WO2017010319A1 - Matrice de moulage et dispositif de moulage de résine - Google Patents

Matrice de moulage et dispositif de moulage de résine Download PDF

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Publication number
WO2017010319A1
WO2017010319A1 PCT/JP2016/069652 JP2016069652W WO2017010319A1 WO 2017010319 A1 WO2017010319 A1 WO 2017010319A1 JP 2016069652 W JP2016069652 W JP 2016069652W WO 2017010319 A1 WO2017010319 A1 WO 2017010319A1
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WO
WIPO (PCT)
Prior art keywords
workpiece
mold
film
work
resin
Prior art date
Application number
PCT/JP2016/069652
Other languages
English (en)
Japanese (ja)
Inventor
中沢　英明
中島　謙二
雅志 岡本
Original Assignee
アピックヤマダ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016095799A external-priority patent/JP6438913B2/ja
Application filed by アピックヤマダ株式会社 filed Critical アピックヤマダ株式会社
Publication of WO2017010319A1 publication Critical patent/WO2017010319A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention relates to a mold that can hold a work without dropping onto a mold clamping surface and can expand a resin mold area, and a resin mold apparatus including the mold.
  • the single wafer film includes a film formed by cutting a long or large size film into a predetermined size in addition to an individual film previously formed into a predetermined size.
  • a resin molding apparatus used in the current semiconductor manufacturing factory, for example, when molding a WLP (Wafer Level Package) or PLP (Panel Level Package) as a workpiece, a resin wafer is molded using a semiconductor wafer of ⁇ 8 inch or ⁇ 12 inch size.
  • resin molding is performed using a rectangular panel (substrate, carrier, etc.) having a size of ⁇ 300 mm to ⁇ 600 mm (each side has a size of 300 mm to 600 mm).
  • a mold die in which a cavity recess is provided in the upper die it is generally performed that a high viscosity resin is collectively supplied to the center position on the workpiece for molding.
  • a cavity recess is provided in the lower mold, the lower mold clamping surface including the lower mold cavity recess is covered with a film, and a mold resin is supplied with a uniform thickness.
  • the resin mold is performed by dipping.
  • the mold In order to deaerate the mold space in which the mold (closed with a workpiece such as a semiconductor wafer or a rectangular substrate) is held by suction, the mold is closed under reduced pressure. .
  • the differential pressure becomes small and the work may fall off.
  • the object of the present invention is to solve the above-mentioned problems of the prior art, and provide a mold that can prevent the displacement and dropping of the work held on the mold clamping surface and can ensure a large resin package size.
  • a resin mold apparatus is provided that is equipped with the above mold dies to increase the size of the resin package as much as possible to improve production efficiency and yield, and to improve the molding quality of large-sized molded products. There is to do.
  • the present invention comprises the following arrangement.
  • a mold that holds a workpiece on a clamp surface of one of the molds and clamps the workpiece on the other mold to be resin-molded. It is provided with a work holding part that is opposed to and arranged at a plurality of locations along the outer shape and that presses and holds the work against the outer peripheral surface of the work. If the mold is used, work holding portions that are pressed against and held by one mold clamping surface against the outer peripheral surface of the work are arranged opposite to each other at a plurality of locations along the outer shape of the work. It can prevent dropping and displacement, centering the work and holding it on the mold clamping surface.
  • the workpiece holding part includes an elastic member that is pressed against the outer peripheral surface of the workpiece and elastically deforms.
  • the elastic member is elastically deformed to sandwich and hold the work, so that it is possible to reliably prevent the work from falling or misaligned.
  • the work outer peripheral surface When the work is brought into close contact with the one mold clamping surface, the work outer peripheral surface may be pressed against each other by the work holding portions arranged to face each other. Thereby, a workpiece
  • a work suction mechanism for sucking and holding the work may be provided on the one mold clamping surface.
  • the workpiece holding part is provided on the upper mold clamping surface, the workpiece held on the upper mold clamping surface can be prevented from falling and the reliability of the apparatus can be improved.
  • a pressure reducing mechanism for forming a pressure reducing space between the pair of molds is provided, the work outer peripheral surface is held by the work holding portion even if the pressure reducing space is formed in the closed mold mold. The workpiece will not fall off from the mold clamping surface.
  • the size of the resin package portion can be increased as much as possible, the productivity and the yield are improved, and the molding quality of a large-sized molded product is improved. Improvements can be made.
  • the above-described mold die it is possible to prevent the position of the workpiece held on the die clamping surface from being displaced or dropped off, and to ensure a large size of the resin package portion. Further, in the resin molding apparatus provided with the above mold, the size of the resin package portion can be increased as much as possible to improve productivity and yield, and the molding quality of a large size molded product can be improved. .
  • FIG. 6 is an explanatory plan view showing a layout configuration example of a work holding unit. It is explanatory drawing which shows the workpiece
  • a film transport device according to the present invention and a resin mold device including the same will be described in detail with reference to the accompanying drawings.
  • a resin molding apparatus that performs resin molding using a single-sided film having a larger size as the film will be described.
  • the resin mold apparatus will be described assuming that the lower mold is a movable mold and the upper mold is a fixed mold.
  • the resin mold apparatus includes a mold opening / closing mechanism, but the illustration is omitted, and the configuration of the mold will be mainly described.
  • the molding apparatus in the present embodiment is configured by connecting a workpiece processing unit Uw, two press units Up, and a dispensing unit Ud, and automatically performs resin molding on the workpiece W in the apparatus.
