WO2017148434A1 - 用于镜筒定位的微机电系统装置 - Google Patents

用于镜筒定位的微机电系统装置 Download PDF

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Publication number
WO2017148434A1
WO2017148434A1 PCT/CN2017/075568 CN2017075568W WO2017148434A1 WO 2017148434 A1 WO2017148434 A1 WO 2017148434A1 CN 2017075568 W CN2017075568 W CN 2017075568W WO 2017148434 A1 WO2017148434 A1 WO 2017148434A1
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WIPO (PCT)
Prior art keywords
micro
lens barrel
barrel
microactuators
camera module
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PCT/CN2017/075568
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English (en)
French (fr)
Inventor
张玉文
林成义
陈振宇
刘义强
朱传贵
Original Assignee
宁波舜宇光电信息有限公司
南洋理工大学
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Application filed by 宁波舜宇光电信息有限公司, 南洋理工大学 filed Critical 宁波舜宇光电信息有限公司
Priority to CN201780014709.9A priority Critical patent/CN108780206B/zh
Publication of WO2017148434A1 publication Critical patent/WO2017148434A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/008—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for characterised by the actuating element
    • F03G7/012—Electro-chemical actuators
    • F03G7/0121—Electroactive polymers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/061—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
    • F03G7/0612—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using polymers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism

Definitions

  • the invention relates to a camera module, wherein the camera module is usually mounted on a smart device camera, wherein a lens barrel is positioned in a camera module to obtain high quality images in image acquisition such as photography and videography.
  • the present invention relates to a thermally driven micro-actuator that is capable of autofocusing and that prevents hand shake from affecting the smart device camera module.
  • Autofocus is often applied to cameras on the market. It uses a linear actuator to position some of the lenses within a camera to move the focus of these lenses to an image sensor. If the focus of these lenses is not on the surface of the image sensor, the image will be blurred. Due to the miniaturization of linear drives, this technology is difficult to apply to smartphone camera modules.
  • VCM Voice coil motors
  • MEMS microelectromechanical systems
  • VCM Voice coil motors
  • MEMS microelectromechanical systems
  • VCM is a conventional driver for lens barrel positioning in an autofocus camera module.
  • VCM is often used for lens barrel positioning of cell phone camera modules.
  • VCM has also been used to provide anti-shake function for mobile phone camera.
  • the lens barrel is fixed by a spring.
  • the spring creates an elbow to the driving action of the VCM to control positioning. Since the applied spring is soft, the barrel is easily tilted and makes a sound during operation. This will result in a bad edge image and a longer focus time.
  • An electromagnetic drive unit is disclosed in U.S. Patent No. 6,064,153 and U.S. Patent No. 8,849,106.
  • the electromagnetic driving device is characterized in that a lens unit is held by a movable member, wherein a driving coil wound around the Z-axis is disposed on an outer peripheral side of the movable member, and a coil assembly for realizing the swing is mounted on the An inner peripheral side of the drive coil is as shown in FIG. 1A.
  • the device provides a compact lens drive.
  • the lens driver features built-in autofocus drive and anti-shake. As shown in Fig. 1B, the same effect can be achieved by arranging the coil assembly to swing on the inner peripheral side of the drive coil.
  • each side of the drive coil generates a Lorentz force F L toward the Z positive direction.
  • a clockwise current opposite the direction indicated can be applied to the drive coil to move the lens retaining element in the negative Z-axis direction. This movement in the Z-axis direction facilitates the autofocus function.
  • the above invention is capable of providing an autofocus function and maintaining the stability of an optical image
  • the complicated structure and magnetic properties of the coil are its main disadvantages.
  • the fate of VCM will soon be transformed in the face of the strict requirements of high-precision fast focusing, low power consumption and thin appearance of the next generation of smartphones.
  • some new technologies such as MEMS, liquid lenses, and liquid crystal lenses have been developed.
  • An electrostatic driver (Invensas) is used to drive a single lens of an autofocus module.
  • electrostatic MEMS drivers are used as lens drivers, which have the advantages of being small, energy efficient, and suitable for portable devices.
  • the hardness of the electrostatic MEMS driver is low and the resulting force is small, the electrostatic MEMS driver can only drive a single lighter lens, but not the entire lens barrel with multiple optical lenses.
  • the adoption of this MEMS autofocus requires redesigning the current optics for optimal performance. It is not possible to directly replace the VCM that moves the entire lens barrel. In other words, since the force generated by the electrostatic actuator is small, the electrostatic actuator is limited to driving a single lens. The adoption of this technology will drive the redesign of current optical devices; therefore, its penetration rate is low.
  • the present invention provides an electrothermally driven MEMS actuator that replaces the VCM as a barrel driver without major variations to existing optics.
  • the novelty of the present invention resides in the use of a thermal bimorph to construct a system that can quickly and accurately position a lens barrel to a smart device, such as an autofocus camera module of a cell phone.
  • VCM is applied to a mobile phone camera module to move a lens barrel to achieve auto focus positioning.
  • the lens barrel is fixed by a spring.
  • the spring biases the VCM drive for position control. Since the spring is soft, the lens barrel is easily tilted and makes a sound during operation. This will result in a bad edge image and a longer focus time.
  • the thermal MEMS positioning device of the present invention has strong mechanical strength, so that it is possible to avoid sounding during the positioning of the lens barrel.
  • the linear motion at this stage does not cause any axis deviation and avoids tilting the lens barrel for better image edge focusing.
  • An electrostatic driver (Invensas) is used to drive a single lens (typically 40 mg) of an autofocus camera module for fast, precise positioning.
  • an electrostatic actuator is limited by the driving force and stroke, so the technique is less applied and causes it to generate only a small driving force, and is not suitable for moving the entire optical lens (200 mg or more).
  • the lens barrel In addition, the electrostatic device requires complicated design of springs and hinges, and has a large number of components. The increase in design complexity leads to higher manufacturing costs. In addition, the application of this technology requires redesigning the optical lens and cannot be used in existing lenses.
  • the thermal MEMS positioning device of the present invention is a monolithic integrated circuit. It is easier to manufacture than an electrostatic actuator.
  • Thermal micro-actuators are capable of generating high thermal stresses that translate into strong driving forces.
  • the strong driving force of the output can drive
  • a lens barrel with multiple optical lenses is used instead of a single lens.
  • the rigidity of the device also minimizes the noise during positioning of the lens barrel.
  • the present invention is capable of controlling the positioning of up to three axes of the lens barrel depending on the structure to which it is applied.
  • the present invention can be applied to existing optical devices of a conventional camera module as a simple alternative to VCM. Likewise, active correction of the lens barrel tilt is possible compared to the VCM, depending on the control configuration used.
  • an advantage of the present invention is to provide a camera module for positioning a lens barrel therein to obtain higher quality photographic and camera images.
  • the present invention relates to a thermal micro-driver that enables autofocusing of a smart device, such as a camera module of a cell phone, and prevents hand shake.
  • Another advantage of the present invention is to provide a thermal micro-driver in which the thermal micro-driver can provide a large driving force and meet the anti-shake requirement when the lens barrel is positioned on a smart phone camera module, wherein the thermal micro-driver It can be set to achieve up to three-axis positioning control without depending on environmental issues.
  • Another advantage of the present invention is to provide a MEMS in which the camera module has fewer structural components than the VCM driven camera module.
  • Another advantage of the present invention is to provide a MEMS thermal micro-driver that provides better image/image quality through precise driving.
  • a portable electronic device camera module includes a base, a lens barrel and a lens barrel positioning device.
  • the barrel positioning device includes at least two micro-actuators and a control unit.
  • the microactuators are operatively coupled between the base and the barrel and radially extend the microactuators relative to the barrel, wherein each microactuator is bendable when heated.
  • each micro-actuator can produce an out-of-plane bend when heated.
  • micro-actuators are disposed at the four corners of the base so as to be simultaneously bent to negatively drive the circular base toward the Z-axis, and the circular base drives the entire carrier and the mirror The cartridge moves down to achieve autofocus.
  • the control unit includes at least one heating circuit.
  • the heating circuit is operatively coupled to the microactuators to controllably provide thermal energy to each of the microactuators, wherein each of the microactuators is correspondingly curved to move the lens barrel relative to the base to control the lens barrel Three-axis positioning.
  • the present invention also provides a camera module manufacturing method, which includes the following steps:
  • a set of micro-actuators is provided, wherein each micro-actuator is bendable under the action of thermal energy.
  • each of the microactuators Controllably providing thermal energy generated by a heating circuit to each of the microactuators, wherein each of the microactuators is correspondingly curved to drive the lens barrel to move relative to the base, thereby controlling the three-axis positioning of the lens barrel.
  • FIG. 1A to 1D illustrate an electromagnetic driving apparatus according to the prior art, wherein FIG. 1A illustrates a coil assembly for performing swinging (providing an anti-shake function) mounted in a driving coil (providing an autofocus function)
  • FIG. 1B illustrates the coil assembly swinging on the inner peripheral side of the drive coil
  • FIG. 1C is a perspective view showing the relationship between the coil assembly and a permanent magnet assembly for achieving swing
  • the current I D flowing counterclockwise in the drive coil, the Lorentz force F L toward the Z-axis positive direction, the flow direction of the current in the coil assembly (R forward swing) of the anti-shake device, and the action are illustrated.
  • the Lorentz force of the drive coil is illustrated.
  • FIG. 2 illustrates a MEMS system in which a MEMS is mounted with a lens barrel in accordance with a preferred embodiment of the present invention.
  • FIG. 3 is a perspective view of the MEMS system in a state in which the lens barrel is not mounted, in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 4 is a side elevational view of the MEMS system in accordance with the above-described preferred embodiment of the present invention, illustrating movement of a lens barrel along the Z-axis.
  • Figure 5 illustrates the movement of the lens barrel when a thermal MEMS actuator is powered, in accordance with the above-described preferred embodiment of the present invention.
  • Figure 6 is a perspective view of a thermal micro-actuator in accordance with the above-described preferred embodiment of the present invention.
  • Figure 7 is a perspective view of a microfin according to the above-described preferred embodiment of the present invention, illustrating a braided microfin with a polymer filled gap.
  • Figure 8 illustrates a micro-heater in accordance with the above-described preferred embodiment of the present invention, wherein the micro-heater is positioned on top of the micro-fin.
  • Figure 9 is a braided skeleton in accordance with the above-described preferred embodiment of the present invention, wherein the braided skeleton has a gap for filling the polymer.
  • FIGS 10A through 10D illustrate different designs of the microfins in accordance with the above-described preferred embodiments of the present invention.
