WO2017154207A1

WO2017154207A1 - Light-emitting device

Info

Publication number: WO2017154207A1
Application number: PCT/JP2016/057804
Authority: WO
Inventors: 千寛原田
Original assignee: パイオニア株式会社
Priority date: 2016-03-11
Filing date: 2016-03-11
Publication date: 2017-09-14

Abstract

An organic layer (120) is positioned between a first electrode (110) and a second electrode (130). A first conductive part (114) overlaps the first electrode (110), and is electrically connected to the first electrode (110). A connecting member (200) is connected to a first terminal (112), and supplies power to the first terminal (112). The first terminal (112) is provided with a first region which has a second conductive part (164), and a second region which does not have the second conductive part (164). The second conductive part (164) contains the same material as the first conductive part (114).

Description

Light emitting device

The present invention relates to a light emitting device.

An organic EL element is one of the light sources of a light emitting device. The organic EL element has a configuration in which an organic layer is disposed between a first electrode serving as an anode and a second electrode serving as a cathode. The anode and the cathode are respectively connected to different terminals. Power is supplied to these terminals via connection members such as lead frames and bonding wires.

One of the factors that increase the power consumption of the light emitting device is the adhesion between the connecting member and the terminal. When the adhesion is poor, the contact resistance between the connection member and the terminal increases due to various storage and aging, which causes an increase in power consumption. Patent Document 1 describes that irregularities are formed on the surface of a terminal by dry etching or wet etching in order to improve the adhesion between the connecting member and the terminal.

JP 2003-347046 A

As described in Patent Document 1, one method for improving the adhesion between the connection member and the terminal is to form irregularities on the surface of the terminal. However, in the method described in Patent Document 1, it is necessary to perform an additional etching step in order to form the unevenness. For this reason, the number of manufacturing steps of the light emitting device has increased.

An example of a problem to be solved by the present invention is to improve the adhesion between the connection member and the terminal without increasing the number of manufacturing steps of the light emitting device.

The invention according to claim 1 is a first electrode;
A second electrode;
An organic layer located between the first electrode and the second electrode;
A first conductive portion overlapping the first electrode and electrically connected to the first electrode;
A terminal portion electrically connected to the first electrode;
A connecting member that is connected to the terminal portion and supplies power to the terminal portion;
With
The terminal portion is
A first region having a second conductive part comprising the same material as the first conductive part;
A second region not having the second conductive portion;
It is a light-emitting device provided with.

The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.

It is a top view which shows the structure of the light-emitting device which concerns on embodiment. It is the figure which removed the sealing member and the connection member from FIG. FIG. 3 is a diagram in which a second electrode is removed from FIG. 2. It is the figure which removed the insulating layer and the organic layer from FIG. It is the figure which removed the 1st electroconductive part and the electroconductive part from FIG. FIG. 2 is a cross-sectional view taken along the line AA in FIG. FIG. 3 is a cross-sectional view taken along the line BB in FIG. It is sectional drawing which shows the modification of FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification Example 1. FIG. FIG. 11 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 2. FIG. 11 is a plan view showing a configuration of a light emitting device according to Modification 3. It is a top view which shows the structure of the light-emitting device which concerns on the modification of FIG. It is a top view which shows the structure of the light-emitting device which concerns on the modification 4. It is sectional drawing which shows the structure of the light-emitting device which concerns on the modification 4.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

(Embodiment)
FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment. FIG. 2 is a view in which the sealing member 180 and the connecting

members

200 and 202 are removed from FIG. FIG. 3 is a diagram in which the second electrode 130 is removed from FIG. 2. 4 is a diagram in which the insulating layer 150 and the organic layer 120 are removed from FIG. FIG. 5 is a view in which the first conductive portion 114 and the

conductive portions

160 and 170 are removed from FIG. 4.

