WO2017138266A1 - Gabarit de serrage, procédé de fabrication de gabarit de serrage, et résine - Google Patents

Gabarit de serrage, procédé de fabrication de gabarit de serrage, et résine Download PDF

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Publication number
WO2017138266A1
WO2017138266A1 PCT/JP2016/088126 JP2016088126W WO2017138266A1 WO 2017138266 A1 WO2017138266 A1 WO 2017138266A1 JP 2016088126 W JP2016088126 W JP 2016088126W WO 2017138266 A1 WO2017138266 A1 WO 2017138266A1
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WO
WIPO (PCT)
Prior art keywords
resin
receiving jig
weight
manufacturing
epoxy resin
Prior art date
Application number
PCT/JP2016/088126
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English (en)
Japanese (ja)
Inventor
広幸 村上
徳村　啓雨
巧 能見
Original Assignee
株式会社ナノマテックス
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Publication of WO2017138266A1 publication Critical patent/WO2017138266A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention is a receiving jig for supporting an object having a convex shape (an electronic board on which a component is mounted or various industrial products) on a convex surface having the convex shape, a manufacturing method thereof, and these. It relates to resin.
  • a substrate (hereinafter also referred to as a substrate) on which electronic components are mounted, generally, electronic components (hereinafter also referred to as components) are mounted on both sides of a substrate in a substrate used in a high-performance electronic device.
  • components electronic components
  • the component is mounted on one side of the both sides, and then the component is mounted on the opposite side.
  • the mounted surface is supported by the receiving jig.
  • FIG. 1A is a diagram illustrating an example of a substrate 100 on which a component 112 is mounted on one side.
  • the object (substrate 100) having a convex shape (the convex shape of the component 112) is supported by the receiving jig on the convex surface having the convex shape (the mounting surface 110 on which the component 112 is mounted). Is done. Thereby, the component 112 is mounted on the opposite surface 120 while the opposite surface 120 on which the component 112 is not yet mounted is kept horizontal.
  • a metal jig or a hard resin containing carbon cut is used as the receiving jig so that the mounted component 112 does not contact the metal or the like constituting the receiving jig.
  • the tip of the support pin may be a cushion such as a spring or rubber, or the tip of the tip disclosed in Patent Document 1 may be used. In this way, unnecessary stress is not applied to the mounted component 112.
  • the receiving jig needs to have antistatic performance.
  • the receiving jig needs to be configured to receive the object at a portion other than the portion where the object is easily damaged, or to be flexible so that the object is not subjected to stress even if it hits the receiving jig.
  • a demerit of a commonly used receiving jig will be described.
  • a method of supporting an object with support pins is a method often used as an object in mounting or inspection on the substrate 100.
  • FIG. 1B is a side view showing a state where the receiving jig 200 including the support pins 202 supports the substrate 100. In FIG. 1B, only three components 112 among the components 112 mounted on the substrate 100 are shown.
  • the substrate 100 is supported by the support pins 202 of the receiving jig 200 in the dead space between the adjacent components 112.
  • the support pins 202 in the substrate 100 are supported by increasing the density of mounting of the component 112 on the substrate 100 by making the smartphone light and thin. There is a tendency for dead space to disappear.
  • the object when the object is supported by the support pins 202, the object is likely to be distorted, tilted, or vibrated because it is supported by a point, and an error is likely to occur in the work performed on the object (such as mounting or inspection).
  • the support pins 202 when the object is supported by the support pins 202, the support pins 202 must be erected in accordance with the convex shape of the object (for example, the mounting position of the component 112 on the board 100). If a mistake is made, the object becomes defective in the manufacturing process of the object, resulting in a loss. Moreover, since the manufacturing process is operating every day, it is difficult to visually manage the deterioration of the support pins 202. Therefore, the quality such as mounting failure due to deterioration of parts constituting the support pin 202 (for example, parts such as a spring or rubber at the tip of the support pin 202 to prevent the object from being damaged by impact or pressure). It is difficult to suppress loss in advance.
  • the receiving jig 200 provided with the support pins 202 has the disadvantages described above, the method using the receiving jig 200 provided with the support pins 202 is not used.
  • NC Genetic Control
  • a metal for example, aluminum
  • a carbon kneading resin a resin in which carbon is kneaded in ABS or the like
  • FIG. 1C is a cross-sectional view showing a state in which the receiving jig 300 having the processing hole 302 supports the substrate 100 as an object.
  • FIG. 1C a cross section of a portion where the three components 112 of the substrate 100 are fitted in the processing hole 302 is shown.
  • the receiving jig 300 is made of metal or carbon-containing hard resin, and is not flexible and hard. Therefore, if the object is displaced when the object is mounted on the receiving jig 300, there is a high possibility that the object is damaged or damaged. Therefore, the processing range of the processing hole 302 of the receiving jig 300 is widened. Therefore, the processing time becomes long, which causes an increase in processing cost and an increase in cost for responding to short delivery date production.
  • the receiving jig 300 may be changed due to, for example, an increase in the number of components 112 or a change in the mounting position of the components 112, but each change requires cost and lead time.
  • the receiving jig 300 is costly, it is more costly to create the receiving jig 300 for each production of the object. Therefore, it is necessary to store the created receiving jig 300 for a long period of time. For example, a large storage space is required in a factory.
  • the receiving jig 300 is made of metal, it is heavy and difficult to handle.
  • the receiving jig 300 is made of a hard resin containing carbon in order to make the receiving jig 300 lighter, the carbon is easily peeled off, and the carbon adheres to an object such as the substrate 100, resulting in a market failure such as a short circuit.
  • a hard resin containing carbon in order to make the receiving jig 300 lighter, the carbon is easily peeled off, and the carbon adheres to an object such as the substrate 100, resulting in a market failure such as a short circuit.
  • the receiving jig 300 cut by using a hard resin containing metal or carbon has a demerit that it cannot be easily formed as described above and is expensive.
  • an object of the present invention is to provide a receiving jig, a manufacturing method of the receiving jig, and a resin that can be easily created and can suppress the influence and stress due to static electricity on the object to be supported.
