WO2017154207A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

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Publication number
WO2017154207A1
WO2017154207A1 PCT/JP2016/057804 JP2016057804W WO2017154207A1 WO 2017154207 A1 WO2017154207 A1 WO 2017154207A1 JP 2016057804 W JP2016057804 W JP 2016057804W WO 2017154207 A1 WO2017154207 A1 WO 2017154207A1
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WO
WIPO (PCT)
Prior art keywords
electrode
conductive
terminal
conductive portion
emitting device
Prior art date
Application number
PCT/JP2016/057804
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English (en)
Japanese (ja)
Inventor
千寛 原田
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2016/057804 priority Critical patent/WO2017154207A1/fr
Publication of WO2017154207A1 publication Critical patent/WO2017154207A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to a light emitting device.
  • An organic EL element is one of the light sources of a light emitting device.
  • the organic EL element has a configuration in which an organic layer is disposed between a first electrode serving as an anode and a second electrode serving as a cathode.
  • the anode and the cathode are respectively connected to different terminals. Power is supplied to these terminals via connection members such as lead frames and bonding wires.
  • Patent Document 1 describes that irregularities are formed on the surface of a terminal by dry etching or wet etching in order to improve the adhesion between the connecting member and the terminal.
  • one method for improving the adhesion between the connection member and the terminal is to form irregularities on the surface of the terminal.
  • An example of a problem to be solved by the present invention is to improve the adhesion between the connection member and the terminal without increasing the number of manufacturing steps of the light emitting device.
  • the invention according to claim 1 is a first electrode; A second electrode; An organic layer located between the first electrode and the second electrode; A first conductive portion overlapping the first electrode and electrically connected to the first electrode; A terminal portion electrically connected to the first electrode; A connecting member that is connected to the terminal portion and supplies power to the terminal portion; With The terminal portion is A first region having a second conductive part comprising the same material as the first conductive part; A second region not having the second conductive portion; It is a light-emitting device provided with.
  • FIG. 3 is a diagram in which a second electrode is removed from FIG. 2. It is the figure which removed the insulating layer and the organic layer from FIG. It is the figure which removed the 1st electroconductive part and the electroconductive part from FIG.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB in FIG.
  • FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification Example 1.
  • FIG. 11 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 2.
  • FIG. 11 is a plan view showing a configuration of a light emitting device according to Modification 3. It is a top view which shows the structure of the light-emitting device which concerns on the modification of FIG. It is a top view which shows the structure of the light-emitting device which concerns on the modification 4. It is sectional drawing which shows the structure of the light-emitting device which concerns on the modification 4.
  • FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment.
  • FIG. 2 is a view in which the sealing member 180 and the connecting members 200 and 202 are removed from FIG.
  • FIG. 3 is a diagram in which the second electrode 130 is removed from FIG. 2.
  • 4 is a diagram in which the insulating layer 150 and the organic layer 120 are removed from FIG.
  • FIG. 5 is a view in which the first conductive portion 114 and the conductive portions 160 and 170 are removed from FIG. 4.
  • the light emitting device 10 includes a first electrode 110, an organic layer 120, a second electrode 130, a first conductive portion 114, a first terminal 112 (terminal portion), and a connection member 200.
  • the organic layer 120 is located between the first electrode 110 and the second electrode 130.
  • the first conductive portion 114 overlaps the first electrode 110 and is electrically connected to the first electrode 110.
  • the connection member 200 is connected to the first terminal 112 and supplies power to the first terminal 112.
  • the first terminal 112 includes a first region having the second conductive part 164 and a second region not having the second conductive part 164.
  • the second conductive part 164 includes the same material as the first conductive part 114.
  • the light emitting device 10 is a lighting device.
  • the light emitting device 10 may be a display.
  • the light emitting device 10 may be a bottom emission type light emitting device or a top emission type light emitting device.
  • the light emitting device 10 is formed using a substrate 100.
  • the substrate 100 is formed of a light transmissive material such as glass or a light transmissive resin.
  • the substrate 100 may be formed of the above-described translucent material or may be formed of a material that does not have translucency.
  • the substrate 100 is, for example, a polygon such as a rectangle.
  • the substrate 100 may have flexibility.
  • the thickness of the substrate 100 is, for example, not less than 10 ⁇ m and not more than 1000 ⁇ m.
  • the thickness of the substrate 100 is, for example, 200 ⁇ m or less.
