WO2017150017A1 - Film de matériau de base pour feuille d'usinage de semi-conducteur, et feuille d'usinage de semi-conducteur - Google Patents

Film de matériau de base pour feuille d'usinage de semi-conducteur, et feuille d'usinage de semi-conducteur Download PDF

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Publication number
WO2017150017A1
WO2017150017A1 PCT/JP2017/002513 JP2017002513W WO2017150017A1 WO 2017150017 A1 WO2017150017 A1 WO 2017150017A1 JP 2017002513 W JP2017002513 W JP 2017002513W WO 2017150017 A1 WO2017150017 A1 WO 2017150017A1
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WO
WIPO (PCT)
Prior art keywords
base film
semiconductor
acid ester
adhesive layer
sensitive adhesive
Prior art date
Application number
PCT/JP2017/002513
Other languages
English (en)
Japanese (ja)
Inventor
尚哉 佐伯
優智 中村
茂之 山下
Original Assignee
リンテック株式会社
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Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to KR1020187015314A priority Critical patent/KR102594219B1/ko
Priority to CN201780012808.3A priority patent/CN108701598B/zh
Priority to JP2017564933A priority patent/JP6343725B2/ja
Publication of WO2017150017A1 publication Critical patent/WO2017150017A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

  • the present invention relates to a semiconductor processed sheet to which the workpiece is attached when processing the workpiece such as a semiconductor wafer, and a base film used for the semiconductor processed sheet.
  • semiconductor wafers such as silicon and gallium arsenide and various packages (hereinafter, these may be collectively referred to as “workpieces”) are manufactured in a large diameter state, It is cut and separated (diced) into “chips” and individually separated (picked up), and transferred to the mounting process, which is the next process.
  • a workpiece such as a semiconductor wafer is attached to a semiconductor processing sheet having a base film and an adhesive layer, and is subjected to dicing, cleaning, drying, expanding, pick-up, and mounting processes.
  • the semiconductor processed sheet in order to facilitate chip pickup, the semiconductor processed sheet is expanded to separate the chip interval, and after the pickup, the semiconductor processed sheet is returned to the original state. Accordingly, the semiconductor processed sheet, particularly the base film of the semiconductor processed sheet, is required to have stretchability (expandability) that can be expanded and restored. Therefore, a polyvinyl chloride film containing a plasticizer is often used as the base film (Patent Documents 1 and 2).
  • plasticizer blended with polyvinyl chloride alkyl esters of phthalic acid, typically dioctyl phthalate (DOP) and dibutyl phthalate (DBP) are used.
  • DOP dioctyl phthalate
  • DBP dibutyl phthalate
  • PVC soft polyvinyl chloride
  • phthalic acid alkyl esters such as DOP and DBP
  • RoHS Restriction on Hazardous Substances
  • REACH European Parliament for the protection of human health and the environment in the European Union and Europe
  • SVHC substances of very high concern
  • an adhesive sheet using as a base material a resin containing at least one dicarboxylic acid selected from succinic acid, adipic acid and terephthalic acid and 1,4-butanediol as copolymerization components is used. It has been proposed (Patent Document 3).
  • the semiconductor processed sheet is required to have good expandability.
  • the base material using the copolymer component of Patent Document 3 as a plasticizer as a substitute for the phthalic acid alkyl ester may not have sufficient expandability, and may be sufficient as a base material for a semiconductor processed sheet. There wasn't.
  • the plasticizer inside a base material transfers to the inside of an adhesive layer until it uses it after manufacturing a sheet
  • the adhesiveness of the pressure-sensitive adhesive layer may change, so that the chip cannot be picked up properly.
  • semiconductor chips mounted on the semiconductor devices have also become thinner, so if the chip pick-up property is not good, the chip may crack in some cases. Problems such as chipping occur.
  • the plasticizer inside the base material may be taken into the pressure-sensitive adhesive layer, and depending on the selection of the plasticizer, the plasticizer itself may remain as a residue in the semiconductor when peeling the semiconductor processed sheet from the semiconductor, In some cases, defects that remain in the semiconductor as a mixture with the adhesive component (hereinafter, these may be collectively referred to as “residue”) may occur.
  • the present invention has been made in view of the above-described circumstances, and exhibits sufficient expandability while using a substitute material for an alkyl phthalate as a plasticizer, and has good pickup performance.
  • An object of the present invention is to provide a base film for a semiconductor processed sheet and a semiconductor processed sheet that can suppress a decrease in performance over time and can suppress generation of a residue when peeling from an adherend.
  • the present invention is for a semiconductor processed sheet used for a semiconductor processed sheet comprising a base film and an adhesive layer laminated on at least one surface side of the base film.
  • a base film for a semiconductor processed sheet comprising a vinyl chloride resin and further containing terephthalic acid ester, adipic acid ester, and barium stearate (Invention) 1).
  • the content of the terephthalic acid ester is preferably larger than the content of the adipic acid ester (Invention 2).
  • the adipic acid ester is one selected from the group consisting of di (2-ethylhexyl) adipate, diisononyl adipate, diisodecyl adipate and di (2-butoxyethyl) adipate Or it is preferable that it is 2 or more types (invention 3).
  • the terephthalic acid ester is preferably di (2-ethylhexyl) terephthalate (Invention 4).
  • the base film for semiconductor processed sheets according to the above inventions contains 0.001% by mass of di (2-ethylhexyl) phthalate, dibutyl phthalate, benzylbutyl phthalate and diisobutyl phthalate. % Or less (Invention 5).
  • the amount of extracted chlorine ions when adding 20 mL of deionized water to 1 g of the base film and extracting at 121 ° C. for 24 hours is preferably 1000 ppm or less (Invention 6).
  • this invention is a semiconductor processed sheet provided with the base film and the adhesive layer laminated
  • the said base film is the said invention (invention).
  • the pressure-sensitive adhesive layer contains the same type of terephthalic acid ester as the terephthalic acid ester contained in the base film (Invention 8).
  • the pressure-sensitive adhesive is preferably non-energy ray curable (Invention 9).
  • the adhesive layer is preferably made of an adhesive formed from an adhesive composition containing an acrylic polymer (Invention 10).
  • the said acrylic polymer contains the monomer which has a polar group as a monomer unit which comprises the said polymer (invention 11), and the said polar group is a cyano group and / or A carboxy group is preferred (Invention 12).
  • the acrylic polymer preferably contains butyl (meth) acrylate as a monomer unit constituting the polymer (Invention 13).
  • the present invention it is possible to exhibit sufficient expandability while using a substitute material for an alkyl phthalate as a plasticizer, to have good pickup performance, and to suppress deterioration of the pickup performance over time.
  • the base film for semiconductor processed sheets and a semiconductor processed sheet which can suppress generation
  • base film for a semiconductor processed sheet (hereinafter sometimes simply referred to as “base film”) and a semiconductor processed sheet according to an embodiment of the present invention will be described.
  • the base film for a semiconductor processed sheet according to the present embodiment contains a vinyl chloride resin, and further contains a terephthalic acid ester, an adipic acid ester, and barium stearate.
  • the base film for a semiconductor processed sheet according to this embodiment includes a vinyl chloride resin.
  • the vinyl chloride resin means all polymers having a repeating unit represented by —CH 2 —CHCl—, and vinyl chloride and a polymerizable monomer such as vinyl chloride homopolymer, ethylene-vinyl chloride copolymer, etc. Copolymers, modified polymers of homopolymers such as chlorinated vinyl chloride copolymers, and chlorinated polyolefins similar in structure to vinyl chloride resins such as chlorinated polyethylene. These vinyl chloride resins may be used alone or in combination of two or more.
  • the lower limit of the average degree of polymerization of the vinyl chloride resin is preferably 300 or more, and more preferably 800 or more.
  • the vinyl chloride resin preferably has an upper limit of the average degree of polymerization of 2500 or less, more preferably 2000 or less.
  • the average degree of polymerization of the vinyl chloride resin is a value measured according to JIS K6720-2: 1999.
  • the base film according to the present embodiment further contains a terephthalic acid ester, an adipic acid ester, and barium stearate in addition to the vinyl chloride resin.
  • terephthalic acid ester and adipic acid ester act as a plasticizer
  • a base material mainly composed of vinyl chloride resin can be plasticized, and a semiconductor processed sheet using such a base film Shows good expandability.