  • the workpiece processing unit Uw includes, for example, a workpiece supply unit 1, a molded product storage unit 2, a curing furnace 3, and a robot transfer device 4.
  • a workpiece supply unit 1 for example, a rectangular panel (a substrate, a carrier, etc.) having a size of about 600 mm on each side is accommodated as the workpiece W.
  • the molded product storage unit 2 stores a molded product M resin-molded in a press unit 5 described later.
  • the curing furnace 3 heats and cures the resin package part by storing the molded product M resin-molded by the press part 5 to be described later in a multi-stage shelf provided in the furnace and after-curing it.
  • the robot transport device 4 delivers and transports the workpiece W and the molded product M between the parts arranged so as to surround the robot transport device 4.
  • the robot conveyance device 4 takes out and supplies the workpiece W from the workpiece supply unit 1, conveys the molded product M to the cure furnace 3, and sequentially conveys and stores the molded product M from the cure furnace 3 to the molded product storage unit 2.
  • a vertical articulated type, a horizontal articulated type, or a multi-joint type robot that combines these is used as the robot conveyance device 4, and the workpiece W and the molded product M are held and conveyed by the robot hand 4 a by suction or gripping. To do.
  • a cooling unit for cooling the molded product M In the workpiece processing unit Uw, a cooling unit for cooling the molded product M, an inspection unit for performing an appearance inspection of the molded product, a data reading unit for reading molding conditions associated with individual workpieces W, and a workpiece W
  • the reversing unit 30 that reverses the front and back of the molded product M may be disposed around the robot transport device 4. For example, when the surface (molding surface) to be resin-molded in the workpiece W is supplied upward in the workpiece supply unit 1, the reversing unit 30 directs the molding surface to the lower surface. Further, the reversing unit 30 is reversed so that the molding surface faces upward before the molded product M in which the resin mold molding is completed is stored in the molded product storage unit 2.
  • the press unit 5 in the press unit Up includes a compression mold 6 (upper mold 6A and lower mold 6B) that opens and closes to a known mold opening / closing mechanism that raises and lowers the platen relative to the posts 5a provided at the four corners. Yes.
  • the press units Up are provided at two places, but may be provided at one place or three or more places.
  • the film hand 13 (film transport device) is configured so that the press unit 5 is in a state in which a mold resin (for example, a granule resin or a powder resin) is supplied from the dispenser 9 to the single wafer film F supplied from the film supply unit 8 in the dispensing unit Ud. Is transferred into the mold 6.
  • the film supply unit 8 is provided with a film roll 8a in which a long film is wound in a roll shape. In a state where the film end is drawn out from the film roll 8a, it is cut (cut) into a rectangular shape of an arbitrary size and prepared as a single wafer film F on the stage 17.
  • the dispenser 9 is a mold resin R (granular resin) necessary for a single resin mold on the sheet film F in a state in which the film film 13 to be described later is supported by applying a necessary tension (tension). Supply.
  • a mold resin R granular resin
  • a powder resin, a liquid resin, a sheet resin, or a combination thereof may be used instead of the granule resin.
  • the sheet film F has heat resistance and is easily peeled off from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth.
  • a monolayer film or a multi-layer film mainly composed of polypropylene film, polyvinylidine chloride, or the like is preferably used.
  • the panel loader 10 is a so-called work loader, which receives the workpiece W from the robot hand 4a of the robot transport device 4 and carries it into the mold 6 (upper die 6A) of the press unit 5. Further, the panel loader 10 receives the molded product M from the mold 6 a and delivers it to the robot hand 4 a of the robot transport device 4. When the panel loader 10 takes out the molded product M from the mold 6, the used single-wafer film F is also sucked and held, and the taken-out single-wafer film F is collected by the film collecting unit 12.
  • the film loader 11 receives a sheet film F held with a required tension applied to the film hand 13 and a mold resin R (granular resin) supplied onto the film F, and receives a mold 6 (lower mold 6B). Transport to.
  • the panel loader 10 and the film loader 11 are provided so as to reciprocate along a plurality of guide rails 14 laid along the longitudinal direction of the apparatus.
  • a loader hand (not shown) is moved to each part (for example, the press part 5) so as to be orthogonal to the position on the guide rail 14.
  • the film hand 13 includes a frame (for example, a rectangular frame 13a) having a predetermined shape corresponding to a lower mold clamping surface surrounding a lower mold cavity recess 6C described later. Further, a fulcrum frame body 13b that serves as a fulcrum portion in the film hand 13 and applies tension to the sheet film F is provided in a rectangular shape along the rectangular frame body 13a (see FIG. 3). As a fulcrum part, you may use the outer corner
  • a plurality of film chucks 13c are provided on the outer side of the film hand 13 for gripping the outer peripheral edge portion of the single wafer film F over the entire circumference.
  • a pair of film chucks 13c are provided on opposite sides in order to grip and convey the rectangular sheet F.
  • an open / close type chuck is used, and the outer peripheral edge portion of the rectangular sheet F is sandwiched and held on each side. Both ends in the longitudinal direction of the pair of film chucks 13c are respectively supported by a pair of rotating levers 13d (rotating members).
  • the pair of rotation levers 13d is provided to be rotatable around a rotation shaft 13e formed inside the film chuck 13c in the rectangular frame 13a. For this reason, the pair of film chucks 13c is provided on the opposite side of the rotary shaft 13e in the rotary lever 13d.
  • the rotation lever 13d is provided with an offset mechanism that rotates only in the direction of offset with respect to the fulcrum frame 13b.
  • the rotation shaft 13e of the film chuck 13c is provided with a ratchet mechanism 13f in which the ratchet teeth and the ratchet pawl mesh.