  • the material of the substrate 100 includes, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. Resin can be used. Further, when the substrate 100 includes a resin material, an inorganic barrier film such as SiN x or SiON is formed on at least a light emitting surface (preferably both surfaces) of the substrate 100 in order to suppress moisture from reaching the organic layer from the substrate 100. Is preferably formed.
  • a light emitting unit 140 is formed on the substrate 100.
  • the light emitting unit 140 is an organic EL element, and includes a first electrode 110, an organic layer 120, and a second electrode 130.
  • the organic layer 120 is located between the first electrode 110 and the second electrode 130.
  • At least one of the first electrode 110 and the second electrode 130 is a transparent electrode having optical transparency.
  • the first electrode 110 is a transparent electrode.
  • the second electrode 130 is a transparent electrode. Note that both the first electrode 110 and the second electrode 130 may be transparent electrodes.
  • the transparent conductive material constituting the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide), and the like. is there.
  • the thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm.
  • the first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method (for example, a vacuum vapor deposition method).
  • the first electrode 110 may be a carbon nanotube, a conductive organic material such as PEDOT / PSS, or a thin metal electrode.
  • the non-transparent electrode is selected from, for example, a first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In. Or a metal layer made of an alloy of metals selected from this first group.
  • This electrode is formed by using, for example, a sputtering method or a vapor deposition method (for example, a vacuum vapor deposition method).
  • the first electrode 110 may have a structure in which a metal layer and a transparent conductive layer are laminated in this order.
  • the organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order.
  • a hole transport layer may be formed between the hole injection layer and the light emitting layer.
  • an electron transport layer may be formed between the light emitting layer and the electron injection layer.
  • the organic layer 120 may be formed by a vapor deposition method (for example, a vacuum vapor deposition method).
  • at least one of the organic layers 120 for example, a layer in contact with the first electrode is formed by a coating method such as an ink jet method, a printing method, or a spray method, and the remaining layers of the organic layer 120 are formed by a vapor deposition method. May be formed.
  • all the layers of the organic layer 120 may be formed using the apply
  • a first conductive portion 114 is formed on the first electrode 110.
  • the first conductive portion 114 is formed using a material having a sheet resistance lower than that of the first electrode 110, such as a metal or an alloy, and functions as an auxiliary electrode of the first electrode 110.
  • the first conductive portion 114 may be formed using a single metal film, or may be formed using a stacked film in which a plurality of metal films are stacked.
  • the first conductive portion 114 may be, for example, a laminated film in which a Mo alloy, an Al alloy, and a Mo alloy are laminated in this order. Note that a conductive portion 160 and a conductive portion 170 described later also have the same cross-sectional structure as the first conductive portion 114.
  • the first conductive portion 114 is formed using, for example, a sputtering method, photolithography, and etching.
  • a plurality of first conductive portions 114 are formed on the first electrode 110.
  • the plurality of first conductive portions 114 are parallel to each other.
  • the width of the first conductive portion 114 is, for example, not less than 5 ⁇ m and not more than 100 ⁇ m. However, the width of the first conductive portion 114 may be out of this range.
  • the arrangement interval of the first conductive portions 114 is not limited.
  • the arrangement form of the first conductive portions 114 is not limited to the stripe shape, and may be a lattice shape, for example. Further, the first conductive portion 114 may be located below the first electrode 110.
  • the first conductive portion 114 may be formed using a coating method such as an inkjet method.
  • the first conductive portion 114 is formed using a conductive ink including, for example, conductive particles (for example, nanoscale metal particles, silver nanoparticles, etc.).
  • the first conductive portion 114 has a structure in which a plurality of conductive particles are bonded to each other (for example, sintered).
  • the light emitting device 10 has a plurality of light emitting units 140.
  • the first electrode 110 and the second electrode 130 are uniformly formed in accordance with the light emitting unit 140.
  • the insulating layer 150 is formed so as to cover the first conductive portion 114.
  • the insulating layer 150 is useful for preventing a short circuit between the first conductive portion 114 and the second electrode 130, but may be omitted.
  • the light emission pattern of the light emission part 140 becomes a stripe form or a grid
  • the insulating layer 150 covers a region other than the light emitting unit 140 in the first electrode 110.
  • a plurality of rectangular openings 152 are formed in the insulating layer 150. These openings 152 are provided to bring the organic layer 120 into contact with the first electrode 110 and are parallel to each other.
