WO2017028274A1 - 手持装置及使用该手持装置的手持云台及电子装置 - Google Patents

手持装置及使用该手持装置的手持云台及电子装置 Download PDF

Info

Publication number
WO2017028274A1
WO2017028274A1 PCT/CN2015/087505 CN2015087505W WO2017028274A1 WO 2017028274 A1 WO2017028274 A1 WO 2017028274A1 CN 2015087505 W CN2015087505 W CN 2015087505W WO 2017028274 A1 WO2017028274 A1 WO 2017028274A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
circuit board
housing
module
handheld
Prior art date
Application number
PCT/CN2015/087505
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
孙荣健
赵喜峰
王勇
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2015/087505 priority Critical patent/WO2017028274A1/zh
Priority to JP2018508764A priority patent/JP6605710B2/ja
Priority to CN201580003653.8A priority patent/CN105993208B/zh
Priority to CN201710938994.5A priority patent/CN107660106B/zh
Publication of WO2017028274A1 publication Critical patent/WO2017028274A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Definitions

  • the present invention relates to a handheld device, and a handheld head and electronic device using the handheld device.
  • a handheld cloud platform typically includes a housing and a circuit board disposed within the housing.
  • the circuit board is provided with a plurality of functional modules for implementing different functions, such as an image processing module, a power module, etc., which usually generate heat when working. Since the functional module is located in a sealed space formed by the casing, the heat generated by the functional module is often difficult to dissipate effectively and timely. If the heat is accumulated to a certain extent, the performance of the functional module will be affected, thereby affecting the overall performance of the pan/tilt.
  • heat sinks such as fans
  • the heat sink increases the volume of the handheld head, making the handheld head unfavorable for miniaturization.
  • a handheld device includes a housing and an electronic component disposed in the housing, the housing being provided with an expansion interface for connecting an electronic device, the expansion interface being a heat conduction interface and extending from the outside of the housing to the In the housing, the expansion interface can derive heat generated when the electronic component operates from outside the housing.
  • the inner cavity of the housing includes a battery chamber and a receiving cavity for accommodating the battery assembly.
  • the accommodating cavity includes an electrical cavity and a heat dissipation cavity communicating with the electrical cavity, the electronic component is disposed in the electrical cavity, and heat generated in the electrical cavity is transmitted to the heat dissipation cavity through the heat dissipation cavity The expansion interface.
  • a heat absorbing member is disposed in the heat dissipation cavity, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the expansion interface.
  • the expansion interface includes a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passes through the housing and extends into the heat dissipation cavity, and the heat conducting portion abuts the housing
  • the outer surface of the fixing portion is for fixing the heat conducting portion to the outer casing.
  • the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion fixes the heat conducting portion through the mounting hole
  • the heat conducting portion abuts against an outer surface of the casing and shields a plurality of the heat dissipation holes.
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and abutting the outer edge of the plurality of the heat dissipation holes An inner surface of the housing, the body absorbing heat generated by the electronic component and transferring the heat to the cladding portion, the cladding portion transferring the heat to the heat conducting portion through the fixing portion The covering portion also transfers the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covers the fixing portion, and the body absorbs heat generated by the electronic component and The heat is transferred to the cladding portion, and the cladding portion transfers the heat to the heat conducting portion through the fixing portion, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat conducting portion is provided with a heat dissipation protrusion
  • the heat conducting portion is provided with a heat dissipating groove.
  • an outer surface of the housing is provided with an operation surface for mounting a function button and a mounting surface for mounting the expansion interface; the operation surface is a plane and is inclined with respect to an axial direction of the housing The mounting surface extends in the axial direction of the housing.
  • the electronic component includes a first circuit board that is vertically disposed within the electrical cavity and disposed along an axial direction of the housing.
  • the first circuit board includes at least one of the following: a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, where the wireless fidelity module is configured to implement a wireless fidelity function.
  • the voltage conversion module is configured to implement a voltage conversion function
  • the photoelectric conversion module is configured to implement a photoelectric conversion function
  • the image processing module is configured to process an image
  • the image transmission module is configured to transmit an image.