  • Figure 11 illustrates the bending motion of the thermal micro-actuator in accordance with the above-described preferred embodiment of the present invention.
  • Figure 12 is a perspective view of the micro-heater on the thermal micro-actuator in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 13 illustrates an integrated heating circuit in accordance with the above-described preferred embodiment of the present invention.
  • Figure 14 illustrates the central position (at voltage zero) of the lens barrel in accordance with the above-described preferred embodiment of the present invention, wherein the lens barrel floats as the ambient temperature changes.
  • Figure 15 illustrates an ambient temperature independent fixed reference point for obtaining the lens barrel by preheating in accordance with the above preferred embodiment of the present invention.
  • 16 is a perspective view of a differential system having two MEMS devices applied to the lens barrel in accordance with the above-described preferred embodiment of the present invention.
  • Figure 17 is a side elevational view of two MEMS devices for the lens barrel in accordance with the above-described preferred embodiment of the present invention.
  • Figure 18 illustrates the lens barrel between the two MEMS devices in accordance with the above-described preferred embodiment of the present invention, wherein the relative arrangement of the two MEMS devices causes the lens barrel to not move with changes in ambient temperature.
  • Figure 19 illustrates the energy supply of the MEMS tip and the low end to move the lens barrel in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 20 is a perspective view of a MEMS system having a lens barrel in accordance with an alternative embodiment of the above-described preferred embodiment of the present invention.
  • FIG. 21 is a perspective view of the MEMS system without the lens barrel of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention.
  • Figure 22 illustrates an independent microdrive module of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention.
  • Figure 23 illustrates an alternative micro-drive module of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention supporting the lens barrel through a micro-driver without the need for any frame.
  • Figure 24 illustrates the stand-alone micro-drive module of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention, wherein the stand-alone micro-drive module is disposed in a PCB circuit to provide control.
  • FIG. 25 illustrates the mounting of the lens barrel on the thermal micro-driver of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention, wherein the thermal micro-driver is secured to the PCB.
  • Figure 26 illustrates a synchronous control circuit of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention.
  • Figure 27 is a circuit diagram of the synchronous control circuit of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention.
  • Figure 28 illustrates a separate, independent mobile control circuit of the alternative embodiment in accordance with the above-described preferred embodiment of the present invention.
  • Figure 29 is a circuit diagram showing the separate independent movement control of the alternative embodiment of the above preferred embodiment of the present invention.
  • Figure 30 illustrates the control of the Z-axis and tilt of the lens barrel in accordance with this alternative embodiment of the above-described preferred embodiment of the present invention. Control method.
  • Figure 31 illustrates the camera module being mounted in a handset for autofocusing in accordance with the above-described preferred embodiment of the present invention.
  • Figure 32 illustrates that the operation of these microactuators in accordance with the above-described preferred embodiments of the present invention are separately controlled to rotate the lens barrel to achieve anti-shake along different axes.
  • Figure 33 illustrates the control of the lens barrel by selectively activating at least one micro-driver to rotate the lens barrel in accordance with the above-described preferred embodiment of the present invention.
  • Figure 34 illustrates a manufacturing process of the micro-driver in accordance with the above-described preferred embodiment of the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • the present invention is applicable to microelectromechanical systems (MEMS) because of its small size and fast, precise positioning. In contrast, conventional designs have driving and travel limitations that are rarely used.
  • MEMS microelectromechanical systems
  • the system of the present invention utilizes a thermal micro-driver to position the lens barrel in a handset camera module.
  • the hot micro-driver can provide a larger driving force and a longer stroke to meet the needs of the camera module.
  • the system can be configured to achieve up to three-axis (XYZ) positioning control.
  • the present invention also discloses a method of obtaining a thermal drive system in which the thermal drive system is independent of ambient temperature.
  • a camera module in accordance with the present invention is mounted to a portable electronic device, such as a smart phone, to provide the camera module with an auto focus function.
  • a portable electronic device such as a smart phone
  • the present invention can be applied to different portable electronic devices, such as a notebook computer or a tablet computer.
  • FIGs 2 to 4 a preferred implementation in accordance with the present invention
  • a camera module of the example is disclosed.
  • the camera module includes a base 10, a lens barrel 20 and a lens barrel positioning device 30.
  • the base 10 is adapted to be mounted to a portable electronic device.
  • the barrel 20 supports at least one optical lens therein and is adapted to move along the Z axis.
  • the barrel positioning device 30 is provided for selectively adjusting the position of the barrel 20 to provide an autofocus function.
  • the barrel positioning device 30 includes at least two micro-actuators 31 and a control unit 32.
  • the microactuators 31 are operatively coupled between the base 10 and the barrel 20 and are positioned such that the microactuators 31 extend radially from the barrel 20, wherein each microdrive 31 is configured to Bent by heat.
  • the control unit 32 includes at least one heating circuit 321 .
  • the heating circuit 321 is operatively coupled to the micro-actuators 31 to controllably provide thermal energy to each micro-driver, wherein each micro-driver reacts to thermal energy applied thereto for corresponding bending, thereby
  • the base 10 moves the lens barrel to control the three-axis positioning of the lens barrel 20.
  • the present invention is arranged such that the base 10 includes a bracket 11 and a step 12 for fixing the barrel 20, a heating unit of the heating circuit 321, and the thermal microactuator 31 (thermal bimorph) ),As shown in Figure 3.
  • the bracket 11 is a frame having four opposing corners. Specifically, the bracket 11 has a cavity 111. Preferably, the frame cavity 111 is formed at a central portion of the bracket 11. Accordingly, at least one optical lens is mounted to the lens barrel 20. Preferably, the optical lens can be securely secured within the barrel 20 such that a beam of light can pass through the barrel 20 and through the optical lens therein.
  • micro-actuators 31 are used to replace the voice coil motor (VCM) that is widely used in the autofocus of smartphone camera modules.
  • VCM voice coil motor
  • a series of analytical designs and experimental validations are planned to be planned to optimize the design of the drive that provides autofocus.
  • the technical prototype of the MEMS driver is implemented in SU8 lithography and deep silicon etching.
  • micro-actuators 31 are symmetrically disposed around the lens barrel 20. According to one embodiment, four microactuators 31 are disposed at the four corners of the bracket 11. In other words, according to this embodiment, the thermal unimorphs 31 are preferably disposed at the four corners of the bracket 11 and surround the periphery of the frame cavity 111, as shown in FIG.
  • the barrel 20 is mounted to the step 12 of the base 10.
  • the lens barrel 20 is moved together with the thermal micro-actuators 31, wherein the thermal micro-actuators 31 are bent out of plane when thermally activated by resistance, as shown in FIG.
  • the rigid support 11 forming the susceptor 10 is made of single crystal silicon as shown in Figs. 2 and 3.
  • the holder 11 functions as a heat sink for these thermo microactuators 31 and has a function as a support for the device according to the present invention.
  • the bracket 11 is the basis for the interconnection of the micro-actuators 31 and the overall circuit of the control unit 32.
  • the center step 12 is disposed in the frame cavity 111 and is coupled to the bracket 11 via the micro-actuators 31. When thermal energy is supplied to these microactuators 31, the step 12 moves (out of plane).
  • the barrel 20 is mounted to the central step 12 for positioning.
  • the integrated circuit of control unit 32 forms a resistive heater to provide the thermal energy required for operation of these thermal microactuators 31.
  • the overall circuit of the control unit 32 can connect all the micro-drivers 31 to the device in one circuit, therefore, It is possible to realize that all the micro drivers 31 are simultaneously driven by one input.
  • the micro-actuators 31 are controllably bent to pass a photosensitive light passing through the step 12 and along a photosensitive chip of the holder 11 disposed in the camera module.
  • the path moves the lens barrel 20 within the cavity 11.
  • the positioning of the plurality of micro-actuators 31 is also very important. Positioning the plurality of micro-actuators 31 in a symmetrical manner can reduce axial offset motion, such as tilting, to achieve linear motion of the lens barrel 20. Preferably, three points may define a plane, and therefore, preferably, at least three micro-actuators 31 are required for proper positioning of the barrel 20. According to the preferred embodiment, the apparatus is provided with four microactuators 31, wherein the four microactuators 31 are symmetrically disposed at four opposite angles to make full use of the space, thereby making the design more compact.
  • each micro-driver 31 includes a plurality of honeycomb-shaped micro-fins 311 and a plurality of polymer thermal expansion elements 312 that are filled in a plurality of fin gaps 310. Activation of these micro-actuators 31 is achieved by electrical resistance heating of an integrated micro-heater 313.
  • the polymeric thermal expansion element 312 is a thermally expandable polymer.
  • Each micro-drive 31 further includes a back bone 314 coupled to one side of each micro-fin 311, wherein the micro-heater 313 is disposed on the other side of each micro-fin 311 to be operatively coupled to the Heating circuit 321.
  • the silicon backing 314 is bent by the polymeric thermal expansion element 312 as the polymeric thermal expansion element 312 expands the silicon fin gap 310.
  • the difference in thermal expansion between the driver backing bone 314 and the polymer component of the polymeric thermal expansion element 312 creates thermal stresses on the microactuators 31, thereby causing the microactuator to bend negatively downward along the Z axis, as shown in FIG. Show.
  • the micro-fins 311 of the braid shape are like a heat conductor between the micro-heater 313 of each micro-actuator 31 and the thermal expansion element 312.
  • Each microfin 311 further serves as a drive beam extending between the bracket 11 and the step 12.
  • the microfin 311 also has a planar confinement effect on the thermal expansion element (i.e., the thermally expandable polymer shown in Fig. 6) to concentrate the volumetric thermal expansion in the driving direction. In other words, when electrical energy is supplied, the thermal expansion element 312 will expand under the action of heat.
  • the difference in expansion between the driver back bone 314 and the polymer 312 causes the micro-actuators 31 to generate thermal stresses, thereby causing the micro-actuators 31 to bend down the Z-axis toward the susceptor 10, as shown in FIG.
  • These microactuators 31 are symmetrically arranged to counteract all of the axis offset motion, thereby moving the step 12 in a straight line, thereby minimizing the tilt of the barrel.
  • the back bone 314 to the micro fin 311 serves as a basic structure, like a rigid layer of a bilayer driver.
  • the back bone 314 has good heat conduction properties, and it connects each fin of the micro fin 311 as shown in FIG.
  • the microheater 313 extends along the meandering skeleton of the curved thermal microactuator 31.
  • the crucible skeleton has a dual function of thermally conductive medium and limiting the thermally expandable polymer of the polymeric thermal expansion element 312 that is filled in the fin gap 310.
