WO2017054318A1 - 一种扬声器模组 - Google Patents

一种扬声器模组 Download PDF

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Publication number
WO2017054318A1
WO2017054318A1 PCT/CN2015/096721 CN2015096721W WO2017054318A1 WO 2017054318 A1 WO2017054318 A1 WO 2017054318A1 CN 2015096721 W CN2015096721 W CN 2015096721W WO 2017054318 A1 WO2017054318 A1 WO 2017054318A1
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WO
WIPO (PCT)
Prior art keywords
speaker module
magnetic
array
magnetic circuit
case
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PCT/CN2015/096721
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English (en)
French (fr)
Inventor
张庆一
陈钢
范双双
Original Assignee
歌尔声学股份有限公司
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Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US15/762,588 priority Critical patent/US10237662B2/en
Publication of WO2017054318A1 publication Critical patent/WO2017054318A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to the field of electroacoustic technology, and more particularly to a speaker.
  • the researcher in view of the relatively small size of the speaker module, the researcher usually does not use the method of improving the structure to enhance the heat dissipation effect, but uses the sound hole and the orifice of the speaker to dissipate heat.
  • the inventors have found that in the above method, since the orifice is generally far away from the magnetic circuit, and the sound hole is also far away from the vibration component, the heat dissipation by the sound hole and the orifice can not effectively and quickly dissipate the heat, and the heat dissipation efficiency is low. .
  • the opening ratio of the orifice and the sound hole is small, which affects the heat dissipation effect. Therefore, the inventors have provided a speaker module capable of efficiently radiating the heat of the speaker without affecting the acoustic characteristics of the speaker.
  • a speaker module comprising:
  • a housing comprising an upper case and a lower case, the case defining a cavity structure, at least one of the upper case or the lower case being provided with an array of micro holes;
  • a speaker unit comprising a magnetic circuit assembly and a vibration assembly, the vibration assembly separating the inner cavity structure into a front cavity and a rear cavity, wherein the magnetic circuit component is provided with a predetermined pattern of magnetic gap, the magnetic circuit component being close to Lower case setting.
  • a microwell array is provided only at a position of the upper casing corresponding to the front cavity region.
  • a microwell array corresponding to the magnetic gap pattern is provided only on the lower case.
  • the lower case is provided with a magnetic conductive plate at a position corresponding to the magnetic circuit assembly, and the micro hole array is disposed on the magnetic conductive plate.
  • a microwell array is disposed at a position corresponding to the front cavity region of the upper case and a position corresponding to the magnetic gap pattern of the lower case.
  • the lower case is provided with a magnetic conductive plate at a position corresponding to the magnetic circuit assembly, and the micro hole array is disposed on the magnetic conductive plate.
  • the pore array has a pore size of no more than 0.05 mm.
  • the housing is provided with an injection-molded steel sheet corresponding to the speaker unit, and the micro-hole array is disposed on a corresponding injection-molded steel sheet.
  • the housing further includes a middle case, and the upper case, the middle case and the lower case collectively define a cavity structure.
  • One technical effect of the present invention is to enhance the heat dissipation effect of the speaker module by using a micro-hole array formed at least on the upper or lower case.
  • the micro-hole array formed on the upper shell or the lower shell of the invention is closer to the heat source and has a higher aperture ratio, thereby greatly improving the speaker module. Cooling efficiency.
  • the inventors of the present invention have found that in view of the compact structure of the speaker module, in the prior art, the research and development personnel do not adopt the method of improving the structure of the speaker module itself to perform heat dissipation, but use the original sound hole and damping.
  • the hole dissipates heat.
  • the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • Figure 1 is a schematic illustration of a speaker module.
  • FIG. 2 is a schematic view of a speaker module.
  • Figure 3 is a cross-sectional view taken at c and c' in Figure 2 .
  • Figure 4 is an enlarged view of a portion A in Figure 3.
  • a speaker module comprising a housing and a speaker unit.
  • the casing is divided into an upper casing 3, a middle casing 2 and a lower casing 1, and the upper casing 3, the middle casing 2 and the lower casing 1 define an internal cavity structure.
  • the speaker unit includes a magnetic circuit assembly 5 and a vibration group
  • the vibration component divides the inner cavity structure into a front cavity and a rear cavity, and the vibration component includes a voice coil 7.