  • the expandability is excellent compared to the case where these are used alone.
  • it is not necessary to use alkyl phthalate the possibility of containing phthalic acid as an impurity is drastically reduced, and there is no concern about environmental burden and toxicity.
  • barium stearate acts as a stabilizer, it is possible to suppress the decomposition of the vinyl chloride resin during the production and processing of the base film and long-term storage, and the base material of this embodiment It is possible to suppress deterioration over time of performance (for example, pickup performance) of the film and a semiconductor processed sheet using the film.
  • the pickup performance of the semiconductor processed sheet becomes good, and Therefore, it is possible to suppress the deterioration of the pickup performance over time. For this reason, as the action of terephthalic acid ester and adipic acid ester, these two kinds of components are transferred from the base film to the pressure-sensitive adhesive layer to reduce the adhesive strength of the semiconductor processed sheet, It is conceivable that sufficient flexibility is imparted by containing the above components, the adherend is easily peeled off from the semiconductor processed sheet, and as a result, the adhesive strength of the semiconductor processed sheet is reduced.
  • barium stearate is a substrate similar to terephthalic acid ester and adipic acid ester. It is presumed that the film moves from the film to the pressure-sensitive adhesive layer or influences the above-described movement of terephthalic acid ester and adipic acid ester (in this case, whether or not barium stearate itself moves).
  • the operation according to the present embodiment is not limited to the operation described here.
  • the semiconductor processed sheet is peeled off from an adherend such as a semiconductor wafer
  • the components of the pressure-sensitive adhesive layer, the plasticizer incorporated into the pressure-sensitive adhesive layer, and the mixture of the plasticizer and the pressure-sensitive adhesive component are covered.
  • a residue remains as a residue on the body.
  • the cause is that the cohesive force of the adhesive decreases due to the plasticizer moving from the inside of the base material to the adhesive layer, and the adhesive coheses and breaks down.
  • the plasticizer moves from the inside of the base material to the adhesive layer. Furthermore, it is conceivable to move to the surface of the adherend.
  • the base film of the semiconductor processed sheet contains terephthalic acid ester, adipic acid ester, and barium stearate, a residue is left when the adherend is peeled from the semiconductor processed sheet. Is suppressed.
  • the mechanism of action of suppressing the generation of residue is not necessarily clear, but terephthalic acid ester and adipic acid ester migrate from the base film to the adhesive layer, while barium stearate itself May be transferred from the base film to the pressure-sensitive adhesive layer, or may affect the above-described transfer of the terephthalic acid ester and the adipic acid ester, and as a result, it is possible to suppress a decrease in cohesive force of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer.
  • production suppression effect of a residue is not limited to the effect
  • the terephthalic acid ester is composed of an ester of terephthalic acid and an alcohol, and is preferably a diester of terephthalic acid and an alcohol.
  • alcohols constituting terephthalic acid and esters include methanol, ethanol, propanol, n-butanol, n-pentanol, n-hexanol, n-heptanol, n-octanol, 2-ethylhexanol, n-nonanol, isononanol, n -Decanol, n-dodecanol, n-tetradecanol and the like. These alcohols may be used individually by 1 type, or may use 2 or more types together.
  • the alcohol is preferably an alcohol having 6 to 12 carbon atoms, more preferably an alcohol having 8 to 10 carbon atoms, and particularly preferably 2-ethylhexanol. That is, the terephthalic acid ester particularly preferably used in this embodiment is di (2-ethylhexyl) terephthalate.
  • the content of the terephthalic acid ester in the base film is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more, with respect to 100 parts by mass of the vinyl chloride resin constituting the base. It is preferably 15 parts by mass or more. Further, the upper limit of the content of the terephthalic acid ester is preferably 40 parts by mass or less, more preferably 38 parts by mass or less, and 30 parts by mass or less with respect to 100 parts by mass of the vinyl chloride resin. It is particularly preferred. While the content of the terephthalic acid ester in the base film is in the above range, the base film can be provided with appropriate flexibility, and for example, the expandability of the semiconductor processed sheet can be made sufficient. Is not excessively soft and has excellent handling properties.
  • the physical properties of the pressure-sensitive adhesive layer can be controlled within a preferable range by transferring the terephthalic acid ester from the base material to the pressure-sensitive adhesive layer.
  • the change in the pick-up performance with time is further suppressed, and the generation of residue is effectively suppressed.
  • the content of the terephthalic acid ester in the base film is preferably larger than the content of the adipic acid ester described later.
  • the base film is imparted with an appropriate flexibility, and troubles are less likely to occur in the expanding process and the picking up process.
  • Adipic acid ester is comprised from ester of adipic acid and alcohol.
  • an adipic acid ester monomer may be used as the adipic acid ester
  • an adipic acid polyester may be used, or both may be used in combination.
  • adipic acid ester monomer refers to an ester of adipic acid and monoalcohol.
  • the adipic acid ester monomer includes a monoester composed of one molecule of adipic acid and one molecule of monoalcohol, and a diester composed of one molecule of adipic acid and two molecules of monoalcohol, and a diester is preferred.
  • Monoalcohols constituting the adipic acid ester monomer include methanol, ethanol, propanol, n-butanol, n-pentanol, n-hexanol, n-heptanol, n-octanol, 2-ethylhexanol, n-nonanol, isononanol, Examples include n-decanol, isodecanol, n-dodecanol, and n-tetradecanol.
  • the monoalcohol may be one having an ether bond in the molecule, such as 1-butoxyethanol, 2-butoxyethanol, and the like. These monoalcohols may be used alone or in combination of two or more.
  • the lower limit of the carbon number is preferably 4 or more, more preferably 6 or more.
  • the upper limit is preferably 16 or less, and more preferably 12 or less.
  • the carbon number of the monoalcohol constituting the adipic acid ester monomer is in the above range, so that the base material is excellent in moldability and processability, and the transition speed of the adipic acid ester monomer from the base material to the adhesive layer is increased. can do.
  • the monoalcohol constituting the adipic acid ester monomer is preferably 2-ethylhexanol, isononanol, isodecanol and 2-butoxyethanol, and particularly preferably 2-ethylhexanol and isononanol.
  • the adipate monomer is preferably di (2-ethylhexyl) adipate, diisononyl adipate, diisodecyl adipate and di (2-butoxyethyl) adipate, and di (2-ethylhexyl) adipate and diisononyl adipate. Is particularly preferred.
  • adipic acid polyester refers to an ester of adipic acid and a polyol.
  • the polyol constituting the adipic acid and the polyester is preferably a dihydric alcohol.
  • the dihydric alcohol include ethylene glycol, propylene glycol, diethylene glycol, 1,4-butanediol, 1,6-hexanediol, 3-methyl-1, 5-pentadiol, neopentyl glycol, 1,4-dihydroxymethylcyclohexane and the like.
  • These polyols may be used individually by 1 type, or may use 2 or more types together.
  • the lower limit of the number of carbon atoms is preferably 2 or more, and more preferably 3 or more.
  • the upper limit is preferably 10 or less, and more preferably 8 or less.
  • the above-mentioned adipic acid polyester preferably has a number average molecular weight lower limit of 400 or more, more preferably 600 or more.
  • the upper limit of the number average molecular weight of the adipic acid polyester is preferably 1500 or less, and more preferably 1200 or less.
  • the number average molecular weight of the adipic acid polyester is a standard polystyrene equivalent value measured (GPC measurement) using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name: HLC-8020) under the following conditions.
  • the content of the adipic acid ester in the base film is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more, with respect to 100 parts by mass of the vinyl chloride resin constituting the base. It is preferably 15 parts by mass or more. Further, the upper limit of the content of the adipic acid ester is preferably 40 parts by mass or less, more preferably 38 parts by mass or less, and 30 parts by mass or less with respect to 100 parts by mass of the vinyl chloride resin. It is particularly preferred. Since the content of the adipic acid ester in the base film is in the above range, the base film can be provided with appropriate flexibility, for example, the expandability of the semiconductor processed sheet can be made sufficient. Is not excessively soft and has excellent handling properties.
  • the physical properties of the pressure-sensitive adhesive layer can be controlled within a preferable range by transferring the adipic acid ester from the base material to the pressure-sensitive adhesive layer.
