WO2017010165A1 - Image pickup module and endoscope - Google Patents

Image pickup module and endoscope Download PDF

Info

Publication number
WO2017010165A1
WO2017010165A1 PCT/JP2016/064916 JP2016064916W WO2017010165A1 WO 2017010165 A1 WO2017010165 A1 WO 2017010165A1 JP 2016064916 W JP2016064916 W JP 2016064916W WO 2017010165 A1 WO2017010165 A1 WO 2017010165A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
bent portion
wiring board
connection
flexible wiring
Prior art date
Application number
PCT/JP2016/064916
Other languages
French (fr)
Japanese (ja)
Inventor
石塚　健
中尾　知
秀秋 臼田
Original Assignee
株式会社フジクラ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社フジクラ filed Critical 株式会社フジクラ
Publication of WO2017010165A1 publication Critical patent/WO2017010165A1/en

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/26—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes using light guides
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to an imaging module and an endoscope. This application claims priority based on Japanese Patent Application No. 2015-139724 for which it applied on July 13, 2015, and uses the content here.
  • the imaging module stores, for example, a flexible wiring board (FPC) on which a solid-state imaging element is mounted and an objective lens unit in a cylindrical metal frame member, and electrically connects the solid-state imaging element to an electric cable via the flexible wiring board. It is set as the structure connected to.
  • FPC flexible wiring board
  • a flexible wiring board in which an imaging element chip (solid-state imaging element) is mounted in the center is electrically connected to a signal cable.
  • the wiring board is bent to the opposite side of the image sensor chip at both ends of the place where the image sensor chip is mounted, and the wiring board is supported in the space surrounded by the center part and the extension part of the circuit board. And a block for guiding is provided.
  • a flexible wiring board having a solid-state imaging device mounted in the center is connected to an electric cable.
  • the flexible wiring board is bent to the opposite side of the solid-state imaging device.
  • the present invention has been made in view of the above-described circumstances, and an object thereof is to provide an imaging module and an endoscope that can be reduced in diameter without impairing connection reliability.
  • An imaging module includes an electrical cable, an imaging device, and a flexible wiring board having a wiring electrically connected between the imaging device and the electrical cable, and the flexible wiring
  • the substrate includes an element mounting portion for mounting the imaging element, and a rear piece that is bent at a bent portion at an end of the element mounting portion and extends in a direction opposite to the position where the imaging element is provided.
  • the element mounting portion has a mounting surface on which the imaging element is mounted, which is a surface intersecting the axial direction of the tip of the electric cable, and the mounting surface is connected to the wiring and the imaging A connection terminal electrically connected to the element, wherein the wiring is connected from the connection terminal to the electric cable through the bent portion and the rear piece, and the connection point of the wiring to the connection terminal But Wherein either located at a position other than the most proximate position with respect to the bent portion, or the extending direction of the wiring in the connection point is a direction away from a direction parallel or the bent portion to the bent portion.
  • connection position of the wiring with respect to the connection terminal may be a position farthest from the bent portion, and the extending direction of the wiring at the connection location may be a direction away from the bent portion.
  • the extending direction of the wiring at the connection location is a direction away from the bent portion, and the separation distance between the position where the wiring is farthest from the bent portion and the connection location is 0.05 mm. It may be the above.
  • the endoscope according to the second aspect of the present invention includes the imaging module according to the above aspect.
  • the imaging module since the position of the connection portion of the wiring with respect to the connection terminal is a position other than the closest position of the bent portion, a sufficient distance is ensured between the connected portion and the bent portion. . Therefore, it is possible to avoid applying a large force to the connection portion when forming the bent portion, and to prevent damage (disconnection) of the wiring. Therefore, connection reliability can be improved. In addition, since the wiring is not easily damaged, an excessive force is not applied to the bent portion even if the outer dimensions of the flexible wiring board are reduced. Therefore, the diameter of the imaging module can be reduced.
  • FIG. 1A It is a sectional side view which shows typically the flexible wiring board and solid-state image sensor which are used for the imaging module which concerns on the 1st Embodiment of this invention. It is a top view which shows the flexible wiring board shown to FIG. 1A. It is sectional drawing which shows a part of front-end
  • FIG. 3 shows the distal end structure of the endoscope 101 assembled using the imaging module 100 and the imaging module 100 of the first embodiment.
  • FIG. 2 is a cross-sectional view showing a part of the tip portion of the imaging module 100.
  • the longitudinal direction of the flexible wiring board 10 in the element mounting portion 11 is referred to as D1.
  • a direction orthogonal to the D1 direction in a plane along the mounting surface 11a of the element mounting portion 11 is referred to as a short direction D2.
  • the left side that is, the solid-state imaging device 4 side with respect to the flexible wiring board 10
  • the opposite direction (right side in FIG. 3) is referred to as a rear side.
  • 2 and 3 are views seen from a direction perpendicular to the front-rear direction and the longitudinal direction D1.
  • the imaging module 100 has a flexible wiring board 10 (FPC) on which a solid-state imaging device 4 having an imaging unit 3 is mounted and connected to the tip of a conductor 2 of an electric cable 1. It is configured.
  • a solid-state imaging element 4 for example, a CMOS (complementary metal oxide semiconductor) can be suitably used.
  • the solid-state imaging element 4 is electrically connected to the electric cable 1 through the flexible wiring board 10.
  • the flexible wiring board 10 includes an element mounting portion 11 on which the solid-state imaging device 4 is mounted on the front mounting surface 11a, and two rear piece portions 12 that are bent at both ends of the element mounting portion 11 and extended to the rear side. , 13.
  • the flexible wiring board 10 is bent at both end portions (bending portion 10 ⁇ / b> A) of the element mounting portion 11 and extended to the rear side, whereby two rear piece portions 12 and 13 are formed.
  • the flexible wiring board 10 is a one-side wiring type flexible wiring board, for example. That is, as shown in FIG. 2, the flexible wiring board 10 includes a wiring 14 formed on one side of an insulating base material 10 a formed in a film shape, and an electrically insulating resist film 10 b (covering layer). For example, a solder resist).
  • the insulating base material 10a is made of polyimide, for example, and the wiring 14 is made of copper, for example.
  • the wiring 14 is in the second layer among the three layers, so that even when bending is performed, the wiring 14 is positioned at the bending neutral point, and an excessive force is applied to the wiring 14. Can be avoided.
  • the mounting portion back surface 11 b is a surface opposite to the mounting surface 11 a of the element mounting portion 11.
  • the mounting surface 11a intersects the direction of the axis of the tip of the electric cable 1 (or the extension of the axis of the tip of the electric cable 1).
  • the mounting surface 11 a is preferably orthogonal (or substantially orthogonal) to the axial direction of the tip of the electric cable 1.
  • pad-shaped conductor terminal portions 12c, 12d, 13c, and 13d are provided on the outer surfaces 12b and 13b (outer surfaces) of the rear piece portions 12 and 13, respectively.
  • the conductor terminal portions 12c, 12d, 13c, and 13d are electrically connected to the inner conductor 2a of the conductor 2 and the outer conductor 2b that are led out from the jacket 5 of the electric cable 1, respectively.
  • a plurality of conductors 2 are collectively covered with an outer jacket 5 to constitute a cable unit.
  • the conductor 2 covers the inner conductor 2a, a primary coating layer 2c that covers the inner conductor 2a, an outer conductor 2b that is formed in a net shape by fine metal wires and is provided around the primary coating layer 2c, and the outer conductor 2b.
  • a secondary coating layer 2d is provided.
  • the imaging unit 3 is electrically connected to the wiring 14 of the flexible wiring board 10 through an electrical circuit formed on the solid-state imaging device 4.
  • the solid-state image pickup device 4 has bumps 4 a electrically connected to the electric circuit of the solid-state image pickup device 4 on the back surface opposite to the front surface on which the image pickup unit 3 is mounted.
  • the bump 4a is, for example, a solder bump, a stud bump, a plating bump, or the like.
  • the solid-state imaging device 4 is a flip-chip type, and is flexible by bonding and fixing bumps 4a to connection terminals 19 (see FIGS. 1A and 1B) formed on the mounting surface 11a of the element mounting portion 11 of the flexible wiring board 10.
  • the wiring board 10 is electrically connected to the wiring 14.
  • the element mounting portion 11 of the flexible wiring board 10 is electrically connected to the conductor terminal portions 12 c, 12 d, 13 c, and 13 d through the wiring 14 of the flexible wiring board 10.
  • the electric circuit of the solid-state imaging device 4 and the conductor 2 of the electric cable 1 are electrically connected via the wiring 14.
  • the wiring 14 is connected to the conductor 2 from the connection terminal 19 through the bent portion 10 ⁇ / b> A through the rear pieces 12 and 13.
  • the entire rear pieces 12 and 13 of the flexible wiring board 10 in the imaging module 100 are covered with an insulating tube 15 having electrical insulation.
  • the insulating tube 15 is a cylindrical member formed of, for example, a silicone resin, and is suitable in that it can be smoothly slid with respect to the conductor 2 of the electric cable 1 and the flexible wiring board 10 with low friction.
  • the insulating tube 15 is fixed and integrated with the flexible wiring board 10 and the conductor 2 inside the insulating tube 15 by an inner layer resin 16 filled and cured inside the insulating tube 15.
  • a conductor connecting portion 17b is formed by soldering the conductor 2b.
  • the endoscope 101 is configured by further mounting the lens unit 20 and the outer frame member 21.
  • the lens unit 20 is attached to the light receiving surface 3 a of the imaging unit 3 via a transparent cover member 22.
  • the outer frame member 21 is, for example, a cylindrical member that houses the tip of the imaging module 100 together with the cover member 22 and the lens unit 20 fixed to the solid-state imaging device 4.
  • the lens unit 20 is a member in which an objective lens (not shown) is incorporated in a cylindrical lens barrel 20a.
  • the lens unit 20 aligns the optical axis with the light receiving surface 3a of the imaging unit 3, and the axial direction of the lens barrel 20a. Is fixed to the cover member 22.
  • the lens unit 20 forms an image of light guided from the front side of the imaging tip unit through the lens in the lens barrel 20 a on the light receiving surface 3 a of the imaging unit 3 in the solid-state imaging device 4.
  • the outer frame member 21 is bonded and fixed to the insulating tube 15 of the imaging module 100 by an outer layer resin 23 filled and cured inside the outer frame member 21.
  • the insulating tube 15 prevents the conductor connection portion 17a and the conductor connection portion 17b formed on each of the two rear pieces 12 and 13 of the flexible wiring board 10 from coming into contact with the outer frame member 21 and short-circuiting. .
  • the two rear pieces 12 and 13 of the flexible wiring board 10 are formed by extending portions 12 e and 13 e formed by bending with respect to the element mounting portion 11, and extending portions 12 e and 13 e. And connecting piece portions 12f and 13f extending rearward from the extending ends 12e1 and 13e1.
  • a bent portion between the element mounting portion 11 and the extending portions 12e and 13e is referred to as a bent portion 10A.
  • the extending portions 12e and 13e extend from both end portions (both end portions in the longitudinal direction D1) of the element mounting portion 11 so as to approach each other as the distance from the element mounting portion 11 increases.
  • the extending portions 12e and 13e are in contact with each other at the extending ends 12e1 and 13e1.
  • the connecting piece portions 12f and 13f constitute a substrate matching portion 24 in which the opposing surfaces 12a and 13a are in contact with each other.
  • the connecting piece portions 12f and 13f are bonded to each other by an interlayer resin 24a interposed between the opposing surfaces 12a and 13a.
  • the in-substrate space 25 surrounded by the extending portions 12e, 13e, the element mounting portion 11, and the substrate mating portion 24 is filled with an adhesive resin R.
  • the extending portions 12e and 13e and the element mounting portion 11 are bonded and fixed to each other via an adhesive resin R.
  • the adhesive resin R filled in the in-board space 25 of the flexible wiring board 10 may be formed by the element mounting portion 11 and the rear piece portions 12 and 13 so as to have a triangular (or substantially triangular) shape as a whole. it can.
  • the corner portion of the adhesive resin R facing the bent portion 10A preferably has a curved convex surface 26 (see FIG. 2) having a substantially arc-shaped cross section.
  • the outer dimension L1 of the flexible wiring board 10 surrounding the adhesive resin R is the dimension (length) of the flexible wiring board 10 in the longitudinal direction D1 of the element mounting portion 11.
  • the outermost peripheral edge in the D1 direction of the flexible wiring board 10 is located outside the outermost peripheral edge in the D1 direction of the solid-state imaging device 4. Therefore, the outer dimension L1 of the flexible wiring board 10 is larger than the outer dimension L2 of the solid-state imaging element 4.
  • the outer side in the direction D1 means a direction closer to the direction away from the center line C1 of the element mounting portion 11 shown in FIG. 1B (rightward in FIG. 1B and FIG. 2 (right direction)).
  • the outermost peripheral edge in the D1 direction of the flexible wiring board 10 is the inner side in the D1 direction (the center line of the element mounting portion 11 shown in FIG.
