WO2017016055A1 - 一种支撑结构及真空设备 - Google Patents

一种支撑结构及真空设备 Download PDF

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Publication number
WO2017016055A1
WO2017016055A1 PCT/CN2015/089993 CN2015089993W WO2017016055A1 WO 2017016055 A1 WO2017016055 A1 WO 2017016055A1 CN 2015089993 W CN2015089993 W CN 2015089993W WO 2017016055 A1 WO2017016055 A1 WO 2017016055A1
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WO
WIPO (PCT)
Prior art keywords
inner support
support leg
height
lifting mechanism
leg
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PCT/CN2015/089993
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English (en)
French (fr)
Inventor
杨元隆
Original Assignee
深圳市华星光电技术有限公司
武汉华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司, 武汉华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/905,797 priority Critical patent/US20170170046A1/en
Publication of WO2017016055A1 publication Critical patent/WO2017016055A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the invention relates to the field of display liquid crystal, in particular to a support structure and a vacuum device.
  • a support pin (Pin) structure is usually used.
  • the glass substrate needs to be processed into the reaction chamber, and the support leg is required to perform the glass substrate.
  • the support leg in the prior art is fixed at a specific position of the base, corresponding to a specific size of the product, when applied to different size products, it is necessary to re-detach the support foot fixed on the base, according to the product size
  • the support legs are fixed on the base, and the implementation process is complicated and the cost is high.
  • the support legs are disposed in the pixel area of the glass substrate, and the support legs are made of a metal material, electrostatic induction is likely to occur when the support legs are in contact with the glass substrate, and when electrostatic discharge occurs, the product may be adversely affected, affecting product quality. .
  • the main object of the present invention is to provide a support structure and a vacuum device, which can improve product reliability.
  • a supporting structure provided by the present invention includes a machine table, the machine table is provided with an outer supporting leg and an inner supporting leg, and the outer supporting leg is disposed at an edge of the machine table, and the inner supporting leg is movable
  • the central support region is disposed in the middle region of the machine.
  • the inner support legs are three, arranged at intervals, and are located in a cutting area corresponding to the glass substrate, and the top ends of the inner support legs and the outer support legs are respectively provided with a metal head.
  • the height of the outer support leg is smaller than the height of the inner support leg.
  • the surface of the machine table is provided with a through hole for inserting and fixing the inner support leg; the bottom of the inner support leg is provided with a card member, and the through hole is provided with the card The groove of the piece snaps.
  • the height of the inner support legs is adjustable.
  • the machine table is provided with a lifting mechanism for inserting and fixing the inner support leg, and the lifting mechanism is used for adjusting the inner support foot to the The distance from the top of the inner support foot to the machine table is greater than the distance from the top of the outer support foot to the machine table.
  • the lifting mechanism is provided with an internal thread structure, and one end of the inner supporting leg contacting the lifting mechanism is provided with an external thread structure, and the internal thread is adapted to the external thread, and the inner support can be rotated
  • the foot adjusts the height of the inner support foot.
  • the inner support leg and the lifting mechanism are both cylinders, and a hole is formed in a middle portion of the lifting mechanism, and an aperture of the hole is slightly larger than a diameter of the inner support leg, and the hole is along the hole
  • Two or more pairs of slots are defined in the sidewall of the lifting mechanism, and the pair of slots include two slots symmetrically disposed at a center of the hole, the two slots having the same depth, each of the slots having different depths
  • An outer wall of one end of the inner support leg contacting the lifting mechanism is provided with a pair of protrusions, and the pair of protrusions are two protrusions symmetrically disposed at an axial center of the inner support leg, and the protrusions are The pair of slots are adapted.
  • At least two of the outer support legs are distributed on four sides of the machine.
  • the present invention also provides a vacuum apparatus including a reaction chamber in which the above-described support structure is provided, the support structure for supporting a glass substrate.
  • the invention provides a supporting structure and a vacuum device.