The light emitting device 10 according to the embodiment includes a first electrode 110, an organic layer 120, a second electrode 130, a first conductive portion 114, a first terminal 112 (terminal portion), and a connection member 200. The organic layer 120 is located between the first electrode 110 and the second electrode 130. The first conductive portion 114 overlaps the first electrode 110 and is electrically connected to the first electrode 110. The connection member 200 is connected to the first terminal 112 and supplies power to the first terminal 112. The first terminal 112 includes a first region having the second conductive part 164 and a second region not having the second conductive part 164. The second conductive part 164 includes the same material as the first conductive part 114. Hereinafter, the light emitting device 10 will be described in detail.

In the example shown in FIGS. 1 to 5, the light emitting device 10 is a lighting device. However, the light emitting device 10 may be a display. The light emitting device 10 may be a bottom emission type light emitting device or a top emission type light emitting device. The light emitting device 10 is formed using a substrate 100.

When the light emitting device 10 is a bottom emission type, the substrate 100 is formed of a light transmissive material such as glass or a light transmissive resin. On the other hand, when the light emitting device 10 is a top emission type, the substrate 100 may be formed of the above-described translucent material or may be formed of a material that does not have translucency. The substrate 100 is, for example, a polygon such as a rectangle. Further, the substrate 100 may have flexibility. In the case where the substrate 100 has flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. In particular, when the substrate 100 is made flexible by using a glass material, the thickness of the substrate 100 is, for example, 200 μm or less. When the substrate 100 is made flexible by using a resin material, the material of the substrate 100 includes, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. Resin can be used. Further, when the substrate 100 includes a resin material, an inorganic barrier film such as SiN _x or SiON is formed on at least a light emitting surface (preferably both surfaces) of the substrate 100 in order to suppress moisture from reaching the organic layer from the substrate 100. Is preferably formed.

A light emitting unit 140 is formed on the substrate 100. The light emitting unit 140 is an organic EL element, and includes a first electrode 110, an organic layer 120, and a second electrode 130. The organic layer 120 is located between the first electrode 110 and the second electrode 130.

At least one of the first electrode 110 and the second electrode 130 is a transparent electrode having optical transparency. For example, when the light emitting device 10 is a bottom emission type light emitting device, at least the first electrode 110 is a transparent electrode. On the other hand, when the light emitting device 10 is a top emission type light emitting device, at least the second electrode 130 is a transparent electrode. Note that both the first electrode 110 and the second electrode 130 may be transparent electrodes.

The transparent conductive material constituting the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide), and the like. is there. The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method (for example, a vacuum vapor deposition method). The first electrode 110 may be a carbon nanotube, a conductive organic material such as PEDOT / PSS, or a thin metal electrode.

Of the first electrode 110 and the second electrode 130, the non-transparent electrode is selected from, for example, a first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In. Or a metal layer made of an alloy of metals selected from this first group. This electrode is formed by using, for example, a sputtering method or a vapor deposition method (for example, a vacuum vapor deposition method).

When the light emitting device 10 is a top emission type light emitting device, the first electrode 110 may have a structure in which a metal layer and a transparent conductive layer are laminated in this order.

The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method (for example, a vacuum vapor deposition method). In addition, at least one of the organic layers 120, for example, a layer in contact with the first electrode is formed by a coating method such as an ink jet method, a printing method, or a spray method, and the remaining layers of the organic layer 120 are formed by a vapor deposition method. May be formed. Moreover, all the layers of the organic layer 120 may be formed using the apply | coating method.

A first conductive portion 114 is formed on the first electrode 110. The first conductive portion 114 is formed using a material having a sheet resistance lower than that of the first electrode 110, such as a metal or an alloy, and functions as an auxiliary electrode of the first electrode 110. The first conductive portion 114 may be formed using a single metal film, or may be formed using a stacked film in which a plurality of metal films are stacked. The first conductive portion 114 may be, for example, a laminated film in which a Mo alloy, an Al alloy, and a Mo alloy are laminated in this order. Note that a conductive portion 160 and a conductive portion 170 described later also have the same cross-sectional structure as the first conductive portion 114. The first conductive portion 114 is formed using, for example, a sputtering method, photolithography, and etching.

