WO2017090001A1 - Trieuse automatique de composants dotée d'un ou plusieurs kit(s) intelligent(s) d'essai de transistor - Google Patents

Trieuse automatique de composants dotée d'un ou plusieurs kit(s) intelligent(s) d'essai de transistor Download PDF

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Publication number
WO2017090001A1
WO2017090001A1 PCT/IB2016/057133 IB2016057133W WO2017090001A1 WO 2017090001 A1 WO2017090001 A1 WO 2017090001A1 IB 2016057133 W IB2016057133 W IB 2016057133W WO 2017090001 A1 WO2017090001 A1 WO 2017090001A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
transistors
segregator
functionality
hopper
Prior art date
Application number
PCT/IB2016/057133
Other languages
English (en)
Inventor
Nitin Gupta
Gaurav RATURI
Amit RIZWANI
Original Assignee
Attero Recycling Pvt. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Attero Recycling Pvt. Ltd. filed Critical Attero Recycling Pvt. Ltd.
Publication of WO2017090001A1 publication Critical patent/WO2017090001A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03B—SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
    • B03B9/00—General arrangement of separating plant, e.g. flow sheets
    • B03B9/06—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
    • B03B9/061—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse the refuse being industrial
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C1/00—Magnetic separation
    • B03C1/02—Magnetic separation acting directly on the substance being separated
    • B03C1/30—Combinations with other devices, not otherwise provided for
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the present invention relates to an apparatus and a method for automatic segregation of recyclable and reusable parts from electronic wastes. More particularly, it relates to an apparatus and a method for automatic separation of the working and non-working parts of a waste printed circuit boards.
  • E-waste management is an important requirement for ecologically sustainable development in many countries. Efficient sorting of waste is a major issue in today's society and is becoming a burgeoning problem for the waste management industries to ensure effective and sustainable management of waste. The economic value of waste is best realized when it is segregated.
  • waste management systems The main problem of manually operated waste management systems is checking and segregating components based upon their recovery, reuse potential.
  • the usual method either involves a manual approach wherein either a person has to wander through the different spots, checking the places for waste collection or a team is required for identification and segregation of the components. This is somewhat complex and time consuming process.
  • the present day waste management system is not as efficient as it should have been taking into consideration the advancements in the technologies that arose in the recent years.
  • there is no safeguard regarding effective utilization of the e-waste by the proper identification, segregation and applying waste management approaches for the underlying components of the e-wastes.
  • PCB's are the important components of electrical equipments that owns a precious composition of metals, non-metals, the parts like diodes, semiconductors, inductors, removable board ports etc. Hence, recycling becomes a more complex task.
  • the complexity of recovery process is not merely due to the disparity of precious composition; rather it is due to the existence of such removable parts that have tendency of reuse, recycle, or recovery depending on the functional state of the components.
  • CN101444784A discloses a method and a device for high-efficiency recovery of waste circuit boards in vacuum.
  • the waste circuit board is arranged in a vacuum vessel and heated for pyrolysis, wherein, most of pyrolysis volatile matter is cooled and liquefied into liquid oil, and the rest is taken into a gas collector; a centrifuge device separates soldering tin from the circuit board during the pyrolysis; substrates and electronic components of the pyrolyzed circuit board are assorted and collected to be further separated and recovered.
  • the main disadvantage of this method is that the heating involved in the pyrolysis process might affect the functionality of working components even pyrolysis take place under vacuum condition.
  • US6234317 discloses device for sorting raw, pretreated or recycled bulk material.
  • the device is of lesser utility in recycling purpose as the main function of component removal from PCB has to be performed separately.
  • the main object of the present invention is to provide an automatic component segregator comprising of a component segregation section and a functionality check section equipped with at least one transistor testing kit, said functionality check section is contiguously connected to segregation section to segregate functional and non-functional transistors in the various stages depending upon their functionality, nature and reusability.
  • Yet another object of the present invention is to provide a Programmable Logic Controller (PLC) controlled apparatus that through a series of input/output modules, sensor modules and communication processors operates the segregation process in an automatic mode.
  • PLC Programmable Logic Controller
  • Yet another object of the present invention is to provide an approach for segregating components present in the waste printed circuit boards or e-waste.
  • Yet another object of the present invention is to provide an apparatus wherein specific parameters like temperature, speed, time can be customized as per the requirement of the segregation process.
  • Yet another object of the present invention is to provide a sensing mechanism enabled apparatus to sense presence of waste on the conveyor belt and initiating the belt movement.
  • Yet another aspect of the present invention is to provide an apparatus with a safety mechanism to protect damage of embedded parts present in the e-waste.