  • the electronic component further includes a second circuit board, the second circuit board is located at a side of the first circuit board facing the operation surface, and is disposed facing the operation surface; the second circuit The board includes at least one of the following: a power management module and a PTZ management module, the power management module is configured to implement a power management function, and the PTZ management module is configured to implement a PTZ management function.
  • the electronic component further includes a third circuit board corresponding to one end of the first circuit board and perpendicular to the first circuit board; the third circuit board includes a connection module, The connection module is configured to implement an interface connection function between the handheld device and the pan-tilt device.
  • the electronic component further includes a fourth circuit board, the fourth circuit board being located between the third circuit board and the first circuit board, and disposed parallel to the third circuit board;
  • the fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, wherein the audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing module is configured to implement a displacement sense of the handheld device. Test function.
  • the heat absorbing member is a heat dissipation plate disposed parallel to the first circuit board.
  • the heat absorbing member is disposed on a side of the first circuit board facing the second circuit board.
  • the handheld device further includes a carrier disposed on a surface of the first circuit board facing the second circuit board, the carrier being configured to carry the heat sink.
  • the handheld device further includes an electromagnetic shielding plate disposed between the carrier and the heat absorbing member, and the heat absorbing member absorbs the operation generated when the first circuit board is operated by the electromagnetic shielding plate Heat.
  • a handheld cloud platform includes a handheld device and a pan-tilt device disposed on the handheld device, the handheld device comprising a housing and electronic components disposed in the housing, the housing being provided with an electronic device for connecting An expansion interface of the device and a connector, the handheld device being connected to the pan/tilt device via the connector, the expansion interface being a heat conduction interface and extending from the outside of the housing into the housing, the expansion interface capable of The heat generated when the electronic component operates is led out of the housing.
  • the inner cavity of the housing includes a battery chamber and a receiving cavity for accommodating the battery assembly.
  • the accommodating cavity includes an electrical cavity and a heat dissipation cavity communicating with the electrical cavity, the electronic component is disposed in the electrical cavity, and heat generated in the electrical cavity is transmitted to the heat dissipation cavity through the heat dissipation cavity The expansion interface.
  • a heat absorbing member is disposed in the heat dissipation cavity, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the expansion interface.
  • the expansion interface includes a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passes through the housing and extends into the heat dissipation cavity, and the heat conducting portion abuts the housing
  • the outer surface of the fixing portion is for fixing the heat conducting portion to the outer casing.
  • the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion fixes the heat conducting portion through the mounting hole
  • the heat conducting portion abuts against an outer surface of the casing and shields a plurality of the heat dissipation holes.
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and abutting the outer edge of the plurality of the heat dissipation holes An inner surface of the housing, the body absorbing heat generated by the electronic component and transferring the heat to the cladding portion, the cladding portion transferring the heat to the heat conducting portion through the fixing portion The covering portion also transfers the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covers the fixing portion, and the body absorbs heat generated by the electronic component and The heat is transferred to the cladding portion, and the cladding portion transfers the heat to the heat conducting portion through the fixing portion, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat conducting portion is provided with a heat dissipation protrusion
  • the heat conducting portion is provided with a heat dissipating groove.
  • an outer surface of the housing is provided with an operation surface for mounting a function button and a mounting surface for mounting the expansion interface; the operation surface is a plane and is inclined with respect to an axial direction of the housing The mounting surface extends in the axial direction of the housing.
  • the electronic component includes a first circuit board that is vertically disposed within the electrical cavity and disposed along an axial direction of the housing.
  • the first circuit board includes at least one of the following: a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, where the wireless fidelity module is configured to implement a wireless fidelity function.
  • the voltage conversion module is configured to implement a voltage conversion function
