WO2017156677A1 - 金属基板的制作方法 - Google Patents

金属基板的制作方法 Download PDF

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Publication number
WO2017156677A1
WO2017156677A1 PCT/CN2016/076270 CN2016076270W WO2017156677A1 WO 2017156677 A1 WO2017156677 A1 WO 2017156677A1 CN 2016076270 W CN2016076270 W CN 2016076270W WO 2017156677 A1 WO2017156677 A1 WO 2017156677A1
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WO
WIPO (PCT)
Prior art keywords
metal substrate
screen
resin glue
slot
groove
Prior art date
Application number
PCT/CN2016/076270
Other languages
English (en)
French (fr)
Inventor
宋道远
彭卫红
王淑怡
张盼盼
刘存生
Original Assignee
深圳崇达多层线路板有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳崇达多层线路板有限公司 filed Critical 深圳崇达多层线路板有限公司
Priority to PCT/CN2016/076270 priority Critical patent/WO2017156677A1/zh
Priority to CN201680000088.4A priority patent/CN107466489B/zh
Publication of WO2017156677A1 publication Critical patent/WO2017156677A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate

Definitions

  • the present invention relates to the technical field of circuit board manufacturing methods, and in particular, to a method of fabricating a metal substrate.
  • a metal substrate composed of a conductive layer, an insulating layer and a metal base layer has excellent heat conduction properties and mechanical properties. In circuit design, the metal substrate can effectively handle thermal diffusion, reducing module operating temperature, extending service life, and increasing power density and reliability.
  • An insulating groove is designed as an isolation region on the metal layer, and the isolation region and the circuit layer are connected into a network.
  • a metal base layer can be fabricated into a high current electrode output terminal or a card slot pin.
  • the substrate design combines good heat dissipation and conduction.
  • the groove length is generally several times the groove width, and the groove type is mostly irregular. Therefore, there are certain technical difficulties in the actual production method, and the produced metal substrate is prone to the following Several defects: First, due to the large area of the metal substrate insulation groove, bubbles, cracks, dents, etc. are prone to occur, and it is difficult to successfully insert the groove at one time; 2.
  • the resin substrate of the metal substrate is void and poorly filled; 3.
  • the insulating substrate of the metal substrate It is prone to bending cracks.
  • An object of the present invention is to provide a method for fabricating a metal substrate capable of improving the problem of voids and poor filling of a metal substrate insulating groove resin in view of the deficiencies of the prior art.
  • the technical solution of the present invention is: a method for fabricating a metal substrate, comprising the following steps
  • a metal substrate is provided, the metal substrate includes opposite upper and lower surfaces, and an insulating groove is disposed on an upper surface of the metal substrate;
  • a screen printing slot providing a screen with a screen through groove placed on the upper surface of the metal substrate, coating a resin glue on the screen, using a cutter to the resin glue Scratch coating until the resin glue penetrates from the screen through groove to fill the insulating groove;
  • pre-curing removing the screen, baking pre-curing the resin glue in the insulating groove to form a solid resin.
  • the cutter applies a speed of 50 to 100 mm/s to the resin glue.
  • the cutter includes a doctor blade and an ink knife, and the resin glue is subjected to a doctor blade, and the doctor blade is firstly coated with the doctor blade in a positive direction.
  • the resin glue is used to scrape the resin glue in a reverse direction with the ink knife, and the pressure applied to the doctor blade is greater than the pressure applied to the ink knife.
  • the pressure applied to the doctor blade is 5-8 kg/cm 2
  • the pressure applied to the ink knife is 3-7 kg/cm 2 °
  • the angle between the scraper and the upper surface of the metal substrate is 50-70°.
  • the scraper has a thickness of 15 to 25 mm.
  • the scraper has a Shore hardness of 75 to 85 degrees.
  • the standing length is more than 4 h, so that the resin glue filled in the insulating groove Cool and solidify.
  • the screen through slot is correspondingly disposed directly above the insulating slot, and the slot of the screen through slot is larger than the slot of the insulating slot mouth.
  • the slot of the screen through slot is 0.15 ⁇ 0.2 mm larger than the slot of the insulating slot.
  • the resin glue liquid is subjected to a defoaming treatment before the resin glue liquid is coated on the screen.
  • the resin glue has a viscosity of 60 to 100 dPa ⁇ s.
  • the screen is a FR-4 copper-free core screen.
  • the FR-4 copper-free core screen has a thickness of 0.3 to 0.5 mm.
  • the distance from the screen to the metal substrate is 6 ⁇ 8 mm
  • the resin glue liquid is subjected to a smear-coating, and the end of the screen is located at a distal end of the tool moving direction.
  • the elevation height of the end of the screen is 10-15 mm.
  • step pre-curing further comprising step grinding to remove the solid resin overflowing the surface of the insulating groove, and grinding and polishing the solid resin on the surface of the insulating groove to be The upper surface of the metal substrate is flush.