  • a magnetic gap of a predetermined pattern is disposed on the magnetic circuit assembly 5, and the magnetic circuit assembly is disposed adjacent to the lower casing.
  • the microwell array 6 is disposed only at a position corresponding to the front cavity region of the upper casing 3.
  • the microwell array herein refers to a microhole array opened by a laser, and may be used in practical applications. Techniques such as etching open microwell arrays.
  • the aperture of the microwell array is controlled within 0.05 mm to ensure that sound does not escape from the micropores.
  • the material used for the position corresponding to the microwell array 6 on the upper casing 3 is an injection molded steel sheet.
  • the material of the upper case 3 should not be specifically limited. Those skilled in the art can perform deformation and expansion according to actual conditions, but these deformations And expansion should fall within the scope of protection of the present invention.
  • the present embodiment is to open the microwell array 6 on the upper case 3 corresponding to the front cavity region, since the diaphragm in the vibration component separates the inner cavity structure into the front cavity and the rear cavity, it can also be said that in this embodiment
  • the microwell array 6 is provided to correspond to the diaphragm.
  • the heat at the diaphragm can be efficiently and effectively discharged to the outside of the speaker module to prevent deformation of the diaphragm due to high temperature.
  • the inventors have considered the acoustic characteristics of the speaker module, so the aperture is required. In the case of repeated trials by the inventors, it was found that the aperture should be controlled within 0.05 mm, which ensures that the sound does not emanate from the micro-holes, that is, while ensuring the acoustic characteristics of the speaker module, it also has excellent heat dissipation. effect.
  • a speaker module includes a housing and a speaker unit.
  • the casing is divided into an upper casing 3, a middle casing 2 and a lower casing 1, and the upper casing 3, the middle casing 2 and the lower casing 1 define an internal cavity structure.
  • the speaker unit includes a magnetic circuit assembly 5 and a vibration assembly.
  • the vibration assembly divides the inner cavity structure into a front cavity and a rear cavity, and the vibration component includes a voice coil 7.
  • a magnetic gap of a predetermined pattern is disposed on the magnetic circuit assembly 5, and the magnetic circuit assembly 5 is disposed adjacent to the lower casing.
  • the microwell array corresponding to the magnetic gap pattern is provided on the lower case 1.
  • the micro-hole array here refers to a micro-hole array opened by a laser, and can also be used in practical applications. Techniques such as etching open microwell arrays.
  • the aperture of the microwell array is controlled within 0.05 mm to ensure that sound does not escape from the micropores.
  • the present embodiment is provided with the microwell array 4 corresponding to the magnetic gap pattern only on the lower case 1, since the microwell array is provided corresponding to the magnetic gap, this method is inherently adopted in the prior art.
  • the way in which the orifice is indirectly dissipated heat is directly discharged by the microporous array conduction.
  • the opening position directly corresponds to the heat source, the heat at the magnetic gap can be efficiently and effectively discharged to the outside of the speaker module to prevent high temperature demagnetization.
  • the inventors have considered the acoustic characteristics of the speaker module, so the aperture is required.
  • the aperture should be controlled within 0.05 mm, which ensures that the sound does not escape from the micro-holes, which not only ensures the acoustic characteristics of the speaker module, but also has an excellent heat dissipation effect.
  • a speaker module comprising a housing and a speaker unit.
  • the casing is divided into an upper casing 3, a middle casing 2 and a lower casing 1, and the upper casing 3, the middle casing 2 and the lower casing 1 define an internal cavity structure.
  • the speaker unit includes a magnetic circuit assembly 5 and a vibration assembly.
  • the vibration assembly divides the inner cavity structure into a front cavity and a rear cavity, and the vibration component includes a voice coil 7.
  • a magnetic gap of a predetermined pattern is disposed on the magnetic circuit assembly 5, and the magnetic circuit assembly is disposed adjacent to the lower casing.
  • the lower case 1 is provided with a magnetic conductive plate 8 at a position corresponding to the magnetic circuit assembly.
  • only the microporous array corresponding to the magnetic gap is disposed on the magnetic conductive plate 8.
  • the microporous array here refers to a microporous array opened by a laser.
  • a micropore array can be opened on the magnetic conductive plate by etching or the like.