  • the photoelectric conversion module is configured to implement a photoelectric conversion function
  • the image processing module is configured to process an image
  • the image transmission module is configured to transmit an image.
  • the electronic component further includes a second circuit board, the second circuit board is located at a side of the first circuit board facing the operation surface, and is disposed facing the operation surface; the second circuit The board includes at least one of the following: a power management module and a PTZ management module, the power management module is configured to implement a power management function, and the PTZ management module is configured to implement a PTZ management function.
  • the electronic component further includes a third circuit board corresponding to one end of the first circuit board and perpendicular to the first circuit board; the third circuit board includes a connection module, The connection module is configured to implement an interface connection function between the handheld device and the pan-tilt device.
  • the electronic component further includes a fourth circuit board, the fourth circuit board being located between the third circuit board and the first circuit board, and disposed parallel to the third circuit board;
  • the fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, wherein the audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing module is configured to implement a displacement sense of the handheld device. Test function.
  • the heat absorbing member is a heat dissipation plate disposed parallel to the first circuit board.
  • the heat absorbing member is disposed on a side of the first circuit board facing the second circuit board.
  • the handheld device further includes a carrier disposed on a surface of the first circuit board facing the second circuit board, the carrier being configured to carry the heat sink.
  • the handheld device further includes an electromagnetic shielding plate disposed between the carrier and the heat absorbing member, and the heat absorbing member absorbs the operation generated when the first circuit board is operated by the electromagnetic shielding plate Heat.
  • the pan/tilt device includes at least one of a pitch axis mechanism, a roll axis mechanism, and a translation axis mechanism.
  • An electronic device comprising:
  • a heat absorbing member is mounted in the accommodating cavity, the heat absorbing member is fixedly connected to the circuit board for carrying the circuit board, and the heat absorbing member and the circuit board are insulated from each other;
  • An expansion interface mounted to the housing and for mechanical connection or/and electrical connection with an external interface
  • the expansion interface is connected to the heat absorbing member, and is capable of conducting heat between the heat absorbing member.
  • the expansion interface at least partially exposes the outside of the housing
  • the heat absorbing member absorbs heat generated by the electronic device on the circuit board and transmits the heat to the expansion interface to dissipate heat to the outside of the housing to perform electronic devices on the circuit board. Cooling.
  • the present invention extends the heat generated by the operation of the electronic components in the housing out of the housing by an expansion interface disposed on the housing and extending from the outside of the housing into the housing, thereby enabling the handheld
  • the device, the handheld cloud platform and the electronic device have better heat dissipation functions, and do not need to separately provide a heat dissipation device, which is advantageous for miniaturization design.
  • FIG. 1 is a schematic diagram of a pan/tilt provided by an embodiment of the present invention.
  • Fig. 2 is a front elevational view of the hand held mechanism of the pan/tilt head shown in Fig. 1.
  • Figure 3 is a partial cross-sectional view of Figure 2 taken along the line III-III.
  • FIG. 4 is a partial exploded view of the hand-held mechanism of the pan/tilt head shown in FIG. 1.
  • Figure 5 is a partial assembled view of Figure 4.
  • a component when referred to as being “fixed” to another component, it can be directly on the other component or the component can be present.
  • a component When a component is considered to "connect” another component, it can be directly connected to another component or possibly a central component.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the terms “vertical,” “horizontal,” “left,” “right,” and the like, as used herein, are for illustrative purposes only.
  • an embodiment of the present invention provides a handheld cloud platform 1000.
  • the handheld cloud platform 1000 includes a handheld device 100 and a pan-tilt device 200 disposed on the handheld device 100.
  • the pan/tilt head device 200 may be a two-axis pan/tilt head or a three-axis pan/tilt head. In the present embodiment, a three-axis pan/tilt head will be described as an example.
  • the pan/tilt head device 200 includes a pitch axis mechanism 210, a roll axis mechanism 220, and a translation axis mechanism 230.
  • the pitch axis mechanism 210 is configured to carry an image capturing device 300, and the image capturing device 300 may be a camera, a camera, or the like.
  • the roll axis mechanism 220 is coupled to the pitch axis mechanism 210 and the translation axis mechanism 230.