  • the outer dimension L1 of the flexible wiring board 10 is smaller than the outer dimension L2 of the solid-state imaging device 4. Further, the outermost peripheral edge of the flexible wiring board 10 and the outermost peripheral edge of the solid-state imaging device 4 may have the same position in the D1 direction. In that case, the outer dimension L1 is equal to the outer dimension L2.
  • the distance in the D1 direction from the outermost peripheral edge can be, for example, 0 to 0.100 mm.
  • the outermost peripheral edge of the flexible wiring board 10 when the outermost peripheral edge of the flexible wiring board 10 is located inside the outermost peripheral edge of the solid-state imaging element 4, the outermost peripheral edge of the flexible wiring board 10 and the solid-state imaging element 4
  • the distance in the D1 direction from the outermost peripheral edge can be, for example, 0 to 0.195 mm.
  • the inner radius (indicated by symbol A2 in FIG. 2) of the bent portion 10A of the flexible wiring board 10 can be set to 0.05 mm or more, for example. By setting the inner radius A2 within this range (0.05 mm or more), it is possible to prevent disconnection at the bent portion 10A.
  • the inner radius A2 can be set to 0.10 mm or less, for example. By setting the inner radius A2 within this range (0.10 mm or less), the tip 18 can be reduced in diameter.
  • the distance in the D1 direction (reference numeral A3 in FIG. 2) from the outermost peripheral edge (right end in FIG. 2) of the bump 4a on the flexible wiring board 10 on which the solid-state imaging device 4 is mounted to the innermost peripheral edge in the D1 direction of the bent portion 10A. Can be set to, for example, 0 to 0.295 mm. By setting the distance A3 within this range (0 to 0.295 mm), the diameter of the tip 18 can be reduced. Between the outermost peripheral edge (right end in FIG. 2) of the bump 4a on the flexible wiring board 10 on which the solid-state imaging element 4 is mounted and the outermost peripheral edge in the D1 direction of the solid-state imaging element 4 (right end in FIG. 2).
  • the distance in the D1 direction (indicated by reference numeral A4 in FIG. 2) can be set to 0.10 to 0.245 mm, for example.
  • the flexible wiring substrate 10 includes the resist film 10 b, but the resist film 10 b may be omitted if no short circuit occurs with respect to the outer frame member 21.
  • FIG. 1A is a side sectional view schematically showing the flexible wiring board 10 and the solid-state imaging device 4 in a state where they are not bent.
  • FIG. 1B is a plan view showing the flexible wiring board 10 in an unbent state.
  • one bent portion 10A (the left bent portion 10A shown in FIGS. 1A and 1B) is called a bent portion (first bent portion) 10A1
  • the other bent portion 10A (right side)
  • the bent portion 10A) is referred to as a bent portion (second bent portion) 10A2.
  • connection terminals 19 (19a, 19b) and a pair of connection terminals 19 (disposed in the D2 direction from the connection terminals 19 (19a, 19b)) ( 19c, 19d).
  • the pair of connection terminals 19 (19a, 19b) are formed at a distance from each other in the D1 direction.
  • the pair of connection terminals 19 (19c, 19d) are also formed at a distance from each other in the D1 direction.
  • connection terminals 19a and 19c and the connection terminals 19b and 19d are positioned on one side (first direction) and the other side (second direction), for example, across the center line C1 in the longitudinal direction of the mounting surface 11a.
  • the connection terminals 19a and 19c and the connection terminals 19b and 19d are preferably in positions that are line-symmetric with respect to the center line C1.
  • the connection terminals 19a and 19b and the connection terminals 19c and 19d are located on one side (first direction) and the other side (second direction), for example, across the center line C2 in the short direction of the mounting surface 11a.
  • the connection terminals 19a and 19b and the connection terminals 19c and 19d are preferably in positions that are line-symmetric with respect to the center line C2, for example.
  • connection terminal 19 may be, for example, a circle or a rectangle.
  • connection terminal 19 is formed in a circular shape in plan view.
  • the solid-state imaging device 4 is electrically connected to the connection terminal 19 by bonding the bumps 4 a of the solid-state imaging device 4.
  • connection portion 27 of the wiring 14 with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) closest to the bent portion 10A (through which the wiring 14 passes).
  • the connection location 27 is located at a position 28b (the most separated position 28b) farthest from the bent portion 10A (through which the wiring 14 passes).
  • the position of the connection portion 27 of the wiring 14a with respect to the connection terminal 19a is a position other than the position 28a (the closest position 28a) closest to the first bent portion 10A1 (left bent portion 10A in FIG. 1B). Is done.
  • the connection location 27 is at a position 28b (the most spaced position 28b) farthest from the first bent portion 10A1.
  • the farthest position 28b is, for example, a position corresponding to an intersection closer to the center line C1 out of two intersections between a straight line passing through the center of the connection terminal 19 and along the direction D1 and the peripheral edge of the connection terminal 19.
  • the closest position 28a is a position corresponding to an intersection point closer to the bent portion 10A through which the wiring 14 passes among the two intersection points.
  • the wiring 14 extends inward in the D1 direction (a direction away from the bent portion 10A, that is, a direction approaching the center line C1) from the connection portion 27 with respect to the connection terminal 19, and is inward in the D2 direction at the first wiring bent portion 31 ( Bending toward the center line C2), bending outward in the D1 direction (direction approaching the bending portion 10A) at the second wiring bending portion 32, and reaching the rear piece portions 12 and 13 via the bending portion 10A.
  • a portion from the connection location 27 to the first wiring bent portion 31 is referred to as a wiring 33 a
  • a portion from the first wiring bent portion 31 to the second wiring bent portion 32 is referred to as a wiring 33 b
  • the second wiring bent A portion from the portion 32 to the bent portion 10A is referred to as a wiring 33c.
  • the wiring 33b from the first wiring bent portion 31 to the second wiring bent portion 32 is at a position farthest from the bent portion 10A.
  • the distance L3 between the wiring 33b and the connection location 27 in the D1 direction (direction away from the bent portion 10A) is preferably 0.05 mm or more. Accordingly, it is possible to prevent a large force from being applied to the connection portion 27 when the bent portion 10A is formed, and it is possible to prevent the wiring 14 from being damaged (disconnected).
  • the imaging module 100 is manufactured as follows, for example.
  • a bending jig (not shown) is arranged on the mounting portion rear surface 11 b of the flexible wiring board 10.
  • the surface of the solid-state imaging device 4 installed on the mounting surface 11a of the flexible wiring board 10 is pressed from above.
  • Extending portions 12e and 13e are formed by bending both end portions (bending portion 10A) of the element mounting portion 11 of the flexible wiring board 10.
  • the connection pieces 12f and 13f of the flexible wiring board 10 are bonded with an adhesive. Thereby, the board
  • a bending jig (not shown) inserted between the element mounting portion 11 and the rear piece portions 12 and 13 of the flexible wiring board 10 is removed, and the substrate resin space R is filled with the adhesive resin R, and then the adhesive resin R Is cured.
  • the position of the connection portion 27 of the wiring 14 with respect to the connection terminal 19 is a position other than the closest position 28a (specifically, the most distant position 28b), and therefore between the connection portion 27 and the bent portion 10A. A sufficient distance is secured. Therefore, it is possible to prevent a large force from being applied to the connection portion 27 when forming the bent portion 10A, and to prevent the wiring 14 from being damaged (disconnected). Therefore, connection reliability can be improved. In addition, since the wiring 14 is not easily damaged, even if the outer dimension of the flexible wiring board 10 is reduced, an excessive force is not applied to the bent portion 10A. Therefore, the diameter of the imaging module 100 can be reduced.
  • FIG. 5 is a plan view showing the flexible wiring board 110 used in the imaging module according to the second embodiment of the present invention.
  • FIG. 5 shows the flexible wiring board 110 in an unbent state.
  • the flexible wiring board 110 is different from the flexible wiring board 10 of the first embodiment in the form of wiring.
  • the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
  • a pair of main wirings 114, 114 are formed along the direction D1 on the mounting surface 11a.
  • the main wirings 114 and 114 are formed at intervals in the D2 direction.
  • the main wirings 114 and 114 are formed between the connection terminal 19a and the connection terminal 19c and between the connection terminal 19b and the connection terminal 19d.
  • Wires 115a and 115c are connected to the connection terminals 19a and 19c, respectively.
  • the position of the connection portion 127 of the wirings 115a and 115c with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) closest to the one bent portion (first bent portion) 10A1.
  • the connection position is a position 28b (the most separated position 28b) that is farthest from the first bent portion 10A1.
  • the wirings 115a and 115c extend from the connection portion 127 to the connection terminal 19 inward in the D1 direction (a direction away from the bent portion 10A1, that is, a direction approaching the center line C1). Bend outward (in the direction away from the center line C2), bend outward in the D1 direction (direction approaching the bent portion 10A1) at the second wiring bent portion 132, pass through the bent portion 10A1, and then the rear piece portions 12 and 13 One of them.
  • Wires 115b and 115d are connected to the connection terminals 19b and 19d, respectively.
  • the position of the connection portion 127 of the wirings 115b and 115d with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) that is closest to the other bent portion (second bent portion) 10A2.
  • the connection location 127 is at a position 28b (the most spaced position 28b) farthest from the second bent portion 10A2.
  • the wirings 115b and 115d extend inward in the D1 direction (a direction away from the bent portion 10A2, that is, a direction approaching the center line C1) from the connection portion 127 with respect to the connection terminal 19, and the first wiring bent portion 133 is in the D2 direction. (In a direction approaching the center line C2) and is connected to the main wirings 114, 114.
  • connection terminals 19 (19a to 19d) are connected to the wiring (wirings 115a and 115c and the main wirings 114 and 114) passing through the first bent portion 10A1, and therefore the rear piece 12 , 13 can concentrate wiring on one side. Therefore, the internal structure of the imaging module 100 can be simplified.
  • FIG. 6 is a plan view showing a first modification of the flexible wiring board 10.
  • the wirings 124 (124a to 124d) are connected to the connection terminals 19 (19a to 19d), respectively.
  • the position of the connection portion 137 of the wiring 124 with respect to the connection terminal 19 is a position closer to the inside in the D2 direction than the most distant position 28b (see FIG. 1B).
  • the connection location 137 includes two lines, a straight line that passes through the center of the connection terminal 19 and is inclined with respect to the D1 direction (for example, a straight line that is inclined approximately 45 ° with respect to the D1 direction) It is a position corresponding to the intersection closer to the center line C1 among the intersections.
  • the wiring 124 extends from the connection location 137 so as to approach the center line C2 as it approaches the center line C1, and bends outward in the D1 direction (direction approaching the bent portion 10A) at the first wiring bent portion 141. Through the bent portion 10A, the rear piece portions 12 and 13 are reached.
  • the extending direction of the wiring 124 from the connection location 137 to the first wiring bent portion 141 is a direction away from the bent portion 10A.
  • FIG. 7 is a plan view showing a second modification of the flexible wiring board 10.
  • wirings 134 (134a to 134d) are connected to the connection terminals 19 (19a to 19d), respectively.
  • the position of the connection part 147 of the wiring 134 with respect to the connection terminal 19 is a position further inward in the D2 direction than the connection part 137 of FIG.
  • the connection point 147 passes through the center of the connection terminal 19 and is a position corresponding to the intersection closer to the center line C2 out of the two intersections of the straight line along the direction D2 and the peripheral edge of the connection terminal 19. is there.
  • the connection location 147 is the center position of the connection terminal 19 in the direction D1, and is closest to the center line C2.
  • the wiring 134 extends from the connection portion 147 so as to approach the center line C2 along the D2 direction, and is bent outward in the D1 direction (direction approaching the bending portion 10A) by the first wiring bending portion 151. To reach the rear piece 12, 13.
  • the extending direction of the wiring 134 from the connection location 147 to the first wiring bent portion 151 is parallel to the bent portion 10A.
  • FIG. 8 is a plan view showing a third modification of the flexible wiring board 10.
  • wirings 154 (154a to 154d) are connected to the connection terminals 19 (19a to 19d), respectively.
  • the position of the connection point 167 of the wiring 154 with respect to the connection terminal 19 is the closest position 28a.
  • the wiring 154 extends from the connection location 167 so as to approach the center line C2 along the D2 direction, and is bent outward in the D1 direction (direction approaching the bent portion 10A) by the first wiring bent portion 161.
  • the extending direction of the wiring 154 in the portion from the connection location 167 to the first wiring bent portion 161 is parallel to the bent portion 10A.
  • Solid-state image sensor 10 Flexible wiring board 10A, 10A1, 10A2 ... Bending part 11 ... Element mounting part 11a ... Mounting surface 12, 13 ... Rear piece part 14, 114, 124, 134, 154 ... Wiring 19 ... Connection terminal 28a ... Closest position (position closest to the bent part) 28b ... the most distant position (the most distant position from the bent portion) 27, 127, 137, 147, 167 ... connection location 100 ... imaging module 101 ... endoscope L1 ... external dimensions of flexible wiring board L2 ... external dimensions of solid-state image sensor