  • the micro-actuator 31 is embodied as a thermally driven Si/Su-8 composite micro-actuator that imparts an imaging mode to a portable electronic device.
  • a carrier and the barrel 20 are connected to each other on the annular silicon step.
  • Each of the drive beams is embodied as a silicon plate SU-8 that is filled between the crucible structure and a platinum film heater.
  • the silicon wafer can effectively transfer heat to the interlayer SU-8.
  • the Si-SU-8 composite is heated by the platinum film heater by resistance heating, the Si-SU-8 drive beam can only produce out-of-plane bending, of which four Si-SU-8 Simultaneous activation of the drive beam (microactuator) allows the annular silicon step to bend in the Z-axis direction, as shown in FIG.
  • FIG. 10(A) discloses the meandering shape of the microfin 311.
  • FIG. 10(B) discloses a double-twist shape of the micro-fin 311.
  • FIG. 10(C) discloses a three-turn shape of the micro-fin 311.
  • FIG. 10(D) discloses a half-turn/semi-parallel combination structure of the micro-fin 311.
  • FIGS. 10(A) to (C) respectively disclose top views of the entire length, half length, and one-third length of the silicon germanium structure of the film heater.
  • Figure 10 (D) discloses that one half of the silicon beam is a braided structure on which the heater is placed. The other half of the silicon beam is formed by a parallel silicon plate.
  • the simulation result shows that the three-turn design with one-third length heater is directed to the entire driving beam. Provide the most balanced exclusion. If the drive beam is scaled to the FEM simulation system, it produces the largest displacement.
  • the table below illustrates the performance and/or heater length of various Si-SU-8 drive beams with different lengths. In the mask design, there are twelve designs depending on the length of the drive beam (width and thickness are fixed to 415 ⁇ m and 15 ⁇ m, respectively) and/or heater length:
  • SP width 5 ⁇ m
  • SP gap 10 ⁇ m
  • T 1 10 ⁇ m
  • T 2 5 ⁇ m
  • the integrated micro-heater 313 includes at least one conductive metal film to match the shape of the micro-fin 311 and is coupled to the micro-fin 311, wherein the conductive metal film has high impedance and High temperature stability.
  • the conductive metal film generates heat when current is passed.
  • all of the microheaters 313 are connected to a circuit of the control unit 32 for simultaneous control by the same input, as shown in FIG.
  • the microheater 313 is a platinum film heater.
  • the shape of the crucible of the microfin 311 increases its contact area with the microheater 313, thereby facilitating the supply of heat therefrom and increasing the heat conduction between the back bone 314 and the polymer thermal expansion element 312. Area to carry out heat transfer.
  • each microactuator 31 is designed to have a footprint of 9.28 mm x 9.28 mm x 0.5 mm (sheet thickness).
  • These microactuators 31 are composed of four heat driven beams.
  • the heat driven beam is coupled to a circular silicon step.
  • the circular silicon step has a diameter of 6.78 mm.
  • the step 12 and the barrel 20 are attached by the heat drive beam.
  • the circular silicon step 12 is etched to form a groove to maximize the driving in the Z-axis direction along the photosensitive path of the photosensitive chip.
  • the drive beam of each micro-actuator 31 is embodied as a braided silicon wafer SU-8 that is filled between the crucible structure and a platinum film heater.
  • the silicon wafer of the microfin 311 can efficiently transfer heat to the interlayer: the polymeric thermal expansion element 312. Due to the constraint of the silicon back bone 314, when the thermal expansion element 312 is resistively heated by the platinum film heater 313, the micro-actuators 31 can only produce out-of-plane bending. Simultaneous activation of the four microactuators 31 can cause the annular silicon step 12 to bend in the Z-axis direction, as shown in FIG. 12, thereby moving the step 12 and the entire carrier of the lens barrel 20 downward to provide an autofocus function. .
  • bendable thermal microactuators 31 such as bimetallic materials or thermal bimolecular films, can be used for such out-of-plane positioning systems.
  • a suitable drive needs to respond quickly to low battery demands. Its demand for electricity is no more than the energy input to a VCM.
  • the hot microdrive 31 is selected due to its large stroke and rapid response. Further, these micro-actuators 31 can be operated without excessive heating which is disadvantageous to the improvement of image quality.
  • SU-8 has a high coefficient of thermal expansion (50-150 ppm/°C), a Young's modulus (3 GPa), and a Poisson's ratio (0.3).
  • the ideal thermally expandable polymer used to make the hot bimorph should have a high coefficient of thermal expansion (>150 ppm/°C) and a Young's modulus (>1 GPa).
  • the polymeric thermal expansion element 312 should also be nearly incompressible (Poisson's ratio 0.49 to 0.5) to maximize thermal stress and tension in the stroke direction.
  • a typical polymer suitable for the above requirements is a silicone based resin (Corning WL-5150 photopatternable silicon).
  • these micro-actuators 31 are embodied as Si/SU-8 micro-actuators made of MEMS drivers that require six templates for fabrication, with the first and third templates being the same type of template.
  • the manufacturing method of these micro-actuators 31 includes the following steps:
  • Step 1 deposit a layer of 100 nm thick Si 3 N 4 on both sides of the SOI (Silicon On Insulator) wafer, wherein the front side Si 3 N 4 is imaged by photolithography and CF4 plasma etching. .
  • the etched area on the top side of the substrate is reserved for Si to form the drive beam structure.
  • Step 2 spraying 20 nm of Ti (titanium) on the top side of the photoresist pattern of the substrate, followed by spraying 200 nm of Pt (platinum) and 80 nm of Au (gold), wherein the final heater is obtained after removing the photoresist in the stripping process. pattern.
  • Step 3 The bonding pad area is covered with the template of Step 1 so that the Au layer on the platinum film heater is removed.
  • Step 4 The Si microstructure was fabricated by a reactive ion deep etching (DRIE) technique (the parallel plates were bent). Etching is performed on the device layer until the desired thickness is reached and etching is complete.
  • DRIE reactive ion deep etching
  • Step 5 A SU-8 resist is molded into the gap between the etched silicon microstructures to form a Si/SU-8 composite. when After the silicon microstructure is filled with SU-8, the pattern is formed by standard photolithography.
  • Step 6 A Si 3 N 4 pattern is formed on the back side of the wafer by photolithography and CF 4 plasma etching, wherein a substrate is formed by DRIE to the substrate.
  • Step 7 The buried oxide layer is etched by a wet HF etch or a CF 4 plasma etch technique to form a MEMS driver.
  • Step 8 The above-described processed substrate was baked at a temperature of 120 ° C for 1 hour on a hot plate and the drive beam was supported by mechanical division (shown by arrows in Fig. 34) to separate a single MEMS micro-actuator from the wafer.
  • each micro-actuator 31 hot bimorph
  • the center position (voltage of 0) of the positioning step of the lens barrel 20 changes as the temperature environment changes, as shown in FIG. Without a defined reference starting point, the temperature dependent offset of the step positioning causes the system to have no positioning control reference.
  • the thermal microdrive 31 can be affected by ambient temperature and thus may not be suitable for system positioning.
  • the present invention discloses two apparatus positioning methods that are independent of ambient temperature.
  • the first method is to preheat the microactuators 31 to a reference temperature point, i.e., above the operating ambient temperature. Heating beyond this reference temperature point enables positioning control to be achieved, as shown in FIG.
  • the first method is to preheat the micro-actuators 31 to the reference temperature point, wherein the reference temperature point exceeds most of the ambient temperatures applied in the prior art. Any temperature change at this reference temperature point is calibrated and then used for positioning.
  • each micro-driver 31 is preheated by the heater circuit 321 to the reference temperature point to calibrate the central position of the lens barrel 20 independent of ambient temperature changes, so that when each micro-driver 31 is used by the heater circuit 321 When heated to the above reference temperature point, the micro-actuators 31 are bent to move the lens barrel 20 from its central position.
  • the second method is based on another differential system as shown in Figures 16-18.
  • the two sets of micro-actuators 31, namely a top set of micro-actuators and a bottom set of micro-actuators, are arranged in parallel and oppositely at any ambient temperature, as shown in Figures 16 to 18, so that the lens barrel 20 is only in the two sets of relative Move when the temperature between the set microdrives is different, as shown in Figure 18.
  • the micro-actuators 31 are arranged to have a top set of micro-actuators 31 coupled to the lens barrel 20 and a bottom-bottom set micro-driver 31 coupled to the barrel 20. Therefore, the lens barrel 20 is maintained at a central position under different ambient temperature conditions.
  • the heater circuit 321 can either supply energy to the top set of micro-actuators 31 or provide energy to the bottom set of micro-actuators 31 to control the movement of the lens barrel 20, as shown in FIG.
  • the positioning of the lens barrel 20 is cancelled to be maintained at the center position, thus The lens barrel 20 is held at a central position without being affected by the ambient temperature.
  • Any change in the environment caused by the change in the top set of micro-actuators 31 is offset by the opposing forces generated by the bottom set of micro-actuators 31 (lens barrel).
  • the top set of micro-actuators 31 are extended between the top bracket 11 and the top step 12.
  • the bottom set microactuator 31 is extended between the bottom bracket 11 and the bottom step 12 as shown in FIG.
  • the top set of micro-actuators 31 and the bottom set of micro-actuators 31 are aligned with each other such that the top set of micro-drivers 31 are disposed face to face with the bottom set of micro-drivers 31. Therefore, when the top group micro-actuator 31 generates a bending motion due to a change in the ambient temperature, thereby generating a force, the force generated by the bottom group micro-actuator 31 cancels the force generated by the top group micro-actuator 31.
  • a housing is provided for receiving the top set of microdrives 31 and the bottom set of microdrives 31 therein.
  • each top or bottom set of microdrives includes at least one microdrive 31.
  • the stroke in one direction is reduced to half, the overall stroke that can be achieved is the same as that of configuring a micro-driver 31. Therefore, this two-layer or two-group structure allows the lens barrel 20 to be disposed in the middle of the entire stroke, thereby achieving fast autofocus. It is also more stable in structure.
  • the lens barrel 20 can be moved up and down to achieve autofocus.
  • the stability of the image can be achieved by activating these micro-drivers 31. Accordingly, when the selected micro-driver 31 (not all of these micro-actuators 31) is activated, the lens barrel 20 can be rotated about the same axis.
  • FIG. 20 an alternate embodiment of the above-described preferred embodiment is illustrated in which an alternative embodiment of the base 10 is illustrated.
  • the step 12 is removed.
