WO2017010165A1 - Module de capture d'image et endoscope - Google Patents

Module de capture d'image et endoscope Download PDF

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Publication number
WO2017010165A1
WO2017010165A1 PCT/JP2016/064916 JP2016064916W WO2017010165A1 WO 2017010165 A1 WO2017010165 A1 WO 2017010165A1 JP 2016064916 W JP2016064916 W JP 2016064916W WO 2017010165 A1 WO2017010165 A1 WO 2017010165A1
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WO
WIPO (PCT)
Prior art keywords
wiring
bent portion
wiring board
connection
flexible wiring
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Application number
PCT/JP2016/064916
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English (en)
Japanese (ja)
Inventor
石塚　健
中尾　知
秀秋 臼田
Original Assignee
株式会社フジクラ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社フジクラ filed Critical 株式会社フジクラ
Publication of WO2017010165A1 publication Critical patent/WO2017010165A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/26—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes using light guides

Definitions

  • the present invention relates to an imaging module and an endoscope. This application claims priority based on Japanese Patent Application No. 2015-139724 for which it applied on July 13, 2015, and uses the content here.
  • the imaging module stores, for example, a flexible wiring board (FPC) on which a solid-state imaging element is mounted and an objective lens unit in a cylindrical metal frame member, and electrically connects the solid-state imaging element to an electric cable via the flexible wiring board. It is set as the structure connected to.
  • FPC flexible wiring board
  • a flexible wiring board in which an imaging element chip (solid-state imaging element) is mounted in the center is electrically connected to a signal cable.
  • the wiring board is bent to the opposite side of the image sensor chip at both ends of the place where the image sensor chip is mounted, and the wiring board is supported in the space surrounded by the center part and the extension part of the circuit board. And a block for guiding is provided.
  • a flexible wiring board having a solid-state imaging device mounted in the center is connected to an electric cable.
  • the flexible wiring board is bent to the opposite side of the solid-state imaging device.
  • the present invention has been made in view of the above-described circumstances, and an object thereof is to provide an imaging module and an endoscope that can be reduced in diameter without impairing connection reliability.
  • An imaging module includes an electrical cable, an imaging device, and a flexible wiring board having a wiring electrically connected between the imaging device and the electrical cable, and the flexible wiring
  • the substrate includes an element mounting portion for mounting the imaging element, and a rear piece that is bent at a bent portion at an end of the element mounting portion and extends in a direction opposite to the position where the imaging element is provided.
  • the element mounting portion has a mounting surface on which the imaging element is mounted, which is a surface intersecting the axial direction of the tip of the electric cable, and the mounting surface is connected to the wiring and the imaging A connection terminal electrically connected to the element, wherein the wiring is connected from the connection terminal to the electric cable through the bent portion and the rear piece, and the connection point of the wiring to the connection terminal But Wherein either located at a position other than the most proximate position with respect to the bent portion, or the extending direction of the wiring in the connection point is a direction away from a direction parallel or the bent portion to the bent portion.
  • connection position of the wiring with respect to the connection terminal may be a position farthest from the bent portion, and the extending direction of the wiring at the connection location may be a direction away from the bent portion.
  • the extending direction of the wiring at the connection location is a direction away from the bent portion, and the separation distance between the position where the wiring is farthest from the bent portion and the connection location is 0.05 mm. It may be the above.
  • the endoscope according to the second aspect of the present invention includes the imaging module according to the above aspect.
  • the imaging module since the position of the connection portion of the wiring with respect to the connection terminal is a position other than the closest position of the bent portion, a sufficient distance is ensured between the connected portion and the bent portion. . Therefore, it is possible to avoid applying a large force to the connection portion when forming the bent portion, and to prevent damage (disconnection) of the wiring. Therefore, connection reliability can be improved. In addition, since the wiring is not easily damaged, an excessive force is not applied to the bent portion even if the outer dimensions of the flexible wiring board are reduced. Therefore, the diameter of the imaging module can be reduced.
