WO2017113797A1 - 柔性电路板及移动终端 - Google Patents

柔性电路板及移动终端 Download PDF

Info

Publication number
WO2017113797A1
WO2017113797A1 PCT/CN2016/093913 CN2016093913W WO2017113797A1 WO 2017113797 A1 WO2017113797 A1 WO 2017113797A1 CN 2016093913 W CN2016093913 W CN 2016093913W WO 2017113797 A1 WO2017113797 A1 WO 2017113797A1
Authority
WO
WIPO (PCT)
Prior art keywords
pad
line
circuit board
flexible circuit
copper foil
Prior art date
Application number
PCT/CN2016/093913
Other languages
English (en)
French (fr)
Inventor
曾元清
Original Assignee
广东欧珀移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2017113797A1 publication Critical patent/WO2017113797A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits

Definitions

  • the present invention relates to the field of communications, and in particular, to a flexible circuit board and a mobile terminal.
  • the technical problem to be solved by the embodiments of the present invention is to provide a flexible circuit board and a mobile terminal with improved quality.
  • the present invention provides a flexible circuit board, wherein the flexible circuit board includes a substrate layer, the substrate layer includes a first side and a second side disposed opposite the first side, the first side is provided a first pad and a first line connecting the first pads, the second side is provided with a second pad disposed opposite to the first pad, and a second pad is provided In the second line, a conductive member passing through the substrate layer is connected between the second line and the first line.
  • the present invention further provides a mobile terminal, the mobile terminal includes a mobile terminal body, a main board disposed inside the mobile terminal body, and a flexible circuit board, the flexible circuit board includes a substrate layer, and the substrate layer includes a a first side and a second side disposed opposite to the first side, the first side is provided with a first pad and a first line connecting the first pads, and the second side is provided with the first a second pad opposite to a pad, and a second line connecting the second pad, wherein the second line and the first line are connected with a conductive layer passing through the substrate layer Pieces.
  • the flexible circuit board and the mobile terminal provided by the present invention are respectively provided with the first pad and the second pad through the first side and the second side of the substrate layer, and are provided with the first solder a first line of the disk, and a second line connected to the second pad, connected by the conductive member between the first line and the second line, thereby causing the first line and The second line phase guide Passing, thereby preventing the first pad or the second pad from coming off the substrate layer causes the flexible circuit board to be unusable, thereby improving the quality of the flexible circuit board and improving the use performance.
  • FIG. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • Figure 2 is a plan view of the flexible circuit board of Figure 1;
  • FIG. 3 is a structural block diagram of a mobile terminal according to an embodiment of the present invention.
  • the present invention provides a flexible circuit board, wherein the flexible circuit board includes a substrate layer, the substrate layer includes a first side and a second side disposed opposite the first side, the first side is provided a first pad and a first line connecting the first pads, the second side is provided with a second pad disposed opposite to the first pad, and a second pad is provided In the second line, a conductive member passing through the substrate layer is connected between the second line and the first line.
  • the number of the first pad and the second pad are multiple, a plurality of the first pads are arranged side by side on the first side, and a plurality of the second pads are arranged side by side in the Said the second side.
  • first pad and the second pad are both rectangular, the length direction of the first pad is parallel to the length direction of the second pad, and the plurality of the first pads are The alignment direction is perpendicular to the length direction of the first pad.
  • the flexible circuit board further includes a first cover film laminated on the first side and covering the first line, and the second cover film is laminated on the first cover film The second side is described and covers the second line.
  • the first side is provided with a first ground copper foil adjacent to the first pad, and the first cover film is provided with a first empty window corresponding to the first ground copper foil.
  • the second side is provided with a second ground copper foil adjacent to the second pad, and the second cover film is provided with a second empty window corresponding to the second ground copper foil.
  • a ground conductor passing between the substrate layers is connected between the first ground copper foil and the second ground copper foil.
  • the conductive member is 1 mm to 3 mm away from the first pad.
  • the distance between the conductive member and the first pad is 1 mm or 3 mm.
  • first line and the second line are both copper foils.
  • the present invention further provides a mobile terminal, the mobile terminal includes a mobile terminal body, a main board disposed inside the mobile terminal body, and a flexible circuit board, the flexible circuit board includes a substrate layer, and the substrate layer includes a a first side and a second side disposed opposite to the first side, the first side is provided with a first pad and a first line connecting the first pads, and the second side is provided with the first a second pad opposite to a pad, and a second line connecting the second pad, wherein the second line and the first line are connected with a conductive layer passing through the substrate layer Pieces.
  • the number of the first pad and the second pad are multiple, a plurality of the first pads are arranged side by side on the first side, and a plurality of the second pads are arranged side by side in the Said the second side.
  • first pad and the second pad are both rectangular, the length direction of the first pad is parallel to the length direction of the second pad, and the plurality of the first pads are The alignment direction is perpendicular to the length direction of the first pad.
  • the flexible circuit board further includes a first cover film laminated on the first side and covering the first line, and the second cover film is laminated on the first cover film The second side is described and covers the second line.
  • the first side is provided with a first ground copper foil adjacent to the first pad, and the first cover film is provided with a first empty window corresponding to the first ground copper foil.
  • the second side is provided with a second ground copper foil adjacent to the second pad, and the second cover film is provided with a second empty window corresponding to the second ground copper foil.
  • a ground conductor passing between the substrate layers is connected between the first ground copper foil and the second ground copper foil.
