程防爆方法可以保证铜制程顺利进行，可以避免药液反应过程中不稳定引起的容器爆炸，保障了作业人员的人身安全。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (16)

  1. 一种具有防爆功能的铜制程装置，其中，包括反应腔室、设于所述反应腔室下方用于盛放刻蚀用的药液的容器、进液管、回流管、温控单元、自控单元和所述进液管上的泵，所述反应腔室内设有用于朝其内的基板喷洒药液的喷淋组件，所述进液管连接在所述喷淋组件和所述容器之间，所述回流管连接在所述应腔室的底部和所述容器之间，所述进液管用于在所述泵的工作下自所述容器朝所述喷淋组件运输药液；所述温控单元包括温度传感器，所述温度传感器设于所述容器内，用于实时检测所述容器内的药液温度；所述自控单元与所述温控单元电连接，所述容器内的药液温度高于预设温度范围时，所述自控单元控制所述泵停止工作。
  2. 根据权利要求1所述的具有防爆功能的铜制程装置，其中，还包括连接所述自控单元的超温警报模块，所述容器内的药液温度高于所述预设温度范围时，所述超温警报模块发出警报信息。
  3. 根据权利要求1所述的具有防爆功能的铜制程装置，其中，所述温控单元还包括加热器，所述容器内的药液温度低于所述预设温度范围时，所述加热器对所述容器内的药液加热直至药液达到所述预设温度范围。
  4. 根据权利要求1所述的具有防爆功能的铜制程装置，其中，还包括连接所述容器的排水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述排水管开启排液。
  5. 根据权利要求1所述的具有防爆功能的铜制程装置，其中，还包括循环管道和设于所述循环管道上的循环泵，所述循环管道的两端分别连接在所述容器的两个不同高度的部位，所述循环泵自所述循环管道较低的管口朝另一管口输送药液。
  6. 根据权利要求1所述的具有防爆功能的铜制程装置，其中，还包括连接所述容器的稀释水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述稀释水管开启进水稀释药液。
  7. 根据权利要求2所述的具有防爆功能的铜制程装置，其中，还包括连接所述容器的稀释水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述稀释水管开启进水稀释药液。
  8. 根据权利要求3所述的具有防爆功能的铜制程装置，其中，还包括连接所述容器的稀释水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述稀释水管开启进水稀释药液。
  9. 根据权利要求4所述的具有防爆功能的铜制程装置，其中，还包括连接所述容器的稀释水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述稀释水管开启进水稀释药液。
  10. 根据权利要求5所述的具有防爆功能的铜制程装置，其中，还包括连接所述容器的稀释水管，所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述稀释水管开启进水稀释药液。
  11. 一种铜制程防爆方法，其中，温控单元检测所述容器内的药液温度，在所述容器内的药液温度高于预设温度范围时，所述自控单元控制所述泵停止工作，同时反应腔室内的药液在重力作用下自所述回流管回流至所述反应腔室下部的所述容器。
  12. 根据权利要求11所述的铜制程防爆方法，其中，还包括：在所述容器内的药液温度低于所述预设温度范围时，所述自控单元控制所述温控单元对所述容器内的药液加热直至药液达到所述预设温度范围。
  13. 根据权利要求11所述的铜制程防爆方法，其中，还包括：在所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制稀释水管朝所述容器内注水直至药液达到所述预设温度范围。
  14. 根据权利要求13所述的铜制程防爆方法，其中，还包括：在所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述排水管开启排液直至药液低于预定液位，单位时间内所述稀释水管的进水量小于排水管的排液量。
  15. 根据权利要求12所述的铜制程防爆方法，其中，还包括：在所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制稀释水管朝所述容器内注水直至药液达到所述预设温度范围。
  16. 根据权利要求15所述的铜制程防爆方法，其中，还包括：在所述容器内的药液温度高于所述预设温度范围时，所述自控单元控制所述排水管开启排液直至药液低于预定液位，单位时间内所述稀释水管的进水量小于排水管的排液量。
PCT/CN2016/081786 2016-03-18 2016-05-12 一种具有防爆功能的铜制程装置及铜制程防爆方法 Ceased WO2017156853A1 (zh)

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