WO2017076064A1 - 散热灯杯 - Google Patents

散热灯杯 Download PDF

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Publication number
WO2017076064A1
WO2017076064A1 PCT/CN2016/090579 CN2016090579W WO2017076064A1 WO 2017076064 A1 WO2017076064 A1 WO 2017076064A1 CN 2016090579 W CN2016090579 W CN 2016090579W WO 2017076064 A1 WO2017076064 A1 WO 2017076064A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
heat
layer
lamp cup
wall
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Application number
PCT/CN2016/090579
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English (en)
French (fr)
Inventor
曾茂进
曹亮亮
陈小波
董永哲
鲍永均
陈金锥
林运南
Original Assignee
漳州立达信光电子科技有限公司
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Application filed by 漳州立达信光电子科技有限公司 filed Critical 漳州立达信光电子科技有限公司
Priority to EP16861334.7A priority Critical patent/EP3273160B1/en
Priority to US15/508,475 priority patent/US20170268761A1/en
Publication of WO2017076064A1 publication Critical patent/WO2017076064A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of LED illumination, in particular to a heat dissipation lamp cup.
  • the existing LED lamps are more and more widely used. Considering the high temperature overheating phenomenon caused by the operation of the LEDs, it is necessary to combine the heat sinks to achieve the purpose of auxiliary heat dissipation. led When the light source is working, it will emit a lot of heat. The higher the power, the more heat is emitted. If it is made of all plastic materials, its thermal conductivity is small and heat transfer is slow, which affects the speed and efficiency of heat propagation. The temperature rise of the heat sink itself also directly affects the normal operation of the LED, resulting in an excessively high LED temperature, which is highly susceptible to failure or affects the safety of the lamp.
  • the technical solution adopted by the present invention is: a heat dissipation lamp cup comprising a light source plate, a heat transfer layer and an insulation layer, wherein the insulation layer is disposed at a periphery of the heat transfer layer, wherein the heat transfer layer comprises a heat conduction portion and a heat transfer layer
  • the heat conducting portion is thermally connected to the light source plate, and the heat conducting portion is disposed obliquely with respect to the heat transfer portion, further comprising a heat transfer wall, one end of the heat transfer wall is thermally connected to the heat conducting portion, and the other end of the heat transfer wall
  • the heat transfer portion is thermally connected, and the insulating layer is disposed outside the heat transfer layer and the heat transfer wall.
  • the heat dissipating lamp cup is provided with a heat transfer layer, a heat transfer wall thermally connected to the heat transfer layer, and the insulating layer is disposed outside the heat transfer layer and the heat transfer wall.
  • the heat generated by the light source panel can be quickly transferred to the insulation.
  • the contact area of the heat transfer layer with the insulating layer can be effectively increased, thereby improving the heat transfer efficiency when heat is transferred from the light source plate to the insulating layer, compared to the conventional all plastic.
  • the heat dissipation lamp cup greatly improves the heat dissipation efficiency of the heat dissipation lamp cup and increases the service life of the LED lamp.
  • the heat dissipating lamp cup includes a light source panel 10, a heat transfer layer 20, and an insulating layer 30.
  • the insulating layer 30 is disposed at a periphery of the heat transfer layer 20.
  • the heat transfer layer 20 includes a heat transfer portion 21 and a heat transfer portion 22 .
  • the heat transfer portion 21 is thermally connected to the light source plate 10 , and the heat transfer portion 21 is disposed obliquely with respect to the heat transfer portion 22 .
  • the hot portion 22 is a hollow cylindrical structure provided at the bottom of the heat transfer portion 21.
  • the top surface of the light source panel 10 is provided with an LED light source, and the bottom of the light source panel 10 is thermally connected to the heat conducting portion 21.
  • a heat transfer wall 40 is further included.
  • the heat transfer wall 40 has a circular ring structure. One end of the heat transfer wall 40 is thermally connected to the heat conducting portion 21 , and the other end of the heat transfer wall 40 is The heat transfer portion 22 is thermally connected, and the insulating layer 30 is disposed outside the heat transfer layer 20 and the heat transfer wall 40. Further, the heat transfer layer 20 and the heat transfer wall 40 are each made of a metal sheet.
  • An opening 41 is formed between the heat transfer wall 40 and the heat transfer layer 20, and the insulating layer 30 is disposed outside the heat transfer layer 20 and the heat transfer wall 40 and enters the opening 41, so that the heat transfer layer 20 and the heat transfer layer 20
  • the insulating layer 30 is filled between the heat transfer walls 40.
  • the opening 41 is an opening provided in the heat transfer wall 40.
  • the insulating layer 30 is made of a thermally conductive plastic. In the embodiment, the insulating layer 30 is disposed outside the heat transfer layer 20 and the heat transfer wall 40 by an injection molding or extrusion process.
  • the heat generated by the LED light source on the light source panel 10 is first transmitted to the heat transfer portion 21 of the heat transfer layer 20, and a portion of the heat is rapidly transmitted to the heat transfer wall 40 through the heat transfer portion 21, and a portion of the heat passes first.
  • the heat transfer portion 22 is further transferred to the heat transfer wall 40, and then heat is transferred to the heat transfer layer 20 and the insulating layer 30 outside the heat transfer wall 40, thereby accelerating heat dissipation in the insulation layer 30. At the speed, the last heat can be dissipated through the insulating layer 30 to the external space.
  • the heat dissipating lamp cup is provided with the heat transfer layer 20, the heat transfer wall 40 thermally connected to the heat transfer layer 20, and the insulating layer 30 disposed outside the heat transfer layer 20 and the heat transfer wall 40,
  • the heat generated by the light source panel 10 can be quickly transferred to the insulation 30.
  • the contact area of the heat transfer layer 20 with the insulating layer 30 can be effectively increased, thereby improving the heat transfer efficiency when heat is transferred from the light source panel 10 to the insulating layer 30, compared with In the traditional all-plastic heat-dissipating lamp cup, the heat-dissipating efficiency of the heat-dissipating lamp cup is greatly improved, and the service life of the LED lamp is increased.
  • Patent Document 1