  • FIG. 1A It is a sectional side view which shows typically the flexible wiring board and solid-state image sensor which are used for the imaging module which concerns on the 1st Embodiment of this invention. It is a top view which shows the flexible wiring board shown to FIG. 1A. It is sectional drawing which shows a part of front-end
  • FIG. 3 shows the distal end structure of the endoscope 101 assembled using the imaging module 100 and the imaging module 100 of the first embodiment.
  • FIG. 2 is a cross-sectional view showing a part of the tip portion of the imaging module 100.
  • the longitudinal direction of the flexible wiring board 10 in the element mounting portion 11 is referred to as D1.
  • a direction orthogonal to the D1 direction in a plane along the mounting surface 11a of the element mounting portion 11 is referred to as a short direction D2.
  • the left side that is, the solid-state imaging device 4 side with respect to the flexible wiring board 10
  • the opposite direction (right side in FIG. 3) is referred to as a rear side.
  • 2 and 3 are views seen from a direction perpendicular to the front-rear direction and the longitudinal direction D1.
  • the imaging module 100 has a flexible wiring board 10 (FPC) on which a solid-state imaging device 4 having an imaging unit 3 is mounted and connected to the tip of a conductor 2 of an electric cable 1. It is configured.
  • a solid-state imaging element 4 for example, a CMOS (complementary metal oxide semiconductor) can be suitably used.
  • the solid-state imaging element 4 is electrically connected to the electric cable 1 through the flexible wiring board 10.
  • the flexible wiring board 10 includes an element mounting portion 11 on which the solid-state imaging device 4 is mounted on the front mounting surface 11a, and two rear piece portions 12 that are bent at both ends of the element mounting portion 11 and extended to the rear side. , 13.
  • the flexible wiring board 10 is bent at both end portions (bending portion 10 ⁇ / b> A) of the element mounting portion 11 and extended to the rear side, whereby two rear piece portions 12 and 13 are formed.
  • the flexible wiring board 10 is a one-side wiring type flexible wiring board, for example. That is, as shown in FIG. 2, the flexible wiring board 10 includes a wiring 14 formed on one side of an insulating base material 10 a formed in a film shape, and an electrically insulating resist film 10 b (covering layer). For example, a solder resist).
  • the insulating base material 10a is made of polyimide, for example, and the wiring 14 is made of copper, for example.
  • the wiring 14 is in the second layer among the three layers, so that even when bending is performed, the wiring 14 is positioned at the bending neutral point, and an excessive force is applied to the wiring 14. Can be avoided.
  • the mounting portion back surface 11 b is a surface opposite to the mounting surface 11 a of the element mounting portion 11.
  • the mounting surface 11a intersects the direction of the axis of the tip of the electric cable 1 (or the extension of the axis of the tip of the electric cable 1).
  • the mounting surface 11 a is preferably orthogonal (or substantially orthogonal) to the axial direction of the tip of the electric cable 1.
  • pad-shaped conductor terminal portions 12c, 12d, 13c, and 13d are provided on the outer surfaces 12b and 13b (outer surfaces) of the rear piece portions 12 and 13, respectively.
  • the conductor terminal portions 12c, 12d, 13c, and 13d are electrically connected to the inner conductor 2a of the conductor 2 and the outer conductor 2b that are led out from the jacket 5 of the electric cable 1, respectively.
  • a plurality of conductors 2 are collectively covered with an outer jacket 5 to constitute a cable unit.
  • the conductor 2 covers the inner conductor 2a, a primary coating layer 2c that covers the inner conductor 2a, an outer conductor 2b that is formed in a net shape by fine metal wires and is provided around the primary coating layer 2c, and the outer conductor 2b.
  • a secondary coating layer 2d is provided.
  • the imaging unit 3 is electrically connected to the wiring 14 of the flexible wiring board 10 through an electrical circuit formed on the solid-state imaging device 4.
  • the solid-state image pickup device 4 has bumps 4 a electrically connected to the electric circuit of the solid-state image pickup device 4 on the back surface opposite to the front surface on which the image pickup unit 3 is mounted.
  • the bump 4a is, for example, a solder bump, a stud bump, a plating bump, or the like.
  • the solid-state imaging device 4 is a flip-chip type, and is flexible by bonding and fixing bumps 4a to connection terminals 19 (see FIGS. 1A and 1B) formed on the mounting surface 11a of the element mounting portion 11 of the flexible wiring board 10.
  • the wiring board 10 is electrically connected to the wiring 14.
  • the element mounting portion 11 of the flexible wiring board 10 is electrically connected to the conductor terminal portions 12 c, 12 d, 13 c, and 13 d through the wiring 14 of the flexible wiring board 10.