In the example shown in the figure, a plurality of first conductive portions 114 are formed on the first electrode 110. The plurality of first conductive portions 114 are parallel to each other. The width of the first conductive portion 114 is, for example, not less than 5 μm and not more than 100 μm. However, the width of the first conductive portion 114 may be out of this range. Further, the arrangement interval of the first conductive portions 114 is not limited. Further, the arrangement form of the first conductive portions 114 is not limited to the stripe shape, and may be a lattice shape, for example. Further, the first conductive portion 114 may be located below the first electrode 110.

The first conductive portion 114 may be formed using a coating method such as an inkjet method. In this case, the first conductive portion 114 is formed using a conductive ink including, for example, conductive particles (for example, nanoscale metal particles, silver nanoparticles, etc.). For this reason, the first conductive portion 114 has a structure in which a plurality of conductive particles are bonded to each other (for example, sintered).

1 to 5, the light emitting device 10 has a plurality of light emitting units 140. The first electrode 110 and the second electrode 130 are uniformly formed in accordance with the light emitting unit 140. In the present embodiment, the insulating layer 150 is formed so as to cover the first conductive portion 114. The insulating layer 150 is useful for preventing a short circuit between the first conductive portion 114 and the second electrode 130, but may be omitted. In addition, since the part in which the 1st electroconductive part 114 and the insulating layer 150 were formed does not light-emit, the light emission pattern of the light emission part 140 becomes a stripe form or a grid | lattice form according to those shapes.

The insulating layer 150 covers a region other than the light emitting unit 140 in the first electrode 110. In other words, a plurality of rectangular openings 152 are formed in the insulating layer 150. These openings 152 are provided to bring the organic layer 120 into contact with the first electrode 110 and are parallel to each other. A portion of the insulating layer 150 located between the openings 152 overlaps the first conductive portion 114. In other words, the first conductive portion 114 is covered with the insulating layer 150.

The insulating layer 150 is made of a resin material such as polyimide. When a photosensitive material is used as the material of the insulating layer 150, it can be exposed and developed after the photosensitive material is applied. This step is performed, for example, after forming the first electrode 110 and the first conductive portion 114 and before forming the organic layer 120.

The light emitting device 10 has a first terminal 112 and a second terminal 132. The first terminal 112 is electrically connected to the first electrode 110, and the second terminal 132 is electrically connected to the second electrode 130. For example, the first terminal 112 and the second terminal 132 include a layer formed of the same material as that of the first electrode 110. A lead wiring may be provided between the first terminal 112 and the first electrode 110. In addition, a lead wiring may be provided between the second terminal 132 and the second electrode 130.

In the example shown in FIGS. 1 to 5, the substrate 100 is rectangular. The first terminal 112 is provided along each of two opposite sides of the four sides of the substrate 100, and the second terminal 132 is provided along each of the remaining two sides of the substrate 100. ing. The layer formed of the same material as the first electrode 110 in the first terminal 112 is integrated with the first electrode 110. On the other hand, the layer formed of the same material as the first electrode 110 in the second terminal 132 is separated from the first electrode 110. In addition, the form (number, arrangement | positioning) of the 1st terminal 112 and the 2nd terminal 132 (extraction electrode) is not restricted to this embodiment.

The first terminal 112 has a conductive portion 160. Each of the conductive portions 160 has a comb shape, and extends along different sides of the substrate 100. The conductive part 160 is formed of a layer containing the same material as the first conductive part 114. Similarly, it is preferable to form the conductive portion 170 also on the second terminal 132. The first region of the first terminal 112 is a region where the conductive part 160 is formed. In addition, the second region of the first terminal 112 has only the same layer as the first electrode 110. For this reason, when the surface (first surface) on which the light emitting unit 140 is formed in the substrate 100 is used as a reference, the first region of the first terminal 112 is located above the second region. In other words, the first terminal 112 has irregularities due to the presence or absence of the conductive portion 160. This concave and convex concave portion (that is, a region without the conductive portion 160) is substantially parallel to the upper surface of the substrate 100.