Abstract

Provided is an image pickup module comprising: an electrical cable; an image pickup element; and a flexible wiring board having wiring which electrically connects the image pickup element and the electrical cable. The flexible wiring board includes: an element mounting part for mounting the image pickup element; and a rear-piece part that is bent at a bent part of an end part of the element mounting part, and that extends in a direction opposite the position where the image pickup element is disposed. The element mounting part includes a mounting surface which is a surface intersecting the axial line direction of the distal end of the electrical cable and on which the image pickup element is mounted. The mounting surface is connected to the wiring and includes a connection terminal which is electrically connected to the image pickup element. From the connection terminal, the wiring passes the rear-piece part via the bent part and connects to the electrical cable. The location where the wiring connects to the connection terminal is disposed at a position other than the position which approaches closest to the bent part, or is disposed so that the extension direction of the wiring at such connection location is a direction which is parallel to the bent part or is spaced apart from the bent part.

Description

撮像モジュール及び内視鏡Imaging module and endoscope
　本発明は、撮像モジュール及び内視鏡に関する。
　本願は、２０１５年７月１３日に出願された特願２０１５－１３９７２４号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to an imaging module and an endoscope.
This application claims priority based on Japanese Patent Application No. 2015-139724 for which it applied on July 13, 2015, and uses the content here.
　内視鏡には、固体撮像素子を有する撮像ユニットを、電気ケーブルの先端に組み立てた撮像モジュールが多く採用されている。
　撮像モジュールは、例えば、固体撮像素子を実装したフレキシブル配線基板（ＦＰＣ）と対物レンズユニットとを筒状の金属枠部材内に収納し、フレキシブル配線基板を介して固体撮像素子を電気ケーブルに電気的に接続した構成とされる。 Many endoscopes employ an imaging module in which an imaging unit having a solid-state imaging device is assembled at the tip of an electric cable.
The imaging module stores, for example, a flexible wiring board (FPC) on which a solid-state imaging element is mounted and an objective lens unit in a cylindrical metal frame member, and electrically connects the solid-state imaging element to an electric cable via the flexible wiring board. It is set as the structure connected to.
　特許文献１に示される撮像装置では、撮像素子チップ（固体撮像素子）を中央部に実装した可撓性を有する配線板（ＦＰＣ）が信号ケーブルに電気的に接続されている。
　配線板は、撮像素子チップが実装された箇所の両端部で、撮像素子チップの反対側に屈曲されており、配線板の中央部及び延長部で囲まれた空間部には、配線板を支持しかつ案内するためのブロックが設けられている。 In the imaging apparatus disclosed in Patent Document 1, a flexible wiring board (FPC) in which an imaging element chip (solid-state imaging element) is mounted in the center is electrically connected to a signal cable.
The wiring board is bent to the opposite side of the image sensor chip at both ends of the place where the image sensor chip is mounted, and the wiring board is supported in the space surrounded by the center part and the extension part of the circuit board. And a block for guiding is provided.
　特許文献２に示される撮像モジュールでは、固体撮像素子を中央部に実装したフレキシブル配線基板（ＦＰＣ）が電気ケーブルに接続されている。フレキシブル配線基板は固体撮像素子の反対側に折り曲げられている。 In the imaging module disclosed in Patent Document 2, a flexible wiring board (FPC) having a solid-state imaging device mounted in the center is connected to an electric cable. The flexible wiring board is bent to the opposite side of the solid-state imaging device.
日本国特開２０１１－２１７８８７号公報Japanese Unexamined Patent Publication No. 2011-217887 日本国特開２０１３－２１４８１５号公報Japanese Unexamined Patent Publication No. 2013-214815
　特許文献１に示される撮像装置では、フレキシブル配線基板の屈曲部において回路配線の断線を生じさせずに細径化するのは難しかった。特許文献２に示される撮像モジュールにおいても、フレキシブル配線基板の屈曲部において回路配線の断線を起こさせずに細径化を図るのは困難であった。例えば、回路配線の断線を生じさせることなく撮像モジュール部の外形寸法を２ｍｍ以下にすることは難しかった。 In the imaging device disclosed in Patent Document 1, it is difficult to reduce the diameter without causing disconnection of the circuit wiring at the bent portion of the flexible wiring board. Also in the imaging module disclosed in Patent Document 2, it is difficult to reduce the diameter without causing disconnection of the circuit wiring at the bent portion of the flexible wiring board. For example, it has been difficult to reduce the outer dimension of the imaging module unit to 2 mm or less without causing disconnection of circuit wiring.
　この発明は、上述した事情に鑑みてなされたものであって、接続信頼性を損なうことなく細径化が可能な撮像モジュール及び内視鏡を提供することを目的とする。 The present invention has been made in view of the above-described circumstances, and an object thereof is to provide an imaging module and an endoscope that can be reduced in diameter without impairing connection reliability.
　本発明の第一態様に係る撮像モジュールは、電気ケーブルと、撮像素子と、前記撮像素子と前記電気ケーブルとの間を電気的に接続した配線を有するフレキシブル配線基板と、を備え、前記フレキシブル配線基板は、前記撮像素子を実装する素子実装部と、前記素子実装部の端部における屈曲部で屈曲されて前記撮像素子が設けられた位置とは反対の方向に延出する後片部とを有し、前記素子実装部は、前記電気ケーブルの先端の軸線方向と交差する面であって前記撮像素子を実装する実装面を有し、前記実装面は、前記配線が接続され、かつ前記撮像素子に電気的に接続される接続端子を有し、前記配線は、前記接続端子から前記屈曲部を通って前記後片部を経て前記電気ケーブルに接続され、前記接続端子に対する前記配線の接続箇所が、前記屈曲部に対して最も近接した位置以外の位置に配置されるか、または、前記接続箇所における前記配線の延在方向が前記屈曲部に平行な方向または前記屈曲部から離間する方向である。
　前記接続端子に対する前記配線の接続位置が前記屈曲部から最も離間した位置であり、かつ、前記接続箇所における前記配線の延在方向が前記屈曲部から離間する方向であってもよい。
　前記接続箇所における前記配線の延在方向が前記屈曲部から離間する方向であり、前記配線が前記屈曲部から最も離間した位置と前記接続箇所との前記離間する方向における離間距離は、０．０５ｍｍ以上であってもよい。 An imaging module according to a first aspect of the present invention includes an electrical cable, an imaging device, and a flexible wiring board having a wiring electrically connected between the imaging device and the electrical cable, and the flexible wiring The substrate includes an element mounting portion for mounting the imaging element, and a rear piece that is bent at a bent portion at an end of the element mounting portion and extends in a direction opposite to the position where the imaging element is provided. And the element mounting portion has a mounting surface on which the imaging element is mounted, which is a surface intersecting the axial direction of the tip of the electric cable, and the mounting surface is connected to the wiring and the imaging A connection terminal electrically connected to the element, wherein the wiring is connected from the connection terminal to the electric cable through the bent portion and the rear piece, and the connection point of the wiring to the connection terminal But Wherein either located at a position other than the most proximate position with respect to the bent portion, or the extending direction of the wiring in the connection point is a direction away from a direction parallel or the bent portion to the bent portion.
The connection position of the wiring with respect to the connection terminal may be a position farthest from the bent portion, and the extending direction of the wiring at the connection location may be a direction away from the bent portion.
The extending direction of the wiring at the connection location is a direction away from the bent portion, and the separation distance between the position where the wiring is farthest from the bent portion and the connection location is 0.05 mm. It may be the above.
　本発明の第二態様に係る内視鏡は、上記態様に係る撮像モジュールを備える。 The endoscope according to the second aspect of the present invention includes the imaging module according to the above aspect.
　上記態様に係る撮像モジュールによれば、接続端子に対する配線の接続箇所の位置が、屈曲部の最近接位置以外の位置であるので、接続箇所と屈曲部との間に十分な距離が確保される。そのため、屈曲部を形成する際に接続箇所に大きな力が加えられるのを回避し、配線の破損（断線）を防ぐことができる。よって、接続信頼性を高めることができる。
　また、配線の破損が起きにくいため、フレキシブル配線基板の外形寸法を小さくしても、屈曲部に無理な力がかかることがない。よって、撮像モジュールの細径化を図ることができる。 According to the imaging module according to the above aspect, since the position of the connection portion of the wiring with respect to the connection terminal is a position other than the closest position of the bent portion, a sufficient distance is ensured between the connected portion and the bent portion. . Therefore, it is possible to avoid applying a large force to the connection portion when forming the bent portion, and to prevent damage (disconnection) of the wiring. Therefore, connection reliability can be improved.
In addition, since the wiring is not easily damaged, an excessive force is not applied to the bent portion even if the outer dimensions of the flexible wiring board are reduced. Therefore, the diameter of the imaging module can be reduced.
本発明の第１の実施形態に係る撮像モジュールに用いられるフレキシブル配線基板及び固体撮像素子を模式的に示す側断面図である。It is a sectional side view which shows typically the flexible wiring board and solid-state image sensor which are used for the imaging module which concerns on the 1st Embodiment of this invention. 図１Ａに示すフレキシブル配線基板を示す平面図である。It is a top view which shows the flexible wiring board shown to FIG. 1A. 本発明の第１の実施形態に係る撮像モジュールの先端部の一部を示す断面図である。It is sectional drawing which shows a part of front-end | tip part of the imaging module which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る撮像モジュール及び前記撮像モジュールを用いて組み立てた内視鏡の先端構造を示す断面図である。It is sectional drawing which shows the front-end | tip structure of the endoscope assembled using the imaging module which concerns on the 1st Embodiment of this invention, and the said imaging module. 撮像モジュールの先端部の他の例の一部を示す断面図である。It is sectional drawing which shows a part of other example of the front-end | tip part of an imaging module. 本発明の第２の実施形態に係る撮像モジュールに用いられるフレキシブル配線基板を示す平面図である。It is a top view which shows the flexible wiring board used for the imaging module which concerns on the 2nd Embodiment of this invention. フレキシブル配線基板の第１の変形例を示す平面図である。It is a top view which shows the 1st modification of a flexible wiring board. フレキシブル配線基板の第２の変形例を示す平面図である。It is a top view which shows the 2nd modification of a flexible wiring board. フレキシブル配線基板の第３の変形例を示す平面図である。It is a top view which shows the 3rd modification of a flexible wiring board.
　本発明の第１の実施形態について図１～図３を参照して説明する。図３は、第１の実施形態の撮像モジュール１００及び撮像モジュール１００を用いて組み立てた内視鏡１０１の先端構造を示す。図２は撮像モジュール１００の先端部の一部を示す断面図である。
　素子実装部１１におけるフレキシブル配線基板１０の長手方向をＤ１という。素子実装部１１の実装面１１ａに沿う面内でＤ１方向に直交する方向を短手方向Ｄ２という。
　図３において左側、すなわちフレキシブル配線基板１０に対して固体撮像素子４側を前側といい、その反対方向（図３において右側）を後側という。図２および図３は、前後方向および長手方向Ｄ１に対して垂直な方向から見た図である。 A first embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows the distal end structure of the endoscope 101 assembled using the imaging module 100 and the imaging module 100 of the first embodiment. FIG. 2 is a cross-sectional view showing a part of the tip portion of the imaging module 100.
The longitudinal direction of the flexible wiring board 10 in the element mounting portion 11 is referred to as D1. A direction orthogonal to the D1 direction in a plane along the mounting surface 11a of the element mounting portion 11 is referred to as a short direction D2.
In FIG. 3, the left side, that is, the solid-state imaging device 4 side with respect to the flexible wiring board 10 is referred to as a front side, and the opposite direction (right side in FIG. 3) is referred to as a rear side. 2 and 3 are views seen from a direction perpendicular to the front-rear direction and the longitudinal direction D1.
　図３に示すように、撮像モジュール１００は、電気ケーブル１の導体２の先端に、撮像部３を有する固体撮像素子４を実装したフレキシブル配線基板１０（ＦＰＣ）を電気的に接続して取り付けて構成されている。
　固体撮像素子４としては、例えばＣＭＯＳ（相補型金属酸化膜半導体）を好適に用いることができる。固体撮像素子４は、フレキシブル配線基板１０を介して、電気ケーブル１と電気的に接続されている。 As shown in FIG. 3, the imaging module 100 has a flexible wiring board 10 (FPC) on which a solid-state imaging device 4 having an imaging unit 3 is mounted and connected to the tip of a conductor 2 of an electric cable 1. It is configured.
As the solid-state imaging element 4, for example, a CMOS (complementary metal oxide semiconductor) can be suitably used. The solid-state imaging element 4 is electrically connected to the electric cable 1 through the flexible wiring board 10.
　フレキシブル配線基板１０は、固体撮像素子４が前側の実装面１１ａに実装される素子実装部１１と、素子実装部１１の両端部で屈曲されて後側へ延出された２つの後片部１２、１３とを有する。
