WO2017122974A3 - 회로 기판 - Google Patents

회로 기판 Download PDF

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Publication number
WO2017122974A3
WO2017122974A3 PCT/KR2017/000255 KR2017000255W WO2017122974A3 WO 2017122974 A3 WO2017122974 A3 WO 2017122974A3 KR 2017000255 W KR2017000255 W KR 2017000255W WO 2017122974 A3 WO2017122974 A3 WO 2017122974A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
circuit
base substrate
present
part area
Prior art date
Application number
PCT/KR2017/000255
Other languages
English (en)
French (fr)
Other versions
WO2017122974A2 (ko
Inventor
이경열
이경욱
정준상
이양석
김만
이주열
이상열
Original Assignee
삼원액트 주식회사
주식회사 이모트
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼원액트 주식회사, 주식회사 이모트, 한국기계연구원 filed Critical 삼원액트 주식회사
Priority to US16/069,893 priority Critical patent/US11291123B2/en
Publication of WO2017122974A2 publication Critical patent/WO2017122974A2/ko
Publication of WO2017122974A3 publication Critical patent/WO2017122974A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Abstract

본 발명은 회로부 영역과 단자부 영역을 포함하는 베이스 기판; 상기 베이스 기판의 상부에 형성되는 회로 패턴; 및 상기 회로 패턴의 상부에 형성되는 저융점 금속층을 포함하는 회로 기판에 관한 것으로, 포토레지스트 공정을 배제하여 제조시간과 제조단가를 낮출 수 있는 회로기판을 제조할 수 있다.
PCT/KR2017/000255 2016-01-13 2017-01-09 회로 기판 WO2017122974A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/069,893 US11291123B2 (en) 2016-01-13 2017-01-09 Circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0004150 2016-01-13
KR1020160004150A KR102315634B1 (ko) 2016-01-13 2016-01-13 회로 기판

Publications (2)

Publication Number Publication Date
WO2017122974A2 WO2017122974A2 (ko) 2017-07-20
WO2017122974A3 true WO2017122974A3 (ko) 2018-08-02

Family

ID=59311980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/000255 WO2017122974A2 (ko) 2016-01-13 2017-01-09 회로 기판

Country Status (3)

Country Link
US (1) US11291123B2 (ko)
KR (1) KR102315634B1 (ko)
WO (1) WO2017122974A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4368503A (en) * 1979-05-24 1983-01-11 Fujitsu Limited Hollow multilayer printed wiring board
JPH05335712A (ja) * 1992-06-01 1993-12-17 Alps Electric Co Ltd プリント配線板のスルーホールおよびその形成方法
JPH0864966A (ja) * 1994-08-25 1996-03-08 Hokuriku Electric Ind Co Ltd 多層プリント基板とその製造方法
KR101139050B1 (ko) * 2004-09-03 2012-04-30 파나소닉 주식회사 범프 형성 방법 및 땜납 범프
WO2014058265A1 (ko) * 2012-10-12 2014-04-17 주식회사 잉크테크 회로패턴 및 통홀 내 도통라인을 인쇄하여 형성하는 양면인쇄회로기판 형성방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2044494B2 (de) * 1970-09-08 1972-01-13 Siemens AG, 1000 Berlin u 8000 München Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
AU5316996A (en) * 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
EP1332654B1 (en) * 2000-11-10 2005-01-12 Unitive Electronics, Inc. Methods of positioning components using liquid prime movers and related structures
KR100957418B1 (ko) 2009-06-26 2010-05-11 손경애 인쇄회로기판의 제조방법 및 그에 따라서 제조된 인쇄회로기판
US9466590B1 (en) * 2015-11-13 2016-10-11 International Business Machines Corporation Optimized solder pads for microelectronic components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4368503A (en) * 1979-05-24 1983-01-11 Fujitsu Limited Hollow multilayer printed wiring board
JPH05335712A (ja) * 1992-06-01 1993-12-17 Alps Electric Co Ltd プリント配線板のスルーホールおよびその形成方法
JPH0864966A (ja) * 1994-08-25 1996-03-08 Hokuriku Electric Ind Co Ltd 多層プリント基板とその製造方法
KR101139050B1 (ko) * 2004-09-03 2012-04-30 파나소닉 주식회사 범프 형성 방법 및 땜납 범프
WO2014058265A1 (ko) * 2012-10-12 2014-04-17 주식회사 잉크테크 회로패턴 및 통홀 내 도통라인을 인쇄하여 형성하는 양면인쇄회로기판 형성방법

Also Published As

Publication number Publication date
US11291123B2 (en) 2022-03-29
KR20170084826A (ko) 2017-07-21
US20190029124A1 (en) 2019-01-24
KR102315634B1 (ko) 2021-10-22
WO2017122974A2 (ko) 2017-07-20

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