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

一种散热灯杯，包括光源板（10）、传热层（20）及绝缘层（30），所述绝缘层（30）设置在所述传热层（20）的外围，所述传热层（20）包括导热部（21）及传热部（22），所述导热部（21）与所述光源板（10）热连接，所述导热部（21）相对所述传热部（22）倾斜设置，还包括传热壁（40），所述传热壁（40）的一端与所述导热部（21）热连接，所述传热壁（40）的另一端与所述传热部（22）热连接，所述绝缘层（30）设置在所述传热层（20）与所述传热壁（40）之外。所述散热灯杯具有散热效率高的优点。

Description

散热灯杯
本发明涉及LED 照明领域，特别是一种散热灯杯。
现有LED灯具应用越来越广泛，虑到发光二极管工作时所产生的高温过热现象，需要结合散热器达到辅助散热的目的。LED 光源在工作时，会散发出大量的热量，功率越大，散发的热量就越多，若采用全部用塑料材料制作，其导热系数小、传热慢，影响到热传播的速度及效率，使得散热壳体本身的温度升高，也直接影响到LED 的正常工作，导致LED温度过高，极易失效或影响灯具的使用安全。
有鉴于此，有必要提供一种散热效率高的散热灯杯。
本发明采用的技术方案为：一种散热灯杯，包括光源板、传热层及绝缘层，该绝缘层设置在该传热层的外围，其特征在于，该传热层包括导热部及传热部，该导热部与该光源板热连接，该导热部相对该传热部倾斜设置，还包括传热壁，该传热壁的一端与该导热部热连接，该传热壁的另一端与该传热部热连接，该绝缘层设置在该传热层与该传热壁之外。
与现有技术相比，该散热灯杯通过设置传热层、与该传热层热连接的传热壁及在该传热层与该传热壁之外设置该绝缘层，这样，使得该光源板产生的热量能够迅速的传递到该绝缘上。而且，通过设置该传热壁，可以有效增加该传热层与该绝缘层的接触面积，从而提高了热量从该光源板传递到该绝缘层时的传热效率，相比于传统的全塑料散热灯杯，大大提高了该散热灯杯的散热效率，增加了LED灯的使用寿命。
 图1
是本发明第一实施例的散热灯杯的立体分解图。
图2
是图1所示散热灯杯的剖视图。
以下结合附图与具体实施方式对本发明作进一步说明。
图1 是本发明第一实施例的散热灯杯的立体分解图，该散热灯杯包括光源板10、传热层20及绝缘层30，该绝缘层30设置在该传热层20的外围。
请参考图1及图2，该传热层20包括导热部21及传热部22，该导热部21与该光源板10热连接，该导热部21相对该传热部22倾斜设置，该传热部22为设置在该导热部21底部的中空筒状结构。该光源板10的顶面设有LED光源，该光源板10的底部与该导热部21热连接。
请参考图1至图3，还包括传热壁40，该传热壁40为圆环形结构，该传热壁40的一端与该导热部21热连接，该传热壁40的另一端与该传热部22热连接，该绝缘层30设置在该传热层20与该传热壁40之外。此外，该传热层20及该传热壁40均由金属片材制成。该传热壁40与该传热层20之间形成开口41，绝缘层30设置在该传热层20与该传热壁40之外并且进入该开口41内，使得该传热层20及该传热壁40之间充填有该绝缘层30。其中，该开口41为设置在该传热壁40上的开孔。此外，该绝缘层30由导热塑料制成，本实施例中，该绝缘层30通过注塑或挤出工艺设置在该传热层20及该传热壁40之外。
工作时，该光源板10上的LED光源产生的热量首先传递到该传热层20的导热部21上，一部分热量通过该导热部21迅速地传递到该传热壁40上，一部分热量先通过该传热部22再传递到该传热壁40上，而后，将热量传递到该传热层20与该传热壁40之外的绝缘层30，加快了热量在该绝缘层30里的散发速度，最后热量可通过该绝缘层30散发到外部空间。
综上所述，该散热灯杯通过设置传热层20、与该传热层20热连接的传热壁40及在该传热层20与该传热壁40之外设置该绝缘层30，这样，使得该光源板10产生的热量能够迅速的传递到该绝缘30。而且，通过设置该传热壁40，可以有效增加该传热层20与该绝缘层30的接触面积，从而提高了热量从该光源板10传递到该绝缘层30时的传热效率，相比于传统的全塑料散热灯杯，大大提高了该散热灯杯的散热效率，增加了LED灯的使用寿命。
以上这些仅为本发明的较佳实施例而已，并不用以限制本发明，任何本领域人员在不脱离本方案技术范围内，可当利用上述揭露的技术内容作些许改动为同等变化的等效实施例。但凡为脱离在本发明技术方案内容，依据本发明技术实质对以上实施例所做的任何修改、等同替换、改进等，均应包含在本发明保护的范围之内。
  1. 10 光源板
  2. 20 传热层
  3. 30 绝缘层
  4. 40 传热壁
  5. 21 导热部
  6. 22 传热部
  7. 41 开口
专利文献1：
非 ：