  • the distance between the conductive member and the first pad is 1 mm to 3 mm.
  • the distance between the conductive member and the first pad is 1 mm or 3 mm.
  • first line and the second line are both copper foils.
  • the flexible circuit board and the mobile terminal provided by the present invention are respectively provided with the first pad and the second pad through the first side and the second side of the substrate layer, and are provided with the first solder a first line of the disk, and a second line connected to the second pad, connected by the conductive member between the first line and the second line, thereby causing the first line and
  • the second line is electrically conductive, thereby preventing the first pad or the second pad from being separated from the substrate layer, thereby causing the flexible circuit board to be unusable, thereby improving the quality of the flexible circuit board and improving Use performance.
  • the present invention provides a mobile terminal 1 including a mobile terminal body 110 as shown in FIG. 3, a main board 120 disposed inside the mobile terminal body 110, and a flexible circuit board 100.
  • the flexible circuit board 100 is disposed inside the mobile terminal body 110 and electrically connected to the main board 120.
  • the mobile terminal 1 can be a smart mobile terminal such as a mobile phone, a computer, a tablet, a handheld game console or a media player.
  • the mobile terminal 1 is used as a mobile phone as an example for description.
  • the flexible circuit board 100 includes a substrate layer 10 that includes a first side 11 and a second side 12 disposed opposite the first side 11.
  • the first side 11 is provided with a first pad 21 and a first line 31 connecting the first pads 21, and the second side 12 is provided with a second solder opposite to the first pad 21
  • the disk 22 is provided with a second line 32 connecting the second pads 22, and a conductive member 30a passing through the substrate layer 10 is connected between the second line 32 and the first line 31.
  • the distance between the conductive member 30a and the first pad 21 is 1 mm to 3 mm, or 1 mm or 3 mm.
  • the first pad 21 and the second pad 22 are respectively disposed through the first side 11 and the second side 12 of the base material layer 10, and a first line connecting the first pads 21 is provided 31, and a second line 32 connected to the second pad 22, is connected between the first line 31 and the second line 32 by the conductive member 30a, so that the first line 31 and the second line 32 are electrically connected, thereby preventing the first pad 21 or the second pad 22 from being detached from the substrate layer 10, thereby causing the flexible circuit board 100 to be unusable, thereby improving the The quality of the flexible circuit board 100 improves the performance.
  • the substrate layer 10 is a flexible layer, thereby increasing the flexibility of the flexible circuit board 100.
  • the base material layer 10 may be polyimide or polyethylene dipic acid diformate. (Polyethylene terephthalate PET) or the like to facilitate the provision of the first pad 21, the second pad 22, the first line 31, and the second line 32 on the substrate layer 10, and capable of providing an insulating environment so that Etching of the first line 31 and the second line 32.
  • the substrate layer 10 may have a thickness of 20 ⁇ m.
  • the substrate layer 10 includes a land 10a and a wiring region 10b connected to the side of the land 10a. The land 10a is located at the edge of the substrate layer 10.
  • the wiring area 10b has a rectangular shape, and the wiring area 10b includes a first side 101 and a second side 102 which are oppositely disposed. The first side 101 and the second side 102 are disposed in the wiring area. 10b in the length direction. The first side 101 is connected to the weld zone 10a. The second side 102 is disposed away from the weld zone 10a. In other embodiments, the wiring region 10b may also be disposed around the land 10a.
  • the first pad 21 and the second pad 22 are both metal plate members, and the first pad 21 and the second pad 22 may be soldered on a copper foil.
  • a copper foil may be formed on the substrate layer 10.
  • the first pad 21 and the second pad 22 are both used to solder electronic components or are plugged into an external connector.
  • the first pad 21 and the second pad 22 are both located within the land 10a.
  • the shape of the first pad 21 is the same as the shape of the second pad 22, thereby increasing the adaptability of the flexible circuit board 100.
  • the first pad 21 may also be different from the second pad 22, thereby diversifying the structure of the flexible circuit board 100.
  • the first line 31 and the second line 32 are both copper foils, and the first line 31 and the second line 32 may be copper foil engraved on the substrate layer 10. Eclipsed.
  • the first line 31 and the second line 32 are both located in the wiring area 10b, the first line 21 extends along a straight line, and the end of the first line 31 away from the first pad 21 faces the Second side 102.
  • the second line 32 is disposed the same as the first line 31.
  • the length direction of the first line 31 is parallel to the length direction of the wiring area 10b, thereby increasing the flexibility of the flexible circuit board 100, thereby facilitating the use of the flexible circuit board 100, and increasing the flexible circuit board 100.
  • the first line 31 may also extend along a curve
  • the second line 32 may also extend in different directions from the first line 31, respectively.
  • the conductive member 30a is a conductive pillar.
  • the conductive member 30a passes through the substrate layer 10.
  • the substrate layer 10 is provided with a via (not labeled) from the first side 11 toward the second side 12, the via The two open ends are respectively connected to the first line 31 and the second end a line 32, the conductive member 30a is disposed in the via hole, so that both ends of the conductive member 30a are respectively connected to the first line 31 and the second line 32, so that the first line 31 And the second line 32 is parallel to the conductive member 30a, and in the case where the first line 31 is disconnected from the first pad 21, the second pad 22 and the first A line 31 and the second line 32 are in communication, or in the case where the second line 32 is disconnected from the second pad 22, the first pad 21 and the first line 31 are still ensured. Communicating with the second line 32 such that the electrical signals of the first line 31 and the second line 32 are the same, thereby improving the performance of the flexible circuit board 100.
  • the flexible circuit board 100 includes a first copper foil layer 20a and a second copper foil layer 20b.
  • the first copper foil layer 20a is laminated on the first side 11, and the second copper foil layer 20b is laminated.
  • a plurality of the first pads 21 are soldered to the first copper foil layer 20a and located in the land 10a, and an arrangement direction of the plurality of the first pads 21 is perpendicular to a length direction of the wiring region 10b. .