  • a portion of the insulating layer 150 located between the openings 152 overlaps the first conductive portion 114. In other words, the first conductive portion 114 is covered with the insulating layer 150.
  • the insulating layer 150 is made of a resin material such as polyimide.
  • a photosensitive material is used as the material of the insulating layer 150, it can be exposed and developed after the photosensitive material is applied. This step is performed, for example, after forming the first electrode 110 and the first conductive portion 114 and before forming the organic layer 120.
  • the light emitting device 10 has a first terminal 112 and a second terminal 132.
  • the first terminal 112 is electrically connected to the first electrode 110
  • the second terminal 132 is electrically connected to the second electrode 130.
  • the first terminal 112 and the second terminal 132 include a layer formed of the same material as that of the first electrode 110.
  • a lead wiring may be provided between the first terminal 112 and the first electrode 110.
  • a lead wiring may be provided between the second terminal 132 and the second electrode 130.
  • the substrate 100 is rectangular.
  • the first terminal 112 is provided along each of two opposite sides of the four sides of the substrate 100, and the second terminal 132 is provided along each of the remaining two sides of the substrate 100. ing.
  • the layer formed of the same material as the first electrode 110 in the first terminal 112 is integrated with the first electrode 110.
  • the layer formed of the same material as the first electrode 110 in the second terminal 132 is separated from the first electrode 110.
  • positioning) of the 1st terminal 112 and the 2nd terminal 132 (extraction electrode) is not restricted to this embodiment.
  • the first terminal 112 has a conductive portion 160.
  • Each of the conductive portions 160 has a comb shape, and extends along different sides of the substrate 100.
  • the conductive part 160 is formed of a layer containing the same material as the first conductive part 114.
  • the first region of the first terminal 112 is a region where the conductive part 160 is formed.
  • the second region of the first terminal 112 has only the same layer as the first electrode 110. For this reason, when the surface (first surface) on which the light emitting unit 140 is formed in the substrate 100 is used as a reference, the first region of the first terminal 112 is located above the second region. In other words, the first terminal 112 has irregularities due to the presence or absence of the conductive portion 160.
  • This concave and convex concave portion that is, a region without the conductive portion 160
  • the conductive part 160 includes a third conductive part 162 and a plurality of second conductive parts 164.
  • the plurality of second conductive portions 164 correspond to comb teeth, and are repeatedly arranged in the direction in which the first terminal 112 extends (the first direction, that is, the direction along the side of the substrate 100).
  • the third conductive portion 162 extends in the same direction (first direction) as the first terminal 112, and connects one end of the plurality of second conductive portions 164 to each other.
  • the third conductive portion 162 is connected to the end of the second conductive portion 164 on the first electrode 110 side.
  • the third conductive portion 162 may be connected to the end of the second conductive portion 164 on the edge side of the substrate 100.
  • the end of the first conductive portion 114 is also connected to the third conductive portion 162.
  • the third conductive portion 162, the second conductive portion 164, and the first conductive portion 114 are formed in the same process and are integrated with each other.
  • the planar shape of the second conductive portion 164 is linear.
  • the direction in which the second conductive portion 164 extends is a direction that intersects the first direction (for example, a direction that intersects perpendicularly), that is, a direction that intersects the third conductive portion 162.
  • the width of the second conductive portion 164 is larger than the interval between the adjacent second conductive portions 164.
  • the width of the second conductive portion 164 is 100 ⁇ m or more.
  • interval of the adjacent 2nd electroconductive part 164 is 50 micrometers or more and 1000 micrometers or less, for example.
  • the width and interval of the second conductive portion 164 need not be the same over the entire area.
  • the width of the second conductive portion 164 is wider than the interval between the second conductive portions 164 (extracted portion: width of the non-formed portion) in the total region (crimped portion) where the connection member 200 is crimped.
  • the number of second conductive portions 164 included in one first terminal 112 is not particularly limited. Further, the length of the second conductive portion 164 is not particularly limited.
  • the conductive portion 170 has the same shape as the conductive portion 160, and in this embodiment, extends in a direction intersecting with the conductive portion 160 (for example, an orthogonal direction).
  • the conductive part 170 has a third conductive part 172 and a second conductive part 174.
  • the third conductive part 172 corresponds to the third conductive part 162 of the conductive part 160.