  • the receiving jig which concerns on 1 aspect of this invention is a receiving jig for supporting the target object which has a convex shape in the convex surface with the said convex shape, Comprising: From resin which has the recessed part corresponding to the said convex-shaped outline The concave portion has a concave shape obtained when the convex mold is taken, and the resin has a hardness of 60 degrees to 90 degrees as measured by an Asker C-type hardness meter, and has a volume resistivity. A resin having a resistance of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm.
  • the manufacturing method of the receiving jig which concerns on 1 aspect of this invention is a manufacturing method of the receiving jig for supporting the target object which has a convex shape in the convex surface with the said convex shape, Comprising:
  • the said convex surface is upwards on a base. Placing the object so as to face, covering the at least one of a release film and a cloth from the convex side of the object placed on the base, the release film and the cloth
  • a frame-shaped outer mold having a height relative to the base higher than the height of the convex portion of the convex surface on the base so as to surround the target object covered with at least one of the convex shape when viewed from above.
  • the post-curing Asker C-type hardness tester has a hardness of 60 to 90 degrees and a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ in the frame of the outer mold in which the resin is put, the step of pressing an inner mold having an outer diameter corresponding to the inner diameter of the outer mold against the resin, and the inner mold Heating the resin while pressed against the resin.
  • the manufacturing method of the receiving jig which concerns on 1 aspect of this invention is a manufacturing method of the receiving jig for supporting the target object which has a convex shape in the convex surface with the said convex shape, Comprising: A step of installing a frame-shaped outer mold having an inner diameter surrounding the object in top view, and a hardness by an Asker C-type hardness meter after curing in the outer mold frame installed on the base from 60 degrees At least one of a release film and a cloth on the resin placed in the frame of the outer mold; and a step of adding a resin having a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm.
  • a step of placing the object on at least one of the release film and the cloth covered with the resin such that the convex surface faces downward, and the object is the release film and Of the cloth A step of pressing an inner mold having an outer diameter corresponding to an inner diameter of the outer mold against the object in a frame of the outer mold placed on at least one of the steps; and a step of heating the resin Including.
  • the resin according to one embodiment of the present invention is a resin in which a conductive material is blended in one of a thermosetting resin and a thermoplastic resin, and is one of the thermosetting resin and the thermoplastic resin.
  • the weight part of the conductive material is 0.3 to 20 parts by weight.
  • a receiving jig a manufacturing method thereof, and a resin used in these, which can be easily created and can suppress the influence and stress due to static electricity on the object to be supported.
  • FIG. 1A is a diagram illustrating an example of a board on which components are mounted on one side.
  • FIG. 1B is a side view showing a state in which a receiving jig including support pins supports a substrate.
  • FIG. 1C is a cross-sectional view showing a state where a receiving jig having a processed hole supports a substrate.
  • FIG. 2 is a diagram illustrating an example of a receiving jig according to the embodiment.
  • FIG. 3 is a diagram illustrating a state in which the receiving jig according to the embodiment supports the substrate.
  • FIG. 4 is a cross-sectional view showing a state where the receiving jig according to the embodiment supports the substrate.
  • FIG. 1A is a diagram illustrating an example of a board on which components are mounted on one side.
  • FIG. 1B is a side view showing a state in which a receiving jig including support pins supports a substrate.
  • FIG. 1C is a cross-section
  • FIG. 5 is a flowchart showing an example of a method of manufacturing a receiving jig according to the embodiment.
  • FIG. 6A is a diagram for describing the placing step according to the embodiment.
  • FIG. 6B is a diagram for explaining the steps to be covered according to the embodiment.
  • FIG. 6C is a diagram for explaining the installation step according to the embodiment.
  • FIG. 6D is a diagram for explaining the steps to be performed according to the embodiment.
  • FIG. 6E is a diagram for explaining a pressing step according to the embodiment.
  • FIG. 7 is a cross-sectional view showing a state in which a release film is covered on the substrate in the covering step according to the embodiment.
  • FIG. 8 is a cross-sectional view showing a state in which the release film and the cloth are covered on the substrate in the covering step according to the embodiment.
  • FIG. 9 is a cross-sectional view showing a state in which the resin in the pressing step according to the embodiment is pressed against the release film and the cloth.
  • FIG. 10A is a diagram illustrating an example of a blending amount of a resin blending material according to the embodiment.
  • FIG. 10B is a diagram illustrating another example of the compounding amount of the resin compounding material according to the embodiment.
  • FIG. 11: A is a figure which shows the compounding quantity of the compounding material of the resin which concerns on an Example.
  • FIG. 11B is a diagram illustrating conditions when the resin according to the example is cured.
  • FIG. 11C is a diagram illustrating physical properties of a resin constituting the receiving jig according to the example.
  • the object supported by the receiving jig is often described as the substrate 100.
  • the object is not limited to the substrate 100, and may be a workpiece used in general manufacturing processes such as various industrial products. There may be.
  • FIG. 2 is a diagram illustrating an example of the receiving jig 10 according to the embodiment.
  • FIG. 2 also shows a substrate 100 supported by the receiving jig 10 in addition to the receiving jig 10. Although six components 112 are mounted on the substrate 100 shown in FIG. 2, 1 to 5 components 112 may be mounted, or seven or more components 112 may be mounted.
  • the receiving jig 10 is a receiving jig for supporting an object having a convex shape on a convex surface having the convex shape.
  • the object is a substrate on which at least one component 112 is mounted, and the convex shape is the shape of the component 112 mounted on the substrate 100. Therefore, the receiving jig 10 supports the substrate 100 on the mounting surface 110 on which the component 112 is mounted.
  • the object is not limited to the substrate 100 but may be a workpiece used in general manufacturing processes such as various industrial products.
  • the receiving jig 10 is made of a resin having a concave portion 12 corresponding to the contour of the convex shape (the convex shape of the component 112). That is, the receiving jig 10 itself is a resin.
  • the resin will be described in detail with reference to FIGS. 10A and 10B, which will be described later.
  • the hardness measured by the Asker C-type hardness meter is 60 degrees to 90 degrees, and the volume resistivity is 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ It is a resin that is cm. In other words, this resin is a resin having high conductivity and flexibility.
  • the concave portion 12 has a concave shape obtained when a mold having a convex shape (the convex shape of the component 112) is taken.