  • the electric circuit of the solid-state imaging device 4 and the conductor 2 of the electric cable 1 are electrically connected via the wiring 14.
  • the wiring 14 is connected to the conductor 2 from the connection terminal 19 through the bent portion 10 ⁇ / b> A through the rear pieces 12 and 13.
  • the entire rear pieces 12 and 13 of the flexible wiring board 10 in the imaging module 100 are covered with an insulating tube 15 having electrical insulation.
  • the insulating tube 15 is a cylindrical member formed of, for example, a silicone resin, and is suitable in that it can be smoothly slid with respect to the conductor 2 of the electric cable 1 and the flexible wiring board 10 with low friction.
  • the insulating tube 15 is fixed and integrated with the flexible wiring board 10 and the conductor 2 inside the insulating tube 15 by an inner layer resin 16 filled and cured inside the insulating tube 15.
  • a conductor connecting portion 17b is formed by soldering the conductor 2b.
  • the endoscope 101 is configured by further mounting the lens unit 20 and the outer frame member 21.
  • the lens unit 20 is attached to the light receiving surface 3 a of the imaging unit 3 via a transparent cover member 22.
  • the outer frame member 21 is, for example, a cylindrical member that houses the tip of the imaging module 100 together with the cover member 22 and the lens unit 20 fixed to the solid-state imaging device 4.
  • the lens unit 20 is a member in which an objective lens (not shown) is incorporated in a cylindrical lens barrel 20a.
  • the lens unit 20 aligns the optical axis with the light receiving surface 3a of the imaging unit 3, and the axial direction of the lens barrel 20a. Is fixed to the cover member 22.
  • the lens unit 20 forms an image of light guided from the front side of the imaging tip unit through the lens in the lens barrel 20 a on the light receiving surface 3 a of the imaging unit 3 in the solid-state imaging device 4.
  • the outer frame member 21 is bonded and fixed to the insulating tube 15 of the imaging module 100 by an outer layer resin 23 filled and cured inside the outer frame member 21.
  • the insulating tube 15 prevents the conductor connection portion 17a and the conductor connection portion 17b formed on each of the two rear pieces 12 and 13 of the flexible wiring board 10 from coming into contact with the outer frame member 21 and short-circuiting. .
  • the two rear pieces 12 and 13 of the flexible wiring board 10 are formed by extending portions 12 e and 13 e formed by bending with respect to the element mounting portion 11, and extending portions 12 e and 13 e. And connecting piece portions 12f and 13f extending rearward from the extending ends 12e1 and 13e1.
  • a bent portion between the element mounting portion 11 and the extending portions 12e and 13e is referred to as a bent portion 10A.
  • the extending portions 12e and 13e extend from both end portions (both end portions in the longitudinal direction D1) of the element mounting portion 11 so as to approach each other as the distance from the element mounting portion 11 increases.
  • the extending portions 12e and 13e are in contact with each other at the extending ends 12e1 and 13e1.
  • the connecting piece portions 12f and 13f constitute a substrate matching portion 24 in which the opposing surfaces 12a and 13a are in contact with each other.
  • the connecting piece portions 12f and 13f are bonded to each other by an interlayer resin 24a interposed between the opposing surfaces 12a and 13a.
  • the in-substrate space 25 surrounded by the extending portions 12e, 13e, the element mounting portion 11, and the substrate mating portion 24 is filled with an adhesive resin R.
  • the extending portions 12e and 13e and the element mounting portion 11 are bonded and fixed to each other via an adhesive resin R.
  • the adhesive resin R filled in the in-board space 25 of the flexible wiring board 10 may be formed by the element mounting portion 11 and the rear piece portions 12 and 13 so as to have a triangular (or substantially triangular) shape as a whole. it can.
  • the corner portion of the adhesive resin R facing the bent portion 10A preferably has a curved convex surface 26 (see FIG. 2) having a substantially arc-shaped cross section.
  • the outer dimension L1 of the flexible wiring board 10 surrounding the adhesive resin R is the dimension (length) of the flexible wiring board 10 in the longitudinal direction D1 of the element mounting portion 11.
  • the outermost peripheral edge in the D1 direction of the flexible wiring board 10 is located outside the outermost peripheral edge in the D1 direction of the solid-state imaging device 4. Therefore, the outer dimension L1 of the flexible wiring board 10 is larger than the outer dimension L2 of the solid-state imaging element 4.
  • the outer side in the direction D1 means a direction closer to the direction away from the center line C1 of the element mounting portion 11 shown in FIG. 1B (rightward in FIG. 1B and FIG. 2 (right direction)).
  • the outermost peripheral edge in the D1 direction of the flexible wiring board 10 is the inner side in the D1 direction (the center line of the element mounting portion 11 shown in FIG.