  • the ratchet mechanism 13f allows the film chuck 13c to rotate only in a direction away from the fulcrum frame 13b (a direction indicated by an arrow in FIG. 2C) by a predetermined angle around the rotation shaft 13e. Accordingly, the film chuck 13c can be transported in a state where the tension applied to the sheet film F is maintained by holding the film chuck 13c at a predetermined rotational position rotated in one direction.
  • the ratchet mechanism 13f can replace with the ratchet mechanism 13f, and can also be set as the structure which adds arbitrary tension
  • the film hand 13 is likely to be larger than the configuration in which the ratchet mechanism 13f is provided, but it is preferable in that the tension applied to the sheet film F can be adjusted at any time.
  • a pair of film chucks 13c hold up the outer peripheral edge (four sides) of the sheet film F and push it up and down by a lift drive mechanism (not shown) (cylinder drive, solenoid drive, motor drive, etc.).
  • the rotation lever 13d is pushed up by the pin 15.
  • the rotating lever 13d rotates around the rotating shaft 13e to offset the film chuck 13c in a direction away from the fulcrum frame 13b (in the direction of the arrow).
  • the edge part of the sheet-fed film F which covers the frame body opening part of the film hand 13 increases the quantity by which it separates via the fulcrum frame body 13b, and is hold
  • the film chuck 13c is rotated about the rotation shaft 13e to separate the film chuck 13c from the fulcrum frame 13b, so that the end portions of the sheet-fed film F are interposed via the fulcrum frame 13b.
  • the amount of separation can be increased to increase the tension.
  • the tension of the sheet film F can be adjusted for each side of the film by each rotation around the rotation axis 13e of the film chuck 13c arranged on the four sides, an appropriate tension is applied to the sheet film F.
  • the film hand 13 that can be used can be made small and simple.
  • a mold resin R (granular resin) necessary for one-time resin molding is supplied from the dispenser 9 (see FIG. 1) to the sheet film F to which the required tension is applied through, for example, the trough 16 (see FIG. 2D). Then, it is uniformly supplied onto the single-wafer film F (see FIG. 2E).
  • an inclined portion 13g having a larger opening diameter is formed in the upper opening of the rectangular frame 13a as the opening end portion has a rectangular shape in plan view.
  • mold resin R can also be supplied in a circular area
  • the film hand 13 (rectangular frame 13a) is chucked by the film loader 11 and conveyed to the mold 6 in a state where the mold resin R is supplied to the sheet film F.
  • the film drooping detection unit 20 may be provided at a position close to the stage 17 (see FIG. 2E).
  • a laser sensor that includes a light emitting unit and a light receiving unit and detects a shielding state and a shielding position between them can be used. In this case, it is preferable to provide the light emitting part and the light receiving part at a position sandwiching the film hand 13.
  • the film drooping detection unit 20 can detect when the film hand 13 is suspended from an appropriate position when the film hand 13 is lifted by detecting a shield in the space on the stage 17. Only one set of the film sag detection unit 20 may be provided so as to detect the sag in one direction, or two sets may be provided so as to detect in two intersecting directions as shown in FIG.
  • the film drooping detection unit 20 may have any configuration as long as the drooping of the single-wafer film F can be detected. For example, a contact sensor (switch) may be used, and when the film hand 13 is lifted to a predetermined height, it may be detected that the film hanging down is in contact.
  • the film chuck 13c that holds each side of the rectangular sheet F shown in FIG. 3 can be made uniform or different in the amount pushed up on each side.
  • the amount pushed up for each set of the pair of film chucks 13c on the opposite sides can be varied. In this case, depending on the length of each side of the sheet film F and the ease with which the film is stretched depending on the direction drawn from the film roll 8a, etc., the amount to be pushed up for each set of film chucks 13c varies.
  • the tension applied to each side of the film F can also be made uniform.
  • the push-up amount of the pair of film chucks 13 c on the two sides (right side and left side) pulled in the longitudinal direction (left and right direction in the figure) is reduced in the short direction (same figure).
  • the up-and-down direction of the pair of film chucks 13c on the two sides (upper side and lower side) to be pulled may be different. That is, the push-up amount of the film chuck 13c in the longitudinal direction may be set larger than the push-up amount of the film chuck 13c in the short direction.
  • the film chuck 13c may be divided into a plurality of parts on one side, without being limited to the case where the single-sided film F is chucked integrally for each side.
  • the amount of rotation of the film chuck 13c at the side position is changed and tension is applied to twist the sheet film F to stretch the wrinkles. It can be held in the state. For example, if the tension is partially increased, wrinkles are generated at other positions. For this reason, after the film chuck 13c is uniformly pushed up and tension is applied, when a wrinkle occurs, the tension of the portion is weakened or the tension other than that portion is increased. Can do.
  • the film chuck 13c is not only configured to be gripped on the side of the sheet film F by a predetermined length so as to be pulled so as to intersect the extending direction of the side, but also from the center at the corner of the sheet film F.
  • a configuration may be adopted in which the corners of the single-wafer film F are gripped in order to stretch in the direction of separation.
  • the present example illustrates a mold 6 for compression molding.
  • the mold 6 is provided with a heater (not shown) at an arbitrary position so that the mold resin R is heat-cured and the workpiece W is resin-molded to produce a molded product M.
  • a vent hole 6b and a vent path 6c communicating with the vent hole 6b are formed to attract and hold the workpiece W.
  • work holding pins 6d are provided at opposing positions on the outer edge of the rectangular work W at a plurality of positions. The work holding pin 6d presses and holds the outer peripheral surface of the work W.