  • the recess 12 is not formed by cutting, but is formed by taking the mold of the component 112 mounted on the mounting surface 110. Therefore, as shown in FIG. 2, the concave portion 12 has a concave shape corresponding to the contour of the component 112.
  • the receiving jig 10 has the component 112 on the mounting surface 110 fitted in the recess 12. In this state, the substrate 100 is supported.
  • FIG. 3 is a diagram illustrating a state in which the receiving jig 10 according to the embodiment supports the substrate 100.
  • the receiving jig 10 supports the substrate 100 on the mounting surface 110, so that the component 112 is mounted on the opposite surface 120 of the mounting surface 110 or the substrate 100 is inspected on the opposite surface 120. Etc. Further, since the receiving jig 10 supports the multi-sided substrate, the multi-sided substrate can be divided.
  • FIG. 4 is a cross-sectional view illustrating a state where the receiving jig 10 according to the embodiment supports the substrate 100.
  • FIG. 4 shows a cross section taken along the IV-IV plane shown in FIG.
  • the recess 12 Since the recess 12 is formed by taking the mold of the component 112, the receiving jig 10 supports the substrate 100 while wrapping the component 112 in the recess 12, as shown in FIG. As shown in FIGS. 2 and 4, the recess 12 has a bottom surface smaller than the opening of the recess 12 and has a wall surface inclined from the opening toward the bottom. That is, the recess 12 has an inverted frustum shape.
  • the recess 12 may have an inverted truncated pyramid shape or an inverted truncated cone shape depending on the shape of the component 112.
  • the bottom surface of the recess 12 is the same size as the top surface of the component 112 (the lower surface of the component 112 in FIGS. 2 and 4) fitted in the recess 12, and the recess 12 is directed from the bottom surface toward the opening. It has an expanding shape.
  • the receiving jig 10 has a hardness of 60 to 90 degrees as measured by an Asker C-type hardness meter, and is made of a resin having a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm. It is a tool and is not obtained by cutting, but has a concave recess 12 obtained by taking a convex mold of the object.
  • FIG. 5 is a flowchart showing an example of a method for manufacturing the receiving jig 10 according to the embodiment.
  • a person performs a method for manufacturing the receiving jig 10, but a machine for manufacturing the receiving jig 10 may be used. Details of step S11 to step S15 will be described with reference to FIGS. 6A to 6E.
  • the object 100, the convex surface, and the convex shape portion are mounted on the substrate 100 shown in FIG. A surface 110 and a part 112 are provided.
  • Step S11 the object is placed on the base so that the convex surface of the object faces upward (step S11). Step S11 will be described with reference to FIG. 6A.
  • FIG. 6A is a diagram for explaining the placing step according to the embodiment.
  • the base 50 has, for example, a substantially rectangular parallelepiped shape, and the substrate 100 is placed on the surface of the base 50. At this time, the substrate 100 is placed on the base 50 so that the mounting surface 110, which is the surface supported by the receiving jig 10, faces upward.
  • Step S12 At least one of the release film and the cloth is put on the convex surface side of the object placed on the base 50 (step S12). Step S12 will be described with reference to FIG. 6B.
  • FIG. 6B is a diagram for explaining the steps to be covered according to the embodiment.
  • FIG. 6B shows a state where the release film 20 is placed on the substrate 100.
  • the release film 20 used in step S12 needs to be a film that satisfies a plurality of conditions shown below. Although details will be described later, since the receiving jig 10 is formed by taking a mold through the release film 20, when the release film 20 expands and contracts, the surface of the receiving jig 10 becomes the release film 20. It becomes a wavy shape due to the expansion and contraction of. Therefore, the release film 20 needs to be a film with a small amount of expansion and contraction due to heat and pressure. Moreover, when the resin put in step S14 described later adheres to the release film 20, the shape of the receiving jig 10 such as the recess 12 may be collapsed when the release film 20 and the resin are peeled off.
  • the mold film 20 needs to be a film that is difficult to adhere. Further, when the resin penetrates into the release film 20, the object is contaminated. Therefore, the release film 20 needs to be a film in which the resin does not easily penetrate. Further, the release film 20 needs to be a film that can withstand the heating of the resin in step S16 described later.
  • the heat resistant temperature of the release film 20 is preferably about 100 to 400 degrees, and more preferably 200 degrees or more. Further, the release film 20 needs to be a film that can clearly mold the part 112 on the mounting surface 110 even through the release film 20.
  • fills the conditions mentioned above may be used instead of the release film 20 by step S12.
  • a fluororesin film, a silicon resin film, a heat-resistant film coated with a release agent, or the like is used as the release film 20 that satisfies these conditions.
  • the resin is put without the release film 20 being placed on the substrate 100, the substrate 100 is contaminated by the resin, and adheres to the substrate 100 when the resin is cured. In order to prevent these, the release film 20 is placed on the substrate 100. Step S12 will be described in more detail with reference to FIG.
  • Step S13 a frame-shaped outer portion whose height relative to the base 50 is higher than the height of the convex portion of the convex surface so as to surround the target object covered with at least one of the release film 20 and the cloth in a top view of the target object.
  • the mold is installed on the base 50 (step S13). Step S13 will be described with reference to FIG. 6C.
  • FIG. 6C is a diagram for explaining the installation steps according to the embodiment.
  • the outer mold 60 which is a frame-shaped mold, is used to copy the shape of the component 112 mounted on the mounting surface 110 of the substrate 100 with the resin put in step S14.
  • the outer mold 60 has, for example, a rectangular tube shape, and the size in the frame of the outer mold 60 in a top view is substantially the same as or slightly larger than the size of the substrate 100, so that the substrate 100 can be surrounded by the outer mold 60. .
  • the outer mold 60 is installed on the base 50 while surrounding the substrate 100.
  • the height of the outer mold 60 from the base 50 when the outer mold 60 is installed on the base 50 is higher than the height of the component 112 from the base 50 when the substrate 100 is placed on the base 50.
  • Step S14 resin is put in the frame of the outer mold 60 installed on the base 50 (step S14). Step S14 will be described with reference to FIG. 6D.
  • FIG. 6D is a diagram for explaining the steps to be performed according to the embodiment.
  • the resin 40 is put on the release film 20 in the frame of the outer mold 60.