  • the lens barrel 20 is directly disposed at the end of these micro-actuators 31 as shown in FIG.
  • the barrel 20 is attached to the mounting point by a glue/mechanical method, as shown in FIG.
  • the micro-actuators 31 extend radially from the bracket 11 to couple the peripheral wall of the lens barrel 20, thereby supporting the lens barrel 20 in the frame cavity 111 and driving the lens barrel 20.
  • the bracket 11 does not require a single integrated circuit but can be replaced by at least two base blocks 11A.
  • Each of the base blocks 11A is provided with a micro-driver 31 as shown in FIGS. 23 and 25. In other words, the bracket 11 may not be provided.
  • These micro-actuators 31 are respectively disposed on a single base block 11A. All microdrives 31 can be controlled by the same circuit with a single power supply to achieve the same effect as the base mechanism, which is primarily Z-axis positioning control.
  • the single base block 11A can also be mounted to the bracket 11, as shown in Figures 24 and 25.
  • Each microdrive 31 can be controlled by circuitry of the control unit 32, such as a printed circuit, as shown in Figures 26 and 27.
  • the lens barrel 20 can be mounted by the same method in which no step is provided, as shown in FIG.
  • Driving the micro-actuator with a single power supply can achieve the same effect as the basic structure, which is mainly the positioning control in the Z-axis direction, as shown in FIGS. 26 and 27.
  • each individual pedestal block 11A can also be controlled by a single circuit of the control unit 32, wherein each module 11A is controlled by a plurality of power sources and a microprocessor, respectively, such that the lens barrel ( The rotation around the x and y axes) enables tilting movement on the basis of the Z-axis movement, thereby performing three-axis positioning control as shown in FIG.
  • microactuators 31 are mounted to the four corners of the bracket 11 and are directly connected to the step 12 or the barrel 20, i.e., no circular silicon steps connecting the four beams are provided.
  • the camera module also has better image stability.
  • Each microdrive 31 has an elongated structure to form a beam.
  • these micro-actuators 31 with separate control beams have an auto-focus function and the image is stable.
  • micro-actuators 31 can still be activated simultaneously to complete auto-focus similar to the integrated micro-driver, as shown in Figure 2.
  • the single beam, the pair of double beams or the three beams can be controlled to be driven in such a manner that the hand shake can be compensated along different axes. If only the beams 1 and 2 of these micro-actuators 31 are used as a pair, or the beams 3 and 4 of these micro-actuators 31 are simultaneously activated as a pair, the barrel 20 is rotated about the x-x' axis.
  • the lens barrel 20 is rotatable about the y-y' axis.
  • the drive beam 2 of these microactuators 31 and the beams 4 of these microactuators 31 are necessary.
  • the drive beams 1, 2 and 3 of these micro-actuators 31 or the beams 1, 3 and 4 of these micro-actuators 31 can also simultaneously drive the barrel 20 to rotate about the u-u' axis.
  • only the drive beam 1 or 3 of these micro-actuators 31 can rotate the barrel 20 about the v-v' axis.
  • the drive beams 1, 2 and 4 of these microactuators 31 or the beams 2, 3 and 4 of these microactuators 31 can simultaneously rotate the barrel 20 about the v-v' axis.
  • a single beam of the micro-actuators 31 or a set of beams of the micro-actuators 31 can be simultaneously driven to cause the barrel 20 to perform a preset rotation.
  • the lens barrel 20 is rotatable about the x-axis.
  • rotation of the barrel 20 about other axes can be achieved by a combination of different drive beams of the top and bottom set microactuators 31.
  • the lens barrel 20 can be rotated about the y-y' axis as shown in Fig. 33(a).
  • the lens barrel 20 can be rotated about the y-y' axis as shown in Fig. 33(b).
  • the camera module has fewer structural components than the VCM driven camera module. Accordingly, the VCM-driven camera module with only the autofocus function includes twelve components. The VCM camera module with autofocus function and image stability guarantees at least 16 components. Fewer structural components make the assembly process simpler and reduce the production cost of the camera module. According to the present invention, the camera module having these micro-actuators 31 can have only 7 to 11 components.
  • the camera module includes only two support members formed by high performance nylon spray molding.
  • the top support element acts primarily as a cover to provide an anti-tilt structure on the inner side wall of the opening.