  • the outer dimension L1 of the flexible wiring board 10 is smaller than the outer dimension L2 of the solid-state imaging device 4. Further, the outermost peripheral edge of the flexible wiring board 10 and the outermost peripheral edge of the solid-state imaging device 4 may have the same position in the D1 direction. In that case, the outer dimension L1 is equal to the outer dimension L2.
  • the distance in the D1 direction from the outermost peripheral edge can be, for example, 0 to 0.100 mm.
  • the outermost peripheral edge of the flexible wiring board 10 when the outermost peripheral edge of the flexible wiring board 10 is located inside the outermost peripheral edge of the solid-state imaging element 4, the outermost peripheral edge of the flexible wiring board 10 and the solid-state imaging element 4
  • the distance in the D1 direction from the outermost peripheral edge can be, for example, 0 to 0.195 mm.
  • the inner radius (indicated by symbol A2 in FIG. 2) of the bent portion 10A of the flexible wiring board 10 can be set to 0.05 mm or more, for example. By setting the inner radius A2 within this range (0.05 mm or more), it is possible to prevent disconnection at the bent portion 10A.
  • the inner radius A2 can be set to 0.10 mm or less, for example. By setting the inner radius A2 within this range (0.10 mm or less), the tip 18 can be reduced in diameter.
  • the distance in the D1 direction (reference numeral A3 in FIG. 2) from the outermost peripheral edge (right end in FIG. 2) of the bump 4a on the flexible wiring board 10 on which the solid-state imaging device 4 is mounted to the innermost peripheral edge in the D1 direction of the bent portion 10A. Can be set to, for example, 0 to 0.295 mm. By setting the distance A3 within this range (0 to 0.295 mm), the diameter of the tip 18 can be reduced. Between the outermost peripheral edge (right end in FIG. 2) of the bump 4a on the flexible wiring board 10 on which the solid-state imaging element 4 is mounted and the outermost peripheral edge in the D1 direction of the solid-state imaging element 4 (right end in FIG. 2).
  • the distance in the D1 direction (indicated by reference numeral A4 in FIG. 2) can be set to 0.10 to 0.245 mm, for example.
  • the flexible wiring substrate 10 includes the resist film 10 b, but the resist film 10 b may be omitted if no short circuit occurs with respect to the outer frame member 21.
  • FIG. 1A is a side sectional view schematically showing the flexible wiring board 10 and the solid-state imaging device 4 in a state where they are not bent.
  • FIG. 1B is a plan view showing the flexible wiring board 10 in an unbent state.
  • one bent portion 10A (the left bent portion 10A shown in FIGS. 1A and 1B) is called a bent portion (first bent portion) 10A1
  • the other bent portion 10A (right side)
  • the bent portion 10A) is referred to as a bent portion (second bent portion) 10A2.
  • connection terminals 19 (19a, 19b) and a pair of connection terminals 19 (disposed in the D2 direction from the connection terminals 19 (19a, 19b)) ( 19c, 19d).
  • the pair of connection terminals 19 (19a, 19b) are formed at a distance from each other in the D1 direction.
  • the pair of connection terminals 19 (19c, 19d) are also formed at a distance from each other in the D1 direction.
  • connection terminals 19a and 19c and the connection terminals 19b and 19d are positioned on one side (first direction) and the other side (second direction), for example, across the center line C1 in the longitudinal direction of the mounting surface 11a.
  • the connection terminals 19a and 19c and the connection terminals 19b and 19d are preferably in positions that are line-symmetric with respect to the center line C1.
  • the connection terminals 19a and 19b and the connection terminals 19c and 19d are located on one side (first direction) and the other side (second direction), for example, across the center line C2 in the short direction of the mounting surface 11a.
  • the connection terminals 19a and 19b and the connection terminals 19c and 19d are preferably in positions that are line-symmetric with respect to the center line C2, for example.
  • connection terminal 19 may be, for example, a circle or a rectangle.
  • connection terminal 19 is formed in a circular shape in plan view.
  • the solid-state imaging device 4 is electrically connected to the connection terminal 19 by bonding the bumps 4 a of the solid-state imaging device 4.
  • connection portion 27 of the wiring 14 with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) closest to the bent portion 10A (through which the wiring 14 passes).
  • the connection location 27 is located at a position 28b (the most separated position 28b) farthest from the bent portion 10A (through which the wiring 14 passes).
  • the position of the connection portion 27 of the wiring 14a with respect to the connection terminal 19a is a position other than the position 28a (the closest position 28a) closest to the first bent portion 10A1 (left bent portion 10A in FIG. 1B). Is done.
