WO2017038008A1 - Batterie secondaire à semi-conducteur à oxyde et son procédé de fabrication - Google Patents
Batterie secondaire à semi-conducteur à oxyde et son procédé de fabrication Download PDFInfo
- Publication number
- WO2017038008A1 WO2017038008A1 PCT/JP2016/003590 JP2016003590W WO2017038008A1 WO 2017038008 A1 WO2017038008 A1 WO 2017038008A1 JP 2016003590 W JP2016003590 W JP 2016003590W WO 2017038008 A1 WO2017038008 A1 WO 2017038008A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- oxide semiconductor
- metal oxide
- type metal
- semiconductor layer
- electrode
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 167
- 238000000034 method Methods 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 157
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 119
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 119
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000011810 insulating material Substances 0.000 claims abstract description 9
- 239000011651 chromium Substances 0.000 claims description 63
- 238000002441 X-ray diffraction Methods 0.000 claims description 49
- 229910052804 chromium Inorganic materials 0.000 claims description 42
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 39
- 239000010936 titanium Substances 0.000 claims description 32
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 25
- 229910052719 titanium Inorganic materials 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 143
- 239000010408 film Substances 0.000 description 77
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 39
- 239000000758 substrate Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 229910052763 palladium Inorganic materials 0.000 description 14
- 238000000576 coating method Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000137 annealing Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 238000001451 molecular beam epitaxy Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007733 ion plating Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910000480 nickel oxide Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000001844 chromium Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- UNRNJMFGIMDYKL-UHFFFAOYSA-N aluminum copper oxygen(2-) Chemical compound [O-2].[Al+3].[Cu+2] UNRNJMFGIMDYKL-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N99/00—Subject matter not provided for in other groups of this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Une batterie secondaire à semi-conducteur à oxyde selon le présent mode de réalisation est pourvue : d'une première électrode (14) ; d'une couche semi-conductrice à oxyde métallique de type n (16) formée sur la première électrode (14) ; d'une couche de charge (18) qui est formée sur la couche semi-conductrice à oxyde métallique de type n (16) et qui est constituée d'un matériau contenant un matériau isolant et un semi-conducteur à oxyde métallique de type n ; d'une couche semi-conductrice à oxyde métallique de type p (20) formée sur la couche de charge (18) ; et d'une seconde électrode 22 formée sur la couche semi-conductrice à oxyde métallique de type p (20). La couche semi-conductrice à oxyde métallique de type n (16) est caractérisée en ce qu'elle contient un dioxyde de titane ayant une structure d'anatase ou une structure amorphe.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-171104 | 2015-08-31 | ||
JP2015171104A JP6656848B2 (ja) | 2015-08-31 | 2015-08-31 | 酸化物半導体二次電池の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017038008A1 true WO2017038008A1 (fr) | 2017-03-09 |
Family
ID=58186806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/003590 WO2017038008A1 (fr) | 2015-08-31 | 2016-08-03 | Batterie secondaire à semi-conducteur à oxyde et son procédé de fabrication |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6656848B2 (fr) |
TW (1) | TWI603492B (fr) |