  • the present invention relates to an apparatus for automatic segregation of working and non-working parts from waste printed circuit boards or electronic waste with minimal or no manual efforts.
  • the apparatus comprises a component segregation section and a functionality check section equipped with at least one transistor testing kit to segregate functional and non-functional transistors in the various stages depending upon their functionality, nature and reusability.
  • the apparatus automatically takes in the bulk waste product as feed; the entry of the same is then sensed by the sensors provided on the conveyor belt and initiates the segregation process.
  • the components from the waste product then undergo a number of stages wherein all necessary steps are taken like shredding, size sorting, metal sorting, reusable parts sorting viz. chips, transistors, resistors etc.
  • the removed components, particularly the transistors are then tested by kits for re-usability. If tested negative, they are directed towards recycling procedures.
  • the segregated transistors are checked for physical integrity and further go through various component specific tests; if the transistors pass said tests, it is qualified for reuse. If not, it is sent for mechanical recycling.
  • the transistors are checked by these smart kits in order to determine whether they should go for mechanical recycling or for reuse.
  • the removed transistors are checked for physical integrity followed by conductivity test; if the transistor passes the physical integrity and conductivity tests, it is qualified for reuse. If not, it is sent for mechanical recycling.
  • FIG. 1 is an isometric view of the component segregator apparatus contiguously attached with a functionality check section according to an embodiment of the present invention.
  • FIG. 2a is a process flow diagram elucidating the component removal procedure.
  • FIG. 2b is a schematic flow diagram for the processing of remaining material obtained is explained.
  • FIG. 3 is a process diagram depicting the various stages like size sorting, metal sorting and chips sorting according to an embodiment of the present invention.
  • FIG. 4 is a perspective view of the main component segregator along with a functionality check section for segregated transistors, according to an embodiment of the present invention.
  • FIG. 5 is a layout of a PLC controlled system controlling various component removal machines equipped in the apparatus.
  • FIG. 6 is a flow chart to explain transistor reuse mechanism is elucidated according to an embodiment of the present invention.
  • FIG. 7 is the perspective view of the transistor testing kit is provided.
  • FIG. 8 is the side view of the transistor testing kit according to an embodiment of the present invention.
  • FIG.9 is a layout of the connecting sockets provided in the transistor test kit.
  • FIG. 1 is an isometric view of component segregator depicting complete system for executing the segregation process.
  • the primary sieving unit 110 receives the e-waste components from component removal machine(s) 400 for sorting.
  • Component removal machines provide two types of fractions, i.e. fine and coarse, other than the blank boards.
  • Primary sieving unit 110 conducts screening of fraction containing Solder balls, dust, diodes, transistors, pins and fine particles, which further goes for separate sorting system 300.
  • the transistors are sorted and separated by any suitable method preferably, a roller separation method. Thereafter, the transistors are selectively sent towards the functionality check section 200 for the functionality determination of transistors is done.
  • the functionality check section 200 is equipped with at least one transistor test kit 215 to assess functionality of the segregated transistor. For said functionality assessment, a scrutiny area 210 is provided on at least one side of the section 200.
  • the functionality check section comprises of at least one conveyor system to convey transistor towards the scrutiny area 210.
  • FIG. 2a is a process flow diagram elucidating the component removal procedure wherein the waste material is fed into the component removal machine/apparatus.
  • the component removal machine CCM performs preparatory steps like primary sorting of electronic waste, and removal of the components of the e-waste, particularly waste printed circuit boards. After component removal, the blank boards are sent for shredding and further recycling procedures. Whereas, the removed components are sent for segregation process of present invention. Precisely, the component removal machine connected prior to the segregator apparatus removes all of the working and non working components from the printed circuit boards and conveys said components for various checks to ensure proper waste management approach depending on the type and status of each component.
  • the apparatus would remove all the embedded components of the printed circuit boards convey all such parts for functionality check with the help of various sensing modules and smart testing kits equipped in the apparatus. If components are found in good working condition, then they are sent for reuse purpose. Similarly, if components are found defective, then other approaches of waste management could be opted based on recovery, recycle potential of such defective part(s). The blank boards after component removal are sent for metal recovery process.
  • FIG. 2b a schematic flow diagram for the processing of remaining material obtained is explained.
  • the removed components are sent for size sorting, sieving, metals sorting, and chips sorting. Size sorting of the removed components is done by the rolling separation method. Whereas, metals present in the removed components are sorted through magnetic sorter.