  • a plurality of the second pads 22 are soldered to the second copper foil layer 20b and located in the soldering region 10a, and a plurality of the second pads 22 are arranged in a direction and a plurality of the first solders
  • the arrangement direction of the disks 21 is the same.
  • the number of the first lines 31 and the number of the second lines 32 may be plural.
  • Each of the first lines 31 is disposed on the first copper foil layer 20a, and is located in the wiring area 10b, and each of the first lines 31 may be connected to one of the first pads 21, It is also possible to connect two or three of the first pads 21.
  • each of the second lines 32 is disposed on the second copper foil layer 20b, located in the wiring area 10b, and each of the second lines 32 may be correspondingly connected to one of the second pads. 22, it is also possible to connect two or three of the second pads 22, but the number of the first line 31 and the second line 32 are the same, and each of the first lines 31 and each The second line 32 corresponds to the second line 32.
  • the plurality of the first pads 21 and the plurality of the second pads 22 may also be arrayed in the first copper foil layer 20a and the second copper foil layer 20b, respectively.
  • first pad 21 and the second pad 22 are both rectangular, and the length direction of the first pad 21 is parallel to the length direction of the second pad 22, and the plurality of The arrangement direction of the first pads 21 is perpendicular to the longitudinal direction of the first pads 21.
  • a plurality of the first pads 21 are rectangular, and an arrangement direction of the plurality of the first pads 21 is perpendicular to a length of the first pads 21 to reduce the width of the first pad 21, thereby reducing the width of the flexible circuit board 100, and ensuring that the current carrying area of the first pad 21 is constant, that is, ensuring the The conductive property of the first pad 21 is not affected, so that the flexibility of the flexible circuit board 100 is improved.
  • the structure of the second pad 22 is the same as that of the first pad 21, and details are not described herein again.
  • the flexible circuit board 100 further includes a first cover film 41 and a second cover film 42 stacked on the first side 11 and covering the first line 31, A second cover film 42 is laminated on the second side 12 and covers the second line 32.
  • the first cover film 41 can be hot pressed by using a polyester material.
  • the first cover film 41 is adhered to the first copper foil layer 20a by adhesive, thereby protecting the first line 31 from being damaged or damaged, and at the same time, by using a glue sticking method,
  • the first cover film 41 is more closely connected to the first copper foil layer 20a, and the first cover film 41 is prevented from being displaced to protect the first line 31 exposing the first cover film 41.
  • the second cover film 42 may be hot pressed using a polyester material.
  • the second cover film 42 is adhered to the second copper foil layer 20b by adhesive, thereby protecting the second line 32 from being damaged or damaged, and at the same time, by means of adhesive bonding,
  • the second cover film 42 is more closely connected to the two copper foil layers 20b, and the second cover film 42 is prevented from being displaced to protect the second line 32 exposing the second cover film 42.
  • the first cover film 41 and the second cover film 42 are respectively provided with a first via hole (not labeled) and a second via hole (not labeled) in the solder pad 10a for the first pad 21 And the second pad 22 is passed through such that the first pad 21 and the second pad 22 can be connected to an external electronic component, and the first cover film 41 and the second cover film 42 protects the connection lines around the first pad 21 and the second pad 22, respectively, thereby preventing a short circuit and improving the safety performance of the flexible circuit board 100.
  • first side 11 is provided with a first ground copper foil 33 adjacent to the first pad 21
  • first cover film 41 is disposed with the first empty window 43 corresponding to the first ground copper foil 33
  • second side 12 has a second ground copper foil 34 adjacent to the second pad 22
  • the second cover film 42 defines a second empty window 44 corresponding to the second ground copper foil 34 .
  • the first grounding copper foil 33 is disposed on the first copper foil layer 20a, and the first grounding copper foil 33 is in a sheet shape, and the grounding electrode is provided for the flexible circuit board 100 through the first
  • the empty window 43 exposes the first ground copper foil 33 in the land 10a such that static electricity around the first pad 21 is introduced to the first ground copper foil via the first void 43 33, thereby eliminating static electricity around the first pad 21, The safety performance of the flexible circuit board 100 is improved.
  • the second grounding copper foil 34 is disposed on the second copper foil layer 20b, located in the soldering zone 10a, such that static electricity around the second pad 22 can pass through the second empty window. 44 is introduced to the second grounded copper foil 34 to improve the safety performance of the flexible circuit board 100.
  • a ground conductor 35 passing between the base material layers 10 is connected between the first ground copper foil 33 and the second ground copper foil 34.
  • the grounding conductor 35 is configured in the same manner as the conductive member 30a.
  • the grounding conductor 35 electrically connects the first grounding copper foil 33 and the second grounding copper foil 34, so that the first grounding copper is The foil 33 and the second grounded copper foil 34 are in the same phase, thereby improving the grounding performance of the flexible circuit board 100.
  • the flexible circuit board and the mobile terminal provided by the present invention are respectively provided with the first pad and the second pad through the first side and the second side of the substrate layer, and are provided with the first solder a first line of the disk, and a second line connected to the second pad, connected by the conductive member between the first line and the second line, thereby causing the first line and
  • the second line is electrically conductive, thereby preventing the first pad or the second pad from being separated from the substrate layer, thereby causing the flexible circuit board to be unusable, thereby improving the quality of the flexible circuit board and improving Use performance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种柔性电路板(100)及移动终端(1)，柔性电路板(100)包括基材层(10)，基材层(10)包括第一侧(11)和相对第一侧(11)设置的第二侧(12)，第一侧(11)设有第一焊盘(21)和连接第一焊盘(21)的第一线路(31)，第二侧(12)设有与第一焊盘(21)相对设置的第二焊盘(22)，以及设有连接第二焊盘(22)的第二线路(32)，第二线路(32)和第一线路(31)之间连接有穿过基材层(10)的导电件(30a)。利用导电件(30a)连接于第一线路(31)和第二线路(32)之间，使得第一线路(31)和第二线路(32)相导通，防止第一焊盘(21)或第二焊盘(22)脱离基材层(10)导致柔性电路板(100)无法使用，提高柔性电路板(100)的质量及使用性能。