  • the change in the pickup performance with time is suppressed, and the generation of residue is effectively suppressed.
  • the total content of terephthalic acid ester and adipic acid ester in the base film is preferably 5 parts by mass or more, and 15 parts by mass or more, with respect to 100 parts by mass of the vinyl chloride resin constituting the base material. More preferably, it is particularly preferably 25 parts by mass or more.
  • the upper limit of the total content of terephthalic acid ester and adipic acid ester is preferably 80 parts by mass or less, more preferably 76 parts by mass or less, relative to 100 parts by mass of the vinyl chloride resin. It is particularly preferable that the amount is not more than part by mass.
  • Barium stearate acts as a stabilizer, and can suppress the decomposition of the vinyl chloride resin during production and processing of the base film and long-term storage. Furthermore, in this embodiment, by using barium stearate in combination with the terephthalic acid ester and adipic acid ester described above, the pickup performance of the semiconductor processed sheet is improved, and the pickup performance is reduced over time. Can be suppressed. Furthermore, in this embodiment, by using barium stearate in combination with the terephthalic acid ester and adipic acid ester described above, generation of adhesive residue when the adherend is peeled from the semiconductor processed sheet is suppressed. .
  • the content of barium stearate in the base film is preferably 0.1 parts by weight or more, and 0.3 parts by weight or more with respect to 100 parts by weight of the vinyl chloride resin constituting the base. More preferably, it is more preferably 0.5 parts by mass or more. Further, the upper limit of the content of barium stearate is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and more preferably 10 parts by mass or less with respect to 100 parts by mass of the vinyl chloride resin. It is particularly preferred. When the content of barium stearate in the base film is in the above range, the decomposition of the vinyl chloride resin in the base film can be effectively suppressed, and the pickup performance becomes more excellent. The change in pick-up performance with time is suppressed, and the generation of residue is effectively suppressed.
  • the base film according to this embodiment is a plasticizer other than adipic acid ester and terephthalic acid ester within the range not impairing the effects of this embodiment, and is regulated by the RoHS directive. You may use together the plasticizer which is not an object candidate, and is not the authorized substance of SVHC (high concern substance) of REACH regulation.
  • plasticizers include trimellitic acid plasticizers such as trimellitic acid-tri-2-ethylhexyl, alicyclic ester plasticizers such as diisononylcyclohexane dicarbonate, and sebacate esters such as dioctyl sebacate.
  • plasticizers examples thereof include plasticizers, phosphate ester plasticizers such as tricresyl phosphate; and epoxy plasticizers such as epoxidized soybean oil.
  • phosphate ester plasticizers such as tricresyl phosphate
  • epoxy plasticizers such as epoxidized soybean oil.
  • the content thereof is not particularly limited, but is preferably 25% by mass or less, for example, 15% by mass or less with respect to the total amount of the plasticizer. It is more preferable.
  • the base film which concerns on this embodiment does not exclude the thing containing a phthalic-acid alkylester type plasticizer.
  • a phthalic-acid alkylester type plasticizer for example, there is a possibility that contamination of the phthalic acid alkyl ester plasticizer may occur in the manufacturing process of the base film.
  • the base film according to this embodiment is a candidate substance subject to the regulation of the RoHS Directive described above and an approved substance of SVHC (highly concerned substance) of the REACH regulation.
  • the phthalic acid alkyl ester plasticizers particularly di (2-ethylhexyl) phthalate, dibutyl phthalate, benzylbutyl phthalate and diisobutyl phthalate are all preferably 0.001% by mass or less, It is particularly preferred not to contain any compound.
  • the base film according to the present embodiment may contain a resin other than the vinyl chloride resin as long as the effects of the present embodiment are not impaired.
  • the resin other than the vinyl chloride resin include an ethylene-vinyl acetate copolymer and an ethylene-acrylic acid ester copolymer. One kind may be used alone, or two kinds may be used. You may use the above together.
  • the content thereof is not particularly limited. For example, the content is preferably 0 to 20% by mass, more preferably 0 to 10% by mass with respect to the base film. preferable.
  • the base film according to this embodiment may contain various additives such as a heat stabilizer, a stabilizing aid, a lubricant, an ultraviolet absorber, a flame retardant, an antistatic agent, and a colorant.
  • the content of these various additives is not particularly limited. For example, it can be 0.01 to 10 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.
  • metal soaps such as calcium stearate, barium stearate, magnesium stearate, dibasic lead stearate; lead stabilizers such as basic lead sulfite and dibasic lead phosphite; dibutyltin dilaurate Tin stabilizers such as dibutyltin malate and dibutyltin mercaptides; calcium stabilizers; zinc stabilizers; magnesium stabilizers; barium stabilizers, and the like. Or you may use 2 or more types together.
  • lubricant examples include fatty acid-based lubricants, fatty acid amide-based lubricants, ester-based lubricants, polyethylene wax, liquid paraffin, and the like. One kind may be used alone, or two or more kinds may be used in combination.
  • ultraviolet absorber examples include benzophenone-based, benzotriazole-based, cyanoacrylate-based, salicylic acid ester-based, and the like. One type may be used alone, or two or more types may be used in combination.
  • antistatic agent examples include polyoxyethylene alkylamine, polyoxyethylene alkylamide, polyoxyethylene alkyl ether, glycerin fatty acid ester, sorbitan fatty acid ester and the like, one kind may be used alone, or two kinds You may use the above together.
  • colorant examples include phthalocyanine colorants, quinacridone colorants, Hansa yellow, alizarin lake, titanium oxide, zinc white, permanent red, carbon black, etc., or one kind may be used alone, or Two or more kinds may be used in combination.
  • the thickness of the base film is not particularly limited as long as a desired work can be performed on a workpiece (semiconductor wafer or the like) to which a semiconductor processed sheet is attached.
  • the thickness of the substrate is preferably 25 ⁇ m or more, and particularly preferably 50 ⁇ m or more.
  • the thickness is preferably 200 ⁇ m or less, and particularly preferably 150 ⁇ m or less.
  • the amount of extracted chlorine ions is preferably 1000 ppm ( ⁇ g / mL) or less when 20 mL of deionized water is added to 1 g of the base film and extracted at 121 ° C. for 24 hours, and is 100 ppm or less. More preferred is 10 ppm or less.
  • a base film containing a vinyl chloride resin a semiconductor wafer or a chip adhered to the adhesive layer by transferring chlorine ions generated by decomposition of the vinyl chloride resin from the base material to the adhesive layer It may corrode electronic circuits formed in the same manner. However, when the amount of extracted chlorine ions is 1000 ppm or less, such corrosion of the electronic circuit can be suppressed.
  • the detail of the measuring method of the amount of extracted chlorine ions is shown in the Example mentioned later.
  • the lower limit value of 25% stress in the MD direction in the tensile test is preferably 5 MPa or more, more preferably 7 MPa or more, and particularly preferably 9 MPa or more.
  • the upper limit value of 25% stress in the MD direction is preferably 24 MPa or less, more preferably 20 MPa or less, and particularly preferably 16 MPa or less.
  • the 25% stress in the MD direction in the tensile test is a value measured in accordance with JIS K7161-1: 2014.
  • the base film of the present embodiment preferably has a lower limit of the breaking stress in a tensile test of 14 MPa or more, more preferably 18 MPa or more, and particularly preferably 22 MPa or more.
  • the upper limit of the stress at break is preferably 48 MPa or less, more preferably 44 MPa or less, and particularly preferably 38 MPa or less.
  • the stress at break in the tensile test is a value measured according to JIS K7161-1: 2014.
  • the 25% stress in the MD direction and the stress at break in the tensile test are in the above ranges, so that the rigidity of the base film becomes appropriate.
  • the expandability of the semiconductor processed sheet is sufficient.
  • the handleability is excellent and the adherend supportability during transportation is excellent.
  • the base film according to the present embodiment includes a vinyl chloride resin, and further includes a terephthalic acid ester, an adipic acid ester, and barium stearate.
  • a vinyl chloride resin and further includes a terephthalic acid ester, an adipic acid ester, and barium stearate.