  • FIG. 3 a process diagram depicting the various stages like size sorting, metal sorting and chips sorting according to an embodiment of the present invention. Size sorting is done in stages further by passing the components through rollers and segregating connectors/ports, processor jack/Iron, transistors where transistors are send for functionality checks to assess whether they need to be introduced to mechanical recycling or reuse.
  • FIG. 4 is a perspective view of the main component segregator along with a functionality check section for segregated transistors, according to an embodiment of the present invention.
  • the segregator comprises a frame 145 to support the conveyor system 120 and other sub-assemblies. There are two types of PCB material fractions received from CRM processing other than Blank board namely fine and coarse.
  • Primary sieving unit 110 does the screening of Fine fraction which contains Solder balls, dust, diodes, pins and fine particles, which further goes for separate sorting system.
  • the primary sieving unit 110 forms with screen, cam mechanism for back and forth vibration. It is same as vibratory feeder.
  • the primary sieving unit 110 receives the components from the component removal machine (CRM) wherein, the coarse and fine components are separated.
  • the coarser components includes the components like heat sink, sockets, connectors, copper coils, diodes, coils, connecter bases, transistors, inductors, chips, etc.
  • the coarse components are then transferred to feeder 115 which receives all sized / coarse fraction of mixed components It works on cam mechanism for back and forth vibration. It is same as vibratory feeder.
  • the feeder 115 is contiguously connected to the conveyor system 120.
  • the conveyor system 120 comprises a motor driven conveyor belt that longitudinally runs along the main frame 145 and conveys the coarse fraction of mixed components which passes through various separation stages.
  • the conveyor system further comprises cameras and proximity sensors to sense the components on the conveyor belt and triggering the motor thus moving the conveyor belt in desired direction.
  • a plurality of roller separators 125, 130, & 140 is provided at a suitable location at an adjustable height above the conveyor belt, such that the belt runs just beneath the separators.
  • Each roller separator unit is provided with at least one hopper 155 to receive and collect the components from the roller separator unit.
  • Each roller separator unit segregates the components depending upon their size and transfers the remaining components towards another roller separator unit where, the components are segregated based on the same principle (size based). As discussed above, the segregated components are collected in the respective hoppers 155. Hoppers acts as guide to segregated materials and help in transfer thereof to the functionality check section 200.
  • a magnetic separator/sorter 160 is provided for segregation of magnetic components. The magnetic separator/sorter is attached subsequently next to the roller separators to initiate the magnetic separation process with the components left after roller separation process and guides segregated iron material to collection bins.
  • the functionality check section 200 comprises a conveyor system, a scrutiny area 210, at least one transistor testing kit 215.
  • the conveyor system conveys the segregated transistor towards the scrutiny area wherein, the functionality assessment takes place.
  • FIG. 5 a layout of a PLC controlled system controlling various component removal machines equipped in the apparatus.
  • the PLC system operates all the machines, rollers and sieving motors in an automatic mode.
  • the status of the operation is displayed on the LCD/TFT screen provided to monitor proper functioning of the apparatus.
  • FIG. 6 a flow chart to explain transistor reuse mechanism is elucidated wherein each type of transistor goes through an initial physical test. If the transistor passes the physical test it proceeds for a further test called functionality test. If, in case, the transistor fails either of the test it is sent for mechanical recycling.
  • the kit comprises at least one connecting socket 220, a means 225 to switch ON/OFF state of the kit, at least one indication means 230, an enclosure 235, at least one mounting screw 240.
  • FIG. 8 is the side view of the transistor testing kit according to an embodiment of the present invention.
  • the transistor testing kit comprises an enclosure 235, and at least one test PCB 245.
  • the kit provides connection sockets for connecting both types of transistors i.e. either NPN or
  • connection socket has EBC/CBE and ECB/BCE junctions.
  • Emitter in E Base in B and Collector in C pins and pressing the push button.
  • the state LED is then noticed, if LED glows then transistor is working. If not, then the connections of transistor pins are changed to reverse direction or to the other junction to detect type of transistor and its functionality accordingly. If the transistor is working on NPN side, it is NPN transistor or if working on PNP side, it is PNP transistor. If transistor is not working on all sockets then transistor is declared faulty.
  • automatic component segregator for segregating electronic waste components comprising: a) a frame;
  • At least one conveyor system to move the components away from the feeder, the system comprising motor driven conveyor belt, at least one proximity sensor; d) plurality of roller separator units to segregate transistors according to their respective sizes, each of the unit comprising at least one roller separator and at least one hopper;
  • the conveyor system senses the load and starts transferring the components towards the roller separator units; the roller separator unit segregates and shifts the transistor(s) to be checked into at least one hopper respective to the roller separator unit; and the functionality check section receives the transistors from at least one hopper to perform at least one functionality test of the transistors using said at least one functionality test kit.