  • the inner wall of the insulating groove on the metal substrate is roughened, so that the roughness of the groove wall can be increased, and the resin glue and the inner wall of the insulating groove can be increased. Bonding stability; and the plug groove, by placing a screen on top of the insulating groove, and placing the resin glue on the screen, the resin glue is smeared by the cutter until the resin glue is discharged from the screen.
  • the mesh plate can penetrate into the filled insulating groove, and even a large-area insulating groove can successfully insert the groove at one time, and can effectively avoid problems such as bubbles, cracks, and depressions; and the manufacturing method of the metal substrate of the present invention
  • the insulating slot plug in the metal substrate can be flattened and flush with the upper surface of the metal substrate, the plug groove is full, and is not hollow, and is not easy to be delaminated and split, thereby effectively improving the insulating groove resin cavity of the metal substrate. And the problem of poor filling, and further, the bending crack of the insulating groove of the metal substrate can be reduced. .
  • FIG. 1 is a flow chart showing a method of fabricating a metal substrate according to an embodiment of the present invention.
  • FIG. 2 is a flow chart showing a step of manufacturing a metal substrate in a screen printing slot according to an embodiment of the invention.
  • FIG. 3 is a flow chart in the step grinding of the manufacturing method of the metal substrate according to the embodiment of the present invention.
  • a method for fabricating a metal substrate according to an embodiment of the present invention includes the following steps:
  • S1 dip, providing a metal substrate, the metal substrate includes opposite upper and lower surfaces, and an insulating groove is disposed on the upper surface of the metal substrate; the upper surface of the metal substrate can be milled by a milling machine Out of the insulating groove, the milling machine has high processing precision and is very convenient and quick;
  • the groove wall of the insulating groove may be browned to increase the roughness of the groove wall.
  • the groove wall of the insulating groove can be alkali-washed and slightly etched to increase the roughness of the groove wall and increase the contact area between the resin glue and the groove wall, thereby increasing the resin glue.
  • the screen printing slot, the screen printing slot comprises the following steps:
  • the step S5 of the screen printing plug includes the following steps: S5.1, removing the solid resin overflowing the surface of the insulating groove, S5.2 The solid resin on the surface of the insulating groove is ground and polished, S5.3, and the solid resin on the surface of the insulating groove is flush with the upper surface of the metal substrate; the surface of the solid resin on the insulating groove is smoothed by the above steps The solid resin does not affect the pressing of the metal substrates after the completion of the plugging.
  • the speed at which the cutter applies the squeegee to the resin glue is 50 mm/ s to 100 mm/s.
  • the blade coating speed of the cutter is controlled at the speed set in the embodiment, which can ensure that the production rate is not too slow, and can ensure that the resin glue can completely penetrate the screen through slot of the screen and enter and fill.
  • the speed at which the tool can wipe the squeegee of the resin glue may be 50 mm/s, 75 mm/s or 100 mm/s.
  • the cutter in the screen printing slot of the step S3, includes a scraper and an ink knife, and the resin glue is scraped and printed, and the scraper is first scraped in the positive direction.
  • the resin glue is applied, and the resin glue is scraped in the opposite direction by the ink knife, and the pressure applied to the doctor blade is greater than the pressure applied to the ink knife.
  • a large pressure is applied to the resin glue on the screen by a doctor blade to apply a large pressure in one direction (defined as a positive direction) to ensure that the resin glue can penetrate the screen through the screen to enter the insulation groove.
  • the ink knife uses the ink knife to continue to apply a small pressure on the resin glue on the screen to the opposite direction of the scraper path (defined as the opposite direction), to ensure that the resin glue can fill the entire insulation groove, to avoid insulation.
  • the groove has problems such as filling of the filling, depression, and the like.
  • the scraper scrapes the resin glue from the left side to the right side of the screen
  • the direction of the left side of the positioning to the right side is the positive direction
  • the ink knife is from the right side of the screen to the left side.
  • the right side is defined as the opposite direction to the left side; on the contrary, the tongue U knife is coated with the resin glue from the right side of the screen to the left side, then the direction of the right side toward the left side is defined as a positive direction.
  • the ink knife draws the resin glue from the left side to the right side of the screen, and defines the right side toward the left side in the opposite direction.
  • the pressure applied to the doctor blade is 5 to 8 kg/cm 2
  • the pressure applied to the ink knife is 3 to 7. Kg/cm2.
  • the tongue ij knife scrapes the resin glue under the pressure of 5 ⁇ 8kg/cm2, which can ensure that the resin glue penetrates the screen through the screen through the screen to enter the insulating groove; and the ink knife is 3 ⁇ 7kg.
  • Under the pressure of /cm 2 continue to reverse the resin glue on the screen to ensure that the gum glue fills the insulating groove smoothly, which avoids the depression of the resin in the insulating groove due to excessive pressure.
  • the resin glue in the insulating groove is flat; and the problem that the pressure is too small to cause dissatisfaction with the resin plug groove of the insulating groove occurs.
  • the pressure applied to the blade may be 5 kg/cm 2 , 6 kg/cm 2 7 kg/cm 2 or 8 kg/cm 2 , etc.