  • the connection location 27 is at a position 28b (the most spaced position 28b) farthest from the first bent portion 10A1.
  • the farthest position 28b is, for example, a position corresponding to an intersection closer to the center line C1 out of two intersections between a straight line passing through the center of the connection terminal 19 and along the direction D1 and the peripheral edge of the connection terminal 19.
  • the closest position 28a is a position corresponding to an intersection point closer to the bent portion 10A through which the wiring 14 passes among the two intersection points.
  • the wiring 14 extends inward in the D1 direction (a direction away from the bent portion 10A, that is, a direction approaching the center line C1) from the connection portion 27 with respect to the connection terminal 19, and is inward in the D2 direction at the first wiring bent portion 31 ( Bending toward the center line C2), bending outward in the D1 direction (direction approaching the bending portion 10A) at the second wiring bending portion 32, and reaching the rear piece portions 12 and 13 via the bending portion 10A.
  • a portion from the connection location 27 to the first wiring bent portion 31 is referred to as a wiring 33 a
  • a portion from the first wiring bent portion 31 to the second wiring bent portion 32 is referred to as a wiring 33 b
  • the second wiring bent A portion from the portion 32 to the bent portion 10A is referred to as a wiring 33c.
  • the wiring 33b from the first wiring bent portion 31 to the second wiring bent portion 32 is at a position farthest from the bent portion 10A.
  • the distance L3 between the wiring 33b and the connection location 27 in the D1 direction (direction away from the bent portion 10A) is preferably 0.05 mm or more. Accordingly, it is possible to prevent a large force from being applied to the connection portion 27 when the bent portion 10A is formed, and it is possible to prevent the wiring 14 from being damaged (disconnected).
  • the imaging module 100 is manufactured as follows, for example.
  • a bending jig (not shown) is arranged on the mounting portion rear surface 11 b of the flexible wiring board 10.
  • the surface of the solid-state imaging device 4 installed on the mounting surface 11a of the flexible wiring board 10 is pressed from above.
  • Extending portions 12e and 13e are formed by bending both end portions (bending portion 10A) of the element mounting portion 11 of the flexible wiring board 10.
  • the connection pieces 12f and 13f of the flexible wiring board 10 are bonded with an adhesive. Thereby, the board
  • a bending jig (not shown) inserted between the element mounting portion 11 and the rear piece portions 12 and 13 of the flexible wiring board 10 is removed, and the substrate resin space R is filled with the adhesive resin R, and then the adhesive resin R Is cured.
  • the position of the connection portion 27 of the wiring 14 with respect to the connection terminal 19 is a position other than the closest position 28a (specifically, the most distant position 28b), and therefore between the connection portion 27 and the bent portion 10A. A sufficient distance is secured. Therefore, it is possible to prevent a large force from being applied to the connection portion 27 when forming the bent portion 10A, and to prevent the wiring 14 from being damaged (disconnected). Therefore, connection reliability can be improved. In addition, since the wiring 14 is not easily damaged, even if the outer dimension of the flexible wiring board 10 is reduced, an excessive force is not applied to the bent portion 10A. Therefore, the diameter of the imaging module 100 can be reduced.
  • FIG. 5 is a plan view showing the flexible wiring board 110 used in the imaging module according to the second embodiment of the present invention.
  • FIG. 5 shows the flexible wiring board 110 in an unbent state.
  • the flexible wiring board 110 is different from the flexible wiring board 10 of the first embodiment in the form of wiring.
  • the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
  • a pair of main wirings 114, 114 are formed along the direction D1 on the mounting surface 11a.
  • the main wirings 114 and 114 are formed at intervals in the D2 direction.
  • the main wirings 114 and 114 are formed between the connection terminal 19a and the connection terminal 19c and between the connection terminal 19b and the connection terminal 19d.
  • Wires 115a and 115c are connected to the connection terminals 19a and 19c, respectively.
  • the position of the connection portion 127 of the wirings 115a and 115c with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) closest to the one bent portion (first bent portion) 10A1.
  • the connection position is a position 28b (the most separated position 28b) that is farthest from the first bent portion 10A1.
  • the wirings 115a and 115c extend from the connection portion 127 to the connection terminal 19 inward in the D1 direction (a direction away from the bent portion 10A1, that is, a direction approaching the center line C1). Bend outward (in the direction away from the center line C2), bend outward in the D1 direction (direction approaching the bent portion 10A1) at the second wiring bent portion 132, pass through the bent portion 10A1, and then the rear piece portions 12 and 13 One of them.