  • the work holding pin 6d may be a cylindrical pin or a prismatic pin, and is preferably configured to be pressed against the work W via an elastic body.
  • the workpiece holding pin 6d may be a guide for centering the workpiece W when the workpiece W is sucked and held. According to such a configuration, for example, the area of the cavity can be widened as compared with a configuration in which the outer periphery of the workpiece W is held by an L-shaped claw-shaped hook.
  • the lower mold 6B is integrally supported with a lower mold cavity piece 6f that forms the bottom of the lower mold cavity in the lower mold block 6e.
  • a lower mold movable clamper 6g that forms the side of the lower mold cavity is floatingly supported on the lower mold block 6e via a coil spring 6h.
  • a lower mold cavity recess 6C is formed by the lower mold cavity piece 6f and the lower mold movable clamper 6g.
  • a gap between the lower mold movable clamper 6g and the lower mold cavity piece 6f is sealed with a seal ring 6i (O-ring).
  • the lower mold movable clamper 6g is provided with ventilation paths 6g1 and 6g2 for attracting and holding the sheet film F on the lower mold surface including the lower mold cavity recess 6C.
  • the air passage 6g1 adsorbs the film inner peripheral side from the gap between the lower mold cavity piece 6f and the lower mold movable clamper 6g, and the air passage 6g2 adsorbs the film outer peripheral side on the clamp surface of the lower mold movable clamper 6g. ing.
  • the sheet film F is adsorbed so as to follow the concave shape of the lower mold cavity concave portion 6C.
  • a pair of upper and lower clamp blocks are provided between the upper mold 6A and the lower mold 6B when a mold clamping operation is started to form a decompression space in the mold. Good.
  • a pusher 6j is provided outside the lower mold movable clamper 6g of the lower mold 6B (tension applying mechanism).
  • the pusher 6j is provided in order to further increase the tension on the single-wafer film F.
  • the sheet film F is carried into the lower mold 6B together with the film hand 13 by the film loader 11, the sheet film F is stretched by the radiant heat from the lower mold 6B, and the tension is lowered.
  • the tension of the sheet film F decreases and sagging occurs, the central part of the sheet film F hangs down due to the weight of the sheet film F or the weight of the supplied mold resin R.
  • the sagging of the sheet film F may become wrinkles.
  • the pusher 6j is provided at a position corresponding to the rotation lever 13d of the lower mold 6B.
  • the pusher 6j is moved up and down by an elevating drive mechanism (for example, a drive mechanism such as cylinder drive, solenoid drive, motor drive, etc.). It is configured to be rotatable.
  • the pusher 6j is provided to increase the offset amount of the pair of film chucks 13c and further increase the tension on the single-wafer film F.
  • the pusher 6j can also be used to release the ratchet mechanism 13f.
  • the work holding pins 6d are arranged at predetermined intervals at a plurality of positions along the outer shape of the work W held by suction on the upper mold clamping surface 6a (see FIG. 7). In addition, it is preferable that the workpiece holding pins 6d are arranged at positions facing each other so that the force applied to the workpiece W is canceled and the position is not displaced.
  • the work holding pin 6d has, for example, an L-shaped one end 6d1 accommodated in the upper mold 6A so as to be swingable about the rotation shaft 6d2, and the other end 6d3 is an upper mold clamping surface 6a of the upper mold 6A.
  • the other end 6d3 can move back and forth in the horizontal direction (left and right direction in FIG. 5) on the upper clamp surface 6a of the upper mold 6A.
  • the other end 6d3 is a direction approaching the outer peripheral surface of the work W and facing the center side of the work W (right direction in FIG. 5), and a direction away from the outer peripheral surface of the work W (see FIG. 5 (left direction in FIG. 5).
  • the other end 6d3 protruding from the upper clamp surface 6a is covered with an elastic member (rubber cover) 6d4. Further, the work holding pin 6d is arranged in a direction (counterclockwise direction in FIG. 5) in which the other end portion 6d3 stands up from the upper clamp surface 6a around the rotation shaft 6d2 by a coil spring 6d5 provided in the upper die 6A. Always energized.
  • the other end 6d3 of the work holding pin 6d is pressed against the side surface (outer peripheral surface) of the work W. Accordingly, the workpiece W can be prevented from dropping even if a force in the direction of dropping is applied to the workpiece W due to the dead weight of the workpiece W or by a negative pressure below the workpiece W by a decompression mechanism (not shown). it can. Further, the workpiece W can be held while being centered on the upper mold clamping surface 6a. Further, the elastic member 6d4 that presses the outer peripheral surface of the workpiece W is elastically deformed, so that the workpiece W can be reliably prevented from falling.
  • the cross-sectional shape on the outer peripheral surface thereof is a shape in which the upper and lower corners are greatly rounded.
  • the center position of the workpiece W in the thickness direction is convex.
  • the elastic member 6d4 is pressed against the side surface of the workpiece W, the center position in the thickness direction is in a state of being bitten into the elastic member 6d4. For this reason, when the workpiece W is a wafer, the function of preventing the workpiece W from dropping by the elastic member 6d4 is more effectively exhibited.
  • FIG. 11 is an enlarged view of a main part in a modified example of the upper mold 6A shown in FIG. 5, and the same components as those in FIG. In the upper die 6A shown in FIG. 11, the push-down pin 6d6 is always pressed against the one end 6d1 side of the work holding pin 6d.
  • the push-down pin 6d6 can be swung around the rotation shaft 6d2 by being lowered at an arbitrary timing by a drive source (not shown) such as an air cylinder or a servo motor.