  • the pressure applied to the ink knife may be 3 kg/cm 2 , 4 kg/cm. 2 5 kg / cm 2, 6 kg / cm 2 or 7kg / cm 2 and the like.
  • an angle between the scraper and the upper surface of the metal substrate is 50 to 70°.
  • the angle formed between the blade and the upper surface of the metal substrate is 50 to 70°, which can reduce the contact between the blade and the screen.
  • the area can reduce the friction between the scraper and the screen, and thus ensure that the scraper is evenly smoothed by the scraper, so that the offset of the insulating groove is better.
  • the angle formed between the doctor blade and the upper surface of the metal substrate may be 50°, 60° or 70° or the like.
  • the thickness of the scraper is 15 to 25 mm.
  • the blade of the size and thickness is moderate, and the contact area between the blade and the screen is too large due to the excessive thickness, affecting the blade coating of the resin glue, and the resin glue cannot be used because the thickness is too small. Smoothly apply the missing mark to fill the insulation groove.
  • the thickness of the blade can be 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, 20 mm ⁇ 21 mm, 22 mm, 23 mm, 24 mm or 25 mm.
  • the scraper has a Shore hardness of 75 to 85 degrees.
  • the Shore hardness scraper can effectively ensure that the resin coating liquid is applied to the plugging tank, and the scraping effect on the resin glue is better.
  • the scraper may have a Shore hardness of 75 degrees, 76 degrees, 77 degrees, 78 degrees, 79 degrees, 80 degrees, 81 degrees, 82 degrees, 83 degrees, 84 degrees, or 85 degrees.
  • the length of the standing raft is 4h or more, so that the inside of the insulating groove is filled.
  • the resin glue is cooled and solidified.
  • the standing length is more than 4 hours, which not only can effectively discharge the bubbles in the gum glue, but also reduce the possibility of bubbles, and can also automatically cool and solidify the resin glue to improve the quality of the plug.
  • standing ⁇ can be 4h, 5h, 6 1 or 7 1 and so on.
  • the screen slot is corresponding to the insulating slot.
  • the slot of the screen through slot is larger than the slot of the insulating slot; specifically, the screen channel is larger than the insulating slot, which ensures that the resin glue enters the insulating slot through the screen passage and is completely covered Insulating groove to avoid leakage of the insulating groove.
  • the slot of the screen through slot is 0.15 ⁇ 0.2 mm larger than the inner edge of the slot of the insulating slot, that is, when the insulating slot is a circular ⁇ , the slot of the screen is also circular, and the mesh
  • the diameter of the through groove is 0.15 ⁇ 0.2mm larger than the diameter of the insulating groove; when the insulating groove is rectangular, the mesh through groove is also rectangular, and the diagonal distance of the mesh through groove is diagonal to the insulating groove. The distance is 0.15 ⁇ 0.2mm.
  • the insulating through-groove under this size does not cause the resin glue to be mostly coated on the periphery of the insulating groove due to excessively large, which affects the effect of the plugging groove. That is to say, the slot of the screen through slot can be 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm or 0.2 mm larger than the slot of the insulating slot.
  • the resin glue is defoamed in the screen printing slot of the step S3, before the resin glue is applied on the screen.
  • the step of increasing the defoaming treatment can eliminate the existing bubbles before the resin glue is inserted into the tank, and after the defoaming treatment of the resin glue, the stirring of the resin glue is minimized, and the completion of the defoaming is avoided.
  • the resin glue generates bubbles again.
  • the viscosity of the resin glue is 60-100 dPa ⁇ s.
  • the resin glue under the viscosity can ensure the fluidity of the resin glue is large, which is also beneficial for the resin glue to smash in the insulating groove, and can be automatically discharged into the resin glue through the self-flow of the resin glue. Bubbles can also improve the quality of the groove.
  • the viscosity of the resin glue may be 60dPa.S, 70dPa.S, 80dPa.S, 90dPa.S or lOOdPa.S or the like.
  • the screen in the screen printing slot of the step S3, the screen is FR-4 copper-free core screen; the thickness of the F R-4 copper-free screen is 0.3-0.5 Mm.
  • the FR-4 copper-free mesh screen belongs to an epoxy board, and its thickness is controlled to be 0.3 mm, which can be used as a screen to scratch the resin glue into the insulating groove.
  • the thickness of the FR-4 copper-free core screen may be 0.3 mm, 0.35 mm, 0.4 mm ⁇ 0.45 mm or 0.5 mm, or the like.
  • the distance from the screen to the metal substrate is 6-8 mm.
  • the screen is placed on the metal substrate. Since the screen is thin and the quality is small, and cannot be completely attached to the upper surface of the metal substrate, it is required to exert a certain external force on the screen to make the highest position.
  • the distance from the upper surface of the metal substrate is 6 mm, and the subsequent stripping of the gum glue is followed. More specifically, the distance from the screen to the metal substrate may be 6 mm, 6.5 mm, 7 mm, 7.5 mm or 8mm and so on.
  • the resin glue liquid is wiped and smeared, and the end of the screen is located at the distal end of the tool moving direction;
  • the elevation height of the end of the screen is 10 to 15 mm.