  • Wires 115b and 115d are connected to the connection terminals 19b and 19d, respectively.
  • the position of the connection portion 127 of the wirings 115b and 115d with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) that is closest to the other bent portion (second bent portion) 10A2.
  • the connection location 127 is at a position 28b (the most spaced position 28b) farthest from the second bent portion 10A2.
  • the wirings 115b and 115d extend inward in the D1 direction (a direction away from the bent portion 10A2, that is, a direction approaching the center line C1) from the connection portion 127 with respect to the connection terminal 19, and the first wiring bent portion 133 is in the D2 direction. (In a direction approaching the center line C2) and is connected to the main wirings 114, 114.
  • connection terminals 19 (19a to 19d) are connected to the wiring (wirings 115a and 115c and the main wirings 114 and 114) passing through the first bent portion 10A1, and therefore the rear piece 12 , 13 can concentrate wiring on one side. Therefore, the internal structure of the imaging module 100 can be simplified.
  • FIG. 6 is a plan view showing a first modification of the flexible wiring board 10.
  • the wirings 124 (124a to 124d) are connected to the connection terminals 19 (19a to 19d), respectively.
  • the position of the connection portion 137 of the wiring 124 with respect to the connection terminal 19 is a position closer to the inside in the D2 direction than the most distant position 28b (see FIG. 1B).
  • the connection location 137 includes two lines, a straight line that passes through the center of the connection terminal 19 and is inclined with respect to the D1 direction (for example, a straight line that is inclined approximately 45 ° with respect to the D1 direction) It is a position corresponding to the intersection closer to the center line C1 among the intersections.
  • the wiring 124 extends from the connection location 137 so as to approach the center line C2 as it approaches the center line C1, and bends outward in the D1 direction (direction approaching the bent portion 10A) at the first wiring bent portion 141. Through the bent portion 10A, the rear piece portions 12 and 13 are reached.
  • the extending direction of the wiring 124 from the connection location 137 to the first wiring bent portion 141 is a direction away from the bent portion 10A.
  • FIG. 7 is a plan view showing a second modification of the flexible wiring board 10.
  • wirings 134 (134a to 134d) are connected to the connection terminals 19 (19a to 19d), respectively.
  • the position of the connection part 147 of the wiring 134 with respect to the connection terminal 19 is a position further inward in the D2 direction than the connection part 137 of FIG.
  • the connection point 147 passes through the center of the connection terminal 19 and is a position corresponding to the intersection closer to the center line C2 out of the two intersections of the straight line along the direction D2 and the peripheral edge of the connection terminal 19. is there.
  • the connection location 147 is the center position of the connection terminal 19 in the direction D1, and is closest to the center line C2.
  • the wiring 134 extends from the connection portion 147 so as to approach the center line C2 along the D2 direction, and is bent outward in the D1 direction (direction approaching the bending portion 10A) by the first wiring bending portion 151. To reach the rear piece 12, 13.
  • the extending direction of the wiring 134 from the connection location 147 to the first wiring bent portion 151 is parallel to the bent portion 10A.
  • FIG. 8 is a plan view showing a third modification of the flexible wiring board 10.
  • wirings 154 (154a to 154d) are connected to the connection terminals 19 (19a to 19d), respectively.
  • the position of the connection point 167 of the wiring 154 with respect to the connection terminal 19 is the closest position 28a.
  • the wiring 154 extends from the connection location 167 so as to approach the center line C2 along the D2 direction, and is bent outward in the D1 direction (direction approaching the bent portion 10A) by the first wiring bent portion 161.
  • the extending direction of the wiring 154 in the portion from the connection location 167 to the first wiring bent portion 161 is parallel to the bent portion 10A.
  • Solid-state image sensor 10 Flexible wiring board 10A, 10A1, 10A2 ... Bending part 11 ... Element mounting part 11a ... Mounting surface 12, 13 ... Rear piece part 14, 114, 124, 134, 154 ... Wiring 19 ... Connection terminal 28a ... Closest position (position closest to the bent part) 28b ... the most distant position (the most distant position from the bent portion) 27, 127, 137, 147, 167 ... connection location 100 ... imaging module 101 ... endoscope L1 ... external dimensions of flexible wiring board L2 ... external dimensions of solid-state image sensor