  • These microactuators 31 are disposed on the top surface of the bottom support member (base). A limiter capable of resisting vibration is integrally molded to the bottom support member.
  • Another advantage of the present invention is that precise driving results in improved image quality. Due to overshoot and oscillation, the lens driven by the VCM can only be fixed at a position 100-200 ms away from the target position. Noise can be achieved by using a self-calibrating VCM driver get over. After the sound is compensated, the VCM's fast positioning sound is small.
  • these thermal microactuators 31 are integrated with sliders and assembled into a printed circuit for performance testing. This two-stage microactuator 31 interprets accurate, fast, and silent displacement (20nm/1KHz).
  • the measured displacement of these microactuators 31 according to the invention indicates that there is no loud noise, so the four drive beams of these microactuators 31 are rigidly arranged. The great reduction in the sound makes the image quality higher and the image clearer.

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Abstract

一种微机电系统（MEMS），其利用微驱动器（31）将镜筒（20）定位于智能设备，例如手机的摄像模组。该微驱动器相对一镜筒放射状延伸，其中每一微驱动器都可以受热弯曲。控制单元（32）包括可运行地连接于该微驱动器的加热电路（321），以将热能可控制地应用于每一微驱动器，其中每一微驱动器相应弯曲，以相对一基座（10）移动该镜筒，从而控制镜筒的三轴定位。该微驱动器的操作不受环境温度变化的影响。

Description

用于镜筒定位的微机电系统装置 技术领域
本发明涉及一摄像模组，其中该摄像模组通常被安装于智能设备摄像头，其中一镜筒被定位于一摄像模组，以在诸如摄影和摄像的图像采集中获取高质量图像。尤其地，本发明涉及一热驱动微驱动器，其中该微驱动器能够实现自动对焦，并能够防止手抖对智能设备摄像模组产生影响。
背景技术
自动对焦常常被应用于市场上的相机。其利用线性驱动器将一些镜片定位于一摄像头内，以将这些镜片的焦点移动至一图像传感器。如果这些镜片的焦点不在该图像传感器的表面，将导致影像模糊。由于线性驱动装置的小型化难题，该技术很难被应用于智能手机摄像模组。
经发现，音圈马达(VCM)和微机电系统(MEMS)适于驱动可自动对焦的手机摄像模组。当前，VCM是现有用于可自动对焦摄像模组内的镜筒定位的驱动器。尤其地，VCM经常被用于手机摄像模组的镜筒定位。近些年，VCM也已经被用以提供手机拍照的防手抖功能。该镜筒被一弹簧固定。该弹簧对VCM的驱动作用产生掣肘，以控制定位。由于应用的弹簧较软，在运转过程中，该镜筒容易倾斜并且发出响声。这将导致形成坏边图像并延长对焦时间。
美国专利US8064153和US8849106公开了一电磁驱动装置。该电磁驱动装置的特点是通过一可移动元件保持一镜头单元，其中绕Z轴环绕的驱动线圈被设置于该可移动元件的一外周侧，并且一用于实现摆动的线圈组件被安装于该驱动线圈的一内周侧上，如图1A所示。通过这种构造，该装置提供一结构紧密的镜头驱动装置。该镜头驱动装置具有内置的自动对焦驱动功能和防抖动功能。如图1B所示，将线圈组件布置成在该驱动线圈的该内周侧摆动也可以达到同样的效果。
如果流经该驱动线圈的电流ID方向为逆时针方向，如图1C和图1D所示，该驱动线圈的每一侧边产生朝向Z正方向的一洛伦兹力FL。与指示方向相反的顺时针方向电流可以被施加于该驱动线圈，以使镜片保持元件朝向Z轴负方向运动。这种Z轴方向的运动有利于自动对焦功能。此外，电流在该线圈组件内流动，以产生朝向R轴正方向的另一洛伦兹力，其反过来驱动镜头，以防止R负向的抖动。
当该电流ID在该驱动线圈中逆时针方向流动时，该洛伦兹力FL的方向朝向Z轴正向，并且 电流在该线圈组件中的方向用于驱动防抖动装置R轴正方向的摆动并且该洛伦兹力作用于该驱动线圈。
尽管以上发明即能够提供自动对焦功能并保持光学影像的稳定性，线圈的复杂结构和磁性是其主要缺点。事实上，随着用户对手机和智能电子设备的摄像功能的期望的不断提升，面对下一代智能手机高精度快速对焦、低能耗和薄形外观的严格要求，VCM的命运即将被转变。以替代VCM为目标，一些新的技术，例如MEMS、液态镜片、液晶镜片已经得到发展。
也有将MEMS应用于镜片定位的先例。静电驱动器(Invensas)被用于驱动一自动对焦模块的单个镜片。当前，静电MEMS驱动器被应用为镜片驱动器，其具有小巧、节能、适用于便携装置的优点。但是，介于该静电MEMS驱动器的硬度较低，并且其产生的力较小，该静电MEMS驱动器仅仅可以驱动单个质量较轻的镜片，而不能驱动具有多个光学镜片的整个镜筒。这种MEMS自动对焦的采用需要对当前光学器件进行再设计，以达到最佳性能。不可以直接替换移动整个镜筒的VCM。换言之，由于静电驱动器产生的力较小，该静电驱动器被局限于驱动单个镜片。该技术的采用将会推动当前光学器件的重新设计；因此其普及率较低。本发明提供一电热驱动的MEMS驱动装置，以取代VCM作为镜筒驱动器，而不用对现有光学器件进行大的变动。
发明内容
本发明的新颖性在于应用热双压电晶片构建一能够将一镜筒快速、精确定位于一智能设备，例如一手机的一自动对焦摄像模组的系统。
当前，VCM被应用于手机摄像模组，以移动一镜筒，从而实现自动对焦定位。该镜筒被弹簧固定。弹簧对VCM驱动器掣肘，以进行定位控制。由于弹簧较软，在运转中该镜筒容易倾斜并发出响声。这将导致形成坏边图像并延长对焦时间。相对VCM系统，本发明的热动MEMS定位装置具有较强的机械强度，因此可以避免在镜筒定位过程中发出响声。该阶段的直线运动不会出现任何轴偏离，并避免镜筒倾斜，以得到更好的图像边缘的对焦。
静电驱动器(Invensas)被用于驱动一自动对焦摄像模组的单个镜片(一般40mg)，以实现快速、精确定位。然而，这种静电驱动器受到驱动力和行程的限制，因此该技术的应用较少，并且导致其只可以产生较小的推动力，不适于移动具有多个光学镜片(200mg或者更重)的整个镜筒。此外，该静电装置需要对弹簧、铰链进行复杂的设计，并且有大量组件。设计复杂性的提升导致较高的制造成本。此外，该技术的应用需要对光学镜片进行再设计，而不能使用在现有镜筒。本发明的热MEMS定位装置是单片集成电路。与静电驱动器相比，其制造较为容易。热微驱动器能够产生高的热应力，进而转化为强的推动力。输出的强推动力能够驱 动具有多个光学镜片的镜筒，而非单个镜片。该装置的刚性也使定位镜筒过程中的响声降到了最低。取决于被应用的结构地，本发明能够控制镜筒的多达三轴的定位。本发明可以被应用于现有一摄像模组的现有光学器件，以作为VCM的一简单替代。同样地，取决于被使用的控制配置地，与VCM相比，镜筒倾斜的主动修正得以成为可能。
相应地，本发明的一优势在于提供一摄像模组，以将一镜筒定位其中，从而得到较高质量的摄影、摄像图像。特别地，本发明涉及一热微驱动器，其能够实现智能设备例如手机的摄像模组的自动对焦，并防止手抖。
本发明的另一优势在于提供一热微驱动器，其中在将镜筒定位于一智能手机摄像模组时，该热微驱动器可以提供大的推动力，并满足防抖需求，其中该热微驱动器可以被设置为在不依赖于环境问题的情况下实现多达三轴的定位控制。
本发明的另一优势在于提供一MEMS，其中与VCM驱动摄像模组相比，其摄像模组的结构组件较少。
本发明的另一优势在于提供一MEMS热微驱动器，其通过精确的驱动提供较好的图像/影像质量。
通过下面的描述，本发明的其它优势和特征将会变得显而易见，并可以通过权利要求书中具体指出的手段和组合得到实现。
依本发明，提供一便携电子设备摄像模组。该便携电子设备摄像模组包括一基座、一镜筒和一镜筒定位装置。
该镜筒定位装置包括至少两个微驱动器和一控制单元。这些微驱动器被可运行地连接于该基座和该镜筒之间并使这些微驱动器相对该镜筒向外放射状延伸，其中每一微驱动器在受热时都是可弯曲的。
根据本发明的一实施例，每一微驱动器在受热时都可以产生平面外弯曲。
根据本发明的一实施例，四个微驱动器被设置于该基座的四角，从而可以同时弯曲，以向Z轴负向驱动该圆形基座，进而该圆形基座驱动整个载体和镜筒移动向下，以实现自动对焦功能。
该控制单元包括至少一加热电路。该加热电路被可运行地连接于这些微驱动器，以将热能可控制地提供给每一微驱动器，其中每一微驱动器相应弯曲，以相对该基座地移动该镜筒，从而控制该镜筒的三轴定位。
根据本发明的另一方面，本发明还提供了一摄像模组制造方法，其包括以下步骤：
(1)提供一组微驱动器，其中每一微驱动器在热能的作用下都是可弯曲的。
(2)将该微驱动器可运行地连接于一基座和一镜筒之间，以使该微驱动器相对该镜筒放 射状地延伸。
(3)可控地将一加热电路产生的热能提供给每一微驱动器，其中每一微驱动器相应弯曲，以驱动该镜筒相对该基座移动，从而控制该镜筒的三轴定位。
通过对随后的描述和附图的理解，本发明进一步的目的和优势将得以充分体现。
本发明的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
图1A至图1D示意了根据现有技术的一电磁驱动装置，其中图1A示意了一用来实现摆动(提供防抖功能)的线圈组件被安装于一驱动线圈(提供自动对焦功能)的内周侧；图1B示意了在该驱动线圈的内周侧摆动的该线圈组件；图1C是一斜视图，示意了用来实现摆动的该线圈组件与一永磁组件之间的关系；图1D示意了在该驱动线圈内逆时针流动的电流ID、朝向Z轴正向的洛伦兹力FL、电流在防抖动装置的该线圈组件(R正向摆动)中的流动方向以及作用于该驱动线圈的洛伦兹力。
图2示意了根据本发明的一优选实施例的一MEMS系统，其中该MEMS被安装有一镜筒。
图3是根据本发明的上述优选实施例的该MEMS系统在未安装镜筒状态下的透视图。
图4是根据本发明的上述优选实施例的该MEMS系统的一侧视图，示意了一镜筒沿Z轴的运动。
图5示意了根据本发明的上述优选实施例，当一热MEMS驱动器被供电时，该镜筒的运动。