Description

柔性电路板及移动终端 技术领域
本发明涉及通信领域，尤其涉及一种柔性电路板及移动终端。
背景技术
目前多数柔性电路板都是单面设置焊盘，以及单面设置连接焊盘的导电线路，由于柔性电路板是软性的物体，因此柔性电路板在使用过程中很容易造成断裂，并且柔性电路板的焊盘在拔插时由于焊盘和基材层的附着力有限，在多次反复拔插时，焊盘受到拉伸的应力，使焊盘脱离基材层，从而导致柔性电路板无法使用。
发明内容
本发明实施例所要解决的技术问题在于，提供一种提高质量的柔性电路板及移动终端。
本发明提供一种柔性电路板，其中，所述柔性电路板包括基材层，所述基材层包括第一侧和相对所述第一侧设置的第二侧，所述第一侧设有第一焊盘和连接所述第一焊盘的第一线路，所述第二侧设有与所述第一焊盘相对设置的第二焊盘，以及设有连接所述第二焊盘的第二线路，所述第二线路和所述第一线路之间连接有穿过所述基材层的导电件。
本发明还提供一种移动终端，所述移动终端包括移动终端本体、设于所述移动终端本体内部的主板以及柔性电路板，所述柔性电路板包括基材层，所述基材层包括第一侧和相对所述第一侧设置的第二侧，所述第一侧设有第一焊盘和连接所述第一焊盘的第一线路，所述第二侧设有与所述第一焊盘相对设置的第二焊盘，以及设有连接所述第二焊盘的第二线路，所述第二线路和所述第一线路之间连接有穿过所述基材层的导电件。
本发明提供的柔性电路板及移动终端，通过所述基材层的第一侧和第二侧分别设置所述第一焊盘和所述第二焊盘，且设有连接所述第一焊盘的第一线路，以及设有连接所述第二焊盘的第二线路，利用所述导电件连接于所述第一线路和所述第二线路之间，从而使得所述第一线路和所述第二线路相导 通，从而防止所述第一焊盘或所述第二焊盘脱离所述基材层导致所述柔性电路板无法使用，从而提高所述柔性电路板的质量，提高使用性能。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的柔性电路板的结构示意图；
图2是图1的柔性电路板的俯视图；
图3是本发明实施例提供的移动终端的结构框图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明提供一种柔性电路板，其中，所述柔性电路板包括基材层，所述基材层包括第一侧和相对所述第一侧设置的第二侧，所述第一侧设有第一焊盘和连接所述第一焊盘的第一线路，所述第二侧设有与所述第一焊盘相对设置的第二焊盘，以及设有连接所述第二焊盘的第二线路，所述第二线路和所述第一线路之间连接有穿过所述基材层的导电件。
其中，所述第一焊盘和所述第二焊盘的数目均为多个，多个所述第一焊盘并排设置所述第一侧，多个所述第二焊盘并排设置于所述第二侧。
其中，所述第一焊盘和所述第二焊盘均呈矩形，所述第一焊盘的长度方向和所述第二焊盘的长度方向相平行，多个所述第一焊盘的排列方向垂直所述第一焊盘的长度方向。
其中，所述柔性电路板还包括第一覆盖膜和第二覆盖膜，所述第一覆盖膜层叠于所述第一侧，并覆盖所述第一线路，所述第二覆盖膜层叠于所述第二侧，并覆盖所述第二线路。
其中，所述第一侧设有邻近所述第一焊盘的第一接地铜箔，所述第一覆盖膜对应所述第一接地铜箔设置第一空窗。
其中，所述第二侧设有邻近所述第二焊盘的第二接地铜箔，所述第二覆盖膜对应所述第二接地铜箔设置第二空窗。
其中，所述第一接地铜箔和所述第二接地铜箔之间连接有穿过所述基材层之间的接地导体。
其中，所述导电件距离所述第一焊盘1mm～3mm。
其中，所述导电件与所述第一焊盘的距离为1mm或3mm。
其中，所述第一线路和所述第二线路均为铜箔。
本发明还提供一种移动终端，所述移动终端包括移动终端本体、设于所述移动终端本体内部的主板以及柔性电路板，所述柔性电路板包括基材层，所述基材层包括第一侧和相对所述第一侧设置的第二侧，所述第一侧设有第一焊盘和连接所述第一焊盘的第一线路，所述第二侧设有与所述第一焊盘相对设置的第二焊盘，以及设有连接所述第二焊盘的第二线路，所述第二线路和所述第一线路之间连接有穿过所述基材层的导电件。
其中，所述第一焊盘和所述第二焊盘的数目均为多个，多个所述第一焊盘并排设置所述第一侧，多个所述第二焊盘并排设置于所述第二侧。
其中，所述第一焊盘和所述第二焊盘均呈矩形，所述第一焊盘的长度方向和所述第二焊盘的长度方向相平行，多个所述第一焊盘的排列方向垂直所述第一焊盘的长度方向。
其中，所述柔性电路板还包括第一覆盖膜和第二覆盖膜，所述第一覆盖膜层叠于所述第一侧，并覆盖所述第一线路，所述第二覆盖膜层叠于所述第二侧，并覆盖所述第二线路。
其中，所述第一侧设有邻近所述第一焊盘的第一接地铜箔，所述第一覆盖膜对应所述第一接地铜箔设置第一空窗。
其中，所述第二侧设有邻近所述第二焊盘的第二接地铜箔，所述第二覆盖膜对应所述第二接地铜箔设置第二空窗。
其中，所述第一接地铜箔和所述第二接地铜箔之间连接有穿过所述基材层之间的接地导体。
其中，所述导电件与所述第一焊盘的距离为1mm～3mm。
其中，所述导电件与所述第一焊盘的距离为1mm或3mm。
其中，所述第一线路和所述第二线路均为铜箔。