  • Three inner supporting legs are arranged in a central portion of the machine table, and the three inner supporting legs correspond to a cutting area of the glass substrate, and even if electrostatic induction occurs, the pixels are not affected by electrostatic induction.
  • the structure creates a hazard and guarantees the quality of the product. Since only three support feet are provided to reduce the cost, the probability of generating static induction can be reduced to some extent, and the reliability of the product is improved.
  • FIG. 1 is a schematic structural view of an embodiment of a support structure of the present invention
  • FIG. 2 is a schematic cross-sectional view of an inner support leg and a lifting mechanism in an embodiment
  • FIG. 3 is a schematic structural view of a lifting mechanism in an embodiment
  • FIG. 4 is a schematic cross-sectional view of an inner support leg in an embodiment.
  • the invention provides a support structure and a vacuum device.
  • Figure 1 illustrates an embodiment of a support structure of the present invention.
  • a schematic diagram of a support structure of the present embodiment includes a machine table 1 , an inner support leg 4 disposed on the machine table 1 , and an outer support leg 3 , and the outer support of the edge of the machine table 1 is fixedly disposed.
  • the inner portion of the machine 1 is provided with the inner support leg 4, and the machine 1 is provided with the inner support leg 4 corresponding to the cutting area of the glass substrate 2.
  • the inner support legs 4 are three, arranged at intervals, and the spacing between the inner support legs 4 may be determined according to the actual cutting size, and the three inner support legs 4 are adjacent to each other.
  • the spacing of the inner support legs 4 is equal or unequal, and is not limited herein.
  • the spacing of the adjacent inner support legs 4 is equal.
  • the outer support leg 3 is fixedly disposed on the surface of the machine table 1.
  • the height and position of the outer support leg 3 are determined. Since the inner support leg 4 is movable on the machine table 1, Therefore, the position and height of the inner support leg 4 can be selected according to the actual size and requirements of the product.
  • the height of the inner support leg 4 herein refers to the distance from the top of the inner support leg 4 to the machine table 1
  • the height of the outer support leg 3 refers to the distance from the top of the outer support leg 3 to the machine table 1.
  • the height of the inner support leg 4 when the height of the inner support leg 4 is fixed, the height of the inner support leg 4 is not less than the height of the outer support leg 3, and at this time, the bottom surface of the inner support leg 4 is provided with a card.
  • the machine table 1 is provided with a through hole corresponding to the position of the inner support leg 4, and the through hole is provided with a groove engaged with the card member, and the inner support leg 4 is inserted into the through hole And engaging and fixing the groove with the slot.
  • the length of the inner support leg 4 may be smaller than the height of the outer support leg 3, and the machine table 1 is provided with a lifting mechanism corresponding to the position of the inner support leg 4. 5. The distance from the top of the inner support leg 4 to the machine table 1 is greater than the height of the outer support leg 3.
  • the lifting mechanism is provided with an internal thread structure, and the bottom of the inner support leg 4 is provided with an external thread structure, and the internal thread is fixedly coupled with the internal thread, and can be controlled when the height of the inner support leg 4 needs to be adjusted.
  • the inner support leg 4 is screwed into the depth of the lifting mechanism, and since the screwing is prior art, it will not be described herein.
  • the inner support leg 4 is a cylinder
  • the lifting mechanism 5 is a cylinder
  • a hole 6 is formed in a middle portion thereof, and the hole 6 has an aperture smaller than the inner portion.
  • the diameter of the support leg 4 is slightly larger, and two or more pairs of slots 7 are opened from the hole 6 in the direction of the side wall of the lifting mechanism 5, and the pair of slots 7 include two symmetrically disposed at the center of the hole 6 a slot (ie, the longest connection of the two slots is centered at the center), the depths of the two slots are the same, each of the slots 7 has a different depth, and the inner support legs 4 and
  • An outer wall of one end of the contact mechanism 5 is provided with a pair of protrusions 8 which are two protrusions symmetrically disposed at an axis of the inner support leg 4 (the longest of the two protrusions)
  • the wire is centered on the axis, and the protrusion 8 may match the shape of the pair of grooves 7 (see
  • the height of the inner support frame 4 can be adjusted by inserting the support leg 4 into the corresponding slot 7 as needed, when the height of the inner support leg 4 needs to be adjusted.