　フレキシブル配線基板１０は、素子実装部１１の両端部（屈曲部１０Ａ）で折り曲げて後側へ延出させることにより、２つの後片部１２、１３が形成される。 The flexible wiring board 10 includes an element mounting portion 11 on which the solid-state imaging device 4 is mounted on the front mounting surface 11a, and two rear piece portions 12 that are bent at both ends of the element mounting portion 11 and extended to the rear side. , 13.
The flexible wiring board 10 is bent at both end portions (bending portion 10 </ b> A) of the element mounting portion 11 and extended to the rear side, whereby two rear piece portions 12 and 13 are formed.
　フレキシブル配線基板１０は、例えば、片側配線タイプのフレキシブル配線基板である。すなわち、フレキシブル配線基板１０は、図２に示すように、フィルム状に形成された電気絶縁性の絶縁基材１０ａの片面側に形成された配線１４が、電気絶縁性のレジスト膜１０ｂ（被覆層、例えばソルダーレジスト）によって覆われた構造である。絶縁基材１０ａは例えばポリイミドから形成され、配線１４は例えば銅から形成される。
　フレキシブル配線基板１０では、３つの層のうち２層目に配線１４があるため、曲げが加えられた場合においても、配線１４を曲げ中立点に位置させ、配線１４に過大な力が加えられるのを回避することができる。 The flexible wiring board 10 is a one-side wiring type flexible wiring board, for example. That is, as shown in FIG. 2, the flexible wiring board 10 includes a wiring 14 formed on one side of an insulating base material 10 a formed in a film shape, and an electrically insulating resist film 10 b (covering layer). For example, a solder resist). The insulating base material 10a is made of polyimide, for example, and the wiring 14 is made of copper, for example.
In the flexible wiring board 10, the wiring 14 is in the second layer among the three layers, so that even when bending is performed, the wiring 14 is positioned at the bending neutral point, and an excessive force is applied to the wiring 14. Can be avoided.
　実装部背面１１ｂは、素子実装部１１の実装面１１ａとは反対の面である。
　実装面１１ａは、電気ケーブル１の先端の軸線（または電気ケーブル１の先端の軸線の延長線）の方向と交差する。実装面１１ａは、電気ケーブル１の先端の軸線方向と直交（または略直交）していることが好ましい。 The mounting portion back surface 11 b is a surface opposite to the mounting surface 11 a of the element mounting portion 11.
The mounting surface 11a intersects the direction of the axis of the tip of the electric cable 1 (or the extension of the axis of the tip of the electric cable 1). The mounting surface 11 a is preferably orthogonal (or substantially orthogonal) to the axial direction of the tip of the electric cable 1.
　図３に示すように、後片部１２、１３の外側面１２ｂ、１３ｂ（外面）には、それぞれパッド状の導体用端子部１２ｃ、１２ｄ、１３ｃ、１３ｄが設けられている。導体用端子部１２ｃ、１２ｄ、１３ｃ、１３ｄには、電気ケーブル１の外被５から口出しされた導体２の内部導体２ａと、外部導体２ｂとがそれぞれ電気的に接続されている。 As shown in FIG. 3, pad-shaped conductor terminal portions 12c, 12d, 13c, and 13d are provided on the outer surfaces 12b and 13b (outer surfaces) of the rear piece portions 12 and 13, respectively. The conductor terminal portions 12c, 12d, 13c, and 13d are electrically connected to the inner conductor 2a of the conductor 2 and the outer conductor 2b that are led out from the jacket 5 of the electric cable 1, respectively.
　電気ケーブル１では、複数本の導体２が外被５によって一括被覆されることで、ケーブルユニットが構成されている。
　導体２は、内部導体２ａと、内部導体２ａを被覆する一次被覆層２ｃと、金属細線によって網状に形成され一次被覆層２ｃの周囲に設けられた外部導体２ｂと、当該外部導体２ｂを被覆する二次被覆層２ｄとを有する。 In the electric cable 1, a plurality of conductors 2 are collectively covered with an outer jacket 5 to constitute a cable unit.
The conductor 2 covers the inner conductor 2a, a primary coating layer 2c that covers the inner conductor 2a, an outer conductor 2b that is formed in a net shape by fine metal wires and is provided around the primary coating layer 2c, and the outer conductor 2b. A secondary coating layer 2d.
　図２および図３に示すように、撮像部３は固体撮像素子４に形成された電気回路を介して、フレキシブル配線基板１０の配線１４と電気的に接続されている。
　固体撮像素子４は、撮像部３が搭載されている表面とは反対の裏面に、固体撮像素子４の電気回路と電気的に接続されたバンプ４ａを有する。バンプ４ａは、例えばはんだバンプ、スタッドバンプ、めっきバンプ等である。
　固体撮像素子４は、フリップチップ方式で、フレキシブル配線基板１０の素子実装部１１の実装面１１ａに形成された接続端子１９（図１Ａ及び図１Ｂ参照）にバンプ４ａを接合固定することにより、フレキシブル配線基板１０の配線１４と電気的に接続されている。 As shown in FIGS. 2 and 3, the imaging unit 3 is electrically connected to the wiring 14 of the flexible wiring board 10 through an electrical circuit formed on the solid-state imaging device 4.
The solid-state image pickup device 4 has bumps 4 a electrically connected to the electric circuit of the solid-state image pickup device 4 on the back surface opposite to the front surface on which the image pickup unit 3 is mounted. The bump 4a is, for example, a solder bump, a stud bump, a plating bump, or the like.
The solid-state imaging device 4 is a flip-chip type, and is flexible by bonding and fixing bumps 4a to connection terminals 19 (see FIGS. 1A and 1B) formed on the mounting surface 11a of the element mounting portion 11 of the flexible wiring board 10. The wiring board 10 is electrically connected to the wiring 14.
　図３に示すように、フレキシブル配線基板１０の素子実装部１１は、フレキシブル配線基板１０の配線１４を介して、各導体用端子部１２ｃ、１２ｄ、１３ｃ、１３ｄと電気的に接続されている。これによって固体撮像素子４の電気回路と、電気ケーブル１の導体２とが配線１４を介して電気的に接続される。
　配線１４は、接続端子１９から屈曲部１０Ａを通って後片部１２、１３を経て導体２に接続されている。 As shown in FIG. 3, the element mounting portion 11 of the flexible wiring board 10 is electrically connected to the conductor terminal portions 12 c, 12 d, 13 c, and 13 d through the wiring 14 of the flexible wiring board 10. As a result, the electric circuit of the solid-state imaging device 4 and the conductor 2 of the electric cable 1 are electrically connected via the wiring 14.
The wiring 14 is connected to the conductor 2 from the connection terminal 19 through the bent portion 10 </ b> A through the rear pieces 12 and 13.
　撮像モジュール１００におけるフレキシブル配線基板１０の後片部１２、１３の全体は、電気絶縁性を有する絶縁チューブ１５に覆われている。
　絶縁チューブ１５は、例えばシリコーン樹脂から形成される筒状部材あり、電気ケーブル１の導体２やフレキシブル配線基板１０に対して低摩擦で円滑にスライド移動させることができる点で好適である。
　この絶縁チューブ１５は、絶縁チューブ１５の内側に充填されかつ硬化された内層樹脂１６によって、絶縁チューブ１５の内側のフレキシブル配線基板１０及び導体２に対して固定、一体化されている。 The entire rear pieces 12 and 13 of the flexible wiring board 10 in the imaging module 100 are covered with an insulating tube 15 having electrical insulation.
The insulating tube 15 is a cylindrical member formed of, for example, a silicone resin, and is suitable in that it can be smoothly slid with respect to the conductor 2 of the electric cable 1 and the flexible wiring board 10 with low friction.
The insulating tube 15 is fixed and integrated with the flexible wiring board 10 and the conductor 2 inside the insulating tube 15 by an inner layer resin 16 filled and cured inside the insulating tube 15.
　フレキシブル配線基板１０の各後片部１２、１３には、それぞれ、導体用端子部１２ｃ、１３ｃに導体２の導体２ａをはんだ付けした導体接続部１７ａ、及び導体用端子部１２ｄ、１３ｄに導体２の導体２ｂをはんだ付けした導体接続部１７ｂが形成されている。 In each of the rear pieces 12 and 13 of the flexible wiring board 10, a conductor connecting portion 17a in which the conductor 2a of the conductor 2 is soldered to the conductor terminal portions 12c and 13c, and a conductor 2 to the conductor terminal portions 12d and 13d, respectively. A conductor connecting portion 17b is formed by soldering the conductor 2b.
　撮像モジュール１００は、レンズユニット２０及び外枠部材２１をさらに装着することにより、内視鏡１０１が構成される。
　レンズユニット２０は、透明なカバー部材２２を介して撮像部３の受光面３ａに取り付けられる。
　外枠部材２１は、固体撮像素子４に固定したカバー部材２２及びレンズユニット２０とともに、撮像モジュール１００の先端を収容する、例えば円筒状等の部材である。 In the imaging module 100, the endoscope 101 is configured by further mounting the lens unit 20 and the outer frame member 21.
The lens unit 20 is attached to the light receiving surface 3 a of the imaging unit 3 via a transparent cover member 22.
The outer frame member 21 is, for example, a cylindrical member that houses the tip of the imaging module 100 together with the cover member 22 and the lens unit 20 fixed to the solid-state imaging device 4.
　レンズユニット２０は、円筒状の鏡筒２０ａ内に、対物レンズ（図示略）を組み込んだ部材であって、撮像部３の受光面３ａに光軸を位置合わせして、鏡筒２０ａの軸線方向の一端をカバー部材２２に固定している。
　レンズユニット２０は、撮像先端ユニットの前側から鏡筒２０ａ内のレンズを介して導いた光を、固体撮像素子４における撮像部３の受光面３ａに結像させる。 The lens unit 20 is a member in which an objective lens (not shown) is incorporated in a cylindrical lens barrel 20a. The lens unit 20 aligns the optical axis with the light receiving surface 3a of the imaging unit 3, and the axial direction of the lens barrel 20a. Is fixed to the cover member 22.
The lens unit 20 forms an image of light guided from the front side of the imaging tip unit through the lens in the lens barrel 20 a on the light receiving surface 3 a of the imaging unit 3 in the solid-state imaging device 4.
　外枠部材２１は、外枠部材２１の内側に充填されかつ硬化された外層樹脂２３によって、撮像モジュール１００の絶縁チューブ１５に接着固定されている。
　絶縁チューブ１５により、フレキシブル配線基板１０の２つの後片部１２、１３のそれぞれに形成された導体接続部１７ａ及び導体接続部１７ｂが、外枠部材２１に接触して短絡することが防止される。 The outer frame member 21 is bonded and fixed to the insulating tube 15 of the imaging module 100 by an outer layer resin 23 filled and cured inside the outer frame member 21.
The insulating tube 15 prevents the conductor connection portion 17a and the conductor connection portion 17b formed on each of the two rear pieces 12 and 13 of the flexible wiring board 10 from coming into contact with the outer frame member 21 and short-circuiting. .
　図３に示すように、フレキシブル配線基板１０の２つの後片部１２、１３は、素子実装部１１に対して屈曲されて形成された延出部１２ｅ、１３ｅと、延出部１２ｅ、１３ｅの延出端１２ｅ１、１３ｅ１から後側に延びる接続片部１２ｆ、１３ｆと、を有する。素子実装部１１と延出部１２ｅ、１３ｅとの間の屈曲した箇所を屈曲部１０Ａという。
　延出部１２ｅ、１３ｅは、素子実装部１１の両端部（長手方向Ｄ１の両端部）から、素子実装部１１から離れるに従って互いに接近するように延出している。延出部１２ｅ、１３ｅは、延出端１２ｅ１、１３ｅ１において互いに当接している。 As shown in FIG. 3, the two rear pieces 12 and 13 of the flexible wiring board 10 are formed by extending portions 12 e and 13 e formed by bending with respect to the element mounting portion 11, and extending portions 12 e and 13 e. And connecting piece portions 12f and 13f extending rearward from the extending ends 12e1 and 13e1. A bent portion between the element mounting portion 11 and the extending portions 12e and 13e is referred to as a bent portion 10A.
The extending portions 12e and 13e extend from both end portions (both end portions in the longitudinal direction D1) of the element mounting portion 11 so as to approach each other as the distance from the element mounting portion 11 increases. The extending portions 12e and 13e are in contact with each other at the extending ends 12e1 and 13e1.
　接続片部１２ｆ、１３ｆは、対向面１２ａ、１３ａ同士を互いに当接させた基板合わせ部２４を構成している。基板合わせ部２４では、接続片部１２ｆ、１３ｆは、対向面１２ａ、１３ａ間に介在された層間樹脂２４ａによって互いに接着される。 The connecting piece portions 12f and 13f constitute a substrate matching portion 24 in which the opposing surfaces 12a and 13a are in contact with each other. In the board mating portion 24, the connecting piece portions 12f and 13f are bonded to each other by an interlayer resin 24a interposed between the opposing surfaces 12a and 13a.
　延出部１２ｅ、１３ｅと、素子実装部１１と、基板合わせ部２４とによって囲まれた基板内空間２５には接着樹脂Ｒが充填されている。延出部１２ｅ、１３ｅと素子実装部１１とは、接着樹脂Ｒを介して互いに接着固定される。 The in-substrate space 25 surrounded by the extending portions 12e, 13e, the element mounting portion 11, and the substrate mating portion 24 is filled with an adhesive resin R. The extending portions 12e and 13e and the element mounting portion 11 are bonded and fixed to each other via an adhesive resin R.
　フレキシブル配線基板１０の基板内空間２５に充填される接着樹脂Ｒは、素子実装部１１と後片部１２、１３とによって、全体として三角形（または略三角形）の形状を有するように形成することができる。屈曲部１０Ａに面する接着樹脂Ｒの角部は、断面略円弧形の湾曲凸面２６（図２参照）を有することが好ましい。 The adhesive resin R filled in the in-board space 25 of the flexible wiring board 10 may be formed by the element mounting portion 11 and the rear piece portions 12 and 13 so as to have a triangular (or substantially triangular) shape as a whole. it can. The corner portion of the adhesive resin R facing the bent portion 10A preferably has a curved convex surface 26 (see FIG. 2) having a substantially arc-shaped cross section.
　図２および図３に示すように、接着樹脂Ｒを囲むフレキシブル配線基板１０の外形寸法Ｌ１は、素子実装部１１の長手方向Ｄ１におけるフレキシブル配線基板１０の寸法（長さ）である。また、固体撮像素子４の外形寸法Ｌ２は、長手方向Ｄ１における固体撮像素子４の寸法（長さ）である。外形寸法Ｌ１と外形寸法Ｌ２はどちらが大きくてもよく、互いに同じ（外形寸法Ｌ１＝外形寸法Ｌ２）であってもよい。 2 and 3, the outer dimension L1 of the flexible wiring board 10 surrounding the adhesive resin R is the dimension (length) of the flexible wiring board 10 in the longitudinal direction D1 of the element mounting portion 11. The external dimension L2 of the solid-state image sensor 4 is the dimension (length) of the solid-state image sensor 4 in the longitudinal direction D1. Either the outer dimension L1 or the outer dimension L2 may be larger, and may be the same (outer dimension L1 = outer dimension L2).
　図２では、フレキシブル配線基板１０のＤ１方向の最外周縁は、固体撮像素子４のＤ１方向の最外周縁に比べ、Ｄ１方向の外側に位置している。そのため、フレキシブル配線基板１０の外形寸法Ｌ１は、固体撮像素子４の外形寸法Ｌ２より大きい。なお、Ｄ１方向の外側とは、図１Ｂに示す素子実装部１１の中央線Ｃ１から離れる方向寄り（図１Ｂおよび図２における右寄り（右方向））を意味する。