  • the second conductive portion 174 corresponds to the second conductive portion 164 of the conductive portion 160 and also corresponds to comb teeth.
  • the width of the second conductive portion 174 is larger than the interval between the adjacent second conductive portions 174. For example, the width of the second conductive portion 174 is 100 ⁇ m or more.
  • interval of the adjacent 2nd electroconductive part 174 is 50 micrometers or more and 1000 micrometers or less, for example.
  • the number of second conductive parts 174 included in one second terminal 132 is not particularly limited. Further, the length of the second conductive portion 174 is not particularly limited.
  • the conductive part 170 is formed in the same process as the conductive part 160.
  • connection member 200 is connected to the first terminal 112, and the connection member 202 is connected to the second terminal 132.
  • the connection members 200 and 202 are, for example, REIT wiring or tab wiring.
  • a portion of the connecting member 200 that is connected to the first terminal 112 extends in the same direction (first direction) as the first terminal 112, and the first is connected via the conductive adhesive layer 210.
  • the terminal 112 is fixed and electrically connected.
  • a portion of the connecting member 202 connected to the second terminal 132 extends in the same direction as the second terminal 132 (a direction intersecting the first direction, for example, a direction orthogonal to the first direction).
  • the second terminal 132 is fixed and electrically connected through the conductive adhesive layer 210.
  • the conductive adhesive layer 210 includes a plurality of particles having conductivity at least on the surface (hereinafter referred to as conductive particles).
  • the connection member 200 is electrically connected to the first terminal 112 through conductive particles in the conductive adhesive layer 210, and the connection member 202 is also connected to the second terminal 132 through conductive particles in the conductive adhesive layer 210. Electrically connected.
  • the width of the third conductive portion 162, the width of the second conductive portion 164, the width of the third conductive portion 172, and the width of the second conductive portion 174 are larger than the width of the conductive particles (in the case of a sphere, the diameter). large.
  • connection resistance (or contact resistance) of the 1st terminal 112 and the connection member 200 will become low, Further, the connection resistance (or contact resistance) between the second terminal 132 and the connection member 202 is also reduced.
  • the second conductive portion 164 is repeatedly provided in the direction intersecting with the connection member 200. Therefore, irregularities are formed on the surface of the first terminal 112.
  • the height of the unevenness is substantially equal to the height of the conductive part 160 or the first conductive part 114, and is, for example, 100 nm or more and 1000 nm or less. The unevenness increases the bonding strength between the first terminal 112 and the conductive adhesive layer 210.
  • the second conductive portion 174 is also repeatedly provided in the direction intersecting with the connection member 202. Therefore, irregularities are formed on the surface of the second terminal 132.
  • the height of the unevenness is substantially equal to the height of the conductive portion 170 or the first conductive portion 114. The unevenness increases the bonding strength between the second terminal 132 and the conductive adhesive layer 210.
  • the light emitting device 10 has a sealing member 180.
  • the sealing member 180 is formed using glass, metal such as aluminum, or resin, and has a shape in which a recess is provided in the center.
  • the sealing member 180 is fixed to the substrate 100 in a direction in which the concave portion faces the substrate 100.
  • the first electrode 110, the organic layer 120, and the second electrode 130 are disposed in the space between the recess of the sealing member 180 and the substrate 100.
  • a desiccant 186 is disposed in the recess of the sealing member 180.
  • An adhesive layer (or adhesive layer) 184 (shown in FIG. 6 described later) is provided on the entire periphery of the edge of the sealing member 180.
  • the sealing member 180 is fixed to the substrate 100 by the adhesive layer 184. Note that the first terminal 112, the second terminal 132, and the connecting members 200 and 202 are located outside the sealing member 180.
  • the light emitting unit 140 may be sealed with a sealing film.
  • the sealing film may be formed using, for example, an ALD (Atomic Layer Deposition) method.
  • the sealing film may have a multilayer structure in which a plurality of layers are stacked. In this case, it may have a structure in which a first sealing layer made of a first material (for example, aluminum oxide) and a second sealing layer made of a second material (for example, titanium oxide) are repeatedly stacked.
  • the sealing film may be formed using another film forming method, for example, a CVD method or a sputtering method.
  • the sealing film can be formed of an insulating film such as SiO 2 or SiN.
  • the sealing film may have a stacked film in which a plurality of film forming methods are combined.
  • the film thickness of the sealing film is, for example, 10 nm or more and 1000 nm or less.