  • the support foot 4 only needs to be inserted into the corresponding pair of slots 7, so that the fixing can be achieved.
  • the structures of the inner support leg 4 and the lifting mechanism 5 as shown in FIG. 2-4 are preferred embodiments, which are exemplified for better understanding, and may be other structures and other shapes.
  • the outer support legs 3 are distributed around the four sides of the machine table 1 (ie, four sides). As shown in FIG. 1 , at least two outer support legs 3 are disposed at the edges in each direction. The number of the outer support legs 3 can be set according to actual needs, which is not limited herein.
  • the inner support legs 4 are distributed in the central region of the machine table 1 , and the inner support legs 4 are three, and the cutting regions in the X direction or the Y direction can be set according to actual needs.
  • the cutting area, and the spacing between the inner supporting legs 4 can be set according to the actual product size, which is not limited herein, since the inner supporting legs 4 are all disposed on the cutting area of the glass substrate, so the mother does not The pixel area on the daughter board after the board is cut is scratched to improve product reliability.
  • the tops of the inner support legs 4 and the outer support legs 3 are provided with metal heads (not shown), and the inner support legs 4 and the outer support legs 3 all provide support for the glass substrate 2, Arranging the position of the inner support leg 4 according to the product size and selecting the number and setting position of the outer support leg 3, so that the inner support leg 4 and the outer support leg 3 are supported by the glass substrate 2 to meet the mechanical requirements, and the glass is ensured.
  • the support structure of the glass substrate is provided by providing three inner support legs in the middle portion of the machine table, the inner support legs are movable, height adjustable, and can be set according to different product lines.