  • the scraper smears the resin glue sputum at one end of the screen, and the other end of the screen needs to be lifted to a set height, so that the force applied to the end of the screen at the end of the squeegee is applied to lift the other end of the screen. Try to ensure that the screen is straight and flat, which is more conducive to the scraper coating the resin glue on the upper surface of the screen.
  • the height of the end of the screen can be 10mm, l lmm, 12mm, 13mm, 14 mm or 15mm
  • the method for fabricating the metal substrate of the present invention is applicable to a plug groove for a large-area insulating trench, and the insulating trench plug in the metal substrate can be flattened and flush with the upper surface of the metal substrate.
  • the plug groove is full, not hollow, and is not easy to be delaminated or split, thereby effectively improving the problem of resin voids and poor filling of the insulating substrate of the metal substrate, and further reducing the occurrence of bending cracks in the insulating groove of the metal substrate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

一种金属基板的制作方法，包括以下步骤：开料，提供一金属基板，金属基板包括相对设置的上表面和下表面，在该金属基板的上表面开设绝缘槽；粗化，对绝缘槽的槽壁进行粗化处理，并在金属基板的下表面对应绝缘槽的位置贴上保护膜；网印塞槽，提供一具有网版通槽的网版放置于金属基板的上表面，将树脂胶液涂覆在网版上，使用刀具对树脂胶液进行刮涂漏印，直至树脂胶液从网版通槽中渗透至填充满所述绝缘槽；预固化，移除网版，对绝缘槽内的树脂胶液进行烘烤预固化形成固态树脂。该方法能够有效改善金属基板的绝缘槽树脂空洞和填胶不良的问题，进而可以降低金属基板的绝缘槽出现弯折性裂纹。

Description

发明名称：金属基板的制作方法
技术领域
[0001] 本发明涉及电路板制造方法技术领域， 尤其涉及金属基板的制作方法。
背景技术
[0002] 电子产品尺寸越来越小， 功率密度越来越大， 解决散热问题是对电子工业设计 的一个巨大的挑战。 由导电层、 绝缘层和金属基层组成的金属基板， 具有优异 的热传导性能和机械性能。 在电路设计中， 金属基板对热扩散能有效处理， 降 低模块运行温度， 延长使用寿命， 提高功率密度和可靠性。
[0003] 在金属层上设计绝缘槽作为隔离区域， 再将隔离区域与线路层连接成网络， 这 样的金属基层就可以制作成大电流的电极输出端子或制成卡槽引脚， 此种金属 基板设计兼备了良好的散热和导通作用。 但由于金属基板绝缘槽设计面积较大 ， 槽长一般都是槽宽的数倍， 槽型多为不规则， 因而在实际生产方法中存在一 定的技术难度， 造成生产出的金属基板易出现以下几点缺陷： 一、 由于金属基 板绝缘槽面积大， 容易出现气泡、 裂缝、 凹陷等问题， 难以一次塞槽成功； 二 、 金属基板绝缘槽树脂空洞、 填胶不良； 三、 金属基板绝缘槽部位易出现弯折 性裂纹。
技术问题
[0004] 本发明的目的在于针对现有技术的不足提供一种能够改善金属基板绝缘槽树脂 空洞和填胶不良问题的金属基板的制作方法。