　図４に示すように、フレキシブル配線基板１０のＤ１方向の最外周縁は、固体撮像素子４のＤ１方向の最外周縁に比べ、Ｄ１方向の内側（図１Ｂに示す素子実装部１１の中央線Ｃ１寄り（Ｃ１に近い位置）。図１Ｂおよび図２では左寄り（左方向））に位置していてもよい。この場合には、フレキシブル配線基板１０の外形寸法Ｌ１は、固体撮像素子４の外形寸法Ｌ２より小さい。
　また、フレキシブル配線基板１０の最外周縁と、固体撮像素子４の最外周縁とは、Ｄ１方向の位置が同じであってもよい。その場合は、外形寸法Ｌ１と外形寸法Ｌ２とは等しくなる。 In FIG. 2, the outermost peripheral edge in the D1 direction of the flexible wiring board 10 is located outside the outermost peripheral edge in the D1 direction of the solid-state imaging device 4. Therefore, the outer dimension L1 of the flexible wiring board 10 is larger than the outer dimension L2 of the solid-state imaging element 4. The outer side in the direction D1 means a direction closer to the direction away from the center line C1 of the element mounting portion 11 shown in FIG. 1B (rightward in FIG. 1B and FIG. 2 (right direction)).
As shown in FIG. 4, the outermost peripheral edge in the D1 direction of the flexible wiring board 10 is the inner side in the D1 direction (the center line of the element mounting portion 11 shown in FIG. It may be located closer to C1 (position close to C1) and closer to the left (leftward in FIGS. 1B and 2). In this case, the outer dimension L1 of the flexible wiring board 10 is smaller than the outer dimension L2 of the solid-state imaging device 4.
Further, the outermost peripheral edge of the flexible wiring board 10 and the outermost peripheral edge of the solid-state imaging device 4 may have the same position in the D1 direction. In that case, the outer dimension L1 is equal to the outer dimension L2.
　図２に示すように、フレキシブル配線基板１０の最外周縁が固体撮像素子４の最外周縁よりも外側に位置している場合には、フレキシブル配線基板１０の最外周縁と固体撮像素子４の最外周縁とのＤ１方向の距離（図２に符号Ａ１で示す）は、例えば０～０.１００ｍｍとすることができる。
　図４に示すように、フレキシブル配線基板１０の最外周縁が固体撮像素子４の最外周縁よりも内側に位置している場合には、フレキシブル配線基板１０の最外周縁と固体撮像素子４の最外周縁とのＤ１方向の距離（図４に符号Ａ５で示す）は、例えば０～０. １９５ｍｍとすることができる。 As shown in FIG. 2, when the outermost peripheral edge of the flexible wiring substrate 10 is located outside the outermost peripheral edge of the solid-state imaging element 4, the outermost peripheral edge of the flexible wiring board 10 and the solid-state imaging element 4 The distance in the D1 direction from the outermost peripheral edge (indicated by reference numeral A1 in FIG. 2) can be, for example, 0 to 0.100 mm.
As shown in FIG. 4, when the outermost peripheral edge of the flexible wiring board 10 is located inside the outermost peripheral edge of the solid-state imaging element 4, the outermost peripheral edge of the flexible wiring board 10 and the solid-state imaging element 4 The distance in the D1 direction from the outermost peripheral edge (indicated by reference numeral A5 in FIG. 4) can be, for example, 0 to 0.195 mm.
　フレキシブル配線基板１０の屈曲部１０Ａの内側半径（図２に符号Ａ２で示す）は、例えば０．０５ｍｍ以上とすることができる。内側半径Ａ２をこの範囲（０．０５ｍｍ以上）とすることによって、屈曲部１０Ａにおける断線を起こりにくくすることができる。
　内側半径Ａ２は、例えば０．１０ｍｍ以下とすることができる。内側半径Ａ２をこの範囲（０．１０ｍｍ以下）とすることによって、先端部１８の細径化を図ることができる。 The inner radius (indicated by symbol A2 in FIG. 2) of the bent portion 10A of the flexible wiring board 10 can be set to 0.05 mm or more, for example. By setting the inner radius A2 within this range (0.05 mm or more), it is possible to prevent disconnection at the bent portion 10A.
The inner radius A2 can be set to 0.10 mm or less, for example. By setting the inner radius A2 within this range (0.10 mm or less), the tip 18 can be reduced in diameter.
　固体撮像素子４が実装されるフレキシブル配線基板１０上のバンプ４ａの最外周縁（図２の右端）から、屈曲部１０ＡのＤ１方向の最内周縁までのＤ１方向における距離（図２に符号Ａ３で示す）は、例えば０～０．２９５ｍｍとすることができる。距離Ａ３をこの範囲（０～０．２９５ｍｍ）とすることによって、先端部１８の細径化を図ることができる。
　固体撮像素子４が実装されるフレキシブル配線基板１０上のバンプ４ａの最外周縁（図２の右端）と、固体撮像素子４のＤ１方向の最外周縁（図２の右端）と、の間のＤ１方向の距離（図２に符号Ａ４で示す）は、例えば０．１０～０．２４５ｍｍとすることができる。
　なお、図２では、フレキシブル配線基板１０はレジスト膜１０ｂを有するが、外枠部材２１に対して短絡が生じなければ、レジスト膜１０ｂはなくてもよい。 The distance in the D1 direction (reference numeral A3 in FIG. 2) from the outermost peripheral edge (right end in FIG. 2) of the bump 4a on the flexible wiring board 10 on which the solid-state imaging device 4 is mounted to the innermost peripheral edge in the D1 direction of the bent portion 10A. Can be set to, for example, 0 to 0.295 mm. By setting the distance A3 within this range (0 to 0.295 mm), the diameter of the tip 18 can be reduced.
Between the outermost peripheral edge (right end in FIG. 2) of the bump 4a on the flexible wiring board 10 on which the solid-state imaging element 4 is mounted and the outermost peripheral edge in the D1 direction of the solid-state imaging element 4 (right end in FIG. 2). The distance in the D1 direction (indicated by reference numeral A4 in FIG. 2) can be set to 0.10 to 0.245 mm, for example.
In FIG. 2, the flexible wiring substrate 10 includes the resist film 10 b, but the resist film 10 b may be omitted if no short circuit occurs with respect to the outer frame member 21.
　図１Ａは、屈曲されていない状態のフレキシブル配線基板１０及び固体撮像素子４を模式的に示す側断面図である。図１Ｂは、屈曲されていない状態のフレキシブル配線基板１０を示す平面図である。
　一対の屈曲部１０Ａ，１０Ａのうち、一方の屈曲部１０Ａ（図１Ａおよび図１Ｂに示す左側の屈曲部１０Ａ）を屈曲部（第１の屈曲部）１０Ａ１といい、他方の屈曲部１０Ａ（右側の屈曲部１０Ａ）を屈曲部（第２の屈曲部）１０Ａ２という。 FIG. 1A is a side sectional view schematically showing the flexible wiring board 10 and the solid-state imaging device 4 in a state where they are not bent. FIG. 1B is a plan view showing the flexible wiring board 10 in an unbent state.
Of the pair of bent portions 10A, 10A, one bent portion 10A (the left bent portion 10A shown in FIGS. 1A and 1B) is called a bent portion (first bent portion) 10A1, and the other bent portion 10A (right side) The bent portion 10A) is referred to as a bent portion (second bent portion) 10A2.
　図１Ｂに示すように、実装面１１ａには、一対の接続端子１９（１９ａ，１９ｂ）と、接続端子１９（１９ａ，１９ｂ）からＤ２方向に間隔をおいて設けられた一対の接続端子１９(１９ｃ，１９ｄ)とが形成されている。
　一対の接続端子１９（１９ａ，１９ｂ）は、Ｄ１方向に互いに間隔をおいて形成されている。一対の接続端子１９（１９ｃ，１９ｄ）も、Ｄ１方向に互いに間隔をおいて形成されている。 As shown in FIG. 1B, on the mounting surface 11a, a pair of connection terminals 19 (19a, 19b) and a pair of connection terminals 19 (disposed in the D2 direction from the connection terminals 19 (19a, 19b)) ( 19c, 19d).
The pair of connection terminals 19 (19a, 19b) are formed at a distance from each other in the D1 direction. The pair of connection terminals 19 (19c, 19d) are also formed at a distance from each other in the D1 direction.
　接続端子１９ａ，１９ｃと接続端子１９ｂ，１９ｄとは、例えば実装面１１ａの長手方向の中央線Ｃ１を挟んで一方側（第１方向）および他方側（第２方向）に位置する。接続端子１９ａ，１９ｃと接続端子１９ｂ，１９ｄとは、中央線Ｃ１を挟んで線対称となる位置にあることが好ましい。
　接続端子１９ａ，１９ｂと接続端子１９ｃ，１９ｄとは、例えば実装面１１ａの短手方向の中央線Ｃ２を挟んで一方側（第１方向）および他方側（第２方向）に位置する。接続端子１９ａ，１９ｂと接続端子１９ｃ，１９ｄとは、例えば中央線Ｃ２を挟んで線対称となる位置にあることが好ましい。 The connection terminals 19a and 19c and the connection terminals 19b and 19d are positioned on one side (first direction) and the other side (second direction), for example, across the center line C1 in the longitudinal direction of the mounting surface 11a. The connection terminals 19a and 19c and the connection terminals 19b and 19d are preferably in positions that are line-symmetric with respect to the center line C1.
The connection terminals 19a and 19b and the connection terminals 19c and 19d are located on one side (first direction) and the other side (second direction), for example, across the center line C2 in the short direction of the mounting surface 11a. The connection terminals 19a and 19b and the connection terminals 19c and 19d are preferably in positions that are line-symmetric with respect to the center line C2, for example.
　接続端子１９の平面視形状は、例えば円形、矩形等としてよい。図１Ｂでは接続端子１９は平面視円形に形成されている。
　図１Ａに示すように、接続端子１９には、固体撮像素子４のバンプ４ａが接合されることにより、固体撮像素子４が電気的に接続される。 The plan view shape of the connection terminal 19 may be, for example, a circle or a rectangle. In FIG. 1B, the connection terminal 19 is formed in a circular shape in plan view.
As shown in FIG. 1A, the solid-state imaging device 4 is electrically connected to the connection terminal 19 by bonding the bumps 4 a of the solid-state imaging device 4.
　図１Ｂに示すように、接続端子１９（１９ａ～１９ｄ）には、それぞれ配線１４（１４ａ～１４ｄ）が接続される。
　接続端子１９に対する配線１４の接続箇所２７の位置は、（当該配線１４が通る）屈曲部１０Ａに対して最も近接した位置２８ａ（最近接位置２８ａ）以外の位置とされる。図１Ｂでは、接続箇所２７は、（当該配線１４が通る）屈曲部１０Ａから最も離間した位置２８ｂ（最離間位置２８ｂ）にある。
　例えば、接続端子１９ａに対する配線１４ａの接続箇所２７の位置は、第１の屈曲部１０Ａ１（図１Ｂの左側の屈曲部１０Ａ）に対して最も近接した位置２８ａ（最近接位置２８ａ）以外の位置とされる。図１Ｂでは、接続箇所２７は、第１の屈曲部１０Ａ１から最も離間した位置２８ｂ（最離間位置２８ｂ）にある。 As shown in FIG. 1B, wirings 14 (14a to 14d) are connected to the connection terminals 19 (19a to 19d), respectively.
The position of the connection portion 27 of the wiring 14 with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) closest to the bent portion 10A (through which the wiring 14 passes). In FIG. 1B, the connection location 27 is located at a position 28b (the most separated position 28b) farthest from the bent portion 10A (through which the wiring 14 passes).
For example, the position of the connection portion 27 of the wiring 14a with respect to the connection terminal 19a is a position other than the position 28a (the closest position 28a) closest to the first bent portion 10A1 (left bent portion 10A in FIG. 1B). Is done. In FIG. 1B, the connection location 27 is at a position 28b (the most spaced position 28b) farthest from the first bent portion 10A1.
　最離間位置２８ｂは、例えば、接続端子１９の中心を通りＤ１方向に沿う直線と、接続端子１９の周縁との２つの交点のうち、中央線Ｃ１に近い方の交点に相当する位置である。なお、最近接位置２８ａは、前記２つの交点のうち、当該配線１４が通る屈曲部１０Ａに近い方の交点に相当する位置である。 The farthest position 28b is, for example, a position corresponding to an intersection closer to the center line C1 out of two intersections between a straight line passing through the center of the connection terminal 19 and along the direction D1 and the peripheral edge of the connection terminal 19. The closest position 28a is a position corresponding to an intersection point closer to the bent portion 10A through which the wiring 14 passes among the two intersection points.
　配線１４は、接続端子１９に対する接続箇所２７から、Ｄ１方向内方（屈曲部１０Ａから離間する方向、すなわち中央線Ｃ１に近づく方向）に延出し、第１配線屈曲部３１でＤ２方向内方（中央線Ｃ２に近づく方向）に屈曲し、第２配線屈曲部３２でＤ１方向外方（屈曲部１０Ａに近づく方向）に屈曲し、屈曲部１０Ａを経て後片部１２、１３に至る。
　配線１４のうち、接続箇所２７から第１配線屈曲部３１までの部分を配線３３ａといい、第１配線屈曲部３１から第２配線屈曲部３２までの部分を配線３３ｂといい、第２配線屈曲部３２から屈曲部１０Ａまでの部分を配線３３ｃという。 The wiring 14 extends inward in the D1 direction (a direction away from the bent portion 10A, that is, a direction approaching the center line C1) from the connection portion 27 with respect to the connection terminal 19, and is inward in the D2 direction at the first wiring bent portion 31 ( Bending toward the center line C2), bending outward in the D1 direction (direction approaching the bending portion 10A) at the second wiring bending portion 32, and reaching the rear piece portions 12 and 13 via the bending portion 10A.
Of the wiring 14, a portion from the connection location 27 to the first wiring bent portion 31 is referred to as a wiring 33 a, and a portion from the first wiring bent portion 31 to the second wiring bent portion 32 is referred to as a wiring 33 b, and the second wiring bent. A portion from the portion 32 to the bent portion 10A is referred to as a wiring 33c.
　第１配線屈曲部３１から第２配線屈曲部３２までの配線３３ｂは、屈曲部１０Ａから最も離間した位置にある。配線３３ｂと、接続箇所２７とのＤ１方向（屈曲部１０Ａから離間する方向）の距離Ｌ３は、０．０５ｍｍ以上であることが好ましい。これによって、屈曲部１０Ａを形成する際に接続箇所２７に大きな力が加えられるのを回避し、配線１４の破損（断線）を起こりにくくすることができる。 The wiring 33b from the first wiring bent portion 31 to the second wiring bent portion 32 is at a position farthest from the bent portion 10A. The distance L3 between the wiring 33b and the connection location 27 in the D1 direction (direction away from the bent portion 10A) is preferably 0.05 mm or more. Accordingly, it is possible to prevent a large force from being applied to the connection portion 27 when the bent portion 10A is formed, and it is possible to prevent the wiring 14 from being damaged (disconnected).
　撮像モジュール１００は、例えば、次のようにして製造される。
　フレキシブル配線基板１０の実装部背面１１ｂに折り曲げ治具（図示略）を配置する。
　フレキシブル配線基板１０の実装面１１ａ上に設置された固体撮像素子４の表面を上方から押さえる。
　フレキシブル配線基板１０の素子実装部１１の両端部（屈曲部１０Ａ）を屈曲させて延出部１２ｅ、１３ｅを形成する。フレキシブル配線基板１０の接続片部１２ｆ、１３ｆを接着剤により接着する。これにより、フレキシブル配線基板１０の基板合わせ部２４を形成する（図３参照）。
　フレキシブル配線基板１０の素子実装部１１と後片部１２、１３との間に挿入されている折り曲げ治具（図示略）を外し、基板内空間２５に接着樹脂Ｒを充填した後、接着樹脂Ｒを硬化させる。 The imaging module 100 is manufactured as follows, for example.