  • the aperture of the microwell array is controlled within 0.05 mm to ensure that sound does not escape from the micropores.
  • the present embodiment only provides the microwell array 4 corresponding to the magnetic gap on the magnetic conductive plate 8 since the microwell array 4 is disposed corresponding to the magnetic gap, this method is inherently modified in the prior art.
  • the way the damper hole is indirectly dissipated the heat is directly discharged by the micro-hole array conduction.
  • the opening position directly corresponds to the heat source, the heat at the magnetic gap can be efficiently and efficiently discharged to the outside of the speaker module to prevent the occurrence of high temperature demagnetization, and the diaphragm can be prevented from being deformed due to excessive temperature.
  • the inventors have considered the acoustic characteristics of the speaker module, so the aperture is required.
  • the aperture should be controlled within 0.05 mm, which ensures that the sound does not escape from the micro-hole, which not only ensures the acoustic characteristics of the speaker module, but also has excellent heat radiation.
  • a speaker module comprising a housing and a speaker unit.
  • the casing is divided into an upper casing 3, a middle casing 2 and a lower casing 1, and the upper casing 3, the middle casing 2 and the lower casing 1 define an internal cavity structure.
  • the speaker unit includes a magnetic circuit assembly 5 and a vibration assembly.
  • the vibration assembly divides the inner cavity structure into a front cavity and a rear cavity, and the vibration component includes a voice coil 7.
  • a magnetic gap of a predetermined pattern is disposed on the magnetic circuit assembly 5, and the magnetic circuit assembly is disposed adjacent to the lower casing.
  • a microwell array is disposed at a position corresponding to the front cavity region of the upper casing 3 and at a position corresponding to the magnetic gap of the lower casing 1, wherein the microhole array refers to a microscopic opening Hole arrays, in practical applications, can also be used to open microwell arrays using etching techniques.
  • the aperture of the microwell array is controlled within 0.05 mm to ensure that sound does not escape from the micropores.
  • the material used for the position corresponding to the microwell array 6 on the upper casing 3 is an injection molded steel sheet. However, those skilled in the art should understand that this is only the most preferred mode of the embodiment, and the material of the upper case 3 should not be specifically limited. Those skilled in the art can perform deformation and expansion according to actual conditions, but these deformations And expansion should fall within the scope of protection of the present invention.
  • the present embodiment is a micropore array corresponding to the magnetic gap in the magnetic circuit assembly at a position corresponding to the front cavity region of the upper casing and the lower casing, the micropore array and the vibration are provided on the upper casing.
  • the array of micropores provided on the lower shell corresponds to the magnetic gap.
  • the heat is directly discharged by using the array of microwells at the two places. Since the opening position directly corresponds to the two heat sources of the diaphragm and the magnetic gap, the heat at the diaphragm and the magnetic gap can be directly and effectively discharged to the outside of the speaker module, while preventing the occurrence of high temperature demagnetization. It can also prevent the diaphragm from being deformed due to excessive temperature.
  • this setting method can effectively improve the pressure environment in the cavity during vibration and reduce the resistance when the diaphragm vibrates, which can effectively reduce the heat generation of the voice coil.
  • the inventors have considered the acoustic characteristics of the speaker module while considering the maximum efficiency of heat dissipation, so the aperture is required. In the case of repeated trials by the inventors, it was found that the aperture should be controlled within 0.05 mm, which ensures that the sound does not emanate from the micro-holes, which not only ensures the acoustic characteristics of the speaker module, but also has the best heat dissipation effect.
  • a speaker module which includes a housing and a speaker unit, and the specific structure is as shown in FIG.
  • the casing is divided into an upper casing 3, a middle casing 2 and a lower casing 1, and the upper casing 3, the middle casing 2 and the lower casing 1 define an internal cavity structure.
  • the lower case further includes a magnetic conductive plate disposed corresponding to the magnetic circuit assembly.
  • the speaker unit includes a magnetic circuit assembly 5 and a vibration assembly.
  • the vibration assembly divides the inner cavity structure into a front cavity and a rear cavity, and the vibration component includes a voice coil 7.
  • a magnetic gap of a predetermined pattern is disposed on the magnetic circuit assembly 5, and the magnetic circuit assembly is disposed adjacent to the lower casing.