  • terephthalic acid ester an adipic acid ester
  • barium stearate There is no particular limitation. For example, it can be obtained by mixing a vinyl chloride resin, terephthalic acid ester, adipic acid ester, barium stearate, and other additives as desired, and forming the resulting mixture into a film.
  • the mixing of each component is generally performed by a mechanical melt kneading method using a single screw extruder, a twin screw extruder, a Henschel mixer, a Banbury mixer, various kneaders, a brabender, a calender roll, or the like.
  • the order of adding each component is not particularly limited.
  • the temperature for melt kneading can be suitably selected from 140 ° C. to 220 ° C.
  • the obtained mixture is processed into a film to obtain the substrate film.
  • the film processing may be performed by general molding processing methods such as extrusion molding, roll molding, calendar molding, and inflation molding.
  • the film forming method may be a method in which the mixture exemplified above is made into a solution or a molten state, and coating is performed by a coating means such as roll molding.
  • the base film is optionally subjected to a surface treatment by an oxidation method, an unevenness method, or a primer treatment on one side or both sides.
  • oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, ultraviolet irradiation treatment, and the like.
  • a pressing method a sand blasting method, and a thermal spraying method.
  • the surface of the base film on which the pressure-sensitive adhesive layer is not laminated may be subjected to a peeling treatment with a release agent. Thereby, even when a semiconductor processed sheet is used as a wound body without using a release film, the feeding can be satisfactorily performed.
  • the semiconductor processed sheet according to the present embodiment includes the base film according to the above embodiment and an adhesive layer laminated on at least one surface of the base film.
  • a release film may be laminated on the surface of the pressure-sensitive adhesive layer opposite to the base film. This release film is peeled off when the semiconductor processed sheet is used, and protects the adhesive layer until then.
  • Adhesive layer The semiconductor processing sheet which concerns on this embodiment can use the adhesive conventionally used for the semiconductor processing sheet as an adhesive which comprises an adhesive layer.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be a non-curing energy ray-curable pressure-sensitive adhesive that does not cure when irradiated with energy rays, or an energy ray-curable pressure-sensitive adhesive that is cured by irradiation with energy rays.
  • An agent may be used.
  • the pressure-sensitive adhesive layer is composed of multiple layers, a combination of energy rays and a non-curable pressure-sensitive adhesive and a curable pressure-sensitive adhesive may be used.
  • the effect of adding terephthalic acid ester, adipic acid ester and barium stearate to the base film is more effectively exhibited when the energy ray non-curable adhesive is used.
  • the pressure-sensitive adhesive it is more preferable to use a non-energy ray-curable pressure-sensitive adhesive.
  • the pressure-sensitive adhesive layer used in this embodiment preferably contains the same type of terephthalic acid ester as the terephthalic acid ester contained in the base film, and the terephthalic acid ester and adipic acid ester contained in the base film. More preferably, the same terephthalic acid ester and adipic acid ester are contained.
  • the pressure-sensitive adhesive layer contains the above components, the pressure-sensitive adhesive properties with time of the pressure-sensitive adhesive layer are stabilized at an early stage, and the transfer of the above components from the base film to the pressure-sensitive adhesive layer is completed in a short period of time. Therefore, when the pressure-sensitive adhesive layer contains the above components, the pickup performance is further improved, and the change in the pickup performance over time is further suppressed.
  • the pressure-sensitive adhesive layer used in the present embodiment may contain barium stearate but may not contain it.
  • the same kind of terephthalic acid ester (preferably, the same kind of terephthalic acid ester and adipic acid ester) contained in the base film is contained in the pressure-sensitive adhesive layer from the base film to the pressure-sensitive adhesive layer.
  • it may be contained in the pressure-sensitive adhesive layer by shifting, it is preferably contained in the pressure-sensitive adhesive layer by blending in advance with the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer.
  • Energy ray non-curable adhesive main agent As the energy ray non-curable adhesive, a conventionally known one can be used. For example, from an adhesive composition containing an energy ray non-curable polymer as an adhesive main agent. What is formed can be used.
  • the energy ray non-curable polymer may be contained as it is in the pressure-sensitive adhesive layer, or at least a part thereof may have a crosslinked structure by performing a crosslinking reaction with the crosslinking agent.
  • the energy ray non-curable polymer include acrylic polymers, phenoxy resins, urethane resins, polyester resins, rubber resins, acrylic urethane resins, silicone resins, and the like. A polymer is preferred. Hereinafter, the case where an acrylic polymer is used will be described in detail.
  • a conventionally known acrylic polymer can be used as the acrylic polymer.
  • the acrylic polymer may be a homopolymer formed from one type of acrylic monomer, may be a copolymer formed from a plurality of types of acrylic monomers, or may be one type or a plurality of types. It may be a copolymer formed from various types of acrylic monomers and monomers other than acrylic monomers. Specific types of the compound that becomes the acrylic monomer are not particularly limited, and specific examples include (meth) acrylic acid, (meth) acrylic acid ester, and derivatives thereof (acrylonitrile, itaconic acid, and the like). In the present specification, (meth) acrylic acid means both acrylic acid and methacrylic acid. The same applies to other similar terms. Further, the “polymer” in this specification may include the concept of “copolymer”.
  • the acrylic polymer preferably contains a monomer having a polar group (polar group-containing monomer) as a monomer unit constituting the polymer.
  • the acrylic polymer is preferably obtained by copolymerizing an acrylic monomer having a polar group, an acrylic monomer having no polar group, and a monomer other than the acrylic monomer if desired. That is, the polar group-containing monomer is preferably an acrylic monomer having a polar group.
  • the acrylic monomer having no polar group includes a (meth) acrylic acid alkyl ester monomer.
  • (meth) acrylic acid alkyl ester monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, and (meth) acrylic acid n- Pentyl, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-decyl (meth) acrylate, lauryl (meth) acrylate, myristyl (meth) acrylate, Examples include palmityl (meth) acrylate and stearyl (meth) acrylate.
  • the (meth) acrylic acid alkyl ester monomers those having an alkyl group having 1 to 18 carbon atoms are preferred
  • the acrylic monomer having no polar group may include, for example, (meth) acrylic acid ester having an aromatic ring such as phenyl (meth) acrylate other than the above (meth) acrylic acid alkyl ester monomer.
  • the acrylic polymer particularly preferably contains butyl (meth) acrylate as a monomer unit constituting the polymer, among monomers having no polar group.
  • the acrylic polymer contains butyl (meth) acrylate as a monomer unit, so that the pick-up property of the adherend becomes good and the generation of residue is suppressed.
  • the acrylic polymer contains butyl (meth) acrylate as a monomer unit, so that the terephthalic acid ester and / or adipic acid ester (particularly terephthalic acid ester) contained in the base material easily migrates to the pressure-sensitive adhesive layer. Presumed to be.
  • the acrylic polymer preferably contains a monomer having a polar group (polar group-containing monomer) as a monomer unit constituting the polymer.
  • a monomer having a polar group as a monomer unit
  • the pick-up property of the adherend becomes good and the generation of a residue is suppressed.
  • the polar group derived from the acrylic polymer is present in the pressure-sensitive adhesive layer, the terephthalic acid ester and / or adipic acid ester (particularly terephthalic acid ester) contained in the base material easily migrates to the pressure-sensitive adhesive layer. It is presumed to be caused by this.
  • the polar group examples include a cyano group, a carboxy group, a hydroxy group, and an amino group. Monomers having these can be used singly or in combination of two or more. Among these, a cyano group or a carboxy group is preferable. When a cyano group and / or a carboxy group are used as the polar group, the effect of this embodiment that the adherend has good pickup properties and the generation of residue is suppressed is more effectively exhibited.
  • examples of the monomer having a cyano group include acrylonitrile.
  • examples of the monomer having a carboxy group include (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid and the like.
  • examples of the monomer having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl acrylate and the like.
  • the acrylic monomer having a polar group may be, for example, methoxymethyl (meth) acrylate, methoxyethyl (meth) acrylate, (meth) acrylic acid, in addition to the acrylic monomer having the cyano group, carboxy group or hydroxy group.
  • a (meth) acrylic acid ester having a non-crosslinking tertiary amino group such as N, N-dimethylaminopropyl acrylate may be included.
  • the said acrylic polymer has a reactive functional group which reacts with a crosslinking agent.