A bending jig (not shown) is arranged on the mounting portion rear surface 11 b of the flexible wiring board 10.
The surface of the solid-state imaging device 4 installed on the mounting surface 11a of the flexible wiring board 10 is pressed from above.
Extending portions 12e and 13e are formed by bending both end portions (bending portion 10A) of the element mounting portion 11 of the flexible wiring board 10. The connection pieces 12f and 13f of the flexible wiring board 10 are bonded with an adhesive. Thereby, the board | substrate matching part 24 of the flexible wiring board 10 is formed (refer FIG. 3).
A bending jig (not shown) inserted between the element mounting portion 11 and the rear piece portions 12 and 13 of the flexible wiring board 10 is removed, and the substrate resin space R is filled with the adhesive resin R, and then the adhesive resin R Is cured.
　撮像モジュール１００では、接続端子１９に対する配線１４の接続箇所２７の位置は、最近接位置２８ａ以外の位置（詳しくは最離間位置２８ｂ）とされているので、接続箇所２７と屈曲部１０Ａとの間に十分な距離が確保される。そのため、屈曲部１０Ａを形成する際に接続箇所２７に大きな力が加えられるのを回避し、配線１４の破損（断線）を防ぐことができる。よって、接続信頼性を高めることができる。
　また、配線１４の破損が起きにくいため、フレキシブル配線基板１０の外形寸法を小さくしても、屈曲部１０Ａに無理な力がかかることがない。よって、撮像モジュール１００の細径化を図ることができる。 In the imaging module 100, the position of the connection portion 27 of the wiring 14 with respect to the connection terminal 19 is a position other than the closest position 28a (specifically, the most distant position 28b), and therefore between the connection portion 27 and the bent portion 10A. A sufficient distance is secured. Therefore, it is possible to prevent a large force from being applied to the connection portion 27 when forming the bent portion 10A, and to prevent the wiring 14 from being damaged (disconnected). Therefore, connection reliability can be improved.
In addition, since the wiring 14 is not easily damaged, even if the outer dimension of the flexible wiring board 10 is reduced, an excessive force is not applied to the bent portion 10A. Therefore, the diameter of the imaging module 100 can be reduced.
　図５は、本発明の第２の実施形態に係る撮像モジュールに用いられるフレキシブル配線基板１１０を示す平面図である。図５は、屈曲されていない状態のフレキシブル配線基板１１０を示す。
　図５に示すように、フレキシブル配線基板１１０は、配線の形態が、第１の実施形態のフレキシブル配線基板１０と異なる。以下、既出の実施形態と同様の構成要素については、同じ符号を付してその説明を簡略化あるいは省略する。 FIG. 5 is a plan view showing the flexible wiring board 110 used in the imaging module according to the second embodiment of the present invention. FIG. 5 shows the flexible wiring board 110 in an unbent state.
As shown in FIG. 5, the flexible wiring board 110 is different from the flexible wiring board 10 of the first embodiment in the form of wiring. Hereinafter, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
　実装面１１ａには、Ｄ１方向に沿う一対の主配線１１４，１１４が形成されている。主配線１１４，１１４は、Ｄ２方向に間隔をおいて形成されている。主配線１１４，１１４は、接続端子１９ａと接続端子１９ｃとの間、および、接続端子１９ｂと接続端子１９ｄとの間を通って形成されている。 A pair of main wirings 114, 114 are formed along the direction D1 on the mounting surface 11a. The main wirings 114 and 114 are formed at intervals in the D2 direction. The main wirings 114 and 114 are formed between the connection terminal 19a and the connection terminal 19c and between the connection terminal 19b and the connection terminal 19d.
　接続端子１９ａ，１９ｃには、それぞれ配線１１５ａ，１１５ｃが接続される。
　接続端子１９に対する配線１１５ａ，１１５ｃの接続箇所１２７の位置は、一方の屈曲部（第１の屈曲部）１０Ａ１に対して最も近接した位置２８ａ（最近接位置２８ａ）以外の位置とされる。
　図５では、接続位置は、第１の屈曲部１０Ａ１から最も離間した位置２８ｂ（最離間位置２８ｂ）である。 Wires 115a and 115c are connected to the connection terminals 19a and 19c, respectively.
The position of the connection portion 127 of the wirings 115a and 115c with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) closest to the one bent portion (first bent portion) 10A1.
In FIG. 5, the connection position is a position 28b (the most separated position 28b) that is farthest from the first bent portion 10A1.
　配線１１５ａ，１１５ｃは、接続端子１９に対する接続箇所１２７から、Ｄ１方向内方（屈曲部１０Ａ１から離間する方向、すなわち中央線Ｃ１に近づく方向）に延出し、第１配線屈曲部１３１でＤ２方向外方（中央線Ｃ２から離間する方向）に屈曲し、第２配線屈曲部１３２でＤ１方向外方（屈曲部１０Ａ１に近づく方向）に屈曲し、屈曲部１０Ａ１を経て、後片部１２、１３のうち一方に至る。 The wirings 115a and 115c extend from the connection portion 127 to the connection terminal 19 inward in the D1 direction (a direction away from the bent portion 10A1, that is, a direction approaching the center line C1). Bend outward (in the direction away from the center line C2), bend outward in the D1 direction (direction approaching the bent portion 10A1) at the second wiring bent portion 132, pass through the bent portion 10A1, and then the rear piece portions 12 and 13 One of them.
　接続端子１９ｂ，１９ｄには、それぞれ配線１１５ｂ，１１５ｄが接続される。
　接続端子１９に対する配線１１５ｂ，１１５ｄの接続箇所１２７の位置は、他方の屈曲部（第２の屈曲部）１０Ａ２に対して最も近接した位置２８ａ（最近接位置２８ａ）以外の位置とされる。
　図５では、接続箇所１２７は、第２の屈曲部１０Ａ２から最も離間した位置２８ｂ（最離間位置２８ｂ）にある。 Wires 115b and 115d are connected to the connection terminals 19b and 19d, respectively.
The position of the connection portion 127 of the wirings 115b and 115d with respect to the connection terminal 19 is a position other than the position 28a (the closest position 28a) that is closest to the other bent portion (second bent portion) 10A2.
In FIG. 5, the connection location 127 is at a position 28b (the most spaced position 28b) farthest from the second bent portion 10A2.
　配線１１５ｂ，１１５ｄは、接続端子１９に対する接続箇所１２７から、Ｄ１方向内方（屈曲部１０Ａ２から離間する方向、すなわち中央線Ｃ１に近づく方向）に延出し、第１配線屈曲部１３３でＤ２方向内方（中央線Ｃ２に近づく方向）に屈曲し、主配線１１４，１１４に接続されている。 The wirings 115b and 115d extend inward in the D1 direction (a direction away from the bent portion 10A2, that is, a direction approaching the center line C1) from the connection portion 127 with respect to the connection terminal 19, and the first wiring bent portion 133 is in the D2 direction. (In a direction approaching the center line C2) and is connected to the main wirings 114, 114.
　フレキシブル配線基板１１０では、すべての接続端子１９（１９ａ～１９ｄ）が、第１の屈曲部１０Ａ１を通る配線（配線１１５ａ，１１５ｃおよび主配線１１４，１１４）に接続されているため、後片部１２、１３のうち一方に配線を集中できる。そのため、撮像モジュール１００の内部構造を簡略にできる。 In the flexible wiring board 110, all the connection terminals 19 (19a to 19d) are connected to the wiring (wirings 115a and 115c and the main wirings 114 and 114) passing through the first bent portion 10A1, and therefore the rear piece 12 , 13 can concentrate wiring on one side. Therefore, the internal structure of the imaging module 100 can be simplified.
　図６は、フレキシブル配線基板１０の第１の変形例を示す平面図である。
　ここに示すフレキシブル配線基板１２０では、接続端子１９（１９ａ～１９ｄ）には、それぞれ配線１２４（１２４ａ～１２４ｄ）が接続される。
　接続端子１９に対する配線１２４の接続箇所１３７の位置は、最離間位置２８ｂ（図１Ｂ参照）よりもＤ２方向内方寄りの位置である。詳しくは、接続箇所１３７は、接続端子１９の中心を通り、かつＤ１方向に対して傾斜した直線（例えばＤ１方向に対して約４５°傾いた直線）と、接続端子１９の周縁との２つの交点のうち、中央線Ｃ１に近い方の交点に相当する位置である。 FIG. 6 is a plan view showing a first modification of the flexible wiring board 10.
In the flexible wiring board 120 shown here, the wirings 124 (124a to 124d) are connected to the connection terminals 19 (19a to 19d), respectively.
The position of the connection portion 137 of the wiring 124 with respect to the connection terminal 19 is a position closer to the inside in the D2 direction than the most distant position 28b (see FIG. 1B). Specifically, the connection location 137 includes two lines, a straight line that passes through the center of the connection terminal 19 and is inclined with respect to the D1 direction (for example, a straight line that is inclined approximately 45 ° with respect to the D1 direction) It is a position corresponding to the intersection closer to the center line C1 among the intersections.
　配線１２４は、接続箇所１３７から、中央線Ｃ１に近づくほど中央線Ｃ２に近づくように傾斜して延出し、第１配線屈曲部１４１でＤ１方向外方（屈曲部１０Ａに近づく方向）に屈曲し、屈曲部１０Ａを経て後片部１２、１３に至る。
　接続箇所１３７から第１配線屈曲部１４１に至る配線１２４の延在方向は、屈曲部１０Ａから離間する方向である。 The wiring 124 extends from the connection location 137 so as to approach the center line C2 as it approaches the center line C1, and bends outward in the D1 direction (direction approaching the bent portion 10A) at the first wiring bent portion 141. Through the bent portion 10A, the rear piece portions 12 and 13 are reached.
The extending direction of the wiring 124 from the connection location 137 to the first wiring bent portion 141 is a direction away from the bent portion 10A.
　図７は、フレキシブル配線基板１０の第２の変形例を示す平面図である。
　ここに示すフレキシブル配線基板１３０では、接続端子１９（１９ａ～１９ｄ）には、それぞれ配線１３４（１３４ａ～１３４ｄ）が接続される。
　接続端子１９に対する配線１３４の接続箇所１４７の位置は、図６の接続箇所１３７よりもさらにＤ２方向内方寄りの位置である。詳しくは、接続箇所１４７は、接続端子１９の中心を通り、かつＤ２方向に沿う直線と、接続端子１９の周縁との２つの交点のうち、中央線Ｃ２に近い方の交点に相当する位置である。接続箇所１４７は、接続端子１９のＤ１方向の中央の位置であり、最も中央線Ｃ２に近接した位置にある。 FIG. 7 is a plan view showing a second modification of the flexible wiring board 10.
In the flexible wiring board 130 shown here, wirings 134 (134a to 134d) are connected to the connection terminals 19 (19a to 19d), respectively.
The position of the connection part 147 of the wiring 134 with respect to the connection terminal 19 is a position further inward in the D2 direction than the connection part 137 of FIG. Specifically, the connection point 147 passes through the center of the connection terminal 19 and is a position corresponding to the intersection closer to the center line C2 out of the two intersections of the straight line along the direction D2 and the peripheral edge of the connection terminal 19. is there. The connection location 147 is the center position of the connection terminal 19 in the direction D1, and is closest to the center line C2.
　配線１３４は、接続箇所１４７から、Ｄ２方向に沿って中央線Ｃ２に近づくように延出し、第１配線屈曲部１５１でＤ１方向外方（屈曲部１０Ａに近づく方向）に屈曲し、屈曲部１０Ａを経て後片部１２、１３に至る。
　接続箇所１４７から第１配線屈曲部１５１に至る配線１３４の延在方向は、屈曲部１０Ａと平行である。 The wiring 134 extends from the connection portion 147 so as to approach the center line C2 along the D2 direction, and is bent outward in the D1 direction (direction approaching the bending portion 10A) by the first wiring bending portion 151. To reach the rear piece 12, 13.
The extending direction of the wiring 134 from the connection location 147 to the first wiring bent portion 151 is parallel to the bent portion 10A.
　図８は、フレキシブル配線基板１０の第３の変形例を示す平面図である。
　ここに示すフレキシブル配線基板１５０では、接続端子１９（１９ａ～１９ｄ）には、それぞれ配線１５４（１５４ａ～１５４ｄ）が接続される。
　接続端子１９に対する配線１５４の接続箇所１６７の位置は、最近接位置２８ａである。
　配線１５４は、接続箇所１６７から、Ｄ２方向に沿って中央線Ｃ２に近づくように延出し、第１配線屈曲部１６１でＤ１方向外方（屈曲部１０Ａに近づく方向）に屈曲し、屈曲部１０Ａを経て後片部１２、１３に至る。
　接続箇所１６７から第１配線屈曲部１６１に至る部分の配線１５４の延在方向は、屈曲部１０Ａと平行である。 FIG. 8 is a plan view showing a third modification of the flexible wiring board 10.
In the flexible wiring board 150 shown here, wirings 154 (154a to 154d) are connected to the connection terminals 19 (19a to 19d), respectively.
The position of the connection point 167 of the wiring 154 with respect to the connection terminal 19 is the closest position 28a.
The wiring 154 extends from the connection location 167 so as to approach the center line C2 along the D2 direction, and is bent outward in the D1 direction (direction approaching the bent portion 10A) by the first wiring bent portion 161. To reach the rear piece 12, 13.
The extending direction of the wiring 154 in the portion from the connection location 167 to the first wiring bent portion 161 is parallel to the bent portion 10A.
　以上、本発明の実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計変更等も含まれる。 The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and design changes and the like within a scope not departing from the gist of the present invention are included.
　１…電気ケーブル
　４…固体撮像素子
　１０…フレキシブル配線基板
　１０Ａ，１０Ａ１，１０Ａ２…屈曲部
　１１…素子実装部
　１１ａ…実装面
　１２、１３…後片部
　１４，１１４，１２４，１３４，１５４…配線
　１９…接続端子
　２８ａ…最近接位置（屈曲部に対して最も近接した位置）
　２８ｂ…最離間位置（屈曲部から最も離間した位置）
　２７，１２７，１３７，１４７，１６７…接続箇所
　１００…撮像モジュール
　１０１…内視鏡
　Ｌ１…フレキシブル配線基板の外形寸法
　Ｌ２…固体撮像素子の外形寸法 DESCRIPTION OF SYMBOLS 1 ... Electric cable 4 ... Solid-state image sensor 10 ... Flexible wiring board 10A, 10A1, 10A2 ... Bending part 11 ... Element mounting part 11a ... Mounting surface 12, 13 ... Rear piece part 14, 114, 124, 134, 154 ... Wiring 19 ... Connection terminal 28a ... Closest position (position closest to the bent part)
28b ... the most distant position (the most distant position from the bent portion)
27, 127, 137, 147, 167 ... connection location 100 ... imaging module 101 ... endoscope L1 ... external dimensions of flexible wiring board L2 ... external dimensions of solid-state image sensor