  • the translational axis mechanism 230 is coupled to the handheld device 100.
  • the handheld device 100 includes a housing 110, a connector 130, electronic components, a heat dissipation component, a carrier 170, an electromagnetic shielding panel 180, and a battery assembly 190.
  • the connecting member 130 is disposed at the top of the housing 110 for connecting the translational shaft mechanism 230.
  • the electronic component, the carrier 170, the electromagnetic shielding plate 180, and the battery assembly 190 are disposed in the housing 110.
  • the heat dissipating component is partially located in the housing 110 and a portion is located outside the housing 110.
  • the heat dissipating component is configured to derive heat generated when the electronic component operates from the outside of the housing 110 to dissipate heat from the electronic component.
  • the battery assembly 190 is used to power the handheld cloud platform 1000.
  • the housing 110 has a substantially rectangular parallelepiped shape. One end of the inner cavity 111 of the housing 110 is partitioned into a battery chamber 112, and the other end is partitioned into a receiving cavity 113.
  • the accommodating cavity 113 includes an electrical cavity 114 and a heat dissipation cavity 115 communicating with the electrical cavity 114.
  • the electronic component is disposed in the electrical cavity 114
  • the heat dissipation component is disposed in the heat dissipation cavity 115
  • the carrier 170 and the electromagnetic shielding plate 180 are disposed in the electrical cavity 114 and the heat dissipation cavity
  • the battery assembly 190 is disposed within the battery cavity 112.
  • the housing 110 includes an operation surface 121 , a first mounting surface 123 adjacent to the operation surface 121 , and a surface adjacent to the operation surface 121 and opposite to the first mounting surface 123 .
  • Second mounting surface 125 The operation surface 121 is provided with a plurality of function buttons (such as the shooting button 122 shown in FIG. 1).
  • An expansion interface (such as the expansion interface 165 shown in FIG. 1) is disposed on the first mounting surface 123.
  • the second mounting surface 125 is provided with function buttons (such as the power button 126 shown in FIG. 2).
  • the operation surface 121 is a flat surface and is disposed obliquely with respect to an axial direction of the housing 110.
  • the first mounting surface 123 and the second mounting surface 125 extend in the axial direction of the housing 110.
  • the electronic component includes circuit boards 152, 154, 156, 158.
  • the circuit board 152 is vertically disposed within the electrical cavity 114 and disposed along an axial direction of the housing 110.
  • the circuit board 154 is located on a side of the circuit board 152 facing the operation surface 121 and is disposed facing the operation surface 121.
  • the circuit board 158 corresponds to one end of the circuit board 152 and is perpendicular to the circuit board 152.
  • the circuit board 156 is located between the circuit board 152 and the circuit board 158 and is parallel to the circuit board 158.
  • the circuit board 152 is connected to the energy card 154, 156, 158 by a flexible cable.
  • the circuit board 152 includes at least one of the following: a Wi-Fi (Wireless Fidelity) module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module.
  • the Wi-Fi module is configured to implement a Wi-Fi function
  • the voltage conversion module is configured to implement a voltage conversion function
  • the photoelectric conversion module is configured to implement a photoelectric conversion function
  • the image processing module is configured to implement an image processing function.
  • the image transmission module is configured to implement an image transmission function.
  • the circuit board 154 includes at least one of the following: a power management module and a pan/tilt management module.
  • the power management module is configured to implement a power management function
  • the cloud platform management module is configured to implement a cloud platform management function.
  • the circuit board 156 includes at least one of the following: an audio signal acquisition module and a displacement sensing module.
  • the audio signal acquisition module is configured to implement an audio signal collection function
  • the position sensing module is configured to implement a displacement sensing function of the handheld device 100.
  • the displacement sensing module includes a gyroscope and a compass.
  • the circuit board 158 includes, but is not limited to, a connection module for implementing an interface connection function between the handheld device 100 and the pan/tilt device 200.
  • the heat dissipating component includes a heat absorbing member 162 and an expansion interface 165 for connecting the electronic device.
  • the heat absorbing member 162 is disposed in the heat dissipation cavity 115, parallel to the circuit board 152, and located on a side of the circuit board facing the circuit board 154.
  • the heat absorbing member 162 includes a body 163 and a covering portion 164 protruding from a rim of the body 163.
  • the expansion interface 165 is a heat conduction interface, and includes a heat conduction portion 166 and a fixing portion 168 extending from the heat conduction portion 166 .