WO (1) | WO2017038008A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018168494A1 (fr) * | 2017-03-15 | 2018-09-20 | 株式会社日本マイクロニクス | Dispositif de stockage d'électricité et procédé pour fabriquer une couche d'électrolyte solide |
WO2019230216A1 (fr) * | 2018-05-28 | 2019-12-05 | 株式会社日本マイクロニクス | Accumulateur et son procédé de fabrication |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7023049B2 (ja) * | 2017-03-16 | 2022-02-21 | 株式会社日本マイクロニクス | 二次電池 |
TWI667805B (zh) * | 2017-10-13 | 2019-08-01 | 行政院原子能委員會核能研究所 | 降低金屬氧化物半導體之阻值的方法及其量子電池的製法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012046325A1 (fr) * | 2010-10-07 | 2012-04-12 | グエラテクノロジー株式会社 | Pile rechargeable |
WO2013065093A1 (fr) * | 2011-10-30 | 2013-05-10 | 株式会社日本マイクロニクス | Batterie quantique déchargeable et chargeable de manière répétée |
JP2015115130A (ja) * | 2013-12-10 | 2015-06-22 | 株式会社日本マイクロニクス | 二次電池及びその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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DK0816466T3 (da) * | 1995-03-20 | 2006-06-12 | Toto Ltd | Anvendelse af materiale, der har en ultrahydrofil og en fotokatalytisk overflade |
EP0831538A3 (fr) * | 1996-09-19 | 1999-07-14 | Canon Kabushiki Kaisha | Elément photovoltaique comportant une couche dopée spécifiquement |
JP2002111019A (ja) * | 2000-07-06 | 2002-04-12 | Mitsubishi Chemicals Corp | 固体光電変換素子、その製造方法、固体光電変換素子を用いた太陽電池及び電源装置 |
JP4742620B2 (ja) * | 2005-03-03 | 2011-08-10 | セイコーエプソン株式会社 | 発光素子、発光装置および電子機器 |
JP2006281026A (ja) * | 2005-03-31 | 2006-10-19 | Tokyo Institute Of Technology | 窒素酸化物接触還元触媒及びそれを用いた亜酸化窒素の処理方法 |
KR100811432B1 (ko) * | 2006-11-09 | 2008-03-12 | 썬텍 주식회사 | 크롬 기판 상에 이산화티타늄 박막이 코팅된 광촉매체 |
JP5204079B2 (ja) * | 2009-11-24 | 2013-06-05 | 株式会社豊田中央研究所 | 色素増感型太陽電池及びその製法 |
JP2011149712A (ja) * | 2010-01-19 | 2011-08-04 | Seiko Epson Corp | 時計用カバーガラス、および時計 |
JP5300903B2 (ja) * | 2011-03-29 | 2013-09-25 | 株式会社東芝 | ポリマーおよびそれを用いた太陽電池、太陽光発電システム |
WO2013065094A1 (fr) * | 2011-10-30 | 2013-05-10 | 株式会社日本マイクロニクス | Dispositif et procédé d'essai de cellule quantique par sonde à semi-conducteur |
KR20140090913A (ko) * | 2013-01-10 | 2014-07-18 | 삼성에스디아이 주식회사 | 리튬 이차 전지 |
JP2014154505A (ja) * | 2013-02-13 | 2014-08-25 | Ricoh Co Ltd | 薄膜固体二次電池素子 |
JP3183181U (ja) * | 2013-02-15 | 2013-05-09 | 株式会社倉元製作所 | 太陽電池を備えた縦型ブラインド用スラット及びこれを用いた縦型ブラインド |
JP6304980B2 (ja) * | 2013-09-10 | 2018-04-04 | 大阪瓦斯株式会社 | ペロブスカイト系材料を用いた光電変換装置 |
-
2015
- 2015-08-31 JP JP2015171104A patent/JP6656848B2/ja active Active
-
2016
- 2016-08-03 WO PCT/JP2016/003590 patent/WO2017038008A1/fr active Application Filing
- 2016-08-29 TW TW105127690A patent/TWI603492B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012046325A1 (fr) * | 2010-10-07 | 2012-04-12 | グエラテクノロジー株式会社 | Pile rechargeable |
WO2013065093A1 (fr) * | 2011-10-30 | 2013-05-10 | 株式会社日本マイクロニクス | Batterie quantique déchargeable et chargeable de manière répétée |
JP2015115130A (ja) * | 2013-12-10 | 2015-06-22 | 株式会社日本マイクロニクス | 二次電池及びその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018168494A1 (fr) * | 2017-03-15 | 2018-09-20 | 株式会社日本マイクロニクス | Dispositif de stockage d'électricité et procédé pour fabriquer une couche d'électrolyte solide |
JP2018152532A (ja) * | 2017-03-15 | 2018-09-27 | 株式会社日本マイクロニクス | 蓄電デバイスおよび固体電解質層の製造方法 |
EP3598466A4 (fr) * | 2017-03-15 | 2021-01-13 | Kabushiki Kaisha Nihon Micronics | Dispositif de stockage d'électricité et procédé pour fabriquer une couche d'électrolyte solide |
WO2019230216A1 (fr) * | 2018-05-28 | 2019-12-05 | 株式会社日本マイクロニクス | Accumulateur et son procédé de fabrication |
JP2019207907A (ja) * | 2018-05-28 | 2019-12-05 | 株式会社日本マイクロニクス | 二次電池、及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6656848B2 (ja) | 2020-03-04 |
TW201717415A (zh) | 2017-05-16 |
JP2017050341A (ja) | 2017-03-09 |
TWI603492B (zh) | 2017-10-21 |
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