  • the reactive functional group since the reactive functional group usually has polarity, it also acts as the polar group described above. Therefore, the functional group-containing monomer having a functional group that reacts with the crosslinking agent usually serves as the polar group-containing monomer. In this case, it is preferable to use a functional group-containing monomer having a functional group that reacts with the crosslinking agent and a monomer having a polar group that does not react with the crosslinking agent as the polar group-containing monomer.
  • the acrylic polymer has a polar group that does not react with the crosslinking agent even after reacting with the crosslinking agent.
  • the method for introducing a polar group into an acrylic polymer is not particularly limited.
  • an acrylic polymer is formed using a monomer having a polar group, and a structural unit based on the monomer having a polar group is used as a skeleton of the polymer.
  • the method of making it contain is mentioned.
  • the acrylic polymer may be formed using a monomer having a cyano group such as acrylonitrile.
  • carboxy groups such as acrylic acid
  • the proportion of the mass of the structural portion derived from the monomer having a polar group in the total mass of the acrylic polymer is preferably 1% by mass or more, particularly 3% by mass. % Or more is preferable. In addition, the ratio is preferably 30% by mass or less, and particularly preferably 20% by mass or less.
  • the proportion of the mass of the structural portion derived from the monomer having a polar group is 1% by mass or more, the pickup property of the adherend becomes favorable and the effect of the present embodiment that the generation of the residue is suppressed is achieved. More effective.
  • the acrylic polymer preferably has a reactive functional group that reacts with the cross-linking agent.
  • the type of the reactive functional group is not particularly limited, and may be appropriately determined based on the type of the crosslinking agent.
  • examples of the reactive functional group that the acrylic polymer has include a hydroxy group, a carboxy group, and an amino group.
  • examples of the reactive functional group that the acrylic polymer has include a carboxy group, an amino group, an amide group, and the like
  • examples of the reactive functional group possessed by the acrylic polymer include a hydroxy group, a carboxy group, and an epoxy group.
  • the method for introducing the reactive functional group into the acrylic polymer is not particularly limited, and examples thereof include the same method as the method for introducing the polar group described above.
  • the proportion of the mass of the structural portion derived from the monomer having a reactive functional group in the total mass of the acrylic polymer is preferably 1% by mass or more. In particular, it is preferably 2% by mass or more. In addition, the ratio is preferably 30% by mass or less, and particularly preferably 20% by mass or less. When the ratio is in the above range, the degree of crosslinking can be improved.
  • monomers other than acrylic monomers include olefins such as ethylene and norbornene, vinyl acetate, and styrene.
  • the acrylic polymer can be obtained by copolymerizing the above monomers by a conventional method.
  • a random copolymer may be sufficient as the superposition
  • the weight average molecular weight (Mw) of the acrylic polymer is preferably 10,000 or more, particularly preferably 100,000 or more.
  • the weight average molecular weight of the acrylic polymer is preferably 2 million or less, and particularly preferably 1.5 million or less. When the weight average molecular weight is in the above range, good adhesiveness can be exhibited, and the film forming property at the time of coating can be ensured satisfactorily.
  • the weight average molecular weight in the present specification is a standard polystyrene equivalent value measured (GPC measurement) under the following conditions using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name “HLC-8020”).
  • the energy ray-curable pressure-sensitive adhesive includes an energy ray-curable monomer and / or oligomer. It may be contained, or may contain a non-energy ray curable polymer and an energy ray curable monomer and / or oligomer, or contain an energy ray curable polymer. It may be a thing containing an energy ray curable polymer and an energy ray curable monomer and / or oligomer, or an energy ray curable polymer and an energy ray non-curing agent.
  • the energy ray-curable pressure-sensitive adhesive may further contain a crosslinking agent.
  • the energy ray curable monomer and / or oligomer and the energy ray curable polymer correspond to the energy ray curable component.
  • Non-energy ray curable polymer used in the energy ray curable adhesive main agent is not particularly limited.
  • the energy ray non-curable adhesive main agent described above has been described.
  • the same polymer can be used.
  • the energy ray curable monomer and / or oligomer (hereinafter referred to as “energy ray curable compound”) has an energy ray curable group, and is an energy ray. Is a compound that polymerizes when irradiated with the above, and has a lower molecular weight than the energy ray-curable polymer described later.
  • the energy ray curable group possessed by the energy ray curable compound is, for example, a group containing an energy ray curable carbon-carbon double bond, and specific examples thereof include a (meth) acryloyl group and a vinyl group. Can do.
  • the energy ray curable compound may be monofunctional or polyfunctional, but is preferably polyfunctional.
  • the energy ray curable compound is preferably bifunctional or more, particularly preferably trifunctional or more, and more preferably tetrafunctional or more.
  • the said energy-beam curable compound is 15 functional or less, It is especially preferable that it is 12 functional or less, Furthermore, it is preferable that it is 10 functional or less.
  • energy ray curable compounds include trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxy.
  • the molecular weight of the energy ray curable compound is preferably 100 or more, and particularly preferably 300 or more. Moreover, it is preferable that the molecular weight of an energy-beam curable compound is 30000 or less, and it is especially preferable that it is 10,000 or less. When the molecular weight of the energy ray-curable compound is in the above range, the effect of material volatilization during coating drying can be suppressed while ensuring film forming properties.
  • the ratio of the energy ray curable compound to the total of 100 parts by mass of the energy ray non-curable polymer and the curable polymer is preferably 30 parts by mass or more, particularly preferably 40 parts by mass or more, It is preferably 50 parts by mass or more.
  • the proportion is preferably 200 parts by mass or less, particularly preferably 170 parts by mass or less, and more preferably 150 parts by mass or less.
  • the energy ray curable polymer is preferably a polymer having an energy ray curable group introduced therein.
  • the polymer into which the energy ray curable group is introduced may be contained as it is in the pressure-sensitive adhesive layer, or at least a part thereof may have a crosslinked structure by performing a crosslinking reaction with a crosslinking agent.
  • Examples of the polymer into which the energy ray-curable group is introduced include a functional group-containing acrylic polymer containing a functional group-containing monomer containing a functional group as a monomer unit, a substituent that reacts with the functional group, and energy.
  • Examples thereof include acrylic polymers obtained by reacting a curable group-containing compound having a linear curable carbon-carbon double bond.
  • the functional group-containing acrylic polymer is preferably a copolymer of an acrylic monomer containing a functional group, an acrylic monomer not containing a functional group, and a monomer other than the acrylic monomer if desired. That is, the functional group-containing monomer is preferably an acrylic monomer containing a functional group.
  • the functional group of the acrylic monomer containing a functional group one capable of reacting with a substituent of the curable group-containing compound is selected.
  • functional groups include a hydroxy group, a carboxy group, an amino group, a substituted amino group, and an epoxy group.
  • the functional group-containing acrylic polymer includes the polar group-containing monomer described above as a monomer unit
  • the polar group-containing monomer has a functional group having a functional group capable of reacting with a substituent of the curable group-containing compound.
  • a group-containing monomer may also serve.
  • the functional group-containing acrylic polymer contains a functional group-containing monomer having a functional group that reacts with the crosslinking agent as a monomer unit. It is preferable that the functional group-containing monomer may also serve as a functional group-containing monomer having a functional group capable of reacting with a substituent of the curable group-containing compound.
  • the acrylic monomer that does not contain a functional group preferably contains a (meth) acrylic acid alkyl ester monomer.
  • (meth) acrylic acid alkyl ester monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, and (meth) acrylic acid n- Pentyl, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-decyl (meth) acrylate, lauryl (meth) acrylate, myristyl (meth) acrylate, Examples include palmityl (meth) acrylate and stearyl (meth) acrylate.
  • the (meth) acrylic acid alkyl ester monomers those having an alkyl group having 1 to 18 carbon atoms are preferred
  • acrylic monomers not containing functional groups include, for example, methoxymethyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxymethyl (meth) acrylate, ( Non-crosslinkable acrylamides such as (meth) acrylic acid esters containing alkenyl groups such as ethoxyethyl (meth) acrylate and aromatic rings such as phenyl (meth) acrylate, acrylamide and methacrylamide (Meth) acrylic acid ester having a non-crosslinking tertiary amino group such as N, N-dimethylaminoethyl (meth) acrylate and N, N-dimethylaminopropyl (meth) acrylate may also be included.