  • the resin 40 is a resin having a hardness of 60 degrees to 90 degrees as measured by an Asker C-type hardness meter and a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm after curing.
  • the resin 40 is, for example, a liquid resin.
  • the amount in which the resin 40 is put is an amount corresponding to 20% to 95% of the volume in the frame of the outer mold 60.
  • the resin 40 may be a plate-like, particle-like (particle size is not particularly limited), pellet-like, or gel-like resin.
  • the resin 40 is in the form of particles, a larger amount of the resin 40 is added than in the case where the resin 40 is in the form of gel.
  • the resin 40 is cured in a state in which the concave portion 12 corresponding to the convex contour of the object is formed when the receiving jig 10 is formed.
  • Step S15 an inner mold having an outer diameter corresponding to the inner diameter of the outer mold 60 is pressed against the resin 40 within the frame of the outer mold 60 in which the resin 40 is placed (step S15). Step S15 will be described with reference to FIG. 6E.
  • FIG. 6E is a diagram for explaining the pressing step according to the embodiment.
  • an inner mold 70 having an outer diameter matching the inner diameter of the outer mold 60 is used, and in order to clarify the convex shape of the component 112 of the substrate 100 when the resin 40 is cured, within the frame of the mold 60, pressure is applied to the resin 40 from above by the inner mold 70.
  • a lid 80 is provided on the upper part of the inner mold 70.
  • the size of the lid 80 when viewed from above is, for example, a size corresponding to the outer diameter of the outer mold 60. Step S15 will be described in more detail with reference to FIG.
  • the base 50, the outer mold 60, and the inner mold 70 are less deformed even in a temperature environment of 80 ° C. or higher, such as metal or wood, and do not burn, burn, or produce contaminants.
  • the material is used.
  • the mold is subjected to non-adhesive surface treatment so that the resin 40 put in step S14 does not stick to the mold when cured.
  • Non-adhesive surface treatment is, for example, fluorine resin coating treatment, silicon resin coating treatment, non-adhesive composite coating treatment, or the like.
  • the thickness of the non-adhesive surface treatment is, for example, 200 ⁇ m or less.
  • the resin 40 is heated in a state where the inner mold 70 is pressed against the resin 40 (step S16).
  • the resin 40 is, for example, a liquid resin that is a thermosetting resin
  • the resin 40 is cured by being heated.
  • the resin 40 is heated at a temperature of 70 to 360 degrees, for example, according to the heat-resistant temperature of the substrate 100 or the like. Moreover, it heats for 10 minutes to 70 minutes according to heating temperature, for example.
  • the relationship between the heating time and the heating temperature is, for example, 100 to 120 degrees for 60 minutes and 200 to 260 degrees for about 30 minutes, but there are variations in the environment around the furnace body. Further, the heating temperature and the heating time are controlled by the type of the curing agent included in the resin 40.
  • the resin 40 is a resin having thermoplasticity, for example, a resin in a plate shape, a particle shape, or a pellet shape
  • the resin 40 is heated and semi-molten (including softening) in a state where the inner mold 70 is pressed against the resin 40. For example, it is cooled at room temperature and cured.
  • the heating furnace for heating the resin 40 may be a reflow furnace for mounting electronic components.
  • a heating furnace is an apparatus which can heat the resin 40, it will not specifically limit.
  • the resin 40 is a resin having thermoplasticity
  • the resin 40 is heated and semi-molten before the step of putting it into the frame of the outer mold 60. May be entered.
  • the resin 40 is cooled and cured at room temperature, for example, with the inner mold 70 pressed against the resin 40.
  • the cured resin 40 is taken out from the mold, and the cured resin 40 becomes the receiving jig 10.
  • step S12 will be described with reference to FIG.
  • FIG. 7 is a cross-sectional view showing a state in which the release film 20 is covered on the substrate 100 in the covering step according to the embodiment.
  • FIG. 7 shows a cross section at a location where three parts 112 on the near side in FIG. 6B are arranged. 7 and the subsequent drawings will be described using the substrate 100, the mounting surface 110, and the component 112 shown in FIG. 2 as the object, the convex surface, and the convex shape portion, respectively.
  • the mold release film 20 placed on the substrate 100 enters between the components 112 as shown in FIG. There is a need.
  • the release film 20 should be thin and easy to bend.
  • the thickness of the release film 20 is, for example, 25 ⁇ m to 500 ⁇ m.
  • a cloth may be used instead of the release film 20.
  • the thickness of the cloth is, for example, 500 ⁇ m to 1000 ⁇ m.
  • the release film 20 is placed on the substrate 100 while the space 22 is provided outside the side surface of the component 112. That is, the release film 20 is placed on the substrate 100 so that the side surface of the component 112 and the release film 20 do not adhere to each other. Thereby, the part which has wrapped the components 112 of the release film 20 becomes a frustum shape. Therefore, as described with reference to FIG. 4, the recess 12 has an inverted frustum shape formed by taking a frustum-shaped mold.
  • the release film 20 covered on the substrate 100 may be one sheet or a plurality of sheets. A plurality of types of films having different properties may be laminated on the substrate 100 in order to reduce expansion and contraction of the release film 20 due to heating in step S16. Moreover, the release film 20 having the same property may be laminated on the substrate 100. Even when a cloth is used instead of the release film 20, the cloth covered on the substrate 100 may be one sheet or plural sheets. In order to reduce the expansion and contraction of the cloth due to heating in step S16, a plurality of types of cloth having different properties may be laminated on the substrate 100. A cloth having the same property may be laminated on the substrate 100.
  • both the release film 20 and the cloth may be put on the substrate 100.
  • FIG. 8 is a cross-sectional view showing a state in which the release film 20 and the cloth 30 are covered with the substrate 100 in the covering step according to the embodiment.
  • FIG. 8 shows a cross section at a position where three parts 112 on the near side in FIG. 6B are arranged when both the release film 20 and the cloth 30 are covered with the substrate 100.
  • Resin 40 may shrink after being cured. That is, the size of the recess 12 of the receiving jig 10 may be reduced. Therefore, a cloth 30 having a thickness corresponding to the shrinkage amount of the resin 40 is placed on the substrate 100. In addition, when both the release film 20 and the cloth 30 are covered on the substrate 100, the release film 20 may be covered after the cloth 30 is covered on the substrate 100. Thereby, it is not necessary to use a cloth having the property that the resin 40 is difficult to adhere as the cloth 30.
