WO2017096818A1 - 焊接导电散热片的pcb板装置、导电散热片及焊接方法 - Google Patents

焊接导电散热片的pcb板装置、导电散热片及焊接方法 Download PDF

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WO2017096818A1
WO2017096818A1 PCT/CN2016/088669 CN2016088669W WO2017096818A1 WO 2017096818 A1 WO2017096818 A1 WO 2017096818A1 CN 2016088669 W CN2016088669 W CN 2016088669W WO 2017096818 A1 WO2017096818 A1 WO 2017096818A1
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Prior art keywords
conductive
heat sink
electrically conductive
pcb
conductive heat
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PCT/CN2016/088669
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English (en)
French (fr)
Inventor
侯晓明
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乐视控股（北京）有限公司
乐视致新电子科技（天津）有限公司
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Priority to US15/250,524 priority Critical patent/US20170171963A1/en
Publication of WO2017096818A1 publication Critical patent/WO2017096818A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Definitions

  • the present application relates to the field of PCB (printed circuit board) soldering technology, and more particularly to a PCB board device for soldering a conductive heat sink, a conductive heat sink, and a soldering method.
  • PCB printed circuit board
  • the normal IC needs to increase the heat sink due to the large amount of heat generated during operation, but only the IC device 13 exists between the existing conductive fins 11 and the PCB board 12. Therefore, in the ESD experiment, since an instantaneous charge is coupled to the conductive fins 11, a large capacitor is formed between the conductive fins 11 and the surface of the PCB 12 (built in a copper layer), thereby accumulating energy.
  • the inventors have found that at least the following problems exist in the prior art: if the contact between the conductive heat sink 11 and the PCB 12 is not good enough, the discharge path of the ESD energy is only discharged through the IC device 13, resulting in an IC device. 13 will withstand a large voltage shock, resulting in damage to the IC body or internal program abnormalities.
  • the present application provides a PCB board device for soldering a conductive heat sink, a conductive heat sink, and a soldering method, which can release ESD energy between the conductive heat sink and the PCB through the conductive foam, thereby avoiding damage of the IC device.
  • PCB board device for soldering conductive heat sinks, including:
  • a PCB board configured to solder the IC device, and having a ground wire ground (Ground, GND) set to be soldered;
  • At least one conductive foam one end of each conductive foam is welded to the surface GND of the PCB board, and the other end is soldered with a conductive fin;
  • a conductive fin is connected to the surface GND of the PCB through the conductive foam to release ESD energy between the conductive fin and the PCB.
  • the conductive foam is a conductive foam of SMT.
  • the conductive heat sink is an aluminum conductive heat sink.
  • the surface GND of the PCB board is a built-in copper layer.
  • the conductive heat sink is welded to one end of at least one conductive foam, and the other end of the at least one conductive foam is soldered to the surface GND of the PCB, and the conductive is released through the conductive foam ESD energy between the heat sink and the PCB.
  • the conductive foam is a conductive foam of Surface Mount Technology (SMT).
  • SMT Surface Mount Technology
  • the conductive heat sink is an aluminum conductive heat sink.
  • the conductive fin is soldered to one end of the at least one conductive foam, and the other end of the at least one conductive foam is soldered to the surface GND of the PCB, and the conductive foam is released between the conductive fin and the PCB through the conductive foam ESD energy.
  • the conductive foam is a conductive foam of SMT.
  • the conductive heat sink is an aluminum conductive heat sink.
  • the surface GND of the PCB board is a built-in copper layer.
  • the conductive heat sink of the present application solders one end of at least one conductive foam, and the other end of the at least one conductive foam welds the surface GND of the PCB board, and the conductive heat sink is released by the conductive foam and ESD energy between the PCB boards.
  • the application increases the ESD energy bleed path to achieve the effect of protecting the IC and avoiding damage to the IC device.
  • FIG. 1 is a schematic structural view of a PCB board device for soldering a conductive heat sink in the prior art
  • FIG. 2 is a schematic structural view of a PCB board device for soldering a conductive heat sink according to the present application
  • FIG. 3 is a schematic view showing welding of a conductive heat sink of the present application.
  • FIG. 5 is a schematic diagram of a specific application structure of a PCB board for soldering a conductive heat sink according to the present application.
  • the conductive heat sink of the present application solders one end of the at least one conductive foam, and the other end of the at least one conductive foam welds the surface GND of the PCB board, and the conductive foam is released between the conductive heat sink and the PCB board through the conductive foam ESD energy.
  • the application increases the ESD energy bleed path to achieve the effect of protecting the IC and avoiding damage to the IC device.
  • a specific embodiment of the present application provides a PCB board device for soldering a conductive heat sink, including:
  • the PCB board 21 is provided as a solder IC device and has a surface GND provided to be soldered.
  • At least one conductive foam 22 one end of each conductive foam 22 is welded to the surface GND of the PCB board 21, and the other end is soldered to the conductive fin 23.
  • the conductive fins 23 are connected to the surface GND of the PCB board 21 through the conductive foam 22 to release ESD energy between the conductive fins 23 and the PCB board 21.
  • the application increases the ESD energy bleed path to achieve the effect of protecting the IC and avoiding damage to the IC device.
  • the conductive foam of SMT can be directly welded, the conductive foam described in the present application uses SMT conductive foam.