  • Non-crosslinkable acrylamides such as (meth) acrylic acid esters containing alkenyl groups such as ethoxyethyl (meth) acrylate and aromatic rings such as phenyl (meth) acryl
  • monomers other than acrylic monomers include olefins such as ethylene and norbornene, vinyl acetate, and styrene.
  • the proportion of the mass of the structural portion derived from the functional group-containing monomer in the total mass of the functional group-containing acrylic polymer is preferably 0.1% by mass or more, particularly 1 mass. % Or more, and more preferably 3% by mass or more.
  • the proportion is preferably 50% by mass or less, particularly preferably 40% by mass or less, and further preferably 30% by mass or less.
  • the functional group-containing acrylic polymer can be obtained by copolymerizing the above monomers by a conventional method.
  • the polymerization mode of the functional group-containing acrylic polymer may be a random copolymer or a block copolymer.
  • the curable group-containing compound has a substituent that reacts with the functional group of the functional group-containing acrylic polymer and an energy ray-curable carbon-carbon double bond.
  • substituent that reacts with the functional group of the functional group-containing acrylic polymer include an isocyanate group, an epoxy group, and a carboxy group, and among them, an isocyanate group that is highly reactive with a hydroxy group is preferable.
  • the curable group-containing compound preferably contains 1 to 5 energy beam-curable carbon-carbon double bonds per molecule of the curable group-containing compound, and particularly preferably contains 1 to 3.
  • curable group-containing compounds examples include 2-methacryloyloxyethyl isocyanate, meta-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, and 1,1- (bisacryloyloxymethyl) ethyl.
  • hardenable group containing compound can also be used individually by 1 type, and can also be used in combination of 2 or more type.
  • the polymer into which the energy ray curable group is introduced has a curable group derived from the curable group-containing compound with respect to a functional group (functional group that reacts with a substituent of the curable group-containing compound) of the polymer.
  • the content is preferably 20 mol% or more, particularly preferably 35 mol% or more, and more preferably 50 mol% or more.
  • an upper limit will be 100 mol%, but when a curable group containing compound is polyfunctional, it may exceed 100 mol%.
  • the ratio of the curable group to the functional group is within the above range, the adhesiveness lowering property due to the energy ray irradiation becomes better.
  • the weight average molecular weight (Mw) of the polymer into which the energy beam curable group is introduced is preferably 100,000 or more, and more preferably 300,000 or more.
  • the weight average molecular weight is preferably 2 million or less, and more preferably 1.5 million or less.
  • the energy beam for curing the energy beam-curable pressure-sensitive adhesive described above include ionizing radiation, that is, X-rays, ultraviolet rays, electron beams, and the like.
  • ionizing radiation that is, X-rays, ultraviolet rays, electron beams, and the like.
  • ultraviolet rays that are relatively easy to introduce irradiation equipment are preferable.
  • near ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm may be used for ease of handling.
  • the amount of light may be appropriately selected according to the type of energy beam curable group and the thickness of the pressure-sensitive adhesive layer possessed by the energy beam curable compound and the energy beam curable polymer, and is usually 50 to 500 mJ / cm 2. 100 to 450 mJ / cm 2 is preferable, and 200 to 400 mJ / cm 2 is more preferable.
  • the ultraviolet illumination is usually 50 ⁇ 500mW / cm 2 or so, preferably 100 ⁇ 450mW / cm 2, more preferably 200 ⁇ 400mW / cm 2.
  • the ultraviolet light source is not particularly limited, and for example, a high pressure mercury lamp, a metal halide lamp, a UV-LED, or the like is used.
  • the acceleration voltage depends on the type of energy beam curable group and the thickness of the pressure-sensitive adhesive layer possessed by the energy beam curable compound and the energy beam curable polymer described above. It may be selected appropriately, and it is usually preferable that the acceleration voltage is about 10 to 1000 kV.
  • the irradiation dose may be set in a range where the above-mentioned energy beam curable compound and energy beam curable polymer are appropriately cured, and is usually selected in a range of 10 to 1000 rad.
  • the electron beam source is not particularly limited.
  • various electron beam accelerators such as a cockcroft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type should be used. Can do.
  • crosslinking agent As a crosslinking agent, the polyfunctional compound which has the reactivity with the functional group which the acrylic polymer mentioned above and the polymer in which the energy-beam curable group was introduce
  • polyfunctional compounds include polyisocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts. And reactive phenol resins.
  • These crosslinking agents may be used individually by 1 type, or may use 2 or more types together.
  • polyisocyanate compound examples include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate, aliphatic polyisocyanates such as hexamethylene diisocyanate, alicyclic polyisocyanates such as isophorone diisocyanate and hydrogenated diphenylmethane diisocyanate, and the like.
  • aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate
  • aliphatic polyisocyanates such as hexamethylene diisocyanate
  • alicyclic polyisocyanates such as isophorone diisocyanate and hydrogenated diphenylmethane diisocyanate
  • biuret bodies, isocyanurate bodies, and adduct bodies that are a reaction product with low molecular active hydrogen-containing compounds such as ethylene glyco
  • the content of the crosslinking agent is preferably 0.01 parts by mass or more as a lower limit with respect to 100 parts by mass of the acrylic polymer or the polymer into which the energy ray curable group is introduced, and particularly 0.02 parts by mass. Part or more. Further, the content of the crosslinking agent is preferably 20 parts by mass or less as an upper limit, particularly 10 parts by mass or less, with respect to 100 parts by mass of the acrylic polymer or the polymer into which the energy ray curable group is introduced. It is preferable that When the content of the crosslinking agent is within the above range, the degree of crosslinking of the obtained pressure-sensitive adhesive layer can be controlled within a preferable range.
  • the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer in this embodiment is a photopolymerization initiator, a coloring material such as a dye or a pigment, an antistatic agent, a tackifier, You may contain various additives, such as a flame retardant and a filler.
  • photopolymerization initiators examples include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds, and photosensitizers such as amines and quinones.
  • 1-hydroxycyclohexyl phenyl ketone benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like.
  • photoinitiators may be used individually by 1 type, or may use 2 or more types together. When ultraviolet rays are used as energy rays, the irradiation time and irradiation amount can be reduced by blending a photopolymerization initiator.
  • the lower limit of the thickness of the pressure-sensitive adhesive layer in this embodiment is preferably 1 ⁇ m or more, particularly preferably 2 ⁇ m or more, and more preferably 3 ⁇ m or more. . Further, the thickness of the pressure-sensitive adhesive layer in this embodiment is preferably 50 ⁇ m or less, particularly preferably 40 ⁇ m or less, and further preferably 30 ⁇ m or less. Since the thickness of the pressure-sensitive adhesive layer is in the above range, a desired adhesive force can be effectively obtained. Moreover, when the pressure-sensitive adhesive layer is formed from an energy ray-curable pressure-sensitive adhesive, the energy ray-curable pressure-sensitive adhesive is easily cured when the upper limit value of the thickness of the pressure-sensitive adhesive layer is not more than the above.
  • peeling film A peeling film protects an adhesive layer until a semiconductor processed sheet is used, and does not necessarily need to be.
  • the configuration of the release film is arbitrary, and examples thereof include a plastic film having peelability with respect to the pressure-sensitive adhesive layer, and a film obtained by peeling the plastic film with a release agent or the like.
  • Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
  • the release agent silicone-based, fluorine-based, rubber-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable.
  • the thickness of the release film is not particularly limited, but is usually about 20 to 250 ⁇ m.
  • the semiconductor processed sheet is provided with a primer layer for improving the adhesion between the base film and the pressure-sensitive adhesive layer between the base film and the pressure-sensitive adhesive layer. It may be.
  • the semiconductor processed sheet may be provided with an intermediate layer between the base film and the pressure-sensitive adhesive layer.
  • an intermediate layer what has the function to provide desired elasticity and the followable
  • Such an intermediate layer is made of, for example, a material containing urethane acrylate or the like.
  • the semiconductor processed sheet may be provided with an adhesive layer located in the outermost layer.
  • the adhesive layer preferably exhibits tackiness by a trigger such as heating.
  • a trigger such as heating.