  • the other end 6d3 is moved in a direction away from the workpiece W (left direction in the figure). As a result, the other end 6d3 can be retracted from the region where the workpiece W is placed, and the workpiece W can be set on the upper clamping surface 6a without interfering with the other end 6d3.
  • the pressing pin 6d6 is raised to swing the workpiece holding pin 6d by the urging force of the coil spring 6d5.
  • the end 6d3 is moved in a direction approaching the outer peripheral surface of the workpiece W (right direction in the figure). Thereby, the other end 6d (elastic member 6d4) can be pressed and held on the side surface of the workpiece W set on the upper clamp surface 6a.
  • FIG. 6AB shows a modification of the work holding pin 6d.
  • the work holding pin 6k is formed in a U-shape, and the pin body 6k1 is accommodated in the upper mold 6A so as to be swingable about the rotation shaft 6k2.
  • One end portion 6k3 of the pin main body 6k1 is provided so as to be able to protrude and retract below the upper mold clamping surface 6a corresponding to the workpiece suction surface.
  • the other end 6k4 of the pin main body 6k2 is always protruded downward from the upper mold clamping surface 6a.
  • the other end 6k4 that contacts the workpiece W is covered with an elastic member 6k5.
  • the one end 6k3 side of the pin body 6k1 is always urged by the coil spring 6k6 so as to protrude downward from the upper mold clamping surface 6a. For this reason, the other end 6k4 of the pin main body 6k1 is in a state where the elastic member 6k5 is inclined in a direction away from the outer peripheral surface of the workpiece W (clockwise direction in FIG. 6A).
  • the workpiece holding pin 6k When the workpiece W is aligned and overlapped with the upper clamping surface 6a by the panel loader 10 (see FIG. 1), as shown in FIG. 6B, the workpiece holding pin 6k has one end against the bias of the coil spring 6k6.
  • the portion 6k3 is pushed into the upper mold 6A, and the pin body 6k1 rotates a predetermined amount in the counterclockwise direction around the rotation shaft 6k2.
  • the other end 6k4 is pressed against the outer peripheral surface of the workpiece W via the elastic member 6k5.
  • the work W is held on the upper clamp surface 6a by air suction from the vent hole 6b. In this manner, the work holding pin 6k can be rotated by pressing the work W against the upper mold clamping surface 6a to press the elastic member 6k5 against the outer peripheral surface of the work W.
  • FIG. 7AB assumes that the workpiece W is circular such as a semiconductor wafer or a carrier plate.
  • the work holding pins 6d (6k) are arranged at predetermined intervals along the outer shape of the work W, and are provided at positions facing the radial direction.
  • the workpiece holding pin 6d (6k) is preferably pressed (pressed) against the workpiece W by rotating the workpiece holding pin 6k toward the center point of the workpiece W. Note that the work holding pins 6d (6k) may not be provided at positions facing the radial direction.
  • the work W is arranged at equal intervals (5 equal parts, 7 equal parts, etc.) along the outer shape, or the pressing force by the work holding pins 6d (6k) is offset. It may be arranged in a position. Thereby, the workpiece
  • FIG. 7A illustrates the case where the pin shape is a cylindrical shape
  • FIG. 7B illustrates the case where the shape is a block shape having a surface to be pressed widely along the arc shape of the workpiece W. is doing.
  • FIG. 7CD assumes that the workpiece W is rectangular such as a semiconductor substrate or a carrier plate.
  • the work holding pins 6d (6k) are arranged at predetermined intervals on each side of the work W, and are provided at positions facing each other across a line symmetric center line. As a result, the workpiece W can be centered toward the center (center) of the opposite side by the pressing force of the opposing workpiece holding pins 6d.
  • FIG. 7C illustrates a case where the pin shape is a cylindrical shape
  • FIG. 7D illustrates a rectangular shape (block shape) having a surface that is widely pressed along the straight side of the workpiece W. The case where it uses is illustrated.
  • FIG. 8 illustrates only the upper mold 6A.
  • the panel loader 10 sucks and conveys the workpiece W with the semiconductor chip mounting surface as the lower surface side. That is, an escape recess 10a for accommodating a semiconductor chip or the like is formed on the upper surface of the panel loader 10, and a vent hole 10b capable of attracting and holding the workpiece W is formed around the recess 10a.
  • the relief recess 10a is formed with a vent hole 10c for discharging air in order to make it easy to deliver the workpiece W when delivering the workpiece W to the upper clamping surface 6a and to prevent the workpiece W from sagging due to its own weight. .
  • the semiconductor chip mounting surface of the workpiece W is placed toward the escape recess 10a, and air is sucked from the vent hole 10b to attract and hold the workpiece W on the upper surface of the loader and communicate with the escape recess 10a.
  • Air is discharged from the vent hole 10c to hold the work W while preventing it from sagging due to its own weight.
  • the work W since the work W is sucked and held in the vent hole 10b, the work W does not move from a predetermined position even if air is discharged from the vent hole 10c.
  • the air discharged from the vent hole 10c can be heated and preheated and the workpiece W can be arbitrarily extended by thermal expansion.
  • the panel loader 10 aligns the outer shape of the workpiece W with the workpiece holding pin 6d provided on the upper clamping surface 6a of the upper die 6A.
  • the air suction operation may be started in advance from the vent hole 6b of the upper mold 6A and the vent path 6c communicating therewith by an upper mold intake / exhaust mechanism (not shown).
  • the panel loader 10 is raised and the workpiece W is pressed against the upper clamp surface 6a.