  • a microwell array 6 is disposed at a position corresponding to the front cavity region of the upper casing 3, and at the same time, a microhole array 4 is disposed at a position corresponding to the magnetic gap on the magnetic conductive plate 8 of the lower casing 1 .
  • the settings are shown in Figures 2 to 4.
  • the micro-hole array here refers to a micro-hole array opened by laser technology, and in practical applications, micro-holes can also be opened by etching techniques.
  • the pore diameter of the micropores is controlled within 0.05 mm to ensure that sound is not scattered from the micropores.
  • the material used for the position corresponding to the microwell array 6 on the upper casing 3 is an injection molded steel sheet.
  • the micropore array 4 is disposed at a position corresponding to the magnetic gap on the magnetic conductive plate 8 of the lower case, Since the position of the microwell array disposed on the upper case corresponds to the diaphragm, the position of the microwell array disposed on the magnetic conductive plate 8 of the lower case corresponds to the magnetic gap, and the method directly utilizes the two places.
  • the microwell array discharges heat.
  • this embodiment is a preferred embodiment, that is, the heat dissipation efficiency of this embodiment is the largest.
  • the inventors have considered the acoustic characteristics of the speaker module while considering the maximum efficiency of heat dissipation, so the aperture is required.
  • the aperture should be controlled within 0.05 mm, which ensures that the sound does not emanate from the micro-holes, which not only ensures the acoustic characteristics of the speaker module, but also has the best heat dissipation effect.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开了一种扬声器模组，包括：壳体，所述壳体包括上壳及下壳，所述壳体限定一内腔结构，至少在上壳或下壳之一上设置有微孔阵列；以及扬声器单体，包括磁路组件和振动组件，所述振动组件将所述内腔结构分隔为前腔及后腔，所述磁路组件上设置有预定图案的磁间隙，所述磁路组件靠近下壳设置。本发明所要解决的一个技术问题是扬声器模组的散热问题。