Specifically, the conductive part 160 includes a third conductive part 162 and a plurality of second conductive parts 164. The plurality of second conductive portions 164 correspond to comb teeth, and are repeatedly arranged in the direction in which the first terminal 112 extends (the first direction, that is, the direction along the side of the substrate 100). The third conductive portion 162 extends in the same direction (first direction) as the first terminal 112, and connects one end of the plurality of second conductive portions 164 to each other. In the example shown in the drawing, the third conductive portion 162 is connected to the end of the second conductive portion 164 on the first electrode 110 side. However, the third conductive portion 162 may be connected to the end of the second conductive portion 164 on the edge side of the substrate 100. The end of the first conductive portion 114 is also connected to the third conductive portion 162. In other words, the third conductive portion 162, the second conductive portion 164, and the first conductive portion 114 are formed in the same process and are integrated with each other.

The planar shape of the second conductive portion 164 is linear. The direction in which the second conductive portion 164 extends is a direction that intersects the first direction (for example, a direction that intersects perpendicularly), that is, a direction that intersects the third conductive portion 162. The width of the second conductive portion 164 is larger than the interval between the adjacent second conductive portions 164. For example, the width of the second conductive portion 164 is 100 μm or more. And the space | interval of the adjacent 2nd electroconductive part 164 is 50 micrometers or more and 1000 micrometers or less, for example. However, the width and interval of the second conductive portion 164 need not be the same over the entire area. It is preferable that the width of the second conductive portion 164 is wider than the interval between the second conductive portions 164 (extracted portion: width of the non-formed portion) in the total region (crimped portion) where the connection member 200 is crimped. The number of second conductive portions 164 included in one first terminal 112 is not particularly limited. Further, the length of the second conductive portion 164 is not particularly limited.

Also, the conductive portion 170 has the same shape as the conductive portion 160, and in this embodiment, extends in a direction intersecting with the conductive portion 160 (for example, an orthogonal direction). Specifically, the conductive part 170 has a third conductive part 172 and a second conductive part 174. The third conductive part 172 corresponds to the third conductive part 162 of the conductive part 160. The second conductive portion 174 corresponds to the second conductive portion 164 of the conductive portion 160 and also corresponds to comb teeth. The width of the second conductive portion 174 is larger than the interval between the adjacent second conductive portions 174. For example, the width of the second conductive portion 174 is 100 μm or more. And the space | interval of the adjacent 2nd electroconductive part 174 is 50 micrometers or more and 1000 micrometers or less, for example. The number of second conductive parts 174 included in one second terminal 132 is not particularly limited. Further, the length of the second conductive portion 174 is not particularly limited. The conductive part 170 is formed in the same process as the conductive part 160.

The connection member 200 is connected to the first terminal 112, and the connection member 202 is connected to the second terminal 132. The

connection members

200 and 202 are, for example, REIT wiring or tab wiring. A portion of the connecting member 200 that is connected to the first terminal 112 extends in the same direction (first direction) as the first terminal 112, and the first is connected via the conductive adhesive layer 210. The terminal 112 is fixed and electrically connected. A portion of the connecting member 202 connected to the second terminal 132 extends in the same direction as the second terminal 132 (a direction intersecting the first direction, for example, a direction orthogonal to the first direction). In addition, the second terminal 132 is fixed and electrically connected through the conductive adhesive layer 210. The conductive adhesive layer 210 includes a plurality of particles having conductivity at least on the surface (hereinafter referred to as conductive particles). The connection member 200 is electrically connected to the first terminal 112 through conductive particles in the conductive adhesive layer 210, and the connection member 202 is also connected to the second terminal 132 through conductive particles in the conductive adhesive layer 210. Electrically connected. The width of the third conductive portion 162, the width of the second conductive portion 164, the width of the third conductive portion 172, and the width of the second conductive portion 174 are larger than the width of the conductive particles (in the case of a sphere, the diameter). large. If it does in this way, it will become easy for the