  • step S15 Details of step S15 will be described with reference to FIG.
  • FIG. 9 is a cross-sectional view showing a state where the resin 40 is pressed against the release film 20 and the cloth 30 in the pressing step according to the embodiment.
  • a screw 90 and a spring 92 not shown in FIG. 6E are shown.
  • the screws 90 are provided through the lid 80 at four corners in the top view of the lid 80, and the spring 92 is provided between the lid 80 and the screw head of the screw 90.
  • FIG. 9 for the sake of explanation, a cross section of a part where three parts 112 are arranged and a part where a screw 90 and a spring 92 are provided is shown on one drawing.
  • a clearance a is provided between the outer peripheral surface of the mold 70.
  • the resin 40 is pressed against the inner mold 70 in a state where the clearance a is 50 ⁇ m to 300 ⁇ m.
  • the size of the clearance a is selected from the above range depending on the viscosity of the resin 40 and the like.
  • the receiving jig 10 mounting or inspection is performed on the substrate 100 while the substrate 100 is supported by the receiving jig 10, so that the surface that supports the mounting surface 110 of the receiving jig 10 and the opposite surface are horizontal. There must be. Therefore, when the receiving jig 10 is created, the resin 40 needs to be pressed against the inner mold 70 with the bottom surface of the inner mold 70 being horizontal with respect to the surface of the base 50 on which the substrate 100 is placed. Moreover, when the resin 40 is heated in a state where it is pressed against the inner mold 70, it is necessary to keep the respective surfaces horizontal.
  • the method of keeping each surface horizontal is not particularly limited, but for example, a screw, a ball screw, a belt, a weight, or a spring is used.
  • screws 90 and springs 92 are used to keep the respective surfaces horizontal.
  • a plurality of screws 90 (for example, screws 90 provided at the four corners of the lid 80) passing through the lid 80 are screwed into the outer mold 60 while adjusting the screwing amounts, so that each surface is kept horizontal.
  • the resin 40 is pressed against the inner mold 70.
  • a spiral spring 92 is used as a buffer between the screw head of the screw 90 and the lid 80. This further improves the horizontal accuracy.
  • the hardness of the Asker C-type hardness tester is 60 to 90 degrees and the volume resistivity is 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm.
  • a receiving jig 10 having a concave recess 12 obtained by taking a convex mold of the object is created.
  • the receiving jig 10 can be cut by a router or the like, and the shape of the recess 12 can be easily corrected after the receiving jig 10 is formed.
  • FIG. 10A is a diagram illustrating an example of the blending amount of the blending material of the resin 40 according to the embodiment.
  • the resin 40 is a resin in which at least a conductive material is blended in one of a thermosetting resin and a thermoplastic resin (uniform dispersion blending: hereinafter also referred to as uniform blending). As shown in FIG. 10A, the weight of the conductive material is 0.3 to 20 parts by weight with respect to one of the thermosetting resin and the thermoplastic resin. Thus, the resin 40 becomes a resin having a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm after curing.
  • thermosetting resin is, for example, an epoxy resin, a urethane resin, a silicon resin, a fluorine resin, a polyimide resin, an acrylic resin, or a phenol resin.
  • Thermoplastic resins include, for example, low molecular weight polyethylene resin, thermoplastic urethane resin, vinyl chloride resin, polypropylene resin, acrylonitrile styrene resin, styrene resin, acrylic resin, methacrylic resin, polyethylene terephthalate resin, polyvinylidene chloride resin, polyvinylidene fluoride, Polyamide resin, acetal resin, polycarbonate resin or polybutylene terephthalate resin.
  • the conductive material is a carbon allotrope containing carbon nanotubes, graphene, or graphite.
  • FIG. 10B is a diagram illustrating another example of the blending amount of the blending material of the resin 40 according to the embodiment.
  • the resin 40 when an epoxy resin is included as a blending material for the resin 40, the resin 40 is obtained by blending a carbon allotrope that is a conductive material, a curing agent, and a curing accelerator in the epoxy resin.
  • the part by weight of the curing agent is 100 to 800 parts by weight
  • the part by weight of the curing accelerator is 1 to 20 parts by weight.
  • the resin 40 has a volume resistivity of 10 2 ⁇ ⁇ cm ⁇ 10 7 ⁇ ⁇ cm next after heat curing, and comprises a resin hardness in Asker C hardness meter is 90 degrees 60 degrees.
  • Curing agents are acid anhydride compounds, diamine compounds, and dialcohol compounds.
  • the curing accelerator is an amine compound.
  • the resin 40 blended in this way becomes the receiving jig 10 by being heated and cured by the method for manufacturing the receiving jig 10 described above.
  • FIG. 11A is a diagram showing a blending amount of the blending material of the resin 40 according to the example.
  • the epoxy resin (flexible epoxy resin) shown in FIG. 11A is an epoxy resin in Example 1, and is a flexible epoxy resin in Examples 2 and 3.
  • thermosetting resin is a bisphenol F type epoxy resin.
  • the curing agent is a mixture in which a polyacid polyanhydride having a long-chain alkyl group and tetrahydromethylphthalic anhydride are mixed.
  • the curing accelerator is 1.8 azabicycloundecene.
  • the conductive material is a multi-walled carbon nanotube.
  • thermosetting resin is a mixture of a bisphenol F-type epoxy resin and a modified epoxy resin.
  • the curing agent is a polyacid polyanhydride having a long chain alkyl group.
  • the curing accelerator is 1.8 azabicycloundecene.
  • the conductive material is a multi-walled carbon nanotube.
  • thermosetting resin is a mixture of a bisphenol F type epoxy resin and a modified epoxy resin.
  • the curing agent is a mixture in which a polyacid polyanhydride having a long-chain alkyl group and tetrahydromethylphthalic anhydride are mixed.
  • the curing accelerator is 1.8 azabicycloundecene.
  • the conductive material is a multi-walled carbon nanotube.
  • Resin 40 is a resin that includes the above-described blending materials in Examples 1 to 3 and is blended in the blending amount shown in FIG. 11A.