Description

一种扬声器模组 技术领域
本发明涉及电声技术领域，更具体地，涉及一种扬声器。
背景技术
随着现代技术的不断发展，人们对电子设备的要求越来越高。扬声器作为移动设备中不可或缺的一部分，人们对其品质也提出了更高的要求。而在提高扬声器声音品质及音量的同时，扬声器的工作功率也不断加大。扬声器模组中的振膜组件在振动的时候会受到前后腔的空气的阻碍，因此在振动的时候会产生大量的热量，随着工作功率的不断增加，其工作过程中所产生的热量也不断增加。扬声器作为一种高精尖的电子零部件，其构造精巧，结构复杂，往往无法将产生的热量及时有效的排除，过多的热量会对振膜组件，磁路组件造成影响。
在现有技术中，鉴于扬声器模组较为微小，研发人员通常不采用改进其构造的方法来增强散热效果，而是采用扬声器固有的出声孔及阻尼孔来进行散热。然而发明人发现上述方法中，由于阻尼孔一般远离磁路，且出声孔也距离振动组件较远，因此采用出声孔及阻尼孔散热的方式无法有效迅速的将热量散出，散热效率低。且阻尼孔及出声孔的开孔率小，影响散热效果。因此发明人提供了一种在不影响扬声器的声学特性的前提下，能够将扬声器热量有效的散发出去的扬声器模组。
发明内容
本发明的一个目的是在不影响声学性能的前提下增强扬声器模组的散热效果。
根据本发明的一个方面，提供一种扬声器模组，包括：
壳体，所述壳体包括上壳及下壳，所述壳体限定一内腔结构，至少在上壳或下壳之一上设置有微孔阵列；以及
扬声器单体，包括磁路组件和振动组件，所述振动组件将所述内腔结构分隔为前腔及后腔，所述磁路组件上设置有预定图案的磁间隙，所述磁路组件靠近下壳设置。
优选地，仅在所述上壳的与所述前腔区域相对应的位置上设置有微孔阵列。
优选地，仅在所述下壳上设置有与所述磁间隙图案相对应的微孔阵列。
优选地，所述下壳与磁路组件相对应的位置上设置有导磁板，所述微孔阵列设置在导磁板上。
优选地，在所述上壳的与所述前腔区域相对应的位置上及所述下壳与磁间隙图案相对应的位置上均设置有微孔阵列。
优选地，所述下壳与磁路组件相对应的位置上设置有导磁板，所述微孔阵列设置在导磁板上。
优选地，所述微孔阵列的孔径不大于0.05mm。
优选地，所述壳体对应所述扬声器单体设置有注塑钢片，所述微孔阵列设置在对应的注塑钢片上。
优选地，所述壳体还包括中壳，所述上壳、中壳及下壳共同限定一内腔结构。
本发明的一个技术效果在于，利用至少在上壳或是下壳上开设的微孔阵列来增强扬声器模组的散热效果。本发明在上壳或是下壳上所开设的微孔阵列与现有技术中的出声孔及阻尼孔相比，距离热源较近，且开孔率较高，因此大大提高了扬声器模组的散热效率。
本发明的发明人发现，鉴于扬声器模组构造精巧，因此在现有技术中，研发人员不采用对扬声器模组本身构造进行改进的方式来进行散热，而是采用原有的出声孔及阻尼孔进行散热，然而由于出声孔及阻尼孔距离热源较远，因此存在散热效率低的缺陷。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1是扬声器模组的示意图。
图2是扬声器模组的示意图。
图3是图2中的c与c’处的剖视图。
图4是图3中A处的放大图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
根据本发明的第一具体实施例，提供一种扬声器模组，该扬声器包括壳体和扬声器单元。其中壳体分为上壳3、中壳2及下壳1，上壳3、中壳2与下壳1限定了一内腔结构。其中扬声器单体包括磁路组件5和振动组 件，振动组件将内腔结构分隔为前腔及后腔，振动组件中包含音圈7。磁路组件5上设置有预定图案的磁间隙，所述磁路组件靠近下壳设置。
本实施例中仅在上壳3的与前腔区域相对应的位置上设置有微孔阵列6，这里的微孔阵列所指的是采用激光开设的微孔阵列，在实际应用中也可采用蚀刻等技术开设微孔阵列。本实施例中微孔阵列的孔径控制在0.05mm内，保证声音不从微孔中散出。本实施例中上壳3上与微孔阵列6对应的位置采用的材料为注塑钢片。然而，本领域技术人员应当了解，这只是本实施例的最优选的方式，且不应对上壳3的材料进行具体的限定，本领域的技术人员可以根据实际情况进行变形和拓展，但这些变形及拓展都应属于本发明的保护范围。