electroconductive parts

160 and 170 to contact the electroconductive particle contained in the electroconductive adhesive layer 210, As a result, the connection resistance (or contact resistance) of the 1st terminal 112 and the connection member 200 will become low, Further, the connection resistance (or contact resistance) between the second terminal 132 and the connection member 202 is also reduced.

The second conductive portion 164 is repeatedly provided in the direction intersecting with the connection member 200. Therefore, irregularities are formed on the surface of the first terminal 112. The height of the unevenness is substantially equal to the height of the conductive part 160 or the first conductive part 114, and is, for example, 100 nm or more and 1000 nm or less. The unevenness increases the bonding strength between the first terminal 112 and the conductive adhesive layer 210.

Further, the second conductive portion 174 is also repeatedly provided in the direction intersecting with the connection member 202. Therefore, irregularities are formed on the surface of the second terminal 132. The height of the unevenness is substantially equal to the height of the conductive portion 170 or the first conductive portion 114. The unevenness increases the bonding strength between the second terminal 132 and the conductive adhesive layer 210.

The light emitting device 10 has a sealing member 180. The sealing member 180 is formed using glass, metal such as aluminum, or resin, and has a shape in which a recess is provided in the center. The sealing member 180 is fixed to the substrate 100 in a direction in which the concave portion faces the substrate 100. The first electrode 110, the organic layer 120, and the second electrode 130 are disposed in the space between the recess of the sealing member 180 and the substrate 100. A desiccant 186 is disposed in the recess of the sealing member 180. An adhesive layer (or adhesive layer) 184 (shown in FIG. 6 described later) is provided on the entire periphery of the edge of the sealing member 180. The sealing member 180 is fixed to the substrate 100 by the adhesive layer 184. Note that the first terminal 112, the second terminal 132, and the connecting

members

200 and 202 are located outside the sealing member 180.

The light emitting unit 140 may be sealed with a sealing film. In this case, the sealing film may be formed using, for example, an ALD (Atomic Layer Deposition) method. In this case, the sealing film may have a multilayer structure in which a plurality of layers are stacked. In this case, it may have a structure in which a first sealing layer made of a first material (for example, aluminum oxide) and a second sealing layer made of a second material (for example, titanium oxide) are repeatedly stacked. . However, the sealing film may be formed using another film forming method, for example, a CVD method or a sputtering method. In this case, the sealing film can be formed of an insulating film such as SiO ₂ or SiN. Further, the sealing film may have a stacked film in which a plurality of film forming methods are combined. The film thickness of the sealing film is, for example, 10 nm or more and 1000 nm or less.

Further, the light emitting unit 140 may be sealed with a sealing plate. As the sealing plate, for example, a metal plate such as Al or stainless steel can be used. The sealing plate is laminated via an adhesive. A desiccant may be provided between the sealing plate and the adhesive, or the adhesive itself may have a drying function.

FIG. 6 is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 3 and FIG. 3, the organic layer 120 and the second electrode 130 are also uniformly formed on the portion of the insulating layer 150 that covers the first conductive portion 114.

7 is a cross-sectional view taken along the line BB in FIG. As described above, the plurality of second conductive portions 164 are repeatedly arranged along the direction in which the first terminals 112 extend. The width w ₁ of the second conductive part 164 is larger than the interval w ₂ between the adjacent second conductive parts 164. Alternatively, the sum of the widths w ₁ of all the second conductive portions 164 formed on the first terminal 112 is larger than the sum of the intervals w ₂ of all the adjacent second conductive portions 164 formed on the first terminal 112. . Further, in the example shown in the figure, the corner of the second conductive portion 164 is not rounded or the radius of curvature is small even when rounded. For example, the conductive portion 160 having such a shape can be formed by uniformly forming a film by sputtering or the like and then patterning using photolithography.