  • FIG. 11B is a diagram illustrating conditions when the resin 40 according to the example is cured.
  • Step S16 in the heating step in Examples 1 to 3 (Step S16), all were cured under the same conditions.
  • the resin 40 was cured by heating at a temperature of 120 ° C. for 60 minutes in a thermostatic bath.
  • Examples 1 to 3 aluminum, which is lightweight, low-cost, and has good workability, was used as the material for the mold (base 50, outer mold 60, and inner mold 70).
  • a fluororesin coating treatment was performed with an accuracy of 100 ⁇ m or less.
  • the release film 20 was covered with a fluororesin film (heat-resistant temperature 220 degrees) and the cloth 30.
  • FIG. 11C the physical properties of the resin constituting the receiving jig 10 manufactured under the conditions of Examples 1 to 3 described in FIGS. 11A and 11B are shown in FIG. 11C.
  • FIG. 11C is a diagram illustrating physical properties of the resin constituting the receiving jig 10 according to the example.
  • the volume resistivity is 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm as the physical properties of the resin constituting the receiving jig 10, and the Asker C type.
  • the hardness measured by a hardness meter is 60 degrees to 90 degrees.
  • the receiving jig 10 is a receiving jig for supporting an object having a convex shape on a convex surface having the convex shape, and has a recess 12 corresponding to the contour of the convex shape. Consists of.
  • the recess 12 has a concave shape obtained when a convex mold is taken.
  • the resin is a resin having a hardness of 60 to 90 degrees as measured by an Asker C-type hardness meter and a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm.
  • the receiving jig 10 is easily produced only by taking a type
  • the receiving jig 10 is made of a resin having a volume resistivity of 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm, even when the object is the substrate 100 on which the component 112 is mounted, the leakage current due to static electricity In addition, it is possible to suppress contamination of the target object with dust. In this way, it is possible to provide the receiving jig 10 that can be easily created and can suppress the influence and stress due to static electricity on the object to be supported.
  • the object is the substrate 100 or the workpiece on which at least one component 112 is mounted.
  • the influence and stress due to static electricity on the workpiece used in the general manufacturing process such as the substrate 100 or various industrial products can be suppressed.
  • the substrate 100 is supported on the mounting surface 110 on which the component 112 is mounted, and can easily be applied to the opposite surface 120 of the mounting surface 110 while suppressing the influence and stress due to static electricity on the object. Parts can be mounted.
  • the substrate 100 can be easily inspected on the opposite surface 120 of the substrate 100. Further, when the substrate 100 is a multi-sided substrate, the substrate 100 can be easily divided.
  • the recess 12 has a bottom surface smaller than the opening of the recess 12 and has a wall surface inclined from the opening toward the bottom.
  • the convex shape of the object fits into the concave portion 12 by sliding the inclined wall surface of the concave portion 12 from the opening side to the bottom surface side, so that the target object can be easily set on the jig 10.
  • the resin constituting the receiving jig 10 is a resin in which a conductive material is blended with one of a thermosetting resin and a thermoplastic resin, and one of the thermosetting resin and the thermoplastic resin.
  • the weight part of the conductive material is 0.3 to 20 parts by weight.
  • the volume resistivity of the resin constituting the receiving jig 10 can be 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm.
  • the thermosetting resin is an epoxy resin, a urethane resin, a silicon resin, a fluorine resin, a polyimide resin, an acrylic resin, or a phenol resin.
  • Thermoplastic resin is low molecular weight polyethylene resin, thermoplastic urethane resin, vinyl chloride resin, polypropylene resin, acrylonitrile styrene resin, styrene resin, acrylic resin, methacrylic resin, polyethylene terephthalate resin, polyvinylidene chloride resin, polyvinylidene fluoride, polyamide resin An acetal resin, a polycarbonate resin or a polybutylene terephthalate resin.
  • the conductive material is a carbon allotrope containing carbon nanotubes, graphene, or graphite.
  • the resin constituting the receiving jig 10 can be selected and blended from the above materials.
  • the conductive material is a carbon allotrope such as carbon nanotube, graphene, or graphite
  • the strength against peeling is higher than when the resin constituting the receiving jig 10 is a carbon-containing resin. Therefore, it is difficult for dust due to carbon peeling to occur, and when the target is the substrate 100 or the like, it is possible to suppress the occurrence of a market defect such as an unnecessary short circuit on the substrate 100 due to dust.
  • the resin constituting the receiving jig 10 is a resin in which a conductive material, a curing agent, and a curing accelerator are blended with an epoxy resin as a thermosetting resin.
  • the curing agent is an acid anhydride compound, a diamine compound, or a dialcohol compound
  • the curing accelerator is an amine compound.
  • the weight part of the curing agent is 100 parts by weight to 800 parts by weight and the weight part of the curing accelerator is 1 part by weight to 20 parts by weight with respect to the thermosetting resin.
  • tool 10 is made flexible by mix
  • the Asker C-type hardness of the resin that constitutes the receiving jig 10 by blending 100 parts by weight to 800 parts by weight of the curing agent and 1 part by weight to 20 parts by weight of the curing accelerator. The hardness by the meter can be changed from 60 degrees to 90 degrees.
  • the epoxy resin is a bisphenol F type epoxy resin.
  • the epoxy resin is a flexible epoxy resin in which a bisphenol F-type epoxy resin and one of an aliphatic epoxy resin and a modified epoxy resin are mixed.
  • the curing agent is a polyacid polyanhydride having a long chain alkyl group or a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethylphthalic anhydride.
  • the curing accelerator is 1.8 azabicycloundecene.
  • the conductive material is a multi-walled carbon nanotube.
  • the characteristics of the resin constituting the receiving jig 10 can be made as shown in FIG. 11C.
  • the manufacturing method of the receiving jig 10 is a manufacturing method of a receiving jig for supporting an object having a convex shape on a convex surface having a convex shape.
  • the manufacturing method includes a step of placing an object such that the convex surface faces upward on the base 50, and at least one of the release film 20 and the cloth 30 from the convex surface side of the object placed on the base 50. Covering the step.
  • the said manufacturing method is higher than the said height of the convex-shaped part of a convex surface so that the target with which at least one of the release film 20 and the cloth 30 was covered may be enclosed in the top view of a target object.