  • the fixing portion 168 passes through the mounting hole 128 of the first mounting surface 123 and extends into the heat dissipation cavity 115.
  • the fixing portion 168 is in an interference fit or threaded engagement with the mounting hole 128 to fix the heat conducting portion 166 to the housing 110.
  • the first mounting surface 123 is further provided with a plurality of heat dissipation holes 129 adjacent to and surrounding the mounting holes 128.
  • the heat conducting portion 166 abuts against an outer surface of the second mounting surface 125 and shields the plurality of the heat dissipation holes 129 .
  • the covering portion 164 covers the fixing portion 168 and abuts against an inner surface of the second mounting surface 125 at an outer edge of the plurality of heat dissipation holes 129 .
  • the expansion interface 165 is used for mechanical connection or/and electrical connection with an interface of the electronic device.
  • the heat absorbing member 162 is a heat dissipation plate disposed parallel to the circuit board 152.
  • the expansion interface 165 is a disk-shaped expansion interface, and the disk-tooth expansion interface is used to expand the handheld cloud platform 1000 to connect electronic devices such as mobile phones and tablets.
  • the fixing portion 168 is substantially cylindrical, and the covering portion 164 is substantially arcuate.
  • the carrier 170 is disposed on a surface of the circuit board 152 facing the circuit board 154 for carrying the electromagnetic shielding plate 180 and the heat absorbing member 162.
  • the electromagnetic shielding plate 180 is used to shield electromagnetic waves and has good thermal conductivity.
  • the electromagnetic shielding plate 180 is disposed between the carrier 170 and the heat absorbing member 162 , and the opposite surfaces of the electromagnetic shielding plate 180 and the heat absorbing member 162 and the carrier 170 respectively contact.
  • the heat absorbing member 162 absorbs heat generated by the operation of the circuit board 152 through the electromagnetic shielding plate 180.
  • the functional modules on the circuit boards 152, 154, 156, 158 operate and generate heat.
  • the body 163 absorbs heat generated by the circuit board 152 through the electromagnetic shielding plate 180, and transmits the absorbed heat to the covering portion 164.
  • the covering portion 164 transfers heat to the heat conducting portion 166 through the fixing portion 168 , and the covering portion 164 also transfers heat to the heat conducting portion 166 through the plurality of the heat dissipation holes 129 .
  • the heat conducting portion 166 conducts the heat out of the housing 110 to achieve a heat dissipation function.
  • a plurality of the heat dissipation holes 129 are provided to enhance heat transfer between the cladding portion 164 and the heat transfer portion 166.
  • the heat conducting portion 166 abuts against the outer surface of the second mounting surface 125, and the covering portion 164 covers the covering portion.
  • the fixing portion 168 abuts against the inner surface of the second mounting surface 125.
  • the covering portion 164 transfers heat to the heat conducting portion 166 through the fixing portion 168, and the heat conducting portion 166 conducts the heat out of the housing 110.
  • the electronic component further includes a chip, a resistor, a capacitor, an inductor, etc.
  • the number of circuit boards included in the electronic component may be one or more, for example, two, three, six, and the like.
  • the number of function modules included in each board and the functions to be implemented by the function modules can be adjusted accordingly.
  • a heat absorbing member 162 can be disposed beside each of the circuit boards to dissipate heat from each of the circuit boards. Therefore, the number of the heat absorbing members 162 can be one or more, and the number of the expansion interfaces 165 can be It can also be one or more.
  • the heat conducting portion 166 is provided with at least one of a heat dissipation protrusion and a heat dissipation groove, and the heat conduction portion 166 enhances the heat conduction area.
  • the battery assembly 190 includes one or more rechargeable batteries.
  • a portion of the housing 110 corresponding to the battery chamber 112 is provided with a plurality of indicator lights (not shown) for indicating the amount of power of the battery assembly 190.
  • the present invention provides the heat sink 162 on the circuit board 152 to absorb the heat of the circuit board 152, and the heat absorbed by the heat sink 162 is led out of the housing through the expansion interface 165. Therefore, the handheld cloud platform 1000 has a better heat dissipation function, and does not need to separately provide a heat dissipation device, which is advantageous for miniaturization design.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Accessories Of Cameras (AREA)
PCT/CN2015/087505 2015-08-19 2015-08-19 手持装置及使用该手持装置的手持云台及电子装置 WO2017028274A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/CN2015/087505 WO2017028274A1 (zh) 2015-08-19 2015-08-19 手持装置及使用该手持装置的手持云台及电子装置
JP2018508764A JP6605710B2 (ja) 2015-08-19 2015-08-19 手持ち装置と、前記手持ち装置を使用する手持ちジンバルおよび電子装置
CN201580003653.8A CN105993208B (zh) 2015-08-19 2015-08-19 手持装置及使用该手持装置的手持云台及电子装置
CN201710938994.5A CN107660106B (zh) 2015-08-19 2015-08-19 手持装置及使用该手持装置的手持云台及电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/087505 WO2017028274A1 (zh) 2015-08-19 2015-08-19 手持装置及使用该手持装置的手持云台及电子装置