FIG. 8 is a cross-sectional view showing a modification of FIG. In the example shown in the figure, the corners of the second conductive portion 164 are rounded and the radius of curvature is large. For example, the conductive portion 160 having such a shape can be formed by using a coating method such as an inkjet method and controlling the coating and drying conditions.

Next, a method for manufacturing the light emitting device 10 will be described. First, the first electrode 110 is formed on the substrate 100. In this step, the same layer as the first electrode 110 is also formed among the first terminal 112 and the second terminal 132. Next, the first conductive part 114 and the conductive part 160 are formed in the same process. At this time, it is preferable to form the conductive portion 170 also on the second terminal 132. Next, the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order.

Next, the sealing member 180 is prepared. At this stage, a desiccant 186 is fixed to the surface of the sealing member 180 facing the substrate 100. Next, the sealing member 180 is fixed to the substrate 100 using the adhesive layer 184. Thereby, the light emitting unit 140 is sealed by the sealing member 180. Next, the connection member 200 is connected to the first terminal 112, and the connection member 202 is connected to the second terminal 132.

As described above, according to the present embodiment, the second conductive portion 164 of the first terminal 112 is repeatedly provided in the direction intersecting with the connection member 200. Therefore, irregularities are formed on the surface of the first terminal 112. For this reason, the surface area of the area | region which opposes the connection member 200 among the 1st terminals 112 becomes large, As a result, the adhesiveness of the 1st terminal 112 and the connection member 200 becomes high. In the direction in which the first terminal 112 extends, the width w ₁ of the second conductive portion 164 is larger than the interval w ₂ between the adjacent second conductive portions 164. Alternatively, the sum of the widths w ₁ of all the second conductive portions 164 formed on the first terminal 112 is larger than the sum of the intervals w ₂ of all the adjacent second conductive portions 164 formed on the first terminal 112. . Accordingly, the connection resistance between the first terminal 112 and the connection member 200 is lower than when the width w ₁ of the second conductive portion 164 is equal to or smaller than the interval w ₂ between the adjacent second conductive portions 164. With such a configuration, it is possible to secure a contact area between the first terminal 112 and the connection member 200 and to prevent a decrease in contact resistance while improving adhesion.

(Modification 1)
FIG. 9 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Modification Example 1, and corresponds to FIG. 7 in the embodiment. The light emitting device 10 according to this modification is the same as the light emitting device 10 according to the embodiment except that the first conductive portion 114, the conductive portion 160, and the conductive portion 170 are formed before the first electrode 110. It is the same composition. The first conductive part 114 is located between the substrate 100 and the first electrode 110. The first terminal 112 has a configuration in which the conductive layer 160 and the same layer as the first electrode 110 are stacked in this order on the substrate 100. The second terminal 132 has a configuration in which the conductive layer 170 and the same layer as the first electrode 110 are stacked on the substrate 100 in this order.

In this modification, the upper surface of the same layer as the first electrode 110 in the first terminal 112 has unevenness due to the presence or absence of the conductive portion 160. Similarly, the upper surface of the same layer as the first electrode 110 in the second terminal 132 has unevenness due to the presence or absence of the conductive portion 170. Therefore, also in this modification, as in the embodiment, the adhesion between the first terminal 112 and the connection member 200, and the second terminal 132 and the connection member 202 is improved.

(Modification 2)
FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device 10 according to Modification Example 2, and corresponds to FIG. 6 in the embodiment. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except that the insulating layer 150 is not provided. Note that the light emitting device 10 according to the first modification may not include the insulating layer 150.

Also in the present modification, as in the embodiment, the adhesion between the first terminal 112 and the connection member 200 and the second terminal 132 and the connection member 202 is increased.