  • a normal IC needs to increase the heat sink because it generates a large amount of heat during operation. Because the aluminum heat sink has better heat conduction and heat dissipation coefficient, lower cost, and convenient soldering, the conductive dispersion described in the present application
  • the heat film uses an aluminum conductive heat sink.
  • PCB boards also known as printed circuit boards, are the providers of electrical connections for electronic components.
  • the surface is provided with a solder resist (Solder resistant/Solder Mask).
  • solder resist solder resistant/Solder Mask
  • Not all copper surfaces are required to eat tin parts. Therefore, in areas where tin is not eaten, a layer of tin-plated material (usually epoxy) is printed. Resin) to avoid short circuits between lines that are not tinned. According to different processes, it is divided into green oil, red oil and blue oil.
  • the surface GND of the PCB board of the present application is a built-in copper layer, that is, the PCB board retains a plurality of copper layer regions not provided with solder resist ink, and the copper layer region is a ground potential.
  • the conductive heat sink and the copper layer region (surface GND) of the PCB board are connected by at least one conductive foam to increase the ESD energy discharge path, thereby achieving the effect of protecting the IC and avoiding damage of the IC device.
  • Another embodiment of the present application further provides a conductive heat sink.
  • the conductive heat sink 31 is soldered to one end of at least one conductive foam 32, and the other end of the at least one conductive foam is soldered to the surface of the PCB board 33. GND, the ESD energy between the conductive fins 31 and the PCB 33 plate is released by the conductive foam 32.
  • the application increases the ESD energy bleed path to achieve the effect of protecting the IC and avoiding damage to the IC device.
  • the conductive foam of SMT can be directly welded, the conductive foam described in the present application uses SMT conductive foam.
  • a normal IC needs to increase the heat sink because it generates a large amount of heat during operation. Because the aluminum heat sink has better heat conduction and heat dissipation coefficient, lower cost, and convenient soldering, the conductive heat sink of the present application adopts an aluminum conductive heat sink.
  • a further embodiment of the present application further provides a soldering method for a conductive heat sink. Referring to FIG. 4, the method includes:
  • the conductive heat sink is welded to one end of the at least one conductive foam, and the other end of the at least one conductive foam is soldered to the surface GND of the PCB board, and the conductive heat sink and the PCB board are released by the conductive foam ESD energy between.
  • the application increases the ESD energy bleed path to achieve the effect of protecting the IC and avoiding damage to the IC device.
  • the conductive foam of SMT can be directly welded, the conductive foam described in the present application uses SMT conductive foam.
  • a normal IC needs to increase the heat sink because it generates a large amount of heat during operation. Because of aluminum heat sink The heat conduction and heat dissipation coefficient are better, the cost is lower, and the welding is convenient.
  • the conductive heat sink of the present application adopts an aluminum conductive heat sink.
  • PCB boards also known as printed circuit boards, are the providers of electrical connections for electronic components.
  • the surface is provided with a solder resist (Solder resistant/Solder Mask).
  • solder resist solder resistant/Solder Mask
  • Not all copper surfaces are required to eat tin parts. Therefore, in areas where tin is not eaten, a layer of tin-plated material (usually epoxy) is printed. Resin) to avoid short circuits between lines that are not tinned. According to different processes, it is divided into green oil, red oil and blue oil.
  • the surface GND of the PCB board of the present application is a built-in copper layer, that is, the PCB board retains a plurality of copper layer regions not provided with solder resist ink, and the copper layer region is a ground potential.
  • the conductive heat sink and the copper layer region (surface GND) of the PCB board are connected by at least one conductive foam to increase the ESD energy discharge path, thereby achieving the effect of protecting the IC and avoiding damage of the IC device.
  • the PCB board 51 of the IC device is soldered.
  • the surface GND of the PCB board 51 is a built-in copper layer, that is, a plurality of copper layer regions on which the solder resist ink is not disposed are left on the PCB board 51.
  • the area is a ground potential.
  • One end of the five SMT conductive foams 52 is welded to the surface copper layer region of the PCB board 51, and the other end is soldered to the conductive fins 53.
  • the aluminum conductive fins 53 are connected to the surface copper layer region of the PCB board 51 through the conductive foam 52, and the ESD energy between the conductive fins 53 and the PCB board 51 is released.
  • the ESD energy between the conductive heat sink 53 and the PCB board 51 of the present application is not released only by the IC device 54, but at the same time, five conductive foams 52 are added as a discharge path for ESD energy to achieve protection.
  • the effect of IC device 54 avoids damage to IC device 54.
  • embodiments of the present application can be provided as a method, apparatus (device), or computer program product.
  • the present application can take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment in combination of software and hardware.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种焊接导电散热片（23,31,53）的PCB板（21,33,51）装置、导电散热片（23,31,53）及导电散热片（23,31,53）的焊接方法，包括：PCB板（21,33,51），设置为焊接IC器件（54），且具有设置为焊接的表面GND；至少一导电泡棉（22,32,52），各导电泡棉（22,32,52）的一端焊接PCB板（21,33,51）的表面GND，另一端焊接导电散热片（23,31,53）；导电散热片（23,31,53），通过导电泡棉（22,32,52）连接PCB板（21,33,51）的表面GND，释放导电散热片（23,31,53）和PCB板（21,33,51）之间的ESD能量。通过导电泡棉（22,32,52）释放导电散热片（23,31,53）和PCB板（21,33,51）之间的ESD能量，避免了IC器件（54）的损坏。