问题的解决方案
技术解决方案
[0005] 为实现上述目的， 本发明的技术方案是： 金属基板的制作方法， 包括以下步骤
[0006] 幵料， 提供一金属基板， 所述金属基板包括相对设置的上表面和下表面， 在该 金属基板的上表面幵设绝缘槽；
[0007] 粗化， 对所述绝缘槽的槽壁进行粗化处理， 并在所述金属基板的下表面对应所 述绝缘槽的位置贴上保护膜；
[0008] 网印塞槽， 提供一具有网版通槽的网版放置于所述金属基板的上表面， 将树脂 胶液涂覆在所述网版上， 使用刀具对所述树脂胶液进行刮涂漏印， 直至所述树 脂胶液从所述网版通槽中渗透至填充满所述绝缘槽；
[0009] 预固化， 移除所述网版， 对所述绝缘槽内的所述树脂胶液进行烘烤预固化形成 固态树脂。
[0010] 进一步地， 在所述网印塞槽步骤中， 所述刀具对所述树脂胶液进行刮涂漏印吋 的速度为 50~100mm/s。
[0011] 进一步地， 在所述网印塞槽步骤中， 所述刀具包括刮刀和墨刀， 对所述树脂胶 液进行刮涂漏印吋， 先用所述刮刀朝正方向刮涂所述树脂胶液， 再用所述墨刀 朝反方向刮涂所述树脂胶液， 对所述刮刀施加的压力大于对所述墨刀施加的压 力。
[0012] 优选地， 对所述刮刀施加的压力为 5~8kg/cm2， 对所述墨刀施加的压力为 3~7kg/ cm2°
[0013] 优选地， 所述刮刀与所述金属基板上表面之间的夹角为 50~70°。
[0014] 进一步地， 所述刮刀的厚度为 15~25mm。
[0015] 优选地， 所述刮刀的邵氏硬度为 75~85度。
[0016] 进一步地， 在所述网印塞槽步骤中， 所述树脂胶液填充满所述绝缘槽后， 静置 吋长大于 4h， 使得填充在所述绝缘槽内的所述树脂胶液冷却凝固。
[0017] 进一步地， 在所述网印塞槽步骤中， 所述网版通槽对应设于所述绝缘槽的正上 方， 且所述网版通槽的槽口大于所述绝缘槽的槽口。
[0018] 优选地， 所述网版通槽的槽口比所述绝缘槽的槽口大 0.15~0.2mm。
[0019] 进一步地， 在所述网印塞槽步骤中， 将所述树脂胶液涂覆在所述网版上前， 先 对所述树脂胶液进行脱泡处理。
[0020] 进一步地， 在所述网印塞槽步骤中， 所述树脂胶液的粘度为 60~100dPa.S。
[0021] 进一步地， 在所述网印塞槽步骤中， 所述网版为 FR-4无铜芯网版。
[0022] 优选地， 所述 FR-4无铜芯网版的厚度为 0.3~0.5mm。
[0023] 进一步地， 在所述网印塞槽步骤中， 所述网版至所述金属基板的距离为 6~8mm [0024] 进一步地， 在所述网印塞槽步骤中， 对所述树脂胶液进行刮涂漏印吋， 抬高所 述网版位于所述刀具运动方向远端的端部。
[0025] 优选地， 对所述网版端部的抬高高度为 10~15mm。
[0026] 优选地， 在所述步骤预固化之后， 还包括步骤研磨， 去除所述绝缘槽表面溢出 的固态树脂， 并对所述绝缘槽表面的固体树脂进行研磨、 抛光， 使其与所述金 属基板的上表面相齐平。
发明的有益效果
有益效果
[0027] 本发明的有益效果： 本发明的金属基板的制作方法， 对金属基板上的绝缘槽的 内壁进行粗化处理， 从而可以加大槽壁的粗糙度， 增加树脂胶液与绝缘槽内壁 的粘接稳定性； 且塞槽吋， 通过在绝缘槽上方设置网版， 并将树脂胶液置于网 版上， 通过刀具将树脂胶液刮涂漏印， 直至树脂胶液从网版上的网版通槽中渗 透至填充满绝缘槽， 即使是大面积的绝缘槽， 也能够一次性塞槽成功， 能够有 效避免气泡、 裂缝、 凹陷等问题的出现； 本发明的金属基板的制作方法， 可以 使金属基板中的绝缘槽塞槽后平整且与金属基板的上表面相齐平， 塞槽饱满， 不空洞， 不易出分层、 幵裂， 从而能够有效改善金属基板的绝缘槽树脂空洞和 填胶不良的问题， 进而可以降低金属基板的绝缘槽出现弯折性裂纹。 。
对附图的简要说明
附图说明
[0028] 图 1是本发明实施例的金属基板的制作方法的流程图。
[0029] 图 2是本发明实施例的金属基板的制作方法步骤网印塞槽中的流程图。
[0030] 图 3是本发明实施例的金属基板的制作方法步骤研磨中的流程图。
本发明的实施方式
[0031] 为了使本发明的目的、 技术方案及优点更加清楚明白， 以下结合附图 1~3及实 施例， 对本发明进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅 仅用以解释本发明， 并不用于限定本发明。
[0032] 需要说明的是， 本实施例中的左、 右、 上、 下、 顶、 底等方位用语， 仅是互为 相对概念或是以产品的正常使用状态为参考的， 而不应该认为是具有限制性的