  • the position and height of the inner support legs are adapted to different sizes of glass substrates to improve the utility of the support structure.
  • the inner support leg is disposed on the cutting area of the glass substrate, even if electrostatic induction occurs, the pixel structure is not harmed by electrostatic induction, and the quality of the product is ensured. Since only three support legs are provided to reduce the cost, the probability of generating electrostatic induction can be reduced to some extent, and product reliability is improved.
  • the present invention also provides a vacuum apparatus including a reaction chamber including a support structure for supporting a glass substrate built therein, the specific structure of the support structure and the technical effects brought about by the above For example, it will not be described here.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种支撑结构及真空设备，支撑结构包括机台(1)，机台(1)上设置有外支撑脚(3)及内支撑脚(4)，外支撑脚(3)设置在所述机台(1)的边缘，内支撑脚(4)可活动地设置在机台(1)的中部区域，内支撑脚(4)为三个，间隔排列设置，位于对应玻璃基板(2)的切割区域，内支撑脚(4)与外支撑脚(3)的顶端均设置有金属头；由于将内支撑脚(4)仅设置3个，降低成本，也可一定程度上减少产生静电感应的几率，提高产品可靠性。

Description

一种支撑结构及真空设备 技术领域
本发明涉及显示液晶领域，尤其涉及一种支撑结构及真空设备。
背景技术
在薄膜晶体管的制备工艺过程中，通常用到支撑脚(Pin)结构，例如在对玻璃基板进行干法蚀刻的过程中，需要将玻璃基板至于反应腔内进行加工，需要支撑脚对玻璃基板进行支撑，现有技术中的支撑脚是固定在基台的特定位置，对应特定尺寸的产品，当应用到不同尺寸产品时，需要重新拆掉固定在基台上的支撑脚，根据产品尺寸重新将支撑脚固定在基台上，实现过程复杂，成本较高。
另外，由于部分支撑脚是设置在玻璃基板的像素区域内，而支撑脚为金属材质，支撑脚与玻璃基板接触时容易发生静电感应，当产生静电放电时，会对产品产生不良影响，影响产品质量。
发明内容
本发明的主要目的在于提供一种支撑结构及真空设备，能够提高产品可靠性。
本发明提供的一种支撑结构，包括机台，所述机台上设置有外支撑脚及内支撑脚，所述外支撑脚设置在所述机台的边缘，所述内支撑脚可活动地设置在所述机台的中部区域，所述内支撑脚为三个，间隔排列设置，位于对应玻璃基板的切割区域，所述内支撑脚与外支撑脚的顶端均设置有金属头。
其中，任意相邻的所述内支撑脚之间的间距相等。
其中，所述外支撑脚的高度小于所述内支撑脚的高度。
其中，所述机台表面对应所述内支撑脚的位置开设有过孔供所述内支撑脚插入固定；所述内支撑脚的底部设有卡件，所述过孔设有与所述卡件卡合的沟槽。
其中，所述内支撑脚的高度均可调。
其中，所述内支撑脚的高度小于所述外支撑脚的高度，所述机台设置有供所述内支撑脚插入固定的升降机构，所述升降机构用于调节所述内支撑脚到所 述机台的距离，所述内支撑脚的顶部到所述机台的距离大于所述外支撑脚的顶部到所述机台的距离。