  • the light emitting unit 140 may be sealed with a sealing plate.
  • a sealing plate for example, a metal plate such as Al or stainless steel can be used.
  • the sealing plate is laminated via an adhesive.
  • a desiccant may be provided between the sealing plate and the adhesive, or the adhesive itself may have a drying function.
  • FIG. 6 is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 3 and FIG. 3, the organic layer 120 and the second electrode 130 are also uniformly formed on the portion of the insulating layer 150 that covers the first conductive portion 114.
  • the plurality of second conductive portions 164 are repeatedly arranged along the direction in which the first terminals 112 extend.
  • the width w 1 of the second conductive part 164 is larger than the interval w 2 between the adjacent second conductive parts 164.
  • the sum of the widths w 1 of all the second conductive portions 164 formed on the first terminal 112 is larger than the sum of the intervals w 2 of all the adjacent second conductive portions 164 formed on the first terminal 112.
  • the corner of the second conductive portion 164 is not rounded or the radius of curvature is small even when rounded.
  • the conductive portion 160 having such a shape can be formed by uniformly forming a film by sputtering or the like and then patterning using photolithography.
  • FIG. 8 is a cross-sectional view showing a modification of FIG.
  • the corners of the second conductive portion 164 are rounded and the radius of curvature is large.
  • the conductive portion 160 having such a shape can be formed by using a coating method such as an inkjet method and controlling the coating and drying conditions.
  • the first electrode 110 is formed on the substrate 100.
  • the same layer as the first electrode 110 is also formed among the first terminal 112 and the second terminal 132.
  • the first conductive part 114 and the conductive part 160 are formed in the same process.
  • the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order.
  • the sealing member 180 is prepared. At this stage, a desiccant 186 is fixed to the surface of the sealing member 180 facing the substrate 100. Next, the sealing member 180 is fixed to the substrate 100 using the adhesive layer 184. Thereby, the light emitting unit 140 is sealed by the sealing member 180. Next, the connection member 200 is connected to the first terminal 112, and the connection member 202 is connected to the second terminal 132.
  • the second conductive portion 164 of the first terminal 112 is repeatedly provided in the direction intersecting with the connection member 200. Therefore, irregularities are formed on the surface of the first terminal 112. For this reason, the surface area of the area
  • the sum of the widths w 1 of all the second conductive portions 164 formed on the first terminal 112 is larger than the sum of the intervals w 2 of all the adjacent second conductive portions 164 formed on the first terminal 112. . Accordingly, the connection resistance between the first terminal 112 and the connection member 200 is lower than when the width w 1 of the second conductive portion 164 is equal to or smaller than the interval w 2 between the adjacent second conductive portions 164. With such a configuration, it is possible to secure a contact area between the first terminal 112 and the connection member 200 and to prevent a decrease in contact resistance while improving adhesion.
  • FIG. 9 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Modification Example 1, and corresponds to FIG. 7 in the embodiment.
  • the light emitting device 10 according to this modification is the same as the light emitting device 10 according to the embodiment except that the first conductive portion 114, the conductive portion 160, and the conductive portion 170 are formed before the first electrode 110. It is the same composition.
  • the first conductive part 114 is located between the substrate 100 and the first electrode 110.
  • the first terminal 112 has a configuration in which the conductive layer 160 and the same layer as the first electrode 110 are stacked in this order on the substrate 100.
  • the second terminal 132 has a configuration in which the conductive layer 170 and the same layer as the first electrode 110 are stacked on the substrate 100 in this order.
  • the upper surface of the same layer as the first electrode 110 in the first terminal 112 has unevenness due to the presence or absence of the conductive portion 160.
  • the upper surface of the same layer as the first electrode 110 in the second terminal 132 has unevenness due to the presence or absence of the conductive portion 170. Therefore, also in this modification, as in the embodiment, the adhesion between the first terminal 112 and the connection member 200, and the second terminal 132 and the connection member 202 is improved.
  • FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device 10 according to Modification Example 2, and corresponds to FIG. 6 in the embodiment.
  • the light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except that the insulating layer 150 is not provided. Note that the light emitting device 10 according to the first modification may not include the insulating layer 150.
  • the adhesion between the first terminal 112 and the connection member 200 and the second terminal 132 and the connection member 202 is increased.
  • FIG. 11 is a plan view illustrating a configuration of the light emitting device 10 according to the third modification.