[0033] 如图 1~3所示， 本发明实施例提供的金属基板的制作方法， 包括以下步骤：
[0034] S l、 幵料， 提供一金属基板， 所述金属基板包括相对设置的上表面和下表面， 在该金属基板的上表面幵设绝缘槽； 可以通过銑床在金属基板的上表面銑出绝 缘槽， 銑床加工精度高， 且非常方便快捷；
[0035] S2、 粗化， 对所述绝缘槽的槽壁进行粗化处理， 如金属基板采用的是铜质材料 ， 那么可以对绝缘槽的槽壁进行棕化处理， 以增加槽壁的粗糙度； 如金属基板 采用的是铝质材料， 则可以对绝缘槽的槽壁进行碱洗微蚀， 以增加槽壁的粗糙 度， 增加树脂胶液与槽壁的接触面积， 从而可以增加树脂胶液与槽壁之间的结 合力度； 接着在所述金属基板的下表面对应所述绝缘槽的位置贴上保护膜， 该 保护膜的设置是为了后续对绝缘槽进行树脂胶液塞槽处理吋， 防止树脂胶液的 漏出， 确保对绝缘槽的有效塞槽处理；
[0036] S3、 网印塞槽， 所述网印塞槽包括以下步骤：
[0037] S3. 提供一具有网版通槽的网版放置于所述金属基板的上表面；
[0038] S3.2、 将树脂胶液涂覆在所述网版上；
[0039] S3.3、 使用刀具对所述树脂胶液进行刮涂漏印；
[0040] S3.4、 直至所述树脂胶液从所述网版通槽中渗透至填充满所述绝缘槽；
[0041] 通过上述步骤能够确保金属基板下面的承托台面的平整， 然后通过刀具对网版 上的树脂胶液进行来回刮涂， 使得树脂胶液渗透过网版上幵设的网版通槽， 直 至树脂胶液填充满绝缘槽， 该种操作可以有效确保单次工作能够对绝缘槽塞槽 成功， 避免出现气泡、 裂缝、 凹陷等问题， 生产出的金属基板不会在绝缘槽的 部位出现弯折性裂纹；
[0042] S4、 预固化， 移除所述网版， 对所述绝缘槽内的所述树脂胶液进行烘烤预固化 形成固态树脂； 通过树脂胶液进行烘烤， 可以使得树脂胶液干燥预固化， 形成 固态树脂， 方便后续对固态树脂进行进一步加工。 [0043] 进一步地， 在步骤 S4、 预固化之后， 还包括步骤 S5研磨， 所述步骤 S5网印塞槽 包括以下步骤： S5.1、 去除所述绝缘槽表面溢出的固态树脂， S5.2、 所述绝缘槽 表面的固体树脂进行研磨、 抛光， S5.3、 使绝缘槽表面的固态树脂与金属基板的 上表面相齐平； 通过上述步骤操作， 使得绝缘槽上的固态树脂的表面光滑， 固 态树脂不会对多块完成塞槽后的金属基板的压合产生影响。
[0044] 本实施例中， 在所述步骤 S3网印塞槽中， 所述刀具对所述树脂胶液进行刮涂漏 印吋的速度为 50mm/S~100mm/s。 具体的， 将刀具的刮涂速度控制在本实施例设 定的速度下， 既能够确保生产速率不会太慢， 又能够确保树脂胶液能够完全渗 透过网版的网版通槽进入并填满绝缘槽， 不会应为过快而导致对绝缘槽塞槽空 洞， 还能够保证对网版上的树脂胶液刮涂的更加干净。 更具体的， 刀具对树脂 胶液进行刮涂漏印吋的速度可以为 50mm/s、 75mm/s或者 lOOmm/s等。
[0045] 本实施例中， 在所述步骤 S3网印塞槽中， 所述刀具包括刮刀和墨刀， 对所述树 脂胶液进行刮涂漏印吋， 先用所述刮刀朝正方向刮涂所述树脂胶液， 再用所述 墨刀朝反方向刮涂所述树脂胶液， 对所述刮刀施加的压力大于对所述墨刀施加 的压力。 具体的， 先用刮刀对网版上的树脂胶液施加较大的压力朝一个方向 （ 定义为正方向） 进行刮涂， 确保树脂胶液能够较快速地渗透过网版通槽进入到 绝缘槽内； 接着再用墨刀继续对网版上的树脂胶液施加较小的压力朝相反刮刀 路径的方向 （定义为反方向） 进行刮涂， 确保树脂胶液能够填充满整个绝缘槽 ， 避免绝缘槽出现填充不满、 凹陷等的问题。
[0046] 需要进一步说明的是， 假如刮刀从网版的左侧朝向右侧刮涂树脂胶液， 那么定 位左侧朝向右侧的方向为正方向， 墨刀从网版的右侧朝向左侧刮涂树脂胶液， 则定义右侧朝向左侧为反方向； 反之， 舌 U刀从网版的右侧朝向左侧刮涂树脂胶 液， 那么定义右侧朝向左侧的方向为正方向， 墨刀从网版的左侧朝向右侧刮涂 树脂胶液， 则定义右侧朝向左侧为反方向。
[0047] 采用该种塞槽方法， 相比传统的方法无需在金属基板的下表面加钻气孔垫板， 对绝缘槽的塞槽效果更佳， 能够一次性对大面积的绝缘槽塞槽成功， 避免出现 气泡、 裂缝和凹陷等的问题。