本发明提供的柔性电路板及移动终端，通过所述基材层的第一侧和第二侧分别设置所述第一焊盘和所述第二焊盘，且设有连接所述第一焊盘的第一线路，以及设有连接所述第二焊盘的第二线路，利用所述导电件连接于所述第一线路和所述第二线路之间，从而使得所述第一线路和所述第二线路相导通，从而防止所述第一焊盘或所述第二焊盘脱离所述基材层导致所述柔性电路板无法使用，从而提高所述柔性电路板的质量，提高使用性能。
请参阅图1-图3，本发明提供实施例的一种移动终端1，包括如图3所示的移动终端本体110、设于所述移动终端本体110内部的主板120以及柔性电路板100，所述柔性电路板100设于所述移动终端本体110内部，并与所述主板120电连接。
所述移动终端1可为手机、电脑、平板、掌上游戏机或媒体播放器等智能移动终端。本实施例中，以所述移动终端1为手机为例进行说明。
所述柔性电路板100包括基材层10，所述基材层10包括第一侧11和相对所述第一侧11设置的第二侧12。所述第一侧11设有第一焊盘21和连接所述第一焊盘21的第一线路31，所述第二侧12设有与所述第一焊盘21相对设置的第二焊盘22，以及设有连接所述第二焊盘22的第二线路32，所述第二线路32和所述第一线路31之间连接有穿过所述基材层10的导电件30a。所述导电件30a与所述第一焊盘21的距离为1mm～3mm，或者1mm或3mm。
通过所述基材层10的第一侧11和第二侧12分别设置所述第一焊盘21和所述第二焊盘22，且设有连接所述第一焊盘21的第一线路31，以及设有连接所述第二焊盘22的第二线路32，利用所述导电件30a连接于所述第一线路31和所述第二线路32之间，从而使得所述第一线路31和所述第二线路32相导通，从而防止所述第一焊盘21或所述第二焊盘22脱离所述基材层10导致所述柔性电路板100无法使用，从而提高所述柔性电路板100的质量，提高使用性能。
本实施方式中，所述基材层10为柔性层，从而增加所述柔性电路板100的柔性。所述基材层10可采用聚酰亚胺或者聚乙烯双笨二甲酸盐 (Polyethylene terephthalate PET)等材料，以便于在所述基材层10上设置所述第一焊盘21、第二焊盘22、第一线路31和第二线路32，并且能够提供绝缘环境，以便于所述第一线路31和第二线路32的刻蚀。优选地，所述基材层10的厚度可为20μm。所所述基材层10包括焊接区10a和连接于所述焊接区10a侧边的布线区10b。所述焊接区10a位于所述基材层10的边缘。所述布线区10b呈长方形，所述布线区10b包括相对设置的第一侧边101和第二侧边102，所述第一侧边101和所述第二侧边102设置于所述布线区10b的长度方向上。所述第一侧边101连接于所述焊接区10a上。所述第二侧边102远离所述焊接区10a设置。在其他实施方式中，所述布线区10b还可以设置于所述焊接区10a周围。
本实施方式中，所述第一焊盘21和所述第二焊盘22均为金属板件，所述第一焊盘21和所述第二焊盘22可以是焊接于铜箔上，该铜箔可以形成于所述基材层10上。所述第一焊盘21和所述第二焊盘22均用以焊接电子元件，或者插接于外置连接器上。所述第一焊盘21和所述第二焊盘22均位于所述焊接区10a内。所述第一焊盘21形状与所述第二焊盘22的形状相同设置，从而增加所述柔性电路板100的适配性。在其他实施方式中，所述第一焊盘21还可以不同于所述第二焊盘22，从而使得所述柔性电路板100的结构多样化。
本实施方式中，所述第一线路31和所述第二线路32均为铜箔，所述第一线路31和所述第二线路32可以是所述基材层10上的铜箔经刻蚀而成。所述第一线路31和所述第二线路32均位于所述布线区10b，所述第一线路21沿直线延伸，所述第一线路31远离所述第一焊盘21的一端朝向所述第二侧边102。所述第二线路32与所述第一线路31相同设置。利用所述第一线路31的长度方向与所述布线区10b的长度方向相平行，从而增加所述柔性电路板100的柔性，从而方便所述柔性电路板100使用，增加所述柔性电路板100的使用功能。在其他实施方式中，所述第一线路31还可以沿曲线延伸，所述第二线路32也可以与所述第一线路31分别沿不同方向延伸。
本实施方式中，所述导电件30a为导电柱体。所述导电件30a穿过所述基材层10，具体的，所述基材层10从所述第一侧11朝所述第二侧12设有过孔(未标示)，所述过孔的两开端端分别连接所述第一线路31和所述第二 线路32，所述导电件30a设置于所述过孔内，从而所述导电件30a的两端分别连接于所述第一线路31和所述第二线路32，从而使得所述第一线路31和所述第二线路32经所述导电件30a相并，在所述第一线路31与所述第一焊盘21断开情况下，仍能保证所述第二焊盘22与所述第一线路31和所述第二线路32相通，或者在所述第二线路32与所述第二焊盘22断开情况下，仍能保证所述第一焊盘21与所述第一线路31和所述第二线路32相通，从而使得所述第一线路31和所述第二线路32电信号相同，从而提高所述柔性电路板100的使用性能。