  • the hardness of the hardened Asker C-type hardness meter is 60 to 90 degrees and the volume resistivity is 10 2 ⁇ ⁇ cm in the frame of the outer mold 60 installed on the base 50.
  • the manufacturing method also includes a step of pressing an inner mold 70 having an outer diameter corresponding to the inner diameter of the outer mold 60 against the resin 40 in a frame of the outer mold 60 in which the resin 40 is placed, and a step of heating the resin 40. And including.
  • the receiving jig 10 can be easily created simply by taking a mold as compared to the supporting pin or cutting receiving jig. Further, since the receiving jig 10 is made of a flexible resin having a hardness of 60 degrees to 90 degrees as measured by an Asker C type hardness tester, scratches or stress is given to the object supported by the receiving jig 10. Absent. Furthermore, since the receiving jig 10 has the recessed part 12 which took the type
  • the volume resistivity is a resin which is 10 2 ⁇ ⁇ cm ⁇ 10 7 ⁇ ⁇ cm, even if the substrate 100 where the object is mounted in the component 112, the leakage current due to static electricity It is possible to suppress the contamination of the object due to dust. In this way, it is possible to provide the receiving jig 10 that can be easily created and can suppress the influence and stress due to static electricity on the object to be supported. Moreover, since the convex mold
  • the resin 40 is heated in a state where the inner mold 70 is pressed against the resin 40 after the pressing step. Further, in the heating step, the resin 40 may be heated before the adding step, and in the adding step, the resin 40 heated in the heating step may be put in the frame of the outer mold 60.
  • the receiving jig 10 can be created even if the order of heating the resin 40 is changed.
  • the object is the substrate 100 or the workpiece on which at least one component 112 is mounted.
  • the release film 20 is a film in which a release agent is coated on a fluororesin film, a silicon resin film, or a heat-resistant film.
  • the surface of the receiving jig 10 is suppressed from being wavy due to the expansion and contraction of the release film 20.
  • the cured resin 40 is less likely to adhere to the release film 20
  • the shape of the receiving jig 10 such as the recess 12 is prevented from collapsing when the release film 20 and the cured resin are peeled off.
  • the release film 20 can withstand the heating temperature when the resin 40 is heated.
  • a convex mold on the convex surface of the object can be clearly obtained even through the release film 20.
  • the outer mold 60 and the inner mold 70 are molds that have been subjected to fluorine resin coating treatment, silicon resin coating treatment, or non-adhesive composite coating treatment.
  • the cured resin 40 is less likely to adhere to the outer mold 60 and the inner mold 70, so that the shape of the receiving jig 10 may collapse when the outer mold 60, the inner mold 70 and the cured resin 40 are peeled off. It is suppressed.
  • the inner mold 70 is pressed in a state where the clearance a between the inner peripheral surface of the outer mold 60 and the outer peripheral surface of the inner mold 70 is 50 ⁇ m to 300 ⁇ m.
  • the resin 40 is heated at a temperature of 70 to 360 degrees.
  • the resin 40 is heated at a temperature of 70 to 360 degrees, so that the resin 40 is cured when the resin 40 is a thermosetting resin, and is semi-molten when the resin 40 is a thermoplastic resin. Then it is cooled and hardened. Then, the resin 40 is 90 degrees from the hardness of 60 degrees due to curing after the Asker-C hardness meter, and the volume resistivity is in the resin is 10 2 ⁇ ⁇ cm ⁇ 10 7 ⁇ ⁇ cm.
  • the resin 40 is a resin in which a conductive material is blended with one of a thermosetting resin and a thermoplastic resin, and the weight part of the conductive material with respect to one of the thermosetting resin and the thermoplastic resin. Is 0.3 to 20 parts by weight.
  • the volume resistivity of the resin 40 can be set to 10 2 ⁇ ⁇ cm to 10 7 ⁇ ⁇ cm.
  • the thermosetting resin is an epoxy resin, a urethane resin, a silicon resin, a fluorine resin, a polyimide resin, an acrylic resin, or a phenol resin.
  • Thermoplastic resin is low molecular weight polyethylene resin, thermoplastic urethane resin, vinyl chloride resin, polypropylene resin, acrylonitrile styrene resin, styrene resin, acrylic resin, methacrylic resin, polyethylene terephthalate resin, polyvinylidene chloride resin, polyvinylidene fluoride, polyamide resin An acetal resin, a polycarbonate resin or a polybutylene terephthalate resin.
  • the conductive material is a carbon allotrope containing carbon nanotubes, graphene, or graphite.
  • the resin 40 can be selected and blended from the above materials.
  • the conductive material is a carbon allotrope such as carbon nanotube, graphene, or graphite
  • the strength against peeling is higher than when the resin constituting the receiving jig 10 is a carbon-containing resin. Therefore, it is difficult for dust due to carbon peeling to occur, and when the target is the substrate 100 or the like, it is possible to suppress the occurrence of a market defect such as an unnecessary short circuit on the substrate 100 due to dust.
  • the resin 40 is a resin in which an electrically conductive material, a curing agent, and a curing accelerator are blended with an epoxy resin as a thermosetting resin.
  • the curing agent is an acid anhydride compound, a diamine compound, or a dialcohol compound
  • the curing accelerator is an amine compound.
  • the weight part of the curing agent is 100 parts by weight to 800 parts by weight and the weight part of the curing accelerator is 1 part by weight to 20 parts by weight with respect to the thermosetting resin.
  • tool 10 is made flexible by mix
  • the Asker C-type hardness of the resin that constitutes the receiving jig 10 by blending 100 parts by weight to 800 parts by weight of the curing agent and 1 part by weight to 20 parts by weight of the curing accelerator. The hardness by the meter can be changed from 60 degrees to 90 degrees.
  • the epoxy resin is a bisphenol F type epoxy resin.
  • the epoxy resin is a flexible epoxy resin in which a bisphenol F-type epoxy resin and one of an aliphatic epoxy resin and a modified epoxy resin are mixed.
  • the curing agent is a polyacid polyanhydride having a long chain alkyl group or a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethylphthalic anhydride.
  • the curing accelerator is 1.8 azabicycloundecene.
  • the conductive material is a multi-walled carbon nanotube.