[0048] 更具体地， 对所述刮刀施加的压力为 5~8kg/cm2， 对所述墨刀施加的压力为 3~7 kg/cm2。 舌 ij刀在 5~8kg/cm2压力下对树脂胶液进行刮涂吋， 能够确保树脂胶液更 加快速地渗透过网版的网版通槽进入到绝缘槽内； 而墨刀在 3~7kg/cm2压力下对 继续反向对网版上的树脂胶液进行刮涂， 可以确保树胶胶液平稳地填充满绝缘 槽， 既避免会因压力过大造成绝缘槽内的树脂出现凹陷， 保证绝缘槽内的树脂 胶液平整； 又避免压力过小导致对绝缘槽的树脂塞槽不满的问题出现。 其中， 对刮刀施加的压力可以为 5 kg/cm2、 6 kg/cm2 7 kg/cm2或者 8kg/cm2等， 对墨刀施 加的压力可以为 3 kg/cm2、 4 kg/cm2 5 kg/cm2、 6 kg/cm2或者 7kg/cm2等。
[0049] 本实施例中， 所述刮刀与所述金属基板上表面之间的夹角为 50~70°。 具体的， 在使用刮刀对网版上的树脂胶液进行刮涂吋， 设定刮刀与金属基板的上表面之 间形成的夹角为 50~70°， 这样可以减小刮刀与网版的接触面积， 从而可以降低刮 刀与网版之间的摩擦力， 进而确保刮刀刮涂树胶胶液吋更加顺畅， 那么对绝缘 槽的刮涂漏印效果也更佳。 更具体的， 刮刀与金属基板的上表面之间形成的夹 角可以为 50°、 60°或者 70°等。
[0050] 本实施例中， 所述刮刀的厚度为 15~25mm。 具体的， 该尺寸厚度的刮刀适中， 既不会因为厚度过大而导致刮刀与网版的接触面积过大， 影响刮刀刮涂树脂胶 液， 也不会因为厚度过小而无法将树脂胶液顺利地刮涂漏印填满绝缘槽。 更具 体的， 刮刀的厚度可以为 15mm、 16mm、 17mm、 18mm、 19mm、 20mm ^ 21mm 、 22mm、 23mm、 24mm或者 25mm等。
[0051] 本实施例中， 所述刮刀的邵氏硬度为 75~85度。 具体的， 该邵氏硬度的刮刀可 以有效确保刮涂树脂胶液进行塞槽， 对树脂胶液的刮涂效果更佳。 优选地， 刮 刀的邵氏硬度可以为 75度、 76度、 77度、 78度、 79度、 80度、 81度、 82度、 83 度、 84度或者 85度等。
[0052] 本实施例中， 在所述步骤 S3网印塞槽中， 所述树脂胶液填充满所述绝缘槽后， 静置吋长为 4h以上， 使得填充在所述绝缘槽内的所述树脂胶液冷却凝固。 具体 的， 静置吋长为 4h以上， 不但可以有效地将树胶胶液内的气泡排出， 降低气泡 存在的可能性， 且还可以使得树脂胶液自动冷却凝固， 提高塞槽的品质。 例如 ， 静置吋可以长 4h、 5 h、 6 1或者7 1等。
[0053] 本实施例中， 在所述步骤 S3网印塞槽中， 所述网版通槽对应设于所述绝缘槽的 正上方， 且所述网版通槽的槽口大于所述绝缘槽的槽口； 具体的， 网版通道比 绝缘槽大， 可以确保树脂胶液经网版通道进入到绝缘槽并完全铺满绝缘槽， 避 免出现对绝缘槽的漏塞。 其中， 所述网版通槽的槽口比所述绝缘槽的槽口内缘 大 0.15~0.2mm， 也就是说， 当绝缘槽为圆形吋， 那么网版通槽也为圆形， 且网 版通槽的直径比绝缘槽的直径大 0.15~0.2mm; 当绝缘槽为矩形吋， 那么网版通 槽也为矩形， 且网版通槽的对角线的距离会绝缘槽对角线的距离大 0.15~0.2mm 。 在该尺寸下的绝缘通槽不会因为过大而导致树脂胶液大部分刮涂在绝缘槽的 周缘， 影响塞槽效果。 也就是说， 网版通槽的槽口比绝缘槽的槽口可以大 0.15m m、 0.16mm、 0.17mm、 0.18mm、 0.19mm或者 0.2mm等。
[0054] 本实施例中， 在所述步骤 S3网印塞槽中， 将所述树脂胶液涂覆在所述网版上前 ， 先对所述树脂胶液进行脱泡处理。 具体的， 增加脱泡处理的工序可以在树脂 胶液进行塞槽前就排除存在的气泡， 且对树脂胶液进行脱泡处理后， 尽量减少 对树脂胶液的搅拌， 避免完成脱泡后的树脂胶液又产生气泡。
[0055] 本实施例中， 在所述步骤 S3网印塞槽中， 所述树脂胶液的粘度为 60~100dPa.S 。 具体的， 该粘度下的树脂胶液能够确保树脂胶液的流动性较大， 这样也有利 于树脂胶液在绝缘槽内吋， 能够通过树脂胶液的自身流动而自动排出树脂胶液 内的气泡， 同样能够提升塞槽品质。 更具体的， 树脂胶液的粘度可以为 60dPa.S 、 70dPa.S、 80dPa.S、 90dPa.S或者 lOOdPa.S等。
[0056] 本实施例中， 在所述步骤 S3网印塞槽中， 所述网版为 FR-4无铜芯网版； 所述 F R-4无铜芯网版的厚度为 0.3~0.5mm。 具体的， FR-4无铜芯网版属于环氧板， 且 控制其厚度在 0.3mm， 能够很好的作为网版对树脂胶液进行刮涂漏印到绝缘槽内 。 其中， FR-4无铜芯网版的厚度具体可以为 0.3mm、 0.35mm、 0.4mm ^ 0.45mm 或者 0.5mm等。