进一步地，所述第一焊盘21的数目和所述第二焊盘22的数目均为多个，多个所述第一焊盘21并排设置所述第一侧11，多个所述第二焊盘22并排设置于所述第二侧12。具体的，所述柔性电路板100包括第一铜箔层20a和第二铜箔层20b，所述第一铜箔层20a层叠于所述第一侧11，所述第二铜箔层20b层叠于所述第二侧12。多个所述第一焊盘21焊接于所述第一铜箔层20a，并位于所述焊接区10a，且多个所述第一焊盘21的排列方向垂直所述布线区10b的长度方向。多个所述第二焊盘22焊接于所述第二铜箔层20b，并位于所述焊接区10a内，且多个所述第二焊盘22的排列方向与多个所述第一焊盘21的排列方向相同设置。所述第一线路31的数目和所述第二线路32的数目可以是多个。每一所述第一线路31设置于所述第一铜箔层20a上，位于所述布线区10b内，而且每一所述第一线路31可以是对应连接一个所述第一焊盘21，也可以是连接两个或三个所述第一焊盘21。同样的，每一所述第二线路32设置于所述第二铜箔层20b，位于所述布线区10b内，而且每一所述第二线路32可以是对应连接一个所述第二焊盘22，也可以是连接两个或三个所述第二焊盘22，但所述第一线路31和所述第二线路32的数目相同，且每一所述第一线路31与每一所述第二线路32相对应。在其他实施方式中，多个所述第一焊盘21和多个所述第二焊盘22还可以是分别阵列于所述第一铜箔层20a和所述第二铜箔层20b。
进一步地，所述第一焊盘21和所述第二焊盘22均呈矩形，所述第一焊盘21的长度方向和所述第二焊盘22的长度方向相平行，多个所述第一焊盘21的排列方向垂直所述第一焊盘21的长度方向。利用多个所述第一焊盘21呈矩形，且多个所述第一焊盘21的排列方向垂直所述第一焊盘21的长度方 向，从而使得所述第一焊盘21的宽度减小，从而可以减小所述柔性电路板100的宽度，并且可以保证所述第一焊盘21的载流面积不变，即保证所述第一焊盘21的导电性能不受影响，从而使得所述柔性电路板100的柔性提高。所述第二焊盘22结构与所述第一焊盘21结构相同设置，在此不再赘述。
进一步地，所述柔性电路板100还包括第一覆盖膜41和第二覆盖膜42，所述第一覆盖膜41层叠于所述第一侧11，并覆盖所述第一线路31，所述第二覆盖膜42层叠于所述第二侧12，并覆盖所述第二线路32。具体的，所述第一覆盖膜41可以采用聚酯材料进行热压成型。所述第一覆盖膜41通过粘胶粘贴于所述第一铜箔层20a上，从而保护所述第一线路31不受到折损或者损坏，同时，采用粘胶粘贴的方式，也能够使得所述第一覆盖膜41与所述第一铜箔层20a的连接更紧密，防止所述第一覆盖膜41移位而无法对露出所述第一覆盖膜41的第一线路31进行保护。同样的，所述第二覆盖膜42可以采用聚酯材料进行热压成型。所述第二覆盖膜42通过粘胶粘贴于所述第二铜箔层20b上，从而保护所述第二线路32不受到折损或者损坏，同时，采用粘胶粘贴的方式，也能够使得所述第二覆盖膜42与所述二铜箔层20b的连接更紧密，防止所述第二覆盖膜42移位而无法对露出所述第二覆盖膜42的第二线路32进行保护。所述第一覆盖膜41和所述第二覆盖膜42在所述焊接区10a分别设有第一过孔(未标示)和第二过孔(未标示)，供所述第一焊盘21和所述第二焊盘22穿过，从而使得所述第一焊盘21和所述第二焊盘22可以连接外置电子元件，并且所述第一覆盖膜41和所述第二覆盖膜42分别对所述第一焊盘21和所述第二焊盘22周围的连接线路进行保护，从而防止短路，提高所述柔性电路板100的安全性能。
进一步地，所述第一侧11设有邻近所述第一焊盘21的第一接地铜箔33，所述第一覆盖膜41对应所述第一接地铜箔33设置第一空窗43。所述第二侧设12有邻近所述第二焊盘22的第二接地铜箔34，所述第二覆盖膜42对应所述第二接地铜箔34设置第二空窗44。具体的，所述第一接地铜箔33设置于所述第一铜箔层20a，所述第一接地铜箔33呈片状，为所述柔性电路板100提供接地电极，通过所述第一空窗43暴露所述第一接地铜箔33，位于所述焊接区10a内，从而使得所述第一焊盘21周围的静电经所述第一空窗43引入至所述第一接地铜箔33内，从而消除所述第一焊盘21周围的静电， 提高所述柔性电路板100的安全性能。同样的，所述第二接地铜箔34设置于所述第二铜箔层20b，位于所述焊接区10a内，从而使得所述第二焊盘22周围的静电可以经所述第二空窗44引入至所述第二接地铜箔34，从而提高所述柔性电路板100的安全性能。
进一步地，所述第一接地铜箔33和所述第二接地铜箔34之间连接有穿过所述基材层10之间的接地导体35。所述接地导体35与所述导电件30a结构相同设置，所述接地导体35实现所述第一接地铜箔33和所述第二接地铜箔34电性连接，从而使得所述第一接地铜箔33和所述第二接地铜箔34相位相同，从而提高所述柔性电路板100的接地性能。
本发明提供的柔性电路板及移动终端，通过所述基材层的第一侧和第二侧分别设置所述第一焊盘和所述第二焊盘，且设有连接所述第一焊盘的第一线路，以及设有连接所述第二焊盘的第二线路，利用所述导电件连接于所述第一线路和所述第二线路之间，从而使得所述第一线路和所述第二线路相导通，从而防止所述第一焊盘或所述第二焊盘脱离所述基材层导致所述柔性电路板无法使用，从而提高所述柔性电路板的质量，提高使用性能。
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (20)