Description

焊接导电散热片的PCB板装置、导电散热片及焊接方法
本申请要求于2015年12月9日提交中国专利局、申请号为2015109203665，发明名称为“焊接导电散热片的PCB板装置、导电散热片及焊接方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及PCB(印刷电路板)焊接技术领域，尤其涉及焊接导电散热片的PCB板装置、导电散热片及焊接方法。
背景技术
随着自发明集成电路(IC)行业的发展，IC集成度越来越高，IC本身抗静电释放(Electro-Static Discharge，ESD)的能力在设计中越来越困难。在推向产品化的过程中，越来越多的产品遇到了ESD测试失败，导致IC损坏或者系统异常的问题。
参看图1，正常IC在工作时由于发热量较大，需要增加散热装置，但是现有的导电散热片11和PCB板12之间仅存在IC器件13。因此，进行ESD实验时，由于瞬间电荷会耦合到导电散热片11上，导电散热片11和PCB板12表面(内置为铜层)之间会形成大的电容器，从而进行能量的累积。在实现本申请过程中，发明人发现现有技术中至少存在如下问题：如果导电散热片11和PCB12之间的接触不够良好，ESD能量的泄放路径只有通过IC器件13泄放，造成IC器件13会承受较大的电压冲击，进而造成IC本体损坏或者内部程序异常。
因此，如何在PCB板上焊接导电散热片，成为现有技术中亟需解决的技术问题。
发明内容
有鉴于此，本申请提供焊接导电散热片的PCB板装置、导电散热片及焊接方法，其可通过导电泡棉释放导电散热片和PCB板之间的ESD能量，避免了IC器件的损坏。
本身请提供一种焊接导电散热片的PCB板装置，包括：
PCB板，设置为焊接IC器件，且具有设置为焊接的表面电线接地端(Ground，GND)；
至少一导电泡棉，各导电泡棉的一端焊接所述PCB板的表面GND，另一端焊接导电散热片；
导电散热片，通过所述导电泡棉连接所述PCB板的表面GND，释放所述导电散热片和所述PCB板之间的ESD能量。
在本申请一具体实施例中，所述导电泡棉为SMT的导电泡棉。
在本申请一具体实施例中，所述导电散热片为铝制导电散热片。
在本申请一具体实施例中，所述PCB板的表面GND为内置的铜层。
本身请提供一种导电散热片，所述导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。
在本申请一具体实施例中，所述导电泡棉为表面贴装技术(Surface Mount Technology，SMT)的导电泡棉。
在本申请一具体实施例中，所述导电散热片为铝制导电散热片。
本身请提供一种导电散热片的焊接方法，包括：
所述导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。
在本申请一具体实施例中，所述导电泡棉为SMT的导电泡棉。
在本申请一具体实施例中，所述导电散热片为铝制导电散热片。
在本申请一具体实施例中，所述PCB板的表面GND为内置的铜层。
由以上技术方案可见，本申请导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。本申请增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。
图1是现有技术焊接导电散热片的PCB板装置的结构示意图；
图2是本申请一种焊接导电散热片的PCB板装置的结构示意图；
图3是本申请一种导电散热片的焊接示意图；
图4是本申请一种导电散热片的方法流程图；
图5是本申请一种焊接导电散热片的PCB板的具体应用结构示意图。
具体实施方式
本申请导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。本申请增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
当然，实施本申请的任一技术方案必不一定需要同时达到以上的所有优点。
为了使本领域的人员更好地理解本申请中的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员所获得的所有其他实施例，都应当属于本申请保护的范围。
下面结合本申请附图具体的说明本申请具体实现。
参见图2，本申请一具体实施例提供一种焊接导电散热片的PCB板装置，包括：
PCB板21，设置为焊接IC器件，且具有设置为焊接的表面GND。