图6是根据本发明的上述优选实施例的一热微驱动器的一透视图。
图7是根据本发明的上述优选实施例的微鳍的一透视图，示意了具有聚合物填充间隙的蜿蜒状微鳍。
图8示意了根据本发明的上述优选实施例的一微加热器，其中该微加热器被定位于该微鳍的顶部。
图9是根据本发明的上述优选实施例的蜿蜒状骨架，其中该蜿蜒状骨架具有供聚合物填充的间隙。
图10A至图10D示意了根据本发明的上述优选实施例的该微鳍的不同设计。
图11示意了根据本发明的上述优选实施例的该热微驱动器的弯曲运动。
图12是根据本发明的上述优选实施例的该热微驱动器上的该微加热器的一透视图。
图13示意了根据本发明的上述优选实施例一集成的加热电路。
图14示意了根据本发明的上述优选实施例的该镜筒的中央位置(在电压零点)，其中该镜筒随着环境温度的变化而浮移。
图15示意了根据本发明的上述优选实施例通过预热获得该镜筒的一不依赖环境温度的固定参考点。
图16是根据本发明的上述优选实施例的具有两个MEMS装置的差动系统的透视图，其中该两个MEMS装置被应用于该镜筒。
图17是根据本发明的上述优选实施例的供该镜筒的两个MEMS装置的侧视图。
图18示意了根据本发明的上述优选实施例的该两个MEMS装置之间的该镜筒，其中该两个MEMS装置的相对设置使该镜筒不会随着环境温度的变化而移动。
图19示意了根据本发明的上述优选实施例的该MEMS顶端和低端的能量供应，以移动该镜筒。
图20是根据本发明的上述优选实施例的一可替换实施例的一具有一镜筒的MEMS系统的透视图。
图21是根据本发明的上述优选实施例的该可替换实施例的未设置镜筒的该MEMS系统的一透视图。
图22示意了根据本发明的上述优选实施例的该可替换实施例的一独立微驱动模块。
图23示意了根据本发明的上述优选实施例的该可替换实施例的独立微驱动模块，其通过微驱动器支撑该镜筒，而不需要任何框架。
图24示意了根据本发明的上述优选实施例的该可替换实施例的该独立微驱动模块，其中该独立微驱动模块被设置于一PCB电路，以提供控制。
图25示意了根据本发明的上述优选实施例的该可替换实施例的该热微驱动器上的镜筒的安装方式，其中该热微驱动器被固定于该PCB。
图26示意了根据本发明的上述优选实施例的该可替换实施例的一同步控制电路。
图27示意了根据本发明的上述优选实施例的该可替换实施例的该同步控制电路的电路图。
图28示意了根据本发明的上述优选实施例的该可替换实施例的分离的独立的移动控制的电路。
图29示意了根据本发明的上述优选实施例的该可替换实施例的该分离的独立的移动控制的电路图。
图30示意了根据本发明的上述优选实施例的该可替换实施例对镜筒Z轴和倾斜进行控制 的控制方法。
图31示意了根据本发明的上述优选实施例的该摄像模组被安装于一手机内以实现自动对焦。
图32示意了根据本发明的上述优选实施例的这些微驱动器的操作被分别控制，以旋转该镜筒，从而实现沿不同轴的防抖动。
图33示意了根据本发明的上述优选实施例通过选择性激活至少一微驱动器来控制该镜筒，以旋转该镜筒。
图34示意了根据本发明的上述优选实施例的该微驱动器的制造过程。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
将镜筒快递、精确定位于手机摄像模组对于获得高质量图像非常重要。介于MEMS尺寸较小且具有快速、精确定位的功能，本发明对微机电系统(MEMS)加以应用。相对而言，传统设计具有驱动力和行程上的限制，从而很少被采用。本发明的该系统利用热微驱动器将镜筒定位于一手机摄像模组。热微驱动器可以提供较大的驱动力和较长的行程，以满足该摄像模组的需求。该系统可以被配置为实现多达三轴(XYZ)的定位控制。本发明还揭露了获得一热驱动器系统的方法，其中该热驱动器系统不依赖于环境温度。
参考说明书附图之图31，根据本发明的一摄像模组被安装于一便携电子设备，例如一智能手机，以使该摄像模组具有自动对焦功能。值得一提的是，本发明可以适用于不同的便携电子设备，例如一笔记本电脑或一平板电脑。如图2至图4所示，根据本发明的一优选实施 例的一摄像模组被揭露。该摄像模组包括一基座10、一镜筒20和一镜筒定位装置30。该基座10适于被安装于一便携电子设备。该镜筒20支撑至少一光学镜片于其中，并且适于沿Z轴运动。该镜筒定位装置30被设置，以供选择性调整该镜筒20的位置，以提供自动对焦功能。
该镜筒定位装置30包括至少两个微驱动器31和一控制单元32。这些微驱动器31被可运行地连接于该基座10和该镜筒20之间，，并且其位置使得这些微驱动器31从该镜筒20放射状延伸，其中每一微驱动器31均被配置为能够受热弯曲。该控制单元32包括至少一加热电路321。该加热电路321被可运行地连接于这些微驱动器31，以可控制地将热能提供给每一微驱动器，其中每一微驱动器对被作用于其的热能作出反应，以进行相应弯曲，从而相对该基座10移动该镜筒，进而控制该镜筒20的三轴定位。
根据一个实施例，本发明被设置为该基座10包括一支架11和一台阶12，以固定该镜筒20、该加热电路321的一加热整体以及该热微驱动器31(热双压电晶片)，如图3所示。
根据一个实施例，该支架11是一个框架，其具有四个相对的角部。具体地，该支架11具有一架腔111。优选地，该架腔111被形成于该支架11的中心部位。相应地，至少一光学镜片被安装于该镜筒20。优选地，该光学镜片可以被牢固固定于该镜筒20内，以使光束可以穿过该镜筒20并透过其内的光学镜片。
这些微驱动器31被用来替代被广泛应用于智能手机摄像模组自动对焦的音圈马达(VCM)。计划执行一系列分析设计和实验验证被计划，以优化提供自动对焦功能的驱动器的设计。MEMS驱动器的技术原形以SU8光刻和深硅刻蚀的方式被实现。
这些微驱动器31被对称地设置于该镜筒20周围。根据一个实施例，四个微驱动器31被设置于该支架11的四个角部。换言之，根据这个实施例，该热微驱动器31(thermal unimorphs)优选为被设置于该支架11的四角，并环绕该架腔111的周边，如图3所示。该镜筒20被安装于该基座10的该台阶12。该镜筒20与这些热微驱动器31一起运动，其中被电阻热激活时，这些热微驱动器31向平面外弯曲，如图5所示。形成该基座10的该刚性支架11由单晶硅制成，如图2和图3所示。该支架11具有作为这些热微驱动器31的散热器的作用，并且具有作为根据本发明的该装置的一支撑物的作用。
相应地，该支架11是这些微驱动器31与该控制单元32的整体电路相互连接的基础。该中心台阶12被设置于该架腔111内，并通过这些微驱动器31与该支架11连接。当热能被提供给这些微驱动器31时，该台阶12移动(平面外)。该镜筒20被安装于该中央台阶12，以供定位。该控制单元32的集成电路形成电阻加热器，以提供这些热微驱动器31工作所需的热能。该控制单元32的整体电路可以在一个电路中连接所有微驱动器31于该装置，因此， 可以通过一次输入实现全部微驱动器31被同时驱动。换言之，通过控制向这些微驱动器31供应的热能，这些微驱动器31被可控地弯曲，以借助通过该台阶12，并沿被设置于该摄像模组的该支架11的一感光芯片的一感光路径移动该架腔11内的该镜筒20。
多个微驱动器31的定位也非常重要。以对称的方式定位多个微驱动器31能够减少轴偏移运动，例如倾斜，以实现该镜筒20的直线运动。优选地，三点可以确定一平面，因此，优选地，对该镜筒20被适当定位至少需要三个微驱动器31。根据该优选实施例，该装置设置四个微驱动器31，其中这四个微驱动器31被对称设置于四个相对角，以对空间进行充分利用，从而使设计更为紧凑。
如图6至图10所示，每一微驱动器31包括多个蜂巢状微鳍311和被填充于多个鳍间隙310的多个聚合物热膨胀元件312。这些微驱动器31的激活是通过一集成微加热器313的电阻加热实现。优选地，该聚合物热膨胀元件312为可热膨胀聚合物。每一微驱动器31进一步包括一背骨314，其被耦合于每一微鳍311的一侧，其中该微加热器313被设置于每一微鳍311的另一侧，以可运行地连接于该加热电路321。当聚合物热膨胀元件312撑大该硅鳍间隙310时，该硅背骨314被该聚合物热膨胀元件312弯曲。该驱动器背骨314与该聚合物热膨胀元件312的聚合物成分在热膨胀上的不同形成了作用于这些微驱动器31的热应力，从而使该微驱动器沿Z轴负向向下弯曲，如图11所示。
参考图6至图10，蜿蜒状的这些微鳍311就像是每一微驱动器31的该微加热器313和该热膨胀元件312之间的一导热体。每一微鳍311进一步作为一延伸于该支架11和该台阶12之间的一驱动梁。该微鳍311还具有对该热膨胀元件(即如图6所示的可热膨胀聚合物)进行平面约束的作用，以聚集驱动方向上的体积热膨胀。换言之，当电能被供应，该热膨胀元件312将会在热的作用下膨胀。该驱动器背骨314与该聚合物312之间膨胀的不同使这些微驱动器31产生了热应力，从而使这些微驱动器31沿Z轴向下、向该基座10弯曲，如图11所示。这些微驱动器31被对称设置，以抵消所有轴偏离运动，从而使该台阶12沿直线运动，从而使得该镜筒的倾斜达到最小。该背骨314至该微鳍311作为基础结构，就像是双分子层驱动器的一刚性层。此外，该背骨314具有良好的热传导性能，其连接该微鳍311的每一鳍板，如图12所示。该硅微鳍311的这种设计使该装置的反应时间较短(一般10-40ms)。该微加热器313沿弯曲的热微驱动器31的蜿蜒骨架延伸。该蜿蜒骨架具有导热媒介和对被填充于该鳍间隙310的该聚合物热膨胀元件312的可热膨胀聚合物进行限制的双重作用。
图10(A)至(D)示意了该微鳍311的不同设计，以作为延伸于该支架11与该台阶12之间的驱动梁，其区别在于薄膜加热器的长度和/或硅微结构。根据本发明的该优选实施例，该微驱动器31具体实施为一热驱动Si/Su-8复合材料微驱动器，其赋予便携电子设备摄像模 组于自动对焦和防抖动的功能，其中该驱动梁与一环形硅台阶相连。一载体和该镜筒20在该环形硅台阶上相互连接。每一驱动梁具体实施为一蜿蜒的硅板SU-8，其被填充于该蜿蜒结构和一铂薄膜加热器之间。介于其优良的热传导能力，硅片可以有效地将热量传递至夹层SU-8。受到硅背骨的限制，当Si-SU-8复合材料被该铂薄膜加热器通过电阻加热的方式加热时，Si-SU-8驱动梁仅可以产生平面外弯曲，其中四个Si-SU-8驱动梁(微驱动器)的同时激活可以使该环形硅台阶在Z轴方向弯曲，如图11所示。
图10(A)揭露了该微鳍311的蜿蜒形状。图10(B)揭露了该微鳍311的一双蜿蜒形状。图10(C)揭露了该微鳍311的一三蜿蜒形状。图10(D)揭露了该微鳍311的一半蜿蜒/半平行组合结构。换言之，图10(A)至(C)分别揭露了薄膜加热器的全部长度、一半长度和三分之一长度的硅蜿蜒结构的俯视图。图10(D)揭露了该硅梁的一半为加热器被设置其上的蜿蜒状结构。该硅梁的另一半通过平行硅板形成。例如，当该硅蜿蜒板的宽度SPwidth为5μm并且该蜿蜒板之间的间隙SPgap为10μm时，模拟结果显示具有三分之一长度加热器的该三蜿蜒设计向整个驱动梁提供最为均衡的排斥。如果该驱动梁被规模化固定于FEM仿真系统，其产生最大位移。下表示意了具有不同长度的各种各样Si-SU-8驱动梁的性能和/或加热器长度。在掩膜设计中，根据该驱动梁不同的长度(宽度和厚度分别被固定为415μm和15μm)和/或加热器长度，可以有十二种设计：