  • Such an adhesive layer can be used, for example, as an adhesive in die bonding.
  • the semiconductor processed sheet may be provided with a protective film forming film located in the outermost layer.
  • the protective film-forming film can be used as a protective film for protecting the back surface of the semiconductor chip, particularly when a semiconductor device is manufactured by a mounting method called a face-down method.
  • the semiconductor processing sheet which concerns on this embodiment can be manufactured similarly to the conventional semiconductor processing sheet.
  • the detailed method is particularly limited as long as the adhesive layer formed from the above-mentioned adhesive composition can be laminated on one surface of the substrate.
  • a pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer and, if desired, a coating liquid further containing a solvent or a dispersion medium are prepared, and a die coater, a curtain coater, and a spray are formed on one surface of the substrate.
  • the pressure-sensitive adhesive layer can be formed by applying the coating solution with a coater, slit coater, knife coater or the like to form a coating film and drying the coating film.
  • the properties of the coating liquid are not particularly limited as long as it can be applied, and may contain a component for forming the pressure-sensitive adhesive layer as a solute or a dispersoid.
  • a coating liquid is formed on the release surface of the release sheet to form a coating film, which is dried to form a pressure-sensitive adhesive layer and the release sheet.
  • the laminated body which consists of a semiconductor process sheet
  • the release sheet in this laminate may be peeled off as a process material, or the adhesive layer may be protected until being attached to an adherend such as a semiconductor chip or a semiconductor wafer.
  • the energy ray non-curable polymer in the coating film can be changed by changing the drying conditions (temperature, time, etc.) or by separately providing a heat treatment. What is necessary is just to advance the crosslinking reaction of an energy-beam curable polymer and a crosslinking agent, and to form a crosslinked structure with a desired density in an adhesive layer.
  • the thickness of the semiconductor processed sheet according to the present embodiment is not particularly limited, but is preferably 50 ⁇ m or more, and particularly preferably 80 ⁇ m or more. Further, the thickness is preferably 200 ⁇ m or less, and particularly preferably 160 ⁇ m or less.
  • the difference between the maximum value and the minimum value of the thickness in one semiconductor processed sheet having a size of 210 mm ⁇ 297 mm is preferably 7 ⁇ m or less, more preferably 5 ⁇ m or less, and 3 ⁇ m or less. It is particularly preferred.
  • the difference between the maximum value and the minimum value of the thickness can be regarded as an index of variation in the thickness of the semiconductor processed sheet. If the difference between the maximum value and the minimum value of the thickness is large, the adherend is attached. When it is attached, pressure concentrates on the thick part of the semiconductor processed sheet, cracking may occur when the adherend is stuck or dicing, or chips may be scattered, but the difference between the maximum value and the minimum value above. If it is 7 micrometers or less, this pressure concentration, the crack of the to-be-adhered body, and chip
  • the upper limit of the adhesive strength of the semiconductor processed sheet according to this embodiment to the silicon mirror wafer is preferably 20000 mN / 25 mm or less, particularly preferably 18000 mN / 25 mm or less, and more preferably 16000 mN / 25 mm or less. Is preferred. Thereby, a semiconductor processing sheet can be easily peeled from an adherend.
  • the lower limit value of the adhesive force is preferably 100 mN / 25 mm or more, particularly preferably 150 mN / 25 mm or more, and more preferably 200 mN / 25 mm or more. Thereby, it is possible to suppress unintended peeling during work on the adherend to which the semiconductor processed sheet is stuck.
  • the adhesive strength in this specification is measured by a 180 ° peeling test in accordance with JIS Z0237: 2000 using a silicon mirror wafer as an adherend, and the adhesive layer is formed from an energy ray curable adhesive. In such a case, it is the adhesive strength before energy beam irradiation.
  • the adhesive strength after energy beam irradiation is 800 mN / 25 mm or less as an upper limit. In particular, it is preferably 600 mN / 25 mm or less, and more preferably 500 mN / 25 mm or less. Thereby, a semiconductor processing sheet can be easily peeled from an adherend.
  • the lower limit value of the post-irradiation adhesive strength is not particularly limited, but is usually preferably 5 mN / 25 mm or more, particularly preferably 10 mN / 25 mm or more, and more preferably 20 mN / 25 mm or more. preferable.
  • the post-irradiation adhesive strength in this specification is a value measured by a 180 ° peeling test in accordance with JIS Z0237: 2000 using a silicon mirror wafer as an adherend.
  • the semiconductor processing sheet according to the present embodiment can be used when supporting and dicing a semiconductor wafer, and further when picking up individual semiconductor chips.
  • the semiconductor processed sheet according to the present embodiment can be used as a dicing sheet.
  • the semiconductor wafer can be separated into semiconductor chips by affixing the semiconductor wafer after back grinding to the semiconductor processing sheet and dicing on the semiconductor processing sheet. Thereafter, a plurality of semiconductor chips can be individually picked up from the semiconductor processing sheet.
  • the semiconductor processed sheet according to the present embodiment can also be used in a tip dicing method in which a dicing process is performed before grinding the back surface of a semiconductor wafer, or a stealth dicing method in which a crushed layer is provided by a laser.
  • a tip dicing method for example, after the dicing, an adhesive sheet for back surface grinding may be attached to the wafer surface, and the semiconductor wafer processing sheet according to the present embodiment may be peeled off.
  • the semiconductor wafer processing sheet according to this embodiment is attached to the back surface of the semiconductor wafer, and the semiconductor wafer processing sheet After performing stealth dicing over the semiconductor wafer processing sheet, the semiconductor wafer processing sheet may be peeled off.
  • the semiconductor processed sheet according to the present embodiment is not used for dicing but can be used only for picking up a semiconductor chip after dicing. In this case, after moving a plurality of semiconductor chips from the dicing sheet to the semiconductor processing sheet, the semiconductor chips can be picked up from the semiconductor processing sheet. Note that the movement from the dicing sheet to the semiconductor processed sheet may be performed by transfer or may be performed by pickup.
  • the semiconductor processed sheet according to the present embodiment can also be used as a dicing / die bonding sheet.
  • the semiconductor processed sheet preferably includes the adhesive layer described above, and further suppresses the transfer of the additive to the adhesive layer between the adhesive layer and the adhesive layer described above. It is preferable to provide a barrier layer for the purpose.
  • the adhesive layer is simultaneously cut along with the semiconductor wafer, and the semiconductor chip to which the adhesive is attached can be obtained by picking up the separated semiconductor chip.
  • the pressure-sensitive adhesive layer in the dicing die-bonding sheet is a pressure-sensitive adhesive that combines a pressure-sensitive adhesive for fixing an adherend such as a semiconductor wafer and a die-bonding adhesive that adheres to a semiconductor chip and has a die-bonding function.
  • the said adhesive layer in this embodiment does not have a function as such an adhesive layer.
  • the semiconductor processed sheet according to the present embodiment can also be used as a protective film forming sheet for forming a protective film on a semiconductor wafer.
  • the semiconductor processed sheet further includes a protective film forming film on the outermost layer.
  • the protective film forming film is cut simultaneously with the semiconductor wafer during dicing. Then, by picking up the separated semiconductor chip, a semiconductor chip having a protective film on the back surface can be obtained.
  • Method for Using Semiconductor Processed Sheet As an example of a method for using the semiconductor processed sheet according to the present embodiment, a method for using the semiconductor processed sheet as a dicing sheet will be described below.
  • the semiconductor processed sheet according to the present embodiment attaches the surface on the pressure-sensitive adhesive layer side (that is, the surface opposite to the base film of the pressure-sensitive adhesive layer) to the semiconductor wafer.
  • a release film is laminated on the surface of the semiconductor processing sheet on the pressure-sensitive adhesive layer side, the release film is peeled off to expose the surface on the pressure-sensitive adhesive layer side, and the surface is attached to the bonding surface of the semiconductor wafer.
  • the peripheral edge of the semiconductor processed sheet is usually attached to an annular jig called a ring frame for conveyance and fixation to an apparatus by an adhesive layer provided at that portion.
  • a dicing process is performed to obtain a plurality of chips from the semiconductor wafer. Furthermore, when the pressure-sensitive adhesive layer is formed of an energy ray-curable pressure-sensitive adhesive, energy beam irradiation is performed from the base film side of the semiconductor processed sheet after the dicing step, thereby reducing the pressure-sensitive adhesive layer.