  • air is discharged from the air suction hole 10b that has adsorbed the workpiece W of the panel loader 10 and air is discharged from the vent hole 10c communicating with the escape recess 10a, so that the workpiece W is reliably placed on the upper clamp surface 6a. Can be handed over.
  • the workpiece W may be pressurized and pressed against the upper mold clamping surface 6a in a state where the workpiece W is held at a medium height. Is possible. In this case, air does not remain in the gap between the upper clamping surface 6a and the workpiece W, and the workpiece W can be held flat.
  • the workpiece holding pins 6d are pressed against the outer peripheral surface to be centered. In this way, since the workpiece W can be centered by the workpiece holding pin 6d, a separate alignment pin for centering becomes unnecessary. After the alignment (centering) is completed, the air is sucked and held on the upper mold clamping surface 6a by air suction from the vent hole 6b.
  • the workpiece holding pin is heated even if the outer diameter increases due to thermal expansion. Since the other end 6d3 of 6d can be moved back and forth, the state held with an appropriate force can be maintained. Further, when the elastic member 6d4 is provided, it is possible to absorb the increase in the outer diameter of the workpiece W due to heating and maintain the state held with an appropriate force.
  • FIG. 9A it is assumed that the sheet load film F and the granular resin R are carried into the lower mold 6B by the film loader 11 as described above.
  • a large-size work W (rectangular panel, rectangular substrate, etc.) having a side of 600 mm, for example, is carried into the upper mold 6A by the panel loader 10 (see FIG. 1) and provided on the upper mold clamping surface 6a. It is adsorbed and held by the vent hole 6b and the vent path 6c.
  • the outer peripheral surface of the rectangular workpiece W is transferred to the upper die 6A by pressing and holding the outer peripheral surface of the workpiece W by the workpiece holding pins 6d provided at the opposing positions at a plurality of locations.
  • the rectangular workpiece W is centered by the workpiece holding pin 6d when the outer peripheral surface of the workpiece W is uniformly pressed by the workpiece holding pin 6d.
  • work W may be performed simultaneously, and after carrying in the workpiece
  • the mold 6 is closed.
  • the lower mold 6B is raised and the workpiece W is clamped between the upper mold 6A.
  • an upper mold chamber block 6p and a lower mold chamber block 6m which will be described later, are interposed between the upper mold 6A and the lower mold 6B via a sealing material 6n. It is preferable that the mold space is closed by clamping to form a decompression space, and molding is performed in a decompressed atmosphere (see FIG. 10).
  • FIG. 9C shows a state where the mold clamping operation of the mold 6 is completed and the workpiece W is immersed in the granule resin R melted in the lower mold cavity recess 6C and is heated and pressurized to be cured (compression molding). Show.
  • the mold 6 is opened.
  • the mold opening is performed while maintaining the suction holding of the molded product M on the upper clamp surface 6a of the upper mold 6A and the suction holding on the lower mold clamping surface including the lower mold cavity recess 6C of the sheet F. Is called.
  • FIG. 9D when the mold is opened, the molded product M is sucked and held on the upper clamp surface 6a of the upper mold 6A, and the single wafer film F includes the lower mold cavity recess 6C.
  • the mold is clamped and held. In this way, the molded product M and the used sheet-fed film F are held in separate molds so that they can be taken out from the press unit 5 and conveyed to the respective storage / accommodation destinations. Can be simplified.
  • the panel loader 10 enters the mold mold 6 that has been opened, and the molded product M is released from the suction of the air holes 6b from the upper mold 6A and is sucked from the air holes 10b to suck the work W into the loader. It is sucked and held on the upper surface and delivered to the panel loader 10.
  • the used single wafer film F is delivered from the lower mold 6B to the opposite surface (lower surface side) of the panel loader 10.
  • compressed air is ejected from the vent hole 6b, and at the same time, the single wafer film F is delivered from the lower mold surface to the panel loader 10.
  • the molded product M is delivered from the panel loader 10 to the robot hand 4a of the robot transport device 4.
  • the used single wafer film F is discharged from the panel loader 10 to the film collecting unit 12 and collected.
  • the robot hand 4 a holds the molded product M and carries it into a predetermined curing furnace 3. After-curing of the molded product M is performed in the curing furnace 3. Subsequently, the robot hand 4 a takes out the molded product M from the curing furnace 3, thereby completing all processes for the workpiece W and completing the manufacturing process of the molded product M. Subsequently, the molded product M is carried into the molded product storage unit 2 where the molded product M is stored.
  • the film hand 13 that conveys the above-described single-wafer film F, the amount of film used is reduced to reduce the running cost, and the molding quality of a large-sized molded product is improved. And the installation area can be reduced.
  • the chuck body 40b which is a work holding portion, is configured to be able to appear and retract in the upper mold 6A.
  • the upper die 6A includes a plurality of (for example, six, eight, etc.) chucks 40 at positions facing the outer periphery of the workpiece W on the upper die clamping surface 6a.
  • the tip of the chuck 40 protrudes from the lower surface of the upper die 6A so as to be rotatable, and presses the outer peripheral surface of the workpiece W from the outside to hold the outer peripheral surface of the workpiece W so as to prevent the fall.
  • the chuck 40 includes a chuck body 40b that is rotatably supported with respect to a rotation shaft 40a provided in the upper die 6A, an elastic member 40c that covers a lower end portion of the chuck body 40b, and a chuck body 40b. And a rotation urging member 40d that always presses the rotation shaft 40a in the rotation direction (counterclockwise direction in FIG. 10A). As a result, the elastic member 40c is pressed against the outer peripheral surface from the side of the workpiece W, whereby the elastic member 40c is elastically deformed so that the workpiece W bites into the elastic member 40c.