其中，所述升降机构设置有内螺纹结构，所述内支撑脚与所述升降机构接触的一端设置有外螺纹结构，所述内螺纹与所述外螺纹适配，可通过旋转所述内支撑脚调节所述内支撑脚的高度。
其中，所述内支撑脚及所述升降机构均为柱体，所述升降机构的中部开设有孔，所述孔的孔径比所述内支撑脚的直径略大，从所述孔沿着所述升降机构的侧壁方向开设有两个以上对槽，所述对槽包括以所述孔所在中心对称设置的两个槽，所述两个槽的深度一致，每一个对槽的深度不一，所述内支撑脚与所述升降机构接触的一端外壁设置有一对凸起，所述一对凸起为以所述内支撑脚所在轴心对称设置的两个凸起，所述凸起与所述对槽适配。
其中，所述机台四条边上都分布有至少两个所述外支撑脚。
本发明还提供一种真空设备，包括反应腔，所述反应腔内设置有上述的支撑结构，所述支撑结构用于支撑玻璃基板。
本发明提供的一种支撑结构及真空设备，通过在机台中部区域设置三个内支撑脚，该三个内支撑脚对应于玻璃基板的切割区域，即使发生静电感应也不会因静电感应而对像素结构产生危害，保证产品的质量；由于将所述支撑脚仅设置3个，降低成本，也可一定程度上减少产生静电感应的几率，提高产品可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明支撑结构一实施例的结构示意图；
图2为一实施例中的内支撑脚与升降机构的截面示意图；
图3为一实施例中的升降机构的结构示意图；
图4为一实施例中的内支撑脚的截面示意图。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明提供了一种支撑结构及真空设备。图1示出了本发明支撑结构的一实施例。
如图1所示，为本实施例的支撑结构示意图，包括机台1、设置在机台1上的内支撑脚4、外支撑脚3，所述机台1的边缘固定设置所述外支撑脚3，所述机台1的中部区域设置有所述内支撑脚4，所述机台1对应玻璃基板2的切割区域设置所述内支撑脚4。
本实施例中，所述内支撑脚4为三个，间隔排列设置，所述内支撑脚4之间的间距可根据实际切割尺寸而定，三个所述内支撑脚4中，相邻的内支撑脚4的间距相等或不等，此处对此不作限制，优选地，相邻的内支撑脚4的间距均相等。
本实施例中，所述外支撑脚3固定设置在机台1的表面上，所述外支撑脚3的高度及位置是确定的，由于内支撑脚4是可活动设置在机台1上，因此可根据产品实际尺寸及需求选择内支撑脚4设置位置及高度，此处所述内支撑脚4的高度指的是所述内支撑脚4的顶部到所述机台1的距离，所述外支撑脚3的高度是指所述外支撑脚3的顶部到所述机台1的距离。
其中，当所述内支撑脚4的高度为固定时，所述内支撑脚4的高度应不小于所述外支撑脚3的高度，此时，所述内支撑脚4的底部表面设置有卡件，所述机台1对应所述内支撑脚4的位置设置有过孔，所述过孔上开设有与所述卡件卡合的沟槽，所述内支撑脚4插入所述过孔，通过所述卡件与所述沟槽进行卡合固定。
当所述内支撑脚4的高度可调节时，所述内支撑脚4的长度可小于所述外支撑脚3的高度，所述机台1对应所述内支撑脚4的位置设置有升降机构5，所述内支撑脚4的顶部到所述机台1的距离大于所述外支撑脚3的高度。
其中所述升降机构设置有内螺纹结构，所述内支撑脚4的底部设置有外螺纹结构，所述内螺纹与内螺纹配合固定，当需要调节所述内支撑脚4的高度时，可控制所述内支撑脚4旋进所述升降机构的深度来实现，由于螺纹固定为现有技术，此处不再赘述。
又一实施例中，如图2至4所示，所述内支撑脚4为圆柱体，所述升降机构5为圆柱体，其中部开设有孔6，所述孔6的孔径比所述内支撑脚4的直径略大，从所述孔6沿着所述升降机构5的侧壁方向开设有两个以上对槽7，所述对槽7包括以所述孔6所在中心对称设置的两个槽(即所述两个槽的最长连线以所述中心为中点)，所述两个槽的深度一致，每一个对槽7的深度不一，所述内支撑脚4与所述升降机构5接触的一端外壁设置有一对凸起8，所述一对凸起8为以所述内支撑脚4所在轴心对称设置的两个凸起(所述两个凸起的最长连线以所述轴心为中点)，所述凸起8可与所述对槽7的形状匹配(见图2及图4)，也可不匹配，只要所述槽7可卡住所述凸起8即可，此处对此不作限制。当需要调节内支撑脚4的高度时，可根据需要将所述支撑脚4插入对应的槽7中，即可实现调节内支撑架4的高度，当需要调节所述内支撑脚4的高度时，只需要将该支撑脚4插入对应的对槽7中，即可实现固定。需要说明的是，如图2-4所示的内支撑脚4及升降机构5的结构为优选实施例，是为了更好理解而举例，还可以是其他结构及其他形状，此处对此不作限制，而图2及3中所示的孔6实际中看不见完整的孔6，而是与对槽7连通设置的，但为了说明，便于理解，此处特地标出；此外，所述对槽7的数量及大小可根据需要而设，此处同样对此不作限制。