(Modification 3)
FIG. 11 is a plan view illustrating a configuration of the light emitting device 10 according to the third modification. The light emitting device 10 according to the present modification has the same configuration as that of the light emitting device 10 according to the embodiment or any one of the first and second modifications, except for the pattern of the conductive portion 160 and the pattern of the conductive portion 170.

In this modification, the conductive portion 160 has a configuration in which an opening 166 is provided in a conductor layer formed on almost the entire surface of the first terminal 112. Then, by providing the opening 166, a plurality of second conductive portions 164 are formed in the conductive portion 160.

In the example shown in FIG. 11, the opening 166 extends in a meander shape along the direction in which the first terminal 112 extends. However, the shape of the opening 166 is not limited to the example shown in FIG. For example, as shown in FIG. 12, a plurality of conductive portions 160 may be arranged in a staggered manner in the conductive portion 160. In this case, the shape of the opening 166 is, for example, a rectangle, but may be another shape.

Note that the conductive portion 170 also has an opening 176, similar to the conductive portion 160. Then, by providing the opening 176, a plurality of second conductive portions 174 are formed in the conductive portion 170.

(Modification 4)
FIG. 13 is a plan view showing a configuration of the light emitting device 10 according to the fourth modification, and corresponds to FIG. 11 in the third modification. FIG. 14 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to the present modification, and corresponds to FIG. 6 in the embodiment. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to modification 3 except for the following points.

First, the conductive portion 160 has a lattice shape. And the part located in a lattice point among the electroconductive parts 160 is thicker than another part. Specifically, for example, the plurality of third conductive portions 162 are formed in parallel with each other by, for example, an ink jet method, and then the plurality of second conductive portions 164 are formed in a direction intersecting the third conductive portions 162 (for example, orthogonal directions). Thus, the conductive portion 160 is formed. Since the portion where the third conductive portion 162 and the second conductive portion 164 overlap is overcoated, the convex portion is thicker than the other portions of the second conductive portion 164 and the third conductive portion 162. Specifically, the thickness of the convex portion is, for example, 1.3 times or more and 2.2 times or less the thickness of the second conductive portion 164. In addition, this convex part may be located in parts other than the intersection with the 3rd electroconductive part 162 among the 2nd electroconductive parts 164. FIG. In order to do this, for example, the coating material may be applied a plurality of times to the region of the second conductive portion 164 that will be the convex portion.

Also in the present modification, as in the embodiment, the adhesion between the first terminal 112 and the connection member 200 and the second terminal 132 and the connection member 202 is increased. Further, the conductive portion 160 is partially thick, and the conductive portion 170 is also partially thick. For this reason, the surface area of the 1st terminal 112 and the surface area of the 2nd terminal 132 become still larger. Accordingly, the adhesion between the first terminal 112 and the connection member 200 and between the second terminal 132 and the connection member 202 is further enhanced.

As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

Claims

A first electrode;
A second electrode;
An organic layer located between the first electrode and the second electrode;
A first conductive portion overlapping the first electrode and electrically connected to the first electrode;
A terminal portion electrically connected to the first electrode;
A connecting member that is connected to the terminal portion and supplies power to the terminal portion;
With
The terminal portion is
A first region having a second conductive part comprising the same material as the first conductive part;
A second region not having the second conductive portion;
A light emitting device comprising:
The light-emitting device according to claim 1.
The first electrode, the second electrode, and the organic layer are formed on a first surface of a substrate;
The light emitting device, wherein the upper surface of the first region is located above the upper surface of the second region when the first surface of the substrate is used as a reference.
The light-emitting device according to claim 1 or 2,
A part of the second conductive part is a convex part thicker than the other part of the second conductive part,
The thickness of the said convex part is a light-emitting device which is 130% or more of the thickness of the said other part.
The light emitting device according to claim 3.
The second region includes a third conductive part that is connected to the second conductive part and includes the same material as the first conductive part,
The convex portion is a light-emitting device located at a portion of the second conductive portion that intersects the third conductive portion.