  • the workpiece W can be held on the upper mold 6A by the elastic member 40c provided on the chuck body 40b, and displacement and dropping can be prevented. Further, the outer peripheral position of the lower mold cavity 6C can be expanded to a position close to the outer peripheral position of the workpiece W, and the number of workpieces can be increased to improve productivity.
  • the chuck 40 has its rotation angle regulated by a stopper 40e provided on the upper die 6A.
  • zipper 40 can also be made larger than the outer periphery shape of the workpiece
  • the lower end of the chuck body 40b can be opened toward the outside of the apparatus. Therefore, when the workpiece W is set on the upper die 6A from below, the workpiece W does not interfere with the chuck 40, and the workpiece W can be easily set on the upper die 6A.
  • a lower mold block 6m is arranged on the lower mold block 6e so as to surround the outer side of the lower movable clamper 6h. Further, the upper mold chamber block 6p is disposed so as to surround the upper mold 6A so as to face the lower mold chamber block 6m. A sealing material 6n is provided on the clamp surface of the lower mold chamber block 6m.
  • the upper mold chamber block 6p is formed with a ventilation path 6q for forming a reduced pressure space in the mold 6.
  • the air passages 6c and 6q provided on the upper die 6A side are connected to the upper die intake / exhaust mechanism 6r, and the air passages 6g1 and 6g2 provided on the lower die 6B side are connected to the lower die intake / exhaust mechanism 6s.
  • the upper mold chamber block 6p and the lower mold chamber block 6m squeeze the sealing material 6n to form a closed space in the mold 6 and from the ventilation path 6q.
  • a vacuum space is formed by air suction. Even if a reduced pressure space is formed in the mold mold 6 that is closed, the work outer peripheral surface is held by the chuck 40, so that the work W will not fall off the upper mold clamp surface 6a due to the differential pressure.
  • the chuck 40 can be provided on the upper die 6A so as to be movable up and down.
  • an accommodation recess 40h in which the chuck body 40b can protrude and retract is provided on the upper clamp surface 6a of the upper mold 6A.
  • the chuck body 40b is provided with a long hole-like lifting hole 40f into which the rotating shaft 40a is inserted.
  • One end of an elevating elastic body 40g (for example, a coil spring) is connected to the bottom of the housing recess 40h, and the other end is connected to the upper end of the chuck body 40b.
  • the lifting elastic body 40 is biased so that the lower end of the chuck body 40b always protrudes from the upper clamp surface 6a.
  • the elevating hole 40f is formed in the rotary shaft 40a.
  • the chuck body 40b rises while being guided, and the elastic body 40g for raising and lowering is compressed, so that the chuck body 40b is housed in the housing recess 40h.
  • the elastic member 40b is pressed against the outer peripheral surface of the workpiece W to be clamped by pressing the chuck body 40b against the stopper 40e by the rotating elastic body 40d.
  • the chuck mechanism in the present embodiment is not limited to the other embodiments, and can be arbitrarily applied as long as it is a compression mold having a structure in which the lower mold 6B includes the lower mold cavity 6C.
  • the case where the workpiece W is conveyed by the panel loader 10 and transferred to the upper clamp surface 6a of the mold 6 has been described.
  • the workpiece W is transferred to the lower clamp surface.
  • the circular workpiece W for example, a semiconductor wafer, an annular carrier, etc.
  • the mold 6 has been described using a compression mold, it may be a transfer mold.
  • the dispensing unit Ud can be used by being incorporated in a resin molding apparatus as described above, but can also be used as a single unit.
  • the film hand 13 holding the sheet film F to which a predetermined tension is applied in the dispensing unit Ud may be prepared, and the film hand may be supplied to the separately provided press unit Up.
  • resin mold molding may be performed on both surfaces of the workpiece W using the reversing unit 30 (see FIG. 1) that reverses the front and back of the workpiece W or the molded product M.
  • the reversing unit 30 see FIG. 1 that reverses the front and back of the workpiece W or the molded product M.
  • the molded product M is inverted by the reversing unit 30 and then molded on the other surface of the workpiece W (molded product M). You may do.
  • it can replace with the inversion part 30, and can also be set as the robot conveyance apparatus 4 which can invert the robot hand 4a.
  • the workpiece holding pin 6d shown in FIG. 11 can be arbitrarily opened and closed, as shown in FIG. 12, an additional drive mechanism is not additionally provided, for example, a panel loader 10 that is essential as a device configuration.
  • the workpiece holding pin 6d can be configured to be openable and closable by the delivery operation of the workpiece W to the upper clamping surface 6a.
  • the upper die 6A includes a work holding pin 60, an elastic member 61 that covers the tip of the work holding pin 60, and a coil spring 62 that constantly biases the work holding pin 60 in the closing direction. Yes.
  • the work holding pin 60 is formed in, for example, a U-shape as shown in the figure, and has one end 60a at a position away from the position where the work W is placed and the other end 60b at a position closer thereto. It protrudes downward from the mold clamping surface 6a.
  • One end 60a protruding from the upper clamp surface 6a has an inclined surface at the tip.
  • an inclined surface facing the one end 60a is also formed at the tip of the push-up pin 10d provided upright on the upper surface of the panel loader 10.
  • the workpiece W When the workpiece W is transferred to the upper mold 6A of the panel loader 10, that is, the sliding operation is performed while the push pins 10d and the inclined surfaces of the one end 60a are pressed against each other in conjunction with the lifting and lowering operation of the panel loader 10, the workpiece
  • the holding pin 60 can be opened and closed. In addition, if these inclined surfaces are provided in at least one of them, an equivalent effect can be achieved.