至少一导电泡棉22，各导电泡棉22的一端焊接所述PCB板21的表面GND，另一端焊接导电散热片23。
导电散热片23，通过所述导电泡棉22连接所述PCB板21的表面GND，释放所述导电散热片23和所述PCB板21之间的ESD能量。
本申请增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
由于SMT的导电泡棉可以直接进行焊接，本申请所述导电泡棉采用SMT的导电泡棉。
正常IC在工作时由于发热量较大，需要增加散热装置。因为铝制散热片的导热和散热系数较好，成本较低，并且焊接比较方便，本申请所述导电散 热片采用铝制导电散热片。
PCB板，又称印刷电路板，是电子元器件电气连接的提供者。通常表面设置有防焊油墨(Solder resistant/Solder Mask)，并非全部的铜面都要吃锡上零件，因此非吃锡的区域，会印一层隔绝铜层吃锡的物质(通常为环氧树脂)，避免非吃锡的线路间短路。根据不同的工艺，分为绿油、红油、蓝油。本申请所述PCB板的表面GND为内置的铜层，即所述PCB板上保留多个未设置防焊油墨的铜层区域，所述铜层区域为一地电位。
本申请通过至少一导电泡棉将导电散热片和PCB板的铜层区域(表面GND)连接，增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
本申请另一实施例还提供一种导电散热片，参看图3，所述导电散热片31焊接至少一导电泡棉32的一端，所述至少一导电泡棉的另一端焊接PCB板33的表面GND，通过所述导电泡棉32释放所述导电散热片31和所述PCB33板之间的ESD能量。
本申请增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
由于SMT的导电泡棉可以直接进行焊接，本申请所述导电泡棉采用SMT的导电泡棉。
正常IC在工作时由于发热量较大，需要增加散热装置。因为铝制散热片的导热和散热系数较好，成本较低，并且焊接比较方便，本申请所述导电散热片采用铝制导电散热片。
本申请再一实施例还提供一种导电散热片的焊接方法，参见图4，包括：
S1、所述导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。
本申请增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
由于SMT的导电泡棉可以直接进行焊接，本申请所述导电泡棉采用SMT的导电泡棉。
正常IC在工作时由于发热量较大，需要增加散热装置。因为铝制散热片 的导热和散热系数较好，成本较低，并且焊接比较方便，本申请所述导电散热片采用铝制导电散热片。
PCB板，又称印刷电路板，是电子元器件电气连接的提供者。通常表面设置有防焊油墨(Solder resistant/Solder Mask)，并非全部的铜面都要吃锡上零件，因此非吃锡的区域，会印一层隔绝铜层吃锡的物质(通常为环氧树脂)，避免非吃锡的线路间短路。根据不同的工艺，分为绿油、红油、蓝油。本申请所述PCB板的表面GND为内置的铜层，即所述PCB板上保留多个未设置防焊油墨的铜层区域，所述铜层区域为一地电位。
本申请通过至少一导电泡棉将导电散热片和PCB板的铜层区域(表面GND)连接，增加ESD能量的泄放路径，而达到保护IC的效果，避免了IC器件的损坏。
下面通过一具体应用场景来具体的说明本申请实现。
参看图5，焊接IC器件的PCB板51，所述PCB板51的表面GND为内置的铜层，即所述PCB板51上保留多个未设置防焊油墨的铜层区域，所述铜层区域为一地电位。
5个SMT的导电泡棉52的一端焊接所述PCB板51的表面铜层区域，另一端焊接导电散热片53。
铝制导电散热片53通过所述导电泡棉52连接所述PCB板51的表面铜层区域，释放所述导电散热片53和所述PCB板51之间的ESD能量。
本申请所述导电散热片53和所述PCB板51之间的ESD能量不会仅通过IC器件54释放，而是同时增加了5个导电泡棉52作为ESD能量的泄放路径，而达到保护IC器件54的效果，避免了IC器件54的损坏。
本领域的技术人员应明白，本申请的实施例可提供为方法、装置(设备)、或计算机程序产品。因此，本申请可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及 其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (11)