由于本实施例是在与前腔区域对应的上壳3上开设微孔阵列6，由于振动组件中的振膜将内腔结构分隔成了前腔及后腔，因此也可以说本实施例中所设的微孔阵列6与振膜相对应。扬声器模组在进行工作的过程中，振膜振动时会产生大量的热量。此种利用在上壳与前腔区域相对应的位置设置微孔的散热方法，一改现有技术中通过固有的出声孔间接散热的方式，直接利用传导将热量排除。此种方法由于开孔位置直接对应热源，可以将振膜处的热量及时有效的排到扬声器模组外部，防止振膜因为高温造成的变形。发明人考虑到扬声器模组的声学特性，所以对孔径进行了要求。在发明人反复试验的情况下，发现孔径需控制在0.05mm内，这样保证了声音不会从微孔中散出，即在保证了扬声器模组的声学特性的同时，也具有极佳的散热效果。
根据本发明的第二具体实施例，提供一种扬声器模组，该扬声器包括壳体和扬声器单元。其中壳体分为上壳3、中壳2及下壳1，上壳3、中壳2与下壳1限定了一内腔结构。其中扬声器单体包括磁路组件5和振动组件，振动组件将内腔结构分隔为前腔及后腔，振动组件中包含音圈7。磁路组件5上设置有预定图案的磁间隙，且磁路组件5靠近下壳设置。
本实施例中仅在下壳1上设置有与磁间隙图案相对应的微孔阵列。这里的微孔阵列所指的是采用激光开设的微孔阵列，在实际应用中也可采用 蚀刻等技术开设微孔阵列。本具体实施例中微孔阵列的孔径控制在0.05mm内，保证声音不从微孔中散出。
由于本实施例是仅在下壳1上设置有与磁间隙图案相对应的微孔阵列4，由于所设置的微孔阵列与磁间隙相对应，此种方法，一改现有技术中通过固有的阻尼孔间接散热的方式，直接利用微孔阵列传导将热量排出。此种方法由于开孔位置直接对应热源，可以将磁间隙处的热量及时有效的排到扬声器模组外部，防止高温退磁现象的发生。发明人考虑到扬声器模组的声学特性，所以对孔径进行了要求。在发明人反复试验的情况下，发现孔径需控制在0.05mm内，这样保证了声音不会从微孔中散出，既保证了扬声器模组的声学特性，同时也具有极佳的散热效果。
根据本发明的第三具体实施例，提供一种扬声器模组，该扬声器包括壳体和扬声器单元。其中壳体分为上壳3、中壳2及下壳1，上壳3、中壳2与下壳1限定了一内腔结构。其中扬声器单体包括磁路组件5和振动组件，振动组件将内腔结构分隔为前腔及后腔，振动组件中包含音圈7。磁路组件5上设置有预定图案的磁间隙，且磁路组件靠近下壳设置。
本实施例中下壳1与磁路组件相对应的位置上设置有导磁板8，本实施例中仅在导磁板8上设置有与磁间隙相对应的微孔阵列。这里的微孔阵列所指的是采用激光开设的微孔阵列，在实际应用中也可采用蚀刻等技术对导磁板开设微孔阵列。本实施例中微孔阵列的孔径控制在0.05mm内，保证声音不从微孔中散出。
由于本实施例仅在导磁板8上设置有与磁间隙相对应的微孔阵列4，由于所设置的微孔阵列4与磁间隙相对应，此种方法，一改现有技术中通过固有的阻尼孔间接散热的方式，直接利用微孔阵列传导将热量排出。此种方法由于开孔位置直接对应热源，可以将磁间隙处的热量及时有效的排到扬声器模组外部，防止高温退磁现象的发生，也可防止振膜因温度过高变形。发明人考虑到扬声器模组的声学特性，所以对孔径进行了要求。在发明人反复试验的情况下，发现孔径需控制在0.05mm内，这样保证了声音不会从微孔中散出，既保证了扬声器模组的声学特性，同时也具有极佳的 散热效果。
根据本发明的第四具体实施例，提供一种扬声器模组，该扬声器包括壳体和扬声器单元。其中壳体分为上壳3、中壳2及下壳1，上壳3、中壳2与下壳1限定了一内腔结构。其中扬声器单体包括磁路组件5和振动组件，振动组件将内腔结构分隔为前腔及后腔，振动组件中包含音圈7。磁路组件5上设置有预定图案的磁间隙，且磁路组件靠近下壳设置。
本实施例在上壳3的与前腔区域相对应的位置上及在下壳1的与磁间隙相对应的位置上设置有微孔阵列，这里的微孔阵列所指的是采用激光开设的微孔阵列，在实际应用中也可采用蚀刻等技术开设微孔阵列。本实施例中微孔阵列的孔径控制在0.05mm内，保证声音不从微孔中散出。本实施例中上壳3上与微孔阵列6对应的位置采用的材料为注塑钢片。然而，本领域技术人员应当了解，这只是本实施例的最优选的方式，且不应对上壳3的材料进行具体的限定，本领域的技术人员可以根据实际情况进行变形和拓展，然而这些变形及拓展都应属于本发明的保护范围。
由于本实施例是在上壳的与前腔区域相对应的位置上及下壳的与磁路组件中的磁间隙相对应的微孔阵列，由于在上壳上所设置的微孔阵列与振膜相对应，在下壳上所设置的微孔阵列与磁间隙相对应，此种方法，直接利用这两处的微孔阵列将热量排出。此种方法由于开孔位置直接对应振膜及磁间隙两处热源，因此可以直接将振膜及磁间隙处的热量及时有效的排到扬声器模组外部，在防止高温退磁现象的发生的同时，也可防止振膜因温度过高变形，并且，此种设置方法可有效改善振动时腔体内气压环境，降低振膜振动时的阻力，可有效降低音圈产热。发明人在考虑到最大效度散热的同时也考虑到了扬声器模组的声学特性，所以对孔径提出了要求。在发明人反复试验的情况下，发现孔径需控制在0.05mm内，这样保证了声音不会从微孔中散出，既保证了扬声器模组的声学特性，同时也具有最佳的散热效果。