Figure PCTCN2017075568-appb-000001
SPwidth＝5μm,SPgap＝10μm,T1＝10μm,T2＝5μm
参考图12，集成的该微加热器313包括至少一蜿蜒状的导电金属薄膜，以匹配该微鳍311的形状并与该微鳍311相耦接，其中该导电金属薄膜具有高阻抗且对高温稳定。当电流通过时，该导电金属薄膜产热。根据该优选实施例，所有的微加热器313被连接于该控制单元32的一个电路，以通过同一输入进行同时控制，如图13所示。优选地，该微加热器313为铂薄膜加热器。值得一提的是，该微鳍311的蜿蜒形状增加了其与该微加热器313的接触面积，从而方便从其提供热量，并增加该背骨314与该聚合物热膨胀元件312之间的热传导面积，以进行热传递。
根据该优选实施例，每一微驱动器31被设计为具有9.28mm×9.28mm×0.5mm(薄片厚度)的占位面积。这些微驱动器31由四个热驱动梁组成。该热驱动梁与一圆形硅台阶相连接。该圆形硅台阶的直径为6.78mm。该台阶12和该镜筒20通过该热驱动梁附接。值得一提的是，该圆形硅台阶12外被蚀刻形成凹槽，以沿该感光芯片的感光路径最大化Z轴方向的驱动。参考等轴侧视图，每一微驱动器31的该驱动梁具体实施为蜿蜒状的硅片SU-8，其被填充于该蜿蜒结构和一铂薄膜加热器之间。由于其良好导热性能，该微鳍311的硅片可以将热量有效地传递至夹层：该聚合物热膨胀元件312。由于受到该硅背骨314的约束，当该热膨胀元件312被该铂薄膜加热器313进行电阻加热(resistively heated)时，这些微驱动器31仅仅可以产生面外弯曲。该四个微驱动器31的同时激活可以使环状硅台阶12在Z轴方向上弯曲，如图12所示，从而使该台阶12和镜筒20的整个载体向下运动，以提供自动对焦功能。
很多类型的可弯曲热微驱动器31，例如双金属材料或热双分子膜可被用于这种平面外定位系统。一个合适的驱动器需要对低电量需求迅速作出反应。其对电量的需求不多于向一VCM输入的能量。由于其较大的行程和快速反应，该热微驱动器31被选择。此外，这些微驱动器31无需不利于图像质量的提高的过热加热即可操作。
当前设计利用微化学SU-8树脂作为该热膨胀元件312的填充聚合物。SU-8具有较高的热膨胀系数(50-150ppm/℃)，一杨氏模量(3GPa)，和泊松比(0.3)。用于制作该热双压电晶片的理想热膨胀聚合物应具有较高的热膨胀系数(>150ppm/℃)和杨氏模量(>1GPa)。该聚合物热膨胀元件312还应该是近乎不能压缩的(泊松比为0.49至0.5)，以最大化冲程方向上的热应力和拉紧力。适合上述需求的典型聚合物为硅基树脂(康宁公司WL-5150可光致图案的硅)。
参考图34，这些微驱动器31具体实施为由MEMS驱动器制成的Si/SU-8微驱动器，其制造需要六个模板，其中第一个和第三个模板为相同类型的模板。这些微驱动器31的制造方法包括以下步骤：
(步骤1)沉积一层100nm厚的Si3N4于SOI(Silicon On Insulator,硅在绝缘层上)晶片的两侧，其中前侧的Si3N4通过影印石版技术和CF4等离子蚀刻技术成像。基底顶侧的刻蚀面积为Si预留，以用于形成驱动梁结构。
(步骤2)喷涂20nmTi(钛)于该基底的光阻图案的顶侧，随后喷涂200nm的Pt(铂)和80nm的Au(金)，其中在剥离工艺中去除光刻胶后获得最终加热器图案。
(步骤3)利用步骤1的模板覆盖接合盘面积，以使该铂薄膜加热器上的Au层被去除。
(步骤4)通过反应离子深蚀刻(DRIE)技术制造Si微结构(使平行板弯曲)。在该设备层上执行蚀刻，直到达到所需厚度，蚀刻方可完成。
(步骤5)模塑SU-8抗蚀剂于被蚀刻的硅微结构之间的间隙，以形成Si/SU-8复合材料。当 硅微结构被填充SU-8以后，通过标准影印石版术形成图案。
(步骤6)通过影印石版术和CF4等离子蚀刻技术形成Si3N4图案于该晶片的后侧，其中通过DRIE形成一底腔于该基底。
(步骤7)通过湿HF蚀刻法或者CF4等离子蚀刻技术蚀刻掩埋氧化物层，以形成MEMS驱动器。
(步骤8)在一热板上，以120℃的温度烘烤上述加工过的基底1小时并通过机械分割(图34箭头所示)支撑驱动梁从该晶片分离出单个的MEMS微驱动器。
值得一提的是，每一微驱动器31(热双压电晶片)的末端位置与环境温度有关。因此，该镜筒20的该定位台阶的中央位置(电压为0)随着温度环境的变化而变化，如图14所示。没有确定的参考起点，台阶定位的温度相关偏移使该系统不具有定位控制参考。
热微驱动器31会受到环境温度的影响，因而可能不适于系统定位。接下来本发明揭露两种不依赖于环境温度的装置定位方法。
参考图15，第一种方法是预热这些微驱动器31至一参考温度点，即高于上述操作环境温度。超过该参考温度点的加热可以使定位控制能够实现，如图15所示。换言之，第一种方法是预热这些微驱动器31至该参考温度点，其中该参考温度点超过现有技术所应用的大多数环境温度。该参考温度点的任何温度变化都被校准，然后被用于定位。换言之，每一微驱动器31被该加热器电路321预热至该参考温度点，以校准与环境温度变化无关的该镜筒20的中央位置，因此当每一微驱动器31被该加热器电路321加热至上述参考温度点时，这些微驱动器31被弯曲，以从其中央位置移动该镜筒20。
第二种方法以如图16至图18所示的另一差动系统为基础。两组微驱动器31，即一顶组微驱动器和一底组微驱动器在任何环境温度下均被平行、相对设置，如图16至图18所示，因此该镜筒20仅仅在该两组相对设置的微驱动器之间的温度不同时进行移动，如图18所示。更具体地，这些微驱动器31被设置为具有被耦接于该镜筒20的顶部一顶组微驱动器31和被耦接于该镜筒20的底部一底组微驱动器31。因此在不同的环境温度条件下，该镜筒20均被保持于中央位置。该加热器电路321既可以向该顶组微驱动器31提供能量，也可以向该底组微驱动器31提供能量，以控制该镜筒20的移动，如图19。换言之，由于随着环境温度的变化，分别产生来自该顶组微驱动器31和该底组微驱动器31的两个相反的力，该镜筒20的定位被抵消，以保持于中央位置，因此该镜筒20被保持于中央位置不会受到环境温度的影响。环境引起的任何定位该顶组微驱动器31的变化都被该底组微驱动器31产生的相反的力所抵消(镜筒)。值得一提的是，该顶组微驱动器31被延伸于顶部支架11和顶部台阶12之间。该底组微驱动器31被延伸至底部支架11和底部台阶12之间，如图16所示。
优选地，该顶组微驱动器31与该底组微驱动器31相互对准，从而该顶组微驱动器31与该底组微驱动器31面对面设置。因此，当该顶组微驱动器31由于环境温度的变化而产生弯曲运动，进而产生作用力时，该底组微驱动器31产生的作用力抵消该顶组微驱动器31产生的作用力。优选地，一壳体被设置用来收纳该顶组微驱动器31与该底组微驱动器31于其中。
值得一提的是，当该顶组微驱动器31被激活后，该镜筒20向上运动。当该底组微驱动器31被激活后，该镜筒20向下运动。每一顶组或底组微驱动器包括至少一微驱动器31。尽管在一个方向上的行程被缩减为一半，其所能达到的整体行程与配置一个微驱动器31相同。因此，这种两层或两组结构使该镜筒20被设置于整个行程的中间部位，从而实现快速自动对焦。其在结构上也更加稳定。通过分别激活该顶组和底组微驱动器31，该镜筒20可被上下移动，以实现自动对焦。
当获得的图像被聚焦于该镜筒20的初始位置时，即不需要自动对焦时，可以通过激活这些微驱动器31实现图像的稳定性。相应地，当被选择的微驱动器31(非所有这些微驱动器31)被激活时，该镜筒20可被绕同样的轴转动。
参考图20和图21，上述优选实施例的一可替换实施例被阐释，其中该基座10的一可替换实施例被阐释。其中该台阶12被去除。该镜筒20直接被设置于这些微驱动器31的末端，如图20所示。该镜筒20通过胶水/机械方法被附接于安装点，如图21所示。换言之，这些微驱动器31从该支架11放射状延伸，以耦接该镜筒20的周壁，从而将该镜筒20支撑于该架腔111并驱动该镜筒20。
图22至图26进一步示意了该基座10的另一可替换实施例。该支架11需要的不是一单片集成电路，而是可以被至少两个基座块11A所替代。其中每一基座块11A设置一微驱动器31，如图23和图25所示。换言之，可以不设置该支架11。这些微驱动器31被分别设置于单个的基座块11A。所有微驱动器31可以被具有单个电源的同一电路控制，以与基础机构达到相同的效果，其主要为Z轴定位控制。该单个基座块11A也可以被安装于该支架11，如图24和25所示。每一微驱动器31可以被该控制单元32的电路，例如一印刷电路控制，如图26和图27所示。该镜筒20可以通过这种未设置台阶的同样的方法被安装，如图25所示。驱动具有单一电源的该微驱动器可以和基础结构达到同样的效果，其主要为Z轴方向的定位控制，如图26和图27所示。
如图28和图29所示，每一单个基座块11A也可以被该控制单元32的单个电路控制，其中每一模块11A分别被多个电源和一微处理器控制，从而该镜筒(绕x和y轴旋转)能够在Z轴移动基础上的倾斜移动，从而进行三轴定位控制，如图30所示。
本发明的操作如下所示。根据一个实施例，四个微驱动器31被安装于该支架11的四个角部，并且直接与该台阶12或该镜筒20相连接，即未设置连接四个梁的圆形硅台阶。该摄像模组还具有较好的图像稳定性。每一微驱动器31具有一细长结构，以形成一梁。然而，具有单独控制梁的这些微驱动器31具有自动对焦功能，且影像稳定。
值得一提的是，四个单独的微驱动器31仍然可以被同时激活，以完成类似于集成微驱动器的自动对焦，如图2所示。根据这种结构，参考图32，单梁、成对双梁或三梁可以被控制，以通过这种方式进行驱动，从而可以沿不同的轴补偿手抖。如果只有这些微驱动器31的梁1和2作为一对，或者这些微驱动器31的梁3和4作为一对被同时激活，该镜筒20被绕x-x’轴旋转。当这些微驱动器31的梁1和梁4作为一对或者这些微驱动器31的梁2和梁3作为一对被同时驱动时，该镜筒20可以绕y-y’轴旋转。为了绕u-u’轴旋转该镜筒20，这些微驱动器31的驱动梁2和这些微驱动器31的梁4都是必要的。这些微驱动器31的驱动梁1、2和3或者这些微驱动器31的梁1、3和4也可以同时驱动该镜筒20绕u-u’轴转动。同样地，只有这些微驱动器31的驱动梁1或3可以使该镜筒20绕v-v’轴旋转。这些微驱动器31的该驱动梁1、2和4或这些微驱动器31的梁2、3和4可以同时使该镜筒20绕v-v’轴旋转。
同样地，参考图33，对于顶组和底组两个微驱动器31，这些微驱动器31的单个梁或这些微驱动器31的一组梁可以被同时驱动，以使该镜筒20进行预设旋转，从而可以补偿手抖带来的不良影响。参考图33(a)和(b)，当该底组微驱动器31的梁1和梁4或梁2和梁3被同时激活时，该镜筒20可以绕x轴旋转。同样地，该镜筒20绕其它轴的旋转可以通过该顶组和底组微驱动器31不同驱动梁组合实现。具体地，当该底组微驱动器31的梁1和梁4被同时驱动时，可以使该镜筒20绕y-y’轴旋转，如图33(a)所示。当该底组微驱动器31的梁2和梁3被同时驱动时，可以使该镜筒20绕y-y’轴旋转，如图33(b)所示。