  • an expanding process for extending the semiconductor processed sheet in the plane direction is performed.
  • the degree of extension may be set as appropriate in consideration of the distance that the chips arranged in close proximity should have, the tensile strength of the base film, and the like. In addition, you may perform an expanding process before energy beam irradiation.
  • the chip on the adhesive layer is picked up.
  • the pickup is performed by general means such as a suction collet.
  • the semiconductor processed sheet according to the present embodiment exhibits sufficient flexibility while using a substitute for alkyl phthalate as a plasticizer contained in the base film, it has excellent expandability, and the chips are spaced apart in the expanding process. The chip can be easily collected.
  • the base film contains terephthalic acid ester, adipic acid ester, and barium stearate, the pick-up performance of the semiconductor processed sheet is improved and the deterioration of the pick-up performance over time is suppressed. Furthermore, generation
  • the picked-up chip is used for the next process such as a transport process.
  • base material 1 Polyvinyl chloride resin (average polymerization degree: 780, weight average molecular weight: 40,000, Tg: 82 ° C.) 100 parts by mass (solid content conversion value; the same shall apply hereinafter), 15 parts by mass of di (2-ethylhexyl) terephthalate, After mixing 14 parts by weight of di (2-ethylhexyl) adipate and 1 part by weight of barium stearate with a Henschel mixer, the roll temperature was set to 180 ° C. A vinyl resin substrate was obtained.
  • base material 1 Polyvinyl chloride resin (average polymerization degree: 780, weight average molecular weight: 40,000, Tg: 82 ° C.) 100 parts by mass (solid content conversion value; the same shall apply hereinafter), 15 parts by mass of di (2-ethylhexyl) terephthalate, After mixing 14 parts by weight of di (2-ethylhexyl) adipate and 1 part by weight
  • Base materials 2 to 4 A vinyl chloride resin base material was obtained in the same manner as the base material 1 except that the additive composition was changed as shown in Table 1.
  • pressure-sensitive adhesive 1 85 parts by mass of butyl acrylate, 10 parts by mass of acrylonitrile, and 5 parts by mass of acrylic acid were copolymerized to obtain an acrylic copolymer (weight average molecular weight: 700,000, glass transition temperature Tg: ⁇ 44 ° C.).
  • Adhesive 2-6 A coating solution for the pressure-sensitive adhesive composition was obtained in the same manner as pressure-sensitive adhesive 1 except that the monomer ratio in the acrylic copolymer and the formulation of the additive in the pressure-sensitive adhesive composition were changed as shown in Table 2.
  • Example 1 Production of semiconductor processed sheet (Example 1)
  • the coating solution of the adhesive composition (adhesive 1) is applied with a die coater and dried at 100 ° C. for 2 minutes to form an adhesive layer having a thickness of 10 ⁇ m, and consists of a release film and an adhesive layer A laminate was obtained.
  • the adhesive layer side surface of the laminate is attached to one surface of the vinyl chloride resin base material (base material 1, thickness: 100 ⁇ m) obtained in (1) above, A semiconductor processed sheet composed of a substrate and a pressure-sensitive adhesive layer was obtained in a state where a release film was laminated on the surface of the pressure-sensitive adhesive layer opposite to the base material.
  • Examples 2 to 6, Comparative Examples 1 to 3 A semiconductor processed sheet was obtained in the same manner as in Example 1 except that the combination of the base material and the adhesive was changed as shown in Table 3.
  • the processed semiconductor sheets produced in the examples were excellent in expandability, good in pick-up properties, and their change with time was suppressed. Moreover, generation
  • the semiconductor processed sheet according to the present invention is suitably used, for example, in a semiconductor wafer processing step, particularly in a processing step having an expanding step.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un film de matériau de base pour feuille d'usinage de semi-conducteur qui est mis en œuvre dans une feuille d'usinage de semi-conducteur équipée d'un film de matériau de base, et d'une couche d'agent adhésif stratifié sur au moins un côté face du film de matériau de base. Ce film de matériau de base pour feuille d'usinage de semi-conducteur est caractéristique en ce qu'il contient une résine à base de chlorure de vinyle, et comprend un ester téréphtalique, un ester adipique et un stéarate de baryum. En outre, l'invention concerne une feuille d'usinage de semi-conducteur qui est équipée de ce film de matériau de base. Le film de matériau de base pour feuille d'usinage de semi-conducteur et la feuille d'usinage de semi-conducteur de l'invention présentent des propriétés d'extension suffisantes tout en mettant en œuvre une matière de substitution d'ester alkylique phtalique en tant que plastifiant, possèdent des performances de capture satisfaisantes, permettent d'inhiber un abaissement de ces performances de capture au cours du temps, et permettent également d'inhiber l'apparition de résidus lors de leur pelage vis-à-vis d'un support.
PCT/JP2017/002513 2016-02-29 2017-01-25 Film de matériau de base pour feuille d'usinage de semi-conducteur, et feuille d'usinage de semi-conducteur WO2017150017A1 (fr)

Priority Applications (3)

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KR1020187015314A KR102594219B1 (ko) 2016-02-29 2017-01-25 반도체 가공 시트용 기재 필름 및 반도체 가공 시트
CN201780012808.3A CN108701598B (zh) 2016-02-29 2017-01-25 半导体加工片用基材膜以及半导体加工片
JP2017564933A JP6343725B2 (ja) 2016-02-29 2017-01-25 半導体加工シート用基材フィルムおよび半導体加工シート

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JP2016038292 2016-02-29
JP2016-038292 2016-02-29

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JP (1) JP6343725B2 (fr)
KR (1) KR102594219B1 (fr)
CN (1) CN108701598B (fr)
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WO (1) WO2017150017A1 (fr)

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CN113508167A (zh) * 2019-03-07 2021-10-15 琳得科株式会社 固晶片、及带膜状粘合剂的半导体芯片的制造方法
EP4019245A4 (fr) * 2019-08-22 2022-12-21 Showa Denko Materials Co., Ltd. Film de traitement de composant électronique et procédé de traitement de composant électronique

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JPH07145359A (ja) * 1993-11-25 1995-06-06 Sekisui Chem Co Ltd 装飾用粘着シート
JP2009504851A (ja) * 2005-08-12 2009-02-05 イーストマン ケミカル カンパニー ポリ塩化ビニル組成物
WO2013080979A1 (fr) * 2011-12-02 2013-06-06 電気化学工業株式会社 Feuille adhésive et procédé de production d'un composant électronique à l'aide de la feuille adhésive

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CN1865324B (zh) * 2006-06-09 2010-12-08 东营天元塑业有限公司 聚氯乙烯耐低温、抗老化盐膜
JP2010260893A (ja) 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP2011057972A (ja) 2009-08-12 2011-03-24 Mitsubishi Plastics Inc 食品包装用フィルム

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JPH07145359A (ja) * 1993-11-25 1995-06-06 Sekisui Chem Co Ltd 装飾用粘着シート
JP2009504851A (ja) * 2005-08-12 2009-02-05 イーストマン ケミカル カンパニー ポリ塩化ビニル組成物
WO2013080979A1 (fr) * 2011-12-02 2013-06-06 電気化学工業株式会社 Feuille adhésive et procédé de production d'un composant électronique à l'aide de la feuille adhésive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113508167A (zh) * 2019-03-07 2021-10-15 琳得科株式会社 固晶片、及带膜状粘合剂的半导体芯片的制造方法
CN113508167B (zh) * 2019-03-07 2023-08-18 琳得科株式会社 固晶片、及带膜状粘合剂的半导体芯片的制造方法
EP4019245A4 (fr) * 2019-08-22 2022-12-21 Showa Denko Materials Co., Ltd. Film de traitement de composant électronique et procédé de traitement de composant électronique

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KR20180118598A (ko) 2018-10-31
KR102594219B1 (ko) 2023-10-25
JP6343725B2 (ja) 2018-06-13
TWI713692B (zh) 2020-12-21
TW201733805A (zh) 2017-10-01
JPWO2017150017A1 (ja) 2018-05-24
CN108701598A (zh) 2018-10-23
CN108701598B (zh) 2022-10-28

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