Claims (4)

  1. 　撮像モジュールであって、
    　電気ケーブルと、撮像素子と、前記撮像素子と前記電気ケーブルとの間を電気的に接続した配線を有するフレキシブル配線基板と、を備え、
    　前記フレキシブル配線基板は、前記撮像素子を実装する素子実装部と、前記素子実装部の端部における屈曲部で屈曲されて前記撮像素子が設けられた位置とは反対の方向に延出する後片部とを有し、
    　前記素子実装部は、前記電気ケーブルの先端の軸線方向と交差する面であって前記撮像素子を実装する実装面を有し、
    　前記実装面は、前記配線が接続され、かつ前記撮像素子に電気的に接続される接続端子を有し、
    　前記配線は、前記接続端子から前記屈曲部を通って前記後片部を経て前記電気ケーブルに接続され、
    　前記接続端子に対する前記配線の接続箇所が、前記屈曲部に対して最も近接した位置以外の位置に配置されるか、または、前記接続箇所における前記配線の延在方向が前記屈曲部に平行な方向または前記屈曲部から離間する方向である撮像モジュール。     An imaging module,
    An electric cable, an image pickup device, and a flexible wiring board having a wiring electrically connected between the image pickup device and the electric cable,
    The flexible wiring board includes an element mounting portion for mounting the imaging element and a rear piece that is bent at a bent portion at an end of the element mounting portion and extends in a direction opposite to the position where the imaging element is provided. And
    The element mounting portion has a mounting surface for mounting the imaging element on the surface intersecting the axial direction of the tip of the electric cable,
    The mounting surface has a connection terminal to which the wiring is connected and electrically connected to the imaging element;
    The wiring is connected to the electrical cable from the connection terminal through the bent portion and the rear piece portion,
    The connection location of the wiring with respect to the connection terminal is arranged at a position other than the position closest to the bent portion, or the direction in which the wiring extends at the connection location is parallel to the bent portion Or the imaging module which is a direction away from the said bending part.
  2. 　前記接続端子に対する前記配線の接続位置が前記屈曲部から最も離間した位置であり、かつ、前記接続箇所における前記配線の延在方向が前記屈曲部から離間する方向である請求項１に記載の撮像モジュール。 The imaging according to claim 1, wherein a connection position of the wiring with respect to the connection terminal is a position farthest from the bent portion, and an extending direction of the wiring at the connection location is a direction away from the bent portion. module.
  3. 　前記接続箇所における前記配線の延在方向が前記屈曲部から離間する方向であり、
    　前記配線が前記屈曲部から最も離間した位置と前記接続箇所との前記離間する方向における距離は、０．０５ｍｍ以上である請求項１または２に記載の撮像モジュール。     The extending direction of the wiring at the connection location is a direction away from the bent portion,
    The imaging module according to claim 1 or 2, wherein a distance between the position where the wiring is farthest from the bent portion and the connecting portion in the separating direction is 0.05 mm or more.
  4. 　請求項１～３のいずれか１項に記載の撮像モジュールを備えた内視鏡。 An endoscope comprising the imaging module according to any one of claims 1 to 3.
PCT/JP2016/064916 2015-07-13 2016-05-19 Image pickup module and endoscope WO2017010165A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-139724 2015-07-13
JP2015139724A JP2017018415A (en) 2015-07-13 2015-07-13 Imaging module and endoscope