  • the distal end portion of the other end portion 60b protruding from the upper mold clamping surface 6a is covered with an elastic member 61 having the same function as the elastic member of the above-described embodiment.
  • the work holding pin 60 is always urged by the coil spring 62 in a direction in which the other end 60b approaches the mounting position of the work W (direction to press against the work outer peripheral surface; right direction in FIG. 12).
  • the mechanism for driving the work holding pin 60 can be simplified by opening and closing the work holding pin 60 using the lifting and lowering operation of the panel loader 10 as shown in FIG.
  • the configuration in which the work holding pin 6d is provided in the upper mold 6A has been described.
  • the work holding pin 6d may be provided in the lower mold 6B. In this case, it is possible to prevent the workpiece W from being displaced or lifted, and to mold the workpiece W at an appropriate position.
  • the work holding pin 6d may be configured such that the elastic member 6d4 is omitted.
  • the position of the elastic member 6d4 as a friction surface provided with arbitrary irregularities, it is possible to make it possible to reliably prevent the fall without combining additional members.
  • a knurled (oblique, flat or crossed) surface, pear surface, corrugated surface or multi-step groove surface is provided to prevent falling by frictional force.
  • the work holding pin 6d has been described as being pressed against the outer peripheral surface of the work W. However, the work holding pin 6d is inserted into a hole provided in the work W, and the work holding pin 6d is inserted into the inner peripheral surface of the hole.
  • the workpiece W may be held by pressing. In this case, for example, not only the workpiece holding pin 6d is pressed toward the center / center of the workpiece W but also the workpiece holding pin 6d may be pressed toward the outer periphery of the workpiece W. Further, the workpiece W may be a ring frame that holds a tape to which a chip to be molded is attached on the outer periphery.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention a pour but de fournir une matrice de moulage pour laquelle un défaut d'alignement ou un abandon d'une pièce à usiner retenue sur une surface de serrage de matrice est empêché, et un volume important peut être assuré dans une partie emballage de résine. Pour atteindre ce but, une partie de retenue de pièce à usiner (6d) permettant de presser contre une surface périphérique externe d'une pièce à usiner (W) et de retenir la pièce à usiner (W) est disposée sur une surface de serrage de matrice supérieure (6a) dans une matrice de moulage (6), la partie de retenue de pièce à usiner (6d) étant disposée face à la pièce à usiner (W) au niveau d'une pluralité d'emplacements le long de la forme externe de la pièce à usiner (W).
PCT/JP2016/069652 2015-07-15 2016-07-01 Matrice de moulage et dispositif de moulage de résine WO2017010319A1 (fr)

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JP2018144335A (ja) * 2017-03-03 2018-09-20 アピックヤマダ株式会社 モールド金型、モールドプレス、およびモールド装置
CN110065191A (zh) * 2018-01-22 2019-07-30 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
WO2020040111A1 (fr) * 2018-08-23 2020-02-27 アピックヤマダ株式会社 Matrice de moulage et dispositif de moulage de résine comprenant celle-ci
TWI737380B (zh) * 2019-07-29 2021-08-21 日商山田尖端科技股份有限公司 樹脂塑封模具
JP2023521260A (ja) * 2021-03-18 2023-05-24 ゴンヤン アイティーティー シーオー．，エルティーディー． プリブローイング下部チャンバ具備型真空成形機
WO2023176130A1 (fr) * 2022-03-16 2023-09-21 株式会社日本製鋼所 Système de moulage de stratifié et méthode de moulage de stratifié

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JP6742273B2 (ja) * 2017-05-18 2020-08-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド方法
JP7406247B2 (ja) * 2020-05-22 2023-12-27 アピックヤマダ株式会社 樹脂モールド装置

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JP2007301939A (ja) * 2006-05-15 2007-11-22 Sumitomo Heavy Ind Ltd 被成形品の落下防止機構
JP2012126074A (ja) * 2010-12-17 2012-07-05 Apic Yamada Corp 樹脂モールド装置
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Publication number Priority date Publication date Assignee Title
JP2018144335A (ja) * 2017-03-03 2018-09-20 アピックヤマダ株式会社 モールド金型、モールドプレス、およびモールド装置
CN110065191A (zh) * 2018-01-22 2019-07-30 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
CN110065191B (zh) * 2018-01-22 2021-12-03 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
WO2020040111A1 (fr) * 2018-08-23 2020-02-27 アピックヤマダ株式会社 Matrice de moulage et dispositif de moulage de résine comprenant celle-ci
JP2020029045A (ja) * 2018-08-23 2020-02-27 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
TWI797372B (zh) * 2018-08-23 2023-04-01 日商山田尖端科技股份有限公司 模製模具及具備其之樹脂模製裝置
TWI737380B (zh) * 2019-07-29 2021-08-21 日商山田尖端科技股份有限公司 樹脂塑封模具
JP2023521260A (ja) * 2021-03-18 2023-05-24 ゴンヤン アイティーティー シーオー．，エルティーディー． プリブローイング下部チャンバ具備型真空成形機
JP7370619B2 (ja) 2021-03-18 2023-10-30 ゴンヤン アイティーティー シーオー．，エルティーディー． プリブローイング下部チャンバ具備型真空成形機
WO2023176130A1 (fr) * 2022-03-16 2023-09-21 株式会社日本製鋼所 Système de moulage de stratifié et méthode de moulage de stratifié

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