Publications (1)

Publication Number Publication Date
WO2017028274A1 true WO2017028274A1 (zh) 2017-02-23

Family

ID=57040923

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/087505 WO2017028274A1 (zh) 2015-08-19 2015-08-19 手持装置及使用该手持装置的手持云台及电子装置

Country Status (3)

Country Link
JP (1) JP6605710B2 (ja)
CN (2) CN107660106B (ja)
WO (1) WO2017028274A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019205012A (ja) * 2018-05-21 2019-11-28 エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ 保持システム、及び撮像システム

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206555683U (zh) * 2016-12-28 2017-10-13 深圳市大疆灵眸科技有限公司 云台手持杆组件及装设有该云台手持杆组件的云台
CN207198528U (zh) * 2017-09-29 2018-04-06 深圳市大疆灵眸科技有限公司 一种相机机体及相机结构
CN112074112B (zh) * 2020-08-13 2021-10-19 华为技术有限公司 一种电子设备和扩展组件
CN112303423B (zh) * 2020-10-15 2022-10-25 天目爱视（北京）科技有限公司 一种转动稳定的智能三维信息采集设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321491B2 (en) * 2006-03-15 2008-01-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink for a portable computer
CN204227000U (zh) * 2014-11-10 2015-03-25 李强 自拍杆
CN204420520U (zh) * 2015-01-27 2015-06-24 马鞍山市赛迪智能科技有限公司 一种手持自稳拍照云台
CN204929513U (zh) * 2015-08-19 2015-12-30 深圳市大疆创新科技有限公司 手持装置及使用该手持装置的手持云台