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  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)

Abstract

L'invention concerne un module de capture d'image comprenant : un câble électrique ; un élément de capture d'image ; et une carte de câblage flexible comprenant un câblage qui connecte électriquement l'élément de capture d'image et le câble électrique. La carte de câblage flexible comprend : une partie de montage d'élément pour monter l'élément de capture d'image ; et une partie de pièce arrière qui est pliée au niveau d'une partie pliée d'une partie d'extrémité de la partie de montage d'élément, et qui s'étend dans une direction opposée à la position où l'élément de capture d'image est disposé. La partie de montage d'élément comprend une surface de montage qui est une surface coupant la direction de ligne axiale de l'extrémité distale du câble électrique et sur laquelle l'élément de capture d'image est monté. La surface de montage est connectée au câblage et comprenant un terminal de connexion qui est électriquement connecté à l'élément de capture d'image. À partir du terminal de connexion, le câblage passe par la partie de pièce arrière par l'intermédiaire de la partie pliée et se connecte au câble électrique. L'emplacement où le câblage se connecte au terminal de connexion est situé en une position autre que la position qui se rapproche le plus près de la partie pliée, ou est situé de telle sorte que la direction d'extension du câblage à cet emplacement de connexion est une direction qui est parallèle à la partie pliée ou est espacée de la partie pliée.
PCT/JP2016/064916 2015-07-13 2016-05-19 Module de capture d'image et endoscope WO2017010165A1 (fr)

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JP2015139724A JP2017018415A (ja) 2015-07-13 2015-07-13 撮像モジュール及び内視鏡
JP2015-139724 2015-07-13

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WO2017010165A1 true WO2017010165A1 (fr) 2017-01-19

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JP6742358B2 (ja) * 2018-04-04 2020-08-19 株式会社フジクラ 撮像ユニット
JP6689908B2 (ja) 2018-05-09 2020-04-28 株式会社フジクラ 撮像モジュール
JP7227011B2 (ja) * 2019-01-09 2023-02-21 ｉ－ＰＲＯ株式会社 内視鏡

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JP2013123628A (ja) * 2011-12-16 2013-06-24 Olympus Medical Systems Corp 内視鏡用撮像ユニット
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JP2014086883A (ja) * 2012-10-24 2014-05-12 Canon Inc デバイス基板とフレキシブル配線基板を有する装置、及び被検体情報取得装置

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KR20010019762A (ko) * 1999-08-30 2001-03-15 윤종용 플렉서블 회로기판 및 그 설계방법
JP2013123628A (ja) * 2011-12-16 2013-06-24 Olympus Medical Systems Corp 内視鏡用撮像ユニット
JP2013214815A (ja) * 2012-03-30 2013-10-17 Fujikura Ltd 撮像モジュール、レンズ付き撮像モジュール、内視鏡、撮像モジュールの製造方法、フレキシブル配線基板成形装置
JP2014086883A (ja) * 2012-10-24 2014-05-12 Canon Inc デバイス基板とフレキシブル配線基板を有する装置、及び被検体情報取得装置

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