Claims (8)

  1. 一种散热灯杯，包括光源板、传热层及绝缘层，该绝缘层设置在该传热层的外围，其特征在于，该传热层包括导热部及传热部，该导热部与该光源板热连接，该导热部相对该传热部倾斜设置，还包括传热壁，该传热壁的一端与该导热部热连接，该传热壁的另一端与该传热部热连接，该绝缘层设置在该传热层与该传热壁之外。
  2. 根据权利要求1所述的散热灯杯，其特征在于：该传热壁与该传热层之间形成开口，绝缘层设置在该传热层与该传热壁之外并且进入该开口内。
  3. 根据权利要求2所述的散热灯杯，其特征在于：该开口为设置在该传热壁上的开孔。
  4. 根据权利要求2或3所述的散热灯杯，其特征在于：该绝缘层通过注塑或挤出工艺设置在该传热层及该传热壁之外。
  5. 根据权利要求1所述的散热灯杯，其特征在于：该传热层及该传热壁均由金属片材制成。
  6. 根据权利要求5所述的散热灯杯，其特征在于：该传热部为设置在该导热部底部的中空筒状结构，该传热壁为圆环形结构。
  7. 根据权利要求1所述的散热灯杯，其特征在于：该绝缘层由导热塑料制成。
  8. 根据权利要求1所述的散热灯杯，其特征在于：该光源板的顶面设有LED光源，该光源板的底部与该导热部热连接。
PCT/CN2016/090579 2015-11-05 2016-07-20 散热灯杯 WO2017076064A1 (zh)

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EP16861334.7A EP3273160B1 (en) 2015-11-05 2016-07-20 Heat-dissipation lamp cup
US15/508,475 US20170268761A1 (en) 2015-11-05 2016-07-20 Heat dissipation light ring

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CN201510744137.2 2015-11-05
CN201510744137.2A CN105276550B (zh) 2015-11-05 2015-11-05 散热灯杯

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Publication number Priority date Publication date Assignee Title
CN105276550B (zh) * 2015-11-05 2020-08-25 漳州立达信光电子科技有限公司 散热灯杯
CN109519900A (zh) * 2018-11-28 2019-03-26 漳州立达信光电子科技有限公司 一种光源板散热结构及灯具
CN110081327A (zh) * 2019-04-09 2019-08-02 江西旺来塑料电器科技有限公司 一种铝合金灯杯及其配合模具

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