  1. 一种柔性电路板，其特征在于：所述柔性电路板包括基材层，所述基材层包括第一侧和相对所述第一侧设置的第二侧，所述第一侧设有第一焊盘和连接所述第一焊盘的第一线路，所述第二侧设有与所述第一焊盘相对设置的第二焊盘，以及设有连接所述第二焊盘的第二线路，所述第二线路和所述第一线路之间连接有穿过所述基材层的导电件。
  2. 如权利要求1所述的柔性电路板，其特征在于:所述第一焊盘和所述第二焊盘的数目均为多个，多个所述第一焊盘并排设置所述第一侧，多个所述第二焊盘并排设置于所述第二侧。
  3. 如权利要求2所述的柔性电路板，其特征在于:所述第一焊盘和所述第二焊盘均呈矩形，所述第一焊盘的长度方向和所述第二焊盘的长度方向相平行，多个所述第一焊盘的排列方向垂直所述第一焊盘的长度方向。
  4. 如权利要求1所述的柔性电路板，其特征在于：所述柔性电路板还包括第一覆盖膜和第二覆盖膜，所述第一覆盖膜层叠于所述第一侧，并覆盖所述第一线路，所述第二覆盖膜层叠于所述第二侧，并覆盖所述第二线路。
  5. 如权利要求4所述的柔性电路板，其特征在于：所述第一侧设有邻近所述第一焊盘的第一接地铜箔，所述第一覆盖膜对应所述第一接地铜箔设置第一空窗。
  6. 如权利要求5所述的柔性电路板，其特征在于：所述第二侧设有邻近所述第二焊盘的第二接地铜箔，所述第二覆盖膜对应所述第二接地铜箔设置第二空窗。
  7. 如权利要求6所述的柔性电路板，其特征在于：所述第一接地铜箔和所述第二接地铜箔之间连接有穿过所述基材层之间的接地导体。
  8. 如权利要求1所述的柔性电路板，其特征在于：所述导电件与所述第一焊盘的距离为1mm～3mm。
  9. 如权利要求1所述的柔性电路板，其特征在于：所述导电件与所述第一焊盘的距离为1mm或3mm。
  10. 如权利要求1所述的柔性电路板，其特征在于：所述第一线路和所述第二线路均为铜箔。
  11. 一种移动终端，其特征在于：所述移动终端包括移动终端本体、设 于所述移动终端本体内部的主板以及柔性电路板，所述柔性电路板包括基材层，所述基材层包括第一侧和相对所述第一侧设置的第二侧，所述第一侧设有第一焊盘和连接所述第一焊盘的第一线路，所述第二侧设有与所述第一焊盘相对设置的第二焊盘，以及设有连接所述第二焊盘的第二线路，所述第二线路和所述第一线路之间连接有穿过所述基材层的导电件。
  12. 如权利要求11所述的移动终端，其特征在于:所述第一焊盘和所述第二焊盘的数目均为多个，多个所述第一焊盘并排设置所述第一侧，多个所述第二焊盘并排设置于所述第二侧。
  13. 如权利要求12所述的移动终端，其特征在于:所述第一焊盘和所述第二焊盘均呈矩形，所述第一焊盘的长度方向和所述第二焊盘的长度方向相平行，多个所述第一焊盘的排列方向垂直所述第一焊盘的长度方向。
  14. 如权利要求11所述的移动终端，其特征在于：所述柔性电路板还包括第一覆盖膜和第二覆盖膜，所述第一覆盖膜层叠于所述第一侧，并覆盖所述第一线路，所述第二覆盖膜层叠于所述第二侧，并覆盖所述第二线路。
  15. 如权利要求14所述的移动终端，其特征在于：所述第一侧设有邻近所述第一焊盘的第一接地铜箔，所述第一覆盖膜对应所述第一接地铜箔设置第一空窗。
  16. 如权利要求15所述的移动终端，其特征在于：所述第二侧设有邻近所述第二焊盘的第二接地铜箔，所述第二覆盖膜对应所述第二接地铜箔设置第二空窗。
  17. 如权利要求16所述的移动终端，其特征在于：所述第一接地铜箔和所述第二接地铜箔之间连接有穿过所述基材层之间的接地导体。
  18. 如权利要求11所述的移动终端，其特征在于：所述导电件与所述第一焊盘的距离为1mm～3mm。
  19. 如权利要求11所述的移动终端，其特征在于：所述导电件与所述第一焊盘的距离为1mm或3mm。
  20. 如权利要求11所述的移动终端，其特征在于：所述第一线路和所述第二线路均为铜箔。
PCT/CN2016/093913 2015-12-29 2016-08-08 柔性电路板及移动终端 WO2017113797A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201511026497.5 2015-12-29
CN201511026497.5A CN105430896B (zh) 2015-12-29 2015-12-29 柔性电路板及移动终端