  • the characteristics of the resin constituting the receiving jig 10 can be made as shown in FIG. 11C.
  • the receiving jig 10 is created by the method in which the resin 40 is pressed against the object placed on the base 50 shown in the above-described steps S11 to S16, but is not limited thereto.
  • the receiving jig 10 may be created by the following method.
  • a frame-shaped outer mold 60 having an inner diameter that surrounds the object in the top view of the object is installed on the base 50.
  • the hardness by the Asker C-type hardness meter after curing is changed from 60 degrees to 90 degrees, and the volume resistivity is 10 2 ⁇ ⁇ cm to 10 7 ⁇ . ⁇ Put resin 40 to be cm.
  • at least one of the release film 20 and the cloth 30 is put on the resin 40 put in the frame of the outer mold 60.
  • an object is placed on at least one of the release film 20 and the cloth 30 covered with the resin 40 so that the convex surface faces downward.
  • the inner mold 70 having an outer diameter corresponding to the inner diameter of the outer mold 60 is pressed against the object.
  • the resin 40 put in the frame of the outer mold 60 is heated in a state where the inner mold 70 is pressed against the object.
  • the temperature at which the resin 40 is heated is 70 degrees to 360 degrees.
  • the inner mold 70 is pressed in a state where the clearance a between the inner peripheral surface of the outer mold 60 and the outer peripheral surface of the inner mold 70 is 50 ⁇ m to 300 ⁇ m.
  • the receiving jig 10 can be easily created.
  • the resin 40 may be heated in advance before being put into the frame of the outer mold 60. Moreover, after the resin 40 is put in the frame of the outer mold 60, it may be heated before at least one of the release film 20 and the cloth 30 is covered. Specifically, in the case where the resin 40 is a resin having thermoplasticity, for example, a resin in the form of a plate, a particle, or a pellet, the resin 40 is heated in advance before the resin 40 is put into the frame of the outer mold 60. Then, after being semi-melted, it may be put in the frame of the outer mold 60.
  • the resin 40 is a resin having thermoplasticity, for example, a resin in the form of a plate, a particle, or a pellet
  • the resin 40 is heated in advance before the resin 40 is put into the frame of the outer mold 60. Then, after being semi-melted, it may be put in the frame of the outer mold 60.
  • the resin 40 instead of heating the resin 40 put in the frame of the outer mold 60 with the inner mold 70 pressed against the object, the resin 40 is pressed with the inner mold 70 pressed against the object. For example, it is cooled at room temperature and cured. Further, the resin 40 may be heated after being put in the frame of the outer mold 60, and at least one of the release film 20 and the cloth 30 may be covered with the heated resin 40. Thus, the receiving jig 10 can be created even if the order of heating the resin 40 is changed.
  • the present invention can be applied to a jig for mounting or inspecting a substrate or the like as an object, or a support jig for stably supporting an intermediate workpiece having various complex structures.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention porte sur un gabarit de serrage (10) facilement reproductible, pouvant réduire au minimum les effets dérivés de l'électricité statique et les contraintes sur un objet étant porté, qui est utilisé pour porter un objet ayant une forme convexe sur une surface convexe à laquelle ladite forme convexe est donnée, ledit gabarit (10) comprenant une résine comportant un évidement (12) qui correspond au contour de la forme convexe, l'évidement (12) présentant une forme évidée obtenue lorsqu'un moule de la forme convexe est enlevé, et le gabarit de serrage (10) étant une résine qui présente une dureté de 60 à 90 degrés selon un duromètre Asker C et une résistivité transversale de 102 Ω•cm à 107 Ω•cm.
PCT/JP2016/088126 2016-02-09 2016-12-21 Gabarit de serrage, procédé de fabrication de gabarit de serrage, et résine WO2017138266A1 (fr)

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JPS6330578A (ja) * 1986-07-24 1988-02-09 Shikoku Chem Corp エポキシ樹脂系レジストインク組成物
JPH07288394A (ja) * 1994-04-19 1995-10-31 Matsushita Electric Ind Co Ltd 基板の支持方法とこれに用いる支持部材、この支持部材の製造方法およびこの支持部材を用いる作業装置
JP2002009487A (ja) * 2000-06-19 2002-01-11 Sharp Corp プリント基板保持治具の製造方法およびプリント基板保持治具
JP2010171069A (ja) * 2009-01-20 2010-08-05 Mitsubishi Chemicals Corp 太陽電池封止材用エポキシ樹脂組成物及び太陽電池
JP2012092201A (ja) * 2010-10-26 2012-05-17 Kyocera Chemical Corp 導電性樹脂組成物およびそれを用いた半導体装置
JP2012097282A (ja) * 2004-04-30 2012-05-24 Kureha Corp 封止用樹脂組成物及び樹脂封止された半導体装置

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JP5257200B2 (ja) * 2009-03-30 2013-08-07 三菱エンジニアリングプラスチックス株式会社 導電性樹脂組成物及び導電性樹脂成形品
KR101662368B1 (ko) * 2013-07-26 2016-10-04 롯데첨단소재(주) 전도성 시트 조성물

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JPS60141725A (ja) * 1983-12-29 1985-07-26 Okamura Seiyu Kk ポリ酸ポリ無水物粉体
JPS6330578A (ja) * 1986-07-24 1988-02-09 Shikoku Chem Corp エポキシ樹脂系レジストインク組成物
JPH07288394A (ja) * 1994-04-19 1995-10-31 Matsushita Electric Ind Co Ltd 基板の支持方法とこれに用いる支持部材、この支持部材の製造方法およびこの支持部材を用いる作業装置
JP2002009487A (ja) * 2000-06-19 2002-01-11 Sharp Corp プリント基板保持治具の製造方法およびプリント基板保持治具
JP2012097282A (ja) * 2004-04-30 2012-05-24 Kureha Corp 封止用樹脂組成物及び樹脂封止された半導体装置
JP2010171069A (ja) * 2009-01-20 2010-08-05 Mitsubishi Chemicals Corp 太陽電池封止材用エポキシ樹脂組成物及び太陽電池
JP2012092201A (ja) * 2010-10-26 2012-05-17 Kyocera Chemical Corp 導電性樹脂組成物およびそれを用いた半導体装置

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