  • the light emitting device 10 according to the present modification has the same configuration as that of the light emitting device 10 according to the embodiment or any one of the first and second modifications, except for the pattern of the conductive portion 160 and the pattern of the conductive portion 170.
  • the conductive portion 160 has a configuration in which an opening 166 is provided in a conductor layer formed on almost the entire surface of the first terminal 112. Then, by providing the opening 166, a plurality of second conductive portions 164 are formed in the conductive portion 160.
  • the opening 166 extends in a meander shape along the direction in which the first terminal 112 extends.
  • the shape of the opening 166 is not limited to the example shown in FIG.
  • a plurality of conductive portions 160 may be arranged in a staggered manner in the conductive portion 160.
  • the shape of the opening 166 is, for example, a rectangle, but may be another shape.
  • the conductive portion 170 also has an opening 176, similar to the conductive portion 160. Then, by providing the opening 176, a plurality of second conductive portions 174 are formed in the conductive portion 170.
  • the adhesion between the first terminal 112 and the connection member 200 and the second terminal 132 and the connection member 202 is increased.
  • FIG. 13 is a plan view showing a configuration of the light emitting device 10 according to the fourth modification, and corresponds to FIG. 11 in the third modification.
  • FIG. 14 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to the present modification, and corresponds to FIG. 6 in the embodiment.
  • the light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to modification 3 except for the following points.
  • the conductive portion 160 has a lattice shape. And the part located in a lattice point among the electroconductive parts 160 is thicker than another part.
  • the plurality of third conductive portions 162 are formed in parallel with each other by, for example, an ink jet method, and then the plurality of second conductive portions 164 are formed in a direction intersecting the third conductive portions 162 (for example, orthogonal directions).
  • the conductive portion 160 is formed. Since the portion where the third conductive portion 162 and the second conductive portion 164 overlap is overcoated, the convex portion is thicker than the other portions of the second conductive portion 164 and the third conductive portion 162.
  • the thickness of the convex portion is, for example, 1.3 times or more and 2.2 times or less the thickness of the second conductive portion 164.
  • this convex part may be located in parts other than the intersection with the 3rd electroconductive part 162 among the 2nd electroconductive parts 164.
  • the coating material may be applied a plurality of times to the region of the second conductive portion 164 that will be the convex portion.
  • the adhesion between the first terminal 112 and the connection member 200 and the second terminal 132 and the connection member 202 is increased.
  • the conductive portion 160 is partially thick, and the conductive portion 170 is also partially thick. For this reason, the surface area of the 1st terminal 112 and the surface area of the 2nd terminal 132 become still larger. Accordingly, the adhesion between the first terminal 112 and the connection member 200 and between the second terminal 132 and the connection member 202 is further enhanced.

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Abstract

Selon l'invention, une couche organique (120) est positionnée entre une première électrode (110) et une seconde électrode (130). Une première partie conductrice (114) chevauche la première électrode (110), et est connectée électriquement à la première électrode (110). Un élément de connexion (200) est connecté à une première borne (112), et fournit de l'énergie à la première borne (112). La première borne (112) comporte une première région qui a une seconde partie conductrice (164), et une seconde région qui n'a pas la seconde partie conductrice (164). La seconde partie conductrice (164) contient le même matériau que la première partie conductrice (114).
PCT/JP2016/057804 2016-03-11 2016-03-11 Dispositif électroluminescent WO2017154207A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011141959A (ja) * 2010-01-05 2011-07-21 Nec Lighting Ltd 有機エレクトロルミネッセンス素子及びこれを用いた照明器具
JP2014203525A (ja) * 2013-04-01 2014-10-27 パイオニア株式会社 接合構造および発光装置
JP2015053182A (ja) * 2013-09-06 2015-03-19 パイオニア株式会社 発光装置
JP2015106453A (ja) * 2013-11-28 2015-06-08 パイオニア株式会社 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011141959A (ja) * 2010-01-05 2011-07-21 Nec Lighting Ltd 有機エレクトロルミネッセンス素子及びこれを用いた照明器具
JP2014203525A (ja) * 2013-04-01 2014-10-27 パイオニア株式会社 接合構造および発光装置
JP2015053182A (ja) * 2013-09-06 2015-03-19 パイオニア株式会社 発光装置
JP2015106453A (ja) * 2013-11-28 2015-06-08 パイオニア株式会社 発光装置

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