Publications (1)

Publication Number Publication Date
WO2017113797A1 true WO2017113797A1 (zh) 2017-07-06

Family

ID=55508743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/093913 WO2017113797A1 (zh) 2015-12-29 2016-08-08 柔性电路板及移动终端

Country Status (2)

Country Link
CN (1) CN105430896B (zh)
WO (1) WO2017113797A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105430896B (zh) * 2015-12-29 2018-06-29 广东欧珀移动通信有限公司 柔性电路板及移动终端
CN113179579A (zh) * 2021-04-27 2021-07-27 昆山国显光电有限公司 电路板和电子设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020117909A1 (en) * 2001-01-25 2002-08-29 Masato Gomyo Motor provided with flexible circuit board
CN101287339A (zh) * 2007-04-13 2008-10-15 富葵精密组件(深圳)有限公司 制作具有断差结构的电路板的方法
CN102137543A (zh) * 2010-01-22 2011-07-27 揖斐电株式会社 刚挠性电路板及其制造方法
CN202035213U (zh) * 2011-04-26 2011-11-09 深圳市精诚达电路有限公司 六层hdi软硬结合板
CN202455651U (zh) * 2012-02-03 2012-09-26 厦门爱谱生电子科技有限公司 一种采用波峰焊接的双面柔性电路板
CN202652685U (zh) * 2012-05-25 2013-01-02 昆山凌达光电科技有限公司 防止金手指断裂的柔性线路板改良结构
CN104039079A (zh) * 2013-12-01 2014-09-10 吴祖 集成线路板
CN105430896A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 柔性电路板及移动终端

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1061784B1 (en) * 1998-07-20 2006-09-27 Samsung Electronics Co., Ltd. Radio-electronic unit
CN101562939B (zh) * 2008-04-18 2011-05-04 鸿富锦精密工业（深圳）有限公司 软性电路板
US8759687B2 (en) * 2010-02-12 2014-06-24 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
JP2013157490A (ja) * 2012-01-31 2013-08-15 Jvc Kenwood Corp 両面フレキシブルプリント基板及び両面フレキシブルプリント基板用コネクタ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020117909A1 (en) * 2001-01-25 2002-08-29 Masato Gomyo Motor provided with flexible circuit board
CN101287339A (zh) * 2007-04-13 2008-10-15 富葵精密组件(深圳)有限公司 制作具有断差结构的电路板的方法
CN102137543A (zh) * 2010-01-22 2011-07-27 揖斐电株式会社 刚挠性电路板及其制造方法
CN202035213U (zh) * 2011-04-26 2011-11-09 深圳市精诚达电路有限公司 六层hdi软硬结合板
CN202455651U (zh) * 2012-02-03 2012-09-26 厦门爱谱生电子科技有限公司 一种采用波峰焊接的双面柔性电路板
CN202652685U (zh) * 2012-05-25 2013-01-02 昆山凌达光电科技有限公司 防止金手指断裂的柔性线路板改良结构
CN104039079A (zh) * 2013-12-01 2014-09-10 吴祖 集成线路板
CN105430896A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 柔性电路板及移动终端

Also Published As

Publication number Publication date
CN105430896A (zh) 2016-03-23
CN105430896B (zh) 2018-06-29

Similar Documents

Publication Publication Date Title
TWI531288B (zh) 具有金手指的柔性電路板及其製作方法
JP6856141B2 (ja) 基板接合体および伝送線路装置
KR100904710B1 (ko) 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩
CN110402615B (zh) 高频传输用印刷线路板
US10181662B2 (en) Switching device having a push button
US8289728B2 (en) Interconnect board, printed circuit board unit, and method
US10756462B2 (en) Resin multilayer substrate and an electronic device and a joint structure of a resin multilayer substrate
JP4664657B2 (ja) 回路基板
US8779292B2 (en) Substrate and substrate bonding device using the same
CN105682343A (zh) 软硬结合板及终端
CN109714882B (zh) 移动终端及柔性线路板
JP2012009478A (ja) 接続構造、電子機器
WO2017113797A1 (zh) 柔性电路板及移动终端
CN105430888A (zh) 柔性电路板及移动终端
JP2017139180A (ja) フレキシブルフラットケーブルおよびその製造方法
JP2008166496A (ja) フレキシブル配線基板
US10188000B2 (en) Component mounting board
CN105578732A (zh) 软硬结合板及终端
JP5107024B2 (ja) 両面フレキシブルプリント基板
CN205883714U (zh) 柔性电路板
JP6617505B2 (ja) フラットケーブル接続構造体
TW200820843A (en) Flexible printed circuit
CN112867226B (zh) 高频传输电路板及其制作方法
CN105682354A (zh) 软硬结合板及终端
JP2011253926A (ja) 両面フレキシブルプリント配線板、接続構造、電子機器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16880592

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16880592

Country of ref document: EP

Kind code of ref document: A1