Publications (1)

Publication Number Publication Date
WO2017010165A1 true WO2017010165A1 (en) 2017-01-19

Family

ID=57756894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/064916 WO2017010165A1 (en) 2015-07-13 2016-05-19 Image pickup module and endoscope

Country Status (2)

Country Link
JP (1) JP2017018415A (en)
WO (1) WO2017010165A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6742358B2 (en) * 2018-04-04 2020-08-19 株式会社フジクラ Imaging unit
JP6689908B2 (en) 2018-05-09 2020-04-28 株式会社フジクラ Imaging module
JP7227011B2 (en) * 2019-01-09 2023-02-21 ｉ－ＰＲＯ株式会社 Endoscope

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010019762A (en) * 1999-08-30 2001-03-15 윤종용 flexible Printed Circuit Board and design method thereof
JP2013123628A (en) * 2011-12-16 2013-06-24 Olympus Medical Systems Corp Imaging unit for endoscope
JP2013214815A (en) * 2012-03-30 2013-10-17 Fujikura Ltd Imaging module, imaging module with lens, endoscope, manufacturing method of imaging module, and flexible wiring board molding device
JP2014086883A (en) * 2012-10-24 2014-05-12 Canon Inc Apparatus with device substrate and flexible wiring board and specimen information acquisition apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10137183A (en) * 1996-11-15 1998-05-26 Olympus Optical Co Ltd Imaging equipment for endoscope
JP5701550B2 (en) * 2010-09-17 2015-04-15 オリンパス株式会社 Imaging apparatus and manufacturing method of imaging apparatus
JP6076048B2 (en) * 2012-11-12 2017-02-08 オリンパス株式会社 Imaging apparatus and endoscope
WO2015019669A1 (en) * 2013-08-05 2015-02-12 オリンパスメディカルシステムズ株式会社 Imaging unit for endoscope

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010019762A (en) * 1999-08-30 2001-03-15 윤종용 flexible Printed Circuit Board and design method thereof
JP2013123628A (en) * 2011-12-16 2013-06-24 Olympus Medical Systems Corp Imaging unit for endoscope
JP2013214815A (en) * 2012-03-30 2013-10-17 Fujikura Ltd Imaging module, imaging module with lens, endoscope, manufacturing method of imaging module, and flexible wiring board molding device
JP2014086883A (en) * 2012-10-24 2014-05-12 Canon Inc Apparatus with device substrate and flexible wiring board and specimen information acquisition apparatus

Also Published As

Publication number Publication date
JP2017018415A (en) 2017-01-26

Similar Documents

Publication Publication Date Title
JP5386567B2 (en) Imaging device chip mounting method, endoscope assembling method, imaging module, and endoscope
US11681164B2 (en) Electrical interconnects within electronic contact lenses
US10015375B2 (en) Image pickup apparatus and endoscope including the same
US10158188B2 (en) Cable connection structure, ultrasonic probe, and ultrasonic endoscope system
US11000184B2 (en) Image pickup module, fabrication method for image pickup module, and endoscope
JP6072209B1 (en) Imaging module and endoscope
WO2017010165A1 (en) Image pickup module and endoscope
US10806333B2 (en) Three-dimensional wiring substrate and imaging unit
WO2016170911A1 (en) Imaging device
US9629524B2 (en) Image pickup unit for endoscope having first and second leads with differing distances to image pickup device
JPWO2015019669A1 (en) Endoscope imaging unit
US10660507B2 (en) Imaging module and catheter with flexible wiring substrate
JP6689908B2 (en) Imaging module
JP2012185420A (en) Composite cable
JP2011249870A (en) Imaging apparatus
US10321814B2 (en) Image pickup apparatus and endoscope
JP6188479B2 (en) Board module
JP6277249B2 (en) Imaging module and endoscope
US10200580B2 (en) Imaging module and catheter with flexible wiring substrate
JP2018089066A (en) Imaging module
US10930696B2 (en) Image pickup unit, endoscope, and method for manufacturing image pickup unit
JP6695366B2 (en) Imaging module
WO2017081718A1 (en) Endoscope
JP6697244B2 (en) Circuit board unit, imaging device and endoscope

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16824145

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16824145

Country of ref document: EP

Kind code of ref document: A1