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8477499B2 (en) * 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8113863B2 (en) * 2009-08-25 2012-02-14 Tyco Electronics Corporation Socket connector having a thermally conductive insert
JP5565117B2 (ja) * 2010-06-07 2014-08-06 株式会社リコー 撮像装置
JP2013214605A (ja) * 2012-04-02 2013-10-17 Sharp Corp 携帯端末機器
CN203040094U (zh) * 2012-12-28 2013-07-03 惠州Tcl移动通信有限公司 一种便捷式宽带无线装置的散热结构
KR102066482B1 (ko) * 2013-07-16 2020-01-15 삼성전자주식회사 섬유 강화 플라스틱 소재 및 그를 포함하는 전자 기기
US20150071627A1 (en) * 2013-09-12 2015-03-12 Chi Khai Hoang Automated Stabilizing Apparatus
CN203950109U (zh) * 2014-03-14 2014-11-19 广州虹天航空科技有限公司 拍摄设备稳定器
CN104812222B (zh) * 2015-05-15 2017-08-25 深圳市大疆灵眸科技有限公司 散热结构及具有该散热结构的电子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321491B2 (en) * 2006-03-15 2008-01-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink for a portable computer
CN204227000U (zh) * 2014-11-10 2015-03-25 李强 自拍杆
CN204420520U (zh) * 2015-01-27 2015-06-24 马鞍山市赛迪智能科技有限公司 一种手持自稳拍照云台
CN204929513U (zh) * 2015-08-19 2015-12-30 深圳市大疆创新科技有限公司 手持装置及使用该手持装置的手持云台

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019205012A (ja) * 2018-05-21 2019-11-28 エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ 保持システム、及び撮像システム

Also Published As

Publication number Publication date
CN107660106B (zh) 2020-08-04
CN105993208A (zh) 2016-10-05
CN107660106A (zh) 2018-02-02
JP2018533037A (ja) 2018-11-08
JP6605710B2 (ja) 2019-11-13
CN105993208B (zh) 2018-06-12

Similar Documents

Publication Publication Date Title
WO2017028274A1 (zh) 手持装置及使用该手持装置的手持云台及电子装置
WO2020032438A1 (en) Electronic device including shielding member connected to conductive plate covering opening of shield can
JP6177244B2 (ja) 冷却航空カメラ
WO2020060227A1 (en) Heat dissipation device formed of nonmetallic material and electronic device including the same
WO2020034862A1 (zh) 一种相机
WO2020085706A1 (ko) 연결 부재로 연결된 복수의 회로 기판 사이에 상 변환 물질이 충진된 전자 장치
WO2021172739A1 (ko) 인터포저를 포함하는 전자 장치
WO2018040585A1 (zh) 电力供应扩展卡及电脑机箱
WO2020222442A1 (ko) 회전 카메라를 포함하는 전자장치
WO2015099502A1 (en) Protective cover and electronic device having it
WO2017003201A1 (ko) 카메라 모듈
WO2021025333A1 (ko) Fpcb 구조체를 포함하는 전자 장치
WO2021157835A1 (ko) 방열 부재를 포함하는 전자 장치
WO2018161778A1 (zh) 终端
WO2016161626A1 (zh) 存储装置及采用该存储装置的无人飞行器
WO2021251732A1 (ko) 카메라 모듈
WO2022108423A1 (ko) 방열 부재를 포함하는 전자 장치
CN111637973B (zh) 一种用于户外的手持式红外热像仪
WO2021137311A1 (ko) 사용자 단말을 다양한 방향 및 각도로 거치할 수 있는 무선 충전 장치
WO2017034099A1 (ko) 전자 디바이스
CN207410465U (zh) 一种基于光纤通讯的摄像头模组测试盒
WO2014129705A1 (ko) 서버 방열시스템
WO2020262849A1 (ko) 방열 구조를 포함하는 전자장치
WO2022103039A1 (ko) 차폐 부재 및 열 확산 부재를 포함하는 전자 장치
JP2011023647A (ja) 電子機器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15901478

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2018508764

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15901478

Country of ref document: EP

Kind code of ref document: A1