根据本发明的第五具体实施例，提供一种扬声器模组，该扬声器包括壳体和扬声器单元，具体结构如图1所示。其中壳体分为上壳3、中壳2及下壳1，上壳3、中壳2与下壳1限定了一内腔结构。本实施例中下壳还包括对应磁路组件设置的导磁板。其中扬声器单体包括磁路组件5和振动组件，振动组件将内腔结构分隔为前腔及后腔，振动组件中包含音圈7。磁路组件5上设置有预定图案的磁间隙，且磁路组件靠近下壳设置。
本实施例在上壳3的与前腔区域相对应的位置上设置有微孔阵列6，且同时在下壳1的导磁板8上与磁间隙相对应的位置设置有微孔阵列4，具体设置如图2至4所示。这里的微孔阵列所指的是采用激光技术开设的微孔阵列，在实际应用中也可采用蚀刻等技术开设微孔。本实施例中微孔的孔径控制在0.05mm内，保证声音不从微孔中散出。本实施例中上壳3上与微孔阵列6对应的位置采用的材料为注塑钢片。然而，本领域技术人员应当了解，这只是本实施例的最优选的方式，且不应对壳体的材料进行具体的限定，本领域的技术人员可以根据实际情况进行变形和拓展，但是这些变形及拓展都应属于本发明的保护范围。
由于本实施例是在上壳3的与前腔区域相对应的位置上设置有微孔阵列6，且同时在下壳的导磁板8上与磁间隙相对应的位置设置有微孔阵列4，由于在上壳上所设置的微孔阵列的位置与振膜相对应，在下壳的导磁板8上所设置的微孔阵列的位置与磁间隙相对应，此种方法，直接利用这两处的微孔阵列将热量排出。此种方法由于开孔位置直接对应振膜及磁间隙两处热源，可以直接将振膜及磁间隙处的热量及时有效的排到扬声器模组外部，在防止高温退磁现象的发生的同时，也可防止振膜因温度过高变形，并且，此种设置方法可有效改善振动时腔体内气压环境，降低振膜振动时的阻力，可有效降低音圈产热。因此本实施例为最优实施例，即本实施例的散热效率最大。发明人在考虑到最大效度散热的同时也考虑到了扬声器模组的声学特性，所以对孔径进行了要求。在发明人反复试验的情况下，发现孔径需控制在0.05mm内，这样保证了声音不会从微孔中散出，既保证了扬声器模组的声学特性，同时也具有最佳的散热效果。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (9)

  1. 一种扬声器模组，其特征在于，包括：
    壳体，所述壳体包括上壳(3)及下壳(1)，所述壳体限定一内腔结构，至少在上壳(3)或下壳(1)之一上设置有微孔阵列；以及
    扬声器单体，包括磁路组件(5)和振动组件，所述振动组件将所述内腔结构分隔为前腔及后腔，所述磁路组件(5)上设置有预定图案的磁间隙，所述磁路组件靠近下壳(1)设置。
  2. 根据权利要求1所述的扬声器模组，其特征在于，仅在所述上壳(3)的与所述前腔区域相对应的位置上设置有微孔阵列(6)。
  3. 根据权利要求1所述的扬声器模组，其特征在于，仅在所述下壳(1)上设置有与所述磁间隙图案相对应的微孔阵列。
  4. 根据权利要求3所述的扬声器模组，其特征在于，所述下壳(1)与磁路组件相对应的位置上设置有导磁板(8)，所述微孔阵列(4)设置在导磁板(8)上。
  5. 根据权利要求1所述的扬声器模组，其特征在于，在所述上壳的与所述前腔区域相对应的位置上及所述下壳与磁间隙图案相对应的位置上均设置有微孔阵列。
  6. 根据权利要求5所述的扬声器模组，其特征在于，所述下壳(1)与磁路组件相对应的位置上设置有导磁板(8)，所述微孔阵列(4)设置在导磁板(8)上。
  7. 根据权利要求1所述的扬声器模组，其特征在于，所述微孔阵列的孔径不大于0.05mm。
  8. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体对应所述扬声器单体设置有注塑钢片，所述微孔阵列设置在对应的注塑钢片上。
  9. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体还包括中壳(2)，所述上壳(3)、中壳(2)及下壳(1)共同限定一内腔结构。
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