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Sorting Of Articles (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

La présente invention concerne un appareil de tri automatique de pièces fonctionnelles et défectueuses dans des cartes de circuit imprimé mises au rebut ou des déchets électroniques avec peu ou pas d'efforts manuels. L'appareil comprend une section de tri de composants et une section de vérification de fonctionnalité équipée d'au moins un kit d'essai de transistor pour distinguer les transistors fonctionnels et non fonctionnels dans les divers étages en fonction de leur fonctionnalité, de leur nature et de leur aptitude à la réutilisation. Les composants issus des déchets subissent alors un tri à travers un certain nombre d'étages où toutes les étapes nécessaires comme le déchiquetage, le tri par tailles, tri de métaux, le tri des pièces réutilisables telles que les puces, transistors, résistances, etc. Dans la section de vérification de la fonctionnalité, les transistors prélevés subissent une vérification de leur intégrité physique suivie d'un test de conductivité. Si le transistor passe les tests d'intégrité physique et de conductivité, il est qualifié pour une réutilisation. Dans le cas contraire, il est dirigé vers le recyclage mécanique.
PCT/IB2016/057133 2015-11-25 2016-11-25 Trieuse automatique de composants dotée d'un ou plusieurs kit(s) intelligent(s) d'essai de transistor WO2017090001A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN3848DE2015 2015-11-25
IN3848/DEL/2015 2015-11-25

Publications (1)

Publication Number Publication Date
WO2017090001A1 true WO2017090001A1 (fr) 2017-06-01

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6568612B1 (en) * 1999-06-30 2003-05-27 Hitachi, Ltd. Method of and apparatus for disposing waste
US7210581B2 (en) * 2001-07-12 2007-05-01 Micron Technology, Inc. Apparatus for magnetically separating integrated circuit devices

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609110A (en) * 1984-08-20 1986-09-02 General Foods Corporation Seed separating apparatus and method
TWI449478B (zh) * 2012-09-13 2014-08-11 Jiin Yeeh Ding Entpr Corp 回收廢棄印刷電路板金屬方法及設備
TW201412417A (zh) * 2012-09-26 2014-04-01 Yung Hsing Machine Industry Co Ltd 回收電路板之電子元件刮除機
CN103990879B (zh) * 2014-05-20 2017-03-22 上海交通大学 带元器件电路板的拆解装置及其拆解方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6568612B1 (en) * 1999-06-30 2003-05-27 Hitachi, Ltd. Method of and apparatus for disposing waste
US7210581B2 (en) * 2001-07-12 2007-05-01 Micron Technology, Inc. Apparatus for magnetically separating integrated circuit devices

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TWI639473B (zh) 2018-11-01
TW201720535A (zh) 2017-06-16

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