本实施例中，所述外支撑脚3分布在所示机台1的四周(即四条边上)，如图1所示，每个方向上的边缘至少设置有两个所述外支撑脚3，其中所述外支撑脚3的个数可根据实际需求而设，此处对此不作限制。
本实施例中，如图1所示，所述内支撑脚4分布在机台1的中部区域，所述内支撑脚4为三个，可根据实际需求设置沿X方向切割区域或者沿Y方向切割区域，而所述内支撑脚4之间的间距可根据实际产品尺寸而设，此处对此不作限制，由于所述内支撑脚4均设置于玻璃基板的切割区域，因此不会对母板切割后所得子板上的像素区域划伤，提高产品可靠性。
优选地，所述内支撑脚4及外支撑脚3的顶部均设置有金属头(图中未示)，所述内支撑脚4及外支撑脚3都是为玻璃基板2提供支撑作用，可根据产品尺寸布置所述内支撑脚4的位置及选择外支撑脚3的个数、设置位置，使得所述内支撑脚4及外支撑脚3为玻璃基板2提高的支撑符合力学要求，保证玻璃基板2的稳定性；此外，由于所述内支撑脚4与玻璃基板2的接触位置均位于切 割区域，即使所述内支持脚4与玻璃基板2之间产生静电感应，也不会对显示结构造成危害，保证产品质量。
本实施例中，所提供的玻璃基板的支撑结构，通过在机台中部区域设置三个内支撑脚，所述内支撑脚是可移动的，高度可调节的，可根据不同产线的产品设置所述内支撑脚的位置及高度，以适应不同尺寸的玻璃基板，提高支撑结构的实用性。此外，由于所述内支撑脚设于玻璃基板的切割区域，即使发生静电感应也不会因静电感应而对像素结构产生危害，保证产品的质量。由于将所述支撑脚仅设置3个，降低成本，也可一定程度上减少产生静电感应的几率，提高产品可靠性。
本发明还提高一种真空设备，所述真空设备包括反应腔，所述反应腔包括内置于其中的支撑玻璃基板的支撑结构，所述支撑结构的具体结构及所带来的技术效果如上述实施例所述，此处不再赘述。
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种支撑结构，其中，包括机台，所述机台上设置有外支撑脚及内支撑脚，所述外支撑脚设置在所述机台的边缘，所述内支撑脚可活动地设置在所述机台的中部区域，所述内支撑脚为三个，间隔排列设置，位于对应玻璃基板的切割区域，所述内支撑脚与外支撑脚的顶端均设置有金属头。
  2. 如权利要求1所述的支撑结构，其中，所述内支撑脚的高度均可调。
  3. 如权利要求1所述的支撑结构，其中，任意相邻的所述内支撑脚之间的间距相等。
  4. 如权利要求3所述的支撑结构，其中，所述内支撑脚的高度均可调。
  5. 如权利要求1所述的支撑结构，其中，所述外支撑脚的高度小于所述内支撑脚的高度。
  6. 如权利要求5所述的支撑结构，其中，所述内支撑脚的高度均可调。
  7. 如权利要求5所述的支撑结构，其中，所述机台表面对应所述内支撑脚的位置开设有过孔供所述内支撑脚插入固定；所述内支撑脚的底部设有卡件，所述过孔设有与所述卡件卡合的沟槽。
  8. 如权利要求7任一项所述的支撑结构，其中，所述内支撑脚的高度均可调。
  9. 如权利要求1所述的支撑结构，其中，所述内支撑脚的高度小于所述外支撑脚的高度，所述机台设置有供所述内支撑脚插入固定的升降机构，所述升降机构用于调节所述内支撑脚到所述机台的距离，所述内支撑脚的顶部到所述机台的距离大于所述外支撑脚的顶部到所述机台的距离。
  10. 如权利要求9所述的支撑结构，其中，所述升降机构设置有内螺纹结构，所述内支撑脚与所述升降机构接触的一端设置有外螺纹结构，所述内螺纹与所述外螺纹适配，可通过旋转所述内支撑脚调节所述内支撑脚的高度。
  11. 如权利要求9所述的支撑结构，其中，所述内支撑脚及所述升降机构均为圆柱体，所述升降机构的中部开设有孔，所述孔的孔径比所述内支撑脚的直径略大，从所述孔沿着所述升降机构的侧壁方向开设有两个以上对槽，所述对槽包括以所述孔所在中心对称设置的两个槽，所述两个槽的深度一致，每一个对槽的深度不一，所述内支撑脚与所述升降机构接触的一端外壁设置有一对 凸起，所述一对凸起为以所述内支撑脚所在轴心对称设置的两个凸起，所述凸起可嵌于所述对槽中。
  12. 如权利要求1所述的支撑结构，其中，所述机台四条边上都分布有至少两个所述外支撑脚。
  13. 一种真空设备，包括反应腔，其中，所述反应腔内设置有如权利要求1至12任意一项所述的支撑结构，所述支撑结构用于支撑玻璃基板。
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