本发明的一优势在于，与VCM驱动摄像模组相比，该摄像模组的结构部件较少。相应地，仅仅具有自动对焦功能的VCM驱动摄像模组包括十二个部件。即具有自动对焦功能，又能够保障图像稳定性的VCM摄像模组至少需要16个部件。较少的结构部件使其组装过程更加简单，并且使摄像模组的生产成本降低。根据本发明，具有这些微驱动器31的摄像模组可以只具有7至11个部件。该摄像模组只包括两个通过高性能尼龙喷射造型法形成的支撑元件。顶部的支撑元件主要起到一个盖子的作用，以在开口的内侧壁提供防倾斜结构。这些微驱动器31被设置于底部支撑元件(基座)的顶表面。一能够抵抗震动的限制器被一体注塑于该底部支撑元件。
本发明的另一优势在于精确驱动使影像质量提高。由于过冲和振荡，被VCM驱动的镜片只能被固定于离目标位置100-200ms的位置。噪音现象可以通过采用一自校正VCM驱动器来 克服。在得到响声补偿后，VCM快速定位的响声很小。根据本发明，这些热微驱动器31集成有滑动器，并且被组装于一印刷电路，以用于性能测试。这种双级微驱动器31诠释了精确、快速、无声位移(20nm/1KHz)。
根据本发明的这些微驱动器31的测量位移表明没有大的响声，因此这些微驱动器31的该四个驱动梁刚性设置足够。响声上的极大减小使得影像的质量更高，影像更为清晰。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (30)

  1. 一用于便携电子设备的摄像模组，其特征在于，包括：
    至少一基座，其适于被支撑于具有至少一感光芯片的便携电子设备；
    至少一镜筒，其被设置于所述基座的上方，并处于所述感光芯片的感光路径；和
    至少一镜筒定位装置，其包括：
    至少两个微驱动器，其中所述微驱动器被可运行地连接于所述基座和所述镜筒之间并使所述微驱动器从所述镜筒放射状延伸，其中每一所述微驱动器在热能的作用下都是可弯曲的；和
    至少一控制单元，其中所述控制单元包括至少一加热器电路，其中所述加热器电路被可运行地连接于所述微驱动器，以将热能可控地提供给每一所述微驱动器，以使每一所述微驱动器能够相应弯曲以驱动所述镜筒相对所述基座运动，从而控制所述镜筒的一至三轴定位。
  2. 根据权利要求1所述的摄像模组，其中所述微驱动器被对称设置于所述镜筒周围。
  3. 根据权利要求1所述的摄像模组，其中每一所述微驱动器包括至少一微鳍，至少一被填充于所述微鳍之间的可热膨胀聚合物和至少一微加热器，其中所述微加热器被可运行地连接于所述加热器电路，以产生加热所述可热膨胀聚合物的热能，从而控制其热膨胀，进而控制每一所述微驱动器因受热而造成的弯曲，进而控制所述镜筒相对所述基座的三轴定位。
  4. 根据权利要求2所述的摄像模组，其中每一所述微驱动器包括至少一微鳍，至少一被填充于所述微鳍之间的可热膨胀聚合物和至少一微加热器，其中所述微加热器被可运行地连接于所述加热器电路，以产生加热所述可热膨胀聚合物的热能，从而控制其热膨胀，进而控制每一所述微驱动器因受热而造成的 弯曲，进而控制所述镜筒相对所述基座的三轴定位。
  5. 根据权利要求3所述的摄像模组，其中每一所述微鳍具有一蜿蜒形状，并且在所述微加热器和所述可热膨胀聚合物之间起到一导热体的作用。
  6. 根据权利要求4所述的摄像模组，其中每一所述微鳍具有一蜿蜒形状，并且在所述微加热器和所述可热膨胀聚合物之间起到一导热体的作用。
  7. 根据权利要求3所述的摄像模组，其中每一所述微驱动器进一步包括至少一背骨，其中所述背骨被耦接于所述微驱动器的所述微鳍的一侧，其中所述微加热器被设置于所述微驱动器的所述微鳍的另一侧。
  8. 根据权利要求6所述的摄像模组，其中每一所述微驱动器进一步包括至少一背骨，其中所述背骨被耦接于所述微驱动器的所述微鳍的一侧，其中所述微加热器被设置于所述微驱动器的所述微鳍的另一侧。
  9. 根据权利要求1所述的摄像模组，其中所述基座包括至少一台阶和至少一支架，其中所述镜筒被支撑于所述台阶，其中所述微驱动器被可运行地连接至所述支架和所述台阶之间，其中所述微驱动器能够弯曲，以驱动所述台阶相对所述支架运动，进而控制所述镜筒的三轴定位。
  10. 根据权利要求8所述的摄像模组，其中所述基座包括至少一台阶和至少一支架，其中所述镜筒被支撑于所述台阶，其中所述微驱动器被可运行地连接至所述支架和所述台阶之间，其中所述微驱动器能够弯曲，以驱动所述台阶相对所述支架运动，进而控制所述镜筒的三轴定位。
  11. 根据权利要求1所述的摄像模组，其中所述基座包括至少两个基座块，其中两个所述基座块被分别耦接于所述微驱动器，从而所述微驱动器被分别可运行地连接至所述镜筒和所述基座块之间。
  12. 根据权利要求8所述的摄像模组，其中所述基座包括至少两个基座块， 其中两个所述基座块被分别耦接于所述微驱动器，从而所述微驱动器被分别可运行地连接至所述镜筒和所述基座块之间。
  13. 根据权利要求1所述的摄像模组，其中每一所述微驱动器被所述加热器电路预加热至一参考温度点，以校正所述镜筒的中央位置，其中所述镜筒的中央位置不会随着温度的变化而变化，从而当每一所述微驱动器被所述加热器电路加热至所述参考温度点时，所述微驱动器弯曲，以驱动所述镜筒从所述镜筒的中央位置移动。
  14. 根据权利要求10所述的摄像模组，其中每一所述微驱动器被所述加热器电路预加热至一参考温度点，以校正所述镜筒的中央位置，其中所述镜筒的中央位置不会随着温度的变化而变化，从而当每一所述微驱动器被所述加热器电路加热至所述参考温度点时，所述微驱动器弯曲，以驱动所述镜筒从所述镜筒的中央位置移动。
  15. 根据权利要求12所述的摄像模组，其中每一所述微驱动器被所述加热器电路预加热至一参考温度点，以校正所述镜筒的中央位置，其中所述镜筒的中央位置不会随着温度的变化而变化，从而当每一所述微驱动器被所述加热器电路加热至所述参考温度点时，所述微驱动器弯曲，以驱动所述镜筒从所述镜筒的中央位置移动。
  16. 根据权利要求1所述的摄像模组，其中所述微驱动器包括被耦接于所述镜筒的一顶部的一顶组微驱动器和被耦接于所述镜筒的一顶底部的一底组微驱动器，其中所述顶组和底组微驱动器被以对称的方式相对设置，从而所述镜筒被保持于与环境温度无关的中央位置。
  17. 根据权利要求10所述的摄像模组，其中所述微驱动器包括被耦接于所述镜筒的一顶部的一顶组微驱动器和被耦接于所述镜筒的一顶底部的一底组微驱 动器，其中所述顶组和底组微驱动器被以对称的方式相对设置，从而所述镜筒被保持于与环境温度无关的中央位置。
  18. 根据权利要求12所述的摄像模组，其中所述微驱动器包括被耦接于所述镜筒的一顶部的一顶组微驱动器和被耦接于所述镜筒的一顶底部的一底组微驱动器，其中所述顶组和底组微驱动器被以对称的方式相对设置，从而所述镜筒被保持于与环境温度无关的中央位置。
  19. 一用于便携电子设备的一摄像模组的一制造方法，其特征在于，包括以下步骤：
    (a)提供一组微驱动器，其中每一所述微驱动器在热能的作用下都是可弯曲的；
    (b)将所述微驱动器可运行地连接于至少一基座和至少一镜筒之间，以使所述微驱动器相对所述镜筒放射状延伸；和
    (c)可控制地施加一加热器电路提供的热能于每一所述微驱动器，以使每一所述微驱动器相应弯曲，从而驱动所述镜筒相对所述基座运动，进而控制所述镜筒的一至三轴定位。
  20. 根据权利要求19所述的方法，其中在所述步骤(b)中，所述微驱动器被均匀设置于所述镜筒周围。
  21. 根据权利要求19所述的方法，其中每一所述微驱动器包括至少一微鳍，至少一可热膨胀聚合物和至少一微加热器，其中该步骤(a)进一步包括以下步骤：
    (a.1)填充所述可热膨胀聚合物于所述微鳍之间；和
    (a.2)将所述微加热器可运行地连接于所述加热器电路，以加热所述可热膨胀聚合物，进而控制其热膨胀。
  22. 根据权利要求21所述的方法，其中每一所述微鳍具有一蜿蜒形状，并且 在所述微加热器和所述可热膨胀聚合物之间起到一导热体的作用。
  23. 根据权利要求22所述的方法，其中该步骤(a)进一步包括以下步骤：
    (a.3)耦接至少一背骨于每一所述微鳍的一侧；和
    (a.4)设置所述微加热器于每一所述微鳍的另一侧。
  24. 根据权利要求19所述的方法，其中该步骤(b)进一步包括以下步骤：
    (b.1)支撑所述镜筒于至少一台阶；和
    (b.2)将所述微驱动器可运行地连接于至少一支架的所述基座和所述台阶之间，从而所述微驱动器能够被弯曲，以驱动所述台阶相对所述支架运动，进而控制所述镜筒的一至三轴定位。
  25. 根据权利要求19所述的方法，其中该步骤(b)进一步包括以下步骤：
    (b.1)耦接所述微驱动器的所述基座块于所述微驱动器；和
    (b.2)将所述微驱动器可运行地连接于至少一支架的所述基座和所述台阶之间，从而所述微驱动器能够被弯曲，以驱动所述台阶相对所述支架运动，进而控制所述镜筒的一至三轴定位。
  26. 根据权利要求19所述的方法，其进一步包括一构建步骤：构建所述镜筒于与环境温度变化无关的中央位置，其中所述构建步骤包括以下步骤：
    通过所述加热器电路预热每一所述微驱动器于一参考温度点，以校正与环境温度变化无关的所述镜筒的中央位置；和
    通过所述加热器电路加热每一所述微驱动器于所述参考温度点，以弯曲每一所述微驱动器，进而使所述镜筒从其中央位置移动。
  27. 根据权利要求26所述的方法，其中所述参考温度点被设置为高于环境温度。
  28. 根据权利要求19所述的方法，其进一步包括一构建步骤：构建所述镜筒 于一与温度无关的中央位置，其中所述构建步骤包括以下步骤：
    构建所述微驱动器，使其具有一耦接于所述镜筒顶部的顶组微驱动器和一耦接于所述镜筒底部的底组微驱动器；和
    通过产生两个相反的力来平衡所述镜筒受到环境温度的变化的影响，其中所述两个相反的力分别来自所述顶组微驱动器和所述底组微驱动器，进而将所述镜筒保持于与环境温度变化无关的中央位置。
  29. 根据权利要求28所述的方法，其中所述顶组微驱动器与所述底组微驱动器相互对齐。
  30. 根据权利要求19所述的方法，其中该步骤(a)进一步包括以下步骤：
    (a.1)沉积一层Si3N4于SOI晶片的两侧，其中前侧的Si3N4通过影印石版技术和CF4等离子蚀刻技术成像，所述基底顶侧的刻蚀面积为Si预留，以用于形成驱动梁结构；
    (a.2)喷涂Ti于所述基底的光阻图案的顶侧，随后喷涂Pt和Au，其中在剥离工艺中去除光刻胶后获得最终加热器图案；
    (a.3)利用步骤(a.1)的模板覆盖接合盘面积，以使Pt薄膜加热器上的Au层被去除；
    (a.4)通过反应离子深蚀刻技术制造Si微结构，使平行板弯曲，在设备层上执行蚀刻，直到达到所需厚度，蚀刻方可完成；
    (a.5)模塑SU-8抗蚀剂于被蚀刻的硅微结构之间的间隙，以形成Si/SU-8复合材料，当硅微结构被填充SU-8以后，通过标准影印石版术形成图案；
    (a.6)通过影印石版术和CF4等离子蚀刻技术形成Si3N4图案于该晶片的后侧，其中通过DRIE形成一底腔于所述基底；
    (a.7)通过湿HF蚀刻法或者CF4等离子蚀刻技术蚀刻掩埋氧化物层，以形成 MEMS驱动器；和
    (a.8)在一热板上，以120℃的温度烘烤上述加工过的所述基底预定时间并通过机械分割支撑驱动梁从所述晶片分离出单个的MEMS微驱动器。
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