[0057] 本实施例中， 在所述步骤 S3网印塞槽中， 所述网版至所述金属基板的距离为 6~ 8mm。 具体的， 网版放置在金属基板上吋， 由于网版较薄也质量较小， 无法完 全贴附在金属基板的上表面， 那么需要通过对网版施加一定的外力作用， 使得 其最高的位置离金属基板的上表面的距离为 6mm， 方面后续对树胶胶液的刮涂 漏印。 更具体的， 网版至金属基板的距离可以为 6mm、 6.5mm、 7mm、 7.5mm或 者 8mm等。
[0058] 本实施例中， 在所述步骤 S3网印塞槽中， 对所述树脂胶液进行刮涂漏印吋， 抬 高所述网版位于所述刀具运动方向远端的端部； 对所述网版端部的抬高高度为 1 0~15mm。 具体的， 刮刀在网版的一端幵始刮涂树脂胶液吋， 需要对网版的另一 端抬起设定的高度， 这样在刮刀施加网版一端的力配合抬起网版另一端施加的 力尽量确保网版拉直平整， 更加有利于刮刀在网版的上表面进行刮涂树脂胶液 。 更具体的， 对网版端部的抬高高度可以为 10mm、 l lmm、 12mm、 13mm、 14 mm或者 15mm
[0059] 经对上述实施例加工出的金属基板经耐弯折测试、 耐压测试和热应力测试， 能 够确定金属基板的绝缘槽内的树脂无裂纹、 无分层、 无起泡、 无脱落等。
[0060] 综上可知， 本发明的金属基板的制作方法， 适用于对大面积绝缘槽的塞槽， 可 以使金属基板中的绝缘槽塞槽后平整且与金属基板的上表面相齐平， 塞槽饱满 ， 不空洞， 不易出分层、 幵裂， 从而能够有效改善金属基板的绝缘槽树脂空洞 和填胶不良的问题， 进而可以降低金属基板的绝缘槽出现弯折性裂纹。
[0061] 以上所述仅为本发明的较佳实施例而已， 并不用以限制本发明， 凡在本发明的 思想和原则之内所作的任何修改、 等同替换或改进等， 均应包含在本发明的保 护范围之内。

Claims

权利要求书
[权利要求 1] 金属基板的制作方法， 其特征在于， 包括以下步骤：
幵料， 提供一金属基板， 所述金属基板包括相对设置的上表面和下表 面， 在该金属基板的上表面幵设绝缘槽；
粗化， 对所述绝缘槽的槽壁进行粗化处理， 并在所述金属基板的下表 面对应所述绝缘槽的位置贴上保护膜；
网印塞槽， 提供一具有网版通槽的网版放置于所述金属基板的上表面
， 将树脂胶液涂覆在所述网版上， 使用刀具对所述树脂胶液进行刮涂 漏印， 直至所述树脂胶液从所述网版通槽中渗透至填充满所述绝缘槽 预固化， 移除所述网版， 对所述绝缘槽内的所述树脂胶液进行烘烤预 固化形成固态树脂。
根据权利要求 1所述的金属基板的制作方法， 其特征在于， 在所述网 印塞槽步骤中， 所述刀具对所述树脂胶液进行刮涂漏印吋的速度为 50 〜100mm/s。
根据权利要求 1所述的金属基板的制作方法， 其特征在于， 在所述网 印塞槽步骤中， 所述刀具包括刮刀和墨刀， 对所述树脂胶液进行刮涂 漏印吋， 先用所述刮刀朝正方向刮涂所述树脂胶液， 再用所述墨刀朝 反方向刮涂所述树脂胶液， 对所述刮刀施加的压力大于对所述墨刀施 加的压力。
根据权利要求 3所述的金属基板的制作方法， 其特征在于， 对所述刮 刀施加的压力为 5~8kg/cm2， 对所述墨刀施加的压力为 3~7kg/cm2。 根据权利要求 3所述的金属基板的制作方法， 其特征在于， 所述刮刀 与所述金属基板上表面之间的夹角为 50~70°。
根据权利要求 3所述的金属基板的制作方法， 其特征在于， 所述刮刀 的厚度为 15~25mm。
根据权利要求 3所述的金属基板的制作方法， 其特征在于， 所述刮刀 的邵氏硬度为 75~85度。 [权利要求 8] 根据权利要求 1~7任一项所述的金属基板的制作方法， 其特征在于， 在所述网印塞槽步骤中， 所述树脂胶液填充满所述绝缘槽后， 静置吋 长大于 4h， 使得填充在所述绝缘槽内的所述树脂胶液冷却凝固。
[权利要求 9] 根据权利要求 1~7任一项所述的金属基板的制作方法， 其特征在于， 在所述网印塞槽步骤中， 所述网版通槽对应设于所述绝缘槽的正上方 ， 且所述网版通槽的槽口大于所述绝缘槽的槽口； 所述网版通槽的槽 口比所述绝缘槽的槽口大 0.15~0.2mm。
[权利要求 10] 根据权利要求 1~7任一项所述的金属基板的制作方法， 其特征在于， 在所述网印塞槽步骤中， 所述树脂胶液的粘度为 60~100dPa.S。
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