  1. 一种焊接导电散热片的PCB板装置，其特征在于，包括：
    PCB板，设置为焊接IC器件，且具有设置为焊接的表面GND；
    至少一导电泡棉，各导电泡棉的一端焊接所述PCB板的表面GND，另一端焊接导电散热片；
    导电散热片，通过所述导电泡棉连接所述PCB板的表面GND，释放所述导电散热片和所述PCB板之间的ESD能量。
  2. 根据权利要求1所述的PCB板装置，其特征在于，所述导电泡棉为SMT的导电泡棉。
  3. 根据权利要求1所述的PCB板装置，其特征在于，所述导电散热片为铝制导电散热片。
  4. 根据权利要求1所述的PCB板装置，其特征在于，所述PCB板的表面GND为内置的铜层。
  5. 一种导电散热片，其特征在于，所述导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。
  6. 根据权利要求5所述的导电散热片，其特征在于，所述导电泡棉为SMT的导电泡棉。
  7. 根据权利要求5所述的导电散热片，其特征在于，所述导电散热片为铝制导电散热片。
  8. 一种导电散热片的焊接方法，其特征在于，包括：
    所述导电散热片焊接至少一导电泡棉的一端，所述至少一导电泡棉的另一端焊接PCB板的表面GND，通过所述导电泡棉释放所述导电散热片和所述PCB板之间的ESD能量。
  9. 根据权利要求8所述的方法，其特征在于，所述导电泡棉为SMT的导电泡棉。
  10. 根据权利要求8所述的方法，其特征在于，所述导电散热片为铝制导电散热片。
  11. 根据权利要求8所述的方法，其特征在于，所述PCB板的表面GND为内置的铜层。
PCT/CN2016/088669 2015-12-09 2016-07-05 焊接导电散热片的pcb板装置、导电散热片及焊接方法 WO2017096818A1 (zh)

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US6871395B2 (en) * 2001-08-06 2005-03-29 Siemens Technology-To-Business Center, Llc. Methods for manufacturing a tactile sensor using an electrically conductive elastomer
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN204634156U (zh) * 2015-05-21 2015-09-09 小米科技有限责任公司 电路保护结构及电子装置

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US6871395B2 (en) * 2001-08-06 2005-03-29 Siemens Technology-To-Business Center, Llc. Methods for manufacturing a tactile sensor using an electrically conductive elastomer
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN204634156U (zh) * 2015-05-21 2015-09-09 小米科技有限责任公司 电路保护结构及电子装置

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